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Internal Use Only
Service ManualLG-P350
Date: January, 2011 / Issue 1.0
- � - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
1. INTRODUCTION
Table Of Contents
1. INTRODUCTION ..................................................................... 3
1.1 Purpose ........................................................................................................3
1.� Regulatory Information .........................................................................3
1.3 Abbreviations.............................................................................................5
2. PERFORMANCE ...................................................................... 7
�.1 Product Name ............................................................................................7
�.� Supporting Standard ..............................................................................7
�.3 Main Parts : GSM Solution .....................................................................7
�.4 HW Features ...............................................................................................8
�.5 SW Features ............................................................................................. 10
�.6 HW SPEC. ................................................................................................. 13
3. TECHNICAL BRIEF ................................................................ 19
3.1 GENERAL DESCRIPTION ...................................................................... 19
3.� GSM MODE .............................................................................................. �1
3.3 UMTS MODE ............................................................................................ �3
3.4 GPS RECEIVER.......................................................................................... �6
3.5 LO GENERATION and DISTRIBUTION CIRCUIT............................ �6
3.6 OFF-CHIP RF COMPONENTS ............................................................. �7
3.7 Digital Baseband(DBB/MSM7��7) .................................................. 3�
3.8 Hardware Architecture ........................................................................ 33
3.9 Subsystem (MSM7��7) ....................................................................... 35
3.10 Power Block ........................................................................................... 38
3.11 External memory interface ............................................................. 43
3.1� H/W Sub System .................................................................................. 44
3.13 Audio and sound ................................................................................ 51
3.14 Display ..................................................................................................... 57
3.15 Vibrators (Q-Coin Motor) ................................................................. 59
3.16 Compass Sensor .................................................................................. 60
3.17 Motion Sensor ...................................................................................... 6�
3.18 Main Features ....................................................................................... 63
3.19 Main component ................................................................................ 64
4. TROUBLE SHOOTING .......................................................... 71
4.1 RF Component ....................................................................................... 71
4.� SIGNAL PATH ........................................................................................... 73
4.3 Checking TCXO Block ........................................................................... 76
4.4 Checking GSM TX Module(GSM PAM + FEM) Block ................ 78
4.5 Checking WCDMA Block .................................................................... 81
4.6 Checking GSM Block ............................................................................ 91
4.7 GPS/WIFI/BT RF Component ............................................................ 99
4.8 GPS/WIFI/BT SIGNAL PATH ..............................................................101
4.9 GPS/WIFI/BT Trouble shooting ......................................................103
4.10 Power ON Troubleshooting ..........................................................109
4.11 Charging Trouble shooting ...........................................................113
4.1� 3M FF Camera trouble ....................................................................117
4.13 Audio Trouble .....................................................................................1�0
4.14 Main LCD trouble ..............................................................................13�
4.15 Motion Sensor on/off trouble ......................................................134
4.16 Compass Sensor on/off trouble ..................................................136
4.17 Q coin Motor .......................................................................................138
5. DOWNLOAD ....................................................................... 140
6. BLOCK DIAGRAM ............................................................... 153
7. CIRCUIT DIAGRAM ............................................................ 158
8. BGA Pin Map ...................................................................... 166
9. PCB LAYOUT ....................................................................... 170
10. CALIBRATION ................................................................... 172
10.1 General Description .........................................................................17�
10.� Requirement .......................................................................................17�
10.3 Setup for RF calibration ..................................................................173
10.4 Tachyon Software Installation .....................................................173
10.5 Tachyon Start ......................................................................................174
10.6 Overview of RF Calibration ...........................................................179
11. STAND ALONE TEST ........................................................ 183
12. EXPLODED VIEW & REPLACEMENT PART LIST ............. 190
1�.1 EXPLODED VIEW ................................................................................190
1�.� Replacement Parts ...........................................................................191
1�.3 Accessory .............................................................................................�15
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1. INTRODUCTION
1. INTRODUCTION
1.1 Purpose
This manual provides the information necessary to repair, calibration, description and download the features of this model.
1.2 Regulatory Information
A. Security
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example, persons other than your company’s employees, agents, subcontractors, or person working on your company’s behalf) can result in substantial additional charges for your telecommunications services. System users are responsible for the security of own system. There are may be risks of toll fraud associated with your telecommunications system. System users are responsible for programming and configuring the equipment to prevent unauthorized use. The manufacturer does not warrant that this product is immune from the above case but will prevent unauthorized use of common carrier telecommunication service of facilities accessed through or connected to it. The manufacturer will not be responsible for any charges that result from such unauthorized use.
B. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and possibly causing harm or interruption in service to the telephone network, it should disconnect telephone service until repair can be done. A telephone company may temporarily disconnect service as long as repair is not done.
C. Changes in Service
A local telephone company may make changes in its communications facilities or procedure. If these changes could reasonably be expected to affect the use of the phones or compatibility with the net work, the telephone company is required to give advanced written notice to the user, allowing the user to take appropriate steps to maintain telephone service.
D. Maintenance Limitations
Maintenance limitations on the phones must be performed only by the manufacturer or its authorized agent. The user may not make any changes and/or repairs expect as specifically noted in this manual. Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system and may void any remaining warranty.
1. INTRODUCTION
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1. INTRODUCTION
E. Notice of Radiated Emissions
This model complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user.
F. Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly different.
G. Interference and Attenuation
A phone may interfere with sensitive laboratory equipment, medical equipment, etc. Interference from unsuppressed engines or electric motors may cause problems.
H. Electrostatic Sensitive Devices
ATTENTION
Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the sign.
Following information is ESD handling:
• Service personnel should ground themselves by using a wrist strap when exchange system boards. • When repairs are made to a system board, they should spread the floor with anti-static mat which is also grounded.
• Use a suitable, grounded soldering iron. • Keep sensitive parts in these protective packages until these are used.
• When returning system boards or parts like EEPROM to the factory, use the protective package as described.
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1. INTRODUCTION
6/140
1.3 AbbreviationsFor the purposes of this manual, following abbreviations apply:
Offset Phase Locked LoopOPLL
Light Emitting DiodeLED
Low Drop OutputLDO
Liquid Crystal DisplayLCD
Intermediate FrequencyIF
International Portable User IdentityIPUI
Global System for Mobile CommunicationsGSM
General Purpose Interface BusGPIB
Gaussian Minimum Shift KeyingGMSK
Flexible Printed Circuit BoardFPCB
Electrostatic DischargeESD
Electrical Erasable Programmable Read-Only MemoryEEPROM
Digital Signal ProcessingDSP
dB relative to 1 milli wattdBm
Digital Communication SystemDCS
Digital to Analog ConverterDAC
Constant Current – Constant VoltageCC-CV
Bit Error RatioBER
BasebandBB
Automatic Power ControlAPC
1. INTRODUCTION
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1. INTRODUCTION
7/140
Wireless Application ProtocolWAP
Voltage Control Temperature Compensated Crystal OscillatorVCTCXO
Voltage Controlled OscillatorVCO
Universal Asynchronous Receiver/TransmitterUART
Time Division Multiple AccessTDMA
Time Division DuplexTDD
Travel AdapterTA
Side Tone Masking RatingSTMR
Pseudo SRAMPSRAM
Static Random Access MemorySRAM
Sending Loudness RatingSLR
Subscriber Identity ModuleSIM
Surface Acoustic WaveSAW
Real Time ClockRTC
Root Mean SquareRMS
Receiving Loudness RatingRLR
Radio FrequencyRF
Public Switched Telephone NetworkPSTN
Phase Locked LoopPLL
Programmable Gain AmplifierPGA
Printed Circuit BoardPCB
Power Amplifier ModulePAM
1. INTRODUCTION
2. PERFORMANCE
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2. PERFORMANCE 2.1 Product Name
LG-P350 : WCDMA900/2100+EGSM/GSM850/DCS/PCS
(HSDPA 3.6Mbps GPRS Class 12 / EDGE Class 12)
2.2 Supporting Standard
Item Feature Comment
Supporting Standard WCDMA(FDD1,8)/EGSM/GSM850/DCS1800/PCS1900
with seamless handover
Phase 2+(include AMR)
SIM Toolkit: Class 1, 2, 3, C-E
Frequency Range WCDMA(FDD1) TX : 1920 – 1980 MHz
WCDMA(FDD1) RX : 2110 – 2170 MHz
WCDMA(FDD8) TX : 880 – 915 MHz
WCDMA(FDD8) RX : 915 – 960 MHz
EGSM TX: 880 – 915 MHz
EGSM RX: 925 – 960 MHz
GSM850 TX: 824 – 849 MHz
GSM850 RX: 869 – 894 MHz
DCS1800 TX : 1710 – 1785 MHz
DCS1800 RX: 1805 – 1880 MHz
PCS1900 TX: 1850 – 1910 MHz
PCS1900 RX: 1930 – 1990 MHz
Application Standard WAP 2.0
2.3 Main Parts : GSM Solution
Item Part Name Comment
Digital Baseband MSM7227 : Qualcomm
Analog Baseband PM7540 : Qualcomm
RF Chip RTR6285 : Qualcomm
2. PERFORMANCE
2. PERFORMANCE
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2.4 HW Features
Item Feature Comment
Form Factor DOP type
1) Capacity
Standard : Li-Ion , 1280mAh
Battery
2) Packing Type : Soft Pack
Size Standard :
108 x 57.5 x 12.2mm
Weight 108g With Battery
Volume TBD
PCB L1B1 type, 8 Layers , 0.8t
Stand by time 2G Up to 580 hrs
3G Up to 510 hrs
@ Paging Period 9 (2G)
@ DRX 8 (3G)
Charging time 3 hrs @ Power Off / 1280mAh
Talk time 2G Up to 450mins
3G Up to 420mins
@ Power Level 10 (2G)
@ Tx = 0dBm (3G)
RX sensitivity
WCDMA(FDD1) : -106.7 dBm
WCDMA(FDD8) : -103.7 dBm
EGSM : -105 dBm
GSM850 : -105 dBm
DCS 1800 : -105 dBm
PCS 1900 : -105 dBm
WCDMA/
GSM/
GPRS
WCDMA : 24dBm/3.84MHz,+1/-3dBm
EGSM : 33dBm
GSM850 : 33 dBm
DCS 1800 : 30 dBm
PCS 1900 : 30 dBm
Class3(WCDMA)
Class4 (EGSM)
Class4 (GSM850)
Class1 (PCS)
Class1 (DCS)
TX
output
power
EDGE
GSM 900 : 27 dBm
DCS 1800 : 26 dBm
PCS 1900 : 26 dBm
E2 (GSM900)
E2 (PCS)
E2 (DCS)
GPRS compatibility GPRS Class 12
EDGE compatibility EDGE Class 12
SIM card type Plug-In SIM
3V /1.8V
2. PERFORMANCE
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Display Main LCD
TFT Main LCD(2.8’, 320 x 240)
Built-in Camera 3M FF CMOS Camera
Status Indicator No
Keypad Function Key : 4
Side Key : 2
Function Key:
Home, Back, Menu, Search
Side Key :
Volume up/down
ANT Main : Internal Fixed Type
System connector 5 Pin
Ear Phone Jack 3.5Phi, 4 Pole, Stereo
PC synchronization Yes
Memory NAND Flash : 4Gbit
SDRAM : 2Gbit
Speech coding FR, EFR, HR,AMR
Data & Fax Built in Data & Fax support
Vibrator Built in Vibrator
Blue Tooth V2.1+ EDR
MIDI(for Buzzer Function) SW Decoded 72Poly
Music Player MP3/ WMA/AAC/HE-AAC/EAAC+
Video Player MPEG4, H.263, H.264
Camcorder MPEG4, H.263, H.264
Voice Recording Yes
Speaker Phone mode
Support Yes
Travel Adapter Yes
CDROM No
Stereo Headset Yes
Data Cable Yes
T-Flash
(External Memory) Yes
2. PERFORMANCE
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2.5 SW Features
Item Feature Comment
RSSI 0 ~ 4 Levels
Battery Charging 0 ~ 6 Levels
Key Volume 0 ~ 7 Level
Audio Volume 1 ~ 15 Level
Time / Date Display Yes
Multi-Language Yes English/French/German/Spanish/Italia
n/Danish/Dutch/Korean
Quick Access Mode Dialing/ Contact / Menu / Message /
Camera
PC Sync No
Speed Dial No Voice mail center -> 1 key
Profile Yes not same with feature phone setting
CLIP / CLIR Yes
Phone Book
Name / Number / Email / Chat Id/
Website/Postal
addresses/Organizations/Groups/
BirthdayNotes / Ringtone
There is no limitation on the number
of items.
It depends on
available memory amount.
Last Dial Number Yes
Last Dial Numbers, Last Received
Numbers and Last Missed Numbers
can store up to a total of 500.
Last Received
Number Yes
Last Dial Numbers, Last Received
Numbers and Last Missed Numbers
can store up to a total of 500.
Last Missed Number Yes
Last Dial Numbers, Last Received
Numbers and Last Missed Numbers
can store up to a total of 500.
Search by Number
/ Name Name
Group Yes
There is no limitation on the number
of items. It depends on
available memory amount.
Fixed Dial Number Yes
2. PERFORMANCE
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Service Dial Number No
Own Number Yes
Read only
(add/edit/delete are not
supported)
Voice Memo Yes
Call Reminder No
Network Selection Automatic
Mute Yes
Call Divert Yes
Call Barring Yes
Call Charge (AoC) Yes
Call Duration Yes
SMS (EMS)
There is no limitation on the
number of items. It depends on
available memory
amount.
EMS does not support.
SMS Over GPRS No
EMS Melody / Picture No
Send / Receive / Save No
MMS MPEG4
Send / Receive / Save Yes
Long Message MAX 459 characters SMS 3pages
Cell Broadcast Yes
Download Over the Web
Game Yes
Calendar Yes
Memo Yes
There is no limitation on the number
of items.
It depends on available memory
amount.
World Clock No
Unit Convert No
Stop Watch No
Wall Paper Yes
2. PERFORMANCE
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WAP Browser No
Support only web browser based on
webkit. WAP stack and wml are not
supported.
Download Melody /
Wallpaper Yes Over web browser
SIM Lock Yes Operator Dependent
SIM Toolkit Class 1, 2, 3, C
MMS Yes Google MMS Client
EONS Yes
CPHS Yes V4.2
ENS No
Camera Yes 3M FF /
Digital Zoom : x4
JAVA Yes CLDC V1.1 / MIDP V2.1
Download Over Web
Voice Dial No
IrDa No
Bluetooth Yes Ver. 2.1+EDR
(HSP,HFP,A2DP,AVRCP)
FM radio Yes
GPRS Yes Class 12
EDGE Yes Class 12
Hold / Retrieve Yes
Conference Call Yes Max. 6
DTMF Yes
Memo pad No
TTY No
AMR Yes
SyncML Yes
IM Yes
Email Yes
2. PERFORMANCE
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2.6 HW SPEC.
1) GSM transceiver specification
Item Specification
Phase Error Rms : 5°
Peak : 20 °
Frequency Error GSM : 0.1 ppm
DCS/PCS : 0.1 ppm
EMC(Radiated Spurious Emission
Disturbance) GSM/DCS : < -28dBm
Transmitter Output power and Burst
Timing
GSM : 5dBm – 33dBm ± 3dB
DCS/PCS : 0dBm – 30dBm ± 3dB
Burst Timing <3.69us
Spectrum due to modulation out to
less than 1800kHz offset
200kHz : -36dBm
600kHz : -51dBm/-56dBm
Spectrum due to modulation out to
larger than 1800kHz offset to the
edge of the transmit band
GSM :
1800-3000kHz :< -63dBc(-46dBm)
3000kHz-6000kHz : <-65dBc(-46dBm)
6000kHz < : < -71dBc(-46dBm)
DCS :
1800-3000kHz :< -65dBc(-51dBm)
6000kHz < : < -73dBc(-51dBm)
Spectrum due to switching transient 400kHz : -19dBm/-22dBm(5/0), -23dBm
600kHz : -21dBm/-24dBm(5/0), -26dBm
Reference Sensitivity – TCH/FS Class II(RBER) : -105dBm(2.439%)
Usable receiver input level range 0.012(-15 - -40dBm)
Intermodulation rejection – Speech
channels
± 800kHz, ± 1600kHz
: -98dBm/-96dBm (2.439%)
AM Suppression
GSM : -31dBm
- DCS : -29dBm
-98dBm/-96dBm (2.439%)
Timing Advance ± 0.5T
2. PERFORMANCE
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2) WCDMA transmitter specification
Item Specification
Transmit Frequency Band1 : 1920 MHz ~ 1980 MHz
Band8 : 880MHz ~ 915MHz
Maximum Output Power +24 dBm / 3.84 MHz, +1 / -3 dB
Frequency Error within ±0.1 PPM
Open Loop Power Control Normal Conditions : within ±9 dB,
Extreme Conditions : within ±12 dB
Minimum Transmit Power < -50 dBm /3.84 MHz
Occupied Bandwidth < 5 MHz at 3.84 Mcps (99% of power)
Adjacent Channel Leakage
Power Ratio (ACLR)
> 33 dB @ ±5 MHz,
> 43 dB @ ±10 MHz
Spurious Emissions
|f-fc| > 12.5 MHz
< -36 dBm / 1 kHz RW @ 9 kHz ≤ f < 150 kHz
< -36 dBm / 10 kHz RW @ 150 KHz ≤ f < 30 MHz
< -36 dBm / 100 kHz RW @ 30 MHz ≤ f < 1 GHz
< -30 dBm / 1 MHz RW @ 1 GHz ≤ f < 12.75 GHz
< -60 dBm / 3.84 MHz RW @ 869 MHz ≤ f ≤ 894 MHz
< -60 dBm / 3.84 MHz RW @ 1930 MHz ≤ f ≤ 1900 MHz
< -60 dBm / 3.84 MHz RW @ 2110 MHz ≤ f ≤ 2155 MHz
< -67 dBm / 100 kHz RW @ 925 MHz ≤ f ≤ 935 MHz
< -79 dBm / 100 kHz RW @ 935 MHz < f ≤ 960 GHz
< -71 dBm / 100 kHz RW @ 1805 MHz ≤ f ≤ 1880 MHz
< -41 dBm / 300 kHz RW @ 1884.5 MHz < f < 1919.6 MHz
Transmit Intermodulation < -31 dBc @ 5 MHz & < -41 dBc @ 10 MHz
when Interference CW Signal Level = -40 dBc
Error Vector Magnitude < 17.5 %, when Pout ≥ -20 dBm
Peak Code Domain Error < -15 dB at Pout -20 dBm
2. PERFORMANCE
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3) WCDMA receiver specification
Item Specification
Receive Frequency Band1 : 2110 ~ 2170 MHz
Band8 : 925 ~ 960 MHz
Reference Sensitivity Level Band1 : BER < 0.001 when Îor = -106.7 dBm / 3.84 MHz
Band8 : BER < 0.001 when Îor = -103.7 dBm / 3.84 MHz
Maximum Input Level BER < 0.001 when Îor = -25 dBm / 3.84 MHz
Adjacent Channel Selectivity
(ACS)
ACS > 33 dB where BER < 0.001 when
Îor = -92.7 dBm / 3.84 MHz
& Ioac = –52 dBm / 3.84 MHz @ ±5 MHz
Blocking Characteristic BER < 0.001 when Îor = -103.7 dBm / 3.84 MHz
& Iblocking = -56 dBm / 3.84 MHz @ Fuw(offset) = ±10 MHz
or Iblocking = -44 dBm / 3.84 MHz @ Fuw(offset) = ±15 MHz
Spurious Response BER < 0.001 when Îor = -103.7 dBm / 3.84 MHz
& Iblocking = -44 dBm
Intermodulation BER < 0.001 when Îor= -103.7 dBm / 3.84 MHz
& Iouw1 = -46 dBm @ Fuw1(offset) = ±10 MHz
& Iouw2 = -46 dBm / 3.84 MHz @ Fuw2(offset) = ±20 MHz
Spurious Emissions < -57 dBm / 100 kHz BW @ 9 kHz ≤ f < 1 GHz
< -47 dBm / 1 MHz BW @ 1 GHz ≤ f ≤ 12.75 GHz
Inner Loop Power Control
In Uplink
Adjust output(TPC command)
cmd 1dB 2dB 3dB
+1 +0.5/1.5 +1/3 +1.5/4
0 -0.5/+0.5 -0.5/+0.5 -0.5/+0.5
-1 -0.5/-1.5 -1/-3 -1.5/-4
group(10equal command group)
+1 +8/+12 +16/+24
2. PERFORMANCE
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4) HSDPA transmitter specification
Item Specification
Transmit Frequency Band1 : 1920 MHz ~ 1980 MHz
Band8 : 880MHz ~ 915 MHz
Maximum Output Power Sub-Test
1=1/15, 2=12/15 21~25dBm / 3.84 MHz
3=13/15 4=15/8 20~25dBm / 3.84 MHz
5=15/7 6=15/0 19~25dBm / 3.84 MHz
HS-DPCCH
Sub-test
in table
C.10.1.4
Power
step
Power step slot
boundary
Power step
size, P [dB]
Transmitter power step
tolerance [dB]
1 Start of Ack/Nack 6 +/- 2.3
2 Start of CQI 1 +/- 0.6
3 Middle of CQI 0 +/- 0.6 5
4 End of CQI 5 +/- 2.3
Spectrum Emission Mask
Sub-Test : 1=1/15, 2=12/15, 3=13/15, 4=15/8, 5=15/7, 6=15/0
Frequency offset
from carrier f Minimum requirement Measurement Bandwidth
2.5 ~ 3.5 MHz -35-15×( f-2.5)dBc 30 kHz
3.5 ~ 7.5 MHz -35-1×( f-3.5)dBc 1 MHz
7.5 ~ 8.5 MHz -35-10×( f-7.5)dBc 1 MHz
8.5 ~ 12.5 MHz -49dBc 1 MHz
Adjacent Channel Leakage
Power Ratio (ACLR)
Sub-Test : 1=1/15, 2=12/15, 3=13/15, 4=15/8, 5=15/7, 6=15/0
> 33 dB @ ±5 MHz
> 43 dB @ ±10 MHz
Error Vector Magnitude < 17.5 %, when Pout ≥ -20 dBm
2. PERFORMANCE
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5) HSDPA receiver specification
Item Specification
Receive Frequency
Band1 : 2110 ~ 2170 MHz
Band8 : 925 ~ 960 MHz
Maximum Input Level
(BLER or R), 16QAM Only
Sub-Test : 1=1/15, 2=12/15, 3=13/15, 4=15/8, 5=15/7, 6=15/0
BLER < 10% or R >= 700kbps
6) WLAN 802.11b transceiver specification
Item Specification
Transmit Frequency 2400 MHz ~ 2483.5 MHz ( CH1~CH13 )
Tx Power Level ≤ 20dBm under (Europe), ≤ 30dBm under (USA)
Frequency Tolerance within ±25 PPM
Chip clock Frequency
Tolerance
within ±25 PPM
Spectrum Mask ≤ -30 @ fc-22MHz< f <fc-11MHz and fc+11MHz< f <fc+22MHz
≤ -50 @ f < fc-22MHz and f > fc+22MHz
Power ramp on/off time ≤ 2us
Carrier Suppression ≤ -15dB
Modulation Accuracy
(Peak EVM)
≤ 35%
Spurious Emissions < -36 dBm @ 30MHz ~ 1GHz
< -30 dBm above @ 1GHz ~ 12.75GHz
< -47 dBm @ 1.8GHz ~ 1.9GHz
< -47 dBm @ 5.15GHz ~ 5.3GHz
Rx Min input Sensitivity ≤ -76dBm(1Mbps,2Mbps,5.5Mbps,11Mbps) @ FER ≤ 8%
Rx Max input Sensitivity ≥ -10dBm(1Mbps,2Mbps,5.5Mbps,11Mbps) @ FER ≤ 8%
Rx Adjacent Channel
Rejection
≥ 35dB @FER ≤ 8%,
interference input signal -70dBm@fc±25MHz(11Mbps)
2. PERFORMANCE
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7) WLAN 802.11g transceiver specification
Item Specification
Transmit Frequency 2400 MHz ~ 2483.5 MHz ( CH1~CH13 )
Tx Power Level ≤ 20dBm under (Europe), ≤ 30dBm under (USA)
Frequency Tolerance within ±25 PPM
Chip clock Frequency
Tolerance
within ±25 PPM
Spectrum Mask ≤ -20 @ ±11MHz offset (9Mhz ~ 11MHz)
≤ -28 @ ±20MHz offset (11MHz ~ 20Mhz)
≤ -40 @ ±30MHz offset (20MHz ~ 30Mhz)
Transmitter constellation error
(rms EVM)
≤ -5dB
Spurious Emissions < -36 dBm @ 30MHz ~ 1GHz
< -30 dBm above @ 1GHz ~ 12.75GHz
< -47 dBm @ 1.8GHz ~ 1.9GHz
< -47 dBm @ 5.15GHz ~ 5.3GHz
Rx Min input Sensitivity PER ≤ 10%
-82dBm@6Mbps, -81dBm@9Mbps, -79dBm@12Mbps
-77dBm@18Mbps, -74dBm@24Mbps, -70dBm@36Mbps
-66dBm@48Mbps, -65dBm@54Mbps
Rx Max input Sensitivity ≥ -20dBm(6,9,12,18,24,36,48,54Mbps) @ PER ≤ 10%
Rx Adjacent Channel
Rejection
PER ≤ 10%, ACR ≥ 16dB@6Mbps, ACR ≥ 15dB@9Mbps, ACR ≥ 13dB@12Mbps, ACR ≥ 11dB@18Mbps, ACR ≥ 8dB@24Mbps, ACR ≥ 4dB@36Mbps ACR ≥ 0dB@48Mbps, ACR ≥ -1dB@54Mbps
ACR shall be measured by setting the desired signal's strength 3 dB above the rate-dependent sensitivity specified in min input sensitivity
8) GPS receiver specification
Item Specification
Receive Frequency 1574.42 MHz ~ 1576.42 MHz
Minimum Sensitivity 1 satellite ≥-142dBm, 7 satellites ≥ -147dBm at coarse time aiding
3. TECHNICAL BRIEF
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3. TECHNICAL BRIEF
3.1 GENERAL DESCRIPTION
The LG-P350 supports UMTS-900, UMTS-2100, GSM-850, GSM-850, GSM-900, GSM-1800, and GSM-1900 based GSM/GPRS/EDGE/UMTS. All receivers and the UMTS transmitter use the radioOne1Zero-IF architecture to eliminate intermediate frequencies, directly converting signals between RF and baseband. The quad-band GSM transmitters use a baseband-to-IF upconversion followed by an offset phase-locked loop that translates the GMSK-modulated or 8-PSK-modulated signal to RF.
[Figure 1-1] Block diagram of RF part
3. TECHNICAL BRIEF
P350 RF Block Diagram RF
3. TECHNICAL BRIEF
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A generic, high-level functional block diagram of LG-P350 is shown in Figure 1-1. One antenna collects base station forward link signals and radiates handset reverse link signals. The antenna connects with receive and transmit paths through a ASM(Antenna-Switch-Module).
The UMTS receive paths each include an LNA, an RF band-pass filter, and a downconverter that translate the signal directly from RF-to-baseband using radioOne ZIF techniques. The RFIC’s Rx analog baseband outputs, for the receive chains, connect to the MSM IC. The UMTS and GSM Rx baseband outputs share the same inputs to the MSM IC.
For the transmit chains, the RTR6285 IC directly translates the Tx baseband signals (from the MSM device) to an RF signal using an internal LO generated by integrated onchip PLL and VCO. The RTR6285 IC outputs deliver fairly high-level RF signals that are first filtered by Tx SAWs and then amplified by their respective UMTS PAs. In the GSM receive path, the received RF signals are applied through their band-pass filters and down-converted directly to baseband in the RTR6285 transceiver IC. These baseband outputs are shared with the UMTS receiver and routed to the MSM IC for further signal processing.
The GSM/EDGE transmit path employs one stage of up-conversion and, in order to improve efficiency, is divided into phase and amplitude components to produce an open-loop Polar topology:
1. The on-chip quadrature up-converter translates the GMSK-modulated signal or 8-PSK modulated signal, to a constant envelope phase signal at RF;
2. The amplitude-modulated (AM) component is applied to the ramping control pin of Polar power amplifier from a DAC within the MSM. LG-P350 power supply voltages are managed and regulated by the PM7540 Power Management IC. This versatile device integrates all wireless handset power management, general housekeeping, and user interface support functions into a single mixed signal IC.
It monitors and controls the external power source and coordinates battery recharging while maintaining the handset supply voltages using low dropout, programmable regulators.
The device’s general housekeeping functions include an ADC and analog multiplexer circuit for monitoring on-chip voltage sources, charging status, and current flow, as well as user-defined off-chip variables such as temperature, RF output power, and battery ID.
Various oscillator, clock, and counter circuits support IC and higher-level handset functions. Key parameters such as under-voltage lockout and crystal oscillator signal presence are monitored to protect against detrimental conditions.
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3.2 GSM MODE
3.2.1 GSM RECEIVER
The GSM-850, GSM-900, GSM-1800, and GSM-1900 receiver inputs of RTR6285 are connected directly to the transceiver front-end Module. GSM-850, GSM-900, GSM-1800, and GSM-1900 receiver inputs use differential configurations to improve common-mode rejection and second-order non-linearity performance. For example Figure 1-2 shows receiver input topologies for DCS and PCS (GSM-850/900 have the same receiver input topologies). The balance between the complementary signals is critical and must be maintained from the RF filter outputs all the way into the IC pins.
[Figure 1-2] DCS and PCS Receiver Inputs Topologies
Since GSM-850, GSM-900, GSM-1800, and GSM-1900 signals are time-division duplex (the handset can only receive or transmit at one time), switches are used to separate Rx and Tx signals in place of frequency duplexers – this is accomplished in the switch module. The GSM-850, GSM-900, GSM-1800, and GSM-1900 receive signals are routed to the RTR6285 through band selection filters and matching networks that transform single-ended 50-Ω sources to differential impedances optimized for gain and noise figure. The RTR input uses a differential configuration to improve second-order intermodulation and common mode rejection performance. The RTR6285 input stages include MSM-controlled gain adjustments that maximize receiver dynamic range.
The amplifier outputs drive the RF ports of the quadrature RF-to-baseband downconverters. The downconverted baseband outputs are multiplexed and routed to lowpass filters (one I and one Q) having passband and stopband characteristics suitable for GMSK or 8-PSK processing. These filter circuits include DC offset corrections. The filter outputs are buffered and passed on to the MSM7227 IC for further processing asshown in Figure 1-2.
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3.2.2 GSM TRANSMITTER
The RTR6285 transmitter outputs(HB_RF_OUT1 and LB_RF_OUT1) include on-chip output matching inductors. 50ohm output impedance is achieved by adding a series capacitor at the output pins. The capacitor value may be optimized for specific applications and PCB characteristics based on pass-band symmetry about the band center frequency as shown in Figure 1-3.
[Figure 1-3] GSM Transmitter Outputs Topologies
The RTR6285 IC is able to support GSM 850/900 and GSM 1800/1900 mode transmitting. This design guideline shows a tri-band GSM application. Both high-band and low band outputs are followed by resistive pads to ensure that the load presented to the outputs remains close to 50ohm.
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3.3 UMTS MODE
3.3.1 UMTS RECEIVER
The UMTS duplexer receiver output is routed to LNA circuits within the RTR6285 device as shown in Figure 1-4. The UMTS Rx input is provided with an on-chip LNA that amplifies the signal before a second stage filter that provides differential downconverter as shown in Figure 1-5. This second stage input is configured differentially to optimize secondorder intermodulation and common mode rejection performance. The gain of the UMTS frontend amplifier and the UMTS second stage differential amplifier are adjustable, under MSM control, to extend the dynamic range of the receivers. The second stage UMTS Rx amplifiers drive the RF ports of the quadrature RF-to-baseband downconverters. The downconverted UMTS Rx baseband outputs are routed to lowpass filters having passband and stopband characteristics suitable for UMTS Rx processing. These filter circuits allow DC offset corrections, and their differential outputs are buffered to interface shared with GSM Rx to the MSM IC. The UMTS baseband outputs are turned off when the RTR6285 is downconverting GSM signals and on when the UMTS is operating.
[Figure 1-4] UMTS Receiver Inputs Topologies
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3.3.2 UMTS TRANSMITTER
The UMTS Tx path begins with differential baseband signals (I and Q) from the MSM device. These analog input signals are amplified, filtered, and applied to the quadrature up-converter mixers. The up-converter output is amplified by multiple variable gain stages that provide transmit AGC control. The AGC output is filtered and applied to the driver amplifier; this output stage includes an integrated matching inductor that simplifies the external matching network to a single series capacitor to achieve the desired 50-Ω interface.
The RTR6285 UMTS output is routed to its power amplifier through a bandpass filter, and delivers fairly high-level signals that are filtered and applied to the PA. Transmit power is delivered from the duplexer to the antenna through the switch module. The transceiver LO synthesizer is contained within the RTR6285 IC with the exception of the off-chip loop filter components and the VC-TCXO. This provides a simplified design for multimode applications. The PLL circuits include a reference divider, phase detector, charge pump, feedback divider, and digital logic generator.
UMTS Tx. Using only PLL1, the LO generation and distribution circuits create the necessary LO signals for nine different frequency converters. The UMTS transmitter also employs the ZIF architecture to translate the signal directly from baseband to RF. This requires FLO to equal FRF, and the RTR6285 IC design achieves this without allowing FVCO to equal FRF. The RTR6285 IC is able to support UMTS 2100/1900/1800/1700 and 850 mode transmitting. This design guideline shows only UMTS 2100 applications.
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[Figure 1-5] RTR6285 IC Functional Block Diagram
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3.4 GPS RECEIVER
The GPS receiver input employs a single-ended connection realized by this pin. The GPS input is routed from the GPS antenna switch, through a band pass filter and then an impedance transformer circuit that optimally matches the impedance looking into the GPS LNA. The impedance transformer circuit topology is shown in Figure 1-6.
[Figure 1.6] GPS Input Network Topology
3.5 LO GENERATION and DISTRIBUTION CIRCUIT
The integrated LO generation and distribution circuits are driven by internal VCOs to support various modes to yield highly flexible quadrature LO outputs that drive all GSM/EDGE, UMTS band and GPS up-converters and down-converters; with the help of these LO generation and distribution circuits, true zero-IF architecture is employed in all GSM and UMTS band receivers and transmitters to translate the signal directly from RFto-baseband and from baseband-to-RF. Two fully functional fraction-N synthesizers, including VCOs and loop filters, are integrated within the RTR6285 IC. In addition, the RTR6285 has a third synthesizer used for GPS operation. The first synthesizer (PLL1) in the RTR6285 creates the transceiver Los that support the UMTS transmitter, and all four GSM band receivers and transmitters including: GSM850, GSM900, GSM1800, and GSM1900. The second synthesizer (PLL2) in the RTR6285 IC provides the LO for the UMTS primary receiver. For the RTR6285 IC only, the second synthesizer also provides the LO for the secondary UMTS receiver. The third synthesizer (PLL3), only in the RTR6285 IC, provides the LO for the GPS receiver. An external TCXO input signal is required to provide the synthesizer frequency reference to which the PLL is phase and frequency locked. The RTR6285 ICs integrate most of the PLL loop filter components on-chip except for three off-chip loop filter-series capacitors, which significantly reduces off-chip component requirement. With the integrated fractional-N PLL synthesizers, the RTR6285 ICs have the advantage of more flexible loop bandwidth control, fast lock time, and low-integrated phase error.
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3.6 OFF-CHIP RF COMPONENTS
3.6.2. UMTS PAM (U1002, ACPM-5281)
The ACPM-5281 is a dual-band PAM (Power Amplifier Module) designed for UMTS Band1 and Band8. The ACPM-5281 meets stringent UMTS linearity requirements. The 4mmx5mm form factor 14-pin surface mount package is self contained, incorporating 50ohm input and output matching networks.
The ACPM-5281 features 5th generation of CoolPAM circuit technology which supports 3 modes – bypass, mid and high power modes. The CoolPAM is stage bypass technology which enables power amplifier to lower power consumption. Active bypass feature is added to 5th generation to enhance power added efficiency at low output range and this technology extends talk time of mobiles more by further saving power amplifier’s current consumption.
The power amplifier is manufactured on an advanced InGaP HBT (hetero-junction Bipolar Transistor) MMIC (microwave monolithic integrated circuit) technology offering state-of-the-art reliability, temperature stability and ruggedness.
The Module is housed in a cost effective, small and thin 4x5mm package.
ACPM-5281 (W2100,W900)
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3.6.2 19.2MHz VCTCXO (X300, DSA321SCL-19.2M)
The Voltage Controlled Temperature Compensated Crystal Oscillator (VCTCXO) provides the reference frequency for all RFIC synthesizers as well as clock generation functions within the MSM6285 IC. The oscillator frequency is controlled by the MSM6285 ICs.
TRK_LO_ADJ pulse density modulated signal in the same manner as the transmit gain control TX_AGC_ADJ. A two-pole RC lowpass filter is recommended on this control line.
The PM7540 IC controls the handset power-up sequence, including a special VCTCXO warm-up interval before other circuits are turned on. This warm-up interval (as well as other TCXO controller functions) is enabled by the MSM TCXO_EN line . The PM7540 IC VREG_TCXO regulated output voltage is used to power the VCTCXO and is enabled before most other regulated outputs. Any GSM mode power control circuits within the MSM7227 IC require a reference voltage for proper operation and sufficient accuracy. Connecting the PM7540 IC REF_OUT directly to the MSM7227 IC GSM_PA_PWR_CTL_REF provides this reference. This sensitive analog signal needs a 0.1 μF low frequency filter near to MSM side, and isolate from digital logic and clock traces with ground on both sides, plus ground above and below if routed on internal layers.
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3.6.3 ASM + GSM PAM (U1001, SKY77544)
SKY77544 is a transmit and receive Front End Module (FEM) designed in a very low profile (0.9 mm), compact form factor for quad-band cellular handsets comprising GSM850/900, DCS1800, and PCS1900 operation — a complete transmit VCO-to-Antenna and Antenna-toreceive SAW filter solution. The FEM also supports Class 12 General Packet Radio Service (GPRS) multi-slot operation and EDGE Polar Modulation. WCDMA switch-through support is provided by three dedicated high-linearity ports.
The module consists of a GSM850/900 PA and DCS1800/PCS1900 PA block, impedancematching circuitry for 50 Ω input and output impedances, Tx harmonic filtering, high linearitylow insertion loss switches, and a CMOS Power Amplifier Control (PAC) block. A custom silicon integrated circuit contains decoder circuitry to control the RF switch while providing a low current external control interface. An integrated temperature sensor provides an analog voltage based on the temperature of the module.
Fabricated in InGaP/GaAs, the Heterojunction Bipolar Transistor (HBT) PA blocks support the GSM850/900 bands and DCS1800/PCS1900 bands. Both PA blocks share common power supply pads to distribute current. The output of the PA block and the outputs to the seven receive pads connect to the antenna pad through a highly linear antenna switch. The WCDMA and Rx ports feature a 0 volts DC offset level, which eliminates any need for external blocking capacitors. The InGaP/GaAs die, switch die, Silicon (Si) controller die, and passive components are mounted on a multi-layer laminate substrate and the entire assembly is encapsulated with plastic overmold.
RF input and output ports of the SKY77544 are internally matched to a 50 Ω load to reduce the number of external components for a quad-band design. Extremely low leakage current of the FEM maximizes handset standby time. Band selection and control of transmit and receive RF signal flows are performed by use of four external control pads. See Figure 1.9 shown on overleaf. Mode of operation Tx, Rx, Band (GSM850, GSM900, DCS, PCS, and UMTS) is controlled with 4 logic inputs: BS1, BS2, Mode, and TxEN. Proper timing of the TxEN input and the VAPC input ensures high isolation between the antenna and Tx-VCO while the VCO is being tuned prior to the transmit burst. The Enable input controls the initial turn-on of the PAC circuitry to minimize battery drain.
The integrated power amplifier control (PAC) function provides envelope amplitude control by reducing sensitivity to input drive, temperature, power supply, and process variation.
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[Figure 1.9] SKY77544 Block Diagram
[Figure 1.10] SKY77544 Control Logic
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3.6.4 GPS LNA (U1003, RF2815)
The RF2815 is a GPS Low Noise Amplifier with an integrated SAW filter at the output. Low noise figure, along with high gain, achieved by the RF2815 makes it ideal for GPS recievers requiring high sensitivity. This module builds upon RFMD’s leading edge pHEMT process and integrates input matching and low loss high rejection SAW filter at the output. This results in high performance and a reduced solution size. The ease of implementation simplifies the reciever design.
The RF2185 is packaged in a compact 3.3 mm x 2.1 mm x 1.0 mm package with low external component count required to achieve the best-in-class performance.
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3.7 Digital Baseband(DBB/MSM7227)
3.7.1 General Description
A. Features(MSM7227)
The basic MSM7227 system solution consists of the MSM7227, RTR6285™, and PM7540™ ICs, plus AMSS™ system software with the SURF7227™ platform available for development. General features include:
-WCDMA Rel ‘99 plus HSDPA and HSUPA
-GSM/GPRS/EDGE
-High-performance ARM1136JF-S™ application processor at up to 600 MHz; QDSP5000™ at 320 MHz
-High-performance ARM926EJ-S™ modem processor at up to 400 MHz; QDSP4000™ at 122.88 MHz
-Java® hardware acceleration for faster Java-based games and other applets
-Support for Bluetooth® 2.1 EDR via an external Bluetooth System-on-Chip (SoC)
-High-speed, serial mobile display digital interface (MDDI) that optimizes the interconnection cost
between the MSM device and the LCD panel
-Receive diversity support for WCDMA mode, thereby providing improved capacity and data throughput
-USB 2.0 compliant high-speed USB core with limited OTG capabilities
-Integrated high-speed USB PHY
-Integrated wideband stereo codec for digital audio applications
-Direct interface to digital camera module with video front-end (VFE) image processing
-GPS position location capabilities
-Vocoder support (GSM-HR, FR, EFR, AMR, and AMR-WB/+)
-Advanced 12 × 12 ×1.05 mm, 0.4 mm pitch, 560 NSP
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BT_UARTBT PCM
Bluetooth v2.1Wi-Fi 802 11b/g
BT & Wi-Fi
System HW Block Diagram All System
CPUInterfaceCPU Interface
Capacitive Touch(Melpas + ELK)
LCD Backlight IC BL I2C TX IQ, PRX IQ
BT_PCM
FM_L&R
RF I/FPRX_IQ
WLAN_SDIOLINE_L& R
BCM43291
Wi-Fi 802.11b/gFM Radio
FM
Tx ModuleGSM & WCDMA
TOUCH I2C2.8" QVGA 240*320 TOUCH INT
TCXO_38.4MHz
FM_L&RF_CLK_IN
CLK_REQ
Transceiver(RTR6285)
Transceiver(RTR6285)
LCD Backlight ICAAT2862
BL_I2C
DDR SDRAM(2G)NAND FRESH (4G)
EBI1 (DDR)
_ Q, _ QRF I/F
GPS
Tx Module(SKY77544)DRX_IQ DRX_IQ
GPIO59
GPS
MCP(Hynix)
SBDT
TCXO
NAND FRESH (4G)
CAM I/F
CAM_I2C
MSM7227EBI2 (NAND)
CAM 3M
MCP(Hynix)Q-Motor
(WHVM-1030Q10)Q-Motor
(WHVM-1030Q10)GPIO_28
LIN_PWM_FREQH8BCS0UN0MCR-4EM
MIC MIC
Speaker & R i
TCXO_19.2MHz(Kyocera)
RTR_TRK_LO_ADJ TCXO_RTR_19.2MHzTCXO_PM_19.2MHz
MOTION_I2CMOTION Sensor(KR3DH) MOTION INT
LINE_ON&OP
EAR1_OP&ON
HPH_L&R
LINE_OP, LINE_ON
RCV_P & N
HPH_R, HPH_LSPK_RCVP, N
Receiver
3.5 piEarjack
EAR_L, RCOMPASS_I2CDigital Compass
(AMI304) COMPASS_INTAudio Sub
WM9093ECS-RGPIO_27 AUDIO_I2C
TCXO IN
MMC SIM
USIM KPD_PWR_N
MOTION_INT
USIMUSIM I/F
GPIO106 SBDT_SSBIPMIC_SSBI
AMUX_OUTHKAIN2 AMUX_OUT
AMUX_OUTPM_INT_N MSM_INT_NGPIO24
PWR/End Key
Vol. up
Send Key
Vol. Down USIM
Key COL, Key ROW
_
Key LED
MUIC_I2C
USBPHYUART3
I2C
UART3MPP3,4
PM7540KPD_DRV_N
PON_RESET_N
PS_HOLDGPIO25RESIN_N
JTAG
PS_HOLD
MUIC(TS5USBA)in
_USB
nnec
tor Backlight_Key
USBH DM & DPArray TP
REMOTE_PWR_ON nJTAG_RESOUTJTAG_PS_HOLD
JTAG CONN.JTAG(TCK,TDI,TDO…)UART3_TX/RX
5pi
Co
3.8 Hardware Architecture<System HW Block>
Figure. Block Diagram
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<Power Block>
Figure. Simplified Block Diagram
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3.9 Subsystem (MSM7227)
3.9.1. ARM Microprocessor Subsystem
The MSM7227 device uses an embedded ARM1136JF-S, ARM926EJ-S microprocessor. This microprocessor, through the system software, controls most of the functionality for the MSM, including control of the external peripherals such as the keypad, LCD, SDRAM, and NANDFlash devices. Through a QUALCOMM proprietary single-wire SBI (SSBI) the ARM926EJ-S configures and controls the functionality of the RTR6285 and PM7540 devices.
3.9.2. WCDMA Subsystem
The WCDMA subsystem performs the data conversions and signal processing necessary to maintain the WCDMA air interface between the handset and the base station (and also the WCDMA network). The subsystem components include:
-Searcher engine
-Demodulating fingers
-Combining block
-Frame deinterleaver
-Viterbi decoder
-Reverse link subsystem
-Turbo decoder
On the forward link traffic channel, the WCDMA subsystem searches, demodulates, and decodes incoming pilot, sync, paging, and traffic channel information. It extracts low bit-rate packet data from the forward link traffic channel and sends the packet data to the vocoder for processing. On the reverse link, the WCDMA subsystem processes the packet data from the vocoder and modulates the reverse traffic channel.
3.9.3. GSM Subsystem
The GSM subsystem performs the data conversions and signal processing necessary to maintain the GSM air interface, including PA gain control for GPRS support. For GSM, the power profile ramps up before the burst and ramps down afterward. For GPRS, transmit bursts can occur in as many as four sequential slots and the PA must be ramped up and down smoothly between each slot, holding the desired output power level during each burst. GSM support includes:
-GSM release ‘99 (circuit switching)
-GPRS (packet switching)
-EDGE E2 power class for 8 PSK
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3.9.4. RF Interface
The RF interface communicates with the mobile station’s external RF and analog baseband circuits. Signals to these circuits control signal gain in the Rx and Tx signal path and maintain The system’s frequency reference.
3.9.5. Single-wire serial bus interface (SSBI)
The MSM7227 device’s SSBI is designed specifically to be a quick, low pin count control protocol for QUALCOMM’s RTR6285 and PM7540 ASICs. Using the SSBI, the RTR6285 and PM7540 devices can be configured for different operating modes and for minimum power consumption, extending battery life in Standby mode. The SBI also controls DC baseband offset errors.
3.9.6. Audio function
MSM7227 audio functions include the analog Rx and Tx paths (or stereo wideband codec), audio digital signal processing (DSP) that provides adjustable gains and filtering, PCM circuits for interfacing with external devices, and additional audio DSP that actually implements encoding and decoding. Other key features include:
-The wideband codec supports stereo music/ringer melody applications in addition to the 8 kHz voice
band applications on the forward link.
-A PCM interface allows an external codec to be used instead of the internal codec; this supports inter-IC
Sound (I2S) modes that allow an external stereo DAC or SADC to be used.
-Currently in AMSS baseline only I2S output mode is supported (SDAC-only, no SADC support).
-Audio decoder summing and headset switch detection are included.
-Audio DSP includes the Rx and Tx filters needed to meet ITU-T G.712 requirements.
-A programmable sidetone path provides for summing part of the Tx audio into the Rx path.
-Many codec parameters are configurable via SBI registers.
-The audio processing is configured through QDSP5 command types and is not directly controlled by the
microprocessor.
3.9.7. Vocoder Subsystem
The MSM7227 device’s QDSP4000 supports AMR,FR,EFR and HR. In addition, the QDSP4000 has modules to support the following audio functions: DTMF tone generation, DTMF tone detection, Tx/Rx volume controls, Tx/Rx automatic gain control (AGC), Rx Automatic Volume Control (AVC), EarSeal Echo Canceller (ESEC), Acoustic Echo Canceller (AEC), Noise Suppression (NS), and programmable, 13-tap, Type-I, FIR, Tx/Rx compensation filters. The MSM7227 device’s integrated ARM9TDMI processor downloads the firmware into the QDSP4000 and configures QDSP4000 to support the desired functionality.
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3.9.8. Mode Select and JTAG Interfaces
The mode pins to the MSM7227 device determine the overall operating mode of the ASIC. The options under the control of the mode inputs are Native mode, which is the normal subscriber unit operation, ETM mode, which enables the built-in trace mode, and test mode for factory testing. The MSM7227 device meets the intent of the ANSI/IEEE 1149.1A-1993 feature list. The JTAG interface can be used to test digital interconnects between devices within the mobile station during manufacture.
3.9.9. General-Purpose Input/Output Interface
The MSM7227 IC includes 133 general purpose input/output (GPIO) pins, and each can be configured as a digital input or digital output. Inputs can be set to have a pull-up, pull-down, keeper, or no-pull. Output drive strength is also programmable. Software assigns functions to the GPIOs and their configurations are set accordingly. Some of the GPIO pins have alternate functions supported on them. The alternate functions include USB interface, additional RAM, ROM, general-purpose chip selects, parallel LCD interface, and a UART interface. The function of these pins is documented in the various software releases.
3.9.10. UART
The MSM7227 device employs three UARTs. UART1 has dedicated pins while UART2 and UART3 share multiplexed pins.
-UART1 for Bluetooth
-UART2 for USIM interface
-UART3 for data
.
3.9.11. USB
The MSM7227 IC supports one High Speed USB (HS-USB) USBH port with built-in PHY and one Full Speed USB-UICC port. The MSM7227 IC supports USB interfaces using two controllers:
-The primary controller is the HS-USB port with an integrated physical layer (PHY). This HS-USB port is
also capable of supporting USB operations at low-speed and full-speed.
-The secondary controller is the FS USB-UICC port, which only supports host mode functionality.
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3.10 Power Block
3.10.1. General
MSM7227, included RF, is fully covered by PM7540 (Qualcomm PMIC). PM7540 cover the power of MSM7227, MSM memory, RF block, Bluetooth, USIM and TCXO.
Major power components are :
PM7540 (U403) : Phone main PMIC
3.10.2 PM7540
The PM7540 device (Figure) integrates all wireless handset power management. The power management portion accepts power from all the most common sources – battery, external charger, adapter, coin cell back-up – and generates all the regulated voltages needed to power the appropriate handset electronics. It monitors and controls the power sources, detecting which sources are applied, verifying that they are within acceptable operational limits, and coordinates battery and coin cell recharging while maintaining the handset electronics supply voltages. Eight programmable output voltages are generated using low dropout voltage regulators, all derived from a common trimmed voltage reference. A dedicated controller manages the TCXO warm-up and signal buffering, and key parameters (under-voltage lockout and crystal oscillator signal presence) are monitored to protect against detrimental conditions. MSM device controls and statuses the PM7540 IC using Single-wire SBI(SSBI) supplemented by an Interrupt Manager for time-critical information. Another dedicated IC Interface circuit monitors multiple trigger events and controls the power-on sequence.
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Figure. PM7540 functional block diagram
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3.10.3. Charging control
A programmable charging block in PM7540 is used for battery charging. It is possible to set limits for the charging current. The external supply typically connects directly to pin (VCHG). The voltage on this pin (VCHG) is monitored by detection circuitry to ascertain whether a valid external supply is applied or not. For additional accuracy or to capture variations over time, this voltage is routed internally to the housekeeping ADC via the analog multiplexer. PM7540 circuits monitor voltages at VCHARGER and ICHARGE pins to determine which supply should be used and when to switch between the two supplies. These pins are connected to the Source (or emitter) and Drain (or collector) contacts of the pass transistor respectively.
3.10.3.1. Trickle Charging
Trickle Charging of the main battery, enabled through SBI control and powered from VDD, is provided by the PM7540 IC, The trickle charger is on-chip programmable current source that supplies current from VDD to pin (VBAT). Trickle charging can be used for lithium-ion and nickel-based batteries, with its performance specified below (3.2V). The charging current is set to 80mA.
Parameter Min Typ Max Unit
Trickle Current 60 80 100 mA
Figure. PM7540 Charging Flow (TC Charging)
3. TECHNICAL BRIEF
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3.10.3.2. Constant Current Charging
The PM7540 IC supports constant current charging of the main battery by controlling the charger pass transistor and the battery transistor. The constant current charging continues until the battery reaches its target voltage, 4.2V.
Figure. PM7540 Charging Flow (CC Charging)
3. TECHNICAL BRIEF
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3.10.3.3. Constant Voltage Charging
Constant voltage charging begins when the battery voltage reaches a target voltage, 4.2V. The end of constant voltage charging is commonly detected 10% of the full charging current.
3.10.3.4. LGP350 Charging Specification
-Charging Method : CC & CV (Constant Current & Constant Voltage)
-Maximum Charging Voltage : 4.2V
-Maximum Charging Current : 700mA
-Nominal Battery Capacity : 1280mAh
-Charging time : Max. 3h
- Full charge indication current (icon stop current) : 50mA
3.10.3.5. LGP350 battery bar icon display
Battery Bar Number Specification
BAR 6 (Full) 90% over
BAR 6 --> 5 90% 89%
BAR 5 --> 4 70% 69%
BAR 4 --> 3 50% 49%
BAR 3 --> 2 30% 29%
BAR 2 --> 1 15% 14%
BAR 1 --> 0 5% 4%
Low Battery Pop-up 4% ~ 15% : One Time popup (No call)
Critical Low Battery Pop-up 0% ~ 3% : Level change popup (No call)
POWER OFF 0%
Remain %
Table. LG-P350 battery bar specification
3. TECHNICAL BRIEF
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3.11 External memory interface
3.11.1. MSM7227
The MSM7227 device was designed to provide two distinct memory interfaces. EBI1 was targeted for supporting DDR synchronous memory devices. EBI2 was targeted towards supporting slower asynchronous devices such as LCD, NAND flash, SRAM, NOR flash etc. To support the high-bandwidth, high-density, and low-latency requirements of the advanced on-chip applications, the MSM7227 IC has two high-speed, high-performance memory slave interfaces: the external bus interface 1 (EBI1) and the stack memory interface (SMI). To achieve higher bandwidth and better use of the memory device interface, the SMI accepts multiple commands for the external memory
device. The SMI interface acts as a slave device to all of the bus masters within the MSM device. The masters arbitrate to gain access to the SMI, and upon obtaining the access, they issue commands to the SMI. The bus masters are connected to the SMI through an advanced extensible interface (AXI) bus bridge (or global interconnect block) and communicate over a 64-bit, non-blocking AXI bus protocol. The AXI bus bridge provides the arbitration logic for all of the bus masters.
EBI1 Features - Support for only low-power memories at 1.8-V I/O power supply voltage - AXI bus frequencies up to 133 MHz - A 16-bit/32-bit static and dynamic memory interface DDR SDRAM interface features include: - Supports both 32-bit DDR SDRAM devices, up to 133-MHz bus speed - Supports auto precharge and manual precharge - Supports partial refresh - Separate CKE pin per chip-select to support partial operation mode - Idle power down to save idling power consumption EBI2 Features - Support for asynchronous FLASH and SRAM(16bit & 8bit). - Interface support for byte addressable 16bit devices(UB_N & LB_N signals). - 2Mbytes of memory per chip select. - Support for 8 bit/16bit wide NAND flash.
- Support for parallel LCD interfaces, port mapped of memory mapped(8 or 16 bit)
3.11.2.LG-P350 External memory Interface
-Multi Chip Package : DDR SDRAM and NAND Flash merged 1 package -2Gbit Mobile DDR SDRAM / 4Gbit NAND Flash
Interface Spec
Part Name Product Gr Maker Operation Voltage Speed
NAND 1.8V 42ns H8BCS0UN0MCR-
4EM SDRAM
HINIX
1.8V 200MHz
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3.12 H/W Sub System
3.12.1. RF Interface
3.12.1.1. RTR6285 (WCDMA_Tx, GSM_Tx/Rx)
MSM7227 controls RF part(RTR6285) using these signals.
-RTR6285_SSBI : SSBI I/F signals for control Sub-chipset -RTR_TXON : Power AMP on RF part -RTR_RX_I/Q_M/P, RTR_TX_I/Q_M/P : I/Q for T/Rx of RF -RTR_DAC_REF : Reference input to the MSM Tx data DACs
3.12.1.2. the others
TRK_LO_ADJ : TCXO(19.2M) Control PA_ON0/PA_RANGE0 : WCDMA(2100) TX Power Amp Enable ANT_SEL[0-3] : Ant Switch Module Mode Selection(WCDMA,GSM Tx/Rx,DCS-PCS Tx/Rx) GSM_PA_RAMP : Power Amp Gain Control of APC_IC
3.12.1.3. RF2815 (GPS LNA)
* GPS_LNA_EN : GPS LNA Enable Signal (GPS LNA Shutdown)
3. TECHNICAL BRIEF
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3.12.1.4. BCM43291SKUBG (BT / WiFi chip )
WiFi
* WLAN_CMD : WLAN SDIO Command Line.
* WLAN_CLK : WLAN SDIO Clock Input.
* WLAN_SDIO[3:0] : WLAN SDIO Data Line.
* WLAN_RESET_N : Low asserting reset for WLAN core.
* WLAN_WAKEUP : WLAN Wakeup Input.
* WLAN_HOST_WAKEUP : WL_HOST_WAKEUP signal output.
BT
* BT_UART_RXD : Bluetooth UART Serial Input.
* BT_UART_RTS : Bluetooth UART Request to Send. Active-low request.
* BT_UART_CTS : Bluetooth UART Clear to Send. Active-low clear.
* BT_UART_TXD : Bluetooth UART Serial Output.
* BT_PCM_CLK : BT PCM clock, can be PCM-master (output) or PCM-slave (input).
* BT_PCM_DIN : BT PCM data input.
* BT_PCM_SYNC : BT PCM sync signal, can be PCM-master (output) or PCM-slave (input).
* BT_PCM_DOUT : BT PCM data output.
* BT_WAKEUP : BT Wakeup Input.
* BT_HOST_WAKEUP : BT Host Wakeup Output
* BT_RESET_N : Low asserting reset for BT core.
Common
* SLEEP_CLK : LPO clock (32.768kHz) input. Used for low-power mode timing.
* CLK_IN : Crystal amplifier input or frequency reference input.
* CLK_REQ : Crystal Circuit / Reference Clock Enable (active-high)
FM Radio
* FM_ANT : FM RF input.
* SLEEP CLK : External reference oscillator input. (32.768KHz)
* FM_R : Right audio line output – digital input data.
* FM_L : Left audio line output – digital frame synchronization.
3. TECHNICAL BRIEF
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LGE Internal Use Only
Figure. Wifi/BT/FM Interface Block Diagram
FM R
LG-P350 WiFi/BT/FM Interface
3.5Ear-Jack
FM_ANT
WLAN_HOST_WAKEUP
FM_R
FM_LFM_ADOUT2
FM_ADOUT1FM_RX
WL_GPIO_0
LINE_R_IP
LINE_L_IP
GPIO94
Ear-
jack
WLAN WAKEUP
WLAN_CMD
WLAN_CLK
WLAN_RESET_N
SDIO_CMD
SDIO_CLKGPIO62
TX_WLBGGPIO63
BT_RFOP
WL_GPIO_1WLAN_WAKEUP
GPIO122
DEA162450BT
TX_WLBG
TX_BT
RX BG
WLAN_SDIO [3:0]
BT_UART_RXD
BT_UART_TXDBT_UART_RXD
BT UART TXD
WL_RST_N
SDIO_DATA [3:0]
GPIO93
GPIO46
227
GPIO45
GPIO[64:67]
RX_BG
GMODE_EXT_LNA_GAIN
RF_SW_CTRL
DEA162450BTRF5501_
SW_CTRL
EXT_LNA_GAIN
BT_RESET_N
BT_UART_CTS
BT_UART_RTS
BT_UART_TXD
BT_UART_RST_N
BT_UART_CTS_N
291S
KU
BG
MSM
7 2 GPIO45
GPIO44
GPIO43
G O 23
PM7540
SLEEP_CLK(LPO Clock:32.768KHz)
_ _
BT_PCM_SYNC
BT_PCM_DIN
BT PCM DOUT
BT_RST_N
BT_PCM_SYNC
BT_PCM_OUT
BCM
43GPIO123
GPIO70
GPIO69WRF_EXTREFIN
38 4MHz
32.768KHz
PM7540BT_PCM_DOUT
BT_PCM_CLK
BT_WAKEUP
BT HOST WAKEUP
BT_GPIO_0
BT_PCM_IN
BT_PCM_CLK
GPIO68
GPIO71
GPIO42
CLK IN 38.4MHzTCXO
BT_HOST_WAKEUPBT_GPIO_1GPIO83 OSCIN
CLK_IN
3. TECHNICAL BRIEF
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3.12.2 MSM Sub System
3.12.2.1. USIM Interface
SIM interface scheme is shown in Figure.
And, there control signals are followed
-USIM_CLK : USIM Clock -USIM_Reset : USIM Reset -USIM_Data : USIM Data T/Rx
3.12.2.2. UART Interface
UART signals are connected to MSM GPIO through IO connector with 115200 bps speed.
GPIO_Map Name Note
GPIO_86 UART3_RX Data_Rx
GPIO_87 UART3_TX Data_Tx
Table. UART Interface
USIM CLK
USIM Reset
USIM Data
VREG_RUIM_ �.85V
USIM CLK
USIM Reset
USIM Data
MSM7227 PM7540 USIM
Figure. SIM Interface
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3.12.2.3. HS-USB
The High-Speed USB module contains an embedded UTMI+ core with a built-in transceiver eliminating the need for an external PHY. The HS-USB port is a standard 4-pin interface that connects directly to the USB connector (USBPHY_DP, USBPHY_DN, USBPHY_ID and USBPHY_VBUS). Two additional pins are required for PHY operations which include an external reference resistor pin (USBPHY_REXT) and a USB system clock pin which the USB PHY uses to lock its internal PLL (SYS_CLK)
Figure. HS-USB connections and architecture
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3.12.3 KEY
3.12.3.1 Side key
There are 2 side key , Send, and END buttons that are controlled by MSM7227.
Refer to the circuit.
Figure. Volume Side key
Figure. End key
Figure. Send key
CN800
4
3
2
1R810 100R811 100R813 100
ZD801ZD800 ZD802
KEY_ROW[1]
KEY_COL[0]KEY_COL[1]
VOL_UP
VOL_DOWN
VA801
R814
100K
KB800
PM_ON_SW
END
ZD805ZD803
KB801
R816 100
R812 100KEY_ROW[0]
KEY_COL[1]
SEND
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3.12.3.3 KEY Backlight
There are 2 White side view LED, 2 white LED in key backlight circuit
Figure. KEY Backlight
VA800
R809
100
R808
100
71 8R
1 5
1u
C805
LD801
EDLH0005901LEWW-S14
LD800
+VPWR
KEY_LED_DRV_N
+VPWR
1608 TOP VIEW LED
3. TECHNICAL BRIEF
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BT_PCM_IN WIFI&FM&BT
BT_PCM_SYNCBCM43291
BT_PCM_OUT
BT_PCM_CLK FM_ANT_ _
FM_RFM_L
MSM7227MICBIAS
FM ANT
AUDIOSUBSYSTEM
TPA2055D3
1
3.13 Audio and sound3.13.1. Overview of Audio path
Figure. Block diagram of Audio & Sound path
3. TECHNICAL BRIEF
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3.13.2. Audio signal processing & interface
3.13.2.1 MSM7227 audio interface
The MSM7227 audio front end comprises the stereo wideband codec, PCM interface, and additional DSP audio processing. The stereo wideband codec allows the MSM7227 device to support stereo music/ringer melody applications in addition to the 8 kHz voice band applications on the forward link.
In the audio transmit path, the device operates as 13-bit linear converter with software, selectable 8 kHz and 16 kHz sampling rate. In the audio receive path, the device operates as a software-selectable 13-bit or 16-bit linear converter with software selectable 8 kHz,16 kHz, 22.05 kHz, 24 kHz, 32 kHz, 44.1 kHz, or 48 kHz sampling rate. Through software, the Rx path can be configured as either a mono or stereo output. New to the MSM7227 device is a transmit (Tx) ADC path that now supports stereo wideband sampling. The integrated codec contains all of the required conversion and amplification stages for the audio front end. The codec operates as a 13-bit linear codec with the transmit (Tx) and receive (Rx) filters designed to meet ITU-T G.712 requirements.
The codec includes a programmable side tone path for summing a portion of the Tx audio into the Rx path. An on-chip voltage/current reference is provided to generate the precise voltages and currents required by the codec. This circuit requires a single capacitor of 0.1 μF to be connected between the CCOMP and GND pins. The on-chip voltage reference also provides a microphone bias voltage required for electret condenser microphones typically used in handset applications. The MICBIAS output pin is designed to provide 1.8 V DC while delivering as much as 1 mA of current. Audio decoder summing and headset switch detection are included. The codec interface includes the amplification stages for both the microphone and earphone. On the transmit (Tx) path, the interface supports two differential microphone inputs, a differential auxiliary input, and a stereo line input. On the receive (Rx) path the interface supports one differential earphone output, a stereo single-ended headphone output, one differential auxiliary output, and stereo single-ended line outputs. The codec is configured by the codec SBI registers. The codec interface is shown in Figure.
Also part of the audio front end is the PCM interface. The PCM interface allows for an external codec to be used instead of the internal codec. This interface can be used in I2S mode which will allows for an external stereo DAC to be used. Finally, the audio front end includes additional DSP audio processing that does gains, filtering and other audio processing.
The DSP audio processing is configured through the QDSP5000 command types and is
not directly controlled by the microprocessor.
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Figure. Detailed diagram of MSM7227 audio interface
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3.13.2.2 TPA2055D3 audio interface
The.TPA2055D3 is an audio subsystem with a mono class-D power amplifier, a stereo class-G DirectPathTM headphone amplifier, and bypass switches. Class-G improves MP3 playback time while DirectPath eliminates the need for external dc-blocking output capacitors. The headphone amplifier drives up to 35mW into 16-ohm speakers form a 1.8-V supply.
The subsystem includes two stereo single-ended(SE) inputs. The stereo inputs are also configurable as differential mono inputs. Each input channel has an independent volume control. Inputs can be individually selected or mixed together. Input impedances remain constant over all input and output gains.
Operating mod and volume levels are controlled over an I2C interface. The i2C interface is compatible over a 1.5V to 5.5V digital supply range.
The TPA2055D3 uses SpeakerGuard TM Limiter technology to prevent output clipping distortion and excessive power to the speakers and headphones. The speaker and headphone amplifier outputs have independent limiter levels, allowing optimum loudness and protection for each output.
The TPM2055D3 is available in a 0.5 mm pitch 20-bump WCSP with less than 0.8 mm height.
Figure. Detailed diagram of TPA2055D3 audio interface
3. TECHNICAL BRIEF
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206R
IND
MIC600
4
3
2
1P
G1
G2
O
C601
1800FB600MIC_1P
MIC_1NMIC_BIAS
MIC
TP602
R630
47
HS_MIC_BIAS_TEMPR628
DNI
C637
DNI
506R
K2.2
R629 47K
HS_MIC_BIAS
1800FB606
C617
33p
2.2u
C606
1800FB603
C607
33p
C615
47p 1n
C618
SC600
1
216R
K01
J600
2
3
4
5
6
1 M5
M4
M3
M4F
M1
M6
116R
K01
FB605 1800
Q600
D
G
S
0 06D
206D
306D
C616
47p
106D
406R
M1
C619
22p
406D
270n
L600
VREG_MSMP_2.6V
1800FB604
306R
K1
606R
K001
EAR_SENSE
EAR_L
EAR_R
EARMIC_P
HOOK_ADC
FM_ANT
3.5pi EAR JACK
HIGH
LOW(DEFAULT)
STATE
UNMATING
EAR_SENSE
MATING
ENJE0008001
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02
6C
u2.
2
U600
3D
1C
2E
2A
C2
B2
B4
A4
B3
E1
A3
D1
A1
C3
B1
E4
E3C4
4D
2D
DD
VP
H
DD
VP
S
IN3- OUT+
OUT-
HPL
IN3+
HPR
CP
IN1+
CN
IN1-
IN2+
IN2-
SDA
SCL
SAI
B
DD
VP
C
SS
VP
C
DN
G
C636
0.1u 0.1u
C605u2.
212
6C
2.2uC614
u2
.2
226C
10u
C604
+VPWR_AUDIO
C603
2.2u
VREG_HPVDD_1.8V
33nC613
R610 K7.4
R609 K7.4
VREG_MSMP_2.6V
33nC612
FB601 600
FB602 600
C608
1n470nC611C610 470n
10R608
C609
1n
10R607RCV_NRCV_P
HPH_RHPH_L
AUDIO_I2C_SCLAUDIO_I2C_SDA
SPK_RCV-SPK_RCV+
EAR_LEAR_RLINE_ON
LINE_OP
+VPWR_AUDIO
Audio SUB SYSTEM
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3.14 Display
LCD module is connected to Main PCB with 40-pin connector.
The LCD is controlled by CPU Interface in MSM7227.
Figure. Schematic of LCD connector (Main Board)
VREG_LCD_1.8V
FL702
15pF 015
64
73
82
91INOUT_A1 INOUT_B1
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
1G
2G
U701 EUSY0391601
NLSV1T244MUTBG
43
52
61VCCA VCCB
A B
GND OE_
15pF
FL701
015
64
73
82
91INOUT_A1 INOUT_B1
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
1G
2G
15pF
ICVE10184E150R101FRFL704
015
64
73
82
91INOUT_A1 INOUT_B1
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
1G
2G
C705
2.2u
FL703 SFEY0010501
15pF 015
64
73
82
91INOUT_A1 INOUT_B1
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
1G
2G
GB042-40S-H10-E3000ENBY0036001
CN700
2120
2219
2318
2417
2516
2615
2714
2813
2912
3011
3110
329
338
347
356
365
374
383
392
401
VREG_LCD_1.8V
FL700
15pF 015
64
73
82
91INOUT_A1 INOUT_B1
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
1G
2G
VA700
VREG_LCD_2.8V
1uC710
1u
C700
R702
100
VREG_MSMP_2.6VVREG_LCD_1.8V
017R
K001
LCD_RESET_N
EBI2_DATA[0]EBI2_DATA[1]
EBI2_DATA[10]EBI2_DATA[11]
EBI2_DATA[12]EBI2_DATA[13]EBI2_DATA[14]EBI2_DATA[15]
EBI2_DATA[2]EBI2_DATA[3]
EBI2_DATA[4]EBI2_DATA[5]EBI2_DATA[6]EBI2_DATA[7]
EBI2_DATA[8]EBI2_DATA[9]
nNAND_OE
nNAND_WE
WLED_PWR
MLED[2]MLED[3]
MLED[1]
MLED[4]MLED[5]
LCD_RSLCD_CS
LCD_VSYNC_OLCD_VSYNC_LS
LCD_VSYNC_LS
LCD_MAKERID_HIGH
LCD Filter(EMI 100 ohm, 15pF)
Maker IF Maker ID
TOVIS H H
3. TECHNICAL BRIEF
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Table. Interface between LCD Module and MAIN Board
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3.15 Vibrators (Q-Coin Motor)
The strength of vibration is determined by the duty cycle of PWM (LIN_PWM_FREQ)
U601 : EUSY0404001 is Q-Coin motor driver IC.
Figure. Q-Coin Moter IC Schematic
Figure. Vibrator Block Diagram
R6231K
C634
0.1u
Q601
C
B
E100KR627
R613
100KU601
B2C1
A1B1
B3C2
A3C3IN- VDD
IN+ VO+
_SHUTDOWN VO-
BYPASS GND
VREG_MOTOR_3.3V
C633
0.1u
VREG_MOTOR_3.3V
R622
4.7K 51K
R624
R626
1KC635 10n
51K
R625
LIN_PWM_FREQ
MOTOR_N
MOTOR_P
1%
1%
1%
1%
1%
1%
3. TECHNICAL BRIEF
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3.16 Compass Sensor
If a customer buy the application SW, The Sensor Support a Eletric Compass function
U604 : AMI304 IC used I2C interface to MSM7227
Figure. Compass Sensor Schematic
U604
12
11
10
9
5
4
6
37
28
1D
DV
D
GE
RV
AD
NG
SD
NG
DD
VA
ADDR
SCL
NC1
TN
I
VPP
DRDY
SDA
C627
10n
VREG_MOTION_3.0V
TP601
R617
2.2K
VREG_MSMP_2.6V
C628
470n
R618
2.2K
COMPASS_DRDYCOMPASS_I2C_SDA
COMPASS_I2C_SCL
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Figure. Compass Sensor Block Diagram
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3.17 Motion Sensor
According to tilt the cell phone, the screen is had rotated automatically.
U603 : KR3DH IC used I2C interface to MSM7227
Figure. Motion Sensor Schematic
Figure. Motion Sensor Block Diagram
C639
10u
TP600
R619 K2.2R620 K2.2
C624
10u
VREG_MOTION_3.0V
U603
6 1
7 6
5
4
8
3
9
2
10
1
11
12
13
41 512
DE
VR
ES
ER
DD
V
GND3
GND2
INT1
VDD_IO
RESERVED1
NC1
INT2
NC2
SC
SCL_SPC
GND1
OD
S_ID
S_A
DS
0A
S _O
DS
4D
NG
C623
0.1u
VREG_MSMP_2.6V
C638
0.1u
MOTION_I2C_SDA
MOTION_I2C_SCLMOTION_INT
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3.18 Main Features
- DOP Type design
- UMTS 2100 + UMTS 900 + GSM 900 + DCS 1800 + PCS 1900 + GSM850 based GSM/GPRS/EDGE/UMTS
- HSDPA 3.6Mbps
- TFT Main LCD(2.8’ QVGA, 280 x 320)
- Capacitive/Electrostatic Touch Window
- 3M FF Camera
- 3.5Phi Stereo Headset & Speaker phone
- Mobile XMF –Mobile DLS / Scaleable Polyphony
- MP3/AMR/AAC/AAC/WAV/WMA decoder and play
- MPEG4 encoder/decoder and play/save
- JPEG en/decoder
- Supports Bluetooth and HS-USB
- Supports WLAN(802.11b, 802.11g)
- Supports FM Radio
- 1280 mAh (Li-Ion)
3. TECHNICAL BRIEF
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3.19 Main component
3.19.1. LG-P350 Main component (bottom)
Main Board Bottom
Logic
RF
PMIC
WLAN
GPS
SD memory
soket
3. TECHNICAL BRIEF
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LGE Internal Use Only
3.19.2. LG-P350 Main component (bottom & Sub carrier)
Main Board Bottom & Sub carrier
Vibrator Camera
3. TECHNICAL BRIEF
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LGE Internal Use Only
3.19.3. LG-P350 Main component (Top)
Main Board Top
Back-up Battery
Dome key
3. TECHNICAL BRIEF
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LGE Internal Use Only
3.19.4. RF of LG-P350
Reference Description Reference Description
U1000 RTR6285(Transceiver) FL1000 EGSM/850 Rx saw filter
U1001 GSM TX Module
(ASM + GSM/EDGE PAM)
FL1001 DCS/PCS Rx saw filter
U1002 WCDMA Dual (I,VIII) PAM X300 VCTCXO(19.2MHz)
FL1005 WCDMA (I) TX SAW Filter SW1000 RF Antenna Connector
FL1003 WCDMA (VIII) TX SAW Filter FL1002 WCDMA (I) RX SAW Filter
FL1007 WCDMA (I) Duplexer FL1004 WCDMA (VIII) Duplexer
SW1000
X300
U1000
U1002 FL1004
U1001
FL1001
FL1007
FL1000
FL1005
FL1003
FL1002
3.19.4. RF of LG-P350
3. TECHNICAL BRIEF
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LGE Internal Use Only
3.19.5. BaseBand AND Power of LG-P350
Reference Description Reference Description
CN702 Camera Connector U603 Motion Sensor
U600 Audio Sub System CN700 LCD Connector
U401 Memory U701 Level shifter
U300 MSM7227 CN501 I/O Connector
X500 Crystal U504 MUIC
U501 PMIC U503 OVP IC
CN701 Touch Connector Q500 Charging IC
U700 Charge Pump IC
U700
U603
CN700
U701
U504
U503
Q500 U501
X500
U401
U300
U600
CN702 CN701
CN501
3. TECHNICAL BRIEF
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LGE Internal Use Only
3.19.6. GPS WIFI of LG-P350
Reference Description Reference Description
U201 WiFi(11bg)+BT+FM(Rx) Chip U1003 GPS LNA
U200 SP3T+LNA FL1006 SAW Filter
U1003
U201
U200
FL1006
3. TECHNICAL BRIEF
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LGE Internal Use Only
3.19.7. Audio of LG-P350
Reference Description Reference Description
U600 TPA2055D3 CN701 Touch Connector
CN702 Camera Connector
U600
CN701
CN702
4. TROUBLE SHOOTING
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LGE Internal Use Only
TROUBLE SHOOTING
4.1 RF Component
FL1007 W2100 Duplexer
FL1004 W900 Duplexer
U1002 W2100/900
PAM
FL1005 W2100
Tx saw
FL1000 EGSM/850
Rx saw
FL1001 DCS/PCS
Rx saw
FL1002 W2100 Rx saw
FL1003 W900
Tx saw
U1001 GSM PAM+ASM
U1000 RF Transceiver
X300 VCTCXO
U1003 GPS LNA
FL1006 GPS Rx saw
4. TROUBLE SHOOTING
4. TROUBLE SHOOTING
- 7� - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
RF component (WCDMA / GSM)
Reference Description Reference Description
U1000 RTR6285(Transceiver) FL1002 WCDMA (I) RX SAW Filter
U1001 GSM TX Module
(ASM + GSM/EDGE PAM) FL1000 EGSM/850 Rx saw filter
U1002 WCDMA Dual (I,VIII) PAM FL1001 DCS/PCS Rx saw filter
FL1005 WCDMA (I) TX SAW Filter X300 VCTCXO(19.2MHz)
FL1003 WCDMA (VIII) TX SAW Filter U1003 GPS LNA
FL1007 WCDMA (I) Duplexer FL1006 GPS RX SAW Filter
FL1004 WCDMA (VIII) Duplexer SW1000 RF Antenna Connector
4. TROUBLE SHOOTING
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LGE Internal Use Only
4.2 SIGNAL PATH
WCDMA I and VIII Band TX Signal PATH
D2. WCDMA 2100 TX PATH
E2. WCDMA 900 TX PATH
F1. COMMON TX/RX PATH
4. TROUBLE SHOOTING
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LGE Internal Use Only
WCDMA BAND I and VIII RX Signal PATH
D1. WCDMA 2100 RX PATH
E1. WCDMA 900 RX PATH
F1. COMMON TX/RX PATH
4. TROUBLE SHOOTING
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LGE Internal Use Only
GSM850/GSM900/DCS/PCS’s RX/TX Signal PATH
A. GSM850/GSM900/DCS1800/PCS1900 RX PATH
B. GSM850/GSM900/DCS1800/PCS1900 TX PATH
C. COMMON TX/RX PATH
4. TROUBLE SHOOTING
- 76 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4.3 Checking TCXO Block
The output frequency (19.2MHz) of TCXO (X200) is used as the reference one of RTR6285 and PM7540 internal
VCO.
Schematic of the Crystal Part (19.2MHz)
TP3
TP2
TP1
TP2 TP3
TP1
C308
10n
R310 33
100
R303
19.2MHzKT3225L19200DCW28RA0
X300
42
31VCONT OUT
GND VCC
C301
0.1u
C320 330p
C307 330p
R319
1
C309 330p
C300
1n
VREG_TCXO_2.85V
VREG_MSMA_2.6VC310 0.1u
U301
3
2
4
15
VCC
GND
R311 100K
TCXO_PM_19.2MHZ
TCXO_EN
TCXO_RTR_19.2MHZ
USBH_SYSCLK
RTR_TRK_LO_ADJ
FFA Rev.C(220Ohm@100MHz)
1.0T
TCXO Circuit
Clesed to TCXO
TP2
TP1
TP3
4. TROUBLE SHOOTING
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LGE Internal Use Only
Check TP1VCC of TCXO
VCC ≥ �.8V Check the PM7540No
Yes
Check TP�
�.4V ≥ Voltage ≥ 0.4V Check the MSM7��7No
Yes
Check TP3
19.� MHz Signal Check soldering and components
No
Yes
TCXO is OK
4. TROUBLE SHOOTING
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LGE Internal Use Only
4.4 Checking GSM TX Module(GSM PAM + ASM) Block
VBATT(TP1)
ANT_SEL0
ANT_SEL3
ANT_SEL2
ANT_SEL1
4. TROUBLE SHOOTING
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LGE Internal Use Only
Schematic of the Antenna Switch Block
TP1
C101839p
19
9001R
C1045 1n
C1049 1nC1046 1n
C1042
47p
19
8001R
C1106
DNI
75
R1006
VBATT
031
5001R
47
R1003
031
4001R
R1002
2.2K
U1001
313029
44434241
403938
736353
1615
4131211101
343332
17
9
188 197 206 215 224
32
3
42
2
52627282
1DCS_PCS_IN
11D
NG
01D
NG
9D
NG
8D
NG
GND1
7D
NG
GSM_IN
6D
NG
VAPCGND5VBATTGND4BS2GND3BS1GND2_TXEN
ANT
ED
OM
WCDMA3
PGND4PGND5PGND6 P
MET
4X
R3
XR
2X
R1
XR
WCDMA1WCDMA2
7D
NG
P8
DN
GP
9D
NG
P PGND10PGND11PGND12
PGND13PGND14PGND15PGND16
PGND1PGND2PGND3
C1043 1n
GSM_PA_RAMP
ANT_SEL3
ANT_SEL0ANT_SEL2
ANT_SEL1
GSM_TX
DCS_PCS_TX
8061
06030603
0603
DCS(1710-1785 MHz)
PCS(1850-1910 MHz)
GSM900(880-915MHz)GSM850(824-849MHz)
7dB
11dB
2mm TP1
4. TROUBLE SHOOTING
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LGE Internal Use Only
Check ANT_SEL 0, 1, �, 3High Level
1.�V < Voltage < 3V Check the TP1(VBATT)No
Yes
Check the Logic in each mode
Checking Switch Block Power Source
4. TROUBLE SHOOTING
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LGE Internal Use Only
4.5 Checking WCDMA Block
START
1. Check TCXO 19.�MHz
6. Ro-download SW & Cal.
�. Check FEM Block Refer to 1.4
3. Check RF Tx Level
4. Check PAM BlockRefer to 1.5.4
5. Check RF Level
4. TROUBLE SHOOTING
- 8� - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4.5.1Checking TCXO Block
Refer to 1.3
4.5.2. Checking Tx Module Block
Refer to 1.4
4.5.3. Checking RF TX Level
Test Point (TX Level)
TP1 TP2
TP3
TP4
4. TROUBLE SHOOTING
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LGE Internal Use Only
R1001DNI
SW1000
42131
G A C
2G
C101839p
19
9001R
C1045 1n
C1049 1n
3.9p
L1040
C100415n
R1000
100p
ANT1000
C1046 1n
L1042DNI
C1042
47p
19
8001R
L1000
100n
ANT1001
C1001
2.7n
C1106
DNI
75
R1006
VBATT
0.5p
L1001
031
5001R
47
R1003
031
4001R
R1002
2.2K
U1001
313029
44434241
403938
7363531615
4131211101
343332
17
9
188 197 206 215 224
32
3
42
2
52627282
1DCS_PCS_IN
11D
NG
01D
NG
9D
NG
8D
NG
GND1
7D
NG
GSM_IN
6D
NG
VAPCGND5VBATTGND4BS2GND3BS1GND2_TXEN
ANT
ED
OM
WCDMA3
PGND4PGND5PGND6 P
MET
4X
R3
XR
2X
R1
XR
WCDMA1WCDMA2
7D
NG
P8
DN
GP
9D
NG
P PGND10PGND11PGND12
PGND13PGND14PGND15PGND16
PGND1PGND2PGND3
L1041DNI
ANT1004
C1043 1n
GSM_PA_RAMP
ANT_SEL3
ANT_SEL0ANT_SEL2
ANT_SEL1
WCDMA_900_RTX
WCDMA_2100_RTX
GSM_TX
DCS_PCS_TX
8061
06030603
0603
DCS(1710-1785 MHz)
PCS(1850-1910 MHz)
GSM900(880-915MHz)GSM850(824-849MHz)
7dB
11dB
2mm
C1080
6.8n
FL1007
1950MHz, 2140MHz
958472
3
6 1RXANT
TX
GND1 GND4GND2 GND5GND3 GND6 C1105 2.2n
C1095 1.8p
C1083 1.8p
1.2n
L1025
L102410n
1950MHz
FL1005
5 2
4 1
3G3
INOUTG1G2
p0017801
C
68 01C
p001
p0014801
C
C1104DNI
10uC1071
VBATT
L1021
2.2p
1n
C1091
L1037DNI
C1088 33n
DNIL1036
DNIL1022
U1002
51
8 7
9 6
10 5
11 4
12 3
13 2
14 1RFIN_LOWRFOUT_LOW
VMODEGND3
VBPVCC2
VCC1GND2
VEN_LOWRFOUT_HI
VEN_HIGND1
RFIN_HICPL
DN
GP
FL1004
897.5 MHz,942.5 MHz
95
8
4 72
3
61
RX1ANT
TXGND1
GND4GND2
RX2
GND3 GND6
C1070330p
C10691n
C1092
4.7n
C1082
3p
C1078
33p
33pL1023
1.2pC1094
C1077
3.9n
C1089
DNI
C1079
1n3.3n
L1018FL1003
897.5 MHz
5 3 2
4 1INOUT
G1G2G3
5801C
p001
L103533p
L1026DNI
33p
C10908101R
001
L10320.75pDNI
L1033
L10393p
C1097
33p
R1016
62
001
7101R
PA_R0
PA_ON0PA_ON1
PA_R1
WCDMA_900_TX_OUT
WCDMA_900_RTXRX_WCDMA_900_M
RX_WCDMA_900_P
PDET_IN
RX_WCDMA_2100
WCDMA_2100_RTX
WCDMA_2100_TX_OUT
1mmNear to 4 Pin Near to 12 Pin
Near to 12 Pin
0603
W900
W2100
W2100 TX(1920 - 1980 MHz)
BAND 1/2
Band 8
BAND2(2520) : ACMD-7407
SDMY0001901
BAND8(2520) : B7953 (SDMY0002801)
W900 TX(880 - 915 MHz)
Band 1
SDMY0002801
BAND1(2520):SAYP1G95AA0B00
W900 RX(925 - 960 MHz)
0603
TP1
TP2
TP2
TP3
TP3
TP4
TP4
4. TROUBLE SHOOTING
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LGE Internal Use Only
For testing, Max power output is needed.
Check ANT_SEL 0, 1, �(High, Low, Low)
Check TP1 Over �1dBm? RF Tx Level is OKYes
No
Check PAM BlockRefer to 1.5.4
Check TP� Over �1dBm? Check TX ModuleYes
No
Check TP3 Over �1dBm? Check DuplexerYes
No
Check TP4 Over 7dBm? Check RTR6�85Yes
No
RTR6�85 Maximum output Power = 7 dBmRTR6�85 minimum output Power = -80 dBmPAM(ACPM-5�81) = Maximum input Power = 10 dBm
4. TROUBLE SHOOTING
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LGE Internal Use Only
4.5.4. Checking PAM Block
PAM control signal
W_PA_ON (W_1700_PA_ON(C1115), W_2100_PA_ON(C1095) and) : PAM Enable
W_PA_RO: PAM Gain Control
W_PA_ON must be HIGH (over 2.6V)
PAM IN/OUT Signal :
When PAM is under the operation of high power mode (WCDMA_PA_R0(C1929):Low),
PAM OUT power must be over 21 dBm
PAM IN power must be under 10 dBm
4. TROUBLE SHOOTING
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LGE Internal Use Only
TP3
TP1
TP2
4. TROUBLE SHOOTING
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LGE Internal Use Only
Set the phone Tx is On andPDM is �10
Check TP3 Over �1dBm? RF Tx Level is OKYes
No
Change the board
Check TP� PA_RO ≥ �.6V Check MSM7��7Yes
No
Check TP1 Over 10 dBm? Check RTR6�85Yes
No
4. TROUBLE SHOOTING
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LGE Internal Use Only
4.5.5. Checking RF Rx Level
Test Point (RF Rx Level)
TP1 TP2
TP3
TP4 Bias
4. TROUBLE SHOOTING
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LGE Internal Use Only
R1001DNI
SW1000
42131
G A C
2G
C101839p
19
9001R
C1045 1n
C1049 1n
3.9p
L1040
C100415n
R1000
100p
ANT1000
C1046 1n
L1042DNI
C1042
47p
19
8001R
L1000
100n
ANT1001
C1001
2.7n
C1106
DNI
75
R1006
VBATT
0.5p
L1001
031
5001R
47
R1003
031
4001R
R1002
2.2K
U1001
313029
44434241
403938
7363531615
4131211101
343332
17
9
188 197 206 215 224
32
3
42
2
52627282
1DCS_PCS_IN
11D
NG
01D
NG
9D
NG
8D
NG
GND1
7D
NG
GSM_IN
6D
NG
VAPCGND5VBATTGND4BS2GND3BS1GND2_TXEN
ANT
ED
OM
WCDMA3
PGND4PGND5PGND6 P
MET
4X
R3
XR
2X
R1
XR
WCDMA1WCDMA2
7D
NG
P8
DN
GP
9D
NG
P PGND10PGND11PGND12
PGND13PGND14PGND15PGND16
PGND1PGND2PGND3
L1041DNI
ANT1004
C1043 1n
GSM_PA_RAMP
ANT_SEL3
ANT_SEL0ANT_SEL2
ANT_SEL1
WCDMA_900_RTX
WCDMA_2100_RTX
GSM_TX
DCS_PCS_TX
8061
06030603
0603
DCS(1710-1785 MHz)
PCS(1850-1910 MHz)
GSM900(880-915MHz)GSM850(824-849MHz)
7dB
11dB
2mm
TP1
FL1007
1950MHz, 2140MHz
958472
3
6 1RXANT
TX
GND1 GND4GND2 GND5GND3 GND6 C1105 2.2n
C1095 1.8p
C1083 1.8p
L102410n
C1104DNI
L1037DNI
C1088 33n
DNIL1036
FL1004
897.5 MHz,942.5 MHz
95
8
4 72
3
61
RX1ANT
TXGND1
GND4GND2
RX2
GND3 GND6
33pL1023
C1089
DNI
L103533p
L10393p
WCDMA_900_RTXRX_WCDMA_900_M
RX_WCDMA_900_P
RX_WCDMA_2100
WCDMA_2100_RTX
W2100 TX(1920 - 1980 MHz)
BAND 1/2
Band 8
BAND2(2520) : ACMD-7407
SDMY0001901
BAND8(2520) : B7953 (SDMY0002801)
W900 TX(880 - 915 MHz)
Band 1
SDMY0002801
BAND1(2520):SAYP1G95AA0B00
W900 RX(925 - 960 MHz)
TP2
TP2
TP3
TP3
4. TROUBLE SHOOTING
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LGE Internal Use Only
Set the phone Rx is On
Check BIAS over �.1V Check bias block solderingNo
Yes
Change the board
Check TP1 Signal exist? Check RF Switch (M/S)No
Yes
Check TP� Signal exist? Check TX Module Refer 1.4No
Yes
Check TP3 Signal exist? Check DuplexerNo
Yes
Check TP4 Signal exist? Check RTR6�85 and Rx SAW filterNo
Yes
1.2n
L1019
C1075
3.3n
2140MHz
FL1002
45
1
32G1 O1
ING2 O2
33pC1074
L1017
1.2n
VDD_RX
C1076DNI C1081
3.9p
DNIC1073
2nL1016
3.9p
C1072
p0018601
C
760 1C
u1 .0
R1015
DNI
R1021
0
K141 01
R
RX_WCDMA_2100_LNA_OUT
RX_WCDMA_1900_LNA_OUT WB2100_MIX_INP
WB2100_MIX_INM
WCDMA RX 2100 LNA Circuit
W2100 RX(2110 - 2170 MHz)0603
TP4
Bias
4. TROUBLE SHOOTING
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LGE Internal Use Only
Start
1. Check TCXO Block
4. Ro-download SW & Cal.
�. Check Tx Module
3. Check RF TRX Level
4.6 Checking GSM Block
4. TROUBLE SHOOTING
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LGE Internal Use Only
1
2,3
4. TROUBLE SHOOTING
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LGE Internal Use Only
4.6.1 Checking TCXO Block
Refer to 1.3
4.6.2 Checking Tx module Block
Refer to 1.4
4.6.3 Checking RF TX level
TP1
TP2 TP3
4. TROUBLE SHOOTING
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LGE Internal Use Only
Schematic of GSM/DCS/PCS Tx Block
TP1
TP3
TP2
R1001DNI
SW1000
42131
G A C
2G
C101839p
19
9001R
C1045 1n
C1049 1n
3.9p
L1040
C100415n
R1000
100p
ANT1000
C1046 1n
L1042DNI
C1042
47p
19
8001R
L1000
100n
ANT1001
C1001
2.7n
C1106
DNI
75
R1006
VBATT
0.5p
L1001
031
5001R
47
R1003
031
4001R
R1002
2.2K
U1001
313029
44434241
403938
7363531615
4131211101
343332
17
9
188 197 206 215 224
32
3
42
2
52627282
1DCS_PCS_IN
11D
NG
01D
NG
9D
NG
8D
NG
GND1
7D
NG
GSM_IN
6D
NG
VAPCGND5VBATTGND4BS2GND3BS1GND2_TXEN
ANT
ED
OM
WCDMA3
PGND4PGND5PGND6 P
MET
4X
R3
XR
2X
R1
XR
WCDMA1WCDMA2
7D
NG
P8
DN
GP
9D
NG
P PGND10PGND11PGND12
PGND13PGND14PGND15PGND16
PGND1PGND2PGND3
L1041DNI
ANT1004
C1043 1n
GSM_PA_RAMP
ANT_SEL3
ANT_SEL0ANT_SEL2
ANT_SEL1
WCDMA_900_RTX
WCDMA_2100_RTX
GSM_TX
DCS_PCS_TX
8061
06030603
0603
DCS(1710-1785 MHz)
PCS(1850-1910 MHz)
GSM900(880-915MHz)GSM850(824-849MHz)
7dB
11dB
2mm
TP1
TP3
TP2
4. TROUBLE SHOOTING
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LGE Internal Use Only
Check TCXO Block Refer to 1.3
Check TP1If GSM over 31 dBm?
If DCS/PCS over �8 dBm?GSM/DCS/PCS Tx is OK
Check other part
Yes
No
Change the board
Check TP�, 3If GSM(TP�) under 6 dBm?
If DCS/PCS(TP3) over 6 dBm?Check ANT SW Block (ASM+EDGR PAM)
Refer to 1.4
Yes
No
Check RTR & PAD Check soldering and componentsNo Problem
Still exist Problem
START
No
4. TROUBLE SHOOTING
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LGE Internal Use Only
4.6.4 Checking RF Rx Block
TP1
TP2
4. TROUBLE SHOOTING
- 97 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Schematic of GSM/DCS/PCS Rx Block
TP1TP2
DNIL1011
33pC1039
DNIL1008
33pC1037
DNIL1005
33p
C1015
33p
C1007
DNIL1002
881.5MHz,942.5MHz
FL1000
103
52
81
9
6
74IN_881_5 OUT_881_5_1
OUT_881_5_2
OUT_942_5_1
IN_942_5 OUT_942_5_2
GND1 GND3
GND2 GND4
SW1000
42131
G A C
2G
12nL1013
2.2p
C1003
2.2p
C1010
22nL1009
C1021
4.7p
L1000
100n
L100718n
C1016
4.7p
5.6n
C1033
C1052
6.8n
5.6n
C1038
C1040
6.8n
C1001
2.7n
1842.5MHz,1960MHz
FL1001
103
52
81
9
6
74IN_1842_5 OUT_1842_5_1
OUT_1842_5_2
OUT_1960_1
IN_1960 OUT_1960_2
GND1 GND3
GND2 GND4
18nL10040.5p
L1001
DNIL1012
0.5pL1010
82nL1006
L100382n
U1001
313029
44434241
403938
736353
1615
4131211101
343332
17
9
188 197 206 215 224
32
3
42
2
52627282
1DCS_PCS_IN
11D
NG
01D
NG
9D
NG
8D
NG
GND1
7D
NG
GSM_IN
6D
NG
VAPCGND5VBATTGND4BS2GND3BS1GND2_TXEN
ANT
ED
OM
WCDMA3
PGND4PGND5PGND6 P
MET
4X
R3
XR
2X
R1
XR
WCDMA1WCDMA2
7D
NG
P8
DN
GP
9D
NG
P PGND10PGND11PGND12
PGND13PGND14PGND15PGND16
PGND1PGND2PGND3
GND
RX_PCS_P
RX_DCS_P
RX_GSM_900_P
RX_GSM_850_P
WCDMA_900_RTXRX_GSM_850_M
RX_GSM_900_M
RX_DCS_M
RX_PCS_M
WCDMA_2100_RTX
GSM(869-894 MHz)
GSM(925-960 MHz)
PCS(1930-1990 MHz)
DCS(1805-1880 MHz)
TP1TP2
4. TROUBLE SHOOTING
- 98 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Set the phone Rx is On
Check TP1 Signal exist? Check RF Switch (M/S)No
Yes
Change the board
Check TP� Signal exist? Check FEM Block Refer 1.4No
Yes
4. TROUBLE SHOOTING
- 99 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4.7 GPS/WIFI/BT RF Component
RF Components(GPS)
Reference Description
ANT1003 ANTENNA PAD
connected to Carrier type antenna
ANT1002 GND PAD
FL1006 GPS SAW FILTER
U1003 GPS LNA
ANT1002
ANT1003
FL1006
U1003
4. TROUBLE SHOOTING
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LGE Internal Use Only
RF component (WiFi / BT )
Reference Description
ANT200 ANTENNA PAD
connected to Carrier type antenna
ANT201 GND PAD
FL200 WiFi / BT Filter
U200 SP3T + LNA for WiFi / BT
U500 WiFi / BT chip
ANT201
ANT200
U201
FL200
U200
4. TROUBLE SHOOTING
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LGE Internal Use Only
4.8 GPS/WIFI/BT SIGNAL PATH
GPS Signal PATH (main board bottom)
GPS Rx PATH
4. TROUBLE SHOOTING
- 10� - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
WiFi / BT Signal PATH
WiFi / BT Tx and Rx PATH
BT Tx
WiFi Tx
4. TROUBLE SHOOTING
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LGE Internal Use Only
4.9 GPS/WIFI/BT Trouble shooting
4.9.1 A-GPS Block
Schematic of the A-GPS block
TP2
TP1
TP1
TP2
Set the phone GPS is ON
Check TP1 About �.7V? Check power LRC filter solderingNo
Yes
Change the board
Check TP� About �.6V? Check SW and NV itemNo
Yes
8.2n
L1038
C1101 100p
5.6n
L1027ANT1002
VREG_RF_2.7V
C1096
100p
ANT1003
100nL1030
C109918p
U1003
3
2
5
4
1NI_F
R
FIL_OUT
VDD
S_D
GND
L1034
3.3nL10286.8n
R1020
1K
L1029DNI
12
R1019
1575.42 MHz
FL100652
41
3G3
IN OUTG1 G2
C11000.1u
GPS_MODE GPS_IN
Near To LNA
0603
0603
TP1
TP2
4. TROUBLE SHOOTING
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LGE Internal Use Only
4.9.2 WLAN/BT/FM Block
Checking Flow
1
2
3
4
START
Component Change
1. Check the Power
�. Check the Clock
3. Check the SP3T+LNA
4. Check the WiFi/BT chip
4. TROUBLE SHOOTING
- 105 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Main chip part
[Figure] Schematic of WiFi/BT/FM
R200 15K
FB200 600
FB202 600
600FB201
10pC224
3.3uL208
u7.4302
C
U2014
H9
D5
D6
E9
A8
D8
B3
C6
B2
E2
D2
C2
A
1G
3F2F1F2H
1H
4E
5E
21P
11P
8P
11F31
G01
G01 F21
D21
E01J21
K31L01
K11
D01
D01
A21
C5
P4
M7J
R1F13F14M5N9L5
P7K11N7K14L4K13N6K9M6L9L2J8H8R4G7R2
L14T2L11R7M9R6L10T7
T1N8P6B11A11P10H9N12M8T12M7R13
P13L8T14G6N13K8N14J9R12
T11M11R11M12P14M14R14M13T13
T10H12R10G12E14R8C14N10D14R9C13T8D13N11G11T9H14P9G14
H3P1E3N1D4N2E8N4B9N5A8
A5M2A4M1A7K4C1K1E1L6K2K5K6J5H6
41B
01E
31E
31H
4P
21F4T1L8
G5
R2
P7L7
K6T5T
3G
2G4F
7C
7E
8C
5C
1A
1D
9C
5B
3A
6D
01M
21L11
C6J7
H01
C21
A31
AO
CV
DD
V_TB
F TD
DV_T
BF
RD
DV_T
B1
OD
DV_T
B2
OD
DV_ T
BF I
DD
V_TB
1C
DD
V_TB
2C
DD
V_TB
2P1_
OC
VD
DV_F
RW
2P1_
XTD
DV_F
RW
2P1_
XR
DD
V_FR
W2
P1_P
CDF
PD
DV_ F
RW
3P3_
GA
PD
DV_F
RW
3P3_
AA
PD
DV_F
RW
2P1_
O LD
DV_F
RW
2P1_
DD
DV_F
RW
2P1_
BA
CD
DV_F
RW
2P1_
AD
DV_F
RW
2 _2P1 _
DD
V _LLP
BB _F
RW
CD
AX
R_D
DV
A_EF
A_FR
WX
UA_
DD
VA_
EFA_F
RW
1_D
S_OI
DD
V2_
DS_
OID
DV
1_FR_
OID
DV
2_FR_
OID
DV
1OI
DD
V2
OID
DV
1D
DV
2D
DV
3D
DV
LAT
X_D
DV
52D
DV_
PTO
DD
VA
NA_
MFO
CV
DD
V_MF
LLP
DD
V_MF
XR
DD
V_MF
RF_SW_CTRL_N_0RF_SW_CTRL_P_0RF_SW_CTRL_N_1RF_SW_CTRL_P_1RF_SW_CTRL_N_3RF_SW_CTRL_P_3
WRF_RFOUTP_G AMODE_TX_PUWRF_RFOUTP_A GMODE_TX_PUWRF_RFINP_G1 AMODE_EXT_LNA_GAINWRF_RFINP_A1 GMODE_EXT_LNA_GAINWRF_RFINN_A1_XFMRWRF_RFINN_G1_XFMR WL_GPIO_0WRF_RES_EXT WL_GPIO_1WRF_EXTREFIN WL_GPIO_2WRF_EXTCOUPLE_AIN WL_GPIO_3WRF_AFE_TSSI_G WL_GPIO_8WRF_AFE_TSSI_A
FM_TXADCIN2VREF_LDO FM_TXADCIN1VOUT_LNLDO1 FM_TXADCVCMVOUT_LDO2 FM_TXPVOUT_CLDO FM_TXNVDD_LNLDO1 FM_RXPVDD_LNLDO2 FM_RXNVDD_CLDO FM_CVAR
FM_ADOUT2SR_PALDO_1 FM_ADOUT1SR_PALDO_2SR_VDDNLDO BT_UART_TXDSR_VLX1_1 BT_UART_RXDSR_VLX1_2 BT_UART_RTS_NSR_VDDBAT3_1 BT_UART_CTS_NSR_VDDBAT3_2SR_VDDBAT2 BT_TM0SR_VDDBAT1_1 BT_TM1SR_VDDBAT1_2 BT_TM3SR_VSSPLDO BT_TM6SR_PVSS_1SR_PVSS_2 BT_SDASR_AVDD2P5 BT_SCLSR_TESTSWG BT_RST_NSR_PNPO BT_RFOP
BT_RFONSDIO_CMD BT_REG_ONSDIO_DATA_0SDIO_DATA_1 BT_PCM_SYNCSDIO_DATA_2 BT_PCM_OUTSDIO_DATA_3 BT_PCM_INSDIO_CLK BT_PCM_CLK
UART_TX_0 BT_GPIO_0UART_RX_0 BT_GPIO_1
BT_GPIO_2TMS BT_GPIO_3TDO BT_GPIO_4TDI BT_GPIO_5TCK BT_GPIO_6TAP_SEL_0 BT_GPIO_7TAP_SEL_1JTAG_TRST_L WL_REG_ON
WL_RST_NOSCIN
OSCOUTXTAL_PU1
SS
V2
SS
V3
SS
VO
CV
SS
V_TB
FR
SS
V_TB
FIS
SV_ T
BP FI
SS
V_ TB
1C
SS
V_ TB
2C
SS
V_TB
1TU
O _X
EO
C_TB
0 TU
O _X
EO
C_ TB
OC
VS
SV_
M FX
RS
SV_
MFL L
PS
SV_
MFFL
DN
GB_
M FS
SV
AN
A_MF
LAT
X_S
SV
ODL_
SS
VA
SS
VA
P _R
SS
SV
A _R
S
2TU
O_OI
PG_ F
RW
1 TU
O_OI
PG_F
RW
PO_T
SET_
EFA_F
RW
NO _T
SE T_
E FA_ F
RW
PI _TS
E T_E F
A_ FR
WNI_T
SET_
EFA_F
RW
FE
RV_
CD
AQI_
EFA_F
RW
CD
AX
R_S
SV
A_EF
A_FR
W
1_3P3_
AA
PD
NG_F
RW
2_3P3_
AA
PD
NG_F
RW
3_3P3_
GA
PD
NG_F
RW
4_3P3_
GA
PD
NG_F
RW
2P1_
XR
DN
G_FR
W2_2
P1_XT
DN
G_FR
W2
P1_D
DN
G_FR
W2
P1_A
DN
G_FR
W2
P1_B
AC
DN
G_FR
W2
P1_O
CV
DN
G_FR
W2
P1_OL
DN
G_FR
W2
P1_P
CDF
PD
NG_F
RW
2P1_
DN
G_LLP
BB_F
RW
u7.4922
C
DNI
C221
u7.4032
C
402C
n022
V6.2_P
MS
M_G
ER
V
C244 10p
15pC245
4.7uC235
10pC223
C239 220n
C232 3.3n
VREG_MSMP_2.6V
VDD_RADIO_PLL
VDD_BT
VDD_PLL
VDD_AFE
C234 0.1u
C231
u01
822C
u1
C226 5p
902C
u1.0
802C
u1.0
702C
u1.0
602C
u1.0
502C
n 01
3 12C
u 1.0
012C
u1
VDD_BT
C238
22p
C243 1u
002C
u1.0
202C
u1.0
C236
47p
102C
u1.0
C242 220n
L206
47n
C233 1n
C237
47p
L207100n
C211
0.1u
212C
p2.8
412C
u1.0
VDD_RADIO_PLL
VDD_CORE
VDD3.3V
+VPWR
VDD_2.5V
C241
u1.0u7.4042
C
VDD_FM
LLP_
DD
VLL
P_OI
DA
R_D
DV
ER
OC_
DD
V
EFA _
DD
V
V3 .3D
DV
ER
OC_
DD
V
VDD_XTAL
LAT
X_D
DV
V5.2_D
DV
MF_D
DV
600FB203
R201
0
006
402BF
V6
.2
_PM
SM_
GER
V
V6
.2_
PMS
M_G
ERV
SLEEP_CLK
WLAN_SDIO[0]WLAN_SDIO[1]WLAN_SDIO[2]WLAN_SDIO[3]
BT_RESET_N
WLAN_CMD
WLAN_CLK
BT_PCM_DINBT_PCM_DOUT
BT_HOST_WAKEUP
BT_UART_RTSBT_UART_CTS
BT_UART_RXDBT_UART_TXD
BT_PCM_SYNC
BT_PCM_CLK
BT_WAKEUP
WLAN_RESET_N
FM_RFM_L
WLAN_HOST_WAKEUPWLAN_WAKEUP
CLK_REQ
SW_BT_TX
SW_WL_TXSW_WL_BT_RX
EXT_LAN_GAIN
VDD_FM
RX_BG
TX_BT
TX_WLBG
V3.
3DD
VV3.
3DDV
CLK_IN
FM_ANT
1%
0: SDIO / N.C : SPI
TP for TSSI Calibration
ANT200 ANT201
2.2n
L205
15p
L201
C225
0.1u
022C
DNI
V3 .3D
DV
C227 0.1u
U2007
8
9
01 11 21
2
31
1
5 46
3GND2
DD
V
NE_
AN L
TU
O_X
R
TX_IN
DN
GP
GND1
XT_C
XR_
C
TN
A
C_BT
BT
GND3
C222
10p
912C
DNIL209
3n
FL200 2450 MHz
3
2
1IN D
NG
OUT
DNI
C217
100pL202
DNIC218
SW_BT_TX
XT_LW_
WS
XR_T
B_ LW_
WS
NIA
G_N
AL_TX
EG
B_X
R
TX_BTTX_WLBG
4. TROUBLE SHOOTING
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LGE Internal Use Only
Checking Flow
Board change
TP1, 2 is OK?
SDIO OK?UART OK?
Check the power block
WiFi / BT chip check
START
TP1
TP2
START
TP1 1, � is OK? Check the power blockNo
Yes
Board change
SDIO OK? UART OK? WiFi/BT chip check
Yes
No
4. TROUBLE SHOOTING
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LGE Internal Use Only
Main clock part
TP1 TP2
TP1
TP2
C248
1u
38.4MHzKT3225L38400UCW28TA0
X200
3 2
4 1GND1VCC
GND2OUT
302R
K0 01
U2025
3 24 1
VOUTVINGNDSTBY
DN
GP
C246 100p
VDD_TCXO
VDD_TCXOC247
1u
+VPWR
CLK_REQCLK_IN
38.4MHz TCXOLDO for TCXO
TP1 TP2
4. TROUBLE SHOOTING
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LGE Internal Use Only
- Bluetooth RF Test procedure
1. Set phone to Bluetooth test-mode.
- Blue tooth ON: Enter Test Mode(277634#*#) Module test set BT DUT BT DUT ON
2. Insert a phone in a TEMCELL (in case of radiation test)
3. Set ‘discover’ after push menu button of the tester and select the link analyzer.
4. After ‘set test mode’, confirm the connection state.
5. Measure the power of full channel after hopping mode is selected to ‘ON’
6. You can select wanted test cases after getting an optimized power
7. Blue tooth On/Off
- Menu Key settings Wireless controls Bluetooth Turn on/Turn off
4. TROUBLE SHOOTING
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LGE Internal Use Only
4.10 Power ON Troubleshooting
Power On sequence of P350 is :
Power key press TP1 go to low PM7540 Power Up TP3(C525), TP7(C526), TP2(C527), TP4(C542), TP5(C541), TP6(C546) power ON Phone booting and TP9(D501) go to High
START
Battery voltage higher than 3.70V(OCV)?
Change or charging the BatteryNo
Yes
Redownload SW image
TP1 or TP9 hight to low when key pness? Check correctly working powerkey
No
Yes
TP�, TP3, TP4, TP5 TP6, TP7 power up? Change the Main board
No
Yes
is clock OK?TP8: 19.�M/TP10:3�.768kHz Change the Main board
No
Yes
4. TROUBLE SHOOTING
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LGE Internal Use Only
TP1 : KPD_PWR_N go to low
VA801
R814
100K
KB800
PM_ON_SW
END
TP1: KPD_PWR_N go to low
4. TROUBLE SHOOTING
- 111 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
VREG_HPVDD_1.8V
HS_MIC_BIAS
HS_MIC_BIAS_TEMP
1u
C571
4.7uL504
L503 4.7u
4.7uL502
2.2u C535
VREG_LCD_1.8V
C546
1u
L501 4.7u
C528
4.7u
DNI C536
CM315_12_5PF
X50032.768KHz 2
1
0.1uC549
VREG_MSME_1.8V
C5402.2u
VREG_TOUCH_3.0V
VREG_RF_2.7V
E10
F10
C12
M12
K7
N13
M13
G10
D9
H12
C13
A13
A12
G12
G1
M1
D13
E12
N11
A3
A10
A8
H13
G13
A11
K13
E13
B13
A9
N12
J13
A2
M4
N4
M9
N10
M6
N6
M8
N8
J1
K1VSW_5V
VREG_5V
VSW_MSMC1
VREG_MSMC1
VSW_MSMC2
VREG_MSMC2
VSW_MSME
VREG_MSME
VSW_PA
VREG_PA
VREG_GP1
VREG_GP2
VREG_GP3
VREG_GP4
VREF_GP5
VREG_GP6
VREG_MMC
VREG_MSMA
VREG_MSME2
VREG_MSMP
VREG_RFRX1
VREG_RFRX2
VREG_RFTX
VREG_RUIM1
VREG_SYNT
VREG_TCXO
VREG_USB
VREG_WLAN
MIC_BIAS
REF_ISET
REG_GND
REF_BYP
TCXO_IN
TCXO_EN
TCXO_OUT
XTAL_IN
XTAL_OUT
SLEEP_CLK
AMUX_OUT
KPD_PWR_N
PON_RESET_N
PS_HOLD
121KR509
D501
22pC515
VREG_TCXO_2.85V
51R510
1n
C524
2.2uC537
2.2uC539
C521
1n
C5442.2u
VREG_MSMC1_1.25V
R515
200K
1n
C523
VREG_RUIM_3.0V
C526
4.7u
C5472.2u
C5382.2u
VREG_MSMA_2.6V
4.7u
C527
1u
C548
VREG_MSMC2_1.25V
VREG_SMPS_2.1V
C522
1n
1u
C545
10u
C520
VREG_MSMP_2.6V
4.7uC542
22u
C525
C5432.2u
VREG_MMC_3.0V
4.7uC541
C500 22p
VREG_AUX2_2.9V
VREG_MOTION_3.0VVREG_LCD_2.8V
C570
33p
C566
1u
D500
+VPWR
L500
2.2u
+VPWR_AUDIO
10uC530
1nC529
SLEEP_CLK
TCXO_PM_19.2MHZ
PS_HOLD
AMUX_OUT
PMIC_TCXOTCXO_EN
PM_ON_SW
JTAG_PS_HOLD
VSNS_MSME_1.8V
VSNS_MSMC2_1.25V
nPON_RST
VSNS_MSMC1_1.25V
0.5mm
Place crystal and load caps close to PM7540
1%
Local Ground PlanPlace in PM7540 room at shield edge
0.6mm
0.6mm
These CAPs close to inductors
0.6mm
Route together
0.3mm 0.3mm
C308
10n
R310 33
100
R303
19.2MHzKT3225L19200DCW28RA0
X300
42
31VCONT OUT
GND VCC
C301
0.1u
C320 330p
C307 330p
R319
1
C309 330p
C300
1n
VREG_TCXO_2.85V
VREG_MSMA_2.6VC310 0.1u
U301
3
2
4
15
VCC
GND
R311 100K
TCXO_PM_19.2MHZ
TCXO_EN
TCXO_RTR_19.2MHZ
USBH_SYSCLK
RTR_TRK_LO_ADJ
FFA Rev.C(220Ohm@100MHz)
1.0T
TCXO Circuit
Clesed to TCXO
TP2TP7TP3
TP5 TP4
TP10
TP9
TP6
TP8
4. TROUBLE SHOOTING
- 11� - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
TP7
TP2
TP4
TP6
TP8
TP5
TP3
TP9
TP10
4. TROUBLE SHOOTING
- 113 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4.11 Charging Trouble shooting
Charging Procedure
- Connect TA or u-USB Cable- Control the charging current by PM7540 IC- Charging current flows into the battery
Check Point
- Connection of TA or USB Cable- Charging current path(NUS5530MIN)- Battery
Troubleshooting Setup
- Connect TA and battery to the phone
Troubleshooting Procedure
- Check the charger (TA or USB Cable) connector- Check the OVP Circuit- Check the charging current Path- Check the battery
MAX14528
U503
EUSY0374601
96
53
4
82
71IN1 OUT1
IN2 OUT2
IC1
OVLO IC2
DN
G
DN
GP
22p
C561 C562
1u
SC500
1
CN501
11
10
9
5
4
3
2
1
8
7
6
ZD502
VCHG_VBUS
22p
C564
FL500
IN OUT
GND1 GND2
USB_ID
USB_DMUSB_DP
OVPchange circuit at REV B
MicroUSB
2mm
C531100u
C53210n
VCHG_VBUS
VBATT
Q500 NUS5530MN
EQFP0008601
56473829110
DRAIN_B
NC1 COLLECTOR_B
COLLECTOR EMITTER
SOURCE BASE
DRAIN NC2
GATE
1.0
605R
CHG_CTL_N
BATT_FET_N
ISNS_P
+VPWR2mm
1608
Charging IC
10V
2mm1%ISNS_M
TA(5.1V)
MainBattery
Charging Current Flow
4. TROUBLE SHOOTING
- 114 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Check the pin and battery Connect terminals of I/O connector
Connection OK?No
Yes
Is the u- USB Cable)voltage 4.8V (or 5.0V)?
No
Yes
Is it charging properlyAfter turning on TP�
START
Check PMIC SMT status by X-ray Exchange TP1 or Change the
main board and Retest
Change I/O connector
Change TA (or u-USB cable)
ENDYes
No
4. TROUBLE SHOOTING
- 115 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
VREG_HPVDD_1.8V
HS_MIC_BIAS
EUSY0407201
U500
5
3 24 1
VOUTVINGNDSTBY
DN
GP
USB_3.3V
HS_MIC_BIAS_TEMP
1u
C571
C502
1n
+VPWR
4.7uL504
L503 4.7u
4.7uL502
K051
205R
VREG_MSMP_2.6V
2.2u C535
VREG_MSME_1.8V
R504
47K
VREG_LCD_1.8V
C546
1u
C507 DNI
L501 4.7u
C528
4.7u
DNI C536
K1
305R
DNIC508
C516
1u
+VPWR
CM315_12_5PF
X50032.768KHz 2
1
0.1uC549
VREG_MSME_1.8V
10uC519
C5402.2u
VREG_TOUCH_3.0V
VREG_RF_2.7V
M_
SNS
I
U501
EUSY0342201
PM7540
9J
8J
7J
6J
5J
9H
8H
7H
6H
5H
9G
8G
7G
6G
5G
9F
8F
7F
6F
5F
9E
8E
7E
6E
5E
H1
E10F1
F10E1
C12N2
B1
M12B2
K7
A5
N13A4
M13B5
B4
G10A7
D9A6
H12B7
B6
C13
A13D10
A12K10
H10
G12J10
G1
M1K4
D13J4
E12H4
N11M2
A3L2
A10H2
A8
H13K2
G13J2
A11G4
K13F4
E13D5
B13B3
A9M5
N12N3
J13N1
A2M3
K6
M4K5
N4K9
M9K8
N10M11
M6L12
N6A1
M8D4
N8B12
J1D8
K1N5
M72
G
21
D
7D
8B
01
M
6D
9B
21
J
31
F
21
F
21
K
7N
9N
01
B
31
L
11
B
2F
4E
2C
1C
1D
1L
2D
2E
GH
CV
N_LTC_
GH
C
SU
BV_
BS
U
N_LTC_
BS
U
P_S
NSI
M_S
NSI
N_ TEF _T
AB
TA
BV
NIO
CV
PU
KC
AB_
V
AN
A_D
DV
E_1C_
DD
V
AP_ 2
C_D
DV
2P
G_D
DV
6P
G_D
DV
2E
MS
M_D
DV
PM
SM _
DD
V
1FR_
DD
V
2FR_
DD
V
MIU
R_D
DV
RK
PS _L_
DD
V
RK
PS _
R_D
DV
OX
CT_D
DV
NAL
W_D
DV
MPP_1
MPP_2 VSW_5V
MPP_3 VREG_5V
MPP_4 VSW_MSMC1
MPP_5 VREG_MSMC1
MPP_6 VSW_MSMC2
MPP_7 VREG_MSMC2
MPP_8 VSW_MSME
MPP_9 VREG_MSME
MPP_10 VSW_PA
MPP_11 VREG_PA
MPP_12
MPP_13 VREG_GP1
MPP_14 VREG_GP2
MPP_15 VREG_GP3
MPP_16 VREG_GP4
MPP_17 VREF_GP5
MPP_18 VREG_GP6
MPP_19 VREG_MMC
MPP_20 VREG_MSMA
MPP_21 VREG_MSME2
MPP_22 VREG_MSMP
VREG_RFRX1
USB_ID VREG_RFRX2
USB_D_P VREG_RFTX
USB_D_M VREG_RUIM1
USB_OE_N VREG_SYNT
USB_DAT VREG_TCXO
USB_SE0 VREG_USB
VREG_WLAN
SBST MIC_BIAS
SBCK
SBDT_SSBI REF_ISET
MSM_INT_N REG_GND
REF_BYP
SPKR_IN_L_M
SPKR_IN_L_P TCXO_IN
SPKR_OUT_L_M TCXO_EN
SPKR_OUT_L_P TCXO_OUT
SPKR_IN_R_P
SPKR_IN_R_M XTAL_IN
SPKR_OUT_R_P XTAL_OUT
SPKR_OUT_R_M
SLEEP_CLK
VIDEO_IN AMUX_OUT
VIDEO_OUT
VIB_DRV_N KPD_PWR_N
KPD_DRV_N PON_RESET_N
LCD_DRV_N PS_HOLD
FLSH_DRV_N
1D
NG
2D
NG
3D
NG
4D
NG
5D
NG
6D
NG
7D
NG
8D
NG
9D
NG
01D
NG
11D
NG
21D
NG
31D
NG
41D
NG
51D
NG
61D
NG
71D
NG
81D
NG
91D
NG
02D
NG
12D
NG
22D
NG
32D
NG
42D
NG
52D
NG
121KR509
D501
0.1uC514
1nC517
22pC515
VREG_TCXO_2.85V
C513 0.1u
C512 0.1u
105R10K
0.1u
C534
51R510
1n
C524
2.2uC537
C568
33p
2.2uC539
C521
1n
C5442.2u
VBATT
VREG_MSMC1_1.25V
VCHG_VBUS
R515
200K
1n
C523
VREG_MSMP_2.6V
1nC518
0.1uC511
VREG_RUIM_3.0V
2.2uC509
C526
4.7u
C5472.2u
C5382.2u
0.1uC510
VREG_MSMA_2.6V
4.7u
C527
1u
C548
VREG_MSMC2_1.25V
VREG_SMPS_2.1V
C522
1n
1u
C545
10u
C520
VREG_MSMP_2.6V
4.7uC542
0.1uC506R500
4.7
22u
C525
C5432.2u
VREG_MMC_3.0V
TP502
0.1uC505
4.7uC541
0.1uC504
C503 0.1u
C500 22p
C501 0.1u
VREG_AUX2_2.9V
VREG_MOTION_3.0VVREG_LCD_2.8V
C570
33p
C566
1uTP501
035R
K00 3
R505
1K
D500
+VPWR
L500
2.2u
+VPWR_AUDIO
10uC530
1nC529
USIM_CLK
USIM_DATA
KEY_LED_DRV_N
SLEEP_CLK
REMOTE_PWR_ON
TCXO_PM_19.2MHZ
PS_HOLD
PM_INT_N
GSM_PA_DAC_REF
AMUX_OUT
PMIC_TCXOTCXO_EN
PMIC_SSBI
PM_ON_SW
JTAG_PS_HOLD
PU_
KC
AB
V
USB_LDO_EN
USB_LDO_EN
PCB_REVISION
PCB_REVISION
N_LTC_
GH
C
N_TEF_TT
AB
P_S
NSI
VBAT_TEMP
VSNS_MSME_1.8V
VSNS_MSMC2_1.25V
nPON_RST
VSNS_MSMC1_1.25V
VBAT_SENSE
USIM_RST
MSM_USIM_CLK
MSM_USIM_RST
MSM_USIM_DATA
RW
PV+
1.30V
close to MSM
USB 3.3V LDO
150K
150K
150K
ADC
150K
TEST&E
150K
0.5mm
R2
2.13V
10K
68K
47K
150K
150K
Place crystal and load caps close to PM7540
REV
1.93V
C&H
B&G
1%
Local Ground Plan
PM7540
Place in PM7540 room at shield edge
A&F
Rev.1.1
150K
150K
PCB Revision Check ADC
Route together
0.16V
Rev.1.0
D&I
0.6mm
Rev.1.2 680K
0.81V
0.6mm
These CAPs close to inductors100K
1.73V
0.62V
300K
R1
0.6mm
1.04V
430K
Route together
Place close to PM7540 pinsPMIC
1608
close to each other
mm5.
0 9
N
,7N
0.3mm 0.3mm
C531100u
C53210n
VCHG_VBUS
VBATT
Q500 NUS5530MN
EQFP0008601
56473829110
DRAIN_B
NC1 COLLECTOR_B
COLLECTOR EMITTER
SOURCE BASE
DRAIN NC2
GATE
1.0
605R
CHG_CTL_N
BATT_FET_N
ISNS_P
+VPWR2mm
1608
Charging IC
10V
2mm1%ISNS_M
MAX14528
U503
EUSY0374601
96
53
4
82
71IN1 OUT1
IN2 OUT2
IC1
OVLO IC2
DN
G
DN
GP
22p
C561 C562
1u
SC500
1
CN501
11
10
9
5
4
3
2
1
8
7
6
ZD502
VCHG_VBUS
22p
C564
FL500
IN OUT
GND1 GND2
USB_ID
USB_DMUSB_DP
OVPchange circuit at REV B
MicroUSB
2mm
TP1
TP2
TP3
TP4
4. TROUBLE SHOOTING
- 116 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
TP2 TP1 TP3 TP4
4. TROUBLE SHOOTING
- 117 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4.12 3M FF Camera trouble
3M camera control signals are generated by MSM7227.
Check the camera Conn. and reconnect the camera
Camera is OK?
No
Change the Main board
ENDYes
Check IOVDD(TP5), DVDD(TP6), AVDD(TP7)
START
Yes
Check the EMI Filter(FL601, FL60�)
Camera is OK
No
No
Yes
MSM 7��7 output signal checkMCLK(TP1), PCLK(TP�),
Reset(TP3), Standby(TP4)
Change the camera
YesEND
Change the Filter(FL601, FL60�)
No
No
Yes
4. TROUBLE SHOOTING
- 118 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
R312
47
7.5p
C321 C322
7.5p
W13
W12
AB12
Y12
AC12
AC11
AF10
W9
AE10
U12
AF9
AC20
AF20
AB21
AE20
AF21
AF22
AC23
AE23
AC21
AF23GPIO_6GPIO_7GPIO_8GPIO_9GPIO_10GPIO_11GPIO_12GPIO_13GPIO_14GPIO_15GPIO_16GPIO_17GPIO_18GPIO_19GPIO_20GPIO_21GPIO_22GPIO_23GPIO_24GPIO_25
CAM_PCLK
CAM_MCLKCAM_VSYNCCAM_HSYNC
AUDIO_I2C_SDA
CAM_DATA[7]CAM_DATA[6]CAM_DATA[5]CAM_DATA[4]CAM_DATA[3]CAM_DATA[2]
PS_HOLDPM_INT_N
MUIC_INT
PA_ON1
MUIC_I2C_SDA
MUIC_I2C_SCL
RC Filter of CAM_MCLK close to MSM
TP1
FL705ICVE10184E070R101FR
7.5pF
0 1 5
6 4
7 3
8 2
9 1INOUT_A1INOUT_B1
INOUT_A2INOUT_B2
INOUT_A3INOUT_B3
INOUT_A4INOUT_B4
1G
2G
FL707 SFEY0011401
7.5pF
015
64
73
82
91INOUT_A1 INOUT_B1
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
1G
2G
7.5pF
ICVE10184E070R101FR FL706
01 5
6 4
7 3
8 2
9 1INOUT_A1INOUT_B1
INOUT_A2INOUT_B2
INOUT_A3INOUT_B3
INOUT_A4INOUT_B4
1G
2G
CAM_PCLK
CAM_VSYNCCAM_HSYNC
CAM_DATA[7]CAM_DATA[6]CAM_DATA[5]CAM_DATA[4]
CAM_DATA[3]CAM_DATA[2]CAM_DATA[1]CAM_DATA[0]
CAM_HSYNC_FCAM_VSYNC_F
CAM_DATA[0]_FCAM_DATA[1]_FCAM_DATA[2]_FCAM_DATA[3]_F
CAM_DATA[4]_FCAM_DATA[5]_FCAM_DATA[6]_FCAM_DATA[7]_F
CAM_PCLK_F
MSM7��7
EMI FILTER
4. TROUBLE SHOOTING
- 119 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
TP1
TP2
TP7
TP6
TP3 TP4 TP5
C713
2.2u 4.7u
C714
GB042-24S-H10-E3000CN702
ENBY0034201
1312
1411
1510
169
178
187
196
205
214
223
232
241
1R706
407R
K2.2
507R
K2 .2
CAM_IOVDD_2.6V
C715
DNI
C712
2.2u
307AV
407AV
107AV
207AV
FB700
120
CAM_AVDD_2.7V
CAM_IOVDD_2.6V
CAM_DVDD_1.8V
CAM_MCLK
CAM_PWDN
CAM_RESET_N
CAM_I2C_SDA
CAM_I2C_SCL
CAM_HSYNC_F
CAM_VSYNC_F
CAM_DATA[0]_F
CAM_DATA[1]_F
CAM_DATA[2]_F
CAM_DATA[3]_F
CAM_DATA[4]_F
CAM_DATA[5]_F
CAM_DATA[6]_F
CAM_DATA[7]_F
CAM_PCLK_FTP2
TP6TP7
TP3TP4
TP5
4. TROUBLE SHOOTING
- 1�0 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4.13 Audio Trouble
4.13.1. Receiver. path
Voice Receiver path as below:
MSM7227 RCV_N / RCV_P TP1(R607), TP2(R608) U600 (Audio Subsystem) TP3( FB601), TP4(FB602) SPK/RCV Pad.
Change the Receiver
The Sine wave appear at TP1(R607) and TP�(R608)?
No
Yes
The Sine wave appear atTP3(FB601), TP4(FB60�)?
START
END
Re-solder at TP1 and TP� or Change the Main board
No
Yes
Connect the phone to networkEquipment and setup call
Setup 1KHz tone out
Change the U600
Hear the tone to the receiver?
END
Yes
4. TROUBLE SHOOTING
- 1�1 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
TP3, TP4
TP1, TP2
026
Cu2
.2
U6003
D
1C
2E
2A
C2
B2
B4
A4
B3
E1
A3
D1
A1
C3
B1
E4
E3C4
4D
2D
DD
VP
H
DD
VP
S
IN3- OUT+
OUT-
HPL
IN3+
HPR
CP
IN1+
CN
IN1-
IN2+
IN2-
SDA
SCL
SAI
B
DD
VP
C
SS
VP
C
DN
G
C636
0.1u 0.1u
C605
u2.2
12
6C
2.2uC614
u2.2
22
6C
10u
C604
+VPWR_AUDIO
C603
2.2u
VREG_HPVDD_1.8V
33nC613
R610 K7.4
R609 K7.4
VREG_MSMP_2.6V
33nC612
FB601 600
FB602 600
C608
1n470nC611C610 470n
10R608
C609
1n
10R607RCV_NRCV_P
HPH_RHPH_L
AUDIO_I2C_SCLAUDIO_I2C_SDA
SPK_RCV-SPK_RCV+
EAR_LEAR_RLINE_ON
LINE_OP
+VPWR_AUDIO
Audio SUB SYSTEM
TP1,2 TP3,4
4. TROUBLE SHOOTING
- 1�� - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4.13.2. Headset path (Voice & Multimedia play) Voice path & Multimedia play for headset as below:
MSM7227 HPH_R, HPH_L TP1(C610),TP2( C611) U600(audio subsystem) TP3(FB603), TP4(FB604)
J600(Earjack connector)
’
The signal appears atTP3(FB603) and TP4(FB604)?
No
Yes
Can you hear the toneor sound?
START
END
Re-solder at TP3 and TP4or Change U600
No
Yes
Connect the phone to networkEquipment and setup call
Setup 1KHz tone out and insert headset.
Or play multimedia contents and insert headset.
Check the 3.5pi Earjack
The signal appears at TP1(C610),TP�(C611)?
Change the Main B’d
Yes
No
4. TROUBLE SHOOTING
- 1�3 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
026
Cu2
.2
U6003
D
1C
2E
2A
C2
B2
B4
A4
B3
E1
A3
D1
A1
C3
B1
E4
E3C4
4D
2D
DD
VP
H
DD
VP
S
IN3- OUT+
OUT-
HPL
IN3+
HPR
CP
IN1+
CN
IN1-
IN2+
IN2-
SDA
SCL
SAI
B
DD
VP
C
SS
VP
C
DN
G
C636
0.1u 0.1u
C605
u2.2
12
6C
2.2uC614
u2.2
22
6C
10u
C604
+VPWR_AUDIO
C603
2.2u
VREG_HPVDD_1.8V
33nC613
R610 K7.4
R609 K7.4
VREG_MSMP_2.6V
33nC612
FB601 600
FB602 600
C608
1n470nC611C610 470n
10R608
C609
1n
10R607RCV_NRCV_P
HPH_RHPH_L
AUDIO_I2C_SCLAUDIO_I2C_SDA
SPK_RCV-SPK_RCV+
EAR_LEAR_RLINE_ON
LINE_OP
+VPWR_AUDIO
Audio SUB SYSTEM
TP1,2
TP602
R630
47
HS_MIC_BIAS_TEMPR628
DNI
C637
DNI
506R
K2.2
R629 47K
HS_MIC_BIAS
1800FB606
C617
33p
2.2u
C606
1800FB603
C607
33p
C615
47p 1n
C618
SC600
1
216R
K01
J600
2
3
4
5
6
1 M5
M4
M3
M4F
M1
M6
116R
K01
FB605 1800
Q600
D
G
S
0 06D
206D
306D
C616
47p
106D
406R
M1
C619
22p
406D
270n
L600
VREG_MSMP_2.6V
1800FB604
306R
K1
606R
K001
EAR_SENSE
EAR_L
EAR_R
EARMIC_P
HOOK_ADC
FM_ANT
3.5pi EAR JACK
HIGH
LOW(DEFAULT)
STATE
UNMATING
EAR_SENSE
MATING
ENJE0008001
TP3
TP4
4. TROUBLE SHOOTING
- 1�4 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
J600
TP3, TP4
TP1, TP2
4. TROUBLE SHOOTING
- 1�5 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4.13.3. Loud speaker path (voice speaker phone & multimedia play)
Loud speaker path as below:
MSM7227 LINE_OP, ON TP1( C612),TP2( C613) U600(Audio subsystem) TP3(FB601), TP4(FB602)
SPK/RCV Pad.
Change the Receiver
The Sine wave appear at TP1(C61�) and TP�(C613)?
No
Yes
The Sine wave appear atTP3(FB601), TP4(FB60�)?
START
END
Re-solder at TP1 and TP� or Change the Main board
No
Yes
Connect the phone to networkEquipment and setup call
Setup 1KHz tone out
Change the U600
Hear the tone to the receiver?
END
Yes
4. TROUBLE SHOOTING
- 1�6 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
TP1, TP2
TP3, TP4
026
Cu2
.2
U6003
D
1C
2E
2A
C2
B2
B4
A4
B3
E1
A3
D1
A1
C3
B1
E4
E3C4
4D
2D
DD
VP
H
DD
VP
S
IN3- OUT+
OUT-
HPL
IN3+
HPR
CP
IN1+
CN
IN1-
IN2+
IN2-
SDA
SCL
SAI
B
DD
VP
C
SS
VP
C
DN
G
C636
0.1u 0.1u
C605
u2.2
12
6C
2.2uC614
u2.2
22
6C
10u
C604
+VPWR_AUDIO
C603
2.2u
VREG_HPVDD_1.8V
33nC613
R610 K7.4
R609 K7.4
VREG_MSMP_2.6V
33nC612
FB601 600
FB602 600
C608
1n470nC611C610 470n
10R608
C609
1n
10R607RCV_NRCV_P
HPH_RHPH_L
AUDIO_I2C_SCLAUDIO_I2C_SDA
SPK_RCV-SPK_RCV+
EAR_LEAR_RLINE_ON
LINE_OP
+VPWR_AUDIO
Audio SUB SYSTEM
TP1,2
TP3,4
4. TROUBLE SHOOTING
- 1�7 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4.13.4. Microphone for Main MIC
Main Microphone path as below:
MIC TP1(FB600) TP2(C315) MSM7227
’
’Make some sound to MIC
The signal appear atTP1(FB600)?
No
Yes
The signal appear atTP�(C315)?
START
END
Re-solder at TP1 or Change the Main MIC
No
Yes
Change the Main B’d
MICBIAS(C305) is 1.8V?
Yes
Make a Call
NoChange the Main B’d
4. TROUBLE SHOOTING
- 1�8 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
206R
IND
MIC600
4
3
2
1P
G1
G2
O
C601
1800FB600MIC_1P
MIC_1NMIC_BIAS
MIC
TP1
D301
113C
Fu1
u1.0413
C
u1 .051 3
C
u1.0713
C
u1 .061 3
C
K2.2
70 3R
Fu1313
C
u1.0813
C
u 1. 02 13
C
8F
8E
7F
7E
7C
7B
6C
5C
6B
5B
PI_R_E
NIL
NI_
R_ENI
LPI
_L_EN
IL
NI_L_EN
IL
P1CIM
N1CIM
P2CIM
N2CIM
PIXU
ANIX
UA
P1_CI
M
R_MF
L_MF
N1 _CI
M
GND|MIC_1N
P_CI
MR
AE
(MIC_1N)
TP2
4. TROUBLE SHOOTING
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LGE Internal Use Only
TP1
MIC60
TP2
4. TROUBLE SHOOTING
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LGE Internal Use Only
4.13.5. Microphone for headset
MIC for Headset path as below:
Insert Headset Interrupt which are the signal of Headset detecting arise in EAR_SENSE
HS_MIC_BIAS:1.2~1.4V (MICBIAS) MIC signal TP1(FB605) TP2( C317) MSM7227
’
’
Make some sound to MIC
The signal appear atTP1(FB600)?
No
Yes
The signal appear atTP�(C317)?
START
END
Re-solder at TP1 or Check the J600
No
Yes
MICBIAS(C606) is 1.�~1.4V?
Yes
Insert Headset & Make a Call
NoCheck the Q600 or Change the Main B’d
Check the TP� or Change the Main B’d
4. TROUBLE SHOOTING
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LGE Internal Use Only
Q600
TP1
TP2
4. TROUBLE SHOOTING
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LGE Internal Use Only
Press END key to tun the power On
Is the circuit powered?
Yes
END
Follow the Power ON trouble shooting
No
LCD display OK?
START
No
Check Power VREG_LCD_1.8V(TP1)VREG_LCD_�.8V(TP�)
No
Change the Main board
Disconnect and reconnect LCD connector
Change the LCD module
The LCD works
Yes
Yes
Yes
4.14 Main LCD trouble
Main LCD control signals are generated by MSM7��7.Those signal’s path are : MSM7��7 -> LCD Module
4. TROUBLE SHOOTING
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LGE Internal Use Only
.
TP1
TP2
TP1(LCD_2.8V)
TP2(LCD_1.8V)
VREG_LCD_1.8V
FL702
15pF 015
64
73
82
91INOUT_A1 INOUT_B1
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
1G
2G
U701 EUSY0391601
NLSV1T244MUTBG
43
52
61VCCA VCCB
A B
GND OE_
15pF
FL701
015
64
73
82
91INOUT_A1 INOUT_B1
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
1G
2G
15pF
ICVE10184E150R101FRFL704
015
64
73
82
91INOUT_A1 INOUT_B1
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
1G
2G
C705
2.2u
FL703 SFEY0010501
15pF 015
64
73
82
91INOUT_A1 INOUT_B1
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
1G
2G
GB042-40S-H10-E3000ENBY0036001
CN700
2120
2219
2318
2417
2516
2615
2714
2813
2912
3011
3110
329
338
347
356
365
374
383
392
401
VREG_LCD_1.8V
FL700
15pF 015
64
73
82
91INOUT_A1 INOUT_B1
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
1G
2G
VA700
VREG_LCD_2.8V
1uC710
1u
C700
R702
100
VREG_MSMP_2.6VVREG_LCD_1.8V
017R
K001
LCD_RESET_N
EBI2_DATA[0]EBI2_DATA[1]
EBI2_DATA[10]EBI2_DATA[11]
EBI2_DATA[12]EBI2_DATA[13]EBI2_DATA[14]EBI2_DATA[15]
EBI2_DATA[2]EBI2_DATA[3]
EBI2_DATA[4]EBI2_DATA[5]EBI2_DATA[6]EBI2_DATA[7]
EBI2_DATA[8]EBI2_DATA[9]
nNAND_OE
nNAND_WE
WLED_PWR
MLED[2]MLED[3]
MLED[1]
MLED[4]MLED[5]
LCD_RSLCD_CS
LCD_VSYNC_OLCD_VSYNC_LS
LCD_VSYNC_LS
LCD_MAKERID_HIGH
LCD Filter(EMI 100 ohm, 15pF)
Maker IF Maker ID
TOVIS H H
TP1
TP2
4. TROUBLE SHOOTING
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LGE Internal Use Only
4.15 Motion Sensor on/off trouble
Motion Sensor is worked as below :
Accelerometer Sensor function On Tilt the phone (90˚) The screen is had rotated automatically.
Measurement
VREG_MOTION_3.0V(TP1)
MOTION_INT(TP2)
MOTION_I2C_SDA(TP3)
MOTION_I2C_ SCL(TP4)
Tilt the phone
The screen is ratated
No
TP1 checkNo
Yes
TP3, TP4 check
START
END
Change the PMIC
No
Yes
Accelerometer Sensor function On
Change the Motion senser U603
Yes
TP� checkNo
Change the Main Board
Yes
Work well?No
Change the Main Board
Yes
4. TROUBLE SHOOTING
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LGE Internal Use Only
TP2 (TP600)
TP3
TP1
TP4
TP2
TP4
TP3
TP1
C639
10u
TP600
R619 K2.2
R620 K2.2
C624
10u
VREG_MOTION_3.0V
U6036 1
7 6
5
4
8
3
9
2
10
1
11
12
13
41 512
DE
VR
ES
ER
DD
V
GND3
GND2
INT1
VDD_IO
RESERVED1
NC1
INT2
NC2
SC
SCL_SPC
GND1
OD
S_ID
S_A
DS
0A
S _O
DS
4D
NG
C623
0.1u
VREG_MSMP_2.6V
C638
0.1u
MOTION_I2C_SDA
MOTION_I2C_SCLMOTION_INT
TP1
TP2TP4
TP3
4. TROUBLE SHOOTING
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LGE Internal Use Only
4.16 Compass Sensor on/off trouble
Compass Sensor is worked as below :
Compass Sensor function On
Measurement
VREG_MOTION_3.0V(TP1)
COMPASS_DRDY(TP2)
PROX_COMPASS_I2C_SCL(TP3)
PROX_COMPASS_I2C_SDA(TP4)
Change the position of the phone
The direction is correct?
No
TP1 checkNo
Yes
TP3, TP4 check
START
END
Change the PMIC
No
Yes
Compass Sensor function On
Change the Motion senser U604
Yes
TP� checkNo
Change the Main Board
Yes
Work well?No
Change the Main Board
Yes
4. TROUBLE SHOOTING
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LGE Internal Use Only
TP1
TP2 (TP601)
TP1
TP2 TP4
TP3
TP4 TP3
U604
12
11
10
9
5
4
6
37
28
1D
DV
D
GE
RV
AD
NG
SD
NG
DD
VA
ADDR
SCL
NC1
TN
I
VPP
DRDY
SDA
C627
10n
VREG_MOTION_3.0V
TP601
R617
2.2K
VREG_MSMP_2.6V
C628
470n
R618
2.2K
COMPASS_DRDYCOMPASS_I2C_SDA
COMPASS_I2C_SCL
TP1
TP3
TP4TP2
4. TROUBLE SHOOTING
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LGE Internal Use Only
4.17 Q coin Motor
Q coin Motor is worked as below :
touch touch-window Vibration feedback
U601 : Used the PWM pulse
Measurement
VREG_MOTOR_3.3V(TP1)
MOTOR_P(TP2) / MOTOR_N(TP3)
LIN_PWM_FREQ(TP4)
TP1, TP� is OK?Yes
No
TP3 is 3.3V?TP4 is working?
START
Check SW
Change the Q coin Motor
Yes
No
Reboot
Check an U60� SMT status by X-ray, Exchange it
Work well?Yes
No
END
Measurement
VREG_MOTOR_3.3V(TP1)
MOTOR_P(TP�) / MOTOR_N(TP3)
LIN_PWM_FREQ(TP4)
4. TROUBLE SHOOTING
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LGE Internal Use Only
TP1
TP2
TP4
TP3
TP1
TP2
TP4
TP3
R6231K
C634
0.1u
VA604
DNI
Q601
C
B
E100KR627
R613
100KU601
B2C1
A1B1
B3C2
A3C3IN- VDD
IN+ VO+
_SHUTDOWN VO-
BYPASS GND
VREG_MOTOR_3.3V
C633
0.1u
VREG_MOTOR_3.3V
R622
4.7K 51K
R624
R626
1KC635 10n
51K
R625L602
1.2n
VB600
2
1
VA605
DNI
L601
1.2n
LIN_PWM_FREQ
MOTOR_N
MOTOR_NMOTOR_P
MOTOR_P
1%
(Q-Coin)1%
MOTOR
1%
Q-coin MOTOR
1%
1%
1%
TP4
TP1
TP2TP3
5. DOWNLOAD
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LGE Internal Use Only
5. DOWNLOAD
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5. DOWNLOAD
5. DOWNLOAD
LG-P350
LG-P350
5. DOWNLOAD
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LGE Internal Use Only - 165 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
5. DOWNLOAD
LG-P350
LG-P350
LG-P350
5. DOWNLOAD
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LGE Internal Use Only - 166 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
5. DOWNLOAD
LG-P350
LG-P350
5. DOWNLOAD
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LGE Internal Use Only - 167 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
5. DOWNLOAD
LG-P350
LG-P350
LG-P350
5. DOWNLOAD
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LGE Internal Use Only - 168 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
5. DOWNLOAD
LG-P350
5. DOWNLOAD
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LGE Internal Use Only - 169 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
5. DOWNLOAD
5. DOWNLOAD
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LGE Internal Use Only - 170 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
5. DOWNLOAD
5. DOWNLOAD
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LGE Internal Use Only - 171 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
5. DOWNLOAD
5. DOWNLOAD
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LGE Internal Use Only - 172 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
5. DOWNLOAD
5. DOWNLOAD
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LGE Internal Use Only - 173 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
5. DOWNLOAD
5. DOWNLOAD
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LGE Internal Use Only - 174 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
5. DOWNLOAD
LG-P350
LG-P350
LG-P350
LG-P350
LG-P350
LG-P350
LG-P350LG-P350
5. DOWNLOAD
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LGE Internal Use Only - 175 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
5. DOWNLOAD
LG-P350 LG-P350
LG-P350 LG-P350
LG-P350
LG-P350 LG-P350
5. DOWNLOAD
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5. DOWNLOAD
LG-P350 LG-P350
LG-P350
LG-P350
6. BLOCK DIAGRAM
- 153 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
BT_UARTBT PCM
Bluetooth v2.1Wi-Fi 802 11b/g
BT & Wi-Fi
System HW Block Diagram All System
CPUInterfaceCPU Interface
Capacitive Touch(Melpas + ELK)
LCD Backlight IC BL I2C TX IQ, PRX IQ
BT_PCM
FM_L&R
RF I/FPRX_IQ
WLAN_SDIOLINE_L& R
BCM43291
Wi-Fi 802.11b/gFM Radio
FM
Tx ModuleGSM & WCDMA
TOUCH I2C2.8" QVGA 240*320 TOUCH INT
TCXO_38.4MHz
FM_L&RF_CLK_IN
CLK_REQ
Transceiver(RTR6285)
Transceiver(RTR6285)
LCD Backlight ICAAT2862
BL_I2C
DDR SDRAM(2G)NAND FRESH (4G)
EBI1 (DDR)
_ Q, _ QRF I/F
GPS
Tx Module(SKY77544)DRX_IQ DRX_IQ
GPIO59
GPS
MCP(Hynix)
SBDT
TCXO
NAND FRESH (4G)
CAM I/F
CAM_I2C
MSM7227EBI2 (NAND)
CAM 3M
MCP(Hynix)Q-Motor
(WHVM-1030Q10)Q-Motor
(WHVM-1030Q10)GPIO_28
LIN_PWM_FREQH8BCS0UN0MCR-4EM
MIC MIC
Speaker & R i
TCXO_19.2MHz(Kyocera)
RTR_TRK_LO_ADJ TCXO_RTR_19.2MHzTCXO_PM_19.2MHz
MOTION_I2CMOTION Sensor(KR3DH) MOTION INT
LINE_ON&OP
EAR1_OP&ON
HPH_L&R
LINE_OP, LINE_ON
RCV_P & N
HPH_R, HPH_LSPK_RCVP, N
Receiver
3.5 piEarjack
EAR_L, RCOMPASS_I2CDigital Compass
(AMI304) COMPASS_INTAudio Sub
WM9093ECS-RGPIO_27 AUDIO_I2C
TCXO IN
MMC SIM
USIM KPD_PWR_N
MOTION_INT
USIMUSIM I/F
GPIO106 SBDT_SSBIPMIC_SSBI
AMUX_OUTHKAIN2 AMUX_OUT
AMUX_OUTPM_INT_N MSM_INT_NGPIO24
PWR/End Key
Vol. up
Send Key
Vol. Down USIM
Key COL, Key ROW
_
Key LED
MUIC_I2C
USBPHYUART3
I2C
UART3MPP3,4
PM7540KPD_DRV_N
PON_RESET_N
PS_HOLDGPIO25RESIN_N
JTAG
PS_HOLD
MUIC(TS5USBA)in
_USB
nnec
tor Backlight_Key
USBH DM & DPArray TP
REMOTE_PWR_ON nJTAG_RESOUTJTAG_PS_HOLD
JTAG CONN.JTAG(TCK,TDI,TDO…)UART3_TX/RX
5pi
Co
6.Block diagram
6. BLOCK DIAGRAM
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LGE Internal Use Only
P350 RF Block Diagram RF
6. BLOCK DIAGRAM
- 155 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
6. BLOCK DIAGRAM
- 156 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
FM R
LG-P350 WiFi/BT/FM Interface
3.5Ear-Jack
FM_ANT
WLAN_HOST_WAKEUP
FM_R
FM_LFM_ADOUT2
FM_ADOUT1FM_RX
WL_GPIO_0
LINE_R_IP
LINE_L_IP
GPIO94
Ear-
jack
WLAN WAKEUP
WLAN_CMD
WLAN_CLK
WLAN_RESET_N
SDIO_CMD
SDIO_CLKGPIO62
TX_WLBGGPIO63
BT_RFOP
WL_GPIO_1WLAN_WAKEUP
GPIO122
DEA162450BT
TX_WLBG
TX_BT
RX BG
WLAN_SDIO [3:0]
BT_UART_RXD
BT_UART_TXDBT_UART_RXD
BT UART TXD
WL_RST_N
SDIO_DATA [3:0]
GPIO93
GPIO46
227
GPIO45
GPIO[64:67]
RX_BG
GMODE_EXT_LNA_GAIN
RF_SW_CTRL
DEA162450BTRF5501_
SW_CTRL
EXT_LNA_GAIN
BT_RESET_N
BT_UART_CTS
BT_UART_RTS
BT_UART_TXD
BT_UART_RST_N
BT_UART_CTS_N
291S
KU
BG
MSM
7 2 GPIO45
GPIO44
GPIO43
G O 23
PM7540
SLEEP_CLK(LPO Clock:32.768KHz)
_ _
BT_PCM_SYNC
BT_PCM_DIN
BT PCM DOUT
BT_RST_N
BT_PCM_SYNC
BT_PCM_OUT
BCM
43GPIO123
GPIO70
GPIO69WRF_EXTREFIN
38 4MHz
32.768KHz
PM7540BT_PCM_DOUT
BT_PCM_CLK
BT_WAKEUP
BT HOST WAKEUP
BT_GPIO_0
BT_PCM_IN
BT_PCM_CLK
GPIO68
GPIO71
GPIO42
CLK IN 38.4MHzTCXO
BT_HOST_WAKEUPBT_GPIO_1GPIO83 OSCIN
CLK_IN
6. BLOCK DIAGRAM
- 157 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
BT_PCM_IN WIFI&FM&BT
BT_PCM_SYNCBCM43291
BT_PCM_OUT
BT_PCM_CLK FM_ANT_ _
FM_RFM_L
MSM7227MICBIAS
FM ANT
AUDIOSUBSYSTEM
TPA2055D3
1
- 158 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
7. CIRCUIT DIAGRAM
C1080
6.8n
4.7u
C1036
R1001DNI
1.2n
L1019
FL1007
1950MHz, 2140MHz
958472
3
6 1RXANT
TX
GND1 GND4GND2 GND5GND3 GND6 C1105 2.2n
C1095 1.8p
C1083 1.8p
8.2n
L1038
C1101 100p
33pC1006C1008 33p
C1075
3.3n
DNIL1011
33pC1039
DNIL1008
33pC1037
DNIL1005
33p
C1015
33p
C1007
DNIL1002
1.2n
L1025
881.5MHz,942.5MHz
FL1000
103
52
81
9
6
74IN_881_5 OUT_881_5_1
OUT_881_5_2
OUT_942_5_1
IN_942_5 OUT_942_5_2
GND1 GND3
GND2 GND4
C1030
0.1u
SW1000
42131
G A C
2G
L102410n
1950MHz
FL1005
5 2
4 1
3G3
INOUTG1G2
5.1R1011
C1053
0.1u
C1061
0.1u
C1028
0.1u
C1009 10n
5.6n
L1027ANT1002
VREG_RF_2.7V
DNIC1050
C1096
100p
ANT1003
C1029
22p
C1027
22p
C1026
0.1u
p0017801
C
6801C
p001
p0014801
C
C1104DNI
C1019 DNI
VDD_RX
10uC1071
VBATT
DNIC1020
L1021
2.2p
1n
C1091
L1037DNI
C1088 33n
DNIL1036
DNIL1022
C1011 10n
C1022 DNI
2140MHz
FL1002
45
1
32G1 O1
ING2 O2
100nL1030
U1002
51
8 7
9 6
10 5
11 4
12 3
13 2
14 1RFIN_LOWRFOUT_LOW
VMODEGND3
VBPVCC2
VCC1GND2
VEN_LOWRFOUT_HI
VEN_HIGND1
RFIN_HICPL
DN
GP
FL1004
897.5 MHz,942.5 MHz
95
8
4 72
3
61
RX1ANT
TXGND1
GND4GND2
RX2
GND3 GND6
C101839p
C109918p
33pC1074
L1017
1.2n
VDD_RX
L10156.8n
C1076DNI
19
9 001R
C1070330p
C10691n
U1003
3
2
5
4
1NI_F
R
FIL_OUT
VDD
S_D
GND
C1081
3.9p
DNIC1073
C1092
4.7n
2nL1016
C1045 1n
u018401
C
L1034
3.3n
C1082
3p
3.9p
C1072
C1049 1n
R1022
0
3.9p
L1040
C100415n
R1000
100p
DNIC1031
12nL1013
C1078
33p
ANT1000
C1032 DNI
C1051 33p
L10286.8n
33pL1023
C1046 1n
L1042DNI
C1042
47p
19
8001R
2.2p
C1003
2.2p
C1010
1.2pC1094
p001860 1
C
C1077
3.9n
C1055
0.1u
C1057
0.1u
C1054
4.7u 4.7u
C1056
22nL1009
C1021
4.7p
C1058
0.1u
C1059
0.1u
C1034
1n
C1025
22p
R1013 12K
L1000
100n
C1014
68p
760 1C
u1 .0
VREG_MSMP_2.6V
C1012 33p
R1015
DNI
ANT1001
R1020
1K
R1012 5.1
C1089
DNI
L100718n
C1016
4.7p
C1013 1n
5.6n
C1033
C1052
6.8n
VREG_RF_2.7V
R1021
0
5.6n
C1038
U1000
32
92
82
53
43
96
62
61
60
54
4336
3738
2768
2552
2142
8
745
144
5347
2246
10
649
448
3
51
6750
1939
40
18
1741
16
1533
32
1331
1430
12
1159
58
956
24
557
55
65
6620
632
6426RF_ON TX_IP
TCXO TX_IN
SBDT TX_QP
TX_QN
LB_RF_OUT1
LB_RF_OUT2 VTUNE1
VTUNE2
HB_RF_OUT1 VTUNE_GPS
HB_RF_OUT2
HB_RF_OUT3 PRX_QP
PRX_QN
WPRXLBP PRX_IP
WPRXLBN PRX_IN
WPRXHBP
WPRXHBN DRX_QP
DRX_QN
WDRXLB DRX_IP
DRX_IN
WDRXHB1
WDRXHB2 NC
GCELL_INP DAC_IREF
GCELL_INN
VDDA1_1
EGSM_INP VDDA1_2
EGSM_INN VDDA1_3
VDDA1_4
DCS_INP VDDA1_5
DCS_INN VDDA1_6
GPCS_INP VDDA2_1
GPCS_INN VDDA2_2
VDDA2_3
GPS_IN VDDA2_4
PDET_IN VDDA2_5
TX_RBIAS VDDA2_6
WPRXSE1 VDDA2_7
WPRXSE2 VDDA2_8
VDDA2_9
VDDA2_10
VDDA2_11
VDDA2_12DN
GP
TU
O_2E
SX
RP
W
TU
O_1E
SX
RP
W
PNI_
XM_
BW
MNI_
XM_
BW
MD
DV
C1040
6.8n
C1001
2.7n
K 141 01
R
1842.5MHz,1960MHz
FL1001
103
52
81
9
6
74IN_1842_5 OUT_1842_5_1
OUT_1842_5_2
OUT_1960_1
IN_1960 OUT_1960_2
GND1 GND3
GND2 GND4
C1106
DNI
C1044 33p
C1023
22p
C1024
0.1u
C1060
0.1u
C1063
0.1u
18nL1004
C1017 33p
VREG_SMPS_2.1V
75
R1006
VBATT
C1079
1n
0.5p
L1001
3.3n
L1018FL1003
897.5 MHz
5 3 2
4 1INOUT
G1G2G3
03 1
500 1R
47
R1003
031
4001R
10R1010
2.2R1007
5801C
p001
L103533p
L1014
100p
DNIL1012
0.5pL1010
82nL1006
L100382n
L1029DNI
R1002
2.2K
U1001
313029
44434241
403938
736353
1615
4131211101
343332
17
9
188 197 206 215 224
32
3
42
2
52627282
1DCS_PCS_IN
11D
NG
01D
NG
9D
NG
8D
NG
GND1
7D
NG
GSM_IN
6D
NG
VAPCGND5VBATTGND4BS2GND3BS1GND2_TXEN
ANT
ED
OM
WCDMA3
PGND4PGND5PGND6 P
MET
4X
R3
XR
2X
R1
XR
WCDMA1WCDMA2
7D
NG
P8
DN
GP
9D
NG
P PGND10PGND11PGND12
PGND13PGND14PGND15PGND16
PGND1PGND2PGND3
L1026DNI
C1064
22p
12
R1019
33p
C1090
1575.42 MHz
FL100652
41
3G3
IN OUTG1 G2
L1041DNI
8101R
001
ANT1004
L10320.75pDNI
L1033
L10393p
C1097
33p
R1016
62
001
7101R
C1043 1n
C1065
100p
C1066
0.1u
7401C
n01
C1005
68p
C11000.1u
RTR6285_SSBI
GPS_MODE
RX0_Q_PRX0_Q_M
RX0_I_MRX0_I_P TX_Q_M
TX_Q_P
TX_I_M
TX_I_P
DAC_REF
PA_R0
PA_ON0PA_ON1
TX_ON
GSM_PA_RAMP
TCXO_RTR_19.2MHZ
ANT_SEL3
ANT_SEL0ANT_SEL2
ANT_SEL1
GND
RX1_Q_PRX1_Q_MRX1_I_PRX1_I_M
VREG_SMPS_2.1V|VSNS_RF_SMPS
VSNS_RF_SMPS
PA_R1
RX_WCDMA_2100_LNA_OUT
RX_WCDMA_2100_LNA_OUT
RX_PCS_P
RX_PCS_P
RX_DCS_PRX_DCS_P
RX_GSM_900_P
RX_GSM_900_P
RX_GSM_850_P
RX_GSM_850_P
RX_WCDMA_1900_LNA_OUT
RX_WCDMA_1900_LNA_OUT
WCDMA_900_TX_OUT
WCDMA_900_TX_OUT
WCDMA_900_RTX
WCDMA_900_RTX
PNI_
XIM_0012
BW
WB2100_MIX_INP
MNI_
XIM_0012
BW
WB2100_MIX_INM
RX_WCDMA_900_M
RX_WCDMA_900_M
RX_WCDMA_900_P
RX_WCDMA_900_P
PDET_IN
PDET_IN
RX_WCDMA_2100
RX_WCDMA_2100
RX_GSM_850_M
RX_GSM_850_M
RX_GSM_900_M
RX_GSM_900_M
RX_DCS_M
RX_DCS_M
RX_PCS_M
RX_PCS_M
WCDMA_2100_RTX
WCDMA_2100_RTX
GSM_TX
GSM_TX
DCS_PCS_TX
DCS_PCS_TX
GPS_IN
GPS_IN
WCDMA_2100_TX_OUT
WCDMA_2100_TX_OUT
0.5mm
1mm
8061
HIGHHIGH
Near to 4 Pin
0603
Near to 12 PinNear to 12 Pin
Near To RTR
Near To LNA
5001
06030603
0603
0603
0603
0603
0603
0603
W1700 LOW
5001
0603
WCDMA RX 2100 LNA Circuit
W2100 RX(2110 - 2170 MHz)
LNA for the GPS
WCDMA Triple
W900
W2100
W2100 TX(1920 - 1980 MHz)
BAND 1/2
DCS(1710-1785 MHz)
PCS(1850-1910 MHz)
LOW
HIGH
LOW
GSM900(880-915MHz)
HIGH
HIGH
HIGH
DCS1800/PCS1900 TX
+2.7V
GSM850/GSM900 TX
PCS1900 RX
HIGH
1%
GSM850(824-849MHz)
+2.1V
HIGH
HIGH
LOW
LOW
LOWLOW
HIGH
HIGH
7dB
HIGH
HIGH
LOW (X)
W900(W850)
EUSY0344001
LOW (X)
LOW (X)
GSM(869-894 MHz)
LOW (X)
LOW
GSM(925-960 MHz)
PCS(1930-1990 MHz)
DCS(1805-1880 MHz)
LOW
11dB
2mm
LOW
LOW LOW LOW
LOWHIGHHIGH
LOW
ANTENNA SWITCH MODULE LOGIC(SKY77544)
LOW
ANT_SEL3
0.5mm
VDDA2 : Pin 1,7,8,21,25,27,37,43,54,60,61,62 = +2.1V VDC
DCS1800 RX
GSM900 RX
ANT_SEL2ANT_SEL1ANT_SEL0
GSM850 RX
LOW
GSM Quad
VDDA1 : Pin 3,4,6,10,22,53 = +2.7V VDC
W2100
0603
0603
8061
Band 8
BAND2(2520) : ACMD-7407
SDMY0001901
BAND8(2520) : B7953 (SDMY0002801)
W900 TX(880 - 915 MHz)
Band 1
SDMY0002801
BAND1(2520):SAYP1G95AA0B00
W900 RX(925 - 960 MHz)
0603
0603
0603
(RX_WCDMA_1900)
L
K
J
I
H
G
F
E
D
C
B
A
12 11 10 9 8 7 6 5 4 3 2 1
L
K
J
I
H
G
F
E
D
C
B
A
12 11 10 9 8 7 6 5 4 3 2 1
7. CIRCUIT DIAGRAM
- 159 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
7. CIRCUIT DIAGRAM
R200 15K
FB200 600
FB202 600
600FB201
10pC224
L
K
J
I
H
G
F
E
D
C
B
A
12 11 10 9 8 7 6 5 4 3 2 1
L
K
J
I
H
G
F
E
D
C
B
A
12 11 10 9 8 7 6 5 4 3 2 1
ANT200 ANT201
2.2n
L205
15p
L201
3.3uL208
u7.4302
C
U201
4H
9D
5D
6E
9A
8D
8B
3C
6B
2E
2D
2C
2A
1G
3F2F1F2H
1H
4E
5E
21P
11P
8P
11F31
G01
G01F21
D21
E01J21
K31L01
K11
D01
D01
A21
C5
P4
M7J
R1F13F14M5N9L5
P7K11N7K14L4K13N6K9M6L9L2J8H8R4G7R2
L14T2L11R7M9R6L10T7
T1N8P6B11A11P10H9N12M8T12M7R13
P13L8T14G6N13K8N14J9R12
T11M11R11M12P14M14R14M13T13
T10H12R10G12E14R8C14N10D14R9C13T8D13N11G11T9H14P9G14
H3P1E3N1D4N2E8N4B9N5A8
A5M2A4M1A7K4C1K1E1L6K2K5K6J5H6
41B
01E
31E
31H
4P
21F4T1L8
G5
R2
P7L7
K6T5T
3G
2G4F
7C
7E
8C
5C
1A
1D
9C
5B
3A
6D
01M
21L11
C6J7
H01
C21
A31
AO
CV
DD
V_TB
F TD
DV_T
BF
RD
DV_T
B1
OD
DV_T
B2
OD
DV_ T
BFI
DD
V_TB
1C
DD
V_TB
2C
DD
V_TB
2P1_
OC
VD
DV_F
RW
2P1_
XTD
DV_F
RW
2P1_
XR
DD
V_FR
W2
P1_P
CDF
PD
DV_F
RW
3P3_
GA
PD
DV_F
RW
3P3_
AA
PD
DV_F
RW
2P1_
OLD
DV_F
RW
2P1_
DD
DV_F
RW
2P1_
BA
CD
DV_F
RW
2P1_
AD
DV_F
RW
2 _2P1 _
DD
V _LLP
BB _F
RW
CD
AX
R_D
DV
A_EF
A_FR
WX
UA_
DD
VA_
EFA_F
RW
1_D
S_OI
DD
V2_
DS_
OID
DV
1_FR_
OID
DV
2_FR_
OID
DV
1OI
DD
V2
OID
DV
1D
DV
2D
DV
3D
DV
LAT
X_D
DV
52D
DV_
PTO
DD
VA
NA_
MFO
CV
DD
V_MF
LLP
DD
V_MF
XR
DD
V_MF
RF_SW_CTRL_N_0RF_SW_CTRL_P_0RF_SW_CTRL_N_1RF_SW_CTRL_P_1RF_SW_CTRL_N_3RF_SW_CTRL_P_3
WRF_RFOUTP_G AMODE_TX_PUWRF_RFOUTP_A GMODE_TX_PUWRF_RFINP_G1 AMODE_EXT_LNA_GAINWRF_RFINP_A1 GMODE_EXT_LNA_GAINWRF_RFINN_A1_XFMRWRF_RFINN_G1_XFMR WL_GPIO_0WRF_RES_EXT WL_GPIO_1WRF_EXTREFIN WL_GPIO_2WRF_EXTCOUPLE_AIN WL_GPIO_3WRF_AFE_TSSI_G WL_GPIO_8WRF_AFE_TSSI_A
FM_TXADCIN2VREF_LDO FM_TXADCIN1VOUT_LNLDO1 FM_TXADCVCMVOUT_LDO2 FM_TXPVOUT_CLDO FM_TXNVDD_LNLDO1 FM_RXPVDD_LNLDO2 FM_RXNVDD_CLDO FM_CVAR
FM_ADOUT2SR_PALDO_1 FM_ADOUT1SR_PALDO_2SR_VDDNLDO BT_UART_TXDSR_VLX1_1 BT_UART_RXDSR_VLX1_2 BT_UART_RTS_NSR_VDDBAT3_1 BT_UART_CTS_NSR_VDDBAT3_2SR_VDDBAT2 BT_TM0SR_VDDBAT1_1 BT_TM1SR_VDDBAT1_2 BT_TM3SR_VSSPLDO BT_TM6SR_PVSS_1SR_PVSS_2 BT_SDASR_AVDD2P5 BT_SCLSR_TESTSWG BT_RST_NSR_PNPO BT_RFOP
BT_RFONSDIO_CMD BT_REG_ONSDIO_DATA_0SDIO_DATA_1 BT_PCM_SYNCSDIO_DATA_2 BT_PCM_OUTSDIO_DATA_3 BT_PCM_INSDIO_CLK BT_PCM_CLK
UART_TX_0 BT_GPIO_0UART_RX_0 BT_GPIO_1
BT_GPIO_2TMS BT_GPIO_3TDO BT_GPIO_4TDI BT_GPIO_5TCK BT_GPIO_6TAP_SEL_0 BT_GPIO_7TAP_SEL_1JTAG_TRST_L WL_REG_ON
WL_RST_NOSCIN
OSCOUTXTAL_PU1
SS
V2
SS
V3
SS
VO
CV
SS
V_ TB
FR
SS
V_TB
FIS
SV_T
BP FI
SS
V_ TB
1C
SS
V_TB
2C
SS
V_TB
1TU
O_X
EO
C_TB
0TU
O_X
EO
C_TB
OC
VS
SV_
MFX
RS
SV_
MFLL
PS
SV_
MFFL
DN
GB_
MFS
SV
AN
A_MF
LAT
X_S
SV
ODL_
SS
VA
SS
VA
P _R
SS
SV
A_R
S
2TU
O_OI
PG_ F
RW
1TU
O_OI
PG_F
RW
PO_T
SET_
EFA_F
RW
NO _T
SE T_
E FA_ F
RW
PI_TS
ET_EF
A_FR
WNI_T
SET_
EFA_F
RW
FE
RV_
CD
AQI_
EFA_F
RW
CD
AX
R_S
SV
A_EF
A_FR
W
1_3P3_
AA
PD
NG_F
RW
2_3P3_
AA
PD
NG_F
RW
3_3P3_
GA
PD
NG_F
RW
4_3P3_
GA
PD
NG_F
RW
2P1_
XR
DN
G_FR
W2_2
P1_XT
DN
G_FR
W2
P1_D
DN
G_FR
W2
P1_A
DN
G_FR
W2
P1_B
AC
DN
G_FR
W2
P1_O
CV
DN
G_FR
W2
P1_OL
DN
G_FR
W2
P1_P
CDF
PD
NG_F
RW
2P1_
DN
G_LLP
BB_F
RW
u 7.492 2
C
DNI
C221
u7.4032
C
402C
n022
V6.2_P
MS
M_G
ER
V
C244 10p
15pC245
4.7uC235
10pC223
C239 220n
C232 3.3n
VREG_MSMP_2.6V
VDD_RADIO_PLL
VDD_BT
VDD_PLL
VDD_AFE
C234 0.1u
C231
u01
822C
u1
C226 5pC225
0.1u
902C
u1.0
802C
u1.0
702C
u1.0
602C
u1.0
502C
n01
3 12C
u 1.0
012C
u1
VDD_BT
C238
22p
C243 1u
002C
u1.0
202C
u1.0
C236
47p
102C
u1. 0
C242 220n
L206
47n
C233 1n
C237
47p
L207100n
C211
0.1u
212C
p2.8
412C
u1.0
VDD_RADIO_PLL
VDD_CORE
VDD3.3V
+VPWR
VDD_2.5V
022C
DNI
C241
u1.0u7.4042
C
VDD_FM
LLP_
DD
VLL
P_OI
DA
R_D
DV
ER
OC_
DD
V
EFA_
DD
V
V3.3D
DV
ER
OC_
DD
V
VDD_XTAL
LAT
X_D
DV
V5.2_D
DV
MF_D
DV
600FB203
V3.3D
DV
C227 0.1u
U2007
8
9
01 11 21
2
31
1
5 46
3GND2
DD
V
NE_
ANL
TU
O_X
R
TX_IN
DN
GP
GND1
XT_C
XR_
C
TN
A
C_BT
BT
GND3
C222
10p
912C
DNI
C248
1u
L209
3n
FL200 2450 MHz
3
2
1IN D
NG
OUT
DNI
C217
100pL202
DNIC218
38.4MHzKT3225L38400UCW28TA0
X200
3 2
4 1GND1VCC
GND2OUT
302R
K001
U202
5
3 24 1
VOUTVINGNDSTBY
DN
GP
C246 100p
VDD_TCXO
VDD_TCXO
R201
0
C247
1u
+VPWR
006
402BF
V6
.2_
PM
SM_
GER
V
V6
.2_P
MSM
_G
ERV
SLEEP_CLK
WLAN_SDIO[0]WLAN_SDIO[1]WLAN_SDIO[2]WLAN_SDIO[3]
BT_RESET_N
WLAN_CMD
WLAN_CLK
BT_PCM_DINBT_PCM_DOUT
BT_HOST_WAKEUP
BT_UART_RTSBT_UART_CTS
BT_UART_RXDBT_UART_TXD
BT_PCM_SYNC
BT_PCM_CLK
BT_WAKEUP
WLAN_RESET_N
FM_RFM_L
WLAN_HOST_WAKEUPWLAN_WAKEUP
CLK_REQ
CLK_REQ
SW_BT_TXSW_BT_TX
XT_LW_
WS
SW_WL_TX
XR_T
B_LW_
WS
SW_WL_BT_RX
NIA
G_N
AL_TX
E
EXT_LAN_GAIN
VDD_FM
GB_
XR
RX_BG
TX_BT
TX_BT
TX_WLBG
TX_WLBG
V3.
3DDVV3.
3DD
V
CLK_INCLK_IN
FM_ANT
1%
WiFi&BT&FM(BCM43291)
0: SDIO / N.C : SPI
TP for TSSI Calibration38.4MHz TCXO
LDO for TCXO
- 160 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
7. CIRCUIT DIAGRAM
K01413
R
D301
C303
47p
C308
10n
003R
K051
R310 33
103R
K003
VREG_MSMP_2.6V
603R
K01
C328
47p
C306
2.2n113
CFu1
503R
K1
2KR313
403R
K02
L
K
J
I
H
G
F
E
D
C
B
A
12 11 10 9 8 7 6 5 4 3 2 1
L
K
J
I
H
G
F
E
D
C
B
A
12 11 10 9 8 7 6 5 4 3 2 1
u1.0413
C
u1.051 3
C
u1.0713
C
0.1u
C304
u1.0613
C
C302
47p
VREG_MSMP_2.6V
100
R303
TP303
TP302
713R
001 001813
R
K2 .2
7 03R
19.2MHzKT3225L19200DCW28RA0
X300
42
31VCONT OUT
GND VCC
C325
33n
VREG_TCXO_2.85V
0.1u
C324
C301
0.1u
C320 330p
TP301
U302
EUSY0408201
43
52
61D VCC
CP NC
GND Q
VREG_MSMA_2.6V
VREG_MSMP_2.6VFu1
313C
C327
47p
C323
33p
R315
49.9
C307 330p
u1.0813
C
22uC305
IND
903R
K001613
R
u 1. 02 13
C
203R
15
0.1u
C319
R312
47
7.5p
C321 C322
7.5p
R319
1
TP305
TP306
TP307
TP300
0406803
R
SU
BV_
GH
CV
C309 330p
003D
IN
D
C300
1n
VREG_TCXO_2.85V
VREG_MSMA_2.6VC310 0.1u
U301
3
2
4
15
VCC
GND
R311 100K
AXT614124ENBY0045901
CN300
1615
87
96
105
114
123
132
141
1817
VREG_MSMP_2.6V
VCHG_VBUS
UAT300
12
11
10
9
8
7
6
5
4
3
2
1GND
RX
TX
NC1
ON_SW
VBAT
NC2
NC3
NC4
DSR
RTS
CTS
GND
RX
TX
VCHAR
ON_SW
VBAT
PWR
URXD
UTXD
3G2.5G
VBATT
MIC_BIAS
U300
M5
Y18
AC19
AF18
Y17
U16
AC18
AF17
W16
AE17
AC17
Y16
AB17
W5
W3
V5
V6
AB9
V9
V8
Y9
W8
AB8
V3
V2
U2
U8
U9
AF4
AE2
AB7
AE4
AE3
AD3
L2
L8
L3
L9
AD2
AC6
AC3
AC2
U15
W15
AC16
AB16
AF15
Y15
AC15
AB15
W14
AE14
AC14
Y14
AC13
U13
Y13
AB13
W13
W12
AB12
Y12
AC12
AC11
AF10
W9
AE10
U12
AF9
AC20
AF20
AB21
AE20
AF21
AF22
AC23
AE23
AC21
AF23
AE21
AB22
AC22
AE24
AE25
AF24
6M
8M
9M
8EA
7FA
8CA
6FA
7CA
6EA
11R
81B
A
81W
11Y
71C
71B
61H
81H
71M
62G
01Y
11T
01W
61E
A
8FA
61F
A
5FA
31F
21C
21B
11H
11J
21H
21J
11E
21F
11F
21E
91E
A
91F
A
02B
A
51C
61F
31H
41H
41J
31J
11C
41L
3F
2F
3E
2E
2D
52G
61L
91C
91B
91H
62F
02H
81J
71J
32H
22F
32F
61J
71E
51J
71F
61B
61C
51H
81B
52B
12F
02B
02F
71H
02E
02C
81C
81F
B21
B22
C21
E21
C22
C24
E26
B24
F25
C26
D26
C23
B23
C25
D25
E23
W20
AD26
N17
T20
J25
M20
N25
V26
H26
L25
P20
U26
V19
AC25
U19
U20
AB23
W25
W26
R19
T19
W22
AC26
V23
AB26
AB25
AA23
AA25
Y26
Y23
T17
Y22
W23
AA26
V20
J26
K20
J20
J23
J22
K19
K26
L22
L19
L23
L20
M19
L26
M26
M22
M23
N26
N19
N20
P26
R26
P19
R25
T26
R22
R23
R20
T23
T22
U25
U23
U22
4C
6G
5G
6N
3N
2N
2W
6W
3M
8T
2K
3K
2J
3J
2H
3H
2G
3G
6R
2P
3P
2R
3R
11
B
41
FA
31
FA
21
FA
11F
A
5B
A
3B
A
2B
A
3AA
2AA
2Y
6A
A
2M
3U
11W
9EA
9CA
6BA
3Y
71W
91B
A
51E
41
C
31C
51B
41B
31B
8H
6F
5F
01J
01H
9H
01
C
01B
9C
9B
8F
8E
7F
7E
7C
7B
6C
5C
6B
5B
PI_
R_EN
IL
NI_
R_
EN
IL
PI
_L_EN
IL
NI_L_EN
IL
P1C
IM
N1C
IM
P2CIM
N2CIM
PIX
UA
NIX
UA
PO
_ENIL
NO_
EN
IL
PO_
1R
AE
NO_1R
AE
TUOX
UA
R_HP
HL
_H
PH
PM
OCC
SAIB_CI
MF
ER
V_
HP
H
KL
CS
YS_
YH
PBS
UP
D_Y
HPB
SU
ND_
YH
PB
SU
DI_
YH
PB
SU
SU
BV_YH
PB
SU
TXER_YH
PB
SU
N_N
IS
ER
N_TUO
SE
R
NE_GO
DW
0_ED
OM
1_E
DO
M2
_E
DO
M3
_EDO
M
OXC
TJ
DA
_O
L_
KR
TK
LC
_P
EE
LS
IDT
SMT
N_T
SR
TOD
TK
CT
KCT
R
P_A
TAD_
ID
DM
N_
ATA
D_
ID
DM
P_
BTS
_I
DD
MN
_BTS
_I
DD
M
KLCP_CD
CL
P_T
UO
_I
N_TUO
_I
P_TU
O_Q
N_T
UO
_Q
FE
R_C
AD
0HC_PI_
I0
HC
_M
I_
I0
HC
_P
I_
Q0
HC
_M
I_
Q1
HC
_PI_
I1
HC_M
I_
I1
HC_P
I_
Q1
HC_M
I_
Q
NO_
XT
JDA
_C
GA
_X
T
0NO_A
P0
EGNA
R_
AP
LT
C_R
WP
_A
PM
_LTC
_R
WP
_AP
FER_GB_
MS
G
0NI
AKH
1NI
AKH
2NIAK
H
EBI1_DQ_0EBI1_DQ_1EBI1_DQ_2EBI1_DQ_3EBI1_DQ_4EBI1_DQ_5EBI1_DQ_6EBI1_DQ_7EBI1_DQ_8EBI1_DQ_9EBI1_DQ_10EBI1_DQ_11EBI1_DQ_12EBI1_DQ_13EBI1_DQ_14EBI1_DQ_15EBI1_DQ_16EBI1_DQ_17EBI1_DQ_18EBI1_DQ_19EBI1_DQ_20EBI1_DQ_21EBI1_DQ_22EBI1_DQ_23EBI1_DQ_24EBI1_DQ_25EBI1_DQ_26EBI1_DQ_27EBI1_DQ_28EBI1_DQ_29EBI1_DQ_30EBI1_DQ_31
EBI1_ADR_0EBI1_ADR_1EBI1_ADR_2EBI1_ADR_3EBI1_ADR_4EBI1_ADR_5EBI1_ADR_6EBI1_ADR_7EBI1_ADR_8EBI1_ADR_9EBI1_ADR_10EBI1_ADR_11EBI1_ADR_12EBI1_ADR_13
EBI1_CKE0EBI1_CKE1EBI1_DCLKEBI1_DCLKBEBI1_WE_NEBI1_CS0_NEBI1_CS1_NEBI1_BA_0EBI1_BA_1EBI1_DQS_0EBI1_DQS_1EBI1_DQS_2EBI1_DQS_3EBI1_DM_0EBI1_DM_1EBI1_DM_2EBI1_DM_3EBI1_RAS_NEBI1_CAS_NEBI1_RESOUT_NEBI1_CAL
EBI2_DATA_0EBI2_DATA_1EBI2_DATA_2EBI2_DATA_3EBI2_DATA_4EBI2_DATA_5EBI2_DATA_6EBI2_DATA_7EBI2_DATA_8EBI2_DATA_9EBI2_DATA_10EBI2_DATA_11EBI2_DATA_12EBI2_DATA_13EBI2_DATA_14EBI2_DATA_150
_RD
A_
2I
BE
1_
RD
A_
2I
BE
2_
RDA
_2
IBE
3_
RDA
_2
IBE
4_
RDA
_2
IBE
5_
RDA
_2
IBE
6_
RD
A_
2IB
E7
_RD
A_
2IB
E8
_RDA
_2IB
E9
_RDA
_2I
BE
01
_RDA
_2
IBE
11
_RDA
_2
IBE
21
_RDA
_2
IBE
31
_RDA
_2
IBE
41
_RD
A_
2IB
E5
1_
RD
A_
2IB
E6
1_
RDA
_2
IB
E
N_
0SC
_2
IBE
N_
1SC
_2
IBE
N_
4SC
_2
IBE
N_
5SC
_2
IBE
N_
6SC
_2
IBE
N_
7S
C_
2IB
EKLC
_2
IB
EN
_EW
_2IB
EN
_EO
_2I
BE
N_BU
_2
IBE
N_BL
_2
IBE
N_
0Y
SUB
_2
IBE
RE
PI
WR
L_S
TL
L_S
TR
U_
ST
LU
_ST
231
_O
IPG
131
_O
IPG
03
1_
OIP
G92
1_
OIP
G821
_O
IP
G721
_OIP
G621
_O
IPG
521
_O
IPG
421
_O
IPG
321
_O
IPG
22
1_
OIP
G121
_O
IP
G021
_O
IP
G911
_OI
PG
811
_O
IPG
711
_OI
PG
611
_O
IPG
511
_O
IPG
411
_O
IPG
31
1_
OIP
G211
_O
IPG
111
_OIP
G011
_OI
PG
901
_O
IPG
801
_O
IPG
701
_O
IPG
601
_O
IPG
501
_O
IP
G401
_O
IP
G301
_O
IPG
201
_O
IPG
101
_OI
PG
001
_O
IPG
99
_O
IPG
89
_O
IPG
79
_O
IP
G69
_O
IP
G59
_O
IP
G49
_OI
PG
39
_O
IPG
29
_O
IPG
19
_O
IPG
09
_O
IPG
98
_O
IP
G8
8_
OIP
G78
_O
IPG
68
_O
IP
G58
_OI
PG
GPIO_0GPIO_1GPIO_2GPIO_3GPIO_4GPIO_5GPIO_6GPIO_7GPIO_8GPIO_9
GPIO_10GPIO_11GPIO_12GPIO_13GPIO_14GPIO_15GPIO_16GPIO_17GPIO_18GPIO_19GPIO_20GPIO_21GPIO_22GPIO_23GPIO_24GPIO_25GPIO_26GPIO_27GPIO_28GPIO_29GPIO_30GPIO_31GPIO_32GPIO_33GPIO_34GPIO_35GPIO_36GPIO_37GPIO_38GPIO_39GPIO_40GPIO_41GPIO_42GPIO_43GPIO_44GPIO_45GPIO_46GPIO_47GPIO_48GPIO_49GPIO_50GPIO_51GPIO_52GPIO_53GPIO_54GPIO_55GPIO_56GPIO_57GPIO_58GPIO_59GPIO_60GPIO_61GPIO_62GPIO_63GPIO_64GPIO_65GPIO_66GPIO_67GPIO_68GPIO_69GPIO_70GPIO_71
GPIO_72_GRFC_9GPIO_73_GRFC_8GPIO_74_GRFC_7GPIO_75_GRFC_6GPIO_76_GRFC_5GPIO_77_GRFC_4GPIO_78_GRFC_3GPIO_79_GRFC_2GPIO_80_GRFC_1GPIO_81_GRFC_0
GPIO_82GPIO_83GPIO_84
SD_MMC_CLKSD_MMC_CMD
SD_MMC_DATA[0]SD_MMC_DATA[1]SD_MMC_DATA[2]SD_MMC_DATA[3]
TNI_
HC
UOT
CAM_PCLK
CAM_MCLK
P1_CI
M
N_V
CR
P_V
CR
R_H
PH
L_H
PH
CAM_VSYNCCAM_HSYNC
SD_MMC_DET
AUDIO_I2C_SCL
AUDIO_I2C_SDA
CAM_DATA[7]CAM_DATA[6]CAM_DATA[5]CAM_DATA[4]CAM_DATA[3]CAM_DATA[2]CAM_DATA[1]CAM_DATA[0]
KLC_
PE
ELS
REMOTE_PWR_ON
REMOTE_PWR_ON
TCXO_PM_19.2MHZ
PS_HOLDPM_INT_N
FE
R_C
AD_
AP_
MS
G
TU
O_X
UM
A
OX
CT_CI
MP
PMIC_TCXO
NE_
OX
CT
TCXO_EN
IB
SS_
CIM
P
JTAG_PS_HOLD
MUIC_INT
RTR6285_SSBI
GPS_MODE
P_Q_0
XR
M_Q_0
XR
M_I_0X
RP_I_0
XR
M_Q_
XTP_
Q_XT
M_I_XT
P_I_XT
FE
R_C
AD
0R_
AP
0N
O_A
P
PA_ON1
NO_
XT
PM
AR_
AP_
MS
G
TCXO_RTR_19.2MHZ
ANT_SEL3
ANT_SEL0
ANT_SEL2ANT_SEL1
MOTION_I2C_SDA
MOTION_I2C_SCL
WLAN_SDIO[0]WLAN_SDIO[1]WLAN_SDIO[2]WLAN_SDIO[3]
JD
A_OL_
KRT
TRK_LO_ADJ
COMPASS_DRDY
AD
S_C2I_L
B_D
CLL
CS_
C2I_LB_
DCL
CAM_PWDNCAM_RESET_N
SDRAM_CKE1
N_T
ESE
R_
TB
N_
TE
SER
_D
CL
CAM_I2C_SDACAM_I2C_SCL
NTS
RT_M
SM
MSM_TRSTN
WLAN_CMDWLAN_CLK
KLC
SY
S_H
BS
U
USBH_SYSCLK
nSDRAM_CS0
SDRAM_DATA[16]
SDRAM_DATA[0]SDRAM_DATA[1]SDRAM_DATA[2]SDRAM_DATA[3]SDRAM_DATA[4]SDRAM_DATA[5]SDRAM_DATA[6]SDRAM_DATA[7]SDRAM_DATA[8]SDRAM_DATA[9]
SDRAM_DATA[10]SDRAM_DATA[11]SDRAM_DATA[12]SDRAM_DATA[13]SDRAM_DATA[14]SDRAM_DATA[15]
SDRAM_DATA[17]SDRAM_DATA[18]SDRAM_DATA[19]SDRAM_DATA[20]SDRAM_DATA[21]SDRAM_DATA[22]SDRAM_DATA[23]SDRAM_DATA[24]SDRAM_DATA[25]SDRAM_DATA[26]SDRAM_DATA[27]SDRAM_DATA[28]SDRAM_DATA[29]SDRAM_DATA[30]SDRAM_DATA[31]
LCD_BL_EN
LC
S_C2I_
HC
UOT
AD
S_C2I_
HC
UOT
BT_PCM_DINBT_PCM_DOUT
LIN_PWM_FREQ
BT_HOST_WAKEUP
BT_UART_RTSBT_UART_CTSBT_UART_RXDBT_UART_TXD
BT_PCM_SYNCBT_PCM_CLK
RTR_TRK_LO_ADJ
RTR_TRK_LO_ADJ
BT_WAKEUP
N_TE
SE
R_N
ALW
R_MF
L_MF
MOTION_INT
SDRAM_ADDR[0]SDRAM_ADDR[1]
SDRAM_ADDR[10]SDRAM_ADDR[11]SDRAM_ADDR[12]
SDRAM_ADDR[2]SDRAM_ADDR[3]SDRAM_ADDR[4]SDRAM_ADDR[5]SDRAM_ADDR[6]SDRAM_ADDR[7]SDRAM_ADDR[8]SDRAM_ADDR[9]
SDRAM_BA0SDRAM_BA1
nSDRAM_CAS
SDRAM_DCLK0SDRAM_DCLK1
SDRAM_DQM0SDRAM_DQM1SDRAM_DQM2SDRAM_DQM3
SDRAM_DQS0SDRAM_DQS1SDRAM_DQS2SDRAM_DQS3
nSDRAM_RAS
nSDRAM_WE
YD
AE
R_H
SALF_
DN
AN
SC_
HS
A LF _D
NA
Nn
EBI2_DATA[0]EBI2_DATA[1]
EBI2_DATA[10]EBI2_DATA[11]EBI2_DATA[12]EBI2_DATA[13]EBI2_DATA[14]EBI2_DATA[15]
EBI2_DATA[2]EBI2_DATA[3]EBI2_DATA[4]EBI2_DATA[5]EBI2_DATA[6]EBI2_DATA[7]EBI2_DATA[8]EBI2_DATA[9]
nRESETOUT
KCT
R_M
SM
MSM_RTCK
TU
OS
ER_
GATJn
TUO
SE
R_G
ATJ
n|
TSR
_NO
Pn
nJTAG_RESOUT
TS
R_N
OPn
KCT_
MS
M
MSM_TCK
IDT_
MS
M
MSM_TDI
ODT_
MS
M
MSM_TDO
SMT_
MS
M
MSM_TMS
SDRAM_ADDR[13]
PU
EK
AW_T
SO
H_N
ALW
nSDRAM_CS1
BL_D
NA
Nn
EO_
DN
ANn
BU_
DN
ANn
EW_
DN
ANn
SDRAM_CKE0
SR_
DCL
SC_
DCL
EAR_SENSE
N1_CI
M
GND|MIC_1N
PU
EK
AW
_NA
LW
O_
CN
YSV
_D
CL
RF_BAND_CHECK
KC
EHC
_DN
AB_
FR
NO_
ENI L
PO_
ENIL
MD_
HB
SU
PD_
HB
SU
MUIC_I2C_SDA
MUIC_I2C_SCL
KEY_ROW[1]
KEY_ROW[0]
KEY_COL[0]
KEY_COL[1]
P_Q_1
XR
M_Q_1
XR
P_I_1X
RM_I_1
XR
P_CI
MR
AE
XT
_TR
AU
UART_TX
UART_TX
UART_TX
XR
_TR
AU
UART_RXUART_RX
UART_RX
AD
S_C2I_
SS
AP
MO
CL
CS_
C2I_S
SA
PM
OC
MSM_USIM_CLKMSM_USIM_RST
MSM_USIM_DATA
CDA
_K
OOH
HG
IH
_DI
RE
KAM
_D
CL
1R
_AP
150K
150K
150K
RC Filter of CAM_MCLK close to MSM
1.30V
ADC
150K
R2
2.13V150K
150K
BAND
1.93V
2100 + 850
2100 + 900
1900 + 850 680K
100K
1.73V300K
R1
1.04V
430K
0000 : Native, ARM9 on PJTAG, ARM11 on AJTAG
NEST JIG2010.01.18 updated
FFA Rev.C(220Ohm@100MHz)
1.0T
ARM9&ARM11 JTAG
TCXO Circuit
Clesed to TCXO
Clesed to NC7SZ74L8X
Array TP
ARM9&ARM11 JTAG
GPS D FLIP-FLOP
MPM Port
(MIC_1N)
MODE[3:0]
0001 : Native, ARM9 + ARM11 on PJTAG
- 161 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
7. CIRCUIT DIAGRAM
DNI
R405
DNI
R404
TP402
TP403
R402 K01
VREG_MSMC1_1.25V
VREG_MSME_1.8V
VREG_MSME_1.8V
VREG_MSME_1.8V
304R
K001
TP400
TP401
TP404
TP405
V8.1_E
MS
M_G
ER
V
V6.2_P
MS
M_G
ER
V
V8.1_E
MS
M_G
ER
V
VREG_MSMC1_1.25V VREG_MSME_1.8VVREG_MSMC2_1.25V VREG_MSMA_2.6V VREG_MSMP_2.6V
124C
u22
u01724
C
VSNS_MSME_1.8V
VSNS_MSMC1_1.25V
VSNS_MSMC2_1.25V
VREG_MSMA_2.6V
VREG_MSMC1_1.25V
VREG_MSMC2_1.25V
VREG_MSME_1.8V
VREG_MSMP_2.6V
V9.2_2X
UA_
GE
RV
V6.2_A
MS
M_G
ER
VV3.3_
BS
UU401
01R
9R
2R
1R
01A
9A
2A
01P
1P
4M
1G
3F01B
2B
1B
E5H7N5G5B5J7E7G9F8F10G6E9J8D10H2C9G2N9K1M10E3L9H8K9G8J10J2
M1C7P8C8H10D7H1D8D1D6B8E8D5M2F6P9F7J1E6H9H4C1H3B9F5G10E4F9F4E10G4D9G3C10J4N10H5M9H6L10J5K10J6J9G7P6K6C5K5K7C6L8C3K8C4L7B4L6B7L5B3L4B6
K2N8J3M7M3N7F1P5F2P4K3N4D4P3E2P2D3M8E1N6D2M6C2P7L3M5L2N3L1N2K4N1
IO0 A0IO1 A1IO2 A2IO3 A3IO4 A4IO5 A5IO6 A6IO7 A7IO8 A8IO9 A9IO10 A10IO11 A11IO12 A12IO13 A13IO14 BA0IO15 BA1
_CE DQ0_RE DQ1_WEN DQ2CLE DQ3ALE DQ4_WP DQ5R_B DQ6
DQ7VSSN1 DQ8VSSN2 DQ9VSSQ1 DQ10VSSQ2 DQ11VSSQ3 DQ12VSSQ4 DQ13VSSQ5 DQ14VSSQ6 DQ15VSSQ7 DQ16VSSQ8 DQ17VSSQ9 DQ18VSSQ10 DQ19VSS1 DQ20VSS2 DQ21VSS3 DQ22VSS4 DQ23VSS5 DQ24VSS6 DQ25
DQ26VDD1 DQ27VDD2 DQ28VDD3 DQ29VDD4 DQ30VDD5 DQ31VDD6
_CSVDDQ0 CLKVDDQ1 _CLKVDDQ2 CKEVDDQ3 _WEDVDDQ4 _RASVDDQ5 _CASVDDQ6 DQM0VDDQ7 DQM1VDDQ8 DQM2VDDQ9 DQM3
DQS0VCCN1 DQS1VCCN2 DQS2
DQS3
1C
N2
CN
3C
N4
CN
5C
N6
CN
7C
N8
CN
1U
ND
2U
ND
3U
ND
4U
ND
5U
ND
6U
ND
7U
ND
C402
2.2u
004R
0
U300
L5
E10
AE22
AD25
AE18
AE15
AE11
AE7
Y5
T5
H25
E25
E22
Y25
V25
T25
P25
M25
K25
AE12
AC10
AC5
Y8
AF26
AF25
AF3
AF2
AE26
AB11
Y20
W19
U17
U11
P23
N23
M11
L17
L12
K23
K9
J19
G23
E19
C2
B26
B3
B2
T2
R8
R5
P9
N8
K6
K5
J6
J5
F9
E6
C8
C3
U6
T6
T3
R9
P8
P5
N9
K8
J9
J8
H6
H5
E9
E5
D3
B8
AE13
AE5
AB14
AB10
AA22
Y19
Y6
V22
U14
T16
T15
T14
T13
T12
R17
R16
R15
R14
R13
R12
P22
P17
P16
P15
P14
P13
P12
P11
P6
N22
N16
N15
N14
N13
N12
M16
M15
M14
M13
M12
L15
L13
L6
K22
G22
F19
F15
F10
E14
B4
7G
A
6G
A
5G
A
4G
A
3G
A
72
GA
62
GA
52
GA
42
GA
32
GA
22
GA
12
GA
02
GA
2G
A
91
GA
81
GA
71
GA
61
GA
51
GA
41
GA
31
GA
21
GA
11
GA
01
GA
1G
A
72
FA
1F
A
72
EA
1E
A
72
DA
1D
A
72
CA
1C
A
72
BA
1B
A
72
AA
1A
A
72
A
62
A
52
A
42
A
32
A
22
A
12
A
02
A
91
A
81
A
71
A
61
A
51
A
41
A
31
A
21
A
11
A
01
A
9A
8A
7A
6A
5A
4A
3A
2A
1A
61
E
41
F
5A
A
22
H
11N
5N
81E
31
E
5U
9T
72Y
1Y
72
W
1W
72
V
1V
72
U
1U
72T
1T
72
R
1R
72
P
1P
72
N
1N
72M
1M
72
L
1L
72
K
1K
72J
1J
72H
1H
72G
1G
72
F
1F
72E
1E
72D
1D
72C
1C
72
B
1B
9GA
8G
A56
_CN
66
_CN
76_CN
86_CN
96
_CN
07
_CN
17
_CN
27
_CN
37
_CN
47_
CN
57_
CN
67
_C
N77
_CN
87
_C
N97
_CN
08
_CN
18
_CN
28
_CN
38_
CN
48_
CN
58
_CN
68
_C
N78
_CN
88
_CN
98
_CN
09
_CN
19_
CN
29_
CN
39
_C
N49
_CN
59
_CN
69
_CN
79
_CN
89
_CN
99
_CN
001
_C
N10
1_C
N20
1_
CN
30
1_CN
401
_C
N
1D
VSR
2D
VSR
8P
_DD
V
9P
_DDV
01
P_D
DV
GR
P_E
SUF
Q_DD
V
1C
_SN
S_
DD
V2C_
SNS
_DDV
6P
2_YHPB
SU
_D
DV
3P
3_YHP
BSU
_D
DV
1_
CN
2_
CN
3_
CN
4_
CN
5_
CN
6_
CN
7_
CN
8_
CN
9_
CN
01_
CN
11_
CN
21_
CN
31_
CN
41_
CN
51_
CN
61_
CN
71_
CN
81_
CN
91_
CN
02_
CN
12_
CN
22_
CN
32_
CN
42_
CN
52_
CN
62_
CN
72_
CN
82_
CN
92_
CN
03_
CN
13_
CN
23_
CN
33_
CN
43_
CN
53_
CN
63_
CN
73_
CN
83_
CN
93_
CN
04_
CN
14_
CN
24_
CN
34_
CN
44_
CN
54_
CN
64_
CN
74_
CN
84_
CN
94_
CN
05_
CN
15_
CN
25_
CN
35_
CN
45_
CN
55_
CN
65_
CN
75_
CN
85_
CN
95_
CN
06_
CN
16_
CN
26_
CN
36_
CN
46_
CN
GND1GND2GND3GND4GND5GND6GND7GND8GND9GND10GND11GND12GND13GND14GND15GND16GND17GND18GND19GND20GND21GND22GND23GND24GND25GND26GND27GND28GND29GND30GND31GND32GND33GND34GND35GND36GND37GND38GND39GND40GND41GND42GND43GND44GND45GND46GND47GND48GND49GND50
GND_A1GND_A2GND_A3GND_A4GND_A5GND_A6GND_A7GND_A8GND_A9GND_A10GND_A11GND_A12GND_A13GND_A14GND_A15GND_A16
VDD_A1VDD_A2VDD_A3VDD_A4VDD_A5VDD_A6VDD_A7VDD_A8VDD_A9
VDD_A10VDD_A11VDD_A12VDD_A13
VDD_C1_1VDD_C1_2VDD_C1_3VDD_C1_4VDD_C1_5VDD_C1_6VDD_C1_7VDD_C1_8VDD_C1_9VDD_C1_10VDD_C1_11VDD_C1_12VDD_C1_13VDD_C1_14VDD_C1_15VDD_C1_16VDD_C1_17VDD_C1_18VDD_C1_19VDD_C1_20VDD_C1_21VDD_C1_22VDD_C1_23VDD_C1_24
VDD_C2_1VDD_C2_2VDD_C2_3
VDD_MDDI
VDD_P1_1VDD_P1_2VDD_P1_3VDD_P1_4VDD_P1_5VDD_P1_6
VDD_P2_1VDD_P2_2VDD_P2_3
VDD_P3_1VDD_P3_2VDD_P3_3VDD_P3_4VDD_P3_5VDD_P3_6
VDD_P4_1VDD_P4_2
VDD_P7_1VDD_P7_2
C408
1n
1n
C404
024C
u1.0R401 I
ND
C409
0.1u
C403
0.1u
VREG_MSME_1.8V
0.1u
C407C406
0.1u2.2u
C405
534C
n1
034C
n1
334C
n01
924C
n01
434C
u1.0
234C
u1.0
524C
n01
824C
u 1.0
624C
n1
224C
n1
814C
n1
51 4C
n01
424C
u1.0
324C
u1.0
914C
u1 .0
614C
u 1. 0
414C
n1
21 4C
n1
314C
n0 1
u2 20 14
C
114C
n 01
L
K
J
I
H
G
F
E
D
C
B
A
12 11 10 9 8 7 6 5 4 3 2 1
L
K
J
I
H
G
F
E
D
C
B
A
12 11 10 9 8 7 6 5 4 3 2 1
C401 0.1u
C400 0.1u
u01714
C
134C
u01
VREG_MSME_1.8V|VSNS_MSME_1.8V
VREG_MSMC2_1.25V|VSNS_MSMC2_1.25V
IBS
S_5
82
6RT
R
PM
AR_
AP_
MS
G
JD
A_
OL
_K
RT
SDRAM_CKE1
KLC
SY
S_H
BS
U
nSDRAM_CS0
SDRAM_DATA[16]
SDRAM_DATA[0]SDRAM_DATA[1]SDRAM_DATA[2]SDRAM_DATA[3]SDRAM_DATA[4]SDRAM_DATA[5]SDRAM_DATA[6]SDRAM_DATA[7]SDRAM_DATA[8]SDRAM_DATA[9]SDRAM_DATA[10]SDRAM_DATA[11]
]21
[A
TAD
_M
AR
DS
SDRAM_DATA[12]SDRAM_DATA[13]SDRAM_DATA[14]
]51[AT
AD_
MA
RD
S
SDRAM_DATA[15]
SDRAM_DATA[17]
]8
1[A
TAD
_M
AR
DS
SDRAM_DATA[18]SDRAM_DATA[19]SDRAM_DATA[20]SDRAM_DATA[21]SDRAM_DATA[22]SDRAM_DATA[23]SDRAM_DATA[24]
]52
[A
TAD
_M
AR
DS
SDRAM_DATA[25]SDRAM_DATA[26]SDRAM_DATA[27]SDRAM_DATA[28]SDRAM_DATA[29]SDRAM_DATA[30]SDRAM_DATA[31]
SDRAM_ADDR[0]SDRAM_ADDR[1]
SDRAM_ADDR[10]SDRAM_ADDR[11]SDRAM_ADDR[12]
SDRAM_ADDR[2]SDRAM_ADDR[3]SDRAM_ADDR[4]SDRAM_ADDR[5]SDRAM_ADDR[6]SDRAM_ADDR[7]SDRAM_ADDR[8]SDRAM_ADDR[9]
SDRAM_BA0SDRAM_BA1
nSDRAM_CAS
SDRAM_DCLK0SDRAM_DCLK1
SDRAM_DQM0SDRAM_DQM1SDRAM_DQM2SDRAM_DQM3SDRAM_DQS0SDRAM_DQS1SDRAM_DQS2SDRAM_DQS3
nSDRAM_RASnSDRAM_WE
NAND_FLASH_READY
nNAND_FLASH_CS
EBI2_DATA[0]EBI2_DATA[1]
EBI2_DATA[10]EBI2_DATA[11]EBI2_DATA[12]EBI2_DATA[13]EBI2_DATA[14]EBI2_DATA[15]
EBI2_DATA[2]EBI2_DATA[3]EBI2_DATA[4]EBI2_DATA[5]EBI2_DATA[6]EBI2_DATA[7]EBI2_DATA[8]
]9
[A
TAD
_2
IBE
EBI2_DATA[9]
nRESETOUT
SDRAM_ADDR[13]
VREG_MSMC1_1.25V|VSNS_MSMC1_1.25V
nSDRAM_CS1 SDRAM_CS1_N_4G
SDRAM_CS1_N_4G
SDRAM_CKE1_4G
SDRAM_CKE1_4G
nNAND_LB
nNAND_OE
nNAND_UBnNAND_WE
SDRAM_CKE0
MD_
HB
SU
PD_
HB
SU
For Artwork
For Artwork
DDR SDRAMNAND 4G / SDRAM 2G
2cs only
2cs only
80
61
80
61
80
61
80
61
chip sel1 + clk1 Should be NC 4G/4G
MSM7227 Power Part
Cap for MSM7227 Power
Hynixu22
>- u0
1
D.v
eR
AF
F8
06
1
- 162 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
7. CIRCUIT DIAGRAM
R514
10
VREG_HPVDD_1.8V
C531100u
MAX14528
U503
EUSY0374601
96
53
4
82
71IN1 OUT1
IN2 OUT2
IC1
OVLO IC2
DN
G
DN
GP
22p
C561
HS_MIC_BIAS
C562
1u
EUSY0407201
U500
5
3 24 1
VOUTVINGNDSTBY
DN
GP
USB_3.3V
HS_MIC_BIAS_TEMP
1u
C571
C502
1n
+VPWR
4.7uL504
L503 4.7u
4.7uL502
K051
205R
VREG_MSMP_2.6V
2.2u C535
VREG_MSME_1.8V
R504
47K
VREG_LCD_1.8V
C546
1u
SC500
1
104DZ
C507 DNI
L501 4.7u
C528
4.7u
DNI C536
K1
305R
4.7K
R531
DNIC508
C516
1u
+VPWR
CM315_12_5PF
X50032.768KHz 2
1
0.1uC549
VREG_MSME_1.8V
10uC519
C5402.2u
VREG_TOUCH_3.0V
VREG_RF_2.7V
M_
SNS
I
U501
EUSY0342201
PM75409J
8J
7J
6J
5J
9H
8H
7H
6H
5H
9G
8G
7G
6G
5G
9F
8F
7F
6F
5F
9E
8E
7E
6E
5E
H1
E10F1
F10E1
C12N2
B1
M12B2
K7
A5
N13A4
M13B5
B4
G10A7
D9A6
H12B7
B6
C13
A13D10
A12K10
H10
G12J10
G1
M1K4
D13J4
E12H4
N11M2
A3L2
A10H2
A8
H13K2
G13J2
A11G4
K13F4
E13D5
B13B3
A9M5
N12N3
J13N1
A2M3
K6
M4K5
N4K9
M9K8
N10M11
M6L12
N6A1
M8D4
N8B12
J1D8
K1N5
M7
2G
21D
7D
8B
01M
6D
9B
21J
31F
21F
21K
7N
9N
01B
31L
11B
2F
4E
2C
1C
1D
1L
2D
2E
GH
CV
N_LTC_
GH
C
SU
BV_
BS
U
N_LTC_
BS
U
P_S
NSI
M_S
NSI
N_ TEF _T
AB
TA
BV
NIO
CV
PU
KC
AB_
V
AN
A_D
DV
E_1C_
DD
V
AP_2
C_D
DV
2P
G_D
DV
6P
G_D
DV
2E
MS
M_D
DV
PM
SM_
DD
V
1FR_
DD
V
2FR_
DD
V
MIU
R_D
DV
RK
PS_L_
DD
V
RK
PS_
R_D
DV
OX
CT_D
DV
NAL
W_D
DV
MPP_1
MPP_2 VSW_5V
MPP_3 VREG_5V
MPP_4 VSW_MSMC1
MPP_5 VREG_MSMC1
MPP_6 VSW_MSMC2
MPP_7 VREG_MSMC2
MPP_8 VSW_MSME
MPP_9 VREG_MSME
MPP_10 VSW_PA
MPP_11 VREG_PA
MPP_12
MPP_13 VREG_GP1
MPP_14 VREG_GP2
MPP_15 VREG_GP3
MPP_16 VREG_GP4
MPP_17 VREF_GP5
MPP_18 VREG_GP6
MPP_19 VREG_MMC
MPP_20 VREG_MSMA
MPP_21 VREG_MSME2
MPP_22 VREG_MSMP
VREG_RFRX1
USB_ID VREG_RFRX2
USB_D_P VREG_RFTX
USB_D_M VREG_RUIM1
USB_OE_N VREG_SYNT
USB_DAT VREG_TCXO
USB_SE0 VREG_USB
VREG_WLAN
SBST MIC_BIAS
SBCK
SBDT_SSBI REF_ISET
MSM_INT_N REG_GND
REF_BYP
SPKR_IN_L_M
SPKR_IN_L_P TCXO_IN
SPKR_OUT_L_M TCXO_EN
SPKR_OUT_L_P TCXO_OUT
SPKR_IN_R_P
SPKR_IN_R_M XTAL_IN
SPKR_OUT_R_P XTAL_OUT
SPKR_OUT_R_M
SLEEP_CLK
VIDEO_IN AMUX_OUT
VIDEO_OUT
VIB_DRV_N KPD_PWR_N
KPD_DRV_N PON_RESET_N
LCD_DRV_N PS_HOLD
FLSH_DRV_N
1D
NG
2D
NG
3D
NG
4D
NG
5D
NG
6D
NG
7D
NG
8D
NG
9D
NG
01D
NG
11D
NG
21D
NG
31D
NG
41D
NG
51D
NG
61D
NG
71D
NG
81D
NG
91D
NG
02D
NG
12D
NG
22D
NG
32D
NG
42D
NG
52D
NG
121KR509
D501
0.1uC514
CN501
11
10
9
5
4
3
2
1
8
7
6
1nC517
22pC515
VREG_TCXO_2.85V
C513 0.1u
C512 0.1u
10 5R10K
0.1u
C534
51R510
1n
C524
2.2uC537
C568
33p
2.2uC539
C521
1n
C569
10n
C5442.2u
VBATT
KQ03LV-3R
ENZY0030401
CN500
3
2
1
D1
D2
0.1u
C560
C53210n
VREG_MSMC1_1.25V
10K
R520
VCHG_VBUS
u 0014 55
C
R515
200K
VCHG_VBUS
VBATT
Q500 NUS5530MN
EQFP0008601
56473829110
DRAIN_B
NC1 COLLECTOR_B
COLLECTOR EMITTER
SOURCE BASE
DRAIN NC2
GATE
1n
C523
1.0
605R
0.1u
C555
VREG_MSMP_2.6V
715R
K6.08
VREG_MSMP_2.6V
1nC518
0.1uC511
VREG_RUIM_3.0V
2.2uC509
C526
4.7u
C5472.2u
C5382.2u
0.1uC510
VREG_MSMA_2.6V
+VPWR
TP503
2.2K
R523
VCHG_VBUS
0.1uC559
4.7u
C527
1u
C548
VREG_MSMC2_1.25V
VREG_SMPS_2.1V
C522
1n
1u
C545
EUSY0372001
TS5USBA33402YZPR
U504
4B
D2
B2
A1 A2
B3
C2
A4
C1
A3 D1
E4
D3 D4
E3
E2 C3
E1 C4
1B
YLP
PU
SV
UART_TXVBUS
UART_RXDM
DP
USB_DMID
USB_DP
AUDIO_LR2_2K
AUDIO_R
MIC
DSS
_INT
SDACLDO
SCL
GNDTE
SI
10u
C520
4.7K
425R
BAT500
ZD502
VREG_MSMP_2.6V
4.7uC542
0.1uC506R500
4.7
22u
C525
C5432.2u
VREG_MMC_3.0V
TP502
0.1uC505
4.7uC541
0.1uC504
C503 0.1u
C500 22p
C501 0.1u
VREG_AUX2_2.9V
VREG_MOTION_3.0VVREG_LCD_2.8V
C570
33p
C566
1uTP501
035R
K00 3VBATT
VCHG_VBUS
22p
C564
FL500
IN OUT
GND1 GND2
0.1u
C556
R505
1K
470K
R516
K086
125R
D500
+VPWR
L500
2.2u
+VPWR_AUDIO
10uC530
1nC529
VREG_MSMP_2.6V
2.2K
625R
2.2K
525R
USIM_CLK
USIM_DATA
KEY_LED_DRV_N
SLEEP_CLK
REMOTE_PWR_ON
TCXO_PM_19.2MHZ
PS_HOLD
PM_INT_N
GSM_PA_DAC_REF
AMUX_OUT
PMIC_TCXOTCXO_EN
PMIC_SSBI
PM_ON_SW
JTAG_PS_HOLD
VBACK_UP
PU_
KC
AB
V
USB_LDO_EN
USB_LDO_EN
PCB_REVISION
PCB_REVISION
CHG_CTL_N
N_LTC_
GH
C
BATT_FET_N
N_TEF_TT
AB
ISNS_P
P_S
NSI
VBAT_TEMP
VBAT_TEMP
USB_ID
USB_ID
USB_DM
USB_DM
USB_DP
USB_DP
MUIC_INT
VSNS_MSME_1.8V
VSNS_MSMC2_1.25V
nPON_RST
VSNS_MSMC1_1.25V
VBAT_SENSE
VBAT_SENSE
USBH_DMUSBH_DP
MUIC_I2C_SDA
MUIC_I2C_SCL
USIM_RST
UART_TXUART_RX
MSM_USIM_CLK
MSM_USIM_RST
MSM_USIM_DATA
RW
PV+
+VPWR
OVPchange circuit at REV B
1.30V
close to MSM
USB 3.3V LDO
150K
150K
150K
ADC
150K
TEST&E
150K
0.5mm
R2
2.13V
10K
68K
47K
150K
150K
Place crystal and load caps close to PM7540
REV
1.93V
C&H
B&G
1%
Local Ground Plan
PM7540
Place in PM7540 room at shield edge
A&F
Rev.1.1
150K
150K
PCB Revision Check ADC
Route together
0.16V
Rev.1.0
D&I
0.6mm
Rev.1.2 680K
0.81V
0.6mm
These CAPs close to inductors100K
1.73V
0.62V
300K
R1
0.6mm
1.04V
430K
Route together
Place close to PM7540 pins
BACK-UP BATTERY
2mm
Battery Conn.
MicroUSB
MUIC
2mm
PMIC
1608
close to each other
mm
5.
0 9
N ,
7N
0.3mm 0.3mm
2mm
1608
Charging IC
10V
2mm1%ISNS_M
L
K
J
I
H
G
F
E
D
C
B
A
12 11 10 9 8 7 6 5 4 3 2 1
L
K
J
I
H
G
F
E
D
C
B
A
12 11 10 9 8 7 6 5 4 3 2 1
- 163 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
7. CIRCUIT DIAGRAM
TP602
R630
47CN600
2
10
26C
u2
.2
U600
3D
1C
2E
2A
C2
B2
B4
A4
B3
E1
A3
D1
A1
C3
B1
E4
E3C4
4D
2D
DD
VP
H
DD
VP
S
IN3- OUT+
OUT-
HPL
IN3+
HPR
CP
IN1+
CN
IN1-
IN2+
IN2-
SDA
SCL
SAI
B
DD
VP
C
SS
VP
C
DN
G
C639
10u
C636
0.1u
HS_MIC_BIAS_TEMP
0.1u
C605
u2
.2
126
C
2.2uC614
u2
.2
22
6C
10u
C604
+VPWR_AUDIO
C603
2.2u
VREG_HPVDD_1.8V
33nC613
R628
DNI
U604
12
11
10
9
5
4
6
37
28
1D
DV
D
GE
RV
AD
NG
SD
NG
DD
VA
ADDR
SCL
NC1
TN
I
VPP
DRDY
SDA
R6231K
L
K
J
I
H
G
F
E
D
C
B
A
12 11 10 9 8 7 6 5 4 3 2 1
L
K
J
I
H
G
F
E
D
C
B
A
12 11 10 9 8 7 6 5 4 3 2 1
R610 K7.4
R609 K7.4
VREG_MSMP_2.6V
206R
IND
C634
0.1u
C637
DNI
MIC600
4
3
2
1P
G1
G2
O
VA603
C601
33nC612
VA604
DNI
Q601
C
B
E
FB601 600
506R
K2.2
OJ601
R629 47K
OJ600
VA602
FB602 600
HS_MIC_BIAS
100KR627
R613
100KU601
B2C1
A1B1
B3C2
A3C3IN- VDD
IN+ VO+
_SHUTDOWN VO-
BYPASS GND
1800FB606
TP600
R619 K2.2
R620 K2.2
VREG_MOTOR_3.3V
C617
33p
C627
10n
C608
1n
C624
10u
VREG_MOTION_3.0V
U603
61
7 6
5
4
8
3
9
2
10
1
11
12
13
41 512
DE
VR
ES
ER
DD
V
GND3
GND2
INT1
VDD_IO
RESERVED1
NC1
INT2
NC2
SC
SCL_SPC
GND1
OD
S_ID
S_A
DS
0A
S_O
DS
4D
NG
C623
0.1u
1800FB600
VREG_MSMP_2.6V
2.2u
C606
1800FB603
C607
33p
C615
47p
C633
0.1u
1n
C618
SC600
1
VREG_MOTOR_3.3V
C638
0.1u
R622
4.7K 51K
R624
VREG_MOTION_3.0V
216R
K01
TP601
R617
2.2K
VREG_MSMP_2.6V
C628
470n
R618
2.2K
R626
1K
470nC611C610 470n
10R608
C635 10n
51K
R625
C609
1n
L602
1.2n
10R607
VB600
2
1
VA605
DNI
L601
1.2n
J600
2
3
4
5
6
1 M5
M4
M3
M4F
M1
M6
116R
K01
FB605 1800
Q600
D
G
S
006D
206D
306D
C616
47p
106D
406R
M1
C619
22p
406D
270n
L600
VREG_MSMP_2.6V
1800FB604
306R
K1
606R
K001
MIC_1P
RCV_NRCV_P
HPH_RHPH_L
AUDIO_I2C_SCLAUDIO_I2C_SDA
SPK_RCV-
SPK_RCV-
SPK_RCV+
SPK_RCV+
MOTION_I2C_SDA
MOTION_I2C_SCLCOMPASS_DRDY
LIN_PWM_FREQMOTION_INT
MOTOR_N
MOTOR_NMOTOR_P
MOTOR_P
EAR_SENSE
EAR_L
EAR_LEAR_R
EAR_R
MIC_1N
LINE_ONLINE_OP
MIC_BIAS
EARMIC_P
+VPWR_AUDIO
COMPASS_I2C_SDA
COMPASS_I2C_SCL
HOOK_ADC
FM_ANTSPEAKER
MICAudio SUB SYSTEM
Close to SPK Pad
Acceleration SensorMust Check Schematic
1%
(Q-Coin)
3.5pi EAR JACK
1%
MOTORDigital Compass
1%
Q-coin MOTOR
1%
1%
1%
HIGH
LOW(DEFAULT)
STATE
UNMATING
EAR_SENSE
MATING
ENJE0008001
- 164 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
7. CIRCUIT DIAGRAM
VREG_LCD_1.8V
FL702
15pF 015
64
73
82
91INOUT_A1 INOUT_B1
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
1G
2G
FL705ICVE10184E070R101FR
7.5pF
0 1 5
6 4
7 3
8 2
9 1INOUT_A1INOUT_B1
INOUT_A2INOUT_B2
INOUT_A3INOUT_B3
INOUT_A4INOUT_B4
1G
2G
U701 EUSY0391601
NLSV1T244MUTBG
43
52
61VCCA VCCB
A B
GND OE_
FL707 SFEY0011401
7.5pF
015
64
73
82
91INOUT_A1 INOUT_B1
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
1G
2G
7.5pF
ICVE10184E070R101FR FL706
01 5
6 4
7 3
8 2
9 1INOUT_A1INOUT_B1
INOUT_A2INOUT_B2
INOUT_A3INOUT_B3
INOUT_A4INOUT_B4
1G
2G
C713
2.2u 4.7u
C714
GB042-24S-H10-E3000CN702
ENBY0034201
1312
1411
1510
169
178
187
196
205
214
223
232
241
u2.2607
C
1R706
407R
K2.2
507R
K2.2CAM_IOVDD_2.6V
C715
DNI
C712
2.2u
307AV
407AV
107AV
207AV
CAM_IOVDD_2.6V
15pF
FL701
015
64
73
82
91INOUT_A1 INOUT_B1
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
1G
2G
u2.2807
C
FB700
120
15pF
ICVE10184E150R101FRFL704
015
64
73
82
91INOUT_A1 INOUT_B1
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
1G
2G
CAM_DVDD_1.8V
1uC702
R700 K7.4
C705
2.2u
C703
2.2u
FL703 SFEY0010501
15pF 015
64
73
82
91INOUT_A1 INOUT_B1
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
1G
2G
GB042-40S-H10-E3000ENBY0036001
CN700
2120
2219
2318
2417
2516
2615
2714
2813
2912
3011
3110
329
338
347
356
365
374
383
392
401
VREG_LCD_1.8V
FL700
15pF 015
64
73
82
91INOUT_A1 INOUT_B1
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
1G
2G
u2.2907
C
u2.2707
C
VA700
L
K
J
I
H
G
F
E
D
C
B
A
12 11 10 9 8 7 6 5 4 3 2 1
L
K
J
I
H
G
F
E
D
C
B
A
12 11 10 9 8 7 6 5 4 3 2 1
GB042-10S-H10-E3000ENBY0051001
CN701
65
74
83
92
101
VREG_LCD_2.8V
1uC710
1u
C700
2.2u
C711
307R
K001
+VPWR
2.2uC704
U700
EUSY0378001
AAT2862
52
02
6
114
8
3
9
105
16
17
18
19
15
14
13
1223
17
12
22
422
+2C
+1C
-1C
-2C
IN1 OUT
IN2 BL1
BL2
BL3
BL4
BL5
BL6
BL7_AUX1
BL8_AUX2
EN LDOA
LDOB
SDA
LDOC
SCL LDOD
DN
GA
DN
GP
PE
CAM_AVDD_2.7V
VREG_MOTOR_3.3V
1uC701
VREG_TOUCH_3.0VVREG_MSMP_2.6V
607AV
707AV
R702
100
507AV
K7.4
807R
707R
K7.4
VREG_MSMP_2.6VVREG_LCD_1.8V
CAM_AVDD_2.7V
CAM_IOVDD_2.6V
CAM_DVDD_1.8V
R701 K7.4
VREG_MSMP_2.6V
TP700
017R
K001
TOUCH_INT
CAM_PCLK
CAM_MCLK
CAM_VSYNCCAM_HSYNC
CAM_DATA[7]CAM_DATA[6]CAM_DATA[5]CAM_DATA[4]
CAM_DATA[3]CAM_DATA[2]CAM_DATA[1]CAM_DATA[0]
LCD_BL_I2C_SDA
LCD_BL_I2C_SCL
CAM_PWDN
CAM_RESET_N
LCD_RESET_N
CAM_I2C_SDA
CAM_I2C_SCL
LCD_BL_EN
TOUCH_I2C_SCL
TOUCH_I2C_SDA
EBI2_DATA[0]EBI2_DATA[1]
EBI2_DATA[10]EBI2_DATA[11]
EBI2_DATA[12]EBI2_DATA[13]EBI2_DATA[14]EBI2_DATA[15]
EBI2_DATA[2]EBI2_DATA[3]
EBI2_DATA[4]EBI2_DATA[5]EBI2_DATA[6]EBI2_DATA[7]
EBI2_DATA[8]EBI2_DATA[9]
nNAND_OE
nNAND_WE
CAM_HSYNC_F
CAM_HSYNC_F
CAM_VSYNC_F
CAM_VSYNC_F
WLED_PWR
WLED_PWR
CAM_DATA[0]_F
CAM_DATA[0]_F
CAM_DATA[1]_F
CAM_DATA[1]_F
CAM_DATA[2]_F
CAM_DATA[2]_F
CAM_DATA[3]_F
CAM_DATA[3]_F
CAM_DATA[4]_F
CAM_DATA[4]_F
CAM_DATA[5]_F
CAM_DATA[5]_F
CAM_DATA[6]_F
CAM_DATA[6]_F
CAM_DATA[7]_F
CAM_DATA[7]_F
MLED[2]
MLED[2]
MLED[3]
MLED[3] MLED[1]
MLED[1]
MLED[4]
MLED[4]
MLED[5]
MLED[5]
CAM_PCLK_F
CAM_PCLK_F
LCD_RSLCD_CS
LCD_VSYNC_OLCD_VSYNC_LS
LCD_VSYNC_LS
LCD_MAKERID_HIGH
LCD Filter(EMI 100 ohm, 15pF)
Backlight Charge Pump
7.0x7.0x4.1tTouch
Camera Filter(EMI 100 ohm, 7.5pF)
Maker IF
3M MAIN CAMERA FF
Maker ID
TOVIS H H
2.8" QVGA LCD
- 165 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
7. CIRCUIT DIAGRAM
CN800
4
3
2
1
C802
0.1u
J800
VCC1
GND14
RST2
VPP5
CLK3
IO6
GND27
GND510
GND38
GND49
VREG_RUIM_3.0V
EDTY0009801
D802
43
52
61
K1.5
608R
VREG_RUIM_3.0V
R804 K74
R810 100R811 100R813 100
ZD805ZD803
C804
33p
VA800
VA801
KB801
C801
33p
R809
100
R808
100
VREG_MMC_3.0V
VREG_MSMP_2.6V
R803 K74
R816 100
R814
100K
1UFC806
R812 100
ZD801
R802 K74
ZD800
R801 K74
718R
15
1u
C805
ZD802
C803
33p
S800
ENSY0023601
168
7
6
5
4
3
2
1 15
G5 G3 G1 CD
C1
C2
C3
C4
C5
C6
C7
C8
G6 G4 G2 COM
G7
LD801
EDLH0005901LEWW-S14
008R
K0 22
C800
33p
LD800
L
K
J
I
H
G
F
E
D
C
B
A
12 11 10 9 8 7 6 5 4 3 2 1
L
K
J
I
H
G
F
E
D
C
B
A
12 11 10 9 8 7 6 5 4 3 2 1
+VPWR
KB800
D80043
52
61
R805 K74
D801 43
52
61
1708
R
SD_MMC_CLK
SD_MMC_CMD
SD_MMC_DATA[0]SD_MMC_DATA[1]
SD_MMC_DATA[2]SD_MMC_DATA[3]
USIM_CLK
USIM_CLK
USIM_DATA
USIM_DATA
SD_MMC_DET
KEY_LED_DRV_N
PM_ON_SW
GND
KEY_ROW[1] KEY_ROW[0]
USIM_RST
USIM_RST
KEY_COL[0]
KEY_COL[1]
KEY_COL[1]
+VPWR
4KEY LED LIGHTING
VOL_UP
VOL_DOWN
USIM SocketMicroSD
VOLUME KEY
1608 TOP VIEW LED
POWER KEY SEND/END KEYSEND
END
VOL_UP
SEND
ROW[1]
ROW[0]
VOL_DOWN
COL[1]COL[0]
Micro SD_DETECT_N
Low(Detected)
High
S/W
Close
Open
8. BGA PIN MAP
- 166 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
8. BGA PIN MAP
MCP
8. BGA PIN MAP
8. BGA PIN MAP
- 167 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
MSM7227
8. BGA PIN MAP
- 168 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
RTR6285(Top View)
8. BGA PIN MAP
- 169 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
PM7540(PMIC)
- 170 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
9. PCB LAYOUT
108
AV
305
R
KB801
308
DZ
218
R
4 18
R
615
C
BAT500
KB800
LD800
MIC600
FB600206
R
C601
LD801
618
R
508
DZ
9. PCB LAYOUT
LG-P350_MAIN_SPFY0246001_1.1_TOP
BAT500 : Backup Battery-RTC reset
MIC600 : Microphone- no far-end voice- no voice recording
- 171 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
9. PCB LAYOUT
14
JTD
RG
A
D
60 1
5
HGFEDCB
1
K
TRPNML
JA
C
B
D
E
1 4
1
24
01A CB
721
CBA
12
13
HGFED
K L M N P RJHGFE
13
M
C
L PNMK
FAU V W Y AA
BA CA
DA
EA
N
D
H
G
F
E
L
K
J
A
B
1
4
CB
1204
E
87
41
02
U300
S800
U1000
ZD401
415
R
006
NC
C633L201
302
C
J800
R623
C221R624
R613
C235
0001
TN
A
100 1
TN
A
406
C2 1
3C
2 40 1
L
FL706
R402
TP404
316
C30
8C
C802
C406
104
C21
4C
108
C71
3C
813
C
C411
3001
LF97
0 1C
7101
R81
01R
6 101
R
C549
C1106
C607
R605
904
C
R706
U401
435
C30
5C
835
C
U501
C511
C541
R509
C301
C308
015
RFL1004
FL1007
L1037
C1049
FL700
FL704
R300
7101
L
L1030
C639
FL703
714
C
D501R400
075
C
R502
R317
C327
FL500
005
D
R817
2701
C
C1073
C1051
C1050
C1032
L1014
ANT1002
ANT1003
105
NC
VA800
C805
6501
C
C1034
C1036
C1028
715
R
302
R8 4
2C
025
R
5 55
C
502
C
3 02
BF
455
C
ANT200
ANT201
7 12
C
002 L
F
2 02 L
812
C
008
NC
C227
C223
U202
C220C219
202
C
402
C
C200
R201002
X
C247
C209
C207
108
DZ
R811
008
DZ
208
DZ
C246
R810
318
R
125
R
6 55
C
615
R
2 26
R
622
C
4 22
C
0 02
R
Q601902L
L205
222
C
626
R
U200
C244
C245
U201
922
CC213
C230
402
BF
C225
232
C
C208
C206
TP302TP303
508
R
D800
308
R
008
R
408
R
400 1
TN
A
U601
VB600
726
R
002
BF
102
C
412
C
212
C
932
CCN500
1401
L
C634
206L
406
AV
506
AV
106L
012
CR625
202
BF
102
B F
536
C60
2L
C238
702L
732
C
C233
432
C63
2C
8 22
C
132
C
802L
112
C
C242C243
042
C14
2C
TP306
TP301 TP305
TP307
108
R
D801
208
R
608
C
R704 VA702
106
BF
206
BF
226
C3 0
6C
7 801
C
5801
C
480 1
C620 1
L
070 1
C
0401
L
VA603
R705 VA701
FB700
VA703
C714
VA704
VA602
C609C636 C608
FL705
416
C12
6C
U600
R405
216
C
R610
R609
016
C
R401
116
C
026
C
TP402
R404R403
C1091
6801
C
5001
LF
520 1
L
0 901
C
2901
C
4 90 1
C
U1002
C1069
1701
C
7901
C
L1032
L1033
R1001
806
R20
8D 4 0
8C
C314
515
C
C303
005
X
C320C546
U1001
C1018R1002
R1000
CN702
C711
C402 C405
304P
T
506
C70
6R
R806
124
C00
8C
C424
703
R
034
C
R308
D301
C315
C316
824
C
C431
503
C
913
C
7 24
C
C311
924
CC415
C313
915
C
005
C
403
C
C502
605
C
C544
C539
C501
U500
405
C
715
C
4 05
R
C545745
C
C513
C535
665
C
R311
R310 C514
R807
245
C
C505
R505 C540
103
U
913
R
C310
L1018
703
C2801
C
0801
C
9 03
C
C1078
1201
L
2201
L
C1077
1001
L
C10010001
L
C1042
SW1000
C1004
517
C
C712
916
C54
01C
340 1
C
L1008
606
R
C606
306
D
006L
C713
304
C
224
C
FL707
404
C
524
C
324
C
624
C
504P
T
C521C527
004
C
C523
C525
105L
305L
TP501
015
C
C518
C571 C512
TP502
X300
8801
C
C1083
3201
L
9801
C
C1095
L1036
L1011
C1037
C1039
L1035
C1015
C1046
C1007
L1005
L1002
Q600FB606
R604
D604
516
C
306
BF
116
R
736
C
9 26
R
0 06
D
0 36
R 506
BF
C617
C618 206
D
R603
VA70610
6D
R628 R612
C616
807
R
804
C
704
C
406
BF
707
R
TP401 TP400
425
C
C522
825
C 903
R
C306
C526
205L
405L
C508
C507 C537C548
C300
U302
C324
C323
523
C
313
RR303
C1031
C1105
9301
L
4201
L
C1104
C1022
C1052
3101
L
210 1
L
C1038
L1015
C10330101
L
C1040
1001
LF
9001
L
C1010
0001
LF
3001
L
7001
L
C1003
C1021
6001
L
4001
L
C1016
TP601
U604
716
R
C628816
R
726
C
J600
014
C
005
R
025
C
405
U30
5U
6 05
R
Q500
C1067
0201
C
R1009 8001
R
3001
R
TP602
U1003
R1020
4301
L72
01L
C1101
VA705 C703
L1038
707
AV
C707
C708
C706
C709
326
C
TP600
426
C
U603
FL702
FL701
R304
C433
C414
R305
U701
D300
TP300
C413
R316
C418
C435
R524
R306
R525
C432
R526
C420
C416
C434
C419
413
R
203
C
635
C
305P
T
C328
035
R
203
R R318
105
R
955
C
905
C
135
R
005 L 96
5C
035
C
C568
C529
C531
C532
L1016
C1074
C1068
C1075
FL100267
01C
R1022
R1014
9101
C
5101
R
1201
R
C1061
0601
C
2101
C
9201
C
6001
C
4401
C
R1006
9201
L
9901
C
910 1
R91
6R
R315
265
C91
01L
R1005
L1028
6901
C
FL1006
0011
C
007
R
C704307
R
107
R
1 07
C20
7C
U700
836
C02
6R
C322
017
R
C321
R312
007
C
103
R5 1
5R
205
DZ46
5C
3 25
R
C560
C561
908
R80
8R
C1047
R1012
C1048
1801
C
C10659501
C C1066
1101
C
C1064
8001
C
7101
C
R1004
C1005
C1057
C1014
003
NC
507
C
007
AV
207
R
0 17
C
010 1
R
1 07
NC
TP700
007
NC
550 1
C
345
C
C1054
C1053
1101
R
C1024
C1063
5201
C
C1013
C1009
C1026
C1027
R1007
C1023
C1058
3101
R
C1030
J600 : 3.5pi Ear-Jack- no Sound
CN701 : Touch Connector - no touch sensing
U700 : ChargePump- no LCD backlight
U401 : Memory- no Booting
U603 : Acceleration Sensor- Can not detect motion
CN700 : LCD Conn.- no Display
U300 : DBB- no Power On- no Servive
U504 : MUIC- no Booting- no USB/Serial Connection
CN501 : I/O conn.- no USB Connection.- no Serial Connection.
Q500 : Charging IC- no Battery Charge
U1000 : Transceiver- no Service- RF Sensitivity & TX Power
U1001 : Tx module (GSM PAM + ASM)- no Service- RF Sensitivity & TX Power
U604 : Compass Sensor -Can not detect direction
CN702 : 3M Camera Connector- no Camera
U601: Motor Driver IC- Can not operate vibrator
U201 : WiFi+BT+FM Radio Module-no WiFi Connection -no BT Connection-no FM Radio
U600 : Audio AMP Sub System & Signal Distributor
- no Sound
J800 : SIM Conn.- No SIM
U501 : PMIC- no Booting- no Power On- no Service
X300 : 19.2Mhz X-tal- no Power On- no Service
U1002 : PAM- no Service- RF Sensitivity & TX Power
S800 : micro-SD socket- Can not use a micro-SD
CN500 : Battery Conn.- no power On
LG-P350_MAIN_SPFY0246001_1.1_BOT
10. CALIBRATION
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LGE Internal Use Only
10. CALIBRATION
1. Calibration
1. CALIBRATION
10.1 General Description This document describes how to install and use the RF calibration software(Tachyon) of LG 3G mobile phone with Qualcomm Chipsets.
10.2 Requirement
Requirements for RF calibration of LGE mobile phone are outlined in the following sections. 10.2.1 Hardware
1) Desktop or laptop computer 2) Agilent 8960 Series 10 (E5515C) Testset 3) GPIB card and cable for communicating with Agilent 8960 Series 10 Testset 4) Power Supply, or 4V battery, and power cable for putting power on the mobile phone. 5) Data(USB or UART) cables for connecting the mobile phone to computer’s serial port 6) RF cable 10.2.2 driver
1) National Instruments GPIB & VISA driver 2) LGE mobile USB driver 3) Data cable driver(optional) 10.2.3 System
1) Windows XP SP2 or better 2) RAM 512M or grater 3) HDD 1GB of available space
10. CALIBRATION
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10.3 Setup for RF calibration
10.4 Tachyon Software Installation 1) Install Tachyon_setup_Eng_20090326.exe to C:/LGE/Tachyon directory.
2) Unzip Tachyon_Release_20101101.zip, and overwrite all files to the same path.
3) Install OCX_Registration.bat for registering Tachyon Components in C:/LGE/Tachyon/OCX/ directory.
GPIB cable
Power supply
10. CALIBRATION
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10.5 Tachyon Start After hardware setup is completed successfully and Tachyon program is installed ordinarily, RF calibration or Auto Test can be start in the following procedure. 1) Execute Tachyon.exe in C:/LGE/Tachyon directory. 2) Click login button in the following login dialog window.
10. CALIBRATION
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3)Click “model selection” button in toolbar for selecting the appropriate model. 4) double click P350/ORF in model tree, and then click ”select” button.
10. CALIBRATION
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5) Click “system option” button in toolbar to connect the mobile phone to the Tachyon.
10. CALIBRATION
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6) Click “run option” button in toolbar for passing over LGE factory setting. 7) Check “PID write” and “Skip previously Phone PID check”
10. CALIBRATION
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8) Execute Hecaton.exe for setting RF cable loss to Agilent 8960. If not, Tachyon can’t run.
9) Click “Calibration+Auto Test” button in Toolbar. Now RF calibration and autotest will start.
For more information, refer to the manual in C:/LGE/Tachyon/Manual folder.
10. CALIBRATION
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10.6 Overview of RF Calibration 10.6.1 Supported entry of RF Calibration
As using RTR6285, P350 adopts some of calibrations in those of RTR6285. This is also supporting two band WCDMA and Quad band GSM. Table 1-1 and Table 1-2 describes the information listed for RF calibration items used by P350.
Table 1-1. The calibration list for WCDMA
Calibration WCDMA 2100 WCDMA 900 description
Tx Sweep Calibration ○ ○ Tx output power measurements
Tx Hdet Calibration ○ ○ HDET ADC measurements vs Tx power
Tx Comp vs Freq Calibration ○ ○ 16-channel Tx output measurements in a certain PDM
Tx Secondary Comp vs Freq Calibration
Irregular Tx power measurements in a certain PDM
Tx Lim vs Freq Calibration ○ ○ HDET ADC measurements in the Target Power
Rx DVGA Gain Offset Calibration ○ ○ Rx DVGA gain measurements
Rx DVGA Gain Offset vs Freq Calibration
○ ○ 16-channel RX DVGA gain measurements
Rx LNA Range Offset Calibration ○ ○ LNA gain offset measurements
Rx LNA Range Offset vs Freq Calibration
○ ○ 16-channel LNA gain offset measurements
Table 1-2. The calibration list for GSM
Calibration GSM900 GSM850 GSM1800 GSM1900 description
VCO Calibration ○ Lowest frequency error- VCO measurement
Thermistor Calibration Thermistor max/min ADC measurement
Tx External Polar Calibration
○ ○ ○ ○ Tx output power measurements
Polar path delay Calibration PM and AM signal path delay
Carrier Suppression Calibration
carrier power measurement
Rx Gain Range Calibration ○ ○ ○ ○ 8 or 16 channel Rx Gain measurements
For more information, refer to RTR6285-RTR6280-RTR6237-RGR1100-MXU6219_NV_ITEMS RevD.pdf (80-VD861-12 Rev. D)
10. CALIBRATION
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10.6.2 Feature of RF calibration
Tachyon configuration is describes in this section. The information indicates the state of the mobile phones will become a factor. WCDMA band
Table 1-3 describes the calibration feature of WCDMA band.
Table 1-3. Feature of Tx/Rx calibration in WCDMA 2100/900 band
Item Sub Item WCDMA 2100 WCDMA 900
Tx 9883 2863 Calibration Channel
Rx 10833 3088
Tx Target Power(dBm) 22.5 22.5
High to low gain 11.0 11.0 PAM gain switching(dBm)
Low to high gain 14.0 14.0
Max 222 227 Calibrated PDM Range
Min 160 134
PDM step 2 3
Measured data of 32 array 26 25
≥ Up threshold 25.0 25.0
High Gain Mode
Threshold of Power Range(dBm) ≤ Low threshold 6.0 6.0
Max 235 255 Calibrated PDM Range
Min 80 69
PDM step 5 6
Measured data of 32 array 27 26
≥ Up threshold 15.0 16.0
Low Gain Mode
Threshold of Power Range(dBm) ≤ Low threshold -55.0 -53.0
≥ Lower limit 16.5 16.5 Allowable power range in HDET range(dBm) ≤ Upper limit 24.5 24.5
≥ Lower limit 50 80 Allowable HDET adc range
≤ Upper limit 160 175
DVGA Calibration Power(dBm) -74.0 -74.0
≥ Lower limit 130 80 DVGA Calibration Range
≤ Upper limit 300 300
Range 0-1 -66.0 -68.0
Range 1-2 -42.0 -50.0
Range 2-3 -26.0 -38.0
LNA Calibration Power(dBm)
Range 3-4 -26.0
10. CALIBRATION
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Quad GSM band
Table 1-4 describes the calibration feature of Quad GSM bands.
Table 1-4. Feature of Tx/Rx calibration in Quad GSM band
Item Sub item GSM 900 GSM 850 GSM 1800 GSM 1900
F1 975 128 512 512 Tx Calibration channel
F2 124 251 885 810
Max 34.0 34.0 31.0 31.0 Power range in AMAM/AMPM NVs
(dBm) Min -20.0 -20.0 -20.0 -20.0
Range 0 -80 -80 -80 -80
Range 1 -80 -80 -80 -80
Range 2 -50 -50 -50 -50
Range 3 -50 -50 -50 -50
Rx Gain Range Calibration Power
(dBm)
Range 4 -50 -50 -50 -50
Range 0 1900/2500 1900/2500 1900/2500 1900/2500
Range 1 1200/2300 1200/2300 1200/2300 1200/2300
Range 2 1300/1900 1300/1900 1300/1900 1300/1900
Range 3 1200/1800 1200/1800 1200/1800 1200/1800
Rx Gain Range Calibration Range
(Lower limit/Upper limit)
Range 4 1100/1700 1100/1700 1100/1700 1100/1700
Tx External Polar calibration
PDM table
13025,1900,1950,2000,2050,2100,2150,2200,2250,2300,2350,2400,2450,2500,2550,2600,2650,2700,2750,2800,2850,2900,2950,3000,3075,3150,3225,3300,3375,3450,3525,3600,3675,3750,3825,3900,3975,4050,4125,4200,4275,4350,4425,4500,4575,4650,4725,4800,4875,4950,5025,5100,5175,5250,5325,5400,5475,5550,5625,5700,5775,5850,5925,6025,6125,6225,6325,6425,6525,6625,6725,6825,6925,7025,7125,7225,7325,7425,7525,7625,7725,7825,7925,8025,8125,8225,8325,8425,8525,8625,8725,8825,8925,9025,9125,9225,9325,9425,9525,9625,9725,9825,9925,10025,10125,10225,10325,10425,10525,10625,10725,10825,10925,11025,11125,11225,11375,11525,11675,11825,11975,12125,12275,12425,12575,12725,12875,13025,13175,13325,13475,13625,13775,13925,14075,14225,14375,14525,14675,14825,14975,15125,15275,15425,15575,15725,15875,16025,16175,16300
10. CALIBRATION
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LGE Internal Use Only
Channels of RF Calibration
Table 1-5 Channel of WCDMA W2100
Tx 9621 9638 9656 9673 9691 9708 9726 9743 9761 9778 9796 9813 9831 9848 9866 9883
W2100 Rx 10571 10588 10606 10623 10641 10658 10676 10693 10711 10728 10746 10763 10781 10798 10816 10833
W900 Tx
2712 2722 2733 2743 2754 2765 2776 2787 2796 2806 2815 2825 2834 2844 2853 2863
W900 Rx
2937 2947 2958 2968 2979 2990 3001 3012 3021 3031 3040 3050 3059 3069 3078 3088
Table 1-5 Channel of GSM850/GSM900
GSM850 12 8 14 5 16 3 180 19 8 215 23 3 251
GSM900 1 31 62 92 12 4 97 5 10 00 10 23
Table 1-7 Channel of GSM/1800/GSM1900
GSM1800 512 537 562 587 612 637 662 687 712 737 762 787 812 837 862 885
GSM1900 512 532 552 572 592 612 632 652 672 692 712 732 752 772 792 810
11. STAND-ALONE TEST
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11. STAND ALONE TEST
Hidden Menu Start
Start shortcut keys: 3845#*350#
Hidden Menu List
Start the desired menu: Menu, click
Version Info
Classified Information representation
11. STAND-ALONE TEST
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Factory Reset
Format SD Card : SD Card Data reset
Factory Reset : Changing the Factory
Delete Userdata : Disabled
Device Test List
Auto All Test :
-> Auto All Test menu click
-> Continuous information on the menu, giving you
ability test
Auto All Test Result
Auto All Test Result
-> From the factory with the ability to view the results
screen
11. STAND-ALONE TEST
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Device Test ListAuto All Test : Device functionality testing at the factory to useAuto All Test Result : Test ResultLCD Test : Display test(Color)Proximity Test : Proximity Sensor Vibrator Test : Vibrator testCamera Test : Camera & Cam testSound Test : Sound testRTC Test : Date/Time SettingTouch Test : Display touch testMotion Sensor test : Motion Sensor testExternal Memory Test : SD Card Write testCompass Test : Compass Test GPS Test : GPS Test IRT Test : N/A
LCD Test List
Manual Test : Click on the following screen
Automatic Test : Automatically, without clicking
- White Display
- Black Display
- Red,Green, Blue, White Display
- Red,Green, Blue, White Display �
Vibrator test
A case-by-state vibration tests
11. STAND-ALONE TEST
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Camera test
Menu features disabled
This feature is part of Auto All Test replaced by
-> Auto All Test
-> Camera test
-> Cam test
Sound test
Ring : Ringtone test
Effect Sound :
Message Tone :
Loop Back test : Mic & Speak loop Back test
Audio CAL Tool : Setting
-> Ring menyujung Enabled
RTC test
Date & time : setting
11. STAND-ALONE TEST
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Touch test
Finger Print : Free mode test
Grid Touch Test : Block mode on touch point mode test
Touch Key Test : key test
Grid Touch Color Change
Block Touch Test
Pinch Zoom in/out : Multi touch Test
Touch Information : Read Touch IC & Firmware Version
Motion Sensor test
Motion Sensor test
-> 4 Check the operation of the sensor in the direction
of lean
External Memory Test
SD Card test
-> Write a test check of the SD Card memory
11. STAND-ALONE TEST
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LGE Internal Use Only
Key / Compass Test
SD Card : Check Recognition
SIM Card : Check Recognition
Up/Down key : Check Recognition
End Call key : Check Recognition
Menu key : Check Recognition
Home key : Check Recognition
Back key : Check Recognition
Search key : Check Recognition
Compass test
GPS Test
GPS test : GPS check recognition
ELT Test
Automatic Mode
Manual Mode
11. STAND-ALONE TEST
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ELT Test
Automatic Mode : LCD Automatic on/off test
-> time setting
ELT Manual Test
LCD Backlight
Ringtone
Vibrator
Camera
Audio Loopback
-> test on the device is working
(The ability to use plant)
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LGE Internal Use Only
12. EXPLODED VIEW & REPLACEMENT PART LIST
12. EXPLODED VIEW & REPLACEMENT PART LIST
12.1 EXPLODED VIEW
EBD00
EAJ00 ADV00
SBPL01
ACQ02
MJN03
MCQ00 AKAC00
SUSY00 MAZ01
EAX00
ABM00
SVCY00
MAZ00
ADB00
EAA00
MBJZ01
GMEY00
SUMY00
SJMY00
MJN01
MJN00
MJN02
ACQ00
ACQ01
SAFY04
Location Description
ADV00 Frame Assembly
EAJ00 LCD,Module-TFT
AKAC00 Keypad Assembly,Main
EBD00 Touch Window Assembly
MCQ00 Damper
ACQ00 Cover Assembly,Front
MJN00 Tape,Window
MJN01 Tape
MJN02 Tape,Window
MJN03 Tape,Window
ACQ01 Cover Assembly,Rear
MBJZ01 Button
EAA00 PIFA Antenna,RF
GMEY00 Screw,Machine
SAFY04 PCB Assembly,Main
SVCY00 Camera Module
SUSY00 Speaker,Dual Mode
SJMY00 Motor,DC
EAX00 PCB,Sidekey
ABM00 Can Assembly,Shield
ADB00 Dome Assembly,Metal
MAZ00 Bracket
MAZ01 Bracket
SUMY00 Microphone,Condenser
ACQ02 Cover Assembly,Battery
SBPL01 Rechargeable Battery,Lithium Ion
12. EXPLODED VIEW & REPLACEMENT PART LIST
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LGE Internal Use Only
by SBOM standard on GCSC
Level Location No. Description PartNumber Spec Remark
1 AGQ000000 Phone Assembly - APEY0992409 LGP350.ADEUSV SV:Silver -
2 MEZ002100 Label, Approval MLAA0062316 COMPLEX GU280 OREBK ZZ:Without ColorCOMPLEX, (empty), , , , ,
2 ACQ100400 Cover Assembly,EMS - ACQ85468411 LGP350.ADEUSV SV:Silver -
3 ACQ003400 Cover Assembly,Bar - ACQ85334101 LGP350.APRTZY BK:Black -
4 ADV00 Frame Assembly - ADV73968301 LGP350.APRTZY SV:Silver -
5 MDQ000000 Frame MFEZ0045501 COMPLEX LG-P350 PRT SV:Silver PRESS, STS,
5 MDS000000 Gasket MDS63537101 COMPLEX LGP350.APRTZY ZZ:Without ColorLCD_FRAME
5 MDS000001 Gasket MDS63612601 COMPLEX LGP350.APRTZY ZZ:Without Color LCDFRAME_2
4 EAJ00 LCD, Module-TFT EAJ61771701 LM283DN2A QVGA 2.8INCH 240X320 400CD COLOR70% 4/3 500:1 60Hz Inverter N - TOVIS
4 AKAC00 Keypad Assembly,Main AKAC0025501 LG-P350 PRT SV:Silver -
4 EBD00 Touch WindowAssembly EBD60946001 LGEC59 CAPACITIVE TOUCH F/F MELFAS MCS6000
2.8" B/B - ELK Corporation
4 MEZ000000 Label MLAZ0038303 COMPLEX LG-LC3200 WA:White PRINTING, PPRIPRINTING
4 MCQ00 Damper MCQ66567501 COMPLEX LGP350.APRTZY ZZ:Without Color LCDMODULE
4 MJN061100 Tape, Protect MJN67679701 COMPLEX LGP350.APRTZY ZZ:Without ColorWINDOW
4 MJN061101 Tape, Protect MJN67772801 COMPLEX LGP350.APRTZY ZZ:Without Color tape,protection [bar]
4 ACQ00 Cover Assembly,Front - ACQ85334201 LGP350.APRTZY BK:Black -
5 MDJ000001 Filter MDJ63008601COMPLEX LGP350.APRTZY ZZ:Without ColorFILTER_SPEAKER [SK4350 + PSR0.3T + SK4350 +250MESH + SK4350]
12.2 Replacement Parts Note: This Chapter is used for reference, Part order is ordered
<Mechanic component>
12. EXPLODED VIEW & REPLACEMENT PART LIST
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LGE Internal Use Only
Level Location No. Description PartNumber Spec Remark
5 MDJ000000 Filter MDJ63008501 COMPLEX LGP350.APRTZY ZZ:Without ColorFILTER_MIC [250MESH + SK4350]
5 MCK032700 Cover, Front - MCJK0142601 COMPLEX LG-P350 PRT SV:Silver MOLD, PC LUPOYSC-1004A,
6 MET099500 INSERT, NUT MICE0016907 MECH_COMMON ZY, ZZ, PRESS, STS, , , , ,
5 MJN000001 Tape MJN67681501 COMPLEX LGP350.APRTZY ZZ:Without Color TAPE,KEYPAD
5 MCQ000000 Damper MPBZ0367801 COMPLEX LG-P350 PRT SV:Silver MOLD, UrethaneRubber S195A,
5 MJN00 Tape, Window MJN67681301 COMPLEX LGP350.APRTZY ZZ:Without Color -
5 MJN01 Tape MJN67681401 COMPLEX LGP350.APRTZY ZZ:Without ColorFPCB_TOUCH_PANEL[FD8152N]
5 MHK000000 Sheet MHK63311201 COMPLEX LGP350.APRTZY BK:Black SPEAKERSHEET
5 MEA000000 Guide MGDZ0003001 COMPLEX LG-P350 PRT SV:Silver MOLD, PC LUPOYSC-1004A,
5 MJN02 Tape, Window MJN67679601 COMPLEX LGP350.APRTZY ZZ:Without Color TAPE,WINDOW_BOTTOM
5 MJN03 Tape, Window MJN67694501 COMPLEX LGP350.APRTZY ZZ:Without Color TAPE,WINDOW_TOP
3 ACQ00 Cover Assembly,Rear - ACQ85334301 LGP350.APRTZY SV:Silver -
4 MBJZ01 Button MBJZ0054101 COMPLEX LGP350.APRTZY SV:Silver PC+TPU doublemold
4 EAA00 PIFA Antenna, RF EAA62405902 LS01-I-10084-A0 MULTI -2DB 3:1 Metal Stamping Type -LS Mtron Ltd.
4 MBL000000 Cap MCCZ0052501 COMPLEX LG-P350 PRT BK:Black PC+TPU doublemold
4 MHK000000 Sheet MHK63325901 COMPLEX LGP350.APRTZY ZZ:Without Color MOBILESWITCH
4 MCK063300 Cover, Rear MCJN0134701 MOLD PC LG-P350 PRT SV:Silver PC+GF10% LGCGP2102-EM59
4 MCQ015700 Damper, Connector MCQ66498001 COMPLEX LGP350.APRTZY ZZ:Without Color PSR0.6T + SK4810
4 MCQ015701 Damper, Connector MCQ66498101 COMPLEX LGP350.APRTZY ZZ:Without Color PSR0.6T + SK4810
4 MCQ009400 Damper, Camera MCQ66498201 COMPLEX LGP350.APRTZY ZZ:Without Color -
4 MCQ049800 Damper, Motor MCQ66498301 COMPLEX LGP350.APRTZY ZZ:Without Color -
ACQ01
12. EXPLODED VIEW & REPLACEMENT PART LIST
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LGE Internal Use Only
Level Location No. Description PartNumber Spec Remark
4 MCQ015702 Damper, Connector MCQ66569301 COMPLEX LGP350.APRTZY ZZ:Without Color camera
4 MJN089300 Tape, Window MJN67679101 COMPLEX LGP350.APRTZY ZZ:Without Color TAPE,CAMERA WINDOW
4 MJN061100 Tape, Protect MJN67679501 COMPLEX LGP350.APRTZY ZZ:Without Color TAPE,PROTECTION [VOLUME]
4 MKC009400 Window, Camera MWAE0070001 CUTTING PC SHEET LG-P350 PRT BK:Black PCSHEET 0.2T + SK4350
3 GMEY00 Screw, Machine GMEY0014301 GMEY0014301 BH + 1.4mM 3.5mM MSWR NI PLT N -KUMGANG SCREW CO., LTD
3 SAFY04 PCB Assembly,Main - SAFY0400309 LGP350.ADEUSV 1.0 MAIN
4 EBR071500 PCB Assembly,Main, Insert - EBR72902101 LGP350.APRTZY 1.0 MAIN
5 MCQ000002 Damper MCQ66591401 COMPLEX LGP350.APRTZY ZZ:Without ColorPAD_PCB_MIC
5 MCQ000000 Damper MCQ66510101 COMPLEX LGP350.APRTZY ZZ:Without Colorwater_protection_lcd_conn
5 MCQ000001 Damper MCQ66510001 COMPLEX LGP350.APRTZY ZZ:Without Colorwater_protection_touch_conn
5 EAA030100 PIFA Antenna, RF EAA62405802 ACB-000094 TRIPLE -2DB 3:1 - - MOBITECHCORPORATION
5 RAA050100 RESIN, PC BRAH0001301 UF-1060, ; , , , , [empty]
5 SVCY00 Camera Module SVCY0029201 HSIS-LM38MIFF LG-P350 PRT HANSUNGELCOMTEC CO., LTD.
5 SUSY00 Speaker, DualMode SUSY0028901
BRS-181213SL08-P Nd-Fe-B 700mW 8OHM 90DB710HZ 1812*3.0T WIRE BUJEON ELECTRONICSCO., LTD
5 SJMY00 Motor, DC SJMY0007116 WHVM-1030Q10 2 V, 65 mA, 10 *3.0T, 3V, WOOSUNGG&T CO., LTD
5 EAX00 PCB, Sidekey EAX63985801 EAX63985801 LGP350.APRTZY 1.0 POLYI Double2layer 1mm SIDEKEY SI FLEX CO., LTD
5 ABM00 Can Assembly,Shield - ABM73476101 LGP350.APRTZY SV:Silver -
6 MBK070300 Can, Shield MCBA0103901 COMPLEX LG-P350 PRT SV:Silver PRESS, STS,
6 MEZ000900 Label, After Service MLAB0001102 COMPLEX C2000 CGRSV WA:White C2000 USASVDIA 4.0 PRINTING,
6 MEV000000 Insulator MEV63756401 COMPLEX LGP350.APRTZY ZZ:Without Colorinsulator_can_shield
12. EXPLODED VIEW & REPLACEMENT PART LIST
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LGE Internal Use Only
Level Location No. Description PartNumber Spec Remark
6 MCQ000000 Damper MCQ66588501 COMPLEX LGP350.APRTZY ZZ:Without ColorDAMPER_CAN, SHIELD
5 ADB00 Dome Assembly,Metal ADB73558901 LGP350.APRTZY ZZ:Without Color -
4 EBR071800 PCB Assembly,Main, SMT - SAFF0299003 LGP350.ADEUSV 1.0 MAIN
5 SAD010000 Software, Mobile SAD32886501 V10A - EUROPE QCT -
5 MEZ000000 Label MLAZ0038301 COMPLEX LG-VX6000 ZZ:Without Color PID Label 4Array PRINTING,
5 SAFC00 PCB Assembly,Main, SMT Bottom - SAFC0161701 LGP350.APRTZY 1.0 MAIN
6 MAZ00 Bracket MAZ63011101 PRESS STS 304 0.3 LGP350.APRTZY ZZ:Without Color-
6 MAZ01 Bracket MAZ63063201 COMPLEX LGP350.APRTZY SV:Silver EARJACK
6 SW1000 Connector, RF ENWY0007901KMS-518(P) NONE STRAIGHT RF ADAPTER SMDT/REEL AU 50OHM 650mDB HIROSE KOREA CO.,LTD
5 SAFD00 PCB Assembly,Main, SMT Top - SAFD0159101 LGP350.APRTZY 1.0 MAIN
6 SUMY00 Microphone,Condenser SUMY0010609 SPU0410HR5H -PB SPU0410HR5H -PB, UNIT, 42 dB,
3.76*2.95*1.1, mems smd mic KNOWLES ACOUSTICS
6 BAT500 CapacitorAssembly SMZY0023501 PAS311HR-VG1 3.8 Backup Capacitor 0.03F, Module
Assembly, KOREA TAIYO YUDEN.CO., LTD.
6 SPFY00 PCB, Main SPFY0246001 SPFY0246001 LGP350.APRTZY 1.0 FR-4 Stack via 80.8 MAIN LG Innotek.com
1 AGF000000 Package Assembly - AGF76138401 LGP350.ADEUSV ZZ:Without Color LG-P350STD(EU1W)
2 MAY084000 Box, Unit MAY64973304 BOX Paper 120 56 90 5 COLOR LGP350.AVIPSVZZ:Without Color LG-P350 STD(EU1W)
2 APLY00 PALLET ASSY - APLY0003901 GD510 BALBK BK, ZZ, EU1TYPE_Body(SW)+Cap(EU)+AL_1200EA
3 MBEC00 Box, Carton MBEC0003601 COMPLEX GD510 CZESV ZZ:Without Color -
3 MCCL00 Cap, Box MCCL0002501 COMPLEX GD510 CZESV ZZ:Without Color -
3 MPCY00 Pallet MPCY0012403 COMPLEX KG800 FRABK DB:DARK BLUE -
2 MBAD00 Bag, Vinyl MBAD0005204 COMPLEX LG-LX260 SPRAG ZZ:Without Color -
2 MBEE00 Box, Master MBEE0061001 COMPLEX GD510 CZESV ZZ:Without Color -
12. EXPLODED VIEW & REPLACEMENT PART LIST
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LGE Internal Use Only
Level Location No. Description PartNumber Spec Remark
2 MLAC00 Label, Barcode MLAC0004541 COMPLEX HB620 KPNBK ZZ:Without Color -
2 MLAJ00 Label, Master Box MLAJ0004402 COMPLEX CG300 CGR ZZ:Without Color LABEL,MASTER BOX(for CGR TDR 2VER. mbox_label)
2 MLAZ01 Label MLAZ0050901 COMPLEX KU990 GBRBK ZZ:Without Color -
1 AAD000000 Addition Assembly - AAD85729101 LGP350.ADEUSV SV:Silver -
2 ACQ00 Cover Assembly,Battery - ACQ85463001 LGP350.APRTZY SV:Silver -
3 MCK000000 Cover MCJZ0066801 COMPLEX LG-P350 PRT SV:Silver MOLD, PC LUPOYSC-1004A,
3 MJN061100 Tape, Protect MJN67753701 COMPLEX LGP350.APRTZY ZZ:Without Colorbattery_cover
ACQ02
12. EXPLODED VIEW & REPLACEMENT PART LIST
- 196 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
by SBOM standard on GCSC
Level Location No. Description PartNumber Spec Remark
6 R530 Resistor, Chip ERHZ0000284 RC1005F434CS 430KOHM 1% 1/16W 1005 R/TP -SAMSUNG ELECTRO-MECHANICS CO., LTD.
6 C531,C554
Capacitor, TA,Conformal EAE62287901
251M1002107MR12A168 0.0001F 20% 10V 50UA -55TO+125C 0.6OHM 3.2x1.6x1.1 NONE SMD R/TPMATSUO ELECTRIC CO., LTD
6 X200 Oscillator, TCXO EXST0002301 1XTW38400FAA 384MHZ 2.5PPM 2.8V 3.2x2.5x0.9MM; SMD R/TP DAISHINKU CORPORATION.
6 X300 Oscillator,VCTCXO EAW61503501 1XTV19200FAA 19.2MHZ 2PPM 2.8V 3.2x2.5x0.9MM ;
SMD R/TP DAISHINKU CORPORATION.
6
C210,C228,C243,C247,C248,C311,C313,C545,C546,C548,C566,C571,C805
Capacitor,Ceramic, Chip ECZH0001215 C1005X5R1A105KT000F 1uF 10% 10V X5R -
55TO+85C 1005 R/TP - TDK KOREA COOPERATION
6 R1022,R201
PCB ASSY, MAIN,PAD SHORT SAFP0000401 LG-LU3000 LGTBK, MAIN, A,
6 C1001 Inductor, Multilayer,Chip ELCH0004708
1005GC2T2N7SLF 2.7NH 0.3NH - 300mA 0.17OHM5.5GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TPPILKOR ELECTRONICS LTD.
12.2 Replacement Parts Note: This Chapter is used for reference, Part order is ordered
<Main component>
12. EXPLODED VIEW & REPLACEMENT PART LIST
- 197 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level Location No. Description PartNumber Spec Remark
6
C1006,C1007,C1008,C1012,C1015,C1017,C1037,C1039,C1044,C1051,C1074,C1078,C1090,C1097,C568,L1023,L1035
Capacitor,Ceramic, Chip ECZH0000830
C1005C0G1H330JT000F 33pF 5% 50V NP0 -55TO+125C 1005 R/TP - TDK KOREACOOPERATION
6
C1043,C1045,C1046,C1049,C1069,C300,C404,C408,C412,C414,C418,C422,C426,C430,C435,C502,C517,C518,C521,C522,C523,C524,C529,C608,C609,C615,C616,C618
Capacitor,Ceramic, Chip ECZH0025920 GRM033R71C102K 1nF 10% 16V X7R -55TO+125C
0603 R/TP - MURATA MANUFACTURING CO., LTD.
12. EXPLODED VIEW & REPLACEMENT PART LIST
- 198 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level Location No. Description PartNumber Spec Remark
6
C1024,C1026,C1057,C1058,C1060,C1061,C1063,C1067,C1100,C200,C201,C202,C206,C207,C208,C209,C213,C214,C225,C227,C241,C301,C304,C310,C312,C314,C315,C316,C317,C318,C319,C324,C400,C401
Capacitor,Ceramic, Chip ECCH0009101 C0603X5R0J104KT00NN 0.1uF 10% 6.3V X5R -
55TO+85C 0603 R/TP - TDK CORPORATION
12. EXPLODED VIEW & REPLACEMENT PART LIST
- 199 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level Location No. Description PartNumber Spec Remark
6
C403,C406,C407,C409,C416,C419,C420,C423,C424,C428,C432,C434,C501,C503,C504,C505,C506,C510,C511,C512,C513,C514,C534,C549,C555,C556,C559,C560,C605,C623,C633,C636,C638,C802
Capacitor,Ceramic, Chip ECCH0009101 C0603X5R0J104KT00NN 0.1uF 10% 6.3V X5R -
55TO+85C 0603 R/TP - TDK CORPORATION
6C410,C421,C525
Capacitor,Ceramic, Chip ECCH0017501
CL10A226MQ8NRNE 22uF 20% 6.3V X5R -55TO+85C1608 R/TP 0.8MM SAMSUNG ELECTRO-MECHANICS CO., LTD.
6
R1014,R1020,R505,R603
Resistor, Chip ERHY0009504 MCR006YZPJ102 1KOHM 5% 1/20W 0603 R/TP -ROHM.
6
R1017,R1018,R303,R317,R318,R702,R810,R811,R813
Resistor, Chip ERHY0009503 MCR006YZPJ101 100OHM 5% 1/20W 0603 R/TP -ROHM.
12. EXPLODED VIEW & REPLACEMENT PART LIST
- �00 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level Location No. Description PartNumber Spec Remark
6C1072,C1081,L1040
Capacitor,Ceramic, Chip ECCH0000195
GRM1555C1H3R9C 3.9pF 0.25PF 50V NP0 -55TO+125C 1005 R/TP - MURATA MANUFACTURINGCO., LTD.
6 R623,R626 Resistor, Chip ERHY0009302 MCR006YZPF1001 1KOHM 1% 1/20W 0603 R/TP -
ROHM.
6
C700,C701,C702,C710,C806
Capacitor,Ceramic, Chip ECCH0004904 GRM155R60J105K 1uF 10% 6.3V X5R -55TO+85C
1005 R/TP - MURATA MANUFACTURING CO., LTD.
6R1002,R704,R705
Resistor, Chip ERHZ0000443 MCR01MZP5J222 2.2KOHM 5% 1/16W 1005 R/TP -ROHM.
6L501,L502,L503
Inductor, WireWound, Chip ELCP0008005
CPI2520LZ4R7ME 4.7UH 20% 0V 900mA 0.3OHM 0HZ0 SHIELD 2.5X2X1MM NONE R/TP SAMWHACAPACITOR CO, LTD.
6 R1016 Resistor, Chip ERHY0009531 MCR006YZPJ620 62OHM 5% 1/20W 0603 R/TP -ROHM.
6
C402,C405,C509,C535,C537,C538,C539,C540,C543,C544,C547,C603,C614,C620,C621,C622,C704,C706,C707,C708,C709,C711,C712,C713
Capacitor,Ceramic, Chip ECCH0000198
CL05A225MQ5NSNC 2.2uF 20% 6.3V X5R -55TO+85C1005 R/TP . SAMSUNG ELECTRO-MECHANICS CO.,LTD.
6 R800 Resistor, Chip ERHY0009518 MCR006YZPJ224 220KOHM 5% 1/20W 0603 R/TP -ROHM.
12. EXPLODED VIEW & REPLACEMENT PART LIST
- �01 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level Location No. Description PartNumber Spec Remark
6
R524,R531,R609,R610,R622,R700,R701,R707,R708
Resistor, Chip ERHY0009526 MCR006YZPJ472 4.7KOHM 5% 1/20W 0603 R/TP -ROHM.
6 U603 IC, AccelerationSensor EUSY0408701 KR3DH NONE NONE LGA R/TP 16P - ST
MICROELECTRONICS ASIA PACIFIC PTE LTD.
6 L1018 Inductor, Multilayer,Chip ELCH0001034
HK1005 3N3S-T 3.3NH 0.3NH - 300mA 0.16OHM 6GHZ8 SHIELD NONE 1.0X0.5X0.5MM R/TP TAIYO YUDENCO., LTD
6 R1006 Resistor, Chip ERHZ0000509 MCR01MZP5J750 75OHM 5% 1/16W 1005 R/TP -ROHM.
6
FB200,FB201,FB202,FB203,FB204
Filter, Bead SFBH0008101BLM15AG601SN1D 600 ohm 1.0X0.5X0.5 25% 0.6 ohm0.3A SMD R/TP 2P 0 MURATA MANUFACTURINGCO., LTD.
6ZD800,ZD801,ZD802
Diode, TVS EDTY0009401 VMNZ6.8CST2R 5.5V 0 10V 0A 200mW SC70 R/TP 6P5 ROHM.
6 R315 Resistor, Chip ERHY0000104 MCR01MZP5F49R9 49.9OHM 1% 1/16W 1005 R/TP -ROHM.
6 R1004, R1005 Resistor, Chip ERHZ0000415 MCR01MZP5J131 130OHM 5% 1/16W 1005 R/TP -ROHM.
6 R520 Resistor, Chip ERHZ0000203 MCR01MZP5F1002 10KOHM 1% 1/16W 1005 R/TP -ROHM.
6C1048,C1071,C231
Capacitor,Ceramic, Chip ECCH0005604
GRM188R60J106M 10000000 pF, 6.3V, M, X5R, TC,1608, R/TP, 0.8 mm MURATA MANUFACTURING CO.,LTD.
6
C1036,C1054,C1056,C203,C229,C230,C714
Capacitor,Ceramic, Chip ECCH0017601
CL05A475MQ5NRNC 4.7uF 20% 6.3V X5R -55TO+85C1005 R/TP 0.5MM SAMSUNG ELECTRO-MECHANICS CO., LTD.
12. EXPLODED VIEW & REPLACEMENT PART LIST
- �0� - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level Location No. Description PartNumber Spec Remark
6
R504,R629,R801,R802,R803,R804,R805
Resistor, Chip ERHY0009527 MCR006YZPJ473 47KOHM 5% 1/20W 0603 R/TP -ROHM.
6
R307,R523,R525,R526,R605,R617,R618,R619,R620
Resistor, Chip ERHY0009516 MCR006YZPJ222 2.2KOHM 5% 1/20W 0603 R/TP -ROHM.
6
R203,R316,R606,R703,R710
Resistor, Chip ERHY0009506 MCR006YZPJ104 100KOHM 5% 1/20W 0603 R/TP -ROHM.
6 FL1007 Filter, Duplexer,IMT SDMY0003001
B7697 2140000000 2112.4 to 2167.6 19500000001922.4 to 1977.6 2.2 1.8 2.5x2.0x0.89 DUAL SMD R/TP- EPCOS PTE LTD.
6 U500 IC, LDO VoltageRegulator EUSY0407201
BU33TD4WNVX SSON004, 4, R/TP, 3.3V 150mASingle LDO, IC, LDO Voltage RegulatorIC, LDO VoltageRegulator ROHM.
6 C1082, L1039 Capacitor,Ceramic, Chip ECCH0000104
MCH155A030C 3pF 0.25PF 50V NP0 -55TO+125C1005 R/TP - ROHM Semiconductor KOREACORPORATION
6 C1083, C1095 Capacitor,Ceramic, Chip ECCH0000183
GRM1555C1H1R8C 1.8pF 0.25PF 50V NP0 -55TO+125C 1005 R/TP - MURATA MANUFACTURINGCO., LTD.
6 D500 Diode, Switching EDSY0011901 SDB310Q 340mV 30V 200mA 1A 0SEC 150mW EMD2R/TP 2P 1 AUK CORP
6 U601 IC, SpeakerAmplifier EUSY0404001
TPA6202A1ZQVR BGA, 8, R/TP, Class AB SPK Amp,IC, Audio AmplifierIC, Audio Amplifier - BGA R/TP 8P -TEXAS INSTRUMENTS KOREA LTD, HONGKONGBRANCH.
6C1013,C1034,C233
Capacitor,Ceramic, Chip ECCH0000143
MCH155CN102KK 1nF 10% 50V X7R -55TO+125C1005 R/TP - ROHM Semiconductor KOREACORPORATION
6
C1070,C307,C309,C320
Capacitor,Ceramic, Chip ECCH0009109 C0603X7R1H331KT00NN 330pF 10% 50V X7R -
55TO+125C 0603 R/TP - TDK CORPORATION
12. EXPLODED VIEW & REPLACEMENT PART LIST
- �03 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level Location No. Description PartNumber Spec Remark
6
C417,C427,C431,C519,C520,C530,C604,C624,C639
Capacitor,Ceramic, Chip ECCH0007803
CL10A106MP8NNNC 10uF 20% 10V X5R -55TO+85C1608 R/TP 0.8MM SAMSUNG ELECTRO-MECHANICS CO., LTD.
6 C1080 Inductor, Multilayer,Chip ELCH0001049
1005GC2T6N8JLF 6.8NH 5% - 250mA 0.32OHM 3GHZ8 SHIELD NONE 1.0X0.5X0.5MM R/TP PILKORELECTRONICS LTD.
6 C1079, C1091 Inductor, Multilayer,Chip ELCH0005020
HK1005 1N0S 1NH 0.3NH - 300mA 0.08OHM 10GHZ 8SHIELD NONE 1.0X0.5X0.5MM R/TP TAIYO YUDENCO., LTD
6 U1000 IC, RFTransceiver, 3G EUSY0344001 RTR6285 1.8VTO3V, 2.7VTO3V 500mW QFN R/TP
68P QUALCOMM INCORPORATED.
6 R607,R608 Resistor, Chip ERHY0009502 MCR006YZPJ100 10OHM 5% 1/20W 0603 R/TP -
ROHM.
6 FB700 Filter, Bead SFBH0009901 HB-1M1005-121JT 120 ohm 1.0X0.5X0.5 25% 0.3 ohm0.5A SMD R/TP 2P 0 CERATECH CORPORATION
6 R806 Resistor, Chip ERHZ0000530 RC1005J512CS 5.1KOHM 5% 1/16W 1005 R/TP -SAMSUNG ELECTRO-MECHANICS CO., LTD.
6 L1024 Inductor, Multilayer,Chip ELCH0001048
1005GC2T10NJLF 10NH 5% - 250mA 0.42OHM2.5GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TPPILKOR ELECTRONICS LTD.
6
C1028,C1030,C1053,C1055,C1059,C1066,C634
Capacitor,Ceramic, Chip ECCH0002001 C1005JB0J104KT000F 0.1uF 10% 6.3V Y5P -
30TO+85C 1005 R/TP - TDK CORPORATION
6R311,R613,R627
Resistor, Chip ERHZ0000204 MCR01MZP5F1003 100KOHM 1% 1/16W 1005 R/TP -ROHM.
6 FB601, FB602 Filter, Bead SFBH0001503HH-1M1608-601JT_1 600 ohm 1.6X0.8X0.8MM 25%0.35 ohm 0.75A SMD R/TP 2P 0 CERATECHCORPORATION
6 FL500 Filter, EMI/Power SFEY0015301 NFM18PC104R1C3 ESD/EMI 0HZ 0.1uF 0H SMD R/TPMURATA MANUFACTURING CO., LTD.
6 C1105 Inductor, Multilayer,Chip ELCH0004721
1005GC2T2N2SLF 2.2NH 0.3NH - 300mA 0.16OHM6GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP PILKORELECTRONICS LTD.
12. EXPLODED VIEW & REPLACEMENT PART LIST
- �04 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level Location No. Description PartNumber Spec Remark
6
C323,C570,C607,C617,C800,C801,C803,C804
Capacitor,Ceramic, Chip ECZH0025916 GRM0335C1E330J 33pF 5% 25V NP0 -55TO+125C
0603 R/TP - MURATA MANUFACTURING CO., LTD.
6
C1042,C302,C303,C327,C328
Capacitor,Ceramic, Chip ECZH0025917 GRM0335C1E470J 47pF 5% 25V NP0 -55TO+125C
0603 R/TP - MURATA MANUFACTURING CO., LTD.
6
C1023,C1029,C500,C515,C561,C619
Capacitor,Ceramic, Chip ECCH0009216 GRM0335C1E220J 22pF 5% 25V X7R -55TO+125C
0603 R/TP - MURATA MANUFACTURING CO., LTD.
6 L1016 Inductor, Multilayer,Chip ELCH0003844
LQG15HS2N0S02D 2NH 0.3NH - 300mA 0.1OHM6GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TPMURATA MANUFACTURING CO., LTD.
6
VA701,VA702,VA703,VA704,VA705,VA706,VA707
Varistor SEVY0004301 ICVL0518100Y500FR 18V 0% 10F 1.0*0.5*0.55 NONESMD R/TP INNOCHIPS TECHNOLOGY
6
C1009,C1011, C1047,C205,C308,C411,C413,C415,C425,C429,C433,C569,C627
Capacitor,Ceramic, Chip ECCH0009106 C0603X7R1C103KT 10nF 10% 10V X7R -55TO+125C
0603 R/TP - TDK CORPORATION
6 CN501 Connector, I/O ENRY0009601 GU074-5P-SD-E1500 5P 0.65MM ANGLERECEPTACLE DIP R/TP - LS Mtron Ltd.
6 U1002 IC, Power Amplifier SMPY0020101
ACPM-5281-TR1 dBm, %, A, dBc, dB, 4x5, SMD, 3GDual PAM B1+8. Coupler Integrated, LGA, R/TP,AVAGO TECHNOLOGIES INTERNATIONAL SALESPTE. LIMITED
12. EXPLODED VIEW & REPLACEMENT PART LIST
- �05 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level Location No. Description PartNumber Spec Remark
6 R624,R625 Resistor, Chip ERHZ0000295 MCR01MZP5F5102 51KOHM 1% 1/16W 1005 R/TP -
ROHM.
6C204,C239,C242
Capacitor,Ceramic, Chip ECCH0032801
GRM033R60J224M 0.00000022F 20% 6.3V X5R -55TO+85C 0603 R/TP 0.3MM MURATAMANUFACTURING CO., LTD.
6 C1005,C1014
Capacitor,Ceramic, Chip ECZH0000844
C1005C0G1H680JT000F 68pF 5% 50V NP0 -55TO+125C 1005 R/TP - TDK KOREACOOPERATION
6
C1065,C1096,C1101,L1014,L202,R1000
Capacitor,Ceramic, Chip ECZH0000813 C1005C0G1H101JT 100pF 5% 50V NP0 -55TO+125C
1005 R/TP - TDK KOREA COOPERATION
6 L1001,L1010
Capacitor,Ceramic, Chip ECZH0001002
C1005CH1H0R5BT000F 0.5pF 0.1PF 50V NP0 -55TO+125C 1005 R/TP - TDK KOREACOOPERATION
6 C325 Capacitor,Ceramic, Chip ECCH0009203 GRM033R60J333K 33nF 10% 6.3V X5R -55TO+85C
0603 R/TP - MURATA MANUFACTURING CO., LTD.
6 C1033,C1038, L1027
Inductor, Multilayer,Chip ELCH0001036
HK1005 5N6S-T 5.6NH 0.3NH - 300mA 0.23OHM 4GHZ8 SHIELD NONE 1.0X0.5X0.5MM R/TP TAIYO YUDENCO., LTD
6 R305 Resistor, Chip ERHZ0000404 MCR01MZP5J102 1KOHM 5% 1/16W 1005 R/TP -ROHM.
6 C1003,C1010, L1021
Capacitor,Ceramic, Chip ECCH0000901
C1005C0G1H2R2CT000F 2.2pF 0.25PF 50V NP0 -55TO+125C 1005 R/TP - TDK KOREACOOPERATION
6 L1006 Inductor, Multilayer,Chip ELCH0004717
1005GC2T82NJLF 82NH 5% - 150mA 2.1OHM 700MHZ8 SHIELD NONE 1.0X0.5X0.5MM R/TP PILKORELECTRONICS LTD.
6 R808,R809 Resistor, Chip ERHY0003301 MCR01MZP5J101 100OHM 5% 1/16W 1005 R/TP -
ROHM.
6 C211,C234
Capacitor,Ceramic, Chip ECCH0000182 GRM155R61A104K 0.1uF 10% 10V X5R -55TO+85C
1005 R/TP - MURATA MANUFACTURING CO., LTD.
6 R313 Resistor, Chip ERHY0009592 MCR006YZPJ202 2KOHM 5% 1/20W 0603 R/TP -ROHM.
6C1004,L1004,L1007
Inductor, Multilayer,Chip ELCH0004714
1005GC2T18NJLF 18NH 5% - 200mA 0.65OHM1.6GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TPPILKOR ELECTRONICS LTD.
12. EXPLODED VIEW & REPLACEMENT PART LIST
- �06 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level Location No. Description PartNumber Spec Remark
6
FB603,FB604,FB605,FB606
Filter, Bead SFBH0008102BLM15HD182SN1D 1800 ohm 1.0X0.5X0.5 25% 2.2ohm 0.2A SMD R/TP 2P 0 MURATAMANUFACTURING CO., LTD.
6 CN701 Connector, BtoB ENBY0051001 GB042-10S-H10-E3000 10P 0.4MM STRAIGHTFEMALE SMD R/TP 1M - LS Mtron Ltd.
6 U200 Filter, Separator,FEM SMZY0028001
RF5501 - - - RF5501, QFN, 12p, 2.0*2.0*0.5, SP3T+LNAfor BT/WiFi with BCM4325/29/30 RF MICRO DEVICESINC
6 R300,R502 Resistor, Chip ERHZ0000222 MCR01MZP5F1503 150KOHM 1% 1/16W 1005 R/TP -
ROHM.
6 R521 Resistor, Chip ERHZ0000537 MCR01MZP5F6803 680KOHM 1% 1/16W 1005 R/TP -ROHM.
6 R302,R510 Resistor, Chip ERHZ0000490 MCR01MZP5J510 51OHM 5% 1/16W 1005 R/TP -
ROHM.
6 R1021 Resistor, Chip ERHY0009501 MCR006YZPJ000 0OHM 5% 1/20W 0603 R/TP -ROHM.
6 L1034 Inductor, Multilayer,Chip ELCH0001405
LL1005-FHL3N3S 3.3NH 0.3NH - 400mA 0.16OHM9.1GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP TOKO,INC.
6 FL1005 Filter, Saw SFSY0028101 SAFEB1G95KA0F00 1950 1.4*1.1*0.6 SMD R/TP 5PMURATA MANUFACTURING CO., LTD.
6 U301 IC, MCP, NOR EUSY0216301 NC7SV00P5X_NL SC70 , 5 PIN, R/TP , Single 2-InputNAND Gate FAIRCHILD SEMICONDUCTOR
6 U501 IC, PMIC EUSY0342201 PM7540 -0.5~18 N/A 0W CSP R/TP 137P -QUALCOMM INCORPORATED.
6 R200 Resistor, Chip ERHZ0000221 MCR01MZP5F1502 15KOHM 1% 1/16W 1005 R/TP -ROHM.
6
R309,R401,R404,R405
PCB ASSY, MAIN,PAD OPEN SAFO0000401 AX3100 ATL SV_SHIPBACK, MAIN, A, 0OHM DNI
6
C1068,C1084,C1085,C1086,C1087,C246
Capacitor,Ceramic, Chip ECCH0009103 C0603C0G1H101JT00NN 100pF 5% 50V X7R -
55TO+125C 0603 R/TP - TDK CORPORATION
6 L207 Inductor, Multilayer,Chip ELCH0003842
LQG15HSR10J02D 100NH 5% - 150mA 1.25OHM600MHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TPMURATA MANUFACTURING CO., LTD.
12. EXPLODED VIEW & REPLACEMENT PART LIST
- �07 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level Location No. Description PartNumber Spec Remark
6 C1088 Inductor, Multilayer,Chip ELCH0004725
1005GC2T33NJLF 33NH 5% - 200mA 1OHM 1.3GHZ 8SHIELD NONE 1.0X0.5X0.5MM R/TP PILKORELECTRONICS LTD.
6
FL700,FL701,FL702,FL703,FL704
Filter, EMI/Power SFEY0010501 ICVE10184E150R101FR ESD/EMI 0HZ 15pF 0H SMDR/TP INNOCHIPS TECHNOLOGY
6FL705,FL706,FL707
Filter, EMI/Power SFEY0011401 ICVE10184E070R101FR ESD/EMI 0HZ 7.5pF 0H SMDR/TP INNOCHIPS TECHNOLOGY
6 U202 IC, LDO VoltageRegulator EUSY0407101
BU28TD4WNVX SSON004, 4, R/TP, 2.8V 150mASingle LDO, IC, LDO Voltage RegulatorIC, LDO VoltageRegulator ROHM.
6R319,R706,R807
Resistor, Chip ERHZ0000434 MCR01MZP5J1R0 1OHM 5% 1/16W 1005 R/TP -ROHM.
6 C245 Capacitor,Ceramic, Chip ECCH0009212
GRM0335C1E4R7C 4.7pF 0.25PF 25V X7R -55TO+125C 0603 R/TP - MURATA MANUFACTURINGCO., LTD.
6 R501 Resistor, Chip ERHZ0000405 MCR01MZP5J103 10KOHM 5% 1/16W 1005 R/TP -ROHM.
6 L209 Inductor, Multilayer,Chip ELCH0003820
LQG15HS3N0S02D 3NH 0.3NH - 300mA 0.17OHM6GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TPMURATA MANUFACTURING CO., LTD.
6 L205 Inductor, Multilayer,Chip ELCH0004108
LLV0603-FH2N2S 2.2NH 0.3NH - 250mA 0.2OHM8.5GHZ 5 SHIELD NONE 0.6X0.3X0.3MM R/TP TOKO,INC.
6 VA602,VA603 Varistor SEVY0010501
IECS0505C040FR 10V 0% 4E-12F 1.0x0.5x0.3IEC61000-4-1 (ESD) level #4 SMD R/TP INNOCHIPSTECHNOLOGY
6 R517 Resistor, Chip ERHZ0000318 MCR01MZP5F8062 80.6KOHM 1% 1/16W 1005 R/TP -ROHM.
6 VA700,VA800 Varistor SEVY0001001 EVLC14S02050 14V 0% 50F 1.0*0.5*0.6 NONE SMD
R/TP AMOTECH CO., LTD.
6 R516 Resistor, Chip ERHZ0000487 MCR01MZP5J474 470KOHM 5% 1/16W 1005 R/TP -ROHM.
6
C526,C527,C528,C541,C542
Capacitor,Ceramic, Chip ECCH0006201 C1608X5R0J475KT000N 4.7uF 10% 6.3V X5R -
55TO+85C 1608 R/TP - TDK CORPORATION
12. EXPLODED VIEW & REPLACEMENT PART LIST
- �08 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level Location No. Description PartNumber Spec Remark
6 CN300 Connector, BtoB ENBY0045901AXT614124 14P 0.4MM STRAIGHT HEADER SMDR/TP 1M - BJ PANASONIC ELECTRONIC PARTSCO., LTD
6 R1013 Resistor, Chip ERHZ0000212 MCR01MZP5F1202 12KOHM 1% 1/16W 1005 R/TP -ROHM.
6 L201 Capacitor,Ceramic, Chip ECCH0000112 MCH155C150J 15pF 5% 50V NP0 -55TO+125C 1005
R/TP - ROHM Semiconductor KOREA CORPORATION
6 R310 Resistor, Chip ERHZ0000463 MCR01MZP5J330 33OHM 5% 1/16W 1005 R/TP -ROHM.
6
C222,C223,C224,C244
Capacitor,Ceramic, Chip ECCH0009514 MCH032A(AN)100DK 10pF 0.5PF 25V X7R -
55TO+125C 0603 R/TP - ROHM.
6 L600 Inductor, Multilayer,Chip ELCH0010402
LK1005 R27K-T 270NH 10% - 25mA 0.91OHM 120MHZ10 SHIELD NONE 1.0X0.5X0.5MM R/TP TAIYOYUDEN CO., LTD
6 U503 IC, Over VoltageProtection EUSY0374601 MAX14528 MAX14528, TDFN, 8, R/TP, Programmable
OVP MAXIM INTEGRATED PRODUCTS INC.
6 R1010,R514 Resistor, Chip ERHZ0000402 MCR01MZP5J100 10OHM 5% 1/16W 1005 R/TP -
ROHM.
6 U604 IC, GeomagneticSensor EUSY0418501
AMI304 QFN, 12, R/TP, Geomagnetic Sensor, IC, A/DConverterIC, A/D Converter - QFN R/TP 12P - AICHISTEEL CORPORATION
6 R1008,R1009 Resistor, Chip ERHZ0000517 MCR01MZP5J910 91OHM 5% 1/16W 1005 R/TP -
ROHM.
6 U1003 IC, RF Amplifier SMZY0025501 RF2815 3.3*2.1*1.0, FILTER+GPS LNA+FILTERMODULE, GPS, RF MICRO DEVICES INC
6
D600,D601,D603,D604,ZD502
Diode, TVS EDTY0010101 ESD9B5.0ST5G ESD9B5.0ST5G, SOD-923, 5 V, 300mW, R/TP, 15pF SCG HONG KONG SAR LTD.
6 C236,C237
Capacitor,Ceramic, Chip ECCH0000122 MCH155A470JK 47pF 5% 50V NP0 -55TO+125C 1005
R/TP - ROHM Semiconductor KOREA CORPORATION
6 Q601 TR, Bipolar EBK61592201LTC014EEBFS8 NPN 0V 0V 50V 100mA 0A 35 150mWEMT3 R/TP 3P ROHM Semiconductor KOREACORPORATION
6 U700 IC, Sub PMIC EUSY0378001 AAT2862 AAT2862, TQFN34, 24, R/TP, 3x4x0.8Advanced Analogic Technologies HK Limited
12. EXPLODED VIEW & REPLACEMENT PART LIST
- �09 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level Location No. Description PartNumber Spec Remark
6 R304 Resistor, Chip ERHZ0000438 MCR01MZP5J203 20KOHM 5% 1/16W 1005 R/TP -ROHM.
6 FL200 Filter, Dielectric SFDY0003201 DEA162450BT-2096A1-H BPF 2.45GHZ 100MHz SMDR/TP 3P TDK CORPORATION
6 C1092 Inductor, Multilayer,Chip ELCH0001035
HK1005 4N7S-T 4.7NH 0.3NH - 300mA 0.21OHM 4GHZ8 SHIELD NONE 1.0X0.5X0.5MM R/TP TAIYO YUDENCO., LTD
6D800,D801,D802
Diode, TVS EDTY0009801 VSMF05LCC 5V 6V 12V 2A 25W SOT-963 R/TP 6P 5PROTEK DEVICES INC.
6 R400 Wire Pad, Short SAFP0000501 LG-VS760 VRZ
6
C1025,C1027,C1064,C238,C564
Capacitor,Ceramic, Chip ECCH0000115 MCH155A220JK 22pF 5% 50V NP0 -55TO+125C 1005
R/TP - ROHM Semiconductor KOREA CORPORATION
6 C305 Capacitor, TA,Conformal ECTH0001903
F980J226MMA 22 uF, 6.3V, M, L_ESR, 1608, R/TPNICHICON CORPORATION, EAST JAPAN SALESOFFICE
6 C532,C635
Capacitor,Ceramic, Chip ECCH0000155
MCH153CN103KK 10nF 10% 16V X7R -55TO+125C1005 R/TP - ROHM Semiconductor KOREACORPORATION
6 C705 Capacitor,Ceramic, Chip ECCH0007804
CL05A225MP5NSNC 2.2uF 20% 10V X5R -55TO+85C1005 R/TP 0.5MM SAMSUNG ELECTRO-MECHANICS CO., LTD.
6 C1077 Inductor, Multilayer,Chip ELCH0004712
1005GC2T3N9SLF 3.9NH 0.3NH - 300mA 0.22OHM4GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP PILKORELECTRONICS LTD.
6 C321,C322
Capacitor,Ceramic, Chip ECCH0010501 GRM1555C1H7R5D 7.5pF C0G TYPE(No X7R)
MURATA MANUFACTURING CO., LTD.
6
L1017,L1019,L1025,L601,L602
Inductor, Multilayer,Chip ELCH0001411
LL1005-FHL1N2S 1.2NH 0.3NH - 400mA 0.1OHM16GHZ 7 SHIELD NONE 1.0X0.5X0.5MM R/TP TOKO,INC.
6
R306,R314,R402,R611,R612
Resistor, Chip ERHY0009505 MCR006YZPJ103 10KOHM 5% 1/20W 0603 R/TP -ROHM.
6 R1011, R1012 Resistor, Chip ERHZ0003801 MCR01MZP5J5R1 5.1OHM 5% 1/16W 1005 R/TP -ROHM.
12. EXPLODED VIEW & REPLACEMENT PART LIST
- �10 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level Location No. Description PartNumber Spec Remark
6C610,C611,C628
Capacitor,Ceramic, Chip ECZH0001217
GRM155R60J474K 470nF 10% 6.3V X5R -25TO+70C1005 BK-DUP - MURATA MANUFACTURING CO.,LTD.
6 FL1003 Filter, Saw SFSY0037501 SAFEB897MAM0F00 897.5MHz 1.4*1.1*0.6 SMD R/TP5P MURATA MANUFACTURING CO., LTD.
6 C612,C613
Capacitor,Ceramic, Chip ECCH0000161
MCH153CN333KK 33nF 10% 16V X7R -55TO+125C1005 R/TP - ROHM Semiconductor KOREACORPORATION
6 R506 Resistor, Chip ERHZ0003901 RC2012FR100CS 0.1OHM 1% 1/8W 2012 R/TP -SAMSUNG ELECTRO-MECHANICS CO., LTD.
6 U401 IC, MCP, NAND EUSY0363306H8BCS0UN0MCR-4EM NAND/4G SDRAM/2G1.7VTO1.9V 13.0x10.5x1.2 TR 137P - - - HYNIXSEMICONDUCTOR INC.
6 C606,C703
Capacitor,Ceramic, Chip ECCH0005602 GRM188R61C225K 2.2uF 10% 16V X5R -55TO+85C
1608 R/TP - MURATA MANUFACTURING CO., LTD.
6 L1030 Inductor, Multilayer,Chip ELCH0001430
LL1005-FHLR10J 100NH 5% - 150mA 2.2OHM1.03GHZ 10 SHIELD NONE 1.0X0.5X0.5MM R/TPTOKO, INC.
6 C1016, C1021 Capacitor,Ceramic, Chip ECZH0000839
C1005C0G1H4R7CT000F 4.7pF 0.25PF 50V NP0 -55TO+125C 1005 R/TP - TDK KOREACOOPERATION
6 D301,D602 Diode, TVS EDTY0008606 PRSB6.8C 4.7V 5.7 - - 10W - R/TP 2P 1 PROTEK
DEVICES INC.
6 C235,C240
Capacitor,Ceramic, Chip ECCH0007802
CL10A475KP8NNNC 4.7uF 10% 10V X5R -55TO+85C1608 R/TP - SAMSUNG ELECTRO-MECHANICS CO.,LTD.
6 C226 Capacitor,Ceramic, Chip ECZH0000806
C1005C0G1H050CT000F 5pF 0.25PF 50V NP0 -55TO+125C 1005 R/TP - TDK KOREACOOPERATION
6 FL1001 Filter, Saw, Dual SFSB0001902SAWEN1G84CN0F00 1842.5MHz, 1960MHz1.8*1.4*0.5 SMD R/TP 10P MURATAMANUFACTURING CO., LTD.
6 U600 IC, Audio SubSystem EUSY0420001 TPA2055D3 1.6~5.5V 0W WLCSP R/TP 20P - TEXAS
INSTRUMENTS INCO.
6 C1040, C1052 Inductor, Multilayer,Chip ELCH0004713
1005GC2T6N8JLF 6.8NH 5% - 250mA 0.32OHM 3GHZ8 SHIELD NONE 1.0X0.5X0.5MM R/TP PILKORELECTRONICS LTD.
6 R500 Resistor, Chip ERHZ0000488 MCR01MZP5J4R7 4.7OHM 5% 1/16W 1005 R/TP -ROHM.
12. EXPLODED VIEW & REPLACEMENT PART LIST
- �11 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level Location No. Description PartNumber Spec Remark
6 C1094 Capacitor,Ceramic, Chip ECCH0000701 C1005C0G1H1R2CT000F 1.2pF 0.25PF 50V NP0 -
55TO+125C 1005 R/TP - TDK CORPORATION
6 J800 Card Socket ENSY0024302 KP09NC-6S-2.54SF SIM 6P ANGLE SMD R/TP Stroke :11.25mm HIROSE KOREA CO., LTD
6 C1075 Inductor, Multilayer,Chip ELCH0004709
1005GC2T3N3SLF 3.3NH 0.3NH - 300mA 0.19OHM4.5GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TPPILKOR ELECTRONICS LTD.
6 D501 Diode, Switching EDSY0010501 KDS114E 900mV 30V 100mA 1A 0SEC 100mW ESCR/TP 2P 1 KEC CORPORAITION
6 L1032 Capacitor,Ceramic, Chip ECCH0000196
MCH155A0R75C 0.75pF 0.25PF 50V NP0 -55TO+125C1005 R/TP - ROHM Semiconductor KOREACORPORATION
6 R1007 Resistor, Chip ERHZ0000456 MCR01MZP5J2R2 2.2OHM 5% 1/16W 1005 R/TP -ROHM.
6 C562 Capacitor,Ceramic, Chip ECZH0003503 GRM188R61E105K 1uF 10% 25V X5R -55TO+85C
1608 R/TP - MURATA MANUFACTURING CO., LTD.
6 R509 Resistor, Chip ERHZ0004201 RC1005F1213CS 121KOHM 1% 1/16W 1005 R/TP -SAMSUNG ELECTRO-MECHANICS CO., LTD.
6 L208 Inductor, WireWound, Chip ELCP0012101
CIG21L3R3MNE 0H 20% - 800mA 0.22OHM - - SHIELD2X1.25X1MM NONE - SAMSUNG ELECTRO-MECHANICS CO., LTD.
6 L500 Inductor, WireWound, Chip ELCP0011901
CPI2012NHL2R2MT 2.2UH 20% - 800mA 0.25OHM - -SHIELD 2X1.25X1MM NONE - SAMWHA CAPACITORCO, LTD.
6 R604 Resistor, Chip ERHY0009507 MCR006YZPJ105 1MOHM 5% 1/20W 0603 R/TP -ROHM.
6 R1003,R312 Resistor, Chip ERHZ0000483 MCR01MZP5J470 47OHM 5% 1/16W 1005 R/TP -
ROHM.
6 R403 Resistor, Chip ERHZ0000406 MCR01MZP5J104 100KOHM 5% 1/16W 1005 R/TP -ROHM.
6 ZD401 Diode, TVS EDTY0008601 PSD05-LF 5V 6 13.5V 42A 500W SOD323 R/TP 2P 1PROTEK DEVICES INC.
6 U1001 RF Module SMRH0006201SKY77544 MHz, MHz, POLA EDGE QUAD TXMODULE, SP9T, 6.0*6.0*1.0, 28p, SKYWORKSSOLUTIONS INC.
6 L1015 Inductor, Multilayer,Chip ELCH0001408 LL1005-FHL6N8J 6.8NH 5% - 300mA 0.23OHM 5.6GHZ
9 SHIELD NONE 1.0X0.5X0.5MM R/TP TOKO, INC.
12. EXPLODED VIEW & REPLACEMENT PART LIST
- �1� - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level Location No. Description PartNumber Spec Remark
6 R301 Resistor, Chip ERHY0000290 MCR01MZP5J304 300KOHM 5% 1/16W 1005 R/TP -ROHM.
6 L1038 Inductor, Multilayer,Chip ELCH0003838
LQG15HS8N2J02D 8.2NH 5% - 300mA 0.24OHM3.7GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TPMURATA MANUFACTURING CO., LTD.
6 L1009 Inductor, Multilayer,Chip ELCH0004711
1005GC2T22NJLF 22NH 5% - 200mA 0.8OHM 1.5GHZ8 SHIELD NONE 1.0X0.5X0.5MM R/TP PILKORELECTRONICS LTD.
6 U504 IC, MUIC EUSY0372001TS5USBA33402YZPR TS5USBA33402, MUIC WCSPR/TP 20P TEXAS INSTRUMENTS KOREA LTD,HONGKONG BRANCH.
6 L504 Inductor, WireWound, Chip ELCP0008004
MIP2016D4R7M 4.7UH 30% 0V 900mA 0.16OHM 0HZ0 SHIELD 2.0X1.6X1.0MM NONE R/TP FDKCORPORATION.
6 S800 Socket, Card ENSY0023601 SCHA4B0402 Micro-SD 8P ANGLE SMD R/TP - ALPSELECTRIC KOREA CO., LTD.
6 U300IC, DigitalBasebandProcessor, 3G
EUSY0392302 MSM7227 0VTO0V 0W 560P - BGA R/TP 560PQUALCOMM INCORPORATED.
6 FL1000 Filter, Saw, Dual SFSB0001802SAWEN881MCN0F00 881.5MHz, 1960MHz 1.8*1.4*0.5SMD R/TP 10P MURATA MANUFACTURING CO.,LTD.
6 C232 Capacitor,Ceramic, Chip ECCH0000149
MCH155CN332KK 3.3nF 10% 50V X7R -55TO+125C1005 R/TP - ROHM Semiconductor KOREACORPORATION
6 C212 Capacitor,Ceramic, Chip ECZH0000846
C1005C0G1H8R2CT000F 8.2pF 0.25PF 50V NP0 -55TO+125C 1005 R/TP - TDK KOREACOOPERATION
6 FL1004 Filter, Duplexer,IMT SDMY0002801 B7953 942500000 925 to 960 897500000 880 to 915 3.8
2.9 2.5x2.0x0.94 DUAL SMD R/TP - EPCOS PTE LTD.
6 FL1006 Filter, Saw SFSY0033404 B9444 1575.42MHz 1.4*1.1*0.45 SMD R/TP 5PEPCOS PTE LTD.
6 C1099 Capacitor,Ceramic, Chip ECCH0000113 MCH155A180J 18pF 5% 50V NP0 -55TO+125C 1005
R/TP - ROHM Semiconductor KOREA CORPORATION
6 L1000 Inductor, Multilayer,Chip ELCH0004727
1005GC2TR10JLF 100NH 5% - 100mA 2.3OHM600MHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TPPILKOR ELECTRONICS LTD.
6 U302 IC, Flip Flop EUSY0408201 74LVC1G79GM 1.65~5.5V - D FLIP-FLOP SOT R/TP6P - STC CORP.
6 R630 Resistor, Chip ERHY0009524 MCR006YZPJ470 47OHM 5% 1/20W 0603 R/TP -ROHM.
12. EXPLODED VIEW & REPLACEMENT PART LIST
- �13 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level Location No. Description PartNumber Spec Remark
6 L206 Inductor, Multilayer,Chip ELCH0001421 LL1005-FHL47NJ 47NH 5% - 200mA 1.3OHM 1.5GHZ
10 SHIELD NONE 1.0X0.5X0.5MM R/TP TOKO, INC.
6 J600 Jack, Phone ENJE0008001 JAM3333-F32-7F 1P 4P ANGLE R/TP 4mM BLACK 6P- HON HAI PRECISION INDUSTRY CO., LTD.
6 R1019 Resistor, Chip ERHZ0000348 MCR01MZP5F12R0 12OHM 1% 1/16W 1005 R/TP -ROHM.
6 U201 IC Assembly EUSY0433901
BCM43291SKUBG WLBGA , 181 , R/TP ,WiFi(11bgn)+BT+FM(Rx), BT3.0+HS, 6.57x5.62x0.55,182pin, 0.4p , ; , IC Assembly BROADCOM ASIADISTRIBUTION PTE LTD
6 R817 Resistor, Chip ERHY0000105 MCR01MZP5F51R0 51OHM 1% 1/16W 1005 R/TP -ROHM.
6 X500 Crystal EXXY0024301 CM315(12.5PF) 32.768KHZ 20PPM 12.5PF 32*15 SMDR/TP CITIZEN DISPLAYS CO., LTD.
6 L1013 Inductor, Multilayer,Chip ELCH0003819
LQG15HS12NJ02D 12NH 5% - 300mA 0.28OHM 3GHZ8 SHIELD NONE 1.0X0.5X0.5MM R/TP MURATAMANUFACTURING CO., LTD.
6 R308 Resistor, Chip ERHY0024201 RC1005F6041CS 6.04KOHM 1% 1/16W 1005 R/TP -SAMSUNG ELECTRO-MECHANICS CO., LTD.
6 C306 Capacitor,Ceramic, Chip ECCH0009230 GRM033R61A222K 2.2nF 10% 25V X5R -55TO+85C
0603 R/TP - MURATA MANUFACTURING CO., LTD.
6 Q600 FET EQFP0004501SI1305-E3 P-CHANNEL MOSFET -8V +-8 -0.92A0.28OHM 340mW SOT323 R/TP 9P VISHAYINTERTECHNOLOGY ASIA PTE LTD
6 CN500 Connector,Terminal Block ENZY0030401 KQ03LV-3R 3, 2.5 mm, STRAIGHT, Gold, Twin One
board 5.4mm HIROSE KOREA CO., LTD
6 L1003 Inductor, Multilayer,Chip ELCH0001425 LL1005-FHL82NJ 82NH 5% - 150mA 1.9OHM 1.15GHZ
10 SHIELD NONE 1.0X0.5X0.5MM R/TP TOKO, INC.
6 CN700 Connector, BtoB ENBY0036001GB042-40S-H10-E3000 40P 0.4MM STRAIGHTSOCKET SMD R/TP 1M ENGINEERING PLASTICUL94V-0 AU OVER NI LS Mtron Ltd.
6 U701 IC, Level Translator EUSY0391601 NLSV1T244-D 0.9~4.5V - LEVEL SHIFTER - R/TP 6P -SCG HONG KONG SAR LTD.
6 R515 Resistor, Chip ERHZ0000439 MCR01MZP5J204 200KOHM 5% 1/16W 1005 R/TP -ROHM.
6 CN702 Connector, BtoB ENBY0034201 GB042-24S-H10-E3000 24P 0.40MM STRAIGHTSOCKET SMD R/TP 1M - LS Mtron Ltd.
12. EXPLODED VIEW & REPLACEMENT PART LIST
- �14 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level Location No. Description PartNumber Spec Remark
6 C1018 Capacitor,Ceramic, Chip ECCH0009226 GRM0335C1E390J 39pF 5% 25V X7R -55TO+125C
0603 R/TP - MURATA MANUFACTURING CO., LTD.
6 Q500 FET EQFP0008601NUS5530MN P-CHANNEL MOSFET -20V 20 -3.9A0.07OHM 1.3W TSOP6 R/TP 8P ONSEMICONDUCTOR
6 FL1002 Filter, Saw SFSY0028201 SAFEB2G14FB0F00 - - - - 2P MURATAMANUFACTURING CO., LTD.
6 R305 Resistor, Chip ERHZ0000404 MCR01MZP5J102 1KOHM 5% 1/16W 1005 R/TP -ROHM.
6 LD800, LD801 LED, Chip EDLH0005901 WHITE 2.85~3.15 20mA 45~60mcd(X:Y=0.273/0.295~0.332/0.358) 75mW 1608 R/TP 2P -
6
FB603,FB604,FB605,FB606
Filter, Bead SFBH0008102BLM15HD182SN1D 1800 ohm 1.0X0.5X0.5 25% 2.2ohm 0.2A SMD R/TP 2P 0 MURATAMANUFACTURING CO., LTD.
6 R808,R809 Resistor, Chip ERHY0003301 MCR01MZP5J101 100OHM 5% 1/16W 1005 R/TP -
ROHM.
6 VA602,VA603 Varistor SEVY0010501
IECS0505C040FR 10V 0% 4E-12F 1.0x0.5x0.3IEC61000-4-1 (ESD) level #4 SMD R/TP INNOCHIPSTECHNOLOGY
6R311,R613,R627
Resistor, Chip ERHZ0000204 MCR01MZP5F1003 100KOHM 1% 1/16W 1005 R/TP -ROHM.
6ZD800,ZD801,ZD802
Diode, TVS EDTY0009401 VMNZ6.8CST2R 5.5V 0 10V 0A 200mW SC70 R/TP 6P5 ROHM.
6
C210,C228,C243,C247,C248,C311,C313,C545,C546,C548,C566,C571,C805
Capacitor,Ceramic, Chip ECZH0001215 C1005X5R1A105KT000F 1uF 10% 10V X5R -
55TO+85C 1005 R/TP - TDK KOREA COOPERATION
12. EXPLODED VIEW & REPLACEMENT PART LIST
- �15 - Copyright © �011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
by SBOM standard on GCSC
Level Location No. Description PartNumber Spec Remark
2 EAY060000 Adapters SSAD0038301 100-240V, 5060 Hz, 5.1 V, 700 mA, CE, AC-DC Adaptor,90Vac~264Vac, 5.1V, 700mA, 5060, WALL 2P, USB,
2 AFN053800 Manual Assembly,Operation - AFN75431803 LGP350.ADEUSV ZZ:Without Color LGP350 manual
assy for DEU
3 MBM087200 Card, Warranty MCDF0001110 COMPLEX KP202 VDG ZZ:Without Color PRINTING,(empty),
3 MFL053800 Manual, Operation MFL67159903 COMPLEX LGP350.ADEUSV ZZ:Without Color LGP350manual for DEU
2 SBPL01 RechargeableBattery, Lithium Ion SBPL0103501
BL-42FN-WW 3.7 V, 1250 mAh, 1 CELL, PRISMATIC,424261, INNERPACK, WW, PRISMATIC, BLACK,TOCAD DONG-HWA CO., LTD
2 EBX000000 Accessory, DataCable SGDY0016701 KCA-ET-8-0020 KCA-ET-8-0020 Micro USB, 1.2M
KSD CO., LTD
2 EAB010200 Earphone, Stereo SGEY0003744EMB-LGE004MSKB 3mW 16OHM 115DB85HZTO126HZ 1M BLACK 3.5 L TYPE STEREO4POLE PLUG - CRESYN CO., LTD
12.3 Accessory Note: This Chapter is used for reference, Part order is ordered