Logic and Switch Products Ordering Information

© 2004 Fairchild Semiconductor Corporation MS012540 www.fairchildsemi.com

September 1995

Revised February 2004

Lo

gic an

d S

witch

Pro

du

cts Ord

ering

Info

rmatio

n

Logic and Switch Products Ordering Information

Ordering Information

TinyLogic is a trademark of Fairchild Semiconductor Corporation.

CROSSVOLT , FACT , FACT Quiet Series , FAST , FASTr , and MicroPak are trademarks of Fairchild Semiconductor Corporation.

www.fairchildsemi.com 2

Package Comparison Summary Dimensions in millimeters. (To scale but not actual size.)

5-Lead Package Options

6-Lead Package Options 6-Lead MicroPak

8-Lead Package Option 8-Lead MicroPak

3 www.fairchildsemi.com

Package Comparison Summary (Continued)Dimensions in millimeters. (To scale but not actual size.)

8-Terminal Package Option 10-Lead MicroPak


14-Terminal Package Option




16-Terminal Package Option (16C) 16-Terminal Package Option (16E)

20-Terminal Package Option








54-Ball Package Option 56-Lead Package Options

96-Ball Package Option 114-Ball Package Option


Small Outline Package Comparison

Units: Inch (mm)

Units: Inch (mm)

Units: Inch (mm)

Package (Code)

Dim 14-Pin 16-Pin 20-Pin 24-Pin

Min Max Min Max Min Max Min Max

SOIC JEDEC A 0.228 0.245 0.228 0.245 0.393 0.420 0.393 0.420

(M, WM) (5.80) (6.20) (5.80) (6.20) (10.0) (10.65) (10.0) (10.65)

B 0.149 0.158 0.149 0.158 0.291 0.300 0.291 0.300

(3.80) (4.00) (3.80) (4.00) (7.40) (7.60) (7.40) (7.60)

SOP EIAJ A 0.295 0.319 0.295 0.319 0.295 0.319

(SJ) (7.50) (8.10) (7.62) (8.89) (7.62) (8.89)

B 0.205 0.213 0.205 0.213 0.205 0.213

(5.20) (5.40) (5.20) (5.40) (5.20) (5.40)

SSOP EIAJ A — — — — 0.301 0.311 0.301 0.311

Type II (MSA) — — — — (7.65) (7.90) (7.65) (7.90)

B — — — — 0.205 0.212 0.205 0.212

— — — — (5.2) (5.38) (5.2) (5.38)

TSSOP A 0.244 0.260 0.244 0.260 0.244 0.260 0.244 0.260

(MTC) (6.20) (6.60) (6.20) (6.60) (6.20) (6.60) (6.20) (6.60)

B 0.169 0.177 0.169 0.177 0.169 0.177 0.169 0.177

(4.30) (4.50) (4.30) (4.50) (4.30) (4.50) (4.30) (4.50)

SSOP JEDEC A 0.231 0.241 0.231 0.241 0.231 0.241

(aka QSOP) (5.87) (6.12) (5.87) (6.12) (5.87) (6.12)

(QSC) B 0.151 0.157 0.151 0.157 0.151 0.157

(3.84) (3.99) (3.84) (3.99) (3.84) (3.99)

48/56 Lead Package Comparison

Dim 48-Pin 56-Pin

Min Max Min Max

SSOP A 0.395 0.420 0.395 0.420

(MEA) (10.04) (10.66) (10.04) (10.66)

B 0.291 0.299 0.291 0.299

(7.40) (7.59) (7.40) (7.59)

TSSOP A 0.313 0.325 0.313 0.325

(MTD) (7.95) (8.25) (7.95) (8.25)

B 0.236 0.244 0.236 0.244

(6.00) (6.20) (6.00) (6.20)

5-Lead Package Comparison

Dim Min Max

SOT-23 A 0.106 0.118

(M5) (2.69) (2.99)

B 0.600 0.066

(1.53) (1.67)

SC70 (P5) A 0.078 0.086

(2.00) (2.20)

B 0.045 0.053

(1.15) (1.35)

6-Lead Package Comparison

Dim Min Max

SC70 A 0.078 0.086

(P6) (2.00) (2.20)

B 0.045 0.053

(1.15) (1.35)


Package Ordering Code vs.Fairchild Semiconductor Package Drawing NumberPackage

DescriptionFairchild Semiconductor Package Drawing Number

Code 5/6 Lead 8/10 Lead 14-Lead 16-Lead 20-Lead 24-Lead 48-Lead 56-Lead BGA

BQX Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC

MLP014 MLP16E MLP020B MLP024B

G Fine-Pitch Ball Grid Array (BGA), JEDEC

BGA54ABGA96ABGA114A

M5 SOT-23 MA05B

P5 SC70 (5-Lead) MAA05A

L6 MicroPak MAC06A

P6 SC70 (6-Lead) MAA06A

K8 US8 MAB08A

L8 MicroPak MAC08A

L10 MicroPak MAC010A

N Molded Dual-In-Line Package

N14A N16A N20A

M Molded Small Outline Package, JEDEC

M14A M16A M20B M24B

MP Molded Leadless Package (MLP)

MLP08C MLP16C

WM Molded Small Outline Package,JEDEC

M20B M24B

SJ Molded Small Outline Package, EIAJ

M14D M16D M20D

MSA Molded Shrink Small Outline Package, EIAJ, Type II (SSOP)

MSA20 MSA24

MTC Molded Thin Shrink Small Outline Package, JEDEC, 4.4 mm Body Width (TSSOP)

MTC14 MTC16 MTC20 MTC24

QSC Molded Shrink Small Outline Package, JEDEC (also known as QSOP)

MQA16 MQA20 MQA24

MEA Molded Shrink Small Outline Package, JEDEC (SSOP)

MS48A MS56A

MTD Molded Thin Shrink Small Outline Package, JEDEC, 6.1 mm Body Width (TSSOP)

MTD48 MTD56


Tube/Tape-and-Reel QuantitiesImmediate Container Quantity

PackageCode

PackageDescription

Package Drawing Number Tube/Rail/Tray Tape and Reel

BQX MLP14A Not Available 3000

BQX Depopulated Quad Very-Thin Flat Pack No Leads, JEDEC MLP16E Not Available 3000

BQX MLP20B Not Available 3000

G BGA54A 364 2500

G Fine-Pitch Ball Grid Array, JEDEC BGA96A 285 2500

G BGA114A 240 2500

M5 SOT-23 MA05B Not Available 250

M5X SOT-23 MA05B Not Available 3000

MP MLP08C Not Available 3000

MP Molded Leadless Package, JEDEC MLP16C Not Available 3000

MPX MLP24B Not Available 3000

P5 SC70 MAA05A Not Available 250

P5X SC70 MAA05A Not Available 3000

P6 SC70 MAA06A Not Available 250

P6X SC70 MAA06A Not Available 3000

K8X US8 MAB08A Not Available 3000

L6X MicroPak-6 MAC06A Not Available 5000



M M14A 55 2500

M Small Outline Package, M16A 48 2500

WM JEDEC (SOIC) M20B 36 1000

WM M24B 30 1000

SJ M14D 47 2000

SJ Small Outline Package, EIAJ (SOP) M16D 47 2000

SJ M20D 38 2000

QSC Shrink Small Outline Package, MQA16 94 2500

QSC JEDEC (QSOP or JEDEC SSOP) MQA20 54 2500

QSC MQA24 54 2500

MSA Shrink Small Outline Package, MSA20 66 2000

MSA EIAJ, Type II (SSOP II) MSA24 58 2000

MTC MTC14 94 2500

MTC Thin Shrink Small Outline Package, MTC16 94 2500

MTC JEDEC, 4.4mm (TSSOP) MTC20 73 2500

MTC MTC24 61 2500

MEA Shrink Small Outline Package MS48A 29 1000

MEA (SSOP) MS56A 25 1000

MTD Thin Shrink Small Outline Package, MTD48 38 1000

MTD 6.1mm (TSSOP) MTD56 34 1000


Tube Specifications and Drawings (All dimensions in millimeters)

14/16/20 Lead PDIPPackage Drawing Number: N14A, N16A, N20A

14/16 Lead SOIC, JEDEC and 20/24 Lead QSOPPackage Drawing Number: M14A, M16A, MQA16, MQA20, MQA24

20/24 Lead SOIC, JEDECPackage Drawing Number: M20B, M24B

SOP, EIAJ and SSOP II, EIAJPackage Drawing Number: M14D, M16D, M20D, MSA20, MSA24


Tube Specifications and Drawings (Continued)(All dimensions in millimeters)

TSSOP, JEDEC, 4.4 mm Body WidthPackage Drawing Number: MTC14, MTC16, MTC20 and MTC24

SSOPPackage Drawing Number: MS48A, MS56A

TSSOPPackage Drawing Number: MTD48, MTD56


Tape-and-Reel Overview and Technical Information

Tape-and-Reel Diagram

Tape Format and Device Orientation

MATERIALS

• Cavity Tape: Static Dissipative PVC or Polystyrene

• Cover Tape: Static Dissipative Polyester or Polyethylene

• Reel: Static Dissipative PVC or Polystyrene

• Surface Resistivity: 105 Ω/ to less than 1012 Ω/ allmaterials.

ELECTROSTATIC CHARGES

Fairchild Semiconductor uses only static dissipative tape

and reel materials (surface resistivity of 105Ω to 1012 Ω/ )to avoid damaging static charges building up during thepeeling off of the cover tape prior to pick and place. Fair-child Semiconductor ran extensive evaluations on covertape materials and found that static charge build up wasvery low (less than 200V) on static dissipative cover tapes.In comparison, commonly used insulative cover tapes hadreadings consistently in excess of 3000V.

COVER TAPE PEEL STRENGTH

• The force required to peel off the cover tape from thecarrier tape will fall within the range of 0.1 Newton to 1.3Newton (10 grams to 130 grams) at a peeling speed of300 mm per minute. This complies with the EIA stan-dard.

TAPE STORAGE

• It is recommended that the sealed tape be stored in con-ditions where the environment does not exceed:

→ Temperature: 40°C maximum

→ Relative humidity: 90% maximum

→ No direct exposure to sunlight.


Reel Specifications and Drawings (All dimensions in millimeters)

Plastic Reel Dimensions for 8mm, 12mm, 16mm, 24mm and 32mm Tape

Package Drawing Number

Tape A N W1 W2

Size (Typical) (Max)

(mm) (mm) (mm) (mm) (mm)

MA05BMAA05AMAA06A

8.0 178 55.0 8.4 14.4

MAC06AMAC08A

8.0 178 55.0 8.4 14.4

MAB08A 8.0 178 55.0 8.4 14.4

MLP08CMLP014AMLP016CMLP016EMLP020BMLP024B

12.0 330 55.0 12.4 18.4

MTC14MTC16

12.0 330 178 12.4 18.4

M14AM16A

MQA16MQA20MQA24 MSA20MSA24 MTC20MTC24

16.0 330 178 16.4 22.4

M14DM16D 16.0 330 100 16.4 22.4

M20BM24B M20DM20D

MTD48MTD56

24.0 330 178 24.4 30.4

BGA54A 16.0 330 178 16.4 22.4

BGA96ABGA114A 24.0 330 178 24.4 30.4

MS48AMS56A 32.0 330 100 32.4 38.4


Reel Specifications and Drawings (Continued)(All dimensions in millimeters)

SOT-23, SC70, SOIC, SOP, QSOP, SSOP II

Note 1: See Diagram below for SC-70 6-Lead package Pin Orientation.

PackageCode

PackageDescription


W(mm)

F(mm)

D(mm)

D1(mm)

P1(mm)

A(mm)

Ao(mm)

Bo(mm)

B(mm)

Ko(mm)

M5 SOT-23 MA05B 8.0 3.5 ± 0.05 φ1.55 ± 0.05 φ1.04 4.0 3.3 3.15 3.2 3.3 1.4

P5 SC70 MAA05A 8.0 3.5 ± 0.10 φ1.55 ± 0.05 φ1.04 4.0 2.35 2.45 2.45 2.35 1.35

P6(Note 1)

SC70 MAA06A 8.0 3.5 ± 0.10 φ1.55 ± 0.05 φ1.04 4.0 2.35 2.45 2.45 2.35 1.35

M JEDEC M14A 16.0 7.5 ± 0.1 φ1.55 ± 0.05 φ1.5 8.0 6.65 6.5 9.5 9.65 2.1

M (SOIC) M16A 16.0 7.5 ± 0.1 φ1.55 ± 0.05 φ1.5 8.0 6.65 6.5 10.3 10.45 2.1

WM M20B 24.0 11.5 ± 0.1 φ1.55 ± 0.05 φ1.5 12.0 11.08 10.9 13.3 13.45 3.0

WM M24B 24.0 11.5 ± 0.1 φ1.55 ± 0.05 φ1.5 12.0 11.10 10.9 15.9 16 3.0

SJ EIAJ M14D 16.0 7.5 ± 0.05 φ1.55 ± 0.05 φ1.5 12.0 8.70 8.4 10.7 11 2.4

SJ (SOP) M16D 16.0 7.5 ± 0.05 φ1.55 ± 0.05 φ1.5 12.0 8.80 8.4 10.7 11 2.4

SJ M20D 24.0 11.5 ± 0.05 φ1.55 ± 0.05 φ1.5 12.0 8.70 8.4 13.2 13.5 2.4

QSC JEDEC MQA16 16.0 7.5 ± 0.1 φ1.55 ± 0.05 φ1.5 8.0 6.65 6.5 9.5 9.65 2.1

QSC (QSOP or MQA20 16.0 7.5 ± 0.1 φ1.55 ± 0.05 φ1.5 8.0 6.65 6.5 9.5 9.65 2.1

QSC SSOP) MQA24 16.0 7.5 ± 0.1 φ1.55 ± 0.05 φ1.5 8.0 6.65 6.5 9.5 9.65 2.1

MSA EIAJ,Type II MSA20 16.0 7.5 ± 0.1 φ1.55 ± 0.05 φ1.5 8.0 8.6 7.6 2.5

MSA (SSOP II) MSA24 16.0 7.5 ± 0.1 φ1.55 ± 0.05 φ1.5 8.0 8.6 8.9 2.5



TSSOP 14, 16, 20 and 24-Lead

Package Code Package Description


W(mm)

A0(mm)

B0(mm)

B1(mm)

K0(mm)

K1(mm)

MTC Thin Shrink Small MTC14 12.0 6.95 ± 0.1 5.6 ± 0.1 6.3 1.6 1.2

MTC Outline Package, MTC16 12.0 6.95 ± 0.1 5.6 ± 0.1 6.3 1.6 1.2

MTC JEDEC, 4.4mm (TSSOP) MTC20 16.0 6.95 ± 0.1 7.1 ± 0.1 7.8 1.6 1.3

MTC MTC24 16.0 6.95 ± 0.1 8.3 ± 0.1 9.0 1.6 1.3



SSOP 48 and 56-Lead

Package Code Package DescriptionPackage Drawing Number

Ao(mm)

Bo(mm)

Ko(mm)

K1(mm)

P(mm)

MEA Shrink Small Outline Package, MS48A 12.0 16.2 3.2 2.4 16.0

MEA JEDEC (SSOP) MS56A 12.0 18.7 3.2 2.4 16.0



TSSOP 48 and 56-Lead

Package Code Package DescriptionPackage Drawing Number

Ao(mm)

Bo(mm)

B1(mm)

Ko(mm)

K1(mm)

MTD Thin Shrink Small Outline Package, MTD48 8.6 13.2 13.9 1.6 1.2

MTD JEDEC, 6.1mm (TSSOP) MTD56 8.6 14.5 17 1.8 1.3



MicroPak 6, 8, and 10-Lead

Package Tape Size DIM A DIM B DIM F DIM KO DIM P1 DIM W

L6X, L8X, 8 mm

0.093 0.096 0.138 ± 0.004 0.053 ± 0.004 0.157 0.315 ± 0.004

L10X (2.35) (2.45) (3.5 ± 0.10) (1.35 ± 0.10) (4) (8 ± 0.1)



US8 8-Lead

K8X

Package Tape Size DIM A DIM B DIM F DIM KO DIM P1 DIM W

K8X 8 mm0.093 0.096 0.138 ± 0.004 0.053 ± 0.004 0.157 0.315 ± 0.004

(2.35) (2.45) (3.5 ± 0.10) (1.35 ± 0.10) (4) (8 ± 0.1)


Lo

gic

an

d S

wit

ch P

rod

uct

s O

rder

ing

Info

rmat

ion


MLP/DQFN 8, 16, 20 and 24-Terminal

Package Code Package Description


A B C D N W1 W2

ML Molded Leadless Package (MLP), MLP08C

13.0(330.0)

0.059(1.50)

0.512(13.00)

0.795(20.20)

2.165(55.00)

0.488(12.4)

0.724(18.4)

ML JEDEC MLP016C

MPX MLP024B

BQX Depopulated Quad Very-Thin Flat MLP014A

BQX Pack No Leads (DQFN), MLP016E

BQX JEDEC MLP020B

Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied andFairchild reserves the right at any time without notice to change said circuitry and specifications.

LIFE SUPPORT POLICY

FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORTDEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILDSEMICONDUCTOR CORPORATION. As used herein:

1. Life support devices or systems are devices or systemswhich, (a) are intended for surgical implant into thebody, or (b) support or sustain life, and (c) whose failureto perform when properly used in accordance withinstructions for use provided in the labeling, can be rea-sonably expected to result in a significant injury to theuser.

2. A critical component in any component of a life supportdevice or system whose failure to perform can be rea-sonably expected to cause the failure of the life supportdevice or system, or to affect its safety or effectiveness.

www.fairchildsemi.com

Documents

Logic and Switch Products Ordering Information