Introduction of EMC for Various Applications

EMC Technology Roadmap CY Past 2013 2014 2015 2016 2017 2018 2020 2022

Event

High Density

High Power High Speed

Environmentally Friendly / Low Cost

Optical Transparent

Ag Reflection

Heat Resistant Si Photonics

SiC Cu Wire Ag Wire 18wafer TSV Air gap Printed Electronics Silicone

Photonics

P/FBGA

(T)SOP/T)QFP

DIP/TO/DPAK

OPTO/MEMS

PIP

POP

MUF

WL(CS)P

Stack+Mtrix

FOWLP

FLIP (no flow)

Power Module

POP/OMUF

TSV

SiP/TSV

PKG Design

Mold Under Fill Particle size (um)

Compression Powder / Sheet

Heat Resistance Durable Temp. (deg.C)

Heat Dissipation

Heat Dissipation Thermal Conductivity (W/mK)

Cu/Ag wire Impurity (Cl-)(ppm) Long Life/Low Temp Cure

Store Temp. (deg.C) Hybrid Metal

LED

45um 20um 10um 1um Nano KE-G1250FC

KE-G1250AH Powder Variation MUF/High Thermal Conductivity

175degC 200degC 250degC KE-G3000D KE-G1250DS Non-Conductive Colorant

3W 4W 6W 10W KE-G1250HT

25W 130W 200W CT285 CT2800>R7

200W/150 deg.C: 2nd gen. Printable PE: Printed Electronics

Roll to Roll

30ppm 10ppm 5ppm KE-G1280TS/KE-G3000DK

Wearable Package

20degC 40degC XKG-G5932(Long Floor Life) Room Temp. Storable (No Freezer)

Ag/SiO2 Ag/Cu Ag/SiO2+Nano CT2001E/CT2020E

CT288 CT227 XT2815R

KE-G1250SS Prot. Variation Large MAP/WLP/Transparent

Low Cost / High Reliability

High Thermal Conductivity Interface

Narrow Gap Fill

Molding Compound Die Attach Paste

http://www.google.co.jp/url?sa=i&rct=j&q=&esrc=s&frm=1&source=images&cd=&cad=rja&uact=8&ved=0CAcQjRw&url=http://tokyodevices.jp/items/131&ei=d8LRVO7BOqK2mwX1hYGgAQ&psig=AFQjCNHWoLKiC47EMch5NJVD3BwJgKQN0g&ust=1423119310466470http://www.google.co.jp/url?sa=i&rct=j&q=&esrc=s&frm=1&source=images&cd=&cad=rja&uact=8&ved=0CAcQjRw&url=http://www.ictradenet.com/SBR20A100CT/&ei=esPRVPWkLqfHmAWxmYGgCg&bvm=bv.85076809,d.dGY&psig=AFQjCNG6sb27ZGUfVGmEcF0ssjXYiDE2-A&ust=1423119564011825http://www.google.co.jp/url?sa=i&rct=j&q=&esrc=s&frm=1&source=images&cd=&cad=rja&uact=8&ved=0CAcQjRw&url=http://www.marutsu.co.jp/pc/i/41174/&ei=_cPRVLXmEeHdmAWQnIK4Cw&bvm=bv.85076809,d.dGY&psig=AFQjCNEoxa2eM6lj4MAvHN-6RkfEjrJpsg&ust=1423119702763568http://www.google.co.jp/url?sa=i&rct=j&q=&esrc=s&frm=1&source=images&cd=&cad=rja&uact=8&ved=0CAcQjRw&url=http://www.ledslamparasahorradoras.com.mx/content/9-led-smd&ei=ccTRVInjJ-K1mwWt_4D4Bw&bvm=bv.85076809,d.dGY&psig=AFQjCNEq506XuZKlSK4zdfH4XriLnQ0zng&ust=1423119806838129http://www.google.co.jp/url?sa=i&rct=j&q=&esrc=s&frm=1&source=images&cd=&cad=rja&uact=8&ved=0CAcQjRw&url=http://www.rlocman.ru/datasheet/data.html?di=74625&/MCF5272VM66&ei=6L_RVMuANqHBmAW6uYCgBg&bvm=bv.85076809,d.dGY&psig=AFQjCNFnPXK6GSLbDBNzWq0FbR2AscjI6A&ust=1423118617356324http://www.google.co.jp/url?sa=i&rct=j&q=&esrc=s&frm=1&source=images&cd=&cad=rja&uact=8&ved=0CAcQjRw&url=http://www.marutsu.co.jp/GoodsListNavi.jsp?fmt=json&limit=50&path=%E5%8D%8A%E5%B0%8E%E4%BD%93&s10[]=3&s2[]=%E8%A1%A8%E7%A4%BA%E3%81%AA%E3%81%97&sort=Score,number1,number2,number3&style=0&ei=ScbRVOLHK4iymAWqyoGwDg&bvm=bv.85076809,d.dGY&psig=AFQjCNHDBcCVDIPMZqm4vThSKn2fcRXepg&ust=1423120217254201http://www.google.co.jp/url?sa=i&rct=j&q=&esrc=s&frm=1&source=images&cd=&cad=rja&uact=8&ved=0CAcQjRw&url=http://news.mynavi.jp/news/2010/07/28/044/&ei=-g7SVJKNNeX6mQXG9oCoAQ&psig=AFQjCNHYQNGlXsWGfreB7JOOBmVnVILRJA&ust=1423138777724835http://www.google.co.jp/url?sa=i&rct=j&q=&esrc=s&frm=1&source=images&cd=&cad=rja&uact=8&ved=0CAcQjRw&url=http://techon.nikkeibp.co.jp/article/NEWS/20031121/60293/&ei=RA_SVIisBMTXmgXLyICoBA&bvm=bv.85076809,d.dGY&psig=AFQjCNHQWa141GWRWAzuOVwuEN1P7C-dHQ&ust=1423138988638987http://www.google.co.jp/url?sa=i&rct=j&q=&esrc=s&frm=1&source=images&cd=&cad=rja&uact=8&ved=0CAcQjRw&url=http://www.technoalpha.co.jp/products/mems/isorg.html&ei=RBKQVLaJCcLWmAX7hoKQBA&bvm=bv.82001339,d.dGY&psig=AFQjCNEn0Yxn-tzfCFZBkW7awPAVV226-Q&ust=1418814244158913

Product Line-up

BGA Package Product Line-up

Package PBGA/FBGA MUF High thermal High permittivity (Finger print sensor) Compression mold

EMC KE-G1250 Series KE-G1250FC Series KE-G1250HT Series

KE-G1250 HK Series

KE-G1250 AH Series

Features

Lower warpage Good moldability Low ion impurity for vamdole

Lower warpag Good narrow gap flowability

Various thermal conductivity (1W, 3W, 4W) High thermal conductivity (6W) High reliability Good moldability

Various premittivity (Dk: 7, 11, 25) Halogen Free High reliability

Thermal conductivity Halogen Free Good moldability High reliability

Result Taiwan China China Taiwan

Taiwan SEA

China Taiwan

Japan China SEA area Taiwan

SMD Package Product Line-up

Package

SO QFP TSOP QFN Small SMD

EMC KE-G5000 XKE-G7445

KE-G3000 series XKE-G7675

XKE-G7426 XKE-G7707

KE-G3000NAS series KE-G300 series

Features

Low water absorption MSL Lv1

High adhesion (PPF) Low water absorption MSL Lv1 Sulfur free for automotive use

Good flowability (Stacked Chip) Low water absorption MSL Lv1 Warpage control

Good flowability (for MAP) Low water absorption MSL Lv1 Warpage comtrol

Good flowability MSL Lv1

Result Japan Japan Japan Korea Japan

Discrete package Product Line-up

Package

TO Diode DIP Small signal Full Pack D-pak

EMC KE-G300FH KE-G300FA XKE-G7039 KE-G300FF KE-G300FR KE-G300FY

KE-G850 KE-G3000DM XKE-G7883

Features High adhesion for Ni-plate Halogen free Good moldability

Halogen free Good moldability

Halogen free Good moldability High reliability

Halogen free Good moldability High reliability

Thermal conductivity Halogen free Good moldability High reliability

High adhesion Low absorption Low stress

Result Japan SEA area China

Japan Japan Japan SEA area China

Japan SEA area Japan

http://www.google.co.jp/url?sa=i&rct=j&q=&esrc=s&frm=1&source=images&cd=&cad=rja&uact=8&ved=0CAcQjRw&url=http://www.datasheetdir.com/package-TO-247&ei=b9TJVN28OoLTmgWGwIKACQ&bvm=bv.84607526,d.dGY&psig=AFQjCNEa4yAegs469-iwFHm2OZEZcUbc-w&ust=1422599559734566

Module Package Product Line-up

Low stress

Lower stress High Tg

High flowability

75mm55mm

Low CTE

Higher Tg High flowability

KE-G1220A-M3F

KE-G1250LM-S

XKE-G7016

KE-G1270M KE-G1250DS-X6

Flame retardant free

Alternative flame retardant

KE-G1270T

KE-G1250LKDS

KE-G1270

KE-G1250WS-C

High filler loading

Shorter resin bleed

KE-G1280TS

EMC for Ag Wire / Coated or Bare Cu wire (BGA)

Compound Unit KE-G1250TC-SL KE-G1250TC-SU XKE-G7708

(KE-G1250 LKDS MW) XKE-G7375

Feature -

Transfer type EMC Transfer type EMC Transfer type EMC Transfer type EMC

For Ag / Bare Cu wire

For Ag / Bare Cu wire

For Au / Cu wire For Ag / Bare Cu wire

Low modulus Low impurity

Epoxy Resin - Modified multi. Modified multi. Modified multi. Modified multi. Filler Content % 87 87 88 87 Filler Shape

(Spherical / Crush) - Spherical Spherical Spherical Spherical

Properties Spiral Flow (70Kgf) cm 180 160 180 170

Gel Time s 45 45 45 50 Flow Viscosity Pa s 5 5 5 6

CTE - a1 E-5 /oC 0.9 1.0 0.9 1.0

- a2 E-5 / oC 3.8 3.9 3.4 3.7 Tg oC 150 135 145 140

Flexural Modulus 25oC GPa 23 23 24 23 240oC GPa 1.0 0.9 0.8 0.8

Hot Hardness (Barcol) - 85 84 84 84 Specific Gravity - 1.97 1.97 1.98 1.98

Water Absorption (PCT) % 0.40 0.40 0.40 0.32 Flammability UL-94 - V-0 V-0 V-0 V-0

Mold Shrinkage % 0.18 0.23 0.11 0.13 Impurity Cl- ppm 6.0 6.0 10 3.5

Na+ ppm 2.0 2.0 2.0 2.0 pH - 6.0 6.0 6.0 6.2

General Properties for MUF (FC-25D2 Series)

Item Unit KE-G1250 FC-25D2 KE-G1250 FC-25D2-1

KE-G1250 FC-25D2-2

KE-G1250 FC-25D2-3

Feature

Resin System - Modified

Multifunctional Modified

Multifunctional Modified

Multifunctional Modified

Multifunctional

Filler Sieving Size um 25 25 25 25

Filler Content % 88 88 87 87

Spiral Flow Cm 145 145 140 140

Gel Time S 52 52 52 52

Flow Viscosity Pa.s 16 16 16 12

CTE a1 ppm/degC 9 9 9 10

CTE a2 ppm/degC 37 38 38 40

Tg degC 131 131 131 131

Specific Gravity - 1.99 1.99 1.99 1.98

Water Absorption % 0.40 0.42 0.43 0.43

Mold Shrinkage % 0.18 0.22 0.25 0.29 Ionic Impurity Cl- ppm 10 10 10 12

pH - 6.0 6.0 6.0 6.0

General Properties for MUF (FC-K Series)

Item Unit KE-G1250

FC-K KE-G1250

FC-K-M KE-G