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ECE 477 Digital Systems Senior Design Project Spring 2005
Homework 9: Reliability and Safety AnalysisDue: Thursday, March 31, at Classtime
Team Code Name: _Double Deuce Alarm System__________________ Group No. __2___
Team Member Completing This Homework: _Michael Tammen ____________________
Report Outline: Introduction (brief description of design project, with a focus on safety and reliability issues) Reliability analysis
o Choose 35 components in your design that you believe are most likely to fail (voltageregulators, power MOSFETs, etc. – basically anything operating above room temperature).
o Perform calculations to determine the number of failures per 106 hours and mean time to failure(MTTF) for each component, making any reasonable assumptions where necessary.
o Summarize conclusions about the reliability of these components and/or the circuit in general. FMECA (failure mode, effects, and criticality analysis) worksheet for entire schematic
o Failure Modes : Divide your schematic into functional blocks (e.g. power circuits, sensor blocks,microcontroller block). Determine all possible failure conditions of each functional block.Indicate the components that could possibly be responsible for such a failure (e.g., a shortedbypass capacitor might cause a voltage drop, but can not cause a voltage increase).
o Effects : For each failure mode above, determine the possible effects, if any, on any majorcomponents in other parts of the design (e.g., damage the microcontroller or fry a resistor) aswell as effects on the overall operation of the project (e.g, audio volume increases to maximum).Do not waste too much time on this! For some failure modes, it is acceptable to declare theeffects unpredictable. “Method of detection” of a particular failure mode should be observedfrom the operation of the device, unless there is particular circuitry intended to detect such afailure.
o Criticality : Begin by defining at least two criticality levels for types of failures in the output ofyour design. Define an acceptable failure rate λ for each level of failure. These are up to youand somewhat arbitrary, but keep in mind λ < 109 is standard for any failure that couldpotentially injure the user.
List of references (including MILHDBK217F)
NOTE: This is the third in a series of four “professional component” homework assignments,each of which is to be completed by one team member. The completed homework will countfor 10% of the team member’s individual grade. It should be a minimum of five printed pages.
ECE 477 Digital Systems Senior Design Project Spring 2005
Evaluation:Component/Criterion Score Multiplier Points
Introduction 0 1 2 3 4 5 6 7 8 9 10 X 1
Reliability Analysis 0 1 2 3 4 5 6 7 8 9 10 X 3
FMECA Worksheet 0 1 2 3 4 5 6 7 8 9 10 X 4
List of References 0 1 2 3 4 5 6 7 8 9 10 X 1
Technical Writing Style 0 1 2 3 4 5 6 7 8 9 10 X 1
TOTAL
ECE 477 Digital Systems Senior Design Project Spring 2005
Introduction
The “Double Deuce Alarm System” is a home security system with an interactive web
interface. Electronic home monitoring systems have been available in their most basic form
since the electronic revolution with electronic hobbyists creating simple buzzer circuits with a
switch to trigger the alarm. Home monitoring has evolved even further over the years with the
first patented smoke and heat detector alarm being patented on February 10, 1976 [1]. This
design will focus on two areas, expandability and integration with the web, both of which are
crucial when it comes to choosing a home security system. Safety and reliability of the design is
crucial to the success of a home security system. Reliability of the system is our biggest
concern. If the system is not reliable, meaning it could fail at any point, the safety of our
customers would be in jeopardy. By nature, failure of the system will not lead directly to any
injuries, but indirect injuries may result. The design’s, at its current state, reliability will be
examined in the following report. It will show that the design is quite reliable and should a
failure occur, it would never be critical and could easily be fixed.
ECE 477 Digital Systems Senior Design Project Spring 2005
Reliability Analysis
The reliability analysis was completed using the information provided by the Military
Handbook for Reliability Prediction of Electronic Equipment [2] and Designing for Reliability,
Maintainability, and Safety [3]. The failures per 106 hours and the Mean Time to Failure
(MTTF) calculations were completed using these data sources. The parameters referred to in the
rest of the documentation are the following:
λP part failure rate πL learning factorC1 die complexity λB base failure rateC2 a constant based on the number of pins πR resistance factorπT temperature coefficient πA application factorπE environmental constant πr power rating factorπQ quality factor πS voltage stress factor
The security system has four major areas for concern when examining the reliability of
the system. The failure of the entire system is something of grave concern so the Freescale
MC9S12NE64 [4] is a component of concern. Monitoring of the sensors is a key component to
the project. This means the Atmel MEGA88V10PI [5] is another component of concern as well
as the accompanying circuitry. Should an alarm be tripped and the horn actually not sound the
homeowner may be harmed. The circuit that controls the horn therefore is one of concern.
Therefore, this document will focus on the following components:
• Freescale MC9S12NE64
• Atmel MEGA88
• Sensor circuitry
• Horn circuitry
Freescale
ECE 477 Digital Systems Senior Design Project Spring 2005
The Freescale MC9S12NE64 [4] is the main onboard chip used in this design. It will be
used to control all major functions of the system, as well as running a web server. The failure
rate is defined as the following:
λP = (C1 * πT + C2 * πE) * πQ * πL Failures/106 hours
Table 1. Freescale MC9S12NE64 Parameters
Parameter Value JustificationC1 0.28 The Freescale MC9S12NE64 is a 16bit microprocessor
(MILHDBK217F, Section 5.1)πT 0.98 Digital CMOS Device
Operation should not exceed 85°C(MILHDBK217F, Section 5.8)
C2 0.0457
112pin SMT deviceC2 = 2.8 * 104 * (NP) 1.08
(MILHDBK217F, Section 5.9)πE 2.0 Assumed “Ground Fixed” environment
(MILHDBK217F, Section 5.10)πQ 10 Commercial component
(MILHDBK217F, Section 5.10)πL 1.5 Years in Production < 1 year
(MILHDBK217F, Section 5.10)
λP 5.487 per 106 hoursMTTF
182249 hours
Atmel
The Atmel MEGA88V10PI [5] is the other microprocessor that will be used in the
system. It is in control of monitoring the sensors and relaying that data back to the NE64 though
the I2C bus. The failure rate can be determined by the following formula:
ECE 477 Digital Systems Senior Design Project Spring 2005
λP = (C1 * πT + C2 * πE) * πQ * πL Failures/106 hours
Table 2. Atmel MEGA88V10PI Parameters
Parameter Value JustificationC1 0.14 Atmel MEGA88V10PI is an 8bit microprocessor
(MILHDBK217F, Section 5.1)πT 0.98 Digital CMOS Device
Operation should not exceed 85°C(MILHDBK217F, Section 5.8)
C2 0.0129
28pin DIP deviceC2 = 3.0 * 105 * (NP) 1.82
(MILHDBK217F, Section 5.9)πE 2.0 Assumed “Ground Fixed” environment
(MILHDBK217F, Section 5.10)πQ 10 Commercial component
(MILHDBK217F, Section 5.10)πL 1.2 Years in Production < 1.5 years
(MILHDBK217F, Section 5.10)λP 1.956 per 106 hoursMTTF
511247 hours
Horn Circuit
The next concern for reliability of the system is the circuit for the horn. The horn will
sound when an alarm has been tripped allowing the owner of the system to know when
something is going wrong in his/her home. The circuit reliability is in the hands of a TIP122
transistor [6] and a T77 relay [7]. Calculations will be done for both of the parts and then added
together to find the overall λP and MTTF for the circuit. The formula for the TIP122 is as
follows:
λP = λB * πT * πA * πr * πS * πQ * πE Failures/106 hours
Table 3. TIP122 Parameters
ECE 477 Digital Systems Senior Design Project Spring 2005
Parameter Value JustificationλB 0.0007
4Base failure rate for NPN and PNP devices(MILHDBK217F, Section 6.3)
πT 8.1 Junction Temperature of TIP122 is +150°C (MILHDBK217F, Section 6.3)
πA 0.7 Switching application(MILHDBK217F, Section 6.3)
πr 4.69 πr = (Pr).37
Pr used is therefore 65W (MILHDBK217F, Section 6.3)
πS 0.11 0 < Vs < .3(MILHDBK217F, Section 6.3)
πQ 8.0 Plastic(MILHDBK217F, Section 6.3)
πE 6.0 Assumed “Ground Fixed” environment(MILHDBK217F, Section 6.3)
λP 0.1039 per 106 hoursMTTF
9624506 hours
The other component is the T77 relay. The default model in the handbook was used. The
formula for failure is the following:
λP = λB * πP * πE Failures/106 hours
Table 4. T77 Relay Parameters
Parameter Value
Justification
λB 0.4 Assumed solid state device(MILHDBK217F, Section 6.3)
ECE 477 Digital Systems Senior Design Project Spring 2005
πP 4.0 Lower(MILHDBK217F, Section 6.3)
πE 3.0 Assumed “Ground Fixed” environment(MILHDBK217F, Section 6.3)
λP 4.8 per 106 hoursMTTF
208333 hours
Optical Isolator
A 425ND 4 Channel Optical Isolator [8] is the Atmel’s relay to the sensors. It is in
charge of isolating the sensor inputs to protect from electromagnetic discharge. No optical
isolators were located in the handbook, so the part will be broken down into the photodiode and
the NPN transistor. Each chip contains 4 isolator circuits, which will also need to be accounted
for. The failure rate for the photodiode is as follows:
λP = λB * πT * πQ * πE Failures/106 hours
Table 5. Photodiode Parameters
Parameter Value JustificationλB 0.002
5Photodiode Output, Single Device(MILHDBK217F, Section 6.11)
πT 6.6 Temperature of junction not to exceed 100°C(MILHDBK217F, Section 6.11)
πQ 5.5 Lower(MILHDBK217F, Section 6.11)
πE 2.0 Assumed “Ground Fixed” environment(MILHDBK217F, Section 6.11)
λP .1815 per 106 hours
ECE 477 Digital Systems Senior Design Project Spring 2005
MTTF
5509641 hours
The calculations for the transistor can be found in Table 3. Accounting for 4 photodiodes and 4
transistors in a chip, that leaves us with the following:
Table 6. Optical Isolator Parameters
λP 1.1416 per 106 hoursMTTF
875964 hours
Conclusions
Table 6 provides a summary of the results. Looking over the results, all of the
components are safe to operate for extended periods of time. The Freescale and the relay are the
two most likely to fail with a MTTF of 1.82249E+05 and 2.08333E+05 respectively. The
microcontroller is low because it is 16bit device along with an assumed operating temperature
of 85°C. Should the microcontroller operate between 50°C and 60°C the MTTF would be
significantly increased. The relay was calculated using a basic equation from the handbook.
However, the relay is a common and easily replaceable component. With the low MTTF for the
relay it would make sense to have the microcontroller monitor the status of it and send an email
via the web server should it quit working. Considering the fact that failures would occur quite
infrequently, the MTTF values calculated were satisfactory.
Table 7. Preliminary Failure Rate Calculations
Component Description Ip/106 hours MTFF
ECE 477 Digital Systems Senior Design Project Spring 2005
U3 Freescale MC9S12NE64 5.487 1.82249E+05J14 Atmel MEGA88V10PI 1.956 5.11247E+05Q1 NPN Transistor (TIP122) 0.1039 9.62450E+06L1 Relay (T77) 4.8 2.08333E+05U27 Optical Isolator (425ND) 1.1416 8.75964E+05
FMECA
The attached schematics have been broken down into the four functional blocks there
were examined earlier. Table 8 shows the blocks
Table 8. FMECA functional blocks
Block Type Main component(s)A Microcontrolle
rFreescale MC9S12NE64
B Microcontroller
Atmel MEGA88V10PI
C Power circuit NPN Transistor & T77 RelayD Isolator Optical Isolator
Two levels of critically have been defined:
Criticality Failure effect Maximum probabilityHigh A critical failure should never
happen, potential for personalinjury
λ < 109
Low During noncritical failure thesystem has lost some or allfunctionality; Customerdissatisfaction results
λ < 105
The following High Criticality failures have been identified for this design:
ECE 477 Digital Systems Senior Design Project Spring 2005
• A3 – software malfunction
• B1 – Output continuous 0
• B3 – software malfunction
• D1 – optical isolator failure
The probibilty of the failures can be reduced by implementing a few things. To monitor
the software a “watchdog” can be implemented. The failure of the horn can be attributed to
failure in the relay or the transistor. The outputs and inputs of the optical isolator can be fed
back to the microcontroller and monitored at all times.
ECE 477 Digital Systems Senior Design Project Spring 2005
FMECA Worksheet – Group __2__
FailureNo.
Failure Mode Possible Causes Failure Effects Method ofDetection
Criticality Remarks
A1Output
continuous 0J34, U25, C36, C34,
softwareLoss of horn
soundingMonitored by
microcontrollerLow
Monitored through theweb server.
A2Output
continuous 1J34, U25, C36, C34,
softwareContinuous horn
soundObservation Low Monitored by the user
A3Software
MalfunctionU3
Disruption of theentire system
Observation High
B1Output
continuous 0 U27, U24, software
Loss of sensormonitoring
Monitored bymicrocontrollerand web server
High
B2Output
continuous 1U27, U24, software
Continuous hornsound
Observation Low
ECE 477 Digital Systems Senior Design Project Spring 2005
FMECA Worksheet – Group __2__
FailureNo.
Failure Mode Possible Causes Failure Effects Method ofDetection
Criticality Remarks
B3Software
MalfunctionJ14
Loss of sensormonitoring
Monitored bymicrocontrollerand web server
High
C1
Relay Failure L1Loss of horn
soundMonitored by
microcontrollerLow
C2
BJT Failure Q1Loss of horn
soundMonitored by
microcontrollerLow
D1
Isolator Failure U27, U24Loss of sensor
monitoringMonitored by
microcontrollerHigh
ECE 477 Digital Systems Senior Design Project Spring 2005
References
[1] History of Home Security Systems
http://inventors.about.com/library/inventors/blhomesecurity.htm
[2] U.S. Department of Defense, Reliability Prediction of Electronic Equipment, MILHDBK217F
http://shay.ecn.purdue.edu/~dsml/ece477/Homework/Fall2004/MilHdbk217F.pdf
[3] George Novacek, Designing for Reliability, Maintainability, and Safety, Circuit Cellar December 2000
http://shay.ecn.purdue.edu/~dsml/ece477/Notes/PDF/4Mod9_ref.pdf
[4] Motorola MC9S12NE64
http://www.freescale.com/files/microcontrollers/doc/data_sheet/MC9S12NE64V1.pdf
[5] Atmel MEGA88V10PI
http://www.atmel.com/dyn/resources/prod_documents/doc2545.pdf
[6] TIP122 Transistor
ECE 477 Digital Systems Senior Design Project Spring 2005
http://rocky.digikey.com/WebLib/Fairchild/Web%20Data/TIP120_121_122.pdf
[7] T77 Relay
http://rocky.digikey.com/WebLib/Potter%20Brumfield/Web%20Data/T77.pdf
[8] Optical Isolator
http://rocky.digikey.com/WebLib/Sharp/Web%20Data/PC3Q67Q.pdf