Impact of SOI technology through ECSEL project dynamic€¦ · GLOBAL PRESENCE. Substrates in the value chain 3/9/20 3 DATE / SOI Session Soitec proprietary & confidential – no

Impact of SOI technology throughECSEL project dynamic

Francois Brunier – Soitec Partnership program manager March 2020

Soitec – Designer & manufacturer of innovative semiconductor material

3/9/20 DATE / SOI Session Soitec proprietary & confidential – no copying or distribution permitted2

We design and deliver innovativesubstrates & solutions to enable our customers’products shaping everyday life

“”

1 Largest manufacturer of engineered substratesLEADER

Unique technologies SMART CUTTM, SMART STACKING 2

4 High-growth marketsSMARTPHONES, AUTOMOTIVE, CLOUD & INFRASTRUCTURE, IOT

Wafer fabs (150, 200 & 300 mm)FRANCE, BELGIUM, SINGAPORE, CHINA6

1,450 Employees Worldwide GLOBAL PRESENCE

Substrates in the value chain

3/9/20 3 DATE / SOI Session Soitec proprietary & confidential – no copying or distribution permitted

Broad product portfolio addressing market growth

PHOTONICS

Photonics-SOIFor high perf. photonics device integration into

silicon

IMAGERS

Imager-SOIFor improved

imager performance in

NIR

PIEZO-ON- INSULATOR

POIFor high

performance 5G filters

PROCESSOR & CONNECTIVITY

SOC

FD-SOIFor power-efficient integration of digital/

²analog/RF

POWER

Power-SOIFor high voltage

device integration

RF FRONT-END

MODULE

RF-SOIFor highly

efficient mobile communication

GaN

GaNFor radio

frequency (RF) 5G and power

systems

Power-SiCFor high voltage

device integration

43/9/20 DATE / SOI Session Soitec proprietary & confidential – no copying or distribution permitted

REFERENCE success story - 2016-2019

› Develop innovative 300mm RF-SOI substrates & technologies

› Enabling realization of integrated Front End modules, and system level demonstrators for cellular, Aeronautics, automotive,

› Pave the way to 5G

3/9/20 5

RF-SOI – The standard technology for smartphones’ front-end modules

>60mm²

Iphone 7Iphone 6Iphone 5S Samsung Galaxy S832mm²27mm²18mm²9mm²

2021Iphone Xs max

40mm²

DATE / SOI Session Soitec proprietary & confidential – no copying or distribution permitted

REFERENCE outcome: 300mm RF-SOI in production and essential for 5G

› RFSOI represents >60% of Soitec growth

› Majority is in 300mm

› 300 jobs created in France

3/9/20 6

2014-2015 2015-2016 2016-2017 2017-2018 2018-20190

50

100

150

200

250

300

350

400

450

500

38

53 56.7106.3

206

Revenue

200mm 300mm other

RIA: First 300mm RF-SOI and RF/FD-SOI

233 M€850 persons

444 M€1450 persons


ECSEL project dynamic: Soitec serves EDGE-AI and 5G

› BEYOND 5 – a follow-up of REFERENCE - aims to demonstrate European technological sovereignty for:

• 5G infrastructure / IoT

• Automotive communications

• Smart sensors including Edge AI

3/9/20 7

› OCEAN12 fosters the FDSOI Market penetration for Ultra low power highly performant computing

› Bosch announced major investments to develop automotive radars on 22FDX


5G Sub 6GHz: RF SOI an enabler for new applications (IOT / V2X)


RF Technology landscape

RFFE IoT system requirement

RFSOISource: NB-IoT RFFE forecast estimation, Navian 2019

5G mmW: FDSOI and RFSOI assessed by market leaders


Phase shifter

Phase shifter

PA

LNA

SwitchUp/Downconv ADC/DAC

Power splitter

mmW RFSOI sub 65nm / SiGemmW RFSOI sub 65nm / SiGe

Antenna array

Front-end module Transceiver

PLL

FDSOI sub 28nm

DFE

Conversion +DFE

X 4 to 2056 X 4 to 2056 X 4 to 2056

Modem

BB

X 4 to 2056

FDSOI sub 18nm

Different system architecture : trade off on• performance• cost • Area / weight • Players IP / know-how

X 1

GaNGaN

GaAsGaAs

Bulk ‘limited performance – thermal issues’

FF

X 4 to 8 X 4 to 8 X 1 X 1 X 1

FFFFAutomotve Radar Market, split per technology (Source Yole 2019)

Radar: FDSOI ideally positioned in the CMOS approach


Automotve Radar Market, split per technology (Source Yole 2019)

RF Technology landscape

mmW automotive radar requirement

› Further develop RF-SOI as a 5G sub 6GHz standard with potential communication up to 28GHz

› Further develop FD-SOI towards a 5G mmWave standard but also other applications including sensors and AI

• Best in class for density, power and speed.

› Demonstrate European technological sovereignty for 5G infrastructure / IoT, automotive communications and intelligent RF sensors

3/9/20 DATE / SOI Session Soitec proprietary & confidential – no copying or distribution permitted11

ECSEL project dynamic

Next: AI inference moving to the edge: Low-power solutions are required

3/9/20

Cloud Already developped

(More’s Moore driven)

Cloud Already developped

(More’s Moore driven)

EdgeEmerging

Multiple techno / standards

EdgeEmerging

Multiple techno / standards

Very EdgeFuture

Empty space for now

Very EdgeFuture

Empty space for now

Source: IMEC, ITF2018

AI InferenceAI Inference

Sensors

Cost

Latency / reliability

Data privacy

Power consumption

4 drivers pushing AI at the edge

12 DATE / SOI Session Soitec proprietary & confidential – no copying or distribution permitted

Next: SiC for green emobility› Automotive Industry needs SiC for EV

50% in overall size reduction

Model S

Model X

SiC

SiC

Si

Si

(+10%) 370 miles

(+10%) 325 miles

Lower electrical losses

USA ~82%

Japan / Korea ~ 14%

China ~ 3%

Europe <1% (captive)

Single source

Large volumes

Risk of delivery shortageNEED

CHALLENGE

Solution

Source: Tesla blog – April 2019

Source: STMicroelectronics, APEC 2019

Source: AUDI courtesy, Jan 2020

› SiC supply: a real Challenge for European OEMs

› Soitec target: A new SiC substrate standard

• Enabling better performances, lower wafer cost, improved yield and more stable solutions

• From 150mm up to 200mm

3/9/20 13

› Ambition from the application perspectives

• Provide technology solutions for a climate neutral eMobility

• Foster a trusted and secure European supply chain for SiC solutions


Take aways

› Innovation in nano-electronics starts at substrate and material level

› Soitec brings green technologies and solutions for European autonomy

• With its low consumption capacity, FD-SOI the key technology for Edge-AI

• New SiC “Smart Cut” technology contribute to Climate neutral

› ECSEL JU is crucial to structure the European collaborative ecosystem


Oct. 2018 S3S Conference Soitec Proprietary Copyright @ 2018 Soitec 15

Technology Design

SystemApplication

RTO / Universities

2020

2016

2018

THANK YOU !


Thank you

Follow us on:

For more information, visit us at:

Soitec@Soitec_FR / @Soitec_ENSoitec

www.soitec.com

16 DATE SOI Session Soitec proprietary & confidential – no copying or distribution permitted3/9/20

Documents

Impact of SOI technology through ECSEL project dynamic€¦ · GLOBAL PRESENCE. Substrates in the value chain 3/9/20 3 DATE / SOI Session Soitec proprietary & confidential – no