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€¦ · Ground Substrate round Via Microstrip Line Dominant transmission medium in microwave ICs Key advantage: IC interconnections have very low ground lead inductance- more

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Page 1: €¦ · Ground Substrate round Via Microstrip Line Dominant transmission medium in microwave ICs Key advantage: IC interconnections have very low ground lead inductance- more
Page 2: €¦ · Ground Substrate round Via Microstrip Line Dominant transmission medium in microwave ICs Key advantage: IC interconnections have very low ground lead inductance- more
Page 3: €¦ · Ground Substrate round Via Microstrip Line Dominant transmission medium in microwave ICs Key advantage: IC interconnections have very low ground lead inductance- more
Page 4: €¦ · Ground Substrate round Via Microstrip Line Dominant transmission medium in microwave ICs Key advantage: IC interconnections have very low ground lead inductance- more
Page 5: €¦ · Ground Substrate round Via Microstrip Line Dominant transmission medium in microwave ICs Key advantage: IC interconnections have very low ground lead inductance- more
Page 6: €¦ · Ground Substrate round Via Microstrip Line Dominant transmission medium in microwave ICs Key advantage: IC interconnections have very low ground lead inductance- more
Page 7: €¦ · Ground Substrate round Via Microstrip Line Dominant transmission medium in microwave ICs Key advantage: IC interconnections have very low ground lead inductance- more
Page 8: €¦ · Ground Substrate round Via Microstrip Line Dominant transmission medium in microwave ICs Key advantage: IC interconnections have very low ground lead inductance- more
Page 9: €¦ · Ground Substrate round Via Microstrip Line Dominant transmission medium in microwave ICs Key advantage: IC interconnections have very low ground lead inductance- more
Page 10: €¦ · Ground Substrate round Via Microstrip Line Dominant transmission medium in microwave ICs Key advantage: IC interconnections have very low ground lead inductance- more
Page 11: €¦ · Ground Substrate round Via Microstrip Line Dominant transmission medium in microwave ICs Key advantage: IC interconnections have very low ground lead inductance- more
Page 12: €¦ · Ground Substrate round Via Microstrip Line Dominant transmission medium in microwave ICs Key advantage: IC interconnections have very low ground lead inductance- more
Page 13: €¦ · Ground Substrate round Via Microstrip Line Dominant transmission medium in microwave ICs Key advantage: IC interconnections have very low ground lead inductance- more
Page 14: €¦ · Ground Substrate round Via Microstrip Line Dominant transmission medium in microwave ICs Key advantage: IC interconnections have very low ground lead inductance- more
Page 15: €¦ · Ground Substrate round Via Microstrip Line Dominant transmission medium in microwave ICs Key advantage: IC interconnections have very low ground lead inductance- more
Page 16: €¦ · Ground Substrate round Via Microstrip Line Dominant transmission medium in microwave ICs Key advantage: IC interconnections have very low ground lead inductance- more
Page 17: €¦ · Ground Substrate round Via Microstrip Line Dominant transmission medium in microwave ICs Key advantage: IC interconnections have very low ground lead inductance- more
Page 18: €¦ · Ground Substrate round Via Microstrip Line Dominant transmission medium in microwave ICs Key advantage: IC interconnections have very low ground lead inductance- more
Page 19: €¦ · Ground Substrate round Via Microstrip Line Dominant transmission medium in microwave ICs Key advantage: IC interconnections have very low ground lead inductance- more
Page 20: €¦ · Ground Substrate round Via Microstrip Line Dominant transmission medium in microwave ICs Key advantage: IC interconnections have very low ground lead inductance- more
Page 21: €¦ · Ground Substrate round Via Microstrip Line Dominant transmission medium in microwave ICs Key advantage: IC interconnections have very low ground lead inductance- more
Page 22: €¦ · Ground Substrate round Via Microstrip Line Dominant transmission medium in microwave ICs Key advantage: IC interconnections have very low ground lead inductance- more
Page 23: €¦ · Ground Substrate round Via Microstrip Line Dominant transmission medium in microwave ICs Key advantage: IC interconnections have very low ground lead inductance- more
Page 24: €¦ · Ground Substrate round Via Microstrip Line Dominant transmission medium in microwave ICs Key advantage: IC interconnections have very low ground lead inductance- more
Page 25: €¦ · Ground Substrate round Via Microstrip Line Dominant transmission medium in microwave ICs Key advantage: IC interconnections have very low ground lead inductance- more
Page 26: €¦ · Ground Substrate round Via Microstrip Line Dominant transmission medium in microwave ICs Key advantage: IC interconnections have very low ground lead inductance- more
Page 27: €¦ · Ground Substrate round Via Microstrip Line Dominant transmission medium in microwave ICs Key advantage: IC interconnections have very low ground lead inductance- more
Page 28: €¦ · Ground Substrate round Via Microstrip Line Dominant transmission medium in microwave ICs Key advantage: IC interconnections have very low ground lead inductance- more
Page 29: €¦ · Ground Substrate round Via Microstrip Line Dominant transmission medium in microwave ICs Key advantage: IC interconnections have very low ground lead inductance- more
Page 30: €¦ · Ground Substrate round Via Microstrip Line Dominant transmission medium in microwave ICs Key advantage: IC interconnections have very low ground lead inductance- more
Page 31: €¦ · Ground Substrate round Via Microstrip Line Dominant transmission medium in microwave ICs Key advantage: IC interconnections have very low ground lead inductance- more
Page 32: €¦ · Ground Substrate round Via Microstrip Line Dominant transmission medium in microwave ICs Key advantage: IC interconnections have very low ground lead inductance- more
Page 33: €¦ · Ground Substrate round Via Microstrip Line Dominant transmission medium in microwave ICs Key advantage: IC interconnections have very low ground lead inductance- more