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1
Raj Hazra
Director, Systems Technology Lab
Exte
nding Energy Efficiency
From Silicon To The Platform
And B
eyond
2
Copyright ©
Inte
l Corporation, 2007. All rights reserved. Third-p
arty
marks and
brands are the property
of th
eir respective owners. All products, date
s, and figures
are preliminary and subject to
change w
ithout notice.
•Defining Terms
•W
hy Platform Energy Efficiency
•Value
•Inte
l Research
•Call to A
ction
Agenda
3
Copyright ©
Inte
l Corporation, 2007. All rights reserved. Third-p
arty
marks and
brands are the property
of th
eir respective owners. All products, date
s, and figures
are preliminary and subject to
change w
ithout notice.
Defining Terms
Efficient Power
Delivery
Improved Power
Management
Optimizing delivery of power
to the platform and through
to silicon
Better m
anaging how and
when power is used
4
Copyright ©
Inte
l Corporation, 2007. All rights reserved. Third-p
arty
marks and
brands are the property
of th
eir respective owners. All products, date
s, and figures
are preliminary and subject to
change w
ithout notice.
Why Platform Efficiency
�As perf/watt of silicon improves, efficient operation across
the rest of the platform becomes increasingly important
CPU
Display
Mem
GMCH
VR
HDD
CK410
other
Future leaps in energy efficiency will come from
combined improvements in silicon andthe platform
Data Center Power Distribution
Laptop Power Utilization
Typical Office Application
�Mobile example
�Data Center Example
5
Copyright ©
Inte
l Corporation, 2007. All rights reserved. Third-p
arty
marks and
brands are the property
of th
eir respective owners. All products, date
s, and figures
are preliminary and subject to
change w
ithout notice.
Value of Improved Platform
Efficiency
•Smaller
•Cooler
•Easier to design
•Lower cost
Mobile
Increased
Battery Life
•Quieter
•Cooler
•Lower utility costs
•Better reliability
Server &
Deskto
p
Lower TCO
•Less cooling
•Lower utility costs
•Better reliability
•Simplified power mgmt
Data
Cente
r
Greate
r D
ensity
6
Copyright ©
Inte
l Corporation, 2007. All rights reserved. Third-p
arty
marks and
brands are the property
of th
eir respective owners. All products, date
s, and figures
are preliminary and subject to
change w
ithout notice.
Value B
eyond Improved D
evices
•Reduced global carbon
footprint for compute
devices
•Fewer number of power
plants to support
expected growth
Environment
Regulato
ry
Emerging
Markets
•Better compliance with
emerging regulatory
pressures
•Improved flexibility
when planning data
centers
•Lessens demand on grid
•Minimizes utility costs in
power limited
geographies
7
Copyright ©
Inte
l Corporation, 2007. All rights reserved. Third-p
arty
marks and
brands are the property
of th
eir respective owners. All products, date
s, and figures
are preliminary and subject to
change w
ithout notice.
How is Inte
l Improving Platform
Efficiency? R
edefining
Power
Management
Innovations in
Power
Delivery
�Moving beyond ACPI
�SW Directed, HW Managed
�Fine Grained Power
Management
1
3
5
7
9
11
13
15
17
19
HW020406080100
Exte
nding to
the D
ata
Cente
r
�Integrated Voltage Regulators
�Load Adaptive
�Fewer Voltage Rails
�Power management across
groups of platform
s
�Optimizing power delivery
within the data center
8
Copyright ©
Inte
l Corporation, 2007. All rights reserved. Third-p
arty
marks and
brands are the property
of th
eir respective owners. All products, date
s, and figures
are preliminary and subject to
change w
ithout notice.
1. Today’s idle behavior
2. New idle behavior
3. Key press
4. Re-e
nte
rs idle
Innovative Power M
anagement
�Shift from OS to HW
based power
management
�Research underway in
multiple areas
Intel Platform
9
Copyright ©
Inte
l Corporation, 2007. All rights reserved. Third-p
arty
marks and
brands are the property
of th
eir respective owners. All products, date
s, and figures
are preliminary and subject to
change w
ithout notice.
Efficient Power D
elivery
�Several challenges in
existing platform
power delivery
�Intel researching
multiple
improvements
30% improvement in power delivery efficiency
10
Copyright ©
Inte
l Corporation, 2007. All rights reserved. Third-p
arty
marks and
brands are the property
of th
eir respective owners. All products, date
s, and figures
are preliminary and subject to
change w
ithout notice.
Innovations in the D
ata
Cente
r
�Better efficiency through improved group management
>25% improvement in data center efficiency
DC/AC
DC/AC
DC/AC
DC/AC
UPS
UPS
UPS
UPS
AC/DC
AC/DC
AC/DC
AC/DC
480V
480V
480V
480V
3 333φ φφφACACACAC
UPS
UPS
UPS
UPS
AC/DC
AC/DC
AC/DC
AC/DC
480V
480V
480V
480V
3 333φ φφφACACACAC
VRVR
DC/DC
CSCSCSCS
12V
12V
12V
12V
400V
400V
400V
400V
DCDCDCDC
Server
Rack
86%
86%
86%
86% � ���75%
75%
75%
75%
93%
93%
93%
93%
97%
97%
97%
97%
97%
97%
97%
97%
AC/DC
DC/AC
DC/AC
DC/AC
DC/AC
PDU
PDU
PDU
PDU
PDU
PDU
PDU
PDU
PDU
PDU
PDU
PDU
PDU
PDU
PDU
PDU
�Optimizing data center power delivery
75%
75%
75%
75% � ���48%
48%
48%
48%
79%
79%
79%
79%
93%
93%
93%
93%
88%
88%
88%
88%
Today
Today
Today
Today’ ’’’s DC:
s DC:
s DC:
s DC:
400Vdc DC:
400Vdc DC:
400Vdc DC:
400Vdc DC:
11
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Inte
l Corporation, 2007. All rights reserved. Third-p
arty
marks and
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eir respective owners. All products, date
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ithout notice.
Energy Efficiency –
Regulato
ry V
iew
•Preserving Perform
ance
•While Reducing Energy
•Impact By 2010
•Save $5.5B
Collectively in
Energy Costs
•Reduce Global CO2
emissions by 54
Million Tons / Year
•Without Derailing
Moore’s Law
Focus: Energy
Efficient
Perfo
rmance
Most Perfo
rmance
w/ Least Energy
•One Planet, many
Regulators
•Working towards
Harm
onized Standards
among all
•Not just Energy, but
ROHS, Materials,
Packaging
Harmonizing
Energy Efficiency
Sta
ndards W
W
Energy Leads in
Holistic G
reen
Strate
gy
•Chips, Boards, Systems,
Software, Data Centers,
Manufacturers, OEMs
•4 Year Roadmap of
Improved PSU &
Motherboard efficiency
Ecosyste
m &
Industry
Partn
ers
We’re all in this
togeth
er
12
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Inte
l Corporation, 2007. All rights reserved. Third-p
arty
marks and
brands are the property
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eir respective owners. All products, date
s, and figures
are preliminary and subject to
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ithout notice.
Investing in Sta
rt-ups
focused on Energy Efficiency
•Voltage Regulation
•Displays
•Low-power wireless
Mobile &
Consumer
•Virtualization
•Voltage Regulation
•Better airflow, lower data error rates
Server &
Deskto
p
Note: example only, not an exhaustive list
13
Copyright ©
Inte
l Corporation, 2007. All rights reserved. Third-p
arty
marks and
brands are the property
of th
eir respective owners. All products, date
s, and figures
are preliminary and subject to
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ithout notice.
Call to A
ction
Advance 400V D
C in data
cente
r
Industry
Coordinate
with R
egulato
ry
Evolve Syste
m Software
Improve Si & Platform
Regulato
ry
Inte
l
Yes
Advances require industry coordination
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
14
Copyright ©
Inte
l Corporation, 2007. All rights reserved. Third-p
arty
marks and
brands are the property
of th
eir respective owners. All products, date
s, and figures
are preliminary and subject to
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ithout notice.
15
Copyright ©
Inte
l Corporation, 2007. All rights reserved. Third-p
arty
marks and
brands are the property
of th
eir respective owners. All products, date
s, and figures
are preliminary and subject to
change w
ithout notice.
Risk Facto
rs
Today
Today’’ s presenta
tion conta
ins forward
s presenta
tion conta
ins forward--looking
looking
sta
tements. All sta
tements m
ade that are not histo
rical
sta
tements. All sta
tements m
ade that are not histo
rical
facts are subject to
a number of risks and uncerta
inties,
facts are subject to
a number of risks and uncerta
inties,
and actu
al results m
ay differ m
ate
rially. Please refer to
and actu
al results m
ay differ m
ate
rially. Please refer to
our m
ost recent Earnings R
elease and our m
ost recent
our m
ost recent Earnings R
elease and our m
ost recent
Form 10
Form 10--Q or 10
Q or 10--K filing available on our w
ebsite for
K filing available on our w
ebsite for
more info
rmation on the risk facto
rs that could cause
more info
rmation on the risk facto
rs that could cause
actu
al results to differ.
actu
al results to differ.
Rev. 4/17/07
16
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arty
marks and
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eir respective owners. All products, date
s, and figures
are preliminary and subject to
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ithout notice.
Legal Disclaim
er
�IN
FO
RM
AT
ION
IN
TH
IS D
OC
UM
EN
T I
S P
RO
VID
ED
IN
CO
NN
EC
TIO
N W
ITH
IN
TE
L®
PR
OD
UC
TS
. NO
LIC
EN
SE
, E
XP
RE
SS
OR
IM
PLIE
D, B
Y E
ST
OP
PE
L O
R O
TH
ER
WIS
E, T
O A
NY
IN
TE
LLE
CT
UA
L P
RO
PE
RT
Y R
IGH
TS
IS
G
RA
NT
ED
BY
TH
IS D
OC
UM
EN
T. E
XC
EP
T A
S P
RO
VID
ED
IN
IN
TE
L’S
TE
RM
S A
ND
CO
ND
ITIO
NS
OF
SA
LE
FO
R
SU
CH
PR
OD
UC
TS
, IN
TE
L A
SS
UM
ES
NO
LIA
BIL
ITY
WH
AT
SO
EV
ER
, A
ND
IN
TE
L D
ISC
LA
IMS
AN
Y E
XP
RE
SS
OR
IM
PLIE
D W
AR
RA
NT
Y, R
ELA
TIN
G T
O S
ALE
AN
D/O
R U
SE
OF
IN
TE
L®
PR
OD
UC
TS
IN
CLU
DIN
G L
IAB
ILIT
Y O
R
WA
RR
AN
TIE
S R
ELA
TIN
G T
O F
ITN
ES
S F
OR
A P
AR
TIC
ULA
R P
UR
PO
SE
, M
ER
CH
AN
TA
BIL
ITY
, O
R IN
FR
ING
EM
EN
T
OF
AN
Y P
AT
EN
T, C
OP
YR
IGH
T O
R O
TH
ER
IN
TE
LLE
CT
UA
L P
RO
PE
RT
Y R
IGH
T. IN
TE
L P
RO
DU
CT
S A
RE
NO
T
INT
EN
DE
D F
OR
US
E I
N M
ED
ICA
L, LIF
E S
AV
ING
, O
R L
IFE
SU
ST
AIN
ING
AP
PLIC
AT
ION
S.
�In
tel m
ay
ma
ke
ch
an
ge
s to
sp
eci
fica
tio
ns
an
d p
rod
uct
de
scri
pti
on
s a
t a
ny
tim
e, w
ith
ou
t n
oti
ce.
�A
ll p
rod
uct
s, d
ate
s, a
nd
fig
ure
s sp
eci
fie
d a
re p
relim
ina
ry b
ase
do
n c
urr
en
t e
xp
ect
ati
on
s, a
nd
are
su
bje
ct t
o
cha
ng
e w
ith
ou
t n
oti
ce.
�In
tel, p
roce
sso
rs, ch
ipse
ts, a
nd
de
skto
p b
oa
rds
ma
y c
on
tain
de
sig
n d
efe
cts
or
err
ors
kn
ow
n a
s e
rra
ta,
wh
ich
ma
y c
au
se t
he
pro
du
ct t
o d
ev
iate
fro
m p
ub
lish
ed
sp
eci
fica
tio
ns.
Cu
rre
nt
cha
ract
eri
zed
err
ata
are
a
va
ila
ble
on
re
qu
est
.
�P
erf
orm
an
ce t
est
s a
nd
ra
tin
gs
are
me
asu
red
usi
ng
sp
eci
fic
com
pu
ter
syst
em
s a
nd
/or
com
po
ne
nts
an
d
refl
ect
th
e a
pp
rox
ima
te p
erf
orm
an
ce o
f In
tel p
rod
uct
s a
s m
ea
sure
d b
y t
ho
se t
est
s. A
ny
dif
fere
nce
in
sy
ste
m h
ard
wa
re o
r so
ftw
are
de
sig
n o
r co
nfi
gu
rati
on
ma
y a
ffe
ct a
ctu
al p
erf
orm
an
ce.
�In
tel, I
nte
l In
sid
e, In
tel X
eo
n, a
nd
th
e In
tel lo
go
are
tra
de
ma
rks
of
Inte
l C
orp
ora
tio
n in
th
e U
nit
ed
Sta
tes
an
d o
the
r co
un
trie
s.
�*O
the
r n
am
es
an
d b
ran
ds
ma
y b
e c
laim
ed
as
the
pro
pe
rty
of
oth
ers
.
�C
op
yri
gh
t ©
20
07
In
tel C
orp
ora
tio
n.