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IT3-32mm SI Report Three-Piece Mezzanine Connector for 20+ Gbps Applications. October 29, 2009. Outline. What is IT3 HFSS simulation models for connector and via Insertion and return losses, NEXT, FEXT, and impedance profile Insertion loss to crosstalk ratio (ICR) - PowerPoint PPT Presentation
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IT3-32mm SI Report
Three-Piece Mezzanine Connectorfor 20+ Gbps Applications
October 29, 2009
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Outline
What is IT3 HFSS simulation models for connector and via Insertion and return losses, NEXT, FEXT, and
impedance profile Insertion loss to crosstalk ratio (ICR)
Fully populated vs. 50% density Connector-only vs. full channel
Eye diagrams Summary Appendix
Measurement vs. simulation correlation Measured ICR for IT3-25mm
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What is IT3
Proven 3-piece design for improved electrical performance and mechanical reliability
Signal Ground
Interposer
Signal / Ground configuration
Mating sideMating / unmating
Locking latch
Mating receptacleIT3D-***S-BGA(**)
Interposerassembly
Mounting sideInstalled and locked
Mounting receptacle IT3M-***S-BGA(**)
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HFSS simulation model
A .s60p file was created, and the differential pair’s response was examined.
Only a quadrant of model is shown.
54321
109876
Signal pin
Ground pin
Differential pairs
1514131211
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Via modelLayer No. Mil
Solder mask 0.51 TOP 2.84
Pre-preg 4.52 Ground 0.7
Core 33 Sig 1 0.7
Pre-preg 3.54 Sig 2 0.7
Core 35 Ground 0.7
Pre-preg 3.56 Ground 0.7
Core 37 Sig 3 0.7
Pre-preg 3.58 Sig 4 0.7
Core 39 Ground 0.7
Pre-preg 3.510 Ground 0.7
Core 311 Sig 5 0.7
Pre-preg 3.512 Sig 6 0.7
Core 313 Ground 0.7
Pre-preg 3.514 Ground 0.7
Core 315 Sig 7 0.7
Pre-preg 3.516 Sig 8 0.7
Core 317 Ground 0.7
Pre-preg 3.518 Ground 0.7
Core 319 Sig 9 0.7
Pre-preg 3.520 Sig10 0.7
Core 321 Ground 0.7
Pre-preg 3.522 Ground 0.7
Core 323 Sig11 0.7
Pre-preg 3.524 Sig12 0.7
Core 325 Ground 0.7
Pre-preg 3.526 Ground 0.7
Core 327 Sig13 0.7
Pre-preg 3.528 Sig14 0.7
Core 329 Ground 0.7
Pre-preg 4.530 BOTTOM 2.84
Solder mask 0.5121.78Total thickness (mil)
A .s60p Touchstone file was also created to study the effect of via stub and coupling.
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IEEE 802.3ap channel spec.
IEEE 802.3ap defined the channel spec. of insertion-loss-to-crosstalk ratio (ICR) up to 5 GHz for 10 Gbps data rate. We will extrapolate this ICR curve to 10 GHz for 20 Gbps data rate.
5
log7.183.23 10GHzf
10 GHz (for 20 Gbps)
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Connector’s ICR
The connector and via transition’s contribution to ICR is independent of channel length, because the insertion loss and crosstalk attenuate at the same rate.
Board A
Board B Insertion loss
FEXT
Board A
Board B
Insertion loss
NEXT
ICR wrt. FEXT:
ICR wrt. NEXT:
Connector and via transition is assumed to be at approximately the middle of channel.
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IT3-32mm connector-only response(Fully populated)
Impedance and delay @1 GHz
All insertion and return losses, and NEXT and FEXT are shown.
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IT3-32mm connector-only response(60% density)
Both NEXT and FEXT are reduced, if some pins are skipped (i.e., terminated or assigned to low-speed signals).
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IT3-32mm connector-only response(50% density)
Even less NEXT and FEXT with 50% density.
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Impedance @60ps rise time (20% to 80%)
IT3’s receptacles were designed to have slightly high impedance to offset the via’s and via stub’s low impedance.
Connector only Connector + ~60mil via stubs
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ICR in a full channel(Fully populated)
ICR with 14-aggressor connector and via FEXT, and ~60 mil stub meets the extrapolated IEEE 802.3ap spec. for 20 Gbps.
6”
6”
IT3
120 milFR408
60 mil stub Via model
FEXT for via-connector-via(w/o trace attenuation)
ICR with 14 FEXTs
20 Gbps
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ICR in a full channel(50% density)
ICR with 6-aggressor connector and via FEXT, and ~60 mil stub gives plenty of margin @20 Gbps, as compared to the extrapolated IEEE 802.3ap spec.
6”
6”
IT3
120 milFR408
60 mil stub Via model
ICR with 6 FEXTs
20 Gbps
FEXT for via-connector-via(w/o trace attenuation)
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Channel simulation @6.25 Gbps(Fully populated)
ADS simulation with 3-tap TX equalization gives good open eyes @6.25 Gbps with ~60mil via stub and 14 FEXT included.
Without connector
Jitter = 15.06ps
Eye Height = 987.57mV
With connector and 14 FEXT
Jitter = 18.57ps
Eye Height = 866.27mV
6”
6”
IT3
120 milFR408
60 mil stub Via model
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Channel simulation @12.5 Gbps(50% density)
ADS simulation with 3-tap TX equalization gives good open eyes @12.5 Gbps with ~60mil via stub and 6 FEXT included.
Without connector
Jitter = 12.44ps
Eye Height = 579.12mV
With connector and 6 FEXT
Jitter = 18.48ps
Eye Height = 469.88mV
6”
6”
IT3
120 milFR408
60 mil stub Via model
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Channel simulation @20 Gbps(50% density)
ADS simulation with 7-tap TX equalization gives good open eyes @20 Gbps with ~60mil via stub and 6 FEXT included.
Without connector
Jitter = 12.89ps
Eye Height = 320.58mV
With connector and 6 FEXT
Jitter = 19.39ps*
Eye Height = 194.93mV*
6”
6”
IT3
120 milFR408
60 mil stub Via model
*Degradation is mainly due to via stubs.
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Summary
IT3 meets the extrapolated IEEE802.3ap’s ICR spec. for 20+ Gbps.
Both characterization and demo boards are available for evaluation.
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Appendix A
Measurement vs. simulation correlation
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Measurement Setup
To measure the connector’s performance directly, we pre-characterized and de-embedded the test boards.
- =
Connector + Test Boards Bottom Test Board Top Test Board Connector Only
Bottom test board
Top test board
-
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Insertion and return losses
Good correlation in differential insertion and return losses.
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NEXT
Good correlation in differential NEXT.
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FEXT
Good correlation in differential FEXT.
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Appendix B
Measured ICR for IT3-25mm
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Test board
VNA measurements were taken on 120mil test boards with IT3-25mm connector, 2 via transitions, and 6”+6” PCB traces routed through the middle layers.
* The ICR curves in the following slides will also be valid for other trace length.
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Optimized 60% density for 20 Gbps
IT3 meets ICR spec. (with FEXT) for 20 Gbps if 40% pins are “skipped”.
ICR wrt. NEXT* ICR wrt. FEXT*
* These curves include 8 aggressors for one IT3-25mm connector and two via transitions. The skipped pins are terminated in this case.
“Skipped” pins
Victim pair13
15
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W U R N L J G E C A