LPDDR4 Memory Comparison 2019 - System Plus · ©2019 System Plus Consulting | LPDDR4 Memory Comparison 2019 1 22 Bd. Benoni Goullin 44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected]

©2019 System Plus Consulting | LPDDR4 Memory Comparison 2019 1

22 Bd. Benoni Goullin44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr

LPDDR4 Memory Comparison 2019Mainstream low power mobile DRAM physical analysis and cost comparison.SP19466- Memory report by Belinda DubeNovember 2019 – Sample

REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT

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Table of Contents

Overview / Introduction 3

o Executive Summary

o Reverse Costing Methodology

Company Profile 10

o Samsung

o SK Hynix

o Micron/Intel

Technology & Market 18

o DRAM Roadmap

o DRAM Revenue

Physical Analysis 24

o Samsung

Synthesis

Die design

Cross-Section

Patents

o Micron

Synthesis

Die design

Cross-Section

Patents

o SK Hynix

Synthesis

Die design

Cross-Section

Patents

Manufacturing Process Flow 147

o Global Overview

o Wafer Fabrication Unit

o Front-End Process

Cost Analysis 180

o Synthesis of the cost analysis

Yields Explanation & Hypotheses

DRAM wafer and die cost

Front-End Cost

Component Cost

Cost Analysis Comparison 223

Estimated Price and Gross Margin Analysis 230

Company services 240


Overview / Introductiono Executive Summaryo Comparison Summaryo Reverse Costing

Methodologyo Glossary

Company Profile

Technology and market

Physical Analysis

Manufacturing Process Flow

Cost Analysis

Cost Analysis Comparison

Selling Price Analysis

Related Reports

About System Plus

Executive Summary

• Samsung LPDDR4 is characterized by : Technology node 1y nm (17nm).

- Product: Samsung 12GB Mobile DRAM from Samsung S10 Plus

- (12Dies ) 8Gb DRAM memory dies (7.9mm x 4.3mm)

- Product release : H1’2019

• Micron is characterized by :Technology node 1x nm (19nm).

- Product : Micron 8GB Mobile DRAM from Huawei P30 Pro

- (8 Dies) 8Gb DRAM memory dies (9.9mm x 5.3mm)

- Product release : Q3-Q4 2018

• SK Hynix is characterized by : Technology node 1xnm

- Product : SK Hynix 6GB Mobile DRAM from Huawei P20 Pro

- (8 Dies) 6Gb DRAM memory Dies (7.1 mm x 4.6 mm)

- Product release : Q2’18


Overview / Introductiono Executive Summaryo Comparison Summaryo Reverse Costing

Methodologyo Glossary

Company Profile


Physical Analysis


Cost Analysis



Related Reports

About System Plus

Comparison Summary


Overview / Introduction

Company Profile


Physical Analysis o Physical Methodologyo Samsung

• Synthesis• Package• Physical Analysis• Patent• Outline

o Micron• Synthesis• Package• Physical Analysis• Patent• Outline

o SK Hynix • Synthesis• Package• Physical Analysis• Patent• Outline

o Comparison


Cost Analysis



Related Reports

About System Plus

Package Opening



Company Profile






o Comparison


Cost Analysis



Related Reports

About System Plus

Die Cross Section



Company Profile






o Comparison


Cost Analysis



Related Reports

About System Plus

Die Cross Cross Section 1



Company Profile






o Comparison


Cost Analysis



Related Reports

About System Plus

Cross Section 1- Isolation Trench and Word Line



Company Profile






o Comparison


Cost Analysis



Related Reports

About System Plus

Cross Section 1- Capacitors



Company Profile






o Comparison


Cost Analysis



Related Reports

About System Plus

Cross Section- Capacitors



Company Profile






o Comparison


Cost Analysis



Related Reports

About System Plus

Samsung Patent- Contacts



Company Profile






o Comparison


Cost Analysis



Related Reports

About System Plus

Micron Memory- Cross Section 1



Company Profile






o Comparison


Cost Analysis



Related Reports

About System Plus

Micron DRAM Memory- Cross Section



Company Profile






o Comparison


Cost Analysis



Related Reports

About System Plus

Micron Memory- Capacitor Structure



Company Profile






o Comparison


Cost Analysis



Related Reports

About System Plus

Micron Memory- CMOS Transistors



Company Profile






o Comparison


Cost Analysis



Related Reports

About System Plus

SK Hynix Memory- Metal Layers



Company Profile






o Comparison


Cost Analysis



Related Reports

About System Plus

SK Hynix Memory- Patent



Company Profile






o Comparison


Cost Analysis



Related Reports

About System Plus

Package Comparison



Company Profile


Physical Analysis

Manufacturing Process Flowo Samsung Overview

Front-End Processo SK Hynix Overview

Front End processo Micron Overview

Front End Processo Comparison

Cost Analysis



Related Reports

About System Plus

StairCase Basic Technic

Drawing not to Scale



Company Profile


Physical Analysis

Manufacturing Process Flowo Samsung Overview

Front-End Processo SK Hynix Overview

Front End processo Micron Overview

Front End Processo Comparison

Cost Analysis



Related Reports

About System Plus

Process flow Comparison



Company Profile


Physical Analysis


Cost Analysiso Synthesiso Toshiba/SanDisk

Supply Chain/Yield Wafer & Die Cost Package Cost Back-End Cost Component Cost

o Samsung Supply Chain/Yield Wafer & Die Cost Package Cost Back-End Cost Component Cost

o SK Hynix Supply Chain/Yield Wafer & Die Cost Package Cost Back-End Cost Component Cost

o Micron/Intel Supply Chain/Yield Wafer & Die Cost Package Cost Back-End Cost Component Cost

o Comparison



Related ReportsAbout System Plus

SK Hynix Memory – CMOS and Metal Layers Front End Cost



Company Profile


Physical Analysis







o Comparison




SK Hynix Memory Front-End Cost



Company Profile


Physical Analysis







o Comparison




Memory Wafer & Die Cost



Company Profile


Physical Analysis







o Comparison




Component Cost – SK Hynix



Company Profile


Physical Analysis


Cost Analysis

Cost Analysis Comparisono Wafer Cost o Die Costo CMOS o DRAM Memory Cellso Top metallizationo DRAM- Cost/Gb


Related Reports

About System Plus

CMOS Cost Comparison



Company Profile


Physical Analysis


Cost Analysis

Cost Analysis Comparisono Wafer Cost o Die Costo CMOS o DRAM Memory Cellso Top metallizationo DRAM- Cost/Gb


Related Reports

About System Plus

Cost per Gb Cost Comparison



Company Profile


Physical Analysis


Cost Analysis



Related Reports

About System Plus

Related Reports

MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT

MEMORY• DRAM & NAND Service – Memory Research• Status of the Memory Industry 2019

REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING

IC • Toshiba-SanDisk 3D DRAM Flash• Samsung 3D V-NAND 92 layers Memory• Leading-edge 3D NAND Memories Comparison 2018

https://www.i-micronews.com/products/status-of-the-memory-industry-2019/


https://www.i-micronews.com/products/nand-service-memory-research/




mailto:[email protected]?subject=Toshiba SanDisk 3D DRAM Flash report - tell me more

https://www.systemplus.fr/reverse-costing-reports/samsung-3d-v-nand-92-layer-memory/

https://www.systemplus.fr/reverse-costing-reports/leading-edge-3d-nand-memory-comparison-2018/








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Physical Analysis


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Company Profile


Physical Analysis


Cost Analysis



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About System Pluso Company serviceso Contact

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LPDDR4 MEMORY COMPARISON 2019



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LPDDR4 Memory Comparison 2019 - System Plus · ©2019 System Plus Consulting | LPDDR4 Memory Comparison 2019 1 22 Bd. Benoni Goullin 44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected]