How to avoid EMC problems in PCB design

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    How to Avoid EMC Problems in PCB Design?

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    EMC Basics• EMC Defnition

     – the ability of devices and systems to operate in theirelectromagnetic environment without impairing theirfunctions

    Main elements to EMC – Emissions: 

    •  !he EM" emissions refer to the generation of unwantedelectromagnetic energy#

    •  !hese need to be reduced below certain acceptablelimits to ensure they do not cause any disruption toother e$uipment#

     – Susceptibility & immunity: •  !he susceptibility of an item of electronics to EM" is the

    way it reacts to unwanted electromagnetic energy#•  !he aim of the design of the circuit is to ensure a

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    Elements of Electromagneticinterference

    • A generator is an E&E devicethat produces EM"

    • A receptor is an E&E devicethat receives or couples inEM"

    A coupling path allows EM"from the generator toproduce an undesiredresponse in the receptor

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     !hree Main 'ays toMinimi(e EM"

    • Reducing the noise rom the generator

     – reducing the generator circuit area – using slower digital logic

     –  reducing the circuit current

     – )ltering* and&or shielding#

    • Altering the coupling path

     – moving the receptor away from the generator

     – or shielding the receptor or generator

    • Improving the immunity o the receptor

     – reducing the receptor circuit area

     – using less susceptible electronic components

     –

    changing the impedance of the circuit

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    +uidelines to address EMC issuesduring the PCB design

    •  !he following guidelines will describe how hardwareengineers can address EMC issues during the PCB design

    ,# +round planes

    -# Component .egregation

    /# Board 0ayers

    1# Digital Circuits

    2# Cloc3 !ermination

    4# Analog Circuits

    5# Decoupling Capacitors

    6# Cables

    7# Crosstal3

    ,8#.hielding

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    ,#+round Planes•

    Ma9imi(ing the ground areaon a PCB reduces theinductance of ground in thesystem* which in turnreduces electromagnetic

    emissions and crosstal3#

    • A poor PCB design is onewhere components are

    connected randomly toground points#

    • A recommended designapproach is to have a full

    ground plane because it

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    -#Component .egregation

    • Components on the PCB needto be grouped according totheir functionality* such asanalog* digital* power supplysections* low:speed circuits*

    high:speed circuits* and so on#

    •  !he trac3s for each groupshould stay in their designatedarea

    • ;or a signal to

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    /#Board 0ayers• "f more than two layers are

    used* then one completelayer should be used as aground plane#

    •  !he layer below the groundlayer should be used as apower plane#

    "f a complete layer ofground is not possible* thenground grids should beused#

    • "f a separate power plane isnot used then round

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    1#Digital Circuits

    •  !races connecting cloc3 andhigh speed signals should be3ept as short as possible andbe ad=acent to the groundplane to 3eep radiation and

    crosstal3 under control#

    •  !hese signals must also be3ept away from the powerplane since they can induce

    noise on the power plane aswell#

    •  !he crystal should also be3ept close to the appropriatechips#

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    2#Cloc3 !ermination

    •  !races carrying cloc3 signalsfrom a source to a devicemust have matchingterminations because

    whenever there is an

    impedance mismatch* a partof the signal gets reective termination*

    including sourcetermination* endtermination* ac termination*etc

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    4#Analog Circuits

    •  !races carrying analog signalsshould be 3ept away fromhigh:speed or switchingsignals and must always beguarded with a ground signal#

    • A low:pass )lter shouldalways be used to get rid ofhigh:fre$uency noise coupledfrom surrounding analogtraces#

    •  !he ground plane of analogand digital subsystems should

    not be shared#

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    5#Decoupling Capacitor

    • A decoupling capacitorprovides a low:impedancepath for high:fre$uencycurrent on the powerplane to ground#

    •  !his path should be 3eptto a minimum possiblelevel by placing a

    decoupling capacitor veryclose to the "C

    • Multiple capacitors withlow E.0 e$uivalent seriesinductance@ should be

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    6#Cables•

    Cables carrying digitalsignals act as e%cientantenna

    • sing a twisted:pair cablehelps 3eep coupling to a

    low level by cancelling anyinduced magnetic )elds

    • 'hen a ribbon cable isused* multiple ground

    return paths must beprovided

    • ;or high:fre$uency signals*shielded cable must beused* where the shielding

    is connected to ground

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    7#Crosstal3

    • Crosstal3 is a function ofmutual inductance mutual capacitance

    Crosstal3 caused bymutual inductance istypically larger than thecrosstal3 caused bymutual capacitance#

    • Mutual inductance canbe reduced byincreasing the spacingbetween the two tracesor by reducing the

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    ,8#.hielding

    • A mechanical approach toreducing EMC

    • .hield reduces the si(e of

    loop antennas byabsorbing and re

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     !han3 ou