lg_32ls3150-ta_chassis_lp24b_mfl67452813

8/9/2019 lg_32ls3150-ta_chassis_lp24b_mfl67452813

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Printed in KoreaP/NO : MFL67452813 (1204-REV00)

LED LCD TV

SERVICE MANUAL

North/Latin America http://aic.lgservice.com

Europe/Africa http://eic.lgservice.com

Asia/Oceania http://biz.lgservice.com

Internal Use Only

CHASSIS : LP24B

MODEL: 32LS3510 32LS3150-TA

CAUTION

BEFORE SERVICING THE CHASSIS,

READ THE SAFETY PRECAUTIONS IN THIS MANUAL.


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- 2 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.

Only for training and service purposes

CONTENTS

CONTENTS .............................................................................................. 2

SAFETY PRECAUTIONS ........................................................................ 3

SERVICING PRECAUTIONS .................................................................... 4

SPECIFICATION ....................................................................................... 6

ADJUSTMENT INSTRUCTION ................................................................ 9

TROUBLESHOOTING GUIDE................................................................ 13

BLOCK DIAGRAM.................................................................................. 16

EXPLODED VIEW .................................................................................. 17

SCHEMATIC CIRCUIT DIAGRAM ..............................................................


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Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the

Schematic Diagram and Exploded View.

It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent

Shock, Fire, or other Hazards.

Do not modify the original design without permission of manufacturer.

General Guidance

An isolation Transformer should always be used during the

servicing of a receiver whose chassis is not isolated from the AC

power line. Use a transformer of adequate power rating as this

protects the technician from accidents resulting in personal injury

from electrical shocks.

It will also protect the receiver and it's components from being

damaged by accidental shorts of the circuitry that may be

inadvertently introduced during the service operation.

If any fuse (or Fusible Resistor) in this TV receiver is blown,

replace it with the specified.

When replacing a high wattage resistor (Oxide Metal Film Resistor,

over 1 W), keep the resistor 10 mm away from PCB.

Keep wires away from high voltage or high temperature parts.

Before returning the receiver to the customer,

always perform an AC leakage current check on the exposed

metallic parts of the cabinet, such as antennas, terminals, etc., to

be sure the set is safe to operate without damage of electrical

shock.

Leakage Current Cold Check(Antenna Cold Check)With the instrument AC plug removed from AC source, connect an

electrical jumper across the two AC plug prongs. Place the AC

switch in the on position, connect one lead of ohm-meter to the AC

plug prongs tied together and touch other ohm-meter lead in turn to

each exposed metallic parts such as antenna terminals, phone

jacks, etc.

If the exposed metallic part has a return path to the chassis, the

measured resistance should be between 1 MΩ and 5.2 MΩ.

When the exposed metal has no return path to the chassis the

reading must be infinite.

An other abnormality exists that must be corrected before the

receiver is returned to the customer.

Leakage Current Hot Check (See below Figure)Plug the AC cord directly into the AC outlet.

Do not use a line Isolation Transformer during this check.

Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor

between a known good earth ground (Water Pipe, Conduit, etc.)

and the exposed metallic parts.

Measure the AC voltage across the resistor using AC voltmeter

with 1000 ohms/volt or more sensitivity.

Reverse plug the AC cord into the AC outlet and repeat AC voltage

measurements for each exposed metallic part. Any voltage

measured must not exceed 0.75 volt RMS which is corresponds to

0.5 mA.

In case any measurement is out of the limits specified, there is

possibility of shock hazard and the set must be checked and

repaired before it is returned to the customer.

Leakage Current Hot Check circuit

IMPORTANT SAFETY NOTICE

SAFETY PRECAUTIONS


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SERVICING PRECAUTIONS

CAUTION: Before servicing receivers covered by this service

manual and its supplements and addenda, read and follow the

SAFETY PRECAUTIONS on page 3 of this publication.NOTE : If unforeseen circumstances create conict between the

following servicing precautions and any of the safety precautions

on page 3 of this publication, always follow the safety precautions.

Remember: Safety First.

General Servicing Precautions

1. Always unplug the receiver AC power cord from the AC power

source before;

a. Removing or reinstalling any component, circuit board mod-

ule or any other receiver assembly.

b. Disconnecting or reconnecting any receiver electrical plug or

other electrical connection.

c. Connecting a test substitute in parallel with an electrolytic

capacitor in the receiver.

CAUTION: A wrong part substitution or incorrect polarity

installation of electrolytic capacitors may result in an explo-

sion hazard.

2. Test high voltage only by measuring it with an appropriate

high voltage meter or other voltage measuring device (DVM,FETVOM, etc) equipped with a suitable high voltage probe.

Do not test high voltage by "drawing an arc".

3. Do not spray chemicals on or near this receiver or any of its

assemblies.

4. Unless specied otherwise in this service manual, clean

electrical contacts only by applying the following mixture to the

contacts with a pipe cleaner, cotton-tipped stick or comparable

non-abrasive applicator; 10 % (by volume) Acetone and 90 %

(by volume) isopropyl alcohol (90 % - 99 % strength)

CAUTION: This is a ammable mixture.

Unless specied otherwise in this service manual, lubrication of

contacts in not required.

5. Do not defeat any plug/socket B+ voltage interlocks with which

receivers covered by this service manual might be equipped.

6. Do not apply AC power to this instrument and/or any of itselectrical assemblies unless all solid-state device heat sinks are

correctly installed.

7. Always connect the test receiver ground lead to the receiver

chassis ground before connecting the test receiver positive

lead.

Always remove the test receiver ground lead last.

8. Use with this receiver only the test xtures specied in this

service manual.

CAUTION: Do not connect the test xture ground strap to any

heat sink in this receiver.

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid-state) devices can be damaged eas-

ily by static electricity. Such components commonly are called

Electrostatically Sensitive (ES) Devices. Examples of typical ESdevices are integrated circuits and some eld-effect transistors

and semiconductor “chip” components. The following techniques

should be used to help reduce the incidence of component dam-

age caused by static by static electricity.

1. Immediately before handling any semiconductor component or

semiconductor-equipped assembly, drain off any electrostatic

charge on your body by touching a known earth ground. Alter-

natively, obtain and wear a commercially available discharging

wrist strap device, which should be removed to prevent poten-

tial shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ES

devices, place the assembly on a conductive surface such as

aluminum foil, to prevent electrostatic charge buildup or expo-

sure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES

devices.

4. Use only an anti-static type solder removal device. Some solder

removal devices not classied as “anti-static” can generate

electrical charges sufcient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate

electrical charges sufcient to damage ES devices.

6. Do not remove a replacement ES device from its protective

package until immediately before you are ready to install it.

(Most replacement ES devices are packaged with leads electri-

cally shorted together by conductive foam, aluminum foil or

comparable conductive material).

7. Immediately before removing the protective material from the

leads of a replacement ES device, touch the protective material

to the chassis or circuit assembly into which the device will be

installed.

CAUTION: Be sure no power is applied to the chassis or circuit,

and observe all other safety precautions.8. Minimize bodily motions when handling unpackaged replace-

ment ES devices. (Otherwise harmless motion such as the

brushing together of your clothes fabric or the lifting of your

foot from a carpeted oor can generate static electricity suf-

cient to damage an ES device.)

General Soldering Guidelines

1. Use a grounded-tip, low-wattage soldering iron and appropriate

tip size and shape that will maintain tip temperature within the

range or 500 °F to 600 °F.

2. Use an appropriate gauge of RMA resin-core solder composed

of 60 parts tin/40 parts lead.

3. Keep the soldering iron tip clean and well tinned.

4. Thoroughly clean the surfaces to be soldered. Use a mall wire-

bristle (0.5 inch, or 1.25 cm) brush with a metal handle.Do not use freon-propelled spray-on cleaners.

5. Use the following unsoldering technique

a. Allow the soldering iron tip to reach normal temperature.

(500 °F to 600 °F)

b. Heat the component lead until the solder melts.

c. Quickly draw the melted solder with an anti-static, suction-

type solder removal device or with solder braid.

CAUTION: Work quickly to avoid overheating the circuit

board printed foil.

6. Use the following soldering technique.

a. Allow the soldering iron tip to reach a normal temperature

(500 °F to 600 °F)

b. First, hold the soldering iron tip and solder the strand against

the component lead until the solder melts.

c. Quickly move the soldering iron tip to the junction of thecomponent lead and the printed circuit foil, and hold it there

only until the solder ows onto and around both the compo-

nent lead and the foil.

CAUTION: Work quickly to avoid overheating the circuit

board printed foil.

d. Closely inspect the solder area and remove any excess or

splashed solder with a small wire-bristle brush.


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IC Remove/Replacement

Some chassis circuit boards have slotted holes (oblong) through

which the IC leads are inserted and then bent at against the cir-

cuit foil. When holes are the slotted type, the following technique

should be used to remove and replace the IC. When working with

boards using the familiar round hole, use the standard technique

as outlined in paragraphs 5 and 6 above.

Removal

1. Desolder and straighten each IC lead in one operation by

gently prying up on the lead with the soldering iron tip as the

solder melts.

2. Draw away the melted solder with an anti-static suction-type

solder removal device (or with solder braid) before removing

the IC.Replacement

1. Carefully insert the replacement IC in the circuit board.

2. Carefully bend each IC lead against the circuit foil pad and

solder it.

3. Clean the soldered areas with a small wire-bristle brush.

(It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete Transistor

Removal/Replacement

1. Remove the defective transistor by clipping its leads as close

as possible to the component body.

2. Bend into a "U" shape the end of each of three leads remaining

on the circuit board.

3. Bend into a "U" shape the replacement transistor leads.

4. Connect the replacement transistor leads to the corresponding

leads extending from the circuit board and crimp the "U" with

long nose pliers to insure metal to metal contact then solder

each connection.

Power Output, Transistor Device

Removal/Replacement

1. Heat and remove all solder from around the transistor leads.2. Remove the heat sink mounting screw (if so equipped).

3. Carefully remove the transistor from the heat sink of the circuit

board.

4. Insert new transistor in the circuit board.

5. Solder each transistor lead, and clip off excess lead.

6. Replace heat sink.

Diode Removal/Replacement

1. Remove defective diode by clipping its leads as close as pos-

sible to diode body.

2. Bend the two remaining leads perpendicular y to the circuit

board.

3. Observing diode polarity, wrap each lead of the new diode

around the corresponding lead on the circuit board.

4. Securely crimp each connection and solder it.5. Inspect (on the circuit board copper side) the solder joints of

the two "original" leads. If they are not shiny, reheat them and if

necessary, apply additional solder.

Fuse and Conventional Resistor

Removal/Replacement

1. Clip each fuse or resistor lead at top of the circuit board hollow

stake.

2. Securely crimp the leads of replacement component around

notch at stake top.

3. Solder the connections.

CAUTION: Maintain original spacing between the replaced

component and adjacent components and the circuit board to

prevent excessive component temperatures.

Circuit Board Foil Repair

Excessive heat applied to the copper foil of any printed circuit

board will weaken the adhesive that bonds the foil to the circuit

board causing the foil to separate from or "lift-off" the board. The

following guidelines and procedures should be followed whenever

this condition is encountered.

At IC Connections

To repair a defective copper pattern at IC connections use the

following procedure to install a jumper wire on the copper pattern

side of the circuit board. (Use this technique only on IC connec-

tions).

1. Carefully remove the damaged copper pattern with a sharp

knife. (Remove only as much copper as absolutely necessary).

2. carefully scratch away the solder resist and acrylic coating (if

used) from the end of the remaining copper pattern.3. Bend a small "U" in one end of a small gauge jumper wire and

carefully crimp it around the IC pin. Solder the IC connection.

4. Route the jumper wire along the path of the out-away copper

pattern and let it overlap the previously scraped end of the

good copper pattern. Solder the overlapped area and clip off

any excess jumper wire.

At Other Connections

Use the following technique to repair the defective copper pattern

at connections other than IC Pins. This technique involves the

installation of a jumper wire on the component side of the circuit

board.

1. Remove the defective copper pattern with a sharp knife.

Remove at least 1/4 inch of copper, to ensure that a hazardouscondition will not exist if the jumper wire opens.

2. Trace along the copper pattern from both sides of the pattern

break and locate the nearest component that is directly con-

nected to the affected copper pattern.

3. Connect insulated 20-gauge jumper wire from the lead of the

nearest component on one side of the pattern break to the lead

of the nearest component on the other side.

Carefully crimp and solder the connections.

CAUTION: Be sure the insulated jumper wire is dressed so the

it does not touch components or sharp edges.


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SPECIFICATIONNOTE : Specifications and others are subject to change without notice for improvement.

1. Application rangeThis specification is applied to the LP24B chassis.

2. Requirement for TestEach part is tested as below without special appointment.

1) Temperature: 25 °C ± 5 °C(77 °F ± 9 °F), CST: 40 °C ± 5 °C

2) Relative Humidity: 65 % ± 10 %

3) Power Voltage

: Standard input voltage (AC 100-240 V~, 50/60 Hz)

* Standard Voltage of each products is marked by models.

4) Specification and performance of each parts are followed

each drawing and specification by part number in

accordance with BOM.

5) The receiver must be operated for about 5 minutes prior to

the adjustment.

3. Test method1) Performance: LGE TV test method followed

2) Demanded other specification

- Safety : CE, IEC specification

- EMC : CE, IEC

4. Model General Specification

No. Item Specication Remarks

1. Market NON EU

2. Broadcasting system

1) PAL/SECAM B/G/D/K

2) PAL-I/II

3) NTSC-M

3. Channel Storage

PAL NTSC China(DK)

E2-C69

S21~S47

2~78

1~71

C1~C62

S1~S41

4. Receiving system Upper Heterodyne

5. Video Input PAL, SECAM, NTSC Rear (1EA)

6. Component Input Y/Cb/Cr, Y/Pb/Pr Rear (1EA)7. USB Input MP3, JPEG Side(1EA)

8. AV Audio Output RF/AV/HDMI Audio Output Rear (1EA)

9. D-SUB INPUT S/W Upgrade Only Rear (1EA)

10. HDMI Input HDMI-DTV, Only PCM MODE Rear (1EA)

11. Audio Input (1EA) AV&Component L/R Input(1EA)


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5. Component Video Input (Y, PB, PR)

No. Resolution H-freq(kHz) V-freq(Hz) Pixel clock(MHz) Proposed

1. 720*480 15.73 59.94 13.500 SDTV, DVD 480I(525I)

2. 720*480 15.75 60.00 13.514 SDTV, DVD 480I(525I)

3. 720*576 15.625 50.00 13.500 SDTV, DVD 576I(625I) 50Hz4. 720*480 31.47 59.94 27.000 SDTV 480P

5. 720*480 31.50 60.00 27.027 SDTV 480P

6. 720*576 31.25 50.00 27.000 SDTV 576P 50Hz

7. 1280*720 44.96 59.94 74.176 HDTV 720P

8. 1280*720 45.00 60.00 74.250 HDTV 720P

9. 1280*720 37.50 50.00 74.25 HDTV 720P 50Hz

10. 1920*1080 28.125 50.00 74.250 HDTV 1080I 50Hz,

11. 1920*1080 33.72 59.94 74.176 HDTV 1080I

12. 1920*1080 33.75 60.00 74.25 HDTV 1080I

13. 1920*1080 56.25 50 148.5 HDTV 1080P

14. 1920*1080 67.432 59.94 148.350 HDTV 1080P

15. 1920*1080 67.5 60.00 148.5 HDTV 1080P

6. HDMI Input6.1. PC Mode

* Spec. out but it can be shown the picture at only HDMI/DVI IN 1 via DVI to HDMI Cable

* Monitor Range Limits

Min Vertical Freq - 58 Hz / Max Vertical Freq - 63 Hz

Min Horiz. Freq - 28 kHz / Max Horiz. Freq - 68 kHz

Pixel Clock - 150 MHz

No. Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed Remarks

1. 640×480 31.469 59.94 25.17 VESA(VGA)

2. 800×600 37.879 60.317 40.00 VESA(SVGA)3. 1024×768 48.363 60.004 65.00 VESA(XGA)

4. 1280×768 47.776 59.87 79.5 VESA(WXGA)

5. 1360×768 47.72 59.799 84.62 VESA(WXGA)

6 1366×768 47.7 60.00 84.62 WXGA

7. 1280×1024 63.595 60.00 108.875 SXGA

8. 1920×1080 66.647 59.988 138.625 WUXGA


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No. Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Proposed Remarks

1. 720*480 15.73 59.94 13.500 SDTV, DVD 480I(525I)

Spec. out but display.2. 720*480 15.75 60.00 13.514 SDTV, DVD 480I(525I)

3. 720*576 15.625 50.00 13.500 SDTV, DVD 576I(625I) 50Hz4. 720*480 31.47 59.94 27 SDTV 480P

5. 720*480 31.5 60.00 27.027 SDTV 480P

6. 720*576 31.25 50.00 27 SDTV 576P

7. 1280*720 44.96 59.94 74.176 HDTV 720P

8. 1280*720 45 60.00 74.25 HDTV 720P

9. 1280*720 37.5 50.00 74.25 HDTV 720P

10. 1920*1080 28.125 50.00 74.25 HDTV 1080I

11 1920*1080 33.72 59.94 74.176 HDTV 1080I

12 1920*1080 33.75 60.00 74.25 HDTV 1080I

13 1920*1080 56.25 50.00 148.5 HDTV 1080P

14 1920*1080 67.432 59.94 148.350 HDTV 1080P

15 1920*1080 67.5 60.00 148.5 HDTV 1080P

16 1920*1080 27 24.00 74.25 HDTV 1080P

17 1920*1080 33.75 30.00 74.25 HDTV 1080P

18 1920*1080 26.97 23.97 74.25 HDTV 1080P

19 1920*1080 33.716 29.976 74.25 HDTV 1080P

6.2. DTV Mode


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ADJUSTMENT INSTRUCTION

1. Application RangeThis specification sheet is applied to all of the LED LCD TV

with LP24B chassis.

2. Designation(1) Because this is not a hot chassis, it is not necessary touse an isolation transformer. However, the use of isolation

transformer will help protect test instrument.

(2) Adjustment must be done in the correct order.

(3) The adjustment must be performed in the circumstance of

25 °C ± 5 °C of temperature and 65 % ± 10 % of relative

humidity if there is no specific designation.

(4) The input voltage of the receiver must keep 100-220 V,

50/60Hz.

(5) The standard signal level is approved in 65 dBµV ± 1 dBµV.(6) The receiver must be operated for over 5 minutes prior to

the adjustment when module is in the circumstance of

above 15 °C.

► In case of keeping module is in the circumstance of 0

°C, it should be placed in the circumstance of above 15°C for 2 hours.

► In case of keeping module is in the circumstance of

below -20 °C, it should be placed in the circumstance of

above 15 °C for 3 hours.

3. PCB assembly adjustment method3.1. Mstar Main S/W program download3.1.1. Using D/L Jig

(1) Preliminary steps

1) Connect the download jig to D-sub(JK201) Jack.

(2) Download steps

1) Execute ‘ISP Tool’ program, the main window(Mstar ISP

utility Vx.x.x) will be opened.2) Click the “Connect” button and confirm “Dialog Box”.

3) Click the “Config.” button and Change speed

I2C Speed setting : 350Khz~400Khz

4) Read and write bin file

Click “(1)Read” tab, and then load download file(XXXX.

bin) by clicking “Read”.

5) Click “(2)Auto” tab and set as below

6) Click “(3)Run”.

7) After downloading, you can see the “(4)Pass” message.

3.1.2. Using the Memory Stick** USB DOWNLOAD : Service Mode

1) Insert the USB memory Stick to the USB port. (The file

name of bin file should start as “M8R…”. and Bin file

should not be encrypted)2) Automatically detect the bin file and ask download or not.


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3) Press OK key then Message will be changed as below.

4) Plug off and on TV set, then you can see downloading

process.

5) Then, Plug off and on TV set again, and Download is

finished

3.2. Input tool option.- Adjust tool option refer to the BOM.

■ Tool Option Input : PCBA Check Process

■ Area Option Input : Set Assembly Process

- After Input Tool Option and AC off Before PCBA check, you have to change the Tool option and

have to AC off/on (Plug out and in)

(If missing this process, set can operate abnormally)

(1) Profile : Must be changed the option value because being

different with some setting value depend on module

maker, inch and market

(2) Equipment : adjustment remote control.

(3) Adjustment method

- The input methods are same as other chassis. (Use

IN-START key on the Adjust Remote control.)

(If not changed the option, the input menu can differ the

model spec.)

Refer to Job Expression of each main chassis ass’y

(EBTxxxxxxxx) for Option value.*Caution: Don’t Press “IN-STOP” key after completing the

function inspection.

* Caution: Don’t connect HDMI cable when downloading the

EDID. If the cables are connected, Downloading of

edid could be failed.

3.3. EDID data- EDID D/L method: The EDID data is automatically saved.

■ HD MODEL

3.4. ADC Calibration3.4.1. ADC Calibration-Component

(Using External pattern)

* Required Equipments

■ Remote controller for adjustment

■ MSPG-925F/MSPG-1025/MSPG-3233 Pattern Generator

3.4.2. Process(1) Change the Input to Component mode.

(2) Input the Component 480P@60 Hz 100% color Bar Y Pb

Pr signal into Component. (MSPG-925F Model: 212/

Pattern: 65)

(3) Press ADJ key on R/C for adjustment.

(4) Enter Password number. Password is “0413”.

(5) Select “Auto-RGB” and press OK(■) key.(6) ADC adjustment is executed automatically.

(7) When ADC adjustment is finished, this OSD appear

“COMPONENT - OK”.

3.4.3. Confirmation(1) Adjust by commanding AUTO_COLOR_ADJUST (0xF1)

0x00 0x02 instruction

(2) We confirm whether “0x77 (offset), 0x78 (gain)” address of

EEPROM “0xBE” is “0xAA” or not.

(3) If “0x77”, “0x78” address of EEPROM “0xBE” isn’t “0xAA”,

we adjust once more

(4) We can confi rm the ADC values from “0x56~0x5B”

addresses in a page “0xBE”

3.4.4. EEPROM Address

0 1 2 3 4 5 6 7 8 9 A B C D E F

0 00 FF FF FF FF FF FF 00 1E 6D 01 00 01 01 01 01

10 01 16 01 03 80 A0 5A 78 0A F3 30 A4 54 46 96 26

20 0F 49 4B 21 08 00 45 40 01 01 61 40 01 01 01 01

30 01 01 01 01 01 01 01 1D 00 72 51 D0 1E 20 6E 2840 55 00 C4 8E 21 00 00 1E 1B 21 50 A0 51 00 1E 30

50 48 88 35 00 BC 77 21 00 00 1C 00 00 00 FC 00 4C

60 47 20 54 56 0A 20 20 20 20 20 20 20 00 00 00 FD

70 00 3A 3F 1C 44 0F 00 0A 20 20 20 20 20 20 01 A6

80 02 03 25 F1 4F 84 07 01 16 02 03 11 12 13 14 05

90 20 22 1F 10 23 09 07 07 83 01 00 00 68 03 0C 00

A0 10 00 80 1E 00 01 1D 00 80 51 D0 1C 20 40 80 35

B0 00 BC 88 21 00 00 1E 8C 0A D0 8A 20 E0 2D 10 10

C0 3E 96 00 13 8E 21 00 00 18 8C 0A A0 14 51 F0 16

D0 00 26 7C 43 00 C4 8E 21 00 00 98 01 1D 80 18 71

E0 1C 16 20 58 2C 25 00 C4 8E 21 00 00 9E 00 00 00

F0 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 2A

EEPROM Address

EEPROM Sub Address 0XBE

Red Gain 0X59

Green Gain 0X5A

Blue Gain 0X5B

Red Offset 0x56

Green Offset 0X57

Blue Offset 0X58


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3.5. Check SW Version3.5.1 Method

(1) Push In-star key on Adjust remote-controller.

(2) SW Version check

Check “Main : Vx.xx” :

4. SET assembly adjustment method4.1. Input Area-Option

(1) Profile : Must be changed the Area option value because

being different of each Country’s

(2) Equipment : adjustment remote control.

(3) Adjustment method

- The input methods are same as other chassis.(Use

IN-START key on the Adjust Remote control.)

Refer to Job Expression of each main chassis ass’y

(EBTxxxxxxxx) for Option value.

4.2. Adjustment of White Balance.■ Purpose: Adjust the color temperature to reduce the

deviation of the module color temperature.

■ Principle: To adjust the white balance without the saturation,

Fix the one of R/G/B gain to C0 and decrease the others.

■ Adjustment mode : Three modes - Cool / Medium / Warm

(Medium data is automatically calibrated by the Cool data)

■ Adj. condition: normal temperature

1) Surrounding Temperature: 25 °C ± 5 °C

2) Warm-up time: About 5 Min

3) Surrounding Humidity: 20 % ~ 80 %

■ Required Equipment

■ Remote controller for adjustment

■ Color Analyzer : CA100+ or CA-210 or same product - LCD

TV(CH: 9), (should be used in the calibrated ch by CS-1000)

■ Auto W/B adjustment instrument (only for Auto adjustment)

4.2.1. Connecting diagram of equipment for measuring(For Automatic Adjustment)

(1) Enter the adjustment mode of DDC

■ 22Set command delay time : 50ms

■ Enter the DDC adjustment mode at the same time heat-

run mode when pushing the power on by power only key)

■ Maintain the DDC adjustment mode with same conditionof Heat-run → Maintain after AC off/on in status of Heat-

run pattern display

(2) Release the DDC adjustment mode

■ Release the adjust mode after AC off/on or std-by off/on

in status of finishing the Hear-run mode.

■ Release the Adjust mode when receiving the aging off

command(WB 00 FF) from adjustment equipment.

■ Need to transmit the aging off command to TV set after

finishing the adjustment.

■ Check DDC adjust mode release by exit key and release

DDC adjust mode.

(3) Enter the adjust mode of white balance

■ Enter the white balance adjustment mode with agingcommand(F3, 00, 00).

(4) Release the adjust mode of white balance

■ Enter the white balance adjustment mode with aging

command(F3, 00, FF)

* Luminance min value is 150cd in the Cool/Medium/Warm

mode(For LCD)

Tool Option Area Option

Module

Maker

0 : CMI

1 : THTF

2 : LPL

Lang Group 0 : NONEU A

1 : NONEU H

2 : NONEU ALL

Inch 0 : 22” (Default)

1 : 23”

2 : 32”

Def. Lang 0 : ENGLISH

1 : CHINESE

2 : ESPANOL

3 : PORTUGUES

Frame 0 : LK230 (Default) TTX Group 0 : OFF

1 : ON

Module

Rev.

0 : Rev.0 (Default)

1 : Rev.1

I II SAVE 0 : OFF

1 : ON

HDEV

MONOBlueBack

Country


12/26



4.3. Adjustment of White Balance(for Manual adjustment)

■ Color analyzer(CA100+, CA210) should be used in the

calibrated ch by CS-1000

■ Operate the zero-calibration of the CA100+ or CA-210, then

stick sensor to the module when adjusting.

■ For manual adjustment, it is also possible by the followingsequence.

1) Select white pattern of heat-run by pressing “POWER

ON” key on remote control for adjustment then operate

heat run longer than 5 minutes. (If not executed this

step, the condition for W/B may be different.)

2) Push “Exit” key.

3) Change to the AV mode by remote control.

4) Input external pattern (85% white pattern)

5) Push the ADJ key two times (entering White Balance

mode) → Enter “0413” (Password)

6) Stick the sensor to the center of the screen and select

each items (Red/Green/Blue Gain and Offset) using

▲/▼(CH +/-) key on R/C..

7) Adjust R/ G/ B Gain using ◄/►(VOL +/-) key on R/C.

8) Adjust three modes all (Cool / Medium / Warm) : Fix theone of R/G/B gain and change the others

9) When adjustment is completed, Exit adjustment mode

using EXIT key on R/C.

* CASE

First adjust the coordinate far away from the target value(x, y).

1) x, y > target

i) Decrease the R, G.

2) x, y < target

i) First decrease the B gain,

ii) Decrease the one of the others.

3) x > target , y < target

i) First decrease B, so make y a little more than the target.

ii) Adjust x value by decreasing the R

4) x < target , y > targeti) First decrease B, so make x a little more than the target.

ii) Adjust x value by decreasing the G

■ Standard color coordinate and temperature when using the

CA100+ or CA210 equipment (Small size inch’s color

coordinate is different from others, So use below table)

1) All Edge LED(except LGD), lamp over 26 and None

Edge LED(LGD Direct LED 42inch) and LGD Edge LED

26inch Over

2) 22” TN Edge LED

(Small size inch’s color coordinate is different from

others, so use below table)

3) 22” Lamp (CMI & THTF)

(Small size inch’s color coordinate is different from

others, So use below table)

4) W/B table in process of time which must be applied for

LGD edge LED module” (Target color coordinate is

different by aging time)

CA210 : CH 14, Test signal : Inner pattern (85IRE)

To check the Coordinates of White Balance, you have to

measure at the below conditions.

Picture Mode : Vivid(User)

Dynamic Contrast : Off , Dynamic Colour : Off

(If you miss the upper condition, the coordinates of W/B

can be lower than the spec.)

ModeColor coordinate

Temp ∆uvx y

Cool 0.271 ± 0.002 0.276 ± 0.002 13,000 K 0.000

Medium 0.287 ± 0.002 0.296 ± 0.002 9,300 K 0.000

Warm 0.315 ± 0.002 0.332 ± 0.002 6,500 K 0.003


Temp ∆uvx y

Cool 0.287 ± 0.002 0.296 ± 0.002 9,300 K 0.000

Medium 0.297 ± 0.002 0.308 ± 0.002 8,000 K 0.000

Warm 0.315 ± 0.002 0.332 ± 0.002 6,500 K 0.003


Temp ∆uvx y

Cool 0.280 ± 0.002 0.283 ± 0.002 9,300 K 0.000

Medium 0.290 ± 0.002 0.295 ± 0.002 8,000 K 0.000

Warm 0.308 ± 0.002 0.319 ± 0.002 6,500 K 0.000

Aging time

(Min)

Cool Medium Warm

X y x y x y

269 273 285 293 313 329

0-2 Minutes 279 288 295 308 319 338

3-5 Minutes 278 286 294 306 318 336

6-9 Minutes 277 285 293 305 317 335

10-19 Minutes 276 283 292 303 316 333

20-35 Minutes 274 280 290 300 314 330

36-49 Minutes 272 277 288 297 312 327

50-79 Minutes 271 275 287 295 311 325

80-149 Minutes 270 274 286 294 310 324

More than 150 Minutes 269 273 285 293 313 329


13/26



TROUBLE SHOOTING

No power

(LED indicator off)

Check 24V, 12V, 3.5Vof Power B/D Check short of Main B/Dor Change Power B/D

Pass

Check Output of

IC701, IC702, IC705,

IC704, IC709

Check P400 Connector

Change LED Assy

: [A] Process (for non-adapter models)

Fail

Fail

Pass

Pass

Check LED Assy

Check Output of Q720

Pass

Check short of

IC701, IC702, IC705,

IC704, IC709

Fail

Re-soldering or Change defect part

Fail

No power

(LED indicator off)

Check output of adapter

(JK700 : 24V)Check short of Main B/D

or Change adapter

Pass

Check Output of

IC701, IC702, IC704,

IC705, IC706,IC707,IC708,

IC709,IC800

Check P400 Connector

Change LED Assy

: [A-1] Process (for adapter models)

Fail

Fail

Pass

Pass

Check LED Assy

Check Output of Q720

Pass

Check short of

IC701, IC702, IC704,

IC705, IC706,IC707,IC708,

IC709,IC800

Fail

Re-soldering or Change defect part

Fail


14/26



No Raster : [B] Process

Check LED status

On Display Unit Repeat [A]/[A-1] Process

Fail

Check PANEL_VCC of LVDS wafer Check Output of Q720Fail

Change Inverter Connector

Or Inverter Fail

Pass

Fail

Pass

Change LVDS CableFail

Check LVDS Cable

Pass

Check Panel Link Cable

Or Module

Change Panel Link Cable

Or Module

Check Inverter Connector

Or Inverter

Pass

No Raster on COMPONENT Signal

Check Input source

Cable And Jack

Pass

Re-soldering or

Change the defect part

Pass

Check the Input/Output

Of IC501

FailRe-soldering or


Repeat [A]/[A-1], & [B] Process

Check The Input/Output

Of JK101

Fail

Pass

No Raster on HDMI Signal

Check Input source

Cable And Jack

Pass


Of JK203

Fail Re-soldering or


Pass

Pass

Pass


Of IC501

Fail Re-soldering or



Pass


15/26



No Raster On AV Video Signal No Signal On TV(RF) Signal

Check Input source

Cable And Jack

Pass

Check Input source

Cable And Jack

Pass


Of JK101

Pass

Re-soldering or


Pass

Fail

Pass



Of IC501

FailRe-soldering or


Pass


Of TU401

Pass

Re-soldering or


Pass

Fail


Of IC501

FailRe-soldering or



No Sound

Check The Input Source


Of IC301

Re-soldering or


Fail

Pass

Pass

Check The Speaker Change SpeakerFail

Check The Speaker Wire

Pass

Change The Source InputFail


16/26


17/26



A 2

A 2 1

A 1 0

A 9

A 4

* S e t +

S t a n d

* S t a n d

B a s e

+

B o d y

9 0 0

9 1 0

4 0 0

5 4 0

5 2 1

5 3 0

8 1 0

2 0 0

3 0 0

5 0 1

5 0 0

1 2 0

1 2 2

1 2 3

5 1 0

L V 1

EXPLODED VIEW

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These

parts are identified by in the Schematic Diagram and EXPLODED VIEW.

It is essential that these special safety parts should be replaced with the same components as

recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.

Do not modify the original design without permission of manufacturer.

IMPORTANT SAFETY NOTICE


18/26

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF ISESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

R115

10K

Q105RT1C3904-T112

E

BC

C1045600pF50V

R12012K

R112220K

COMMON_RIN

MUTE_AOUT

R11912K

MUTE_AOUT

R10775

R116

10K

R111220K

COMP_PR

ZD10630V

D10530V

ZD10730V

Q104RT1C3904-T112

E

BC

MNT_ROUTC1035600pF50V

MNT_LOUTR124

1K

COMMON_LIN

R10975

ZD101SD05

COMP_PB

COMMON_VIN

Q103RT1C3904-T112

E

BC

Q106RT1C3904-T112

E

BC

ZD102SD05

R10875

ZD100SD05

D10430V

R123

1K

C101 10uF

16V

C102 10uF

16V

C105560pF50V

READY

C106560pF50V

READY

JK101

PPJ243-01

5C [GN]C-SPRING

6C [GN]E-LUG

4C [GN]CONTACT

5D [BL]C-SPRING

7E [RD2]E-LUG-S

5E [RD2]C-SPRING

5F [WH2]C-SPRING

4G [RD3]CONTACT

5G [RD3]C-SPRING

6G [RD3]E-LUG

6A [WH1]E-LUG

5A [WH1]C-SPRING

4B [RD1]CONTACT

5B [RD1]C-SPRING

6B [RD1]E-LUG

Q103-*1

2N3904S

For China

E

B

C

Q105-*12N3904S

For China

E

B

C

Q104-*1

2N3904S

For China

E

B

C

Q106-*1

2N3904S

For China

E

B

C

COMPONENT / AV IN / AV AUDIO OUT

LP24B

EAX64671103

POP NOISE

POP NOISE

pyright © 2012 LG Electronics. Inc. All rights reserved.

y for training and service purposes


19/26

U SB D

OWN

STREAM


DSUB_SDA

DSUB_SCL

JK201

SPG09-DB-0106630TGA004Q

RED

1

GREEN

2

BLUE

3

GND_1

4

DDC_GND

5

RED_GND6

GREEN_GND7

BLUE_GND8

NC9

SYNC_GND10

GND_2

11

DDC_DATA12

H_SYNC13

V_SYNC14

DDC_CLOCK15

SHILED16

ZD21030V

C21033pFREADY

ZD21130V

C21133pFREADY

HPDR23010K

R2311K

Q230

2SC3875S

MMBT3904(NXP)

E

B

C

JK203

14 NC

13 CEC

5 DATA1_SHIELD

20

SHIELD

12 CLK-

11 CLK_SHIELD

2 DATA2_SHIELD

19 HPD

18 +5V_POWER

10 CLK+

4 DATA1+

1DATA2+

17 DDC/CEC_GND

9 DATA0-

8 DATA0_SHIELD

3 DATA2-

16 SDA

7 DATA0+

6DATA1-

15 SCL

L221

120OHM

READY

C223

10uF16V

READY

JK2023AU04S-305-ZC-(LG)

1

2

3

4

5 C222

0.1uF50V

READY

R222510

READY

R2211K

READY

+5V_USB

ZD22130V

READY

D220READY

AAC

C

ZD22030V

READY

IC202

AP2191SG-13

READY

3IN_2

2IN_1

4EN

1GND

5FLG

6OUT_1

7OUT_2

8NC

USB_DP

USB_DN

+3.3V_M

R220

0

R223

4.7K

READY

L220

120-ohmC22010uF10V

C221100uF16V

LP24B

EAX64671103

I2C Control

Close to SIDE_USB

USB(SIDE)

HDMI(REAR)




20/26

THERMAL


MNT_ROUT

C3500.1uF16V

MNT_LOUT

C3550.1uF16V

C30210uF10V

OPT

0.1uF

C316

50V

C321390pF50V

R32712

R32612

R32412

L304

10.0uH

C322390pF50V

R30610K

C3060.1uF

16V

R31812

C309

1uF

25V

L305

10.0uH

C301

100pF

50V

R 31 2 1 00

D303

100V

1N4148W

OPT

C323

1uF

25V

R315

100

D302

100V

1N4148W

OPT

0.1uFC311

16V

R340

10K

I2S_WS

C326

22000pF

50V

C 3 1 2

2 2 0 0 0 p F

5 0 V

L306

10.0uH

+3.3V_M

0.1uF

C308

16V

C325

1uF

25V

SOUND_VCC

C313

33pF

50V

C3034.7uF16V

SOUND_VCC

D304

100V

1N4148W

OPT

I2S_MCLK

C314

33pF

50V

I2S_SDO

I2S_SCK

R307

3.3K

AUAMP_SDA

C342390pF50V

AUAMP_SCL

R31612

C324

22000pF

50VR33810K

C3041000pF50V

R 31 3 1 00

C337390pF50V

C320

22000pF

50V

L303

10.0uH

R31912

L309

BLM18PG121SN1D

R32512

C31010uF10V

OPT

IC301

NTP-7500L

1AGND_PLL

2AVDD_PLL

3DVDD_PLL

4LF

5DGND_PLL

6GND_1

7DGND

8DVDD

9SDATA

10WCK

11BCK

12SDA

1 3

S C L

1 4

/ F A U L T

1 5

M O N I T O R 0

1 6

M O N I T O R 1

1 7

M O N I T O R 2

1 8

B S T 2 B

1 9

P G N D 2 B

2 0

O U T 2 B_

1

2 1

O U T 2 B_

2

2 2

P V D D 2_

1

2 3

P V D D 2_

2

2 4

P V D D 2_

3

25 OUT2A_1

26 OUT2A_2

27 PGND2A

28 BST2A

29 VDR2

30 AGND

31 VCC_5

32 VDR1

33 BST1B

34 PGND1B

35 OUT1B_1

36 OUT1B_2 3 7

P V D D 1_

1

3 8

P V D D 1_

2

3 9

P V D D 1_

3

4 0

O U T 1 A_

1

4 1

O U T 1 A_

2

4 2

P G N D 1 A

4 3

B S T 1 A

4 4

/ R E S E T

4 5

A D

4 6

G N D_

I O

4 7

C L K_

I

4 8

V D D_

I O

49

[ E P ] R317

12

0.1uF

C333

50V

C341

10uF

10V

HW_RESET

C317

10uF

35V

0.1uFC305

16V

OPT

+3.5V_ST

SW_RESET

Q302

MMBT3904(NXP)

E

B

C

C3071000pF

50V

D301

100V

1N4148W

OPT

C3181000pF

50V

C360

10uF

35V

R3284.7K

R E A D Y

R3294.7K

R E A D Y

+3.3V_M

R 36 1 1 00

R362 100

R363100

R 36 0 1 00

LP24B

EAX64671103

AUDIO_OUT




21/26

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF ISESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.R

KEY2

R4244.7K

+3.3V_M

IR

R42210K

C4010.1uF16V

READY

ZD4215.6V

Soft/T

SUB_SDA

ZD4225.6V

C422470pF

50V

Non_Adapter

L424

120-ohm

L423120-ohm

SUB_SCL

IF_N

C40547pF50V

R42310K

C4210.1uF

READY

RF_AGC

R4034.7K

C4000.1uF16V

READY

R401

100

R4060

READY

C40310uF10V

L426

120-ohm

R405

47C40647pF50V

5V_TUNER

TUNER_SDA

C424

0.1uF

16V

C425

1000pF

50V

L422120-ohm

R426

10K

+3.5V_ST

C426100pF

50VREADY

C402100uF16V

READY

ZD4205.6V

Soft/T

R404

47

C4200.1uF

READY

TUNER_SCL

IF_P

C42847pF50V

READY

R4070

READY

C4270.1uF

50V

READY

R4024.7K

+3.3V_M

C423470pF50V

Non_Adapter

+3.5V_ST

0.01uFC404

50V

LED

+3.5V_ST

KEY1

R420Soft/T

100

R421Soft/T

100

R4

0

10P_

TU401

TDTK-G703D

5B+[+5V]

11AIF-

2NC_2

10AIF+

4RF_AGC

1NC_1

9NC_5

8NC_4

3NC_3

7 SCL

6SDA

12

SHIELD

LP24B

EAX64671103

Near the pin

IF




22/26


23/26


RXO4-

RXE3-

R62710K

REA

RXO0-

RXE3+

RXO1-

L621120-ohm26_32 inch

P603

FF10001-30WAFER_HD_LARGE

1[30]

2[29]

3[28]

4[27]

5[26]

6[25]

7[24]

8[23]

9[22]

10[21]

11[20]

12[19]

13[18]

14[17]

15[16]

16[15]

17[14]

18[13]

19[12]

20[11]

21[10]

22[09]

23[08]

24[07]

25[06]

26[05]

27[04]

28[03]

29[02]

30[01]

31

.

RXO3+

PANEL_VCC

RXO1+

P600FI-RE51S-HF-J-R1500

WAFER_FHD_51P

1[01]

2[02]

3[03]

4[04]

5[05]

6[06]

7[07]

8[08]

9[09]

10[10]

11[11]

12[12]

13[13]

14[14]

15[15]

16[16]

17[17]

18[18

19[19]

20[20]

21[21]

22[22]

23[23]

24[24]

25[25]

26[26]

27[27]

28[28]

29[29]

30[30]

31[31]

32[32]

33[33]

34[34]

35[35]

36[36]

37[37]

38[38]

39[39]

40[40]

41[41]

42[42]

43[43]

44[44]

45[45]

46[46]

47[47]

48[58]

49[59]

50[50]

51[51]

52

.

RXECK-

RXO2-

RXE1-

RXE0-

RXE4+

+3.3V_M

RXE3-

RXE1+

RXE0+

R624 0 HD_LARGE

RXE2+

RXE0-

RXECK+

RXE1-

RXOCK-

R624.7K

READ

RXE2-

RXO4+

RXE0+

R623 0 READY

RXE3+

RXE2+

RXE4-

RXOCK+

RXECK-

C628

10uF

16VREADY

RXO0+

RXE1+

RXO3-

RXO2+

RXECK+

RXE2-

R622 0 READY

C626

0.1uF

16V26_32 inch

C627

1000pF

50VREADY

R602 0

FHD_51P_IPS

R 60 1 1 0K

FHD_51P_BIT_SEL_LOW

R6284.7K

READY

+3.3V_M

R62910K

READY

PANEL_VCC

C603

10uF

16V

READY

C601

0.1uF

16V

42 Inch

L601120-ohm

42 Inch

C602

1000pF

50V

READY

R603 0

42" AUO

R604 0

42" AUO

LP24B

EAX64671103

[51Pin LVDS Connector](For FHD 60Hz_Large)

[30Pin LVDS Connector] (For HD 60Hz_Large)




24/26


25/26

THERMAL

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF ISESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.R

PWM_DIM_LED_DRIVER

WLED_ENABLE

R8123K

1/8W+3.5V_ST

R827100

1/10W

C802

2.2uF

50V

Q801AP18T10GH

S

D

G

C8122200pF50V

ERROR_OUT

C8040.1uF50V

IC800

MAX16814

1IN

3COMP

7

S E T I

9

S G N D

1 0

D I M

11 OUT1

12 OUT2

13 LEDGND

14 OUT3

15 OUT4 1 6

C S

1 7

P G N D

1 8

N D R V

1 9

D R V

2 0

V C C

5FLT

8

R S D T

6

O V P

4RT

2EN 21

[ E P ] P G N D / L E D G N D

R822-*2

59K

1/16W1%

CMI_TN

C802.2

100V

C8030.1uF50V

R820

51K 1%READY

R816

4.71/10W

C814100pF50V

R819

390

1/10W

R828

16K 1%

L80133uH

C806

1000pF

50VREADY

R821

47K

1/10W

1%AUO_TN

R821-*1

27K

1/10W

1%LGD_TN

R80210K

C81

100

50V

+24V_LED_driver

R813

0.1

1%

R814

560K

1/10W

R818

100K

1/10W

R80110K

READY

R817100

1/10W

INV_ON

R815-*1

11K

1/10W 5%21.5_AUO_LGD_

R800

10K

Q800

MMBT3904(NXP) E

B

C

+3.3V_M

R810

5.1

READYC8051000pF

50VREADY

C80810uF

100V

C8100.1uF50V

R822

51K

1/10W

5%AUO_TN

C8191uF10V

R821-*2

59K

1/16W1%

CMI_TN

R803

1K

C8072.2uF

100V

D801PDS5100H-13

R82410K

1/8W

R804

6.8K

READY

R825100

1/10WREADY

C811100pF50V

R811

3.3

1/10W

5%

C813

0.33uF50V

C801

2.2uF

50V

WLED_ENABLE

C816

1000pF

50V

C815

1000pF

50V

R823

7.5K

1/8W

R826

10K

1/10W

READYR822-*1

27K

1/10W

1%LGD_TN

R815

13K

1/10W 5%

22_CMI_EDGE

LP24B

EAX64671103

59Kohm

C106 : 0.68uF --> 0.33uF

ILED=1500/RSETI

R10013

61.35mA

2010.06.30. hwson

for thermal Issue

must be modifed

110mA_Typ

CMI_18.5

51.27Kohm

R10011

AUO_21.5_FHD

50mA_Typ

CMI_21.5

36

CMI_21.5_FHD

Operating Freq.

50.85mA

TN_module_LED_DRIVER_CIRCUIT

AUO_21.557.

3.3K -> 1K (threshold voltage up)

2010.02.07 for PQ/19V_LED

ModuleModule

59Kohm

must be modifed

60mA_Typ

C104 : 10uF --> 2.2nF

Remark

CMI_18.5_HD

44.

LGD_21.5

52.

ILED spec

51Kohm

33

R113/R114

LGD_21.5_FHD

63mA_Max47Kohm

ESD protection

47.

AUO_18.5

111.11mA

2010.06.30 HWSON

R121 : 0.03 --> 0.1

R120 : 6.8K --> 3K

OVP setting

120mA_Max

OVP sett

R111 : 470 --> 390

Vs

34

56mA_Max

close to IC100

close to IC100

56

34

F=7.35x10^9/RT

27Kohm

AUO_18.5_HD




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Documents

lg_32ls3150-ta_chassis_lp24b_mfl67452813