LUXEON 3535 Mid-Power LEDsLUXEON 3535 Datasheet DS202 20130228 ©2013 Philips Lumileds Lighting Company. 2 General Information Product Nomenclature LUXEON Mid-Power Illumination emitters

Features and Benefits

•Highefficacyforsustainabledesign

•Compact3535package

•Minimum70and80CRIforbothindoorandoutdoorapplications

•ANSIcompliant1/6thcolorbinning

•SupportsENERGYSTAR®lumenmaintenancecertification

requirements

Key Applications

•Lamps

•IndoorAreaLighting

•Downlight

•Outdoor

•Architecture

•Highbay&Lowbay

LUXEON3535DatasheetDS202©2013PhilipsLumiledsLightingCompany.

LUXEON3535Mid-PowerLEDsIlluminationPortfolio

Introduction

LUXEON®3535deliversoptimizedperformanceincombinationwithqualityoflightneeded

fordistributedlightsourceapplications.Inadditiontodeliveringspecifiedcorrelatedcolor

temperatureandcolorrenderingcombinations,theseemittersdelivertheefficacyandreliability

requiredbytheindoorilluminationmarkets.Thisdocumentcontainstheperformancedata

neededtodesignandengineerapplicationsbasedontheseLUXEON3535emitters.

LUXEON3535DatasheetDS20220130228©2013PhilipsLumiledsLightingCompany. i

Table of Contents

General Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

Product Nomenclature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

Average Lumen Maintenance Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

Environmental Compliance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

Product Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

Optical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

JEDEC Moisture Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Reflow Soldering Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Mechanical Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Solder Pad Design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Relative Spectral Distribution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Light Output Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Luminous Efficacy Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Forward Current Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Typical Radiation Patterns . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Emitter Pocket Tape Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Emitter Reel Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Product Binning and Labeling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Forward Voltage Bins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

Color Bin Structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

LUXEON3535DatasheetDS20220130228©2013PhilipsLumiledsLightingCompany. 2

General Information

Product NomenclatureLUXEONMid-PowerIlluminationemittersaretestedandbinnedat100mA,withcurrentpulsedurationof20ms.All

characteristicchartswherethethermalpadiskeptatconstanttemperature(25ºCtypically)aremeasuredwithcurrentpulse

durationof20ms.

ThepartnumberdesignationsfortheMXM8seriesisexplainedasfollows:

MXMA-BCDE-IJKL

Where:

A — designatesminimumCRIperformance(value7=70minimumand8=80minimum)

B — designatesradiationpattern(valueP=Lambertian)

C — designatescolor(valueW=White)

D,E — designatesnominalANSICCT(forexample,30=3000Kand40=4000K)

I,J,K&L— designatesadditionalpartnumbers

ThereforeproductsinthisserieswithminimumCRIvalueof80,CCTof4000Kwillhavethepartnumberingscheme:

MXM8-PW40

Average Lumen Maintenance CharacteristicsLumenmaintenanceforsolid-statelightingdevices(LEDs)istypicallydefinedintermsofthepercentageofinitiallightoutput

remainingafteraspecifiedperiodoftime.

Environmental CompliancePhilipsLumiledsiscommittedtoprovidingenvironmentallyfriendlyproductstothesolid-statelightingmarket.LUXEON

Mid-PowerLEDsarecomplianttotheEuropeanUniondirectivesontherestrictionofhazardoussubstancesinelectronic

equipment,namelyREACHandtheRoHSdirective.PhilipsLumiledswillnotintentionallyaddthefollowingrestrictedmaterials

totheseLEDs:lead,mercury,cadmium,hexavalentchromium,polybrominatedbiphenyls(PBB)orpolybrominateddiphenyl

ethers(PBDE).


Product Selection

Product Selection for Mid-Power LEDs Solder Pad Temperature = 25°C, Test Current = 100 mA

Table 1.

Nominal CCT

Part Number

Minimum CRI

Typical CRI

Typical R9

Minimum Luminous Flux (lm) ɸ V

Typical Luminous Flux (lm) ɸ V

2700K MXM8-PW27-0000 80 82 10 28 32

3000K MXM8-PW30-0000 80 82 10 30 33

3500K MXM8-PW35-0000 80 82 10 30 34

4000K MXM8-PW40-0000 80 82 10 32 36

5000K MXM8-PW50-0000 80 82 10 32 36

5700K MXM8-PW57-0000 80 82 10 32 36

6500K MXM8-PW65-0000 80 82 10 32 36

Product Selection for Mid-Power LEDs Solder Pad Temperature = 25°C, Test Current = 100 mA

Table 2.

Nominal CCT Part Number

Color Rendering Index Minimum Luminous Flux (lm) ɸ V

Typical Luminous Flux (lm) ɸ V

Minimum Typical

4000K MXM7-PW40-0000 70 72 32 39

5000K MXM7-PW50-0000 70 73 32 39

5700K MXM7-PW57-0000 70 73 32 39

6500K MXM7-PW65-0000 70 74 32 39

Note for Tables 1 & 2:

1. PhilipsLumiledsmaintainsatoleranceof±7.5%onluminousfluxand±2onCRImeasurements.


Optical Characteristics

Optical Characteristics of Mid-Power LEDs Solder Pad Temperature = 25°C, Test Current = 100 mA

Table 3.

Nominal CCT

Color Temperature CCT Typical Total Included Angle [1] (degrees) u0 .90V

Typical Viewing Angle [2] (degrees) 2u ½Minimum Typical Maximum

2700K 2550K 2700K 2850K 150 115

3000K 2850K 3000K 3200K 150 115

3500K 3200K 3500K 3750K 150 115

4000K 3750K 4000K 4250K 150 115

5000K 4700K 5000K 5300K 150 115

5700K 5300K 5700K 6000K 150 115

6500K 6000K 6500K 7000K 150 115

Notes for Table 3:

1. Totalangleatwhich90%oftotalluminousfluxiscaptured.

2. Viewingangleistheoffaxisanglefromlampcenterlinewheretheluminousintensityis½ofthepeakvalue.


Electrical Characteristics

Electrical Characteristics of Mid-Power LEDs Thermal Pad Temperature = 25ºC, Test Current = 100 mA

Table 4.

Part Number

Forward Voltage Vf [1] (V) Typical Temperature

Coefficient of Forward Voltage [2] (mV/°C)

DVF / DTJ

Typical Thermal Resistance Junction to Solder Pad

(°C/W) Ru J-C

Minimum Typical Maximum

MXM8-PW27-0000MXM8-PW30-0000MXM8-PW35-0000MXM8-PW40-0000MXM8-PW50-0000MXM8-PW57-0000MXM8-PW65-0000

2.80 3.10 3.40 -2.0to-4.0 20

Notes for Table 4:

1. PhilipsLumiledsmaintainsatoleranceof±0.10Vonforwardvoltagemeasurements.

2.MeasuredatTjbetween25°Cand110°C.

Absolute Maximum Ratings

Table 5.

Parameter Maximum Performance

DCForwardCurrent(mA)[1] 150

PeakPulsedForwardCurrent(mA)[2] 180

ESDSensitivity Class3AHumanBodyModelClassCMachineModel

LEDJunctionTemperature[3] 115°C

OperatingCaseTemperatureat100mA -40°C-105°C

StorageTemperature -40°C-100°C

SolderingTemperature JEDEC020D260°C

AllowableReflowCycles 3

ReverseVoltage(Vr)[4],[5] -5V

Notes for Table 5:

1. Ripplecurrentwithafrequencyof50-150Hzisallowed,aslongastheaverageofthecurrentwaveformisbelow150mA,andthemaximumofthecurrentwaveformislowerthan180mA.

2.At10%dutycycleandpulsewidth10mS.

3. Propercurrentderatingmustbeobservedtomaintainjunctiontemperaturebelowthemaximum.

4. LUXEONMid-PowerLEDsarenotdesignedtobedriveninreversebias.

5.Atmaximumreversecurrentof10µA.

JEDEC Moisture Sensitivity

Table 6.

LevelFloor Life Soak Requirements

Standard

Time Conditions Time Conditions

2 1year [30°C/60%RH

168Hrs.+5/-0Hrs.

[85°C/60%RH


Reflow Soldering Characteristics

Table 7. Reflow Profile in Accordance with J-Std-020D.

Profile Feature Lead Free Assembly

Preheat/Soak:TemperatureMin(Tsmin)TemperatureMax(Tsmax)

MaximumTime(ts)fromTsmintoTsmax

150°C200°C

120seconds

Ramp-upRate(TLtoTp) 3°C/second

LiquidousTemperature(TL) 217°C

MaximumTime(tL)MaintainedaboveTL 150seconds

MaximumPeakPackageBodyTemperature(Tp) 260°C

Time(tp)within5°Cofthespecifiedtemperature(Tc) 10-30seconds

MaximumRamp-DownRate(TptoTL) 6°C/second

MaximumTime25°CtoPeakTemperature 8minutes

Note for Table 7:

1.AlltemperaturesrefertotheapplicationPrintedCircuitBoard(PCB),measuredonthesurfaceadjacenttothepackagebody.

0

50

100

150

200

250

300

0 50 100 150 200 250 300

Tem

pera

ture

(�C

)

Time (seconds)

TL: 217°C

255°C +5/-0°C

260°C +0/-5°C

ts: 60-120sec. tL: 60-150 sec,max

tp: 10-30sec. 30sec max.Tsmin: 150°C

Ramp-Up Rate, 3°C/sec. max.

Tsmax: 200°C

Tp: 260°C

Figure 1. Temperature profile for Table 7.


Mechanical Dimensions

Notes for Figure 2:

1.Alldimensionsareinmillimeters.

2. Tolerance:±0.10mm.

3.Materials

• LeadFrame:CopperAlloywithSilverPlating

• PackageBody:HighTemperatureThermalPlastic

• Encapsulant:SiliconeResin

• SolderLeadFinish:Sn-SnPlating

3.5

3.5

2.6

0.8

1.5

0.8

0.05

0.5 0.7

3.8 max

R 1. 30Anode Mark

Figure 2. Package outline drawing.


Solder Pad Design

Notes for Figure 3:

1. ThedrawingaboveshowstherecommendedsolderpadlayoutonPrintedCircuitBoard(PCB).

2.ApplicationBriefAB202providesextensivedetailsforthislayout.Inaddition,the.dwgfilesareavailableatwww.philipslumileds.comandwww.philipslumileds.cn.com.

Recommended Solder Pad Dimensions

Recommended Pad Layout Dimensions

Additional conductor area covered by solder mask for improving heat dissipation

Figure 3. Solder pad layout.


Relative Spectral Distribution

Relative Intensity vs . Wavelength, MXM7-PWXX

Relative Intensity vs . Wavelength, MXM8-PWXX

2.5

4000K

2.05000K

1.5

nten

sity

5700K

6500K4000K

1.0

Rel

ativ

e In 6500K4000K

0.5

5700K

5000K

0.0400 450 500 550 600 650 700 750 800

6500K

Wavelength (nm)

Figure 4. Typical color spectrum of MXM7-PWXX emitter, integrated measurement

at solder pad temperature = 25°C, forward current = 100 mA.

2.5

2700K

3000K

2.0

3000K

3500K

4000K

2700K

1.5

tens

ity

5000K

5700K

3000K

3500K

1.0

Rel

ativ

e In 6500K4000K

0.5

R

5700K

5000K

6500K

0.0400 450 500 550 600 650 700 750 800

Wavelength (nm)

Figure 5. Typical color spectrum of MXM8-PWXX emitter, integrated measurement

at solder pad temperature = 25°C, forward current = 100 mA.


Light Output Characteristics

Relative Flux over Temperature MXM8-PWXX/MXM7-PWXX

Relative Flux vs . Forward Current MXM8-PWXX/MXM7-PWXX

120%

100%

60%

80%

Flux

40%

60%

Rel

ativ

e

20%

40%

0%10 25 40 55 70 85 100 11510 25 40 55 70 85 100 115

Thermal Pad Temperature (C)

Figure 6. Typical relative light output vs. thermal pad temperature, forward current = 100 mA.

1.60

1.20

Flux

0.80

Rel

ativ

eF

0.40

0.000 25 50 75 100 125 150

Forward Current (mA)

Figure 7. Typical relative luminous flux vs. forward current, solder pad temperature = 25ºC.


Luminous Efficacy Characteristics

Relative Luminous Efficacy vs . Forward Current MXM8-PWXX/MXM7-PWXX

1.4

1.6

1.2

cy

1.0

us E

ffica

c

2700K

3000K

0.6

0.8

ve L

umin

o

3500K

4000K

0.4Rel

ativ 5000K

5700K

6500K

0 0

0.2

6500K

0.00 15 30 45 60 75 90 105 120 135 150

Forward Current (mA)

Figure 8. Typical emitter efficacy versus forward current, solder pad temperature = 25°C.


Forward Current Characteristics

Forward Current vs . Forward Voltage MXM8-PWXX/MXM7-PWXX

150

125

)

100

rren

t (m

A)

50

75

rwar

d C

ur

25

50

For

0

25

2.00 2.25 2.50 2.75 3.00 3.25 3.50 3.75 4.00

Forward Voltage (V)

Figure 9. Typical forward current vs. forward voltage, solder pad temperature = 25°C.


Typical Radiation Patterns

Radiation Pattern in Cartesian Coordinate System

Radiation Pattern in Polar Coordinate System

1.25

1.00

0.75

nten

sity

0.50

Rel

ativ

e In

0.25

0.00-90 -75 -60 -45 -30 -15 0 15 30 45 60 75 90

Angle (Degree)

Figure 10. Typical representative spatial radiation pattern.

0

30

60

90

120

150

180

-150

-120

-90

-60

-30

20%

40%

60%

80%

0

30

60

90

120

150

180

-150

-120

-90

-60

-30

20%

40%

60%

80%

0

30

60

90

120

150

180

-150

-120

-90

-60

-30

20%

40%

60%

80%

0

30

60

90

120

150

180

-150

-120

-90

-60

-30

20%

40%

60%

80%

Figure 11. Typical polar plot of radiation pattern.


Color Shift vs . Viewing Angle

0.06

0.07

Dx Dy

0.05

y

0.04

Dy

0.02

0.03

Dx,

0.01

-0.01

0.00

-90 -75 -60 -45 -30 -15 0 15 30 45 60 75 90

Angle (Degree)

Figure 12. Typical plot of color shift vs. viewing angle.


Emitter Pocket Tape Packaging

Notes for Figure 13:

1.Alldimensionsareinmillimeters

2. Emptycomponentpocketssealedwithtopcovertape

3. ThemaximumnumberofconsecutivemissingLEDsistwo.

8.0 ±0.1

5.5 ±

0.1

Ø1.50 4.0 ±0.1 2.0 ±0.05

Ø1.50 ±0.25/-0.0

12 +

0.3/-0

.1

0.29 ±0.02

2.2 ±0.1

3.75 ±0.1

Anode Mark

Anode Side

1.75 ±0.1

3.85 ±0.1

Figure 13. Emitter pocket tape packaging.


Emitter Reel Packaging

Notes for Figure 14:

1.Alldimentionsareinmillimeters.

2. Emptycomponentpocketssealedwithtopcovertape.

3. 7inchreel-1000piecesperreel.

4.Minimumpackingquantityis500pieces.

5. ThemaximumnumberofconsecutivemissingLEDsistwo.

6. InaccordancewithEIA-481-1-Bspecification.62

.5 +0

/-2.5

12.4 +2/-0

18.4 max18

0.0 ±

0.5

PART NO: MXM8-PW40-5601

CAT CODE: L56X DATE CODE: 1205

QUANTITY: 1998

LOT NO: 090430-0136959718

Ø24.0 ±0.5

Ø13.0 ±0.2

2.0 +0.5/-0.0

Figure 14. Emitter reel packaging.


Product Binning and Labeling

Purpose of Product Binning

Inthemanufacturingofsemiconductorproducts,thereisavariationofperformancearoundtheaveragevaluesgivenin

thetechnicaldatasheets.Forthisreason,PhilipsLumiledsbinstheLEDcomponentsforluminousflux,colorandforward

voltage(Vf).

Decoding Product Bin Labeling

LUXEONMid-Poweremittersarelabeledusingafourdigitalphanumericcode(CATcode)depictingthebinvaluesfor

emitterspackagedonasinglereel.Allemitterspackagedwithinareelareofthesame3-variablebincombination.Using

thesecodes,itispossibletodetermineoptimummixingandmatchingofproductsforconsistencyinagivenapplication.

Reelsof2700K,3000K,3500K,4000K,5000K,5700K,6500KemittersarelabeledwithafourdigitalphanumericCATcode

followingtheformatbelow.

ABCD

A= Fluxbin(Letc.)

BandC= Colorbin(Forexample51,52,53,54,55,56)

D= Vfbin

Luminous Flux Bins

Table8liststhestandardphotometricluminousfluxbinsforLUXEONMid-Poweremitters(testedandbinnedat100mA).

Althoughseveralbinsareoutlined,productavailabilityinaparticularbinvariesbyproductionrunandbyproductperformance.

Notallbinsareavailableinallcolors.

Table 8. Flux Bins - All Colors

Bin Code Minimum Photometric Flux (lm)

Maximum Photometric Flux (lm)

K 28 32

L 32 36

M 36 40

P 40 44

Tested and binned at 25°C, If=100 mA . Tester tolerance: ±7% .


Forward Voltage Bins

Table 9. Vf Bins

Bin Code Minimum Forward Voltage (V)

Maximum Forward Voltage (V)

T 2.8 2.9

V 2.9 3.0

W 3.0 3.1

X 3.1 3.2

Y 3.2 3.3

Z 3.3 3.4

Tested and binned at 25°C, If = 100 mA .


Color Bin Structure

MXM8-PW27-0000 Color Bin Structure

LUXEONMid-PowerEmittersaretestedandbinnedbyx,ycoordinates.

Table 10.

LUXEON Mid-Power ANSI 1/6 Color Bin Coordinates for MXM8-PW27-0000 Emitter

Bin Code x y Bin Code x y

81

0.46250.47290.48130.4703

0.41130.42990.43190.4130

84

0.44460.45460.46250.4520

0.39100.40950.41130.3927

82

0.45200.46250.47030.4593

0.39270.41130.41320.3944

85

0.44680.45620.46460.4546

0.40770.42600.42800.4095

83

0.45460.46460.47290.4625

0.40950.42800.42990.4113

86

0.43730.44680.45460.4446

0.38930.40770.40950.3910

Notes for Table 10:

1. Testertolerance:±0.01inxandycoordinates.

0.440

0.450

0.430

0.420

85

81

83

2700K

0.400

0.410y

828486

2700K

0.390

86

2580

2870K

0.380

2870K

0.3700.430 0.435 0.440 0.445 0.450 0.455 0.460 0.465 0.470 0.475 0.480 0.485 0.490

x

Figure 15. ANSI 2700K 1/6th color bin structure, forward current = 100 mA, thermal pad temperature = 25°C.


Color Bin Structure, Continued



Table 11.



71

0.43860.44740.45620.4468

0.40480.42280.42600.4077

74

0.42220.43050.43860.4298

0.38400.40190.40480.3867

72

0.42980.43860.44680.4373

0.38670.40480.40770.3893

75

0.42230.42990.43870.4305

0.39900.41650.41970.4019

73

0.43050.43870.44740.4386

0.40190.41970.42280.4048

76

0.41470.42230.43050.4222

0.38140.39900.40190.3840

Notes for Table 11:


0.435

0.445

0.425

0.415

3000K75

7173

0.395

0.405y3000K

7274

0.385

0.395 74

76

2870K

0.375

3200K

0.3650.405 0.410 0.415 0.420 0.425 0.430 0.435 0.440 0.445 0.450 0.455 0.460 0.465

x






Table 12.



61

0.41300.41980.42990.4223

0.39440.41150.41650.3990

64

0.39750.40360.41300.4061

0.37310.38980.39440.3773

62

0.40610.41300.42230.4147

0.37730.39440.39900.3814

65

0.39430.39960.40970.4036

0.38530.40150.40650.3898

63

0.40360.40970.41980.4130

0.38980.40650.41150.3944

66

0.38890.39430.40360.3975

0.36900.38530.38980.3731

Notes for Table 12:


0 420

0.430

0.410

0.420

0.400

61

63

0.390

y

3500K

65

62

0.380

64

66 3250K

0.370

3750K

0.3600.380 0.385 0.390 0.395 0.400 0.405 0.410 0.415 0.420 0.425 0.430 0.435 0.440

x






Table 13.



51

0.38690.39160.40060.3952

0.38290.39870.40440.3880

54

0.37460.37860.38690.3822

0.36240.37770.38290.3670

52

0.38220.38690.39520.3898

0.36700.38290.38800.3716

55

0.37030.37360.38260.3786

0.37260.38740.39310.3777

53

0.37860.38260.39160.3869

0.37770.39310.39870.3829

56

0.36700.37030.37860.3746

0.35780.37260.37770.3624

Notes for Table 13:


0.410

0.420

0.400

0.39051

53

55

0.370

0.380y

4000K 52

54

55

0.360

3750K56

0.350

4250K

0.3400.360 0.365 0.370 0.375 0.380 0.385 0.390 0.395 0.400 0.405 0.410

x






Table 14.



31

0.34790.34930.35510.3533

0.35800.37120.37600.3624

34

0.34160.34250.34790.3465

0.34080.35360.35800.3448

32

0.34650.34790.35330.3515

0.34480.35800.36240.3487

35

0.33710.33760.34340.3425

0.34930.36160.36640.3536

33

0.34250.34340.34930.3479

0.35360.36640.37120.3580

36

0.33660.33710.34250.3416

0.33690.34930.35360.3408

Notes for Table 14:


0 380

0.390

0.370

0.380

0.360

35

31

33

0.350

y5000K

35

32

34 4750K

0.340

5250K

36

0.330

5250K

0.3200.325 0.330 0.335 0.340 0.345 0.350 0.355 0.360 0.365

x






Table 15.



21

0.33190.33200.33760.3371

0.34460.35650.36160.3493

24

0.32700.32670.33190.3318

0.32850.33990.34460.3327

22

0.33180.33190.33710.3366

0.33270.34460.34930.3369

25

0.32150.32070.32630.3267

0.33530.34620.35130.3399

23

0.32670.32630.33200.3319

0.33990.35130.35650.3446

26

0.32220.32150.32670.3270

0.32430.33530.33990.3285

Notes for Table 15:


0.370

0.360

210.350

25

21

23

0.340y 5700K 22

24

265250K

0.330

6000K

26

0.3206000K

0.3100.310 0.315 0.320 0.325 0.330 0.335 0.340 0.345 0.350

x






Table 16.



11

0.31580.31460.32060.3213

0.33170.34220.34810.3371

14

0.31190.31030.31580.3170

0.31620.32630.33170.3212

12

0.31700.31580.32130.3221

0.32120.33170.33710.3261

15

0.30480.30280.30870.3103

0.32090.33040.33630.3263

13

0.31030.30870.31460.3158

0.32630.33630.34220.3317

16

0.30680.30480.31030.3119

0.31130.32090.32630.3162

Notes for Table 16:


0 355

0.365

0.345

0.355

0.335

11

13

0.325

y

6500K15

12

146000K

0.315

7000K

16

0.305

7000K

0.2950.290 0.295 0.300 0.305 0.310 0.315 0.320 0.325 0.330 0.335

x


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lighting,homelighting,digitalimaging,displayandautomotivelighting.

PhilipsLumiledsisafullyintegratedsupplier,producingcoreLEDmaterialinallthreebasecolors,(Red,Green,Blue)and

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SingaporeandPenang,Malaysia.Foundedin1999,PhilipsLumiledsisthehighfluxLEDtechnologyleaderandisdedicatedto

bridgingthegapbetweensolid-statetechnologyandthelightingworld.Moreinformationaboutthecompany’sLUXEONLED

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LUXEON 3535 Mid-Power LEDsLUXEON 3535 Datasheet DS202 20130228 ©2013 Philips Lumileds Lighting Company. 2 General Information Product Nomenclature LUXEON Mid-Power Illumination emitters