Internal Use Only
Service ManualL-04C
Date: January, 2011 / Issue 1.0
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1. INTRODUCTION
Table Of Contents
1. INTRODUCTION ..................................................................... 3
1.1 Purpose ........................................................................................................3
1.� Regulatory Information .........................................................................3
1.3 Abbreviations.............................................................................................5
2. PERFORMANCE ...................................................................... 7
�.1 The Name of the Product ......................................................................7
�.� Objectives ....................................................................................................7
�.3 Product Outline .........................................................................................7
�.4 Application Range ...................................................................................7
�.5 Terms of Definition ..................................................................................8
�.6 Product Condtitution .............................................................................9
�.7 Electrical Characteristics ..................................................................... 11
3. TECHNICAL BRIEF ................................................................ 25
3.1 General Description ............................................................................. �5
3.� GSM Mode ................................................................................................ �7
3.3 UMTS Mode ............................................................................................. 31
3.4 LO Phase-locked Loop ......................................................................... 35
3.5 Off-chip RF Components ................................................................... 36
3.6 Digital Baseband(DBB/MSM7��7) .................................................. 53
3.7 Modem system / subsystem ............................................................. 56
3.8 Power Block ............................................................................................. 65
3.9 Memory Support ................................................................................... 77
3.10 H/W Sub System .................................................................................. 8�
3.11 Main features ......................................................................................110
3.1� RF Component ...................................................................................111
3.13 Main Component..............................................................................113
4. TROUBLE SHOOTING ........................................................ 122
4.1 Checking VCXO Block ........................................................................1��
4.� Checking FEM SW Block ...................................................................1�3
4.3 Checking UMTS Block ........................................................................1�5
4.4 Checking GSM Block ..........................................................................134
4.5 GPS ............................................................................................................138
4.6 Bluetooth/WLAN OFF-CHIP RF COMPONENTS .......................140
4.7 GPS, Wi-Fi/BT RF COMPONENTS ....................................................146
4.8 GPS, Wi-Fi/BT SIGNAL PATH .............................................................149
4.9 GPS, BT/Wi-Fi TROUBLE SHOOTING .............................................151
4.10 Power ONTroubleshooting ...........................................................156
4.11 Charger Troubleshooting ..............................................................159
4.1� USB Troubleshooting ......................................................................16�
4.13 RUIM Detect Troubleshooting .....................................................165
4.14 3 Mega Camera Troubleshooting...............................................167
4.15 Keypad Backlight Troubleshooting ...........................................170
4.15 Keypad Backlight Troubleshooting ...........................................17�
4.16 Main LCD Troubleshooting ...........................................................174
4.17 Receiver Path ......................................................................................175
4.18 Headset path ......................................................................................178
4.19 Speaker phone path ........................................................................181
4.�0Main microphone ..............................................................................184
4.�1 Headsetmicrophone .......................................................................186
4.�� Vibrator .................................................................................................188
4.�3 SD card operation .............................................................................190
4.�4 Touch Troubleshootingz ................................................................193
4.�5 Proximity Sensor Troubleshooting ............................................195
4.�6 Digital Compass Troubleshooting .............................................197
5. DOWNLOAD ....................................................................... 199
6. BLOCK DIAGRAM ............................................................... 212
7. CIRCUIT DIAGRAM ............................................................ 224
8. BGA Pin Map ...................................................................... 237
9. PCB LAYOUT ....................................................................... 244
10. CALIBRATION ................................................................... 252
10.1 Introduction ........................................................................................�5�
10.� Terminology ........................................................................................�5�
10.3 Installation ...........................................................................................�5�
10.4 Tachyon Start ......................................................................................�55
10.5 Tachyon Main UI ................................................................................�58
10.6 Functional explain ............................................................................�63
11. EXPLODED VIEW & REPLACEMENT PART LIST ............. 281
11.1 EXPLODED VIEW ................................................................................�81
11.� Replacement Parts ...........................................................................�8�
11.3 Accessory .............................................................................................310
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1.1 PurposeThis manual provides the information necessary to repair, calibration, description and download the features of this model.
1.2 Regulatory InformationA. Security
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example, persons other than your company’s employees, agents, subcontractors, or person working on your company’s behalf) can result in substantial additional charges for your telecommunications services. System users are responsible for the security of own system. There are may be risks of toll fraud associated with your telecommunications system. System users are responsible for programming and configuring the equipment to prevent unauthorized use. The manufacturer does not warrant that this product is immune from the above case but will prevent unauthorized use of common-carrier telecommunication service of facilities accessed through or connected to it.
The manufacturer will not be responsible for any charges that result from such unauthorized use.
B. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and possibly causing harm or interruption in service to the telephone network, it should disconnect telephone service until repair can be done. A telephone company may temporarily disconnect service as long as repair is not done.
C. Changes in Service
A local telephone company may make changes in its communications facilities or procedure. If these changes could reasonably be expected to affect the use of the this phone or compatibility with the network, the telephone company is required to give advanced written notice to the user, allowing the user to take appropriate steps to maintain telephone service.
D. Maintenance Limitations
Maintenance limitations on this model must be performed only by the manufacturer or its authorized agent. The user may not make any changes and/or repairs expect as specifically noted in this manual. Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system and may void any remaining warranty.
1. INTRODUCTION
1. INTRODUCTION1. INTRODUCTION
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1. INTRODUCTION
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E. Notice of Radiated Emissions
This model complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user.
F. Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly different.
G. Interference and Attenuation
Phone may interfere with sensitive laboratory equipment, medical equipment, etc.Interference from unsuppressed engines or electric motors may cause problems.
H. Electrostatic Sensitive Devices
ATTENTION
Boards, which contain Electrostatic Sensitive Device (ESD), are indicated
by the sign. Following information is ESD handling:
• Service personnel should ground themselves by using a wrist strap when exchange system boards.
• When repairs are made to a system board, they should spread the floor with anti-static mat
which is also grounded.
• Use a suitable, grounded soldering iron.
• Keep sensitive parts in these protective packages until these are used.
• When returning system boards or parts like EEPROM to the factory, use the protective
package as described.
2. INTRODUCTION
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1.3 AbbreviationsFor the purposes of this manual, following abbreviations apply:
Offset Phase Locked LoopOPLL
Light Emitting DiodeLED
Low Drop OutputLDO
Liquid Crystal DisplayLCD
Intermediate FrequencyIF
International Portable User IdentityIPUI
Global System for Mobile CommunicationsGSM
General Purpose Interface BusGPIB
Gaussian Minimum Shift KeyingGMSK
Flexible Printed Circuit BoardFPCB
Electrostatic DischargeESD
Electrical Erasable Programmable Read-Only MemoryEEPROM
Digital Signal ProcessingDSP
dB relative to 1 milli wattdBm
Digital Communication SystemDCS
Digital to Analog ConverterDAC
Constant Current – Constant VoltageCC-CV
Bit Error RatioBER
BasebandBB
Automatic Power ControlAPC
1. INTRODUCTION
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Wireless Application ProtocolWAP
Voltage Control Temperature Compensated Crystal OscillatorVCTCXO
Voltage Controlled OscillatorVCO
Universal Asynchronous Receiver/TransmitterUART
Time Division Multiple AccessTDMA
Time Division DuplexTDD
Travel AdapterTA
Side Tone Masking RatingSTMR
Pseudo SRAMPSRAM
Static Random Access MemorySRAM
Sending Loudness RatingSLR
Subscriber Identity ModuleSIM
Surface Acoustic WaveSAW
Real Time ClockRTC
Root Mean SquareRMS
Receiving Loudness RatingRLR
Radio FrequencyRF
Public Switched Telephone NetworkPSTN
Phase Locked LoopPLL
Programmable Gain AmplifierPGA
Printed Circuit BoardPCB
Power Amplifier ModulePAM
1. INTRODUCTION
2. PERFORMANCE
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2 1 The Name of the Product2.1 The Name of the Product
This product is Android OS Smart phone which has GSM/GPRS/WCDMA dual mode of GSM/GPRS form and wireless connection/WCDMA FDD form, called L-04C.
2.2 Objectives
The objective of L-04C, Japan 3G Android Smart phone, is to pursue Total Information & Entertainment StationThe objective of L 04C, Japan 3G Android Smart phone, is to pursue Total Information & Entertainment Station through Mobile Multimedia, satisfying UMTS release 5 Version.
2.3 Product Outline
1. WCDMA / GSM (EGSM,DCS,PCS) Dual Mode2. HSDPA (Category 8 – Up to 7.2Mbps) + HSUPA (Category 5 – Up to 2Mbps)3. GPS, Bluetooth 2.1+EDR, Wi-fi 802.11 b/g3. G S, B uetoot . D , 80 . b/g4. Android 2.2 (Froyo) OS5. 8Gbits NAND + 4Gbits DDR SDRAM6. Slide Qwerty Keypad7. 3.2” HVGA 320(RGB) X 480 TFT LCD8. 3.1Mega Pixel CMOS AF Camera9. Capacitive Full Touch Window10. External Micro-SD (Up to 32GB) Memory Support11. USB 2.0 Hi-Speed12. 18X10 Type Speaker , Q-Coin Motor13. Proximity Sensor, Acceleration Sensor14. Digital Compass15. 3.5Φ Stereo Headset16. 5 pin Standard MicroUSB Connector
2.4 Application Range
1. Phone2. Battery (1,350mAh)3. Battery Cover4. Charging Gender (Arib to MicroUSB)5. Stereo Earmic Set6 USB C bl6. USB Cable
2. PERFORMANCE
2. PERFORMANCE
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2.5 Terms of Definition2.5 Terms of Definition
1. GSM(Global System for Mobile): The standard digital cellular system in Europe, Asia, and other parts of the world. It is a variation on TDMA, with a data transfer rate of 9.6Kbps.
2. GPRS(General Packet Radio Services): General packet radio service (GPRS) is a packet oriented mobile data service available to users of the 3G cellular communication systems. GPRS allows a data transmission rate of up to 171.2 kbps and is suitable for internet access.
3 DBB(Di i l B B d) Th l i d i l di P f i S i id l d3. DBB(Digital Base Band): The control unit product including Processor for use in Set inside control and the DSP which operate GSM algorithm.
4. ABB (Analog Base Band processor): Transmission and reception of Baseband, Supporting control parts keeping input and output of Voice band (a mic, speaker connection) and ADC are included.
5. Memory: All S/W including protocol, User Interface is stored, and to apply.
6. USIM(Universal Subscriber Identity Module): USIM is part of a removable smart card ICC (Integrated Circuit Card), is stored personal information. So, Even if user use other mobile phone, not user’s own mobile phone, it can be used if USIM is in it.
7. RF Transceiver: This component has Low noise signal amplifier (LNA) of the reception first grade,Mixer which mixes a signal, module in Transmission and reception part including A Programmable amplifier and IQ strange demodulators.
8. VCTCXO(Voltage Controlled Temperature Compensated Crystal Oscillator): A voltage controlled / temperature compensated crystal oscillators are used in applications that require excellent phase noisetemperature compensated crystal oscillators are used in applications that require excellent phase noise performance.
9. PLL (Phase Locked Loop): A circuit that consists essentially of a phase detector which compares the frequency of a voltage-controlled oscillator with that of an incoming carrier signal or reference-frequencygenerator.
10. VCO (Voltage Controlled Oscillator): An oscillator that can be tuned over a wide range of frequencies by applying a voltage (tuning voltage) to it. Used in many applications such as radio tuners, y pp y g g ( g g ) y pp ,VCOs are less costly than crystal oscillators, but not as stable. Contrast with crystal oscillator.
11. SAW (Surface Acoustic Wave) Filter: A semiconductor device that is used to filter out desired frequencies. Widely used in mobile phones to filter both RF and IF frequencies, a SAW filter uses the piezoelectric effect to turn the input signal into vibrations that are turned back into electrical signals in the desired frequency range.
12. PAM (Power Amplifier Module): PAM is a form of signal modulation where the message information is encoded in the amplitude of a series of signal pulses.
13. APC(Automatic Power Control): A signal level of PAM is adjusted precisely.
14. FEM (Front End Module): The switch which chooses transmission and reception of wireless signal and a frequency band.
2. PERFORMANCE
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15. UMTS(Universal Mobile Telecommunication System): UMTS is one of the third-generation (3G) mobile15. UMTS(Universal Mobile Telecommunication System): UMTS is one of the third generation (3G) mobile telecommunications technologies.
16. WCDMA(Wide-band Code Division Multiple Access): WCDMA has been designed for high speed dataservices and, more particularly, Internet-based packet-data, offering up to 2Mbps in stationary or officeenvironments and up to 384Kbps in wide area or mobile environments.
2.6 Product Condtitution
2.6.1 A Whole Product Appearance
2. PERFORMANCE
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2 6 2 Basic Constitution of a Product2.6.2 Basic Constitution of a Product
Item Type / Spec Function Explanation & Characteristics
1. Battery Li-Ion 564447 Cell, 1,350mAhCharging Voltage : 4.2V (Typical)1350mAh,5.0Mh/3.7V , L10
2. Charging Gender 5.4V Input , 4.6V Output DoCoMo TA Charging Gender
3. Battery Cover
4. Ear_Mic 3.5Φ Stereo Earphone, Carnal , Stereo Headset, Headset call,Ear Hook
5. USB Data Cable MicroUSB 5 pin USB data Communication
6. Micro SD Card 2GB Micro SD Memory User Data storage
7. Manual User Manual
* L-04C Uses NTT DoCoMo Standard Travel Adapter and Other Accessary. Which are not Provided.
2. PERFORMANCE
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2.7 Electrical Characteristics2.7 Electrical Characteristics
It depends on a national (Japan and Pan-Europe, the Americas) electric characteristic standard (a form approval standard).
2.7.1 System Outline
List Type / Spec.
1. Phone Type Full Touch Qwerty Slide
2. Size 116 x 58 x 15.3(mm)
3. Weight 149g
4. Battery 1,350mAh (Li-Ion)
5. MSM chipset MSM7227, RTR6285, PM7540
6 M 8Gb(N d Fl h) / 4Gb(SDRAM)6. Memory 8Gb(Nand Flash) / 4Gb(SDRAM)
7. OS Android 2.2 (Froyo)
8. LCD Size 3.2 inch
Dot 320(RGB) X 480
Color 16,777,216 Colors
Display Type Transmissive,Normally Black,p y yp yIn-Plane Switching.
NTSC 70% (typ.)
Contrast Ratio 500 (typ.)
Pixel Pitch 0.141mm
9. Camera (3M) Type CMOS image sensor
R l ti (Eff ti ) 2072(H) X 1552(V) i lResolution (Effective)(Output)
2072(H) X 1552(V) pixels.2048(H) X 1536(V) pixels.
Frame Rate Max 15 (QXGA) fps
Digital Zoom 3M,2M,1M, VGA, QVGA (X9)
Image Scaling Down 3M,2M,1M, VGA, QVGA
Moving Picture
10. Audio 1) Speaker 18X10 Speaker/Receiver Dual Mode
2) Mic SMD type
3) Headset 3.5Φ Stereo Headset and Mic.
2. PERFORMANCE
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Li t T / S
12. Bluetooth Effective Distance 10M
13. WLAN Spec. IEEE 802.11b/g
Throughput MAX 4Mbps (Depends on SDIO Driver Perfornance)
11. Motor 10 Φ Q-Coin Motor
List Type / Spec.
Effective Distance 50 ~ 200m (Depends on Environment)
14. GPS
2.7.2 Using Condition
) Ph U i E i
Item Spec. Unit
Using Voltage 3.7 (Typ.), 4.2 (Max.) V
Using Temp. -20 ~ + 60 ℃
Store Temp. -30 ~ + 85 ℃
1) Phone Using Environment
Humidity 0 ~ 80 %
Item Spec.
Input Voltage AC 100 ~ 240V,50~ 60Hz
2) TA Using Environment
2. PERFORMANCE
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2 7 3 wireless characteristic2.7.3 wireless characteristic
wireless characteristic follows GSM Approval examination Specification(ETSI EN 300 607 11.10)
1) Electrical Characterisrics of WCDMA Transmission Part.
Item Spec. Min Typ. Max Unit
Maximum Output Power Power class Ⅲ 21.0 24 25.0 dBm/3.84MHzPower
Frequency Accuracy 0.1 ppm -200 - +200 Hz
Minimum Output Power
- - - -50 dBm/3.84MHz
Occupied Bandwidth - - - 4.6 MHz
Adjacent Channel Leakage Power Ratio
Δf = 5MHz - - -33 dBm/3.84MHz
Δf = 10MHz - - -43 dBm/3.84MHz
Error Vector Magnitude(EVM) - - - 17 %
Peak Code Domain Error - - - 15 dBm/3.84MHz
Open LoopOutput Power
Ior =-106.7dBm/3.84MHz -46.7 - -28.7 dBm/3.84MHz
Ior =-65.7dBm/3.84MHz -23.0 - -5.0 dBm/3.84MHz
Ior =-25.0dBm/3.84MHz -0.0 - 14.0 dBm/3.84MHz
Transmit Off Power - - - -56 dBm/3.84MHz
Δf = 2.5~3.5MHz -35-15 * (Δf-2.5) dBc/30KHz
Spectrum Emission Mask
Δf = 3.5~7.5MHz -35-1 * (Δf-3.5) dBc/1MHz
Δf = 7.5~8.5MHz -39 10 * (Δf-7.5) dBc/1MHz
Δf = 8.5~12.5MHz -49 dBc/1MHz
Transmit Spurious
9kHz ~ 150kHz -36 dBm
150kHz ~ 30MHz -36 dBm
Emission 30MHz ~ 1GHz -36 dBm
1GHz ~ 12.5GHz -30 dBm
2. PERFORMANCE
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2) Electrical Characterisrics of WCDMA Reception Part.2) Electrical Characterisrics of WCDMA Reception Part.
Item Spec. Min Typ. Max Unit
Reference Sensitivity Level
BER < 0.1% - - -106.7 dBm/3.84MHz
MaximumInput Level
Pin = -25dBm - - 0.1 BER(%)
Adjacent Channel Selectivity(ACS)
Jammer(Modulation)= -52dBm/3.84MHzΔf = 5MHzBER < 0.001%
- - -103 dBm/3.84MHz
In Band Blocking
Jammer(Modulation)= -56dBm/3.84MHzΔf = 10MHzBER < 0.001%
- - -103.7 dBm/3.84MHz
Jammer(Modulation)Jammer(Modulation)= -44dBm/3.84MHzΔf = 15MHzBER < 0.001%
- - -103.7 dBm/3.84MHz
Inter-modulationDesensitization
Jammer1(CW)= -46dBmJammer2(Modulation)= -46dBm/3.84MHzΔf= 10MHzBER < 0.001%
- - -103.7 dBm/3.84MHz
Jammer1= -46dBm(CW)( )Jammer2(Modulation)= -46dBm/3.84MHzΔf= 20MHzBER < 0.001%
- - -103.7 dBm/3.84MHz
30kHz ~ 1GHz - - -57 dBm/30kHz
1GHz ~ 1.92GHz - - -47 dBm/1MHz
G G dB /Spurious Emissions
1.92GHz ~ 1.98GHz - - -60 dBm/3.84MHz
1.98GHz ~ 2.11GHz - - -47 dBm/3.84MHz
2.11GHz ~ 2.17GHz - - -60 dBm/3.84MHz
2.17GHz ~ 12.75GHz - - -47 dBm/1MHz
2. PERFORMANCE
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3) Electrical Characterisrics of HSDPA Transmission and ReceptionPart.3) Electrical Characterisrics of HSDPA Transmission and ReceptionPart.
Item Spec. Min Typ. Max Unit
5.2.A Maximum Output Power with HS-DPCCH
1/15 c/d 12/1513/15 c/d 15/815/7 c/d 15/0
212019
2322.522
252525
dBm/3.84MHz
5.7A HS-DPCCHMAX /0dBm
Step 0 0 dBm +/- 1 dB dB
Step 1 – Step 0 6 dB +/- 2.3 dB dB
Step 2 – Step 3 1 dB +/- 0.6 dB dB
Step 5 – Step 4 0 dB +/- 0.6 dB dB
Transmission
Step 6 – Step 7 5 dB +/- 2.3 dB dB
5.9A Spectrum Emission Mask with HS-DPCCH
Δf = 2.5~3.5MHz -35-15 * (Δf-2.5) dBc/30KHz
Δf = 3.5~7.5MHz -35-1 * (Δf-3.5) dBc/1MHz
Δf = 7.5~8.5MHz -39 10 * (Δf-7.5) dBc/1MHz
Δf = 8.5~12.5MHz -49 dBc/1MHz
5.10A Adjacent Channel Leakage Power Ratio with HS-DPCCH
Δf = 5MHz - - -33 dBm/3.84MHz
Δf = 10MHz - - -43 dBm/3.84MHz
5 13 1A Error Vector5.13.1A Error Vector Magnitude (EVM) with HS-DPCCH
MAX Power-20 dBm
- - 17.5 %
Reception
6.3A MaximumInput Level for HS-PDSCH Reception
Pin = -25dBm - - 10 BLER(%)
2. PERFORMANCE
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4) Electrical Characterisrics of GSM Transmission and Reception Part.
Item Spec.
Phase ErrorRms : 5°Peak : 20 °
Frequency ErrorGSM : 0.1 ppmDCS/PCS : 0.1 ppm
4) Electrical Characterisrics of GSM Transmission and Reception Part.
EMC(Radiated Spurious Emission Disturbance) GSM/DCS : < -28dBm
Transmitter Output power and Burst TimingGSM : 5dBm – 33dBm ± 3dBDCS/PCS : 0dBm – 30dBm ± 3dB
Burst Timing <3.69us
Spectrum due to modulation out to less than kH ff
200kHz : -36dBm1800kHz offset 600kHz : -51dBm/-56dBm
Spectrum due to modulation out to larger than 1800kHz offset to the edge of the transmit band
GSM : 1800-3000kHz :< -63dBc(-46dBm)3000kHz-6000kHz : <-65dBc(-46dBm)6000kHz < : < -71dBc(-46dBm)DCS :1800-3000kHz :< -65dBc(-51dBm)6000kHz < : < -73dBc(-51dBm)
Spectrum due to switching transient400kHz : -19dBm/-22dBm(5/0), -23dBm600kHz : -21dBm/-24dBm(5/0), -26dBm
Reference Sensitivity – TCH/FS Class II(RBER) : -105dBm(2.439%)
Usable receiver input level range 0.012(-15 - -40dBm)
I d l i j i S h h l± 800kHz, ± 1600kHz
Intermodulation rejection – Speech channels,
: -98dBm/-96dBm (2.439%)
AM Suppression-GSM : -31dBm - DCS : -29dBm
-98dBm/-96dBm (2.439%)
Timing Advance ± 0.5T
- Frequency Range : GSM(880~915MHz/925~960MHz), DCS(1710~1785MHz/1805~1880MHz)PCS (1850~1910MHz/1830~1990MHz)
- Local Oscillation Frequency Range : 1688 ~ 1736 MHz- IF : zero IF- Rated MAX Power : 1995.3 mW(33dBm)
2. PERFORMANCE
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5) Electrical Characterisrics of Bluetooth Transmission5) Electrical Characterisrics of Bluetooth Transmission
Item Spec. Min Typ. Max Unit
Output Power DH5PRBS9
Nominal Pwr -6 - +4 dBm
Peak Pwr - - +23 dBm
Power Density DH5 @100kHz BW +20 dBmPower Density PRBS9 @100kHz BW - +20 dBm
Frequency Range DH5PRBS9
-30dBm@100kHz BW
2400 - 2483 MHz
Tx Output Spectrum(20dB BW)
DH5PRBS9 Δf =fH-fL - 1 MHz
Tx Output Spectrum(Adj t O t t DH5 @M-N = 2 - -20 dBm(Adjacent Output Power)
D 5PRBS9 @M-N >= 3 - -40 dBm
Modulation Index
DH511110000 f1AVG 140 - 175 kHz
DH510101010
f2MAX 115 - kHz
f2AVG/f1AVG 0.8 -
Initial Carrier Freq.Tolerance
DH5PRBS9 -75 - +75 kHz
Carrier Frequency Drift
DH110101010
Freq. Drift -25 - +25 kHz
Drift Rate -20 - +20 kHz/50us
DH3 Freq. Drift -40 - +40 kHzCarrier Frequency Drift 10101010 Drift Rate -20 - +20 kHz/50us
DH510101010
Freq. Drift -40 - +40 kHz
Drift Rate -20 - +20 kHz/50us
Out of Band Spurious Emission
DH1PRBS9 @ 30MHz ~ 12.75GHz 20 dBc
★ Gray Items cannot be measured now.
2. PERFORMANCE
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6) Electrical Characterisrics of Bluetooth Reception Part6) Electrical Characterisrics of Bluetooth Reception Part
Item Spec. Min Typ. Max Unit
Sensitivity(Single Slot Packet)
DH1PRBS9 BER @ 0.1% - -70 dBm
Sensitivity(Multi Slot Packet)
DH5PRBS9 BER @ 0.1% - -70 dBm
C/I Performance DH1
Co-Channel-60dBm@ BER0.1%
- 11
dB
C/I @1MHz-60dBm@ BER 0.1%
- 0
C/I @2MHz-60dBm@ BER 0.1%
- -30
C/I Performance PRBS9 dBC/I @≥3MHz-67dBm@ BER0.1%
- -40
C/I @Image-67dBm@ BER 0.1%
- -9
C/I @1MHz Image-67dBm@ BER 0.1%
- -20
Blocking Performance DH1PRBS9
-10dBm @30M ~2 GHz
- -67 dBm
-27dBm @2 ~ 2.4 GHz
-27dBm @2.5 ~ 3 GHz
-10dBm @10dBm @3 ~ 12.75 GHz
Intermodulation Performance DH1PRBS9
Δf = +5MHz (CW)Δf = +10MHz (BT)BER @ 0.1%
- -64 dBm
Δf = -5MHz (CW)Δf = -10MHz (BT)BER @ 0 1%
- -64 dBmBER @ 0.1%
Maximum Input Level DH1PRBS9 BER @ 0.1% -20 - dBm
★ Gray Items cannot be measured now.
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8) Electrical Characterisrics of GPS Reception Part
★ Referred to Qualcomm A-GPS Specification
8) Electrical Characterisrics of GPS Reception Part
Item Spec.
Radiated C/No C/No ≥ 34dB
Calculated TIS -149dBm / Hz
p
Item Specification
Transmit Frequency 2400 MHz ~ 2483.5 MHz ( CH1~CH13 )
9) Electrical Characteristics of WLAN 802.11b Transmission and Receptioin Part
Tx Power Level ≤ 20dBm under (Europe), ≤ 30dBm under (USA)
Frequency Tolerance within ±25 PPM
Chip clock FrequencyTolerance
within ±25 PPM
Spectrum Mask ≤ -30 @ fc-22MHz< f <fc-11MHz and fc+11MHz< f <fc+22MHz≤ -50 @ f < fc-22MHz and f > fc+22MHz
Power ramp on/off time ≤ 2us
Carrier Suppression ≤ -15dB
Modulation Accuracy(Peak EVM)
≤ 35%
Spurious Emissions < -36 dBm @ 30MHz ~ 1GHz < -30 dBm above @ 1GHz ~ 12.75GHz < -47 dBm @ 1.8GHz ~ 1.9GHz < -47 dBm @ 5.15GHz ~ 5.3GHz
Rx Min input Sensitivity ≤ -76dBm(1Mbps,2Mbps,5.5Mbps,11Mbps) @ FER ≤ 8%
Rx Max input Sensitivity ≥ -10dBm(1Mbps,2Mbps,5.5Mbps,11Mbps) @ FER ≤ 8%
Rx Adjacent ChannelRejection
≥ 35dB @FER ≤ 8%,interference input signal -70dBm@fc±25MHz(11Mbps)
2. PERFORMANCE
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10) Electrical Characteristics of WLAN 802.11g Transmission and Receptioin Part
Item Specification
Transmit Frequency 2400 MHz ~ 2483.5 MHz ( CH1~CH13 )
Tx Power Level ≤ 20dBm under (Europe), ≤ 30dBm under (USA)
Frequency Tolerance within±25 PPM
10) Electrical Characteristics of WLAN 802.11g Transmission and Receptioin Part
Frequency Tolerance within ±25 PPM
Chip clock FrequencyTolerance
within ±25 PPM
Spectrum Mask≤ -20 @ ±11MHz offset (9Mhz ~ 11MHz)≤ -28 @ ±20MHz offset (11MHz ~ 20Mhz)≤ -40 @ ±30MHz offset (20MHz ~ 30Mhz)
Transmitter constellation error(rms EVM) ≤ -5.6%
Spurious Emissions
< -36 dBm @ 30MHz ~ 1GHz < -30 dBm above @ 1GHz ~ 12.75GHz < -47 dBm @ 1.8GHz ~ 1.9GHz < -47 dBm @ 5.15GHz ~ 5.3GHz
Rx Min input Sensitivity
PER ≤ 10%-82dBm@6Mbps, -81dBm@9Mbps, -79dBm@12Mbps-77dBm@18Mbps, -74dBm@24Mbps, -70dBm@36Mbps-66dBm@48Mbps, -65dBm@54Mbps
Rx Max input Sensitivity ≥ -20dBm(6,9,12,18,24,36,48,54Mbps) @ PER ≤ 10%
PER ≤ 10%,
Rx Adjacent ChannelRejection
ACR ≥ 16dB@6Mbps, ACR ≥ 15dB@9Mbps, ACR ≥ 13dB@12Mbps, ACR ≥ 11dB@18Mbps, ACR ≥ 8dB@24Mbps, ACR ≥ 4dB@36MbpsACR ≥ 0dB@48Mbps, ACR ≥ -1dB@54Mbps
※ACR shall be measured by setting the desired signal's strength 3 dB above the rate-dependentsensitivity specified in min input sensitivity
2. PERFORMANCE
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2 7 4 Electrical Characteristics (continued)2.7.4 Electrical Characteristics (continued)
1) Current Consumption
ItemSpecification
WCDMA GSM
1. Sleep Mode Under 3 mA Under 3 mAp
2. Sleep : Ear jack conencted Under 3.5 mA Under 3.5 mA
3. Idle Mode Under 160 mA Under 160 mA
4. Standby (Sleep & Idle Avg.) Under 5.5mA @ DRX 7 Under 5.5mA @ P.P 5
5. Talk ModeTx 23dBm (LCD OFF):Under 600 mA @ Avg
EGSM LVL 5(LCD OFF)Under 350 mA @ Avg
◈ RF Current Consumptions are measured in Backlight Off state.
Under 600 mA @ Avg Under 350 mA @ Avg
6. No SVC Mode Under 160 mA Under 160 mA
7. Power Off Mode Under 450 uA Under 450 uA
2) RSSI indicate (traffic)
Antenna BARSpecification
unitWCDMA GSM(EGSM) GSM(DCS/PCS)
4 3 -89 2 -91 2 -91 2
3 2 -95 2 -99 2 -99 2
RSSI is measured 10 seconds after Power change. (For RSSI stability)
In WCDMA case, There is not display “ No SVC” in traffic.
dBm2 1 -102 2 -104 2 -103 2
1 0 -105 2 -106 2 -105 2
0 No SVC -113 2 -117 2 -117 2
In WCDMA case, There is not display No SVC in traffic.
2. PERFORMANCE
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3) Battery Discharging Graph : Referred to Battery Log File3) Battery Discharging Graph : Referred to Battery Log File
TOCAD (Sanyo Cell 1350mAh), 300mA Load current
Battery Capacity Battery Voltage
90% 4.02V 0.05(3.97V~4.07V)
60% 3.76V 0.05(3.71V~3.81V)
30% 3.67V 0.05(3.62V~3.72V)
Battery Icon Battery Capacity Bar
90~100 6
70~89 5
50~69 430% 3.67V 0.05(3.62V 3.72V)
10% 3.58V 0.05(3.53V~3.63V)
OFF Under 3.30V
30~49 3
15~29 2
5~14 1
0~4 0
2. PERFORMANCE
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4) Battery Usage Time) y g
Specification Test Condition
Standby Time & Current(WCDMA)
Over 200 hrsUnder 6mA
DRX 7 @ BATT Capacity : 1350mA/h
Standby Time & C t Over 200 hrs
EGSM P2 BATT C i 1350 A/h& Current(GSM) Under 6mA
EGSM P2 @ BATT Capacity : 1350mA/h
Voice Call Time
(WCDMA)Over 250 min. 10dBm @ BATT Capacity :1350mA/h (AMR Mode )
Voice Call Time Over 240 min. EGSM, LV5 @ BATT Capacity : 1350mA/h
5) MP3 Usage Time
(GSM)
Charging Time Under 240 min. Phone off
Specification Test Condition
Speaker Over 6 hrs Reference MP3 : Life is good.mp3-92dBm, Half Rate, Backlight Off, Volume Max.Ear Phone Over 6 Hrs
6) Ringtone SPL
Specification Test Condition
Over 60% Over 60 dBspl 1 m distance
100% Over 55 dBspl 1 m distance
2. PERFORMANCE
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2.7.5 examination measurement method and a rule2.7.5 examination measurement method and a rule
Voltage of mobile phone that is applied at the time of each measurement (contact terminal of battery) is Typ. DC 4.0Volt, Min. DC 3.4Volt.
1. Electric characteristic measurement method : Follow standard examination method of product performance examination rules.
2. Reliability examination method: Follow standard examination method of reliability examination rules.y y
3. U/I verification rules: Follow standard examination method of QE U/I verification rules.
4. Field Test rules: Follow standard examination method of QE Field Test.
5. Examination method and SPEC. definition according to new functions: New functions for S/W is measured by method mentioned in the manual.
3. TECHNICAL BRIEF
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1. TECHNICAL BRIEF
3.1 General Description
The L-04C supports UMTS-800, UMTS-2100, GSM-900, DCS-1800, and PCS-1900 based GSM/GPRS/UMTS. All receivers and the UMTS transmitter use the radioOne1Zero-IF architecture to eliminate intermediate frequencies, directly converting signals between RF and baseband. The tri-band GSM transmitters use a baseband-to-IF up conversion followed by an offset phase-locked loop that translates the GMSK-modulated or 8-PSK-modulated signal to RF.
Fig 1.1-1 Block diagram of RF part
A generic, high-level functional block diagram of L-04C is shown in Figure 1-1. One antenna collects base station forward link signals and radiates handset reverse link signals. The antenna connects with receive and transmit paths through a FEM(Front End Module) (plus two duplexers for UMTS high-band and low-band operations).
The UMTS receive paths each include an LNA, an RF band-pass filter, and a downconverter that translate the signal directly from RF-to-baseband using radioOne ZIF techniques.
1 QUALCOMM’s branded chipset that implements a Zero-IF radio architecture.
3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
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The high-band UMTS receive path and low-band path are accommodated in the RTR6285 IC. The RFIC.s Rx analog baseband outputs, for the receive chains, connect to the MSM IC. The UMTS and GSM Rx baseband outputs share the same inputs to the MSM IC .
For the transmit chains, the RTR6285 IC directly translates the Tx baseband signals (from the MSM device) to an RF signal using an internal LO generated by integrated on-chip PLL and VCO. The RTR6285 IC outputs deliver fairly high-level RF signals that are first filtered by Tx SAWs and then amplified by their respective UMTS PAs. The high- and low-band UMTS RF transmit signals emerge from the RTR6285 transceiver.
In the GSM receive path, the received RF signals are applied through their band-pass filters and down-converted directly to baseband in the RTR6285 transceiver IC. These baseband outputs are shared with the UMTS receiver and routed to the MSM IC for further signal processing. .
The GSM transmit path employs one stage of up-conversion and, in order to improve efficiency, is divided into phase and amplitude components to produce an open-loop Polar topology:
1. The on-chip quadrature up-converter translates the GMSK-modulated signal or 8-PSK modulated signal, to a constant envelope phase signal at RF;
2. The amplitude-modulated (AM) component is applied to the ramping control pin of Polar power amplifier from a DAC within the MSM
L-04C power supply voltages are managed and regulated by the PM7540 Power Management IC. This versatile device integrates all wireless handset power management, general housekeeping, and user interface support functions into a single mixed signal IC. It monitors and controls the external power source and coordinates battery recharging while maintaining the handset supply voltages using low dropout, programmable regulators.
The device’s general housekeeping functions include an ADC and analog multiplexer circuit for monitoring on-chip voltage sources, charging status, and current flow, as well as user-defined off-chip variables such as temperature, RF output power, and battery ID. Various oscillator, clock, and counter circuits support IC and higher-level handset functions. Key parameters such as under-voltage lockout and crystal oscillator signal presence are monitored to protect against detrimental conditions.
3. TECHNICAL BRIEF
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3.2 GSM Mode
3.2.1 GSM Receiver
The Dual-mode L-04C’s receiver functions are split between the three RFICs as follows:
■ UMTS-800, UMTS-2100, GSM-900, DCS-1800, and PCS-1900 modes use the RTR6285 IC only. Each mode has independent front-end circuits and down-converters, but they share common baseband circuits (with only one mode active at a time). All receiver control functions are beginning with SSBI-controlled parameters.
RF Front end consists of antenna, Front End Module(D5017) which includes nine path antenna SW and quad band GSM PAM(GSM850, GSM900, DCS, and PCS). The Front End Module allows multiple operating bands and modes to share the same antenna.
In L-04C, a common antenna connects to one of eight paths:
1) UMTS-800 Rx/Tx, 2) UMTS-2100 Rx/Tx, 3) GSM-900 Rx, 4) GSM-900 Tx,
5) DCS-1800 Rx, 6) PCS-1900 Rx, 7) DCS-1800 TX, 8) PCS-1900 TX.
UMTS operation requires simultaneous reception and transmission, so the UMTS Rx/Tx connection is routed to a duplexer that separates receive and transmit signals.
GSM850/GSM900, DCS, and PCS operation is time division duplexed, so only the receiver or transmitter is active at any time and a frequency duplexer is not required.
Table 1.2-1 Antenna Switch Module Control logic
3. TECHNICAL BRIEF
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The GSM900, DCS, and PCS receiver inputs of RTR6285 are connected directly to the transceiver front-end circuits(filters and antenna switch module). GSM900, DCS, and PCS receiver inputs use differential configurations to improve common-mode rejection and second-order non-linearity performance. The balance between the complementary signals is critical and must be maintained from the RF filter outputs all the way into the IC pins. The RTR6285 input stages include MSM-controlled gain adjustments that maximize receiver dynamic range.
Since GSM900, DCS, and PCS signals are time-division duplex (the handset can only receive or transmit at one time), switches are used to separate Rx and Tx signals in place of frequency duplexers – this is accomplished in the switch module.
The amplifier outputs drive the RF ports of the quadrature RF-to-baseband downconverters. The downconverted baseband outputs are multiplexed and routed to lowpass filters (one I and one Q) having passband and stopband characteristics suitable for GMSK or 8-PSK processing. These filter circuits include DC offset corrections. The filter outputs are buffered and passed on to the MSM7227 IC for further processing.
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Fig 1.2-1 RTR6285 RX feature
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3.2.2 GSM Transmitter
The RTR6285 transmitter outputs(HB_RF_OUT1 and LB_RF_OUT1)include on-chip output matching inductors. 50ohm output impedance is achieved by adding a series capacitor at the output pins. The capacitor value may be optimized for specific applictions and PCB characteristics based on pass-band symmetry about the band center frequency, the suggested starting value is shown in Figure1.2.2
Figure 1.2-2 GSM Transmitter matching
The RTR6285 IC is able to support GSM 850/1900 and GSM 1800/1900 mode transmitting. This design guideline shows a quad-band GSM application.
Both high-band and low band outputs are followed by resistive pads to ensure that the load
Presented to the outputs remains close to 50ohm. The low-band GSM. Tx sSAW can be eliminated because ETSI spec requires mid channels to pass RX Band noise only.
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3.3 UMTS Mode
3.3.1 Receiver
The UMTS duplexer receiver outputs are routed to LNA circuits within the RTR6285 device.
The RTR6285/RTR6285 receive paths include four WCDMA Rx signal paths(two single-ended and two differential) for one UMTS low-band and three UMTS high-bands.
WCDMA_�100_RX
WCDMA_800_RX
Figure 1.3-1 RTR6285 IC functional block diagram
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The two RTR6285/RTR6285 UMTS single-ended inputs accept its UMTS 2100/1900/1800/1700 input signal from the handset RF front-end filters. The UMTS Rx inputs are provided with onchip LNAs that amplify the signal before second-stage filters that provide differential signal to a shared downconverter. This second-stage input is configured differentially to optimize secondorder inter-modulation and common mode rejection performance. The gain of the UMTS front-end amplifier and the UMTS second-stage differential amplifier are adjustable, under MSM control, to extend the dynamic range of the receivers.
The second-stage UMTS Rx amplifiers drive the RF ports of the quadrature RF-to-baseband downconverters. The downconverted UMTS Rx baseband outputs are routed to lowpass filters having passband and stopband characteristics suitable for UMTS Rx processing. These filter circuits allow DC-offset corrections, and their differential outputs are buffered to interface with the MSM IC.
The RTR6285/RTR6285 UMTS differential input paths stay on-chip; off-chip inter-stage filtering is not required. Other than this, the architecture is similar to the single-ended inputs. The UMTS duplexer receiver output is routed to LNA circuits within the RTR6285 device. UMTS LNA circuits(one for low-band UMTS and one for high-band UMTS path) separated from all other receive functions contained within the RTR6285 IC to improve mixer LO to RF isolation- a critical parameter in the ZIF architecture. Isolation is further improved using high-reverse isolation circuits in the LNA designs
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3.3.2 Transmitter
The RTR6285/RTR6285 transmit includes four transmit signal paths with five outputs (three high bands and two low bands) supporting multi-band and multi-mode GSM/GPRS/EDGE polar transmit and WCDMA/HSDPA transmit architectures. The transmit path begins with differential baseband signals (I and Q) from the MSM device.
These analog input signals are buffered, filtered by low-pass filters, amplified, and then applied to the quadrature upconverter mixers. The upconverter outputs are amplified by multiple variable gain stages that provide transmit AGC control. SSBI control from the MSM IC is used to generate the gain range control signal. The AGC outputs are then applied to the high-band and low-output driver amplifiers; the specified driver amplifier output level is achieved while supporting the GSM/EDGE and UMTS transmit standard’s requirements for GSM ORFS, carrier and image suppression, WCDMA ACLR, spurious emissions, Rx-band noise, and so forth. Again, the upconverter LO signals are generated by circuits described in Section 1.2.3. These upconverters translate the polar GMSK-modulated or 8-PSK modulated baseband PM signals and/or WCDMA baseband signals directly to the RF signals, which are filtered and fed into the GSM/EDGE polar PA and/or WCDMA PA. The WCDMA TX power is coupled back to the RTR6285/RTR6285 internal power detector input pin, PWD_DET_IN, using a coupler for power measurement.
The low-band drive amplifiers are used to transmit the polar phase modulated (PM) signal for GSM/EDGE 850/900 while the high-band driver amplifiers are for the GSM/EDGE 1800/1900.
By using the radioOne architecture, the same high-band transmit path can be used to transmit the UMTS 2100/1900/1800/1700 signal, and the low-band transmit path can be used to transmit the UMTS 800/850/900 signal, depending on the application. The envelope path is used in polar mode of operation for GSM and EDGE. Input from the MSM IC, the baseband envelope (AM) signal, is applied directly to the ramp control pin of the GSM/EDGE polar PA to modulate the power supply of the PA so that the polar modulated GSM/EDGE signal in the MSM can be recovered and transmitted.
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WCDMA_�100_TX
WCDMA_800_TX
Figure 1.3-2 RTR6285 IC functional block diagram
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3.4 LO Phase-locked Loop
The integrated LO generation and distribution circuits are driven by internal VCOs to support various modes to yield highly flexible quadrature LO outputs that drive all GSM/EDGE, UMTS band and GPS upconverters and downconverters; with the help of these LO generation and distribution circuits, true zero-IF architecture is employed in all GSM and UMTS band receivers and transmitters to translate the signal directly from RF-to-baseband and from baseband-to-RF.
Two fully functional fractional-N synthesizers, including VCOs and loop filters, are integrated within the RTR6285/RTR6285 IC. In addition, the RTR6285 has a third synthesizer used for GPS operation. The first synthesizer (PLL1) in the RTR6285/6280 creates the transceiver LOs that support the UMTS transmitter, and all four GSM band receivers and transmitters including: GSM 850, GSM 900, GSM 1800, and GSM 1900. The second synthesizer (PLL2) in the RTR6285/RTR6285 IC provides the LO for the UMTS primary receiver. For the RTR6285 IC only, the second synthesizer also provides the LO for the secondary UMTS receiver. The third synthesizer (PLL3), only in the RTR6285 IC, provides the LO for the GPS receiver. An external TCXO input signal is required to provide the synthesizer frequency reference to which the PLL is phase and frequency locked. The RTR6285/RTR6285 ICs integrate most of the PLL loop filter components on-chip except for three off-chip loop filter-series capacitors, which significantly reduces off-chip component requirement. With the integrated fractional-N PLL synthesizers, the RTR6285/RTR6285 ICs have the advantage of more flexible loop bandwidth control, fast lock time, and low-integrated phase error.
RTR6285 PLL’s functional block diagram
GSM RX/TX / WCDMA TX
WCDMA RX
GPS RX
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3.5 Off-chip RF Components
3.5.1 Front End module (FL1001 : D5017)
Product Description
D5017 is a transmit and receive Front End Module (FEM) designed in a very low profile (1.1 mm), compact form factor for quad-band cellular handsets comprising GSM850/900, DCS1800, and PCS1900 operation . RF input and output ports of the D5017 are internally matched to a 50 Ω load to reduce the number of external components for a quad-band design. Band selection and control of transmit and receive RF signal flows are performed by use of four external control pads. See Figure 1.5.1 shown on overleaf. Mode of operation Tx, Rx, Band (GSM850, GSM900, DCS, PCS, and UMTS) is controlled with CTRL 1~4 inputs (figure 1.5.2)
Fig 1.5-1 D5017 block diagram
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Absolute Maximum Ratings1
D5017 Control Characteristics
Fiure 1.5.2 D5017 control table
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3.5.2 UMTS 2100 duplexer ; (FL1003 : SAYFP1G95AA0B00)
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3.5.3 UMTS 800 duplexer (FL1004 : SAYFP836MCA0F00R00)
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3. TECHNICAL BRIEF
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3.5.4 UMTS 2100 Power Amplifier modules (U1003 : SKY77701)
SKY77701 Description
The SKY77701 Power Amplifier Module(PAM) is a fully matched 10-pad surface mount module developed for WCDMA applications. This small and efficient module packs full 1920-1980Mhz bandwith coverage into a single compact packae. Because of high efficiencies attaited throught the entire power range, the SKY77701 delivers unsurpassed talk-time advantages. A directional coupler is intergrated into the module thus eliminating the need for any any external coupler. The SKY77701 PAM is manufactured with Skyworks’ InGaP GaAs HBT BiFET process that provides for all positive voltage DC supply operation while maintaining high efficiency and good linearity. Primary bias to the SKY77701 is supplied directly from any three-cell Ni-Cd, a single-cell li-ion,or other suitable battery with an output in the 3.2 to 4.2Volt range. Power down is accomplished by setting the voltage on VENABLE to zero volts.
SKY77701 Functional block diagram
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SKY77701 Pin names and configuration(top view)
SKY77701 Absolute Electrical ratings
VCC1
RF_IN
VMODE_1
VMODE_0
VEN
VCC2
RF_OUT
CPL_IN
GND
CPL_OUTGROUND PAD
1
2
3
4
5
10
9
8
7
6
SKY77701 Pin names and configuration(top view)
SKY77701 Absolute Electrical ratings
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SKY77701 Recommecded operation conditions
SKY77701 Mode of Operation
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3.5.5 UMTS 800 Power Amplifier modules (U1004: SKY77704)
SKY77704Description
The SKY77704Power Amplifier Module(PAM) is a fully matched 10-pad surface mount module developed for WCDMA applications. This small and efficient module packs full 824-849Mhz bandwith coverage into a single compact packae. Because of high efficiencies attaited throught the entire power range, the SKY77704 delivers unsurpassed talk-time advantages. A directional coupler is intergrated into the module thus eliminating the need for any any external coupler.The SKY77704 PAM is manufactured with Skyworks’ InGaP GaAs HBT BiFET process that provides for all positive voltage DC supply operation while maintaining high efficiency and good linearity. Primary bias to the SKY77704 is supplied directly from any three-cell Ni-Cd, a single-cell li-ion,or other suitable battery with an output in the 3.2 to 4.2Volt range. Power down is accomplished by setting the voltage on VENABLE to zero volts.
SKY77704 Block Diagram
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SKY77704 Pin names and Configuration(top view)
SKY77704 Absolute Maximum rating
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SKY77704 Recommended Operation Conditions
SKY77704 Mode of Operation
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SKY77704 Electrical Specifications for Nominal operating conditions
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3.5.6 UMTS Rx SAW filter (FL1002: SAFEB2G14FA0F00)
An RF filter is located between the UMTS LNA and mixer. Insertion loss is important, but not as critical as losses before the LNA. The most important parameters of this component include:
■ Out-of-band rejection or attenuation levels, usually specified to meet these conditions:
□ Far out-of-band signals - ranging from DC up to the first band of particular concern and from the last band of particular concern to beyond three times the highest passband frequency.
□ Tx-band leakage - the transmitter channel power, although attenuated by the duplexer, still presents a cross- modulation threat in combination with Rx-band jammers. The RF filter must provide rejection of this Tx-band leakage.
□ Other frequencies of particular concern . bands known to include other wireless transmitters that may deliver significant power levels to the receiver input.
■ Phase and amplitude balance - the ZIF architecture requires well-balanced differential inputs to the RTR6285/80. This is accomplished by the RF filters which take a single-ended outputs from the ICs and provide differential outputs having nominal 180° phase separation. Phase and/or amplitude imbalance causes degraded common-mode rejection and second-order nonlinearity, so their requirements are specified jointly.
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Table 1.5-6 SAFEB2G14FA0F00 Electrical specification.
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3.5.7 VCTCXO (X300 : KT-3225L-19.2MHz)
The Voltage Controlled Temperature Compensated Crystal Oscillator (VCTCXO) provides the reference frequency for all RFIC synthesizers as well as clock generation functions within the MSM7227 IC. The oscillator frequency is controlled by the MSM7227’s TRK_LO_ADJ pulse density modulated signal in the same manner as the transmit gain control.
The filtered PDM signal results in an analog control signal into the VCTCXO tuning port whose voltage is directly proportional to the density of the digital bit stream. The MSM device varies the pulse density to change the analog control voltage that sets the oscillator frequency – all within a feedback control loop that minimizes handset frequency drift relative to the network.
3.5.8 UMTS 2100 TX SAW Filter (FL1004 : SAFEB1G95KA0F00)
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3.5.9 UMTS 800 TX SAW Filter (FL1005 : SAFEB836MAL0F00)
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3. Technical Brief
3.6 Digital Baseband(DBB/MSM7227)
3.6.1 General Description
L-04C supports UMTS-800, UMTS-2100, GSM-900, GSM -1800, GSM-1900. All receivers and the transmitter use the radio One Zero-IF architecture to eliminate intermediate frequencies, directly converting signals between RF and baseband.
A generic, high-level functional block diagram of L-04C is shown in Figure 1. One antenna collects base station g , g g gforward link signals and radiates handset reverse link signals. The antenna connects with receive and transmit paths through a SPDT( Single Port Double Throw ).
RTR6285 receive paths include four GSM/EDGE Rx signal paths that supportGSM 900, 1800, and 1900 bands, and four WCDMA Rx signal paths(two single-ended and two differential) for one UMTS low-band and three UMTS high-bands.
RTR6285 transmit includes four transmit signal paths with five outputs (three high bands and two low bands) supporting multi-band and multi-mode GSM/GPRS/EDGE polar transmit and WCDMA/HSDPA transmit architectures.
L-04C power is managed and regulated by the PM7540 Power Management IC. This versatile device integrates all wireless handset power management, general housekeeping, and user interface support functions into a single mixed signal IC. It monitors and controls the external power source and coordinates battery recharging while maintaining the handset supply voltages using low dropout, programmable regulators.
The device’s general housekeeping functions include an ADC and analog multiplexer circuit for monitoring on-chip voltage sources, charging status, and current flow, as well as user-defined off-chip variables such as temperature and battery ID. Various oscillator, clock, and counter circuits support IC and higher-level handset functions. Key parameters such as under-voltage lockout and crystal oscillator signal presence are monitored to protect against detrimental conditions.
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A. Features(MSM7227)
The basic MSM7227 system solution consists of the MSM7227, RTR6285™, and PM7540™ ICs, plus AMSS™ system software with the SURF7227™ platform available for development.
General features include:
WCDMA Rel ‘99 plus HSDPA and HSUPA
GSM/GPRS/EDGE
High-performance ARM1136JF-S™ application processor at up to 600 MHz; QDSP5000™ at 320 MHz
High-performance ARM926EJ-S™ modem processor at up to 400 MHz; QDSP4000™ at 122.88 MHz
Java® hardware acceleration for faster Java-based games and other applets
Support for Bluetooth® 2.1 EDR via an external Bluetooth System-on-Chip (SoC)
High-speed, serial mobile display digital interface (MDDI) that optimizes the interconnection cost between the MSM device and the LCD panel
R i di it t f WCDMA d th b idi i d it d d t th h tReceive diversity support for WCDMA mode, thereby providing improved capacity and data throughput
USB 2.0 compliant high-speed USB core with limited OTG capabilities
Integrated high-speed USB PHY
Integrated wideband stereo codec for digital audio applications
Direct interface to digital camera module with video front-end (VFE) image processing
GPS position location capabilities
Vocoder s pport (GSM HR FR EFR AMR and AMR WB/+)Vocoder support (GSM-HR, FR, EFR, AMR, and AMR-WB/+)
Advanced 12 × 12 ×1.05 mm, 0.4 mm pitch, 560 NSP
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Figure. MSM7227 functionl Block Diagram in typical application
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3.7 Modem system / subsystem
3. Technical Brief
The modem subsystem includes all blocks that provide modem functionality directly (such as airlink modulation and demodulation, searching, etc) plus supporting functions (such as the modem DSP, modem AHB bus, sleep controller, interrupt controller, etc):
■ An ARM926EJ-S (ARM9) as the main modem processor.
■ A bridge to the peripheral bus that connects the modem subsystem to functions like the crypto-engine, keypad, UART, and EBI2.
■ Th AHB t AXI b id th t id t hi h d i EBI1 ll th ti li ti■ The AHB-to-AXI bridge that provides access to high-speed memory via EBI1 as well as the entire applications subsystem.
■ A modem DSP (mDSP) that controls modem hardware blocks and assists with symbol-level processing of physical layer traffic. All modem functions require mDSP support to operate.It has a limited amount of processing power and program/data storage; it must meet the sum of all modem MIPS and memory requirements (plus some overhead) for concurrent operation.
■ A 64 kB secure boot ROM containing the primary boot loader for the ARM9 processor.
■ An internal RAM (IRAM) used for inter-processor communications between the modem and applications processors. Its top eight word locations are vectors to the modem processor exception handlers.
■ A security mode control (SMC) block
Electrical fuses that are used to disable specific functionality (such as ARM debug modes
that are useful for testing but pose a potential security breach during normal operation).
Memory protection that physically prevents certain masters on the modem subsystem bus from accessingMemory protection that physically prevents certain masters on the modem subsystem bus from accessing certain memory regions. This memory protection prevents modem DM access to either IRAM or the SMC; it only allows access via the modem ARM in its supervisor mode.
The SMC block also contains other security features, such as a device ID to uniquely identify a chip.
■ An always-on modem power manager (MPM) block that controls power collapsing of the modem subsystem.
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3. Technical Brief
Bus interfaces provide the necessary connections to other functions:
■ The high-speed AXI bus provides access to the applications subsystem.
The modem processor and other masters can access the application subsystem, but masters within the p pp yapplication subsystem (such as the application processor) cannot access the modem subsystem for
security reasons.
■ The local AHB bus is connected to the peripheral subsystem through a bridge. The modem processor shares access to this subsystem with the applications processor. Peripherals include standard interfaces (such as USB, UART, and UIM) for external communications, and can access MSM-internal peripheral functions as well.
■ The local AHB bus also bridges to asynchronous buses to communicate with the modem hardware blocks■ The local AHB bus also bridges to asynchronous buses to communicate with the modem hardware blocks.
■ The local AHB bus is a slow-speed request/acknowledge-based bus that is used to configure the modem cores.
■ The DM host interface is used to program the data mover through the modem processor. Since these data paths have moderately high data rates (up to 3.1 Mbit/sec plus overhead), they have a direct connection to the AHB instead of going through an asynchronous bus.
Figure. MSM7227 modem subystem functional block diagram
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3.7.1 ARM9 modem processor
3. Technical Brief
The ARM9 is a single-clock, high-performance, Java-enabled, synthesizable core:
■ Harvard architecture, 16 kB instruction and 16 kB data caches; each 4-way associative supported on the modem subsystem
■ ARM and THUMB states are supported
■ Jazelle ARM9 core (Java support)
■ Embedded trace macrocell (ETM) supportpp
■DC power-saving techniques
■Operation at a target frequency of 400 MHz
Key functions and modes are discussed in the following subsections.
3.7.2 Reset and pauseThe modem microprocessor includes reset and pause functions that are responsible for:
■ Generating synchronous reset signals for the modem processor as well as the other bus architecture peripherals.
■ Providing status information concerning the source of the last reset (pin or watchdog generated).
■ Controlling the clock to the ARM microprocessor, thereby providing reset or pause mechanisms for the modem processor.
■ Allowing software to control this pause mechanism to halt the ARM for a specified duration.
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3.7.3 Watchdog timerW t hd ti h t i ti
3. Technical Brief
Watchdog timer characteristics:
14-bit counter running off the sleep controller clock regime
Enables the handset to recover from unexpected hardware or software anomalies
If the microprocessor fails to periodically reset the watchdog timer the timer expires and the handset is reset
Disabled and/or reset by grounding the WDOG_EN pin or by asserting the RESIN_N pin Hardware disabling example: the ARM processor enters debug mode (indicated by the DBGACK pin of the processor
i i i f l hi h)transitioning from low to high)
Enabled by leaving the WDOG_EN pin unconnected (it has an internal pull-up) or by connecting it to VDD If temporarily disabled, it can be re-enabled by applying a system reset that clears the state of the internal signal wdog_disable When enabled, the watchdog circuit pulses the WATCHDOG_EXPIRED signal whenever its timer has expired. In NATIVE mode this signal is combined with the RESIN_N pin to generate the RESOUT_N signals and the MSM device's internal reset.
3.7.4 Sleep mode and watchdog freezeThe modem processor cannot reset the watchdog timer while in its sleep mode, but the watchdog can be frozen before entering sleep mode. To enable the freeze, the microprocessor writes a 1-0 sequence to the WDOG_FREEZE register.
3.7.5 Non-sleep modepIn non-sleep mode the processor must reset the watchdog timer at least once every 390 ms. If not, the watchdog timer expires and asserts an internal RESIN_N signal to the system. The WDOG_EXPIRED signal lasts between 53 and 106 ms (97.5 ms typical). To reset the watchdog timer, the microprocessor must write a 1-0-1 sequence to the WATCH_DOG bit of the SLEEP_CTL register.
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3.7.6 Modem DSP (mDSP)
3. Technical Brief
The modem subsystem includes the modem DSP (mDSP) and supporting blocks like the data mover, a master that is connected to the AXI bus for access to internal and external memory. A QDSP4000 running at up to 128 MHz is used.
3.7.7 Applications system
The MSM7227 applications system consists of the following subsystems and major functional blocks.
The ARM1136JF-S (ARM11) applications processor subsystem with supporting watchdog, clock, and timers
The applications subsystem that includes key apps functions (the aDSP and data mover) plus severalmultimedia and connectivity functions
The peripheral subsystem
Peripheral functions like crypto-engine, SDIOs, EBI2, UART/UIM, I2C, etc. Most of these functions are discussed within the connectivity chapter.y pA bridge that connects the modem subsystem, applications processor subsystem, aDSP, applications data mover, and MDP to the peripheral functions. The peripheral buses
AXI wrappers and AXI bus that connect the applications system to the modem system The applications system includes six AXI bus masters: 1) aDSP external memory master, 2) data mover, 3) HS USB, 4) MDDI, 5) VFE, and 6) MDP. The AXI bus is discussed in Section 3.3.1, but a few comments about the applications system masters are highlighted here: y g g
The data mover is a general-purpose DMA engine that supports up to 16 channels. Under control of the modem ARM, application ARM, or aDSP, it handles memory-to-memory data transfers as well as aDSP, crypto engine, NAND controller, SD controller, and USB RLP data transfers.
The data mover is used for byte alignment/packing of USB RLP data and putting it back into system memory, and then the USB DMA master transfers the byte-aligned data from system memory. The USB AHB slave interface is on the peripheral bus and is used for configuring the USB registers.
The mobile display processor is a hardware accelerator responsible for transferring an updated image from system memory to an LCD module through the MDDI host. The video front-end receives camera data directly from the parallel camera interface. It communicates with aDSP through an xDMA channel and has its own AXI bus master to access system memory.
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3. Technical Brief
Memory
D l b t th hi h d b t (EBI1) f l d dDual-memory buses separate the high-speed memory subsystem (EBI1) from low-speed memory and peripheral devices (EBI2).
The example application supports 200 MHz DDR SDRAM memory on EBI1, and adds NAND memory and the UBM™ subsystem via EBI2 (either 1.8 or 2.6 V devices).
Other EBI2 device options include mux OneNAND™ flash memory and LCD support. EBI2 memory is used for system boot .
Air interfaces
The MSM7227 device supports WCDMA (Rel ‘99, HSDPA, and HSUPA), and GSM (Rel ‘99, GPRS, and EDGE). These enable rich wireless multimedia services, such as high-speed upload of multimedia files and attachments, interactive gaming, and a variety of IP-based services such as voice over internet protocol (VoIP).
Real-time conversation services such as push-to-talk, video telephony, and instant multimedia (an extension of push-to-talk that combines immediate voice with simultaneous delivery of video and pictures) are also supported.
Very high peak data rates are supported: 7.2 Mbps on the downlink and 5.76 Mbps on the uplink using HSDPA/HSUPA.
Such high data rates enable network operators to provide an even broader range of wireless multimedia and other data services for consumers and enterprise customers. HSDPA/HSUPA are optimized for packet data service and provide some of the lowest costs per bit when compared with other wireless wide areadata service and provide some of the lowest costs per bit when compared with other wireless wide area network (WWAN) technologies.
The MSM7227 solution integrates powerful application processors into the Qualcomm market-proven wireless modem, offering increased processing capacity combined with lower power consumption.
With the MSM7227 chipset solution, handset manufacturers can design sleek, converged consumer wireless devices that boast the industry’s most advanced image quality and resolution to provide enhanced 3D animation, gaming, streaming video, videoconferencing, broadcast reception, and more.
Multimedia
The MSM7227 IC enables Enhanced Platform products that leverage the convenience of consumer electronics to support a wide array of multimedia features.
Camera interface and video front-end
Expanded image processing capabilities include a direct interface for digital camera modules with videoExpanded image-processing capabilities include a direct interface for digital camera modules with video front-end image processing. The high-quality digital-camera processing supports CCD or CMOS image sensors up to 8 megapixels.
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3. Technical Brief
Display support
Di l i l d hi h d bil di l di i l i f (MDDI) f i i bDisplay support includes a high-speed mobile display digital interface (MDDI) for communications between the MSM and display devices and/or a camera. The third-generation mobile display processor (MDP3) is a hardware accelerator that: 1) improves processing speeds; 2) has a more flexible architecture; and 3) expands compatibility to include the RGB interface – relative to previous generations. The embedded LCD controller is also used to support the RGB interface.
Audio codec
The integrated wideband stereo codec supports digital audio applications with several input/output combinations:
Left and right LINE inputs, two MIC inputs, and one auxiliary input Headphone, earpiece, LINE, and auxiliary outputs Key audio features include: external vocoder support; internal vocoder that supports 13 kbps PureVoice®; PureVoice VR™ voice recognition; acoustic echo cancellation; PureVoice Audio AGC™; standard MIDI with 16 voices; and 128-tone CMX® (text, picture, and MIDI streaming).
Connectivity
In addition to the basic handset-control interfaces like the keypad and touch screen, the MSM7227 IC supports a variety of consumer electronics with its connectivity ports:
High-speed universal serial bus (HS-USB) with built-in PHY
USB universal integrated circuit card (UICC)USB universal integrated circuit card (UICC)
Four universal asynchronous receiver transmitter (UART) serial ports
Two data mover (DM) high-speed UARTs (4 Mbps)
Two user identity module (UIM) controllers; 1.8 and 3.0 V optionsFour integrated 4-bit secure digital (SD) controllers for SD/mini-SD cards and SDIO; two can be combined to form one 8-bit SDIO interface Transport stream interface (TSIF) for reception of digital mobile broadcast signals, including the Qualcomm MediaFLO™ technology, DVB-H, ISDB-T, T-DMB, and S-DMB LCD controller for RGB interface gyAUX_PCM for Bluetooth, stereo ADC, and stereo DAC support Inter-integrated circuit (I2C) interface for peripheral devices Various combinations of these connectivity ports are used to support wireless connectivity systems, including:Bluetooth (BT 2.1 EDR) – requires an external Bluetooth system-on-chip IC, (for example, the Qualcomm BTS4025™ device)802.11 wireless local area network (WLAN) – requires an external system-on-chip (SoC) Universal Broadcast Modem™ (UBM) device – requires an external Mobile Broadcast Platform IC, either the QualcommMBP1600™ or the MBP1610™ device
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RF transceivers
T RFIC d h k h d i li k
3. Technical Brief
Two RFICs are used to connect to the networks over the supported airlinks:
The RTR6285™ RF transceiver IC supports UMTS and GSM reception and transmission over the following operating bands:
Low band UMTS paths support UMTS-800, UMTS-850, and UMTS-900 High band UMTS paths support UMTS-1700, UMTS-1800, UMTS-1900, UMTS-2100, and UMTS-AW Low band GSM paths support GSM-850 and GSM-900 High band GSM paths support GSM-1800 and GSM-1900 The RTR6285 RFIC includes primary and secondary receiver paths, thereby enabling advanced techniques such as Mobile Receive Diversity (MRD). Additional RFIC details are available in their document sets (80-VD861-x for the RTR6285 IC).
Power management
The MSM7227 chipset is powered by a Qualcomm powerOne™ series PM7540™ power management IC. The power source is selected from either the battery, external charger, adaptor, or USB device, and then the IC generates all of the regulated voltages needed to power the handset electronics. The main battery and backup coin-cell voltages are monitored, and charging is conducted as needed.
In addition to these basic power functions, the PMIC also provides:
Housekeeping functions
Analog multiplexer that allows monitoring of IC-level and handset-level sensors System clocks, including the MSM IC’s 32 kHz sleep clock and 19.2 MHz operating clock Real-time clock and associated alarms.
- User interfaces
- Current drivers for keypad and LCD backlights, LEDs, and camera flash
- Vibration driver for silent incoming call alerts
- Two-channel speaker driver for far-field speakers
- Video amplifier for camcorder or slide presentations
IC l l i f- IC-level interfaces
- Monitoring of triggering events and coordination of the power-on and power-off sequences
Software features
Qualcomm provides a complete software suite that extends handset capabilities and expedites product development.
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Advance Mobile Subscriber Software (AMSS)
Many hardware features and operational parameters are enabled by the proper versions of AMSS software
3. Technical Brief
Many hardware features and operational parameters are enabled by the proper versions of AMSS software. This software is designed to run on a Subscriber Unit Reference (SURF™) phone platform, an optional development platform used to evaluate, test, and debug AMSS software.
Launchpad™ Suite
The Launchpad Suite of integrated applications offers wireless operators and manufacturers a cost-effective, scalable, and timely solution for providing advanced wireless data services. This seamlessly integratedscalable, and timely solution for providing advanced wireless data services. This seamlessly integrated solution enables advanced next-generation applications and services that incorporate multimedia, position-location, connectivity, customized user interface, and storage capabilities. Launchpad features are available for each Qualcomm chipset, closely matching the specific functionality and cost-target objectives agreed upon in joint product planning with manufacturers and wireless service operators worldwide.
The MSM7227 solution supports Launchpad’s advanced feature set, including streaming video and audio, still-image and video encoding and decoding, Java acceleration, and an 8-megapixel camera interface.still image and video encoding and decoding, Java acceleration, and an 8 megapixel camera interface. The MSM7227 solution also integrates gpsOne® functionality to support assisted and standalone GPS –enabling a wide variety of location-based services and applications, including points-of-interest, personal navigation, and friend finder. Seamless communication directly with printers, digital cameras, keyboards, and other accessories is also supported via the integrated wireless Bluetooth and USB controller functions.
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3.8 Power Block
3. Technical Brief
3.8.1 General
MSM7227 included RF, is fully covered by PM7540(Qualcomm PMIC). PM7540 cover The power of MSM7227, MSM memory, RF block, Micro SD, USIM and TCXO.
Major power components are :
PM7540 (U704, Main PCB) : Phone Power Supply
AAT2870 (U101, Qwerty Key PCB) : LCD Backlight charge pump
MAX17040G (U1005, Main PCB) : FUEL GUAGE IC
3.8.2 PM7540
The PM7540 device (Figure 1-1) integrates all wireless handset power management, general housekeeping, and user interface support functions into a single mixed signal IC.Its versatile design is suitable for CDMA and non-CDMA handsets, and other wireless products such as PC PDAs.
The power management portion accepts power from common sources - battery, external charger, adapter, USB_VBUS, coin cell backup - and generates all the regulated voltages needed to power the appropriate handset electronics. It monitors and controls the power sources, detecting which sources are applied, verifying that they are within acceptable operational limits, and coordinates battery and coin cell recharging while maintaining the handset electronics supply voltages.
On-chip voltage regulators generate 24 programmable output voltages using a combination of switched-mode power supplies and low dropout voltage regulators, all derived from a common trimmed voltage reference. One regulator is dedicated for generating microphone bias voltages.
The device's general housekeeping functions include a 16-position analog multiplexer that has five internal connections, six hardwired external connections, and supports an additional 22 external connections. The internal connections are used to monitor on-chip functions such as the temperature sensor. The hardwired external connections access input power nodes such as VCHG, VBAT, etc. p p , ,The 22 additional external connections are made using the IC's multipurpose pins configured as analog inputs that are routed through switch circuits to create five multiplexer inputs; these are available to monitor system parameters such as temperature and battery ID.
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The multiplexer output signal's offset and gain is adjusted, then buffered and routed to the Mobile Station Modem™ (MSM™) device for analog-to-digital conversion.
3. Technical Brief
( ) g gVarious oscillator, clock, and counter circuits are provided to initialize and maintain valid pulse waveforms and measure time intervals for higher-level handset functions. A dedicated controller manages the TCXO warmup and signal buffering, and key parameters are monitored to protect against detrimental conditions.
Figure. PM7540 functional block diagram
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Handset-level user interfaces are also supported. The IC includes four backlight or LED drivers with brightness (current) control that could be used for keypad, LCD, camera flash, and general-purpose drivers.
3. Technical Brief
brightness (current) control that could be used for keypad, LCD, camera flash, and general purpose drivers. A vibration motor driver alerts handset users of incoming calls, and a two-channel speaker driver with volume control can be used for audio alerts or speakerphone and melody-ringer applications. The speaker circuits accept stereo differential, stereo single-ended, and mono-differential inputs, and can be configured for stereo or mono outputs. A video amplifier is included that allows the handset to be used as a camcorder or for slide presentations.
IC-level interfaces include the configurable serial bus interface (SBI) used by the MSM device to control and status the PM7540 IC. This bus is supplemented by an interrupt manager for time-critical information.status the PM7540 IC. This bus is supplemented by an interrupt manager for time critical information. Another dedicated IC interface circuit monitors multiple trigger events and controls the poweron/poweron sequences. A universal serial bus/on-the-go (USB-OTG) transceiver is included for interfacing the MSM device to computers as a USB peripheral, or connecting the MSM device to other peripherals. removable user identity module (RUIM) level translators enable MSM device interfacing with external modules.
The PM7540 IC is a mixed signal BiCMOS device and is available in the 137-pin chip scale package (137-CSP) that includes several center ground pins for electrical ground and thermal relief.that includes several center ground pins for electrical ground and thermal relief.
Since the PM7540 IC includes so many diverse functions, its operation is more easily understood by considering major functional blocks individually. Therefore, the PM7540 document set is organized by the following device functionality:
■ Input power management
■Output voltage regulation
■ General housekeeping■ General housekeeping
■ User interfaces
■ IC interfaces
■Multipurpose pins (which can be configured to function within some of the other categories)
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3.8.3 Charging control
3. Technical Brief
Voltage regulation (VDD or VBAT)
The PM7540 IC provides closed-loop control of the active pass transistor (via CHG_CTL_N or USB_CTL_N) to regulate either the handset supply voltage (VDD) when not charging or the main battery final voltage (VBAT) when charging. When fast charging is disabled, the battery MOSFET is opened and the voltage regulation point is the ISNS_M pin (VDD). When fast charging is enabled, the VBAT pin is the voltage regulation point,
thereby improving the voltage precision of the fully charged battery (Li-ion battery manufacturers specify 1% accuracy).
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Current regulation, monitoring, and protection
3. Technical Brief
If a sense resistor is installed across ISNS_P and ISNS_M (pins C1 and C2, respectively) the PM7540 IC constantly monitors the total handset electronics plus charging current. If the programmed current threshold is exceeded, the active pass transistor is forced to a higher resistance, disrupting VDD or VBAT regulation but protecting against excess current. The VCHG current monitor defaults to its 1 Amp current setting upon powerup, thereby minimizing the risk of a large in-rush load collapsing VDD. Similarly, the VUSB current monitor defaults to its 0.5 A current setting upon powerup.
Battery C it Battery Voltage
Battery Icon Battery Capacity BarCapacity y g
90% 4.02V 0.05(3.97V~4.07V)
60% 3.76V 0.05(3.71V~3.81V)
30% 3.67V 0.05(3.62V~3.72V)
90~100 6
70~89 5
50~69 4
30~49 3
15~29 2
10% 3.58V 0.05(3.53V~3.63V)
OFF Under 3.30V
5~14 1
0~4 0
L-04C Battery Bar Display
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Main Battery Charging
3. Technical Brief
The PM7540 IC provides support circuitry for charging lithium-ion batteries, cycling through as many as four charging techniques: trickle, constant current, constant voltage, and pulsed. Battery voltage, external supply voltage, and total detected current measurements are available to the MSM device through the PM7540 analog multiplexer.This allows the MSM device to monitor charging parameters, make decisions, and control the charging process.
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Trickle Charging
3. Technical Brief
Trickle charging of the main battery, enabled through MSM control and powered from VDD, is provided by the PM7540 IC. This mode is used to raise a severely depleted battery's voltage to a level sufficient to begin fast charging.
Parameter Min Typ Max Unit
Trickle Current 60 80 100 mA
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3. Technical Brief
Constant Current Charging
The PM7540 IC supports constant current charging of the main battery by closing the battery MOSFET (connecting the battery to VDD), and closed-loop controlling the active pass transistor (charger or USB). The closed-loop control regulates the total current (handset electronics plus charging current) to match the programmed value (IMAXSEL).The MSM device monitors the charging process as described earlier and continues the constant current mode until the battery reaches its target voltage. Lithium-ion batteries require further charging using constant voltage or pulsed techniques.
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Constant Voltage Charging
3. Technical Brief
Once constant current charging of a lithium-ion battery is finished, the charging continues using either constant voltage or pulse techniques.The MSM device and its software determines if and when it is appropriate to begin the constant voltage mode within the charging process. Usually the decision to stop the constant current mode is based upon the battery voltage reaching a programmed threshold slightly above the intended final voltage.
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Pulse charging
3. Technical Brief
Once constant current charging of a lithium-ion battery is finished, the charging continues using either constant voltage or pulse techniques.
Charging Feature
• Charging Method : CC & CV (Constant Current & Constant Voltage)• Maximum Charging Voltage : 4.225V• Maximum Charging Current : 500mA• Nominal Battery Capacity : 1350mAh• Charger Voltage : 5.4V• Charging time : Max 240min (Except time trickle charging) • Full charge indication current (icon stop current) : 140mA• Low battery message : 3.30 ± 0.05V
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3.8.4 MAX17040G
3. Technical Brief
The classical coulomb-counter-based fuel gauges suffer from accuracy drift due to the accumulation of the offset error in the current-sense measurement. Although the error is often very small, the error increases over time in such systems, cannot be eliminated, and requires periodic corrections. The corrections are usually performed on a predefined SOC level near full or empty. Some other systems use the relaxed battery voltage to perform corrections. These systems determine the true SOC based on the battery voltage after a long time of no activity. Both have the same limitation: if the correction condition is not observed over time in the actual application, the error in th t i b dl I t f ll h /di h l i i d t li i t th d iftthe system is boundless. In some systems, a full charge/discharge cycle is required to eliminate the drift error.
1258R
K 074U1005
MAX17040G
9
7 4
8 1
6
5
3 2CELLVDD
SEO
EO
CTGSDA
GNDSCL DN
GP
C8550
1u
VBAT
02 58R
051
915 8R
0 51
C8551
10n
VREG_MSMP_2.6V
K2. 2225 8
R
K2.2325 8
R
1u
C8549
FUEL_I2C_SDAFUEL_I2C_SCL
FUEL GUAGE
3. TECHNICAL BRIEF
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LGE Internal Use Only
3.9 Memory Support
3. Technical Brief
The MSM7227 IC external memory support (Figure 3.9) includes the following major functions:
For high-speed memory devices – EBI1 port, DDR SDRAM controller, and the AXI memory controller (MemC) bridge for access to the AXI bus
For lower-speed memory devices, an LCD, and asynchronous devices like UBM – EBI2 port, a set of EBI2 controllers, and an AHB interface for access to the peripheral bus
i l hi h l l bl k diFigure3.9 Extemal memory support high-level block diagram
Table Memory and LCD configuration
Figure. 3.9 Extemal memory support high-level block diagram
Table.3.9 Memory and LCD configurations
3. TECHNICAL BRIEF
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LGE Internal Use Only
3.9.1 High-speed memory interface (EBI1)
3. Technical Brief
EBI1 provides connectivity between multiple bus masters and their high-bandwidth memory controllers. Using the AXI (Section 3.3.1) as a standard interface between bus masters and slaves ensures high-performance data transfers. The EBI1 high-level architecture (Figure 3.9.1) includes two major functional blocks:
AXI memory controller bridge – the interface block to the AXI bus interconnect. Its primary function is to communicate with command and data transfer masters through the interconnect; it supports most non-blocking features of the AXI bus protocol. g p
SDRAM controller – the memory controller that interfaces externally with DDR SDRAM devices, and internally with the AXI memory controller bridge over a 64-bit AHB-lite interface. Its primary function is to receive and execute SDRAM memory commands from the AXI memory controller bridge.
Figure3.9.1 EBI1 high-level archiecture
EBI1 connections
All EBI1-related pins are located in the same general area of the IC package. This allows optimal routing and should minimize interference from this bus to more sensitive functions (such as analog baseband). EBI1 layout guidelines are given in Section 4.3.3.2. A single 32-bit DDR SDRAM memory device or two 16-bit devices are supported (Figure 3.9.2).
3. TECHNICAL BRIEF
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LGE Internal Use Only
3. Technical Brief
Figure3.9.2 EBI1 intetface options
3. TECHNICAL BRIEF
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LGE Internal Use Only
Lower-speed memory interfaces (EBI2)
3. Technical Brief
The second external memory interface (Figure 3.9.3)provides the interface for slow peripheral devices such as LCDs, flash memory, and the UBM receiver. In order to support all these device types, the interface requires three different controllers:
- Serial flash controller – to access NAND and OneNAND devices - LCD controller – for LCD devices - External memory controller (EBI2_XMEM) – to access SRAM and generic asynchronous interface devices
(including the UBM receiver)
Figure3.9.3 EBI2 functional block diagram
General EBI2 features
1.8 V or 2.6 V memory interface support
Three categories of devices are supported - NAND or OneNAND via the serial flash controller- Display via the LCD controller
A h d i i h l ll (i l di UBM i )- Asynchronous devices via the external memory controller (including UBM receiver)
Boot from NAND or OneNAND In addition, specific EBI2 features are listed in each controller subsection.
3. TECHNICAL BRIEF
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LGE Internal Use Only
3. Technical Brief
Figure3.9.4 EBI2 example applition
3. TECHNICAL BRIEF
- 8� - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
L1015
1.2n C1013 33p
1001R
0
C1073 100p94 01
Cu1. 0
C1042 10n
C1041 1n
00 01R
IN
D
VREG_MSMP_2.6V
u1.07301
C
6301C
p001
5301C
u7.4
4301C
u 7.4
C1033
10u
u1.02301
C
5.1
R1007
R1006
5.1
VREG_RFRX1_2.7V
1n
C1031
C1030
0.1u
u1.09201
C
C1028 10np22
720 1C
12KR1003
C1072 22p
C1025 100p
RTR6285U1000
329282534396
62
61
60
54
4336
3738
2768
2552
2142
8
745
144
5347
2246
10
649
448
3
51
6750
1939
40
18
1741
16
1533
32
1331
1430
12
1159
58
956
24
557
55
65
6620
632
6426RF_ON TX_IP
TCXO TX_IN
SBDT TX_QP
TX_QN
LB_RF_OUT1
LB_RF_OUT2 VTUNE1
VTUNE2
HB_RF_OUT1 VTUNE_GPS
HB_RF_OUT2
HB_RF_OUT3 PRX_QP
PRX_QN
WPRXLBP PRX_IP
WPRXLBN PRX_IN
WPRXHBP
WPRXHBN DRX_QP
DRX_QN
WDRXLB DRX_IP
DRX_IN
WDRXHB1
WDRXHB2 NC
GCELL_INP DAC_IREF
GCELL_INN
VDDA1_1
EGSM_INP VDDA1_2
EGSM_INN VDDA1_3
VDDA1_4
DCS_INP VDDA1_5
DCS_INN VDDA1_6
GPCS_INP VDDA2_1
GPCS_INN VDDA2_2
VDDA2_3
GPS_IN VDDA2_4
PDET_IN VDDA2_5
TX_RBIAS VDDA2_6
WPRXSE1 VDDA2_7
WPRXSE2 VDDA2_8
VDDA2_9
VDDA2_10
VDDA2_11
VDDA2_12DN
GP
TU
O_2E
SX
RP
W
TU
O_1E
SX
RP
W
PNI_
XM_
BW
MNI_
XM_
BW
MD
DV
4.7u
C1024
p0013201
C
C1026 7p
C1038 27p
22p
C56
10u
C53
2201C
u1.0
VRF_SMPS_2.1V
VDD_RX
600
FB1001
FB1000
600
68p
C1012
C1011
68p
C1010
0.1u
u1.09001
C
u1.05001
C
4001C
u1.0
3001C
u 1.0
03R
2001C
u1. 01001C
u1.0
u1.00001
C
L1016
DNI
TCXO_RTR_19.2MHZ
RTR_DAC_REF
RTR_TXIP
RTR_TXIM
RTR_TXQP
RTR_TXQM
RTR_RXIPRTR_RXIM
RTR_RXQMRTR_RXQP
RTR_DRXIPRTR_DRXIM
RTR_DRXQMRTR_DRXQP
RTR6285_SSBI
RX_WCDMA_1900
GPS_IN
DCS_PCS_TX
GSM_TX
RX_PCS_PRX_PCS_M
RX_DCS_M
RX_GSM_900_PRX_GSM_900_M
RX_WCDMA_2100
PDET_IN
RX_DCS_P
RTR_TXON
WCDMA_800_TX_OUT
VSNS_RF_SMPS
RX_WCDMA_2100_LNA_OUT
RX_WCDMA_800_MRX_WCDMA_800_P
WB2100_MIX_INM
WB2100_MIX_INP
WCDMA_2100_TX_OUT
VDDA2 [2.1V] : Pin 1,7,8,21,25,27,37,43
VDDA2 [2.1V] : Pin 54,60,61,62==> PLL1, PLL2, GPS PLL, VCOs
==> DCS/PCS LNA, dirver amp, mixers and baseband Tx
VDDA1 [2.7V] : Pin 3,4,6,10,22,53
Close to RTR
==> Baseband Rx, WCDMA LNA, Cell/EGSM LNA
VDDA1: PIN 3,4,6,10,22,53 = 2.7V VDC
1%
1608 1608
VDDA2: PIN 1,7,8,21,25,27,37,43,54,60,61,62 = 2.1V VDC
1608
0603
0603
0603
06030603
0603
3.10 H/W Sub System
3.10.1 RF Interface
3. TECHNICAL BRIEF
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LGE Internal Use Only
A. RTR6285 (WCDMA_Tx/Rx)
MSM7227 controls RF part(RTR6285) using these signals.
RTR SSBI : SSBI interface signals to control RTR6285RX_I/Q_M/P,TX_I/Q_M/P : I/Q data for Tx/Rx of RF
B. The others
RTR_TRK_LO_ADJ : VC-TCXO(19.2MHz) Control PA_ON0,1: WCDMA(2100,800) TX Power Amp EnablePA_R0: Power Amp Mode ControlGSM_PA_RAMP: GSM Power Amp gain control signalGSM_PA_EN: GSM Power Amp EnableGSM_PA_BAND: Power Amp Band select Control
3. TECHNICAL BRIEF
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LGE Internal Use Only
3.10.2 MSM Sub System
3. Technical Brief
3.10.2.1 USIM Interface
The MSM side is powered by (or referenced to) VREG_MSME or VREG_MSMP voltage; the selection is made via SBI. VREG_MSME can be programmed from 0.75V to 3.05 V in 25-mV increments, while the VREG_MSMP options are 1.5 V to 3.05 V in 50-mV increments.The RUIM side is referenced to the VREG_RUIM output that can be set from 1.5 V to 3.05 V in 50 mV increments. Since the two sides (MSM device and RUIM) can run off different voltages, a level-translation is achieved. The RUIM side usually runs off either 1 8 V or 3 0 VThe RUIM side usually runs off either 1.8 V or 3.0 V.
SIM interface scheme is shown in Figure. And, there control signals are followed
SIM_CLK: SIM Clock SIM_Reset: SIM ResetSIM_Data: SIM Data T/Rx
MSM7227 PM7540 USIMMSM_USIM CLKMSM_USIM RSTMSM USIM Data
SIM IOSIM RSTSIM CLK
VREG_RUIM 3.0V
Figure. SIM Interface
MSM_USIM Data
3.10.2 MSM Sub System
3.10.2.1 USIM Interface
3. TECHNICAL BRIEF
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LGE Internal Use Only
PM7540PM7540
3.10.2.2 Universal asynchronous receiver transmitter (UART) Interface
The MSM7227 IC provides four UART ports capable of applications such as:
- Serial data interface that conforms to the RS-232 interface protocol- Handset’s serial data port for test and debug- External keypad or ringer interface
Wi h EEPROM fl h d l d d/ d f- With EEPROM or flash memory – used to load and/or upgrade system software
3. TECHNICAL BRIEF
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LGE Internal Use Only
3. Technical Brief
3.10.2.3 USB
The universal serial bus (USB) is an interconnection standard widely supported by the electronics industry. The USB 2.0 specification defines three operating data rates: low-speed (1.5 Mb/s); full-speed (12 Mb/s); and high-speed (480 Mb/s).
The MSM7227 IC supports one High Speed USB (HS-USB) USBH port with built-in PHY and one Full Speed USB-UICC port. The MSM7227 IC supports USB interfaces using two controllers:
The primary controller is the HS-USB port with an integrated physical layer (PHY). This HS-USB port is also capable of supporting USB operations at low speed and full speedcapable of supporting USB operations at low-speed and full-speed.
The secondary controller is the FS USB-UICC port, which only supports host mode functionality.
3. TECHNICAL BRIEF
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LGE Internal Use Only
3. TECHNICAL BRIEF
- 88 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
3.10.2.4 HKADC(House Keeping ADC)
3. Technical Brief
The MSM7227 IC has an on-chip 12-bit analog-to-digital converter (ADC) that is available for digitizing analog signals representing parameters such as battery voltage, temperature, and RF power levels. These parameters support handset-level housekeeping functions – various tasks that must be performed to keep the ‘house’, or handset, in order. This ADC is also used as a touch screen interface, so the acronyms TS-ADC and HK/TS-ADC are sometimes used. The HK/TS-ADC is a 12-bit successive-approximation circuit with a programmable resolution of 8, 10, or 12 bits. Its high-level block diagram is illustrated and explained in Figure 3.10.1.
Channel Signal Note
HKAIN0 - -
HKAIN1 HOOK ADC Earjack hook recogni e
Figure 3.10.1 HK/TS-ADC functional block diagram
Table. HKADC channel table
HKAIN1 HOOK_ADC Earjack hook recognize
HKAIN2 AMUX_OUT Delivery the battery temperature and Main PCB revision from PMIC to MSM
3. TECHNICAL BRIEF
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LGE Internal Use Only
3.10.3 Key Pad
3. Technical Brief
There are 55 buttons in Qwerty key, 3 main keys and 2 side keys in Figure. Shows the Keypad circuit. ‘END’ Key is connected Key_PWR_ON_N to PMIC(PM7540).
L3
100n223AV
433R
K2.2
VREG_MSMP_2.6V
C3030.1u
333R
K2.2
0.1uC302
470R332
023AV
913AV
813AV
713AV
470R331
PP2106M3
U301
41312 11 10198
157
166
175
184
193
202
211
2232425262728292D
NG
P
2D
NG
BTE
SE
R
IX O
X
LE
S_K L
C
DD
V
01P
TEST P40
SEL_28P P41
P57 P42
P56 P43
P55 P44
P17 P45
P15 P46
1D
NG
45P
35P
25P
15P
05P
74P
613AV
513AV
413AV
313AV
213AV
113AV
013AV
903AV
803AV
KB353
703AV
470R324
470R323
470R322
R321 470
470R320
470R319
470R318
R317 470
470R316
R315 470
470R314
R313 470
R312 470
K021
113R
KB351 KB350 KB356 KB355 KB349
KB352
KB348
323AV KB347
KB345KB344 KB357 KB354 KB343 KB342KB341 KB317
KB339KB338 KB337 KB336 KB335 KB334KB333
KB324
KB331KB330 KB329 KB328 KB327 KB326KB325
KB332
KB323 KB322 KB321 KB320 KB319KB318
KB340
KB316
KB315
KB314 KB313 KB312 KB311 KB310KB309
KB346
KB307KB306 KB305 KB304 KB303 KB302KB301
470R302
100nL5
KEY_COL[2]
QTKEY_SCL
KEY_COL[3]
KEY_ROW[7]
QTKEY_SDA
QTKEY_RESET
QTKEY_INT
KEY_COL[0] KEY_COL[1]
KEY_ROW[5]
KEY_COL[7]
KEY_ROW[6]
KEY_ROW[1]
KEY_COL[4]
KEY_COL[5] KEY_COL[6]
SPACE2
Key Coder ICQwerty 54key / 4pie DR
%1
1 2 3 4 5 6 7
BACK8 9 0 DEL ENTER1SEARCH
Q W E R T Y U
I O P Fn A SLANG
D F G H J K L
MENU
DOT
Z X C V SPACE1
B N MMANNER UP DOWN
HIPEN
END
COMA
SHIFT1
SHIFT2
HOME
HOMESENDLEFT RIGHT
3. TECHNICAL BRIEF
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LGE Internal Use Only
KB308
100n
L4
2L
n001
KEY_ROW[1]
KEY_COL[5]
ENTER2
KB101
001A
V
101A
V
501A
V
301A
V
201A
V
KB102
KB100
KPD_PWR_N
KEY_ROW[7]
KEY_ROW[7]
KEY_COL[6]
KEY_COL[7]
END
HOME
SEND
CN301
3
2
1
503AV
R309 100ohmsR308 100ohms
20 3AV
DK_Volume_DOWNDK_Volume_UP
VOLUME SIDEKEYChanged 03/24
From 4P to 3P
3. TECHNICAL BRIEF
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LGE Internal Use Only
3.10.4 Camera Interface
3. Technical Brief
L-04C Installed 3 Mega Pixel Auto Focus Camera.Below figure shows the camera board to board connector and camera I/F signal.
Figure. 3 Mega Camera module and Qwerty PCB 34Pin Board to Board Connector
10uC119
VREG_CAM_AVDD_2.7V
R110 12
GB042-34S-H10-E3000CN101
1716151413121110
98765
314323332341
30
29
28
27
26
25
24
23
22
21
20
19
18
VREG_CAM_DVDD_1.2V
120FB102
C1170.1u
VREG_CAM_AF_2.8V
VA1
VREG_CAM_IOVDD_1.8V
C3
DNI
0.1uC114
C1130.1u
FB101120
0.1uC112
VA101
C1111u
33p
C120
CAM_PWDN
CAM_RESET_N
FLT_CAM_DATA[7]FLT_CAM_DATA[6]
FLT_CAM_DATA[5]FLT_CAM_DATA[4]FLT_CAM_DATA[3]FLT_CAM_DATA[2]FLT_CAM_DATA[1]FLT_CAM_DATA[0]
CAM_MCLK
CAM_PCLK
FLT_CAM_VSYNCFLT_CAM_HSYNC
FLT_CAM_I2C_SDAFLT_CAM_I2C_SCL
3. TECHNICAL BRIEF
- 9� - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
3. Technical Brief
3 Mega Camera module is connected to Qwerty Key PCB with 34pin Board to Board connector. This interface is dedicated camera interface port in Camera ISP and also MSM7227.This interface is dedicated camera interface port in Camera ISP and also MSM7227.The camera port supply 26.6 MHz master clock to camera module and is received 79.8 MHz pixel clock , vertical sync signal, horizontal sync signal, reset signal and 8bits data from camera ISP. The camera module is controlled by I2C port from MSM7227.
3. TECHNICAL BRIEF
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LGE Internal Use Only
3.10.5 Qwerty slide OPEN/CLOSE Operation
3. Technical Brief
There is a magnet to detect the Qwerty slide OPEN/CLOSE status If a magnet is close to the hall-effect switch, the voltage at pin-out of Hall-effect switch goes to 2.6V. Otherwise, 0V.
This SLIDE_DETECT signal delivered to MSM7227.
Figure. Schematic of Qwerty slide OPEN/CLOSE detection circuit at Qwerty Key PCB
D207D208
U202
32
41VDD OUT
VSS NC
100nC203
VREG_MSMP_2.6V
C2020.1UF
SLIDE_DETECT
SLIDE DETECTChanged 03/24
Active : Low
3. TECHNICAL BRIEF
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LGE Internal Use Only
3.10.6 Numeric Keypad LED Light
3. Technical Brief
There are 3 White LEDs in RF_slide PCB, which are driven by SLIDE_KPD_DRV_N line from PM7540.
Figure. Numeric Keypad lighting Circuit
LD100CL-435F-WQT-SD-TS
4
3
2
1
LD102CL-435F-WQT-SD-TS
4
3
2
1
VA104
+VPWR
R103
33
R104
33
CL-435F-WQT-SD-TSLD101
4
3
2
1
R102
33
SLIDE_KPD_DRV_N
3. TECHNICAL BRIEF
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LGE Internal Use Only
3.10.7 LCD Module (TX08D39VM0BAA : Hitachi LCD module)
3. Technical Brief
- The TX08D39VM0BAA model is a Color TFT Main LCD Module. It is supplied by Hitachi Display Ltd. This main Module has a 3.2 inch diagonally measured active display area with 320 X 3(R,G,B)(W) X 480(H) dots resolution. Each pixel is divided into Red, Green and Blue sub-pixels and dots which are arranged in vertical stripes.
* Features- Display mode(Main LCD) : Transmissive Type, Normally Black Mode, In-Plane Switching Mode- LCD Driver IC & Driving Method : S6D05A1 (Source, Gate and Power IC)g- Interface : MDDI Interface
Figure. LCD Module Block Diagram
3. TECHNICAL BRIEF
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LGE Internal Use Only
* LCD Module InterfaceLCD module is connected to 25pin Zip connector (GB042-50P-H10-E3000)
3. Technical Brief
LCD module is connected to 25pin Zip connector (GB042 50P H10 E3000)The LCD module is controlled by MDDI from MSM7227.
Figure. LCD Module 25 pin Zip Connector (GB042-50P-H10-E3000)
2.2uC107
2.2uC106
D102
43
52
61
+VPWR
VREG_LCD_1.8V VREG_LCD_2.8V
04-6293-025-001-829CN103
25
24
23
22
21
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
ICMEF214P101MFL100
019
84736251
P1 P5P2 P6P3 P7P4 P8
1G
2G
C108
2.2u
LCD_MAKERID_LOW
MDDI_P_STB_MMDDI_P_STB_P
MDDI_P_DATA_MMDDI_P_DATA_P
LCD_RESET_N
LCD_VSYNC_O
WLED7WLED6
WLED1WLED2WLED3WLED4WLED5
3. TECHNICAL BRIEF
- 97 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
3. Technical Brief
No. Name Function
1 GND Ground
2 - Back Light Control of LED Driver
3 LCD_VSYNC_O Tearing Effect Signal
4 LCD_MAKERID_LOW Maker ID (Low : GND level)
5 GND Ground
6 MDDI P STB M MDDI strobe negative signal6 MDDI_P_STB_M MDDI strobe negative signal
7 MDDI_P_STB_P MDDI strobe positive signal
8 GND Ground
9 MDDI_P_DATA_M MDDI data negative signal
10 MDDI_P_DATA_P MDDI data positive signal
11 GND Ground
12 VREG_LCD_1.8V Power Supply for Interface I/O
13 VREG_LCD_2.8V Power Supply for Analog and Voltage booster block
14 LCD_RESET_N Reset
15 WLED7 Ground for LED
16 WLED6 Ground for LED
17 WLED5 Ground for LED
18 WLED4 Ground for LED
19 WLED3 Ground for LED
20 WLED2 Ground for LED
21 WLED1 Ground for LED
22 +VPWR Power Supply for LED
Table. Interface between LCD module and Folder FPCB
22 +VPWR Power Supply for LED
23 +VPWR Power Supply for LED
24 - Non Connect Pin
25 GND Ground
3. TECHNICAL BRIEF
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LGE Internal Use Only
3. Technical Brief
3.10.8 Touch Module (TSMC-P307A : LG Innotek)
- The TSMC-P307A model is a L-04C Touch Module. It is supplied by LG Innotek.This main Module has a 3.25 inch diagonally measured active display area.
* Features
Item Spec. Remark
Active Screen Size 3.25” Diagonal
Mechanical
Active Screen Size 3.25 Diagonal
Out Dimension (With Window) 50[W] x 94.2[H] [㎜]
Out Dimension (Only TSP) 49.6[W] x 82.57[H] [㎜]
View Area 46.09[W] x 68.63[H] [㎜]
Thickness 1.33 [㎜]
Input Method Finger .
Total light transmittance ≥ 80% 400 (Nippon Denshoku)Optical
g pp
Type Clear
Figure. Touch Module 10 pin B to B Connector (GB042-10P-H10-E3000)g p
CN100GB042-10P-H10-E3000
65
74
83
92
101
601AV
701AV
C109
1u
801AV
VREG_TOUCH_3.0V
TOUCH_INT
TOUCH_I2C_SCL
TOUCH_I2C_SDA
Touch Connector
1 pin : right, lower
3. TECHNICAL BRIEF
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LGE Internal Use Only
3.10.9 Q-coin Motor driver IC (TPA6202A1)
3. Technical Brief
- The TPA6202A1 is a 1.25W mono amplifier
*Features1.25 W Into 8Ω From a 5V Supply at THD = 1% (Typical)
CN601
2
1
L511 100n
L512 100n
523AV
423AV
Q601
C
B
E GND
IN
OUT
R619
100K
TPA6202A1ZQVRU601
B2C1
A1B1
B3C2
A3C3IN- VDD
IN+ VO+
_SHUTDOWN VO-
BYPASS GND
VREG_MOTOR_3.3VVREG_MOTOR_3.3V
K1
716R
100K
R622
51K
R620
51K
R621
C638
0.1u
10nC640
816R
K1
K7.4
32 6R
C639
1u
MOTOR_PWM
CONNECTOR Type
%1%1 1%
Q-coin MOTOR
1%
1%
1%
3. TECHNICAL BRIEF
- 100 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
3.10.10 Compass (AMI304)
3. Technical Brief
- The AMI304 is a n intelligent electronic compass that integrates three Magnet-Impedance sensor elements (MI-element) with their controller IC in a single small package.
- The controller IC of the AMI304 consists of a circuit for detecting the magnetic signals from three MI-sensor elements, an amplifier capable of compensating each sensors offset and setting appropriate sensitivity values, a thermal sensor for measuring the ambient temperature, a 12bit AD converter, an I2C serial interface circuit and a constant voltage circuit for power control.
470n
C2
6R
K3.3
1C
n01
U1AMI304
12
11
10
9
5
4
6
37
28
1D
DV
D
GE
RV
AD
NG
SD
NG
DD
VA
ADDR
SCL
NC1
TNI
VPP
DRDY
SDA
K3. 3
7R
TP1
VREG_PROX_COMPASS_2.6V
0R2
R4 0
PROX_COMPASS_I2C_SDA
PROX_COMPASS_I2C_SCL
COMPASS_DRDY
3. TECHNICAL BRIEF
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LGE Internal Use Only
<Pin description>
3. TECHNICAL BRIEF
- 10� - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
3.10.11 Proximity Sensor
3. Technical Brief
- The GP2AP002S00F model is a Proximity Sensor. It is supplied by SHARP. - GP2AP002S00F is equipped with a 7-bit address as a slave device on the I2C bus interface.
Through the SDA and SCL terminals, GP2AP002S00F’s registers can be set up, and also GP2AP002S00F’s sensing result can be read out.
No. Name Pin name
1 GND LED Anode
2 - LED Cathode
3 LCD_VSYNC_O Vcc
4 PROX_OUT Output
5 GND Ground5 GND Ground
6 VREG_PROX_COMPASS_2.6V Logic I/O output
7 PROX_COMPASS_I2C_SDA I2C DATA BUS
8 PROX_COMPASS_I2C_SCL I2C CLOCK
VREG_PROX_COMPASS_2.6V
VREG_PROX_COMPASS_2.6V
R100
4.7
u1 101C
TP1000.1u
C103C102
4.7u
R101
10
C100 4.7uU100 GP2AP002S00F
54
63
72
81LEDA SCL
LEDC SDA
VCC VIO
VOUT GND
PROX_COMPASS_I2C_SCL
PROX_OUT
PROX_COMPASS_I2C_SDA
Proximity SensorTuning point
3. TECHNICAL BRIEF
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LGE Internal Use Only
3.10.12 Accelerometer Sensor
3. Technical Brief
- The KR3DM model is a Accelerometer Sensor. It is supplied by STMicroelectronics. - The KR3DM is an ultra low-power high performance three axes linear accelerometer belonging to the
“nano” family, with digital I2C/SPI serial interface standard output.
* Features– Wide supply voltage, 2.16V to 3.6V
Lo oltage compatible IOs 1 8V– Low voltage compatible IOs, 1.8V– I2C/SPI digital output interface– 8 bit resolution
C810
0.1u
VREG_MSMP_2.6V
K2.2
308R
K2.2
408R
C809
4.7u
KR3DMU801
61
76
5
4
8
3
9
2
10
1
11
12
13
41512
DE
VR
ES
ER
DD
V
GND3
GND2
INT1
VDD_IO
RESERVED1
NC1
INT2
NC2
SC
SCL_SPC
GND1
OD
S_ID
S_A
DS
0A
S_O
DS
4D
NG
MOTION_INT
MOTION_I2C_SDA
MOTION_I2C_SCL
3. TECHNICAL BRIEF
- 104 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Pi d i ti<Pin description>
3. TECHNICAL BRIEF
- 105 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
3.10.13 Audio Signal Processing & Interface
3. Technical Brief
Audio signal processing is divided uplink path and downlink path.The uplink path amplifies the audio signal from MIC and converts this analog signal to digital signal and then transmits it to DBB Chip (MSM7227).This transmitted signal is reformed to fit in GSM & WCDMA frame format and delivered to RF Chipset. The downlink path amplifies the signal from DBB chip (MSM7227) and outputs it to receiver (or speaker).
The receive path can be directed to either one of two earphone amplifiers or the auxiliary output.The outputs earphone1 (EAR1OP, EAR1ON) and auxiliary out (AUXOP, AUXON) are differential outputs. p p ( , ) y ( , ) pEarphone2 (EAR2/EAR3) is a single-ended output stage designed to drive a headset speaker.
The microphone interface consists of two differential microphone inputs, one differential auxiliary input and a two-stage audio amplifier.
Figure. Audio Interface Detailed Diagram(MSM7227)
3. TECHNICAL BRIEF
- 106 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
3. Technical Brief
MSM7227 Audio part
Figure . Audio part schematics
C321
39p
6R
0
C31122u
0.1u
C310
VA305
u1.0703
C
603C
u1.0
u1.0503
C
303C
u1.0
323C
u1.0
47p
C301
MIC_BIAS
31C
51B
41B
31
B
8H
6F
5F
01J
01H
9H
01C
01B
9C
9B
8F
8E
7F
7E
7C
7B
6C
5C
6B
5B
PI_R_EN
IL
NI_
R_E
NI
LP
I_
L_E
NI
LNI_L_E
NIL
P1
CIM
N1CIM
P2CIM
N2CIM
PIXU
ANIX
UA
PO_ENIL
NO
_ENIL
PO_1RA
ENO_1R
AE
TUOX
UA
R_HP
HL_HPH
PMO
CC
SAIB_C
IM
FERV_
HP
H
KLC
SY
S_YHP
BSU
PD_Y
HP
BSU
ND_YH
PBSU
L_H
PH
R _H
PH
N_V
CR
P_V
CR
MD_
HB
SU
PD_
HB
SU
KLC
SY
S_H
BS
U
N1
_C
IM
CIM _
SH
P 1_C I
M
PO_
ENIL
NO_
ENIL
MIC_1P_PIN
nip 5E ot esol
C
3. TECHNICAL BRIEF
- 107 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
3. Technical Brief
3.5 Ear Jack
Figure . Audio part schematics
312 R
I ND
ZD20
1ZD
202
ZD20
5
C21
6
100p
412 R
I ND
FB20
218
00
FB20
318
00
C20
6
4.7u
R21
6
100K
1800
FB20
1
0.1u
C21
247
p
C21
033
p
C20
8
2.2u
C20
7
912 R
K74
47p
C20
4
402D
VR
EG
_MS
MP
_2.6
V
K2. 2
302R
33p
C20
1
202D
102D
202R
K001
1800
FB20
4
U20
1
5
32
41
VO
UT
VIN
GN
DS
TBY
DNGP
001 Q
D
G
S
022 R
M1
VR
EG
_MS
MP
_2.6
V
J201
2 3 6 5 4 1M
5_M
IC
M4_
L
M3_
DE
TEC
T
M4D
-DE
TEC
T
M1_
R
M6_
GN
D
HO
OK
_AD
C
EA
R_R
EA
R_L
HS
_MIC
_BIA
S_E
N
HS
_MIC
EA
R_S
EN
SE
AU
DIO
_GN
D
3.5
EA
R_J
AC
K
MA
TIN
G
EA
R_S
EN
SE
UN
MA
TIN
G
STA
TE
LOW
(DE
FAU
LT)
HIG
H
5/10
Add
ed
3. TECHNICAL BRIEF
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LGE Internal Use Only
3. Technical Brief
Audio Sub system
Microphone
Figure . Audio part schematics
FB701600
C710
39p
307R
02
407R
02
R724 47KC783
10u
C711
39p
C712
39p
C713
39p C715
0.1uR725 47KC717 1u
C716 1u
C707 47n
47nC706
K7.4
11R
9R
K7.4
VREG_MSMP_2.6V
0.1u
C701C700
2.2u
C714
0.1u
C9002.2u
470nC708
C709 470nU701
WM9093ECS-R
3B
A4
C3
C2
2B
D1
D3
4D
C1
A1D2
1B
D5
A2
A5
A3B5
4B
C5
4C
DN
G
OUT+D
DV
PH
CPVDDCPVSS
CN
HPL
OUT-
SAI
B
IN2- HPR
IN1+
DD
VS
IN3-
IN2+
AD
S
IN1-
IN3+
CP
LC
S
C722
2.2u
+VPWR_AUDIO
2.2uC719
2.2u
C723
2.2uC720
VREG_MSME_1.8V
HPH_LHPH_R
RCV_N
RCV_P
SPK_RCV-SPK_RCV+LINE_OP
LINE_ON
EAR_REAR_L
AUDIO_I2C_SDAAUDIO_I2C_SCL
AUDIO SUBSYSTEM
MIC1
6
5
4
3
2
1OUT
G1
G2
G3
PWR
G4
1 02R
IN
D
512C
p51
4 12C
u 01
312C
p74
FB1 1800MIC_1PMIC_1N
MIC_BIAS
3. TECHNICAL BRIEF
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LGE Internal Use Only
* Audio Mode
3. Technical Brief
MODE Device Description
Voice Call
Receiver Mode Receiver Voice Call
Loud Mode Speaker Phone
Headset Headset Voice Call
Loud Mode Speaker OGG Bell
Table Audio Mode
OGGLoud Mode Speaker OGG Bell
Headset Headset OGG Bell
SD contentsLoud Mode Speaker MP3
Headset Headset MP3
Table. Audio Mode
Audio & Sound Main Component
There are 5 main components in L-04C
Component Design No. Maker Part No. Note
1 MSM7227 U302 MSM7227 Base-Band Modem
2 3.5 Ear Jack J201 KJA-PH-0-0176 3.5 Φ Ear Jack
3 Audio sub system U701 WM9093ECS-R Mono Class D Speaker driverMono Class AB earpiece driver
4 Speaker & Receiver
1810-8T-05W1P 8 ohm DUAL MODE SPEAKER
Table. Audio main component list
Receiver
5 MIC MIC1 SPM0410LR5H-QB - 38 dB microphone
3. TECHNICAL BRIEF
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LGE Internal Use Only
3.11 Main features
1. Main Features
Mech. : Full touch Qwerty Slide Smart Phone
RF: WCDMA with HSDPA (Category 8) / HSUPA (Category 5)- UMTS : 800 / 2100 , GSM 900/1800/1900
Modem: MSM7227
OS: Android 2.2 (Froyo)
Di l 3 2" HVGA (320 480) TFTDisplay : 3.2",HVGA (320x480) TFT
Touch : Capacitive Multi Touch
Camera : 3M AF, Sony(1/5")
Memory : 8G NAND+4G DRAM & Micro SD Card
Media : MP3, OGG bell
Battery : 1350mAh UF564447F (Li-ion) / Sanyo
Connectivity : USB 2.0, Bluetooth, 3.5 Φ Ear-jack
SPK/RCV : 18 X 10, 8Ω, DUAL MODE SPEAKER
I/O : Micro 5 Pin USB
Function : GPS, Wi-Fi, Bluetooth
Sensor : Accelerometer, Proximity, Digital Compass
3. TECHNICAL BRIEF
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LGE Internal Use Only
3.12 RF Component
FL1005
FL1006
U1004
U1003
FL1003
FL1002
U1000
U1002 FL1004
FL1001
SW1000
U400
U302
U1002
U704 X300
U1001
FL1000
3. TECHNICAL BRIEF
- 11� - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Diagram Ref. No Part Name Function Comment
RF
U1003 SKY77701 21000 PAM TX
U1004 SKY77704 800 PAM TX
FL1001 D5017 FEM Band selection/TX
SW1000 MS-156C Test Connector Calibration etc
FL1003 SAYFP1G95AA0B00 W2100 Duplexer Tx/RX
FL1004 SAYFP836MCA0F00R00 W800 Duplexer Tx / Rx
FL1005 SAFEB836MAL0F00 W800 SAW TX
FL1006 SAFEB1G95KA0F00 W2100 SAW TX
U1002 SKY77336 QUAD GSM PAM TX
FL1002 SAFEB2G14FB0F00 W2100 SAW RX
U1000 RTR6285 RF Transceiver Tx / Rx
Diagram Ref. No Part Name Function Comment
RF
U400 MT29C8G96MAGAPDZA-5IT Memory 8G/4G
U302 MSM7227 Main Control Main Chipset
U704 PM7540 Power Control Power Supply
X300 TG-5010LH(19.2M)-75A VCTCXO 19.2MHz
U1002 LBEH19UNBC-338 WiFi/BT Transceiver Tx / Rx
U1001 RF2815 GPS LNA Rx
FL1000 SAFEB1G57KB0F00 GPS SAW Rx
3. TECHNICAL BRIEF
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LGE Internal Use Only
3.13 Main Component
2. Main Components
Main board, Top
Main board, Bottom
3. TECHNICAL BRIEF
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LGE Internal Use Only
2. Main Components
Qwerty board, Top
Qwerty board, Bottom
3. TECHNICAL BRIEF
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LGE Internal Use Only
2. Main Components
RF-Slide board, BottomRF-Slide board, Top
B TO B board, BottomB TO B board, Top
3. TECHNICAL BRIEF
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LGE Internal Use Only
- Logic
2. Main Components
Main board, Top
Reference Part Number DescriptionCN700 HSMU-5SB-24DR2 connector、I/O
Q1、Q2 QST4 TR、Bipolar
Q3 SIA431DJ FET
U301 NC7SV00P5X_NL IC、MCP、NOR
U1005 MAX17040G IC、Fuel GaugeC、 ue Gauge
U704 PM7540 IC、PMIC
IC1 TS5USBA33402YZPR IC、MUICU302 MSM7227 IC、Digital Baseband Processor、3 GU701 WM9093ECS-R IC、Audio Sub System
U801 KR3DM IC、Acceleration Sensor
U300 74LVC1G79GM IC、Flip Flop
U400 MT29C8G96MAZAPDJA-5 IT MCP
Main board, Top
U400 MT29C8G96MAZAPDJA-5 IT MCP
X300 KT3225L19200DCW28RA0 Oscillator、VCTCXO
X700 FC-135 Crystal
3. TECHNICAL BRIEF
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LGE Internal Use Only
2. Main Components
- Logic
Main board, Bottom
Reference Part Number Description
CN900 24-5804-080-000-829+ Connector、BtoB
J800 KP09N-6S-2_54SF Sim Card Socket
SW1001 UFL-R-SMT10 Connector、RF
SW1000 MS-156C Connector、RF
FL700 NFM18PC104R1C3 Filter、EMI/Power
CN701 KQ03LP1-3R Connector、Battery
U700 MAX14528 IC、Over Voltage Protection
U802 BU28TD2WNVX IC、LDO Voltage Regulator
Main board, Bottom
3. TECHNICAL BRIEF
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LGE Internal Use Only
- Qwerty PCB
2. Main Components
Qwerty PCB ASSY, Top
Reference Part Number Description
CN401 GB042 50S H10 E3000 C t Bt B
Qwerty PCB ASSY, Top
CN401 GB042-50S-H10-E3000 Connector、BtoB
U301 PP2106M3 IC、Key Encoder
U1 AMI304 IC、Digital Compass Sensor
U202 S-5711AC이-I4T1G IC、Hall IC
3. TECHNICAL BRIEF
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LGE Internal Use Only
- Qwerty PCB
2. Main Components
Qwerty PCB ASSY, Bottom
Reference Part Number Description
CN101 GB042-34S-H10-E3000 Connector, BtoB
CN402 24-5804-080-000-829+ Connector, BtoB
CN601 24-8000-002-000-829 Connector, I/O
J201 KJA-PH-0-0176 EarJack
CN1 SCHA4B0402 Socket, SD Card
SW401 UFL-R-SMT10 Connector, RF
Q601 KRC402E TR BipolarQ601 KRC402E TR, Bipolar
Q100 SI1305-E3 FET
U101 AAT2870 IC, Sub PMIC
U103 NLSX4373MUTAG IC, Level Translator
U102 NLSV1T244MUTBG IC, Level Translator
U601 TPA6202A1ZQVR IC, Motor Driver IC
CN4, CN5 HJ-BCT-04Y ANT Contact
Qwerty PCB ASSY, Bottom
MIC1 SPM0410LR5H-QB Microphone, Condenser
FL1, FL101, FL102 ICVE10184E070R100FR Filte, EMI/Power
3. TECHNICAL BRIEF
- 1�0 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
- RF-Slide FPCB
2. Main Components
Reference Part Number Description
CN100 GB042-10P-H10-E3000 Connector、BtoB
U100 GP2AP002S00F IC、Proximity
RF-Slide FPCB ASSY, TOP RF-Slide FPCB ASSY, Bottom
SUB FPCB ASSY, TOP, Bottom
FL100 ICMEF214P101M Filter、EMI/Power
CN102 GB042-50P-H10-E3000 Connector、BtoB
CN103 04-6293-025-001-829 Connector、FFC/FPC/PIC
BAT100 311HR-VG1 Coin Battery
3. TECHNICAL BRIEF
- 1�1 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
- BTOB FPCB
2. Main Components
BTOB FPCB, Top BTOB FPCB, Bottom
Reference Part Number Description
CN1 14-5804-080-000-829+ Connector、BtoB
CN2 14-5804-080-000-829+ Connector、BtoB
BTOB FPCB, Top BTOB FPCB, Bottom
BTOB FPCB, Top, Bottom
、
4. TROUBLE SHOOTING
- 1�� - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
4.1 Checking VCXO Block
The reference frequency (19.2MHz) from X10 (TCXO) is used in UMTS TX part, GSM part and BB part.
4. TROUBLE SHOOTING
R10 0
10n
C313
R306
100
19.2MHzX300
KT3225L19200DCW28RA0
42
31VCONT OUT
GND VCC
C309
100p
33
R309
C312 1n
1n
C314
VREG_TCXO_2.85V
VREG_MSMA_2.6V
C315 100p
C316
0.1u
100K
R313
0.1u
C319
NC7SV00P5X_NLU3013
2
4
15
VCC
GNDSC1
1
SC2
1
TCXO_RTR_19.2MHZ
TCXO_PM_19.2MHZ
TCXO_EN
USBH_SYSCLK
RTR_TRK_LO_ADJ
1.0T
TCXO Circuit
Clesed to TCXO
TP1
TP2
TP4
TP3
4. TROUBLE SHOOTING
- 1�3 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Check TP1VCC of VCXO
VCC ≥ �.8V Check TP1 of PMIC (U704)No
Yes
Check TP�TRK_LO_ADJ
�V ≥ Voltage ≥ 1V Check TP� of MSM (U30�)No
Yes
Check TP3,4With Oscilloscope
�V ≥ Voltage ≥ 1V Check soldering and components
No
Yes
VCXO is OKCheck other part
4.2 Checking FEM SW Block
4. TROUBLE SHOOTING
- 1�4 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Logic Table of the Front End Module
Check Soldering ofANT_SEL 0, 1, �,3 High Level
1.5V < Voltage < 3.0V Check TP1No
Yes
Check the Logic in each mode
Checking Switch Block power source
4. TROUBLE SHOOTING
- 1�5 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4.3 Checking UMTS Block
4.3.1 Checking TX POWER of UMTS2100MHz
990 1C
n8.1
C1101
0.5p
L1029
15n
2801C
n3.3
FL1003 B7697
1950MHz, 2140MHz
958472
3
6 1RXANT
TX
GND1 GND4GND2 GND5GND3 GND6
TP1
C1053
1.5n
DNI
C1051
MS-156CSW1000
43
2
1ANT COMMON
G3 G4
L1003
68n
L1002
68n L1027
2.7n
FL1006SAFEB1G95KA0F00
1950MHz5 2
4 1
3G3
INOUTG1G2
L8057
DNI
C10863.3n
0011C
n6.5
TP2
TP4TP3
4. TROUBLE SHOOTING
- 1�6 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Run a FTM program set RF mode to �100 set uplink freq.
To 1750 Click Tx On and WCDMA set PA Range R0 and
R1 on set Tx AGC to 330
Check a current over
500mA?
Check TP4 over -5dBm?
Check a PAM (U1003)
Check TP1over �7dBm?
Check TP1
Check TP� over �4dBm?
Check FL1003 and TP�
Check TP3 over �3dBm?
Check TP3
Tx is OK
No
Yes
Yes
Yes
Yes
No
Yes No
No
No
Check RTR and FL1006?
4. TROUBLE SHOOTING
- 1�7 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Checking TX POWER of UMTS 800MHz
Measured value and spectrum of TP1
Measured value and spectrum of TP2
Measured value and spectrum of TP3
26.77
24.66
23.34
4. TROUBLE SHOOTING
- 1�8 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
FL1004B7671
836.5 MHz,881.5 MHz
95
7
3
1
2
8
4
6ANT
GND2
RX_OUT2
GND1
RX_OUT1
TX_IN
GND4
GND3 GND5
DNIL1031
L1033
1p
L1026
6.8n
TP1
C1053
1.5n
DNI
C1051
MS-156CSW1000
43
2
1ANT COMMON
G3 G4
L1003
68n
L1002
68n
FL1005
SAFEB836MAL0F00
836.5MHz3 2
4 1
5GND
INOUTG1G2100p
L1024
L1032
DNI
L1034
8.2n
C8555
DNI
TP2
TP4TP3
4. TROUBLE SHOOTING
- 1�9 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Run a FTM program set RF mode to 800 set uplink freq.
To 835 Click Tx On and WCDMA set PA Range R0 and
R1 on set Tx AGC to 330
Check a current over
500mA?
Check TP4 over -5dBm?
Check a PAM (U1004)
Check TP1over �7dBm?
Check TP1
Check TP� over �4dBm?
Check FL1004 and TP�
Check TP3 over �3dBm?
Check TP3
Tx is OK
No
Yes
Yes
Yes
Yes
No
Yes No
No
No
Check RTR and FL1005?
4. TROUBLE SHOOTING
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LGE Internal Use Only
Measured value and spectrum of TP1
Measured value and spectrum of TP2
Measured value and spectrum of TP3
26.39
24.43
23.55
23.43 dBm
23.43 dBm
22.55 dBm
4. TROUBLE SHOOTING
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4.3.3 Checking UMTS PAM Control Block
PAM control signal
TP1 : PWR_DET : UMTS Tx Power Detected value.
TP2, 2* : PA_ON0, PA_ON1 : UMTS2100, UMTS800 PAM enable (about 2.6V)
TP3, 3* : OCP_+VPWR : UMTS2100, UMTS800 PAM Main Voltage ( 3V <VPWR < 4.2V)
TP3
C1098 1n
C1096
100p100p
C1095
680p
C1094680p
C1093C1091
4.7u
+VPWR
3201R
011
56
R1022
1201R
011
U1004SKY77704-15
6 5
7 4
8 3
9 2
10 1
11PGND
VCC1VCC2
RFINRFOUT
VMODE_1CPL_IN
VMODE_0GND
VENCPL_OUT
C1104
56p
PA_R0PA_ON1PDET_IN
8.5dB
4.3.3 Checking UMTS PAM Control Block
PAM control signal
TP1 : PWR_DET : UMTS Tx Power Detected value.
TP2, 2* : PA_ON0, PA_ON1 : UMTS2100, UMTS800 PAM enable (about 2.6V)
TP3, 3* : OCP_+VPWR : UMTS2100, UMTS800 PAM Main Voltage ( 3V <VPWR < 4.2V)
+VPWR
51
R1024
680p
C1092C1090
680p
100p
C1089
100p
C1088
33p
C1087
SKY77701U1003
6 5
7 4
8 3
9 2
10 1
11PGND
VCC1VCC2
RFINRFOUT
VMODE_1CPL_IN
VMODE_0GND
VENCPL_OUT
4.7u
C57
PA_ON0PA_R0
TP3
TP3*
TP2
TP2*TP1
4. TROUBLE SHOOTING
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4.3.4 Checking RF Rx Level of UMTS 2100/800MHz
990 1C
n8.1
C1101
0.5p
L1029
15n
2801C
n3.3
FL1003 B7697
1950MHz, 2140MHz
958472
3
6 1RXANT
TX
GND1 GND4GND2 GND5GND3 GND6
4.3.4 Checking RF Rx Level of UMTS 2100/800MHz
TP2
FL1002SAFEB2G14FB0F00
2140MHz 45
1
32G1 O1
ING2 O2
L10782.7n
C1076
0.5p
L1020
1n
C1075
2.2n L1019
1n
C1053
1.5n
DNI
C1051
MS-156CSW1000
43
2
1ANT COMMON
G3 G4
L1003
68n
L1002
68n
TP1FL1004B7671
836.5 MHz,881.5 MHz
95
7
3
1
2
8
4
6ANT
GND2
RX_OUT2
GND1
RX_OUT1
TX_IN
GND4
GND3 GND5
DNIL1031
L1033
1p
L1026
6.8n
TP3*
TP2*
TP3*
TP4
TP4
TP3
4. TROUBLE SHOOTING
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Check vbias / vbias’ over �V? Check bias block solderingNo
Yes
Rx is OK
Chack TP1/TP1* signal exist? Check ANTNo
Yes
Check TP� / TP�*signal exist? Check FEM FL1001No
Yes
Check TP4 / TP4*signal exist? Check U1007No
Yes
Set the phone Rx is ON
Check TP3 / TP3*signal exist? Check Duplexer FL1003, FL1004No
Yes
TP* : UMTS 800 Rx PATHTP : UMTS �100 Rx PATH
4. TROUBLE SHOOTING
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4.4 Checking GSM Block
4.4.1 Checking GSM PAM Block
TP1. GSM_PA_RAMP : Power Amp Gain Control. typically, 0.2V < Vramp < 1.45V
TP2. OCP_+VPWR : PAM Supply Voltage Vcc higher than 3.0V
+VPWR
9101R
180
C106039p
8 101R
120
39p
C1059
R1017
51SKY77336U1002
23 2224 2125 2026 1927 1828 17
9 810 711 612 513 414 315 216 1
DCS_PCS_INDCS_PCS_OUT
BSGND6
TX_ENGND5
VBATTVCC_OUT
VAPCGND4
NCGND3
GND1GND2
GSM_INGSM_OUT
PGND1PGND12
PGND2PGND11
PGND3PGND10
PGND4PGND9
PGND5PGND8
PGND6PGND7
6101R
120
5101R
180
R1014
2.2K
30
R1013
C1070
10u
GSM_PA_EN
GSM_PA_RAMP
GSM_PA_BAND
GND DCS_PCS_TX
GSM_TX
DCS1800(1710-1785 MHz)PCS1900(1850-1910 MHz)
GSM900(880-915 MHz)
2mm
5dB
8dB
TP2
TP1
4. TROUBLE SHOOTING
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4.4.2 Checking RF Rx Block of GSM Bands
1.8pC1068
DNI
L101418n
L1013
1.8pC1067
C1062 2.2p
L1009
3.9nDNI
L1010
C1064 2.2p
L1008DNI
C1063 2.2p
L10074.7n
FL1001D5017
850,1900,2100MHz
65437
11
9
22
21
20
1324
1223
10
158
141
17
162
19
18PCS_RX1
PCS_RX2
ANT PCN_RX1
PCN_RX2
GND1 EGSM_RX1
GND2 EGSM_RX2
GND3
GND4 GSM850_RX1
GND5 GSM850_RX2
WCDMA_2100
WCDMA_850
WCDMA_1900
PCN_PCS_TX
GSM850_EGSM_TX
DD
V
1LRT
C
2LRT
C
3LRT
C
4LRT
C
C1061 2.2p
RX_PCS_P
RX_PCS_M
RX_DCS_M
RX_GSM_900_P
RX_GSM_900_M
RX_DCS_P
WCDMA_2100_RTX
WCDMA_800_RTX
DCS(1805-1880 MHz)
GSM(925-960 MHz)
PCS(1930-1990 MHz)
TP3
TP3
TP2
TP2
TP1
TP1
4. TROUBLE SHOOTING
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*** WCDMA FTM control order using QPST
1
2 3 4
5
6
7
8
1. Choose mode – WCDMA 2. Choose com port 3. Choose FTM 4. Click Mode Control button 5. Choose band – 2100MHz or 800MHz 6. Choose channel & enter 7. Tx control pannel 8. Write wanted AGC value & enter – WCDMA : 344
*** WCDMA FTM control order using QPST
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*** GSM FTM control order using QPST
1
2 3 4
5
6
7
8 9
1. Choose mode – GSM 2. Choose com port 3. Choose FTM 4. Click Mode Control button 5. Choose band – EGSM or DCS or PCS 6. Choose channel & enter 7. Check on Tx on 8. Write wanted PA DAC value - GSM : 15000 9. Click PA DAC input button
*** GSM FTM control order using QPST
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4.5 GPS
4.5.1. GPS RECEIVER
The GPS receiver input employs a single-ended connection realized by this pin. The GPS input is routed from the GPS antenna, through a band pass filter and then an impedance transformer circuit that optimally matches the impedance looking into the GPS LNA. The impedance transformer circuit topology is shown in Figure 4.1.
Figure 4.1. The impedance transformer circuit topology
4.5.2. GPS RECEIVER SPECIFICATION
Receive Frequency 1574.42 MHz ~ 1576.42 MHz
Minimum Sensitivity 1 satellite ≥-142dBm, 7 satellites ≥ -147dBm at coarse time aiding
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4.5.3. GPS OFF-CHIP RF COMPONENTS
4.5.3.1. GPS LNA (RF2815)
The RF2815 is a GPS Low Noise Amplifier with an integrated SAW filter at the output. Low noise figure, along with high gain, achieved by the RF2815 makes it ideal for GPS receivers requiring high sensitivity. This module builds upon RFMD’s leading edge pHEMT process and integrates input matching and low loss high rejection SAW filter at the output. This results in high performance and a reduced solution size. The ease of implementation simplifies the receiver design. The RF2185 is packaged in a compact 3.3mmx2.1mmx1.0mm package with low external component count required to achieve the best-in-class performance. The block diagram of RF2815 is shown in Figure 4.2.
Figure 4.2. RF2815 block diagram
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4.6 Bluetooth/WLAN OFF-CHIP RF COMPONENTS
4.6.1. Bluetooth/WLAN Module (LBEH19UNBC-338)
The L-04C device provides the highest level of integration for a mobile wireless system, with integrated IEEE802.11 b/g, Bluetooth 2.1. The LBEH19UNBC that is included of BCM4325 solution is supported three kinds of functions. It is the one antenna structure which is supported of WLAN/Bluetooth in 2.4GHz band.
Figure 4.3. Block diagram of Bluetooth/WLAN module in L-04C
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Figure 4.4. Pin layout of Bluetooth/WLAN module in L-04C
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Table 4.1. Pin description of Bluetooth/WLAN module in L-04C
Table 4.2. Rating of Bluetooth/WLAN module in L-04C
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Table 4.3. Operating condition of Bluetooth/WLAN module in L-04C
Table 4.4. Power consumption of Bluetooth/WLAN module in L-04C
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4.6.1.1. BLUETOOTH
The L-04C provides the Bluetooth 2.1 + EDR specification. The Bluetooth module is the optimal solution for any voice or data application that requires the Bluetooth SIG standard Host Controller Interface (HCI) using a high-speed UART and PCM. The Bluetooth solution has an integrated radio transceiver that has been optimized for 2.4GHz Bluetooth wireless systems. It has been designed to provided low-power, low-cost, robust communications for applications operating in the globally available 2.4GHz unlicensed ISM band. It is fully compliant with the Bluetooth Radio Specification and meets or exceeds the requirements to provide the highest communication link quality of service. It shows the Bluetooth system architecture in the L-04C in Figure 4.3.
Figure 4.5. The Bluetooth system architecture in the L-04C
4.5.
System HW Block Diagram ; BLUETOOTH & Wi-FiBT_UART_TXDGPIO45
BT_RXD
BT_UART_RXD
BT_UART_CTS
BT_UART_RTS
GPIO45
GPIO46
GPIO43
GPIO44
BT_PCM_INGPIO68
GPIO69
BT/Wi-Fi
ANTENNA
BT_TXDBT_RTSBT_CTS
BT_PCM_DOUTBT_PCM_DIN
BT_PCM_OUT
BT_PCM_CLK
BT_PCM_SYNC
GPIO69
GPIO71
GPIO70
BT_RESET_N
BT_WAKEUP
RF_IN_OUT
BT GPIO 0
_ _
BT_PCM_CLKBT_PCM_SYNC
BT_RST_N
GPIO42
GPIO123
PM7540SLEEP_CLK
BT_HOST_WAKEUP
SLEEP_CLK
GPIO83
SLEEP_CLK
BT_GPIO_0
MSM7227
BT_GPIO_1
GPIO42
PM7540
VDD
VBAT_IN
VREG_MSMP_2.6V VREG_MSMPGPIO62
WLAN_CMD
+VPWR
WLAN_CLKWLAN_SDIO[3]WLAN_SDIO[2]WLAN SDIO[1]
SDIO D1
SDIO_D2
SDIO_D3
SDIO_CLK
SDIO_CMDGPIO63
GPIO64
GPIO65
GPIO66
GPIO94
GPIO93
CLK_REQ
WLAN HOST WAKE B
_ [ ]WLAN_SDIO[0]
WLAN_RESET_NWLAN_WAKEUPWLAN_REG_ONWLAN HOST WAKEUP
WLAN_REG_ON
WLAN_WAKEUP
WLAN_RESET_N
SDIO_D0
SDIO_D1
LDOGPIO23
GPIO66
GPIO67
GPIO122
26MHZTCXO
F_CLK_IN
GPIO94
BT / Wi-Fi
WLAN_HOST_WAKE_BWLAN_HOST_WAKEUP
VDD_TCXO
LBEH19UNBC-338
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4.6.1.2. WLAN
The L-04C supports single-band 2.4GHz IEEE802.11b/g standardization. The WLAN module which is consisted of the BCM4325 single chip device provides for the highest level of integration for a mobile or handheld wireless system, with integrated IEEE802.11TM b/g (MAC/baseband/radio). The BCM4325's integrated CMOS WLAN 2.4GHz power amplifier provides sufficient output power to meet the need of most WLAN devices. The interface between MSM7227 and WLAN module is the standard interfaces SDIO v1.2 (4-bit and 1-bit). Figure 4.4 shows the WLAN system architecture in the L-04C.
Figure 4.6. The WLAN system architecture in the L-04C
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4.7 GPS, Wi-Fi/BT RF COMPONENTS
4.7.1. GPS RF COMPONENTS
Figure 4.7. GPS RF component, Main Bottom side
Reference Description
ANT801 GPS Chip Antenna
FL1000 GPS Saw Filter
U1001 GPS LNA
Table 4.5. GPS RF components
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4.7.2. BT/Wi-Fi RF COMPONENTS
Figure 4.8. BT/Wi-Fi RF component, Main Bottom side
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Figure 4.9. BT/Wi-Fi RF component, Main Top side
Reference Description
ANT800 BT/Wi-Fi Chip Antenna
U802 BT/Wi-Fi TCXO LDO
U800 BT/Wi-Fi Module
Table 4.6. BT/Wi-Fi RF components
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4.8 GPS, Wi-Fi/BT SIGNAL PATH
4.8.1. GPS SIGNAL PATH
Figure 4.10. GPS signal path (GPS Rx path)
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4.8.2. BT/Wi-Fi SIGNAL PATH
Figure 4.11. BT/Wi-Fi Signal Path (BT/Wi-Fi Tx Rx Path)
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4.9 GPS, BT/Wi-Fi TROUBLE SHOOTING
4.9.1. A-GPS BLOCK
Figure 4.12. Test Points of LNA for the GPS in the L-04C (Schematic)
Figure 4.13. Test Points of LNA for the GPS in the L-04C
C8554
2.5p
C85531n
L1000 8.2n
R1002
1K
C1016
15n
C1050
DNI
L8056 1n
p001
0401C
RF2815U1001
3
2
5
4
1NI_F
R
FIL_OUT
VDD
S_D
GND
C1019 33p
C1018DNI
VREG_RFRX1_2.7V
DNIC1017
FL1000SAFEB1G57KB0F00
1575.42 MHz 5 3 2
4 1INOUT
G1G2G3
C1007
18p
DNIC1015
C10140.1u
C1039
5.6n
ANT801
ODGPPTR3015
2
31
4DUMMY3
FEED DUMMY2
DUMMY1
L1011
100n
L1001 5.6n
GPS_LNA_EN GPS_IN
TP1
TP2
4. TROUBLE SHOOTING
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Set the GPS is ON
The Voltage levelat TP1≒�.7V Check power LRC fiter soldering.
No
Yes
Check the RTR circuit and the peripheral circuit or the other parts.
The Voltage levelat TP�≒�.6V Check SW and NV item
No
Yes
4. TROUBLE SHOOTING
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4.9.2. BT/Wi-Fi BLOCK
U800LBEH19UNBC-338
039282726252423222120291817161
31
3215
14
33
3413
3512
3611
3710
389
398
407
6
415
4
42
433
442
45
1
6474849405152535451
DN
G
2D
NG
3D
NG
4D
NG
B_E
KA
W_TS
OH_L
W
DXT_T
RA
U_TB
N_ST
C_TR
AU_T
B
N _ST
R_TR
AU_T
B
DX
R_TR
AU_T
B
ANT
BT_PCM_CLK
GND5 BT_PCM_OUT
VDD_WL_PA BT_PCM_SYNC
BT_PCM_IN
SDIO_CMD
SDIO_CLK VDD_BT_PA
SDIO_D3
SDIO_D2 S_CLK_IN
SDIO_D1 GND6
SDIO_D0 FM_ANT
WL_RST_N BT_GPIO_0
WL_WAKE_B BT_GPIO_1
REG_ON BT_GPIO_3
VBAT_IN BT_GPIO_4
BT_GPIO_7
SR_VLX1
SR_VLX1BB F_CLK_IN
F_CLK_OUT
BB2
XLV_
RS
BBT
UO
V_R
S
OID
DV
UP _L
ATX
DS_
OID
DV
TU
O_2P1 _
G ID
TU
O_ 2P1_
GLN
A
ODL
V2P1_
NIV
TU
O_2O
DLNL
AD
S_TB
LC
S_TB
1OI
DU
A
2OI
DU
A
N_TS
R_TB
7D
NG
R801
11K
L80554.7u
7158R
0
10uC822
C8547
1u
3.3uL803
VREG_MSMP_2.6V
0.1u
C817
600
FB8501
2.2u
C8535
0.1u
C8543
4.7u
C816
0.1u
C823
2.2u
C8538
VREG_MSMP_2.6V
4.7uC813
4.7u
C8541
10uC8534
+VPWR
0.1uC814
8.2p
C8544
TP4TP10
TP3TP2
TP6 TP7
TP8
TP9
BT_RESET_N
PUEKAW_TSOH_NALWWLAN_RESET_N
SLEEP_CLK
BT_PCM_CLK
BT_PCM_SYNCBT_PCM_DOUT
WLAN_CLKWLAN_CMD
BT_WAKEUP
WLAN_SDIO[0]
WLAN_SDIO[2]WLAN_SDIO[1]
BT_PCM_DIN
BT_HOST_WAKEUP
WLAN_SDIO[3]
DXT_TRAU_TB
DXR_TRAU_TB
S TC_TRAU_TBSTR_TRAU_TB
WLAN_WAKEUP
CLK_REQ
CLK_IN
RF_IN_OUT
WLAN_REG_ON
TP2
TP1
Figure 4.14. BT/Wi-Fi module (LBEH19UNBC-338)
C825
2.2u
VDD_TCXO
+VPWR
K 001
5 08R
C824
1u
BU28TD2WNVX U802
5
3 24 1
VOUTVINGNDSTBY
DN
GP
CLK_REQ
TCXO LDO
3060
3060
Figure 4.17. BT/Wi-Fi Main Clock part
TP3TP4
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Figure 4.18. Test Points of BT/Wi-Fi in the L-04C, main top
Figure 4.19. Test Points of BT/Wi-Fi in the L-04C, main bottom
4. TROUBLE SHOOTING
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Activate Bluetooth/WiFi
The Voltage level atTP1≒�.6V, TP��3.5V
Yes
Chang the main board
Check power circuitNo
The Voltage level is1.�V<TP3<3V
Yes
The Voltage level atTP4=�.8V
Yes
Check BT Ant, matching or filter.
No
Check TCXO LDONo
Dose the Bluetooth/Wi-Fi function work well?
No
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4.10 Power ON Troubleshooting
4. Troubleshooting
Power On sequence of L-04C is :
PWR key press (Main PCB) KEY_PWR_N go to low,PM7540 KPD_PWR_ON_N pin PM7540 Power Up VREG_MSMC1_1.25V(C749), VREG_MSMC2_1.25V(C750) VREG_MSME_1.8V(C751), VREG_MSMP_2.6V(C768), VREG_MSMA_2.6V(C767), VREG_TCXO_2.85V(C772) power up and system reset assert to MSM Phone booting and PS_HOLD(R772) assert to PMIC.
Start
Check the Battery voltage. higher than 3.23V?
Change or charge the Battery
NO
TP1 high to lowwhen key press?
Check the Key DomeOr Check Main PCB
YES
YES
NO
TP2/TP3 is1.35V?, TP4 is 1.8V? TP5 is 2.6V,? TP6 is 2.6V?,
TP7 is 2.85V?
Change the Main boardNO
Is clock ok?TP8 : 19.2MTP9 : 32.768khz
Check the TXCO & Crystal
YES
YES
NO
Change the Main board
TP1 high to lowwhen key press?
Yes
Change or charge theBattery
No
TP�/TP3 is1.35V?, TP4 is 1.8V? TP5 is �.6V,? TP6 is �.6V?,
TP7 is �.85V?
START
Yes
Is clock ok?TP8 : 19.�M, TP9 : 3�.768khz
Yes
Change the Main board
Check the Battery voltage.higher than 3.�3V?
Yes
Check the Key Domeor Check Main PCB
No
Change the Main boardNo
Check the TXCO & CrystalNo
4. TROUBLE SHOOTING
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4. Troubleshooting
TP2
TP3
TP6
M i b d TOP
TP4
TP5
TP7
TP9
Main board, TOP
TP1
Slide FPCB, TOP
TP8
Main board, TOP
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C779
33p
157C
u01
u012 57
C
VREG_FEM_2.7V
007X
531-CF
z HK8 67.232
1
R723 0
4.7uC754
C744
4.7u
2.2u
C761
VREG_PROX_COMPASS_2.6V
2.2u
C771
4.7u
C768
4.7uELCP0008004
L703
VREG_TOUCH_3.0V
22pC774
22pC776
200K
R722
TP702
ELCP0008012
4.7uL701
947C
u22
VREG_LCD_1.8V
L704ELCP0008004
4.7u
C760 2.2u
547C
n1
VREG_MSME_1.8V
C765
2.2u
VREG_RFRX1_2.7V
E10F10C12
M12K7
N13M13
G10D9H12
C13A13A12
G12G1M1D13E12N11A3A10A8H13G13A11K13E13B13A9N12J13A2
M4N4M9N10M6N6M8N8J1K1
VSW_5V
VREG_5V
VSW_MSMC1
VREG_MSMC1
VSW_MSMC2
VREG_MSMC2
VSW_MSME
VREG_MSME
VSW_PA
VREG_PA
VREG_GP1
VREG_GP2
VREG_GP3
VREG_GP4
VREF_GP5
VREG_GP6
VREG_MMC
VREG_MSMA
VREG_MSME2
VREG_MSMP
VREG_RFRX1
VREG_RFRX2
VREG_RFTX
VREG_RUIM1
VREG_SYNT
VREG_TCXO
VREG_USB
VREG_WLAN
MIC_BIAS
REF_ISET
REG_GND
REF_BYP
TCXO_IN
TCXO_EN
TCXO_OUT
XTAL_IN
XTAL_OUT
SLEEP_CLK
AMUX_OUT
KPD_PWR_N
PON_RESET_N
PS_HOLD
R715 121K
VREG_TCXO_2.85V
R716 51
847C
n1
C762
2.2u
C770
2.2u
VREG_MSMC1_1.25V
VREG_MMC_3.0V
0.1uC773
n164 7
C
VREG_RUIM_3.0V
C763
2.2u
VREG_MSMA_2.6V
2.2u
C766
VREG_MSMC2_1.25V
VRF_SMPS_2.1V
n1747
C
C772
1u
VREG_MSMP_2.6V
SDB310QD701
2.2u
C769
KDS114E-RTK_HA
D702
ELCP0008012
4.7uL702
057C
u 7.4
+VPWR
1nC753
+VPWR_AUDIO
4.7u
C767
VREG_AUX2_2.9V
VREG_LCD_2.8V
C759 2.2u
2.2u
L700
PMIC_TCXO
TCXO_PM_19.2MHZ
JTAG_PS_HOLD
TCXO_EN
SLEEP_CLK
PS_HOLDnPON_RST
AMUX_OUT
KPD_PWR_N
VSNS_RF_SMPS
VSNS_MSMC2_1.25V
VSNS_MSMC1_1.25V
VSNS_MSME_1.8V
2010.03.20
2009.11.18
0.3mm 0.3mm
09.11.12
Turbo Mode0603
NDK --> EPSON
0603
0603
Route together
0.6mm
These CAPs close to inductors
0.6mm
0.6mm
Place in PM7540 room at shield edge
Local Ground Plan
0.5mm
1%
Place crystal and load caps close to PM7540
TP2
5 01A
VKB102
KPD_PWR_N
END
R10 0
10n
C313
R306
100
19.2MHzX300
KT3225L19200DCW28RA0
42
31VCONT OUT
GND VCC
C309
100p
33
R309
C312 1n
1n
C314
VREG_TCXO_2.85V
VREG_MSMA_2.6V
C315 100p
C316
0.1u
100K
R313
0.1u
C319
NC7SV00P5X_NLU3013
2
4
15
VCC
GNDSC1
1
SC2
1
TCXO_RTR_19.2MHZ
TCXO_PM_19.2MHZ
TCXO_EN
USBH_SYSCLK
RTR_TRK_LO_ADJ
1.0T
TCXO Circuit
Clesed to TCXO
TP3TP4
TP6TP5
TP7
TP9
TP1
TP8
4. TROUBLE SHOOTING
- 159 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4.11 Charger Troubleshooting
Check the pin and batteryConnect terminals of I/O connector
Connection OK?
Yes
Change I/O connectorNo
START
Change the Main board
Is the TA voltage 5.4V?
Yes
Change TANo
Is the TP3 4.6V?
Yes
Check U700 And FL700 orChange the Main Board
Is it charging properlyAfter turning on Q1, Q�, Q3?
No
ENDYes
4. TROUBLE SHOOTING
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LGE Internal Use Only
4. Troubleshooting
5.4V
TP3
4. TROUBLE SHOOTING
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LGE Internal Use Only
C703
1u
SC3
4
3
2
1
CN700HSMU-5SB-24DR2
15
13
11
9
7
5
4
3
2
1
14
12
10
8
6
D700C70422p
C702
22pZD700
FL700
NFM18PC104R1C31
IN OUT
GND1 GND2
C705
1u
VCHG_VBUS
U700
MAX14528
96
53
4
82
71IN1 OUT1
IN2 OUT2
IC1
OVLO IC2DN
G
DN
GP
USB_ID
MAX_DM
MAX_DP
2mm2mm
u-USB Connector
VBUS 2mm TP2
Troubleshooting Procedure
- Check the charger connector:TP�- Check the Current path :TP3 / TP4- Check the battery
Charging Procedure
- Connect TA- Control the charging current by PM7540 IC
Charging current flows into the battery
Troubleshooting Setup
- Connect TA and battery to the phone
Check Point
- Connection of TA- Charging current path- Battery
Check Charging Current
- Idle → 500mA- Voice Call → 500mA (Alternative)
Q1
QST4
321
456
VCHG_VBUS
Q3SIA431DJ
S1S2
G
D1D2D3D4D5
5C
u33
Q2
QST4
321
456
317R
1.0
VBAT
+VPWR
R16
51
10nC757
+VPWR
BATT_FET_N
CHG_CTL_N
ISNS_P
ISNS_M1%
2mmBattery Charging Circuit
10V1608
2mm
TA(5.4V)
MainBattery
TP3
TP4
4. TROUBLE SHOOTING
- 16� - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4.12 USB Troubleshooting
USB Initial sequence of L-04C is :USB connected to L-04C power on � VCHG_VBUS � IC1 (USB_ID) � USBH_DP/DM and UART_TX/RX �USB work.
Cable is inserted?
Yes
Insert cableNo
START
TP1 is 5V?
Yes
Check U700No
TP� is High?
Yes
Check IC1 or Change Main Board
TP3 Is triggered?
Yes
Check IC1 or Change Main Board
No
Power is on?
Yes
Go to power on trouble shooting
No
Change the Main board
TP4 Is triggered?
Yes
Check MSM7��7 or Change Main Board
No
No
4. TROUBLE SHOOTING
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LGE Internal Use Only
807
R
K7.
4
10n
C725
TS5USBA33402YZPRIC1
4B
D2
B2
A1 A2
B3
C2
A4
C1
A3 D1
E4
D3 D4
E3
E2 C3
E1 C4
1B
YLP
PU
SV
UART_TXVBUS
UART_RXDM
DP
USB_DMID
USB_DP
AUDIO_LR2_2K
AUDIO_R
MIC
DSS
_INT
SDACLDO
SCL
GNDTE
SI
2.2K
R705
C724
0.1u
VCHG_VBUSK2
707
R
607
R
K2
VREG_MSMP_2.6V
C721
0.1u
+VPWR
USBH_DM
USBH_DP
MUIC_INT
MUIC_I2C_SCL
MUIC_I2C_SDA
UART2_TXD
UART2_RXD
USB_ID
MAX_DM
MAX_DP
MUIC
TP2
C703
1u
SC3
4
3
2
1
CN700HSMU-5SB-24DR2
15
13
11
9
7
5
4
3
2
1
14
12
10
8
6
D700C70422p
C702
22pZD700
FL700
NFM18PC104R1C31
IN OUT
GND1 GND2
C705
1u
VCHG_VBUS
U700
MAX14528
96
53
4
82
71IN1 OUT1
IN2 OUT2
IC1
OVLO IC2DN
G
DN
GP
USB_ID
MAX_DM
MAX_DP
2mm2mm
u-USB Connector
VBUS 2mmTP1
TP3
TP4
4. TROUBLE SHOOTING
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LGE Internal Use Only
4. Troubleshooting4. Troubleshooting
TP1
TP2TP4
TP3
4. TROUBLE SHOOTING
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LGE Internal Use Only
4.13 RUIM Detect Troubleshooting
RUIM Initial sequence of L-04C is :SIM_CLK, SIM_RST,SIM_IO triggered � VREG_RUIM_3V go to 3V � RUIM IF work
Re-insert the RUIM card
Work well?
No
ENDYes
START
Change the Main board
TP1 is 3V?TP� is triggered ? Check J800
No
Work well?
No
ENDYes
Change RUIM card
4. TROUBLE SHOOTING
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LGE Internal Use Only
4. Troubleshooting
TP1TP2
TP1TP2TP1
Main Bottom
C801
22p 22p
C800
008R
K7.4
J800
ENSY0024301KP09N-6S-2_54SF
98
107
63
52
41VCC GND1
RST VPP
CLK IO
GND2 GND5
GND3 GND4
22p
C803C802
0.1u
C804
10p
VREG_RUIM_3.0V
SIM_IOSIM_CLKSIM_RST
TP2TP1
4. TROUBLE SHOOTING
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LGE Internal Use Only
4.14 3 Mega Camera Troubleshooting
3 Mega Camera control signals are generated by MSM7��7.
Check the camera connector and reconnect the camera
Camera is OK?
No
ENDYes
START
Change the Main board
TP1 is1 �V?, TP� is 1.8V?TP3 is �.7V?, TP4 is �.8V?
Yes
Change the Qwerty boardNo
Camera is OK
No
ENDYes
Change the camera
TP6 is the MCLK?
Yes
Change the Qwerty boardNo
Check the TP5 (PCLK)
Yes
Change the Qwerty boardNo
MCLK: �6 MhzPCLK : 7� Mhz
4. TROUBLE SHOOTING
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LGE Internal Use Only
10uC119
VREG_CAM_AVDD_2.7V
R110 12
GB042-34S-H10-E3000CN101
1716151413121110
98765
314323332341
30
29
28
27
26
25
24
23
22
21
20
19
18
VREG_CAM_DVDD_1.2V
120FB102
C1170.1u
VREG_CAM_AF_2.8V
VA1
VREG_CAM_IOVDD_1.8V
C3
DNI
0.1uC114
C1130.1u
FB101120
0.1uC112
VA101
C1111u
33p
C120
CAM_PWDN
CAM_RESET_N
FLT_CAM_DATA[7]FLT_CAM_DATA[6]
FLT_CAM_DATA[5]FLT_CAM_DATA[4]FLT_CAM_DATA[3]FLT_CAM_DATA[2]FLT_CAM_DATA[1]FLT_CAM_DATA[0]
CAM_MCLK
CAM_PCLK
FLT_CAM_VSYNCFLT_CAM_HSYNC
FLT_CAM_I2C_SDAFLT_CAM_I2C_SCL
TP5
Qwerty To Camera Connector
TP6
TP3TP1 TP2
TP4
4. TROUBLE SHOOTING
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LGE Internal Use Only
4. Troubleshooting
Qwerty B’D
TP1TP2TP3TP4TP6
TP5
TP 5 TP 6
4. TROUBLE SHOOTING
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LGE Internal Use Only
4.15 Keypad Backlight Troubleshooting
Key Pad LED Light is on as below :Key pressing � QT_KPD_DRV_N is Low � KEYPAD LED Lighting (on)
Key press
TP1 s Low
Yes
Chage Dome SheetNo
START
Battery voltage is higherThan 3.�8V?
Yes
Change the BatteryNo
Change the Qwerty board
4. TROUBLE SHOOTING
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LGE Internal Use Only
TP1
TP1
LD3054
3
2
1
LD3044
3
2
1
LD3034
3
2
1
+VPWR
LD3014
3
2
1
533R
0
VA321
C301
1u
33R330
R329 33
33R328
R327 33
QT_KPD_DRV_NTP1
4. TROUBLE SHOOTING
- 17� - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4.15 Keypad Backlight Troubleshooting
Key Pad LED Light is on as below :Key pressing � QT_KPD_DRV_N is Low � KEYPAD LED Lighting (on)
Key press
TP1 s Low
Yes
Chage Dome SheetNo
START
Battery voltage is higherThan 3.�8V?
Yes
Change the BatteryNo
Change the Qwerty board
4. TROUBLE SHOOTING
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LGE Internal Use Only
TP1TP1
TP1TP1
magnet
D207D208
U202
32
41VDD OUT
VSS NC
100nC203
VREG_MSMP_2.6V
C2020.1UF
SLIDE_DETECT
SLIDE DETECTChanged 03/24
Active : Low
TP1
4. TROUBLE SHOOTING
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LGE Internal Use Only
4.16 Main LCD Troubleshooting
Main LCD control signals are generated by MSM7��7. The signal path is :MSM7��7 �CN40� �BtoB CN �CN401 �CN103 �CN10� �LCD Moudle
Press END key
Key LED is on?
Yes
GO to power on trouble shooting
No
START
Check the solder of and reconnect
LCD display OK? ENDYes
Change the LCD Module
LCD display OK?
No
ENDYes
Change the Folder Assy
LCD display OK?
No
ENDYes
Change the Qwerty Board ENDYes
No
Change the Main Board
Yes
4. TROUBLE SHOOTING
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LGE Internal Use Only
4.17 Receiver Path
MSM7��7 RCV+/RCV- � AMP (U701) � Main to Qwerty PCB� Qwerty PCB to RF_Slide FPCB � SPK&RCV
Can you hear the tone?
No
ENDYes
START
The sine wave appears at TP1?
No
Change SPK&RCVYes
Check the solder ofCN�01,CN401 and reconnect
The sine wave appears at TP�?
No
Change RF_Slide FPCBYes
Connect the phone to networkEquipment and setup call
Setup 1KHz tone out
Change the Main board
No
4. TROUBLE SHOOTING
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LGE Internal Use Only
4. Troubleshooting
TP1
TP1
p93501
C
401C
p93
CN101
2
1
101D
001D
SPK_RCV-
SPK_RCV+TP1
4. TROUBLE SHOOTING
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LGE Internal Use Only
4. Troubleshooting
TP2
TP2
VREG_PROX_COMPASS_2.6V
VREG_TOUCH_3.0V
GB042-50P-H10-E3000CN102
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
501
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
SPK_RCV-SPK_RCV+
PROX_COMPASS_I2C_SCLPROX_OUT
PROX_COMPASS_I2C_SDA
TOUCH_INTTOUCH_I2C_SCL
TOUCH_I2C_SDA
WLED7WLED6
WLED1WLED2WLED3WLED4WLED5
VCOIN
TP2
4. TROUBLE SHOOTING
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LGE Internal Use Only
4. Troubleshooting
4.19 Headset path
MSM7227 HPH_R, HPH_L AMP (U701) J201 (3.5 Ear jack)
Start
Connect the phone to network
YES
equipment and setup call.Setup 1KHz tone outand insert headset.
Can you hear the tone? END
YESSine wave appears
at TP1?Change the Headset
NO
NO
NO
Change the Main board
YESSine wave appears
at TP2?Change the Qwerty_Key PCB
4.18 Headset path
MSM7��7 HPH_R, HPH_L � AMP (U701) � J�01 (3.5 Ear jack)
Can you hear the tone?
No
ENDYes
START
The sine wave appears at TP1?
No
Change the HeadsetYes
Change the Main board
The sine wave appears at TP�?
No
Change the Qwerty_Key PCBYes
Connect the phone to network
equipment and setup call.Setup 1KHz tone outand insert headset.
4. TROUBLE SHOOTING
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LGE Internal Use Only
4. Troubleshooting
TP1 (L, R)
Ear_Jack
TP1 (R)
TP1 (L)
Qwerty bottom
1800FB201
J201
2
36
5
4
1M5_MIC
M4_L
M3_DETECT
M4D-DETECT
M1_R
M6_GND TP1(R)
TP1(L)
4. TROUBLE SHOOTING
- 180 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
TP2
Amp
TP2
Main TopMain Top
FB701600
C710
39p
307R
02
407R
02
R724 47KC783
10u
C711
39p
C712
39p
C713
39p C715
0.1uR725 47KC717 1u
C716 1u
C707 47n
47nC706
K7.4
11R
9R
K7.4
VREG_MSMP_2.6V
0.1u
C701C700
2.2u
C714
0.1u
C9002.2u
470nC708
C709 470nU701
WM9093ECS-R
3B
A4
C3
C2
2B
D1
D3
4D
C1
A1D2
1B
D5
A2
A5
A3B5
4B
C5
4C
DN
G
OUT+
DD
VP
H
CPVDDCPVSS
CN
HPL
OUT-
SAI
B
IN2- HPR
IN1+D
DV
S
IN3-
IN2+
AD
S
IN1-
IN3+
CP
LC
S
C722
2.2u
+VPWR_AUDIO
2.2uC719
2.2u
C723
2.2uC720
VREG_MSME_1.8V
HPH_LHPH_R
RCV_N
RCV_P
SPK_RCV-SPK_RCV+LINE_OP
LINE_ON
EAR_REAR_L
AUDIO_I2C_SDAAUDIO_I2C_SCL
AUDIO SUBSYSTEM
TP2
4. TROUBLE SHOOTING
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LGE Internal Use Only
4.19 Speaker phone path
MSM7��7 LINE_ON, LINE_OP � AMP (U701) � Main to Qwerty PCB � Qwerty PCB to RF_Slide FPCB � SPK&RCV
Can you hear the tone?
No
ENDYes
START
The sine wave appears at TP1?
No
Change SPK&RCVYes
Check the solder ofCN�01,CN401 and reconnect
The sine wave appears at TP�?
No
Change RF_Slide FPCBYes
Connect the phone to networkEquipment and setup call
Setup 1KHz tone out
Change the Main board
No
4. TROUBLE SHOOTING
- 18� - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4. Troubleshooting
TP1
TP1
p93501
C
401C
p93
CN101
2
1
101D
001D
SPK_RCV-
SPK_RCV+TP1
4. TROUBLE SHOOTING
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LGE Internal Use Only
4. Troubleshooting
TP2
TP2
TP2
VREG_PROX_COMPASS_2.6V
VREG_TOUCH_3.0V
GB042-50P-H10-E3000CN102
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
501
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
SPK_RCV-SPK_RCV+
PROX_COMPASS_I2C_SCLPROX_OUT
PROX_COMPASS_I2C_SDA
TOUCH_INTTOUCH_I2C_SCL
TOUCH_I2C_SDA
WLED7WLED6
WLED1WLED2WLED3WLED4WLED5
VCOIN
TP2
4. TROUBLE SHOOTING
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LGE Internal Use Only
4.20 Main microphone
MIC1 � MIC1P
TP1 is 1.8V ?
Yes
Change Qwerty BoardNo
START
The sine wave appears at TP�?
Yes
Change the MICNo
Change the Main board
Make a call
Make sound to MIC
Yes
Work well? ENDYesNo
4. TROUBLE SHOOTING
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LGE Internal Use Only
4. Troubleshooting
TP2
TP1
TP1
TP2
MIC1
6
5
4
3
2
1OUT
G1
G2
G3
PWR
G4
1 02R
IN
D
512C
p51
4 12C
u 01
312C
p74
FB1 1800MIC_1PMIC_1N
MIC_BIAS
TP2
TP1
4. TROUBLE SHOOTING
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LGE Internal Use Only
4.21 Headsetmicrophone
Headset � ZD�06 � MIC�P
No
ENDOK
START
TP1 is High?
Yes
Change the MAIN boardNo
Change the Main PCB
TP� is �.6v?
Yes
Change the Qwerty BoardNo
Change the headset and retry
Make a call
Yes
The sine wave appears at TP�? Change the headset orQwerty Board and retry.
No
Yes
4. TROUBLE SHOOTING
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LGE Internal Use Only
312R
IN
D
ZD201 ZD202
ZD205
C216
100p
412R
IN
D
FB202 1800
FB203 1800
C206
4.7u
R216
100K
1800FB201
0.1u
C21247p
C21033p
C208
2.2u
C207
912R
K74
47p
C204
402D
VREG_MSMP_2.6V
K2.2
302R
33pC201
202D
102D
202R
K001
1800
FB204
U201
5
3 24 1
VOUTVINGNDSTBY
DN
GP
001Q
D
G
S
022R
M1
VREG_MSMP_2.6V
J201
2
36
5
4
1M5_MIC
M4_L
M3_DETECT
M4D-DETECT
M1_R
M6_GND
HOOK_ADC
EAR_R
EAR_L
HS_MIC_BIAS_EN
HS_MIC
EAR_SENSE
AUDIO_GND
3.5 EAR_JACK
MATING
EAR_SENSE
UNMATING
STATE
LOW(DEFAULT)
HIGH
5/10 Added
4. Troubleshooting
TP1TP2
TP3
< Main Bottom >
TP1TP3
TP2
TP2
TP3
TP1
4. TROUBLE SHOOTING
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LGE Internal Use Only
4.22 Vibrator
MSM7��7 (MOTOR_PWM) � U601 � Motor
START
TP1 is PWM?
Yes
Check the MAIN or ReplaceNo
Change vibrator
Check TP� signal exist ? Ch k th U601Check the Or Replace
No
Operate the Vibrator
Yes
NoKey Function is OK?
Change the Qwerty boardNo
No
No
4. TROUBLE SHOOTING
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LGE Internal Use Only
TP1 TP2
TP2
CN601
2
1
L511 100n
L512 100n
523AV
423AV
Q601
C
B
E GND
IN
OUT
R619
100K
TPA6202A1ZQVRU601
B2C1
A1B1
B3C2
A3C3IN- VDD
IN+ VO+
_SHUTDOWN VO-
BYPASS GND
VREG_MOTOR_3.3VVREG_MOTOR_3.3VK1
716R
100K
R622
51K
R620
51K
R621
C638
0.1u
10nC640
816R
K1
K7.4
32 6R
C639
1u
MOTOR_PWM
CONNECTOR Type
%1%1 1%
Q-coin MOTOR
1%
1%
1%
TP1
TP2
4. TROUBLE SHOOTING
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LGE Internal Use Only
4.23 SD card operation
START
Check TP1 Level High?
Yes
Check the R�1� & Re solderingNo
Change the Main board
Check TP� Level 3V?
Yes
Reconnect BtoB orCheck U704(Main PCB)
No
Yes
Check TP3, TP4 Signal is exist? Change Qwerty PCBNo
SD card operation is OK?
END
Low level : 0VHigh level : 3V
4. TROUBLE SHOOTING
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LGE Internal Use Only
ZD206
CN1
168
7
6
5
4
3
2
1 15
G5 G3 G1 CD
C1
C2
C3
C4
C5
C6
C7
C8
G6 G4 G2 COM
G7
212R
smho
K001
0.1u
C205
K74
112R
602D
43
52
61
VREG_MSMP_2.6V
R210 2.2
VREG_MMC_3.0V502
D
43
52
61
K74
9 02R
802R
K 74
K74
702R
K7 4
6 02R
MMC_CLK
MMC_CMDMMC_DATA[3]MMC_DATA[2]
MMC_DATA[1]MMC_DATA[0]
MICROSD_DET_N
Open
Detect
Close (Detect =COM)
S/W
LOW (Detect)
HIGH (Normal)
Micro SD Socket
TP2TP3
TP4
TP1
4. TROUBLE SHOOTING
- 19� - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4. Troubleshooting
TP2
TP1
TP3 TP4
TP1
4. TROUBLE SHOOTING
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LGE Internal Use Only
4.24 Touch Troubleshooting
Touch Window
Press Touch Window
Yes
Change theTouchWindowNo
Change the Main board
TP� is triggered ?
Yes
Reconnect RF Slide FPCBConnectorwith Touch Window
No
Yes
TP1 is 3V ? Reconnect BtoB ConnectorNo
Touch operating OK?
END
4. TROUBLE SHOOTING
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LGE Internal Use Only
CN100GB042-10P-H10-E3000
65
74
83
92
101
601AV
701AV
C109
1u801
AV
VREG_TOUCH_3.0V
TOUCH_INT
TOUCH_I2C_SCL
TOUCH_I2C_SDA
Touch Connector
1 pin : right, lower
4. Troubleshooting
TP2 TP1TP2 TP1
TP1
TP2
Touch Window Connector RF Slide FPCB ConnectorTouch Window Connector RF Slide FPCB Connector
TP2
TP2
TP1
4. TROUBLE SHOOTING
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LGE Internal Use Only
4.25 Proximity Sensor Troubleshooting
Proximity Some Objects
Cognition Objects?
Yes
Reconnect CN10� to Qwerty Board
No
Change the RF Slide FPCB
TP� is LOW ?
Yes
Check the U100 or ReplaceNo
Yes
TP1 is �.6V ? Change the Qwerty BoardNo
Compass operating OK?
END
4. TROUBLE SHOOTING
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LGE Internal Use Only
4. Troubleshooting
TP2 TP1
TP1
TP2
RF Slide FPCB BOT RF Slide FPCB TOP
VREG_PROX_COMPASS_2.6V
VREG_PROX_COMPASS_2.6V
R100
4.7
u1 101C
TP1000.1u
C103C102
4.7u
R101
10
C100 4.7uU100 GP2AP002S00F
54
63
72
81LEDA SCL
LEDC SDA
VCC VIO
VOUT GND
PROX_COMPASS_I2C_SCL
PROX_OUT
PROX_COMPASS_I2C_SDA
Proximity SensorTuning point
TP1
TP2
4. TROUBLE SHOOTING
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LGE Internal Use Only
4.26 Digital Compass Troubleshooting
Navigate Compass
The needle of a compass moving?
Yes
Reconnect CN401 to Qwerty Board
No
Change the Qwerty board
Cognition Objects?
Yes
Check the U1 or ReplaceNo
Yes
TP� is triggered ? Change the Main boardNo
Compass operating OK?
END
4. TROUBLE SHOOTING
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LGE Internal Use Only
470n
C2
6R
K3.3
1C
n01
U1AMI304
12
11
10
9
5
4
6
37
28
1D
DV
D
GE
RV
AD
NG
SD
NG
DD
VA
ADDR
SCL
NC1
TNI
VPP
DRDY
SDAK3. 3
7R
TP1
VREG_PROX_COMPASS_2.6V
0R2
R4 0
PROX_COMPASS_I2C_SDA
PROX_COMPASS_I2C_SCL
COMPASS_DRDY
4. Troubleshooting
TP2
TP1
TP1
TP2
Qwerty Board BOTQwerty Board TOP
TP1
TP2
TP2
5. DOWNLOAD
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LGE Internal Use Only
5. DOWNLOAD
- 164 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
5. DOWNLOAD
5. DOWNLOAD
L-04C
L-04C
5. DOWNLOAD
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LGE Internal Use Only - 165 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
5. DOWNLOAD
L-04C
L-04C
L-04C
5. DOWNLOAD
- �01 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only - 166 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
5. DOWNLOAD
L-04C
L-04C
5. DOWNLOAD
- �0� - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only - 167 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
5. DOWNLOAD
L-04C
L-04C
L-04C
5. DOWNLOAD
- �03 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only - 168 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
5. DOWNLOAD
L-04C
5. DOWNLOAD
- �04 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only - 169 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
5. DOWNLOAD
5. DOWNLOAD
- �05 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only - 170 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
5. DOWNLOAD
5. DOWNLOAD
- �06 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only - 171 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
5. DOWNLOAD
5. DOWNLOAD
- �07 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only - 172 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
5. DOWNLOAD
5. DOWNLOAD
- �08 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only - 173 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
5. DOWNLOAD
5. DOWNLOAD
- �09 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only - 174 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
5. DOWNLOAD
L-04C
L-04C
L-04C
L-04C
L-04C
L-04C
L-04CL-04C
5. DOWNLOAD
- �10 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only - 175 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
5. DOWNLOAD
L-04C L-04C
L-04C L-04C
L-04C
L-04C L-04C
5. DOWNLOAD
- �11 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only - 176 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
5. DOWNLOAD
L-04C L-04C
L-04C
L-04C
6. BLOCK DIAGRAM
- �1� - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
6.Block diagram
Elini Total Block Diagram
6. BLOCK DIAGRAM
- �13 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
System HW Block Diagram ; RF
6. BLOCK DIAGRAM
- �14 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
System RF Block Diagram ; Control signals and Clocks
6. BLOCK DIAGRAM
- �15 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
System HW Block Diagram ; BLUETOOTH & Wi-Fi
6. BLOCK DIAGRAM
- �16 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
System HW Block Diagram ; Memory, MICRO-SD, USIM
6. BLOCK DIAGRAM
- �17 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
System HW Block Diagram ; LCD
6. BLOCK DIAGRAM
- �18 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
System HW Block Diagram ; CAMERA
6. BLOCK DIAGRAM
- �19 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
System HW Block Diagram ; Audio
6. BLOCK DIAGRAM
- ��0 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Power Block
6. BLOCK DIAGRAM
- ��1 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Power Block
6. BLOCK DIAGRAM
- ��� - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
BLUETOOTH Block
6. BLOCK DIAGRAM
- ��3 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Wi-Fi Block
- 224 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
7. CIRCUIT DIAGRAM
L1015
1.2n
C8554
2.5p
+VPWR
C1013 33p
FL1004B7671
836.5 MHz,881.5 MHz
95
7
3
1
2
8
4
6ANT
GND2
RX_OUT2
GND1
RX_OUT1
TX_IN
GND4
GND3 GND5
1001R
0
1.8pC1068
DNI
L101418n
L1013
1.8pC1067
FL1005
SAFEB836MAL0F00
836.5MHz3 2
4 1
5GND
INOUTG1G2
C1062 2.2p
C85531n
L1009
3.9nDNI
L1010
L1000 8.2n
C1064 2.2p
L1008DNI
C1063 2.2p
L10074.7n
9101R
180
C106039p
8101R
120
39p
C1059
DNI
C1058
R1017
51
C1057DNI
SKY77336U1002
23 2224 2125 2026 1927 1828 17
9 810 711 612 513 414 315 216 1
DCS_PCS_INDCS_PCS_OUT
BSGND6
TX_ENGND5
VBATTVCC_OUT
VAPCGND4
NCGND3
GND1GND2
GSM_INGSM_OUT
PGND1PGND12
PGND2PGND11
PGND3PGND10
PGND4PGND9
PGND5PGND8
PGND6PGND7
15pC1056
L1006
15n
6 10 1R
120
5101R
180
R1014
2.2K
+VPWR
L1005
DNI
30
R1013
1KR1012
1KR1011
R1010 1K
15n
L1004
1KR1009
C1053
1.5n
C1054
0.1u C1073 100p
L1027
2.7n
9901C
n8.1
C1052
33p
VREG_FEM_2.7V
FL1001D5017
850,1900,2100MHz
65437
11
9
22
21
20
1324
1223
10
158
141
17
162
19
18PCS_RX1
PCS_RX2
ANT PCN_RX1
PCN_RX2
GND1 EGSM_RX1
GND2 EGSM_RX2
GND3
GND4 GSM850_RX1
GND5 GSM850_RX2
WCDMA_2100
WCDMA_850
WCDMA_1900
PCN_PCS_TX
GSM850_EGSM_TX
DD
V
1LRT
C
2LRT
C
3LRT
C
4LRT
C
DNI
C1051
R1002
1K
C1016
15n
C1050
DNI
9401C
u1.0
51
R1024
L8056 1n
L1017
6.8n
C1042 10n
C1041 1n
0001R
IN
D
p 0 01
04 01C
L1023
2.2n
RF2815U1001
3
2
5
4
1NI_F
R
FIL_OUT
VDD
S_D
GND
VREG_MSMP_2.6V
u1.07301
C
6301C
p001
5301C
u7.4
4301C
u7.4
C1033
10u
u1.02301
C
5.1
R1007
R1006
5.1
VREG_RFRX1_2.7V
1n
C1031
C1030
0.1u
u1.09201
C
C1028 10n
p227201
C
12KR1003
C51
DNI
C1072 22p
C1084 1.8p
C1025 100p
RTR6285U1000
329282534396
62
61
60
54
4336
3738
2768
2552
2142
8
745
144
5347
2246
10
649
448
3
51
6750
1939
40
18
1741
16
1533
32
1331
1430
12
1159
58
956
24
557
55
65
6620
632
6426RF_ON TX_IP
TCXO TX_IN
SBDT TX_QP
TX_QN
LB_RF_OUT1
LB_RF_OUT2 VTUNE1
VTUNE2
HB_RF_OUT1 VTUNE_GPS
HB_RF_OUT2
HB_RF_OUT3 PRX_QP
PRX_QN
WPRXLBP PRX_IP
WPRXLBN PRX_IN
WPRXHBP
WPRXHBN DRX_QP
DRX_QN
WDRXLB DRX_IP
DRX_IN
WDRXHB1
WDRXHB2 NC
GCELL_INP DAC_IREF
GCELL_INN
VDDA1_1
EGSM_INP VDDA1_2
EGSM_INN VDDA1_3
VDDA1_4
DCS_INP VDDA1_5
DCS_INN VDDA1_6
GPCS_INP VDDA2_1
GPCS_INN VDDA2_2
VDDA2_3
GPS_IN VDDA2_4
PDET_IN VDDA2_5
TX_RBIAS VDDA2_6
WPRXSE1 VDDA2_7
WPRXSE2 VDDA2_8
VDDA2_9
VDDA2_10
VDDA2_11
VDDA2_12DN
GP
TU
O_2E
SX
RP
W
TU
O_1E
SX
RP
W
PNI_
XM_
BW
MNI_
XM_
BW
MD
DV
4.7u
C1024
p0013201
C
MS-156CSW1000
43
2
1ANT COMMON
G3 G4
C1102
3.3n
C1101
0.5p
C1098 1n
DNIL1031
L1033
1p
FL1006SAFEB1G95KA0F00
1950MHz5 2
4 1
3G3
INOUTG1G2
L1036
22n
L1026
6.8n
C1096
100p100p
C1095
680p
C1094680p
C1093
L8057
DNI
680p
C1092
C1091
4.7u
C1090
680p
100p
C1089
100p
C1088DNIL1028
33p
C1087C10863.3n
C1026 7p
C1085 33p
L1030
12n
FL1002SAFEB2G14FB0F00
2140MHz 45
1
32G1 O1
ING2 O2
DNIL1025
+VPWR
L1029
15n
100p
L1024
C1083
15p
C1061 2.2p
C1038 27p
L1018
33p
2801C
n3.3
DNI
C52
22p
C56
10u
C53
3201R
011
2201C
u1.0
L1003
68n
0011C
n6.5
C1019 33p
C1018DNI
VREG_RFRX1_2.7V
DNIC1017
FL1000SAFEB1G57KB0F00
1575.42 MHz 5 3 2
4 1INOUT
G1G2G3
C1007
18p
56
R1022
VRF_SMPS_2.1V
DNIC1015
L10782.7n
C1077
100p
VDD_RX
600
FB1001
FB1000
600
C1076
0.5p
0 201R
K1
L1020
1n
C10140.1u
1201R
011
68p
C1012
C1011
68p
C1010
0.1u
u1.09001
C
C1075
2.2n
C1039
5.6n
u1.05001
C
4001C
u1.0
3001C
u1.0
L1019
1n
ANT801
ODGPPTR3015
2
31
4DUMMY3
FEED DUMMY2
DUMMY1
L1022
DNIL1032
DNI
03R
2001C
u1.0
FL1003 B7697
1950MHz, 2140MHz
958472
3
6 1RXANT
TX
GND1 GND4GND2 GND5GND3 GND6
L1011
100n
L1002
68n
1001C
u1.0
U1004SKY77704-15
6 5
7 4
8 3
9 2
10 1
11PGND
VCC1VCC2
RFINRFOUT
VMODE_1CPL_IN
VMODE_0GND
VENCPL_OUT
L1034
8.2n
GND
CN7
1
CN8
1
GND
u1.00001
C
SW1001
UFL-R-SMT10
G1
ANTG2
CN5
1
GND GND C1097 1.8p
SKY77701U1003
6 5
7 4
8 3
9 2
10 1
11PGND
VCC1VCC2
RFINRFOUT
VMODE_1CPL_IN
VMODE_0GND
VENCPL_OUT
CN6
1
GND
CN3
1
GND
CN4
1
GND
CN1
1
GND
CN2
1
L1001 5.6n
C8555
DNI
L1016
DNI
C1103
33p
C1104
56p
C1079
DNI
5301L
n2.2
5501C
n2.2
0.1u
C1074
4.7u
C57
33p
C55p3 3
45C C1070
10u
ANT_SEL0ANT_SEL1ANT_SEL2
GSM_PA_EN
GSM_PA_RAMP
ANT_SEL3
TCXO_RTR_19.2MHZ
RTR_DAC_REF
RTR_TXIP
RTR_TXIM
RTR_TXQP
RTR_TXQM
RTR_RXIPRTR_RXIM
RTR_RXQMRTR_RXQP
RTR_DRXIPRTR_DRXIM
RTR_DRXQMRTR_DRXQP
GSM_PA_BAND
PA_ON0
RTR6285_SSBI
GPS_LNA_EN
PA_R0
PA_R0PA_ON1
GND
RX_WCDMA_1900
RX_WCDMA_1900
GPS_IN
GPS_IN
DCS_PCS_TX
DCS_PCS_TX
GSM_TX
GSM_TX
RX_PCS_P
RX_PCS_P
RX_PCS_M
RX_PCS_M
RX_DCS_M
RX_DCS_M
RX_GSM_900_PRX_GSM_900_P
RX_GSM_900_M
RX_GSM_900_M
RX_WCDMA_2100
RX_WCDMA_2100
PDET_IN
PDET_IN
VDD_RX
RX_DCS_P
RX_DCS_P
RTR_TXON
WCDMA_800_TX_OUT
WCDMA_800_TX_OUT
VSNS_RF_SMPS
RX_WCDMA_2100_LNA_OUT
RX_WCDMA_2100_LNA_OUT
RX_WCDMA_800_M
RX_WCDMA_800_M
RX_WCDMA_800_P
RX_WCDMA_800_P
WB2100_MIX_INM
WB2100_MIX_INM
WB2100_MIX_INP
WB2100_MIX_INP
WCDMA_2100_RTX
WCDMA_2100_RTX
WCDMA_2100_TX_OUT
WCDMA_2100_TX_OUT
WCDMA_800_RTX
WCDMA_800_RTX
VDDA2 [2.1V] : Pin 1,7,8,21,25,27,37,43
VDDA2 [2.1V] : Pin 54,60,61,62==> PLL1, PLL2, GPS PLL, VCOs
==> DCS/PCS LNA, dirver amp, mixers and baseband Tx
VDDA1 [2.7V] : Pin 3,4,6,10,22,53
8.5dB
Close to RTR
DCS1800(1710-1785 MHz)PCS1900(1850-1910 MHz)
GSM900(880-915 MHz)
DCS(1805-1880 MHz)
GSM(925-960 MHz)
PCS(1930-1990 MHz)
HIGH
HIGHLOW
LOWLOW
LOW
LOW
HIGH
LOW
LOW
HIGH
LOW
LOW
LOW
LOW LOW
LOWDCS/PCS TX
LOW
ANT_SEL0 ANT_SEL2
LOW
LOW
EGSM TX HIGH
DCS1800 RX
WCDMA 850 (PIN21)
HIGH
HIGH
LOW
ANT_SEL3ANT_SEL1
EGSM RX
PCS1900(1850-1910 MHz)2mm
5dB
GSM900(880-915 MHz)
DCS1800(1710-1785 MHz)
8dB
PCS1900 RX
WCDMA 2100 (PIN20) HIGH
HIGH
LOWLOW
==> Baseband Rx, WCDMA LNA, Cell/EGSM LNA
GSM_PA_BAND
LOW
HIGH
VDDA1: PIN 3,4,6,10,22,53 = 2.7V VDC
MODE
1%
WCDMA RX 2100 LNA Circuit
ANTENNA SWITCH MODULE LOGIC (D5017)
GSM
1608 1608
LNA for the GPS
VDDA2: PIN 1,7,8,21,25,27,37,43,54,60,61,62 = 2.1V VDC
1608
DCS/PCS
0603
0603
0603
0603
W2100 RX(2110 - 2170 MHz)
0603
0603
GSMWCDMA
7. CIRCUIT DIAGRAM
- 225 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
7. CIRCUIT DIAGRAM
CN300JTAG_STD_1COLUMN_10P
10
9
8
7
6
5
4
3
2
1TCK
RTCK
TDO
TDI
TMS
TRST
VCC
RESIN
PS_HOLD
GND
R10 0
VA300 VA301 VA302 VA303
VA304
TP300
VBAT
UAT300
12
11
10
9
8
7
6
5
4
3
2
1GND
RX
TX
NC1
ON_SW
VBAT
NC2
NC3
NC4
DSR
RTS
CTS
GND
RX
TX
VCHAR
ON_SW
VBAT
PWR
URXD
UTXD
3G2.5G
VCHG_VBUS
TP302
TP303
TP304
C321
39p
VREG_MSMP_2.6V
K01
103R
0.1u
C300K001
003R
10n
C313
R306
100
C304 47p
K01213
RV6.2_
PM
SM_
GE
RV
19.2MHzX300
KT3225L19200DCW28RA0
42
31VCONT OUT
GND VCC
103D
C309
100p
V6.2 _P
MS
M_G
ER
V
33
R309
6R
0
113R
K01
513R
001
47pC322
49.9
R310
613R
001
TP310
803R
0406
IN
D4
R
C31122u
K1703
R
0.1u
C310
TP309
VA305
u1.0703
C
603C
u1.0
C312 1n
u1.0503
C
303C
u1.0
323C
u1.0
203D
47p
C301
MIC_BIAS
M5
Y18
AC19
AF18
Y17
U16
AC18
AF17
W16
AE17
AC17
Y16
AB17
W5
W3
V5
V6
MSM7227
U302
AB9
V9
V8
Y9
W8
AB8
V3
V2
U2
U8
U9
AF4
AE2
AB7
AE4
AE3
AD3
L2
L8
L3
L9
AD2
AC6
AC3
AC2
U15
W15
AC16
AB16
AF15
Y15
AC15
AB15
W14
AE14
AC14
Y14
AC13
U13
Y13
AB13
W13
W12
AB12
Y12
AC12
AC11
AF10
W9
AE10
U12
AF9
AC20
AF20
AB21
AE20
AF21
AF22
AC23
AE23
AC21
AF23
AE21
AB22
AC22
AE24
AE25
AF24
6M
8M
9M
8E
A
7F
A
8C
A
6F
A
7C
A
6E
A
11
R
81
BA
81
W
11
Y
71
C
71
B
61
H
81
H
71
M
62
G
01
Y
11
T
01
W
61
EA
8F
A
61
FA
5F
A
31
F
21
C
21
B
11
H
11
J
21
H
21
J
11
E
21
F
11
F
21
E
91
EA
91
FA
02
BA
51
C
61
F
31
H
41
H
41
J
31
J
11
C
41
L
3F
2F
3E
2E
2D
52
G
61
L
91
C
91
B
91
H
62
F
02
H
81
J
71
J
32
H
22
F
32
F
61
J
71
E
51
J
71
F
61
B
61
C
51
H
81
B
52
B
12
F
02
B
02
F
71
H
02
E
02
C
81
C
81
F
B21
B22
C21
E21
C22
C24
E26
B24
F25
C26
D26
C23
B23
C25
D25
E23
W20
AD26
N17
T20
J25
M20
N25
V26
H26
L25
P20
U26
V19
AC25
U19
U20
AB23
W25
W26
R19
T19
W22
AC26
V23
AB26
AB25
AA23
AA25
Y26
Y23
T17
Y22
W23
AA26
V20
J26
K20
J20
J23
J22
K19
K26
L22
L19
L23
L20
M19
L26
M26
M22
M23
N26
N19
N20
P26
R26
P19
R25
T26
R22
R23
R20
T23
T22
U25
U23
U22
4C
6G
5G
6N
3N
2N
2W
6W
3M
8T
2K
3K
2J
3J
2H
3H
2G
3G
6R
2P
3P
2R
3R
11B
41F
A
31
FA
21
FA
11
FA
5BA
3BA
2BA
3A
A
2A
A
2Y
6AA
2M
3U
11
W
9E
A
9C
A
6BA
3Y
71W
91BA
51
E
41
C
31C
51B
41B
31B
8H
6F
5F
01J
01H
9H
01
C
01B
9C
9B
8F
8E
7F
7E
7C
7B
6C
5C
6B
5B
PI_R
_E
NIL
NI
_R_
EN
IL
PI
_L_
EN
IL
NI_
L_E
NI
LP
1C
IM
N1
CI
MP2
CI
MN2CI
MPIXU
ANI
XU
A
PO_
ENIL
NO
_ENIL
PO_
1RA
ENO
_1
RAE
TUOX
UA
R_HP
HL_H
PH
PM
OCC
SAI
B_C
IM
FER
V_
HP
H
KL
CSY
S_
YH
PBS
UPD_Y
HP
BSU
ND_
YH
PBSU
DI
_Y
HPB
SU
SU
BV_
YH
PBS
UT
XE
R_Y
HP
BSU
N_
NI
SER
N_
TU
OSE
R
NE_G
ODW
0_E
DOM
1_
EDO
M2
_E
DOM
3_
EDOM
OX
CT
JDA
_O
L_KR
TKLC
_P
EELS
ID
TSM
TN
_T
SRT
OD
TKC
TK
CTR
P_A
TAD_I
DDM
N_
ATA
D_
IDD
MP_
BTS
_I
DD
MN_
BTS_I
DDM
KL
CP
_CD
CL
P_TU
O_
IN_TU
O_I
P_
TU
O_Q
N_
TU
O_Q
FER
_CAD
0HC
_P
I_
I0H
C_
MI_
I0HC_
PI_Q
0HC
_M
I_Q
1H
C_
PI_I
1H
C_
MI_
I1H
C_PI_
Q1
HC
_MI
_Q
NO
_X
TJDA
_C
GA_X
T
0NO
_A
P0E
GNA
R_
AP
LT
C_RWP
_AP
M_L
TC_
RW
P_AP
FER
_G
B_
MSG
0N
IA
KH
1NIA
KH
2NI
AK
H
EBI1_DQ_0EBI1_DQ_1EBI1_DQ_2EBI1_DQ_3EBI1_DQ_4EBI1_DQ_5EBI1_DQ_6EBI1_DQ_7EBI1_DQ_8EBI1_DQ_9EBI1_DQ_10EBI1_DQ_11EBI1_DQ_12EBI1_DQ_13EBI1_DQ_14EBI1_DQ_15EBI1_DQ_16EBI1_DQ_17EBI1_DQ_18EBI1_DQ_19EBI1_DQ_20EBI1_DQ_21EBI1_DQ_22EBI1_DQ_23EBI1_DQ_24EBI1_DQ_25EBI1_DQ_26EBI1_DQ_27EBI1_DQ_28EBI1_DQ_29EBI1_DQ_30EBI1_DQ_31
EBI1_ADR_0EBI1_ADR_1EBI1_ADR_2EBI1_ADR_3EBI1_ADR_4EBI1_ADR_5EBI1_ADR_6EBI1_ADR_7EBI1_ADR_8EBI1_ADR_9EBI1_ADR_10EBI1_ADR_11EBI1_ADR_12EBI1_ADR_13
EBI1_CKE0EBI1_CKE1EBI1_DCLKEBI1_DCLKBEBI1_WE_NEBI1_CS0_NEBI1_CS1_NEBI1_BA_0EBI1_BA_1EBI1_DQS_0EBI1_DQS_1EBI1_DQS_2EBI1_DQS_3EBI1_DM_0EBI1_DM_1EBI1_DM_2EBI1_DM_3EBI1_RAS_NEBI1_CAS_NEBI1_RESOUT_NEBI1_CAL
EBI2_DATA_0EBI2_DATA_1EBI2_DATA_2EBI2_DATA_3EBI2_DATA_4EBI2_DATA_5EBI2_DATA_6EBI2_DATA_7EBI2_DATA_8EBI2_DATA_9EBI2_DATA_10EBI2_DATA_11EBI2_DATA_12EBI2_DATA_13EBI2_DATA_14EBI2_DATA_150
_R
DA
_2
IB
E
1_
RD
A_
2I
BE
2_R
DA
_2I
BE
3_R
DA
_2I
BE
4_R
DA
_2I
BE
5_R
DA
_2I
BE
6_R
DA
_2I
BE
7_R
DA
_2I
BE
8_R
DA
_2I
BE
9_R
DA
_2I
BE
01_R
DA
_2I
BE
11_R
DA
_2I
BE
21_R
DA
_2I
BE
31_R
DA
_2I
BE
41_R
DA
_2I
BE
51_R
DA
_2I
BE
61_R
DA
_2I
BE
N_0
SC
_2I
BE
N_1
SC
_2I
BE
N_4
SC
_2I
BE
N_5
SC
_2I
BE
N_6
SC
_2I
BE
N_7
SC
_2I
BE
KLC
_2I
BE
N_
EW
_2I
BE
N_
EO
_2I
BE
N_
BU
_2I
BE
N_
BL
_2I
BE
N_
0YS
UB
_2I
BE
REP
IW
RL_
ST
LL_
ST
RU_
ST
LU_
ST
231
_OI
PG
131
_OI
PG
031
_OI
PG
921
_OI
PG
821
_OI
PG
721
_OI
PG
621
_OI
PG
521
_OI
PG
421
_OI
PG
321
_OI
PG
221
_OI
PG
121
_OI
PG
021
_OI
PG
911
_OI
PG
811
_OI
PG
711
_OI
PG
611
_OI
PG
511
_OI
PG
411
_OI
PG
311
_OI
PG
211
_OI
PG
111
_OI
PG
011
_OI
PG
901
_OI
PG
801
_OI
PG
701
_OI
PG
601
_OI
PG
501
_OI
PG
401
_OI
PG
301
_OI
PG
201
_OI
PG
101
_OI
PG
001
_OI
PG
99
_OI
PG
89
_OI
PG
79
_OI
PG
69
_OI
PG
59
_OI
PG
49
_OI
PG
39
_OI
PG
29
_OI
PG
19
_OI
PG
09
_OI
PG
98
_OI
PG
88
_OI
PG
78
_OI
PG
68
_OI
PG
58
_OI
PG
GPIO_0GPIO_1GPIO_2GPIO_3GPIO_4GPIO_5GPIO_6GPIO_7GPIO_8GPIO_9
GPIO_10GPIO_11GPIO_12GPIO_13GPIO_14GPIO_15GPIO_16GPIO_17GPIO_18GPIO_19GPIO_20GPIO_21GPIO_22GPIO_23GPIO_24GPIO_25GPIO_26GPIO_27GPIO_28GPIO_29GPIO_30GPIO_31GPIO_32GPIO_33GPIO_34GPIO_35GPIO_36GPIO_37GPIO_38GPIO_39GPIO_40GPIO_41GPIO_42GPIO_43GPIO_44GPIO_45GPIO_46GPIO_47GPIO_48GPIO_49GPIO_50GPIO_51GPIO_52GPIO_53GPIO_54GPIO_55GPIO_56GPIO_57GPIO_58GPIO_59GPIO_60GPIO_61GPIO_62GPIO_63GPIO_64GPIO_65GPIO_66GPIO_67GPIO_68GPIO_69GPIO_70GPIO_71
GPIO_72_GRFC_9GPIO_73_GRFC_8GPIO_74_GRFC_7GPIO_75_GRFC_6GPIO_76_GRFC_5GPIO_77_GRFC_4GPIO_78_GRFC_3GPIO_79_GRFC_2GPIO_80_GRFC_1GPIO_81_GRFC_0
GPIO_82GPIO_83GPIO_84
47p
C25
V6.2_A
MS
M_G
ER
V
U300
74LVC1G79GM
43
52
61D VCC
CP NC
GND Q
0.1u
C718
(0603)
2.2n
C35
15
31R
1n
C314
VREG_TCXO_2.85V
VREG_MSMA_2.6V
C315 100p
C316
0.1u
C317
0.1u
100K
R313
C318
33p
0.1u
C319
2K
R314
VREG_TCXO_2.85V
C320
33n
NC7SV00P5X_NLU3013
2
4
15
VCC
GND
7.5p
C4
47
R14
TP306
TP307
TP308
7.5p
C3
SC1
1
SC2
1
VCHG_VBUS
ANT_SEL0ANT_SEL1ANT_SEL2
GSM_PA_EN
PM
AR_
AP_
MS
G
ANT_SEL3
TCXO_RTR_19.2MHZ
FE
R_C
AD_
RTR
PIXT_
RTR
MIXT_
RTR
PQ
XT_RT
RM
QXT_
RTR
PIX
R_RT
RMI
XR_
RTR
MQ
XR_
RTR
PQ
XR_
RTR
PIX
RD_
RTR
MIX
RD_
RTR
MQ
XR
D_RT
RP
QX
RD_
RTR
GSM_PA_BAND
0N
O_A
P
RTR6285_SSBI
GPS_LNA_EN
0R_
AP
PA_ON1
CAM_MCLK
N_TE
SE
R_TB
PU
EK
AW_T
SO
H_N
ALW
TNI_
HC
UOT
LC
S_C2I_
SS
AP
MO
C_X
OR
P
N_TE
SE
R_N
ALW
TU
O_X
OR
P
PMIC_TCXOO
XCT_
CIM
P
TCXO_PM_19.2MHZ
JTAG_PS_HOLD
MOTION_INT
nSDRAM_CS0nSDRAM_WE
EO_
DN
ANn
EW_
DN
ANn
YD
AE
R _H
SALF_
DN
AN
EBI2_DATA[7]EBI2_DATA[6]EBI2_DATA[5]EBI2_DATA[4]EBI2_DATA[3]EBI2_DATA[2]EBI2_DATA[1]EBI2_DATA[0]
EBI2_DATA[15]EBI2_DATA[14]EBI2_DATA[13]EBI2_DATA[12]EBI2_DATA[11]EBI2_DATA[10]EBI2_DATA[9]EBI2_DATA[8]
NE_
OX
CT
TCXO_EN
KLC_
PE
ELS
L_H
PH
R_H
PH
N_V
CR
PM_INT_NPS_HOLD
MSM_USIM_CLK
MSM_USIM_DATA
BT_PCM_CLKBT_PCM_SYNC
BT_PCM_DOUT
WLAN_CLKWLAN_CMD
BT_WAKEUP
SDRAM_DQM3SDRAM_DQM2SDRAM_DQM1SDRAM_DQM0SDRAM_DQS3SDRAM_DQS2SDRAM_DQS1SDRAM_DQS0
nRESETOUT
SDRAM_DCLK0SDRAM_DCLK1
SDRAM_CKE
SDRAM_ADDR[12]SDRAM_ADDR[11]SDRAM_ADDR[10]SDRAM_ADDR[9]SDRAM_ADDR[8]SDRAM_ADDR[7]
SDRAM_ADDR[5]SDRAM_ADDR[4]SDRAM_ADDR[3]SDRAM_ADDR[2]SDRAM_ADDR[1]SDRAM_ADDR[0]
SDRAM_ADDR[6]
SDRAM_DATA[16]
SDRAM_DATA[0]
SDRAM_BA0SDRAM_BA1
SDRAM_ADDR[13]
SDRAM_DATA[1]SDRAM_DATA[2]SDRAM_DATA[3]SDRAM_DATA[4]SDRAM_DATA[5]SDRAM_DATA[6]SDRAM_DATA[7]SDRAM_DATA[8]SDRAM_DATA[9]
SDRAM_DATA[10]SDRAM_DATA[11]SDRAM_DATA[12]SDRAM_DATA[13]SDRAM_DATA[14]SDRAM_DATA[15]
SDRAM_DATA[17]SDRAM_DATA[18]SDRAM_DATA[19]SDRAM_DATA[20]SDRAM_DATA[21]SDRAM_DATA[22]SDRAM_DATA[23]SDRAM_DATA[24]SDRAM_DATA[25]SDRAM_DATA[26]SDRAM_DATA[27]SDRAM_DATA[28]SDRAM_DATA[29]SDRAM_DATA[30]SDRAM_DATA[31]
nSDRAM_RASnSDRAM_CAS
BU_
DN
ANn
BL_D
NA
Nn
MSM_USIM_RST
WLAN_SDIO[0]
WLAN_SDIO[2]WLAN_SDIO[1]
BT_PCM_DIN
BT_HOST_WAKEUP
WLAN_SDIO[3]
FE
R_C
AD_
AP_
MS
G
P_V
CR
LC
S_C2I_
HC
UOT
SC _
HS
ALF_D
NA
Nn
AD
S_C2I_
HC
UOT
TS
R_N
OPn
REMOTE_PWR_ONREMOTE_PWR_ON
MD_
HB
SU
PD_
HB
SU
TU
O_X
UM
A
MOTION_I2C_SDAMOTION_I2C_SCL
NO
XT_RT
R
SDRAM_CKE1
MUIC_INT
LC
S_C2I_L
B_D
CLA
DS_
C2I_LB_
DCL
LCD_BL_EN
CAM_DATA[0]CAM_DATA[1]
MSM_RTCK
KCT
R_M
SM
MSM_TDO
ODT_
MS
M
MSM_TDI
IDT_
MS
M
MSM_TMS
SMT_
MS
M
MSM_TCK
KCT_
MS
M
MSM_TRSTN
NTS
RT_M
SM
USBH_SYSCLK
KLC
SY
S_H
BS
U
OL_
KRT
TRK_LO
RTR_TRK_LO_ADJ
RTR_TRK_LO_ADJ
N1
_CI
M
CAM_RESET_N
CIM_
SH
CAM_PWDN
MICROSD_DET_N
CD
A_K
OO
H
O_C
NY
SV_
DCL_
MS
M
BT_UART_TXDBT_UART_RXDBT_UART_CTSBT_UART_RTS
WOL_
DIR
EK
AM_
DCL
QTKEY_RESET
MUIC_I2C_SCL
MUIC_I2C_SDA
QTKEY_INT
DXT_2T
RA
U
UART2_TXDUART2_TXD
DX
R_2TR
AU
UART2_RXD UART2_RXD
MMC_CLKMMC_CMD
MMC_DATA[3]MMC_DATA[2]MMC_DATA[1]MMC_DATA[0]
P1_CI
M
HS_MIC_BIAS_EN
CAM_I2C_SCLCAM_I2C_SDA
SLIDE_DETECT
QTKEY_SDAQTKEY_SCL
PO_
ENIL
EAR_SENSE
NO_
ENIL
M_BT
S_P_I
DD
MP_
BTS_
P_ID
DM
M_AT
AD_
P_ID
DM
P_AT
AD_
P_ID
DM
N_TE
SE
R_D
CL
CAM_DATA[4]CAM_DATA[3]CAM_DATA[2]
CAM_DATA[6]CAM_DATA[7]
CAM_DATA[5]
CAM_PCLKCAM_HSYNCCAM_VSYNC
PU
EK
AW_
NAL
W
IB
SS_
CIM
P
AUDIO_I2C_SDA
AUDIO_I2C_SCL
nSDRAM_CS1
MOTOR_EN
MOTOR_PWM
WLAN_REG_ON
COMPASS_DRDY
AD
S_C2I_
SS
AP
MO
C_X
OR
P
DK_Volume_UPDK_Volume_DOWN
AD
S_C2I_L
EUF
FUEL_I2C_SCL
MIC_1P_PIN
nJTAG_RESOUT
TU
OSE
R_G
ATJ
n
Array TPUART TP
ARM9&ARM11 JTAG
%1
nip 5E o t esol
C
1% Close to MSM
0000 : Native, ARM9 on PJTAG, ARM11 on AJTAG
ARM9&ARM11 JTAG
MODE[3:0]
clse to MSM
1.0T
TCXO Circuit
GPS D FLIP-FLOP
Low = Detect
Changed 03/22
VPWR Delete
Clesed to TCXO
0001 : Native, ARM9 + ARM11 on PJTAG
- 226 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
7. CIRCUIT DIAGRAM
U400MT29C8G96MAZAPDJA-5 IT
01P
1P
4M
M3
5G
1G
5E
01B
1B
H8
7H
7J01R
9R
G10
2R
F9
1R
E10
01A
D9
9A
C10
2A
N10
M9
E7
L10
F8
K10
G6
J9
J8
H2
G9
G2
F10
K1
E9
B2
D10
E3
C9
G8
N9
F3
M10
J2
L9
K9
C7
J10
C8
D7
M2
D8
P9
D6
J1
E8
H9
D5
C1
F6
B9
F7
E6
M1
H4
P8
H3
H10
F5
H1
E4
D1
F4
B8
G4
G3
P6
J4
C5
H5
H6
N5
J5
B5
J6
G7
C6
K6
C3
K5
C4
K7
B4
L8
B7
K8
B3
L7
B6
L6
L5
N8
L4
M7
N7
K2
P5
J3
P4
F1
N4
F2
P3
K3
P2
D4
M8
E2
N6
D3
M6
E1
P7
D2
M5
C2
N3
L3
N2
L2
N1
L1
K4A0
A1
IO0
A2
IO1
A3
IO2
A4
IO3
A5
IO4
A6
IO5
A7
IO6
A8
IO7
A9
IO8
A10
IO9
A11
IO10
A12
IO11
BA0
IO12
BA1
IO13
IO14
DQ0
IO15
DQ1
DQ2
CE#
DQ3
RE#
DQ4
WE#2
DQ5
CLE
DQ6
ALE
DQ7
WP#
DQ8
R_B#
DQ9
DQ10
VCC1
DQ11
VCC2
DQ12
DQ13
VSS6
DQ14
VSS7
DQ15
DQ16
VDD6
DQ17
VDD1
DQ18
VDD2
DQ19
VDD3
DQ20
VDD4
DQ21
VDD5
DQ22
DQ23
VSS8
DQ24
VSS1
DQ25
VSS2
DQ26
VSS3
DQ27
VSS4
DQ28
VSS5
DQ29
DQ30
VDDQ0
DQ31
VDDQ1
VDDQ5
CS0#
VDDQ3
CS1#
VDDQ4
CK
VDDQ2
CKE0
VDDQ7
CKE1
VDDQ6
WE#1
VDDQ8
RAS#
VDDQ9
CAS#
DM0
VSSQ0
DM1
VSSQ1
DM2
VSSQ2
DM3
VSSQ3
VSSQ4
0U
ND
VSSQ5
1U
ND
VSSQ6
2U
ND
VSSQ7
3U
ND
VSSQ8
4U
ND
VSSQ9
5U
ND
6U
ND
0S
QD
2S
QD
CK#
4C
N
6C
N
3S
QD
UN
D
1S
QD
A13
1UF
R
2UF
R
KC
OL
0
R8
R7
0
0
R5
C1
10u
10u
C2
R1 0
0R2
V52.1_1C
MS
M_G
ER
V
10n
C459
10n
C458C457
10n
C456
10n
0.1u
C450
0.1u
C451
0.1u
C452C448
10n0.1u
C447
u0
10
44
C
35
4C
u0
1
144C
u1.0
444C
u2.2
n01244
C
534C
u1.0
C443
0.1u
C454
10n
C20
0.1u
C30
1n
u7.4314
C
C28
10n
C31
1n
U302
L5
E10
AE22
AD25
AE18
AE15
AE11
AE7
Y5
T5
H25
E25
E22
Y25
V25
T25
P25
M25
K25
AE12
AC10
AC5
Y8
AF26
AF25
AF3
AF2
AE26
AB11
Y20
W19
U17
U11
P23
N23
M11
L17
L12
K23
K9
J19
G23
E19
C2
B26
B3
B2
T2
R8
R5
P9
N8
K6
K5
J6
J5
F9
E6
C8
C3
U6
T6
T3
R9
P8
P5
N9
K8
J9
J8
H6
H5
E9
E5
D3
B8
AE13
AE5
AB14
AB10
AA22
Y19
Y6
V22
U14
T16
T15
T14
T13
T12
R17
R16
R15
R14
R13
R12
P22
P17
P16
P15
P14
P13
P12
P11
P6
N22
N16
N15
N14
N13
N12
M16
M15
M14
M13
M12
L15
L13
L6
K22
G22
F19
F15
F10
E14
B4
7G
A
6G
A
5G
A
4G
A
3G
A
72
GA
62
GA
52
GA
42
GA
32
GA
22
GA
12
GA
02
GA
2G
A
91
GA
81
GA
71
GA
61
GA
51
GA
41
GA
31
GA
21
GA
11
GA
01
GA
1G
A
72
FA
1F
A
72
EA
1E
A
72
DA
1D
A
72
CA
1C
A
72
BA
1B
A
72
AA
1A
A
72
A
62
A
52
A
42
A
32
A
22
A
12
A
02
A
91
A
81
A
71
A
61
A
51
A
41
A
31
A
21
A
11
A
01
A
9A
8A
7A
6A
5A
4A
3A
2A
1A
61
E
41
F
5A
A
22
H
11N
5N
81
E
31
E
5U
9T
72
Y
1Y
72
W
1W
72
V
1V
72U
1U
72
T
1T
72
R
1R
72
P
1P
72N
1N
72
M
1M
72
L
1L
72
K
1K
72J
1J
72
H
1H
72
G
1G
72
F
1F
72E
1E
72
D
1D
72
C
1C
72
B
1B
9GA
8GA
56
_C
N6
6_CN
76
_CN
86
_CN
96
_CN
07_
CN
17_
CN
27_
CN
37_
CN
47
_CN
57_
CN
67_
CN
77_
CN
87_
CN
97_
CN
08_
CN
18_
CN
28
_CN
38
_CN
48_
CN
58_
CN
68_
CN
78_
CN
88_
CN
98_
CN
09_
CN
19
_CN
29_
CN
39_
CN
49_
CN
59_
CN
69_
CN
79_
CN
89_
CN
99
_CN
001
_CN
101
_C
N2
01
_CN
301
_C
N401
_C
N
1DV
SR
2D
VSR
8P_
DDV
9P_
DD
V
01P
_DDV
GRP
_ES
UF
Q_DDV
1C_
SN
S_D
DV
2C_
SNS
_D
DV
6P2
_YHPB
SU_DDV
3P3
_Y
HP
BSU
_D
DV
1_
CN
2_
CN
3_
CN
4_
CN
5_
CN
6_
CN
7_
CN
8_
CN
9_
CN
01_
CN
11_
CN
21_
CN
31_
CN
41_
CN
51_
CN
61_
CN
71_
CN
81_
CN
91_
CN
02_
CN
12_
CN
22_
CN
32_
CN
42_
CN
52_
CN
62_
CN
72_
CN
82_
CN
92_
CN
03_
CN
13_
CN
23_
CN
33_
CN
43_
CN
53_
CN
63_
CN
73_
CN
83_
CN
93_
CN
04_
CN
14_
CN
24_
CN
34_
CN
44_
CN
54_
CN
64_
CN
74_
CN
84_
CN
94_
CN
05_
CN
15_
CN
25_
CN
35_
CN
45_
CN
55_
CN
65_
CN
75_
CN
85_
CN
95_
CN
06_
CN
16_
CN
26_
CN
36_
CN
46_
CN
GND1GND2GND3GND4GND5GND6GND7GND8GND9GND10GND11GND12GND13GND14GND15GND16GND17GND18GND19GND20GND21GND22GND23GND24GND25GND26GND27GND28GND29GND30GND31GND32GND33GND34GND35GND36GND37GND38GND39GND40GND41GND42GND43GND44GND45GND46GND47GND48GND49GND50
GND_A1GND_A2GND_A3GND_A4GND_A5GND_A6GND_A7GND_A8GND_A9GND_A10GND_A11GND_A12GND_A13GND_A14GND_A15GND_A16
VDD_A1VDD_A2VDD_A3VDD_A4VDD_A5VDD_A6VDD_A7VDD_A8VDD_A9VDD_A10VDD_A11VDD_A12VDD_A13
VDD_C1_1VDD_C1_2VDD_C1_3VDD_C1_4VDD_C1_5VDD_C1_6VDD_C1_7VDD_C1_8VDD_C1_9VDD_C1_10VDD_C1_11VDD_C1_12VDD_C1_13VDD_C1_14VDD_C1_15VDD_C1_16VDD_C1_17VDD_C1_18VDD_C1_19VDD_C1_20VDD_C1_21VDD_C1_22VDD_C1_23VDD_C1_24
VDD_C2_1VDD_C2_2VDD_C2_3
VDD_MDDI
VDD_P1_1VDD_P1_2VDD_P1_3VDD_P1_4VDD_P1_5VDD_P1_6
VDD_P2_1VDD_P2_2VDD_P2_3
VDD_P3_1VDD_P3_2VDD_P3_3VDD_P3_4VDD_P3_5VDD_P3_6
VDD_P4_1VDD_P4_2
VDD_P7_1VDD_P7_2
V3.3_B
SU_
GE
RV
V6.2_A
MS
M_G
ER
V
10n
C400
V9.2_2X
UA_
GE
RV
V8.1_E
MS
M_G
ER
V
VREG_MSMP_2.6V
VREG_MSME_1.8V
VREG_MSMC2_1.25V
VREG_MSMC1_1.25V
VREG_MSMA_2.6V
VREG_USB_3.3V
C455
10n
C409
10n
C445
0.1u
VREG_MSME_1.8V
C436
0.1u
VREG_AUX2_2.9V
C415
0.1u0.1u
C416
10n
C417C418
0.1u
0.1u
C19
0.1u
C446
0.1u
C4230.1u
C424
0.1u
C425
0.1u
C426
C428
10n22u
C434 C429
1n
C34
1n10u
C430
0.1u
C431
C404
0.1u
C433
10u
VREG_MSMA_2.6VVREG_MSMP_2.6V
VREG_MSMC1_1.25V VREG_MSME_1.8VVREG_MSMC2_1.25V
VREG_MSME_1.8V
TP408
VREG_MSME_1.8V
VREG_MSME_1.8V
834C
u2.2
TP407
n1734
C
TP406
TP405
TP404
TP403
TP402
C439
0.1u
n01724
C
R403
10K
0.1u
C414
TP401
TP5
C32
1n
V6.2_P
MS
M_G
ER
V
100K
R15
C21
0.1u
C15
10n 1n
C33
C449
0.1u
DNI
R12
10n
C422
C29
10n
PM
AR_
AP_
MS
G
MI
XT
_R
TR
MQ
XT
_R
TR
MI
XR
_R
TR
MQ
XR_
RT
R
MI
XRD
_RT
R
MQ
XR
D_
RT
R
IB
SS
_5
82
6R
TR
0R
_A
P
N_T
ESE
R_
TB
TU
O_
XOR
P
nSDRAM_CS0
nSDRAM_WE
nNAND_OE
EO_
DN
ANn
nNAND_WE
NAND_FLASH_READY
EBI2_DATA[7]
]6[
ATA
D_
2I
BE
EBI2_DATA[6]
]5
[A
TA
D_
2I
BE
EBI2_DATA[5]EBI2_DATA[4]EBI2_DATA[3]
]3[
AT
AD_
2I
BE
EBI2_DATA[2]EBI2_DATA[1]EBI2_DATA[0]
EBI2_DATA[15]
]51[
AT
AD
_2I
BE
EBI2_DATA[14]
]41[
AT
AD
_2I
BE
EBI2_DATA[13]EBI2_DATA[12]EBI2_DATA[11]EBI2_DATA[10]
]9
[A
TA
D_2
IB
E
EBI2_DATA[9]EBI2_DATA[8]
]8[
AT
AD_
2I
BE
AT
AD_
MI
SU
_M
SM
SDRAM_DQM3SDRAM_DQM2SDRAM_DQM1
0M
QD
_M
AR
DS
SDRAM_DQM0
3SQ
D_
MA
RDS
SDRAM_DQS3SDRAM_DQS2SDRAM_DQS1
0S
QD_
MAR
DS
SDRAM_DQS0
nRESETOUTTU
OTE
SER
n
0K
LCD
_M
ARD
S
SDRAM_DCLK0SDRAM_DCLK1
SDRAM_CKE
SDRAM_ADDR[12]
]21
[R
DDA
_M
ARD
S
SDRAM_ADDR[11]SDRAM_ADDR[10]
]0
1[R
DD
A_M
AR
DS
SDRAM_ADDR[9]SDRAM_ADDR[8]SDRAM_ADDR[7]
SDRAM_ADDR[5]SDRAM_ADDR[4]SDRAM_ADDR[3]SDRAM_ADDR[2]SDRAM_ADDR[1]
]1[R
DD
A_
MAR
DS
SDRAM_ADDR[0]
]6[
RDD
A_
MA
RD
S
SDRAM_ADDR[6]
SDRAM_DATA[16]
SDRAM_DATA[0]
SDRAM_BA0SDRAM_BA1
SDRAM_ADDR[13]
SDRAM_DATA[1]SDRAM_DATA[2]SDRAM_DATA[3]SDRAM_DATA[4]SDRAM_DATA[5]SDRAM_DATA[6]SDRAM_DATA[7]
]8[
ATA
D_
MA
RD
S
SDRAM_DATA[8]SDRAM_DATA[9]SDRAM_DATA[10]
]1
1[A
TA
D_M
AR
DS
SDRAM_DATA[11]
]2
1[AT
AD_
MA
RD
S
SDRAM_DATA[12]SDRAM_DATA[13]SDRAM_DATA[14]
]5
1[
AT
AD_M
ARD
S
SDRAM_DATA[15]
SDRAM_DATA[17]
]81
[AT
AD
_M
AR
DS
SDRAM_DATA[18]
]9
1[A
TA
D_M
AR
DS
SDRAM_DATA[19]SDRAM_DATA[20]SDRAM_DATA[21]SDRAM_DATA[22]SDRAM_DATA[23]SDRAM_DATA[24]
]5
2[AT
AD_
MA
RD
S
SDRAM_DATA[25]SDRAM_DATA[26]SDRAM_DATA[27]SDRAM_DATA[28]SDRAM_DATA[29]SDRAM_DATA[30]
]1
3[
AT
AD_
MA
RDS
SDRAM_DATA[31]
nSDRAM_RASnSDRAM_CAS
nNAND_UBnNAND_LB
P_VC
R
nNAND_FLASH_CS
V6.
2_A
MS
M_
GE
RV
ADS_
C2
I_
HCU
OT
MD_
HB
SU
PD_
HB
SU
SDRAM_CKE1
TNI_
CI
UM
AD
S_C
2I
_LB
_D
CL
OD
T_M
SM
ID
T_M
SM
SM
T_
MSM
KL
CS
YS
_HB
SU
OL
_KR
T
N_
TE
SER
_M
AC
DX
T_T
RA
U_T
B
ST
R_
TRA
U_
TB
LC
S_
C2
I_
CI
UM
KL
C_
CMM
DM
C_
CMM
LC
S_
C2
I_
MAC
PO
_E
NIL
M_
BTS
_P
_I
DDM
P_
BT
S_P
_I
DDM
M_AT
AD_
P_
IDD
M
P_
AT
AD_
P_
IDD
M
]2
[A
TA
D_M
AC
]6
[A
TA
D_M
AC
]7
[A
TA
D_
MAC
CN
YS
V_
MAC
V5
2.1
_1
CMS
M_
GE
RV
V52.
1_1CM
SM_G
ERV
V5
2.
1_1
CMS
M_
GER
V
V5
2.
1_1
CM
SM_
GE
RV
V5
2.1
_1
CMS
M_
GER
V
V5
2.
1_1
CM
SM
_GE
RV
V5
2.
1_1
CM
SM_
GE
RV
VSNS_MSMC2_1.25V
VSNS_MSMC1_1.25V
VSNS_MSME_1.8V
nSDRAM_CS1
ADS
_C2
I_
SS
AP
MOC
_X
OR
P
NW
OD_
em
ul
oV_
KD
NIP_
P1
_CI
M
MSM7227 Power Part
Cap for MSM7227 Power
Micron 8G+4G (EUSY0430901)
- 227 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
7. CIRCUIT DIAGRAM
C779
33p
157C
u01
u01257
C
VREG_FEM_2.7V
Q1
QST4
321
456
VCHG_VBUS10uC781
C7031u
207R
K003
1258R
K074
FB701600
U1005MAX17040G
9
7 4
8 1
6
5
3 2CELLVDD
SEO
EO
CTGSDA
GNDSCL DN
GP
SC3
4
3
2
1
C710
39p
307R
02
407R
02
R724 47KC783
10u
C711
39p
R600
10K
C712
39p
007X
531-CF
zHK867.232
1
C713
39p C715
0.1u
R723 0
CN700HSMU-5SB-24DR2
15
13
11
9
7
5
4
3
2
1
14
12
10
8
6
Q3SIA431DJ
S1S2
G
D1D2D3D4D5
R725 47KC717 1u
C716 1u
5C
u33
C707 47n
C8550
1u
CN701KQ03LP1-3R
3
2
1
D1
D2
VBAT
02 58R
051
9158R
051
807R
K7.4
47nC706
C8551
10n
VREG_MSMP_2.6V
10n
C725
K2.22258
R
K2.2325 8
R
K086
917R
470K
R717
K7.4
11R
9R
K7.4
VREG_MSMP_2.6V
107R
K051
D700
107DZ
u1.0087
C
577C
u33
VBAT
smho
K6.08
027R
VREG_MSMP_2.6V
VA700
777C
u1.0
C70422p
C70222pZD700
FL700NFM18PC104R1C3
1IN OUT
GND1 GND2
877C
p22
1u
C8549
4.7uC754
TS5USBA33402YZPRIC1
4B
D2
B2
A1 A2
B3
C2
A4
C1
A3 D1
E4
D3 D4
E3
E2 C3
E1 C4
1B
YLP
PU
SV
UART_TXVBUS
UART_RXDM
DP
USB_DMID
USB_DP
AUDIO_LR2_2K
AUDIO_R
MIC
DSS
_INT
SDACLDO
SCL
GNDTE
SI
2.2K
R705
C7240.1u
VCHG_VBUS
K2
707R
607R
K2
VREG_MSMP_2.6V
C7210.1u
+VPWR
C744
4.7u
C8552
1u
2.2u
C761
VREG_PROX_COMPASS_2.6V
BU33TD2WNVXU703
5
3 24 1
VOUTVINGNDSTBY
DN
GP
47K
R709
C730
2.2u
2.2u
C771
VREG_MSMP_2.6V
4.7u
C768
4.7uELCP0008004
L703
VREG_TOUCH_3.0V
VREG_USB_3.3V
+VPWR
22pC774
22pC776
200K
R722
TP702
VREG_MSMP_2.6V
TP701TP700
R710
4.7
ELCP0008012
4.7uL701
VREG_MSME_1.8V
947C
u22
VREG_LCD_1.8V
L704ELCP0008004
4.7u
C760 2.2u
547C
n1
+VPWR
VREG_MSME_1.8V
C765
2.2u
VREG_RFRX1_2.7VPM7540U704
9J8J7J6J5J9H8H7H6 H5 H9G8G7G6G5G9F8F7F6F5F9E8E7E6E5E
H1E10F1F10E1C12N2
B1M12B2K7
A5N13A4M13B5
B4G10A7D9A6H12B7
B6C13A13D10A12K10
H10G12J10G1M1K4D13J4E12H4N11M2A3L2A10H2A8H13K2G13J2A11G4K13F4E13D5B13B3A9M5N12N3J13N1A2M3
K6M4K5N4K9M9K8N10M11M6L12N6A1M8D4N8B12J1D8K1N5
M7
2G21D7D8B01M6 D9 B21J31F21 F21K7N9N01B
31L11B2F4E2C1C1D1 L2 D2E
GH
CV
N_LTC_
GH
C
SU
BV_
BS
U
N _L TC_
BS
U
P_S
NSI
M_S
NSI
N_TEF _T
AB
TA
BV
NIO
CV
PU
KC
AB_
V
AN
A _D
DV
E_1C_
DD
V
AP _2
C _D
DV
2P
G_D
DV
6P
G _D
DV
2E
MS
M _D
DV
PM
SM_
DD
V
1FR_
DD
V
2FR_
DD
V
M IU
R_D
DV
RK
PS_L_
DD
V
RK
PS_
R_D
DV
OX
C T_D
DV
NAL
W_D
DV
MPP_1
MPP_2 VSW_5V
MPP_3 VREG_5V
MPP_4 VSW_MSMC1
MPP_5 VREG_MSMC1
MPP_6 VSW_MSMC2
MPP_7 VREG_MSMC2
MPP_8 VSW_MSME
MPP_9 VREG_MSME
MPP_10 VSW_PA
MPP_11 VREG_PA
MPP_12
MPP_13 VREG_GP1
MPP_14 VREG_GP2
MPP_15 VREG_GP3
MPP_16 VREG_GP4
MPP_17 VREF_GP5
MPP_18 VREG_GP6
MPP_19 VREG_MMC
MPP_20 VREG_MSMA
MPP_21 VREG_MSME2
MPP_22 VREG_MSMP
VREG_RFRX1
USB_ID VREG_RFRX2
USB_D_P VREG_RFTX
USB_D_M VREG_RUIM1
USB_OE_N VREG_SYNT
USB_DAT VREG_TCXO
USB_SE0 VREG_USB
VREG_WLAN
SBST MIC_BIAS
SBCK
SBDT_SSBI REF_ISET
MSM_INT_N REG_GND
REF_BYP
SPKR_IN_L_M
SPKR_IN_L_P TCXO_IN
SPKR_OUT_L_M TCXO_EN
SPKR_OUT_L_P TCXO_OUT
SPKR_IN_R_P
SPKR_IN_R_M XTAL_IN
SPKR_OUT_R_P XTAL_OUT
SPKR_OUT_R_M
SLEEP_CLK
VIDEO_IN AMUX_OUT
VIDEO_OUT
VIB_DRV_N KPD_PWR_N
KPD_DRV_N PON_RESET_N
LCD_DRV_N PS_HOLD
FLSH_DRV_N
1D
NG
2D
NG
3D
NG
4D
NG
5D
NG
6D
NG
7D
NG
8D
NG
9D
NG
01D
NG
11D
NG
21D
NG
31D
NG
41D
NG
51D
NG
61D
NG
71D
NG
81D
NG
91D
NG
02D
NG
12D
NG
22D
NG
32D
NG
42D
NG
52D
NG
Q2
QST4
321
456
R715 121K
K01117
R
VREG_TCXO_2.85V
R716 51
847C
n1
C762
2.2u
1K
R712
C770
2.2u
VBAT
VREG_MSMC1_1.25V
VREG_MMC_3.0V
VCHG_VBUS
0.1uC773
n1647
C
VREG_RUIM_3.0V
u2.2047
C
C763
2.2u
VREG_MSMA_2.6V
2.2u
C766
VREG_MSMC2_1.25V
VRF_SMPS_2.1V
n1747
C
C772
1u
VREG_MSMP_2.6V
SDB310QD701
2.2u
C769
KDS114E-RTK_HA
D702
ELCP0008012
4.7uL702
10uC743
057C
u7.4
C739 0.1u
0.1uC736
C735 0.1u
0.1uC734
C733 0.1u
0.1uC732
C731 0.1u
+VPWR
1nC753
0.1uC729C728
33p
+VPWR_AUDIOC742 1n
4.7u
C767
VREG_AUX2_2.9V
VREG_LCD_2.8V
C759 2.2u
0.1uC727
0.1uC726
C705
1u
VCHG_VBUS
U700
MAX14528
96
53
4
82
71IN1 OUT1
IN2 OUT2
IC1
OVLO IC2DN
G
DN
GP
2.2u
L700
1nC741
317R
1.0
VBAT
+VPWR
R16
51
10nC757
0.1u
C701C700
2.2u
C714
0.1u
C9002.2u
470nC708
C709 470nU701
WM9093ECS-R
3B
A4
C3
C22
B
D1
D3
4D
C1
A1D21
B
D5
A2
A5
A3B5
4B
C5
4C
DN
G
OUT+
DD
VP
HCPVDDCPVSS
CN
HPL
OUT-
SAI
BIN2- HPR
IN1+
DD
VS
IN3-
IN2+
AD
SIN1-
IN3+
CP
LC
S
C722
2.2u
+VPWR_AUDIO
2.2uC719
2.2u
C723
2.2uC720
VREG_MSME_1.8V
VBAT_TEMP
VBAT_TEMP
PMIC_TCXO
TCXO_PM_19.2MHZ
JTAG_PS_HOLD
TCXO_EN
SLEEP_CLK
HPH_LHPH_R
RCV_N
PM_INT_N
PS_HOLD
MSM_USIM_CLK
MSM_USIM_DATA
MSM_USIM_RST
GSM_PA_DAC_REF
RCV_P
nPON_RST
REMOTE_PWR_ON
USBH_DMUSBH_DP
AMUX_OUT
SLIDE_KPD_DRV_N
NIO
CV
SIM_IO
SIM_CLK
KPD_PWR_N
SIM_RST
SPK_RCV-SPK_RCV+
MUIC_INT
MUIC_I2C_SCLMUIC_I2C_SDA
UART2_TXDUART2_RXD
LINE_OPLINE_ON
USB_ID
USB_ID
MAX_DM
MAX_DM
MAX_DP
MAX_DP
PCB_REVISION
PCB_REVISION
+VPWR
RW
PV+
VSNS_RF_SMPS
VSNS_MSMC2_1.25V
VSNS_MSMC1_1.25V
VSNS_MSME_1.8V
BATT_FET_N
N_TEF_TT
AB
CHG_CTL_N
N_LTC_
GH
C
ISNS_P
P_S
NSI
VBAT_SENSE
VBAT_SENSE
PMIC_SSBI
USB_3.3V_EN
USB_3.3V_EN
EAR_REAR_L
AUDIO_I2C_SDAAUDIO_I2C_SCL
QT_KPD_DRV_N
FUEL_I2C_SDAFUEL_I2C_SCL
2mm
Global 5pin TA
Global 5pin USB Cable
PCB Revision
Battery Connector
2mm
Jap. Charging Gender
Jap. Data Gender
430K
1.04V
R1
300K
0.62V
1.73V
100K
0.81V
680KRev.1.2
D&I
Rev.1.0
0.16V
HKAIN0 : PCB Revision Check ADC
150K
150K
Rev.1.1
A&F
B&G
C&H
1.93V
REV
150K
150K
47K
68K
10K
2.13V
R2
150K
TEST&E
150K
ADC
150K
150K
150K
1.30V
u-USB Connector MUIC
VBUS 2mm
2010.03.20
2010.01.28 added
2009.11.18
0.3mm 0.3mm
09.11.12
Turbo Mode
180k
Am08 eldnaH naC ecarT
180k
1608
0603
0603
0603
3060
0603
mm5.0 9N ,7 N close to each other
FUEL GUAGE
NDK --> EPSON
M_SNSI
330k
Open
Short
Pulled By PC
Open
Pulled By PC
No Charging (TBD)
300mA Normal
Call : 500mA Alternative Charging (TBD)Idle : 600mA Normal
DCM shop usage
ID Resistance USB D+/D-
0603
0603
1608
Place close to PM7540 pins
Route together
USB 3.3V LDO
0603
0.6mm
0603
These CAPs close to inductors
0.6mm
0.6mm
Place in PM7540 room at shield edge
PM7540
Local Ground Plan
0.5mm
rehtegot etuoR
1%
Place crystal and load caps close to PM7540
ISNS_M 1%
2mm
Battery Charging Circuit
10V1608
2mm
AUDIO SUBSYSTEM
- 228 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
7. CIRCUIT DIAGRAM
U800LBEH19UNBC-338
039282726252423222120291817161
31
3215
14
33
3413
3512
3611
3710
389
398
407
6
415
4
42
433
442
45
1
6474849405152535451
DN
G
2D
NG
3D
NG
4D
NG
B_E
KA
W_TS
OH_L
W
DXT_T
RA
U_TB
N_ST
C_TR
AU_T
B
N_ST
R_TR
AU_T
B
DX
R_TR
AU_T
B
ANT
BT_PCM_CLK
GND5 BT_PCM_OUT
VDD_WL_PA BT_PCM_SYNC
BT_PCM_IN
SDIO_CMD
SDIO_CLK VDD_BT_PA
SDIO_D3
SDIO_D2 S_CLK_IN
SDIO_D1 GND6
SDIO_D0 FM_ANT
WL_RST_N BT_GPIO_0
WL_WAKE_B BT_GPIO_1
REG_ON BT_GPIO_3
VBAT_IN BT_GPIO_4
BT_GPIO_7
SR_VLX1
SR_VLX1BB F_CLK_IN
F_CLK_OUT
BB2
XLV_
RS
BBT
UO
V_R
S
OID
DV
UP_L
ATX
DS_
O ID
DV
TU
O_2P1_
GID
TU
O_2P1_
GLN
A
ODL
V2P1_
NIV
TU
O_2O
DLNL
AD
S_TB
LC
S_TB
1OI
DU
A
2OI
DU
A
N_TS
R_TB
7D
NG
C810
0.1u
VREG_MSMP_2.6V
K2.2
308R
K2.2
408R
C825
2.2u
L804
4.7n
C809
4.7u
KR3DMU801
61
76
5
4
8
3
9
2
10
1
11
12
13
41512
DE
VR
ES
ER
DD
V
GND3
GND2
INT1
VDD_IO
RESERVED1
NC1
INT2
NC2
SC
SCL_SPC
GND1
OD
S_ID
S_A
DS
0A
S_O
DS
4D
NG
R801
11K
L80554.7u
C801
22p
7158R
0
C807
1.2p
C826 100p
22p
C800ANT800
SNGF0048003ITBTPTR3015
2
3 1
4G2
FEEDG1
NC
008R
K7.4
L801
100n
26MHz
X800
TG-5010LH-87N
4 2
3 1NCOUT
GNDVCC
J800
ENSY0024301KP09N-6S-2_54SF
98
107
63
52
41VCC GND1
RST VPP
CLK IO
GND2 GND5
GND3 GND4
VDD_TCXO
VDD_TCXO
+VPWR
10uC822
C8547
1u
3.3uL803
VREG_MSMP_2.6V
0.1u
C817
600
FB8501
2.2u
C8535
0.1u
C8543
4.7u
C816
0.1u
C823
2.2u
C8538
VREG_MSMP_2.6V
4.7uC813
4.7u
C8541
10uC8534
+VPWR
0.1uC814
8.2p
C8544
TP4
C805
12p
TP10
K001
508R
C824
1u
BU28TD2WNVX U802
5
3 24 1
VOUTVINGNDSTBY
DN
GP
1u
C827
22p
C803C802
0.1u
C804
10p
VREG_RUIM_3.0V
VREG_RUIM_3.0V
D800
43
52
61
TP3TP2
TP6 TP7
TP8
TP9
BT_RESET_N
PUEKAW_TSOH_NALW
WLAN_RESET_N
MOTION_INT
SLEEP_CLK
BT_PCM_CLK
BT_PCM_SYNCBT_PCM_DOUT
WLAN_CLKWLAN_CMD
BT_WAKEUP
WLAN_SDIO[0]
WLAN_SDIO[2]WLAN_SDIO[1]
BT_PCM_DIN
BT_HOST_WAKEUP
WLAN_SDIO[3]
MOTION_I2C_SDA
MOTION_I2C_SCL
SIM_IO
SIM_IOSIM_CLK
SIM_CLKSIM_RST
SIM_RST
DXT_TRAU_TB
DXR_TRAU_TB
STC_TRAU_TBSTR_TRAU_TB
WLAN_WAKEUP
CLK_REQ
CLK_REQ
CLK_IN
CLK_IN
RF_IN_OUT
RF_IN_OUT
WLAN_REG_ON
BT_ANTRF
Wi-Fi&BT&FM MODULE
TCXO LDO
Acceleration SENSOR
USIM Socket
26MHz TCXO
0603
3060
3060 3060
- 229 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
7. CIRCUIT DIAGRAM
+VPWR
VREG_MMC_3.0V
VREG_LCD_2.8V
VREG_LCD_1.8V
VREG_TOUCH_3.0V
VREG_MSMP_2.6V
VREG_PROX_COMPASS_2.6V
CN90024-5804-080-000-829+
4140
4239
4338
4437
4536
4635
4734
4833
4932
5031
5130
5229
5328
5427
5526
5625
5724
5823
5922
6021
6120
6219
6318
6417
6516
6615
6714
6813
6912
7011
7110
729
738
747
756
765
774
783
792
801
CAM_MCLK
TOUCH_INT
PROX_COMPASS_I2C_SCL
PROX_OUT
TOUCH_I2C_SCL
TOUCH_I2C_SDA
MIC_BIAS
SLIDE_KPD_DRV_N
VCOIN
KPD_PWR_N
SPK_RCV-
SPK_RCV+
LCD_BL_I2C_SCL
LCD_BL_I2C_SDA
LCD_BL_EN
CAM_DATA[0]
CAM_DATA[1]
MIC_1N CAM_RESET_N
HS_MIC
CAM_PWDN
MICROSD_DET_N
HOOK_ADC
MSM_LCD_VSYNC_O
LCD_MAKERID_LOW
QTKEY_RESET
QTKEY_INT
MMC_CLK
MMC_CMD
MMC_DATA[3]
MMC_DATA[2]
MMC_DATA[1]
MMC_DATA[0]
MIC_1P
HS_MIC_BIAS_EN
CAM_I2C_SCL
CAM_I2C_SDA
SLIDE_DETECT
QTKEY_SDA
QTKEY_SCL
EAR_SENSE
MDDI_P_STB_M
MDDI_P_STB_P
MDDI_P_DATA_M
MDDI_P_DATA_P
LCD_RESET_N
CAM_DATA[4]
CAM_DATA[3]
CAM_DATA[2]
CAM_DATA[6]
CAM_DATA[7]
CAM_DATA[5]
CAM_PCLK
CAM_HSYNC
CAM_VSYNC
EAR_R
EAR_L
MOTOR_EN
MOTOR_PWM
COMPASS_DRDY
PROX_COMPASS_I2C_SDA
DK_Volume_UP
DK_Volume_DOWN
QT_KPD_DRV_N
Audio GND - Routing Carefully
Main to Qwerty Connector
- 230 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
7. CIRCUIT DIAGRAM
CN214-5804-080-000-829+
4140
4239
4338
4437
4536
4635
4734
4833
4932
5031
5130
5229
5328
5427
5526
5625
5724
5823
5922
6021
6120
6219
6318
6417
6516
6615
6714
6813
6912
7011
7110
729
738
747
756
765
774
783
792
801
VREG_LCD_2.8V
VREG_LCD_1.8V
+VPWR
VREG_MMC_3.0V
VREG_TOUCH_3.0V
VREG_MSMP_2.6V
VREG_PROX_COMPASS_2.6V
CN114-5804-080-000-829+
4140
4239
4338
4437
4536
4635
4734
4833
4932
5031
5130
5229
5328
5427
5526
5625
5724
5823
5922
6021
6120
6219
6318
6417
6516
6615
6714
6813
6912
7011
7110
729
738
747
756
765
774
783
792
801
VREG_PROX_COMPASS_2.6V
VREG_MSMP_2.6V
VREG_TOUCH_3.0V
VREG_LCD_1.8V
VREG_LCD_2.8V
VREG_MMC_3.0V
+VPWR
LCD_BL_I2C_SCLLCD_BL_I2C_SCL
LCD_BL_I2C_SDALCD_BL_I2C_SDA
LCD_BL_ENLCD_BL_EN
CAM_DATA[0]CAM_DATA[0]
CAM_DATA[1]CAM_DATA[1]
SPK_RCV+SPK_RCV+
SPK_RCV-SPK_RCV-
MIC_1NMIC_1N CAM_RESET_NCAM_RESET_N
HS_MICHS_MIC
CAM_PWDNCAM_PWDN
MICROSD_DET_NMICROSD_DET_N
HOOK_ADCHOOK_ADC
MSM_LCD_VSYNC_OMSM_LCD_VSYNC_O
LCD_MAKERID_LOWLCD_MAKERID_LOW
QTKEY_RESETQTKEY_RESET
EAR_REAR_R
EAR_LEAR_L
KPD_PWR_NKPD_PWR_N
QTKEY_INTQTKEY_INT
PROX_OUTPROX_OUT
MMC_CLKMMC_CLK
MMC_CMDMMC_CMD
MMC_DATA[3]MMC_DATA[3]
MMC_DATA[2]MMC_DATA[2]
MMC_DATA[1]MMC_DATA[1]
MMC_DATA[0]MMC_DATA[0]
MIC_1PMIC_1P
HS_MIC_BIAS_ENHS_MIC_BIAS_EN
TOUCH_INTTOUCH_INT
CAM_I2C_SCLCAM_I2C_SCL
CAM_I2C_SDACAM_I2C_SDA
TOUCH_I2C_SCLTOUCH_I2C_SCL
TOUCH_I2C_SDATOUCH_I2C_SDA
SLIDE_DETECTSLIDE_DETECT
QTKEY_SDAQTKEY_SDA
QTKEY_SCLQTKEY_SCL
EAR_SENSEEAR_SENSE
MIC_BIASMIC_BIAS
MDDI_P_STB_MMDDI_P_STB_M
MDDI_P_STB_PMDDI_P_STB_P
MDDI_P_DATA_MMDDI_P_DATA_M
MDDI_P_DATA_PMDDI_P_DATA_P
LCD_RESET_NLCD_RESET_N
CAM_DATA[4]CAM_DATA[4]
CAM_DATA[3]CAM_DATA[3]
CAM_DATA[2]CAM_DATA[2]
CAM_DATA[6]CAM_DATA[6]
CAM_DATA[7]CAM_DATA[7]
CAM_DATA[5]CAM_DATA[5]
CAM_MCLKCAM_MCLK
CAM_PCLKCAM_PCLK
CAM_HSYNCCAM_HSYNC
CAM_VSYNCCAM_VSYNC
QT_KPD_DRV_NQT_KPD_DRV_N
DK_Volume_DOWNDK_Volume_DOWN
DK_Volume_UPDK_Volume_UP
PROX_COMPASS_I2C_SDAPROX_COMPASS_I2C_SDA
COMPASS_DRDYCOMPASS_DRDY
MOTOR_PWMMOTOR_PWM
MOTOR_ENMOTOR_EN
VCOINVCOIN
SLIDE_KPD_DRV_NSLIDE_KPD_DRV_N
PROX_COMPASS_I2C_SCLPROX_COMPASS_I2C_SCL
AUDIO_GNDAUDIO_GND
BtoB Connector
Main Connector Sub Connector
Main To Sub
- 231 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
7. CIRCUIT DIAGRAM
10uC119
VREG_LCD_1.8V VREG_MSMP_2.6V
NLSV1T244MUTBGU102
43
52
61VCCA VCCB
A B
GND OE_
VREG_CAM_AVDD_2.7V
R110 12
GB042-34S-H10-E3000CN101
1716151413121110
98765
314323332341
30
29
28
27
26
25
24
23
22
21
20
19
18
VREG_CAM_DVDD_1.2V
120FB102
C1170.1u
VREG_CAM_AF_2.8V
VA1
FL102 7.5pF
01 5
6 4
7 3
8 2
9 1INOUT_A1INOUT_B1
INOUT_A2INOUT_B2
INOUT_A3INOUT_B3
INOUT_A4INOUT_B4
1G
2G
FL101 7.5pF
01 5
6 4
7 3
8 2
9 1INOUT_A1INOUT_B1
INOUT_A2INOUT_B2
INOUT_A3INOUT_B3
INOUT_A4INOUT_B4
1G
2G
VREG_CAM_IOVDD_1.8V
C3
DNI
0.1uC114
C1130.1u
FB101120
0.1uC112
VA101
C1111u
AAT2870
U101
D2
1E
A4
C1
B3
3F5C
3A
A2
C2
B2
D1
B1
A1
D3
F1
E2
F2
E3
E4
F4
E5
F5
C3
D5A5
4C
4D
4B
5B
+2C
+1C
-1C
-2C
IN NEG
SDA
BL1
BL2
BL3
BL4
BL5
BL6
BL7
BL8
SCL
LDOA
LDOB
BC_M
LDOC
FLTR
LDOD
1D
NG
A
1D
NG
P
2D
NG
P
SBIAS
AMB_IN
IN_LDO
2DNGA
EN
C11033u
2.2uC109
+VPWR
FL1 7.5pF
015
64
73
82
91INOUT_A1 INOUT_B1
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
1G
2G
111R
K2 .2
VREG_MSMP_2.6V
601R
K001 VREG_CAM_AF_2.8V
2.2uC106
2.2uC105C104
2.2uC1032.2u
VREG_CAM_AVDD_2.7V
VREG_CAM_DVDD_1.2V
VREG_CAM_IOVDD_1.8V
VREG_CAM_IOVDD_1.8V
U103
EUSY0342405NLSX4373MUTAG
54
63
72
81VL VCC
IO_VL1 IO_VCC1
IO_VL2 IO_VCC2
GND EN
211R
K2.2
33p
C120
C107
1u 1u
C108
501R
K7.4
VREG_MSMP_2.6V
401R
K7.4
201R
K2.2
K2.2101
R
CAM_PWDN
CAM_RESET_N
FLT_CAM_DATA[7]
FLT_CAM_DATA[7]
FLT_CAM_DATA[6]
FLT_CAM_DATA[6]
FLT_CAM_DATA[5]
FLT_CAM_DATA[5]
FLT_CAM_DATA[4]
FLT_CAM_DATA[4]FLT_CAM_DATA[3]
FLT_CAM_DATA[3]
FLT_CAM_DATA[2]
FLT_CAM_DATA[2]
FLT_CAM_DATA[1]
FLT_CAM_DATA[1]
FLT_CAM_DATA[0]
FLT_CAM_DATA[0]CAM_DATA[0]CAM_DATA[1]
LCD_BL_I2C_SCLLCD_BL_I2C_SDALCD_VSYNC_O MSM_LCD_VSYNC_O
WLED7WLED6
WLED1WLED2WLED3WLED4WLED5
LCD_BL_EN
CAM_DATA[4]
CAM_DATA[3]CAM_DATA[2]
CAM_DATA[6]CAM_DATA[7]
CAM_DATA[5]
CAM_MCLK
CAM_PCLK
CAM_HSYNC
CAM_VSYNC
FLT_CAM_VSYNC
FLT_CAM_VSYNC
FLT_CAM_HSYNC
FLT_CAM_HSYNC
CAM_I2C_SDA
CAM_I2C_SCL
FLT_CAM_I2C_SDA
FLT_CAM_I2C_SDA
FLT_CAM_I2C_SCL
FLT_CAM_I2C_SCL
LCD BACKLIGHT CHARGE PUMPLCD Vsync
CAMERA EMI FILTER
3M CAMERA LGIT_1/4'' SVCY0024801(C3AA-Y314A)
- 232 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
7. CIRCUIT DIAGRAM
C25001u
11R
p001
C402
DNI
CN40224-5804-080-000-829+
4140
4239
4338
4437
4536
4635
4734
4833
4932
5031
5130
5229
5328
5427
5526
5625
5724
5823
5922
6021
6120
6219
6318
6417
6516
6615
6714
6813
6912
7011
7110
729
738
747
756
765
774
783
792
801
VREG_PROX_COMPASS_2.6V
VREG_MSMP_2.6V
VREG_TOUCH_3.0V
VREG_MMC_3.0V
VREG_TOUCH_3.0V
VREG_LCD_2.8VVREG_LCD_1.8V
VREG_LCD_1.8V
VREG_LCD_2.8V
CN5
HJ-BCT-04Y
1
VREG_MSMP_2.6V
CN4
HJ-BCT-04Y
1
SW401
G1
ANTG2
VREG_PROX_COMPASS_2.6V
K7.4
304R
K7.4
204R
+VPWR
C403
27n
CN401GB042-50S-H10-E3000
2625
2724
2823
2922
3021
3120
3219
3318
3417
3516
3615
3714
3813
3912
4011
4110
429
438
447
456
465
474
483
492
501
104R
K01
+VPWR1K
R8
CAM_PWDN
CAM_RESET_N
CAM_DATA[0]
CAM_DATA[1]
LCD_BL_I2C_SCL
LCD_BL_I2C_SDA
LCD_VSYNC_O
MSM_LCD_VSYNC_O
WLED7WLED6
WLED1WLED2WLED3WLED4WLED5
LCD_BL_EN
CAM_DATA[4]
CAM_DATA[3]
CAM_DATA[2]
CAM_DATA[6]
CAM_DATA[7]
CAM_DATA[5]
CAM_MCLK
CAM_PCLK
CAM_HSYNC
CAM_VSYNC
VCOIN
VCOIN
MIC_1P
PROX_COMPASS_I2C_SDA
PROX_COMPASS_I2C_SDA
PROX_COMPASS_I2C_SCL
PROX_COMPASS_I2C_SCL
DK_Volume_DOWN
QTKEY_SCL
KEY_ROW[7]
QTKEY_SDA
QT_KPD_DRV_N
MIC_1N
HOOK_ADC
LCD_MAKERID_LOW
LCD_MAKERID_LOW
PROX_OUT
PROX_OUT
TOUCH_INT
TOUCH_INT
TOUCH_I2C_SCL
TOUCH_I2C_SCL
TOUCH_I2C_SDA
TOUCH_I2C_SDA
SPK_RCV-
SPK_RCV-
SPK_RCV+
SPK_RCV+
MDDI_P_STB_M
MDDI_P_STB_M
MDDI_P_STB_P
MDDI_P_STB_P
MDDI_P_DATA_M
MDDI_P_DATA_M
MDDI_P_DATA_P
MDDI_P_DATA_P
LCD_RESET_N
LCD_RESET_N
MMC_CLK
MMC_CMD
MMC_DATA[3]
MMC_DATA[2]
MMC_DATA[1]
MMC_DATA[0]QTKEY_RESET
EAR_R
EAR_L
MICROSD_DET_N
QTKEY_INT
HS_MIC_BIAS_EN
HS_MIC
SLIDE_DETECT
EAR_SENSE
MIC_BIAS
KEY_COL[7]KEY_COL[6]
MOTOR_EN
MOTOR_PWM
COMPASS_DRDY
SLIDE_KPD_DRV_N
SLIDE_KPD_DRV_N
DK_Volume_UP
KPD_PWR_N
KPD_PWR_N
AUDIO_GND
CAM_I2C_SDA
CAM_I2C_SCL
Sub to LCD FPCB Connector
Main Antenna
Main to Sub Connector
PROX power : Route 0.2mmPROX and COMPASS common Power/I2C
- 233 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
7. CIRCUIT DIAGRAM
LD305
CL-435F-WQT-SD-TS
4
3
2
1
LD3044
3
2
1
L3
100n
LD3034
3
2
1
+VPWR
LD3014
3
2
1
533R
0
223AV
433R
K2.2
VREG_MSMP_2.6V
C3030.1u
333R
K2.2
0.1uC302
470R332
VA321
023AV
913AV
813AV
713AV
470R331
PP2106M3
U301
41312 11 10198
157
166
175
184
193
202
211
2232425262728292D
NG
P
2D
NG
BTE
SE
R
IX O
X
LE
S_K L
C
DD
V
01P
TEST P40
SEL_28P P41
P57 P42
P56 P43
P55 P44
P17 P45
P15 P46
1D
NG
45P
35P
25P
15P
05P
74P
613AV
513AV
C301
1u
33R330
413AV
R329 33
33R328
R327 33
313AV
213AV
113AV
013AV
903AV
803AV
KB353
703AV
470R324
470R323
470R322
R321 470
470R320
470R319
470R318
R317 470
470R316
R315 470
470R314
R313 470
R312 470
CN301
3
2
1K021
113R
KB351 KB350 KB356 KB355 KB349
KB352
503AV
KB348
R309 100ohmsR308 100ohms
203AV
323AV KB347
KB308
KB345KB344 KB357 KB354 KB343 KB342KB341 KB317
KB339KB338 KB337 KB336 KB335 KB334KB333
KB324
KB331KB330 KB329 KB328 KB327 KB326KB325
KB332
KB323 KB322 KB321 KB320 KB319KB318
KB340
KB316
KB315
KB314 KB313 KB312 KB311 KB310KB309
KB346
KB307KB306 KB305 KB304 KB303 KB302KB301
470R302
100nL5
100n
L4
2L
n001
DK_Volume_DOWN
KEY_COL[2]
QTKEY_SCL
KEY_COL[3]
KEY_ROW[7]
QTKEY_SDA
QT_KPD_DRV_N
QTKEY_RESET
QTKEY_INT
KEY_COL[0] KEY_COL[1]
KEY_ROW[5]
KEY_COL[7]
KEY_ROW[6]
KEY_ROW[1]
KEY_ROW[1]
KEY_COL[4]
KEY_COL[5]
KEY_COL[5] KEY_COL[6]
DK_Volume_UP
SPACE2
Key Coder ICQwerty 54key / 4pie DR
%1
KEY LED LIGHT
VOLUME SIDEKEY
ENTER2
Changed 03/24From 4P to 3P
Citizen for Japan
1 2 3 4 5 6 7
BACK8 9 0 DEL ENTER1SEARCH
Q W E R T Y U
I O P Fn A SLANG
D F G H J K L
MENU
DOT
Z X C V SPACE1
B N MMANNER UP DOWN
HIPEN
END
COMA
SHIFT1
SHIFT2
HOME
HOMESENDLEFT RIGHT
- 234 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
7. CIRCUIT DIAGRAM
312R
IN
D
MIC1
6
5
4
3
2
1OUT
G1
G2
G3
PWR
G4
10 2R
IN
D
ZD206 ZD201 ZD202
D207D208
ZD205
C216
100p
412R
IN
D
U202
32
41VDD OUT
VSS NC
FB202 1800
FB203 1800
C206
4.7u
CN1
168
7
6
5
4
3
2
1 15
G5 G3 G1 CD
C1
C2
C3
C4
C5
C6
C7
C8
G6 G4 G2 COM
G7
512C
p51
41 2C
u 0 1
3 12C
p74
R216
100K
1800FB201
0.1u
C21247p
C21033p
C208
2.2u
C207
912R
K74
212R
smho
K001
0.1u
C205
K74
112R
602D
43
52
61
VREG_MSMP_2.6V
R210 2.2
VREG_MMC_3.0V
502D
43
52
61
K74
9 02R
802R
K 74
K74
702R
K7 4
6 02R
47p
C204
402D
FB1 1800
100nC203
VREG_MSMP_2.6V
C2020.1UF
VREG_MSMP_2.6V
K2.2
302R
33pC201
202D
102D
202R
K001
1800
FB204
U201
5
3 24 1
VOUTVINGNDSTBY
DN
GP
001Q
D
G
S
022R
M1
VREG_MSMP_2.6V
J201
2
36
5
4
1M5_MIC
M4_L
M3_DETECT
M4D-DETECT
M1_R
M6_GND
MIC_1PMIC_1N
HOOK_ADCMMC_CLK
MMC_CMDMMC_DATA[3]MMC_DATA[2]
MMC_DATA[1]MMC_DATA[0]
EAR_R
EAR_L
MICROSD_DET_N
HS_MIC_BIAS_EN
HS_MIC
SLIDE_DETECT
EAR_SENSE
MIC_BIAS
AUDIO_GND
MICROPHONE SLIDE DETECT
3.5 EAR_JACK
MATING
EAR_SENSE
UNMATING
STATE
Open
Detect
Close (Detect =COM)
S/W
LOW (Detect)
HIGH (Normal)
Micro SD SocketLOW(DEFAULT)
HIGH
Changed 03/24
Active : Low
5/10 Added
- 235 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
7. CIRCUIT DIAGRAM
CN601
2
1
L511 100n
L512 100n
470n
C2
523AV
423AV
C4
1u
6R
K3.3
1C
n01
U1AMI304
12
11
10
9
5
4
6
37
28
1D
DV
D
GE
RV
AD
NG
SD
NG
DD
VA
ADDR
SCL
NC1
TNI
VPP
DRDY
SDA
K3.3
7R
TP1
VREG_PROX_COMPASS_2.6V
0R2
R4 0
Q601
C
B
E GND
IN
OUT
R619
100K
TPA6202A1ZQVRU601
B2C1
A1B1
B3C2
A3C3IN- VDD
IN+ VO+
_SHUTDOWN VO-
BYPASS GND
VREG_MOTOR_3.3VVREG_MOTOR_3.3V
K1
716R
100K
R622
51K
R620
51K
R621
C638
0.1u
10nC640
816R
K1
K7.4
326R
C639
1u
C471
1u
R430
100K
+VPWR
VREG_MOTOR_3.3V
U405BU33TD2WNVX
5
3 24 1
VOUTVINGNDSTBY
DN
GP
PROX_COMPASS_I2C_SDA
PROX_COMPASS_I2C_SCL
MOTOR_EN
MOTOR_PWM
COMPASS_DRDY
CONNECTOR Type
Digital Compass
%1%1 1%
Q-coin MOTOR
1%
1%
1%
2010.03.10 addedMotor 3.3V LDO
0603
- 236 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
7. CIRCUIT DIAGRAM
KB101
LD100CL-435F-WQT-SD-TS
4
3
2
1
001A
V
101A
V
501A
V
301A
V
201A
V
LD102CL-435F-WQT-SD-TS
4
3
2
1
KB102
KB100
VA104
+VPWR
R103
33
VREG_PROX_COMPASS_2.6V
CN100GB042-10P-H10-E3000
65
74
83
92
101
311HR-VG1BAT100
p93501
C
401C
p9 3CN101
2
1
101D
001D
VREG_PROX_COMPASS_2.6V
VREG_LCD_1.8VVREG_LCD_2.8V
VREG_PROX_COMPASS_2.6V
R100
4.7
u1 101C
TP100
+VPWR
0.1u
C103C102
4.7u
R101
10
C100 4.7uU100 GP2AP002S00F
54
63
72
81LEDA SCL
LEDC SDA
VCC VIO
VOUT GND
VREG_TOUCH_3.0V
GB042-50P-H10-E3000CN102
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
501
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
2.2uC107
2.2uC106
D102
43
52
61
+VPWR
VREG_LCD_1.8V VREG_LCD_2.8V
04-6293-025-001-829CN103
25
24
23
22
21
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
ICMEF214P101MFL100
019
84736251
P1 P5P2 P6P3 P7P4 P8
1G
2G
R104
33
CL-435F-WQT-SD-TSLD101
4
3
2
1
601AV
C110
DNI
R102
33
C108
2.2u
701AV
C109
1u
801AV
SPK_RCV-
SPK_RCV-
SPK_RCV+
SPK_RCV+
PROX_COMPASS_I2C_SCL
PROX_COMPASS_I2C_SCL
PROX_OUT
PROX_OUT
LCD_MAKERID_LOW
LCD_MAKERID_LOW
VREG_TOUCH_3.0V
PROX_COMPASS_I2C_SDA
PROX_COMPASS_I2C_SDA
TOUCH_INT
TOUCH_INT
TOUCH_I2C_SCL
TOUCH_I2C_SCL
TOUCH_I2C_SDA
TOUCH_I2C_SDA
MDDI_P_STB_M
MDDI_P_STB_M
MDDI_P_STB_P
MDDI_P_STB_P
MDDI_P_DATA_M
MDDI_P_DATA_M
MDDI_P_DATA_P
MDDI_P_DATA_P
LCD_RESET_N
LCD_RESET_N
LCD_VSYNC_O
LCD_VSYNC_O
WLED7
WLED7
WLED6
WLED6
WLED1
WLED1
WLED2
WLED2
WLED3
WLED3
WLED4
WLED4
WLED5
WLED5
KPD_PWR_N
KPD_PWR_N
KEY_ROW[7]
KEY_ROW[7]
KEY_ROW[7]
SLIDE_KPD_DRV_NSLIDE_KPD_DRV_N
KEY_COL[6]
KEY_COL[6]
KEY_COL[7]
KEY_COL[7]
VCOIN
VCOIN
VCOIN
SLIDE FPCB TO QW
SLIDE FPCB TO QW(HEADER)
SPEAKER
LCD FPCB side
Proximity Sensor
KEY PCB side
Touch Connector
Tuning point
END1 pin : right, lower
HOME
SEND
2EA --> 3EALED : SEOUL-SEMI --> CITIZEN
3.2" HVGA LCD Connector
8. BGA PIN MAP
- �37 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
[U302]
: USE
: NO USE
U302 : MSM 7227(EUSY0392302)
8. BGA PIN MAP
U302 : MSM 7227 (EUSY0392302)
USE
NO USE
8. BGA PIN MAP
- �38 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
[U400]
: USE
: NO USE
U400 : MT29C8G96MAZAPDJA-5 ITU400 : MT29C8G96MAZAPDJA-5 IT(EUSY0430901)
U400 : MT29C8G96MAZAPDJA-5 IT (EUSY0430901)
USE
NO USE
8. BGA PIN MAP
- �39 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
[U704]
: USE
: NO USE
U704 PM7540U704 : PM7540(EUSY0342201)
U704 : PM7540 (EUSY0342201)
USE
NO USE
8. BGA PIN MAP
- �40 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
[IC1]
: USE
: NO USE NO USE
IC1 : TS5USBA33402YZPR(EUSY0372001)
IC1 : TS5USBA33402YZPR (EUSY0372001)
USE
NO USE
8. BGA PIN MAP
- �41 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
[U701]
: USE
: NO USE NO USE
U701 : WM9093ECS-R(EUSY0403901)
U701 : WM9093ECS-R (EUSY0403901)
USE
NO USE
8. BGA PIN MAP
- �4� - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
[U101]
: USE
: NO USE NO USE
U101 : AAT2870(EUSY0336503)
U101 : AAT2870 (EUSY0336503)
USE
NO USE
8. BGA PIN MAP
- �43 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
[U601]
: USE
: NO USE NO USE
U601 : TPA6202A1ZQVRG1(EUSY0404001)
U601 : TPA6202A1ZQVRG1 (EUSY0404001)
USE
NO USE
- 244 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
9. PCB LAYOUT
F
13ABCDE
1
N H GM L K J
K
D
AA
K
L
R
P
N
M
J
H
G
F
E
A
C
BGAFA
BACADAEA
UVWY
LMNPRT
1
JHGFEDCBA
1
D
1
5
01
72
4
C B
01
E D
1
C
P
A
B
H
G
F
E
D
L
N
M
J
K
R
007X
517R
967C
FB8501
267C
177C
017R
047C
117R
327R
767C
C733
567C
217R
C739
757C
C736
477C
006R
9458C1258R
C780
L8055L803
023C
407R
334C
618C
318C
713C3458C
003U 1458C
107R
307R
C723
103U
203U
107UC701
R724
134C
C451
R9
C725
C809
IC1
R300
207D
204PT
C29
C439
044C
2558C
R316
3CS
CN
700
314C
604PT
504PT
704PT
404PT
5C
C827
C826
C726
TP701
3Q
R8522
C8550
R8523
R8519
R713
2PT
01PT3PT
4PT
X800
228C
C8535
C8544
108R
827C
C754
107D137C
C753
C735
207PT
C772
C773
C761
C729
R716
C8551
R85205001U
237C
008U
007PT
R709 007L
C744
U704
C763
C768
727C
C759
437C
C766
R717
R719
C750
C741187C
C8534
9PT
418C 7158R
328C
8PT
C8547
7PT6PT
407L
207L
C760
3R
C752
C749
C742
107L
347C
677C
C751
307L
077C
577C
007AV027R
C778
944C
C746
103C
413R
718C
813C
C8538
R7
C748
12C
4R
C1
224C644C
254C524C
C745
91C
53C
8R
C779
424C
817C
503C
C2 R702
603C
C747
777C
013C
107DZ
C311
C458
603R
C33
C454
C429
C428
C31
603PT
C900
517C317C
003X 313C
613C413C
803PT703PT
123C
707C227C
C303
VA305
R6
703C
807C
907C
607C
C323
417C217C
313R
4C3C
903R
41R
TP309
C720
213C
903C513C
TP310
C717
387CC
716
C700
R725
017C117C
R11 917C
C810
554C
C447
C418
C423
C448
C416
R804
U801
R803
R10
714C
C319
C430
054CR308
C20C
434
107BF
954C
904C624C004C
51C
R707
R706
C704
C322
R705 D
301R
708R
13
227R
D302
213R
113R R307
C25
R310
C28
R12
R2
TP401
C34
C32
C456
C404
354C
C435
C457
C415
U703037C
C721
D700
R301
VA
303
C724
2Q
1Q
1R
004U
C414
C436
C438
VA
302
R315
C304
TP408C
441C
443R
15R
403
444C
TP5
C427
VA
300C
445V
A304
C437
VA
301C
442
5R
C30 304PT
9. PCB LAYOUT
L-04C_MAIN_SPFY0244801-10_TOP
U800 BT, Wifi Module- No BT, WiFi
X800 BT, Wifi Reference Oscillator- No BT, WiFi
U704 PM7540- No Booting, No Service- No Charging
U1005 Fuel Guage IC- No Battery Level
CN700 IO Connector- No Charging
Q1, Q2 Charging TR- No Charging
IC1 MUIC- No USB, NO UART
U801 Acceleration Sensor- No Auto Rotate Display
U302 MSM7227- No Booting,No Service
U400 Memory- No Booting
U301 NAND GATE- No High Speed USB
X300 VCTCXO- No Service
U300 D FlipFlop- No GPS Sensitivity
- 245 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
9. PCB LAYOUT
7
8
8041 40
41
1001 WS
R1012
SW
1000
2201L
4301L
2301L
4901 C3901 C
4801 C
1011 C
7901 C
4501 C
107 NC
FL1006
5101L
508 R
6801 C
2001LF
2801 C
3201L
4601 C
2601 C
3601 C
1601 C
2201 R
7601 C
8601 C
8501 C
6501 C
C1057
5501 C
6001L
CN
5
4201 C
C53
7101 R
CN
4
008 R
J800
AN
T8016101 C
C702
007 U
CN
7
CN
900
CN
6C
1051
C1091
C1095
4201LC1096
L1003
L1002
4001LF
L1031R
1009R
1011C
8555
5001LF
1 NC
U1004
8901 C
3301L
4011 C
L1036
C1102
6201L C108525 C
2501 C
L1004
3501 C
C1087
C1088
4201 R
C1089
FL1001L1030 L1016
R1010
408L
708 CC805 108L
U802
7201L
428 C
U1003
3011 C
3001LF
L1025
L1035
9901 C
L1029
15 C
L1008L1010
45 CC55
L1014
8 NC
C825
C1100
C10750201 R
7508L
C57
3701 C
008TNA
8701L
8101L
8201L
7101L
2901 C
0901 C
R1001
4001 C
C1077
9701 C
C1074
R1000
3801 C
3001 C
L1009L1007
5001L
L1013
1201 R
C1013
C1049
C1005
L1020
0001BF
L1019U
1000
2 NC
3301 C
C10356701 C
0301 C
8201 C
65 C
C1026
C1072
C1002
C1038
C1001
C1025
3201 R 8101 R
2001 U
3 NC
C1034
C1000
1001BF
C1023
C1022
R1015
C1060
R1014
C1010 C
1027
R1006
1301 C
R1007
C1037
C1036
C1041
2301 C
C1009C
1029C
1042
3001 RC1011
C1012
6101 R
C1070
3101 R
9501 C
9101 R
C1039
U1001
2001 R0501 C
0001L
C1040 C
1007
R16
4101 C
008 C
8101 C
408 C
003PT
FL1000
C8553
208 C
4558 C
5101 C
7101 C
6508L
9101 C
108 C
1001L
D800
1101L
C300
308 C
303PT 203PT
003 NC
ZD700
C703
C705
007LF
403PT
L-04C_MAIN_SPFY0244801-10_BOT
FL1000 GPS Saw Filter- No GPS
ANT801 GPS ANT - No GPS
U1001 GPS LNA- No GPS
U700 OVP(Over Voltage Protection) IC- No Charging
J800 USIM Socket- No SIM
ANT800 BT, WiFi ANT- No BT, WiFi
U1004 WCDMA800 PAM- No WCDMA TX, No Service
U1004 WCDMA800 PAM- NoWCDMA TX, No Service
CN900 Main to Qwerty Connector- No Display, No Camera- No Booting
FL1004 WCDMA800 Duplexer- No WCDMA TX, RX sensitivity - No Service
FL1001 FEM- No WCDMA, No GSM- No Service
SW1001 RF Connector- No Service
U1000 RTR6285- No WCDMA / GSM- No Service. No GPS
U1002 GSM PAM- No GSM
FL1004 WCDMA800 Duplexer- No WCDMA TX, RX sensitivity - No Service
- 246 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
9. PCB LAYOUT
4180
40
CN
2
L-04C_F_SUB_SPCY0263701-10_TOP
Connector BtoB14-5804-080-000-829+
- 247 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
9. PCB LAYOUT
4140
80
CN
1
L-04C_F_SUB_SPCY0263701-10_BOT
Connector BtoB14-5804-080-000-829+
- 248 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
9. PCB LAYOUT
502625
203C
333R
223R013AV
C214
113AV
213AV 423R
323R
913R
023R
703AV
613AV 233R
803AV
123R903AV
KB
304K
B312
KB
311K
B309
KB
313K
B306
KB
307K
B305
KB
324K
B301
KB
316
R311
202U802D
702D
VA
323
1PTU1
303C
433R
103U
CN
401
813AV513R
R318
VA
313
R302
C1
C2
C213
613R
023AV713R
913AV
313R
413R
413AV
513AV
213R
133R 223AV
713AV
102R
FB1
512C
C120
R328
C2500
R8
R329
C3
011R
R327
R330
LD303
LD305
LD301
LD304
KB
350K
B356
KB
355K
B357
KB
343K
B303
KB
351K
B349
KB
347K
B348
KB
344K
B345
KB
338K
B337
KB
336K
B335
KB
339K
B333
KB
334K
B330
KB
331K
B329
KB
354
KB
326K
B323
KB
315K
B341
KB
308K
B327
KB
325K
B322
KB
321K
B320
KB
318K
B319
KB
342K
B317
KB
328K
B310
KB
314K
B353
KB
352K
B332
KB
346K
B302
KB
340
U1 Digital Compass Sensor- No Navigation
U301 Key Encoder- No Key Interface
CN401 Qwerty PCB to Slide FPCB Connector- No Display- No earjack- No Key Interface
U202 Hall IC- No Slide Detect
L-04C_QW_KEY_SPEY0069101-10_TOP
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LGE Internal Use Only
9. PCB LAYOUT
40
3418
4180
17
F
5
402 C
102 D
312 R
104 WS
MIC
1
102J
304 C
204 C
R220
C119
R105
R104
C639
VA
101
011 C
106 Q
L3
802 R
212 R
902 R
FB202
202 C
302 C
CN
402
CN
301
C208
012 C
102 DZ
412 R
D202
FB203
402 D
702 C
C206
FB204
FL102
533 R
FB201
212 C
612 RR203
612 C
102 C
U201
ZD205
912 R
202 R
123AV
1AV
FL101
103 C
FL1
VA
305
R308
VA
302
R309
R11
ZD202
L511
VA
325
CN
101R
2
R6
R4
R7
VA
324
L512
106 NC
CN
5
R102
R101001 Q
C117
301 C
FB102
601 C
401 C
411 C
U102
FB101
111 C
301 U
046 C
211 R
226 R
111 R
501 C
916 R
326 R
026 R816 R
C638
716 R
126 RU601
CN
4
701 C
C113
C112
C108
901 C
101 U
601 R
L5
C471034 R
R403
R402
R401
504 U
C4
ZD206
L2 L4
D206 R
210
R207
502 C
D205
R206
R211
CN
1
J201 Earjack- No Earjack Detect- No Earjack Sound
CN101 Camera Connector- No Camera
CN402 Main to Qwerty Connector- No Display, No Sound,No Service- No Motor
FL1, FL101, FL102 EMI Filter- No Camera Display
Q100 FET- No Earjack Detect
U101 SUB PMIC- No LCD Backlight- No Camera
CN1 SD Socket- No SD
U601 Motor Driver IC- No Motor
SW401 RF Connector- No Service
CN601 Motor Connector- No Motor
MIC1 Microphone- No Voice Transmit
CN601 Motor Connector- No Motor
L-04C_QW_KEY_SPEY0069101-10_BOT
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LGE Internal Use Only
9. PCB LAYOUT
6 01
51
VA
102
201BK
001PT
U100
001DL
VA
103
VA
105
R102
101BK
201DL
VA
100
VA
104
R104
R103
VA
101
001BK
101DL
001NC
U100 Proximity Sensor- No Proximity Operation
CN100 Touch Connector- No Touch
L-04C_RF_SLIDE_SPCY0259301-10_TOP
- 251 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
9. PCB LAYOUT
43
71
81
5026 25
001LF
CN
101
701AVC105
201 D
601AV
801AV
901 C
701 C
601 C
011 C
BAT100
001 R
101 C
001 C
301 C
201 C
101 R
C108
D101
301 NC
D100
C104
CN
102
L-04C_RF_SLIDE_SPCY0259301-10_BOT
CN101 Speaker PAD- No Sound
BAT100 Coin Battery- No Real Time
CN102 Slide to Qwerty connector- No Display, No Sound, No Touch
CN103 LCD to Slide Connector- No Display
FL 100 LCD EMI Filter- No Display
10. CALIBRATION
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10. CALIBRATIONTachyon User manual
10.1 Introduction
Tachyon will explain how to use the program for the user. Used in this article Tachyon except for a detailed description of the environment file, and only the description is only required. 10.2 Terminology
Tachyon : CMTest2, HotKimchi integrated program. - Dictionary meaning : Quick bitboda of virtual particles. - Mean : Want to reduce the time means fast bitboda moment.
10.3 Installation Explains hot to install the program.
10.3.1 System demand
ITEM Minimum requirements
Maximum requiermensts
Recommand
OS Window XP SP2CPU Pentium 4 1.0G higher
(support ‘Hyper thread’)
RAM 512M higherHDD 1G higher
10.3.2 Install
10.3.2.1 Install Sequence
Below in order to install.
1. Excute the install file. (Install files released on http://ene.lge.com)
2. Click the ‘Tachyon/OCX/OCX_Registration.bat’ file. (C:\LGE\Tachyon\Ocx)
10. CALIBRATION
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10.3.2.2 Directory
Directory structure is described.
Installation Location : “C\LGE\Tachyon”
<Ficture 1 : Tachyon Directory>
L-04C/ L-04CL-04CL-04CL-04C
L-04C
10. CALIBRATION
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Folder explain
Folder Description
Tachyon Exe file and MFC dll, UI dll is present.
Common Common dll files. (XML Data I/O , Auto Test Logic, Tachyon Logic Control, Communication)
Config Envirement files. (Port configuration, Loss adjust)
Instrument Tester control dll.
Model Model files is present. (Model -> Solution (Qualcomm, EMP, ADI, INFINEON) -> MODEL NAME(LGGM630, LGSH470, ..) -> BUYER NAME(SKT, TEL, VIVO, …)
OCX Conponent files.
PhoneCmd Phone communication file
Report Report Files is present. (Cal data, test data)
Temp
Configuration file explain
File Description ‘MODEL NAME’_Calibration.XML There are imformations to calibrate.
It consist of calibration items. ‘MODEL NAME’_CallSetup.XML There are imformations to call.
‘MODEL NAME’_NV.INI It consists of default values. It is written when ‘cal&auto’ is begun.
‘MODEL NAME’_Sequence.XML It is described a testing procedures.
10. CALIBRATION
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10.4 Tachyon Start
Below in order to excute. 1. Excute the c:/LGE/Tachyon/Tachyon_xx.Exe.
<Ficture 2 : Login >
Click the Login button after Pop-up a <Piccutue 2>. Settings do not need.
Then, find the instruments connected to PC.
Support instruments is as follows.
TESTER TESTER NAME
Base Station Agilent 8960 Series 10 E5515C (available) R & S CMU200 (develop progress) Anritsu MT8820 (develop progress) Wiltek (develop progress)
Power Supply KE2303 /KE2306(available) HP66311B(available) R & S NGMO2(available)
10. CALIBRATION
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<Ficture 3 : Find Instrument>
2. If you found instruments <Ficture 3> the output.
3. If instrument(Base station) found only one, then <Ficture 3> would disappear immediately.
Otherwise if instrument found two or more, then you can decide whether to use instrument.
10. CALIBRATION
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<Ficture 4: Use of instrument>
If it is connected more than two instruments, you can use instrument that you wanted with checking Yes or No.
4. Progress has been correctly, then <Ficture 5> the output.
<Ficture 5>
“Operation Info/ Result” Dialog is test results to the output screen.
If you want disapper dialog with Click or ‘ESC’ button.
10. CALIBRATION
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10.5 Tachyon Main UI
It will be explained in the Main Screen.
10.5.1 Menu / Toolbar / Run Button Tachyon has “Menu”, “Toolbar” and Buttons.
<Ficture 6>
10.5.1.1 Menu
There are six kinds of menu.
(“Program”, “Run”, “Additional Function”, “Option”, “View”, “Help”)
Program
Menu Description
Model Selection Select model
Config Editor… Develope progress
NV Item Manager… Develop progress
Sequence Editor… Develope progress
Exit Exit program
10. CALIBRATION
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Run
Menu Description
Calibration + Test Start Calibration and Auto Test
Calibration Only Start Calibration
Test Only Start Auto Test
Select band Calibration Start Calibration with selected Band
Select Band/Item Calibration Start Calibration with selected band and item.
Select Band Auto Test Start Auto Test with selected Band
NV Read Read the NV items.
NV Write Write the NV items. Stop STOP
Additional Function
Menu Description
Loss Adjustment… Configuratation and adjust RF-LOSS.
Instrument Calibration… Instrument calibration(available on E5515C)
Phone Control… Phone control (like QPST, available on Qaulcomm)
RF Switch Check… Check the RF Switch Box.
Show Result… Result screen pop-up/pop-down
Option
Menu Description
System Option… COM-Port configuration
Run Option… Special opstion.
Instrument Change… Change instrument
Voltage / Current Setting… Voltage,Current setting
View
Menu Description
Toolbar, Menubar Toggle.
Help
Menu Description
Tachyon Help Develope progress
Tachyon Hotkey…
About Tachyon…
10. CALIBRATION
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10.5.1.2 Toolbar
Toolbar Provides for frequently used commands.
<Ficture 7 : Toolbar>
<Ficture 7> Commands in order are as follows :
1. Model Selection
2. Calibration + Test
3. Not availalable.
4. Stop
5. Test Only
6. Calibration Only
7. Phone Control
8. Loss Adjustment
9. System Option
10. Run Option
11. Voltage / Current Setting
12. Show Result
10.5.1.3 Command Button
<Ficture 8 : Start Button>
“Calibration + Test” Button , “Stop” Button .
10. CALIBRATION
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10.5.2 UI Display Information About the item on the screen output will be explained.
10.5.2.1 Port / Loss info
<Ficture 9 : COM Port / Loss Information>
Area 1, the output is imformation about the COM port.
Area 2, Show the RF-LOSS for the selected model.
10. CALIBRATION
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Tachyon User manual
10.5.2.2 Phone Info / System Option Status
Model Information : Information of model that user selected Solution : chipset (Qualcomm, Emp, ADI, Infineon) Model : Model name, Buyer : Buyer name Binary Ver : Binary Version.(Phone s/w version) Product ID : PID (read from phone). System Information : ezlooks, shield box, rf switch box. Local : Factory location, Ezlooks Mode : On-line/Off-line Limo : Using Shield box or not Run Information : Option Repeat Test : Aging test, ESN Write : Write the ESN(IMEI). Test Only : Only auto test Rework : Rework Option. Verification : Using verification or not. Base Inst. Information : information of instrument Base Inst. : Equipment type Execution Mode : Display the Command that user input Time Elapse : test time Voltage : voltage Current Limit : current limit Consumption Current(mA) : doesn’t work
10. CALIBRATION
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10.6 Functional explain
This will be explained in detail about the functionality provided.
10.6.1 Model Selection This provides the ablity to select and change.
Description
How to Excute 1. <Menu> Program -> Model Selection….
2. <Toolbar> Click .
Hot Key Ctrl + M
Model selection screen is shown below
<Ficture 10 : model selection dialog>
10. CALIBRATION
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The order follows :
1) Chipsets imformation, Check.
2) Select the Chipsets.
<Ficture 11 : Solution selection>
3) Select the model.
<Ficture 12 : Model selection>
L-03CL-04CL-05C
L-03C L-04C
L-05C
10. CALIBRATION
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Tachyon User manual
4) Select the buyer. (must be dobble clicked)
<Ficture 13 : Buyer selection>
5) After select Buyer, if environment files is normally, “PASS” screen shows. Otherwise “Fail” screen shows.
NOTE) The following files must exist.
- Model name_Calibration.xml (Buyer Folder)
- Model name_CalLogic.dll (Mdoel Folder)
- Model name_CallSetup.xml (Buyer Folder)
- Model name_Sequence.xml (Buyer Folder)
6) If “Fail” screen shows, check the File List.
7) If “PASS” screen shows, Click the “Select” button.
8) If normal progress, then the screen is as shown below
L-04C
L-03CL-04C
L-04CL-04CL-04CL-04CL-04CL-04CL-04C
10. CALIBRATION
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<Ficture 14 : Normal screen>
Shows the selected model imformation and RF-LOSS.(Ficture14).
If you don’t see imformation and RF-LOSS, the files was wrong.
L-04C
10. CALIBRATION
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10.6.2 Start / Run This will be explained in detail about the functionality provided.
10.6.2.1 Calibration + Test
This perform the calibraton, Test.
Select when ‘Calibration and Auto Test’ process
Description.
Excution 1. <Menu> Run-> Calibration + Test.
2. <Toolbar> Click .
Hot Key F5 : Shield Box 1 F6 : Shield Box 2
Button
button Click.
<Calibration + Test> will be in the order. Sequence xml file has it. i) Precede Action - NV Write. - Test command send ii) Calibration - Calibration iii) Auto Test - Auto test iV) After Action - Phone reset - Change AMSS
If you have a multi-system, you must select the Channel(1,2) that you wanted, then you can test.
<Ficture 15 : Channel selection>
10. CALIBRATION
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10.6.2.2 Calibration Only
This perform only the Calibraton.
Select when ‘Calibration only’ process.
Description.
Excution 1. <Menu> Run-> Calibration Only.
2. <Toolbar> Click.
Hot Key F9
Button NONE.
If you have a multi-system, you must select the Channel(1,2) that you wanted, then you can test.
<Ficture 16 : Calibration Only>
10. CALIBRATION
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Tachyon User manual
10.6.2.3 Test Only
This perform only the Test.
Select when “Test Only” process
Description.Excution 1. <Menu> Run-> Test Only.
2. <Toolbar> Click. Hot Key F8 Button NONE.
If you have a multi-system, you must select the Channel(1,2) that you wanted, then you can test.
<Ficture 17 : Test Only>
10. CALIBRATION
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Tachyon User manual
10.6.2.4 NV Read
This perform reading the NV items.
Description
Excution 1. <Menu> Run-> NV Read
Hot Key F1
Button NONE.
If there is a MODEL-NAME_NV.INT file, you can read the NV items. INI file define about NV items.
INI file should be existed to Read the NV items.
10.6.2.5 NV Write
This perform writing the NV items.
Description
Excution 1. <Menu> Run-> NV Write
Hot Key F2
Button NONE
Same as ‘NV Read’.
10.6.2.6 Stop
This perform Stopping the process.
Description.
Excution 1. <Menu> Run-> STOP
2. <Toolbar> Click.
Hot Key ESC
Button
button Click.
10.6.2.7 Select Band Calibration
This perform the calibration.only with user selected band
Description.
Excution 1. <Menu> Run-> Select Band Calibration
Hot Key NONE
Button NONE.
10. CALIBRATION
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Perform in the following order :
1) Select the TAB of channel you want test
<Ficture 18 : TAB of CH1_Calibration>
2) After 1), Select the BAND you want test.
<Ficture 19 : Band Select>
10. CALIBRATION
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3) After 2), “RUN” -> “Select Band Calibration”
<Ficture 20 : Select Band Calibration>
10. CALIBRATION
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Tachyon User manual
10.6.2.8 Select Band/Item Calibration
This perform the calibration you selected item, after you selected band.
Description.
Excution 1. <Menu> Run Select Band / Item Calibration
Hot Key NONE
Button NONE
Perform in the following order :
1) Excute <6,2,7> 1 and 2.
2) Select the Calibration item in Band you wanted..
<Ficture 21 : Calibration Item>
3) “Run” ->”Select Band/Item Calibration”
<Ficture 22 : Select Band/Item Calibration >
10. CALIBRATION
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Tachyon User manual
10.6.2.9 Select Band Auto Test
This perform the Auto Test you selected band, After you selected model..
Description.
Excution 1. <Menu> Run-> Select Band Auto Test
Hot Key NONE.
Button NONE
Perform in the following order:
1) Select the TAB of channel you want test. <Figure 23>
<Ficture 23 : Test Tab>
2) Select the band you wanted. <Figure 24>
<Figure 24 : Test Band>
3) “RUN” -> “Select Band Auto Test”.
10. CALIBRATION
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Tachyon User manual
10.6.3 System Loss Setting Explains how to set the RF-LOSS.
10.6.3.1 Loss Setting
This perform RF-LOSS setting.
Description
Excution 1. <Menu> Additional Function -> Loss Adjustment…
2. <Toolbar> Click.
Hot Key Ctrl + L
Button NONE.
When you run the above command <Figure 25> is the output, such as Dialog. Dialog is divided into two parts.
First part(Loss Adjustment), you can set the RF-Loss with inputed value
Second part(Detail Loss Adjustment), it doesn’t work now.
<Ficture 25 : Loss Adjustment>
10. CALIBRATION
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Tachyon User manual
10.6.3.2 Manual Loss Setting (Loss Adjustment)
In tachyon, RF-LOSS is the sum of value of ‘MS Calble Type’ and value of ‘RF Cable Type’
MS Cable Loss Setting
User must select ‘MS Cable Type’.
Also, user can create new msl file for another ‘MS Cable Type’.
<Ficture 26 : MS Cable Type selection>
If you select ‘MS Cable Type’, then selected ‘MS Cable Type’ Loss is output.
<Ficture 27 : MS Cable Loss (ex.) >
L-04C.mslL-04C.msl
10. CALIBRATION
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Tachyon User manual
You clicked the cell that you wanted twice(double click) when you want change the Loss. And you can input new loss.
<Ficture 28 : Change the Loss>
You must save after change the loss.
<Ficture 29 : Save After change>
If there is no msl file about cable that you will use, you can create new file. The dialog shows After you click the “Create New File”.
<Ficture 30 : Create new MS Cable Loss File>
Then you input the new file name and push the save button. caution : You must not change location that file storing. Now you can select MS cable type you created and you can input new value for one.
10. CALIBRATION
- �78 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Tachyon User manual
RF Cable Loss Setting
If you use RF Cable, you must use loss of ‘RF Cable Type’.
Caution : RF Cable Loss is sum of all except MS Cable loss.
(ex : RF Cable Loss + Shield Box Loss + RF Switch box loss = RF Cable Loss)
<Ficture 31 : RF Cable type selection>
Inputting loss of ‘RF Cable Type’ is similar inputting loss of ‘MS Cable Type’.
If the loss of ‘RF Cable Type’ that you used is present, you can select the file. (Figure 31)
Also you can create new .rfl file for ‘RF Cable Type’. (Figure 32)
<Figure 32 : Create the new RF Loss File>
10. CALIBRATION
- �79 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Tachyon User manual
Cable Loss setup
You must select Ms Cable loss and RF Cable loss. And you should proceed as follows.
<Figure 33 : Loss Adjust>
1) After you select MS Cable Type and RF Cable Type, you push the Display button.
Then cobined value is output on the screen.(Figure 33)
2) Determine the value is printed on the screen, Push the “Apply” Button.
System Loss File
Cobined value is saved below file.
< ..\Tachyon\Config\SystemLoss.Ini>
10.6.3.3 Auto Loss Setting (Detail Loss Adjustment>
It doesn’t work now.
10. CALIBRATION
- �80 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Tachyon User manual
10.6.4 System Option Setting This perform setting varioust features or not setting.
There are features in System Option.
1) Setting the COM port 2) Setting the Repore Data 3) Setting the Language. 4) Setting the Message Queue.. 5) Setting the Repeat Test. 6) File manager.
Description
Excution 1. <Menu> Option -> System Option
2. <Toolbar> Click .
Hot Key Ctrl + O
Button NONE
<Ficture 34 : System Option>
<Ficture 34> is running screen, if you want to terminate then you push ‘OK’ button.
- 281 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
11. EXPLODED VIEW & REPLACEMENT PART LIST
11. EXPLODED VIEW & REPLACEMENT PART LIST
11.1 EXPLODED VIEW
MJN00ACGT00
SVLM00SUSY00
EBR01 AHFY00 MBJZ00
FAB04 MCCH00
ADCA01
AKAC00SUMY00
SAEY00 AFBZ00
ABL00
SPKY00
MBFZ00SAFY00
SNGF01SNGF02
MCCE00MBL00
ACGM00
FAB00
FAB03
ADCA00
SWCC00
EAU00
FAB01
FAB02
EBR00
ABM00ABM01
MFEZ01MFEZ02
SNGF00
SBPL00 ACGA00
ABM02
Location Description
SBPL00 Rechargeable Battery,Lithium Ion
ACGA00 Cover Assembly,Battery
FAB00 Screw,Machine
ACGM00 Cover Assembly,Rear
SNGF00 Antenna,Helical
MBL00 Cap,Mobile Switch
MCCE00 Cap,Receptacle
SVLM00 LCD,Module-TFT
FAB01 Screw,Machine
FAB02 Screw,Machine
MJN00 Tape,Protect
EAU00 Motor,DC
EBR00 PCB Assembly,Flexible
SAEY00 PCB Assembly,Keypad
SPKY00 PCB,Sidekey
ABL00 Camera Assembly
ADCA00 Dome Assembly,Metal
SUMY00 Microphone,Condenser
SUSY00 Speaker Module
SWCC00 Cable,Assembly
FAB03 Screw,Machine
FAB04 Screw,Machine
MCCH00 Cap,Screw
ACGT00 Cover Assembly,Upper
AFBZ00 Frame Assembly
AHFY00 Hinge Assembly
MBJZ00 Button
AKAC00 Keypad Assembly,Main
EBR01 PCB Assembly,Flexible
ADCA01 Dome Assembly,Metal
SAFY00 PCB Assembly,Main
ABM00 Can Assembly,Shield
ABM01 Can Assembly,Shield
ABM02 Can Assembly,Shield
SNGF01 Antenna,Helical
SNGF02 Antenna,Helical
MBFZ00 Bracket
MFEZ01 Frame
MFEZ02 Frame
11. EXPLODED VIEW & REPLACEMENT PART LIST
- �8� - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
by SBOM standard on GCSC
Level Location No. Description PartNumber Spec Remark
1 AGF000000 PackageAssembly - AGF75965906 L04C.ANTTWV BK:Black L-04C S_White
Silver(NTT2_720ea) Package Assembly
2 MAY047100 Box, Master MAY64817120 BOX TW 293 215 248 MULTI COLOR L04C.ANTTWVBK:Black L-04C Set Master Box _NTT2
2 MAY084000 Box, Unit MAY64856716BOX TW 188 49 139 MULTI COLOR L04C.ANTTWVWV:WHITE SILVER L-04C Main Unit Box_WhiteSilver_NTT2
2 AGJ000000 PALLET ASSY - APLY0003308 L-01A NTTTK TK, ZZ, NTT-2 Palletizing-720ea
3 MBAD00 Bag, Vinyl MBAD0003101 COMPLEX PDM MIGRATION MODEL(Seoul) ZZ:WithoutColor 1700*1700*0.04t EXTRUSION, LDPE,
3 MPBZ02 Damper MPBZ0036864 COMPLEX BL40 ORUBK ZZ:Without Color -
3 MBEC00 Box, Carton MBEC0000267 COMPLEX L-01A NTTXK ZZ:Without Color -
3 MCJZ00 Cover MCJZ0030564 COMPLEX L-01A NTTXK ZZ:Without Color -
3 MLAJ00 Label, Master Box MLAJ0004201 COMPLEX LG-VX6100 ZZ:Without ColorNew_TDR_Shipping Label PRINTING,
3 MPBZ01 Damper MPBZ0036822 COMPLEX L-01A NTTXK BK:Black -
3 MPBZ00 Damper MPBZ0036823 COMPLEX L-01A NTTXK BK:Black -
3 MPCY00 Pallet MPCY0017602 COMPLEX L706ie NTTWT ZZ:Without Color -
2 MJN000000 Tape MTAZ0127608 COMPLEX L-03A NTTPW ZZ:Without Color -
2 MCQ007001 Damper, Box MPBA0004030 COMPLEX L-01A NTTXK ZZ:Without Color -
2 MEZ000002 Label MLAZ0050901 COMPLEX KU990 GBRBK ZZ:Without Color -
2 MEZ084100 Label, Unit Box MLAQ0018201 COMPLEX L-02B NTTPN ZZ:Without Color PRINTING,NTT docomo Unit Box Label(70X30)
2 MEZ047200 Label, Master Box MLAJ0004402 COMPLEX CG300 CGR ZZ:Without Color LABEL,MASTER BOX(for CGR TDR 2VER. mbox_label)
2 MFZ005600 Packing,Blister(Lower) MFZ62837403 MOLD PULP [email protected] ZZ:Without
Color L-04C NTT2 Packing, Blister(Lower)
2 MEZ003500 Label, Barcode MEZ63820101 PRINTING L01C.ANTTDH ZZ:Without Color DoccomoNew IMEI Peel Label_3 piece_71*40
2 MAF086500 Bag, Vinyl MBAD0005204 COMPLEX LG-LX260 SPRAG ZZ:Without Color -
11.2 Replacement Parts Note: This Chapter is used for reference, Part order is ordered
<Mechanic component>
11. EXPLODED VIEW & REPLACEMENT PART LIST
- �83 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level Location No. Description PartNumber Spec Remark
1 AAAY00 Addition Assembly - AAAY0488301 L-04C NTTWV ZZ:Without Color -
2 ACGA00 Cover Assembly,Battery - ACGA0052801 L-04C NTTWV WV:WHITE SILVER -
3 MAF000001 Bag MAF62668801 COMPLEX L04C.ANTTWV ZZ:Without Color -
3 MJN061100 Tape, Protect MJN67676501 COMPLEX L04C.ANTTWV WV:WHITE SILVER -
3 MCJA00 Cover, Battery MCJA0129301 COMPLEX L-04C NTTWV WV:WHITE SILVER MOLD,PC LUPOY SC-1004A,
1 APEY00 PHONE - APEY0951301 L-04C NTTWV WV, WV,
2 MEZ002100 Label, Approval MEZ63809401 COMPLEX L04C.ANTTWV ZZ:Without Color -
2 ACGY00 COVER ASSY,EMS - ACGY0053201 L-04C NTTWV WV, WV,
3 FAB03 Screw, Machine FAB31123901 FH Y 2.7M 3M SWRCH18A BLACK N A
3 EAN011400 IC, Memory Card,MINI SD SMZY0027202 SD-C02G2CYB MicroSD Card / 2GB (MLC NAND
16Gbx1), Module Assembly, TOSHIBA
3 ACGM00 Cover Assembly,Rear - ACGM0169801 L-04C NTTWV WV:WHITE SILVER -
4 SNGF00 Antenna, Helical SNGF0064303L04C-MAIN-EMW 3.0, -2.0 dBd, L-04C Main Internal,W800+2100+GSM900+1800+1900, Pb-Free, MULTI, -2.0,50ohm, 3.0 E.M.W CO., LTD.
4 MBL00 Cap, MobileSwitch MBL64797401 COMPLEX L04C.ANTTWV WV:WHITE SILVER -
4 MEV000000 Insulator MIDZ0276801 COMPLEX L04C.ANTTWV BK:Black COMPLEX, (empty),, , , ,
4 MKC009400 Window, Camera MWAE0066101 COMPLEX L04C.ANTTWV ZZ:Without Color CUTTING,PMMA MR 200, , , , ,
4 MJN009400 Tape, Camera MTAK0042301 COMPLEX L04C.ANTTWV ZZ:Without Color COMPLEX,(empty), , , , ,
4 MCQ000000 Damper MCQ66596301 COMPLEX L04C.ANTTWV ZZ:Without Color -
4 MEZ000900 Label, AfterService MLAB0003601 COMPLEX L602i NTTRY ZZ:Without Color -
4 MCQ009400 Damper, Camera MPBT0099601 COMPLEX L04C.ANTTWV BK:Black COMPLEX, (empty),, , , ,
4 MCCE00 Cap, Receptacle MCCE0063201 COMPLEX L-04C NTTWV WV:WHITE SILVER MOLD,PC LUPOY SC-1004A, , , , ,
4 MCJN00 Cover, Rear MCJN0133901 COMPLEX L-04C NTTWV WV:WHITE SILVER MOLD,PC LUPOY SC-1004A,
4 MDAY00 Decor MDAY0098701 COMPLEX L-04C NTTWV SV:Silver MOLD, ABS AF-308,
FAB00
11. EXPLODED VIEW & REPLACEMENT PART LIST
- �84 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level Location No. Description PartNumber Spec Remark
3 ACGQ00 COVER ASSY,SLIDE - ACGQ0054301 L-04C NTTWV WV, WV,
4 SVLM00 LCD, Module-TFT SVLM0040101TX08D39VM0BAA Main, 3.2", HVGA, 49.92x77.83x1.9t,16.7M, TFT, TM, S6D05A0(Samsung), HITACHIDISPLAY DEVICES LTD.
4 FAB01 Screw, Machine FAB31124101 FH Y 3.5M 2.5M SWRCH18A BLACK N A
4 FAB02 Screw, Machine FAB31124001 FH Y 3.5M 1.5M SWRCH18A BLACK N A
4 MJN00 Tape, Protect MJN67676801 COMPLEX L04C.ANTTWV ZZ:Without Color window
4 MEV000000 Insulator MIDZ0270801 COMPLEX L04C.ANTTWV BK:Black COMPLEX, (empty),, , , ,
4 MDS000000 Gasket MGAZ0104901 COMPLEX L04C.ANTTWV GD:Gold COMPLEX, (empty),, , , ,
4 MDS000002 Gasket MDS63632401 COMPLEX L04C.ANTTWV ZZ:Without Color -
4 EAU00 Motor, DC EAU61523501 MVMF-A301K2 2V 40mA 40mA 12KRPM 12KRPM30mSEC 40mGF.CM 36OHM LG INNOTEK CO., LTD
4 EBR00 PCB Assembly,Flexible - EBR73129101 L04C.ANTTWV 1.0 Flexible
5 EBR070400 PCB Assembly,Flexible, SMT - EBR73130101 L04C.ANTTWV 1.0 Flexible
6 EBR070300PCB Assembly,Flexible,SMT Top
- EBR73130701 L04C.ANTTWV 1.0 Flexible
7 EAX010700 PCB, Flexible SPCY0263701 SPCY0263701 L04C.ANTTWV 1.0 POLYI Multi - 0.3mmFLEXIBLE YOUNG POONG ELECTRONICS CO. LTD.
6 EBR070200PCB Assembly,Flexible, SMTBottom
- EBR73130401 L04C.ANTTWV 1.0 Flexible
4 SAEY00 PCB Assembly,Keypad - SAEY0073301 L04C.ANTTWV 1.0 KEYPAD
5 SAEB00 PCB Assembly,Keypad, Insert - SAEB0033001 L04C.ANTTWV 1.0 KEYPAD
6 SPKY00 PCB, Sidekey SPKY0098801 SPKY0098801 L04C.ANTTWV 1.1 POLYI Double 2 0.18SIDEKEY YOUNG POONG ELECTRONICS CO. LTD.
6 ABL00 Camera Assembly - ABL72995501 L04C.ANTTWV ZZ:Without Color -
7 EBP000000 Camera Module EBP61301801C3AA-Y314C C3AA-Y314C 3M AF, Sony(1/5"),8.5x8.5x5.4t, FPCB 3.5mm, 90degree LG INNOTEK CO.,LTD
7 MDS000000 Gasket MGAZ0105001 COMPLEX L04C.ANTTWV GD:Gold COMPLEX, (empty),, , , ,
11. EXPLODED VIEW & REPLACEMENT PART LIST
- �85 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level Location No. Description PartNumber Spec Remark
7 MDS000001 Gasket MGAZ0113701 COMPLEX L-04C NTTWV GD:Gold COMPLEX, (empty),
6 RAA050100 RESIN, PC BRAH0001301 UF-1060, ; , , , , [empty]
6 RAA050101 RESIN, PC BRAH0002601 UNIQUE4000HFW, ; , , , , [empty]
6 MDS000002 Gasket MDS63535001 COMPLEX L04C.ANTTWV ZZ:Without Color -
6 MDS000003 Gasket MDS63515401 COMPLEX L04C.ANTTWV ZZ:Without Color -
6 ADCA00 Dome Assembly,Metal ADCA0121401 L-04C NTTWV ZZ:Without Color -
6 MFBZ00 Filter MFBZ0036201 COMPLEX L-04C NTTWV BK:Black COMPLEX, (empty),
5 SAEE00 PCB Assembly,Keypad, SMT - SAEE0039601 L04C.ANTTWV 1.0 KEYPAD
6 SAEC00PCB Assembly,Keypad, SMTBottom
- SAEC0038401 L04C.ANTTWV 1.0 KEYPAD
7 SUMY00 Microphone,Condenser SUMY0010610
SPM0410LR5H-QB SPM0410LR5H-QB, UNIT, 42 dB,4.72*3.76*1.25, mems TDMA Improve KNOWLESACOUSTICS
6 SAED00PCB Assembly,Keypad,SMT Top
- SAED0037701 L04C.ANTTWV 1.0 KEYPAD
7 EAX010400 PCB, Keypad SPEY0069101 SPEY0069101 L04C.ANTTWV 1.0 FR-4 Build-Up 6 0.5KEYPAD LG Innotek.com
4 SUSY00 Speaker Module SUSY0028012 1810-8T-05W1P 1810-8T-05W1P, ASSY, 8 ohm, 92 dB,1810 mm, 10mm KIRYN TELECOM CO., LTD
4 SWCC00 Cable, Assembly SWCC0011001 U.FL-2LPVHF-04N1TC-A76LG 76 mm, LINE, U.FL_U.FL,H=2.0, WHITE, HIROSE KOREA CO., LTD
4 FAB00 Screw, Machine FAB31123701 FH Y 2.7M 3M SWRCH18A BLACK N A
4 FAB04 Screw, Machine FAB31159701 FH Y 2.7M 2.5M SWRCH18A BLACK N A
4 MCCH00 Cap, Screw MCCH0165901 COMPLEX L04C.ANTTWV GR:Gray COMPLEX, (empty),, , , ,
4 MJN061101 Tape, Protect MJN67750701 COMPLEX L04C.ANTTWV ZZ:Without Color -
4 MJN061102 Tape, Protect MJN67807701 COMPLEX L04C.ANTTWV ZZ:Without Color qwertykeypad
4 MEZ000000 Label MLAZ0038303 COMPLEX LG-LC3200 WA:White PRINTING, PPRIPRINTING
4 ACGT00 Cover Assembly,Upper - ACGT0011001 L-04C NTTWV WV:WHITE SILVER -
5 MEV000000 Insulator MIDZ0275601 COMPLEX L04C.ANTTWV ZZ:Without Color COMPLEX,(empty), , , , ,
FAB03
11. EXPLODED VIEW & REPLACEMENT PART LIST
- �86 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level Location No. Description PartNumber Spec Remark
5 MCQ000002 Damper MPBZ0331001 COMPLEX L04C.ANTTWV BK:Black COMPLEX, (empty),, , , ,
5 EBD030100 Touch WindowAssembly SMZY0029603 Film to Film Contact 50*94.2 1% 90%
5 MJN000001 Tape MJN67771201 COMPLEX L04C.ANTTWV ZZ:Without Color remove touchwindow
5 MDJ000000 Filter MFBZ0027201 COMPLEX L04C.ANTTWV BK:Black COMPLEX, (empty),, , , ,
5 MJN061100 Tape, Protect MTAB0428501 COMPLEX L04C.ANTTWV ZZ:Without Color COMPLEX,(empty), , , , ,
5 MEV000001 Insulator MIDZ0275901 COMPLEX L04C.ANTTWV ZZ:Without Color COMPLEX,(empty), , , , ,
5 MJN000000 Tape MJN67676901 COMPLEX L04C.ANTTWV ZZ:Without Color remove
5 RAB150000 Magnet MMAZ0006601 COMPLEX, (empty), , , , , COMPLEX, (empty), , , , ,
5 MCQ043300 Damper, LCD MPBG0114301 COMPLEX L04C.ANTTWV BK:Black COMPLEX, (empty),, , , ,
5 MCQ000000 Damper MPBZ0330801 COMPLEX L04C.ANTTWV BK:Black COMPLEX, (empty),, , , ,
5 MCQ000001 Damper MPBZ0330901 COMPLEX L04C.ANTTWV BK:Black COMPLEX, (empty),, , , ,
5 AKAD00 Keypad Assembly,Sub AKAD0006001 L-04C NTTWV WV:WHITE SILVER -
5 MCJX00 Cover, Upper - MCJX0012801 COMPLEX L-04C NTTWV WV:WHITE SILVER MOLD,PC LUPOY SC-2302,
6 MET099500 Insert, Nut MICE0016901 COMPLEX MECH_COMMON ZZ:Without Color -
6 MBFZ00 Bracket MBFZ0061801 COMPLEX L-04C NTTWV ZZ:Without Color PRESS, STS,0.3,
4 AFBZ00 Frame Assembly - AFBZ0024201 L-04C NTTWV ZZ:Without Color MIDDLE
5 MCQ000000 Damper MPBZ0330401 COMPLEX L04C.ANTTWV ZZ:Without Color COMPLEX,(empty), , , , ,
5 MJN000000 Tape MTAZ0351701 COMPLEX L04C.ANTTWV ZZ:Without Color COMPLEX,(empty), , , , ,
5 MCQ000001 Damper MPBZ0330501 COMPLEX L04C.ANTTWV ZZ:Without Color COMPLEX,(empty), , , , ,
5 MFEZ00 Frame - MFEZ0045101 COMPLEX L-04C NTTWV ZZ:Without Color MOLD, PCLUPOY SC-2302,
6 MBFZ00 Bracket MBFZ0062101 COMPLEX L-04C NTTWV ZZ:Without Color PRESS, STS,0.4,
11. EXPLODED VIEW & REPLACEMENT PART LIST
- �87 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level Location No. Description PartNumber Spec Remark
4 AHFY00 Hinge Assembly - AHFY0005501 L-04C NTTWV WV:WHITE SILVER -
5 MJN061100 Tape, Protect MJN67807801 COMPLEX L04C.ANTTWV ZZ:Without Color lower
5 FAB010000 Screw, Machine GMEY0019201 GMEY0019201 FH + 1.4mM 1.8mM SWCH FZW N NKUMGANG SCREW CO., LTD
5 ACGK00 Cover Assembly,Front - ACGK0180501 L-04C NTTWV WV:WHITE SILVER -
6 MCQ000000 Damper MPBZ0323801 COMPLEX L04C.ANTTWV ZZ:Without Color COMPLEX,(empty), , , , ,
6 MJN061100 Tape, Protect MTAB0429601 COMPLEX L04C.ANTTWV ZZ:Without Color COMPLEX,(empty), , , , ,
6 MBJZ00 Button MBJZ0052801 COMPLEX L-04C NTTWV WV:WHITE SILVERCOMPLEX, (empty),
6 MEV000000 Insulator MEV63676501 COMPLEX L04C.ANTTWV ZZ:Without Color -
6 MCJK00 Cover, Front - MCJK0141701 COMPLEX L-04C NTTWV WV:WHITE SILVER MOLD,PC LUPOY SC-1004A,
7 MET099500 INSERT, NUT MICE0016902 MECH_COMMON ZY, ZZ, PRESS, STS, , , , ,
7 MET099500 Insert, Nut MICE0016901 COMPLEX MECH_COMMON ZZ:Without Color -
6 MDAY00 Decor MDAY0098601 COMPLEX L-04C NTTWV WV:WHITE SILVER MOLD,PC LUPOY SC-1004A,
6 MFEZ00 Frame MFEZ0044801 COMPLEX L-04C NTTWV BK:Black PRESS, STS, 0.2,
5 ACGU00 Cover Assembly,Lower - ACGU0008501 L-04C NTTWV WV:WHITE SILVER -
6 MCQ000000 Damper MPBZ0324001 COMPLEX L04C.ANTTWV ZZ:Without Color COMPLEX,(empty), , , , ,
6 MCQ000004 Damper MPBZ0330701 COMPLEX L04C.ANTTWV BK:Black COMPLEX, (empty),, , , ,
6 MCQ000002 Damper MPBZ0330601 COMPLEX L04C.ANTTWV BK:Black COMPLEX, (empty),, , , ,
6 MCQ000001 Damper MPBZ0324301 COMPLEX L04C.ANTTWV ZZ:Without Color COMPLEX,(empty), , , , ,
6 MDS000002 Gasket MDS63515501 COMPLEX L04C.ANTTWV ZZ:Without Color LOWERFORM 2
6 MDS000000 Gasket MGAZ0109401 COMPLEX L04C.ANTTWV ZZ:Without Color COMPLEX,(empty), , , , ,
6 MDS000001 Gasket MGAZ0109701 COMPLEX L04C.ANTTWV GD:Gold COMPLEX, (empty),, , , ,
6 MCQ000003 Damper MPBZ0324101 COMPLEX L04C.ANTTWV ZZ:Without Color COMPLEX,(empty), , , , ,
11. EXPLODED VIEW & REPLACEMENT PART LIST
- �88 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level Location No. Description PartNumber Spec Remark
6 MCJY00 Cover, Lower - MCJY0010001 COMPLEX L-04C NTTWV WV:WHITE SILVER MOLD,PC LUPOY SC-2302,
7 MAZ000001 Bracket MAZ63004601 PRESS STEEL STS304-H 0.3 L04C.ANTTWV ZZ:WithoutColor -
7 MBFZ00 Bracket MBFZ0061901 COMPLEX L-04C NTTWV ZZ:Without Color PRESS, STS,0.3,
5 ARDY00 Rail Assembly,Slide ARDY0017801 L-04C NTTWV WV:WHITE SILVER -
4 AKAC00 Keypad Assembly,Main AKAC0021101 L-04C NTTWV ZZ:Without Color -
4 EBR01 PCB Assembly,Flexible - EBR73159401 L04C.ANTTWV 1.0 Flexible
5 EBR070100 PCB Assembly,Flexible, Insert - EBR73178201 L04C.ANTTWV 1.0 Flexible
6 ADCA01 Dome Assembly,Metal ADCA0119301 L04C.ANTTWV ZZ:Without Color slide
5 EBR070400 PCB Assembly,Flexible, SMT - EBR73178301 L04C.ANTTWV 1.0 Flexible
6 EBR070200PCB Assembly,Flexible, SMTBottom
- EBR73159701 L04C.ANTTWV 1.0 Flexible
6 EBR070300PCB Assembly,Flexible,SMT Top
- EBR73159801 L04C.ANTTWV 1.0 Flexible
7 EAX010700 PCB, Flexible SPCY0259301 SPCY0259301 L04C.ANTTWV 1.1 - - - - FLEXIBLEYOUNG POONG ELECTRONICS CO. LTD.
3 SAFY00 PCB Assembly,Main - SAFY0387901 L04C.ANTTWV 1.0 MAIN
4 SAFB00 PCB Assembly,Main, Insert - SAFB0122201 L04C.ANTTWV 1.0 MAIN
5 ABM00 Can Assembly,Shield - ABM73456201 L04C.ANTTWV WV:WHITE SILVER -
6 MBK070300 Can, Shield MCBA0079401 COMPLEX L-04C NTTWV SV:Silver -
6 MEV000000 Insulator MEV63672701 COMPLEX L04C.ANTTWV BL:Blue CAN TOP 1
6 MEV000001 Insulator MEV63676901 COMPLEX L04C.ANTTWV WV:WHITE SILVER -
5 RAA050100 RESIN, PC BRAH0001301 UF-1060, ; , , , , [empty]
5 RAA050101 RESIN, PC BRAH0002601 UNIQUE4000HFW, ; , , , , [empty]
5 MCQ015700 Damper,Connector MCQ66493201 COMPLEX L04C.ANTTWV WV:WHITE SILVER -
11. EXPLODED VIEW & REPLACEMENT PART LIST
- �89 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level Location No. Description PartNumber Spec Remark
5 ABM01 Can Assembly,Shield - ABM73457001 L04C.ANTTWV WV:WHITE SILVER -
6 MBK070300 Can, Shield MCBA0080001 COMPLEX L-04C NTTWV SV:Silver -
6 MEV000000 Insulator MEV63672801 COMPLEX L04C.ANTTWV BL:Blue CAN TOP 2
5 ABM02 Can Assembly,Shield - ABM73476001 L04C.ANTTWV WV:WHITE SILVER -
6 MBK070300 Can, Shield MCBA0079501 COMPLEX L-04C NTTWV SV:Silver -
6 MEV000000 Insulator MEV63691401 COMPLEX L04C.ANTTWV WV:WHITE SILVER -
4 SAFF00 PCB Assembly,Main, SMT - SAFF0288401 L04C.ANTTWV 1.0 MAIN
5 MEZ000000 Label MLAZ0038301 COMPLEX LG-VX6000 ZZ:Without Color PID Label 4Array PRINTING,
5 SAD010000 Software, Mobile SAD32863801 V10a - JAPAN QCT -
5 SAFC00 PCB Assembly,Main, SMT Bottom - SAFC0154701 L04C.ANTTWV 1.0 MAIN
6 SNGF01 Antenna, Helical SNGF0041301 ODGPPTR3015 SINGLE -2DB 50OHM 3 PARTRONCOMPANY LIMITED
6 SNGF02 Antenna, Helical SNGF0048003 ITBTPTR3015 SINGLE -2DB 50OHM 3 PARTRONCOMPANY LIMITED
5 SAFD00PCB Assembly,Main,SMT Top
- SAFD0152601 L04C.ANTTWV 1.0 MAIN
6 EAX010000 PCB, Main SPFY0244801 SPFY0244801 L04C.ANTTWV 1.0 FR-4 Any Layer 100.75 MAIN LG Innotek.com
6 MBFZ00 Bracket MBFZ0061001 COMPLEX L-04C NTTWV ZZ:Without Color PRESS, NS,, , , ,
6 MFEZ01 Frame MFEZ0032701 COMPLEX L-04C NTTWV SV:Silver -
6 MFEZ02 Frame MFEZ0033601 COMPLEX L-04C NTTWV SV:Silver -
11. EXPLODED VIEW & REPLACEMENT PART LIST
- �90 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
by SBOM standard on GCSC
Level Location No. Description PartNumber Spec Remark
7 CN2 Connector, BtoB ENBY005110114-5804-080-000-829+ 80P 0.40MM STRAIGHT MALESMD R/TP 900mM - KYOCERA ELCO KOREA SALESCO., LTD.
7 CN2 Connector, BtoB ENBY005110114-5804-080-000-829+ 80P 0.40MM STRAIGHT MALESMD R/TP 900mM - KYOCERA ELCO KOREA SALESCO., LTD.
7 CN4,CN5 Contact MCIZ0008701 COMPLEX L-04C, ANTTWV ZZ:Without Color PRESS,
YCUT-FX, 4.2, 2.5, 1.5,
7 C204,C210
Capacitor,Ceramic, Chip ECCH0000122 MCH155A470JK 47pF 5% 50V NP0 -55TO+125C 1005
R/TP - ROHM Semiconductor KOREA CORPORATION
7
C103,C104,C105,C106,C207
Capacitor,Ceramic, Chip ECCH0000198
CL05A225MQ5NSNC 2.2uF 20% 6.3V X5R -55TO+85C1005 R/TP . SAMSUNG ELECTRO-MECHANICS CO.,LTD.
7D201,D202,D204
Diode, TVS EDTY0010101 ESD9B5.0ST5G ESD9B5.0ST5G, SOD-923, 5 V, 300mW, R/TP, 15pF SCG HONG KONG SAR LTD.
7 R111,R112 Resistor, Chip ERHY0009516 MCR006YZPJ222 2.2KOHM 5% 1/20W 0603 R/TP -
ROHM.
7 C109 Capacitor,Ceramic, Chip ECCH0005602 GRM188R61C225K 2.2uF 10% 16V X5R -55TO+85C
1608 R/TP - MURATA MANUFACTURING CO., LTD.
7R101,R102,R203
Resistor, Chip ERHZ0000443 MCR01MZP5J222 2.2KOHM 5% 1/16W 1005 R/TP -ROHM.
7
C112,C113,C114,C117,C638
Capacitor,Ceramic, Chip ECCH0009101 C0603X5R0J104KT00NN 0.1uF 10% 6.3V X5R -
55TO+85C 0603 R/TP - TDK CORPORATION
7 C640 Capacitor,Ceramic, Chip ECCH0009106 C0603X7R1C103KT 10nF 10% 10V X7R -55TO+125C
0603 R/TP - TDK CORPORATION
7
C111,C4,
C471,C639
Capacitor,Ceramic, Chip ECCH0017301
CL03A105MQ3CSNH 0.000001F 20% 6.3V X5R -45TO+85C 0603 R/TP - SAMSUNG ELECTRO-MECHANICS CO., LTD.
7 C206 Capacitor,Ceramic, Chip ECCH0017601
CL05A475MQ5NRNC 4.7uF 20% 6.3V X5R -55TO+85C1005 R/TP 0.5MM SAMSUNG ELECTRO-MECHANICSCO., LTD.
11.2 Replacement Parts Note: This Chapter is used for reference, Part order is ordered
<Main component>
11. EXPLODED VIEW & REPLACEMENT PART LIST
- �91 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level Location No. Description PartNumber Spec Remark
7 R220 Resistor, Chip ERHZ0000407 MCR01MZP5J105 1MOHM 5% 1/16W 1005 R/TP -ROHM.
7 C119 Capacitor, TA,Conformal ECTH0003701 TCSCM0J106MJAR 10 uF, 6.3V, M, L_ESR, 1608, R/TP
SAMSUNG ELECTRO-MECHANICS CO., LTD.
7 C201,C208
Capacitor,Ceramic, Chip ECZH0000830 C1005C0G1H330JT000F 33pF 5% 50V NP0 -55TO+125C
1005 R/TP - TDK KOREA COOPERATION
7 C110 Capacitor, TA,Conformal ECTH0005203 TCTP1A336M8R , [empty] , [empty] , , [empty] , , [empty] ,
[empty] , [empty] , [empty] ROHM.
7C107,C108,C301
Capacitor,Ceramic, Chip ECZH0001215 C1005X5R1A105KT000F 1uF 10% 10V X5R -55TO+85C
1005 R/TP - TDK KOREA COOPERATION
7
R104,R105,R402,R403,R623
Resistor, Chip ERHY0009526 MCR006YZPJ472 4.7KOHM 5% 1/20W 0603 R/TP -ROHM.
7 C205,C212
Capacitor,Ceramic, Chip ECZH0003103 GRM36X7R104K10PT 100nF 10% 10V X7R -55TO+125C
1005 R/TP - MURATA MANUFACTURING CO., LTD.
7 D205,D206 Diode, TVS EDTY0009801 VSMF05LCC 5V 6V 12V 2A 25W SOT-963 R/TP 6P 5
PROTEK DEVICES INC.
7 R106,R430 Resistor, Chip ERHY0009506 MCR006YZPJ104 100KOHM 5% 1/20W 0603 R/TP -
ROHM.
7 L2, L3,L4, L5
Inductor,Multilayer, Chip ELCH0001430 LL1005-FHLR10J 100NH 5% - 150mA 2.2OHM 1.03GHZ
10 SHIELD NONE 1.0X0.5X0.5MM R/TP TOKO, INC.
7 L511,L512
Inductor,Multilayer, Chip ELCH0004727
1005GC2TR10JLF 100NH 5% - 100mA 2.3OHM 600MHZ8 SHIELD NONE 1.0X0.5X0.5MM R/TP PILKORELECTRONICS LTD.
7 CN101 Connector, BtoB ENBY0040301 GB042-34S-H10-E3000 34P 0.4MM STRAIGHT SOCKETSMD R/TP 1M - LS Mtron Ltd.
7R2,
R335,R4
PCB ASSY,MAIN, PADSHORT
SAFP0000401 LG-LU3000 LGTBK, MAIN, A,
7 CN402 Connector, BtoB ENBY005120124-5804-080-000-829+ 80P 0.40MM STRAIGHT FEMALESMD R/TP 900mM - KYOCERA ELCO KOREA SALESCO., LTD.
7 CN601 Connector, I/O ENEY0003801 24-8000-002-000-829 2P 1.00MM ANGLE SOCKET TYPESMD R/TP - KYOCERA ELCO KOREA SALES CO., LTD.
7 J201 Jack, Phone ENJE0007601 KJA-PH-0-0176 1P 4P ANGLE R/TP 4mM BLACK 6P -KSD CO., LTD
7 CN1 Socket, Card ENSY0023601 SCHA4B0402 Micro-SD 8P ANGLE SMD R/TP - ALPSELECTRIC KOREA CO., LTD.
11. EXPLODED VIEW & REPLACEMENT PART LIST
- �9� - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level Location No. Description PartNumber Spec Remark
7 R219 Resistor, Chip ERHY0009518 MCR006YZPJ224 220KOHM 5% 1/20W 0603 R/TP -ROHM.
7
FB201,FB202,FB203,FB204
Filter, Bead SFBH0008105BLM15BD182SN1D 1800 ohm 1.0X0.5X0.5 25% 1.4 ohm0.1A SMD R/TP 2P 0 MURATA MANUFACTURING CO.,LTD.
7 SW401 Connector, RF ENWY0003901 U.FL-R-SMT(10) 1.90MM STRAIGHT SOCKET SMDT/REEL CU 50OHM 300mDB HIROSE KOREA CO., LTD
7R202,R212,R216
Resistor, Chip ERHZ0000406 MCR01MZP5J104 100KOHM 5% 1/16W 1005 R/TP -ROHM.
7 Q601 TR, Bipolar EQBN0012401 KRC402E NPN 30V 0V 50V 100mA 500mA 50 100mWESM R/TP 3P KEC CORPORAITION
7 R308,R309 Resistor, Chip ERHY0003301 MCR01MZP5J101 100OHM 5% 1/16W 1005 R/TP -
ROHM.
7 Q100 FET EQFP0004501SI1305-E3 P-CHANNEL MOSFET -8V +-8 -0.92A0.28OHM 340mW SOT323 R/TP 9P VISHAYINTERTECHNOLOGY ASIA PTE LTD
7 R617,R618 Resistor, Chip ERHY0009302 MCR006YZPF1001 1KOHM 1% 1/20W 0603 R/TP -
ROHM.
7 R401 Resistor, Chip ERHY0009505 MCR006YZPJ103 10KOHM 5% 1/20W 0603 R/TP -ROHM.
7 C403 Inductor,Multilayer, Chip ELCH0004715
1005GC2T27NJLF 27NH 5% - 200mA 0.9OHM 1.4GHZ 8SHIELD NONE 1.0X0.5X0.5MM R/TP PILKORELECTRONICS LTD.
7 C202,C203
Capacitor,Ceramic, Chip ECZH0004402
CL05F104ZO5NNNC 0.1uF -20TO+80% 16V Y5V -30TO+85C 1005 R/TP - SAMSUNG ELECTRO-MECHANICS CO., LTD.
7 R619,R622 Resistor, Chip ERHZ0000204 MCR01MZP5F1003 100KOHM 1% 1/16W 1005 R/TP -
ROHM.
7 R620,R621 Resistor, Chip ERHZ0000295 MCR01MZP5F5102 51KOHM 1% 1/16W 1005 R/TP -
ROHM.
7 U103 IC, Bus Controller EUSY0342405 NLSX4373MUTAG 1.5~5.5V 2uA - DFN R/TP 8P - SCGHONG KONG SAR LTD.
7 R210 Resistor, Chip ERHZ0000456 MCR01MZP5J2R2 2.2OHM 5% 1/16W 1005 R/TP -ROHM.
7 R6, R7 Resistor, Chip ERHZ0000465 MCR01MZP5J332 3.3KOHM 5% 1/16W 1005 R/TP -ROHM.
7
R206,R207,R208,R209,R211
Resistor, Chip ERHZ0000486 MCR01MZP5J473 47KOHM 5% 1/16W 1005 R/TP -ROHM.
11. EXPLODED VIEW & REPLACEMENT PART LIST
- �93 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level Location No. Description PartNumber Spec Remark
7 C216 Capacitor,Ceramic, Chip ECCH0009103 C0603C0G1H101JT00NN 100pF 5% 50V X7R -
55TO+125C 0603 R/TP - TDK CORPORATION
7 U101 IC, Sub PMIC EUSY0336503 AAT2870IUW-T1 CSP , 35 , R/TP , 3.1x2.6 , ; , IC, SubPMIC Advanced Analogic Technologies HK Limited
7 U102 IC, LevelTranslator EUSY0391601 NLSV1T244-D 0.9~4.5V - LEVEL SHIFTER - R/TP 6P -
SCG HONG KONG SAR LTD.
7 U601 IC, SpeakerAmplifier EUSY0404001
TPA6202A1ZQVR BGA, 8, R/TP, Class AB SPK Amp, IC,Audio AmplifierIC, Audio Amplifier - BGA R/TP 8P - TEXASINSTRUMENTS KOREA LTD, HONGKONG BRANCH.
7 U405 IC, LDO VoltageRegulator EUSY0407201
BU33TD4WNVX SSON004, 4, R/TP, 3.3V 150mA SingleLDO, IC, LDO Voltage RegulatorIC, LDO Voltage RegulatorROHM.
7 U201 IC, LDO VoltageRegulator EUSY0407501
BU18TD4WNVX SSON004, 4, R/TP, 1.8V 150mA SingleLDO, IC, LDO Voltage RegulatorIC, LDO Voltage RegulatorROHM.
7
VA302,VA305,VA324,VA325
Varistor SEVY0001001 EVLC14S02050 14V 0% 50F 1.0*0.5*0.6 NONE SMDR/TP AMOTECH CO., LTD.
7 VA1,VA101 Varistor SEVY0004301 ICVL0518100Y500FR 18V 0% 10F 1.0*0.5*0.55 NONE
SMD R/TP INNOCHIPS TECHNOLOGY
7 FB101, FB102 Filter, Bead SFBH0009901 HB-1M1005-121JT 120 ohm 1.0X0.5X0.5 25% 0.3 ohm0.5A SMD R/TP 2P 0 CERATECH CORPORATION
7FL1,
FL101,FL102
Filter, EMI/Power SFEY0011701 ICVE10184E070R100FR ESD/EMI 0HZ 7.5pF 0H SMDR/TP INNOCHIPS TECHNOLOGY
7
ZD201,ZD202,ZD205,ZD206
Diode, TVS EDTY0009101 ESD9X5.0ST5G 5V 6.2 12.3V 8.7A 107W SOD528 R/TP2P 1 ON SEMICONDUCTOR
7 R11 Capacitor,Ceramic, Chip ECZH0000813 C1005C0G1H101JT 100pF 5% 50V NP0 -55TO+125C
1005 R/TP - TDK KOREA COOPERATION
7 C215 Capacitor,Ceramic, Chip ECCH0000112 MCH155C150J 15pF 5% 50V NP0 -55TO+125C 1005
R/TP - ROHM Semiconductor KOREA CORPORATION
7 C204,C210
Capacitor,Ceramic, Chip ECCH0000122 MCH155A470JK 47pF 5% 50V NP0 -55TO+125C 1005
R/TP - ROHM Semiconductor KOREA CORPORATION
7 C1 Capacitor,Ceramic, Chip ECCH0000155
MCH153CN103KK 10nF 10% 16V X7R -55TO+125C1005 R/TP - ROHM Semiconductor KOREACORPORATION
7 C302,C303
Capacitor,Ceramic, Chip ECCH0002001 C1005JB0J104KT000F 0.1uF 10% 6.3V Y5P -30TO+85C
1005 R/TP - TDK CORPORATION
11. EXPLODED VIEW & REPLACEMENT PART LIST
- �94 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level Location No. Description PartNumber Spec Remark
7 C214 Capacitor, TA,Conformal ECTH0001901
F980J106MMA 10 uF, 6.3V, M, L_ESR, 1608, R/TPNICHICON CORPORATION, EAST JAPAN SALESOFFICE
7 C201,C208
Capacitor,Ceramic, Chip ECZH0000830 C1005C0G1H330JT000F 33pF 5% 50V NP0 -55TO+125C
1005 R/TP - TDK KOREA COOPERATION
7 C2 Capacitor,Ceramic, Chip ECZH0001210 C1005Y5V1A474ZT000F 470nF -20TO+80% 10V Y5V -
30TO+85C 1005 R/TP - TDK KOREA COOPERATION
7LD301,LD303,
LD304, LD305LED, Chip EDLH0014307
CL-435F-WQT-SD-TS WHITE 2.8~3.6V 30mA 1200~2080x, y 114mW - R/TP 4P - CITIZEN ELECTRONICS CO.,LTD.
7 CN401 Connector, BtoB ENBY0040501 GB042-50S-H10-E3000 50P 0.4MM STRAIGHT SOCKETSMD R/TP 1M - LS Mtron Ltd.
7 D207,D208 Diode, TVS EDTY0008606 PRSB6.8C 4.7V 5.7 - - 10W - R/TP 2P 1 PROTEK
DEVICES INC.
7 R311 Resistor, Chip ERHZ0000213 MCR01MZP5F1203 120KOHM 1% 1/16W 1005 R/TP -ROHM.
7
R327,R328,R329,R330
Resistor, Chip ERHZ0000270 MCR01MZP5F33R0 33OHM 1% 1/16W 1005 R/TP -ROHM.
7
R302,R312,R313,R314,R315,R316,R317,R318,R319,R320,R321,R322,R323,R324,R331,R332
Resistor, Chip ERHZ0000285 MCR01MZP5F4700 470OHM 1% 1/16W 1005 R/TP -ROHM.
7 R8 Resistor, Chip ERHZ0000404 MCR01MZP5J102 1KOHM 5% 1/16W 1005 R/TP -ROHM.
7 R110 Resistor, Chip ERHZ0000410 MCR01MZP5J120 12OHM 5% 1/16W 1005 R/TP -ROHM.
7R101,R102,R203
Resistor, Chip ERHZ0000443 MCR01MZP5J222 2.2KOHM 5% 1/16W 1005 R/TP -ROHM.
11. EXPLODED VIEW & REPLACEMENT PART LIST
- �95 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level Location No. Description PartNumber Spec Remark
7 U301 IC, Bus Controller EUSY0300008 PP2106M3 1.8/2.6V 1mA - MLF R/TP 28P - G5CORPORATION
7 U202 IC, AccelerationSensor EUSY0408901 S-5711ACDL 2.5 to 3.3 - - R/TP 4P - SEIKO
INSTRUMENTS INC
7 U1 IC, GeomagneticSensor EUSY0418501
AMI304 QFN, 12, R/TP, Geomagnetic Sensor, IC, A/DConverterIC, A/D Converter - QFN R/TP 12P - AICHISTEEL CORPORATION
7
VA302,VA305,VA324,VA325
Varistor SEVY0001001 EVLC14S02050 14V 0% 50F 1.0*0.5*0.6 NONE SMDR/TP AMOTECH CO., LTD.
7 FB1 Filter, Bead SFBH0008102BLM15HD182SN1D 1800 ohm 1.0X0.5X0.5 25% 2.2 ohm0.2A SMD R/TP 2P 0 MURATA MANUFACTURING CO.,LTD.
7C107,C108,C301
Capacitor,Ceramic, Chip ECZH0001215 C1005X5R1A105KT000F 1uF 10% 10V X5R -55TO+85C
1005 R/TP - TDK KOREA COOPERATION
7 R201 Wire Pad, Open SAFO0000501 AX3100 ATL SV_SHIPBACK, MAIN, A, 0OHM_1005_DNI
7 C205,C212
Capacitor,Ceramic, Chip ECZH0003103 GRM36X7R104K10PT 100nF 10% 10V X7R -55TO+125C
1005 R/TP - MURATA MANUFACTURING CO., LTD.
7 D207,D208 Diode, TVS EDTY0008606 PRSB6.8C 4.7V 5.7 - - 10W - R/TP 2P 1 PROTEK
DEVICES INC.
7 D205,D206 Diode, TVS EDTY0009801 VSMF05LCC 5V 6V 12V 2A 25W SOT-963 R/TP 6P 5
PROTEK DEVICES INC.
7 C206 Capacitor,Ceramic, Chip ECCH0017601
CL05A475MQ5NRNC 4.7uF 20% 6.3V X5R -55TO+85C1005 R/TP 0.5MM SAMSUNG ELECTRO-MECHANICSCO., LTD.
7 C101,C109
Capacitor,Ceramic, Chip ECCH0004904 GRM155R60J105K 1uF 10% 6.3V X5R -55TO+85C 1005
R/TP - MURATA MANUFACTURING CO., LTD.
7
C103,C104,C105,C106,C207
Capacitor,Ceramic, Chip ECCH0000198
CL05A225MQ5NSNC 2.2uF 20% 6.3V X5R -55TO+85C1005 R/TP . SAMSUNG ELECTRO-MECHANICS CO.,LTD.
7 C104,C105
Capacitor,Ceramic, Chip ECCH0000120 MCH155A390J 39pF 5% 50V NP0 -55TO+125C 1005
R/TP - ROHM Semiconductor KOREA CORPORATION
7 CN102 Connector, BtoB ENBY0040401 GB042-50P-H10-E3000 50P 0.4MM STRAIGHT PLUGSMD R/TP 1M - LS Mtron Ltd.
7 BAT100 CapacitorAssembly SMZY0023501 PAS311HR-VG1 3.8 Backup Capacitor 0.03F, Module
Assembly, KOREA TAIYO YUDEN.CO., LTD.
7 FL100 Filter, EMI/Power SFEY0015901 ICMEF214P101MFR ICMEF214P101MFR, SMD, ESDCommon mode Filter INNOCHIPS TECHNOLOGY
11. EXPLODED VIEW & REPLACEMENT PART LIST
- �96 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level Location No. Description PartNumber Spec Remark
7 R100 Resistor, Chip ERHZ0000488 MCR01MZP5J4R7 4.7OHM 5% 1/16W 1005 R/TP -ROHM.
7 R101 Resistor, Chip ERHZ0000402 MCR01MZP5J100 10OHM 5% 1/16W 1005 R/TP -ROHM.
7 CN103 Connector,FFC/FPC/PIC ENQY0015301
04-6293-625-005-829+ 25P 0.30MM FFC STRAIGHTTOP SMD T/REEL LOCKING - KYOCERA ELCO KOREASALES CO., LTD.
7LD301,LD303,
LD304, LD305LED, Chip EDLH0014307
CL-435F-WQT-SD-TS WHITE 2.8~3.6V 30mA 1200~2080x, y 114mW - R/TP 4P - CITIZEN ELECTRONICS CO.,LTD.
7 VA104 Varistor SEVY0005201 EVLC5S02050 5.5V 0% 50F 1.0*0.5*0.6 - SMD R/TPAMOTECH CO., LTD.
7
VA302,VA305,VA324,VA325
Varistor SEVY0001001 EVLC14S02050 14V 0% 50F 1.0*0.5*0.6 NONE SMDR/TP AMOTECH CO., LTD.
7 U100 IC, Proximity EUSY0376201 GP2AP002S00F GP2AP002S00F, 8, R/TP SHARPCORPORATION.
7
R327,R328,R329,R330
Resistor, Chip ERHZ0000270 MCR01MZP5F33R0 33OHM 1% 1/16W 1005 R/TP -ROHM.
7 CN100 Connector, BtoB ENBY0050901 GB042-10P-H10-E3000 10P 0.4MM STRAIGHT MALESMD R/TP 1M - LS Mtron Ltd.
6 L1000 Inductor,Multilayer, Chip ELCH0001426 LL1005-FHL8N2J 8.2NH 5% - 300mA 0.25OHM 4.7GHZ 9
SHIELD NONE 1.0X0.5X0.5MM R/TP TOKO, INC.
6 C804 Capacitor,Ceramic, Chip ECCH0000110 MCH155A100D 10pF 0.25PF 50V NP0 -55TO+125C 1005
R/TP - ROHM Semiconductor KOREA CORPORATION
6 C1026 Capacitor,Ceramic, Chip ECCH0000108 C1005NP0709DGT 7pF 0.5PF 50V NP0 -55TO+125C
1005 R/TP - NEOTECH CO., LTD
6 C215 Capacitor,Ceramic, Chip ECCH0000112 MCH155C150J 15pF 5% 50V NP0 -55TO+125C 1005
R/TP - ROHM Semiconductor KOREA CORPORATION
6 C205,C212
Capacitor,Ceramic, Chip ECZH0003103 GRM36X7R104K10PT 100nF 10% 10V X7R -55TO+125C
1005 R/TP - MURATA MANUFACTURING CO., LTD.
6 C1007 Capacitor,Ceramic, Chip ECCH0000113 MCH155A180J 18pF 5% 50V NP0 -55TO+125C 1005
R/TP - ROHM Semiconductor KOREA CORPORATION
11. EXPLODED VIEW & REPLACEMENT PART LIST
- �97 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level Location No. Description PartNumber Spec Remark
6
C1072,C702,C800,C801,C803
Capacitor,Ceramic, Chip ECCH0000115 MCH155A220JK 22pF 5% 50V NP0 -55TO+125C 1005
R/TP - ROHM Semiconductor KOREA CORPORATION
6 C104,C105
Capacitor,Ceramic, Chip ECCH0000120 MCH155A390J 39pF 5% 50V NP0 -55TO+125C 1005
R/TP - ROHM Semiconductor KOREA CORPORATION
6 C1038 Capacitor,Ceramic, Chip ECCH0000117
CL05C270JB5NNNC 27pF 5% 50V NP0 -55TO+125C1005 R/TP 0.5 SAMSUNG ELECTRO-MECHANICS CO.,LTD.
6 C1031, C1041 Capacitor,Ceramic, Chip ECCH0000143 MCH155CN102KK 1nF 10% 50V X7R -55TO+125C 1005
R/TP - ROHM Semiconductor KOREA CORPORATION
6 C1 Capacitor,Ceramic, Chip ECCH0000155
MCH153CN103KK 10nF 10% 16V X7R -55TO+125C1005 R/TP - ROHM Semiconductor KOREACORPORATION
6 C1082, C1086 Inductor,Multilayer, Chip ELCH0001405
LL1005-FHL3N3S 3.3NH 0.3NH - 400mA 0.16OHM9.1GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP TOKO,INC.
6C1067,C1068,
C1084, C1097
Capacitor,Ceramic, Chip ECCH0000183 GRM1555C1H1R8C 1.8pF 0.25PF 50V NP0 -55TO+125C
1005 R/TP - MURATA MANUFACTURING CO., LTD.
6C1061,C1062,
C1063, C1064
Capacitor,Ceramic, Chip ECCH0000901 C1005C0G1H2R2CT000F 2.2pF 0.25PF 50V NP0 -
55TO+125C 1005 R/TP - TDK KOREA COOPERATION
6 C807 Capacitor,Ceramic, Chip ECCH0000701 C1005C0G1H1R2CT000F 1.2pF 0.25PF 50V NP0 -
55TO+125C 1005 R/TP - TDK CORPORATION
6 C302,C303
Capacitor,Ceramic, Chip ECCH0002001 C1005JB0J104KT000F 0.1uF 10% 6.3V Y5P -30TO+85C
1005 R/TP - TDK CORPORATION
6 C1033,C53
Capacitor,Ceramic, Chip ECCH0005604
GRM188R60J106M 10000000 pF, 6.3V, M, X5R, TC,1608, R/TP, 0.8 mm MURATA MANUFACTURING CO.,LTD.
6 C8554 Capacitor,Ceramic, Chip ECCH0004906
GRM1555C1H2R5CZ01D 2.5pF 0.25PF 50V X7R -55TO+125C 1005 R/TP - MURATA MANUFACTURINGCO., LTD.
6
C1024,C1034,C1035,C1091,
C57
Capacitor,Ceramic, Chip ECCH0007802
CL10A475KP8NNNC 4.7uF 10% 10V X5R -55TO+85C1608 R/TP - SAMSUNG ELECTRO-MECHANICS CO.,LTD.
6 C1070 Capacitor,Ceramic, Chip ECCH0007803
CL10A106MP8NNNC 10uF 20% 10V X5R -55TO+85C1608 R/TP 0.8MM SAMSUNG ELECTRO-MECHANICSCO., LTD.
11. EXPLODED VIEW & REPLACEMENT PART LIST
- �98 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level Location No. Description PartNumber Spec Remark
6 C825 Capacitor,Ceramic, Chip ECCH0007804
CL05A225MP5NSNC 2.2uF 20% 10V X5R -55TO+85C1005 R/TP 0.5MM SAMSUNG ELECTRO-MECHANICSCO., LTD.
6
C112,C113,C114,C117,C638
Capacitor,Ceramic, Chip ECCH0009101 C0603X5R0J104KT00NN 0.1uF 10% 6.3V X5R -
55TO+85C 0603 R/TP - TDK CORPORATION
6 C216 Capacitor,Ceramic, Chip ECCH0009103 C0603C0G1H101JT00NN 100pF 5% 50V X7R -
55TO+125C 0603 R/TP - TDK CORPORATION
6 C1011, C1012 Capacitor,Ceramic, Chip ECCH0009206 GRM0335C1E680J 68pF 5% 25V X7R -55TO+125C 0603
R/TP - MURATA MANUFACTURING CO., LTD.
6 C1027,C56
Capacitor,Ceramic, Chip ECCH0009216 GRM0335C1E220J 22pF 5% 25V X7R -55TO+125C 0603
R/TP - MURATA MANUFACTURING CO., LTD.
6
C111,C4,
C471,C639
Capacitor,Ceramic, Chip ECCH0017301
CL03A105MQ3CSNH 0.000001F 20% 6.3V X5R -45TO+85C 0603 R/TP - SAMSUNG ELECTRO-MECHANICS CO., LTD.
6 L1033 Capacitor,Ceramic, Chip ECZH0000802 C1005C0G1H010CT 1pF 0.25PF 50V NP0 -55TO+125C
1005 R/TP - TDK KOREA COOPERATION
6 C201,C208
Capacitor,Ceramic, Chip ECZH0000830 C1005C0G1H330JT000F 33pF 5% 50V NP0 -55TO+125C
1005 R/TP - TDK KOREA COOPERATION
6 R11 Capacitor,Ceramic, Chip ECZH0000813 C1005C0G1H101JT 100pF 5% 50V NP0 -55TO+125C
1005 R/TP - TDK KOREA COOPERATION
6 C1104 Capacitor,Ceramic, Chip ECZH0000841 C1005C0G1H560JT000F 56pF 5% 50V NP0 -55TO+125C
1005 R/TP - TDK KOREA COOPERATION
6 C1076, C1101 Capacitor,Ceramic, Chip ECZH0001002 C1005CH1H0R5BT000F 0.5pF 0.1PF 50V NP0 -
55TO+125C 1005 R/TP - TDK KOREA COOPERATION
6C1090,C1092,
C1093, C1094
Capacitor,Ceramic, Chip ECZH0001122 C1005X7R1H681KT000F 680pF 10% 50V X7R -
55TO+125C 1005 R/TP - TDK KOREA COOPERATION
6C107,C108,C301
Capacitor,Ceramic, Chip ECZH0001215 C1005X5R1A105KT000F 1uF 10% 10V X5R -55TO+85C
1005 R/TP - TDK KOREA COOPERATION
6 C705 Capacitor,Ceramic, Chip ECZH0003503 GRM188R61E105K 1uF 10% 25V X5R -55TO+85C 1608
R/TP - MURATA MANUFACTURING CO., LTD.
6 C1013, C1052 Capacitor,Ceramic, Chip ECZH0025916 GRM0335C1E330J 33pF 5% 25V NP0 -55TO+125C 0603
R/TP - MURATA MANUFACTURING CO., LTD.
6 D205,D206 Diode, TVS EDTY0009801 VSMF05LCC 5V 6V 12V 2A 25W SOT-963 R/TP 6P 5
PROTEK DEVICES INC.
11. EXPLODED VIEW & REPLACEMENT PART LIST
- �99 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level Location No. Description PartNumber Spec Remark
6 ZD700 Diode, TVS EDTY0008602 PSD12-LF 12V 13.3 25.9V 21A 500W SOD323 R/TP 2P 1PROTEK DEVICES INC.
6 L1013 Inductor,Multilayer, Chip ELCH0001032
HK1005 18NJ-T 18NH 5% - 300mA 0.55OHM 2.1GHZ 8SHIELD NONE 1.0X0.5X0.5MM R/TP TAIYO YUDENCO., LTD
6 C1100 Inductor,Multilayer, Chip ELCH0001054
1005GC2T5N6SLF 5.6NH 0.3NH - 300mA 0.27OHM3.2GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP PILKORELECTRONICS LTD.
6 C1016 Inductor,Multilayer, Chip ELCH0001401 LL1005-FHL15NJ 15NH 5% - 300mA 0.5OHM 2.8GHZ 9
SHIELD NONE 1.0X0.5X0.5MM R/TP TOKO, INC.
6 C1039, L1001 Inductor,Multilayer, Chip ELCH0001407
LL1005-FHL5N6S 5.6NH 0.3NH - 300mA 0.22OHM6.1GHZ 9 SHIELD NONE 1.0X0.5X0.5MM R/TP TOKO,INC.
6 C1098 Inductor,Multilayer, Chip ELCH0001403 LL1005-FHL1N0S 1NH 0.3NH - 400mA 0.1OHM 20GHZ 7
SHIELD NONE 1.0X0.5X0.5MM R/TP TOKO, INC.
6 C1053 Inductor,Multilayer, Chip ELCH0001404
LL1005-FHL1N5S 1.5NH 0.3NH - 400mA 0.13OHM15GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP TOKO,INC.
6 L1007,L804
Inductor,Multilayer, Chip ELCH0001406 LL1005-FHL4N7S 4.7NH 0.3NH - 300mA 0.2OHM 7GHZ
9 SHIELD NONE 1.0X0.5X0.5MM R/TP TOKO, INC.
6 L1015 Inductor,Multilayer, Chip ELCH0001411 LL1005-FHL1N2S 1.2NH 0.3NH - 400mA 0.1OHM 16GHZ
7 SHIELD NONE 1.0X0.5X0.5MM R/TP TOKO, INC.
6 C1099 Inductor,Multilayer, Chip ELCH0001412
LL1005-FHL1N8S 1.8NH 0.3NH - 400mA 0.14OHM15GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP TOKO,INC.
6 L1009 Inductor,Multilayer, Chip ELCH0001420
LL1005-FHL3N9S_ 3.9NH 0.3NH - 300mA 0.18OHM7.4GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP TOKO,INC.
6 L1036 Inductor,Multilayer, Chip ELCH0001413 LL1005-FHL22NJ 22NH 5% - 300mA 0.7OHM 2.5GHZ 10
SHIELD NONE 1.0X0.5X0.5MM R/TP TOKO, INC.
6 L1002,L1003
Inductor,Multilayer, Chip ELCH0001431 LL1005-FHL68NJ 68NH 5% - 180mA 1.7OHM 1.3GHZ 10
SHIELD NONE 1.0X0.5X0.5MM R/TP TOKO, INC.
6 L1027,L1078
Inductor,Multilayer, Chip ELCH0001416
LL1005-FHL2N7S 2.7NH 0.3NH - 400mA 0.15OHM9.6GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP TOKO,INC.
6 L1017 Inductor,Multilayer, Chip ELCH0004114 LLV0603-FH6N8J 6.8NH 5% - 220mA 0.4OHM 3.5GHZ 6
SHIELD NONE 0.6X0.3X0.3MM R/TP TOKO, INC.
11. EXPLODED VIEW & REPLACEMENT PART LIST
- 300 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level Location No. Description PartNumber Spec Remark
6 L1030 Inductor,Multilayer, Chip ELCH0004701
1005GC2T12NJLF 12NH 5% - 250mA 0.48OHM 2.1GHZ8 SHIELD NONE 1.0X0.5X0.5MM R/TP PILKORELECTRONICS LTD.
6 L1026 Inductor,Multilayer, Chip ELCH0001408 LL1005-FHL6N8J 6.8NH 5% - 300mA 0.23OHM 5.6GHZ 9
SHIELD NONE 1.0X0.5X0.5MM R/TP TOKO, INC.
6 L1034 Inductor,Multilayer, Chip ELCH0004705
1005GC2T8N2JLF 8.2NH 5% - 250mA 0.37OHM 2.8GHZ8 SHIELD NONE 1.0X0.5X0.5MM R/TP PILKORELECTRONICS LTD.
6 C1102 Inductor,Multilayer, Chip ELCH0004709
1005GC2T3N3SLF 3.3NH 0.3NH - 300mA 0.19OHM4.5GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP PILKORELECTRONICS LTD.
6L1004,L1006,L1029
Inductor,Multilayer, Chip ELCH0004710
1005GC2T15NJLF 15NH 5% - 250mA 0.53OHM 2GHZ 8SHIELD NONE 1.0X0.5X0.5MM R/TP PILKORELECTRONICS LTD.
6
C1055,C1075,L1023,L1035
Inductor,Multilayer, Chip ELCH0004721
1005GC2T2N2SLF 2.2NH 0.3NH - 300mA 0.16OHM6GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP PILKORELECTRONICS LTD.
6
C8553,L1019,L1020,L8056
Inductor,Multilayer, Chip ELCH0004703
1005GC2T1N0SLF 1NH 0.3NH - 300mA 0.12OHM 10GHZ8 SHIELD NONE 1.0X0.5X0.5MM R/TP PILKORELECTRONICS LTD.
6 CN402 Connector, BtoB ENBY005120124-5804-080-000-829+ 80P 0.40MM STRAIGHT FEMALESMD R/TP 900mM - KYOCERA ELCO KOREA SALESCO., LTD.
6 J800 Card Socket ENSY0024301 KP09N-6S-2.54SF SIM 6P ANGLE SMD R/TP - HIROSEKOREA CO., LTD
6 SW401 Connector, RF ENWY0003901 U.FL-R-SMT(10) 1.90MM STRAIGHT SOCKET SMDT/REEL CU 50OHM 300mDB HIROSE KOREA CO., LTD
6 SW1000 Connector, RF ENWY0008701 MS-156C NONE STRAIGHT SOCKET SMD T/REEL AU50OHM 400mDB HIROSE KOREA CO., LTD
6 CN701 Connector,Terminal Block ENZY0027601 KQ03LP1-3R 3P 2.50MM STRAIGHT SMD R/TP -
HIROSE KOREA CO., LTD
6 R1002 Resistor, Chip ERHY0000241 MCR01MZP5J102 1KOHM 5% 1/16W 1005 R/TP -ROHM.
6 R16 Resistor, Chip ERHY0000105 MCR01MZP5F51R0 51OHM 1% 1/16W 1005 R/TP -ROHM.
6 R1024 Resistor, Chip ERHY0009311 MCR006YZPF51R0 51OHM 1% 1/20W 0603 R/TP -ROHM.
11. EXPLODED VIEW & REPLACEMENT PART LIST
- 301 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level Location No. Description PartNumber Spec Remark
6
R1009,R1010,R1011,
R1012, R1020
Resistor, Chip ERHY0009504 MCR006YZPJ102 1KOHM 5% 1/20W 0603 R/TP -ROHM.
6 R106,R430 Resistor, Chip ERHY0009506 MCR006YZPJ104 100KOHM 5% 1/20W 0603 R/TP -
ROHM.
6 R1003 Resistor, Chip ERHZ0000212 MCR01MZP5F1202 12KOHM 1% 1/16W 1005 R/TP -ROHM.
6 R1015, R1019 Resistor, Chip ERHZ0000327 MCR01MZSF1800 180OHM 1% 1/16W 1005 R/TP -ROHM.
6 R1021, R1023 Resistor, Chip ERHZ0000408 MCR01MZP5J111 110OHM 5% 1/16W 1005 R/TP -ROHM.
6 R1016, R1018 Resistor, Chip ERHZ0000411 MCR01MZP5J121 120OHM 5% 1/16W 1005 R/TP -ROHM.
6R101,R102,R203
Resistor, Chip ERHZ0000443 MCR01MZP5J222 2.2KOHM 5% 1/16W 1005 R/TP -ROHM.
6 R1013 Resistor, Chip ERHZ0000457 MCR01MZP5J300 30OHM 5% 1/16W 1005 R/TP -ROHM.
6 C805 Capacitor,Ceramic, Chip ECZH0000816 C1005C0G1H120JT000F 12pF 5% 50V NP0 -55TO+125C
1005 R/TP - TDK KOREA COOPERATION
6 R1017 Resistor, Chip ERHZ0000490 MCR01MZP5J510 51OHM 5% 1/16W 1005 R/TP -ROHM.
6 R800 Resistor, Chip ERHZ0000485 MCR01MZP5J472 4.7KOHM 5% 1/16W 1005 R/TP -ROHM.
6 R1022 Resistor, Chip ERHZ0000495 MCR01MZP5J560 56OHM 5% 1/16W 1005 R/TP -ROHM.
6 R1006, R1007 Resistor, Chip ERHZ0003801 MCR01MZP5J5R1 5.1OHM 5% 1/16W 1005 R/TP -ROHM.
6 U1000 IC, RFTransceiver, 3G EUSY0344001 RTR6285 1.8VTO3V, 2.7VTO3V 500mW QFN R/TP 68P
QUALCOMM INCORPORATED.
6 U700 IC, Over VoltageProtection EUSY0374601 MAX14528 MAX14528, TDFN, 8, R/TP, Programmable
OVP MAXIM INTEGRATED PRODUCTS INC.
6 U802 IC, LDO VoltageRegulator EUSY0407101
BU28TD4WNVX SSON004, 4, R/TP, 2.8V 150mA SingleLDO, IC, LDO Voltage RegulatorIC, LDO Voltage RegulatorROHM.
11. EXPLODED VIEW & REPLACEMENT PART LIST
- 30� - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level Location No. Description PartNumber Spec Remark
6
CN1,CN2,CN3,CN4,CN5,CN6,CN7,CN8
Clip MCGY0003801 COMPLEX LG-KH3900 KTF ZZ:Without Color -
6 R201 Wire Pad, Open SAFO0000501 AX3100 ATL SV_SHIPBACK, MAIN, A, 0OHM_1005_DNI
6 FL1004 Filter, Duplexer,DCN SDDY0005101 B7671 881500000 869 to 894 836500000 824 to 849 2.7
2.1 2.5x2.0x0.68 DUAL SMD R/TP - EPCOS PTE LTD.
6 FL1003 Filter, Duplexer,IMT SDMY0003001
B7697 2140000000 2112.4 to 2167.6 1950000000 1922.4to 1977.6 2.2 1.8 2.5x2.0x0.89 DUAL SMD R/TP - EPCOSPTE LTD.
6 FL1001 Filter, Separator SFAY0012501 D5017 1.5 35 35 , dB, dB, dB, dB, 4532, FEM/SP9T,Supply voltage(2.5V min, 3.2V max) EPCOS PTE LTD.
6 FB1000,FB1001 Filter, Bead SFBH0000903 HB-1M1005-601JT 600 ohm 1.0*0.5*0.5 25% 0.6 ohm
0.3A SMD R/TP 2P 0 CERATECH CORPORATION
6R2,
R335,R4
PCB ASSY,MAIN, PADSHORT
SAFP0000401 LG-LU3000 LGTBK, MAIN, A,
6 FL700 Filter, EMI/Power SFEY0015301 NFM18PC104R1C3 ESD/EMI 0HZ 0.1uF 0H SMD R/TPMURATA MANUFACTURING CO., LTD.
6 FL1006 Filter, Saw SFSY0028101 SAFEB1G95KA0F00 1950 1.4*1.1*0.6 SMD R/TP 5PMURATA MANUFACTURING CO., LTD.
6 L2, L3,L4, L5
Inductor,Multilayer, Chip ELCH0001430 LL1005-FHLR10J 100NH 5% - 150mA 2.2OHM 1.03GHZ
10 SHIELD NONE 1.0X0.5X0.5MM R/TP TOKO, INC.
6 FL1002 Filter, Saw SFSY0028201 SAFEB2G14FB0F00 - - - - 2P MURATAMANUFACTURING CO., LTD.
6 FL1005 Filter, Saw SFSY0029901 SAFEB836MAL0F00 836.5 1.4X1.1X0.6 SMD R/TP 5PMURATA MANUFACTURING CO., LTD.
6 FL1000 Filter, Saw SFSY0038901
SAFEB1G57KB0F00 SAFEB1G57KB0F00, 1575.42 MHz,1.4*1.1*0.6, SMD, 1574.22M~1576.62M, IL 0.8, 5pin, U-U,50-50, GPS LOW LOSS MURATA MANUFACTURINGCO., LTD.
6 U1002 IC, PowerAmplifier SMPY0019101 SKY77336 SKY77336, dBm, %, A, dBc, dB, 5x5, SMD,
Polar Edge for QCT SKYWORKS SOLUTIONS INC.
11. EXPLODED VIEW & REPLACEMENT PART LIST
- 303 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level Location No. Description PartNumber Spec Remark
6 U1003 IC, PowerAmplifier SMPY0022701
SKY77701 28.25 dBm, 40 %, 10 mA, -40 dBc, 27 dB,3.0*3.0*1.0, SMD, WBAND 1, LBAND 1, CPL, 3 MODE,3.2V~4.2V, 28.25dBm, 1, SMD, R/TP, 10, 3.2V~4.2V,28.25dBm, 1, SMD, R/TP, 10 SKYWORKS SOLUTIONSINC.
6 U1004 IC, PowerAmplifier SMPY0023801
SKY77704-15 28.25 dBm, 40 %, 10 mA, -40 dBc, 27 dB,3.0*3.0*1.0, SMD, DCN, WBAND 5, LBAND 5, 8PCL6, 3MODE, 3.2V~4.2V, 28.25dBm, 1, SMD, R/TP, 10PINSKYWORKS SOLUTIONS INC.
6 U1001 IC, RF Amplifier SMZY0025501 RF2815 3.3*2.1*1.0, FILTER+GPS LNA+FILTERMODULE, GPS, RF MICRO DEVICES INC
6 C816 Capacitor,Ceramic, Chip ECCH0007805
CL05A106MQ5NUNC 10uF 20% 6.3V X5R -55TO+85C1005 R/TP - SAMSUNG ELECTRO-MECHANICS CO.,LTD.
6
C1072,C702,C800,C801,C803
Capacitor,Ceramic, Chip ECCH0000115 MCH155A220JK 22pF 5% 50V NP0 -55TO+125C 1005
R/TP - ROHM Semiconductor KOREA CORPORATION
6 C1031, C1041 Capacitor,Ceramic, Chip ECCH0000143 MCH155CN102KK 1nF 10% 50V X7R -55TO+125C 1005
R/TP - ROHM Semiconductor KOREA CORPORATION
6
C103,C104,C105,C106,C207
Capacitor,Ceramic, Chip ECCH0000198
CL05A225MQ5NSNC 2.2uF 20% 6.3V X5R -55TO+85C1005 R/TP . SAMSUNG ELECTRO-MECHANICS CO.,LTD.
6 C1 Capacitor,Ceramic, Chip ECCH0000155
MCH153CN103KK 10nF 10% 16V X7R -55TO+125C1005 R/TP - ROHM Semiconductor KOREACORPORATION
6 C302,C303
Capacitor,Ceramic, Chip ECCH0002001 C1005JB0J104KT000F 0.1uF 10% 6.3V Y5P -30TO+85C
1005 R/TP - TDK CORPORATION
6 C1033,C53
Capacitor,Ceramic, Chip ECCH0005604
GRM188R60J106M 10000000 pF, 6.3V, M, X5R, TC,1608, R/TP, 0.8 mm MURATA MANUFACTURING CO.,LTD.
6 C101,C109
Capacitor,Ceramic, Chip ECCH0004904 GRM155R60J105K 1uF 10% 6.3V X5R -55TO+85C 1005
R/TP - MURATA MANUFACTURING CO., LTD.
6
C1024,C1034,C1035,C1091,
C57
Capacitor,Ceramic, Chip ECCH0007802
CL10A475KP8NNNC 4.7uF 10% 10V X5R -55TO+85C1608 R/TP - SAMSUNG ELECTRO-MECHANICS CO.,LTD.
6 C1070 Capacitor,Ceramic, Chip ECCH0007803
CL10A106MP8NNNC 10uF 20% 10V X5R -55TO+85C1608 R/TP 0.8MM SAMSUNG ELECTRO-MECHANICSCO., LTD.
11. EXPLODED VIEW & REPLACEMENT PART LIST
- 304 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level Location No. Description PartNumber Spec Remark
6
C112,C113,C114,C117,C638
Capacitor,Ceramic, Chip ECCH0009101 C0603X5R0J104KT00NN 0.1uF 10% 6.3V X5R -
55TO+85C 0603 R/TP - TDK CORPORATION
6 C825 Capacitor,Ceramic, Chip ECCH0007804
CL05A225MP5NSNC 2.2uF 20% 10V X5R -55TO+85C1005 R/TP 0.5MM SAMSUNG ELECTRO-MECHANICSCO., LTD.
6 C216 Capacitor,Ceramic, Chip ECCH0009103 C0603C0G1H101JT00NN 100pF 5% 50V X7R -
55TO+125C 0603 R/TP - TDK CORPORATION
6 C640 Capacitor,Ceramic, Chip ECCH0009106 C0603X7R1C103KT 10nF 10% 10V X7R -55TO+125C
0603 R/TP - TDK CORPORATION
6
C321,C710,C711,C712,C713
Capacitor,Ceramic, Chip ECCH0009226 GRM0335C1E390J 39pF 5% 25V X7R -55TO+125C 0603
R/TP - MURATA MANUFACTURING CO., LTD.
6 C35 Capacitor,Ceramic, Chip ECCH0009107
GRM033R71C222K 2.2nF 10% 16V X7R -55TO+125C0603 R/TP - KOREA MURATA ELECTRONICS CO.LTD.
6 C320 Capacitor,Ceramic, Chip ECCH0009203 GRM033R60J333K 33nF 10% 6.3V X5R -55TO+85C
0603 R/TP - MURATA MANUFACTURING CO., LTD.
6
C111,C4,
C471,C639
Capacitor,Ceramic, Chip ECCH0017301
CL03A105MQ3CSNH 0.000001F 20% 6.3V X5R -45TO+85C 0603 R/TP - SAMSUNG ELECTRO-MECHANICS CO., LTD.
6 C3, C4 Capacitor,Ceramic, Chip ECCH0010501 GRM1555C1H7R5D 7.5pF C0G TYPE(No X7R) MURATA
MANUFACTURING CO., LTD.
6 C434,C749
Capacitor,Ceramic, Chip ECCH0017501
CL10A226MQ8NRNE 22uF 20% 6.3V X5R -55TO+85C1608 R/TP 0.8MM SAMSUNG ELECTRO-MECHANICSCO., LTD.
6 C205,C212
Capacitor,Ceramic, Chip ECZH0003103 GRM36X7R104K10PT 100nF 10% 10V X7R -55TO+125C
1005 R/TP - MURATA MANUFACTURING CO., LTD.
6 C311 Capacitor, TA,Conformal ECTH0001903
F980J226MMA 22 uF, 6.3V, M, L_ESR, 1608, R/TPNICHICON CORPORATION, EAST JAPAN SALESOFFICE
6 C110 Capacitor, TA,Conformal ECTH0005203 TCTP1A336M8R , [empty] , [empty] , , [empty] , , [empty] ,
[empty] , [empty] , [empty] ROHM.
6 C8544 Capacitor,Ceramic, Chip ECZH0000846 C1005C0G1H8R2CT000F 8.2pF 0.25PF 50V NP0 -
55TO+125C 1005 R/TP - TDK KOREA COOPERATION
6 C708,C709
Capacitor,Ceramic, Chip ECZH0001217 GRM155R60J474K 470nF 10% 6.3V X5R -25TO+70C
1005 BK-DUP - MURATA MANUFACTURING CO., LTD.
11. EXPLODED VIEW & REPLACEMENT PART LIST
- 305 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level Location No. Description PartNumber Spec Remark
6 C206 Capacitor,Ceramic, Chip ECCH0017601
CL05A475MQ5NRNC 4.7uF 20% 6.3V X5R -55TO+85C1005 R/TP 0.5MM SAMSUNG ELECTRO-MECHANICSCO., LTD.
6 C1013, C1052 Capacitor,Ceramic, Chip ECZH0025916 GRM0335C1E330J 33pF 5% 25V NP0 -55TO+125C 0603
R/TP - MURATA MANUFACTURING CO., LTD.
6
C25,C301,C304,C322
Capacitor,Ceramic, Chip ECZH0025917 GRM0335C1E470J 47pF 5% 25V NP0 -55TO+125C 0603
R/TP - MURATA MANUFACTURING CO., LTD.
6
C30,C31,
C312,C314,C32,C33,C34,
C429,C437,C741,C742,C753
Capacitor,Ceramic, Chip ECZH0025920 GRM033R71C102K 1nF 10% 16V X7R -55TO+125C
0603 R/TP - MURATA MANUFACTURING CO., LTD.
6R2,
R335,R4
PCB ASSY,MAIN, PADSHORT
SAFP0000401 LG-LU3000 LGTBK, MAIN, A,
6 R702 Resistor, Chip ERHZ0000265 MCR01MZP5F3003 300KOHM 1% 1/16W 1005 R/TP -ROHM.
6 D701 Diode, Switching EDSY0011901 SDB310Q 340mV 30V 200mA 1A 0SEC 150mW EMD2R/TP 2P 1 AUK CORP
6D301,D302,D702
Diode, Switching EDSY0010501 KDS114E 900mV 30V 100mA 1A 0SEC 100mW ESCR/TP 2P 1 KEC CORPORAITION
6 ZD701 Diode, TVS EDTY0008610 PLW0501H-LF 800mV 6V 12.5V 16A 250W SOD523R/TP 2P 1 PROTEK DEVICES INC.
6D201,D202,D204
Diode, TVS EDTY0010101 ESD9B5.0ST5G ESD9B5.0ST5G, SOD-923, 5 V, 300mW, R/TP, 15pF SCG HONG KONG SAR LTD.
6 Q3 FET EQFP0011101
SiA431DJ PowerPAK SC-70-6L-Single, 3.5 W, -20 V, -12A, R/TP, P-CHANNEL, MOSFET, -20 V, +- 8V, -12 A, 0.07OHM, 3.5W, SC70, R/TP, 6P VISHAYINTERTECHNOLOGY ASIA PTE LTD
6 L703,L704
Inductor, WireWound, Chip ELCP0008004
MIP2016D4R7M 4.7UH 30% 0V 900mA 0.16OHM 0HZ 0SHIELD 2.0X1.6X1.0MM NONE R/TP FDKCORPORATION.
6 L8055 Inductor, WireWound, chip ELCP0008001 MIP2520D4R7M 4.7UH 30% 0V 1.1A 0.11OHM 0HZ 0
SHIELD 2.5X2X1MM NONE R/TP FDK CORPORATION.
11. EXPLODED VIEW & REPLACEMENT PART LIST
- 306 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level Location No. Description PartNumber Spec Remark
6 L803 Inductor, WireWound, Chip ELCP0008007 MIPS2520D3R3M 3.3UH 30% - 1A 0.12OHM - - SHIELD
2.5X2X1MM NONE R/TP FDK CORPORATION.
6 L701,L702
Inductor, WireWound, chip ELCP0008012 VLS252012T-4R7MR81 VLS252012T-4R7MR81, 4.7 uH,
M, 2.5*2*1.2, R/TP, Coil TDK CORPORATION
6 L700 Inductor, WireWound, Chip ELCP0011901
CPI2012NHL2R2MT 2.2UH 20% - 800mA 0.25OHM - -SHIELD 2X1.25X1MM NONE - SAMWHA CAPACITORCO, LTD.
6 CN700 connector, I/O ENRY0008701 HSMU-5SB-24DR2 5, mm, ETC HAN SHIN TERMINALCO., LTD.
6 Q1, Q2 TR, Bipolar EQBP0009901 QST4 PNP -6V -15V -12V -6A -0.1A 680 500mW TS6R/TP 6P ROHM.
6 R310 Resistor, Chip ERHY0000104 MCR01MZP5F49R9 49.9OHM 1% 1/16W 1005 R/TP -ROHM.
6 R16 Resistor, Chip ERHY0000105 MCR01MZP5F51R0 51OHM 1% 1/16W 1005 R/TP -ROHM.
6 R722 Resistor, Chip ERHY0000161 MCR01MZP5F2003 200KOHM 1% 1/16W 1005 R/TP -ROHM.
6 R14 Resistor, Chip ERHY0008207 RC1005F470CS 47OHM 1% 1/16W 1005 R/TP -SAMSUNG ELECTRO-MECHANICS CO., LTD.
6 R711 Resistor, Chip ERHY0009303 MCR006YZPF1002 10KOHM 1% 1/20W 0603 R/TP -ROHM.
6 R8521 Resistor, Chip ERHY0009307 MCR006YZPF4703 470KOHM 1% 1/20W 0603 R/TP -ROHM.
6 R1024 Resistor, Chip ERHY0009311 MCR006YZPF51R0 51OHM 1% 1/20W 0603 R/TP -ROHM.
6R306,R315,R316
Resistor, Chip ERHY0009503 MCR006YZPJ101 100OHM 5% 1/20W 0603 R/TP -ROHM.
6 R703,R704 Resistor, Chip ERHY0009539 MCR006YZPF20R0 20OHM 1% 1/20W 0603 R/TP -
ROHM.
6
R1009,R1010,R1011,
R1012, R1020
Resistor, Chip ERHY0009504 MCR006YZPJ102 1KOHM 5% 1/20W 0603 R/TP -ROHM.
6 R401 Resistor, Chip ERHY0009505 MCR006YZPJ103 10KOHM 5% 1/20W 0603 R/TP -ROHM.
6 R724,R725 Resistor, Chip ERHY0009550 MCR006YZPF4702 47KOHM 1% 1/20W 0603 R/TP -
ROHM.
11. EXPLODED VIEW & REPLACEMENT PART LIST
- 307 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level Location No. Description PartNumber Spec Remark
6
R104,R105,R402,R403,R623
Resistor, Chip ERHY0009526 MCR006YZPJ472 4.7KOHM 5% 1/20W 0603 R/TP -ROHM.
6 R709 Resistor, Chip ERHY0009527 MCR006YZPJ473 47KOHM 5% 1/20W 0603 R/TP -ROHM.
6 R15 Resistor, Chip ERHY0009536 MCR006YZPF1003 100KOHM 1% 1/20W 0603 R/TP -ROHM.
6 R8522, R8523 Resistor, Chip ERHY0009586 MCR006YZPF2201 2.2KOHM 1% 1/20W 0603 R/TP -ROHM.
6 R314 Resistor, Chip ERHY0009592 MCR006YZPJ202 2KOHM 5% 1/20W 0603 R/TP -ROHM.
6 R308 Resistor, Chip ERHY0024201 RC1005F6041CS 6.04KOHM 1% 1/16W 1005 R/TP -SAMSUNG ELECTRO-MECHANICS CO., LTD.
6 R8519, R8520 Resistor, Chip ERHY0024601 RC0603J151CS 150OHM 5% 1/20W 0603 R/TP -SAMSUNG ELECTRO-MECHANICS CO., LTD.
6 R619,R622 Resistor, Chip ERHZ0000204 MCR01MZP5F1003 100KOHM 1% 1/16W 1005 R/TP -
ROHM.
6 R705 Resistor, Chip ERHZ0000243 MCR01MZP5F2201 2.2KOHM 1% 1/16W 1005 R/TP -ROHM.
6 R717 Resistor, Chip ERHZ0000288 MCR01MZP5F4703 470KOHM 1% 1/16W 1005 R/TP -ROHM.
6 R720 Resistor, Chip ERHZ0000318 MCR01MZP5F8062 80.6KOHM 1% 1/16W 1005 R/TP -ROHM.
6 R301,R600 Resistor, Chip ERHZ0000405 MCR01MZP5J103 10KOHM 5% 1/16W 1005 R/TP -
ROHM.
6 R706,R707 Resistor, Chip ERHZ0000437 MCR01MZP5J202 2KOHM 5% 1/16W 1005 R/TP -
ROHM.
6 R701 Resistor, Chip ERHZ0000222 MCR01MZP5F1503 150KOHM 1% 1/16W 1005 R/TP -ROHM.
6R101,R102,R203
Resistor, Chip ERHZ0000443 MCR01MZP5J222 2.2KOHM 5% 1/16W 1005 R/TP -ROHM.
6 R309 Resistor, Chip ERHZ0000463 MCR01MZP5J330 33OHM 5% 1/16W 1005 R/TP -ROHM.
6 R800 Resistor, Chip ERHZ0000485 MCR01MZP5J472 4.7KOHM 5% 1/16W 1005 R/TP -ROHM.
6 R100 Resistor, Chip ERHZ0000488 MCR01MZP5J4R7 4.7OHM 5% 1/16W 1005 R/TP -ROHM.
11. EXPLODED VIEW & REPLACEMENT PART LIST
- 308 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level Location No. Description PartNumber Spec Remark
6 C706,C707
Capacitor,Ceramic, Chip ECCH0009201
GRM033R60J473KE19D 47nF 10% 6.3V X5R -55TO+85C 0603 R/TP - MURATA MANUFACTURINGCO., LTD.
6 R719 Resistor, Chip ERHZ0000537 MCR01MZP5F6803 680KOHM 1% 1/16W 1005 R/TP -ROHM.
6 R713 Resistor, Chip ERHZ0003901 RC2012FR100CS 0.1OHM 1% 1/8W 2012 R/TP -SAMSUNG ELECTRO-MECHANICS CO., LTD.
6 R715 Resistor, Chip ERHZ0004201 RC1005F1213CS 121KOHM 1% 1/16W 1005 R/TP -SAMSUNG ELECTRO-MECHANICS CO., LTD.
6 U301 IC, MCP, NOR EUSY0216301 NC7SV00P5X_NL SC70 , 5 PIN, R/TP , Single 2-InputNAND Gate FAIRCHILD SEMICONDUCTOR
6 U1005 IC, Fuel Gauge EUSY0242303MAX17040G DFN, 8, R/TP, Fuel gauge, IC, CMOSIC,CMOS - - DFN R/TP 8P - MAXIM INTEGRATEDPRODUCTS INC.
6 U704 IC, PMIC EUSY0342201 PM7540 -0.5~18 N/A 0W CSP R/TP 137P - QUALCOMMINCORPORATED.
6 IC1 IC, MUIC EUSY0372001TS5USBA33402YZPR TS5USBA33402, MUIC WCSPR/TP 20P TEXAS INSTRUMENTS KOREA LTD,HONGKONG BRANCH.
6 U302IC, DigitalBasebandProcessor, 3G
EUSY0392302 MSM7227 0VTO0V 0W 560P - BGA R/TP 560PQUALCOMM INCORPORATED.
6 U701 IC, Audio SubSystem EUSY0403901 WM9093ECS/R 1.71~5.5V 0W WLCSP R/TP 20P -
WOLFSON MICROELECTRONICS PLC
6 U405 IC, LDO VoltageRegulator EUSY0407201
BU33TD4WNVX SSON004, 4, R/TP, 3.3V 150mA SingleLDO, IC, LDO Voltage RegulatorIC, LDO Voltage RegulatorROHM.
6 U801 IC, AccelerationSensor EUSY0407801
KR3DM LGA16, 16, R/TP, 3-Axis G-Sensor, IC, A/DConverterIC, A/D Converter - LGA R/TP 16P - STMICROELECTRONICS
6 U300 IC, Flip Flop EUSY0408201 74LVC1G79GM 1.65~5.5V - D FLIP-FLOP SOT R/TP 6P -STC CORP.
6 X300 Oscillator,VCTCXO EXSK0008901 KT3225L19200DCW28RA0 19.2MHZ 2PPM 2.8V
0.0x0.0x0.0MM NONE SMD R/TP KYOCERA CORP.
6 U400 MCP EUSY0430901
MT29C8G96MAZAPDJA-5 IT FBGA , 137 , ETC , 1.8V8G(LB/512Mx16)NAND+4G(DDR400/16Mx4x32*2_2CS)DRAM , ; , IC, MCP MICRON SEMICONDUCTOR ASIAPTE LTD.
6 R801 Resistor, Chip ERHY0011601 MCR01MZP5F1102 11KOHM 1% 1/16W 1005 R/TP -ROHM.
6 X800 Oscillator, TCXO EXST0001901 TG-5010LH-87N 26MHZ 2.5PPM 2.8V 32.0x25.0x10.0MM- SMD R/TP EPSON TOYOCOM CORP
11. EXPLODED VIEW & REPLACEMENT PART LIST
- 309 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level Location No. Description PartNumber Spec Remark
6 VA305 Varistor SEVY0008101 EVLC5S01033 EVLC5S01033, 5.5 V, , SMD , 0603AMOTECH CO., LTD.
6 X700 Crystal EXXY0018701 FC-135(12.5PF, +-20PPM) 32.768KHZ 20PPM 12.5PF32*15 SMD R/TP SEIKO EPSON CORP
6 R12, R4PCB ASSY,MAIN, PADOPEN
SAFO0000401 AX3100 ATL SV_SHIPBACK, MAIN, A, 0OHM DNI
6 VA700 Varistor SEVY0003601 ICVL0505101V150FR 5.6V 0% 60F 1.0*0.5*0.55 NONESMD R/TP INNOCHIPS TECHNOLOGY
6
VA300,VA301,VA302,VA303,VA304
Varistor SEVY0007902 ICVS0305500FR ICVS0305500FR, 5.6 V, M , SMD , 0603SIZE INNOCHIPS TECHNOLOGY
6 FB8501 Filter, Bead SFBH0008101BLM15AG601SN1D 600 ohm 1.0X0.5X0.5 25% 0.6 ohm0.3A SMD R/TP 2P 0 MURATA MANUFACTURING CO.,LTD.
6 FB701 Filter, Bead SFBH0009801 HH-1M1005-601JT_1 600 ohm 1.0X0.5X0.5 25% 0.6 ohm0.5A SMD P/TP 2P 0 CERATECH CORPORATION
6 U800 Module, WLAN SMZY0024901 LBEH19UNBC-338 2.3VTO5.5V LGA 54P 9.0x7.8x1.3MMMURATA MANUFACTURING CO., LTD.
11. EXPLODED VIEW & REPLACEMENT PART LIST
- 310 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
by SBOM standard on GCSC
Level Location No. Description PartNumber Spec Remark
2 SBPL00RechargeableBattery, LithiumIon
SBPL0102103 LGIP-590F-TO-DCM 3.7 V, 1350 mAh, 1 CELL,PRISMATIC, PRISMATIC, BLACK, TOCAD DONGHWA
2 MBM087201 Card, Warranty MBM63220002 COMPLEX L03C.ANTTBK ZZ:Without Color micro SDWarranty
2 MBM087200 Card, Warranty MBM63220301 COMPLEX L04C.ANTTBK ZZ:Without Color -
2 AFN053800 Manual Assembly,Operation - AFN75293501 L04C.ANTTBK ZZ:Without Color -
3 MBM062602 Card, QuickReference MCDD0031510 COMPLEX L-04B NTTBK ZZ:Without Color PRINTING,
(empty), , , , ,
3 MBM062604 Card, QuickReference MBM63296001 COMPLEX L03C.ANTTBK ZZ:Without Color -
3 MBM062603 Card, QuickReference MCDD0031511 COMPLEX L04C.ANTTBK ZZ:Without Color PRINTING,
(empty), , , , ,
3 MFL053802 Manual, Operation MFL66994405 COMPLEX L04C.ANTTBK ZZ:Without Color -
3 MFL053801 Manual, Operation MFL66994404 COMPLEX L04C.ANTTBK ZZ:Without Color -
3 MFL053800 Manual, Operation MFL66994401 COMPLEX L04C.ANTTBK ZZ:Without Color -
2 EBX000000 Accessory,Gender SGDG0002901 BRHA-1010C-05A - - BARONICS CO., LTD.
2 EAB010200 Earphone, Stereo SGEY0007603
HC-MYO-LG058 HC-MYO-LG058, 20mW, 16Ohm, 99dB,1KHZ, 1mW, 65dB 10KHZ, 104dB 100KHZ3.5 L TYPESTEREO 4POLE PLUG, Deco canal(white), Earphone, SteI-SOUND CO, LTD
2 EBX000001 Accessory, DataCable SGDY0019301 KCA-ET-8-0210 , 0.5M, BLACK, Without LG Logo, Micro
USB Data Cable, N KSD CO., LTD
11.3 Accessory Note: This Chapter is used for reference, Part order is ordered