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Eco-Info & Lead-free (Pb-free): Lead-

free (Pb-free) Logo

July 21, 2007 - TI Implements Label Changes for Lead-free (Pb-free) IC

packages to include chasing arrow symbol

Lead-free (Pb-free) Logo

TI to Implement Label Changes for Lead-free (Pb-free) IC packages

TI is committed to supplying Lead-free (Pb-free) semiconductor components that are

compatible with the higher temperature requirements of lead-free soldering processes.

TI defines "Lead-free (Pb-free) " or "Pb-Free" to mean semiconductor products thatare compatible with the current RoHS requirements for all six substances, including

the requirements that lead not exceed 0.1% by weight in homogeneous materials.

RoHS, also known as "Restriction on the Use of Hazardous Substances in Electrical

and Electronic Equipment," refers to legislation 2002/95/EC enacted by the European

Union on January 27, 2003.

RoHS status is based on TI's current understanding of the European Union's RoHS

Directive 2002/95/EC, and TI's knowledge of the materials that go into its products.

Examples of TI's Pb-Free finishes include nickel-palladium-gold (NiPdAu) for 

leadframe-based packages and tin-silver-copper (SnAgCu) balls for array packages.Many TI packages are already qualified with Pb-Free finishes/balls and high-

temperature material sets.

In addition to the conversion of integrated circuit (IC) packages to Pb-Free/high-

temperature material sets, many TI packages will also transition to "Green" mold

compounds. TI defines "Green" to mean Pb-Free (RoHS compatible), and free of 

Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed

0.1% by weight in homogeneous material).

Pb-Free Product Package Labels: After July 21, 2007, TI began shipping Pb-Free

capable IC components using packing labels on shipping boxes and bags thatcontinue to align with JESD97 "Marking, Symbols and Labels for Identification of 

Lead (Pb) Free Assemblies, Components and Devices" released in May 2004. There

are no changes to the Pb-free symbol currently used on products containing no RoHS

materials above the maximum concentration values. TI labels will continue to reflect

these markings for applicable devices (See Figures 1 - 4 below).

TI originally implemented the use of the Pb-free logo on packaging labels in 2003 for 

devices that utilize both a Pb-Free finish and a material set rated for use in lead-free

reflow processes (see the details of TI's previous labeling, Pb-free Label through May

2004, Pb-free Label June 2004 through June 2007).

TI is rating our surface mount packages for use in reflow operations with a peak 

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temperature as defined by the JEDEC document (J-STD-020).

Pb-Free Finish Category: The JESD97 standard includes Pb-Free finish categories

with an option to identify the component finish on the packing label and in the device

marking (see figure 5 below). The JEDEC Pb-Free finish categories that describe theLead-free (Pb-free) terminal finish/material of components and/or the solder 

 paste/solder used in board assembly are:

• e1 - SnAgCu (shall not be included in category e2)

• e2 - Sn alloys with no Bi or Zn excluding SnAgCu

• e3 - Sn

• e4 - Preplated (e.g., Ag, Au, NiPd, NiPdAu)

• e5 - SnZn, SnZnx (no Bi)

• e6 - contains Bi

• e7 - low temperature solder (</= 150C) containing Indium (no Bi)

• e0, e8, e9 symbols are unassigned at this time

TI will print the Pb-Free finish category (e1, for example) on the packing label of 

applicable device/package combinations beginning June 1, 2004.

Green Conversions: Beginning June 1, 2004, TI will change the "e" in the Pb-free

finish category to a "G" when a TI device/package combination converts to a "Green"

mold compound. For example, a TI device built with NiPdAu finish will have a Pb-

free finish category of "e4" until a green mold compound is implemented. When

implemented, the Pb-Free finish category will be changed to "G4". (Replacement of 

the "e" with a "G" in the Pb-Free finish category is not part of the JEDEC standard at

this time, but will be implemented for TI products.)

RoHS symbolization: Beginning July 21, 2007, TI will add the chasing arrow

symbol to its labels. Products containing no RoHS materials above MCVs will have

the chasing arrow with an "e" in the middle. Product that contains RoHS materials

above MCVs, even if that use is exempted in the EU, will use the chasing arrow

symbol with the Environmentally Friendly Use Period of 50 years in the middle. This

would apply to products which require an EU RoHS exemption, like TI flip-chips, or 

 product that contains one of the RoHS materials above the MCV allowed.

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