Esm Android Smart Phone 53693009 Lg l 04c Sm

Internal Use Only

Service ManualL-04C

Date: January, 2011 / Issue 1.0

- � - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes

LGE Internal Use Only

1. INTRODUCTION

Table Of Contents

1. INTRODUCTION ..................................................................... 3

1.1 Purpose ........................................................................................................3

1.� Regulatory Information .........................................................................3

1.3 Abbreviations.............................................................................................5

2. PERFORMANCE ...................................................................... 7

�.1 The Name of the Product ......................................................................7

�.� Objectives ....................................................................................................7

�.3 Product Outline .........................................................................................7

�.4 Application Range ...................................................................................7

�.5 Terms of Definition ..................................................................................8

�.6 Product Condtitution .............................................................................9

�.7 Electrical Characteristics ..................................................................... 11

3. TECHNICAL BRIEF ................................................................ 25

3.1 General Description ............................................................................. �5

3.� GSM Mode ................................................................................................ �7

3.3 UMTS Mode ............................................................................................. 31

3.4 LO Phase-locked Loop ......................................................................... 35

3.5 Off-chip RF Components ................................................................... 36

3.6 Digital Baseband(DBB/MSM7��7) .................................................. 53

3.7 Modem system / subsystem ............................................................. 56

3.8 Power Block ............................................................................................. 65

3.9 Memory Support ................................................................................... 77

3.10 H/W Sub System .................................................................................. 8�

3.11 Main features ......................................................................................110

3.1� RF Component ...................................................................................111

3.13 Main Component..............................................................................113

4. TROUBLE SHOOTING ........................................................ 122

4.1 Checking VCXO Block ........................................................................1��

4.� Checking FEM SW Block ...................................................................1�3

4.3 Checking UMTS Block ........................................................................1�5

4.4 Checking GSM Block ..........................................................................134

4.5 GPS ............................................................................................................138

4.6 Bluetooth/WLAN OFF-CHIP RF COMPONENTS .......................140

4.7 GPS, Wi-Fi/BT RF COMPONENTS ....................................................146

4.8 GPS, Wi-Fi/BT SIGNAL PATH .............................................................149

4.9 GPS, BT/Wi-Fi TROUBLE SHOOTING .............................................151

4.10 Power ONTroubleshooting ...........................................................156

4.11 Charger Troubleshooting ..............................................................159

4.1� USB Troubleshooting ......................................................................16�

4.13 RUIM Detect Troubleshooting .....................................................165

4.14 3 Mega Camera Troubleshooting...............................................167

4.15 Keypad Backlight Troubleshooting ...........................................170

4.15 Keypad Backlight Troubleshooting ...........................................17�

4.16 Main LCD Troubleshooting ...........................................................174

4.17 Receiver Path ......................................................................................175

4.18 Headset path ......................................................................................178

4.19 Speaker phone path ........................................................................181

4.�0Main microphone ..............................................................................184

4.�1 Headsetmicrophone .......................................................................186

4.�� Vibrator .................................................................................................188

4.�3 SD card operation .............................................................................190

4.�4 Touch Troubleshootingz ................................................................193

4.�5 Proximity Sensor Troubleshooting ............................................195

4.�6 Digital Compass Troubleshooting .............................................197

5. DOWNLOAD ....................................................................... 199

6. BLOCK DIAGRAM ............................................................... 212

7. CIRCUIT DIAGRAM ............................................................ 224

8. BGA Pin Map ...................................................................... 237

9. PCB LAYOUT ....................................................................... 244

10. CALIBRATION ................................................................... 252

10.1 Introduction ........................................................................................�5�

10.� Terminology ........................................................................................�5�

10.3 Installation ...........................................................................................�5�

10.4 Tachyon Start ......................................................................................�55

10.5 Tachyon Main UI ................................................................................�58

10.6 Functional explain ............................................................................�63

11. EXPLODED VIEW & REPLACEMENT PART LIST ............. 281

11.1 EXPLODED VIEW ................................................................................�81

11.� Replacement Parts ...........................................................................�8�

11.3 Accessory .............................................................................................310

- 3 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes


1. INTRODUCTION

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1.1 PurposeThis manual provides the information necessary to repair, calibration, description and download the features of this model.

1.2 Regulatory InformationA. Security

Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example, persons other than your company’s employees, agents, subcontractors, or person working on your company’s behalf) can result in substantial additional charges for your telecommunications services. System users are responsible for the security of own system. There are may be risks of toll fraud associated with your telecommunications system. System users are responsible for programming and configuring the equipment to prevent unauthorized use. The manufacturer does not warrant that this product is immune from the above case but will prevent unauthorized use of common-carrier telecommunication service of facilities accessed through or connected to it.

The manufacturer will not be responsible for any charges that result from such unauthorized use.

B. Incidence of Harm

If a telephone company determines that the equipment provided to customer is faulty and possibly causing harm or interruption in service to the telephone network, it should disconnect telephone service until repair can be done. A telephone company may temporarily disconnect service as long as repair is not done.

C. Changes in Service

A local telephone company may make changes in its communications facilities or procedure. If these changes could reasonably be expected to affect the use of the this phone or compatibility with the network, the telephone company is required to give advanced written notice to the user, allowing the user to take appropriate steps to maintain telephone service.

D. Maintenance Limitations

Maintenance limitations on this model must be performed only by the manufacturer or its authorized agent. The user may not make any changes and/or repairs expect as specifically noted in this manual. Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system and may void any remaining warranty.

1. INTRODUCTION

1. INTRODUCTION1. INTRODUCTION



1. INTRODUCTION

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E. Notice of Radiated Emissions

This model complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user.

F. Pictures

The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly different.

G. Interference and Attenuation

Phone may interfere with sensitive laboratory equipment, medical equipment, etc.Interference from unsuppressed engines or electric motors may cause problems.

H. Electrostatic Sensitive Devices

ATTENTION

Boards, which contain Electrostatic Sensitive Device (ESD), are indicated

by the sign. Following information is ESD handling:

• Service personnel should ground themselves by using a wrist strap when exchange system boards.

• When repairs are made to a system board, they should spread the floor with anti-static mat

which is also grounded.

• Use a suitable, grounded soldering iron.

• Keep sensitive parts in these protective packages until these are used.

• When returning system boards or parts like EEPROM to the factory, use the protective

package as described.

2. INTRODUCTION



1. INTRODUCTION

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1.3 AbbreviationsFor the purposes of this manual, following abbreviations apply:

Offset Phase Locked LoopOPLL

Light Emitting DiodeLED

Low Drop OutputLDO

Liquid Crystal DisplayLCD

Intermediate FrequencyIF

International Portable User IdentityIPUI

Global System for Mobile CommunicationsGSM

General Purpose Interface BusGPIB

Gaussian Minimum Shift KeyingGMSK

Flexible Printed Circuit BoardFPCB

Electrostatic DischargeESD

Electrical Erasable Programmable Read-Only MemoryEEPROM

Digital Signal ProcessingDSP

dB relative to 1 milli wattdBm

Digital Communication SystemDCS

Digital to Analog ConverterDAC

Constant Current – Constant VoltageCC-CV

Bit Error RatioBER

BasebandBB

Automatic Power ControlAPC

1. INTRODUCTION



1. INTRODUCTION

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Wireless Application ProtocolWAP

Voltage Control Temperature Compensated Crystal OscillatorVCTCXO

Voltage Controlled OscillatorVCO

Universal Asynchronous Receiver/TransmitterUART

Time Division Multiple AccessTDMA

Time Division DuplexTDD

Travel AdapterTA

Side Tone Masking RatingSTMR

Pseudo SRAMPSRAM

Static Random Access MemorySRAM

Sending Loudness RatingSLR

Subscriber Identity ModuleSIM

Surface Acoustic WaveSAW

Real Time ClockRTC

Root Mean SquareRMS

Receiving Loudness RatingRLR

Radio FrequencyRF

Public Switched Telephone NetworkPSTN

Phase Locked LoopPLL

Programmable Gain AmplifierPGA

Printed Circuit BoardPCB

Power Amplifier ModulePAM

1. INTRODUCTION

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2 1 The Name of the Product2.1 The Name of the Product

This product is Android OS Smart phone which has GSM/GPRS/WCDMA dual mode of GSM/GPRS form and wireless connection/WCDMA FDD form, called L-04C.

2.2 Objectives

The objective of L-04C, Japan 3G Android Smart phone, is to pursue Total Information & Entertainment StationThe objective of L 04C, Japan 3G Android Smart phone, is to pursue Total Information & Entertainment Station through Mobile Multimedia, satisfying UMTS release 5 Version.

2.3 Product Outline

1. WCDMA / GSM (EGSM,DCS,PCS) Dual Mode2. HSDPA (Category 8 – Up to 7.2Mbps) + HSUPA (Category 5 – Up to 2Mbps)3. GPS, Bluetooth 2.1+EDR, Wi-fi 802.11 b/g3. G S, B uetoot . D , 80 . b/g4. Android 2.2 (Froyo) OS5. 8Gbits NAND + 4Gbits DDR SDRAM6. Slide Qwerty Keypad7. 3.2” HVGA 320(RGB) X 480 TFT LCD8. 3.1Mega Pixel CMOS AF Camera9. Capacitive Full Touch Window10. External Micro-SD (Up to 32GB) Memory Support11. USB 2.0 Hi-Speed12. 18X10 Type Speaker , Q-Coin Motor13. Proximity Sensor, Acceleration Sensor14. Digital Compass15. 3.5Φ Stereo Headset16. 5 pin Standard MicroUSB Connector

2.4 Application Range

1. Phone2. Battery (1,350mAh)3. Battery Cover4. Charging Gender (Arib to MicroUSB)5. Stereo Earmic Set6 USB C bl6. USB Cable

2. PERFORMANCE

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2.5 Terms of Definition2.5 Terms of Definition

1. GSM(Global System for Mobile): The standard digital cellular system in Europe, Asia, and other parts of the world. It is a variation on TDMA, with a data transfer rate of 9.6Kbps.

2. GPRS(General Packet Radio Services): General packet radio service (GPRS) is a packet oriented mobile data service available to users of the 3G cellular communication systems. GPRS allows a data transmission rate of up to 171.2 kbps and is suitable for internet access.

3 DBB(Di i l B B d) Th l i d i l di P f i S i id l d3. DBB(Digital Base Band): The control unit product including Processor for use in Set inside control and the DSP which operate GSM algorithm.

4. ABB (Analog Base Band processor): Transmission and reception of Baseband, Supporting control parts keeping input and output of Voice band (a mic, speaker connection) and ADC are included.

5. Memory: All S/W including protocol, User Interface is stored, and to apply.

6. USIM(Universal Subscriber Identity Module): USIM is part of a removable smart card ICC (Integrated Circuit Card), is stored personal information. So, Even if user use other mobile phone, not user’s own mobile phone, it can be used if USIM is in it.

7. RF Transceiver: This component has Low noise signal amplifier (LNA) of the reception first grade,Mixer which mixes a signal, module in Transmission and reception part including A Programmable amplifier and IQ strange demodulators.

8. VCTCXO(Voltage Controlled Temperature Compensated Crystal Oscillator): A voltage controlled / temperature compensated crystal oscillators are used in applications that require excellent phase noisetemperature compensated crystal oscillators are used in applications that require excellent phase noise performance.

9. PLL (Phase Locked Loop): A circuit that consists essentially of a phase detector which compares the frequency of a voltage-controlled oscillator with that of an incoming carrier signal or reference-frequencygenerator.

10. VCO (Voltage Controlled Oscillator): An oscillator that can be tuned over a wide range of frequencies by applying a voltage (tuning voltage) to it. Used in many applications such as radio tuners, y pp y g g ( g g ) y pp ,VCOs are less costly than crystal oscillators, but not as stable. Contrast with crystal oscillator.

11. SAW (Surface Acoustic Wave) Filter: A semiconductor device that is used to filter out desired frequencies. Widely used in mobile phones to filter both RF and IF frequencies, a SAW filter uses the piezoelectric effect to turn the input signal into vibrations that are turned back into electrical signals in the desired frequency range.

12. PAM (Power Amplifier Module): PAM is a form of signal modulation where the message information is encoded in the amplitude of a series of signal pulses.

13. APC(Automatic Power Control): A signal level of PAM is adjusted precisely.

14. FEM (Front End Module): The switch which chooses transmission and reception of wireless signal and a frequency band.

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15. UMTS(Universal Mobile Telecommunication System): UMTS is one of the third-generation (3G) mobile15. UMTS(Universal Mobile Telecommunication System): UMTS is one of the third generation (3G) mobile telecommunications technologies.

16. WCDMA(Wide-band Code Division Multiple Access): WCDMA has been designed for high speed dataservices and, more particularly, Internet-based packet-data, offering up to 2Mbps in stationary or officeenvironments and up to 384Kbps in wide area or mobile environments.

2.6 Product Condtitution

2.6.1 A Whole Product Appearance

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2 6 2 Basic Constitution of a Product2.6.2 Basic Constitution of a Product

Item Type / Spec Function Explanation & Characteristics

1. Battery Li-Ion 564447 Cell, 1,350mAhCharging Voltage : 4.2V (Typical)1350mAh,5.0Mh/3.7V , L10

2. Charging Gender 5.4V Input , 4.6V Output DoCoMo TA Charging Gender

3. Battery Cover

4. Ear_Mic 3.5Φ Stereo Earphone, Carnal , Stereo Headset, Headset call,Ear Hook

5. USB Data Cable MicroUSB 5 pin USB data Communication

6. Micro SD Card 2GB Micro SD Memory User Data storage

7. Manual User Manual

* L-04C Uses NTT DoCoMo Standard Travel Adapter and Other Accessary. Which are not Provided.

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2.7 Electrical Characteristics2.7 Electrical Characteristics

It depends on a national (Japan and Pan-Europe, the Americas) electric characteristic standard (a form approval standard).

2.7.1 System Outline

List Type / Spec.

1. Phone Type Full Touch Qwerty Slide

2. Size 116 x 58 x 15.3(mm)

3. Weight 149g

4. Battery 1,350mAh (Li-Ion)

5. MSM chipset MSM7227, RTR6285, PM7540

6 M 8Gb(N d Fl h) / 4Gb(SDRAM)6. Memory 8Gb(Nand Flash) / 4Gb(SDRAM)

7. OS Android 2.2 (Froyo)

8. LCD Size 3.2 inch

Dot 320(RGB) X 480

Color 16,777,216 Colors

Display Type Transmissive,Normally Black,p y yp yIn-Plane Switching.

NTSC 70% (typ.)

Contrast Ratio 500 (typ.)

Pixel Pitch 0.141mm

9. Camera (3M) Type CMOS image sensor

R l ti (Eff ti ) 2072(H) X 1552(V) i lResolution (Effective)(Output)

2072(H) X 1552(V) pixels.2048(H) X 1536(V) pixels.

Frame Rate Max 15 (QXGA) fps

Digital Zoom 3M,2M,1M, VGA, QVGA (X9)

Image Scaling Down 3M,2M,1M, VGA, QVGA

Moving Picture

10. Audio 1) Speaker 18X10 Speaker/Receiver Dual Mode

2) Mic SMD type

3) Headset 3.5Φ Stereo Headset and Mic.

2. PERFORMANCE

- 1� - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes


6

Li t T / S

12. Bluetooth Effective Distance 10M

13. WLAN Spec. IEEE 802.11b/g

Throughput MAX 4Mbps (Depends on SDIO Driver Perfornance)

11. Motor 10 Φ Q-Coin Motor

List Type / Spec.

Effective Distance 50 ~ 200m (Depends on Environment)

14. GPS

2.7.2 Using Condition

) Ph U i E i

Item Spec. Unit

Using Voltage 3.7 (Typ.), 4.2 (Max.) V

Using Temp. -20 ~ + 60 ℃

Store Temp. -30 ~ + 85 ℃

1) Phone Using Environment

Humidity 0 ~ 80 %

Item Spec.

Input Voltage AC 100 ~ 240V,50~ 60Hz

2) TA Using Environment

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2 7 3 wireless characteristic2.7.3 wireless characteristic

wireless characteristic follows GSM Approval examination Specification(ETSI EN 300 607 11.10)

1) Electrical Characterisrics of WCDMA Transmission Part.

Item Spec. Min Typ. Max Unit

Maximum Output Power Power class Ⅲ 21.0 24 25.0 dBm/3.84MHzPower

Frequency Accuracy 0.1 ppm -200 - +200 Hz

Minimum Output Power

- - - -50 dBm/3.84MHz

Occupied Bandwidth - - - 4.6 MHz

Adjacent Channel Leakage Power Ratio

Δf = 5MHz - - -33 dBm/3.84MHz

Δf = 10MHz - - -43 dBm/3.84MHz

Error Vector Magnitude(EVM) - - - 17 %

Peak Code Domain Error - - - 15 dBm/3.84MHz

Open LoopOutput Power

Ior =-106.7dBm/3.84MHz -46.7 - -28.7 dBm/3.84MHz

Ior =-65.7dBm/3.84MHz -23.0 - -5.0 dBm/3.84MHz

Ior =-25.0dBm/3.84MHz -0.0 - 14.0 dBm/3.84MHz

Transmit Off Power - - - -56 dBm/3.84MHz

Δf = 2.5~3.5MHz -35-15 * (Δf-2.5) dBc/30KHz

Spectrum Emission Mask

Δf = 3.5~7.5MHz -35-1 * (Δf-3.5) dBc/1MHz

Δf = 7.5~8.5MHz -39 10 * (Δf-7.5) dBc/1MHz

Δf = 8.5~12.5MHz -49 dBc/1MHz

Transmit Spurious

9kHz ~ 150kHz -36 dBm

150kHz ~ 30MHz -36 dBm

Emission 30MHz ~ 1GHz -36 dBm

1GHz ~ 12.5GHz -30 dBm

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2) Electrical Characterisrics of WCDMA Reception Part.2) Electrical Characterisrics of WCDMA Reception Part.


Reference Sensitivity Level

BER < 0.1% - - -106.7 dBm/3.84MHz

MaximumInput Level

Pin = -25dBm - - 0.1 BER(%)

Adjacent Channel Selectivity(ACS)

Jammer(Modulation)= -52dBm/3.84MHzΔf = 5MHzBER < 0.001%

- - -103 dBm/3.84MHz

In Band Blocking

Jammer(Modulation)= -56dBm/3.84MHzΔf = 10MHzBER < 0.001%

- - -103.7 dBm/3.84MHz

Jammer(Modulation)Jammer(Modulation)= -44dBm/3.84MHzΔf = 15MHzBER < 0.001%

- - -103.7 dBm/3.84MHz

Inter-modulationDesensitization

Jammer1(CW)= -46dBmJammer2(Modulation)= -46dBm/3.84MHzΔf= 10MHzBER < 0.001%

- - -103.7 dBm/3.84MHz

Jammer1= -46dBm(CW)( )Jammer2(Modulation)= -46dBm/3.84MHzΔf= 20MHzBER < 0.001%

- - -103.7 dBm/3.84MHz

30kHz ~ 1GHz - - -57 dBm/30kHz

1GHz ~ 1.92GHz - - -47 dBm/1MHz

G G dB /Spurious Emissions

1.92GHz ~ 1.98GHz - - -60 dBm/3.84MHz

1.98GHz ~ 2.11GHz - - -47 dBm/3.84MHz

2.11GHz ~ 2.17GHz - - -60 dBm/3.84MHz

2.17GHz ~ 12.75GHz - - -47 dBm/1MHz

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3) Electrical Characterisrics of HSDPA Transmission and ReceptionPart.3) Electrical Characterisrics of HSDPA Transmission and ReceptionPart.


5.2.A Maximum Output Power with HS-DPCCH

1/15 c/d 12/1513/15 c/d 15/815/7 c/d 15/0

212019

2322.522

252525

dBm/3.84MHz

5.7A HS-DPCCHMAX /0dBm

Step 0 0 dBm +/- 1 dB dB

Step 1 – Step 0 6 dB +/- 2.3 dB dB



Transmission


5.9A Spectrum Emission Mask with HS-DPCCH

Δf = 2.5~3.5MHz -35-15 * (Δf-2.5) dBc/30KHz

Δf = 3.5~7.5MHz -35-1 * (Δf-3.5) dBc/1MHz

Δf = 7.5~8.5MHz -39 10 * (Δf-7.5) dBc/1MHz

Δf = 8.5~12.5MHz -49 dBc/1MHz

5.10A Adjacent Channel Leakage Power Ratio with HS-DPCCH

Δf = 5MHz - - -33 dBm/3.84MHz

Δf = 10MHz - - -43 dBm/3.84MHz

5 13 1A Error Vector5.13.1A Error Vector Magnitude (EVM) with HS-DPCCH

MAX Power-20 dBm

- - 17.5 %

Reception

6.3A MaximumInput Level for HS-PDSCH Reception

Pin = -25dBm - - 10 BLER(%)

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4) Electrical Characterisrics of GSM Transmission and Reception Part.

Item Spec.

Phase ErrorRms : 5°Peak : 20 °

Frequency ErrorGSM : 0.1 ppmDCS/PCS : 0.1 ppm

4) Electrical Characterisrics of GSM Transmission and Reception Part.

EMC(Radiated Spurious Emission Disturbance) GSM/DCS : < -28dBm

Transmitter Output power and Burst TimingGSM : 5dBm – 33dBm ± 3dBDCS/PCS : 0dBm – 30dBm ± 3dB

Burst Timing <3.69us

Spectrum due to modulation out to less than kH ff

200kHz : -36dBm1800kHz offset 600kHz : -51dBm/-56dBm

Spectrum due to modulation out to larger than 1800kHz offset to the edge of the transmit band

GSM : 1800-3000kHz :< -63dBc(-46dBm)3000kHz-6000kHz : <-65dBc(-46dBm)6000kHz < : < -71dBc(-46dBm)DCS :1800-3000kHz :< -65dBc(-51dBm)6000kHz < : < -73dBc(-51dBm)

Spectrum due to switching transient400kHz : -19dBm/-22dBm(5/0), -23dBm600kHz : -21dBm/-24dBm(5/0), -26dBm

Reference Sensitivity – TCH/FS Class II(RBER) : -105dBm(2.439%)

Usable receiver input level range 0.012(-15 - -40dBm)

I d l i j i S h h l± 800kHz, ± 1600kHz

Intermodulation rejection – Speech channels,

: -98dBm/-96dBm (2.439%)

AM Suppression-GSM : -31dBm - DCS : -29dBm

-98dBm/-96dBm (2.439%)

Timing Advance ± 0.5T

- Frequency Range : GSM(880~915MHz/925~960MHz), DCS(1710~1785MHz/1805~1880MHz)PCS (1850~1910MHz/1830~1990MHz)

- Local Oscillation Frequency Range : 1688 ~ 1736 MHz- IF : zero IF- Rated MAX Power : 1995.3 mW(33dBm)

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5) Electrical Characterisrics of Bluetooth Transmission5) Electrical Characterisrics of Bluetooth Transmission


Output Power DH5PRBS9

Nominal Pwr -6 - +4 dBm

Peak Pwr - - +23 dBm

Power Density DH5 @100kHz BW +20 dBmPower Density PRBS9 @100kHz BW - +20 dBm

Frequency Range DH5PRBS9

-30dBm@100kHz BW

2400 - 2483 MHz

Tx Output Spectrum(20dB BW)

DH5PRBS9 Δf =fH-fL - 1 MHz

Tx Output Spectrum(Adj t O t t DH5 @M-N = 2 - -20 dBm(Adjacent Output Power)

D 5PRBS9 @M-N >= 3 - -40 dBm

Modulation Index

DH511110000 f1AVG 140 - 175 kHz

DH510101010

f2MAX 115 - kHz

f2AVG/f1AVG 0.8 -

Initial Carrier Freq.Tolerance

DH5PRBS9 -75 - +75 kHz

Carrier Frequency Drift

DH110101010

Freq. Drift -25 - +25 kHz

Drift Rate -20 - +20 kHz/50us

DH3 Freq. Drift -40 - +40 kHzCarrier Frequency Drift 10101010 Drift Rate -20 - +20 kHz/50us

DH510101010

Freq. Drift -40 - +40 kHz

Drift Rate -20 - +20 kHz/50us

Out of Band Spurious Emission

DH1PRBS9 @ 30MHz ~ 12.75GHz 20 dBc

★ Gray Items cannot be measured now.

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6) Electrical Characterisrics of Bluetooth Reception Part6) Electrical Characterisrics of Bluetooth Reception Part


Sensitivity(Single Slot Packet)

DH1PRBS9 BER @ 0.1% - -70 dBm

Sensitivity(Multi Slot Packet)

DH5PRBS9 BER @ 0.1% - -70 dBm

C/I Performance DH1

Co-Channel-60dBm@ BER0.1%

- 11

dB

C/I @1MHz-60dBm@ BER 0.1%

- 0

C/I @2MHz-60dBm@ BER 0.1%

- -30

C/I Performance PRBS9 dBC/I @≥3MHz-67dBm@ BER0.1%

- -40

C/I @Image-67dBm@ BER 0.1%

- -9

C/I @1MHz Image-67dBm@ BER 0.1%

- -20

Blocking Performance DH1PRBS9

-10dBm @30M ~2 GHz

- -67 dBm

-27dBm @2 ~ 2.4 GHz

-27dBm @2.5 ~ 3 GHz

-10dBm @10dBm @3 ~ 12.75 GHz

Intermodulation Performance DH1PRBS9

Δf = +5MHz (CW)Δf = +10MHz (BT)BER @ 0.1%

- -64 dBm

Δf = -5MHz (CW)Δf = -10MHz (BT)BER @ 0 1%

- -64 dBmBER @ 0.1%

Maximum Input Level DH1PRBS9 BER @ 0.1% -20 - dBm

★ Gray Items cannot be measured now.

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8) Electrical Characterisrics of GPS Reception Part

★ Referred to Qualcomm A-GPS Specification

8) Electrical Characterisrics of GPS Reception Part

Item Spec.

Radiated C/No C/No ≥ 34dB

Calculated TIS -149dBm / Hz

p

Item Specification

Transmit Frequency 2400 MHz ~ 2483.5 MHz ( CH1~CH13 )

9) Electrical Characteristics of WLAN 802.11b Transmission and Receptioin Part

Tx Power Level ≤ 20dBm under (Europe), ≤ 30dBm under (USA)

Frequency Tolerance within ±25 PPM

Chip clock FrequencyTolerance

within ±25 PPM

Spectrum Mask ≤ -30 @ fc-22MHz< f <fc-11MHz and fc+11MHz< f <fc+22MHz≤ -50 @ f < fc-22MHz and f > fc+22MHz

Power ramp on/off time ≤ 2us

Carrier Suppression ≤ -15dB

Modulation Accuracy(Peak EVM)

≤ 35%

Spurious Emissions < -36 dBm @ 30MHz ~ 1GHz < -30 dBm above @ 1GHz ~ 12.75GHz < -47 dBm @ 1.8GHz ~ 1.9GHz < -47 dBm @ 5.15GHz ~ 5.3GHz

Rx Min input Sensitivity ≤ -76dBm(1Mbps,2Mbps,5.5Mbps,11Mbps) @ FER ≤ 8%

Rx Max input Sensitivity ≥ -10dBm(1Mbps,2Mbps,5.5Mbps,11Mbps) @ FER ≤ 8%

Rx Adjacent ChannelRejection

≥ 35dB @FER ≤ 8%,interference input signal -70dBm@fc±25MHz(11Mbps)

2. PERFORMANCE

- �0 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes


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10) Electrical Characteristics of WLAN 802.11g Transmission and Receptioin Part

Item Specification

Transmit Frequency 2400 MHz ~ 2483.5 MHz ( CH1~CH13 )

Tx Power Level ≤ 20dBm under (Europe), ≤ 30dBm under (USA)

Frequency Tolerance within±25 PPM

10) Electrical Characteristics of WLAN 802.11g Transmission and Receptioin Part

Frequency Tolerance within ±25 PPM

Chip clock FrequencyTolerance

within ±25 PPM

Spectrum Mask≤ -20 @ ±11MHz offset (9Mhz ~ 11MHz)≤ -28 @ ±20MHz offset (11MHz ~ 20Mhz)≤ -40 @ ±30MHz offset (20MHz ~ 30Mhz)

Transmitter constellation error(rms EVM) ≤ -5.6%

Spurious Emissions

< -36 dBm @ 30MHz ~ 1GHz < -30 dBm above @ 1GHz ~ 12.75GHz < -47 dBm @ 1.8GHz ~ 1.9GHz < -47 dBm @ 5.15GHz ~ 5.3GHz

Rx Min input Sensitivity

PER ≤ 10%-82dBm@6Mbps, -81dBm@9Mbps, -79dBm@12Mbps-77dBm@18Mbps, -74dBm@24Mbps, -70dBm@36Mbps-66dBm@48Mbps, -65dBm@54Mbps

Rx Max input Sensitivity ≥ -20dBm(6,9,12,18,24,36,48,54Mbps) @ PER ≤ 10%

PER ≤ 10%,

Rx Adjacent ChannelRejection

ACR ≥ 16dB@6Mbps, ACR ≥ 15dB@9Mbps, ACR ≥ 13dB@12Mbps, ACR ≥ 11dB@18Mbps, ACR ≥ 8dB@24Mbps, ACR ≥ 4dB@36MbpsACR ≥ 0dB@48Mbps, ACR ≥ -1dB@54Mbps

※ACR shall be measured by setting the desired signal's strength 3 dB above the rate-dependentsensitivity specified in min input sensitivity

2. PERFORMANCE



15

2 7 4 Electrical Characteristics (continued)2.7.4 Electrical Characteristics (continued)

1) Current Consumption

ItemSpecification

WCDMA GSM

1. Sleep Mode Under 3 mA Under 3 mAp

2. Sleep : Ear jack conencted Under 3.5 mA Under 3.5 mA

3. Idle Mode Under 160 mA Under 160 mA

4. Standby (Sleep & Idle Avg.) Under 5.5mA @ DRX 7 Under 5.5mA @ P.P 5

5. Talk ModeTx 23dBm (LCD OFF):Under 600 mA @ Avg

EGSM LVL 5(LCD OFF)Under 350 mA @ Avg

◈ RF Current Consumptions are measured in Backlight Off state.

Under 600 mA @ Avg Under 350 mA @ Avg

6. No SVC Mode Under 160 mA Under 160 mA

7. Power Off Mode Under 450 uA Under 450 uA

2) RSSI indicate (traffic)

Antenna BARSpecification

unitWCDMA GSM(EGSM) GSM(DCS/PCS)

4 3 -89 2 -91 2 -91 2

3 2 -95 2 -99 2 -99 2

RSSI is measured 10 seconds after Power change. (For RSSI stability)

In WCDMA case, There is not display “ No SVC” in traffic.

dBm2 1 -102 2 -104 2 -103 2

1 0 -105 2 -106 2 -105 2

0 No SVC -113 2 -117 2 -117 2

In WCDMA case, There is not display No SVC in traffic.

2. PERFORMANCE

- �� - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes


16

3) Battery Discharging Graph : Referred to Battery Log File3) Battery Discharging Graph : Referred to Battery Log File

TOCAD (Sanyo Cell 1350mAh), 300mA Load current

Battery Capacity Battery Voltage

90% 4.02V 0.05(3.97V~4.07V)

60% 3.76V 0.05(3.71V~3.81V)

30% 3.67V 0.05(3.62V~3.72V)

Battery Icon Battery Capacity Bar

90~100 6

70~89 5

50~69 430% 3.67V 0.05(3.62V 3.72V)

10% 3.58V 0.05(3.53V~3.63V)

OFF Under 3.30V

30~49 3

15~29 2

5~14 1

0~4 0

2. PERFORMANCE



17

4) Battery Usage Time) y g

Specification Test Condition

Standby Time & Current(WCDMA)

Over 200 hrsUnder 6mA

DRX 7 @ BATT Capacity : 1350mA/h

Standby Time & C t Over 200 hrs

EGSM P2 BATT C i 1350 A/h& Current(GSM) Under 6mA

EGSM P2 @ BATT Capacity : 1350mA/h

Voice Call Time

(WCDMA)Over 250 min. 10dBm @ BATT Capacity :1350mA/h (AMR Mode )

Voice Call Time Over 240 min. EGSM, LV5 @ BATT Capacity : 1350mA/h

5) MP3 Usage Time

(GSM)

Charging Time Under 240 min. Phone off


Speaker Over 6 hrs Reference MP3 : Life is good.mp3-92dBm, Half Rate, Backlight Off, Volume Max.Ear Phone Over 6 Hrs

6) Ringtone SPL


Over 60% Over 60 dBspl 1 m distance

100% Over 55 dBspl 1 m distance

2. PERFORMANCE



18

2.7.5 examination measurement method and a rule2.7.5 examination measurement method and a rule

Voltage of mobile phone that is applied at the time of each measurement (contact terminal of battery) is Typ. DC 4.0Volt, Min. DC 3.4Volt.

1. Electric characteristic measurement method : Follow standard examination method of product performance examination rules.

2. Reliability examination method: Follow standard examination method of reliability examination rules.y y

3. U/I verification rules: Follow standard examination method of QE U/I verification rules.

4. Field Test rules: Follow standard examination method of QE Field Test.

5. Examination method and SPEC. definition according to new functions: New functions for S/W is measured by method mentioned in the manual.

3. TECHNICAL BRIEF



1. TECHNICAL BRIEF

3.1 General Description

The L-04C supports UMTS-800, UMTS-2100, GSM-900, DCS-1800, and PCS-1900 based GSM/GPRS/UMTS. All receivers and the UMTS transmitter use the radioOne1Zero-IF architecture to eliminate intermediate frequencies, directly converting signals between RF and baseband. The tri-band GSM transmitters use a baseband-to-IF up conversion followed by an offset phase-locked loop that translates the GMSK-modulated or 8-PSK-modulated signal to RF.

Fig 1.1-1 Block diagram of RF part

A generic, high-level functional block diagram of L-04C is shown in Figure 1-1. One antenna collects base station forward link signals and radiates handset reverse link signals. The antenna connects with receive and transmit paths through a FEM(Front End Module) (plus two duplexers for UMTS high-band and low-band operations).

The UMTS receive paths each include an LNA, an RF band-pass filter, and a downconverter that translate the signal directly from RF-to-baseband using radioOne ZIF techniques.

1 QUALCOMM’s branded chipset that implements a Zero-IF radio architecture.

3. TECHNICAL BRIEF

3. TECHNICAL BRIEF



The high-band UMTS receive path and low-band path are accommodated in the RTR6285 IC. The RFIC.s Rx analog baseband outputs, for the receive chains, connect to the MSM IC. The UMTS and GSM Rx baseband outputs share the same inputs to the MSM IC .

For the transmit chains, the RTR6285 IC directly translates the Tx baseband signals (from the MSM device) to an RF signal using an internal LO generated by integrated on-chip PLL and VCO. The RTR6285 IC outputs deliver fairly high-level RF signals that are first filtered by Tx SAWs and then amplified by their respective UMTS PAs. The high- and low-band UMTS RF transmit signals emerge from the RTR6285 transceiver.

In the GSM receive path, the received RF signals are applied through their band-pass filters and down-converted directly to baseband in the RTR6285 transceiver IC. These baseband outputs are shared with the UMTS receiver and routed to the MSM IC for further signal processing. .

The GSM transmit path employs one stage of up-conversion and, in order to improve efficiency, is divided into phase and amplitude components to produce an open-loop Polar topology:

1. The on-chip quadrature up-converter translates the GMSK-modulated signal or 8-PSK modulated signal, to a constant envelope phase signal at RF;

2. The amplitude-modulated (AM) component is applied to the ramping control pin of Polar power amplifier from a DAC within the MSM

L-04C power supply voltages are managed and regulated by the PM7540 Power Management IC. This versatile device integrates all wireless handset power management, general housekeeping, and user interface support functions into a single mixed signal IC. It monitors and controls the external power source and coordinates battery recharging while maintaining the handset supply voltages using low dropout, programmable regulators.

The device’s general housekeeping functions include an ADC and analog multiplexer circuit for monitoring on-chip voltage sources, charging status, and current flow, as well as user-defined off-chip variables such as temperature, RF output power, and battery ID. Various oscillator, clock, and counter circuits support IC and higher-level handset functions. Key parameters such as under-voltage lockout and crystal oscillator signal presence are monitored to protect against detrimental conditions.

3. TECHNICAL BRIEF



3.2 GSM Mode

3.2.1 GSM Receiver

The Dual-mode L-04C’s receiver functions are split between the three RFICs as follows:

■ UMTS-800, UMTS-2100, GSM-900, DCS-1800, and PCS-1900 modes use the RTR6285 IC only. Each mode has independent front-end circuits and down-converters, but they share common baseband circuits (with only one mode active at a time). All receiver control functions are beginning with SSBI-controlled parameters.

RF Front end consists of antenna, Front End Module(D5017) which includes nine path antenna SW and quad band GSM PAM(GSM850, GSM900, DCS, and PCS). The Front End Module allows multiple operating bands and modes to share the same antenna.

In L-04C, a common antenna connects to one of eight paths:

1) UMTS-800 Rx/Tx, 2) UMTS-2100 Rx/Tx, 3) GSM-900 Rx, 4) GSM-900 Tx,

5) DCS-1800 Rx, 6) PCS-1900 Rx, 7) DCS-1800 TX, 8) PCS-1900 TX.

UMTS operation requires simultaneous reception and transmission, so the UMTS Rx/Tx connection is routed to a duplexer that separates receive and transmit signals.

GSM850/GSM900, DCS, and PCS operation is time division duplexed, so only the receiver or transmitter is active at any time and a frequency duplexer is not required.

Table 1.2-1 Antenna Switch Module Control logic

3. TECHNICAL BRIEF



The GSM900, DCS, and PCS receiver inputs of RTR6285 are connected directly to the transceiver front-end circuits(filters and antenna switch module). GSM900, DCS, and PCS receiver inputs use differential configurations to improve common-mode rejection and second-order non-linearity performance. The balance between the complementary signals is critical and must be maintained from the RF filter outputs all the way into the IC pins. The RTR6285 input stages include MSM-controlled gain adjustments that maximize receiver dynamic range.

Since GSM900, DCS, and PCS signals are time-division duplex (the handset can only receive or transmit at one time), switches are used to separate Rx and Tx signals in place of frequency duplexers – this is accomplished in the switch module.

The amplifier outputs drive the RF ports of the quadrature RF-to-baseband downconverters. The downconverted baseband outputs are multiplexed and routed to lowpass filters (one I and one Q) having passband and stopband characteristics suitable for GMSK or 8-PSK processing. These filter circuits include DC offset corrections. The filter outputs are buffered and passed on to the MSM7227 IC for further processing.

3. TECHNICAL BRIEF



Fig 1.2-1 RTR6285 RX feature

3. TECHNICAL BRIEF



3.2.2 GSM Transmitter

The RTR6285 transmitter outputs(HB_RF_OUT1 and LB_RF_OUT1)include on-chip output matching inductors. 50ohm output impedance is achieved by adding a series capacitor at the output pins. The capacitor value may be optimized for specific applictions and PCB characteristics based on pass-band symmetry about the band center frequency, the suggested starting value is shown in Figure1.2.2

Figure 1.2-2 GSM Transmitter matching

The RTR6285 IC is able to support GSM 850/1900 and GSM 1800/1900 mode transmitting. This design guideline shows a quad-band GSM application.

Both high-band and low band outputs are followed by resistive pads to ensure that the load

Presented to the outputs remains close to 50ohm. The low-band GSM. Tx sSAW can be eliminated because ETSI spec requires mid channels to pass RX Band noise only.

3. TECHNICAL BRIEF



3.3 UMTS Mode

3.3.1 Receiver

The UMTS duplexer receiver outputs are routed to LNA circuits within the RTR6285 device.

The RTR6285/RTR6285 receive paths include four WCDMA Rx signal paths(two single-ended and two differential) for one UMTS low-band and three UMTS high-bands.

WCDMA_�100_RX

WCDMA_800_RX

Figure 1.3-1 RTR6285 IC functional block diagram

3. TECHNICAL BRIEF



The two RTR6285/RTR6285 UMTS single-ended inputs accept its UMTS 2100/1900/1800/1700 input signal from the handset RF front-end filters. The UMTS Rx inputs are provided with onchip LNAs that amplify the signal before second-stage filters that provide differential signal to a shared downconverter. This second-stage input is configured differentially to optimize secondorder inter-modulation and common mode rejection performance. The gain of the UMTS front-end amplifier and the UMTS second-stage differential amplifier are adjustable, under MSM control, to extend the dynamic range of the receivers.

The second-stage UMTS Rx amplifiers drive the RF ports of the quadrature RF-to-baseband downconverters. The downconverted UMTS Rx baseband outputs are routed to lowpass filters having passband and stopband characteristics suitable for UMTS Rx processing. These filter circuits allow DC-offset corrections, and their differential outputs are buffered to interface with the MSM IC.

The RTR6285/RTR6285 UMTS differential input paths stay on-chip; off-chip inter-stage filtering is not required. Other than this, the architecture is similar to the single-ended inputs. The UMTS duplexer receiver output is routed to LNA circuits within the RTR6285 device. UMTS LNA circuits(one for low-band UMTS and one for high-band UMTS path) separated from all other receive functions contained within the RTR6285 IC to improve mixer LO to RF isolation- a critical parameter in the ZIF architecture. Isolation is further improved using high-reverse isolation circuits in the LNA designs

3. TECHNICAL BRIEF



3.3.2 Transmitter

The RTR6285/RTR6285 transmit includes four transmit signal paths with five outputs (three high bands and two low bands) supporting multi-band and multi-mode GSM/GPRS/EDGE polar transmit and WCDMA/HSDPA transmit architectures. The transmit path begins with differential baseband signals (I and Q) from the MSM device.

These analog input signals are buffered, filtered by low-pass filters, amplified, and then applied to the quadrature upconverter mixers. The upconverter outputs are amplified by multiple variable gain stages that provide transmit AGC control. SSBI control from the MSM IC is used to generate the gain range control signal. The AGC outputs are then applied to the high-band and low-output driver amplifiers; the specified driver amplifier output level is achieved while supporting the GSM/EDGE and UMTS transmit standard’s requirements for GSM ORFS, carrier and image suppression, WCDMA ACLR, spurious emissions, Rx-band noise, and so forth. Again, the upconverter LO signals are generated by circuits described in Section 1.2.3. These upconverters translate the polar GMSK-modulated or 8-PSK modulated baseband PM signals and/or WCDMA baseband signals directly to the RF signals, which are filtered and fed into the GSM/EDGE polar PA and/or WCDMA PA. The WCDMA TX power is coupled back to the RTR6285/RTR6285 internal power detector input pin, PWD_DET_IN, using a coupler for power measurement.

The low-band drive amplifiers are used to transmit the polar phase modulated (PM) signal for GSM/EDGE 850/900 while the high-band driver amplifiers are for the GSM/EDGE 1800/1900.

By using the radioOne architecture, the same high-band transmit path can be used to transmit the UMTS 2100/1900/1800/1700 signal, and the low-band transmit path can be used to transmit the UMTS 800/850/900 signal, depending on the application. The envelope path is used in polar mode of operation for GSM and EDGE. Input from the MSM IC, the baseband envelope (AM) signal, is applied directly to the ramp control pin of the GSM/EDGE polar PA to modulate the power supply of the PA so that the polar modulated GSM/EDGE signal in the MSM can be recovered and transmitted.

3. TECHNICAL BRIEF



WCDMA_�100_TX

WCDMA_800_TX

Figure 1.3-2 RTR6285 IC functional block diagram

3. TECHNICAL BRIEF



3.4 LO Phase-locked Loop

The integrated LO generation and distribution circuits are driven by internal VCOs to support various modes to yield highly flexible quadrature LO outputs that drive all GSM/EDGE, UMTS band and GPS upconverters and downconverters; with the help of these LO generation and distribution circuits, true zero-IF architecture is employed in all GSM and UMTS band receivers and transmitters to translate the signal directly from RF-to-baseband and from baseband-to-RF.

Two fully functional fractional-N synthesizers, including VCOs and loop filters, are integrated within the RTR6285/RTR6285 IC. In addition, the RTR6285 has a third synthesizer used for GPS operation. The first synthesizer (PLL1) in the RTR6285/6280 creates the transceiver LOs that support the UMTS transmitter, and all four GSM band receivers and transmitters including: GSM 850, GSM 900, GSM 1800, and GSM 1900. The second synthesizer (PLL2) in the RTR6285/RTR6285 IC provides the LO for the UMTS primary receiver. For the RTR6285 IC only, the second synthesizer also provides the LO for the secondary UMTS receiver. The third synthesizer (PLL3), only in the RTR6285 IC, provides the LO for the GPS receiver. An external TCXO input signal is required to provide the synthesizer frequency reference to which the PLL is phase and frequency locked. The RTR6285/RTR6285 ICs integrate most of the PLL loop filter components on-chip except for three off-chip loop filter-series capacitors, which significantly reduces off-chip component requirement. With the integrated fractional-N PLL synthesizers, the RTR6285/RTR6285 ICs have the advantage of more flexible loop bandwidth control, fast lock time, and low-integrated phase error.

RTR6285 PLL’s functional block diagram

GSM RX/TX / WCDMA TX

WCDMA RX

GPS RX

3. TECHNICAL BRIEF



3.5 Off-chip RF Components

3.5.1 Front End module (FL1001 : D5017)

Product Description

D5017 is a transmit and receive Front End Module (FEM) designed in a very low profile (1.1 mm), compact form factor for quad-band cellular handsets comprising GSM850/900, DCS1800, and PCS1900 operation . RF input and output ports of the D5017 are internally matched to a 50 Ω load to reduce the number of external components for a quad-band design. Band selection and control of transmit and receive RF signal flows are performed by use of four external control pads. See Figure 1.5.1 shown on overleaf. Mode of operation Tx, Rx, Band (GSM850, GSM900, DCS, PCS, and UMTS) is controlled with CTRL 1~4 inputs (figure 1.5.2)

Fig 1.5-1 D5017 block diagram

3. TECHNICAL BRIEF



Absolute Maximum Ratings1

D5017 Control Characteristics

Fiure 1.5.2 D5017 control table

3. TECHNICAL BRIEF



3.5.2 UMTS 2100 duplexer ; (FL1003 : SAYFP1G95AA0B00)

3. TECHNICAL BRIEF



3. TECHNICAL BRIEF



3.5.3 UMTS 800 duplexer (FL1004 : SAYFP836MCA0F00R00)

3. TECHNICAL BRIEF



3. TECHNICAL BRIEF



3.5.4 UMTS 2100 Power Amplifier modules (U1003 : SKY77701)

SKY77701 Description

The SKY77701 Power Amplifier Module(PAM) is a fully matched 10-pad surface mount module developed for WCDMA applications. This small and efficient module packs full 1920-1980Mhz bandwith coverage into a single compact packae. Because of high efficiencies attaited throught the entire power range, the SKY77701 delivers unsurpassed talk-time advantages. A directional coupler is intergrated into the module thus eliminating the need for any any external coupler. The SKY77701 PAM is manufactured with Skyworks’ InGaP GaAs HBT BiFET process that provides for all positive voltage DC supply operation while maintaining high efficiency and good linearity. Primary bias to the SKY77701 is supplied directly from any three-cell Ni-Cd, a single-cell li-ion,or other suitable battery with an output in the 3.2 to 4.2Volt range. Power down is accomplished by setting the voltage on VENABLE to zero volts.

SKY77701 Functional block diagram

3. Technical Brief

- 43 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes


SKY77701 Pin names and configuration(top view)

SKY77701 Absolute Electrical ratings

VCC1

RF_IN

VMODE_1

VMODE_0

VEN

VCC2

RF_OUT

CPL_IN

GND

CPL_OUTGROUND PAD

1

2

3

4

5

10

9

8

7

6

SKY77701 Pin names and configuration(top view)

SKY77701 Absolute Electrical ratings

3. TECHNICAL BRIEF



SKY77701 Recommecded operation conditions

SKY77701 Mode of Operation

3. TECHNICAL BRIEF



3.5.5 UMTS 800 Power Amplifier modules (U1004: SKY77704)

SKY77704Description

The SKY77704Power Amplifier Module(PAM) is a fully matched 10-pad surface mount module developed for WCDMA applications. This small and efficient module packs full 824-849Mhz bandwith coverage into a single compact packae. Because of high efficiencies attaited throught the entire power range, the SKY77704 delivers unsurpassed talk-time advantages. A directional coupler is intergrated into the module thus eliminating the need for any any external coupler.The SKY77704 PAM is manufactured with Skyworks’ InGaP GaAs HBT BiFET process that provides for all positive voltage DC supply operation while maintaining high efficiency and good linearity. Primary bias to the SKY77704 is supplied directly from any three-cell Ni-Cd, a single-cell li-ion,or other suitable battery with an output in the 3.2 to 4.2Volt range. Power down is accomplished by setting the voltage on VENABLE to zero volts.

SKY77704 Block Diagram

3. TECHNICAL BRIEF



SKY77704 Pin names and Configuration(top view)

SKY77704 Absolute Maximum rating

3. TECHNICAL BRIEF



SKY77704 Recommended Operation Conditions

SKY77704 Mode of Operation

3. TECHNICAL BRIEF



SKY77704 Electrical Specifications for Nominal operating conditions

3. TECHNICAL BRIEF



3.5.6 UMTS Rx SAW filter (FL1002: SAFEB2G14FA0F00)

An RF filter is located between the UMTS LNA and mixer. Insertion loss is important, but not as critical as losses before the LNA. The most important parameters of this component include:

■ Out-of-band rejection or attenuation levels, usually specified to meet these conditions:

□ Far out-of-band signals - ranging from DC up to the first band of particular concern and from the last band of particular concern to beyond three times the highest passband frequency.

□ Tx-band leakage - the transmitter channel power, although attenuated by the duplexer, still presents a cross- modulation threat in combination with Rx-band jammers. The RF filter must provide rejection of this Tx-band leakage.

□ Other frequencies of particular concern . bands known to include other wireless transmitters that may deliver significant power levels to the receiver input.

■ Phase and amplitude balance - the ZIF architecture requires well-balanced differential inputs to the RTR6285/80. This is accomplished by the RF filters which take a single-ended outputs from the ICs and provide differential outputs having nominal 180° phase separation. Phase and/or amplitude imbalance causes degraded common-mode rejection and second-order nonlinearity, so their requirements are specified jointly.

3. TECHNICAL BRIEF



Table 1.5-6 SAFEB2G14FA0F00 Electrical specification.

3. TECHNICAL BRIEF



3.5.7 VCTCXO (X300 : KT-3225L-19.2MHz)

The Voltage Controlled Temperature Compensated Crystal Oscillator (VCTCXO) provides the reference frequency for all RFIC synthesizers as well as clock generation functions within the MSM7227 IC. The oscillator frequency is controlled by the MSM7227’s TRK_LO_ADJ pulse density modulated signal in the same manner as the transmit gain control.

The filtered PDM signal results in an analog control signal into the VCTCXO tuning port whose voltage is directly proportional to the density of the digital bit stream. The MSM device varies the pulse density to change the analog control voltage that sets the oscillator frequency – all within a feedback control loop that minimizes handset frequency drift relative to the network.

3.5.8 UMTS 2100 TX SAW Filter (FL1004 : SAFEB1G95KA0F00)

3. TECHNICAL BRIEF



3.5.9 UMTS 800 TX SAW Filter (FL1005 : SAFEB836MAL0F00)

3. TECHNICAL BRIEF



3. Technical Brief

3.6 Digital Baseband(DBB/MSM7227)

3.6.1 General Description

L-04C supports UMTS-800, UMTS-2100, GSM-900, GSM -1800, GSM-1900. All receivers and the transmitter use the radio One Zero-IF architecture to eliminate intermediate frequencies, directly converting signals between RF and baseband.

A generic, high-level functional block diagram of L-04C is shown in Figure 1. One antenna collects base station g , g g gforward link signals and radiates handset reverse link signals. The antenna connects with receive and transmit paths through a SPDT( Single Port Double Throw ).

RTR6285 receive paths include four GSM/EDGE Rx signal paths that supportGSM 900, 1800, and 1900 bands, and four WCDMA Rx signal paths(two single-ended and two differential) for one UMTS low-band and three UMTS high-bands.

RTR6285 transmit includes four transmit signal paths with five outputs (three high bands and two low bands) supporting multi-band and multi-mode GSM/GPRS/EDGE polar transmit and WCDMA/HSDPA transmit architectures.

L-04C power is managed and regulated by the PM7540 Power Management IC. This versatile device integrates all wireless handset power management, general housekeeping, and user interface support functions into a single mixed signal IC. It monitors and controls the external power source and coordinates battery recharging while maintaining the handset supply voltages using low dropout, programmable regulators.

The device’s general housekeeping functions include an ADC and analog multiplexer circuit for monitoring on-chip voltage sources, charging status, and current flow, as well as user-defined off-chip variables such as temperature and battery ID. Various oscillator, clock, and counter circuits support IC and higher-level handset functions. Key parameters such as under-voltage lockout and crystal oscillator signal presence are monitored to protect against detrimental conditions.

3. TECHNICAL BRIEF



A. Features(MSM7227)

The basic MSM7227 system solution consists of the MSM7227, RTR6285™, and PM7540™ ICs, plus AMSS™ system software with the SURF7227™ platform available for development.

General features include:

WCDMA Rel ‘99 plus HSDPA and HSUPA

GSM/GPRS/EDGE

High-performance ARM1136JF-S™ application processor at up to 600 MHz; QDSP5000™ at 320 MHz

High-performance ARM926EJ-S™ modem processor at up to 400 MHz; QDSP4000™ at 122.88 MHz

Java® hardware acceleration for faster Java-based games and other applets

Support for Bluetooth® 2.1 EDR via an external Bluetooth System-on-Chip (SoC)

High-speed, serial mobile display digital interface (MDDI) that optimizes the interconnection cost between the MSM device and the LCD panel

R i di it t f WCDMA d th b idi i d it d d t th h tReceive diversity support for WCDMA mode, thereby providing improved capacity and data throughput

USB 2.0 compliant high-speed USB core with limited OTG capabilities

Integrated high-speed USB PHY

Integrated wideband stereo codec for digital audio applications

Direct interface to digital camera module with video front-end (VFE) image processing

GPS position location capabilities

Vocoder s pport (GSM HR FR EFR AMR and AMR WB/+)Vocoder support (GSM-HR, FR, EFR, AMR, and AMR-WB/+)

Advanced 12 × 12 ×1.05 mm, 0.4 mm pitch, 560 NSP

3. TECHNICAL BRIEF



Figure. MSM7227 functionl Block Diagram in typical application

3. TECHNICAL BRIEF



3.7 Modem system / subsystem

3. Technical Brief

The modem subsystem includes all blocks that provide modem functionality directly (such as airlink modulation and demodulation, searching, etc) plus supporting functions (such as the modem DSP, modem AHB bus, sleep controller, interrupt controller, etc):

■ An ARM926EJ-S (ARM9) as the main modem processor.

■ A bridge to the peripheral bus that connects the modem subsystem to functions like the crypto-engine, keypad, UART, and EBI2.

■ Th AHB t AXI b id th t id t hi h d i EBI1 ll th ti li ti■ The AHB-to-AXI bridge that provides access to high-speed memory via EBI1 as well as the entire applications subsystem.

■ A modem DSP (mDSP) that controls modem hardware blocks and assists with symbol-level processing of physical layer traffic. All modem functions require mDSP support to operate.It has a limited amount of processing power and program/data storage; it must meet the sum of all modem MIPS and memory requirements (plus some overhead) for concurrent operation.

■ A 64 kB secure boot ROM containing the primary boot loader for the ARM9 processor.

■ An internal RAM (IRAM) used for inter-processor communications between the modem and applications processors. Its top eight word locations are vectors to the modem processor exception handlers.

■ A security mode control (SMC) block

Electrical fuses that are used to disable specific functionality (such as ARM debug modes

that are useful for testing but pose a potential security breach during normal operation).

Memory protection that physically prevents certain masters on the modem subsystem bus from accessingMemory protection that physically prevents certain masters on the modem subsystem bus from accessing certain memory regions. This memory protection prevents modem DM access to either IRAM or the SMC; it only allows access via the modem ARM in its supervisor mode.

The SMC block also contains other security features, such as a device ID to uniquely identify a chip.

■ An always-on modem power manager (MPM) block that controls power collapsing of the modem subsystem.

3. TECHNICAL BRIEF



3. Technical Brief

Bus interfaces provide the necessary connections to other functions:

■ The high-speed AXI bus provides access to the applications subsystem.

The modem processor and other masters can access the application subsystem, but masters within the p pp yapplication subsystem (such as the application processor) cannot access the modem subsystem for

security reasons.

■ The local AHB bus is connected to the peripheral subsystem through a bridge. The modem processor shares access to this subsystem with the applications processor. Peripherals include standard interfaces (such as USB, UART, and UIM) for external communications, and can access MSM-internal peripheral functions as well.

■ The local AHB bus also bridges to asynchronous buses to communicate with the modem hardware blocks■ The local AHB bus also bridges to asynchronous buses to communicate with the modem hardware blocks.

■ The local AHB bus is a slow-speed request/acknowledge-based bus that is used to configure the modem cores.

■ The DM host interface is used to program the data mover through the modem processor. Since these data paths have moderately high data rates (up to 3.1 Mbit/sec plus overhead), they have a direct connection to the AHB instead of going through an asynchronous bus.

Figure. MSM7227 modem subystem functional block diagram

3. TECHNICAL BRIEF



3.7.1 ARM9 modem processor

3. Technical Brief

The ARM9 is a single-clock, high-performance, Java-enabled, synthesizable core:

■ Harvard architecture, 16 kB instruction and 16 kB data caches; each 4-way associative supported on the modem subsystem

■ ARM and THUMB states are supported

■ Jazelle ARM9 core (Java support)

■ Embedded trace macrocell (ETM) supportpp

■DC power-saving techniques

■Operation at a target frequency of 400 MHz

Key functions and modes are discussed in the following subsections.

3.7.2 Reset and pauseThe modem microprocessor includes reset and pause functions that are responsible for:

■ Generating synchronous reset signals for the modem processor as well as the other bus architecture peripherals.

■ Providing status information concerning the source of the last reset (pin or watchdog generated).

■ Controlling the clock to the ARM microprocessor, thereby providing reset or pause mechanisms for the modem processor.

■ Allowing software to control this pause mechanism to halt the ARM for a specified duration.

3. TECHNICAL BRIEF



3.7.3 Watchdog timerW t hd ti h t i ti

3. Technical Brief

Watchdog timer characteristics:

14-bit counter running off the sleep controller clock regime

Enables the handset to recover from unexpected hardware or software anomalies

If the microprocessor fails to periodically reset the watchdog timer the timer expires and the handset is reset

Disabled and/or reset by grounding the WDOG_EN pin or by asserting the RESIN_N pin Hardware disabling example: the ARM processor enters debug mode (indicated by the DBGACK pin of the processor

i i i f l hi h)transitioning from low to high)

Enabled by leaving the WDOG_EN pin unconnected (it has an internal pull-up) or by connecting it to VDD If temporarily disabled, it can be re-enabled by applying a system reset that clears the state of the internal signal wdog_disable When enabled, the watchdog circuit pulses the WATCHDOG_EXPIRED signal whenever its timer has expired. In NATIVE mode this signal is combined with the RESIN_N pin to generate the RESOUT_N signals and the MSM device's internal reset.

3.7.4 Sleep mode and watchdog freezeThe modem processor cannot reset the watchdog timer while in its sleep mode, but the watchdog can be frozen before entering sleep mode. To enable the freeze, the microprocessor writes a 1-0 sequence to the WDOG_FREEZE register.

3.7.5 Non-sleep modepIn non-sleep mode the processor must reset the watchdog timer at least once every 390 ms. If not, the watchdog timer expires and asserts an internal RESIN_N signal to the system. The WDOG_EXPIRED signal lasts between 53 and 106 ms (97.5 ms typical). To reset the watchdog timer, the microprocessor must write a 1-0-1 sequence to the WATCH_DOG bit of the SLEEP_CTL register.

3. TECHNICAL BRIEF



3.7.6 Modem DSP (mDSP)

3. Technical Brief

The modem subsystem includes the modem DSP (mDSP) and supporting blocks like the data mover, a master that is connected to the AXI bus for access to internal and external memory. A QDSP4000 running at up to 128 MHz is used.

3.7.7 Applications system

The MSM7227 applications system consists of the following subsystems and major functional blocks.

The ARM1136JF-S (ARM11) applications processor subsystem with supporting watchdog, clock, and timers

The applications subsystem that includes key apps functions (the aDSP and data mover) plus severalmultimedia and connectivity functions

The peripheral subsystem

Peripheral functions like crypto-engine, SDIOs, EBI2, UART/UIM, I2C, etc. Most of these functions are discussed within the connectivity chapter.y pA bridge that connects the modem subsystem, applications processor subsystem, aDSP, applications data mover, and MDP to the peripheral functions. The peripheral buses

AXI wrappers and AXI bus that connect the applications system to the modem system The applications system includes six AXI bus masters: 1) aDSP external memory master, 2) data mover, 3) HS USB, 4) MDDI, 5) VFE, and 6) MDP. The AXI bus is discussed in Section 3.3.1, but a few comments about the applications system masters are highlighted here: y g g

The data mover is a general-purpose DMA engine that supports up to 16 channels. Under control of the modem ARM, application ARM, or aDSP, it handles memory-to-memory data transfers as well as aDSP, crypto engine, NAND controller, SD controller, and USB RLP data transfers.

The data mover is used for byte alignment/packing of USB RLP data and putting it back into system memory, and then the USB DMA master transfers the byte-aligned data from system memory. The USB AHB slave interface is on the peripheral bus and is used for configuring the USB registers.

The mobile display processor is a hardware accelerator responsible for transferring an updated image from system memory to an LCD module through the MDDI host. The video front-end receives camera data directly from the parallel camera interface. It communicates with aDSP through an xDMA channel and has its own AXI bus master to access system memory.

3. TECHNICAL BRIEF



3. Technical Brief

Memory

D l b t th hi h d b t (EBI1) f l d dDual-memory buses separate the high-speed memory subsystem (EBI1) from low-speed memory and peripheral devices (EBI2).

The example application supports 200 MHz DDR SDRAM memory on EBI1, and adds NAND memory and the UBM™ subsystem via EBI2 (either 1.8 or 2.6 V devices).

Other EBI2 device options include mux OneNAND™ flash memory and LCD support. EBI2 memory is used for system boot .

Air interfaces

The MSM7227 device supports WCDMA (Rel ‘99, HSDPA, and HSUPA), and GSM (Rel ‘99, GPRS, and EDGE). These enable rich wireless multimedia services, such as high-speed upload of multimedia files and attachments, interactive gaming, and a variety of IP-based services such as voice over internet protocol (VoIP).

Real-time conversation services such as push-to-talk, video telephony, and instant multimedia (an extension of push-to-talk that combines immediate voice with simultaneous delivery of video and pictures) are also supported.

Very high peak data rates are supported: 7.2 Mbps on the downlink and 5.76 Mbps on the uplink using HSDPA/HSUPA.

Such high data rates enable network operators to provide an even broader range of wireless multimedia and other data services for consumers and enterprise customers. HSDPA/HSUPA are optimized for packet data service and provide some of the lowest costs per bit when compared with other wireless wide areadata service and provide some of the lowest costs per bit when compared with other wireless wide area network (WWAN) technologies.

The MSM7227 solution integrates powerful application processors into the Qualcomm market-proven wireless modem, offering increased processing capacity combined with lower power consumption.

With the MSM7227 chipset solution, handset manufacturers can design sleek, converged consumer wireless devices that boast the industry’s most advanced image quality and resolution to provide enhanced 3D animation, gaming, streaming video, videoconferencing, broadcast reception, and more.

Multimedia

The MSM7227 IC enables Enhanced Platform products that leverage the convenience of consumer electronics to support a wide array of multimedia features.

Camera interface and video front-end

Expanded image processing capabilities include a direct interface for digital camera modules with videoExpanded image-processing capabilities include a direct interface for digital camera modules with video front-end image processing. The high-quality digital-camera processing supports CCD or CMOS image sensors up to 8 megapixels.

3. TECHNICAL BRIEF



3. Technical Brief

Display support

Di l i l d hi h d bil di l di i l i f (MDDI) f i i bDisplay support includes a high-speed mobile display digital interface (MDDI) for communications between the MSM and display devices and/or a camera. The third-generation mobile display processor (MDP3) is a hardware accelerator that: 1) improves processing speeds; 2) has a more flexible architecture; and 3) expands compatibility to include the RGB interface – relative to previous generations. The embedded LCD controller is also used to support the RGB interface.

Audio codec

The integrated wideband stereo codec supports digital audio applications with several input/output combinations:

Left and right LINE inputs, two MIC inputs, and one auxiliary input Headphone, earpiece, LINE, and auxiliary outputs Key audio features include: external vocoder support; internal vocoder that supports 13 kbps PureVoice®; PureVoice VR™ voice recognition; acoustic echo cancellation; PureVoice Audio AGC™; standard MIDI with 16 voices; and 128-tone CMX® (text, picture, and MIDI streaming).

Connectivity

In addition to the basic handset-control interfaces like the keypad and touch screen, the MSM7227 IC supports a variety of consumer electronics with its connectivity ports:

High-speed universal serial bus (HS-USB) with built-in PHY

USB universal integrated circuit card (UICC)USB universal integrated circuit card (UICC)

Four universal asynchronous receiver transmitter (UART) serial ports

Two data mover (DM) high-speed UARTs (4 Mbps)

Two user identity module (UIM) controllers; 1.8 and 3.0 V optionsFour integrated 4-bit secure digital (SD) controllers for SD/mini-SD cards and SDIO; two can be combined to form one 8-bit SDIO interface Transport stream interface (TSIF) for reception of digital mobile broadcast signals, including the Qualcomm MediaFLO™ technology, DVB-H, ISDB-T, T-DMB, and S-DMB LCD controller for RGB interface gyAUX_PCM for Bluetooth, stereo ADC, and stereo DAC support Inter-integrated circuit (I2C) interface for peripheral devices Various combinations of these connectivity ports are used to support wireless connectivity systems, including:Bluetooth (BT 2.1 EDR) – requires an external Bluetooth system-on-chip IC, (for example, the Qualcomm BTS4025™ device)802.11 wireless local area network (WLAN) – requires an external system-on-chip (SoC) Universal Broadcast Modem™ (UBM) device – requires an external Mobile Broadcast Platform IC, either the QualcommMBP1600™ or the MBP1610™ device

3. TECHNICAL BRIEF



RF transceivers

T RFIC d h k h d i li k

3. Technical Brief

Two RFICs are used to connect to the networks over the supported airlinks:

The RTR6285™ RF transceiver IC supports UMTS and GSM reception and transmission over the following operating bands:

Low band UMTS paths support UMTS-800, UMTS-850, and UMTS-900 High band UMTS paths support UMTS-1700, UMTS-1800, UMTS-1900, UMTS-2100, and UMTS-AW Low band GSM paths support GSM-850 and GSM-900 High band GSM paths support GSM-1800 and GSM-1900 The RTR6285 RFIC includes primary and secondary receiver paths, thereby enabling advanced techniques such as Mobile Receive Diversity (MRD). Additional RFIC details are available in their document sets (80-VD861-x for the RTR6285 IC).

Power management

The MSM7227 chipset is powered by a Qualcomm powerOne™ series PM7540™ power management IC. The power source is selected from either the battery, external charger, adaptor, or USB device, and then the IC generates all of the regulated voltages needed to power the handset electronics. The main battery and backup coin-cell voltages are monitored, and charging is conducted as needed.

In addition to these basic power functions, the PMIC also provides:

Housekeeping functions

Analog multiplexer that allows monitoring of IC-level and handset-level sensors System clocks, including the MSM IC’s 32 kHz sleep clock and 19.2 MHz operating clock Real-time clock and associated alarms.

- User interfaces

- Current drivers for keypad and LCD backlights, LEDs, and camera flash

- Vibration driver for silent incoming call alerts

- Two-channel speaker driver for far-field speakers

- Video amplifier for camcorder or slide presentations

IC l l i f- IC-level interfaces

- Monitoring of triggering events and coordination of the power-on and power-off sequences

Software features

Qualcomm provides a complete software suite that extends handset capabilities and expedites product development.

3. TECHNICAL BRIEF



Advance Mobile Subscriber Software (AMSS)

Many hardware features and operational parameters are enabled by the proper versions of AMSS software

3. Technical Brief

Many hardware features and operational parameters are enabled by the proper versions of AMSS software. This software is designed to run on a Subscriber Unit Reference (SURF™) phone platform, an optional development platform used to evaluate, test, and debug AMSS software.

Launchpad™ Suite

The Launchpad Suite of integrated applications offers wireless operators and manufacturers a cost-effective, scalable, and timely solution for providing advanced wireless data services. This seamlessly integratedscalable, and timely solution for providing advanced wireless data services. This seamlessly integrated solution enables advanced next-generation applications and services that incorporate multimedia, position-location, connectivity, customized user interface, and storage capabilities. Launchpad features are available for each Qualcomm chipset, closely matching the specific functionality and cost-target objectives agreed upon in joint product planning with manufacturers and wireless service operators worldwide.

The MSM7227 solution supports Launchpad’s advanced feature set, including streaming video and audio, still-image and video encoding and decoding, Java acceleration, and an 8-megapixel camera interface.still image and video encoding and decoding, Java acceleration, and an 8 megapixel camera interface. The MSM7227 solution also integrates gpsOne® functionality to support assisted and standalone GPS –enabling a wide variety of location-based services and applications, including points-of-interest, personal navigation, and friend finder. Seamless communication directly with printers, digital cameras, keyboards, and other accessories is also supported via the integrated wireless Bluetooth and USB controller functions.

3. TECHNICAL BRIEF



3.8 Power Block

3. Technical Brief

3.8.1 General

MSM7227 included RF, is fully covered by PM7540(Qualcomm PMIC). PM7540 cover The power of MSM7227, MSM memory, RF block, Micro SD, USIM and TCXO.

Major power components are :

PM7540 (U704, Main PCB) : Phone Power Supply

AAT2870 (U101, Qwerty Key PCB) : LCD Backlight charge pump

MAX17040G (U1005, Main PCB) : FUEL GUAGE IC

3.8.2 PM7540

The PM7540 device (Figure 1-1) integrates all wireless handset power management, general housekeeping, and user interface support functions into a single mixed signal IC.Its versatile design is suitable for CDMA and non-CDMA handsets, and other wireless products such as PC PDAs.

The power management portion accepts power from common sources - battery, external charger, adapter, USB_VBUS, coin cell backup - and generates all the regulated voltages needed to power the appropriate handset electronics. It monitors and controls the power sources, detecting which sources are applied, verifying that they are within acceptable operational limits, and coordinates battery and coin cell recharging while maintaining the handset electronics supply voltages.

On-chip voltage regulators generate 24 programmable output voltages using a combination of switched-mode power supplies and low dropout voltage regulators, all derived from a common trimmed voltage reference. One regulator is dedicated for generating microphone bias voltages.

The device's general housekeeping functions include a 16-position analog multiplexer that has five internal connections, six hardwired external connections, and supports an additional 22 external connections. The internal connections are used to monitor on-chip functions such as the temperature sensor. The hardwired external connections access input power nodes such as VCHG, VBAT, etc. p p , ,The 22 additional external connections are made using the IC's multipurpose pins configured as analog inputs that are routed through switch circuits to create five multiplexer inputs; these are available to monitor system parameters such as temperature and battery ID.

3. TECHNICAL BRIEF



The multiplexer output signal's offset and gain is adjusted, then buffered and routed to the Mobile Station Modem™ (MSM™) device for analog-to-digital conversion.

3. Technical Brief

( ) g gVarious oscillator, clock, and counter circuits are provided to initialize and maintain valid pulse waveforms and measure time intervals for higher-level handset functions. A dedicated controller manages the TCXO warmup and signal buffering, and key parameters are monitored to protect against detrimental conditions.

Figure. PM7540 functional block diagram

3. TECHNICAL BRIEF



Handset-level user interfaces are also supported. The IC includes four backlight or LED drivers with brightness (current) control that could be used for keypad, LCD, camera flash, and general-purpose drivers.

3. Technical Brief

brightness (current) control that could be used for keypad, LCD, camera flash, and general purpose drivers. A vibration motor driver alerts handset users of incoming calls, and a two-channel speaker driver with volume control can be used for audio alerts or speakerphone and melody-ringer applications. The speaker circuits accept stereo differential, stereo single-ended, and mono-differential inputs, and can be configured for stereo or mono outputs. A video amplifier is included that allows the handset to be used as a camcorder or for slide presentations.

IC-level interfaces include the configurable serial bus interface (SBI) used by the MSM device to control and status the PM7540 IC. This bus is supplemented by an interrupt manager for time-critical information.status the PM7540 IC. This bus is supplemented by an interrupt manager for time critical information. Another dedicated IC interface circuit monitors multiple trigger events and controls the poweron/poweron sequences. A universal serial bus/on-the-go (USB-OTG) transceiver is included for interfacing the MSM device to computers as a USB peripheral, or connecting the MSM device to other peripherals. removable user identity module (RUIM) level translators enable MSM device interfacing with external modules.

The PM7540 IC is a mixed signal BiCMOS device and is available in the 137-pin chip scale package (137-CSP) that includes several center ground pins for electrical ground and thermal relief.that includes several center ground pins for electrical ground and thermal relief.

Since the PM7540 IC includes so many diverse functions, its operation is more easily understood by considering major functional blocks individually. Therefore, the PM7540 document set is organized by the following device functionality:

■ Input power management

■Output voltage regulation

■ General housekeeping■ General housekeeping

■ User interfaces

■ IC interfaces

■Multipurpose pins (which can be configured to function within some of the other categories)

3. TECHNICAL BRIEF



3.8.3 Charging control

3. Technical Brief

Voltage regulation (VDD or VBAT)

The PM7540 IC provides closed-loop control of the active pass transistor (via CHG_CTL_N or USB_CTL_N) to regulate either the handset supply voltage (VDD) when not charging or the main battery final voltage (VBAT) when charging. When fast charging is disabled, the battery MOSFET is opened and the voltage regulation point is the ISNS_M pin (VDD). When fast charging is enabled, the VBAT pin is the voltage regulation point,

thereby improving the voltage precision of the fully charged battery (Li-ion battery manufacturers specify 1% accuracy).

3. TECHNICAL BRIEF



Current regulation, monitoring, and protection

3. Technical Brief

If a sense resistor is installed across ISNS_P and ISNS_M (pins C1 and C2, respectively) the PM7540 IC constantly monitors the total handset electronics plus charging current. If the programmed current threshold is exceeded, the active pass transistor is forced to a higher resistance, disrupting VDD or VBAT regulation but protecting against excess current. The VCHG current monitor defaults to its 1 Amp current setting upon powerup, thereby minimizing the risk of a large in-rush load collapsing VDD. Similarly, the VUSB current monitor defaults to its 0.5 A current setting upon powerup.

Battery C it Battery Voltage

Battery Icon Battery Capacity BarCapacity y g

90% 4.02V 0.05(3.97V~4.07V)

60% 3.76V 0.05(3.71V~3.81V)

30% 3.67V 0.05(3.62V~3.72V)

90~100 6

70~89 5

50~69 4

30~49 3

15~29 2

10% 3.58V 0.05(3.53V~3.63V)

OFF Under 3.30V

5~14 1

0~4 0

L-04C Battery Bar Display

3. TECHNICAL BRIEF



Main Battery Charging

3. Technical Brief

The PM7540 IC provides support circuitry for charging lithium-ion batteries, cycling through as many as four charging techniques: trickle, constant current, constant voltage, and pulsed. Battery voltage, external supply voltage, and total detected current measurements are available to the MSM device through the PM7540 analog multiplexer.This allows the MSM device to monitor charging parameters, make decisions, and control the charging process.

3. TECHNICAL BRIEF



Trickle Charging

3. Technical Brief

Trickle charging of the main battery, enabled through MSM control and powered from VDD, is provided by the PM7540 IC. This mode is used to raise a severely depleted battery's voltage to a level sufficient to begin fast charging.

Parameter Min Typ Max Unit

Trickle Current 60 80 100 mA

3. TECHNICAL BRIEF



3. Technical Brief

Constant Current Charging

The PM7540 IC supports constant current charging of the main battery by closing the battery MOSFET (connecting the battery to VDD), and closed-loop controlling the active pass transistor (charger or USB). The closed-loop control regulates the total current (handset electronics plus charging current) to match the programmed value (IMAXSEL).The MSM device monitors the charging process as described earlier and continues the constant current mode until the battery reaches its target voltage. Lithium-ion batteries require further charging using constant voltage or pulsed techniques.

3. TECHNICAL BRIEF



3. TECHNICAL BRIEF



Constant Voltage Charging

3. Technical Brief

Once constant current charging of a lithium-ion battery is finished, the charging continues using either constant voltage or pulse techniques.The MSM device and its software determines if and when it is appropriate to begin the constant voltage mode within the charging process. Usually the decision to stop the constant current mode is based upon the battery voltage reaching a programmed threshold slightly above the intended final voltage.

3. TECHNICAL BRIEF



Pulse charging

3. Technical Brief

Once constant current charging of a lithium-ion battery is finished, the charging continues using either constant voltage or pulse techniques.

Charging Feature

• Charging Method : CC & CV (Constant Current & Constant Voltage)• Maximum Charging Voltage : 4.225V• Maximum Charging Current : 500mA• Nominal Battery Capacity : 1350mAh• Charger Voltage : 5.4V• Charging time : Max 240min (Except time trickle charging) • Full charge indication current (icon stop current) : 140mA• Low battery message : 3.30 ± 0.05V

3. TECHNICAL BRIEF



3.8.4 MAX17040G

3. Technical Brief

The classical coulomb-counter-based fuel gauges suffer from accuracy drift due to the accumulation of the offset error in the current-sense measurement. Although the error is often very small, the error increases over time in such systems, cannot be eliminated, and requires periodic corrections. The corrections are usually performed on a predefined SOC level near full or empty. Some other systems use the relaxed battery voltage to perform corrections. These systems determine the true SOC based on the battery voltage after a long time of no activity. Both have the same limitation: if the correction condition is not observed over time in the actual application, the error in th t i b dl I t f ll h /di h l i i d t li i t th d iftthe system is boundless. In some systems, a full charge/discharge cycle is required to eliminate the drift error.

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3. TECHNICAL BRIEF



3.9 Memory Support

3. Technical Brief

The MSM7227 IC external memory support (Figure 3.9) includes the following major functions:

For high-speed memory devices – EBI1 port, DDR SDRAM controller, and the AXI memory controller (MemC) bridge for access to the AXI bus

For lower-speed memory devices, an LCD, and asynchronous devices like UBM – EBI2 port, a set of EBI2 controllers, and an AHB interface for access to the peripheral bus

i l hi h l l bl k diFigure3.9 Extemal memory support high-level block diagram

Table Memory and LCD configuration

Figure. 3.9 Extemal memory support high-level block diagram

Table.3.9 Memory and LCD configurations

3. TECHNICAL BRIEF



3.9.1 High-speed memory interface (EBI1)

3. Technical Brief

EBI1 provides connectivity between multiple bus masters and their high-bandwidth memory controllers. Using the AXI (Section 3.3.1) as a standard interface between bus masters and slaves ensures high-performance data transfers. The EBI1 high-level architecture (Figure 3.9.1) includes two major functional blocks:

AXI memory controller bridge – the interface block to the AXI bus interconnect. Its primary function is to communicate with command and data transfer masters through the interconnect; it supports most non-blocking features of the AXI bus protocol. g p

SDRAM controller – the memory controller that interfaces externally with DDR SDRAM devices, and internally with the AXI memory controller bridge over a 64-bit AHB-lite interface. Its primary function is to receive and execute SDRAM memory commands from the AXI memory controller bridge.

Figure3.9.1 EBI1 high-level archiecture

EBI1 connections

All EBI1-related pins are located in the same general area of the IC package. This allows optimal routing and should minimize interference from this bus to more sensitive functions (such as analog baseband). EBI1 layout guidelines are given in Section 4.3.3.2. A single 32-bit DDR SDRAM memory device or two 16-bit devices are supported (Figure 3.9.2).

3. TECHNICAL BRIEF



3. Technical Brief

Figure3.9.2 EBI1 intetface options

3. TECHNICAL BRIEF



Lower-speed memory interfaces (EBI2)

3. Technical Brief

The second external memory interface (Figure 3.9.3)provides the interface for slow peripheral devices such as LCDs, flash memory, and the UBM receiver. In order to support all these device types, the interface requires three different controllers: 　

- Serial flash controller – to access NAND and OneNAND devices 　- LCD controller – for LCD devices 　- External memory controller (EBI2_XMEM) – to access SRAM and generic asynchronous interface devices

(including the UBM receiver)

Figure3.9.3 EBI2 functional block diagram

General EBI2 features

1.8 V or 2.6 V memory interface support 　

Three categories of devices are supported 　- NAND or OneNAND via the serial flash controller- Display via the LCD controller

A h d i i h l ll (i l di UBM i )- Asynchronous devices via the external memory controller (including UBM receiver)

Boot from NAND or OneNAND In addition, specific EBI2 features are listed in each controller subsection.

3. TECHNICAL BRIEF



3. Technical Brief

Figure3.9.4 EBI2 example applition

3. TECHNICAL BRIEF



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WB2100_MIX_INM

WB2100_MIX_INP

WCDMA_2100_TX_OUT

VDDA2 [2.1V] : Pin 1,7,8,21,25,27,37,43

VDDA2 [2.1V] : Pin 54,60,61,62==> PLL1, PLL2, GPS PLL, VCOs

==> DCS/PCS LNA, dirver amp, mixers and baseband Tx

VDDA1 [2.7V] : Pin 3,4,6,10,22,53

Close to RTR

==> Baseband Rx, WCDMA LNA, Cell/EGSM LNA

VDDA1: PIN 3,4,6,10,22,53 = 2.7V VDC

1%

1608 1608

VDDA2: PIN 1,7,8,21,25,27,37,43,54,60,61,62 = 2.1V VDC

1608

0603

0603

0603

06030603

0603

3.10 H/W Sub System

3.10.1 RF Interface

3. TECHNICAL BRIEF



A. RTR6285 (WCDMA_Tx/Rx)

MSM7227 controls RF part(RTR6285) using these signals.

RTR SSBI : SSBI interface signals to control RTR6285RX_I/Q_M/P,TX_I/Q_M/P : I/Q data for Tx/Rx of RF

B. The others

RTR_TRK_LO_ADJ : VC-TCXO(19.2MHz) Control PA_ON0,1: WCDMA(2100,800) TX Power Amp EnablePA_R0: Power Amp Mode ControlGSM_PA_RAMP: GSM Power Amp gain control signalGSM_PA_EN: GSM Power Amp EnableGSM_PA_BAND: Power Amp Band select Control

3. TECHNICAL BRIEF



3.10.2 MSM Sub System

3. Technical Brief

3.10.2.1 USIM Interface

The MSM side is powered by (or referenced to) VREG_MSME or VREG_MSMP voltage; the selection is made via SBI. VREG_MSME can be programmed from 0.75V to 3.05 V in 25-mV increments, while the VREG_MSMP options are 1.5 V to 3.05 V in 50-mV increments.The RUIM side is referenced to the VREG_RUIM output that can be set from 1.5 V to 3.05 V in 50 mV increments. Since the two sides (MSM device and RUIM) can run off different voltages, a level-translation is achieved. The RUIM side usually runs off either 1 8 V or 3 0 VThe RUIM side usually runs off either 1.8 V or 3.0 V.

SIM interface scheme is shown in Figure. And, there control signals are followed

SIM_CLK: SIM Clock SIM_Reset: SIM ResetSIM_Data: SIM Data T/Rx

MSM7227 PM7540 USIMMSM_USIM CLKMSM_USIM RSTMSM USIM Data

SIM IOSIM RSTSIM CLK

VREG_RUIM 3.0V

Figure. SIM Interface

MSM_USIM Data

3.10.2 MSM Sub System

3.10.2.1 USIM Interface

3. TECHNICAL BRIEF



PM7540PM7540

3.10.2.2 Universal asynchronous receiver transmitter (UART) Interface

The MSM7227 IC provides four UART ports capable of applications such as:

- Serial data interface that conforms to the RS-232 interface protocol- Handset’s serial data port for test and debug- External keypad or ringer interface

Wi h EEPROM fl h d l d d/ d f- With EEPROM or flash memory – used to load and/or upgrade system software

3. TECHNICAL BRIEF



3. Technical Brief

3.10.2.3 USB

The universal serial bus (USB) is an interconnection standard widely supported by the electronics industry. The USB 2.0 specification defines three operating data rates: low-speed (1.5 Mb/s); full-speed (12 Mb/s); and high-speed (480 Mb/s).

The MSM7227 IC supports one High Speed USB (HS-USB) USBH port with built-in PHY and one Full Speed USB-UICC port. The MSM7227 IC supports USB interfaces using two controllers: 　

The primary controller is the HS-USB port with an integrated physical layer (PHY). This HS-USB port is also capable of supporting USB operations at low speed and full speedcapable of supporting USB operations at low-speed and full-speed.

The secondary controller is the FS USB-UICC port, which only supports host mode functionality.

3. TECHNICAL BRIEF



3. TECHNICAL BRIEF



3.10.2.4 HKADC(House Keeping ADC)

3. Technical Brief

The MSM7227 IC has an on-chip 12-bit analog-to-digital converter (ADC) that is available for digitizing analog signals representing parameters such as battery voltage, temperature, and RF power levels. These parameters support handset-level housekeeping functions – various tasks that must be performed to keep the ‘house’, or handset, in order. This ADC is also used as a touch screen interface, so the acronyms TS-ADC and HK/TS-ADC are sometimes used. The HK/TS-ADC is a 12-bit successive-approximation circuit with a programmable resolution of 8, 10, or 12 bits. Its high-level block diagram is illustrated and explained in Figure 3.10.1.

Channel Signal Note

HKAIN0 - -

HKAIN1 HOOK ADC Earjack hook recogni e

Figure 3.10.1 HK/TS-ADC functional block diagram

Table. HKADC channel table

HKAIN1 HOOK_ADC Earjack hook recognize

HKAIN2 AMUX_OUT Delivery the battery temperature and Main PCB revision from PMIC to MSM

3. TECHNICAL BRIEF



3.10.3 Key Pad

3. Technical Brief

There are 55 buttons in Qwerty key, 3 main keys and 2 side keys in Figure. Shows the Keypad circuit. ‘END’ Key is connected Key_PWR_ON_N to PMIC(PM7540).

L3

100n223AV

433R

K2.2

VREG_MSMP_2.6V

C3030.1u

333R

K2.2

0.1uC302

470R332

023AV

913AV

813AV

713AV

470R331

PP2106M3

U301

41312 11 10198

157

166

175

184

193

202

211

2232425262728292D

NG

P

2D

NG

BTE

SE

R

IX O

X

LE

S_K L

C

DD

V

01P

TEST P40

SEL_28P P41

P57 P42

P56 P43

P55 P44

P17 P45

P15 P46

1D

NG

45P

35P

25P

15P

05P

74P

613AV

513AV

413AV

313AV

213AV

113AV

013AV

903AV

803AV

KB353

703AV

470R324

470R323

470R322

R321 470

470R320

470R319

470R318

R317 470

470R316

R315 470

470R314

R313 470

R312 470

K021

113R

KB351 KB350 KB356 KB355 KB349

KB352

KB348

323AV KB347

KB345KB344 KB357 KB354 KB343 KB342KB341 KB317

KB339KB338 KB337 KB336 KB335 KB334KB333

KB324

KB331KB330 KB329 KB328 KB327 KB326KB325

KB332

KB323 KB322 KB321 KB320 KB319KB318

KB340

KB316

KB315

KB314 KB313 KB312 KB311 KB310KB309

KB346

KB307KB306 KB305 KB304 KB303 KB302KB301

470R302

100nL5

KEY_COL[2]

QTKEY_SCL

KEY_COL[3]

KEY_ROW[7]

QTKEY_SDA

QTKEY_RESET

QTKEY_INT

KEY_COL[0] KEY_COL[1]

KEY_ROW[5]

KEY_COL[7]

KEY_ROW[6]

KEY_ROW[1]

KEY_COL[4]


SPACE2

Key Coder ICQwerty 54key / 4pie DR

%1

1 2 3 4 5 6 7

BACK8 9 0 DEL ENTER1SEARCH

Q W E R T Y U

I O P Fn A SLANG

D F G H J K L

MENU

DOT

Z X C V SPACE1

B N MMANNER UP DOWN

HIPEN

END

COMA

SHIFT1

SHIFT2

HOME

HOMESENDLEFT RIGHT

3. TECHNICAL BRIEF



KB308

100n

L4

2L

n001

KEY_ROW[1]

KEY_COL[5]

ENTER2

KB101

001A

V

101A

V

501A

V

301A

V

201A

V

KB102

KB100

KPD_PWR_N

KEY_ROW[7]

KEY_ROW[7]

KEY_COL[6]

KEY_COL[7]

END

HOME

SEND

CN301

3

2

1

503AV

R309 100ohmsR308 100ohms

20 3AV

DK_Volume_DOWNDK_Volume_UP

VOLUME SIDEKEYChanged 03/24

From 4P to 3P

3. TECHNICAL BRIEF



3.10.4 Camera Interface

3. Technical Brief

L-04C Installed 3 Mega Pixel Auto Focus Camera.Below figure shows the camera board to board connector and camera I/F signal.

Figure. 3 Mega Camera module and Qwerty PCB 34Pin Board to Board Connector

10uC119

VREG_CAM_AVDD_2.7V

R110 12

GB042-34S-H10-E3000CN101

1716151413121110

98765

314323332341

30

29

28

27

26

25

24

23

22

21

20

19

18

VREG_CAM_DVDD_1.2V

120FB102

C1170.1u

VREG_CAM_AF_2.8V

VA1

VREG_CAM_IOVDD_1.8V

C3

DNI

0.1uC114

C1130.1u

FB101120

0.1uC112

VA101

C1111u

33p

C120

CAM_PWDN

CAM_RESET_N

FLT_CAM_DATA[7]FLT_CAM_DATA[6]

FLT_CAM_DATA[5]FLT_CAM_DATA[4]FLT_CAM_DATA[3]FLT_CAM_DATA[2]FLT_CAM_DATA[1]FLT_CAM_DATA[0]

CAM_MCLK

CAM_PCLK

FLT_CAM_VSYNCFLT_CAM_HSYNC

FLT_CAM_I2C_SDAFLT_CAM_I2C_SCL

3. TECHNICAL BRIEF



3. Technical Brief

3 Mega Camera module is connected to Qwerty Key PCB with 34pin Board to Board connector. This interface is dedicated camera interface port in Camera ISP and also MSM7227.This interface is dedicated camera interface port in Camera ISP and also MSM7227.The camera port supply 26.6 MHz master clock to camera module and is received 79.8 MHz pixel clock , vertical sync signal, horizontal sync signal, reset signal and 8bits data from camera ISP. The camera module is controlled by I2C port from MSM7227.

3. TECHNICAL BRIEF



3.10.5 Qwerty slide OPEN/CLOSE Operation

3. Technical Brief

There is a magnet to detect the Qwerty slide OPEN/CLOSE status If a magnet is close to the hall-effect switch, the voltage at pin-out of Hall-effect switch goes to 2.6V. Otherwise, 0V.

This SLIDE_DETECT signal delivered to MSM7227.

Figure. Schematic of Qwerty slide OPEN/CLOSE detection circuit at Qwerty Key PCB

D207D208

U202

32

41VDD OUT

VSS NC

100nC203

VREG_MSMP_2.6V

C2020.1UF

SLIDE_DETECT

SLIDE DETECTChanged 03/24

Active : Low

3. TECHNICAL BRIEF



3.10.6 Numeric Keypad LED Light

3. Technical Brief

There are 3 White LEDs in RF_slide PCB, which are driven by SLIDE_KPD_DRV_N line from PM7540.

Figure. Numeric Keypad lighting Circuit

LD100CL-435F-WQT-SD-TS

4

3

2

1


4

3

2

1

VA104

+VPWR

R103

33

R104

33

CL-435F-WQT-SD-TSLD101

4

3

2

1

R102

33

SLIDE_KPD_DRV_N

3. TECHNICAL BRIEF



3.10.7 LCD Module (TX08D39VM0BAA : Hitachi LCD module)

3. Technical Brief

- The TX08D39VM0BAA model is a Color TFT Main LCD Module. It is supplied by Hitachi Display Ltd. This main Module has a 3.2 inch diagonally measured active display area with 320 X 3(R,G,B)(W) X 480(H) dots resolution. Each pixel is divided into Red, Green and Blue sub-pixels and dots which are arranged in vertical stripes.

* Features- Display mode(Main LCD) : Transmissive Type, Normally Black Mode, In-Plane Switching Mode- LCD Driver IC & Driving Method : S6D05A1 (Source, Gate and Power IC)g- Interface : MDDI Interface

Figure. LCD Module Block Diagram

3. TECHNICAL BRIEF



* LCD Module InterfaceLCD module is connected to 25pin Zip connector (GB042-50P-H10-E3000)

3. Technical Brief

LCD module is connected to 25pin Zip connector (GB042 50P H10 E3000)The LCD module is controlled by MDDI from MSM7227.

Figure. LCD Module 25 pin Zip Connector (GB042-50P-H10-E3000)

2.2uC107

2.2uC106

D102

43

52

61

+VPWR

VREG_LCD_1.8V VREG_LCD_2.8V

04-6293-025-001-829CN103

25

24

23

22

21

20

19

18

17

16

15

14

13

12

11

10

9

8

7

6

5

4

3

2

1

ICMEF214P101MFL100

019

84736251

P1 P5P2 P6P3 P7P4 P8

1G

2G

C108

2.2u

LCD_MAKERID_LOW

MDDI_P_STB_MMDDI_P_STB_P

MDDI_P_DATA_MMDDI_P_DATA_P

LCD_RESET_N

LCD_VSYNC_O

WLED7WLED6

WLED1WLED2WLED3WLED4WLED5

3. TECHNICAL BRIEF



3. Technical Brief

No. Name Function

1 GND Ground

2 - Back Light Control of LED Driver

3 LCD_VSYNC_O Tearing Effect Signal

4 LCD_MAKERID_LOW Maker ID (Low : GND level)

5 GND Ground

6 MDDI P STB M MDDI strobe negative signal6 MDDI_P_STB_M MDDI strobe negative signal

7 MDDI_P_STB_P MDDI strobe positive signal

8 GND Ground

9 MDDI_P_DATA_M MDDI data negative signal

10 MDDI_P_DATA_P MDDI data positive signal

11 GND Ground

12 VREG_LCD_1.8V Power Supply for Interface I/O

13 VREG_LCD_2.8V Power Supply for Analog and Voltage booster block

14 LCD_RESET_N Reset

15 WLED7 Ground for LED







22 +VPWR Power Supply for LED

Table. Interface between LCD module and Folder FPCB



24 - Non Connect Pin

25 GND Ground

3. TECHNICAL BRIEF



3. Technical Brief

3.10.8 Touch Module (TSMC-P307A : LG Innotek)

- The TSMC-P307A model is a L-04C Touch Module. It is supplied by LG Innotek.This main Module has a 3.25 inch diagonally measured active display area.

* Features

Item Spec. Remark

Active Screen Size 3.25” Diagonal

Mechanical

Active Screen Size 3.25 Diagonal

Out Dimension (With Window) 50[W] x 94.2[H] [㎜]

Out Dimension (Only TSP) 49.6[W] x 82.57[H] [㎜]

View Area 46.09[W] x 68.63[H] [㎜]

Thickness 1.33 [㎜]

Input Method Finger .

Total light transmittance ≥ 80% 400 (Nippon Denshoku)Optical

g pp

Type Clear

Figure. Touch Module 10 pin B to B Connector (GB042-10P-H10-E3000)g p

CN100GB042-10P-H10-E3000

65

74

83

92

101

601AV

701AV

C109

1u

801AV

VREG_TOUCH_3.0V

TOUCH_INT

TOUCH_I2C_SCL

TOUCH_I2C_SDA

Touch Connector

1 pin : right, lower

3. TECHNICAL BRIEF



3.10.9 Q-coin Motor driver IC (TPA6202A1)

3. Technical Brief

- The TPA6202A1 is a 1.25W mono amplifier

*Features1.25 W Into 8Ω From a 5V Supply at THD = 1% (Typical)

CN601

2

1

L511 100n

L512 100n

523AV

423AV

Q601

C

B

E GND

IN

OUT

R619

100K

TPA6202A1ZQVRU601

B2C1

A1B1

B3C2

A3C3IN- VDD

IN+ VO+

_SHUTDOWN VO-

BYPASS GND

VREG_MOTOR_3.3VVREG_MOTOR_3.3V

K1

716R

100K

R622

51K

R620

51K

R621

C638

0.1u

10nC640

816R

K1

K7.4

32 6R

C639

1u

MOTOR_PWM

CONNECTOR Type

%1%1 1%

Q-coin MOTOR

1%

1%

1%

3. TECHNICAL BRIEF



3.10.10 Compass (AMI304)

3. Technical Brief

- The AMI304 is a n intelligent electronic compass that integrates three Magnet-Impedance sensor elements (MI-element) with their controller IC in a single small package.

- The controller IC of the AMI304 consists of a circuit for detecting the magnetic signals from three MI-sensor elements, an amplifier capable of compensating each sensors offset and setting appropriate sensitivity values, a thermal sensor for measuring the ambient temperature, a 12bit AD converter, an I2C serial interface circuit and a constant voltage circuit for power control.

470n

C2

6R

K3.3

1C

n01

U1AMI304

12

11

10

9

5

4

6

37

28

1D

DV

D

GE

RV

AD

NG

SD

NG

DD

VA

ADDR

SCL

NC1

TNI

VPP

DRDY

SDA

K3. 3

7R

TP1

VREG_PROX_COMPASS_2.6V

0R2

R4 0

PROX_COMPASS_I2C_SDA

PROX_COMPASS_I2C_SCL

COMPASS_DRDY

3. TECHNICAL BRIEF



<Pin description>

3. TECHNICAL BRIEF



3.10.11 Proximity Sensor

3. Technical Brief

- The GP2AP002S00F model is a Proximity Sensor. It is supplied by SHARP. - GP2AP002S00F is equipped with a 7-bit address as a slave device on the I2C bus interface.

Through the SDA and SCL terminals, GP2AP002S00F’s registers can be set up, and also GP2AP002S00F’s sensing result can be read out.

No. Name Pin name

1 GND LED Anode

2 - LED Cathode

3 LCD_VSYNC_O Vcc

4 PROX_OUT Output

5 GND Ground5 GND Ground

6 VREG_PROX_COMPASS_2.6V Logic I/O output

7 PROX_COMPASS_I2C_SDA I2C DATA BUS

8 PROX_COMPASS_I2C_SCL I2C CLOCK



R100

4.7

u1 101C

TP1000.1u

C103C102

4.7u

R101

10

C100 4.7uU100 GP2AP002S00F

54

63

72

81LEDA SCL

LEDC SDA

VCC VIO

VOUT GND


PROX_OUT


Proximity SensorTuning point

3. TECHNICAL BRIEF



3.10.12 Accelerometer Sensor

3. Technical Brief

- The KR3DM model is a Accelerometer Sensor. It is supplied by STMicroelectronics. - The KR3DM is an ultra low-power high performance three axes linear accelerometer belonging to the

“nano” family, with digital I2C/SPI serial interface standard output.

* Features– Wide supply voltage, 2.16V to 3.6V

Lo oltage compatible IOs 1 8V– Low voltage compatible IOs, 1.8V– I2C/SPI digital output interface– 8 bit resolution

C810

0.1u

VREG_MSMP_2.6V

K2.2

308R

K2.2

408R

C809

4.7u

KR3DMU801

61

76

5

4

8

3

9

2

10

1

11

12

13

41512

DE

VR

ES

ER

DD

V

GND3

GND2

INT1

VDD_IO

RESERVED1

NC1

INT2

NC2

SC

SCL_SPC

GND1

OD

S_ID

S_A

DS

0A

S_O

DS

4D

NG

MOTION_INT

MOTION_I2C_SDA

MOTION_I2C_SCL

3. TECHNICAL BRIEF



Pi d i ti<Pin description>

3. TECHNICAL BRIEF



3.10.13 Audio Signal Processing & Interface

3. Technical Brief

Audio signal processing is divided uplink path and downlink path.The uplink path amplifies the audio signal from MIC and converts this analog signal to digital signal and then transmits it to DBB Chip (MSM7227).This transmitted signal is reformed to fit in GSM & WCDMA frame format and delivered to RF Chipset. The downlink path amplifies the signal from DBB chip (MSM7227) and outputs it to receiver (or speaker).

The receive path can be directed to either one of two earphone amplifiers or the auxiliary output.The outputs earphone1 (EAR1OP, EAR1ON) and auxiliary out (AUXOP, AUXON) are differential outputs. p p ( , ) y ( , ) pEarphone2 (EAR2/EAR3) is a single-ended output stage designed to drive a headset speaker.

The microphone interface consists of two differential microphone inputs, one differential auxiliary input and a two-stage audio amplifier.

Figure. Audio Interface Detailed Diagram(MSM7227)

3. TECHNICAL BRIEF



3. Technical Brief

MSM7227 Audio part

Figure . Audio part schematics

C321

39p

6R

0

C31122u

0.1u

C310

VA305

u1.0703

C

603C

u1.0

u1.0503

C

303C

u1.0

323C

u1.0

47p

C301

MIC_BIAS

31C

51B

41B

31

B

8H

6F

5F

01J

01H

9H

01C

01B

9C

9B

8F

8E

7F

7E

7C

7B

6C

5C

6B

5B

PI_R_EN

IL

NI_

R_E

NI

LP

I_

L_E

NI

LNI_L_E

NIL

P1

CIM

N1CIM

P2CIM

N2CIM

PIXU

ANIX

UA

PO_ENIL

NO

_ENIL

PO_1RA

ENO_1R

AE

TUOX

UA

R_HP

HL_HPH

PMO

CC

SAIB_C

IM

FERV_

HP

H

KLC

SY

S_YHP

BSU

PD_Y

HP

BSU

ND_YH

PBSU

L_H

PH

R _H

PH

N_V

CR

P_V

CR

MD_

HB

SU

PD_

HB

SU

KLC

SY

S_H

BS

U

N1

_C

IM

CIM _

SH

P 1_C I

M

PO_

ENIL

NO_

ENIL

MIC_1P_PIN

nip 5E ot esol

C

3. TECHNICAL BRIEF



3. Technical Brief

3.5 Ear Jack


312 R

I ND

ZD20

1ZD

202

ZD20

5

C21

6

100p

412 R

I ND

FB20

218

00

FB20

318

00

C20

6

4.7u

R21

6

100K

1800

FB20

1

0.1u

C21

247

p

C21

033

p

C20

8

2.2u

C20

7

912 R

K74

47p

C20

4

402D

VR

EG

_MS

MP

_2.6

V

K2. 2

302R

33p

C20

1

202D

102D

202R

K001

1800

FB20

4

U20

1

5

32

41

VO

UT

VIN

GN

DS

TBY

DNGP

001 Q

D

G

S

022 R

M1

VR

EG

_MS

MP

_2.6

V

J201

2 3 6 5 4 1M

5_M

IC

M4_

L

M3_

DE

TEC

T

M4D

-DE

TEC

T

M1_

R

M6_

GN

D

HO

OK

_AD

C

EA

R_R

EA

R_L

HS

_MIC

_BIA

S_E

N

HS

_MIC

EA

R_S

EN

SE

AU

DIO

_GN

D

3.5

EA

R_J

AC

K

MA

TIN

G

EA

R_S

EN

SE

UN

MA

TIN

G

STA

TE

LOW

(DE

FAU

LT)

HIG

H

5/10

Add

ed

3. TECHNICAL BRIEF



3. Technical Brief

Audio Sub system

Microphone


FB701600

C710

39p

307R

02

407R

02

R724 47KC783

10u

C711

39p

C712

39p

C713

39p C715

0.1uR725 47KC717 1u

C716 1u

C707 47n

47nC706

K7.4

11R

9R

K7.4

VREG_MSMP_2.6V

0.1u

C701C700

2.2u

C714

0.1u

C9002.2u

470nC708

C709 470nU701

WM9093ECS-R

3B

A4

C3

C2

2B

D1

D3

4D

C1

A1D2

1B

D5

A2

A5

A3B5

4B

C5

4C

DN

G

OUT+D

DV

PH

CPVDDCPVSS

CN

HPL

OUT-

SAI

B

IN2- HPR

IN1+

DD

VS

IN3-

IN2+

AD

S

IN1-

IN3+

CP

LC

S

C722

2.2u

+VPWR_AUDIO

2.2uC719

2.2u

C723

2.2uC720

VREG_MSME_1.8V

HPH_LHPH_R

RCV_N

RCV_P

SPK_RCV-SPK_RCV+LINE_OP

LINE_ON

EAR_REAR_L

AUDIO_I2C_SDAAUDIO_I2C_SCL

AUDIO SUBSYSTEM

MIC1

6

5

4

3

2

1OUT

G1

G2

G3

PWR

G4

1 02R

IN

D

512C

p51

4 12C

u 01

312C

p74

FB1 1800MIC_1PMIC_1N

MIC_BIAS

3. TECHNICAL BRIEF



* Audio Mode

3. Technical Brief

MODE Device Description

Voice Call

Receiver Mode Receiver Voice Call

Loud Mode Speaker Phone

Headset Headset Voice Call

Loud Mode Speaker OGG Bell

Table Audio Mode

OGGLoud Mode Speaker OGG Bell

Headset Headset OGG Bell

SD contentsLoud Mode Speaker MP3

Headset Headset MP3

Table. Audio Mode

Audio & Sound Main Component

There are 5 main components in L-04C

Component Design No. Maker Part No. Note

1 MSM7227 U302 MSM7227 Base-Band Modem

2 3.5 Ear Jack J201 KJA-PH-0-0176 3.5 Φ Ear Jack

3 Audio sub system U701 WM9093ECS-R Mono Class D Speaker driverMono Class AB earpiece driver

4 Speaker & Receiver

1810-8T-05W1P 8 ohm DUAL MODE SPEAKER

Table. Audio main component list

Receiver

5 MIC MIC1 SPM0410LR5H-QB - 38 dB microphone

3. TECHNICAL BRIEF



3.11 Main features

1. Main Features

Mech. : Full touch Qwerty Slide Smart Phone

RF: WCDMA with HSDPA (Category 8) / HSUPA (Category 5)- UMTS : 800 / 2100 , GSM 900/1800/1900

Modem: MSM7227

OS: Android 2.2 (Froyo)

Di l 3 2" HVGA (320 480) TFTDisplay : 3.2",HVGA (320x480) TFT

Touch : Capacitive Multi Touch

Camera : 3M AF, Sony(1/5")

Memory : 8G NAND+4G DRAM & Micro SD Card

Media : MP3, OGG bell

Battery : 1350mAh UF564447F (Li-ion) / Sanyo

Connectivity : USB 2.0, Bluetooth, 3.5 Φ Ear-jack

SPK/RCV : 18 X 10, 8Ω, DUAL MODE SPEAKER

I/O : Micro 5 Pin USB

Function : GPS, Wi-Fi, Bluetooth

Sensor : Accelerometer, Proximity, Digital Compass

3. TECHNICAL BRIEF



3.12 RF Component

FL1005

FL1006

U1004

U1003

FL1003

FL1002

U1000

U1002 FL1004

FL1001

SW1000

U400

U302

U1002

U704 X300

U1001

FL1000

3. TECHNICAL BRIEF



Diagram Ref. No Part Name Function Comment

RF

U1003 SKY77701 21000 PAM TX

U1004 SKY77704 800 PAM TX

FL1001 D5017 FEM Band selection/TX

SW1000 MS-156C Test Connector Calibration etc

FL1003 SAYFP1G95AA0B00 W2100 Duplexer Tx/RX

FL1004 SAYFP836MCA0F00R00 W800 Duplexer Tx / Rx

FL1005 SAFEB836MAL0F00 W800 SAW TX

FL1006 SAFEB1G95KA0F00 W2100 SAW TX

U1002 SKY77336 QUAD GSM PAM TX

FL1002 SAFEB2G14FB0F00 W2100 SAW RX

U1000 RTR6285 RF Transceiver Tx / Rx

Diagram Ref. No Part Name Function Comment

RF

U400 MT29C8G96MAGAPDZA-5IT Memory 8G/4G

U302 MSM7227 Main Control Main Chipset

U704 PM7540 Power Control Power Supply

X300 TG-5010LH(19.2M)-75A VCTCXO 19.2MHz

U1002 LBEH19UNBC-338 WiFi/BT Transceiver Tx / Rx

U1001 RF2815 GPS LNA Rx

FL1000 SAFEB1G57KB0F00 GPS SAW Rx

3. TECHNICAL BRIEF



3.13 Main Component

2. Main Components

Main board, Top

Main board, Bottom

3. TECHNICAL BRIEF



2. Main Components

Qwerty board, Top

Qwerty board, Bottom

3. TECHNICAL BRIEF



2. Main Components

RF-Slide board, BottomRF-Slide board, Top

B TO B board, BottomB TO B board, Top

3. TECHNICAL BRIEF



- Logic

2. Main Components

Main board, Top

Reference Part Number DescriptionCN700 HSMU-5SB-24DR2 connector、I/O

Q1、Q2 QST4 TR、Bipolar

Q3 SIA431DJ FET

U301 NC7SV00P5X_NL IC、MCP、NOR

U1005 MAX17040G IC、Fuel GaugeC、 ue Gauge

U704 PM7540 IC、PMIC

IC1 TS5USBA33402YZPR IC、MUICU302 MSM7227 IC、Digital Baseband Processor、3 GU701 WM9093ECS-R IC、Audio Sub System

U801 KR3DM IC、Acceleration Sensor

U300 74LVC1G79GM IC、Flip Flop

U400 MT29C8G96MAZAPDJA-5 IT MCP

Main board, Top

U400 MT29C8G96MAZAPDJA-5 IT MCP

X300 KT3225L19200DCW28RA0 Oscillator、VCTCXO

X700 FC-135 Crystal

3. TECHNICAL BRIEF



2. Main Components

- Logic

Main board, Bottom

Reference Part Number Description

CN900 24-5804-080-000-829+ Connector、BtoB

J800 KP09N-6S-2_54SF Sim Card Socket

SW1001 UFL-R-SMT10 Connector、RF

SW1000 MS-156C Connector、RF

FL700 NFM18PC104R1C3 Filter、EMI/Power

CN701 KQ03LP1-3R Connector、Battery

U700 MAX14528 IC、Over Voltage Protection

U802 BU28TD2WNVX IC、LDO Voltage Regulator

Main board, Bottom

3. TECHNICAL BRIEF



- Qwerty PCB

2. Main Components

Qwerty PCB ASSY, Top


CN401 GB042 50S H10 E3000 C t Bt B

Qwerty PCB ASSY, Top

CN401 GB042-50S-H10-E3000 Connector、BtoB

U301 PP2106M3 IC、Key Encoder

U1 AMI304 IC、Digital Compass Sensor

U202 S-5711AC이-I4T1G IC、Hall IC

3. TECHNICAL BRIEF



- Qwerty PCB

2. Main Components

Qwerty PCB ASSY, Bottom


CN101 GB042-34S-H10-E3000 Connector, BtoB

CN402 24-5804-080-000-829+ Connector, BtoB

CN601 24-8000-002-000-829 Connector, I/O

J201 KJA-PH-0-0176 EarJack

CN1 SCHA4B0402 Socket, SD Card

SW401 UFL-R-SMT10 Connector, RF

Q601 KRC402E TR BipolarQ601 KRC402E TR, Bipolar

Q100 SI1305-E3 FET

U101 AAT2870 IC, Sub PMIC

U103 NLSX4373MUTAG IC, Level Translator

U102 NLSV1T244MUTBG IC, Level Translator

U601 TPA6202A1ZQVR IC, Motor Driver IC

CN4, CN5 HJ-BCT-04Y ANT Contact

Qwerty PCB ASSY, Bottom

MIC1 SPM0410LR5H-QB Microphone, Condenser

FL1, FL101, FL102 ICVE10184E070R100FR Filte, EMI/Power

3. TECHNICAL BRIEF

- 1�0 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes


- RF-Slide FPCB

2. Main Components


CN100 GB042-10P-H10-E3000 Connector、BtoB

U100 GP2AP002S00F IC、Proximity

RF-Slide FPCB ASSY, TOP RF-Slide FPCB ASSY, Bottom

SUB FPCB ASSY, TOP, Bottom

FL100 ICMEF214P101M Filter、EMI/Power

CN102 GB042-50P-H10-E3000 Connector、BtoB

CN103 04-6293-025-001-829 Connector、FFC/FPC/PIC

BAT100 311HR-VG1 Coin Battery

3. TECHNICAL BRIEF



- BTOB FPCB

2. Main Components

BTOB FPCB, Top BTOB FPCB, Bottom




BTOB FPCB, Top BTOB FPCB, Bottom

BTOB FPCB, Top, Bottom

、

4. TROUBLE SHOOTING

- 1�� - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes


4. TROUBLE SHOOTING

4.1 Checking VCXO Block

The reference frequency (19.2MHz) from X10 (TCXO) is used in UMTS TX part, GSM part and BB part.

4. TROUBLE SHOOTING

R10 0

10n

C313

R306

100

19.2MHzX300

KT3225L19200DCW28RA0

42

31VCONT OUT

GND VCC

C309

100p

33

R309

C312 1n

1n

C314

VREG_TCXO_2.85V

VREG_MSMA_2.6V

C315 100p

C316

0.1u

100K

R313

0.1u

C319

NC7SV00P5X_NLU3013

2

4

15

VCC

GNDSC1

1

SC2

1

TCXO_RTR_19.2MHZ

TCXO_PM_19.2MHZ

TCXO_EN

USBH_SYSCLK

RTR_TRK_LO_ADJ

1.0T

TCXO Circuit

Clesed to TCXO

TP1

TP2

TP4

TP3

4. TROUBLE SHOOTING



Check TP1VCC of VCXO

VCC ≥ �.8V Check TP1 of PMIC (U704)No

Yes

Check TP�TRK_LO_ADJ

�V ≥ Voltage ≥ 1V Check TP� of MSM (U30�)No

Yes

Check TP3,4With Oscilloscope

�V ≥ Voltage ≥ 1V Check soldering and components

No

Yes

VCXO is OKCheck other part

4.2 Checking FEM SW Block

4. TROUBLE SHOOTING



Logic Table of the Front End Module

Check Soldering ofANT_SEL 0, 1, �,3 High Level

1.5V < Voltage < 3.0V Check TP1No

Yes

Check the Logic in each mode

Checking Switch Block power source

4. TROUBLE SHOOTING



4.3 Checking UMTS Block

4.3.1 Checking TX POWER of UMTS2100MHz

990 1C

n8.1

C1101

0.5p

L1029

15n

2801C

n3.3

FL1003 B7697

1950MHz, 2140MHz

958472

3

6 1RXANT

TX

GND1 GND4GND2 GND5GND3 GND6

TP1

C1053

1.5n

DNI

C1051

MS-156CSW1000

43

2

1ANT COMMON

G3 G4

L1003

68n

L1002

68n L1027

2.7n

FL1006SAFEB1G95KA0F00

1950MHz5 2

4 1

3G3

INOUTG1G2

L8057

DNI

C10863.3n

0011C

n6.5

TP2

TP4TP3

4. TROUBLE SHOOTING



Run a FTM program set RF mode to �100 set uplink freq.

To 1750 Click Tx On and WCDMA set PA Range R0 and

R1 on set Tx AGC to 330

Check a current over

500mA?

Check TP4 over -5dBm?

Check a PAM (U1003)

Check TP1over �7dBm?

Check TP1

Check TP� over �4dBm?

Check FL1003 and TP�

Check TP3 over �3dBm?

Check TP3

Tx is OK

No

Yes

Yes

Yes

Yes

No

Yes No

No

No

Check RTR and FL1006?

4. TROUBLE SHOOTING



Checking TX POWER of UMTS 800MHz

Measured value and spectrum of TP1



26.77

24.66

23.34

4. TROUBLE SHOOTING



FL1004B7671

836.5 MHz,881.5 MHz

95

7

3

1

2

8

4

6ANT

GND2

RX_OUT2

GND1

RX_OUT1

TX_IN

GND4

GND3 GND5

DNIL1031

L1033

1p

L1026

6.8n

TP1

C1053

1.5n

DNI

C1051

MS-156CSW1000

43

2

1ANT COMMON

G3 G4

L1003

68n

L1002

68n

FL1005

SAFEB836MAL0F00

836.5MHz3 2

4 1

5GND

INOUTG1G2100p

L1024

L1032

DNI

L1034

8.2n

C8555

DNI

TP2

TP4TP3

4. TROUBLE SHOOTING



Run a FTM program set RF mode to 800 set uplink freq.

To 835 Click Tx On and WCDMA set PA Range R0 and

R1 on set Tx AGC to 330

Check a current over

500mA?

Check TP4 over -5dBm?

Check a PAM (U1004)

Check TP1over �7dBm?

Check TP1

Check TP� over �4dBm?

Check FL1004 and TP�

Check TP3 over �3dBm?

Check TP3

Tx is OK

No

Yes

Yes

Yes

Yes

No

Yes No

No

No

Check RTR and FL1005?

4. TROUBLE SHOOTING






26.39

24.43

23.55

23.43 dBm

23.43 dBm

22.55 dBm

4. TROUBLE SHOOTING



4.3.3 Checking UMTS PAM Control Block

PAM control signal

TP1 : PWR_DET : UMTS Tx Power Detected value.

TP2, 2* : PA_ON0, PA_ON1 : UMTS2100, UMTS800 PAM enable (about 2.6V)

TP3, 3* : OCP_+VPWR : UMTS2100, UMTS800 PAM Main Voltage ( 3V <VPWR < 4.2V)

TP3

C1098 1n

C1096

100p100p

C1095

680p

C1094680p

C1093C1091

4.7u

+VPWR

3201R

011

56

R1022

1201R

011

U1004SKY77704-15

6 5

7 4

8 3

9 2

10 1

11PGND

VCC1VCC2

RFINRFOUT

VMODE_1CPL_IN

VMODE_0GND

VENCPL_OUT

C1104

56p

PA_R0PA_ON1PDET_IN

8.5dB

4.3.3 Checking UMTS PAM Control Block

PAM control signal

TP1 : PWR_DET : UMTS Tx Power Detected value.

TP2, 2* : PA_ON0, PA_ON1 : UMTS2100, UMTS800 PAM enable (about 2.6V)

TP3, 3* : OCP_+VPWR : UMTS2100, UMTS800 PAM Main Voltage ( 3V <VPWR < 4.2V)

+VPWR

51

R1024

680p

C1092C1090

680p

100p

C1089

100p

C1088

33p

C1087

SKY77701U1003

6 5

7 4

8 3

9 2

10 1

11PGND

VCC1VCC2

RFINRFOUT

VMODE_1CPL_IN

VMODE_0GND

VENCPL_OUT

4.7u

C57

PA_ON0PA_R0

TP3

TP3*

TP2

TP2*TP1

4. TROUBLE SHOOTING



4.3.4 Checking RF Rx Level of UMTS 2100/800MHz

990 1C

n8.1

C1101

0.5p

L1029

15n

2801C

n3.3

FL1003 B7697

1950MHz, 2140MHz

958472

3

6 1RXANT

TX


4.3.4 Checking RF Rx Level of UMTS 2100/800MHz

TP2

FL1002SAFEB2G14FB0F00

2140MHz 45

1

32G1 O1

ING2 O2

L10782.7n

C1076

0.5p

L1020

1n

C1075

2.2n L1019

1n

C1053

1.5n

DNI

C1051

MS-156CSW1000

43

2

1ANT COMMON

G3 G4

L1003

68n

L1002

68n

TP1FL1004B7671

836.5 MHz,881.5 MHz

95

7

3

1

2

8

4

6ANT

GND2

RX_OUT2

GND1

RX_OUT1

TX_IN

GND4

GND3 GND5

DNIL1031

L1033

1p

L1026

6.8n

TP3*

TP2*

TP3*

TP4

TP4

TP3

4. TROUBLE SHOOTING



Check vbias / vbias’ over �V? Check bias block solderingNo

Yes

Rx is OK

Chack TP1/TP1* signal exist? Check ANTNo

Yes

Check TP� / TP�*signal exist? Check FEM FL1001No

Yes

Check TP4 / TP4*signal exist? Check U1007No

Yes

Set the phone Rx is ON

Check TP3 / TP3*signal exist? Check Duplexer FL1003, FL1004No

Yes

TP* : UMTS 800 Rx PATHTP : UMTS �100 Rx PATH

4. TROUBLE SHOOTING



4.4 Checking GSM Block

4.4.1 Checking GSM PAM Block

TP1. GSM_PA_RAMP : Power Amp Gain Control. typically, 0.2V < Vramp < 1.45V

TP2. OCP_+VPWR : PAM Supply Voltage Vcc higher than 3.0V

+VPWR

9101R

180

C106039p

8 101R

120

39p

C1059

R1017

51SKY77336U1002

23 2224 2125 2026 1927 1828 17

9 810 711 612 513 414 315 216 1

DCS_PCS_INDCS_PCS_OUT

BSGND6

TX_ENGND5

VBATTVCC_OUT

VAPCGND4

NCGND3

GND1GND2

GSM_INGSM_OUT

PGND1PGND12

PGND2PGND11

PGND3PGND10

PGND4PGND9

PGND5PGND8

PGND6PGND7

6101R

120

5101R

180

R1014

2.2K

30

R1013

C1070

10u

GSM_PA_EN

GSM_PA_RAMP

GSM_PA_BAND

GND DCS_PCS_TX

GSM_TX

DCS1800(1710-1785 MHz)PCS1900(1850-1910 MHz)

GSM900(880-915 MHz)

2mm

5dB

8dB

TP2

TP1

4. TROUBLE SHOOTING



4.4.2 Checking RF Rx Block of GSM Bands

1.8pC1068

DNI

L101418n

L1013

1.8pC1067

C1062 2.2p

L1009

3.9nDNI

L1010

C1064 2.2p

L1008DNI

C1063 2.2p

L10074.7n

FL1001D5017

850,1900,2100MHz

65437

11

9

22

21

20

1324

1223

10

158

141

17

162

19

18PCS_RX1

PCS_RX2

ANT PCN_RX1

PCN_RX2

GND1 EGSM_RX1

GND2 EGSM_RX2

GND3

GND4 GSM850_RX1

GND5 GSM850_RX2

WCDMA_2100

WCDMA_850

WCDMA_1900

PCN_PCS_TX

GSM850_EGSM_TX

DD

V

1LRT

C

2LRT

C

3LRT

C

4LRT

C

C1061 2.2p

RX_PCS_P

RX_PCS_M

RX_DCS_M

RX_GSM_900_P

RX_GSM_900_M

RX_DCS_P

WCDMA_2100_RTX

WCDMA_800_RTX

DCS(1805-1880 MHz)

GSM(925-960 MHz)

PCS(1930-1990 MHz)

TP3

TP3

TP2

TP2

TP1

TP1

4. TROUBLE SHOOTING



*** WCDMA FTM control order using QPST

1

2 3 4

5

6

7

8

1. Choose mode – WCDMA 2. Choose com port 3. Choose FTM 4. Click Mode Control button 5. Choose band – 2100MHz or 800MHz 6. Choose channel & enter 7. Tx control pannel 8. Write wanted AGC value & enter – WCDMA : 344

*** WCDMA FTM control order using QPST

4. TROUBLE SHOOTING



*** GSM FTM control order using QPST

1

2 3 4

5

6

7

8 9

1. Choose mode – GSM 2. Choose com port 3. Choose FTM 4. Click Mode Control button 5. Choose band – EGSM or DCS or PCS 6. Choose channel & enter 7. Check on Tx on 8. Write wanted PA DAC value - GSM : 15000 9. Click PA DAC input button

*** GSM FTM control order using QPST

4. TROUBLE SHOOTING



4.5 GPS

4.5.1. GPS RECEIVER

The GPS receiver input employs a single-ended connection realized by this pin. The GPS input is routed from the GPS antenna, through a band pass filter and then an impedance transformer circuit that optimally matches the impedance looking into the GPS LNA. The impedance transformer circuit topology is shown in Figure 4.1.

Figure 4.1. The impedance transformer circuit topology

4.5.2. GPS RECEIVER SPECIFICATION

Receive Frequency 1574.42 MHz ~ 1576.42 MHz

Minimum Sensitivity 1 satellite ≥-142dBm, 7 satellites ≥ -147dBm at coarse time aiding

4. TROUBLE SHOOTING



4.5.3. GPS OFF-CHIP RF COMPONENTS

4.5.3.1. GPS LNA (RF2815)

The RF2815 is a GPS Low Noise Amplifier with an integrated SAW filter at the output. Low noise figure, along with high gain, achieved by the RF2815 makes it ideal for GPS receivers requiring high sensitivity. This module builds upon RFMD’s leading edge pHEMT process and integrates input matching and low loss high rejection SAW filter at the output. This results in high performance and a reduced solution size. The ease of implementation simplifies the receiver design. The RF2185 is packaged in a compact 3.3mmx2.1mmx1.0mm package with low external component count required to achieve the best-in-class performance. The block diagram of RF2815 is shown in Figure 4.2.

Figure 4.2. RF2815 block diagram

4. TROUBLE SHOOTING



4.6 Bluetooth/WLAN OFF-CHIP RF COMPONENTS

4.6.1. Bluetooth/WLAN Module (LBEH19UNBC-338)

The L-04C device provides the highest level of integration for a mobile wireless system, with integrated IEEE802.11 b/g, Bluetooth 2.1. The LBEH19UNBC that is included of BCM4325 solution is supported three kinds of functions. It is the one antenna structure which is supported of WLAN/Bluetooth in 2.4GHz band.

Figure 4.3. Block diagram of Bluetooth/WLAN module in L-04C

4. TROUBLE SHOOTING



Figure 4.4. Pin layout of Bluetooth/WLAN module in L-04C

4. TROUBLE SHOOTING



Table 4.1. Pin description of Bluetooth/WLAN module in L-04C

Table 4.2. Rating of Bluetooth/WLAN module in L-04C

4. TROUBLE SHOOTING



Table 4.3. Operating condition of Bluetooth/WLAN module in L-04C

Table 4.4. Power consumption of Bluetooth/WLAN module in L-04C

4. TROUBLE SHOOTING



4.6.1.1. BLUETOOTH

The L-04C provides the Bluetooth 2.1 + EDR specification. The Bluetooth module is the optimal solution for any voice or data application that requires the Bluetooth SIG standard Host Controller Interface (HCI) using a high-speed UART and PCM. The Bluetooth solution has an integrated radio transceiver that has been optimized for 2.4GHz Bluetooth wireless systems. It has been designed to provided low-power, low-cost, robust communications for applications operating in the globally available 2.4GHz unlicensed ISM band. It is fully compliant with the Bluetooth Radio Specification and meets or exceeds the requirements to provide the highest communication link quality of service. It shows the Bluetooth system architecture in the L-04C in Figure 4.3.

Figure 4.5. The Bluetooth system architecture in the L-04C

4.5.

System HW Block Diagram ; BLUETOOTH & Wi-FiBT_UART_TXDGPIO45

BT_RXD

BT_UART_RXD

BT_UART_CTS

BT_UART_RTS

GPIO45

GPIO46

GPIO43

GPIO44

BT_PCM_INGPIO68

GPIO69

BT/Wi-Fi

ANTENNA

BT_TXDBT_RTSBT_CTS

BT_PCM_DOUTBT_PCM_DIN

BT_PCM_OUT

BT_PCM_CLK

BT_PCM_SYNC

GPIO69

GPIO71

GPIO70

BT_RESET_N

BT_WAKEUP

RF_IN_OUT

BT GPIO 0

_ _

BT_PCM_CLKBT_PCM_SYNC

BT_RST_N

GPIO42

GPIO123

PM7540SLEEP_CLK

BT_HOST_WAKEUP

SLEEP_CLK

GPIO83

SLEEP_CLK

BT_GPIO_0

MSM7227

BT_GPIO_1

GPIO42

PM7540

VDD

VBAT_IN

VREG_MSMP_2.6V VREG_MSMPGPIO62

WLAN_CMD

+VPWR

WLAN_CLKWLAN_SDIO[3]WLAN_SDIO[2]WLAN SDIO[1]

SDIO D1

SDIO_D2

SDIO_D3

SDIO_CLK

SDIO_CMDGPIO63

GPIO64

GPIO65

GPIO66

GPIO94

GPIO93

CLK_REQ

WLAN HOST WAKE B

_ [ ]WLAN_SDIO[0]

WLAN_RESET_NWLAN_WAKEUPWLAN_REG_ONWLAN HOST WAKEUP

WLAN_REG_ON

WLAN_WAKEUP

WLAN_RESET_N

SDIO_D0

SDIO_D1

LDOGPIO23

GPIO66

GPIO67

GPIO122

26MHZTCXO

F_CLK_IN

GPIO94

BT / Wi-Fi

WLAN_HOST_WAKE_BWLAN_HOST_WAKEUP

VDD_TCXO

LBEH19UNBC-338

4. TROUBLE SHOOTING



4.6.1.2. WLAN

The L-04C supports single-band 2.4GHz IEEE802.11b/g standardization. The WLAN module which is consisted of the BCM4325 single chip device provides for the highest level of integration for a mobile or handheld wireless system, with integrated IEEE802.11TM b/g (MAC/baseband/radio). The BCM4325's integrated CMOS WLAN 2.4GHz power amplifier provides sufficient output power to meet the need of most WLAN devices. The interface between MSM7227 and WLAN module is the standard interfaces SDIO v1.2 (4-bit and 1-bit). Figure 4.4 shows the WLAN system architecture in the L-04C.

Figure 4.6. The WLAN system architecture in the L-04C

4. TROUBLE SHOOTING



4.7 GPS, Wi-Fi/BT RF COMPONENTS

4.7.1. GPS RF COMPONENTS

Figure 4.7. GPS RF component, Main Bottom side

Reference Description

ANT801 GPS Chip Antenna

FL1000 GPS Saw Filter

U1001 GPS LNA

Table 4.5. GPS RF components

4. TROUBLE SHOOTING



4.7.2. BT/Wi-Fi RF COMPONENTS

Figure 4.8. BT/Wi-Fi RF component, Main Bottom side

4. TROUBLE SHOOTING



Figure 4.9. BT/Wi-Fi RF component, Main Top side

Reference Description

ANT800 BT/Wi-Fi Chip Antenna

U802 BT/Wi-Fi TCXO LDO

U800 BT/Wi-Fi Module

Table 4.6. BT/Wi-Fi RF components

4. TROUBLE SHOOTING



4.8 GPS, Wi-Fi/BT SIGNAL PATH

4.8.1. GPS SIGNAL PATH

Figure 4.10. GPS signal path (GPS Rx path)

4. TROUBLE SHOOTING



4.8.2. BT/Wi-Fi SIGNAL PATH

Figure 4.11. BT/Wi-Fi Signal Path (BT/Wi-Fi Tx Rx Path)

4. TROUBLE SHOOTING



4.9 GPS, BT/Wi-Fi TROUBLE SHOOTING

4.9.1. A-GPS BLOCK

Figure 4.12. Test Points of LNA for the GPS in the L-04C (Schematic)

Figure 4.13. Test Points of LNA for the GPS in the L-04C

C8554

2.5p

C85531n

L1000 8.2n

R1002

1K

C1016

15n

C1050

DNI

L8056 1n

p001

0401C

RF2815U1001

3

2

5

4

1NI_F

R

FIL_OUT

VDD

S_D

GND

C1019 33p

C1018DNI

VREG_RFRX1_2.7V

DNIC1017

FL1000SAFEB1G57KB0F00

1575.42 MHz 5 3 2

4 1INOUT

G1G2G3

C1007

18p

DNIC1015

C10140.1u

C1039

5.6n

ANT801

ODGPPTR3015

2

31

4DUMMY3

FEED DUMMY2

DUMMY1

L1011

100n

L1001 5.6n

GPS_LNA_EN GPS_IN

TP1

TP2

4. TROUBLE SHOOTING



Set the GPS is ON

The Voltage levelat TP1≒�.7V Check power LRC fiter soldering.

No

Yes

Check the RTR circuit and the peripheral circuit or the other parts.

The Voltage levelat TP�≒�.6V Check SW and NV item

No

Yes

4. TROUBLE SHOOTING



4.9.2. BT/Wi-Fi BLOCK

U800LBEH19UNBC-338

039282726252423222120291817161

31

3215

14

33

3413

3512

3611

3710

389

398

407

6

415

4

42

433

442

45

1

6474849405152535451

DN

G

2D

NG

3D

NG

4D

NG

B_E

KA

W_TS

OH_L

W

DXT_T

RA

U_TB

N_ST

C_TR

AU_T

B

N _ST

R_TR

AU_T

B

DX

R_TR

AU_T

B

ANT

BT_PCM_CLK

GND5 BT_PCM_OUT

VDD_WL_PA BT_PCM_SYNC

BT_PCM_IN

SDIO_CMD

SDIO_CLK VDD_BT_PA

SDIO_D3

SDIO_D2 S_CLK_IN

SDIO_D1 GND6

SDIO_D0 FM_ANT

WL_RST_N BT_GPIO_0

WL_WAKE_B BT_GPIO_1

REG_ON BT_GPIO_3

VBAT_IN BT_GPIO_4

BT_GPIO_7

SR_VLX1

SR_VLX1BB F_CLK_IN

F_CLK_OUT

BB2

XLV_

RS

BBT

UO

V_R

S

OID

DV

UP _L

ATX

DS_

OID

DV

TU

O_2P1 _

G ID

TU

O_ 2P1_

GLN

A

ODL

V2P1_

NIV

TU

O_2O

DLNL

AD

S_TB

LC

S_TB

1OI

DU

A

2OI

DU

A

N_TS

R_TB

7D

NG

R801

11K

L80554.7u

7158R

0

10uC822

C8547

1u

3.3uL803

VREG_MSMP_2.6V

0.1u

C817

600

FB8501

2.2u

C8535

0.1u

C8543

4.7u

C816

0.1u

C823

2.2u

C8538

VREG_MSMP_2.6V

4.7uC813

4.7u

C8541

10uC8534

+VPWR

0.1uC814

8.2p

C8544

TP4TP10

TP3TP2

TP6 TP7

TP8

TP9

BT_RESET_N

PUEKAW_TSOH_NALWWLAN_RESET_N

SLEEP_CLK

BT_PCM_CLK

BT_PCM_SYNCBT_PCM_DOUT

WLAN_CLKWLAN_CMD

BT_WAKEUP

WLAN_SDIO[0]

WLAN_SDIO[2]WLAN_SDIO[1]

BT_PCM_DIN

BT_HOST_WAKEUP

WLAN_SDIO[3]

DXT_TRAU_TB

DXR_TRAU_TB

S TC_TRAU_TBSTR_TRAU_TB

WLAN_WAKEUP

CLK_REQ

CLK_IN

RF_IN_OUT

WLAN_REG_ON

TP2

TP1

Figure 4.14. BT/Wi-Fi module (LBEH19UNBC-338)

C825

2.2u

VDD_TCXO

+VPWR

K 001

5 08R

C824

1u

BU28TD2WNVX U802

5

3 24 1

VOUTVINGNDSTBY

DN

GP

CLK_REQ

TCXO LDO

3060

3060

Figure 4.17. BT/Wi-Fi Main Clock part

TP3TP4

4. TROUBLE SHOOTING



Figure 4.18. Test Points of BT/Wi-Fi in the L-04C, main top

Figure 4.19. Test Points of BT/Wi-Fi in the L-04C, main bottom

4. TROUBLE SHOOTING



Activate Bluetooth/WiFi

The Voltage level atTP1≒�.6V, TP��3.5V

Yes

Chang the main board

Check power circuitNo

The Voltage level is1.�V<TP3<3V

Yes

The Voltage level atTP4=�.8V

Yes

Check BT Ant, matching or filter.

No

Check TCXO LDONo

Dose the Bluetooth/Wi-Fi function work well?

No

4. TROUBLE SHOOTING



4.10 Power ON Troubleshooting

4. Troubleshooting

Power On sequence of L-04C is :

PWR key press (Main PCB) KEY_PWR_N go to low,PM7540 KPD_PWR_ON_N pin PM7540 Power Up VREG_MSMC1_1.25V(C749), VREG_MSMC2_1.25V(C750) VREG_MSME_1.8V(C751), VREG_MSMP_2.6V(C768), VREG_MSMA_2.6V(C767), VREG_TCXO_2.85V(C772) power up and system reset assert to MSM Phone booting and PS_HOLD(R772) assert to PMIC.

Start

Check the Battery voltage. higher than 3.23V?

Change or charge the Battery

NO

TP1 high to lowwhen key press?

Check the Key DomeOr Check Main PCB

YES

YES

NO

TP2/TP3 is1.35V?, TP4 is 1.8V? TP5 is 2.6V,? TP6 is 2.6V?,

TP7 is 2.85V?

Change the Main boardNO

Is clock ok?TP8 : 19.2MTP9 : 32.768khz

Check the TXCO & Crystal

YES

YES

NO

Change the Main board

TP1 high to lowwhen key press?

Yes

Change or charge theBattery

No

TP�/TP3 is1.35V?, TP4 is 1.8V? TP5 is �.6V,? TP6 is �.6V?,

TP7 is �.85V?

START

Yes

Is clock ok?TP8 : 19.�M, TP9 : 3�.768khz

Yes


Check the Battery voltage.higher than 3.�3V?

Yes

Check the Key Domeor Check Main PCB

No

Change the Main boardNo

Check the TXCO & CrystalNo

4. TROUBLE SHOOTING



4. Troubleshooting

TP2

TP3

TP6

M i b d TOP

TP4

TP5

TP7

TP9

Main board, TOP

TP1

Slide FPCB, TOP

TP8

Main board, TOP

4. TROUBLE SHOOTING



C779

33p

157C

u01

u012 57

C

VREG_FEM_2.7V

007X

531-CF

z HK8 67.232

1

R723 0

4.7uC754

C744

4.7u

2.2u

C761


2.2u

C771

4.7u

C768

4.7uELCP0008004

L703

VREG_TOUCH_3.0V

22pC774

22pC776

200K

R722

TP702

ELCP0008012

4.7uL701

947C

u22

VREG_LCD_1.8V

L704ELCP0008004

4.7u

C760 2.2u

547C

n1

VREG_MSME_1.8V

C765

2.2u

VREG_RFRX1_2.7V

E10F10C12

M12K7

N13M13

G10D9H12

C13A13A12

G12G1M1D13E12N11A3A10A8H13G13A11K13E13B13A9N12J13A2

M4N4M9N10M6N6M8N8J1K1

VSW_5V

VREG_5V

VSW_MSMC1

VREG_MSMC1

VSW_MSMC2

VREG_MSMC2

VSW_MSME

VREG_MSME

VSW_PA

VREG_PA

VREG_GP1

VREG_GP2

VREG_GP3

VREG_GP4

VREF_GP5

VREG_GP6

VREG_MMC

VREG_MSMA

VREG_MSME2

VREG_MSMP

VREG_RFRX1

VREG_RFRX2

VREG_RFTX

VREG_RUIM1

VREG_SYNT

VREG_TCXO

VREG_USB

VREG_WLAN

MIC_BIAS

REF_ISET

REG_GND

REF_BYP

TCXO_IN

TCXO_EN

TCXO_OUT

XTAL_IN

XTAL_OUT

SLEEP_CLK

AMUX_OUT

KPD_PWR_N

PON_RESET_N

PS_HOLD

R715 121K

VREG_TCXO_2.85V

R716 51

847C

n1

C762

2.2u

C770

2.2u

VREG_MSMC1_1.25V

VREG_MMC_3.0V

0.1uC773

n164 7

C

VREG_RUIM_3.0V

C763

2.2u

VREG_MSMA_2.6V

2.2u

C766

VREG_MSMC2_1.25V

VRF_SMPS_2.1V

n1747

C

C772

1u

VREG_MSMP_2.6V

SDB310QD701

2.2u

C769

KDS114E-RTK_HA

D702

ELCP0008012

4.7uL702

057C

u 7.4

+VPWR

1nC753

+VPWR_AUDIO

4.7u

C767

VREG_AUX2_2.9V

VREG_LCD_2.8V

C759 2.2u

2.2u

L700

PMIC_TCXO

TCXO_PM_19.2MHZ

JTAG_PS_HOLD

TCXO_EN

SLEEP_CLK

PS_HOLDnPON_RST

AMUX_OUT

KPD_PWR_N

VSNS_RF_SMPS

VSNS_MSMC2_1.25V

VSNS_MSMC1_1.25V

VSNS_MSME_1.8V

2010.03.20

2009.11.18

0.3mm 0.3mm

09.11.12

Turbo Mode0603

NDK --> EPSON

0603

0603

Route together

0.6mm

These CAPs close to inductors

0.6mm

0.6mm

Place in PM7540 room at shield edge

Local Ground Plan

0.5mm

1%

Place crystal and load caps close to PM7540

TP2

5 01A

VKB102

KPD_PWR_N

END

R10 0

10n

C313

R306

100

19.2MHzX300


42

31VCONT OUT

GND VCC

C309

100p

33

R309

C312 1n

1n

C314

VREG_TCXO_2.85V

VREG_MSMA_2.6V

C315 100p

C316

0.1u

100K

R313

0.1u

C319

NC7SV00P5X_NLU3013

2

4

15

VCC

GNDSC1

1

SC2

1

TCXO_RTR_19.2MHZ

TCXO_PM_19.2MHZ

TCXO_EN

USBH_SYSCLK

RTR_TRK_LO_ADJ

1.0T

TCXO Circuit

Clesed to TCXO

TP3TP4

TP6TP5

TP7

TP9

TP1

TP8

4. TROUBLE SHOOTING



4.11 Charger Troubleshooting

Check the pin and batteryConnect terminals of I/O connector

Connection OK?

Yes

Change I/O connectorNo

START


Is the TA voltage 5.4V?

Yes

Change TANo

Is the TP3 4.6V?

Yes

Check U700 And FL700 orChange the Main Board

Is it charging properlyAfter turning on Q1, Q�, Q3?

No

ENDYes

4. TROUBLE SHOOTING



4. Troubleshooting

5.4V

TP3

4. TROUBLE SHOOTING



C703

1u

SC3

4

3

2

1

CN700HSMU-5SB-24DR2

15

13

11

9

7

5

4

3

2

1

14

12

10

8

6

D700C70422p

C702

22pZD700

FL700

NFM18PC104R1C31

IN OUT

GND1 GND2

C705

1u

VCHG_VBUS

U700

MAX14528

96

53

4

82

71IN1 OUT1

IN2 OUT2

IC1

OVLO IC2DN

G

DN

GP

USB_ID

MAX_DM

MAX_DP

2mm2mm

u-USB Connector

VBUS 2mm TP2

Troubleshooting Procedure

- Check the charger connector:TP�- Check the Current path :TP3 / TP4- Check the battery

Charging Procedure

- Connect TA- Control the charging current by PM7540 IC

Charging current flows into the battery

Troubleshooting Setup

- Connect TA and battery to the phone

Check Point

- Connection of TA- Charging current path- Battery

Check Charging Current

- Idle → 500mA- Voice Call → 500mA (Alternative)

Q1

QST4

321

456

VCHG_VBUS

Q3SIA431DJ

S1S2

G

D1D2D3D4D5

5C

u33

Q2

QST4

321

456

317R

1.0

VBAT

+VPWR

R16

51

10nC757

+VPWR

BATT_FET_N

CHG_CTL_N

ISNS_P

ISNS_M1%

2mmBattery Charging Circuit

10V1608

2mm

TA(5.4V)

MainBattery

TP3

TP4

4. TROUBLE SHOOTING



4.12 USB Troubleshooting

USB Initial sequence of L-04C is :USB connected to L-04C power on � VCHG_VBUS � IC1 (USB_ID) � USBH_DP/DM and UART_TX/RX �USB work.

Cable is inserted?

Yes

Insert cableNo

START

TP1 is 5V?

Yes

Check U700No

TP� is High?

Yes

Check IC1 or Change Main Board

TP3 Is triggered?

Yes

Check IC1 or Change Main Board

No

Power is on?

Yes

Go to power on trouble shooting

No


TP4 Is triggered?

Yes

Check MSM7��7 or Change Main Board

No

No

4. TROUBLE SHOOTING



807

R

K7.

4

10n

C725

TS5USBA33402YZPRIC1

4B

D2

B2

A1 A2

B3

C2

A4

C1

A3 D1

E4

D3 D4

E3

E2 C3

E1 C4

1B

YLP

PU

SV

UART_TXVBUS

UART_RXDM

DP

USB_DMID

USB_DP

AUDIO_LR2_2K

AUDIO_R

MIC

DSS

_INT

SDACLDO

SCL

GNDTE

SI

2.2K

R705

C724

0.1u

VCHG_VBUSK2

707

R

607

R

K2

VREG_MSMP_2.6V

C721

0.1u

+VPWR

USBH_DM

USBH_DP

MUIC_INT

MUIC_I2C_SCL

MUIC_I2C_SDA

UART2_TXD

UART2_RXD

USB_ID

MAX_DM

MAX_DP

MUIC

TP2

C703

1u

SC3

4

3

2

1

CN700HSMU-5SB-24DR2

15

13

11

9

7

5

4

3

2

1

14

12

10

8

6

D700C70422p

C702

22pZD700

FL700

NFM18PC104R1C31

IN OUT

GND1 GND2

C705

1u

VCHG_VBUS

U700

MAX14528

96

53

4

82

71IN1 OUT1

IN2 OUT2

IC1

OVLO IC2DN

G

DN

GP

USB_ID

MAX_DM

MAX_DP

2mm2mm

u-USB Connector

VBUS 2mmTP1

TP3

TP4

4. TROUBLE SHOOTING



4. Troubleshooting4. Troubleshooting

TP1

TP2TP4

TP3

4. TROUBLE SHOOTING



4.13 RUIM Detect Troubleshooting

RUIM Initial sequence of L-04C is :SIM_CLK, SIM_RST,SIM_IO triggered � VREG_RUIM_3V go to 3V � RUIM IF work

Re-insert the RUIM card

Work well?

No

ENDYes

START


TP1 is 3V?TP� is triggered ? Check J800

No

Work well?

No

ENDYes

Change RUIM card

4. TROUBLE SHOOTING



4. Troubleshooting

TP1TP2

TP1TP2TP1

Main Bottom

C801

22p 22p

C800

008R

K7.4

J800

ENSY0024301KP09N-6S-2_54SF

98

107

63

52

41VCC GND1

RST VPP

CLK IO

GND2 GND5

GND3 GND4

22p

C803C802

0.1u

C804

10p

VREG_RUIM_3.0V

SIM_IOSIM_CLKSIM_RST

TP2TP1

4. TROUBLE SHOOTING



4.14 3 Mega Camera Troubleshooting

3 Mega Camera control signals are generated by MSM7��7.

Check the camera connector and reconnect the camera

Camera is OK?

No

ENDYes

START


TP1 is1 �V?, TP� is 1.8V?TP3 is �.7V?, TP4 is �.8V?

Yes

Change the Qwerty boardNo

Camera is OK

No

ENDYes

Change the camera

TP6 is the MCLK?

Yes


Check the TP5 (PCLK)

Yes


MCLK: �6 MhzPCLK : 7� Mhz

4. TROUBLE SHOOTING



10uC119

VREG_CAM_AVDD_2.7V

R110 12

GB042-34S-H10-E3000CN101

1716151413121110

98765

314323332341

30

29

28

27

26

25

24

23

22

21

20

19

18

VREG_CAM_DVDD_1.2V

120FB102

C1170.1u

VREG_CAM_AF_2.8V

VA1

VREG_CAM_IOVDD_1.8V

C3

DNI

0.1uC114

C1130.1u

FB101120

0.1uC112

VA101

C1111u

33p

C120

CAM_PWDN

CAM_RESET_N


FLT_CAM_DATA[5]FLT_CAM_DATA[4]FLT_CAM_DATA[3]FLT_CAM_DATA[2]FLT_CAM_DATA[1]FLT_CAM_DATA[0]

CAM_MCLK

CAM_PCLK

FLT_CAM_VSYNCFLT_CAM_HSYNC

FLT_CAM_I2C_SDAFLT_CAM_I2C_SCL

TP5

Qwerty To Camera Connector

TP6

TP3TP1 TP2

TP4

4. TROUBLE SHOOTING



4. Troubleshooting

Qwerty B’D

TP1TP2TP3TP4TP6

TP5

TP 5 TP 6

4. TROUBLE SHOOTING



4.15 Keypad Backlight Troubleshooting

Key Pad LED Light is on as below :Key pressing � QT_KPD_DRV_N is Low � KEYPAD LED Lighting (on)

Key press

TP1 s Low

Yes

Chage Dome SheetNo

START

Battery voltage is higherThan 3.�8V?

Yes

Change the BatteryNo

Change the Qwerty board

4. TROUBLE SHOOTING



TP1

TP1

LD3054

3

2

1

LD3044

3

2

1

LD3034

3

2

1

+VPWR

LD3014

3

2

1

533R

0

VA321

C301

1u

33R330

R329 33

33R328

R327 33

QT_KPD_DRV_NTP1

4. TROUBLE SHOOTING



4.15 Keypad Backlight Troubleshooting

Key Pad LED Light is on as below :Key pressing � QT_KPD_DRV_N is Low � KEYPAD LED Lighting (on)

Key press

TP1 s Low

Yes

Chage Dome SheetNo

START

Battery voltage is higherThan 3.�8V?

Yes

Change the BatteryNo


4. TROUBLE SHOOTING



TP1TP1

TP1TP1

magnet

D207D208

U202

32

41VDD OUT

VSS NC

100nC203

VREG_MSMP_2.6V

C2020.1UF

SLIDE_DETECT

SLIDE DETECTChanged 03/24

Active : Low

TP1

4. TROUBLE SHOOTING



4.16 Main LCD Troubleshooting

Main LCD control signals are generated by MSM7��7. The signal path is :MSM7��7 �CN40� �BtoB CN �CN401 �CN103 �CN10� �LCD Moudle

Press END key

Key LED is on?

Yes

GO to power on trouble shooting

No

START

Check the solder of and reconnect

LCD display OK? ENDYes

Change the LCD Module

LCD display OK?

No

ENDYes

Change the Folder Assy

LCD display OK?

No

ENDYes

Change the Qwerty Board ENDYes

No

Change the Main Board

Yes

4. TROUBLE SHOOTING



4.17 Receiver Path

MSM7��7 RCV+/RCV- � AMP (U701) � Main to Qwerty PCB� Qwerty PCB to RF_Slide FPCB � SPK&RCV

Can you hear the tone?

No

ENDYes

START

The sine wave appears at TP1?

No

Change SPK&RCVYes

Check the solder ofCN�01,CN401 and reconnect

The sine wave appears at TP�?

No

Change RF_Slide FPCBYes

Connect the phone to networkEquipment and setup call

Setup 1KHz tone out


No

4. TROUBLE SHOOTING



4. Troubleshooting

TP1

TP1

p93501

C

401C

p93

CN101

2

1

101D

001D

SPK_RCV-

SPK_RCV+TP1

4. TROUBLE SHOOTING



4. Troubleshooting

TP2

TP2


VREG_TOUCH_3.0V

GB042-50P-H10-E3000CN102

26

27

28

29

30

31

32

33

34

35

36

37

38

39

40

41

42

43

44

45

46

47

48

49

501

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

SPK_RCV-SPK_RCV+

PROX_COMPASS_I2C_SCLPROX_OUT


TOUCH_INTTOUCH_I2C_SCL

TOUCH_I2C_SDA

WLED7WLED6


VCOIN

TP2

4. TROUBLE SHOOTING



4. Troubleshooting

4.19 Headset path

MSM7227 HPH_R, HPH_L AMP (U701) J201 (3.5 Ear jack)

Start

Connect the phone to network

YES

equipment and setup call.Setup 1KHz tone outand insert headset.

Can you hear the tone? END

YESSine wave appears

at TP1?Change the Headset

NO

NO

NO


YESSine wave appears

at TP2?Change the Qwerty_Key PCB

4.18 Headset path

MSM7��7 HPH_R, HPH_L � AMP (U701) � J�01 (3.5 Ear jack)


No

ENDYes

START


No

Change the HeadsetYes



No

Change the Qwerty_Key PCBYes

Connect the phone to network

equipment and setup call.Setup 1KHz tone outand insert headset.

4. TROUBLE SHOOTING



4. Troubleshooting

TP1 (L, R)

Ear_Jack

TP1 (R)

TP1 (L)

Qwerty bottom

1800FB201

J201

2

36

5

4

1M5_MIC

M4_L

M3_DETECT

M4D-DETECT

M1_R

M6_GND TP1(R)

TP1(L)

4. TROUBLE SHOOTING



TP2

Amp

TP2

Main TopMain Top

FB701600

C710

39p

307R

02

407R

02

R724 47KC783

10u

C711

39p

C712

39p

C713

39p C715

0.1uR725 47KC717 1u

C716 1u

C707 47n

47nC706

K7.4

11R

9R

K7.4

VREG_MSMP_2.6V

0.1u

C701C700

2.2u

C714

0.1u

C9002.2u

470nC708

C709 470nU701

WM9093ECS-R

3B

A4

C3

C2

2B

D1

D3

4D

C1

A1D2

1B

D5

A2

A5

A3B5

4B

C5

4C

DN

G

OUT+

DD

VP

H

CPVDDCPVSS

CN

HPL

OUT-

SAI

B

IN2- HPR

IN1+D

DV

S

IN3-

IN2+

AD

S

IN1-

IN3+

CP

LC

S

C722

2.2u

+VPWR_AUDIO

2.2uC719

2.2u

C723

2.2uC720

VREG_MSME_1.8V

HPH_LHPH_R

RCV_N

RCV_P

SPK_RCV-SPK_RCV+LINE_OP

LINE_ON

EAR_REAR_L


AUDIO SUBSYSTEM

TP2

4. TROUBLE SHOOTING



4.19 Speaker phone path

MSM7��7 LINE_ON, LINE_OP � AMP (U701) � Main to Qwerty PCB � Qwerty PCB to RF_Slide FPCB � SPK&RCV


No

ENDYes

START


No

Change SPK&RCVYes

Check the solder ofCN�01,CN401 and reconnect


No

Change RF_Slide FPCBYes

Connect the phone to networkEquipment and setup call

Setup 1KHz tone out


No

4. TROUBLE SHOOTING



4. Troubleshooting

TP1

TP1

p93501

C

401C

p93

CN101

2

1

101D

001D

SPK_RCV-

SPK_RCV+TP1

4. TROUBLE SHOOTING



4. Troubleshooting

TP2

TP2

TP2


VREG_TOUCH_3.0V

GB042-50P-H10-E3000CN102

26

27

28

29

30

31

32

33

34

35

36

37

38

39

40

41

42

43

44

45

46

47

48

49

501

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

SPK_RCV-SPK_RCV+

PROX_COMPASS_I2C_SCLPROX_OUT


TOUCH_INTTOUCH_I2C_SCL

TOUCH_I2C_SDA

WLED7WLED6


VCOIN

TP2

4. TROUBLE SHOOTING



4.20 Main microphone

MIC1 � MIC1P

TP1 is 1.8V ?

Yes

Change Qwerty BoardNo

START


Yes

Change the MICNo


Make a call

Make sound to MIC

Yes

Work well? ENDYesNo

4. TROUBLE SHOOTING



4. Troubleshooting

TP2

TP1

TP1

TP2

MIC1

6

5

4

3

2

1OUT

G1

G2

G3

PWR

G4

1 02R

IN

D

512C

p51

4 12C

u 01

312C

p74

FB1 1800MIC_1PMIC_1N

MIC_BIAS

TP2

TP1

4. TROUBLE SHOOTING



4.21 Headsetmicrophone

Headset � ZD�06 � MIC�P

No

ENDOK

START

TP1 is High?

Yes

Change the MAIN boardNo

Change the Main PCB

TP� is �.6v?

Yes

Change the Qwerty BoardNo

Change the headset and retry

Make a call

Yes

The sine wave appears at TP�? Change the headset orQwerty Board and retry.

No

Yes

4. TROUBLE SHOOTING



312R

IN

D

ZD201 ZD202

ZD205

C216

100p

412R

IN

D

FB202 1800

FB203 1800

C206

4.7u

R216

100K

1800FB201

0.1u

C21247p

C21033p

C208

2.2u

C207

912R

K74

47p

C204

402D

VREG_MSMP_2.6V

K2.2

302R

33pC201

202D

102D

202R

K001

1800

FB204

U201

5

3 24 1

VOUTVINGNDSTBY

DN

GP

001Q

D

G

S

022R

M1

VREG_MSMP_2.6V

J201

2

36

5

4

1M5_MIC

M4_L

M3_DETECT

M4D-DETECT

M1_R

M6_GND

HOOK_ADC

EAR_R

EAR_L

HS_MIC_BIAS_EN

HS_MIC

EAR_SENSE

AUDIO_GND

3.5 EAR_JACK

MATING

EAR_SENSE

UNMATING

STATE

LOW(DEFAULT)

HIGH

5/10 Added

4. Troubleshooting

TP1TP2

TP3

< Main Bottom >

TP1TP3

TP2

TP2

TP3

TP1

4. TROUBLE SHOOTING



4.22 Vibrator

MSM7��7 (MOTOR_PWM) � U601 � Motor

START

TP1 is PWM?

Yes

Check the MAIN or ReplaceNo

Change vibrator

Check TP� signal exist ? Ch k th U601Check the Or Replace

No

Operate the Vibrator

Yes

NoKey Function is OK?


No

No

4. TROUBLE SHOOTING



TP1 TP2

TP2

CN601

2

1

L511 100n

L512 100n

523AV

423AV

Q601

C

B

E GND

IN

OUT

R619

100K

TPA6202A1ZQVRU601

B2C1

A1B1

B3C2

A3C3IN- VDD

IN+ VO+

_SHUTDOWN VO-

BYPASS GND

VREG_MOTOR_3.3VVREG_MOTOR_3.3VK1

716R

100K

R622

51K

R620

51K

R621

C638

0.1u

10nC640

816R

K1

K7.4

32 6R

C639

1u

MOTOR_PWM

CONNECTOR Type

%1%1 1%

Q-coin MOTOR

1%

1%

1%

TP1

TP2

4. TROUBLE SHOOTING



4.23 SD card operation

START

Check TP1 Level High?

Yes

Check the R�1� & Re solderingNo


Check TP� Level 3V?

Yes

Reconnect BtoB orCheck U704(Main PCB)

No

Yes

Check TP3, TP4 Signal is exist? Change Qwerty PCBNo

SD card operation is OK?

END

Low level : 0VHigh level : 3V

4. TROUBLE SHOOTING



ZD206

CN1

168

7

6

5

4

3

2

1 15

G5 G3 G1 CD

C1

C2

C3

C4

C5

C6

C7

C8

G6 G4 G2 COM

G7

212R

smho

K001

0.1u

C205

K74

112R

602D

43

52

61

VREG_MSMP_2.6V

R210 2.2

VREG_MMC_3.0V502

D

43

52

61

K74

9 02R

802R

K 74

K74

702R

K7 4

6 02R

MMC_CLK

MMC_CMDMMC_DATA[3]MMC_DATA[2]

MMC_DATA[1]MMC_DATA[0]

MICROSD_DET_N

Open

Detect

Close (Detect =COM)

S/W

LOW (Detect)

HIGH (Normal)

Micro SD Socket

TP2TP3

TP4

TP1

4. TROUBLE SHOOTING



4. Troubleshooting

TP2

TP1

TP3 TP4

TP1

4. TROUBLE SHOOTING



4.24 Touch Troubleshooting

Touch Window

Press Touch Window

Yes

Change theTouchWindowNo


TP� is triggered ?

Yes

Reconnect RF Slide FPCBConnectorwith Touch Window

No

Yes

TP1 is 3V ? Reconnect BtoB ConnectorNo

Touch operating OK?

END

4. TROUBLE SHOOTING



CN100GB042-10P-H10-E3000

65

74

83

92

101

601AV

701AV

C109

1u801

AV

VREG_TOUCH_3.0V

TOUCH_INT

TOUCH_I2C_SCL

TOUCH_I2C_SDA

Touch Connector

1 pin : right, lower

4. Troubleshooting

TP2 TP1TP2 TP1

TP1

TP2

Touch Window Connector RF Slide FPCB ConnectorTouch Window Connector RF Slide FPCB Connector

TP2

TP2

TP1

4. TROUBLE SHOOTING



4.25 Proximity Sensor Troubleshooting

Proximity Some Objects

Cognition Objects?

Yes

Reconnect CN10� to Qwerty Board

No

Change the RF Slide FPCB

TP� is LOW ?

Yes

Check the U100 or ReplaceNo

Yes

TP1 is �.6V ? Change the Qwerty BoardNo

Compass operating OK?

END

4. TROUBLE SHOOTING



4. Troubleshooting

TP2 TP1

TP1

TP2

RF Slide FPCB BOT RF Slide FPCB TOP



R100

4.7

u1 101C

TP1000.1u

C103C102

4.7u

R101

10

C100 4.7uU100 GP2AP002S00F

54

63

72

81LEDA SCL

LEDC SDA

VCC VIO

VOUT GND


PROX_OUT


Proximity SensorTuning point

TP1

TP2

4. TROUBLE SHOOTING



4.26 Digital Compass Troubleshooting

Navigate Compass

The needle of a compass moving?

Yes

Reconnect CN401 to Qwerty Board

No


Cognition Objects?

Yes

Check the U1 or ReplaceNo

Yes

TP� is triggered ? Change the Main boardNo

Compass operating OK?

END

4. TROUBLE SHOOTING



470n

C2

6R

K3.3

1C

n01

U1AMI304

12

11

10

9

5

4

6

37

28

1D

DV

D

GE

RV

AD

NG

SD

NG

DD

VA

ADDR

SCL

NC1

TNI

VPP

DRDY

SDAK3. 3

7R

TP1


0R2

R4 0



COMPASS_DRDY

4. Troubleshooting

TP2

TP1

TP1

TP2

Qwerty Board BOTQwerty Board TOP

TP1

TP2

TP2

5. DOWNLOAD



5. DOWNLOAD

- 164 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes

5. DOWNLOAD

5. DOWNLOAD

L-04C

L-04C

5. DOWNLOAD


LGE Internal Use Only - 165 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes


5. DOWNLOAD

L-04C

L-04C

L-04C

5. DOWNLOAD


LGE Internal Use Only - 166 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes

5. DOWNLOAD

L-04C

L-04C

5. DOWNLOAD

- �0� - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes



5. DOWNLOAD

L-04C

L-04C

L-04C

5. DOWNLOAD



5. DOWNLOAD

L-04C

5. DOWNLOAD




5. DOWNLOAD

5. DOWNLOAD



5. DOWNLOAD

5. DOWNLOAD




5. DOWNLOAD

5. DOWNLOAD



5. DOWNLOAD

5. DOWNLOAD




5. DOWNLOAD

5. DOWNLOAD



5. DOWNLOAD

L-04C

L-04C

L-04C

L-04C

L-04C

L-04C

L-04CL-04C

5. DOWNLOAD




5. DOWNLOAD

L-04C L-04C

L-04C L-04C

L-04C

L-04C L-04C

5. DOWNLOAD



5. DOWNLOAD

L-04C L-04C

L-04C

L-04C

6. BLOCK DIAGRAM



6.Block diagram

Elini Total Block Diagram

6. BLOCK DIAGRAM



System HW Block Diagram ; RF

6. BLOCK DIAGRAM



System RF Block Diagram ; Control signals and Clocks

6. BLOCK DIAGRAM



System HW Block Diagram ; BLUETOOTH & Wi-Fi

6. BLOCK DIAGRAM



System HW Block Diagram ; Memory, MICRO-SD, USIM

6. BLOCK DIAGRAM



System HW Block Diagram ; LCD

6. BLOCK DIAGRAM



System HW Block Diagram ; CAMERA

6. BLOCK DIAGRAM



System HW Block Diagram ; Audio

6. BLOCK DIAGRAM

- ��0 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes


Power Block

6. BLOCK DIAGRAM



Power Block

6. BLOCK DIAGRAM

- �� - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes


BLUETOOTH Block

6. BLOCK DIAGRAM



Wi-Fi Block



7. CIRCUIT DIAGRAM

L1015

1.2n

C8554

2.5p

+VPWR

C1013 33p

FL1004B7671

836.5 MHz,881.5 MHz

95

7

3

1

2

8

4

6ANT

GND2

RX_OUT2

GND1

RX_OUT1

TX_IN

GND4

GND3 GND5

1001R

0

1.8pC1068

DNI

L101418n

L1013

1.8pC1067

FL1005

SAFEB836MAL0F00

836.5MHz3 2

4 1

5GND

INOUTG1G2

C1062 2.2p

C85531n

L1009

3.9nDNI

L1010

L1000 8.2n

C1064 2.2p

L1008DNI

C1063 2.2p

L10074.7n

9101R

180

C106039p

8101R

120

39p

C1059

DNI

C1058

R1017

51

C1057DNI

SKY77336U1002

23 2224 2125 2026 1927 1828 17

9 810 711 612 513 414 315 216 1

DCS_PCS_INDCS_PCS_OUT

BSGND6

TX_ENGND5

VBATTVCC_OUT

VAPCGND4

NCGND3

GND1GND2

GSM_INGSM_OUT

PGND1PGND12

PGND2PGND11

PGND3PGND10

PGND4PGND9

PGND5PGND8

PGND6PGND7

15pC1056

L1006

15n

6 10 1R

120

5101R

180

R1014

2.2K

+VPWR

L1005

DNI

30

R1013

1KR1012

1KR1011

R1010 1K

15n

L1004

1KR1009

C1053

1.5n

C1054

0.1u C1073 100p

L1027

2.7n

9901C

n8.1

C1052

33p

VREG_FEM_2.7V

FL1001D5017

850,1900,2100MHz

65437

11

9

22

21

20

1324

1223

10

158

141

17

162

19

18PCS_RX1

PCS_RX2

ANT PCN_RX1

PCN_RX2

GND1 EGSM_RX1

GND2 EGSM_RX2

GND3

GND4 GSM850_RX1

GND5 GSM850_RX2

WCDMA_2100

WCDMA_850

WCDMA_1900

PCN_PCS_TX

GSM850_EGSM_TX

DD

V

1LRT

C

2LRT

C

3LRT

C

4LRT

C

DNI

C1051

R1002

1K

C1016

15n

C1050

DNI

9401C

u1.0

51

R1024

L8056 1n

L1017

6.8n

C1042 10n

C1041 1n

0001R

IN

D

p 0 01

04 01C

L1023

2.2n

RF2815U1001

3

2

5

4

1NI_F

R

FIL_OUT

VDD

S_D

GND

VREG_MSMP_2.6V

u1.07301

C

6301C

p001

5301C

u7.4

4301C

u7.4

C1033

10u

u1.02301

C

5.1

R1007

R1006

5.1

VREG_RFRX1_2.7V

1n

C1031

C1030

0.1u

u1.09201

C

C1028 10n

p227201

C

12KR1003

C51

DNI

C1072 22p

C1084 1.8p

C1025 100p

RTR6285U1000

329282534396

62

61

60

54

4336

3738

2768

2552

2142

8

745

144

5347

2246

10

649

448

3

51

6750

1939

40

18

1741

16

1533

32

1331

1430

12

1159

58

956

24

557

55

65

6620

632

6426RF_ON TX_IP

TCXO TX_IN

SBDT TX_QP

TX_QN

LB_RF_OUT1

LB_RF_OUT2 VTUNE1

VTUNE2

HB_RF_OUT1 VTUNE_GPS

HB_RF_OUT2

HB_RF_OUT3 PRX_QP

PRX_QN

WPRXLBP PRX_IP

WPRXLBN PRX_IN

WPRXHBP

WPRXHBN DRX_QP

DRX_QN

WDRXLB DRX_IP

DRX_IN

WDRXHB1

WDRXHB2 NC

GCELL_INP DAC_IREF

GCELL_INN

VDDA1_1

EGSM_INP VDDA1_2

EGSM_INN VDDA1_3

VDDA1_4

DCS_INP VDDA1_5

DCS_INN VDDA1_6

GPCS_INP VDDA2_1

GPCS_INN VDDA2_2

VDDA2_3

GPS_IN VDDA2_4

PDET_IN VDDA2_5

TX_RBIAS VDDA2_6

WPRXSE1 VDDA2_7

WPRXSE2 VDDA2_8

VDDA2_9

VDDA2_10

VDDA2_11

VDDA2_12DN

GP

TU

O_2E

SX

RP

W

TU

O_1E

SX

RP

W

PNI_

XM_

BW

MNI_

XM_

BW

MD

DV

4.7u

C1024

p0013201

C

MS-156CSW1000

43

2

1ANT COMMON

G3 G4

C1102

3.3n

C1101

0.5p

C1098 1n

DNIL1031

L1033

1p

FL1006SAFEB1G95KA0F00

1950MHz5 2

4 1

3G3

INOUTG1G2

L1036

22n

L1026

6.8n

C1096

100p100p

C1095

680p

C1094680p

C1093

L8057

DNI

680p

C1092

C1091

4.7u

C1090

680p

100p

C1089

100p

C1088DNIL1028

33p

C1087C10863.3n

C1026 7p

C1085 33p

L1030

12n

FL1002SAFEB2G14FB0F00

2140MHz 45

1

32G1 O1

ING2 O2

DNIL1025

+VPWR

L1029

15n

100p

L1024

C1083

15p

C1061 2.2p

C1038 27p

L1018

33p

2801C

n3.3

DNI

C52

22p

C56

10u

C53

3201R

011

2201C

u1.0

L1003

68n

0011C

n6.5

C1019 33p

C1018DNI

VREG_RFRX1_2.7V

DNIC1017

FL1000SAFEB1G57KB0F00

1575.42 MHz 5 3 2

4 1INOUT

G1G2G3

C1007

18p

56

R1022

VRF_SMPS_2.1V

DNIC1015

L10782.7n

C1077

100p

VDD_RX

600

FB1001

FB1000

600

C1076

0.5p

0 201R

K1

L1020

1n

C10140.1u

1201R

011

68p

C1012

C1011

68p

C1010

0.1u

u1.09001

C

C1075

2.2n

C1039

5.6n

u1.05001

C

4001C

u1.0

3001C

u1.0

L1019

1n

ANT801

ODGPPTR3015

2

31

4DUMMY3

FEED DUMMY2

DUMMY1

L1022

DNIL1032

DNI

03R

2001C

u1.0

FL1003 B7697

1950MHz, 2140MHz

958472

3

6 1RXANT

TX


L1011

100n

L1002

68n

1001C

u1.0

U1004SKY77704-15

6 5

7 4

8 3

9 2

10 1

11PGND

VCC1VCC2

RFINRFOUT

VMODE_1CPL_IN

VMODE_0GND

VENCPL_OUT

L1034

8.2n

GND

CN7

1

CN8

1

GND

u1.00001

C

SW1001

UFL-R-SMT10

G1

ANTG2

CN5

1

GND GND C1097 1.8p

SKY77701U1003

6 5

7 4

8 3

9 2

10 1

11PGND

VCC1VCC2

RFINRFOUT

VMODE_1CPL_IN

VMODE_0GND

VENCPL_OUT

CN6

1

GND

CN3

1

GND

CN4

1

GND

CN1

1

GND

CN2

1

L1001 5.6n

C8555

DNI

L1016

DNI

C1103

33p

C1104

56p

C1079

DNI

5301L

n2.2

5501C

n2.2

0.1u

C1074

4.7u

C57

33p

C55p3 3

45C C1070

10u

ANT_SEL0ANT_SEL1ANT_SEL2

GSM_PA_EN

GSM_PA_RAMP

ANT_SEL3

TCXO_RTR_19.2MHZ

RTR_DAC_REF

RTR_TXIP

RTR_TXIM

RTR_TXQP

RTR_TXQM

RTR_RXIPRTR_RXIM

RTR_RXQMRTR_RXQP

RTR_DRXIPRTR_DRXIM

RTR_DRXQMRTR_DRXQP

GSM_PA_BAND

PA_ON0

RTR6285_SSBI

GPS_LNA_EN

PA_R0

PA_R0PA_ON1

GND

RX_WCDMA_1900

RX_WCDMA_1900

GPS_IN

GPS_IN

DCS_PCS_TX

DCS_PCS_TX

GSM_TX

GSM_TX

RX_PCS_P

RX_PCS_P

RX_PCS_M

RX_PCS_M

RX_DCS_M

RX_DCS_M

RX_GSM_900_PRX_GSM_900_P

RX_GSM_900_M

RX_GSM_900_M

RX_WCDMA_2100

RX_WCDMA_2100

PDET_IN

PDET_IN

VDD_RX

RX_DCS_P

RX_DCS_P

RTR_TXON

WCDMA_800_TX_OUT

WCDMA_800_TX_OUT

VSNS_RF_SMPS



RX_WCDMA_800_M

RX_WCDMA_800_M

RX_WCDMA_800_P

RX_WCDMA_800_P

WB2100_MIX_INM

WB2100_MIX_INM

WB2100_MIX_INP

WB2100_MIX_INP

WCDMA_2100_RTX

WCDMA_2100_RTX

WCDMA_2100_TX_OUT

WCDMA_2100_TX_OUT

WCDMA_800_RTX

WCDMA_800_RTX

VDDA2 [2.1V] : Pin 1,7,8,21,25,27,37,43

VDDA2 [2.1V] : Pin 54,60,61,62==> PLL1, PLL2, GPS PLL, VCOs

==> DCS/PCS LNA, dirver amp, mixers and baseband Tx

VDDA1 [2.7V] : Pin 3,4,6,10,22,53

8.5dB

Close to RTR

DCS1800(1710-1785 MHz)PCS1900(1850-1910 MHz)

GSM900(880-915 MHz)

DCS(1805-1880 MHz)

GSM(925-960 MHz)

PCS(1930-1990 MHz)

HIGH

HIGHLOW

LOWLOW

LOW

LOW

HIGH

LOW

LOW

HIGH

LOW

LOW

LOW

LOW LOW

LOWDCS/PCS TX

LOW

ANT_SEL0 ANT_SEL2

LOW

LOW

EGSM TX HIGH

DCS1800 RX

WCDMA 850 (PIN21)

HIGH

HIGH

LOW

ANT_SEL3ANT_SEL1

EGSM RX

PCS1900(1850-1910 MHz)2mm

5dB

GSM900(880-915 MHz)

DCS1800(1710-1785 MHz)

8dB

PCS1900 RX

WCDMA 2100 (PIN20) HIGH

HIGH

LOWLOW

==> Baseband Rx, WCDMA LNA, Cell/EGSM LNA

GSM_PA_BAND

LOW

HIGH

VDDA1: PIN 3,4,6,10,22,53 = 2.7V VDC

MODE

1%

WCDMA RX 2100 LNA Circuit

ANTENNA SWITCH MODULE LOGIC (D5017)

GSM

1608 1608

LNA for the GPS

VDDA2: PIN 1,7,8,21,25,27,37,43,54,60,61,62 = 2.1V VDC

1608

DCS/PCS

0603

0603

0603

0603

W2100 RX(2110 - 2170 MHz)

0603

0603

GSMWCDMA

7. CIRCUIT DIAGRAM



7. CIRCUIT DIAGRAM

CN300JTAG_STD_1COLUMN_10P

10

9

8

7

6

5

4

3

2

1TCK

RTCK

TDO

TDI

TMS

TRST

VCC

RESIN

PS_HOLD

GND

R10 0

VA300 VA301 VA302 VA303

VA304

TP300

VBAT

UAT300

12

11

10

9

8

7

6

5

4

3

2

1GND

RX

TX

NC1

ON_SW

VBAT

NC2

NC3

NC4

DSR

RTS

CTS

GND

RX

TX

VCHAR

ON_SW

VBAT

PWR

URXD

UTXD

3G2.5G

VCHG_VBUS

TP302

TP303

TP304

C321

39p

VREG_MSMP_2.6V

K01

103R

0.1u

C300K001

003R

10n

C313

R306

100

C304 47p

K01213

RV6.2_

PM

SM_

GE

RV

19.2MHzX300


42

31VCONT OUT

GND VCC

103D

C309

100p

V6.2 _P

MS

M_G

ER

V

33

R309

6R

0

113R

K01

513R

001

47pC322

49.9

R310

613R

001

TP310

803R

0406

IN

D4

R

C31122u

K1703

R

0.1u

C310

TP309

VA305

u1.0703

C

603C

u1.0

C312 1n

u1.0503

C

303C

u1.0

323C

u1.0

203D

47p

C301

MIC_BIAS

M5

Y18

AC19

AF18

Y17

U16

AC18

AF17

W16

AE17

AC17

Y16

AB17

W5

W3

V5

V6

MSM7227

U302

AB9

V9

V8

Y9

W8

AB8

V3

V2

U2

U8

U9

AF4

AE2

AB7

AE4

AE3

AD3

L2

L8

L3

L9

AD2

AC6

AC3

AC2

U15

W15

AC16

AB16

AF15

Y15

AC15

AB15

W14

AE14

AC14

Y14

AC13

U13

Y13

AB13

W13

W12

AB12

Y12

AC12

AC11

AF10

W9

AE10

U12

AF9

AC20

AF20

AB21

AE20

AF21

AF22

AC23

AE23

AC21

AF23

AE21

AB22

AC22

AE24

AE25

AF24

6M

8M

9M

8E

A

7F

A

8C

A

6F

A

7C

A

6E

A

11

R

81

BA

81

W

11

Y

71

C

71

B

61

H

81

H

71

M

62

G

01

Y

11

T

01

W

61

EA

8F

A

61

FA

5F

A

31

F

21

C

21

B

11

H

11

J

21

H

21

J

11

E

21

F

11

F

21

E

91

EA

91

FA

02

BA

51

C

61

F

31

H

41

H

41

J

31

J

11

C

41

L

3F

2F

3E

2E

2D

52

G

61

L

91

C

91

B

91

H

62

F

02

H

81

J

71

J

32

H

22

F

32

F

61

J

71

E

51

J

71

F

61

B

61

C

51

H

81

B

52

B

12

F

02

B

02

F

71

H

02

E

02

C

81

C

81

F

B21

B22

C21

E21

C22

C24

E26

B24

F25

C26

D26

C23

B23

C25

D25

E23

W20

AD26

N17

T20

J25

M20

N25

V26

H26

L25

P20

U26

V19

AC25

U19

U20

AB23

W25

W26

R19

T19

W22

AC26

V23

AB26

AB25

AA23

AA25

Y26

Y23

T17

Y22

W23

AA26

V20

J26

K20

J20

J23

J22

K19

K26

L22

L19

L23

L20

M19

L26

M26

M22

M23

N26

N19

N20

P26

R26

P19

R25

T26

R22

R23

R20

T23

T22

U25

U23

U22

4C

6G

5G

6N

3N

2N

2W

6W

3M

8T

2K

3K

2J

3J

2H

3H

2G

3G

6R

2P

3P

2R

3R

11B

41F

A

31

FA

21

FA

11

FA

5BA

3BA

2BA

3A

A

2A

A

2Y

6AA

2M

3U

11

W

9E

A

9C

A

6BA

3Y

71W

91BA

51

E

41

C

31C

51B

41B

31B

8H

6F

5F

01J

01H

9H

01

C

01B

9C

9B

8F

8E

7F

7E

7C

7B

6C

5C

6B

5B

PI_R

_E

NIL

NI

_R_

EN

IL

PI

_L_

EN

IL

NI_

L_E

NI

LP

1C

IM

N1

CI

MP2

CI

MN2CI

MPIXU

ANI

XU

A

PO_

ENIL

NO

_ENIL

PO_

1RA

ENO

_1

RAE

TUOX

UA

R_HP

HL_H

PH

PM

OCC

SAI

B_C

IM

FER

V_

HP

H

KL

CSY

S_

YH

PBS

UPD_Y

HP

BSU

ND_

YH

PBSU

DI

_Y

HPB

SU

SU

BV_

YH

PBS

UT

XE

R_Y

HP

BSU

N_

NI

SER

N_

TU

OSE

R

NE_G

ODW

0_E

DOM

1_

EDO

M2

_E

DOM

3_

EDOM

OX

CT

JDA

_O

L_KR

TKLC

_P

EELS

ID

TSM

TN

_T

SRT

OD

TKC

TK

CTR

P_A

TAD_I

DDM

N_

ATA

D_

IDD

MP_

BTS

_I

DD

MN_

BTS_I

DDM

KL

CP

_CD

CL

P_TU

O_

IN_TU

O_I

P_

TU

O_Q

N_

TU

O_Q

FER

_CAD

0HC

_P

I_

I0H

C_

MI_

I0HC_

PI_Q

0HC

_M

I_Q

1H

C_

PI_I

1H

C_

MI_

I1H

C_PI_

Q1

HC

_MI

_Q

NO

_X

TJDA

_C

GA_X

T

0NO

_A

P0E

GNA

R_

AP

LT

C_RWP

_AP

M_L

TC_

RW

P_AP

FER

_G

B_

MSG

0N

IA

KH

1NIA

KH

2NI

AK

H

EBI1_DQ_0EBI1_DQ_1EBI1_DQ_2EBI1_DQ_3EBI1_DQ_4EBI1_DQ_5EBI1_DQ_6EBI1_DQ_7EBI1_DQ_8EBI1_DQ_9EBI1_DQ_10EBI1_DQ_11EBI1_DQ_12EBI1_DQ_13EBI1_DQ_14EBI1_DQ_15EBI1_DQ_16EBI1_DQ_17EBI1_DQ_18EBI1_DQ_19EBI1_DQ_20EBI1_DQ_21EBI1_DQ_22EBI1_DQ_23EBI1_DQ_24EBI1_DQ_25EBI1_DQ_26EBI1_DQ_27EBI1_DQ_28EBI1_DQ_29EBI1_DQ_30EBI1_DQ_31

EBI1_ADR_0EBI1_ADR_1EBI1_ADR_2EBI1_ADR_3EBI1_ADR_4EBI1_ADR_5EBI1_ADR_6EBI1_ADR_7EBI1_ADR_8EBI1_ADR_9EBI1_ADR_10EBI1_ADR_11EBI1_ADR_12EBI1_ADR_13

EBI1_CKE0EBI1_CKE1EBI1_DCLKEBI1_DCLKBEBI1_WE_NEBI1_CS0_NEBI1_CS1_NEBI1_BA_0EBI1_BA_1EBI1_DQS_0EBI1_DQS_1EBI1_DQS_2EBI1_DQS_3EBI1_DM_0EBI1_DM_1EBI1_DM_2EBI1_DM_3EBI1_RAS_NEBI1_CAS_NEBI1_RESOUT_NEBI1_CAL

EBI2_DATA_0EBI2_DATA_1EBI2_DATA_2EBI2_DATA_3EBI2_DATA_4EBI2_DATA_5EBI2_DATA_6EBI2_DATA_7EBI2_DATA_8EBI2_DATA_9EBI2_DATA_10EBI2_DATA_11EBI2_DATA_12EBI2_DATA_13EBI2_DATA_14EBI2_DATA_150

_R

DA

_2

IB

E

1_

RD

A_

2I

BE

2_R

DA

_2I

BE

3_R

DA

_2I

BE

4_R

DA

_2I

BE

5_R

DA

_2I

BE

6_R

DA

_2I

BE

7_R

DA

_2I

BE

8_R

DA

_2I

BE

9_R

DA

_2I

BE

01_R

DA

_2I

BE

11_R

DA

_2I

BE

21_R

DA

_2I

BE

31_R

DA

_2I

BE

41_R

DA

_2I

BE

51_R

DA

_2I

BE

61_R

DA

_2I

BE

N_0

SC

_2I

BE

N_1

SC

_2I

BE

N_4

SC

_2I

BE

N_5

SC

_2I

BE

N_6

SC

_2I

BE

N_7

SC

_2I

BE

KLC

_2I

BE

N_

EW

_2I

BE

N_

EO

_2I

BE

N_

BU

_2I

BE

N_

BL

_2I

BE

N_

0YS

UB

_2I

BE

REP

IW

RL_

ST

LL_

ST

RU_

ST

LU_

ST

231

_OI

PG

131

_OI

PG

031

_OI

PG

921

_OI

PG

821

_OI

PG

721

_OI

PG

621

_OI

PG

521

_OI

PG

421

_OI

PG

321

_OI

PG

221

_OI

PG

121

_OI

PG

021

_OI

PG

911

_OI

PG

811

_OI

PG

711

_OI

PG

611

_OI

PG

511

_OI

PG

411

_OI

PG

311

_OI

PG

211

_OI

PG

111

_OI

PG

011

_OI

PG

901

_OI

PG

801

_OI

PG

701

_OI

PG

601

_OI

PG

501

_OI

PG

401

_OI

PG

301

_OI

PG

201

_OI

PG

101

_OI

PG

001

_OI

PG

99

_OI

PG

89

_OI

PG

79

_OI

PG

69

_OI

PG

59

_OI

PG

49

_OI

PG

39

_OI

PG

29

_OI

PG

19

_OI

PG

09

_OI

PG

98

_OI

PG

88

_OI

PG

78

_OI

PG

68

_OI

PG

58

_OI

PG

GPIO_0GPIO_1GPIO_2GPIO_3GPIO_4GPIO_5GPIO_6GPIO_7GPIO_8GPIO_9

GPIO_10GPIO_11GPIO_12GPIO_13GPIO_14GPIO_15GPIO_16GPIO_17GPIO_18GPIO_19GPIO_20GPIO_21GPIO_22GPIO_23GPIO_24GPIO_25GPIO_26GPIO_27GPIO_28GPIO_29GPIO_30GPIO_31GPIO_32GPIO_33GPIO_34GPIO_35GPIO_36GPIO_37GPIO_38GPIO_39GPIO_40GPIO_41GPIO_42GPIO_43GPIO_44GPIO_45GPIO_46GPIO_47GPIO_48GPIO_49GPIO_50GPIO_51GPIO_52GPIO_53GPIO_54GPIO_55GPIO_56GPIO_57GPIO_58GPIO_59GPIO_60GPIO_61GPIO_62GPIO_63GPIO_64GPIO_65GPIO_66GPIO_67GPIO_68GPIO_69GPIO_70GPIO_71

GPIO_72_GRFC_9GPIO_73_GRFC_8GPIO_74_GRFC_7GPIO_75_GRFC_6GPIO_76_GRFC_5GPIO_77_GRFC_4GPIO_78_GRFC_3GPIO_79_GRFC_2GPIO_80_GRFC_1GPIO_81_GRFC_0

GPIO_82GPIO_83GPIO_84

47p

C25

V6.2_A

MS

M_G

ER

V

U300

74LVC1G79GM

43

52

61D VCC

CP NC

GND Q

0.1u

C718

(0603)

2.2n

C35

15

31R

1n

C314

VREG_TCXO_2.85V

VREG_MSMA_2.6V

C315 100p

C316

0.1u

C317

0.1u

100K

R313

C318

33p

0.1u

C319

2K

R314

VREG_TCXO_2.85V

C320

33n

NC7SV00P5X_NLU3013

2

4

15

VCC

GND

7.5p

C4

47

R14

TP306

TP307

TP308

7.5p

C3

SC1

1

SC2

1

VCHG_VBUS

ANT_SEL0ANT_SEL1ANT_SEL2

GSM_PA_EN

PM

AR_

AP_

MS

G

ANT_SEL3

TCXO_RTR_19.2MHZ

FE

R_C

AD_

RTR

PIXT_

RTR

MIXT_

RTR

PQ

XT_RT

RM

QXT_

RTR

PIX

R_RT

RMI

XR_

RTR

MQ

XR_

RTR

PQ

XR_

RTR

PIX

RD_

RTR

MIX

RD_

RTR

MQ

XR

D_RT

RP

QX

RD_

RTR

GSM_PA_BAND

0N

O_A

P

RTR6285_SSBI

GPS_LNA_EN

0R_

AP

PA_ON1

CAM_MCLK

N_TE

SE

R_TB

PU

EK

AW_T

SO

H_N

ALW

TNI_

HC

UOT

LC

S_C2I_

SS

AP

MO

C_X

OR

P

N_TE

SE

R_N

ALW

TU

O_X

OR

P

PMIC_TCXOO

XCT_

CIM

P

TCXO_PM_19.2MHZ

JTAG_PS_HOLD

MOTION_INT

nSDRAM_CS0nSDRAM_WE

EO_

DN

ANn

EW_

DN

ANn

YD

AE

R _H

SALF_

DN

AN

EBI2_DATA[7]EBI2_DATA[6]EBI2_DATA[5]EBI2_DATA[4]EBI2_DATA[3]EBI2_DATA[2]EBI2_DATA[1]EBI2_DATA[0]

EBI2_DATA[15]EBI2_DATA[14]EBI2_DATA[13]EBI2_DATA[12]EBI2_DATA[11]EBI2_DATA[10]EBI2_DATA[9]EBI2_DATA[8]

NE_

OX

CT

TCXO_EN

KLC_

PE

ELS

L_H

PH

R_H

PH

N_V

CR

PM_INT_NPS_HOLD

MSM_USIM_CLK

MSM_USIM_DATA

BT_PCM_CLKBT_PCM_SYNC

BT_PCM_DOUT

WLAN_CLKWLAN_CMD

BT_WAKEUP

SDRAM_DQM3SDRAM_DQM2SDRAM_DQM1SDRAM_DQM0SDRAM_DQS3SDRAM_DQS2SDRAM_DQS1SDRAM_DQS0

nRESETOUT

SDRAM_DCLK0SDRAM_DCLK1

SDRAM_CKE

SDRAM_ADDR[12]SDRAM_ADDR[11]SDRAM_ADDR[10]SDRAM_ADDR[9]SDRAM_ADDR[8]SDRAM_ADDR[7]

SDRAM_ADDR[5]SDRAM_ADDR[4]SDRAM_ADDR[3]SDRAM_ADDR[2]SDRAM_ADDR[1]SDRAM_ADDR[0]

SDRAM_ADDR[6]

SDRAM_DATA[16]

SDRAM_DATA[0]

SDRAM_BA0SDRAM_BA1

SDRAM_ADDR[13]

SDRAM_DATA[1]SDRAM_DATA[2]SDRAM_DATA[3]SDRAM_DATA[4]SDRAM_DATA[5]SDRAM_DATA[6]SDRAM_DATA[7]SDRAM_DATA[8]SDRAM_DATA[9]

SDRAM_DATA[10]SDRAM_DATA[11]SDRAM_DATA[12]SDRAM_DATA[13]SDRAM_DATA[14]SDRAM_DATA[15]

SDRAM_DATA[17]SDRAM_DATA[18]SDRAM_DATA[19]SDRAM_DATA[20]SDRAM_DATA[21]SDRAM_DATA[22]SDRAM_DATA[23]SDRAM_DATA[24]SDRAM_DATA[25]SDRAM_DATA[26]SDRAM_DATA[27]SDRAM_DATA[28]SDRAM_DATA[29]SDRAM_DATA[30]SDRAM_DATA[31]

nSDRAM_RASnSDRAM_CAS

BU_

DN

ANn

BL_D

NA

Nn

MSM_USIM_RST

WLAN_SDIO[0]


BT_PCM_DIN

BT_HOST_WAKEUP

WLAN_SDIO[3]

FE

R_C

AD_

AP_

MS

G

P_V

CR

LC

S_C2I_

HC

UOT

SC _

HS

ALF_D

NA

Nn

AD

S_C2I_

HC

UOT

TS

R_N

OPn

REMOTE_PWR_ONREMOTE_PWR_ON

MD_

HB

SU

PD_

HB

SU

TU

O_X

UM

A

MOTION_I2C_SDAMOTION_I2C_SCL

NO

XT_RT

R

SDRAM_CKE1

MUIC_INT

LC

S_C2I_L

B_D

CLA

DS_

C2I_LB_

DCL

LCD_BL_EN

CAM_DATA[0]CAM_DATA[1]

MSM_RTCK

KCT

R_M

SM

MSM_TDO

ODT_

MS

M

MSM_TDI

IDT_

MS

M

MSM_TMS

SMT_

MS

M

MSM_TCK

KCT_

MS

M

MSM_TRSTN

NTS

RT_M

SM

USBH_SYSCLK

KLC

SY

S_H

BS

U

OL_

KRT

TRK_LO

RTR_TRK_LO_ADJ

RTR_TRK_LO_ADJ

N1

_CI

M

CAM_RESET_N

CIM_

SH

CAM_PWDN

MICROSD_DET_N

CD

A_K

OO

H

O_C

NY

SV_

DCL_

MS

M

BT_UART_TXDBT_UART_RXDBT_UART_CTSBT_UART_RTS

WOL_

DIR

EK

AM_

DCL

QTKEY_RESET

MUIC_I2C_SCL

MUIC_I2C_SDA

QTKEY_INT

DXT_2T

RA

U

UART2_TXDUART2_TXD

DX

R_2TR

AU

UART2_RXD UART2_RXD

MMC_CLKMMC_CMD

MMC_DATA[3]MMC_DATA[2]MMC_DATA[1]MMC_DATA[0]

P1_CI

M

HS_MIC_BIAS_EN

CAM_I2C_SCLCAM_I2C_SDA

SLIDE_DETECT

QTKEY_SDAQTKEY_SCL

PO_

ENIL

EAR_SENSE

NO_

ENIL

M_BT

S_P_I

DD

MP_

BTS_

P_ID

DM

M_AT

AD_

P_ID

DM

P_AT

AD_

P_ID

DM

N_TE

SE

R_D

CL

CAM_DATA[4]CAM_DATA[3]CAM_DATA[2]


CAM_DATA[5]

CAM_PCLKCAM_HSYNCCAM_VSYNC

PU

EK

AW_

NAL

W

IB

SS_

CIM

P

AUDIO_I2C_SDA

AUDIO_I2C_SCL

nSDRAM_CS1

MOTOR_EN

MOTOR_PWM

WLAN_REG_ON

COMPASS_DRDY

AD

S_C2I_

SS

AP

MO

C_X

OR

P

DK_Volume_UPDK_Volume_DOWN

AD

S_C2I_L

EUF

FUEL_I2C_SCL

MIC_1P_PIN

nJTAG_RESOUT

TU

OSE

R_G

ATJ

n

Array TPUART TP

ARM9&ARM11 JTAG

%1

nip 5E o t esol

C

1% Close to MSM

0000 : Native, ARM9 on PJTAG, ARM11 on AJTAG

ARM9&ARM11 JTAG

MODE[3:0]

clse to MSM

1.0T

TCXO Circuit

GPS D FLIP-FLOP

Low = Detect

Changed 03/22

VPWR Delete

Clesed to TCXO

0001 : Native, ARM9 + ARM11 on PJTAG



7. CIRCUIT DIAGRAM

U400MT29C8G96MAZAPDJA-5 IT

01P

1P

4M

M3

5G

1G

5E

01B

1B

H8

7H

7J01R

9R

G10

2R

F9

1R

E10

01A

D9

9A

C10

2A

N10

M9

E7

L10

F8

K10

G6

J9

J8

H2

G9

G2

F10

K1

E9

B2

D10

E3

C9

G8

N9

F3

M10

J2

L9

K9

C7

J10

C8

D7

M2

D8

P9

D6

J1

E8

H9

D5

C1

F6

B9

F7

E6

M1

H4

P8

H3

H10

F5

H1

E4

D1

F4

B8

G4

G3

P6

J4

C5

H5

H6

N5

J5

B5

J6

G7

C6

K6

C3

K5

C4

K7

B4

L8

B7

K8

B3

L7

B6

L6

L5

N8

L4

M7

N7

K2

P5

J3

P4

F1

N4

F2

P3

K3

P2

D4

M8

E2

N6

D3

M6

E1

P7

D2

M5

C2

N3

L3

N2

L2

N1

L1

K4A0

A1

IO0

A2

IO1

A3

IO2

A4

IO3

A5

IO4

A6

IO5

A7

IO6

A8

IO7

A9

IO8

A10

IO9

A11

IO10

A12

IO11

BA0

IO12

BA1

IO13

IO14

DQ0

IO15

DQ1

DQ2

CE#

DQ3

RE#

DQ4

WE#2

DQ5

CLE

DQ6

ALE

DQ7

WP#

DQ8

R_B#

DQ9

DQ10

VCC1

DQ11

VCC2

DQ12

DQ13

VSS6

DQ14

VSS7

DQ15

DQ16

VDD6

DQ17

VDD1

DQ18

VDD2

DQ19

VDD3

DQ20

VDD4

DQ21

VDD5

DQ22

DQ23

VSS8

DQ24

VSS1

DQ25

VSS2

DQ26

VSS3

DQ27

VSS4

DQ28

VSS5

DQ29

DQ30

VDDQ0

DQ31

VDDQ1

VDDQ5

CS0#

VDDQ3

CS1#

VDDQ4

CK

VDDQ2

CKE0

VDDQ7

CKE1

VDDQ6

WE#1

VDDQ8

RAS#

VDDQ9

CAS#

DM0

VSSQ0

DM1

VSSQ1

DM2

VSSQ2

DM3

VSSQ3

VSSQ4

0U

ND

VSSQ5

1U

ND

VSSQ6

2U

ND

VSSQ7

3U

ND

VSSQ8

4U

ND

VSSQ9

5U

ND

6U

ND

0S

QD

2S

QD

CK#

4C

N

6C

N

3S

QD

UN

D

1S

QD

A13

1UF

R

2UF

R

KC

OL

0

R8

R7

0

0

R5

C1

10u

10u

C2

R1 0

0R2

V52.1_1C

MS

M_G

ER

V

10n

C459

10n

C458C457

10n

C456

10n

0.1u

C450

0.1u

C451

0.1u

C452C448

10n0.1u

C447

u0

10

44

C

35

4C

u0

1

144C

u1.0

444C

u2.2

n01244

C

534C

u1.0

C443

0.1u

C454

10n

C20

0.1u

C30

1n

u7.4314

C

C28

10n

C31

1n

U302

L5

E10

AE22

AD25

AE18

AE15

AE11

AE7

Y5

T5

H25

E25

E22

Y25

V25

T25

P25

M25

K25

AE12

AC10

AC5

Y8

AF26

AF25

AF3

AF2

AE26

AB11

Y20

W19

U17

U11

P23

N23

M11

L17

L12

K23

K9

J19

G23

E19

C2

B26

B3

B2

T2

R8

R5

P9

N8

K6

K5

J6

J5

F9

E6

C8

C3

U6

T6

T3

R9

P8

P5

N9

K8

J9

J8

H6

H5

E9

E5

D3

B8

AE13

AE5

AB14

AB10

AA22

Y19

Y6

V22

U14

T16

T15

T14

T13

T12

R17

R16

R15

R14

R13

R12

P22

P17

P16

P15

P14

P13

P12

P11

P6

N22

N16

N15

N14

N13

N12

M16

M15

M14

M13

M12

L15

L13

L6

K22

G22

F19

F15

F10

E14

B4

7G

A

6G

A

5G

A

4G

A

3G

A

72

GA

62

GA

52

GA

42

GA

32

GA

22

GA

12

GA

02

GA

2G

A

91

GA

81

GA

71

GA

61

GA

51

GA

41

GA

31

GA

21

GA

11

GA

01

GA

1G

A

72

FA

1F

A

72

EA

1E

A

72

DA

1D

A

72

CA

1C

A

72

BA

1B

A

72

AA

1A

A

72

A

62

A

52

A

42

A

32

A

22

A

12

A

02

A

91

A

81

A

71

A

61

A

51

A

41

A

31

A

21

A

11

A

01

A

9A

8A

7A

6A

5A

4A

3A

2A

1A

61

E

41

F

5A

A

22

H

11N

5N

81

E

31

E

5U

9T

72

Y

1Y

72

W

1W

72

V

1V

72U

1U

72

T

1T

72

R

1R

72

P

1P

72N

1N

72

M

1M

72

L

1L

72

K

1K

72J

1J

72

H

1H

72

G

1G

72

F

1F

72E

1E

72

D

1D

72

C

1C

72

B

1B

9GA

8GA

56

_C

N6

6_CN

76

_CN

86

_CN

96

_CN

07_

CN

17_

CN

27_

CN

37_

CN

47

_CN

57_

CN

67_

CN

77_

CN

87_

CN

97_

CN

08_

CN

18_

CN

28

_CN

38

_CN

48_

CN

58_

CN

68_

CN

78_

CN

88_

CN

98_

CN

09_

CN

19

_CN

29_

CN

39_

CN

49_

CN

59_

CN

69_

CN

79_

CN

89_

CN

99

_CN

001

_CN

101

_C

N2

01

_CN

301

_C

N401

_C

N

1DV

SR

2D

VSR

8P_

DDV

9P_

DD

V

01P

_DDV

GRP

_ES

UF

Q_DDV

1C_

SN

S_D

DV

2C_

SNS

_D

DV

6P2

_YHPB

SU_DDV

3P3

_Y

HP

BSU

_D

DV

1_

CN

2_

CN

3_

CN

4_

CN

5_

CN

6_

CN

7_

CN

8_

CN

9_

CN

01_

CN

11_

CN

21_

CN

31_

CN

41_

CN

51_

CN

61_

CN

71_

CN

81_

CN

91_

CN

02_

CN

12_

CN

22_

CN

32_

CN

42_

CN

52_

CN

62_

CN

72_

CN

82_

CN

92_

CN

03_

CN

13_

CN

23_

CN

33_

CN

43_

CN

53_

CN

63_

CN

73_

CN

83_

CN

93_

CN

04_

CN

14_

CN

24_

CN

34_

CN

44_

CN

54_

CN

64_

CN

74_

CN

84_

CN

94_

CN

05_

CN

15_

CN

25_

CN

35_

CN

45_

CN

55_

CN

65_

CN

75_

CN

85_

CN

95_

CN

06_

CN

16_

CN

26_

CN

36_

CN

46_

CN

GND1GND2GND3GND4GND5GND6GND7GND8GND9GND10GND11GND12GND13GND14GND15GND16GND17GND18GND19GND20GND21GND22GND23GND24GND25GND26GND27GND28GND29GND30GND31GND32GND33GND34GND35GND36GND37GND38GND39GND40GND41GND42GND43GND44GND45GND46GND47GND48GND49GND50

GND_A1GND_A2GND_A3GND_A4GND_A5GND_A6GND_A7GND_A8GND_A9GND_A10GND_A11GND_A12GND_A13GND_A14GND_A15GND_A16

VDD_A1VDD_A2VDD_A3VDD_A4VDD_A5VDD_A6VDD_A7VDD_A8VDD_A9VDD_A10VDD_A11VDD_A12VDD_A13

VDD_C1_1VDD_C1_2VDD_C1_3VDD_C1_4VDD_C1_5VDD_C1_6VDD_C1_7VDD_C1_8VDD_C1_9VDD_C1_10VDD_C1_11VDD_C1_12VDD_C1_13VDD_C1_14VDD_C1_15VDD_C1_16VDD_C1_17VDD_C1_18VDD_C1_19VDD_C1_20VDD_C1_21VDD_C1_22VDD_C1_23VDD_C1_24

VDD_C2_1VDD_C2_2VDD_C2_3

VDD_MDDI

VDD_P1_1VDD_P1_2VDD_P1_3VDD_P1_4VDD_P1_5VDD_P1_6

VDD_P2_1VDD_P2_2VDD_P2_3

VDD_P3_1VDD_P3_2VDD_P3_3VDD_P3_4VDD_P3_5VDD_P3_6

VDD_P4_1VDD_P4_2

VDD_P7_1VDD_P7_2

V3.3_B

SU_

GE

RV

V6.2_A

MS

M_G

ER

V

10n

C400

V9.2_2X

UA_

GE

RV

V8.1_E

MS

M_G

ER

V

VREG_MSMP_2.6V

VREG_MSME_1.8V

VREG_MSMC2_1.25V

VREG_MSMC1_1.25V

VREG_MSMA_2.6V

VREG_USB_3.3V

C455

10n

C409

10n

C445

0.1u

VREG_MSME_1.8V

C436

0.1u

VREG_AUX2_2.9V

C415

0.1u0.1u

C416

10n

C417C418

0.1u

0.1u

C19

0.1u

C446

0.1u

C4230.1u

C424

0.1u

C425

0.1u

C426

C428

10n22u

C434 C429

1n

C34

1n10u

C430

0.1u

C431

C404

0.1u

C433

10u

VREG_MSMA_2.6VVREG_MSMP_2.6V

VREG_MSMC1_1.25V VREG_MSME_1.8VVREG_MSMC2_1.25V

VREG_MSME_1.8V

TP408

VREG_MSME_1.8V

VREG_MSME_1.8V

834C

u2.2

TP407

n1734

C

TP406

TP405

TP404

TP403

TP402

C439

0.1u

n01724

C

R403

10K

0.1u

C414

TP401

TP5

C32

1n

V6.2_P

MS

M_G

ER

V

100K

R15

C21

0.1u

C15

10n 1n

C33

C449

0.1u

DNI

R12

10n

C422

C29

10n

PM

AR_

AP_

MS

G

MI

XT

_R

TR

MQ

XT

_R

TR

MI

XR

_R

TR

MQ

XR_

RT

R

MI

XRD

_RT

R

MQ

XR

D_

RT

R

IB

SS

_5

82

6R

TR

0R

_A

P

N_T

ESE

R_

TB

TU

O_

XOR

P

nSDRAM_CS0

nSDRAM_WE

nNAND_OE

EO_

DN

ANn

nNAND_WE

NAND_FLASH_READY

EBI2_DATA[7]

]6[

ATA

D_

2I

BE

EBI2_DATA[6]

]5

[A

TA

D_

2I

BE

EBI2_DATA[5]EBI2_DATA[4]EBI2_DATA[3]

]3[

AT

AD_

2I

BE

EBI2_DATA[2]EBI2_DATA[1]EBI2_DATA[0]

EBI2_DATA[15]

]51[

AT

AD

_2I

BE

EBI2_DATA[14]

]41[

AT

AD

_2I

BE

EBI2_DATA[13]EBI2_DATA[12]EBI2_DATA[11]EBI2_DATA[10]

]9

[A

TA

D_2

IB

E

EBI2_DATA[9]EBI2_DATA[8]

]8[

AT

AD_

2I

BE

AT

AD_

MI

SU

_M

SM

SDRAM_DQM3SDRAM_DQM2SDRAM_DQM1

0M

QD

_M

AR

DS

SDRAM_DQM0

3SQ

D_

MA

RDS

SDRAM_DQS3SDRAM_DQS2SDRAM_DQS1

0S

QD_

MAR

DS

SDRAM_DQS0

nRESETOUTTU

OTE

SER

n

0K

LCD

_M

ARD

S

SDRAM_DCLK0SDRAM_DCLK1

SDRAM_CKE

SDRAM_ADDR[12]

]21

[R

DDA

_M

ARD

S

SDRAM_ADDR[11]SDRAM_ADDR[10]

]0

1[R

DD

A_M

AR

DS

SDRAM_ADDR[9]SDRAM_ADDR[8]SDRAM_ADDR[7]

SDRAM_ADDR[5]SDRAM_ADDR[4]SDRAM_ADDR[3]SDRAM_ADDR[2]SDRAM_ADDR[1]

]1[R

DD

A_

MAR

DS

SDRAM_ADDR[0]

]6[

RDD

A_

MA

RD

S

SDRAM_ADDR[6]

SDRAM_DATA[16]

SDRAM_DATA[0]

SDRAM_BA0SDRAM_BA1

SDRAM_ADDR[13]

SDRAM_DATA[1]SDRAM_DATA[2]SDRAM_DATA[3]SDRAM_DATA[4]SDRAM_DATA[5]SDRAM_DATA[6]SDRAM_DATA[7]

]8[

ATA

D_

MA

RD

S

SDRAM_DATA[8]SDRAM_DATA[9]SDRAM_DATA[10]

]1

1[A

TA

D_M

AR

DS

SDRAM_DATA[11]

]2

1[AT

AD_

MA

RD

S

SDRAM_DATA[12]SDRAM_DATA[13]SDRAM_DATA[14]

]5

1[

AT

AD_M

ARD

S

SDRAM_DATA[15]

SDRAM_DATA[17]

]81

[AT

AD

_M

AR

DS

SDRAM_DATA[18]

]9

1[A

TA

D_M

AR

DS


]5

2[AT

AD_

MA

RD

S


]1

3[

AT

AD_

MA

RDS

SDRAM_DATA[31]

nSDRAM_RASnSDRAM_CAS

nNAND_UBnNAND_LB

P_VC

R

nNAND_FLASH_CS

V6.

2_A

MS

M_

GE

RV

ADS_

C2

I_

HCU

OT

MD_

HB

SU

PD_

HB

SU

SDRAM_CKE1

TNI_

CI

UM

AD

S_C

2I

_LB

_D

CL

OD

T_M

SM

ID

T_M

SM

SM

T_

MSM

KL

CS

YS

_HB

SU

OL

_KR

T

N_

TE

SER

_M

AC

DX

T_T

RA

U_T

B

ST

R_

TRA

U_

TB

LC

S_

C2

I_

CI

UM

KL

C_

CMM

DM

C_

CMM

LC

S_

C2

I_

MAC

PO

_E

NIL

M_

BTS

_P

_I

DDM

P_

BT

S_P

_I

DDM

M_AT

AD_

P_

IDD

M

P_

AT

AD_

P_

IDD

M

]2

[A

TA

D_M

AC

]6

[A

TA

D_M

AC

]7

[A

TA

D_

MAC

CN

YS

V_

MAC

V5

2.1

_1

CMS

M_

GE

RV

V52.

1_1CM

SM_G

ERV

V5

2.

1_1

CMS

M_

GER

V

V5

2.

1_1

CM

SM_

GE

RV

V5

2.1

_1

CMS

M_

GER

V

V5

2.

1_1

CM

SM

_GE

RV

V5

2.

1_1

CM

SM_

GE

RV

VSNS_MSMC2_1.25V

VSNS_MSMC1_1.25V

VSNS_MSME_1.8V

nSDRAM_CS1

ADS

_C2

I_

SS

AP

MOC

_X

OR

P

NW

OD_

em

ul

oV_

KD

NIP_

P1

_CI

M

MSM7227 Power Part

Cap for MSM7227 Power

Micron 8G+4G (EUSY0430901)



7. CIRCUIT DIAGRAM

C779

33p

157C

u01

u01257

C

VREG_FEM_2.7V

Q1

QST4

321

456

VCHG_VBUS10uC781

C7031u

207R

K003

1258R

K074

FB701600

U1005MAX17040G

9

7 4

8 1

6

5

3 2CELLVDD

SEO

EO

CTGSDA

GNDSCL DN

GP

SC3

4

3

2

1

C710

39p

307R

02

407R

02

R724 47KC783

10u

C711

39p

R600

10K

C712

39p

007X

531-CF

zHK867.232

1

C713

39p C715

0.1u

R723 0

CN700HSMU-5SB-24DR2

15

13

11

9

7

5

4

3

2

1

14

12

10

8

6

Q3SIA431DJ

S1S2

G

D1D2D3D4D5

R725 47KC717 1u

C716 1u

5C

u33

C707 47n

C8550

1u

CN701KQ03LP1-3R

3

2

1

D1

D2

VBAT

02 58R

051

9158R

051

807R

K7.4

47nC706

C8551

10n

VREG_MSMP_2.6V

10n

C725

K2.22258

R

K2.2325 8

R

K086

917R

470K

R717

K7.4

11R

9R

K7.4

VREG_MSMP_2.6V

107R

K051

D700

107DZ

u1.0087

C

577C

u33

VBAT

smho

K6.08

027R

VREG_MSMP_2.6V

VA700

777C

u1.0

C70422p

C70222pZD700

FL700NFM18PC104R1C3

1IN OUT

GND1 GND2

877C

p22

1u

C8549

4.7uC754

TS5USBA33402YZPRIC1

4B

D2

B2

A1 A2

B3

C2

A4

C1

A3 D1

E4

D3 D4

E3

E2 C3

E1 C4

1B

YLP

PU

SV

UART_TXVBUS

UART_RXDM

DP

USB_DMID

USB_DP

AUDIO_LR2_2K

AUDIO_R

MIC

DSS

_INT

SDACLDO

SCL

GNDTE

SI

2.2K

R705

C7240.1u

VCHG_VBUS

K2

707R

607R

K2

VREG_MSMP_2.6V

C7210.1u

+VPWR

C744

4.7u

C8552

1u

2.2u

C761


BU33TD2WNVXU703

5

3 24 1

VOUTVINGNDSTBY

DN

GP

47K

R709

C730

2.2u

2.2u

C771

VREG_MSMP_2.6V

4.7u

C768

4.7uELCP0008004

L703

VREG_TOUCH_3.0V

VREG_USB_3.3V

+VPWR

22pC774

22pC776

200K

R722

TP702

VREG_MSMP_2.6V

TP701TP700

R710

4.7

ELCP0008012

4.7uL701

VREG_MSME_1.8V

947C

u22

VREG_LCD_1.8V

L704ELCP0008004

4.7u

C760 2.2u

547C

n1

+VPWR

VREG_MSME_1.8V

C765

2.2u

VREG_RFRX1_2.7VPM7540U704

9J8J7J6J5J9H8H7H6 H5 H9G8G7G6G5G9F8F7F6F5F9E8E7E6E5E

H1E10F1F10E1C12N2

B1M12B2K7

A5N13A4M13B5

B4G10A7D9A6H12B7

B6C13A13D10A12K10

H10G12J10G1M1K4D13J4E12H4N11M2A3L2A10H2A8H13K2G13J2A11G4K13F4E13D5B13B3A9M5N12N3J13N1A2M3

K6M4K5N4K9M9K8N10M11M6L12N6A1M8D4N8B12J1D8K1N5

M7

2G21D7D8B01M6 D9 B21J31F21 F21K7N9N01B

31L11B2F4E2C1C1D1 L2 D2E

GH

CV

N_LTC_

GH

C

SU

BV_

BS

U

N _L TC_

BS

U

P_S

NSI

M_S

NSI

N_TEF _T

AB

TA

BV

NIO

CV

PU

KC

AB_

V

AN

A _D

DV

E_1C_

DD

V

AP _2

C _D

DV

2P

G_D

DV

6P

G _D

DV

2E

MS

M _D

DV

PM

SM_

DD

V

1FR_

DD

V

2FR_

DD

V

M IU

R_D

DV

RK

PS_L_

DD

V

RK

PS_

R_D

DV

OX

C T_D

DV

NAL

W_D

DV

MPP_1

MPP_2 VSW_5V

MPP_3 VREG_5V

MPP_4 VSW_MSMC1

MPP_5 VREG_MSMC1

MPP_6 VSW_MSMC2

MPP_7 VREG_MSMC2

MPP_8 VSW_MSME

MPP_9 VREG_MSME

MPP_10 VSW_PA

MPP_11 VREG_PA

MPP_12

MPP_13 VREG_GP1

MPP_14 VREG_GP2

MPP_15 VREG_GP3

MPP_16 VREG_GP4

MPP_17 VREF_GP5

MPP_18 VREG_GP6

MPP_19 VREG_MMC

MPP_20 VREG_MSMA

MPP_21 VREG_MSME2

MPP_22 VREG_MSMP

VREG_RFRX1

USB_ID VREG_RFRX2

USB_D_P VREG_RFTX

USB_D_M VREG_RUIM1

USB_OE_N VREG_SYNT

USB_DAT VREG_TCXO

USB_SE0 VREG_USB

VREG_WLAN

SBST MIC_BIAS

SBCK

SBDT_SSBI REF_ISET

MSM_INT_N REG_GND

REF_BYP

SPKR_IN_L_M

SPKR_IN_L_P TCXO_IN

SPKR_OUT_L_M TCXO_EN

SPKR_OUT_L_P TCXO_OUT

SPKR_IN_R_P

SPKR_IN_R_M XTAL_IN

SPKR_OUT_R_P XTAL_OUT

SPKR_OUT_R_M

SLEEP_CLK

VIDEO_IN AMUX_OUT

VIDEO_OUT

VIB_DRV_N KPD_PWR_N

KPD_DRV_N PON_RESET_N

LCD_DRV_N PS_HOLD

FLSH_DRV_N

1D

NG

2D

NG

3D

NG

4D

NG

5D

NG

6D

NG

7D

NG

8D

NG

9D

NG

01D

NG

11D

NG

21D

NG

31D

NG

41D

NG

51D

NG

61D

NG

71D

NG

81D

NG

91D

NG

02D

NG

12D

NG

22D

NG

32D

NG

42D

NG

52D

NG

Q2

QST4

321

456

R715 121K

K01117

R

VREG_TCXO_2.85V

R716 51

847C

n1

C762

2.2u

1K

R712

C770

2.2u

VBAT

VREG_MSMC1_1.25V

VREG_MMC_3.0V

VCHG_VBUS

0.1uC773

n1647

C

VREG_RUIM_3.0V

u2.2047

C

C763

2.2u

VREG_MSMA_2.6V

2.2u

C766

VREG_MSMC2_1.25V

VRF_SMPS_2.1V

n1747

C

C772

1u

VREG_MSMP_2.6V

SDB310QD701

2.2u

C769

KDS114E-RTK_HA

D702

ELCP0008012

4.7uL702

10uC743

057C

u7.4

C739 0.1u

0.1uC736

C735 0.1u

0.1uC734

C733 0.1u

0.1uC732

C731 0.1u

+VPWR

1nC753

0.1uC729C728

33p

+VPWR_AUDIOC742 1n

4.7u

C767

VREG_AUX2_2.9V

VREG_LCD_2.8V

C759 2.2u

0.1uC727

0.1uC726

C705

1u

VCHG_VBUS

U700

MAX14528

96

53

4

82

71IN1 OUT1

IN2 OUT2

IC1

OVLO IC2DN

G

DN

GP

2.2u

L700

1nC741

317R

1.0

VBAT

+VPWR

R16

51

10nC757

0.1u

C701C700

2.2u

C714

0.1u

C9002.2u

470nC708

C709 470nU701

WM9093ECS-R

3B

A4

C3

C22

B

D1

D3

4D

C1

A1D21

B

D5

A2

A5

A3B5

4B

C5

4C

DN

G

OUT+

DD

VP

HCPVDDCPVSS

CN

HPL

OUT-

SAI

BIN2- HPR

IN1+

DD

VS

IN3-

IN2+

AD

SIN1-

IN3+

CP

LC

S

C722

2.2u

+VPWR_AUDIO

2.2uC719

2.2u

C723

2.2uC720

VREG_MSME_1.8V

VBAT_TEMP

VBAT_TEMP

PMIC_TCXO

TCXO_PM_19.2MHZ

JTAG_PS_HOLD

TCXO_EN

SLEEP_CLK

HPH_LHPH_R

RCV_N

PM_INT_N

PS_HOLD

MSM_USIM_CLK

MSM_USIM_DATA

MSM_USIM_RST

GSM_PA_DAC_REF

RCV_P

nPON_RST

REMOTE_PWR_ON

USBH_DMUSBH_DP

AMUX_OUT

SLIDE_KPD_DRV_N

NIO

CV

SIM_IO

SIM_CLK

KPD_PWR_N

SIM_RST

SPK_RCV-SPK_RCV+

MUIC_INT

MUIC_I2C_SCLMUIC_I2C_SDA

UART2_TXDUART2_RXD

LINE_OPLINE_ON

USB_ID

USB_ID

MAX_DM

MAX_DM

MAX_DP

MAX_DP

PCB_REVISION

PCB_REVISION

+VPWR

RW

PV+

VSNS_RF_SMPS

VSNS_MSMC2_1.25V

VSNS_MSMC1_1.25V

VSNS_MSME_1.8V

BATT_FET_N

N_TEF_TT

AB

CHG_CTL_N

N_LTC_

GH

C

ISNS_P

P_S

NSI

VBAT_SENSE

VBAT_SENSE

PMIC_SSBI

USB_3.3V_EN

USB_3.3V_EN

EAR_REAR_L


QT_KPD_DRV_N

FUEL_I2C_SDAFUEL_I2C_SCL

2mm

Global 5pin TA

Global 5pin USB Cable

PCB Revision

Battery Connector

2mm

Jap. Charging Gender

Jap. Data Gender

430K

1.04V

R1

300K

0.62V

1.73V

100K

0.81V

680KRev.1.2

D&I

Rev.1.0

0.16V

HKAIN0 : PCB Revision Check ADC

150K

150K

Rev.1.1

A&F

B&G

C&H

1.93V

REV

150K

150K

47K

68K

10K

2.13V

R2

150K

TEST&E

150K

ADC

150K

150K

150K

1.30V

u-USB Connector MUIC

VBUS 2mm

2010.03.20

2010.01.28 added

2009.11.18

0.3mm 0.3mm

09.11.12

Turbo Mode

180k

Am08 eldnaH naC ecarT

180k

1608

0603

0603

0603

3060

0603

mm5.0 9N ,7 N close to each other

FUEL GUAGE

NDK --> EPSON

M_SNSI

330k

Open

Short

Pulled By PC

Open

Pulled By PC

No Charging (TBD)

300mA Normal

Call : 500mA Alternative Charging (TBD)Idle : 600mA Normal

DCM shop usage

ID Resistance USB D+/D-

0603

0603

1608

Place close to PM7540 pins

Route together

USB 3.3V LDO

0603

0.6mm

0603

These CAPs close to inductors

0.6mm

0.6mm

Place in PM7540 room at shield edge

PM7540

Local Ground Plan

0.5mm

rehtegot etuoR

1%

Place crystal and load caps close to PM7540

ISNS_M 1%

2mm

Battery Charging Circuit

10V1608

2mm

AUDIO SUBSYSTEM



7. CIRCUIT DIAGRAM

U800LBEH19UNBC-338

039282726252423222120291817161

31

3215

14

33

3413

3512

3611

3710

389

398

407

6

415

4

42

433

442

45

1

6474849405152535451

DN

G

2D

NG

3D

NG

4D

NG

B_E

KA

W_TS

OH_L

W

DXT_T

RA

U_TB

N_ST

C_TR

AU_T

B

N_ST

R_TR

AU_T

B

DX

R_TR

AU_T

B

ANT

BT_PCM_CLK

GND5 BT_PCM_OUT

VDD_WL_PA BT_PCM_SYNC

BT_PCM_IN

SDIO_CMD

SDIO_CLK VDD_BT_PA

SDIO_D3

SDIO_D2 S_CLK_IN

SDIO_D1 GND6

SDIO_D0 FM_ANT

WL_RST_N BT_GPIO_0

WL_WAKE_B BT_GPIO_1

REG_ON BT_GPIO_3

VBAT_IN BT_GPIO_4

BT_GPIO_7

SR_VLX1

SR_VLX1BB F_CLK_IN

F_CLK_OUT

BB2

XLV_

RS

BBT

UO

V_R

S

OID

DV

UP_L

ATX

DS_

O ID

DV

TU

O_2P1_

GID

TU

O_2P1_

GLN

A

ODL

V2P1_

NIV

TU

O_2O

DLNL

AD

S_TB

LC

S_TB

1OI

DU

A

2OI

DU

A

N_TS

R_TB

7D

NG

C810

0.1u

VREG_MSMP_2.6V

K2.2

308R

K2.2

408R

C825

2.2u

L804

4.7n

C809

4.7u

KR3DMU801

61

76

5

4

8

3

9

2

10

1

11

12

13

41512

DE

VR

ES

ER

DD

V

GND3

GND2

INT1

VDD_IO

RESERVED1

NC1

INT2

NC2

SC

SCL_SPC

GND1

OD

S_ID

S_A

DS

0A

S_O

DS

4D

NG

R801

11K

L80554.7u

C801

22p

7158R

0

C807

1.2p

C826 100p

22p

C800ANT800

SNGF0048003ITBTPTR3015

2

3 1

4G2

FEEDG1

NC

008R

K7.4

L801

100n

26MHz

X800

TG-5010LH-87N

4 2

3 1NCOUT

GNDVCC

J800

ENSY0024301KP09N-6S-2_54SF

98

107

63

52

41VCC GND1

RST VPP

CLK IO

GND2 GND5

GND3 GND4

VDD_TCXO

VDD_TCXO

+VPWR

10uC822

C8547

1u

3.3uL803

VREG_MSMP_2.6V

0.1u

C817

600

FB8501

2.2u

C8535

0.1u

C8543

4.7u

C816

0.1u

C823

2.2u

C8538

VREG_MSMP_2.6V

4.7uC813

4.7u

C8541

10uC8534

+VPWR

0.1uC814

8.2p

C8544

TP4

C805

12p

TP10

K001

508R

C824

1u

BU28TD2WNVX U802

5

3 24 1

VOUTVINGNDSTBY

DN

GP

1u

C827

22p

C803C802

0.1u

C804

10p

VREG_RUIM_3.0V

VREG_RUIM_3.0V

D800

43

52

61

TP3TP2

TP6 TP7

TP8

TP9

BT_RESET_N

PUEKAW_TSOH_NALW

WLAN_RESET_N

MOTION_INT

SLEEP_CLK

BT_PCM_CLK

BT_PCM_SYNCBT_PCM_DOUT

WLAN_CLKWLAN_CMD

BT_WAKEUP

WLAN_SDIO[0]


BT_PCM_DIN

BT_HOST_WAKEUP

WLAN_SDIO[3]

MOTION_I2C_SDA

MOTION_I2C_SCL

SIM_IO

SIM_IOSIM_CLK

SIM_CLKSIM_RST

SIM_RST

DXT_TRAU_TB

DXR_TRAU_TB

STC_TRAU_TBSTR_TRAU_TB

WLAN_WAKEUP

CLK_REQ

CLK_REQ

CLK_IN

CLK_IN

RF_IN_OUT

RF_IN_OUT

WLAN_REG_ON

BT_ANTRF

Wi-Fi&BT&FM MODULE

TCXO LDO

Acceleration SENSOR

USIM Socket

26MHz TCXO

0603

3060

3060 3060



7. CIRCUIT DIAGRAM

+VPWR

VREG_MMC_3.0V

VREG_LCD_2.8V

VREG_LCD_1.8V

VREG_TOUCH_3.0V

VREG_MSMP_2.6V


CN90024-5804-080-000-829+

4140

4239

4338

4437

4536

4635

4734

4833

4932

5031

5130

5229

5328

5427

5526

5625

5724

5823

5922

6021

6120

6219

6318

6417

6516

6615

6714

6813

6912

7011

7110

729

738

747

756

765

774

783

792

801

CAM_MCLK

TOUCH_INT


PROX_OUT

TOUCH_I2C_SCL

TOUCH_I2C_SDA

MIC_BIAS

SLIDE_KPD_DRV_N

VCOIN

KPD_PWR_N

SPK_RCV-

SPK_RCV+

LCD_BL_I2C_SCL

LCD_BL_I2C_SDA

LCD_BL_EN

CAM_DATA[0]

CAM_DATA[1]

MIC_1N CAM_RESET_N

HS_MIC

CAM_PWDN

MICROSD_DET_N

HOOK_ADC

MSM_LCD_VSYNC_O

LCD_MAKERID_LOW

QTKEY_RESET

QTKEY_INT

MMC_CLK

MMC_CMD

MMC_DATA[3]

MMC_DATA[2]

MMC_DATA[1]

MMC_DATA[0]

MIC_1P

HS_MIC_BIAS_EN

CAM_I2C_SCL

CAM_I2C_SDA

SLIDE_DETECT

QTKEY_SDA

QTKEY_SCL

EAR_SENSE

MDDI_P_STB_M

MDDI_P_STB_P

MDDI_P_DATA_M

MDDI_P_DATA_P

LCD_RESET_N

CAM_DATA[4]

CAM_DATA[3]

CAM_DATA[2]

CAM_DATA[6]

CAM_DATA[7]

CAM_DATA[5]

CAM_PCLK

CAM_HSYNC

CAM_VSYNC

EAR_R

EAR_L

MOTOR_EN

MOTOR_PWM

COMPASS_DRDY


DK_Volume_UP

DK_Volume_DOWN

QT_KPD_DRV_N

Audio GND - Routing Carefully

Main to Qwerty Connector



7. CIRCUIT DIAGRAM

CN214-5804-080-000-829+

4140

4239

4338

4437

4536

4635

4734

4833

4932

5031

5130

5229

5328

5427

5526

5625

5724

5823

5922

6021

6120

6219

6318

6417

6516

6615

6714

6813

6912

7011

7110

729

738

747

756

765

774

783

792

801

VREG_LCD_2.8V

VREG_LCD_1.8V

+VPWR

VREG_MMC_3.0V

VREG_TOUCH_3.0V

VREG_MSMP_2.6V


CN114-5804-080-000-829+

4140

4239

4338

4437

4536

4635

4734

4833

4932

5031

5130

5229

5328

5427

5526

5625

5724

5823

5922

6021

6120

6219

6318

6417

6516

6615

6714

6813

6912

7011

7110

729

738

747

756

765

774

783

792

801


VREG_MSMP_2.6V

VREG_TOUCH_3.0V

VREG_LCD_1.8V

VREG_LCD_2.8V

VREG_MMC_3.0V

+VPWR

LCD_BL_I2C_SCLLCD_BL_I2C_SCL

LCD_BL_I2C_SDALCD_BL_I2C_SDA

LCD_BL_ENLCD_BL_EN



SPK_RCV+SPK_RCV+

SPK_RCV-SPK_RCV-

MIC_1NMIC_1N CAM_RESET_NCAM_RESET_N

HS_MICHS_MIC

CAM_PWDNCAM_PWDN

MICROSD_DET_NMICROSD_DET_N

HOOK_ADCHOOK_ADC

MSM_LCD_VSYNC_OMSM_LCD_VSYNC_O

LCD_MAKERID_LOWLCD_MAKERID_LOW

QTKEY_RESETQTKEY_RESET

EAR_REAR_R

EAR_LEAR_L

KPD_PWR_NKPD_PWR_N

QTKEY_INTQTKEY_INT

PROX_OUTPROX_OUT

MMC_CLKMMC_CLK

MMC_CMDMMC_CMD





MIC_1PMIC_1P

HS_MIC_BIAS_ENHS_MIC_BIAS_EN

TOUCH_INTTOUCH_INT

CAM_I2C_SCLCAM_I2C_SCL

CAM_I2C_SDACAM_I2C_SDA

TOUCH_I2C_SCLTOUCH_I2C_SCL

TOUCH_I2C_SDATOUCH_I2C_SDA

SLIDE_DETECTSLIDE_DETECT

QTKEY_SDAQTKEY_SDA

QTKEY_SCLQTKEY_SCL

EAR_SENSEEAR_SENSE

MIC_BIASMIC_BIAS

MDDI_P_STB_MMDDI_P_STB_M

MDDI_P_STB_PMDDI_P_STB_P

MDDI_P_DATA_MMDDI_P_DATA_M

MDDI_P_DATA_PMDDI_P_DATA_P

LCD_RESET_NLCD_RESET_N







CAM_MCLKCAM_MCLK

CAM_PCLKCAM_PCLK

CAM_HSYNCCAM_HSYNC

CAM_VSYNCCAM_VSYNC

QT_KPD_DRV_NQT_KPD_DRV_N

DK_Volume_DOWNDK_Volume_DOWN

DK_Volume_UPDK_Volume_UP

PROX_COMPASS_I2C_SDAPROX_COMPASS_I2C_SDA

COMPASS_DRDYCOMPASS_DRDY

MOTOR_PWMMOTOR_PWM

MOTOR_ENMOTOR_EN

VCOINVCOIN

SLIDE_KPD_DRV_NSLIDE_KPD_DRV_N

PROX_COMPASS_I2C_SCLPROX_COMPASS_I2C_SCL

AUDIO_GNDAUDIO_GND

BtoB Connector

Main Connector Sub Connector

Main To Sub



7. CIRCUIT DIAGRAM

10uC119

VREG_LCD_1.8V VREG_MSMP_2.6V

NLSV1T244MUTBGU102

43

52

61VCCA VCCB

A B

GND OE_

VREG_CAM_AVDD_2.7V

R110 12

GB042-34S-H10-E3000CN101

1716151413121110

98765

314323332341

30

29

28

27

26

25

24

23

22

21

20

19

18

VREG_CAM_DVDD_1.2V

120FB102

C1170.1u

VREG_CAM_AF_2.8V

VA1

FL102 7.5pF

01 5

6 4

7 3

8 2

9 1INOUT_A1INOUT_B1

INOUT_A2INOUT_B2

INOUT_A3INOUT_B3

INOUT_A4INOUT_B4

1G

2G

FL101 7.5pF

01 5

6 4

7 3

8 2

9 1INOUT_A1INOUT_B1

INOUT_A2INOUT_B2

INOUT_A3INOUT_B3

INOUT_A4INOUT_B4

1G

2G

VREG_CAM_IOVDD_1.8V

C3

DNI

0.1uC114

C1130.1u

FB101120

0.1uC112

VA101

C1111u

AAT2870

U101

D2

1E

A4

C1

B3

3F5C

3A

A2

C2

B2

D1

B1

A1

D3

F1

E2

F2

E3

E4

F4

E5

F5

C3

D5A5

4C

4D

4B

5B

+2C

+1C

-1C

-2C

IN NEG

SDA

BL1

BL2

BL3

BL4

BL5

BL6

BL7

BL8

SCL

LDOA

LDOB

BC_M

LDOC

FLTR

LDOD

1D

NG

A

1D

NG

P

2D

NG

P

SBIAS

AMB_IN

IN_LDO

2DNGA

EN

C11033u

2.2uC109

+VPWR

FL1 7.5pF

015

64

73

82

91INOUT_A1 INOUT_B1

INOUT_A2 INOUT_B2

INOUT_A3 INOUT_B3

INOUT_A4 INOUT_B4

1G

2G

111R

K2 .2

VREG_MSMP_2.6V

601R

K001 VREG_CAM_AF_2.8V

2.2uC106

2.2uC105C104

2.2uC1032.2u

VREG_CAM_AVDD_2.7V

VREG_CAM_DVDD_1.2V

VREG_CAM_IOVDD_1.8V

VREG_CAM_IOVDD_1.8V

U103

EUSY0342405NLSX4373MUTAG

54

63

72

81VL VCC

IO_VL1 IO_VCC1

IO_VL2 IO_VCC2

GND EN

211R

K2.2

33p

C120

C107

1u 1u

C108

501R

K7.4

VREG_MSMP_2.6V

401R

K7.4

201R

K2.2

K2.2101

R

CAM_PWDN

CAM_RESET_N

FLT_CAM_DATA[7]

FLT_CAM_DATA[7]

FLT_CAM_DATA[6]

FLT_CAM_DATA[6]

FLT_CAM_DATA[5]

FLT_CAM_DATA[5]

FLT_CAM_DATA[4]


FLT_CAM_DATA[3]

FLT_CAM_DATA[2]

FLT_CAM_DATA[2]

FLT_CAM_DATA[1]

FLT_CAM_DATA[1]

FLT_CAM_DATA[0]

FLT_CAM_DATA[0]CAM_DATA[0]CAM_DATA[1]

LCD_BL_I2C_SCLLCD_BL_I2C_SDALCD_VSYNC_O MSM_LCD_VSYNC_O

WLED7WLED6


LCD_BL_EN

CAM_DATA[4]



CAM_DATA[5]

CAM_MCLK

CAM_PCLK

CAM_HSYNC

CAM_VSYNC

FLT_CAM_VSYNC

FLT_CAM_VSYNC

FLT_CAM_HSYNC

FLT_CAM_HSYNC

CAM_I2C_SDA

CAM_I2C_SCL

FLT_CAM_I2C_SDA

FLT_CAM_I2C_SDA

FLT_CAM_I2C_SCL

FLT_CAM_I2C_SCL

LCD BACKLIGHT CHARGE PUMPLCD Vsync

CAMERA EMI FILTER

3M CAMERA LGIT_1/4'' SVCY0024801(C3AA-Y314A)



7. CIRCUIT DIAGRAM

C25001u

11R

p001

C402

DNI

CN40224-5804-080-000-829+

4140

4239

4338

4437

4536

4635

4734

4833

4932

5031

5130

5229

5328

5427

5526

5625

5724

5823

5922

6021

6120

6219

6318

6417

6516

6615

6714

6813

6912

7011

7110

729

738

747

756

765

774

783

792

801


VREG_MSMP_2.6V

VREG_TOUCH_3.0V

VREG_MMC_3.0V

VREG_TOUCH_3.0V

VREG_LCD_2.8VVREG_LCD_1.8V

VREG_LCD_1.8V

VREG_LCD_2.8V

CN5

HJ-BCT-04Y

1

VREG_MSMP_2.6V

CN4

HJ-BCT-04Y

1

SW401

G1

ANTG2


K7.4

304R

K7.4

204R

+VPWR

C403

27n

CN401GB042-50S-H10-E3000

2625

2724

2823

2922

3021

3120

3219

3318

3417

3516

3615

3714

3813

3912

4011

4110

429

438

447

456

465

474

483

492

501

104R

K01

+VPWR1K

R8

CAM_PWDN

CAM_RESET_N

CAM_DATA[0]

CAM_DATA[1]

LCD_BL_I2C_SCL

LCD_BL_I2C_SDA

LCD_VSYNC_O

MSM_LCD_VSYNC_O

WLED7WLED6


LCD_BL_EN

CAM_DATA[4]

CAM_DATA[3]

CAM_DATA[2]

CAM_DATA[6]

CAM_DATA[7]

CAM_DATA[5]

CAM_MCLK

CAM_PCLK

CAM_HSYNC

CAM_VSYNC

VCOIN

VCOIN

MIC_1P





DK_Volume_DOWN

QTKEY_SCL

KEY_ROW[7]

QTKEY_SDA

QT_KPD_DRV_N

MIC_1N

HOOK_ADC

LCD_MAKERID_LOW

LCD_MAKERID_LOW

PROX_OUT

PROX_OUT

TOUCH_INT

TOUCH_INT

TOUCH_I2C_SCL

TOUCH_I2C_SCL

TOUCH_I2C_SDA

TOUCH_I2C_SDA

SPK_RCV-

SPK_RCV-

SPK_RCV+

SPK_RCV+

MDDI_P_STB_M

MDDI_P_STB_M

MDDI_P_STB_P

MDDI_P_STB_P

MDDI_P_DATA_M

MDDI_P_DATA_M

MDDI_P_DATA_P

MDDI_P_DATA_P

LCD_RESET_N

LCD_RESET_N

MMC_CLK

MMC_CMD

MMC_DATA[3]

MMC_DATA[2]

MMC_DATA[1]

MMC_DATA[0]QTKEY_RESET

EAR_R

EAR_L

MICROSD_DET_N

QTKEY_INT

HS_MIC_BIAS_EN

HS_MIC

SLIDE_DETECT

EAR_SENSE

MIC_BIAS

KEY_COL[7]KEY_COL[6]

MOTOR_EN

MOTOR_PWM

COMPASS_DRDY

SLIDE_KPD_DRV_N

SLIDE_KPD_DRV_N

DK_Volume_UP

KPD_PWR_N

KPD_PWR_N

AUDIO_GND

CAM_I2C_SDA

CAM_I2C_SCL

Sub to LCD FPCB Connector

Main Antenna

Main to Sub Connector

PROX power : Route 0.2mmPROX and COMPASS common Power/I2C



7. CIRCUIT DIAGRAM

LD305

CL-435F-WQT-SD-TS

4

3

2

1

LD3044

3

2

1

L3

100n

LD3034

3

2

1

+VPWR

LD3014

3

2

1

533R

0

223AV

433R

K2.2

VREG_MSMP_2.6V

C3030.1u

333R

K2.2

0.1uC302

470R332

VA321

023AV

913AV

813AV

713AV

470R331

PP2106M3

U301

41312 11 10198

157

166

175

184

193

202

211

2232425262728292D

NG

P

2D

NG

BTE

SE

R

IX O

X

LE

S_K L

C

DD

V

01P

TEST P40

SEL_28P P41

P57 P42

P56 P43

P55 P44

P17 P45

P15 P46

1D

NG

45P

35P

25P

15P

05P

74P

613AV

513AV

C301

1u

33R330

413AV

R329 33

33R328

R327 33

313AV

213AV

113AV

013AV

903AV

803AV

KB353

703AV

470R324

470R323

470R322

R321 470

470R320

470R319

470R318

R317 470

470R316

R315 470

470R314

R313 470

R312 470

CN301

3

2

1K021

113R

KB351 KB350 KB356 KB355 KB349

KB352

503AV

KB348

R309 100ohmsR308 100ohms

203AV

323AV KB347

KB308

KB345KB344 KB357 KB354 KB343 KB342KB341 KB317

KB339KB338 KB337 KB336 KB335 KB334KB333

KB324

KB331KB330 KB329 KB328 KB327 KB326KB325

KB332

KB323 KB322 KB321 KB320 KB319KB318

KB340

KB316

KB315

KB314 KB313 KB312 KB311 KB310KB309

KB346

KB307KB306 KB305 KB304 KB303 KB302KB301

470R302

100nL5

100n

L4

2L

n001

DK_Volume_DOWN

KEY_COL[2]

QTKEY_SCL

KEY_COL[3]

KEY_ROW[7]

QTKEY_SDA

QT_KPD_DRV_N

QTKEY_RESET

QTKEY_INT


KEY_ROW[5]

KEY_COL[7]

KEY_ROW[6]

KEY_ROW[1]

KEY_ROW[1]

KEY_COL[4]

KEY_COL[5]


DK_Volume_UP

SPACE2

Key Coder ICQwerty 54key / 4pie DR

%1

KEY LED LIGHT

VOLUME SIDEKEY

ENTER2

Changed 03/24From 4P to 3P

Citizen for Japan

1 2 3 4 5 6 7

BACK8 9 0 DEL ENTER1SEARCH

Q W E R T Y U

I O P Fn A SLANG

D F G H J K L

MENU

DOT

Z X C V SPACE1

B N MMANNER UP DOWN

HIPEN

END

COMA

SHIFT1

SHIFT2

HOME

HOMESENDLEFT RIGHT



7. CIRCUIT DIAGRAM

312R

IN

D

MIC1

6

5

4

3

2

1OUT

G1

G2

G3

PWR

G4

10 2R

IN

D

ZD206 ZD201 ZD202

D207D208

ZD205

C216

100p

412R

IN

D

U202

32

41VDD OUT

VSS NC

FB202 1800

FB203 1800

C206

4.7u

CN1

168

7

6

5

4

3

2

1 15

G5 G3 G1 CD

C1

C2

C3

C4

C5

C6

C7

C8

G6 G4 G2 COM

G7

512C

p51

41 2C

u 0 1

3 12C

p74

R216

100K

1800FB201

0.1u

C21247p

C21033p

C208

2.2u

C207

912R

K74

212R

smho

K001

0.1u

C205

K74

112R

602D

43

52

61

VREG_MSMP_2.6V

R210 2.2

VREG_MMC_3.0V

502D

43

52

61

K74

9 02R

802R

K 74

K74

702R

K7 4

6 02R

47p

C204

402D

FB1 1800

100nC203

VREG_MSMP_2.6V

C2020.1UF

VREG_MSMP_2.6V

K2.2

302R

33pC201

202D

102D

202R

K001

1800

FB204

U201

5

3 24 1

VOUTVINGNDSTBY

DN

GP

001Q

D

G

S

022R

M1

VREG_MSMP_2.6V

J201

2

36

5

4

1M5_MIC

M4_L

M3_DETECT

M4D-DETECT

M1_R

M6_GND

MIC_1PMIC_1N

HOOK_ADCMMC_CLK

MMC_CMDMMC_DATA[3]MMC_DATA[2]


EAR_R

EAR_L

MICROSD_DET_N

HS_MIC_BIAS_EN

HS_MIC

SLIDE_DETECT

EAR_SENSE

MIC_BIAS

AUDIO_GND

MICROPHONE SLIDE DETECT

3.5 EAR_JACK

MATING

EAR_SENSE

UNMATING

STATE

Open

Detect

Close (Detect =COM)

S/W

LOW (Detect)

HIGH (Normal)

Micro SD SocketLOW(DEFAULT)

HIGH

Changed 03/24

Active : Low

5/10 Added



7. CIRCUIT DIAGRAM

CN601

2

1

L511 100n

L512 100n

470n

C2

523AV

423AV

C4

1u

6R

K3.3

1C

n01

U1AMI304

12

11

10

9

5

4

6

37

28

1D

DV

D

GE

RV

AD

NG

SD

NG

DD

VA

ADDR

SCL

NC1

TNI

VPP

DRDY

SDA

K3.3

7R

TP1


0R2

R4 0

Q601

C

B

E GND

IN

OUT

R619

100K

TPA6202A1ZQVRU601

B2C1

A1B1

B3C2

A3C3IN- VDD

IN+ VO+

_SHUTDOWN VO-

BYPASS GND

VREG_MOTOR_3.3VVREG_MOTOR_3.3V

K1

716R

100K

R622

51K

R620

51K

R621

C638

0.1u

10nC640

816R

K1

K7.4

326R

C639

1u

C471

1u

R430

100K

+VPWR

VREG_MOTOR_3.3V

U405BU33TD2WNVX

5

3 24 1

VOUTVINGNDSTBY

DN

GP



MOTOR_EN

MOTOR_PWM

COMPASS_DRDY

CONNECTOR Type

Digital Compass

%1%1 1%

Q-coin MOTOR

1%

1%

1%

2010.03.10 addedMotor 3.3V LDO

0603



7. CIRCUIT DIAGRAM

KB101


4

3

2

1

001A

V

101A

V

501A

V

301A

V

201A

V


4

3

2

1

KB102

KB100

VA104

+VPWR

R103

33


CN100GB042-10P-H10-E3000

65

74

83

92

101

311HR-VG1BAT100

p93501

C

401C

p9 3CN101

2

1

101D

001D


VREG_LCD_1.8VVREG_LCD_2.8V


R100

4.7

u1 101C

TP100

+VPWR

0.1u

C103C102

4.7u

R101

10

C100 4.7uU100 GP2AP002S00F

54

63

72

81LEDA SCL

LEDC SDA

VCC VIO

VOUT GND

VREG_TOUCH_3.0V

GB042-50P-H10-E3000CN102

26

27

28

29

30

31

32

33

34

35

36

37

38

39

40

41

42

43

44

45

46

47

48

49

501

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

2.2uC107

2.2uC106

D102

43

52

61

+VPWR

VREG_LCD_1.8V VREG_LCD_2.8V

04-6293-025-001-829CN103

25

24

23

22

21

20

19

18

17

16

15

14

13

12

11

10

9

8

7

6

5

4

3

2

1

ICMEF214P101MFL100

019

84736251

P1 P5P2 P6P3 P7P4 P8

1G

2G

R104

33

CL-435F-WQT-SD-TSLD101

4

3

2

1

601AV

C110

DNI

R102

33

C108

2.2u

701AV

C109

1u

801AV

SPK_RCV-

SPK_RCV-

SPK_RCV+

SPK_RCV+



PROX_OUT

PROX_OUT

LCD_MAKERID_LOW

LCD_MAKERID_LOW

VREG_TOUCH_3.0V



TOUCH_INT

TOUCH_INT

TOUCH_I2C_SCL

TOUCH_I2C_SCL

TOUCH_I2C_SDA

TOUCH_I2C_SDA

MDDI_P_STB_M

MDDI_P_STB_M

MDDI_P_STB_P

MDDI_P_STB_P

MDDI_P_DATA_M

MDDI_P_DATA_M

MDDI_P_DATA_P

MDDI_P_DATA_P

LCD_RESET_N

LCD_RESET_N

LCD_VSYNC_O

LCD_VSYNC_O

WLED7

WLED7

WLED6

WLED6

WLED1

WLED1

WLED2

WLED2

WLED3

WLED3

WLED4

WLED4

WLED5

WLED5

KPD_PWR_N

KPD_PWR_N

KEY_ROW[7]

KEY_ROW[7]

KEY_ROW[7]

SLIDE_KPD_DRV_NSLIDE_KPD_DRV_N

KEY_COL[6]

KEY_COL[6]

KEY_COL[7]

KEY_COL[7]

VCOIN

VCOIN

VCOIN

SLIDE FPCB TO QW

SLIDE FPCB TO QW(HEADER)

SPEAKER

LCD FPCB side

Proximity Sensor

KEY PCB side

Touch Connector

Tuning point

END1 pin : right, lower

HOME

SEND

2EA --> 3EALED : SEOUL-SEMI --> CITIZEN

3.2" HVGA LCD Connector

8. BGA PIN MAP



[U302]

: USE

: NO USE

U302 : MSM 7227(EUSY0392302)

8. BGA PIN MAP

U302 : MSM 7227 (EUSY0392302)

USE

NO USE

8. BGA PIN MAP



[U400]

: USE

: NO USE

U400 : MT29C8G96MAZAPDJA-5 ITU400 : MT29C8G96MAZAPDJA-5 IT(EUSY0430901)

U400 : MT29C8G96MAZAPDJA-5 IT (EUSY0430901)

USE

NO USE

8. BGA PIN MAP



[U704]

: USE

: NO USE

U704 PM7540U704 : PM7540(EUSY0342201)

U704 : PM7540 (EUSY0342201)

USE

NO USE

8. BGA PIN MAP



[IC1]

: USE

: NO USE NO USE

IC1 : TS5USBA33402YZPR(EUSY0372001)

IC1 : TS5USBA33402YZPR (EUSY0372001)

USE

NO USE

8. BGA PIN MAP



[U701]

: USE

: NO USE NO USE

U701 : WM9093ECS-R(EUSY0403901)

U701 : WM9093ECS-R (EUSY0403901)

USE

NO USE

8. BGA PIN MAP



[U101]

: USE

: NO USE NO USE

U101 : AAT2870(EUSY0336503)

U101 : AAT2870 (EUSY0336503)

USE

NO USE

8. BGA PIN MAP



[U601]

: USE

: NO USE NO USE

U601 : TPA6202A1ZQVRG1(EUSY0404001)

U601 : TPA6202A1ZQVRG1 (EUSY0404001)

USE

NO USE



9. PCB LAYOUT

F

13ABCDE

1

N H GM L K J

K

D

AA

K

L

R

P

N

M

J

H

G

F

E

A

C

BGAFA

BACADAEA

UVWY

LMNPRT

1

JHGFEDCBA

1

D

1

5

01

72

4

C B

01

E D

1

C

P

A

B

H

G

F

E

D

L

N

M

J

K

R

007X

517R

967C

FB8501

267C

177C

017R

047C

117R

327R

767C

C733

567C

217R

C739

757C

C736

477C

006R

9458C1258R

C780

L8055L803

023C

407R

334C

618C

318C

713C3458C

003U 1458C

107R

307R

C723

103U

203U

107UC701

R724

134C

C451

R9

C725

C809

IC1

R300

207D

204PT

C29

C439

044C

2558C

R316

3CS

CN

700

314C

604PT

504PT

704PT

404PT

5C

C827

C826

C726

TP701

3Q

R8522

C8550

R8523

R8519

R713

2PT

01PT3PT

4PT

X800

228C

C8535

C8544

108R

827C

C754

107D137C

C753

C735

207PT

C772

C773

C761

C729

R716

C8551

R85205001U

237C

008U

007PT

R709 007L

C744

U704

C763

C768

727C

C759

437C

C766

R717

R719

C750

C741187C

C8534

9PT

418C 7158R

328C

8PT

C8547

7PT6PT

407L

207L

C760

3R

C752

C749

C742

107L

347C

677C

C751

307L

077C

577C

007AV027R

C778

944C

C746

103C

413R

718C

813C

C8538

R7

C748

12C

4R

C1

224C644C

254C524C

C745

91C

53C

8R

C779

424C

817C

503C

C2 R702

603C

C747

777C

013C

107DZ

C311

C458

603R

C33

C454

C429

C428

C31

603PT

C900

517C317C

003X 313C

613C413C

803PT703PT

123C

707C227C

C303

VA305

R6

703C

807C

907C

607C

C323

417C217C

313R

4C3C

903R

41R

TP309

C720

213C

903C513C

TP310

C717

387CC

716

C700

R725

017C117C

R11 917C

C810

554C

C447

C418

C423

C448

C416

R804

U801

R803

R10

714C

C319

C430

054CR308

C20C

434

107BF

954C

904C624C004C

51C

R707

R706

C704

C322

R705 D

301R

708R

13

227R

D302

213R

113R R307

C25

R310

C28

R12

R2

TP401

C34

C32

C456

C404

354C

C435

C457

C415

U703037C

C721

D700

R301

VA

303

C724

2Q

1Q

1R

004U

C414

C436

C438

VA

302

R315

C304

TP408C

441C

443R

15R

403

444C

TP5

C427

VA

300C

445V

A304

C437

VA

301C

442

5R

C30 304PT

9. PCB LAYOUT

L-04C_MAIN_SPFY0244801-10_TOP

U800 BT, Wifi Module- No BT, WiFi

X800 BT, Wifi Reference Oscillator- No BT, WiFi

U704 PM7540- No Booting, No Service- No Charging

U1005 Fuel Guage IC- No Battery Level

CN700 IO Connector- No Charging

Q1, Q2 Charging TR- No Charging

IC1 MUIC- No USB, NO UART

U801 Acceleration Sensor- No Auto Rotate Display

U302 MSM7227- No Booting,No Service

U400 Memory- No Booting

U301 NAND GATE- No High Speed USB

X300 VCTCXO- No Service

U300 D FlipFlop- No GPS Sensitivity



9. PCB LAYOUT

7

8

8041 40

41

1001 WS

R1012

SW

1000

2201L

4301L

2301L

4901 C3901 C

4801 C

1011 C

7901 C

4501 C

107 NC

FL1006

5101L

508 R

6801 C

2001LF

2801 C

3201L

4601 C

2601 C

3601 C

1601 C

2201 R

7601 C

8601 C

8501 C

6501 C

C1057

5501 C

6001L

CN

5

4201 C

C53

7101 R

CN

4

008 R

J800

AN

T8016101 C

C702

007 U

CN

7

CN

900

CN

6C

1051

C1091

C1095

4201LC1096

L1003

L1002

4001LF

L1031R

1009R

1011C

8555

5001LF

1 NC

U1004

8901 C

3301L

4011 C

L1036

C1102

6201L C108525 C

2501 C

L1004

3501 C

C1087

C1088

4201 R

C1089

FL1001L1030 L1016

R1010

408L

708 CC805 108L

U802

7201L

428 C

U1003

3011 C

3001LF

L1025

L1035

9901 C

L1029

15 C

L1008L1010

45 CC55

L1014

8 NC

C825

C1100

C10750201 R

7508L

C57

3701 C

008TNA

8701L

8101L

8201L

7101L

2901 C

0901 C

R1001

4001 C

C1077

9701 C

C1074

R1000

3801 C

3001 C

L1009L1007

5001L

L1013

1201 R

C1013

C1049

C1005

L1020

0001BF

L1019U

1000

2 NC

3301 C

C10356701 C

0301 C

8201 C

65 C

C1026

C1072

C1002

C1038

C1001

C1025

3201 R 8101 R

2001 U

3 NC

C1034

C1000

1001BF

C1023

C1022

R1015

C1060

R1014

C1010 C

1027

R1006

1301 C

R1007

C1037

C1036

C1041

2301 C

C1009C

1029C

1042

3001 RC1011

C1012

6101 R

C1070

3101 R

9501 C

9101 R

C1039

U1001

2001 R0501 C

0001L

C1040 C

1007

R16

4101 C

008 C

8101 C

408 C

003PT

FL1000

C8553

208 C

4558 C

5101 C

7101 C

6508L

9101 C

108 C

1001L

D800

1101L

C300

308 C

303PT 203PT

003 NC

ZD700

C703

C705

007LF

403PT

L-04C_MAIN_SPFY0244801-10_BOT

FL1000 GPS Saw Filter- No GPS

ANT801 GPS ANT - No GPS

U1001 GPS LNA- No GPS

U700 OVP(Over Voltage Protection) IC- No Charging

J800 USIM Socket- No SIM

ANT800 BT, WiFi ANT- No BT, WiFi

U1004 WCDMA800 PAM- No WCDMA TX, No Service

U1004 WCDMA800 PAM- NoWCDMA TX, No Service

CN900 Main to Qwerty Connector- No Display, No Camera- No Booting

FL1004 WCDMA800 Duplexer- No WCDMA TX, RX sensitivity - No Service

FL1001 FEM- No WCDMA, No GSM- No Service

SW1001 RF Connector- No Service

U1000 RTR6285- No WCDMA / GSM- No Service. No GPS

U1002 GSM PAM- No GSM

FL1004 WCDMA800 Duplexer- No WCDMA TX, RX sensitivity - No Service



9. PCB LAYOUT

4180

40

CN

2

L-04C_F_SUB_SPCY0263701-10_TOP

Connector BtoB14-5804-080-000-829+



9. PCB LAYOUT

4140

80

CN

1

L-04C_F_SUB_SPCY0263701-10_BOT

Connector BtoB14-5804-080-000-829+



9. PCB LAYOUT

502625

203C

333R

223R013AV

C214

113AV

213AV 423R

323R

913R

023R

703AV

613AV 233R

803AV

123R903AV

KB

304K

B312

KB

311K

B309

KB

313K

B306

KB

307K

B305

KB

324K

B301

KB

316

R311

202U802D

702D

VA

323

1PTU1

303C

433R

103U

CN

401

813AV513R

R318

VA

313

R302

C1

C2

C213

613R

023AV713R

913AV

313R

413R

413AV

513AV

213R

133R 223AV

713AV

102R

FB1

512C

C120

R328

C2500

R8

R329

C3

011R

R327

R330

LD303

LD305

LD301

LD304

KB

350K

B356

KB

355K

B357

KB

343K

B303

KB

351K

B349

KB

347K

B348

KB

344K

B345

KB

338K

B337

KB

336K

B335

KB

339K

B333

KB

334K

B330

KB

331K

B329

KB

354

KB

326K

B323

KB

315K

B341

KB

308K

B327

KB

325K

B322

KB

321K

B320

KB

318K

B319

KB

342K

B317

KB

328K

B310

KB

314K

B353

KB

352K

B332

KB

346K

B302

KB

340

U1 Digital Compass Sensor- No Navigation

U301 Key Encoder- No Key Interface

CN401 Qwerty PCB to Slide FPCB Connector- No Display- No earjack- No Key Interface

U202 Hall IC- No Slide Detect

L-04C_QW_KEY_SPEY0069101-10_TOP



9. PCB LAYOUT

40

3418

4180

17

F

5

402 C

102 D

312 R

104 WS

MIC

1

102J

304 C

204 C

R220

C119

R105

R104

C639

VA

101

011 C

106 Q

L3

802 R

212 R

902 R

FB202

202 C

302 C

CN

402

CN

301

C208

012 C

102 DZ

412 R

D202

FB203

402 D

702 C

C206

FB204

FL102

533 R

FB201

212 C

612 RR203

612 C

102 C

U201

ZD205

912 R

202 R

123AV

1AV

FL101

103 C

FL1

VA

305

R308

VA

302

R309

R11

ZD202

L511

VA

325

CN

101R

2

R6

R4

R7

VA

324

L512

106 NC

CN

5

R102

R101001 Q

C117

301 C

FB102

601 C

401 C

411 C

U102

FB101

111 C

301 U

046 C

211 R

226 R

111 R

501 C

916 R

326 R

026 R816 R

C638

716 R

126 RU601

CN

4

701 C

C113

C112

C108

901 C

101 U

601 R

L5

C471034 R

R403

R402

R401

504 U

C4

ZD206

L2 L4

D206 R

210

R207

502 C

D205

R206

R211

CN

1

J201 Earjack- No Earjack Detect- No Earjack Sound

CN101 Camera Connector- No Camera

CN402 Main to Qwerty Connector- No Display, No Sound,No Service- No Motor

FL1, FL101, FL102 EMI Filter- No Camera Display

Q100 FET- No Earjack Detect

U101 SUB PMIC- No LCD Backlight- No Camera

CN1 SD Socket- No SD

U601 Motor Driver IC- No Motor

SW401 RF Connector- No Service

CN601 Motor Connector- No Motor

MIC1 Microphone- No Voice Transmit

CN601 Motor Connector- No Motor

L-04C_QW_KEY_SPEY0069101-10_BOT



9. PCB LAYOUT

6 01

51

VA

102

201BK

001PT

U100

001DL

VA

103

VA

105

R102

101BK

201DL

VA

100

VA

104

R104

R103

VA

101

001BK

101DL

001NC

U100 Proximity Sensor- No Proximity Operation

CN100 Touch Connector- No Touch

L-04C_RF_SLIDE_SPCY0259301-10_TOP



9. PCB LAYOUT

43

71

81

5026 25

001LF

CN

101

701AVC105

201 D

601AV

801AV

901 C

701 C

601 C

011 C

BAT100

001 R

101 C

001 C

301 C

201 C

101 R

C108

D101

301 NC

D100

C104

CN

102

L-04C_RF_SLIDE_SPCY0259301-10_BOT

CN101 Speaker PAD- No Sound

BAT100 Coin Battery- No Real Time

CN102 Slide to Qwerty connector- No Display, No Sound, No Touch

CN103 LCD to Slide Connector- No Display

FL 100 LCD EMI Filter- No Display

10. CALIBRATION



10. CALIBRATIONTachyon User manual

10.1 Introduction

Tachyon will explain how to use the program for the user. Used in this article Tachyon except for a detailed description of the environment file, and only the description is only required. 10.2 Terminology

Tachyon : CMTest2, HotKimchi integrated program. - Dictionary meaning : Quick bitboda of virtual particles. - Mean : Want to reduce the time means fast bitboda moment.

10.3 Installation Explains hot to install the program.

10.3.1 System demand

ITEM Minimum requirements

Maximum requiermensts

Recommand

OS Window XP SP2CPU Pentium 4 1.0G higher

(support ‘Hyper thread’)

RAM 512M higherHDD 1G higher

10.3.2 Install

10.3.2.1 Install Sequence

Below in order to install.

1. Excute the install file. (Install files released on http://ene.lge.com)

2. Click the ‘Tachyon/OCX/OCX_Registration.bat’ file. (C:\LGE\Tachyon\Ocx)

10. CALIBRATION



Tachyon User manual

10.3.2.2 Directory

Directory structure is described.

Installation Location : “C\LGE\Tachyon”

<Ficture 1 : Tachyon Directory>

L-04C/ L-04CL-04CL-04CL-04C

L-04C

10. CALIBRATION



Tachyon User manual

Folder explain

Folder Description

Tachyon Exe file and MFC dll, UI dll is present.

Common Common dll files. (XML Data I/O , Auto Test Logic, Tachyon Logic Control, Communication)

Config Envirement files. (Port configuration, Loss adjust)

Instrument Tester control dll.

Model Model files is present. (Model -> Solution (Qualcomm, EMP, ADI, INFINEON) -> MODEL NAME(LGGM630, LGSH470, ..) -> BUYER NAME(SKT, TEL, VIVO, …)

OCX Conponent files.

PhoneCmd Phone communication file

Report Report Files is present. (Cal data, test data)

Temp

Configuration file explain

File Description ‘MODEL NAME’_Calibration.XML There are imformations to calibrate.

It consist of calibration items. ‘MODEL NAME’_CallSetup.XML There are imformations to call.

‘MODEL NAME’_NV.INI It consists of default values. It is written when ‘cal&auto’ is begun.

‘MODEL NAME’_Sequence.XML It is described a testing procedures.

10. CALIBRATION



Tachyon User manual

10.4 Tachyon Start

Below in order to excute. 1. Excute the c:/LGE/Tachyon/Tachyon_xx.Exe.

<Ficture 2 : Login >

Click the Login button after Pop-up a <Piccutue 2>. Settings do not need.

Then, find the instruments connected to PC.

Support instruments is as follows.

TESTER TESTER NAME

Base Station Agilent 8960 Series 10 E5515C (available) R & S CMU200 (develop progress) Anritsu MT8820 (develop progress) Wiltek (develop progress)

Power Supply KE2303 /KE2306(available) HP66311B(available) R & S NGMO2(available)

10. CALIBRATION



Tachyon User manual

<Ficture 3 : Find Instrument>

2. If you found instruments <Ficture 3> the output.

3. If instrument(Base station) found only one, then <Ficture 3> would disappear immediately.

Otherwise if instrument found two or more, then you can decide whether to use instrument.

10. CALIBRATION



Tachyon User manual

<Ficture 4: Use of instrument>

If it is connected more than two instruments, you can use instrument that you wanted with checking Yes or No.

4. Progress has been correctly, then <Ficture 5> the output.

<Ficture 5>

“Operation Info/ Result” Dialog is test results to the output screen.

If you want disapper dialog with Click or ‘ESC’ button.

10. CALIBRATION



Tachyon User manual

10.5 Tachyon Main UI

It will be explained in the Main Screen.

10.5.1 Menu / Toolbar / Run Button Tachyon has “Menu”, “Toolbar” and Buttons.

<Ficture 6>

10.5.1.1 Menu

There are six kinds of menu.

(“Program”, “Run”, “Additional Function”, “Option”, “View”, “Help”)

Program

Menu Description

Model Selection Select model

Config Editor… Develope progress

NV Item Manager… Develop progress

Sequence Editor… Develope progress

Exit Exit program

10. CALIBRATION



Tachyon User manual

Run

Menu Description

Calibration + Test Start Calibration and Auto Test

Calibration Only Start Calibration

Test Only Start Auto Test

Select band Calibration Start Calibration with selected Band

Select Band/Item Calibration Start Calibration with selected band and item.

Select Band Auto Test Start Auto Test with selected Band

NV Read Read the NV items.

NV Write Write the NV items. Stop STOP

Additional Function

Menu Description

Loss Adjustment… Configuratation and adjust RF-LOSS.

Instrument Calibration… Instrument calibration(available on E5515C)

Phone Control… Phone control (like QPST, available on Qaulcomm)

RF Switch Check… Check the RF Switch Box.

Show Result… Result screen pop-up/pop-down

Option

Menu Description

System Option… COM-Port configuration

Run Option… Special opstion.

Instrument Change… Change instrument

Voltage / Current Setting… Voltage,Current setting

View

Menu Description

Toolbar, Menubar Toggle.

Help

Menu Description

Tachyon Help Develope progress

Tachyon Hotkey…

About Tachyon…

10. CALIBRATION



Tachyon User manual

10.5.1.2 Toolbar

Toolbar Provides for frequently used commands.

<Ficture 7 : Toolbar>

<Ficture 7> Commands in order are as follows :

1. Model Selection

2. Calibration + Test

3. Not availalable.

4. Stop

5. Test Only

6. Calibration Only

7. Phone Control

8. Loss Adjustment

9. System Option

10. Run Option

11. Voltage / Current Setting

12. Show Result

10.5.1.3 Command Button

<Ficture 8 : Start Button>

“Calibration + Test” Button , “Stop” Button .

10. CALIBRATION



Tachyon User manual

10.5.2 UI Display Information About the item on the screen output will be explained.

10.5.2.1 Port / Loss info

<Ficture 9 : COM Port / Loss Information>

Area 1, the output is imformation about the COM port.

Area 2, Show the RF-LOSS for the selected model.

10. CALIBRATION



Tachyon User manual

10.5.2.2 Phone Info / System Option Status

Model Information : Information of model that user selected Solution : chipset (Qualcomm, Emp, ADI, Infineon) Model : Model name, Buyer : Buyer name Binary Ver : Binary Version.(Phone s/w version) Product ID : PID (read from phone). System Information : ezlooks, shield box, rf switch box. Local : Factory location, Ezlooks Mode : On-line/Off-line Limo : Using Shield box or not Run Information : Option Repeat Test : Aging test, ESN Write : Write the ESN(IMEI). Test Only : Only auto test Rework : Rework Option. Verification : Using verification or not. Base Inst. Information : information of instrument Base Inst. : Equipment type Execution Mode : Display the Command that user input Time Elapse : test time Voltage : voltage Current Limit : current limit Consumption Current(mA) : doesn’t work

10. CALIBRATION



Tachyon User manual

10.6 Functional explain

This will be explained in detail about the functionality provided.

10.6.1 Model Selection This provides the ablity to select and change.

Description

How to Excute 1. <Menu> Program -> Model Selection….

2. <Toolbar> Click .

Hot Key Ctrl + M

Model selection screen is shown below

<Ficture 10 : model selection dialog>

10. CALIBRATION



Tachyon User manual

The order follows :

1) Chipsets imformation, Check.

2) Select the Chipsets.

<Ficture 11 : Solution selection>

3) Select the model.

<Ficture 12 : Model selection>

L-03CL-04CL-05C

L-03C L-04C

L-05C

10. CALIBRATION



Tachyon User manual

4) Select the buyer. (must be dobble clicked)

<Ficture 13 : Buyer selection>

5) After select Buyer, if environment files is normally, “PASS” screen shows. Otherwise “Fail” screen shows.

NOTE) The following files must exist.

- Model name_Calibration.xml (Buyer Folder)

- Model name_CalLogic.dll (Mdoel Folder)

- Model name_CallSetup.xml (Buyer Folder)

- Model name_Sequence.xml (Buyer Folder)

6) If “Fail” screen shows, check the File List.

7) If “PASS” screen shows, Click the “Select” button.

8) If normal progress, then the screen is as shown below

L-04C

L-03CL-04C

L-04CL-04CL-04CL-04CL-04CL-04CL-04C

10. CALIBRATION



Tachyon User manual

<Ficture 14 : Normal screen>

Shows the selected model imformation and RF-LOSS.(Ficture14).

If you don’t see imformation and RF-LOSS, the files was wrong.

L-04C

10. CALIBRATION



Tachyon User manual

10.6.2 Start / Run This will be explained in detail about the functionality provided.

10.6.2.1 Calibration + Test

This perform the calibraton, Test.

Select when ‘Calibration and Auto Test’ process

Description.

Excution 1. <Menu> Run-> Calibration + Test.


Hot Key F5 : Shield Box 1 F6 : Shield Box 2

Button

button Click.

<Calibration + Test> will be in the order. Sequence xml file has it. i) Precede Action - NV Write. - Test command send ii) Calibration - Calibration iii) Auto Test - Auto test iV) After Action - Phone reset - Change AMSS

If you have a multi-system, you must select the Channel(1,2) that you wanted, then you can test.

<Ficture 15 : Channel selection>

10. CALIBRATION



Tachyon User manual

10.6.2.2 Calibration Only

This perform only the Calibraton.

Select when ‘Calibration only’ process.

Description.

Excution 1. <Menu> Run-> Calibration Only.

2. <Toolbar> Click.

Hot Key F9

Button NONE.


<Ficture 16 : Calibration Only>

10. CALIBRATION



Tachyon User manual

10.6.2.3 Test Only

This perform only the Test.

Select when “Test Only” process

Description.Excution 1. <Menu> Run-> Test Only.

2. <Toolbar> Click. Hot Key F8 Button NONE.


<Ficture 17 : Test Only>

10. CALIBRATION



Tachyon User manual

10.6.2.4 NV Read

This perform reading the NV items.

Description

Excution 1. <Menu> Run-> NV Read

Hot Key F1

Button NONE.

If there is a MODEL-NAME_NV.INT file, you can read the NV items. INI file define about NV items.

INI file should be existed to Read the NV items.

10.6.2.5 NV Write

This perform writing the NV items.

Description

Excution 1. <Menu> Run-> NV Write

Hot Key F2

Button NONE

Same as ‘NV Read’.

10.6.2.6 Stop

This perform Stopping the process.

Description.

Excution 1. <Menu> Run-> STOP

2. <Toolbar> Click.

Hot Key ESC

Button

button Click.

10.6.2.7 Select Band Calibration

This perform the calibration.only with user selected band

Description.

Excution 1. <Menu> Run-> Select Band Calibration

Hot Key NONE

Button NONE.

10. CALIBRATION



Tachyon User manual

Perform in the following order :

1) Select the TAB of channel you want test

<Ficture 18 : TAB of CH1_Calibration>

2) After 1), Select the BAND you want test.

<Ficture 19 : Band Select>

10. CALIBRATION



Tachyon User manual

3) After 2), “RUN” -> “Select Band Calibration”

<Ficture 20 : Select Band Calibration>

10. CALIBRATION



Tachyon User manual

10.6.2.8 Select Band/Item Calibration

This perform the calibration you selected item, after you selected band.

Description.

Excution 1. <Menu> Run Select Band / Item Calibration

Hot Key NONE

Button NONE

Perform in the following order :

1) Excute <6,2,7> 1 and 2.

2) Select the Calibration item in Band you wanted..

<Ficture 21 : Calibration Item>

3) “Run” ->”Select Band/Item Calibration”

<Ficture 22 : Select Band/Item Calibration >

10. CALIBRATION



Tachyon User manual

10.6.2.9 Select Band Auto Test

This perform the Auto Test you selected band, After you selected model..

Description.

Excution 1. <Menu> Run-> Select Band Auto Test

Hot Key NONE.

Button NONE

Perform in the following order:

1) Select the TAB of channel you want test. <Figure 23>

<Ficture 23 : Test Tab>

2) Select the band you wanted. <Figure 24>

<Figure 24 : Test Band>

3) “RUN” -> “Select Band Auto Test”.

10. CALIBRATION



Tachyon User manual

10.6.3 System Loss Setting Explains how to set the RF-LOSS.

10.6.3.1 Loss Setting

This perform RF-LOSS setting.

Description

Excution 1. <Menu> Additional Function -> Loss Adjustment…

2. <Toolbar> Click.

Hot Key Ctrl + L

Button NONE.

When you run the above command <Figure 25> is the output, such as Dialog. Dialog is divided into two parts.

First part(Loss Adjustment), you can set the RF-Loss with inputed value

Second part(Detail Loss Adjustment), it doesn’t work now.

<Ficture 25 : Loss Adjustment>

10. CALIBRATION



Tachyon User manual

10.6.3.2 Manual Loss Setting (Loss Adjustment)

In tachyon, RF-LOSS is the sum of value of ‘MS Calble Type’ and value of ‘RF Cable Type’

MS Cable Loss Setting

User must select ‘MS Cable Type’.

Also, user can create new msl file for another ‘MS Cable Type’.

<Ficture 26 : MS Cable Type selection>

If you select ‘MS Cable Type’, then selected ‘MS Cable Type’ Loss is output.

<Ficture 27 : MS Cable Loss (ex.) >

L-04C.mslL-04C.msl

10. CALIBRATION



Tachyon User manual

You clicked the cell that you wanted twice(double click) when you want change the Loss. And you can input new loss.

<Ficture 28 : Change the Loss>

You must save after change the loss.

<Ficture 29 : Save After change>

If there is no msl file about cable that you will use, you can create new file. The dialog shows After you click the “Create New File”.

<Ficture 30 : Create new MS Cable Loss File>

Then you input the new file name and push the save button. caution : You must not change location that file storing. Now you can select MS cable type you created and you can input new value for one.

10. CALIBRATION



Tachyon User manual

RF Cable Loss Setting

If you use RF Cable, you must use loss of ‘RF Cable Type’.

Caution : RF Cable Loss is sum of all except MS Cable loss.

(ex : RF Cable Loss + Shield Box Loss + RF Switch box loss = RF Cable Loss)

<Ficture 31 : RF Cable type selection>

Inputting loss of ‘RF Cable Type’ is similar inputting loss of ‘MS Cable Type’.

If the loss of ‘RF Cable Type’ that you used is present, you can select the file. (Figure 31)

Also you can create new .rfl file for ‘RF Cable Type’. (Figure 32)

<Figure 32 : Create the new RF Loss File>

10. CALIBRATION



Tachyon User manual

Cable Loss setup

You must select Ms Cable loss and RF Cable loss. And you should proceed as follows.

<Figure 33 : Loss Adjust>

1) After you select MS Cable Type and RF Cable Type, you push the Display button.

Then cobined value is output on the screen.(Figure 33)

2) Determine the value is printed on the screen, Push the “Apply” Button.

System Loss File

Cobined value is saved below file.

< ..\Tachyon\Config\SystemLoss.Ini>

10.6.3.3 Auto Loss Setting (Detail Loss Adjustment>

It doesn’t work now.

10. CALIBRATION



Tachyon User manual

10.6.4 System Option Setting This perform setting varioust features or not setting.

There are features in System Option.

1) Setting the COM port 2) Setting the Repore Data 3) Setting the Language. 4) Setting the Message Queue.. 5) Setting the Repeat Test. 6) File manager.

Description

Excution 1. <Menu> Option -> System Option


Hot Key Ctrl + O

Button NONE

<Ficture 34 : System Option>

<Ficture 34> is running screen, if you want to terminate then you push ‘OK’ button.



11. EXPLODED VIEW & REPLACEMENT PART LIST


11.1 EXPLODED VIEW

MJN00ACGT00

SVLM00SUSY00

EBR01 AHFY00 MBJZ00

FAB04 MCCH00

ADCA01

AKAC00SUMY00

SAEY00 AFBZ00

ABL00

SPKY00

MBFZ00SAFY00

SNGF01SNGF02

MCCE00MBL00

ACGM00

FAB00

FAB03

ADCA00

SWCC00

EAU00

FAB01

FAB02

EBR00

ABM00ABM01

MFEZ01MFEZ02

SNGF00

SBPL00 ACGA00

ABM02

Location Description

SBPL00 Rechargeable Battery,Lithium Ion

ACGA00 Cover Assembly,Battery

FAB00 Screw,Machine

ACGM00 Cover Assembly,Rear

SNGF00 Antenna,Helical

MBL00 Cap,Mobile Switch

MCCE00 Cap,Receptacle

SVLM00 LCD,Module-TFT

FAB01 Screw,Machine

FAB02 Screw,Machine

MJN00 Tape,Protect

EAU00 Motor,DC

EBR00 PCB Assembly,Flexible

SAEY00 PCB Assembly,Keypad

SPKY00 PCB,Sidekey

ABL00 Camera Assembly

ADCA00 Dome Assembly,Metal

SUMY00 Microphone,Condenser

SUSY00 Speaker Module

SWCC00 Cable,Assembly

FAB03 Screw,Machine

FAB04 Screw,Machine

MCCH00 Cap,Screw

ACGT00 Cover Assembly,Upper

AFBZ00 Frame Assembly

AHFY00 Hinge Assembly

MBJZ00 Button

AKAC00 Keypad Assembly,Main

EBR01 PCB Assembly,Flexible

ADCA01 Dome Assembly,Metal

SAFY00 PCB Assembly,Main

ABM00 Can Assembly,Shield





MBFZ00 Bracket

MFEZ01 Frame

MFEZ02 Frame




by SBOM standard on GCSC

Level Location No. Description PartNumber Spec Remark

1 AGF000000 PackageAssembly - AGF75965906 L04C.ANTTWV BK:Black L-04C S_White

Silver(NTT2_720ea) Package Assembly

2 MAY047100 Box, Master MAY64817120 BOX TW 293 215 248 MULTI COLOR L04C.ANTTWVBK:Black L-04C Set Master Box _NTT2

2 MAY084000 Box, Unit MAY64856716BOX TW 188 49 139 MULTI COLOR L04C.ANTTWVWV:WHITE SILVER L-04C Main Unit Box_WhiteSilver_NTT2

2 AGJ000000 PALLET ASSY - APLY0003308 L-01A NTTTK TK, ZZ, NTT-2 Palletizing-720ea

3 MBAD00 Bag, Vinyl MBAD0003101 COMPLEX PDM MIGRATION MODEL(Seoul) ZZ:WithoutColor 1700*1700*0.04t EXTRUSION, LDPE,

3 MPBZ02 Damper MPBZ0036864 COMPLEX BL40 ORUBK ZZ:Without Color -

3 MBEC00 Box, Carton MBEC0000267 COMPLEX L-01A NTTXK ZZ:Without Color -

3 MCJZ00 Cover MCJZ0030564 COMPLEX L-01A NTTXK ZZ:Without Color -

3 MLAJ00 Label, Master Box MLAJ0004201 COMPLEX LG-VX6100 ZZ:Without ColorNew_TDR_Shipping Label PRINTING,

3 MPBZ01 Damper MPBZ0036822 COMPLEX L-01A NTTXK BK:Black -

3 MPBZ00 Damper MPBZ0036823 COMPLEX L-01A NTTXK BK:Black -

3 MPCY00 Pallet MPCY0017602 COMPLEX L706ie NTTWT ZZ:Without Color -

2 MJN000000 Tape MTAZ0127608 COMPLEX L-03A NTTPW ZZ:Without Color -

2 MCQ007001 Damper, Box MPBA0004030 COMPLEX L-01A NTTXK ZZ:Without Color -

2 MEZ000002 Label MLAZ0050901 COMPLEX KU990 GBRBK ZZ:Without Color -

2 MEZ084100 Label, Unit Box MLAQ0018201 COMPLEX L-02B NTTPN ZZ:Without Color PRINTING,NTT docomo Unit Box Label(70X30)

2 MEZ047200 Label, Master Box MLAJ0004402 COMPLEX CG300 CGR ZZ:Without Color LABEL,MASTER BOX(for CGR TDR 2VER. mbox_label)

2 MFZ005600 Packing,Blister(Lower) MFZ62837403 MOLD PULP [email protected] ZZ:Without

Color L-04C NTT2 Packing, Blister(Lower)

2 MEZ003500 Label, Barcode MEZ63820101 PRINTING L01C.ANTTDH ZZ:Without Color DoccomoNew IMEI Peel Label_3 piece_71*40

2 MAF086500 Bag, Vinyl MBAD0005204 COMPLEX LG-LX260 SPRAG ZZ:Without Color -

11.2 Replacement Parts Note: This Chapter is used for reference, Part order is ordered

<Mechanic component>





1 AAAY00 Addition Assembly - AAAY0488301 L-04C NTTWV ZZ:Without Color -

2 ACGA00 Cover Assembly,Battery - ACGA0052801 L-04C NTTWV WV:WHITE SILVER -

3 MAF000001 Bag MAF62668801 COMPLEX L04C.ANTTWV ZZ:Without Color -

3 MJN061100 Tape, Protect MJN67676501 COMPLEX L04C.ANTTWV WV:WHITE SILVER -

3 MCJA00 Cover, Battery MCJA0129301 COMPLEX L-04C NTTWV WV:WHITE SILVER MOLD,PC LUPOY SC-1004A,

1 APEY00 PHONE - APEY0951301 L-04C NTTWV WV, WV,

2 MEZ002100 Label, Approval MEZ63809401 COMPLEX L04C.ANTTWV ZZ:Without Color -

2 ACGY00 COVER ASSY,EMS - ACGY0053201 L-04C NTTWV WV, WV,

3 FAB03 Screw, Machine FAB31123901 FH Y 2.7M 3M SWRCH18A BLACK N A

3 EAN011400 IC, Memory Card,MINI SD SMZY0027202 SD-C02G2CYB MicroSD Card / 2GB (MLC NAND

16Gbx1), Module Assembly, TOSHIBA

3 ACGM00 Cover Assembly,Rear - ACGM0169801 L-04C NTTWV WV:WHITE SILVER -

4 SNGF00 Antenna, Helical SNGF0064303L04C-MAIN-EMW 3.0, -2.0 dBd, L-04C Main Internal,W800+2100+GSM900+1800+1900, Pb-Free, MULTI, -2.0,50ohm, 3.0 E.M.W CO., LTD.

4 MBL00 Cap, MobileSwitch MBL64797401 COMPLEX L04C.ANTTWV WV:WHITE SILVER -

4 MEV000000 Insulator MIDZ0276801 COMPLEX L04C.ANTTWV BK:Black COMPLEX, (empty),, , , ,

4 MKC009400 Window, Camera MWAE0066101 COMPLEX L04C.ANTTWV ZZ:Without Color CUTTING,PMMA MR 200, , , , ,

4 MJN009400 Tape, Camera MTAK0042301 COMPLEX L04C.ANTTWV ZZ:Without Color COMPLEX,(empty), , , , ,

4 MCQ000000 Damper MCQ66596301 COMPLEX L04C.ANTTWV ZZ:Without Color -

4 MEZ000900 Label, AfterService MLAB0003601 COMPLEX L602i NTTRY ZZ:Without Color -

4 MCQ009400 Damper, Camera MPBT0099601 COMPLEX L04C.ANTTWV BK:Black COMPLEX, (empty),, , , ,

4 MCCE00 Cap, Receptacle MCCE0063201 COMPLEX L-04C NTTWV WV:WHITE SILVER MOLD,PC LUPOY SC-1004A, , , , ,

4 MCJN00 Cover, Rear MCJN0133901 COMPLEX L-04C NTTWV WV:WHITE SILVER MOLD,PC LUPOY SC-1004A,

4 MDAY00 Decor MDAY0098701 COMPLEX L-04C NTTWV SV:Silver MOLD, ABS AF-308,

FAB00





3 ACGQ00 COVER ASSY,SLIDE - ACGQ0054301 L-04C NTTWV WV, WV,

4 SVLM00 LCD, Module-TFT SVLM0040101TX08D39VM0BAA Main, 3.2", HVGA, 49.92x77.83x1.9t,16.7M, TFT, TM, S6D05A0(Samsung), HITACHIDISPLAY DEVICES LTD.

4 FAB01 Screw, Machine FAB31124101 FH Y 3.5M 2.5M SWRCH18A BLACK N A


4 MJN00 Tape, Protect MJN67676801 COMPLEX L04C.ANTTWV ZZ:Without Color window

4 MEV000000 Insulator MIDZ0270801 COMPLEX L04C.ANTTWV BK:Black COMPLEX, (empty),, , , ,

4 MDS000000 Gasket MGAZ0104901 COMPLEX L04C.ANTTWV GD:Gold COMPLEX, (empty),, , , ,

4 MDS000002 Gasket MDS63632401 COMPLEX L04C.ANTTWV ZZ:Without Color -

4 EAU00 Motor, DC EAU61523501 MVMF-A301K2 2V 40mA 40mA 12KRPM 12KRPM30mSEC 40mGF.CM 36OHM LG INNOTEK CO., LTD

4 EBR00 PCB Assembly,Flexible - EBR73129101 L04C.ANTTWV 1.0 Flexible

5 EBR070400 PCB Assembly,Flexible, SMT - EBR73130101 L04C.ANTTWV 1.0 Flexible

6 EBR070300PCB Assembly,Flexible,SMT Top

- EBR73130701 L04C.ANTTWV 1.0 Flexible

7 EAX010700 PCB, Flexible SPCY0263701 SPCY0263701 L04C.ANTTWV 1.0 POLYI Multi - 0.3mmFLEXIBLE YOUNG POONG ELECTRONICS CO. LTD.

6 EBR070200PCB Assembly,Flexible, SMTBottom


4 SAEY00 PCB Assembly,Keypad - SAEY0073301 L04C.ANTTWV 1.0 KEYPAD

5 SAEB00 PCB Assembly,Keypad, Insert - SAEB0033001 L04C.ANTTWV 1.0 KEYPAD

6 SPKY00 PCB, Sidekey SPKY0098801 SPKY0098801 L04C.ANTTWV 1.1 POLYI Double 2 0.18SIDEKEY YOUNG POONG ELECTRONICS CO. LTD.

6 ABL00 Camera Assembly - ABL72995501 L04C.ANTTWV ZZ:Without Color -

7 EBP000000 Camera Module EBP61301801C3AA-Y314C C3AA-Y314C 3M AF, Sony(1/5"),8.5x8.5x5.4t, FPCB 3.5mm, 90degree LG INNOTEK CO.,LTD






7 MDS000001 Gasket MGAZ0113701 COMPLEX L-04C NTTWV GD:Gold COMPLEX, (empty),

6 RAA050100 RESIN, PC BRAH0001301 UF-1060, ; , , , , [empty]

6 RAA050101 RESIN, PC BRAH0002601 UNIQUE4000HFW, ; , , , , [empty]



6 ADCA00 Dome Assembly,Metal ADCA0121401 L-04C NTTWV ZZ:Without Color -

6 MFBZ00 Filter MFBZ0036201 COMPLEX L-04C NTTWV BK:Black COMPLEX, (empty),

5 SAEE00 PCB Assembly,Keypad, SMT - SAEE0039601 L04C.ANTTWV 1.0 KEYPAD

6 SAEC00PCB Assembly,Keypad, SMTBottom

- SAEC0038401 L04C.ANTTWV 1.0 KEYPAD

7 SUMY00 Microphone,Condenser SUMY0010610

SPM0410LR5H-QB SPM0410LR5H-QB, UNIT, 42 dB,4.72*3.76*1.25, mems TDMA Improve KNOWLESACOUSTICS

6 SAED00PCB Assembly,Keypad,SMT Top

- SAED0037701 L04C.ANTTWV 1.0 KEYPAD

7 EAX010400 PCB, Keypad SPEY0069101 SPEY0069101 L04C.ANTTWV 1.0 FR-4 Build-Up 6 0.5KEYPAD LG Innotek.com

4 SUSY00 Speaker Module SUSY0028012 1810-8T-05W1P 1810-8T-05W1P, ASSY, 8 ohm, 92 dB,1810 mm, 10mm KIRYN TELECOM CO., LTD

4 SWCC00 Cable, Assembly SWCC0011001 U.FL-2LPVHF-04N1TC-A76LG 76 mm, LINE, U.FL_U.FL,H=2.0, WHITE, HIROSE KOREA CO., LTD

4 FAB00 Screw, Machine FAB31123701 FH Y 2.7M 3M SWRCH18A BLACK N A


4 MCCH00 Cap, Screw MCCH0165901 COMPLEX L04C.ANTTWV GR:Gray COMPLEX, (empty),, , , ,

4 MJN061101 Tape, Protect MJN67750701 COMPLEX L04C.ANTTWV ZZ:Without Color -

4 MJN061102 Tape, Protect MJN67807701 COMPLEX L04C.ANTTWV ZZ:Without Color qwertykeypad

4 MEZ000000 Label MLAZ0038303 COMPLEX LG-LC3200 WA:White PRINTING, PPRIPRINTING

4 ACGT00 Cover Assembly,Upper - ACGT0011001 L-04C NTTWV WV:WHITE SILVER -

5 MEV000000 Insulator MIDZ0275601 COMPLEX L04C.ANTTWV ZZ:Without Color COMPLEX,(empty), , , , ,

FAB03





5 MCQ000002 Damper MPBZ0331001 COMPLEX L04C.ANTTWV BK:Black COMPLEX, (empty),, , , ,

5 EBD030100 Touch WindowAssembly SMZY0029603 Film to Film Contact 50*94.2 1% 90%

5 MJN000001 Tape MJN67771201 COMPLEX L04C.ANTTWV ZZ:Without Color remove touchwindow

5 MDJ000000 Filter MFBZ0027201 COMPLEX L04C.ANTTWV BK:Black COMPLEX, (empty),, , , ,

5 MJN061100 Tape, Protect MTAB0428501 COMPLEX L04C.ANTTWV ZZ:Without Color COMPLEX,(empty), , , , ,

5 MEV000001 Insulator MIDZ0275901 COMPLEX L04C.ANTTWV ZZ:Without Color COMPLEX,(empty), , , , ,

5 MJN000000 Tape MJN67676901 COMPLEX L04C.ANTTWV ZZ:Without Color remove

5 RAB150000 Magnet MMAZ0006601 COMPLEX, (empty), , , , , COMPLEX, (empty), , , , ,

5 MCQ043300 Damper, LCD MPBG0114301 COMPLEX L04C.ANTTWV BK:Black COMPLEX, (empty),, , , ,



5 AKAD00 Keypad Assembly,Sub AKAD0006001 L-04C NTTWV WV:WHITE SILVER -

5 MCJX00 Cover, Upper - MCJX0012801 COMPLEX L-04C NTTWV WV:WHITE SILVER MOLD,PC LUPOY SC-2302,

6 MET099500 Insert, Nut MICE0016901 COMPLEX MECH_COMMON ZZ:Without Color -

6 MBFZ00 Bracket MBFZ0061801 COMPLEX L-04C NTTWV ZZ:Without Color PRESS, STS,0.3,

4 AFBZ00 Frame Assembly - AFBZ0024201 L-04C NTTWV ZZ:Without Color MIDDLE

5 MCQ000000 Damper MPBZ0330401 COMPLEX L04C.ANTTWV ZZ:Without Color COMPLEX,(empty), , , , ,

5 MJN000000 Tape MTAZ0351701 COMPLEX L04C.ANTTWV ZZ:Without Color COMPLEX,(empty), , , , ,


5 MFEZ00 Frame - MFEZ0045101 COMPLEX L-04C NTTWV ZZ:Without Color MOLD, PCLUPOY SC-2302,






4 AHFY00 Hinge Assembly - AHFY0005501 L-04C NTTWV WV:WHITE SILVER -

5 MJN061100 Tape, Protect MJN67807801 COMPLEX L04C.ANTTWV ZZ:Without Color lower

5 FAB010000 Screw, Machine GMEY0019201 GMEY0019201 FH + 1.4mM 1.8mM SWCH FZW N NKUMGANG SCREW CO., LTD

5 ACGK00 Cover Assembly,Front - ACGK0180501 L-04C NTTWV WV:WHITE SILVER -


6 MJN061100 Tape, Protect MTAB0429601 COMPLEX L04C.ANTTWV ZZ:Without Color COMPLEX,(empty), , , , ,

6 MBJZ00 Button MBJZ0052801 COMPLEX L-04C NTTWV WV:WHITE SILVERCOMPLEX, (empty),

6 MEV000000 Insulator MEV63676501 COMPLEX L04C.ANTTWV ZZ:Without Color -

6 MCJK00 Cover, Front - MCJK0141701 COMPLEX L-04C NTTWV WV:WHITE SILVER MOLD,PC LUPOY SC-1004A,

7 MET099500 INSERT, NUT MICE0016902 MECH_COMMON ZY, ZZ, PRESS, STS, , , , ,

7 MET099500 Insert, Nut MICE0016901 COMPLEX MECH_COMMON ZZ:Without Color -

6 MDAY00 Decor MDAY0098601 COMPLEX L-04C NTTWV WV:WHITE SILVER MOLD,PC LUPOY SC-1004A,

6 MFEZ00 Frame MFEZ0044801 COMPLEX L-04C NTTWV BK:Black PRESS, STS, 0.2,

5 ACGU00 Cover Assembly,Lower - ACGU0008501 L-04C NTTWV WV:WHITE SILVER -





6 MDS000002 Gasket MDS63515501 COMPLEX L04C.ANTTWV ZZ:Without Color LOWERFORM 2

6 MDS000000 Gasket MGAZ0109401 COMPLEX L04C.ANTTWV ZZ:Without Color COMPLEX,(empty), , , , ,







6 MCJY00 Cover, Lower - MCJY0010001 COMPLEX L-04C NTTWV WV:WHITE SILVER MOLD,PC LUPOY SC-2302,

7 MAZ000001 Bracket MAZ63004601 PRESS STEEL STS304-H 0.3 L04C.ANTTWV ZZ:WithoutColor -


5 ARDY00 Rail Assembly,Slide ARDY0017801 L-04C NTTWV WV:WHITE SILVER -

4 AKAC00 Keypad Assembly,Main AKAC0021101 L-04C NTTWV ZZ:Without Color -

4 EBR01 PCB Assembly,Flexible - EBR73159401 L04C.ANTTWV 1.0 Flexible

5 EBR070100 PCB Assembly,Flexible, Insert - EBR73178201 L04C.ANTTWV 1.0 Flexible

6 ADCA01 Dome Assembly,Metal ADCA0119301 L04C.ANTTWV ZZ:Without Color slide

5 EBR070400 PCB Assembly,Flexible, SMT - EBR73178301 L04C.ANTTWV 1.0 Flexible

6 EBR070200PCB Assembly,Flexible, SMTBottom


6 EBR070300PCB Assembly,Flexible,SMT Top


7 EAX010700 PCB, Flexible SPCY0259301 SPCY0259301 L04C.ANTTWV 1.1 - - - - FLEXIBLEYOUNG POONG ELECTRONICS CO. LTD.

3 SAFY00 PCB Assembly,Main - SAFY0387901 L04C.ANTTWV 1.0 MAIN

4 SAFB00 PCB Assembly,Main, Insert - SAFB0122201 L04C.ANTTWV 1.0 MAIN

5 ABM00 Can Assembly,Shield - ABM73456201 L04C.ANTTWV WV:WHITE SILVER -

6 MBK070300 Can, Shield MCBA0079401 COMPLEX L-04C NTTWV SV:Silver -

6 MEV000000 Insulator MEV63672701 COMPLEX L04C.ANTTWV BL:Blue CAN TOP 1

6 MEV000001 Insulator MEV63676901 COMPLEX L04C.ANTTWV WV:WHITE SILVER -

5 RAA050100 RESIN, PC BRAH0001301 UF-1060, ; , , , , [empty]

5 RAA050101 RESIN, PC BRAH0002601 UNIQUE4000HFW, ; , , , , [empty]

5 MCQ015700 Damper,Connector MCQ66493201 COMPLEX L04C.ANTTWV WV:WHITE SILVER -







6 MEV000000 Insulator MEV63672801 COMPLEX L04C.ANTTWV BL:Blue CAN TOP 2



6 MEV000000 Insulator MEV63691401 COMPLEX L04C.ANTTWV WV:WHITE SILVER -

4 SAFF00 PCB Assembly,Main, SMT - SAFF0288401 L04C.ANTTWV 1.0 MAIN

5 MEZ000000 Label MLAZ0038301 COMPLEX LG-VX6000 ZZ:Without Color PID Label 4Array PRINTING,

5 SAD010000 Software, Mobile SAD32863801 V10a - JAPAN QCT -

5 SAFC00 PCB Assembly,Main, SMT Bottom - SAFC0154701 L04C.ANTTWV 1.0 MAIN

6 SNGF01 Antenna, Helical SNGF0041301 ODGPPTR3015 SINGLE -2DB 50OHM 3 PARTRONCOMPANY LIMITED

6 SNGF02 Antenna, Helical SNGF0048003 ITBTPTR3015 SINGLE -2DB 50OHM 3 PARTRONCOMPANY LIMITED

5 SAFD00PCB Assembly,Main,SMT Top

- SAFD0152601 L04C.ANTTWV 1.0 MAIN

6 EAX010000 PCB, Main SPFY0244801 SPFY0244801 L04C.ANTTWV 1.0 FR-4 Any Layer 100.75 MAIN LG Innotek.com

6 MBFZ00 Bracket MBFZ0061001 COMPLEX L-04C NTTWV ZZ:Without Color PRESS, NS,, , , ,

6 MFEZ01 Frame MFEZ0032701 COMPLEX L-04C NTTWV SV:Silver -

6 MFEZ02 Frame MFEZ0033601 COMPLEX L-04C NTTWV SV:Silver -






7 CN2 Connector, BtoB ENBY005110114-5804-080-000-829+ 80P 0.40MM STRAIGHT MALESMD R/TP 900mM - KYOCERA ELCO KOREA SALESCO., LTD.

7 CN2 Connector, BtoB ENBY005110114-5804-080-000-829+ 80P 0.40MM STRAIGHT MALESMD R/TP 900mM - KYOCERA ELCO KOREA SALESCO., LTD.

7 CN4,CN5 Contact MCIZ0008701 COMPLEX L-04C, ANTTWV ZZ:Without Color PRESS,

YCUT-FX, 4.2, 2.5, 1.5,

7 C204,C210

Capacitor,Ceramic, Chip ECCH0000122 MCH155A470JK 47pF 5% 50V NP0 -55TO+125C 1005

R/TP - ROHM Semiconductor KOREA CORPORATION

7

C103,C104,C105,C106,C207

Capacitor,Ceramic, Chip ECCH0000198

CL05A225MQ5NSNC 2.2uF 20% 6.3V X5R -55TO+85C1005 R/TP . SAMSUNG ELECTRO-MECHANICS CO.,LTD.

7D201,D202,D204

Diode, TVS EDTY0010101 ESD9B5.0ST5G ESD9B5.0ST5G, SOD-923, 5 V, 300mW, R/TP, 15pF SCG HONG KONG SAR LTD.

7 R111,R112 Resistor, Chip ERHY0009516 MCR006YZPJ222 2.2KOHM 5% 1/20W 0603 R/TP -

ROHM.

7 C109 Capacitor,Ceramic, Chip ECCH0005602 GRM188R61C225K 2.2uF 10% 16V X5R -55TO+85C

1608 R/TP - MURATA MANUFACTURING CO., LTD.

7R101,R102,R203

Resistor, Chip ERHZ0000443 MCR01MZP5J222 2.2KOHM 5% 1/16W 1005 R/TP -ROHM.

7

C112,C113,C114,C117,C638

Capacitor,Ceramic, Chip ECCH0009101 C0603X5R0J104KT00NN 0.1uF 10% 6.3V X5R -

55TO+85C 0603 R/TP - TDK CORPORATION

7 C640 Capacitor,Ceramic, Chip ECCH0009106 C0603X7R1C103KT 10nF 10% 10V X7R -55TO+125C

0603 R/TP - TDK CORPORATION

7

C111,C4,

C471,C639


CL03A105MQ3CSNH 0.000001F 20% 6.3V X5R -45TO+85C 0603 R/TP - SAMSUNG ELECTRO-MECHANICS CO., LTD.

7 C206 Capacitor,Ceramic, Chip ECCH0017601

CL05A475MQ5NRNC 4.7uF 20% 6.3V X5R -55TO+85C1005 R/TP 0.5MM SAMSUNG ELECTRO-MECHANICSCO., LTD.

11.2 Replacement Parts Note: This Chapter is used for reference, Part order is ordered

<Main component>





7 R220 Resistor, Chip ERHZ0000407 MCR01MZP5J105 1MOHM 5% 1/16W 1005 R/TP -ROHM.

7 C119 Capacitor, TA,Conformal ECTH0003701 TCSCM0J106MJAR 10 uF, 6.3V, M, L_ESR, 1608, R/TP

SAMSUNG ELECTRO-MECHANICS CO., LTD.

7 C201,C208

Capacitor,Ceramic, Chip ECZH0000830 C1005C0G1H330JT000F 33pF 5% 50V NP0 -55TO+125C

1005 R/TP - TDK KOREA COOPERATION

7 C110 Capacitor, TA,Conformal ECTH0005203 TCTP1A336M8R , [empty] , [empty] , , [empty] , , [empty] ,

[empty] , [empty] , [empty] ROHM.

7C107,C108,C301

Capacitor,Ceramic, Chip ECZH0001215 C1005X5R1A105KT000F 1uF 10% 10V X5R -55TO+85C


7

R104,R105,R402,R403,R623

Resistor, Chip ERHY0009526 MCR006YZPJ472 4.7KOHM 5% 1/20W 0603 R/TP -ROHM.

7 C205,C212

Capacitor,Ceramic, Chip ECZH0003103 GRM36X7R104K10PT 100nF 10% 10V X7R -55TO+125C


7 D205,D206 Diode, TVS EDTY0009801 VSMF05LCC 5V 6V 12V 2A 25W SOT-963 R/TP 6P 5

PROTEK DEVICES INC.

7 R106,R430 Resistor, Chip ERHY0009506 MCR006YZPJ104 100KOHM 5% 1/20W 0603 R/TP -

ROHM.

7 L2, L3,L4, L5

Inductor,Multilayer, Chip ELCH0001430 LL1005-FHLR10J 100NH 5% - 150mA 2.2OHM 1.03GHZ

10 SHIELD NONE 1.0X0.5X0.5MM R/TP TOKO, INC.

7 L511,L512

Inductor,Multilayer, Chip ELCH0004727

1005GC2TR10JLF 100NH 5% - 100mA 2.3OHM 600MHZ8 SHIELD NONE 1.0X0.5X0.5MM R/TP PILKORELECTRONICS LTD.

7 CN101 Connector, BtoB ENBY0040301 GB042-34S-H10-E3000 34P 0.4MM STRAIGHT SOCKETSMD R/TP 1M - LS Mtron Ltd.

7R2,

R335,R4

PCB ASSY,MAIN, PADSHORT

SAFP0000401 LG-LU3000 LGTBK, MAIN, A,

7 CN402 Connector, BtoB ENBY005120124-5804-080-000-829+ 80P 0.40MM STRAIGHT FEMALESMD R/TP 900mM - KYOCERA ELCO KOREA SALESCO., LTD.

7 CN601 Connector, I/O ENEY0003801 24-8000-002-000-829 2P 1.00MM ANGLE SOCKET TYPESMD R/TP - KYOCERA ELCO KOREA SALES CO., LTD.

7 J201 Jack, Phone ENJE0007601 KJA-PH-0-0176 1P 4P ANGLE R/TP 4mM BLACK 6P -KSD CO., LTD

7 CN1 Socket, Card ENSY0023601 SCHA4B0402 Micro-SD 8P ANGLE SMD R/TP - ALPSELECTRIC KOREA CO., LTD.





7 R219 Resistor, Chip ERHY0009518 MCR006YZPJ224 220KOHM 5% 1/20W 0603 R/TP -ROHM.

7

FB201,FB202,FB203,FB204

Filter, Bead SFBH0008105BLM15BD182SN1D 1800 ohm 1.0X0.5X0.5 25% 1.4 ohm0.1A SMD R/TP 2P 0 MURATA MANUFACTURING CO.,LTD.

7 SW401 Connector, RF ENWY0003901 U.FL-R-SMT(10) 1.90MM STRAIGHT SOCKET SMDT/REEL CU 50OHM 300mDB HIROSE KOREA CO., LTD

7R202,R212,R216

Resistor, Chip ERHZ0000406 MCR01MZP5J104 100KOHM 5% 1/16W 1005 R/TP -ROHM.

7 Q601 TR, Bipolar EQBN0012401 KRC402E NPN 30V 0V 50V 100mA 500mA 50 100mWESM R/TP 3P KEC CORPORAITION

7 R308,R309 Resistor, Chip ERHY0003301 MCR01MZP5J101 100OHM 5% 1/16W 1005 R/TP -

ROHM.

7 Q100 FET EQFP0004501SI1305-E3 P-CHANNEL MOSFET -8V +-8 -0.92A0.28OHM 340mW SOT323 R/TP 9P VISHAYINTERTECHNOLOGY ASIA PTE LTD

7 R617,R618 Resistor, Chip ERHY0009302 MCR006YZPF1001 1KOHM 1% 1/20W 0603 R/TP -

ROHM.


7 C403 Inductor,Multilayer, Chip ELCH0004715

1005GC2T27NJLF 27NH 5% - 200mA 0.9OHM 1.4GHZ 8SHIELD NONE 1.0X0.5X0.5MM R/TP PILKORELECTRONICS LTD.

7 C202,C203

Capacitor,Ceramic, Chip ECZH0004402

CL05F104ZO5NNNC 0.1uF -20TO+80% 16V Y5V -30TO+85C 1005 R/TP - SAMSUNG ELECTRO-MECHANICS CO., LTD.

7 R619,R622 Resistor, Chip ERHZ0000204 MCR01MZP5F1003 100KOHM 1% 1/16W 1005 R/TP -

ROHM.


ROHM.

7 U103 IC, Bus Controller EUSY0342405 NLSX4373MUTAG 1.5~5.5V 2uA - DFN R/TP 8P - SCGHONG KONG SAR LTD.

7 R210 Resistor, Chip ERHZ0000456 MCR01MZP5J2R2 2.2OHM 5% 1/16W 1005 R/TP -ROHM.

7 R6, R7 Resistor, Chip ERHZ0000465 MCR01MZP5J332 3.3KOHM 5% 1/16W 1005 R/TP -ROHM.

7

R206,R207,R208,R209,R211

Resistor, Chip ERHZ0000486 MCR01MZP5J473 47KOHM 5% 1/16W 1005 R/TP -ROHM.





7 C216 Capacitor,Ceramic, Chip ECCH0009103 C0603C0G1H101JT00NN 100pF 5% 50V X7R -


7 U101 IC, Sub PMIC EUSY0336503 AAT2870IUW-T1 CSP , 35 , R/TP , 3.1x2.6 , ; , IC, SubPMIC Advanced Analogic Technologies HK Limited

7 U102 IC, LevelTranslator EUSY0391601 NLSV1T244-D 0.9~4.5V - LEVEL SHIFTER - R/TP 6P -

SCG HONG KONG SAR LTD.

7 U601 IC, SpeakerAmplifier EUSY0404001

TPA6202A1ZQVR BGA, 8, R/TP, Class AB SPK Amp, IC,Audio AmplifierIC, Audio Amplifier - BGA R/TP 8P - TEXASINSTRUMENTS KOREA LTD, HONGKONG BRANCH.

7 U405 IC, LDO VoltageRegulator EUSY0407201

BU33TD4WNVX SSON004, 4, R/TP, 3.3V 150mA SingleLDO, IC, LDO Voltage RegulatorIC, LDO Voltage RegulatorROHM.



7

VA302,VA305,VA324,VA325

Varistor SEVY0001001 EVLC14S02050 14V 0% 50F 1.0*0.5*0.6 NONE SMDR/TP AMOTECH CO., LTD.

7 VA1,VA101 Varistor SEVY0004301 ICVL0518100Y500FR 18V 0% 10F 1.0*0.5*0.55 NONE

SMD R/TP INNOCHIPS TECHNOLOGY

7 FB101, FB102 Filter, Bead SFBH0009901 HB-1M1005-121JT 120 ohm 1.0X0.5X0.5 25% 0.3 ohm0.5A SMD R/TP 2P 0 CERATECH CORPORATION

7FL1,

FL101,FL102

Filter, EMI/Power SFEY0011701 ICVE10184E070R100FR ESD/EMI 0HZ 7.5pF 0H SMDR/TP INNOCHIPS TECHNOLOGY

7

ZD201,ZD202,ZD205,ZD206

Diode, TVS EDTY0009101 ESD9X5.0ST5G 5V 6.2 12.3V 8.7A 107W SOD528 R/TP2P 1 ON SEMICONDUCTOR

7 R11 Capacitor,Ceramic, Chip ECZH0000813 C1005C0G1H101JT 100pF 5% 50V NP0 -55TO+125C


7 C215 Capacitor,Ceramic, Chip ECCH0000112 MCH155C150J 15pF 5% 50V NP0 -55TO+125C 1005


7 C204,C210




MCH153CN103KK 10nF 10% 16V X7R -55TO+125C1005 R/TP - ROHM Semiconductor KOREACORPORATION

7 C302,C303

Capacitor,Ceramic, Chip ECCH0002001 C1005JB0J104KT000F 0.1uF 10% 6.3V Y5P -30TO+85C






7 C214 Capacitor, TA,Conformal ECTH0001901

F980J106MMA 10 uF, 6.3V, M, L_ESR, 1608, R/TPNICHICON CORPORATION, EAST JAPAN SALESOFFICE

7 C201,C208



7 C2 Capacitor,Ceramic, Chip ECZH0001210 C1005Y5V1A474ZT000F 470nF -20TO+80% 10V Y5V -

30TO+85C 1005 R/TP - TDK KOREA COOPERATION

7LD301,LD303,

LD304, LD305LED, Chip EDLH0014307

CL-435F-WQT-SD-TS WHITE 2.8~3.6V 30mA 1200~2080x, y 114mW - R/TP 4P - CITIZEN ELECTRONICS CO.,LTD.

7 CN401 Connector, BtoB ENBY0040501 GB042-50S-H10-E3000 50P 0.4MM STRAIGHT SOCKETSMD R/TP 1M - LS Mtron Ltd.

7 D207,D208 Diode, TVS EDTY0008606 PRSB6.8C 4.7V 5.7 - - 10W - R/TP 2P 1 PROTEK

DEVICES INC.

7 R311 Resistor, Chip ERHZ0000213 MCR01MZP5F1203 120KOHM 1% 1/16W 1005 R/TP -ROHM.

7

R327,R328,R329,R330

Resistor, Chip ERHZ0000270 MCR01MZP5F33R0 33OHM 1% 1/16W 1005 R/TP -ROHM.

7

R302,R312,R313,R314,R315,R316,R317,R318,R319,R320,R321,R322,R323,R324,R331,R332

Resistor, Chip ERHZ0000285 MCR01MZP5F4700 470OHM 1% 1/16W 1005 R/TP -ROHM.

7 R8 Resistor, Chip ERHZ0000404 MCR01MZP5J102 1KOHM 5% 1/16W 1005 R/TP -ROHM.

7 R110 Resistor, Chip ERHZ0000410 MCR01MZP5J120 12OHM 5% 1/16W 1005 R/TP -ROHM.

7R101,R102,R203






7 U301 IC, Bus Controller EUSY0300008 PP2106M3 1.8/2.6V 1mA - MLF R/TP 28P - G5CORPORATION

7 U202 IC, AccelerationSensor EUSY0408901 S-5711ACDL 2.5 to 3.3 - - R/TP 4P - SEIKO

INSTRUMENTS INC

7 U1 IC, GeomagneticSensor EUSY0418501

AMI304 QFN, 12, R/TP, Geomagnetic Sensor, IC, A/DConverterIC, A/D Converter - QFN R/TP 12P - AICHISTEEL CORPORATION

7

VA302,VA305,VA324,VA325


7 FB1 Filter, Bead SFBH0008102BLM15HD182SN1D 1800 ohm 1.0X0.5X0.5 25% 2.2 ohm0.2A SMD R/TP 2P 0 MURATA MANUFACTURING CO.,LTD.

7C107,C108,C301



7 R201 Wire Pad, Open SAFO0000501 AX3100 ATL SV_SHIPBACK, MAIN, A, 0OHM_1005_DNI

7 C205,C212



7 D207,D208 Diode, TVS EDTY0008606 PRSB6.8C 4.7V 5.7 - - 10W - R/TP 2P 1 PROTEK

DEVICES INC.


PROTEK DEVICES INC.



7 C101,C109

Capacitor,Ceramic, Chip ECCH0004904 GRM155R60J105K 1uF 10% 6.3V X5R -55TO+85C 1005

R/TP - MURATA MANUFACTURING CO., LTD.

7

C103,C104,C105,C106,C207



7 C104,C105

Capacitor,Ceramic, Chip ECCH0000120 MCH155A390J 39pF 5% 50V NP0 -55TO+125C 1005


7 CN102 Connector, BtoB ENBY0040401 GB042-50P-H10-E3000 50P 0.4MM STRAIGHT PLUGSMD R/TP 1M - LS Mtron Ltd.

7 BAT100 CapacitorAssembly SMZY0023501 PAS311HR-VG1 3.8 Backup Capacitor 0.03F, Module

Assembly, KOREA TAIYO YUDEN.CO., LTD.

7 FL100 Filter, EMI/Power SFEY0015901 ICMEF214P101MFR ICMEF214P101MFR, SMD, ESDCommon mode Filter INNOCHIPS TECHNOLOGY







7 CN103 Connector,FFC/FPC/PIC ENQY0015301

04-6293-625-005-829+ 25P 0.30MM FFC STRAIGHTTOP SMD T/REEL LOCKING - KYOCERA ELCO KOREASALES CO., LTD.

7LD301,LD303,

LD304, LD305LED, Chip EDLH0014307

CL-435F-WQT-SD-TS WHITE 2.8~3.6V 30mA 1200~2080x, y 114mW - R/TP 4P - CITIZEN ELECTRONICS CO.,LTD.

7 VA104 Varistor SEVY0005201 EVLC5S02050 5.5V 0% 50F 1.0*0.5*0.6 - SMD R/TPAMOTECH CO., LTD.

7

VA302,VA305,VA324,VA325


7 U100 IC, Proximity EUSY0376201 GP2AP002S00F GP2AP002S00F, 8, R/TP SHARPCORPORATION.

7

R327,R328,R329,R330

Resistor, Chip ERHZ0000270 MCR01MZP5F33R0 33OHM 1% 1/16W 1005 R/TP -ROHM.

7 CN100 Connector, BtoB ENBY0050901 GB042-10P-H10-E3000 10P 0.4MM STRAIGHT MALESMD R/TP 1M - LS Mtron Ltd.

6 L1000 Inductor,Multilayer, Chip ELCH0001426 LL1005-FHL8N2J 8.2NH 5% - 300mA 0.25OHM 4.7GHZ 9

SHIELD NONE 1.0X0.5X0.5MM R/TP TOKO, INC.

6 C804 Capacitor,Ceramic, Chip ECCH0000110 MCH155A100D 10pF 0.25PF 50V NP0 -55TO+125C 1005


6 C1026 Capacitor,Ceramic, Chip ECCH0000108 C1005NP0709DGT 7pF 0.5PF 50V NP0 -55TO+125C

1005 R/TP - NEOTECH CO., LTD

6 C215 Capacitor,Ceramic, Chip ECCH0000112 MCH155C150J 15pF 5% 50V NP0 -55TO+125C 1005


6 C205,C212



6 C1007 Capacitor,Ceramic, Chip ECCH0000113 MCH155A180J 18pF 5% 50V NP0 -55TO+125C 1005






6

C1072,C702,C800,C801,C803



6 C104,C105

Capacitor,Ceramic, Chip ECCH0000120 MCH155A390J 39pF 5% 50V NP0 -55TO+125C 1005



CL05C270JB5NNNC 27pF 5% 50V NP0 -55TO+125C1005 R/TP 0.5 SAMSUNG ELECTRO-MECHANICS CO.,LTD.

6 C1031, C1041 Capacitor,Ceramic, Chip ECCH0000143 MCH155CN102KK 1nF 10% 50V X7R -55TO+125C 1005




6 C1082, C1086 Inductor,Multilayer, Chip ELCH0001405

LL1005-FHL3N3S 3.3NH 0.3NH - 400mA 0.16OHM9.1GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP TOKO,INC.

6C1067,C1068,

C1084, C1097

Capacitor,Ceramic, Chip ECCH0000183 GRM1555C1H1R8C 1.8pF 0.25PF 50V NP0 -55TO+125C


6C1061,C1062,

C1063, C1064

Capacitor,Ceramic, Chip ECCH0000901 C1005C0G1H2R2CT000F 2.2pF 0.25PF 50V NP0 -


6 C807 Capacitor,Ceramic, Chip ECCH0000701 C1005C0G1H1R2CT000F 1.2pF 0.25PF 50V NP0 -


6 C302,C303



6 C1033,C53


GRM188R60J106M 10000000 pF, 6.3V, M, X5R, TC,1608, R/TP, 0.8 mm MURATA MANUFACTURING CO.,LTD.


GRM1555C1H2R5CZ01D 2.5pF 0.25PF 50V X7R -55TO+125C 1005 R/TP - MURATA MANUFACTURINGCO., LTD.

6

C1024,C1034,C1035,C1091,

C57


CL10A475KP8NNNC 4.7uF 10% 10V X5R -55TO+85C1608 R/TP - SAMSUNG ELECTRO-MECHANICS CO.,LTD.


CL10A106MP8NNNC 10uF 20% 10V X5R -55TO+85C1608 R/TP 0.8MM SAMSUNG ELECTRO-MECHANICSCO., LTD.






CL05A225MP5NSNC 2.2uF 20% 10V X5R -55TO+85C1005 R/TP 0.5MM SAMSUNG ELECTRO-MECHANICSCO., LTD.

6

C112,C113,C114,C117,C638





6 C1011, C1012 Capacitor,Ceramic, Chip ECCH0009206 GRM0335C1E680J 68pF 5% 25V X7R -55TO+125C 0603


6 C1027,C56

Capacitor,Ceramic, Chip ECCH0009216 GRM0335C1E220J 22pF 5% 25V X7R -55TO+125C 0603


6

C111,C4,

C471,C639



6 L1033 Capacitor,Ceramic, Chip ECZH0000802 C1005C0G1H010CT 1pF 0.25PF 50V NP0 -55TO+125C


6 C201,C208



6 R11 Capacitor,Ceramic, Chip ECZH0000813 C1005C0G1H101JT 100pF 5% 50V NP0 -55TO+125C


6 C1104 Capacitor,Ceramic, Chip ECZH0000841 C1005C0G1H560JT000F 56pF 5% 50V NP0 -55TO+125C


6 C1076, C1101 Capacitor,Ceramic, Chip ECZH0001002 C1005CH1H0R5BT000F 0.5pF 0.1PF 50V NP0 -


6C1090,C1092,

C1093, C1094

Capacitor,Ceramic, Chip ECZH0001122 C1005X7R1H681KT000F 680pF 10% 50V X7R -


6C107,C108,C301



6 C705 Capacitor,Ceramic, Chip ECZH0003503 GRM188R61E105K 1uF 10% 25V X5R -55TO+85C 1608


6 C1013, C1052 Capacitor,Ceramic, Chip ECZH0025916 GRM0335C1E330J 33pF 5% 25V NP0 -55TO+125C 0603



PROTEK DEVICES INC.





6 ZD700 Diode, TVS EDTY0008602 PSD12-LF 12V 13.3 25.9V 21A 500W SOD323 R/TP 2P 1PROTEK DEVICES INC.

6 L1013 Inductor,Multilayer, Chip ELCH0001032

HK1005 18NJ-T 18NH 5% - 300mA 0.55OHM 2.1GHZ 8SHIELD NONE 1.0X0.5X0.5MM R/TP TAIYO YUDENCO., LTD


1005GC2T5N6SLF 5.6NH 0.3NH - 300mA 0.27OHM3.2GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP PILKORELECTRONICS LTD.

6 C1016 Inductor,Multilayer, Chip ELCH0001401 LL1005-FHL15NJ 15NH 5% - 300mA 0.5OHM 2.8GHZ 9


6 C1039, L1001 Inductor,Multilayer, Chip ELCH0001407


6 C1098 Inductor,Multilayer, Chip ELCH0001403 LL1005-FHL1N0S 1NH 0.3NH - 400mA 0.1OHM 20GHZ 7



LL1005-FHL1N5S 1.5NH 0.3NH - 400mA 0.13OHM15GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP TOKO,INC.

6 L1007,L804

Inductor,Multilayer, Chip ELCH0001406 LL1005-FHL4N7S 4.7NH 0.3NH - 300mA 0.2OHM 7GHZ


6 L1015 Inductor,Multilayer, Chip ELCH0001411 LL1005-FHL1N2S 1.2NH 0.3NH - 400mA 0.1OHM 16GHZ



LL1005-FHL1N8S 1.8NH 0.3NH - 400mA 0.14OHM15GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP TOKO,INC.


LL1005-FHL3N9S_ 3.9NH 0.3NH - 300mA 0.18OHM7.4GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP TOKO,INC.

6 L1036 Inductor,Multilayer, Chip ELCH0001413 LL1005-FHL22NJ 22NH 5% - 300mA 0.7OHM 2.5GHZ 10


6 L1002,L1003

Inductor,Multilayer, Chip ELCH0001431 LL1005-FHL68NJ 68NH 5% - 180mA 1.7OHM 1.3GHZ 10


6 L1027,L1078



6 L1017 Inductor,Multilayer, Chip ELCH0004114 LLV0603-FH6N8J 6.8NH 5% - 220mA 0.4OHM 3.5GHZ 6







1005GC2T12NJLF 12NH 5% - 250mA 0.48OHM 2.1GHZ8 SHIELD NONE 1.0X0.5X0.5MM R/TP PILKORELECTRONICS LTD.

6 L1026 Inductor,Multilayer, Chip ELCH0001408 LL1005-FHL6N8J 6.8NH 5% - 300mA 0.23OHM 5.6GHZ 9



1005GC2T8N2JLF 8.2NH 5% - 250mA 0.37OHM 2.8GHZ8 SHIELD NONE 1.0X0.5X0.5MM R/TP PILKORELECTRONICS LTD.


1005GC2T3N3SLF 3.3NH 0.3NH - 300mA 0.19OHM4.5GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP PILKORELECTRONICS LTD.

6L1004,L1006,L1029


1005GC2T15NJLF 15NH 5% - 250mA 0.53OHM 2GHZ 8SHIELD NONE 1.0X0.5X0.5MM R/TP PILKORELECTRONICS LTD.

6

C1055,C1075,L1023,L1035


1005GC2T2N2SLF 2.2NH 0.3NH - 300mA 0.16OHM6GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP PILKORELECTRONICS LTD.

6

C8553,L1019,L1020,L8056


1005GC2T1N0SLF 1NH 0.3NH - 300mA 0.12OHM 10GHZ8 SHIELD NONE 1.0X0.5X0.5MM R/TP PILKORELECTRONICS LTD.

6 CN402 Connector, BtoB ENBY005120124-5804-080-000-829+ 80P 0.40MM STRAIGHT FEMALESMD R/TP 900mM - KYOCERA ELCO KOREA SALESCO., LTD.

6 J800 Card Socket ENSY0024301 KP09N-6S-2.54SF SIM 6P ANGLE SMD R/TP - HIROSEKOREA CO., LTD

6 SW401 Connector, RF ENWY0003901 U.FL-R-SMT(10) 1.90MM STRAIGHT SOCKET SMDT/REEL CU 50OHM 300mDB HIROSE KOREA CO., LTD

6 SW1000 Connector, RF ENWY0008701 MS-156C NONE STRAIGHT SOCKET SMD T/REEL AU50OHM 400mDB HIROSE KOREA CO., LTD

6 CN701 Connector,Terminal Block ENZY0027601 KQ03LP1-3R 3P 2.50MM STRAIGHT SMD R/TP -

HIROSE KOREA CO., LTD

6 R1002 Resistor, Chip ERHY0000241 MCR01MZP5J102 1KOHM 5% 1/16W 1005 R/TP -ROHM.

6 R16 Resistor, Chip ERHY0000105 MCR01MZP5F51R0 51OHM 1% 1/16W 1005 R/TP -ROHM.

6 R1024 Resistor, Chip ERHY0009311 MCR006YZPF51R0 51OHM 1% 1/20W 0603 R/TP -ROHM.





6

R1009,R1010,R1011,

R1012, R1020

Resistor, Chip ERHY0009504 MCR006YZPJ102 1KOHM 5% 1/20W 0603 R/TP -ROHM.

6 R106,R430 Resistor, Chip ERHY0009506 MCR006YZPJ104 100KOHM 5% 1/20W 0603 R/TP -

ROHM.


6 R1015, R1019 Resistor, Chip ERHZ0000327 MCR01MZSF1800 180OHM 1% 1/16W 1005 R/TP -ROHM.

6 R1021, R1023 Resistor, Chip ERHZ0000408 MCR01MZP5J111 110OHM 5% 1/16W 1005 R/TP -ROHM.

6 R1016, R1018 Resistor, Chip ERHZ0000411 MCR01MZP5J121 120OHM 5% 1/16W 1005 R/TP -ROHM.

6R101,R102,R203



6 C805 Capacitor,Ceramic, Chip ECZH0000816 C1005C0G1H120JT000F 12pF 5% 50V NP0 -55TO+125C



6 R800 Resistor, Chip ERHZ0000485 MCR01MZP5J472 4.7KOHM 5% 1/16W 1005 R/TP -ROHM.


6 R1006, R1007 Resistor, Chip ERHZ0003801 MCR01MZP5J5R1 5.1OHM 5% 1/16W 1005 R/TP -ROHM.

6 U1000 IC, RFTransceiver, 3G EUSY0344001 RTR6285 1.8VTO3V, 2.7VTO3V 500mW QFN R/TP 68P

QUALCOMM INCORPORATED.

6 U700 IC, Over VoltageProtection EUSY0374601 MAX14528 MAX14528, TDFN, 8, R/TP, Programmable

OVP MAXIM INTEGRATED PRODUCTS INC.







6

CN1,CN2,CN3,CN4,CN5,CN6,CN7,CN8

Clip MCGY0003801 COMPLEX LG-KH3900 KTF ZZ:Without Color -

6 R201 Wire Pad, Open SAFO0000501 AX3100 ATL SV_SHIPBACK, MAIN, A, 0OHM_1005_DNI

6 FL1004 Filter, Duplexer,DCN SDDY0005101 B7671 881500000 869 to 894 836500000 824 to 849 2.7

2.1 2.5x2.0x0.68 DUAL SMD R/TP - EPCOS PTE LTD.

6 FL1003 Filter, Duplexer,IMT SDMY0003001

B7697 2140000000 2112.4 to 2167.6 1950000000 1922.4to 1977.6 2.2 1.8 2.5x2.0x0.89 DUAL SMD R/TP - EPCOSPTE LTD.

6 FL1001 Filter, Separator SFAY0012501 D5017 1.5 35 35 , dB, dB, dB, dB, 4532, FEM/SP9T,Supply voltage(2.5V min, 3.2V max) EPCOS PTE LTD.

6 FB1000,FB1001 Filter, Bead SFBH0000903 HB-1M1005-601JT 600 ohm 1.0*0.5*0.5 25% 0.6 ohm

0.3A SMD R/TP 2P 0 CERATECH CORPORATION

6R2,

R335,R4



6 FL700 Filter, EMI/Power SFEY0015301 NFM18PC104R1C3 ESD/EMI 0HZ 0.1uF 0H SMD R/TPMURATA MANUFACTURING CO., LTD.

6 FL1006 Filter, Saw SFSY0028101 SAFEB1G95KA0F00 1950 1.4*1.1*0.6 SMD R/TP 5PMURATA MANUFACTURING CO., LTD.

6 L2, L3,L4, L5

Inductor,Multilayer, Chip ELCH0001430 LL1005-FHLR10J 100NH 5% - 150mA 2.2OHM 1.03GHZ


6 FL1002 Filter, Saw SFSY0028201 SAFEB2G14FB0F00 - - - - 2P MURATAMANUFACTURING CO., LTD.

6 FL1005 Filter, Saw SFSY0029901 SAFEB836MAL0F00 836.5 1.4X1.1X0.6 SMD R/TP 5PMURATA MANUFACTURING CO., LTD.

6 FL1000 Filter, Saw SFSY0038901

SAFEB1G57KB0F00 SAFEB1G57KB0F00, 1575.42 MHz,1.4*1.1*0.6, SMD, 1574.22M~1576.62M, IL 0.8, 5pin, U-U,50-50, GPS LOW LOSS MURATA MANUFACTURINGCO., LTD.

6 U1002 IC, PowerAmplifier SMPY0019101 SKY77336 SKY77336, dBm, %, A, dBc, dB, 5x5, SMD,

Polar Edge for QCT SKYWORKS SOLUTIONS INC.





6 U1003 IC, PowerAmplifier SMPY0022701

SKY77701 28.25 dBm, 40 %, 10 mA, -40 dBc, 27 dB,3.0*3.0*1.0, SMD, WBAND 1, LBAND 1, CPL, 3 MODE,3.2V~4.2V, 28.25dBm, 1, SMD, R/TP, 10, 3.2V~4.2V,28.25dBm, 1, SMD, R/TP, 10 SKYWORKS SOLUTIONSINC.

6 U1004 IC, PowerAmplifier SMPY0023801

SKY77704-15 28.25 dBm, 40 %, 10 mA, -40 dBc, 27 dB,3.0*3.0*1.0, SMD, DCN, WBAND 5, LBAND 5, 8PCL6, 3MODE, 3.2V~4.2V, 28.25dBm, 1, SMD, R/TP, 10PINSKYWORKS SOLUTIONS INC.

6 U1001 IC, RF Amplifier SMZY0025501 RF2815 3.3*2.1*1.0, FILTER+GPS LNA+FILTERMODULE, GPS, RF MICRO DEVICES INC


CL05A106MQ5NUNC 10uF 20% 6.3V X5R -55TO+85C1005 R/TP - SAMSUNG ELECTRO-MECHANICS CO.,LTD.

6

C1072,C702,C800,C801,C803



6 C1031, C1041 Capacitor,Ceramic, Chip ECCH0000143 MCH155CN102KK 1nF 10% 50V X7R -55TO+125C 1005


6

C103,C104,C105,C106,C207





6 C302,C303



6 C1033,C53


GRM188R60J106M 10000000 pF, 6.3V, M, X5R, TC,1608, R/TP, 0.8 mm MURATA MANUFACTURING CO.,LTD.

6 C101,C109

Capacitor,Ceramic, Chip ECCH0004904 GRM155R60J105K 1uF 10% 6.3V X5R -55TO+85C 1005


6

C1024,C1034,C1035,C1091,

C57


CL10A475KP8NNNC 4.7uF 10% 10V X5R -55TO+85C1608 R/TP - SAMSUNG ELECTRO-MECHANICS CO.,LTD.


CL10A106MP8NNNC 10uF 20% 10V X5R -55TO+85C1608 R/TP 0.8MM SAMSUNG ELECTRO-MECHANICSCO., LTD.





6

C112,C113,C114,C117,C638




CL05A225MP5NSNC 2.2uF 20% 10V X5R -55TO+85C1005 R/TP 0.5MM SAMSUNG ELECTRO-MECHANICSCO., LTD.



6 C640 Capacitor,Ceramic, Chip ECCH0009106 C0603X7R1C103KT 10nF 10% 10V X7R -55TO+125C


6

C321,C710,C711,C712,C713

Capacitor,Ceramic, Chip ECCH0009226 GRM0335C1E390J 39pF 5% 25V X7R -55TO+125C 0603



GRM033R71C222K 2.2nF 10% 16V X7R -55TO+125C0603 R/TP - KOREA MURATA ELECTRONICS CO.LTD.

6 C320 Capacitor,Ceramic, Chip ECCH0009203 GRM033R60J333K 33nF 10% 6.3V X5R -55TO+85C


6

C111,C4,

C471,C639



6 C3, C4 Capacitor,Ceramic, Chip ECCH0010501 GRM1555C1H7R5D 7.5pF C0G TYPE(No X7R) MURATA

MANUFACTURING CO., LTD.

6 C434,C749


CL10A226MQ8NRNE 22uF 20% 6.3V X5R -55TO+85C1608 R/TP 0.8MM SAMSUNG ELECTRO-MECHANICSCO., LTD.

6 C205,C212



6 C311 Capacitor, TA,Conformal ECTH0001903

F980J226MMA 22 uF, 6.3V, M, L_ESR, 1608, R/TPNICHICON CORPORATION, EAST JAPAN SALESOFFICE

6 C110 Capacitor, TA,Conformal ECTH0005203 TCTP1A336M8R , [empty] , [empty] , , [empty] , , [empty] ,

[empty] , [empty] , [empty] ROHM.

6 C8544 Capacitor,Ceramic, Chip ECZH0000846 C1005C0G1H8R2CT000F 8.2pF 0.25PF 50V NP0 -


6 C708,C709

Capacitor,Ceramic, Chip ECZH0001217 GRM155R60J474K 470nF 10% 6.3V X5R -25TO+70C

1005 BK-DUP - MURATA MANUFACTURING CO., LTD.







6 C1013, C1052 Capacitor,Ceramic, Chip ECZH0025916 GRM0335C1E330J 33pF 5% 25V NP0 -55TO+125C 0603


6

C25,C301,C304,C322

Capacitor,Ceramic, Chip ECZH0025917 GRM0335C1E470J 47pF 5% 25V NP0 -55TO+125C 0603


6

C30,C31,

C312,C314,C32,C33,C34,

C429,C437,C741,C742,C753

Capacitor,Ceramic, Chip ECZH0025920 GRM033R71C102K 1nF 10% 16V X7R -55TO+125C


6R2,

R335,R4




6 D701 Diode, Switching EDSY0011901 SDB310Q 340mV 30V 200mA 1A 0SEC 150mW EMD2R/TP 2P 1 AUK CORP

6D301,D302,D702

Diode, Switching EDSY0010501 KDS114E 900mV 30V 100mA 1A 0SEC 100mW ESCR/TP 2P 1 KEC CORPORAITION

6 ZD701 Diode, TVS EDTY0008610 PLW0501H-LF 800mV 6V 12.5V 16A 250W SOD523R/TP 2P 1 PROTEK DEVICES INC.

6D201,D202,D204

Diode, TVS EDTY0010101 ESD9B5.0ST5G ESD9B5.0ST5G, SOD-923, 5 V, 300mW, R/TP, 15pF SCG HONG KONG SAR LTD.

6 Q3 FET EQFP0011101

SiA431DJ PowerPAK SC-70-6L-Single, 3.5 W, -20 V, -12A, R/TP, P-CHANNEL, MOSFET, -20 V, +- 8V, -12 A, 0.07OHM, 3.5W, SC70, R/TP, 6P VISHAYINTERTECHNOLOGY ASIA PTE LTD

6 L703,L704

Inductor, WireWound, Chip ELCP0008004

MIP2016D4R7M 4.7UH 30% 0V 900mA 0.16OHM 0HZ 0SHIELD 2.0X1.6X1.0MM NONE R/TP FDKCORPORATION.

6 L8055 Inductor, WireWound, chip ELCP0008001 MIP2520D4R7M 4.7UH 30% 0V 1.1A 0.11OHM 0HZ 0

SHIELD 2.5X2X1MM NONE R/TP FDK CORPORATION.





6 L803 Inductor, WireWound, Chip ELCP0008007 MIPS2520D3R3M 3.3UH 30% - 1A 0.12OHM - - SHIELD

2.5X2X1MM NONE R/TP FDK CORPORATION.

6 L701,L702

Inductor, WireWound, chip ELCP0008012 VLS252012T-4R7MR81 VLS252012T-4R7MR81, 4.7 uH,

M, 2.5*2*1.2, R/TP, Coil TDK CORPORATION

6 L700 Inductor, WireWound, Chip ELCP0011901

CPI2012NHL2R2MT 2.2UH 20% - 800mA 0.25OHM - -SHIELD 2X1.25X1MM NONE - SAMWHA CAPACITORCO, LTD.

6 CN700 connector, I/O ENRY0008701 HSMU-5SB-24DR2 5, mm, ETC HAN SHIN TERMINALCO., LTD.

6 Q1, Q2 TR, Bipolar EQBP0009901 QST4 PNP -6V -15V -12V -6A -0.1A 680 500mW TS6R/TP 6P ROHM.

6 R310 Resistor, Chip ERHY0000104 MCR01MZP5F49R9 49.9OHM 1% 1/16W 1005 R/TP -ROHM.

6 R16 Resistor, Chip ERHY0000105 MCR01MZP5F51R0 51OHM 1% 1/16W 1005 R/TP -ROHM.

6 R722 Resistor, Chip ERHY0000161 MCR01MZP5F2003 200KOHM 1% 1/16W 1005 R/TP -ROHM.

6 R14 Resistor, Chip ERHY0008207 RC1005F470CS 47OHM 1% 1/16W 1005 R/TP -SAMSUNG ELECTRO-MECHANICS CO., LTD.

6 R711 Resistor, Chip ERHY0009303 MCR006YZPF1002 10KOHM 1% 1/20W 0603 R/TP -ROHM.


6 R1024 Resistor, Chip ERHY0009311 MCR006YZPF51R0 51OHM 1% 1/20W 0603 R/TP -ROHM.

6R306,R315,R316

Resistor, Chip ERHY0009503 MCR006YZPJ101 100OHM 5% 1/20W 0603 R/TP -ROHM.

6 R703,R704 Resistor, Chip ERHY0009539 MCR006YZPF20R0 20OHM 1% 1/20W 0603 R/TP -

ROHM.

6

R1009,R1010,R1011,

R1012, R1020

Resistor, Chip ERHY0009504 MCR006YZPJ102 1KOHM 5% 1/20W 0603 R/TP -ROHM.


6 R724,R725 Resistor, Chip ERHY0009550 MCR006YZPF4702 47KOHM 1% 1/20W 0603 R/TP -

ROHM.





6

R104,R105,R402,R403,R623

Resistor, Chip ERHY0009526 MCR006YZPJ472 4.7KOHM 5% 1/20W 0603 R/TP -ROHM.



6 R8522, R8523 Resistor, Chip ERHY0009586 MCR006YZPF2201 2.2KOHM 1% 1/20W 0603 R/TP -ROHM.


6 R308 Resistor, Chip ERHY0024201 RC1005F6041CS 6.04KOHM 1% 1/16W 1005 R/TP -SAMSUNG ELECTRO-MECHANICS CO., LTD.

6 R8519, R8520 Resistor, Chip ERHY0024601 RC0603J151CS 150OHM 5% 1/20W 0603 R/TP -SAMSUNG ELECTRO-MECHANICS CO., LTD.


ROHM.

6 R705 Resistor, Chip ERHZ0000243 MCR01MZP5F2201 2.2KOHM 1% 1/16W 1005 R/TP -ROHM.


6 R720 Resistor, Chip ERHZ0000318 MCR01MZP5F8062 80.6KOHM 1% 1/16W 1005 R/TP -ROHM.

6 R301,R600 Resistor, Chip ERHZ0000405 MCR01MZP5J103 10KOHM 5% 1/16W 1005 R/TP -

ROHM.

6 R706,R707 Resistor, Chip ERHZ0000437 MCR01MZP5J202 2KOHM 5% 1/16W 1005 R/TP -

ROHM.


6R101,R102,R203



6 R800 Resistor, Chip ERHZ0000485 MCR01MZP5J472 4.7KOHM 5% 1/16W 1005 R/TP -ROHM.






6 C706,C707


GRM033R60J473KE19D 47nF 10% 6.3V X5R -55TO+85C 0603 R/TP - MURATA MANUFACTURINGCO., LTD.


6 R713 Resistor, Chip ERHZ0003901 RC2012FR100CS 0.1OHM 1% 1/8W 2012 R/TP -SAMSUNG ELECTRO-MECHANICS CO., LTD.

6 R715 Resistor, Chip ERHZ0004201 RC1005F1213CS 121KOHM 1% 1/16W 1005 R/TP -SAMSUNG ELECTRO-MECHANICS CO., LTD.

6 U301 IC, MCP, NOR EUSY0216301 NC7SV00P5X_NL SC70 , 5 PIN, R/TP , Single 2-InputNAND Gate FAIRCHILD SEMICONDUCTOR

6 U1005 IC, Fuel Gauge EUSY0242303MAX17040G DFN, 8, R/TP, Fuel gauge, IC, CMOSIC,CMOS - - DFN R/TP 8P - MAXIM INTEGRATEDPRODUCTS INC.

6 U704 IC, PMIC EUSY0342201 PM7540 -0.5~18 N/A 0W CSP R/TP 137P - QUALCOMMINCORPORATED.

6 IC1 IC, MUIC EUSY0372001TS5USBA33402YZPR TS5USBA33402, MUIC WCSPR/TP 20P TEXAS INSTRUMENTS KOREA LTD,HONGKONG BRANCH.

6 U302IC, DigitalBasebandProcessor, 3G

EUSY0392302 MSM7227 0VTO0V 0W 560P - BGA R/TP 560PQUALCOMM INCORPORATED.

6 U701 IC, Audio SubSystem EUSY0403901 WM9093ECS/R 1.71~5.5V 0W WLCSP R/TP 20P -

WOLFSON MICROELECTRONICS PLC



6 U801 IC, AccelerationSensor EUSY0407801

KR3DM LGA16, 16, R/TP, 3-Axis G-Sensor, IC, A/DConverterIC, A/D Converter - LGA R/TP 16P - STMICROELECTRONICS

6 U300 IC, Flip Flop EUSY0408201 74LVC1G79GM 1.65~5.5V - D FLIP-FLOP SOT R/TP 6P -STC CORP.

6 X300 Oscillator,VCTCXO EXSK0008901 KT3225L19200DCW28RA0 19.2MHZ 2PPM 2.8V

0.0x0.0x0.0MM NONE SMD R/TP KYOCERA CORP.

6 U400 MCP EUSY0430901

MT29C8G96MAZAPDJA-5 IT FBGA , 137 , ETC , 1.8V8G(LB/512Mx16)NAND+4G(DDR400/16Mx4x32*2_2CS)DRAM , ; , IC, MCP MICRON SEMICONDUCTOR ASIAPTE LTD.

6 R801 Resistor, Chip ERHY0011601 MCR01MZP5F1102 11KOHM 1% 1/16W 1005 R/TP -ROHM.

6 X800 Oscillator, TCXO EXST0001901 TG-5010LH-87N 26MHZ 2.5PPM 2.8V 32.0x25.0x10.0MM- SMD R/TP EPSON TOYOCOM CORP





6 VA305 Varistor SEVY0008101 EVLC5S01033 EVLC5S01033, 5.5 V, , SMD , 0603AMOTECH CO., LTD.

6 X700 Crystal EXXY0018701 FC-135(12.5PF, +-20PPM) 32.768KHZ 20PPM 12.5PF32*15 SMD R/TP SEIKO EPSON CORP

6 R12, R4PCB ASSY,MAIN, PADOPEN

SAFO0000401 AX3100 ATL SV_SHIPBACK, MAIN, A, 0OHM DNI

6 VA700 Varistor SEVY0003601 ICVL0505101V150FR 5.6V 0% 60F 1.0*0.5*0.55 NONESMD R/TP INNOCHIPS TECHNOLOGY

6

VA300,VA301,VA302,VA303,VA304

Varistor SEVY0007902 ICVS0305500FR ICVS0305500FR, 5.6 V, M , SMD , 0603SIZE INNOCHIPS TECHNOLOGY

6 FB8501 Filter, Bead SFBH0008101BLM15AG601SN1D 600 ohm 1.0X0.5X0.5 25% 0.6 ohm0.3A SMD R/TP 2P 0 MURATA MANUFACTURING CO.,LTD.

6 FB701 Filter, Bead SFBH0009801 HH-1M1005-601JT_1 600 ohm 1.0X0.5X0.5 25% 0.6 ohm0.5A SMD P/TP 2P 0 CERATECH CORPORATION

6 U800 Module, WLAN SMZY0024901 LBEH19UNBC-338 2.3VTO5.5V LGA 54P 9.0x7.8x1.3MMMURATA MANUFACTURING CO., LTD.






2 SBPL00RechargeableBattery, LithiumIon

SBPL0102103 LGIP-590F-TO-DCM 3.7 V, 1350 mAh, 1 CELL,PRISMATIC, PRISMATIC, BLACK, TOCAD DONGHWA

2 MBM087201 Card, Warranty MBM63220002 COMPLEX L03C.ANTTBK ZZ:Without Color micro SDWarranty

2 MBM087200 Card, Warranty MBM63220301 COMPLEX L04C.ANTTBK ZZ:Without Color -

2 AFN053800 Manual Assembly,Operation - AFN75293501 L04C.ANTTBK ZZ:Without Color -

3 MBM062602 Card, QuickReference MCDD0031510 COMPLEX L-04B NTTBK ZZ:Without Color PRINTING,

(empty), , , , ,

3 MBM062604 Card, QuickReference MBM63296001 COMPLEX L03C.ANTTBK ZZ:Without Color -

3 MBM062603 Card, QuickReference MCDD0031511 COMPLEX L04C.ANTTBK ZZ:Without Color PRINTING,

(empty), , , , ,

3 MFL053802 Manual, Operation MFL66994405 COMPLEX L04C.ANTTBK ZZ:Without Color -



2 EBX000000 Accessory,Gender SGDG0002901 BRHA-1010C-05A - - BARONICS CO., LTD.

2 EAB010200 Earphone, Stereo SGEY0007603

HC-MYO-LG058 HC-MYO-LG058, 20mW, 16Ohm, 99dB,1KHZ, 1mW, 65dB 10KHZ, 104dB 100KHZ3.5 L TYPESTEREO 4POLE PLUG, Deco canal(white), Earphone, SteI-SOUND CO, LTD

2 EBX000001 Accessory, DataCable SGDY0019301 KCA-ET-8-0210 , 0.5M, BLACK, Without LG Logo, Micro

USB Data Cable, N KSD CO., LTD

11.3 Accessory Note: This Chapter is used for reference, Part order is ordered

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