High energy IonsFrom this direction

Liquid Hydrogen TargetGold Foil surround (Not Shown)

3 Layers of Silicon

Vacuum Chamber

Calorimeter

R3B Si Tracker Layout Optimised for tracking of high-energy protonsto select events from QFS reactions e.g. (p,2p), (p,pn)…

Silicon

ASICs (12 or 16 per side of each module)

Rigid PCBs with flex tail1 per side of module with Al cooling plate between

Feed through connectors. 68 way.

24

Connector with all connections for up to 16 ASICs on one side of Si module. 150 pins per connector:• 4 diff pairs for serial data• 1 diff pair for TS clock• 3 single ended for I 2C• 1 wired OR for FT OR• 1 diff pairs for Val/gate• 1 single ended for reset• 4 pins ladder address (3 levels) • 8 pins for 2x PT100• 1 pin for Si bias voltage/return• 64 Ground pins 4 per ASIC• 32 Power pins 2 per ASIC (A & D)• 24 Extra grounds

Buffer board including LVDS buffers, power regulation and signal isolation.

The R3B Si tracker comprises 30 double sided modules like the one shown here:•Outer layer 12 modules (16+16 ASICs each)•Middle layer 12 modules (16+16 ASICs each)•Inner layer 6 modules (12+12 ASICs each)

Shared Si modulesupport PCB.

No active parts, routing only

(Probably 1 annular shape PCB handling all 30 modules)

Diagram to show how a single Si module (ladder) is connected to the Si support module and feed-throughs.

Power connection for ASICs and Si bias(common for all modules)

Si Inner

Si Middle

Si Outer

ASIC

ASIC

ASIC

ASIC

ASIC

ASIC

120k strips912 ASICs

Si Inner

ASIC

ASIC

Si Middle

ASIC

ASIC

Si Outer

ASIC

ASIC

x6

x12

x12

FPGAenet

FPGAenet

FPGAenet

FPGAenet

FPGAenet

FPGAenet

Detectors in Vacuum DAQ in Air

Slow Control

10G

Switc

h10

G Sw

itch

DAQ PC(s)

To R3B DAQ

30 uTCA FEE cards + switches and clock card

CALIFA Timestamp & coincidence

links

R3B Si Tracker (NUSTAR)

Clk & trig i/f

White Rabbittiming

FMCi/f

FMCi/f

FMCi/f

FMCi/f

FMCi/f

FMCi/f

3x uTCAcrates

Outer detector assembly (300µm)

Inner detector assembly (100µm)

Plan to use the same mask set for the green detector of the outer and inner modules to reduce cost. In total 4 different masks are needed.

R3B Si Tracker Sensors

Silicon sensorsFour different geometries (A, B, C, D), and thickness of 300 um (outer ring) and 100 um (inner ring). Number of strips ranges from 876 in D(100) detector to 2048 in C(300).

50.5 um strips in stereo configuration of p and n side

A B C

D B

300 um

100 um

Alignment and BondingThree ABC mechanical pieces (single sided sensors) assembled on a PCB frame. This is being used to perfect the procedure to bond strips together. Adjusting bonding parameters on our sample pieces has allowed us to achieve good wire bonds with sufficiently good pull strengths.

R3B Si Tracker Status - 19 April 2013

Main Highlights:• First ASIC prototypes delivered and testing system constructed• Tests of ASIC so far show they are functioning• Readout tests of 300um prototype Si finished, 100um ongoing• Approval given to Micron for production of 300um Si sensors• Prototype flex cable received and assembled• Assembly procedure of ASICs to Flex trialled• Prototype ASICs bonded to flex cable and awaiting bonding• Production of prototype Si ladder underway• Production of prototype readout underway• Final R3B PDRA interviews held at Daresbury yesterday (18 April 2013)• Conceptual design for a target mechanism done• Mechanical design concentrating on supporting the Si tracker structure

and vacuum chamber, insertion and removal, etc.• Status will be reported at R3B Collaboration Meeting in GSI in May.

Dave Seddon,Liverpool

SiC fibre structure

ASIC chips mounted onFlex board

Cu cooling blocks

Coolant ~-20° Cflowing in Cu pipe

Day 3

Day 3 - Section

Prototype R3B Si Tracker Modules

Work underway to determine how to align the sensors to be wire bonded togetherHoping to be able to use cut edges of the detectors if good enough quality and relationship with Fiducials marked on Si well established.

Work also underway on Si test assembliesBonding jigs built to test gluing and wire bonding with ‘mechanical’ Si pieces (300 um so far). Liverpool and Daresbury technicians training in LSDC. Confident that sensors can be wire bonded successfully.

Next stepsWire bonding of ‘real’ R3B Si sensors and readout with VA1TA ASIC test boards (before R3B ASIC PCBsavailable) planned for end of January 2013.Plan to build ‘mock-up’ detector module trial assemblies with 300um glass and glass blank ASIC chips.

£155k (+VAT) For masks and 14 sensors R3B Si Tracker Prototype Sensors

13 (+1) useable R3B Si prototype sensors from Micron since summer 2012.All 4 designs (A, B, C, D) and 2 thicknesses (100um and 300 um).All tested in Liverpool LSDC against specifications.

The R3B Si prototypesGoal: to assembly one detector module to test the detector performance as well as the production process.

silicon sensors

mounting frame

PCB

ASICs

Alignment and BondingThree mechanical pieces (single sided sensors) assembled on a PCB frame. This is being used to perfect the procedure to bond strips together.

At each corner, use the SmartScope’s feature finder to identify the edges, and find where these lines intersect to define the corner.

Alignment and BondingThree ABC mechanical pieces (single sided sensors) assembled on a PCB frame. This is being used to perfect the procedure to bond strips together. Adjusting bonding parameters on our sample pieces has allowed us to achieve good wire bonds with sufficiently good pull strengths.

Full Flex PCB completedPT100

ASICsFithere

All three items viewed from above.

The black raised ASIC vacuum pads can just be seen on the vacuum jig underside.

200um spars in laser cut stencil to separate ASICs.

ASIC-Flex Assembly Procedure: I

ASIC-Flex Assembly Procedure: II

ASIC-Flex Assembly Procedure: III

• Testing of chip assembly can start now

Flex during attachment to copper cooling plateAttached with double sided thermal adhesive coated copper tape

ASIC/Si test box – prototype detector Copper cooling plate(s) fixed to FR4 PCB ready to accept Flex boards.

FR4 board waiting for silicon to be fitted and wire bonded.