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© 2016 LAPIS Semiconductor Co., Ltd.
LAPIS Semiconductor An IoT enabling company
22nd April, 2016 Wireless Communication Solution development unit.
P. 2 © 2016 LAPIS Semiconductor Co., Ltd.
Who am I
LAPIS Semiconductor, was spun off in October 2008 from Oki Electric Industry Co., Ltd..※ And, it became a member of the ROHM Group. In October 2011, it has changed its name to “LAPIS Semiconductor Co., Ltd.”. ※At that time: OKI Semiconductor Co., Ltd.
Company Name LAPIS Semiconductor Co., Ltd. President Noriaki Okada Address 2-4-8 Shinyokohama, Kouhoku-ku, Yokohama 222-8575 Japan Establishment October 1st, 2008 Capital JPY 400 million Employees 1,107 ( Consolidated )*As of Mar. 31, 2015 Major Product Line Logic LSIs, Memory LSIs, Display driver LSIs, Foundry Service
P. 3 © 2016 LAPIS Semiconductor Co., Ltd.
Rohm’s Growth Engines [LSI Synergy]
Accomplish
Miniaturization/
High-Precision
・Low Noise
・High Speed Response
・Low Power
Consumption
・Software Gyro
Capability
・Small Footprint
・Low Cost
Applications:Wearables, Mobile, Navigation, etc.
Motor drivers work
efficiently
in various loads
by digital control
of microcomputer.
Development and product synergy are created by fusing ROHM’s industry-leading analog technology with LAPIS Semiconductor’s digital expertise solutions.
Technology fusion together with LAPIS
6 & 9 – Axis Sensors
Technology fusion together with Kionix
Motor
Drivers
Pre-driver
Position Sensing Circuit
Power
Heating protection
Micro
Controllers
OCP
3-Phase
PWM
A/D
OSC
RAM
ROM
WDT
Timer
Magnetic Sensor
X-axis
X-axis
Y-axis
Z-axis
Accelerometers
Sensor
Smart Motor Drivers
Development
Example
Development
Example
Development and product synergy are created by fusing ROHM’s industry-leading analog technology with Kionix’s cutting-edge MEMS solutions.
Y-axis
Z-axis
P. 4 © 2016 LAPIS Semiconductor Co., Ltd.
Rohm’s Growth Engines [Sensor Devices]
Analog Front End
Signal Processing
Interface
Non-Volatile Logic
Provides a rich set of Sensor Devices to center the MEMS Technology.
MEMS Photodiode
Gyro
scopes
Barometric
Pressure
Accelerometers
Temperature
Magnetic
Hall Effect
Geomagnetic
UV
Ambient
Light
Optical
Proximity
RGB
Piezoelectric
Ultrasonic
IR
Analog Technology
Specified
Low Power Wireless LAN
EnOcean HD-PLC Wi-SUN
Bluetooth ®
ASIC Wireless Technology
Sensor Technology
Zigbee ®
P. 5 © 2016 LAPIS Semiconductor Co., Ltd.
Rohm’s Growth Engines [Optical Devices]
Combine Optical Devices to support a variety of applications.
LED
Laser Diode
Mold
Ultra-Compact
PICOLED
Reflector
High
Brightness
Ultra-High-Efficiency
LED Power Supply Module
Device + Package + Emission / Control Technologies
CAN
IrDA
Communication
High Heat
Dissipation
Frame
<InGaAlP>
Orange (605nm)
Red (630nm)
Infrared (850~950nm)
Green (560nm)
Yellow - Green (564nm)
Yellow (590nm)
<InGaN>
+ Phosphor Technology
White (0.3,0.3)
Green (527nm)
Blue (470nm)
<GaAs / GaAlAs>
Red (635~660nm)
Infrared (782~842nm)
Photo Tr.
Photo Di
Control Technologies
Sensing Ambient Light Sensors
Motion Sensors
Wireless communication
Wireless Communication Module
Drivers Triac Dimming
PWM Dimming
Linear Dimming
Ultra-High-Efficiency LED Power
Supply Module
92% efficiency
achieved (via converter system)
Energy
Saving
Emission Technologies
TM
Triple
Dimming
Applications
Automotive
Display equipment
Office/
Consumer Electronics Wearable Tech
Measurement
Devices
P. 6 © 2016 LAPIS Semiconductor Co., Ltd.
Rohm’s Growth Engines [Discrete Device]
Taking advantage of advanced compound semiconductors to fulfill a variety of needs.
Developing high power products
that anticipate market needs.
Discrete
semiconductor
Market-leading compact products.
Passives
* Share (2013 results WW) *1 WSTS Survey *2 ROHM Survey
Laser Diodes
Transistors (MOSFETs / Bipolar / Digital)
Resistors (chip)
2014 Sales Ratio by Sector
ROHM has a proven track record and has for many years commanded a large share of the discrete products market
*1 *2 *2
Optoelectronics
Power Devices
[ ] LD for Printer
& MFP
Diodes (Schottky Barrier / Fast Recovery/
Rectification / High Frequency)
*1
10%
SiC-MOS
SiC-SBD
IGBT
IPM, PM 80%
[ SiC for On-board charger ] *2 High Quality, High Automotive
sales ratio
44% 35% 15%
17%
[ Small-Signal Transistors ] [ Chip R ]
[ Small-Signal Diodes ]
[ ] Dual-Wavelength
LD for Player 9%
36%
30%
25%
Consumer
Communication
・PC
Indus
-trial
Automotive
P. 7 © 2016 LAPIS Semiconductor Co., Ltd.
One stop IoT solution
Accelerometer KX022
Geomagnetic Sensor BM1422GMV Low Power MCU
ML620Q504
Gyroscope Pressure Sensor BM1383GLV
Bluetooth Low Energy Module MK71050-03
Gyroscope Accelerometer Pressure
Sensor Magnetometer
Bluetooth
Low Energy IC Low Power
MCU
P. 8 © 2016 LAPIS Semiconductor Co., Ltd.
Rohm Group production locations
LAPIS Semiconductor
Miyagi Co., Ltd. (Miyagi)
*Some assembly processes only
Headquarters(Kyoto)
ROHM Hamamatsu
Co., Ltd.(Shizuoka)
895E07C
Wafer Process (Expanded in Japan)
ROHM Shiga Co., Ltd.
ROHM Electronics Dalian Co., Ltd.
ROHM Electronics
Philippines, Inc.
Assembly Process (Expanded throughout Asia)
ROHM Integrated Systems
(Thailand) Co., Ltd.
ROHM Korea Corporation
ROHM Apollo Co., Ltd.
(Fukuoka) LAPIS Semiconductor
Miyazaki Co., Ltd.
(Miyazaki)
ROHM Semiconductor
(China) Co., Ltd.
ROHM-Wako Electronics
(Malaysia) Sdn. Bhd.
ROHM Wako Co., Ltd.
(Okayama)
P. 9 © 2016 LAPIS Semiconductor Co., Ltd.
Rohm Group production locations
●Design Center
●QA Center
ROHM has established centers in multiple regions to conduct timely development and analysis
and provide optimum support and fast response to quality problems for customers worldwide.
● Singapore
●The USA (Detroit) ●
● Germany
(Dusseldorf)
●
● Yokohama
● San Diego ● Santa Clara ● Thailand
●
● Korea
Shenzhen ●
●
●
● Taiwan
Kyoto
(Station Square) ● Kyoto (Headquarters)
●
●
●
● Shanghai
● India
P. 10 © 2016 LAPIS Semiconductor Co., Ltd.
Rohm Group sales network
>> The USA
- Bangkok
- Kuala Lumpur
- Penang
>> Hong Kong
- Hong Kong
>> Shanghai
- Sao Paulo
>> Philippines
- Manila
>>
Singapore
-Taipei
- Kaohsiung
- Dusseldorf
>> Germany
-
Stuttgart
- Chennai
- New Delhi
- Pune
- Bangalore
- Shenzhen
- Dongguan
- Guangzhou
- Xiamen
- Zhuhai
- Chongqing
- San Diego
- Santa Clara
- Atlanta
-
Chicago
- Detroit
- Mexico
- Denver
- Kyoto
- Yokohama
- Tokyo
- Nagoya
- Nishi-Tokyo
- Takasaki
- Sendai
- Mito
- Matsumoto
- Utsunomiya
- Fukuoka
>> Korea
- Oulu
>> Finland
>> Hungary - Budapest
>>
Russia - Moscow
>> France
>> United Kingdom
>> Spain - Paris
- Milton Keynes
- Barcelona
- Seoul
- Gumi
- Suwon
- Cheonan
- Chan won
>> Dalian
>> Japan
>> Taiwan
>> Malaysia
>>
Shenzhen
>> Brazil >> India
>> Thailand
- Shanghai
- Beijing
- Nanjing
- Qingdao
- Tianjin
- Wuhan
- Hefei
- Suzhou
- Ningbo
- Hangzhou
- Xian
>> Italy
- Besana in
Brianza
P. 12 © 2016 LAPIS Semiconductor Co., Ltd.
Internet of Things
New approach to resolve social problems ⇒ Intelligent network + cloud computing
What can we do for wide variety of demand ?
Food supply Food Safety
Smart Metering HEMS
Infra/Soil- monitor
Disaster Prevention
Agriculture Logistics & Retail
Factory
Supply chain Management
Manufacturing control
- Improvement QCD
Energy Save
Energy
Transportation
Convenient & Safe mobility
cloud
P. 13 © 2016 LAPIS Semiconductor Co., Ltd.
IoT devices
■IoT system consists of “IoT node device”, network equipment and system.
・”IoT node device” may be combination of MCU, Connectivity, Software and Sensor
・Typical example such as ESL, Logger device, RF Tag etc.
・Combining sensing technology with wireless technology with more intelligence, things will be connected to internet.
sense
High constraints, limited resources (power, performance)
think/measure/control actuate/notify
■Quest for lowest power technology, produce world’s No.1 device suitable for various user’s application.
・Each applications have their own key requirement and it is vary.
・MCU+Wireless as platform, variation and differentiation by Sensor and Control
P. 15 © 2016 LAPIS Semiconductor Co., Ltd.
BLE
BLE BLE
BLE
Smart Phone as network HUB
Bluetooth in IoT --- typical case
cloud
P. 16 © 2016 LAPIS Semiconductor Co., Ltd.
①Bluetooth Beacon generated by infra side
②User receive Beacon by their smart phone
Information flow from Infra side to terminal
Beacon Broadcaster
BLE
Bluetooth Beacon --- typical case
P. 17 © 2016 LAPIS Semiconductor Co., Ltd. ①User broadcast information by Beacon
②SynapSensor unit located at infra side receive Beacon and transfer information to 920MHz radio network
920MHz band
BLE
920MHz band
Connector 各種サービス Services
BLE
920MHz band
BLE
BLE BLE BLE
Information flow from terminal to Infra side
Point I Any device such as smart watches can be connected to cloud server II Location X Sensing IoT infra produce various service models. III As Bluetooth LE uses 2.4Ghz band, 920MHz RF to avoid interference.
cloud
SynapSensor
P. 18 © 2016 LAPIS Semiconductor Co., Ltd.
In case of Hotel stuff is urgently requiring support from others, by pressing a key of wrist watch to make
alert to others.
At Hotel or Retail stores
18
P. 19 © 2016 LAPIS Semiconductor Co., Ltd.
Manage human resources and materials, machine
condition by single system.
At Plant or Office
19
P. 20 © 2016 LAPIS Semiconductor Co., Ltd.
Location of personnel, time duration can be managed as
security system.
At School or Hospital
P. 22 © 2016 LAPIS Semiconductor Co., Ltd.
Bluetooth SMART / Sub-GHz
Wireless Products
bit rate
distance
Use environment
LSI:ML7105 Module:MK71050
USB Evaluation kit BLE-Sheild
for Arduino
Built-in CPU :ML7416
(Wi-SUN)
LSI:ML7396
(920MHz) ML7396B Evaluation kit
Wi-SUN PHY certification
1st acquisition
wearable Home Area Network Office / Factory Metropolitan Area NW
Low Power
High performance
P. 23 © 2016 LAPIS Semiconductor Co., Ltd.
2014 2015 2016 2017
RFID (800/900MHz)
Sensitivity Controlled & High throughput RFID ML7900
R & D / RFID TEG
Ambient RF Energy Harvest
△WS
Sub-GHz RF (High Data Rate)
RF ML7396
RF+MCU ML7436
RF+MCU ML7426
Cortex-M0+ Cortex-M3 LAPIS Low Power MCU
MCU Integrated
△ES
RF+MCU ML7416
Bluetooth Smart (2.4GHz)
BLE+MCU ML7105
BLE+MCU ML7125
BLE+MCU ML7135
Low Power / MCU integrated Cortex-M0 Cortex-M0+
Active Current: 9mA Active Current: 5mA Active Current: 3mA
Next Gen BLE
BLE+MCU / HS ML71xx
Active Current: below 3mA
△WS
NFC (13.56MHz)
(Battery-less) NFC+MCU ML620Q7xx
R & D / NFC TEG NFC+BLE ML71xx
Wireless combo
Battery-less / BLE combo
Sub-GHz RF (Low Data Rate)
RF ML7344
RF ML7345
△ES
RF ML7411 / ML7404
Hi-performance & Hi-data rate / Long-distance
LSI Product Roadmap
P. 24 © 2016 LAPIS Semiconductor Co., Ltd.
MK71050-03 Bluetooth SMART module
■ Bluetooth SIG Core Spec v4.0 ■ TELEC/FCC/IC/CE certified ■ Design by Insight SiP using Lapis ML7105 LSI
MK71050-03 overview
・Bluetooth SIG Core Spec v4.0
・Operating voltage 1.8 to 3.6V
・Operating temp. -20 to +70℃
・Current consumption (Typ.)
- Tx 9mA
- Rx 9mA
- Sleep 0.8uA
・Radio certification
TELEC,FCC,IC,CE
・Bluetooth ®Qualfied Design (End Product QDID:66491)
・ML7105 produced by Lapis
・26MHz crystal oscillator
・Module size
10.7x13.6x1.78mm
Ultra Low
Power RF
Bluetooth v4.0
Link Layer H/W
GPIO
I2C
UART
SPI
MP now
Lenear/
Switching
REG 1.2V/0.9V
Pattern
Anntena Host
MCU
MK71050-03
Module
ML7105
BLE LSI
Switch Battery
3.3V
Master Clock Oscillator
26MHz
EEPROM
Low Power Oscillator
32.768kHz
P. 25 © 2016 LAPIS Semiconductor Co., Ltd.
SiP module enables IoT
Bluetooth SMART LSIs
Sub-GHz RF LSIs
Wireless modules
IoT Reference
design
IoT module with SiP
technology
Small, Low Power, combination of functions, Lapis/Rohm produce IoT module with SiP technlogies
P. 26 © 2016 LAPIS Semiconductor Co., Ltd.
SiP module enables IoT
Bluetooth and/or
SubGHz
Application CPU
Gyroscope Accelerometer
Pressure
Sensor
Magnetometer Baseline function with
Wireless connectivity
&
and/or
and/or
Combination of baseline function and sensor(s) cover many use cases
Lapis will produce tailor made IoT solution optimized for each use cases
SiP technology is one of solution to enable individual customer’s requirement
Radio certification and qualification : ready to go solution
Reference application code shorten customers development time
IoT module development on going now.
Temperature
and/or
Ambient Light