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Hi-P INTERNATIONAL LTD赫比国际集团Introduction

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HI-P INTERNATIONAL LIMITED

Incorporated in Singapore on 26 Dec 1980

Listed 17 Dec 2003 on Mainboard of Singapore Stock Exchange

Chairman cum CEO, Mr. CT Yao owns 58%

15 manufacturing plants globally

20,000 employees worldwide

Corporate Overview

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Mr. Yao Hsiao Tung is our Executive Chairman and

Chief Executive Officer of the Group. He is

responsible for formulating the strategic directions of

the Group as well as overall management of the

operations. Mr. Yao has more than 40 years of

experience in the precision tooling and plastic

injection molding industry. Mr. Yao was conferred

Honorary Doctorate by his Alma Mater, National

Kaohsiung University of Applied Sciences, on 25

October 2009.

Chairman Introduction

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History & Milestones

Mr. Yao invested his S$50,000 saving and managed the company

1983

Incorporation in SingaporeHi-P Tool & Die

1980

Molex invested and became its customer

1987

Hi-P XiamenHi-P Mold Base ChengduHaier Hi-P JV Qingdao

2001

Hi-P IndustriesHi-P Tianjin

2002

IPO on Singapore Stock ExchangeRevenue >US$100milHi-P Suzhou TechHi-P Suzhou Electronics

2003Revenue crossed US$10mil 1995

First overseas expansion,Hi-P Shanghai Electronics

1993

Renamed Hi-P InternationalHi-P Camera Products

Hi-P Spray Painting

2000

Hi-P Precision Chengdu 1998

Hi-P Mexico, first in N.AmericaChanged name to Hi-P Singapore

1997

Hi-P Dongguan2006

Hi-P Shanghai Optical Lens2004

Hi-P Poland, first in EuropeHi-P ThailandHi-P Shanghai Tech

2005

2009 Hi-P acquires G-Flex

2010 Acquisition of Motorola’s R&D Center

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Global Presence

中国 China

美国USA

总部 Corp

工厂 Plant

业务拓展及办事处 ESI & Offices

天津 Tianjin

成都 Chengdu

上海 Shanghai

苏州 Suzhou

台湾 Taiwan

厦门 Xiamen泰国Thailand

波兰Wroclaw

芝加哥Chicago

墨西哥Guadalajara

匈牙利Hungary

新加坡Singapore

东京 Tokyo

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Our Vision

Our Vision

“Recognized leader as an integrated electro-mechanical solution provider focusing on value creation and exceeding customer

expectations through innovation”

我们的愿景成为垂直整合机电一体化的行业领导者，透过创新来增加客户的价值并

超过客户的期望

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Our Mission“Partner with customers to add value and contribute to mutual success”

我们的使命作为客户的合作伙伴为客户增加价值并取得双向的成功

Our GoalContinue with the 8 measures as we strive towards our Vision 10, 2020

我们的目标持续贯彻开源节流 ，成就十年百亿大业

Our Mission & Goal

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Key Customers

Wireless Consumer Electronics Computing Peripherals

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Revenue Growth

3.5 4.7 6.8 7.8 12.2 19.3 21.4 27.7 33.2 45.282.5 100.5143.1

248.9

560.9

633.0

839.1

976.6

1,077.1

749.9

957.7

0.0

100.0

200.0

300.0

400.0

500.0

600.0

700.0

800.0

900.0

1,000.0

1,100.0

1,200.0

'90 '91 '92 '93 '94 '95 '96 '97 '98 '99 '00 '01 '02 '03 '04 '05 '06 '07 '08 '09 '10

S$’Mil

Tooling House

Component

Manufacturer

Mod

ule

Assem

blies

Inte

grat

ed E

-Mec

h

Solu

tions

Pro

vide

r

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Vertical IntegrationIntegratedElectro-Mechanics Solutions

Cosmetic MetalPrecision Stamping

Plastic Injection2Colors/3Colors

NCVM

IML

Surface Decoration

ODMTool Fabrication

Tool Design

PCBA

In-house Test Development

Electro-MechanicsAssembly

Module Assembly

FPC

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Tooling NPI

Molding Painting Pad Printing

NCVM IMLCNC

IMD

DesignDFM/ESI with Customer

Laser Etching

Plastics & Decoration Capabilities

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Laser Marking Chemical Etching

Control Env Assy

PolishingSandblasting

Tempo PrintED

Color Anodizing

Laser Welding

PVD

Spot Welding

De-greasing

Metals & Decoration Capabilities

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FPC & Rigid Flex Capabilities

8 Layer Rigid Flex8 Layer Rigid FlexMulti Layer FPCMulti Layer FPC5 Layer Rigid Flex5 Layer Rigid Flex 6 Layer Rigid Flex6 Layer Rigid Flex 10 Layer Rigid Flex10 Layer Rigid Flex

Items Standard Customized

Material Used Polyimide / PET 0.5mil / 1mil 0.5mil / 1mil

Maximum Panel Size 　 19.7” X 24” (500mm X 610mm)

Line Width and Spacing 　 3mil (0.07mm) 2mil (0.05mm)

Copper Thickness 　 1/3 oz min 1/4 oz min

via / Drill Size Min Drill Hole Diameter 6mil (0.15mm) 4mil (0.1mm)

　 Min via Size After Plating 4mil (0.1mm) 3mil (0.075mm)

Micro via (Laser) 　 4mil (0.1mm) 3mil (0.075mm)

Hole to Thickness Ratio Thru Hole Via 1:6 　　 Blind Via 1:1 　Surface Finished Hard and soft Gold / ENIG / OSP / Tin Lead Plating /HASL

Cover Layer Polyimide / Flexible Solder Mask / PET

Stiffener Material Polyimide / FR4 /Metal / PET

Shielding Material Copper / Silver Ink / Tatsuta

Tooling Tolerance 　 +/-2mil (0.05mm) +/-1mil (0.025mm)

ZIF Tolerance 　 +/-4mil (0.1mm) +/-2mil (0.05mm)

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SMT Capabilities 20 mil Pitch BGA Assembly, Rework and Repair, Re-balling SMT with 0201 Chip & 16 mil Fine Pitch QFP Dome Force Measure & Dome Force Test Double Sided Reflow ICT Testing Lead Free Technology FPC Punch EL Dome Module

Solder Paste Printer

Placement Equipment

Reflow Oven Router

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Hi-P Singapore Design Center Located at Motorola Singapore facility ~100 experienced R&D & support staff Comprehensive mobile phone lab facilities Capable to design mobile phones, tablets

and related products & accessories

1984 - SDC established1990 - Center of Excellence was

formed1992 - Received Singapore Design

Award1996 - Received Singapore Quality

Award 2009 - Changed to iDen Design Center2011- Acquired by Hi-P

Core Competences

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Hi-P CultureOur Core Pillars

• People Oriented: Respect, Care and Support

• Results Oriented: Performance Based Rewards, Bonuses and Promotion

Our Attitudes

- Contribution : One for all and all for one

- Ownership

How we Conduct Ourselves

• Manners ， Spirit ， Integrity ， Discipline

Results Expected

We seek to create a united and highly productive team that will contribute to our families, our company, society and the world.

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Awards• Ranked in 2007 as 658 in Global Chinese Enterprise Listing

with a revenue of US$6.48M• Group Chairman Mr. Yao was awarded the “2009 Asia-

Pacific Region Entrepreneur of the Year”• Top 50 Singapore Companies for five consecutive years• Excellent Supplier Award from Motorola, Braun, Gillette • Forbes ranking of 31 for Singapore companies • RIM "best supplier“ Award

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Summary Recognized leader in Integrated Electro-Mechnical Solution arena

Seamless design to manufacturing solution

Uncompromised quality

Competitive overall cost

Time-to-volume; time-to-market

Simplified supply chain

Strong Employee Value Proposition

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