Herbert Reichl (Editor)

MICRO SYSTEMTechnologies 2003International Conference & Exhibitionon Micro Electro, Opto, Mechanical Systemsand Components

Miinchen, October 7-8, 2003

inkl. CD-ROM

TECHINFORMATICS

UNIVERGITAHAN!

M1SCHENSOiBL!

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FRANZIS

Table of Contents

Plenary Session

Microsystems for Automotive Applications 19Roland Muller-Fiedler, Robert Bosch GmbH, Germany

Microsystems in Mobile Phone Applications 27Robert Aigner, Infineon Technologies AG, Germany

A Vision of Microsystes within th Low Cost Consumer Disposable ProductsIndustry 35F. Sherman, The Procter & Gamble Company, USA

Leading-edge System-ln-a-Package (SiP) Assembly 36Ho-Ming Tong, ASE, Taiwan

Medical Applications for Microsystems 37Sarah Audet, Medtronic, USA

RF and microwave packaging

Advanced Packages for Surface Acoustic Wave Components 44Gregor Feiertag, EPCOS AG, Munich, GermanyHans Kriiger, EPCOS AG, Munich, GermanyPeter Selmeier, EPCOS AG, Munich, Germany

Wafer-Level Encapsulation on MEMS Using Solder Sealing 52Thomas Harder, Fraunhofer ISIT, Itzehoe, GermanyHelge Schimanski, Fraunhofer ISIT, Itzehoe, GermanyLars Bertels, Fraunhofer ISIT, Itzehoe, GermanyMargarete Zoberbier, SUSS MicroTec AG, Garching, Germany

RF MEMS Glass Frit Packaging 60Mathias Reimann, Robert Bosch GmbH, Stuttgart, GermanyMarkus Ulm, Robert Bosch GmbH, Stuttgart, GermanyThomas Buck, Robert Bosch GmbH, Stuttgart, GermanyJorg Schobel, Robert Bosch GmbH, Stuttgart, GermanyJorn Dechow, Robert Bosch GmbH, Stuttgart, GermanyRoland Muller-Fiedler, Robert Bosch GmbH, Stuttgart, Germany

Design, Simulation, Fabrication and Packaging of Microwave RF Switch 68Paolo Bondavalli, Thales Research and Technology, France

Testing of microsystems and devices

A Calibration Setup for a New Type of Nano-Probe 69E.J.C. Bos, Eindhoven University of Technology, The NetherlandsI.Widdershoven, Eindhoven University of Technology, The NetherlandsP. H. J. Schellekens, Eindhoven University of Technology, The NetherlandsH. Haitjema, Eindhoven University of Technology, The Netherlands

Microstructure Analysis, Evaluation of Mechanical Functionality and QualityAssurance of Microsystems and Devices Using Non Destructive TestingMethods 77Jiirgen Schreiber, Fraunhofer Institute for Nondestructive Testing Branch Lab EADQ,Dresden, Germany

NanoDAC - Nano Scale Deformation Measurements for Reliability Analysis ofMicrosystems and Micro Materials 78Bemd Michel, Fraunhofer IZM, Berlin, Germany

Assembly technology

A Novel Micromechanic Alignment-Mechanism for 2DFibre-Arrays in TelecomApplications Manufactured by DRIE 86Oliver Krampitz, Protron Mikrotechnik GmbH, Bremen, GermanyVolker Biefeld, Protron Mikrotechnik GmbH, Bremen, GermanyRalf Hbper, Protron Mikrotechnik GmbH, Bremen, GermanyGuido Mannmeusel, Protron Mikrotechnik GmbH, Bremen, GermanyAndreas Menz, Protron Mikrotechnik GmbH, Bremen, Germany

Assembly of Optical Fibers 94Matthias Mohaupt, Fraunhofer IOF, Jena, GermanyRamona Eberhardt, Fraunhofer IOF, Jena, GermanyErik Beckert, Fraunhofer IOF, Jena, GermanyHenrik Banse, Fraunhofer IOF, Jena, GermanyChristian Siebenhaar, Fraunhofer IOF, Jena, GermanyVolker Guyenot, Fraunhofer IOF, Jena, Germany

Application of Low Temperature Direct Bonding in Optical Devices andIntegrated Systems 102Karla Hiller, Chemnitz University of Technology, GermanySteffen Kurth, Fraunhofer Institute of Reliability and Microintegration, Chemnitz, GermanyNorbert Neumann, InfraTec GmbH, Dresden, GermanyRamon Hahn, Chemnitz University of Technology, GermanyChristian Kaufmann, Chemnitz University of Technology, GermanyMarian Hanf, Chemnitz University of Technology, GermanySteffen Heinz, Chemnitz University of Technology, GermanyThomas Gessner, Chemnitz University of Technology, GermanyFraunhofer Institute of Reliability and Microintegration, Chemnitz, GermanyWolfram Dotzel, Chemnitz University of Technology, GermanyGunter Ebest, Chemnitz University of Technology, Germany

Chip Scale Packaging in Glass of Pressure Sensors 110Ciprian Iliescu, Institute of Bioengineering and Nanotechnology, SingaporeJianmin Miao, Nanyang Technological University, SingaporeFancis E.H. Tay, National University of Singapore, Singapore

Micro-Integration Techniques for Micro-Optical Subassemblies 117Arnd Menschig, MiLaSys technologies GmbH, Stuttgart, Germany

A Wafer Level Packaging for Pressure Sensor MEMS 123Stephen Wong, Singapore Institute of Manufacturing Technology, SingaporeJ. Wei, Singapore Institute of Manufacturing Technology, SingaporeG.J.Qi, Singapore Institute of Manufacturing Technology, SingaporeZ. F. Wang, Singapore Institute of Manufacturing Technology, SingaporeY.F. Jin, Singapore Institute of Manufacturing Technology, SingaporeP.C. Lim, Singapore Institute of Manufacturing Technology, Singapore

Agile Micro-Assembly - Flexible Solutions by Tele-Operation and Automation 131Johannes Schilp, Institute for Machine Tools and Industrial Management (iwb), Munich,GermanyMichael Ehrenstrasser, Institute for Machine Tools and Industrial Management (iwb),Munich, GermanyMark Harfensteller, Institute for Machine Tools and Industrial Management (iwb), Munich,GermanyDirk Jacob, Institute for Machine Tools and Industrial Management (iwb), Munich, GermanyMichael F. Zaeh, Institute for Machine Tools and Industrial Management (iwb), Munich,Germany

Methods and Sensors for the Observation of Micro Assembly 139Gerd Dussler, CeWe Color, Oldenburg, GermanyBastian Engelmann, Chair of Metrology and Quality Management, Aachen, GermanyTilo Pfeifer, Chair of Metrology and Quality Management, Aachen, Germany

The Liquid Crystal Polymer Packaging Solution 145Brian Farrell, Foster Miller Co., Waltham, USAPaul Jaynes, Foster Miller Co., Waltham, USAWayne Johnson, Auburn University, USARobert Dean, Auburn University, USA

System in Package: A New Wafer Level Assembly and Packaging MethodUsing Conventional Assembly Equipment 153Ramin Azadeh, Fraunhofer Institute for Reliability and Microintegration, Berlin, GermanyT. Braun, Fraunhofer Institute Reliability and Microintegration, Berlin, GermanyK.-F. Becker, Fraunhofer Institute Reliability and Microintegration, Berlin, GermanyA. Ostmann, Technical University of Berlin, GermanyE. Jung, Fraunhofer Institute Reliability and Microintegration, Berlin, GermanyR. Aschenbrenner, Fraunhofer Institute Reliability and Microintegration, Berlin, GermanyH. Reichl, Technical University of Berlin, Germany

Low-Cost Solder Bumping and Flip-Chip Assembly for AutomotiveMicrosystem Applications 161Reiner Schiitz, Robert Bosch GmbH, Reutlingen, Germany

Flip Chip Assembly on laser Patterned Molded Interconnect Devices (MID) 172Ulrike Scholz, Hahn-Schickard-lnstitute for Micro Assembly Technology (HSG-IMAT),Stuttgart, GermanyWolfgang Eberhardt, Hahn-Schickard-lnstitute for Micro Assembly Technology (HSG-IMAT),Stuttgart, GermanyUlrich Kessler, Hahn-Schickard-lnstitute for Micro Assembly Technology (HSG-IMAT),Stuttgart, GermanyHeinz Kiick, Hahn-Schickard-lnstitute for Micro Assembly Technology (HSG-IMAT),Stuttgart, Germany

Packaging of microdevices (MEMS, MOEMS, microfluidic, sensors)

Micro Dome Shape Structures Made of Thin Film Metallic Glass 180Seiichi Hata, Tokyo Institute of Technology, Yokohama, JapanJyunpei Sakurai, Tokyo Institute of Technology, Yokohama, JapanEng. Akira Shimokohbe, Tokyo Institute of Technology, Yokohama, Japan

Packaging Solutions for Multi-Functional and Modular MEMS 188Achim Stock, Fraunhofer Institute for Manufacturing Engineering and Automation IPA,Stuttgart, GermanyAbdelmalek Houdir, Fraunhofer Institute for Manufacturing Engineering and Automation IPA,Stuttgart, Germany

Patterned Getter Film Wafers for Wafers Level Packaging of MEMS 195M. Moraja, SAES Getters S.p.A., Lainate, ItalyMarco Amiotti, SAES Getters S.p.A., Lainate, ItalyG. Longoni, SAES Getters S.p.A., Lainate, Italy

Advanced Microsystems Assembly Using Screen Printing Technology 202Robert Kay, Heriot Watt University, Edinburgh, UKMarc Desmulliez, Heriot Watt University, Edinburgh, UKStoyan Stoyanov, University of Greenwich, UKGregory Glinski, University of Greenwich, UKChris Bailey, University of Greenwich, UKRajkumar Durairaj, University of Greenwich, UKNnamdi Ekere, University of Greenwich, UKMike Hendriksen, Celestica Limited, Kidsgrove, UKBrian Smith, Celestica Limited, Kidsgrove, UKDennis Price, Merlin Circuit Technology Limited, Deeside, UKAndrew Roberts, Merlin Circuit Technology Limited, Deeside, UKMark Whitmore, DEK Printing Machines Limited, Weymouth, UKPeter Ongley, Electronic Technology Services, Bristol, UKJames Gourlay, MicroEmissive Displays, Edinburgh, UK

Integrated processes

Integrated Process Chains for Enhanced Micro Manufacturing Technologies 210Jens P. Wulfsberg, University of the Federal Armed Forces, Hamburg, GermanySven-Eric Hilbert, University of the Federal Armed Forces, Hamburg, GermanyJorg Lehmann, University of the Federal Armed Forces, Hamburg, Germany

Multifunctional Microparts by Metal Injection Molding 218Philipp Imgrund, Fraunhofer IFAM, Bremen, GermanyAstrid Rota, Fraunhofer IFAM, Bremen, Germany

Study and Experimental Charcterization of Backgrinding on Silicon Wafer forMEMS Applications 226Matteo Garavaglia, R&D Process, STMicroelectronics, Castelletto, ItalyMichele Monno, Politecnico di Milano, ItalyMichela Pozzoni,Politecnico di Milano, ItalyAndrea Rusconi Clerici, Fraunhofer Institute for Silicon Technology ISIT, Itzehoe, Germany

The Thin Wafer Challenge - Techniques for Preparation and Processing ofUltra Thin Semiconductor Substrates 234M. Bleier, Fraunhofer Institute for Reliability and Microintegration, Munich, GermanyK. Bock, Fraunhofer Institute for Reliability and Microintegration, Munich, GermanyO. Kothe, Fraunhofer Institute for Reliability and Microintegration, Munich, GermanyC. Landesberger, Fraunhofer Institute for Reliability and Microintegration, Munich, Germany

Direct Laser Etching of High Quality Microstructrues in Pyrex for Applicationsin Micro-System Technology 242Rico Bohme, Leibniz-lnstitut fur Oberflachenmodifizierung, Leipzig, Germany

Flexible Laser Micro Machining of Semiconductor Materials UsingFrequency Quadrupled Solid-State Laser 248Andreas Ostendorf, Laser Zentrum Hannover e.V., GermanyThorsten Temme, Laser Zentrum Hannover e.V., GermanyFrank Otte, Laser Zentrum Hannover e.V., Germany

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A Versatile 2D/3D SoC/SiP Device Fabrication Technology 256H. Bernhard Pogge, IBM Microelectronics, New York, USARoy Yu, IBM Microelectronics, New York, USAMichel Despont, IBM Research, Rueschlikon, SwitzerlandUte Drechsler, IBM Research, Rueschlikon, SwitzerlandPeter Vettiger, IBM Research, Rueschlikon, Switzerland

High-Density 3D Interconnect: Merging VLSI-CMOS and VLSI-MEMSTechnologies 264Michel Despont, IBM Zurich Research Laboratory, Switzerland

Fabrication of High Aspect Ratio Microstructures on Strong SlopingTopography Substrates 265Gunter Engelmann, Fraunhofer Institute for Reliability and Microintegration, Berlin, GermanyRainer Engelke, mircro resist technology GmbH, Berlin, GermanyMarina Heinrich, mircro resist technology GmbH, Berlin, GermanyGabi Griitzner, mircro resist technology GmbH, Berlin, GermanyJurgen Wolf, Fraunhofer Institute for Reliability and Microintegration, Berlin, GermanyHerbert Reichl, Fraunhofer Institute for Reliability and Microintegration, Berlin, Germany

Electroforming of Metallic Microparts via Two-Component Injection Moldingof Sacrificial Templates 273Nils Holstein, Research Centre Karlsruhe GmbH, GermanyVolker Piotter, Research Centre Karlsruhe GmbH, GermanyRobert Ruprecht, Research Centre Karlsruhe GmbH, GermanyGerhard Schanz, Research Centre Karlsruhe GmbH, Germany

A Failure Criteria for Interface Notches in Silicon/Glass Anodic Bonds 281Michael Knaup, Fraunhofer IWM, Halle/Saale, GermanyMichael Busch, Fraunhofer IWM, Halle/Saale, GermanyJorg Bagdahn, Fraunhofer IWM, Halle/Saale, GermanyHans-Gunther Maschke, Fraunhofer IWM, Halle/Saale, Germany

PRINCE - Process Information and Management Center 289Andreas Wagener, University of Siegen, GermanyJens Popp, University of Siegen, GermanyKai Hahn, University of Siegen, Germany

Manufacturing of microsystems

Development of an SOI-Based Micro Check Valve 297Min Hu, Nanyang Technological University, SingaporeHejun Du, Nanyang Technological University, SingaporeShih-Fu Ling, Nanyang Technological University, Singapore

Development of Miniaturized Planar Fuel Cells Using Thin-Film and Micro-Patterning Technologies 303Stefan Wagner, Fraunhofer Institute for Reliability and Microintegration, Berlin, GermanyRobert Hahn, Fraunhofer Institute for Reliability and Microintegration, Berlin, GermanyTorsten Fischer, Fraunhofer Institute for Reliability and Microintegration, Berlin, GermanyFrank Ebling, Fraunhofer Institute for Reliability and Microintegration, Berlin, GermanyMichael Krumm, Technical University, Berlin, GermanyKrystan Marquardt, Technical University, Berlin, Germany

Flow-Sensor from Polymer Fabricated with the AMANDA-Process 312Ralf Ahrens, Research Centre Karlsruhe, GermanyDirk Dittmann, Research Centre Karlsruhe, Robert Bosch GmbH Reutlingen, GermanyZeno Rummler, Research Centre Karlsruhe, GermanyKlaus Schlote-Holubek, Forschungszentrum Karlsruhe GmbH, GermanyWerner K. Schomburg, Research Centre Karlsruhe, GermanyPeige Shao, Research Centre Karlsruhe, GermanyNational University of Singapore, Singapore

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A Laser Welded Multilayered Metal Micro-Reactor for Chemical Synthesis 320Kensuke Tsuchiya, The Univrsity of Tokyo, JapanAtsushi Yamaji, The Univrsity of Tokyo, JapanOoi Takeshi, The Univrsity of Tokyo, JapanTetsuy Hamaguchi, The Univrsity of Tokyo, JapanMasayuki Nakao, The Univrsity of Tokyo, Japan

A Reliable Fabrication Process for Capacitive Microphones with SensitivityTrimming 328Jianmin Miao, Nanyang Technological University, SingaporeCiprian Iliescu, Institute of Bioengineering and Nanotechnology, Singapore

A Trial Manufacturing of Micromechanism Elements by Use of a Fast AtomBeam Etching Machine 334Mikio Horie, Tokyo Institute of Technology, Yokohama, JapanTomoyuki Ishibashi, Tokyo Institute of Technology, Yokohama, JapanDaiki Kamiya, Tokyo Institute of Technology, Yokohama, Japan

A Novel 3-D MEMS Gyroscope 342Ronen Nakash, Institute of Mechanical Systems, ETH, Zurich, SwitzerlandJiirg Dual, Institute of Mechanical Systems, ETH, Zurich, SwitzerlandStefan Blunier, Institute of Mechanical Systems, ETH, Zurich, SwitzerlandMarkus Hageli, Institute of Mechanical Systems, ETH, Zurich, SwitzerlandUeli Marti, Institute of Mechanical Systems, ETH, Zurich, Switzerland

Applications

Micro Hydro Power Generator 350Sebastian Pobering, Munich University of Technology, GermanyNorbert Schwesinger, Munich University of Technology, Germany

New Principle for Front Light Systems in Automotive ApplicationsUse of Mechatronic Principles for Integration of Sensing Elements inAutomotive and Industrial Applications 358Thomas Alt, Fraunhofer Institute Reliability and Microintegration, Wessling, GermanyF. Ansorge, Fraunhofer Institute for Reliability and Microintegration, Wessling, GermanyHorst Hanisch, Fraunhofer Institute Reliability and Microintegration, Wessling, GermanyHerbert Reichl, Fraunhofer Institute Reliability and Microintegration, Wessling, GermanyJo'rg Wolter, Fraunhofer Institute Reliability and Microintegration, Wessling, GermanyHelmut Erdl, BMW AG, Munich, Germany

Micro-Opto-Electromechanical Multiplexing System on the Base of ModernMicroactuators 366D. Krogmann, Bodenseewerk Geratetechnik GmbH, Uberlingen, GermanyH. D. Tholl, Bodenseewerk Geratetechnik GmbH, Qberlingen, GermanyR. Goring, Pyramid Optics GmbH, Lederhose, GermanyP. Dannberg, Fraunhofer Institute IOF, Jena, Germany

Gas Analytical Performance of Gradient Microarrays Coated With LateralInhomogeneous Alumina Membranes 374Christian Arnold, Institute for Instrumental Analysis, Karlsruhe, GermanyMarkus Frietsch, SYSCA AG, Knittlingen, GermanyJoachim Goschnick, Institute for Instrumental Analysis, Karlsruhe, GermanyIlia Kiselev, Institute for Instrumental Analysis, Karlsruhe, GermanyThomas Walter, Institute for Instrumental Analysis, Karlsruhe, Germany

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Medical Session

Evaluation and Optimization of Planar Microcoils Fabricated byPolyimide based Electroplating for the Application of ImplantableTelemetry Systems 379Sohee Kim, Fraunhofer Institute for Biomedical Engineering (IBMT), St. Ingbert, GermanyOliver Scholz, Fraunhofer Institute for Biomedical Engineering (IBMT), St. Ingbert, Germany

Development of Novel Drug Delivery Products Based on Micro SystemTechnologies 387Didier Maillefer, DEBIOTECH SA, Lausanne, Switzerland

Chemiluminescence Multichannel Immunosensor 395E. Yacoub-George, Fraunhofer Institute for Reliability and Microintegration, Munich,GermanyWaltraud Scheithauer, Fraunhofer Institute for Reliability and Microintegration, Munich,GermanyLeonhard Meixner, Fraunhofer Institute for Reliability and Microintegration, Munich,GermanyAndreas Koppi, Fraunhofer Institute for Reliability and Microintegration, Munich, GermanyStephan Drost, Fraunhofer Institute for Reliability and Microintegration, Munich, Germany

Self-Assembling BioMEMSS 401Gunasekaran, John F. Welch Technology Centre, Bangalore, India

Micro - Opto - Mechanical Flow Sensor for Medical Applications 408Ruben Keoschkerjan, Fraunhofer IZM-M, Munich, GermanyMartin Richter, Fraunhofer IZM-M, Munich, GermanyAndreas Drost, Fraunhofer IZM-M, Munich, GermanyNorbert Lutter, University of Erlangen, Germany

Polymer BioMEMS with Integrated Optical and Fluidic Functionality 416Kirsten Windhorn, Fraunhofer Institute for Reliability and Microintegration, Munich, GermanyLeonhard Meixner, Fraunhofer Institute for Reliability and Microintegration, Munich,GermanyStephan Drost, Fraunhofer Institute for Reliability and Microintegration, Munich, GermanyHenning Schroder, Fraunhofer Institute for Reliability and Microintegration, Berlin, GermanyElke Kilgus, Fraunhofer Institute for Reliability and Microintegration, Berlin, GermanyWolfgang Scheel, Fraunhofer Institute for Reliability and Microintegration, Berlin, GermanyHerbert Reichl, Fraunhofer Institute for Reliability and Microintegration, Berlin, GermanyFrank Ebling, Technical University of Berlin, GermanyMatthias Kiichler, Fraunhofer Institute for Reliability and Microintegration, Chemnitz,GermanyJorg Nestler, Fraunhofer Institute for Reliability and Microintegration, Chemnitz, GermanyThomas Otto, Fraunhofer Institute for Reliability and Microintegration, Chemnitz, GermanyThomas Geliner, Fraunhofer Institute for Reliability and Microintegration, Chemnitz,GermanyChristof StrohhOfer, Fraunhofer Institute for Reliability and Microintegration, Munich,Germany

The Microfluidic Toolbox - Examples for Fluidic Interfaces andStandardization Concepts 424Claudia Gartner, amt - Application Centre for Microtechnology Jena, GermanyBirgit Anton, Microfluidic ChipShop GmbH, Jena, GermanyOliver Retting, Microfluidic ChipShop GmbH, Jena, Germany

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Testing & Equipment for Manufacturing

New Developments in Silicon and Oxide ICP Etching for MEMS 430Nicolas Arnal, Alcatel Vacuum Technology, FrancePeter Dijkstra, Alcatel Vacuum Technology, FranceJean Marc Gruffat, Alcatel Vacuum Technology, FranceNicolas Launay, Alcatel Vacuum Technology, FranceLaetitia Rolland, Alcatel Vacuum Technology, France

Accurate New 3 D-Motion Analyzer for MEMS 435Christian Rembe, Polytec GmbH, Waldbronn, GermanyAlexander Drabenstedt, Polytec GmbH, Waldbronn, GermanyFrank Heimes, Polytec GmbH, Waldbronn, Germany

MEMS Metrology for MEMS Characterization 443Erik Novak, Veeco Metrology, Tucson, USAFreek Pasop, Veeco Instruments, Breda, The Netherlands

Functional Testing and Calibration of Microsystems at Wafer Level 451Soren P. Rybro, DELTA, Horsholm, Denmark

Commercialization of microsystems emerging markets

World MEMS Fab: an Overwiew of the MEMS Industry Worldwide 456Eric Mounier, Yole Developement, Lyon, France

MEMS in IT Peripherals 462Henning Wicht, WTC-Wicht Technologie Consultant, Munich, GermanyJeremie Bouchaud, WTC-Wicht Technologie Consulting, Munich, Germany

Microsystems in Household Appliances 464Guido Tschulena, sgt Sensor Consulting, Wehrheim, Germany

Worldwide Packaging and Assembly Services for Microsystems 470Henne van Heeren, Enabling M3, Dordrecht, The NetherlandsPatric Salomon, 4M2C PATRIC SALOMON, Berlin, GermanyLia Paschalidou, Market Intelligence Consultant, London, UK

Commercialization of Microsystems and Emerging Trends 478S. Gunasekaran, John F. Welch Technology Centre, Bangalore, India

Poster Presentations

Alternative Ways to High Current Structures in Ceramic Substrates 486Arne Albrecht, Technical University llmenau, GermanyJ. Botiov, Technical University llmenau, GermanyM. Fischer, Technical University llmenau, GermanyK.-H. Drue, Technical University llmenau, GermanyM. Hintz, Technical University llmenau, GermanyH. Wurmus, Technical University llmenau, Germany

Concepts for Production of Low Cost Microsystems Using Reel to ReelProcesses 489M. Feil, Fraunhofer-lnstitute for Reliability and Microintegration, Munchen, GermanyK. Bock, Fraunhofer-lnstitute for Reliability and Microintegration, Munchen, GermanyH.-E. Endres, Fraunhofer-lnstitute for Reliability and Microintegration, Munchen, GermanyM. Richter, Fraunhofer-lnstitute for Reliability and Microintegration, Munchen, Germany

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Calibration of a Micro Force Setting Standards Using a New Nano ForceCalibration Device 492Lutz Doering, Physikalisch-Technische Bundesanstalt (PTB), Braunschweig GermanyErwin Peiner, Technische Universitat Braunschweig, GermanyIngo Behrens, Technische Universitat Braunschweig, GermanyUwe Brand, Physikalisch-Technische Bundesanstalt, Braunschweig, Germany

Micro Cutting Process under SEM Observation 495Frank Loffler, Physical-Technical Institute, Braunschweig, GermanyMichael Miiller, Physical-Technical Institute, Braunschweig, GermanyMartin Klein, Visitec Microtechnik GmbH, Grevesmuhlen, Germany

Aligned Wafer Bonding for MEMS Devices 498Viorel Dragoi, EV Group, Scharding, AustriaPaul Lindner, EV Group, Scharding, AustriaJohann Weixlberger, EV Group, Scharding, Austria

Technique and Equipment for High Accuracy Device Assembly 501Hartwig Udo, FINETECH GmbH, Berlin, GermanyGunter Kurbis, FINETECH GmbH, Berlin, GermanyThomas Schwarz, OSRAM Opto Semiconductors, Regensburg, Germany

Deposition and Characterization Study of Low-Stress LPCVD SiliconNitride Films for MEMS Applications 504Mustapha Lemiti, Laboratoire de Physique de la Matiere, Insa Lyon, FranceChristophe Malhaire, Laboratoire de Physique de la Matiere, Insa Lyon, FranceBachir Semmache, Jipelec (Division of Qualiflow), Montpellier, France

Finite Element Modeling of Magnetostriction for the Design of MEMS Devices 507Chongdu Cho, Inha University, Inchon, KoreaHo-Mun Si, Inha University, Inchon, Korea

Fabrication of 3-D Microstructure by the X-Ray Intensity Distribution Control 510Yoshihiro Fukuda, Himeji Institute of Technology, Hyogo, JapanHiroyasu Ueda, Himeji Institute of Technology, Hyogo, JapanKinji Takiguchi, Himeji Institute of Technology, Hyogo, JapanTadashi Hattori, Himeji Institute of Technology, Hyogo, Japan

MEMS and MOEMS Packaging / 3-D Interconnection 513Christian Val-Ceo, 3 D Plus, France

New Type PN Junction Temperature-Sensor with AdjustableSensitivity and Its Application to MEMS Absolute-Humidity Sensors 514Mitsuteru Kimura, Tohoku-Gakuin University, Miyagi, JapanM. S. Shigemi Fujiwara, Tohoku-Gakuin University, Miyagi, JapanB. S. Kazuya Kikuchi, Tohoku-Gakuin University, Miyagi, Japan

Comparison of the Performance of Polymer-Based Capillary ElectrophoresisMicrochips Fabricated by Using Resist Molds Prepared by SynchrotronRadiation Lithography and Ultraviolet Light Lithography 517Tsunemasa Saiki, Himeji Institute of Technology, Ako-Gun, JapanMotoaki Ozaki, Himeji Institute of Technology, Ako-Gun, JapanYuichi Utsumi, Himeji Institute of Technology, Ako-Gun, JapanHideaki Hisamoto, Himeji Institute of Technology, Ako-Gun, JapanTadashi Hattori, Himeji Institute of Technology, Ako-Gun, Japan

Water Uptake of Polymeric MEMS Packaging Materials 520Jakob Janting, DELTA Danish Electronics Light and Acoustics, Hoersholm, DenmarkElisabeth Kjaerside Storm, DELTA Danish Electronics Light and Acoustics, Hoersholm,Denmark

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Module for the Transmission of MPEG-4 Video DataUsing Bluetooth - Components and Packaging 523

Thomas Fritzsch, Fraunhofer IZM, Berlin, GermanyKai Zoschke, Fraunhofer Institute for Reliability and Microintegration (IZM), Berlin, GermanyOswin Ehrmann, Fraunhofer Institute for Reliability and Microintegration (IZM), Berlin,GermanyJurgen Wolf, Fraunhofer Institute for Reliability and Microintegration (IZM), Berlin, GermanyMichael Topper, Fraunhofer Institute for Reliability and Microintegration (IZM), Berlin,GermanyKlaus Buschick, Fraunhofer Institute for Reliability and Microintegration (IZM), Berlin,GermanyVeronika Glaw, Fraunhofer Institute for Reliability and Microintegration (IZM), Berlin,GermanyHerbert Reichl, Fraunhofer Institute for Reliability and Microintegration (IZM), Berlin,GermanyBenno Stabernack, Heinrich-Hertz Institute (HHI), Berlin, GermanyRainer Steffen, Fraunhofer Institute for Communication Systems (ESK), Munich, Germany

Frequency and Directivity Reconfigurable Antenna For Millimeter-Wave 526Hidetoshi Kotera, Kyoto University, JapanIsaku Kanno, Kyoto University, JapanYoshihisa Fukuda, Kyoto University, JapanTakuya Murayama, Kyoto University, JapanUshio Sangawa, Matsushita Electric Industry, Co., Ltd., Kyoto, JapanKazuyuki Sakiyama, Matsushita Electric Industry, Co., Ltd., Kyoto, Japan

Low-Voltage Actuation of RF-MEMS Switch Using Piezoelectric PZT Thin Films 529Isaku Kanno, Kyoto University, JapanHironobu Endo, Kyoto University, JapanHidetoshi Kotera, Kyoto University, Japan

Match-X-LTCC-X-Packages for Modular Microsystems 532Thomas Bartnitzek, VIA electronic GmbH, Hermsdorf, Germany

A High Luminosity Lighting-Panel for Liquid Crystal DisplaysManufactured by Deep X-Ray Lithography 535Yuichi Utsumi, Himeji Institute of Technology, Kamigori, Ako, JapanMegumi Minamitani, Fujipream Corporation, Himeji, JapanTadashi Hattori, Himeji Institute of Technology, Kamigori, Ako, Japan

A High Aspect Ratio Vertical FET Sensor for Motion Detection 538Steffen Heinz, Chemnitz University of Technology, GermanyStephan Buschnakowski, Chemnitz University of Technology, GermanyAndreas Bertz, Chemnitz University of Technology, GermanyWolfgang Brauer, Chemnitz University of Technology, GermanyReinhardt Schuberth, Chemnitz University of Technology, GermanyGunter Ebest, Chemnitz University of Technology, GermanyThomas Gessner, Chemnitz University of Technology, Fraunhofer Instituteof Reliability and Microintegration, Chemnitz, Germany

Microactuators with Diffraction Grating 541M. Kuhn, Chemnitz University of Technology, GermanyM. Flaspohler, Chemnitz University of Technology, GermanyS. Kronert, Chemnitz University of Technology, GermanyC. Kaufmann, Chemnitz University of Technology, GermanyT. Gessner, Chemnitz University of Technology, GermanyA. Hubler, Chemnitz University of Technology, GermanyJ. Fruhauf, Chemnitz University of Technology, Germany

Wafer Level Encapsulation of Surface Micromechanical Sensors - Demands andSolution 544Roy Knechtel, X-FAB Semiconductor Foundries AG, Germany

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Improvement on Thermal Performance of the Circular Heat Pipe with Nanofluid 547Hsin-Tang Chien, National Taiwan University, Taipei, TaiwanChien-ln Tsai, National Taiwan University, Taipei, TaiwanChih-Wei Chang, National Taiwan University, Taipei, TaiwanPing-Hei Chen, National Taiwan University, Taipei, TaiwanPo-Yeh Chen, Asia Vietal Components Co., Ltd., Taiwan

A Novel 3 D Anisotropic Etching Scheme 550Frank Goldschmidtboing, Institute of Microsystems Technology (IMTEK), GermanyP. Woias, Institute of Microsystems Technology (IMTEK), Germany

StackPac - Development of a 3 D Package for Micromechatronic Applications 553Horst Hanisch, Fraunhofer Institute for Reliability and Microintegration (FhG-IZM),Oberpfaffenhofen, GermanyFrank Ansorge, Fraunhofer Institute for Reliability and Microintegration (FhG-IZM),Oberpfaffenhofen, GermanyChristian Rebholz, Fraunhofer Institute for Reliability and Microintegration (FhG-IZM),Oberpfaffenhofen, GermanyHerbert Reichl, Fraunhofer Institute for Reliability and Microintegration, Berlin, Germany

Rapid Micro Prototyping of MEMS in Silicon 556Mark Herding, Institute of Microsystems Technology (IMTEK), Freiburg, GermanyStefan Bange, Institute of Microsystems Technology (IMTEK), Freiburg, GermanyFrank Goldschmidtboing, Institute of Microsystems Technology (IMTEK), Freiburg, GermanyPeter Woias, Institute of Microsystems Technology (IMTEK), Freiburg, Germany

Tunable Infrared Filter Based on a Fabry-Perot-lnterferometer 559Steffen Kurth, Fraunhofer Institute for Reliability and Microintegration (IZM), Chemnitz,GermanyKarla Hiller, Chemnitz University of Technology, GermanyWolfram Dotzel, Chemnitz University of Technology, GermanyThomas Gessner, Chemnitz University of Technology, GermanyNorbert Neumann, InfraTec GmbH, Dresden, GermanyMatthias Heinze, Chemnitz University of Technology, Germany

Embedded Life-Cycle Information Module for Monitoring and Identificationof Product Use Conditions 562Andreas Middendorf, Fraunhofer Institute for Reliability and Microintegration (IZM), Berlin,GermanyH. Griese, Fraunhofer Institute for Reliability and Microintegration (IZM), Berlin, GermanyJ. Hefer, Fraunhofer Institute for Reliability and Microintegration (IZM), Berlin, GermanyO. Ness, Fraunhofer Institute for Reliability and Microintegration (IZM), Berlin, GermanyH. Reichl, TU-Berlin, GermanyW. Grimm, Bosch, Pittsburgh, USA

Novel Possibilities in Physical Analytics Employing Micro System Devices 565Thomas Otto, Fraunhofer Institute for Reliability and Microintegration, Chemnitz, GermanyThomas Gessner, Fraunhofer Institute for Reliability and Microintegration, ChemnitzUniversity of Technology, GermanyRay Saupe, Chemnitz University of Technology, Germany

Molecular Dynamics Simulation in Nanowiring of Poly (dG)-Poly(dC)DNA on Highly Orientated Pyrolytic Graphite 568S. Kawano, Tohoku University, Sendai, JapanT. Shiga, Tohoku University, Sendai, JapanC. Takatoh, Ebara Research Co., LTD., Fujisawa, JapanT. Kawai, Osaka University, Japan

Kelvin-Helmholtz Instability Theory in Developmentof Microfludidic Mixing System 571Satoyuki Kawano, Tohoku University, Sendai, JapanHirofumi Shintaku, Kyoto University, JapanHidetoshi Kotera, Kyoto University, Japan

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Effect of Temperature-Dependent Thermo-Mechanical Properties onElectro thermal Buckling of Polysilicon Micro Beams 574Mahnaz Shamshirsaz, AmirKabir University of Technology, Tehran, IranMohammad Bagher Asgari, Abbaspour University of Technology, Tehran, Iran

Messekalender 577

Index of Authors 578

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