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Extremely Critical Control Environment for Next Generation
Fabrication Processes: FOUP and Loadport Unit
Mr. Bill Chiu / 邱銘乾先生Chairman & CEO Gudeng, Co Ltd
Agenda
•Technical Roadmap
• 300mm wafer carrierWINdowTM FOUP
• 450mm wafer carrierDiffuser FOUP
•Critical scenario of FOUP door opening Clean dry air curtain control in the sub-20 nm
semiconductor processes.
•Summary
100mm
1975
150mm
1982
200mm
1991
300mm
1999
450mm
2018
Technical Roadmap
2001-
300mm200mm150mm100mm
1991-1982-1975-
2001-
300mm200mm150mm100mm
1991-1982-1975-
2001-
300mm200mm150mm100mm
1991-1982-1975-
2001-
300mm200mm150mm100mm
1991-1982-1975-
Wafer yield
300mm wafer carrier WINdowTM FOUP
Unibody Shell & Intergrated Diffusor Low Humidity & ESD
Optimized carrier & material design
FM Approval
a. Integrated Design b. Specific Material
c. Excellent Performance d. Special Certification
300mm Wafer Carrier
0
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Front
Back
Left
Right
Time (sec)
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Back
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Slot_13
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0 1 2 3 4 5 6 7
Front
Back
Left
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Slot_25
Time (sec)
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Slot_1
Time (sec)
Hu
mid
ity
LCP
Liquid Crystal Plastic
300mm wafer carrier WINdowTM FOUP
uniform flow
non-uniform flow
Before
After
300mm wafer carrier WINdowTM FOUP
We integrate the diffuser into FOUP shell by flat window type. We also
use insert-molding technology to produce the FOUP. This unique design
will not influence the original SEMI spec and allows FOUP to be cleaned
easily and brings a better purge performance at next generation.
Purge Gas Inlet
It can prevent the
influence of robot.
Purge Gas Inlet
Slot_1 Slot_13 Slot_25
300mm wafer carrier WINdowTM FOUP
450mm Wafer carrier
450mm wafer carrier Diffuser type
Side view Top view
wafer
2 inlets
Purge Flow
wafer
2 inlets
Purge Flow
FOUP
Wafer
CDA Purge gas
Purge Flow
FOUP
WaferCDA Purge gas
Diffuser
Purge
Purge Flow
450mm wafer carrier Diffuser type
Oxygen concentration curve when only
diffuser purge with different flow rateWafer Carrier CDA purge w & w/o diffuser
different flow rate at slot 1 front
1. The FOUP’s relative humidity will increase when the flow rate is QP =
200(L/min) without diffuser purging. After importing diffuser into FOUP, the
relative humidity will increase when the flow rate is QP = 240(L/min). This result
shows the atmosphere’s moisture will roll into the FOUP as the purge flow rate
increase, the moisture barrier effect will decrease.
2. Because of the best flow rate of diffuser is QP =200 (L/min), we set 200, 210,
240 (L/min) as diffuser flow rate. From the result of diffuser flow rate, QP =210
(L/min) has the best oxygen barrier effect when the FOUP door opening.
Air Curtain
Warm Air
Cold AirCold Air
Warm Air
Fly Insects
Dirt / Dust
Inside
Out
side
Air Flow
Patent :103219919 ( Taipei Tech )
Air Curtain
Annular grooves
Filling holes
UPE Ventilation plate
Air Curtain
Air Curtain
• Air Curtain width 50 mm 360
(L/min)
• V = 0.29 (m/s)
332
355
288
860
805
40
432
1600
532
Unit: mm
• CFD Software : Ansys Fluent
• Turbulence modeling: Large Eddy Simulation(LES)
• Mesh size:0.01m
Mesh separately
Max X:0.0065m Max Y:0.0065m
Max Z:0.00335m
Summary
1. The WINdowTM FOUP only needs 35~40 LPM will make it
maintain at low relative humidity when the door opening. It also can
prevent the influence of robot , effectively.
2. The FOUP with diffuser has much better purging effect than
normal FOUP. It cause the uniform gas current distribution in FOUP.
3. With the different width of air curtain, the moisture barrier effect
will be different. From the result, it shows that 50mm width of air
curtain with 300(L/min) flow rate have the best barrier effect. It
makes FOUP’s inner relative humidity maintaining at 0%.