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2002 Microchip Technology Inc. DS21345B-page 1
Features
• Combines Two Comparators and a VoltageReference in a Single Package
• Optimized for Single Supply Operation
• Small Package: 8-Pin MSOP
• Ultra Low Input Bias Current: Less than 100pA
• Low Quiescent Current, Operating: 10µA (Typ.)Shutdown Mode: 6µA (Typ.)
• Rail-to-Rail Inputs and Outputs
• Operates Down to VDD = 1.8V
• Reference and One Comparator Remain Active inShutdown to Provide Supervisory Functions
Applications
• Power Supply Circuits
• Battery Operated Equipment
• Consumer Products
• Replacements for Discrete Components
Device Selection Table
Package Type
General Description
The TC1040 is a mixed-function device combining twocomparators and a voltage reference in a single 8-pinpackage. The inverting input of Comparator A and thenon-inverting input of Comparator B are internallyconnected to the reference.
This increased integration allows the user to replacetwo packages, which saves space, lowers supplycurrent and increases system performance. TheTC1040 operates from two 1.5V alkaline cells down toVDD = 1.8V. It requires only 10µA typical of supplycurrent, which significantly extends battery life. A lowpower shutdown input (SHDN) disables one of thecomparators, placing its outputs in a high-impedancestate. This mode saves battery power and allowscomparator outputs to share common analog lines(multiplexing). Shutdown current is 6µA (typical).
Rail-to-rail inputs and outputs allow operation from lowsupply voltages with large input and output signalswings.
Packaged in an 8-Pin MSOP, the TC1040 is ideal forapplications requiring low power level detection.
Functional Block DiagramPart Number PackageTemperature
Range
TC1040CEUA 8-Pin MSOP -40°C to +85°C
INB-
REF
1
2
3
4
8
7
6
5
TC1040CEUA
8-Pin MSOP
OUTB
VDD
INA+
VSS
OUTA
SHDN
+ –
+
–
TC1040OUTB
VDD
REF
SHDN INB-
INA+
VSS
OUTA
BA
VoltageReference
VSS
1
2
3
4 5
6
7
8
TC1040Linear Building Block – Dual Low Power Comparator and
Voltage Reference with Shutdown
TC1040
DS21345B-page 2 2002 Microchip Technology Inc.
1.0 ELECTRICALCHARACTERISTICS
ABSOLUTE MAXIMUM RATINGS*
Supply Voltage ......................................................6.0V
Voltage on Any Pin .......... (VSS – 0.3V) to (VDD + 0.3V)
Junction Temperature.......................................+150°C
Operating Temperature Range............. -40°C to +85°C
Storage Temperature Range .............. -55°C to +150°C
*Stresses above those listed under "Absolute MaximumRatings" may cause permanent damage to the device. Theseare stress ratings only and functional operation of the deviceat these or any other conditions above those indicated in theoperation sections of the specifications is not implied.Exposure to Absolute Maximum Rating conditions forextended periods may affect device reliability.
TC1040 ELECTRICAL SPECIFICATIONS
Electrical Characteristics: Typical values apply at 25°C and VDD = 3.0V. Minimum and maximum values apply for TA = -40° to+85°C and VDD = 1.8V to 5.5V, unless otherwise specified.
Symbol Parameter Min Typ Max Units Test Conditions
VDD Supply Voltage 1.8 — 5.5 V
IQ Supply Current Operating — 10 15 µA All outputs unloaded, SHDN = VDD
ISHDN Supply Current, Shutdown — 0.05 0.1 µA SHDN = VSS
Shutdown Input
VIH Input High Threshold 80% VDD — — V
VIL Input Low Threshold — — 20% VDD V
ISI Shutdown Input Current — — ±100 nA
Comparators
ROUT(SD) Output Resistance in Shutdown 20 — — MΩ SHDN = VSS, COMPB only
COUT(SD) Output Capacitance in Shutdown — — 5 pF SHDN = VSS, COMPB only
TSEL Select Time (For Valid Output) — 20 — µsec (SHDN = VIH to VOUT)RL =10kΩ to VSS, COMPB only
TDESEL Deselect Time — 500 — nsec (SHDN = VIL to VOUT)RL =10kΩ to VSS, COMPB only
VIR Input Voltage Range VSS – 0.2 — VDD + 0.2 V
VOS Input Offset Voltage -5-5
— +5+5
mV VDD = 3V, TA = 25°CTA = -40°C to 85°C
IB Input Bias Current — — ±100 pA TA = 25°C, INA+, INB- = VDD to VSS
VOH Output High Voltage VDD – 0.3 — — V RL = 10kΩ to VSS
VOL Output Low Voltage — — 0.3 V RL = 10kΩ to VDD
PSRR Power Supply Rejection Ratio 60 — — dB TA = 25°CVDD = 1.8V to 5V
ISRC Output Source Current 1 — — mA INA+ = VDD, INB- = VSSOutput Shorted to VSSVDD = 1.8V
ISINK Output Sink Current 2 — — mA INA+ = VSS, INB- =VDD,Output Shorted to VDDVDD = 1.8V
tPD1 Response Time — 4 — µsec 100mV Overdrive, CL = 100pF
tPD2 Response Time — 6 — µsec 10mV Overdrive, CL = 100pF
Voltage Reference
VREF Reference Voltage 1.176 1.200 1.224 V
IREF(SOURCE) Source Current 50 — — µA
IREF(SINK) Sink Current 50 — — µA
CL(REF) Load Capacitance — — 100 pF
EVREF Voltage Noise — 20 — µVRMS 100Hz to 100kHz
eVREF Noise Density — 1.0 — µV/√Hz 1kHz
2002 Microchip Technology Inc. DS21345B-page 3
TC1040
2.0 PIN DESCRIPTION
The description of the pins are listed in Table 2-1.
TABLE 2-1: PIN FUNCTION TABLE
Pin No.(8-Pin MSOP)
Symbol Description
1 OUTA Comparator output.
2 VSS Negative power supply.
3 INA+ Non-inverting input to Comparator A.
4 INB- Inverting input to Comparator B.
5 SHDN Shutdown input.
6 REF Voltage reference output.
7 VDD Positive power supply.
8 OUTB Comparator output.
TC1040
DS21345B-page 4 2002 Microchip Technology Inc.
3.0 DETAILED DESCRIPTION
The TC1040 is one of a series of very low power, linearbuilding block products targeted at low voltage, singlesupply applications. The TC1040 minimum operatingvoltage is 1.8V and typical supply current is only 10µA(fully enabled). It combines two comparators and avoltage reference in a single package. A shutdownmode is incorporated for easy adaptation to systempower management schemes. During shutdown, onecomparator is disabled (i.e., powered down with outputat a high impedance). The “still awake” comparator andvoltage reference can be used as a wake-up timer,power supply monitor, LDO controller or othercontinuous duty circuit function.
3.1 Comparators
The TC1040 contains two comparators. The compara-tor’s input range extends beyond both supply voltagesby 200mV and the outputs will swing to within severalmillivolts of the supplies, depending on the load currentbeing driven. The inverting input of Comparator A andthe non-inverting input of Comparator B are internallyconnected to the output of the voltage reference.
The comparators exhibit a propagation delay andsupply current which are largely independent of supplyvoltage. The low input bias current and offset voltagemake them suitable for high impedance precisionapplications.
Comparator B is disabled during shutdown and has ahigh impedance output. Comparator COMPA remainsactive.
3.2 Voltage Reference
A 2.0 percent tolerance, internally biased, 1.20Vbandgap voltage reference is included in the TC1040.It has a push-pull output capable of sourcing andsinking 50µA. The voltage reference remains fullyenabled during shutdown.
3.3 Shutdown Input
SHDN at VIL disables one comparator. The SHDN inputcannot be allowed to float; when not used, connect it toVDD. The disabled comparator’s output is in a highimpedance state when shutdown is active. Thedisabled comparator’s inputs and outputs can be drivenfrom rail-to-rail by an external voltage when theTC1040 is in shutdown. No latchup will occur when thedevice is driven to its enabled state when SHDN is setto VIH.
4.0 TYPICAL APPLICATIONS
The TC1040 lends itself to a wide variety ofapplications, particularly in battery powered systems. Ittypically finds application in power management,processor supervisory and interface circuitry.
4.1 Wake-Up Timer
Many microcontrollers have a low-power “sleep” modethat significantly reduces their supply current. Typically,the microcontroller is placed in this mode via a softwareinstruction, and returns to a fully-enabled state uponreception of an external signal (“wake-up”). The wake-up signal is usually supplied by a hardware timer. Mostsystem applications demand that this timer have a longduration (typically seconds or minutes), and consumeas little supply current as possible.
The circuit shown in Figure 4-1 is a wake-up timermade from Comparator A. (Comparator A is usedbecause the wake-up timer must operate when SHDNis active.) Capacitor C1 charges through R1 until avoltage equal to VR is reached, at which point the“wake-up” is driven active. Upon wake-up, themicrocontroller resets the timer by forcing a logic lowon a dedicated, open drain I/O port pin. This dischargesC1 through R4 (the value of R4 is chosen to limitmaximum current sunk by the I/O port pin). With a 3Vsupply, the circuit as shown consumes typically 8µAand furnishes a nominal timer duration of 25 seconds.
FIGURE 4-1: WAKE-UP TIMER
Wake-Up
R15M
R4
VR
C110µF
VDD
VDD
–
+
I/O*
*Open Drain Port Pin
Microcontroller
COMPA
1/2
TC1040
2002 Microchip Technology Inc. DS21345B-page 5
TC1040
4.2 Precision Battery Monitor
Figure 4-2 is a precision battery low/battery deadmonitoring circuit. Typically, the battery low outputwarns the user that a battery dead condition isimminent. Battery dead typically initiates a forcedshutdown to prevent operation at low internal supplyvoltages (which can cause unstable system operation).
The circuit in Figure 4-2 uses a single TC1040, one-half of a TC1029, and only six external resistors.COMPA and COMPB provide precision voltagedetection using VR as a reference. Resistors R2 andR4 set the detection threshold for BATT LOW, whileResistors R1 and R7 set the detection threshold forBATT FAIL. The component values shown assertBATT LOW at 2.2V (typical) and BATT FAIL at 2.0(typical). Total current consumed by this circuit istypically 22µA at 3V. Resistors R5 and R6 providehysteresis for comparators COMPA and COMPB,respectively.
4.3 External Hysteresis (Comparator)
Hysteresis can be set externally with two resistorsusing positive feedback techniques (see Figure 4-3).The design procedure for setting external comparatorhysteresis is as follows:
1. Choose the feedback resistor RC. Since theinput bias current of the comparator is at most100pA, the current through RC can be set to100nA (i.e., 1000 times the input bias current)and retain excellent accuracy. The currentthrough RC at the comparator’s trip point is VR /RC where VR is a stable reference voltage.
2. Determine the hysteresis voltage (VHY) betweenthe upper and lower thresholds.
3. Calculate RA as follows:
EQUATION 4-1:
4. Choose the rising threshold voltage for VSRC(VTHR).
5. Calculate RB as follows:
EQUATION 4-2:
6. Verify the threshold voltages with theseformulas:
VSRC rising:
EQUATION 4-3:
VSRC falling:
EQUATION 4-4:
RA RC
VHY
VDD-----------
=
RB1
VTHR
VR RA×---------------------
1
RA-------– 1
RC-------–
-----------------------------------------------------------=
VTHR VR( ) RA( ) 1RA-------
1
RB-------
1
RC-------
+ +=
VTHF VTHR
RA VDD×RC
------------------------- –=
TC1040
DS21345B-page 6 2002 Microchip Technology Inc.
FIGURE 4-2: PRECISION BATTERY MONITOR
FIGURE 4-3: COMPARATOREXTERNAL HYSTERESISCONFIGURATION
VDD
VDD
VDD
R2, 330k, 1%
R4, 470k, 1%
R5, 7.5M
R6, 7.5M
R3, 470k, 1%
R1, 270k, 1%
VR
To System DC/DCConverter
3V Alkaline
TC1040
BATTFAIL
BATTLOWCOMPA
+
–
COMPB+
–
AMP1
+
–
+
TC1034
+
–
VR
VDD
VOUTVSRC
RA
RB
RC
COMPA
TC1040
1/2
2002 Microchip Technology Inc. DS21345B-page 7
TC1040
5.0 TYPICAL CHARACTERISTICS
Note: The graphs and tables provided following this note are a statistical summary based on a limited number ofsamples and are provided for informational purposes only. The performance characteristics listed hereinare not tested or guaranteed. In some graphs or tables, the data presented may be outside the specifiedoperating range (e.g., outside specified power supply range) and therefore outside the warranted range.
7
6
5
4
3
21.5 2 2.5 3 3.5 4 4.5 5 5.5
SUPPLY VOLTAGE (V) SUPPLY VOLTAGE (V)
Comparator Propagation Delayvs. Supply Voltage
DE
LA
Y T
O R
ISIN
G E
DG
E (
µsec
)
Overdrive = 10mV
Overdrive = 50mV
7
6
5
4
3
21.5 2 2.5 3 3.5 4 4.5 5 5.5
DE
LA
Y T
O F
AL
LIN
G E
DG
E (
µsec
)
7
6
5
4
3-40°C 85°C25°C
TEMPERATURE (°C)
DE
LA
Y T
O R
ISIN
G E
DG
E (
µsec
) Overdrive = 100mV
Overdrive = 10mV
Overdrive = 50mV
Comparator Propagation Delayvs. Supply Voltage
Comparator Propagation Delayvs. Temperature
TA = 25°CCL = 100pF
TA = 25°CCL = 100pF
Overdrive = 100mVVDD = 4V
VDD = 5V
VDD = 2V
VDD = 3V
-40°C 85°C25°C
2.5
2.0
1.5
1.0
.5
00 1 2 3 4 5 6
VD
D -
VO
UT (
V)
ISOURCE (mA)
7
6
5
4
3
Comparator Output Swingvs. Output Source Current
DE
LA
Y T
O F
AL
LIN
G E
DG
E (
µsec
)
Overdrive = 100mV
2.5
2.0
1.5
1.0
.5
00 1 2 3 4 5
Comparator Propagation Delayvs. Temperature
Comparator Output Swingvs. Output Sink Current
TEMPERATURE (°C) ISINK (mA)
VDD = 4V
VDD = 5V
VDD = 2V
VDD = 3V
TA = 25°C TA = 25°C
VDD = 3VVDD = 1.8V
VDD = 5.5V
VDD = 3V
VDD = 1.8V
VDD = 5.5V
VO
UT -
VS
S (
V)
6
60
50
Sinking
40
30
20
10
00 1 2 3 4 5 6
OU
TPU
T S
HO
RT-
CIR
CU
IT C
UR
RE
NT
(mA
)
SUPPLY VOLTAGE (V)
Comparator Output Short-CircuitCurrent vs. Supply Voltage
Sourcing
TA = -40°C
T A = -4
0°C
TA = 25°C
TA = 85°C
TA = 25°C
TA = 85°C
RE
FE
RE
NC
E V
OL
TA
GE
(V
)
1.240
1.220
1.200
1.180
1.160
1.1400 2 4 6 8 10
LOAD CURRENT (mA)
Reference Voltage vs.Load Current
VDD = 1.8V VDD = 3VVDD = 5.5V
Sinking
Sourcing
VDD = 1.8V
VDD = 3V
VDD = 5.5V
4
3
2
1
00 100 200 300 400S
UP
PL
Y A
ND
RE
FE
RE
NC
E V
OL
TA
GE
S (
V)
TIME (µsec)
Line TransientResponse of VREF
VDD
VREF
TC1040
DS21345B-page 8 2002 Microchip Technology Inc.
5.0 TYPICAL CHARACTERISTICS (CONTINUED)
1.25
1.20
1.15
1.10
1.051 2 3 4 5
RE
FE
RE
NC
E V
OL
TA
GE
(V
)
0 1 2 3 4 5 6
SU
PP
LY
CU
RR
EN
T (
µA)
SUPPLY VOLTAGE (V)
Supply Current vs. Supply Voltage
TA = 85°C
TA = -40°CTA = 25°C
Reference Voltagevs. Supply Voltage
SUPPLY VOLTAGE (V)
12
11
10
9
8
7
6
2002 Microchip Technology Inc. DS21345B-page 9
TC1040
6.0 PACKAGING INFORMATION
6.1 Package Marking Information
Package marking data not available at this time.
6.2 Taping Form
6.3 Package Dimensions
Component Taping Orientation for 8-Pin MSOP Devices
Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size
8-Pin MSOP 12 mm 8 mm 2500 13 in
Carrier Tape, Number of Components Per Reel and Reel Size
PIN 1
User Direction of Feed
Standard Reel Component Orientationfor TR Suffix Device
W
P
8-Pin MSOP
.122 (3.10)
.114 (2.90)
.122 (3.10)
.114 (2.90)
.043 (1.10) MAX.
.006 (0.15) .002 (0.05)
.016 (0.40)
.010 (0.25)
.197 (5.00)
.189 (4.80)
.008 (0.20)
.005 (0.13)
.028 (0.70)
.016 (0.40)
6° MAX.
.026 (0.65) TYP.
PIN 1
Dimensions: inches (mm)
TC1040
DS21345B-page 10 2002 Microchip Technology Inc.
NOTES:
2002 Microchip Technology Inc. DS21345B-page11
TC1040
Sales and Support
Data SheetsProducts supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recom-mended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1. Your local Microchip sales office2. The Microchip Corporate Literature Center U.S. FAX: (480) 792-72773. The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
New Customer Notification SystemRegister on our web site (www.microchip.com/cn) to receive the most current information on our products.
TC1040
DS21345B-page12 2002 Microchip Technology Inc.
NOTES:
2002 Microchip Technology Inc. DS21345B-page 13
TC1040
Information contained in this publication regarding deviceapplications and the like is intended through suggestion onlyand may be superseded by updates. It is your responsibility toensure that your application meets with your specifications.No representation or warranty is given and no liability isassumed by Microchip Technology Incorporated with respectto the accuracy or use of such information, or infringement ofpatents or other intellectual property rights arising from suchuse or otherwise. Use of Microchip’s products as critical com-ponents in life support systems is not authorized except withexpress written approval by Microchip. No licenses are con-veyed, implicitly or otherwise, under any intellectual propertyrights.
Trademarks
The Microchip name and logo, the Microchip logo, FilterLab,KEELOQ, microID, MPLAB, PIC, PICmicro, PICMASTER,PICSTART, PRO MATE, SEEVAL and The Embedded ControlSolutions Company are registered trademarks of Microchip Tech-nology Incorporated in the U.S.A. and other countries.
dsPIC, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,In-Circuit Serial Programming, ICSP, ICEPIC, microPort,Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM,MXDEV, PICC, PICDEM, PICDEM.net, rfPIC, Select Modeand Total Endurance are trademarks of Microchip TechnologyIncorporated in the U.S.A.
Serialized Quick Turn Programming (SQTP) is a service markof Microchip Technology Incorporated in the U.S.A.
All other trademarks mentioned herein are property of theirrespective companies.
© 2002, Microchip Technology Incorporated, Printed in theU.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received QS-9000 quality systemcertification for its worldwide headquarters,design and wafer fabrication facilities inChandler and Tempe, Arizona in July 1999and Mountain View, California in March 2002.The Company’s quality system processes andprocedures are QS-9000 compliant for itsPICmicro® 8-bit MCUs, KEELOQ® code hoppingdevices, Serial EEPROMs, microperipherals,non-volatile memory and analog products. Inaddition, Microchip’s quality system for thedesign and manufacture of developmentsystems is ISO 9001 certified.
DS21345B-page 14 2002 Microchip Technology Inc.
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03/01/02
*DS21345B*
WORLDWIDE SALES AND SERVICE