Place, Press, Process

Totally new dimension analysis system

Instant Measurement

Image Dimension Measurement System

IM-6500 Series Wide-fi eld Model

NEW

Instant measurement is provided by a totally new dimension

analysis system which defies traditional metrology techniques.

Data is obtained using a system based on the same optical

technology that provides digital microscopes with the industry-

highest resolution, the image processing technology that

gives overwhelming power of problem solving to vision

systems, and now with the reliability that is needed for factory

automation environments.

Incomparable with Conventional Systems

Instant Measurement

P L A C E , P R E S S , P R O C E S S

2

The power of quality imaging optics

and optical design technology used in digital microscopes

has achieved a revolutionary lens system which captures the precise shape of a target.

Precise shape recognition and the detection of fine features.

The image processing technology cultivated through vision

system development has achieved high-precision dimensional

measurement.

Delivering an essential product when the customer needs it most.

The policy established in factory automation environments will also be applied to

measurement systems.

Any issues encountered by the customer will receive our full backing.

Direct sales from the manufacturer without using agents or distributors.

Technically-knowledgeable sales representatives offer careful support to solve customers'

problems quickly.

Optical design technology

Optical

Technology

Pattern matching algorithm

used by vision systems

Image processing technology for

recognizing fine features

Image Processing Technology

Strength 1

Strength 2

Strength 3

Reliability perfected in

factory automation

environments

Support

SystemSame day

shipment

Directsupport

3

A Totally New Dimension Measurement System Born

from A New Concept which Eliminates the need

for X-Y stages with the IM-6500 Series Wide-field Model

Optical Comparator

Vernier caliper/

micrometer

Measuring

microscopeOptical CMM

Instant Measurement will answer existing issues

associated with conventional methods.

A completely new concept of measuring the dimension of an entire target simultaneously by

eliminating the XY stage has been achieved with place-and-press measurement. It greatly

improves the efficiency of measurement inspections.

√

X

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X

X

X

√

X

X

X

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X

X

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X

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Reduced measurement time

No individual user differences

Easy operation

Easy data management

√

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Optical CMM IM SeriesMeasuring microscope

Optical Comparator

Vernier caliper/micrometer

4

Drastically Reduced Measurement Time

Just place and press: 99 features are measured in seconds.

Just place a target and press the button. Ninety-nine points are measured in

seconds. The system automatically finds and measures targets even when they

are placed in a different location or orientation, which significantly reduces

measurement time.

Eliminating Individual Differences

High-precision automatic measurement using the latest image processing technology

Since the shape of a target is automatically recognized before measurement, the

result is not affected by individual differences such as alignment errors or

variations in the skill level of equipment users. The same results can be obtained

consistently no matter who is taking the measurements.

Easy Setup for Wider Applications

Easy setup by checking the entire image of a target

Even the initial setup is easy, just specify points with the mouse while checking

the entire image of a target. You can easily complete the setup procedure for a

wider range of measurements from outer diameter, circular pitch, and angle

measurements to measurements using virtual lines or points.

Easy Data Management

Statistics/analysis function for easy trend checking or reporting

All measurement results will be saved automatically. The included statistics/

analysis function allows easy checking of the points for improvement and

preparation of inspection records. Of course, measurement data can be imported

to and used on spreadsheet software.

Cost ef f ic iency

Four Features will Support your QCD Improvement.

Shorter lead t imeImproved qual i ty

5

Advanced Lens Technology Drastically Reduces

Inspection Time and Provides One Step Measurement

Advanced Telecentric Lens System Captures the Entire Target in One Image

Most targets have surfaces which are not flat but uneven with height differences.

The most important component to capturing the entire image of a target for

simultaneous measurement was the development of a lens which accurately

generated target images regardless of height differences in the field of view.

For the IM Series, advanced technologies pioneered by the digital microscope

industry were applied to the development of a lens which maintained a clear

focus and constant size even for targets with height differences and which did

not cause distortion along the circumference even in a wide field of view.

6

Clear Focus not Affected by Height Differences

Apparent Feature Size not Affected by Height Differences

Less Distortion Along Circumference

A lens providing high depth of field has been developed to

ensure clear focus even for targets with height differences.

This achieves not only the ability to measure dimensions of

the entire target simultaneously, but also easy setup which

does not require focus adjustment for each measurement

point.

A telecentric lens maintains a constant feature size on the

projected image regardless of the height differences of the

target. This is essential for accurate measurement of

targets with uneven surfaces. The development of a large

diameter lens with a 100 mm (3.94") field of view has

brought a completely new measurement system which

captures the entire target in one image for simultaneous

measurement.

A low distortion lens plays a vital role to achieve accurate

measurement throughout the field of view by satisfying the

measurement accuracy even for the area along the outer

edge of the field of view. Our optical technology

accumulated in the digital microscope industry has

achieved a system providing both a wide field of view and

low distortion.

[High depth of fi eld]

[Telecentric lens]

[Low distortion lens]

Normal camera lens The image is out of focus due to height

differences.

Normal camera lens The recessed features appear smaller.

Normal camera lens The area along the outer edge is shown

distorted.

IM Series The image is in focus regardless of

height differences.

IM Series The top and recessed surfaces are

displayed correctly.

IM Series The image is less distorted throughout

the field of view.

7

Conventional method

(optical comparator)

Just Place and Press to Measure 99 Features in Seconds.

IM Series

Just place a target on the stage and press the button.

The location, orientation and focus are automatically

adjusted. Simple place-and-press operation

measures 99 features in seconds. Anyone can easily

complete measurement in an incredibly short period

of time.

In addition to initial positioning of the target, you

needed to move the stage to measure each point.

The measurement time increases in proportion to the

number of measurement points. The time further

increases when focus adjustment is required.

99 features are measured in seconds.

Every measurement requires more time

All points aremeasured in seconds.

Just place a target

And pressthe button.

Positioning

Focus adjustment

Measurement

Filling out theinspection

record

Moving tothe next point

Repeated for

the number of

measurement

points

SIGNIFICANTLY

REDUCED

INSPECTION TIME

8

The location and orientation of the target placed in the field of view are

automatically adjusted for measurement.

ADVANCED TECHNOLOGIES FOR ACHIEVING "PLACE-AND-PRESS"

MEASUREMENT

ProjectorIn addition to the inspection time, the standby time

during product changeover is also reduced. This helps

improve the facility utilization ratio and reduce costs.

SIGNIFICANT TIME REDUCTION

IM Ser ies

Positioning time Focus adjustment time Measurement time

No need for positioning, focus adjustment, and stage movement

5 minutes or more

5 seconds or less

Industry first

Industry first

Industry first

Pattern search for automatic orientation correction

The location and orientation of the target placed

on the stage are automatically adjusted based on

the recorded shape of the target. There is no need

for positioning of a target or preparation of a jig at

the beginning of measurement. This is literally

place-and-press measurement.

Simultaneous measurement of 99 features by capturing an entire part

This is a completely new measurement system

which measures by capturing the entire image of

a target within the field of view. It does not require

time for alignment of the stage and completes the

measurement of 99 features in seconds.

Measurement time can be reduced significantly

compared with conventional optical comparators,

measuring microscopes and optical CMMs.

Batch measurement for further reduction in measurement time

The dimensions of all targets on the stage are

measured simultaneously. Even when the targets

are placed randomly, it is unnecessary to align

them in a jig because the location and orientation

of each target is automatically adjusted before

measurement. This further reduces measurement

time.

Example: When 5 or more minutes are required to measure 10 points with an optical comparator

Even when many feature are specified on a dimension drawing,

all features can be measured within a few seconds.

Even targets placed randomly are measured simultaneously.

Clicking each target shows its measurement result.

9

Setting differences

Pressure differences

Measurement point selection differences

Alignment differences

Focus adjustment differences

Virtual point calculation differences

Conventional measurement was

susceptible to individual user

differences.

Just place a target and press the button. The location

and orientation of the target are automatically adjusted

and measurement is performed using the specified

points. The measurement is not affected by individual

differences in alignment, measurement points, and

focus adjustment.

The results varied not only among individual users

but also among measurements performed by the

same user depending on the measured features,

specified target edge and focus adjustment.

Latest image processing technology for stable measurement

Different results caused by individual operator habits or skill levels

With the IM Series,

everyone's an expert.

To reliably measurean exact dimensions.

Just place and press

Same Results no Matter who Carried Out the Measurement

Conventional method

(Vernier caliper,

Digital micrometer, projector)

IM Series

ELIMINATING

INDIVIDUAL

VARIATIONS

10

One pixel is

divided into

100 or more

squaresWithout sub-pixel processing

The target is measured by one pixel of the

light receiving element.

One pixel of the light receiving element

With sub-pixel processing

The target is measured by one hundredth or

less of a pixel of the light receiving element.

About 100 points are detected automatically. The shape is recognized by the least square method

using the detected points.

Options for processing abnormal points,

burrs, and chips

Abnormal points (red points) are ignored during shape

recognition.

LATEST TECHNOLOGIES TO “ELIMINATE INDIVIDUAL DIFFERENCES”

Industry first

Sub-pixel processing for measurement down to one hundredth or less of one pixel

One pixel of the light receiving element

is divided into 100 or more squares

and used as a unit for shape

recognition. This allows high-resolution

measurement in a wider field of view.

The optical system is also taken into

consideration to improve accuracy.

A line or circle is recognized using 100 or more points*

The shape of a line or circle used for

measurement is recognized by the

least square fit algorithm using

approximately 100 points detected

automatically. Using many points

ensures stable measurement.

* The exact number of points is user adjustable for optimal detection.

Eliminating discrepancies in results caused by burrs and chips

During the extraction of a line or circle,

the system eliminates the influence of

burrs or chips by ignoring points at

abnormal locations in comparison with

other points. It is also possible to set

the system to interrupt measurement

when burrs or chips are found.

11

Easy measurement using midlines or virtual points

Various options are available for

facilitating the measurement using

midlines or virtual points for which

complicated setup was required.

Moreover, a special menu is available

for measuring small rounded corners,

curved surfaces, and geometric

tolerances such as position or

concentricity.

Easy Setup by Checking the Entire Target

Just click the points to be measured with the mouse

To set up feature inspections, just

select the desired tool from the menu

and roughly specify the measurement

points on the screen with the mouse.

Since the entire image of a target is

displayed, you can set details

intuitively through simple mouse

operations.

Profile comparison & perimeter measurement functions included

The profile tolerance (difference from

the reference dimension) or perimeter

of a target can be measured. The

reference dimension for the profile

tolerance measurement can be

created from CAD data*. The statistics

result can be displayed as an image

for easy trend checking.

* Optional software required

EASY SETUP FOR

WIDER APPLICATIONS

Select a desired measurement type from the menu. Roughly specify the measurement points with the mouse.

Various options including a midline and intersection.

Various options from basic measurement to geometric dimensioning and tolerancing

Just specifying the points along the perimeter of the target will allow profile tolerance and perimeter measurements.

The profile statistics function shows a color-coded image to indicate differences from the reference dimension.

Industry first

12

Measurement

complete

Animation

replay

SUPPORT TOOLS FOR INCREASING FUNCTIONALITY

Industry first

Industry first

NEW

Automatic element extraction function

Just specify the points along the

perimeter of the target, and the

element required for measurement

such as a “line”, “circle” or “arc” is

automatically extracted. All you have to

do now is select an option for

measurement and click the extracted

element.

Measurement Guide and animated navigation for further ease of use

Each inspection tool built into the

onboard software comes with a step

by step Measurement Guide displayed

at the upper right corner of the screen.

Clicking the Play button starts a simple

video guide which illustrates the

procedure in a few easy steps.

Linking to a PC/CAD for further convenience *Optional

Various application software is

available including editor software

which allows setup on a PC in the

same way as on the IM Series, and

import software for loading CAD

diagrams. These applications allow

smooth setup without interrupting

normal inspection schedules.

Highlight the target area. Any lines, circles, or arcs are extracted automatically.

The Measurement Guide displays the next operation.

Animated navigation illustrates the procedure in a few easy to follow steps.

Editor software for enabling setup on a PC Import software for loading CAD diagrams

13

The measurement values are saved automatically and can

be easily organized and processed with the statistics/

analysis function to create analysis of a statistical index,

trend, variations or to prepare inspection records.

Trend

graph

Inspection

Report

Just clickthe menuoption.

Measurement complete

Data

list

Manual recording of results was necessary every

time the operator completed measurement of one

point. There were other tasks such as PC data entry

and processing which required considerable time

and effort. In addition, manual data recording and

input sometimes produced additional errors.

Considerable time and effort required for recording and processing

Easy data analysis and report preparation

Measurement complete

Fill out an inspection

Log

Input Datato a PC

Process withspreadsheet

software

Analysis/inspection Report

Repeated for the

number of

measurement

points

Automatic Saving of Measurement Values.Statistics/Analysis Function for Further Use.

EASY DATA

MANAGEMENT

Conventional method

(Vernier caliper, Digital micrometer,

optical comparator)

IM Series

14

STATISTICS/ANALYSIS FUNCTIONS

Data can be used easily in reports or spreadsheet software.

Inspection records and analysis

reports can be prepared with the press

of a button. No additional work is

required such as data transcription or

input to a PC. It is also easy to import

measurement data to spreadsheet

software for processing.

Trend graph/histogram functions for on-site analysis of product trends and variations

The trend graph/histogram function

allows on site analysis of production

trends and variations. Quick feedback

helps quality management prevent

defective production.

Automatic calculation of major statistical values.Group extraction is also easy.

Critical statistical values required for

inspection reports are automatically

calculated and displayed, including

maximum, minimum, average, σ, 3σ

and CPK. You can also set various

conditions for group extraction for

statistical, analysis, and inspection

records.

Inspection records and reports can be prepared easily.

The trend graph shows tendencies of a product at a quick glance.

Measurement data can also be used easily on spreadsheet software.

Histogram settings can be adjusted as required.

Critical statistical values required for inspection reports are provided by default.

Groups can be extracted on various conditions.

15

Performance and Reliability for Field Use

Highly rigid body and temperature sensor ensures practical installation anywhere.

The highly rigid body and built-in

temperature sensor have enabled

"installation anywhere". Deformation

can be prevented to limits and

temperature compensation ensures

accurate measurement in the field.

Space-saving design small footprint

In addition to the compact body, the

built-in monitor saves significant space

in the installation process. It can be

installed anywhere. These important

features allow you to take your lab to

the production line for immediate part

feedback.

Traceability system

The reference scales used for manufacturing, inspection, and calibration conform to the reference scale of JCSS accredited

calibration laboratories to establish traceability back to the national standard.

Temperature sensor ensures more stable measurement.Frame strength analysis diagram

Projector Measuring microscopeImage Measure IM Series

small footprint

Built-in

temperature sensor

16

Two Types of Illumination for a Wide Range of Measurements

Backlighting

A high intensity green LED light is

mounted at the bottom of the head

unit.Uniform, parallel light has been

achieved through KEYENCE’s

accumulated expertise in lens

development. Optimized illumination

ensures a wide field of view and stable

measurement of targets even with

significant height differences.

Ring epi-illumination

A high intensity white LED ring light

surrounds the image pickup lens.

The light is divided into four parts

along the circumference. These can

be turned on/off individually. These

settings are then retained as part of

the inspection routine, allowing each

individual feature to have individually

optimized lighting settings.

One target can be measured with different illumination types.

Torsion spring

IC

Lead frame

Gear

Plastic cap

Ceramic capacitor

Molded connector

Keypad

17

PC applications

Special PC software is available: A statistics/

analysis viewer for measurement data browsing,

statistics/analysis processing, and report

preparation; a measurement setup editor for

measurement setup; and a CAD import module

for converting CAD diagrams into IM

measurement data.Statistics/analysis viewer

Applicable OS

Windows XP Professional/Home Edition SP3 or later (32-bit version),

Windows Vista Ultimate/Business/Home Premium/Home Basic SP2 or later

(32-bit version), Windows 7 Ultimate/Professional/Home Premium

(32/64-bit version), preinstalled version

CPU Intel Core 2 Duo 1.6 GHz or higher

Memory capacity 1 GB or more (2 GB or more recommended for Windows Vista/7)

HDD free space 1 GB or more

Display color 32 bits or more

Operating system environment

Measurement setup editor

IM-H11E CAD import module

IM-H1C

Optional

Optional

Sapphire glass for the measurement stage

OP-86986 (Normal glass:OP-86985)

System configuration

Optional accessory

Internal LAN

Remote factory

CONVENIENT PC BASED DATA MANAGEMENT

Head

IM-6010/6020

RGB

LAN

USB

Indicator,

buzzer, etc.

Inkjet

printer

Footswitch

Controller

IM-6501E

PC

Monitor

PC

ServerSetting file Setting file

Measurement data Measurement data

NEW

NEW

Central data management

A LAN connection allows you to easily obtain

measurement data or setting files for IM Series

units located in remote locations. You can also

send the setting files created on a PC or one IM

Series unit to another IM Series unit. Managing

data centrally on a server reduces the risk of data

loss.

Coming soon

Coming soon

18

551

240

48226418.98"10.39"

9.45"

21.69"

Specifications

ModelController IM-6501E

Head IM-6010 IM-6020

Image pickup device 1" 6.6 mega pixel CMOS

Display 10.4" LCD monitor (XGA: 1024 x 768)

Light receiving lens Double telecentric lens

Field of viewWide-field measurement mode ø100 mm ø3.94" ø100 mm ø3.94"

High-precision measurement mode – ø25 mm ø0.98"

Minimum display unit 0.1 μm 0.004Mil

Repetition AccuracyWide-field measurement mode ±1 μm ±0.04Mil ±1 μm ±0.04Mil

High-precision measurement mode – ±0.5 μm ±0.02Mil

Measurement accuracyWide-field measurement mode ±5 μm*1

±0.2Mil ±5 μm*1 ±0.2Mil

High-precision measurement mode – ±2 μm*2 ±0.08Mil

External remote input No-voltage input (with and without contact)

External output Comparator output (OK/NG/FAIL) Relay output/rated load: 24 VDC 0.5A/ON resistance: 50 mΩ or less

InterfaceLAN RJ-45 (10BASE-T/100BASE-TX/1000BASE-T)

USB 2.0 series A 6 ports (Front: 2, Rear: 4)

Record Hard disk drive 160 GB

Resistance to environmentOperating ambient temperature +10 to 35˚C +50 °F to 95°F

Operating ambient humidity 20% to 80% RH (no condensation)

Illumination systemCoaxial transparent illumination Telecentric transparent illumination (green LED)

Ring epi-illumination Four division ring illumination (white LED)

Z-axis stageMoving range along Z axis 30 mm 1.18"

Withstand load 3 kg

Power supplyPower supply voltage AC100 to 240 V 50/60 Hz

Power consumption 180 VA max.

WeightController Approx. 8 kg

Head Approx. 24 kg Approx. 25 kg

*1 ±2σ in the range of ø80 mm ø3.15" from the center of the stage at the operating temperature range of +23±1.0°C +73.4±1.8°F degrees at the focused focal point position*2 ±2σ in the range of ø20 mm ø0.79" from the center of the stage at the operating temperature range of +23±1.0°C +73.4±1.8°F degrees at the focused focal point position

Measurement points 99 points max. (99 x 9 points possible when the measurement setting binding function is used)

Pattern search (Profile tracking function) XYθ (with 360° rotary position compensation)

Registration of measurement configuration 1000 or more*3

Basic measurement function

Distance measurement 8 types (point-point/line-point/line-line/circle-point/circle-line/circle-circle/circle/arc)

Angle measurement Provided

Calculation Provided

Virtual line function

Point Middle point/intersection

Conjunction edge Line conjunction/circular conjunction

Line 6 types (midline/perpendicular line/parallel lines/tangent line/line passing through the point/approximate line)

Circle Middle circle/approximate circle/auxiliary circle

Application tool

Pitch measurement Line/circumference

Width measurement Edge width

Thickness measurement Thickness measurement/Gap measurement between inner and outer diameters

Special tool Rounded corner/curved surface/oval/reticle/point position/perimeter

GD&T

Shape tolerance Straightness/circularity/profile

Orientation tolerance Squareness/parallelism

Position tolerance Point position/concentricity

Element tool

Point Point (on a line or arc)/maximum/minimum (rectangle, circle, arc)

Line Line/centerline

Circle Circle/arc

Profile extraction Provided

Special tool Automatic generation

Manual measurement Provided

Coordinate system configuration Provided

Batch configuration of tolerance Provided

Element list editing Provided

Measurement setting data binding function Provided

*3 Depending on the measurement setting data and number of data pieces being stored

Dimensions

173 322

343.313.52"

6.81" 12.68"

Head

IM-6010/6020ControllerIM-6501E

Unit:mm inch

19

Copyright (c) 2011 KEYENCE CORPORATION. All rights reserved. IM6500W-KA-C-E 1041-1 611566 Printed in Japan

* 6 1 1 5 6 6 *

❙ Large depth-of-fi eld: 20x larger than conventional optics❙ Free-angle observation for 360 degree inspection❙ Observe, record and measure - all with a single system❙ 2D & 3D Image Stitching expands viewing area up to

50 times❙ View low-contrast and highly-refl ective targets❙ 0.1x - 5000x magnifi cation range: brightfi eld, darkfi eld,

transmitted, DIC, polarized illumination

54 Million Pixel Digital MicroscopeDigital Microscope