Jim McGregorJim McGregor

DirectorDirector

InStatInStat

Continued Growth of Mobile ApplicationsContinued Growth of Mobile Applications

TechnologiesTechnologies

Usages modelsUsages models

ContentContent

Business modelsBusiness models

UMDs62.8%

PMP47.9%

SmartPhones38.6%Portable

Nav32.1%Mobile

PCs20.5%

CellPhones10.2%0.0%

10.0%

20.0%

30.0%

40.0%

50.0%

60.0%

70.0%

2006

-201

1 C

AG

R

Source: In-Stat

Critical CriteriaCritical Criteria

Power EfficiencyPower Efficiency–– New battery technology faces many hurdlesNew battery technology faces many hurdles

Performance BalancingPerformance Balancing–– Device Device ↔↔ Communications Communications ↔↔ NetworkNetwork

Specialized RequirementsSpecialized Requirements–– Flexible solutions vs. many SKUsFlexible solutions vs. many SKUs

Solution PricingSolution Pricing–– Price = Device + ServicesPrice = Device + Services

Mooly EdenMooly Eden

Vice President &Vice President &General ManagerGeneral Manager

Mobile Platforms GroupMobile Platforms GroupIntel CorporationIntel Corporation

Energy EfficiencyEnergy Efficiency

Intel Advantage = Accomplish Both at the Same TimeIntel Advantage = Accomplish Both at the Same Time

PerformancePerformance

++

Power SavingsPower Savings

Intel Advantage = Accomplish Both at the Same TimeIntel Advantage = Accomplish Both at the Same Time

PerformancePerformance

++

Power SavingsPower Savings

Energy EfficiencyEnergy Efficiency

45 nm45 nm

HighHigh--KK

SSE4SSE4

DDR3DDR3Large L2 CacheLarge L2 Cache

Super Shuffle EngineSuper Shuffle Engine

Deep Power Down (c6)Deep Power Down (c6)

Dynamic Acceleration Technology Dynamic Acceleration Technology

Enhanced Virtualization Technology Enhanced Virtualization Technology

Fast RadixFast Radix--16 Divider16 Divider

2008: Next Leap in Mobility2008: Next Leap in Mobility

Source: Intel

Santa RosaSanta Rosa

Mobile IntelMobile Intel®® 965 Express Chipset Family965 Express Chipset Family(Crestline & ICH8M)(Crestline & ICH8M)

IntelIntel®® Wireless WiFi Link 4965AGNWireless WiFi Link 4965AGN(Kedron)(Kedron)

IntelIntel®® CoreCoreTMTM 2 Duo 2 Duo Processor Processor

800 MHz FSB800 MHz FSB

Santa Rosa Santa Rosa RefreshRefresh

Penryn Penryn Processor Processor

800 MHz FSB800 MHz FSB

TodayToday Q1 2008Q1 2008

MontevinaMontevina

Penryn Penryn Processor Processor

MVMV

MidMid--20082008

Cantiga ChipsetCantiga ChipsetICH9MICH9M

Echo PeakEcho PeakWiMAX/WiWiMAX/Wi--FiFiShirley PeakShirley Peak

WiWi--FiFi

Increased Energy Increased Energy Efficient PerformanceEfficient Performance

Enhanced HD MultimediaEnhanced HD MultimediaEnhanced ManageabilityEnhanced Manageability

Enhanced SecurityEnhanced Security

Expanded WirelessExpanded Wirelesscapabilitiescapabilities

Model For Sustained Technology LeadershipModel For Sustained Technology Leadership

Compaction/DerivativeCore™ Duo · Pentium-D

Core™ MicroarchitectureCore™2 Duo, DC Xeon® 5100

65nm2

YEA

RS

TickTick––Tock ModelTock Model

Compaction/DerivativePENRYN

New MicroarchitectureNEHALEM2

YEA

RS

45nm

Compaction/DerivativeWestmere

New MicroarchitectureSandy Bridge2

YEA

RS

32nm

Unleashing The Internet ExperienceUnleashing The Internet ExperienceUnleashing The Internet Experience

Gadi SingerGadi Singer

VP & GM, Ultra Mobility GroupVP & GM, Ultra Mobility Group

Intel CorporationIntel Corporation

Software CompatibilitySoftware CompatibilityFor The User And DeveloperFor The User And Developer

Always On Always ConnectedAlways On Always Connected

Mobile ResponsivenessAnd Visualization

What’s Needed To Unleash The Full InternetWhatWhat’’s Needed To Unleash The Full Internets Needed To Unleash The Full Internet

Progress UpdateProgress UpdateProgress UpdateContinued Silicon InnovationsContinued Silicon Innovations Working Menlow PrototypesWorking Menlow Prototypes

Strategic CollaborationStrategic Collaboration Aligned Ecosystem CoAligned Ecosystem Co--TravelersTravelers

InventecInventec CompalCompal

BenQBenQ

EBEB

AsusAsus QuantaQuanta

Sriram ViswanathanSriram Viswanathan

Vice President Intel Capital andVice President Intel Capital andGM WiMAX Program GM WiMAX Program Intel CorporationIntel Corporation

Global Carrier Interest growsGlobal Carrier Interest growsSupported by new spectrumSupported by new spectrum

VodaphoneVodaphone & Sony Ericsson join the WiMAX Forum & Sony Ericsson join the WiMAX Forum

WiMAX Forum holds 3 successful mobile plug fests WiMAX Forum holds 3 successful mobile plug fests

Major global device manufacturers announce support for WiMAX DevMajor global device manufacturers announce support for WiMAX Devices at 3GSMices at 3GSM’’0808

Mobile trials pass 120 in 46 countries, Fixed trials and deploymMobile trials pass 120 in 46 countries, Fixed trials and deployments pass 220 in 52 countriesents pass 220 in 52 countries

Intel Silicon driving new devicesIntel Silicon driving new devicesWorlds first combo Worlds first combo WiWi--Fi/WiMAXFi/WiMAX ModuleModule

Fixed Modems Mobile NotebooksMobile Notebooks& handhelds& handhelds CE

Other names and brands may be claimed as the property of others Intel may make changes to specifications, product descriptions, and plans at any time, without notice.

2006-2007 20072007--20082008 2008+

Committed to embed WiMAX into next-generation Intel®Centrino® Processor Technology notebooks