LCTPC/LPWP-10th phonemeeting

27/09/2006 Ron Settles MPI-Munich/DESY 10th WP phonemeeting 27 September 2006

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LCTPC/LPWP-10th phonemeeting

– Date 27 September 2006 – Time

• 7:00 west coast• 10:00 east coast• 16:00 central Europe • 23:00 Japan

– To join, Phone +494089981390 code 52872#


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Agenda for 10th WP phonemeeting(in future the meetings will be managed via http://ilcagenda.cern.ch/)

AGENDA -1.News

Formation of the LCTPC/LP CollaborationWWS-R&D-panel tracking review at Beijing

-2.WP meetingTPC R&D planning (Takeshi)WP meeting, other contributions (whoever is ready)

-3.Future meetings -Eudetmeeting at MPI 18-20 October -Valencia European WS 6-10 November -Beijing Asian WS February 3-7 February


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AGENDA -1a.Formation of the LCTPC/LP collaboration -The proposed structure is shown on the next foil #4. -The Collaboration-Board (CB) of group representatives is

complete for the groups on foil # 5 -Names of both CB and TB are shown on foils #6,7. -A proposal by the interim-SP for the next steps was sent to

the CB and TB and the first collaboration phonemeeting was held on 20.09.2006:

-There it was said that the structure should be kept simple and that the collaboration must be open to new groups.

-It was decided that each region independently select a Regional Coordinator, via vote by that region’s CB members, to replace the interim SPs, and that the 3 Regional Coordinators would choose a chairperson who is the sole Spokesperson.

-This should take place a.s.a.p. so that the organization process can proceed without delay; the interim-SPs will organize the selection process for their region.


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Formation of the LCTPC/LP collaborationThe proposal is to have:1)Three coordinators, one chosen by each region. These spokespersons (SP)coordinate the work of the following two boards:

2)The collaboration board (CB), consisting of one representative from eachgroup or set of groups (the group leader, principle investigator or otherchosen member). Each CB member looks after the resources for its group(s)(money and people).

3)The technical board (TB), consisting of the existing workpackage (WP)conveners. The TB will ensure the technical integrity of their WP andcompatibility with other WPs while maintaining close contact with thecollaboration.

This structure now exists. 1) We are three interim coordinators and areto be replaced by chosen ones in the course of this formation phase.2) The CB is (almost) complete. 3) The workpackages and WP convenerswere identified during the first half of this year. The names of CB andTB members are listed in the next slide.


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LCTPC/LP Groups (19Sept06) AmericasCarleton MontrealVictoriaCornellIndianaLBNL

Purdue (observer)

EuropeEuropeLAL OrsayLAL Orsay IPN OrsayIPN Orsay

CEA SaclayCEA SaclayAachenAachenBonnBonnDESYDESY

U HamburgU HamburgFreiburgFreiburg

MPI-MunichMPI-MunichTU Munich TU Munich (observer)(observer)

RostockRostockSiegenSiegenNIKHEFNIKHEF

NovosibirskNovosibirskLundLundCERNCERN

AsiaAsiaTsinghuaTsinghua

CDC:CDC:HiroshimaHiroshima

KEKKEKKinki UKinki USaga Saga

KogakuinKogakuinTokyo UA&TTokyo UA&T

U TokyoU TokyoU TsukubaU Tsukuba

Minadano SU-IITMinadano SU-IIT Other groups

MITMITMIT (LCRD)MIT (LCRD)Temple/Wayne State (UCLC)Temple/Wayne State (UCLC)YaleYaleKarlsruheKarlsruheUMM KrakowUMM KrakowBucharest Bucharest


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The CB members are:==================--Americas-Carleton: Madhu DixitMontreal: Jean-Pierre MartinVictoria: Dean KarlenCornell: Dan PetersonIndiana: Rick Van KootenLBNL: Mike Ronan

--Asia-Tsinghua: Yuanning Gao

For the following CDC groups: Akira SugiyamaHiroshima

KEKKinkiSaga

KogakuinTokyo U A&T

U TokyoTsukuba

Mindanao


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--Europe-LAL Orsay/IPN Orsay: Vincent LepeltierCEA Sacly: Paul ColasAachen: Stefan RothBonn: Klaus DeschDesy/UHamburg: Ties BehnkeEudet: Joachim MnichFreiburg: Andreas BambergerMPI-Munich: Ariane FreyRostock: Henning Schroeder (deputy: Alexander Kaukher)Siegen: Ivor FleckNikhef: Jan TimmermansNovosibirsk: Alexei BuzulutskovSt.Peterburg: Anatoliy KrivchitchLund: Leif JonssonCERN: Michael Hauschild (deputy: Lucie Linsen)

--Groups with Observer status-TU Munich: Bernhard Ketzer

Purdue: Ian Shipsey

--Replies still missing from:MITYale

KarlsruheKrakow

Bucharest


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The TB members are:==================1) Workpackage Mechanics Ron Settles a) LP design (incl. endplate structure) Dan Peterson b) Fieldcage, laser Ties Behnke c) GEM panels for endplate Akira Sugiyama d) Micromegas panels for endplate Paul Colas e) Pixel panels for endplate Jan Timmermans f) Resistive foil for endplate Madhu Dixit2) Workpackage Electronics Leif Jonsson a)"Standard" RO/DAQ sytem for LP Leif Jonsson+Postdoc b) CMOS RO electronics Harry van der Graaf c) Electronics for LCTPC Luciano Musa3) Workpackage Software Peter Wienemann a) LP SW, simul./reconstr.framework Peter Wienemann b) TPC simulation, backgrounds Stefan Roth c) Full detector simulation Keisuke Fujii4) Workpackage Calibration Dean Karlen a) Field map Lucie Linssen b) Alignment Takeshi Matsuda c) Distortion correction Dean Karlen d) Radiation hardness of materials Anatoliy Krivchitch e) LP Gas/HV Eudet Postdoc


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AGENDA -1b.Tracking review at Beijing:

………some info………


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AGENDA -2a.TPC R&D planning (Takeshi)-Opinions/discussion on how to stage LP; LP1 and

LP2 (LP1.5?)? -The available beam time, which may well be

known among the EUDET people?


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Here are some ideas for the evolution up to the Design Phase

3(under discussion with the collab.)• 2007-08: SP (small prototype) tests, LP1 –> two endplates: Gem+pixel, Microm.+pixel• 2009-10: LP2 -> real LCTPC prototype endplate: Gem or Mm + carbon-fibre sandwich, gating grid, sector/panel shape, LCTPC electronics, gas, etc


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AGENDA -2a.WP meeting (whoever is ready)


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AGENDA

-3.Future meetingsThere are (in addition to bi-weekly phonemeetings):-Eudet annual meeting MPI-Munich (18-20 October 2006)

withwebsite:

http://www.eudet.org/AnnualMeeting2006/AnnualMeeting2006.html-European LC workshop Valencia (6-10 November 2006),

seehttp://ific.uv.es/~ilc/ECFA-GDE2006/

-Asian LC workshop Beijing (4-7 February 2007)Website:http://bilcw07.ihep.ac.cn/

http://www.eudet.org/AnnualMeeting2006/AnnualMeeting2006.html

http://ific.uv.es/~ilc/ECFA-GDE2006/

http://bilcw07.ihep.ac.cn/


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AGENDA -4.AOB


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Back up slides, for reference


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Akira Sugiyama – GLD DOD


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RS study - LDC DOD - together with

Joel PouthasPhilippe Rosier

(IPN Orsay)


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Aleph Endplate


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Some features• Zigzag structure prevented loss of tracks > θ~22°• Sectors mounted from inside using a “handling tool” to minimize the dead space between sectors. This straight-forward operation which was performed at least 30 times during the lifetime of Aleph. • Alu sandwich structure stiff, lightweight to

- contain 7mb overpressure- provide forced-air thermal insulation between electronics and TPC volume

• Water cooling of 1kW electronics/side in addition- 22K channels per side

• Combination water/air cooling blocked all heat to TPC• Overall thickness ~ 25%Xo (average) w/o cables• Bending of endplate

- 20 micrometers due to 7mb overpressure- 5 micrometers due to wire tension


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R&D Planning• 1) Demonstration phase

– Continue work with small prototypes on mapping out parameter space, understanding resolution, etc, to prove feasibility of an MPGD TPC. For CMOS/Si-based ideas this will include a basic proof-of-principle.

• 2) Consolidation phase– Build and operate the LP, large prototype, (Ø ≥ 75cm, drift

≥ 100cm), with EUDET infrastructure as pedestal, to test manufacturing techniques for MPGD endplates, fieldcage and electronics. Design is starting---building and testing will take another ~ 3 years.

• 3) Design phase– After phase 2, the decision as to which endplate

technology to use for the LC TPC would be taken and final design started.

Documents

LCTPC/LPWP-10th phonemeeting