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IntroductionThis document describes how to use the evaluation board in order to check FDA803D and FDA903D devices’ performance; forany other information and deeper details please refer to the FDA803D and FDA903D datasheets.
Evaluation boards for FDA803D and FDA903D power amplifiers
UM2447
User manual
UM2447 - Rev 1 - March 2019For further information contact your local STMicroelectronics sales office.
www.st.com
http://www.st.com
1 Purpose
The purpose of this document is to describe the FDA803D (and FDA903D) Stand Alone Demo Module for SlugDown package.
Table 1. Board summary
Order Code Device supported
EVAL-FDA803D-SA FDA803D
EVAL-FDA903D-SA FDA903D
It contains the module description, the schematic, the bill of materials and the board layout of the followingmodule:
6038-443.16In the following chapters it will be referred as 443 module.
UM2447Purpose
UM2447 - Rev 1 page 2/12
2 Warning
This evaluation board/kit is intended for the following uses:• Engineering development• Demonstrations• Evaluation purposes only
and is not considered by ST Microelectronics (ST) to be a finished end-product fit for general consumer use.The people who handle the product(s) must have electronics training and observe good engineering standardpractices.As such, the goods being provided are not intended to be complete in terms of required design-, marketing-,and/or manufacturing-related protective considerations, including product safety and environmental measurestypically found in end products that incorporate such semiconductor components or circuit boards.This evaluation board/kit does not fall within the purpose of the European Union directives regardingelectromagnetic compatibility, restricted substances (RoHS), recycling (WEEE), FCC, CE or UL, and thereforemay not meet the technical requirements of these directives or other related directives.
UM2447Warning
UM2447 - Rev 1 page 3/12
3 Module description
This board is a 1x45W class D amplifier based on the ST FDA803D (or FDA903D) and is intended to demonstratethe device’s capabilities.
Figure 1. 6038-443.16 - top view
Figure 2. 6038-443.16 with Coilcraft XAL4040 - bottom view
Note: The output LC filter in this module can be assembled with different values and kind of coils and capacitors. Bydefault it is assembled for a 14.4V application with ferrite coils that are a good compromise consideringperformances, price and availability that allow to drive 4 ohm.
3.1 HW Configuration and Control SW
3.1.1 Connectors and connectionsThe 443 module embeds a Stand Alone connection which is different from the previous power amplifiers boardsdeveloped.Based on that:
UM2447Module description
UM2447 - Rev 1 page 4/12
• The Voltage Supply to the power amplifier can be provided through J3 connector (Vbat 3.3–18V, GND) withthe chance to use the sense technique close to the device through the VCC/GND test points;
• The Feedback default configuration including the output L-C low-pass filter, allowing superior frequencyresponse linearity and lower distortion. Furthermore, there is also the chance to use the FDA803D (orFDA903D) as traditional class D amplifiers with the feedback directly connected to the PWM output (beforeL-C filter stage). Both working modes can be selected mounting or not the following resistors:
Table 2. Working mode selection
R5, R6 R7, R8
Traditional feedback 0 Ω DO NOT MOUNT
Feedback after the demodulation filter DO NOT MOUNT 0 Ω
• The Device State and Address Selection of the power amplifier can be set through the ENABLE pins ENx( x = 1, 2, 3, 4) on J10 connector. With an open connection the ENx is set to high logical value and through ajumper it is possible to pull down (to GND) the ENx desired thus setting the low logical value. In this way it ispossible to select different I2C addresses (up to 8) or to configure the device in 4 different legacy modesaccording to the Data Sheet table;
• The HW Mute of the power amplifier can be set through the MUTE pin on J10 connector. With an openconnection the MUTE pin is set to high value (the amplifier is in play state) and through a jumper it ispossible to pull down (to GND) the MUTE pin thus setting the low value and put in mute state the amplifier;
• The Output Channel of the power amplifier can be monitored/analyzed through the J1 connector (CH+/CH-);
3.1.2 How to manage the I2C
3.1.2.1 I2C HW & SW control
For the programmability of a “Stand Alone module” in terms of I2C settings, there is the J10 connector on 424stand alone module (I2C SCL, I2C SDA, GND).GUI is available and it is running on a Windows PC if the user adopts ST interface board (description available inthe dedicated user manual)For the GUI description, please refer to its own manuals.There are other possibilities to control the device in terms of I2C settings (e.g. FTDI, etc) but the SW controlneeds to be implemented by the final user.
3.1.2.2 I2S HW & SW controlThe I2S signals (I2S SCL, I2S WS, I2S SDA1) of 424 “Stand Alone module” can be provided through the J10connector with different HW configurations:1. Directly from Audio Precision instruments:
a. PSIA controller (AP 2700 series)b. Digital Serial Transmitter (APx5xx series)
2. ST interface board (description available in the dedicated user manual)
UM2447HW Configuration and Control SW
UM2447 - Rev 1 page 5/12
4 Schematic, BOM and layouts
4.1 Schematic
Figure 3. Schematic
C191uF
C18100nF
VCC1VCC
TP2
C251uF
C24100nF
C2033nF
C2133pF
EN4
R9
1K
R10
Mur
ata
PRG
18BB
470M
B1RB
D1MMSZ4684T1
I2S_SDA1
I2C_SCL
I2S_SCL
I2S_WS
I2S_TEST
CD/DIAG
I2C_SDA
DVdd
EN3
EN2
EN1
AVdd
VCC2
VCC1
C174.7uF
C15100pF
DGSVR
D1V8SVR
MUTEC75nF
C8
4.7uF
C10
100pF
SVR
A5VSVR
AGSVR
R410
C6
3.3uF 50V
C2330p
C41uF
R2 10
10uHL2
XAL5050-103MEOUT1- CH1-
R8 0R
R6 0R NMFB1-
R310
C53.3uF 50V
C1330p
C31uF
R1 10
10uHL1
XAL5050-103ME
OUT1+CH1+
R7 0R
R5 0R NM FB1+
TAB 1
GNDM 2
VCCM 3
OUTM 4
OUTM 5
FBM 6
NC 7
DGND 8
DVDD 9
ENABLE 1 10
ENABLE 2 11
ENABLE 3 12
ENABLE 4 13
THSENS 14
CDDIAG 15
NC 16
D1V8SVR 17
DGSVR 18I2CDATA19I2CCLK20I2STEST21I2SDATA22I2SCLK23I2SWS24AGND25AVDD26
AGSVR28
A5VSVR27
SVR29HWMUTE30FBP31OUTP32OUTP33NC34
GNDP36
VCCP35
U1
FDA803
TP4
THS
2
1
J3
EN1
EN2
EN3
R 13
10K
R11
10K
C27
100pF
R15
10K
R12
10K
3V3
R 14
10K
STD DONGLE CONNECTOR
CH1+
CH1-2
1
J1
EN4
C28470uF 50V
POWER STAGE
S 2S 3
G4
D5D6D7D8
S 1
Q1 STS10P4LLF6
R1722K
R1622K
C261uF
L3
4.7uH
D3SM6T36CAY
C234.7uF
C224.7uF
C9
10nF
C1610nF
C11
100pF
C12
10nF
C14
100pF
C13
10nF
VCC2
3V3TP3
GNDTP1
I2S_SCL
I2S_WS
I2S_SDA1
I2S_SDA2
2
4
6
8
10
1
3
5
7
9
11 12
13 14
15 16
17 18
19 20
21 22
23 24
25 26
27 28
29 30
31 32
33 34
35 36
37 38
39 40
J10
20x2 p2.54mm M Horiz.
CD/DIAG
I2C_SCL
Vbatt
I2C_SDA
Vbatt
AVdd
BLM3
BLM18BA220SN1
BLM2
BLM18BD102SN1
DVdd
I2S_TEST
D2MMBZ5244B
MUTE
Vbatt
GNDTP4
P1 P2 P3 P4 P5
GADG1707181240PS
(exposed pad)PowerSSO-36
SLUG DOWN
Jumper Jumper Jumper Jumper Jumper
SPEAKERS CONNECTOR
4.2 Bill of materials
Table 3. Bill of materials
Comment Description Designator Package Voltage rate Quantity
0R Surface mount chip resistor R7, R8 0603 2
0R NM Surface mount chip resistor R5, R6 0603 2
20x2 p2.54mm M Horiz. Header Male, Dual row, SMD,Horiz. J10 1
4.7 µH Inductor L3 1
BLM18BA220SN1 Inductor BLM3 0603 1
BLM18BD102SN1 Inductor BLM2 0603 1
UM2447Schematic, BOM and layouts
UM2447 - Rev 1 page 6/12
Comment Description Designator Package Voltage rate Quantity
FDA803 Fully digital class D amplifier1ch U1 PSSOP36 1
Jumper Top Jumper Socket WithHandle red gold p127 P1, P2, P3, P4, P5 5
MC000034 Terminal Block 2positionp5.08mm J1, J3 2
MMBZ5244B 3.3V Zener Diode D2 1
MMSZ4684T1 3.3V Zener Diode D1 1
Murata PRG18BB470MB1RB Surface mount chip resistor R10 0603 1
SM6T36AY Transil D3 1
STS10P4LLF6 Q1 1
1K Surface mount chip resistor R9 0805 1
1µF MLCC X7R Capacitor C3, C4, C19, C25, C26 0805 50 V 5
3.3 µF 50V MLCC X7R Capacitor C5, C6 1210 50 V 2
4.7 µF MLCC X7R Capacitor C22, C23 2020 100 V 2
4.7 µF MLCC X7R Capacitor C8, C17 0805 25 V 2
5 nF MLCC X7R Capacitor C7 0603 50 V 1
10 Surface mount chip resistor R1, R2, R3, R4 1210 4
10 kΩ Surface mount chip resistor R11, R12, R13, R14,R15 0603 5
10 nF MLCC X7R Capacitor C9, C12, C13, C16 0603 25 V 4
XAL5050-103ME Inductor L1, L2 2
22 kΩ Surface mount chip resistor R16, R17 0603 2
33 nF MLCC X7R Capacitor C20 0603 50 V 1
33 pF MLCC X7R Capacitor C21 0603 50 V 1
100 nF MLCC X7R Capacitor C18, C24 0603 50 V 2
100 pF MLCC X7R Capacitor C10, C11, C14, C15 0603 50 V 4
100 pF MLCC X7R Capacitor C27 0603 50 V 1
330 pF MLCC X7R Capacitor C1, C2 0603 50 V 2
470 µF 50 V Alluminium Polarized CapacitorSMD C28 50 V 1
UM2447Bill of materials
UM2447 - Rev 1 page 7/12
4.3 PCB layoutsAll the useful circuitry/components for the FDA803/903, in terms of PCB space occupation, is highlighted by theblack rectangle while outside there are the power supply stage and connectors (Vbat, Out, Signal Controls I2C,I2S, Enables, Mute, CDDIAG).
Figure 4. 6038-443.16 - FDA803 (903) – Top layer and silkscreen
Figure 5. 6038-443.16 - FDA803D (903D) – Inner1 layer
Note: It is possible that some boards are produced with different marking: 6038-424.15 - FDA803 SD SA – 1.2 –101016. No differences respect to the one marked 6038-443.16 - FDA803D (903D) SD SA.
UM2447PCB layouts
UM2447 - Rev 1 page 8/12
Figure 6. 6038-443.16 - FDA803D (903D) – Inner2 layer
Figure 7. 6038-443.16 - FDA803D (903D) – Bottom layer and silkscreen
UM2447PCB layouts
UM2447 - Rev 1 page 9/12
Revision history
Table 4. Document revision history
Date Version Changes
20-Mar-2019 1 Initial release.
UM2447
UM2447 - Rev 1 page 10/12
Contents
1 Purpose . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2
2 Warning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3
3 Module description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4
3.1 HW Configuration and Control SW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3.1.1 Connectors and connections. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3.1.2 How to manage the I2C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
4 Schematic, BOM and layouts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6
4.1 Schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
4.2 Bill of materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
4.3 PCB layouts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
UM2447Contents
UM2447 - Rev 1 page 11/12
IMPORTANT NOTICE – PLEASE READ CAREFULLY
STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to STproducts and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. STproducts are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement.
Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design ofPurchasers’ products.
No license, express or implied, to any intellectual property right is granted by ST herein.
Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.
ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or servicenames are the property of their respective owners.
Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
© 2019 STMicroelectronics – All rights reserved
UM2447
UM2447 - Rev 1 page 12/12
http://www.st.com/trademarks
1 Purpose2 Warning3 Module description3.1 HW Configuration and Control SW3.1.1 Connectors and connections3.1.2 How to manage the I2C3.1.2.1 I2C HW & SW control3.1.2.2 I2S HW & SW control
4 Schematic, BOM and layouts4.1 Schematic4.2 Bill of materials4.3 PCB layouts
Revision history