Molex Connector Product Overview

ttieurope.com

ttieurope.com

CONNECTOR PRODUCT OVERVIEW FOR ADVANCED INTERCONNECTS

2 www.ttieurope.com/molex

ttieurope.com

MOLEX SOLUTIONSALWAYS AHEAD OF THE CURVE

Molex is a leading global supplier of innovative interconnect solutions. To meet the needs of customers all over the world, we have developed one of the industry’s largest product portfolios, including over 100,000 connectors, interface solutions, application tooling and more.

3www.ttieurope.com/molex

ttieurope.com

Connector Product Overviewfor advanced interconnects

Molex innovative portfolio is always growing. Every

year, we design and manufacture solutions that set

new standards and drive innovation in a wide array

of markets – from telecom and computer networking,

to transportation and consumer goods, to medical

and lighting. We’re committed to looking ahead and

anticipating the needs of our customers.

Innovation through intensive research

With our state-of-the-art product design centers, Molex

has made a serious commitment to research and

development. All of our products are designed to meet

the demands of next-generation applications and are

based on a deep understanding of industry trends.

At Molex, we use the latest systems and technology,

including advanced Computer Aided Engineering

software and predictive engineering tools. It’s all part

of our focus on delivering tomorrow’s technologies,

today.

A strong commitment to sustainability

We believe the global environment is an important

issue for everyone. That’s why we not only adhere

to all environmental regulations, but also insist on

ecofriendly and safety-focused business practices.


ttieurope.comEdgeLine® Mezzanine Connectors

Micro-Fit 3.0™ Power Products

Mini-Fit® Power Products

SL™ (Stackable Linear) Modular Connectors

KK® Power and Signal Connectors

Mini-Fit Sr.™ Power Products

ConnectorOverview


ttieurope.comMLX™ Power Connectors

Mezzanine Products

EXTreme Power™ Products

SlimStack™Products

Power Products

Consumer I/O Products

ConnectorOverview


ttieurope.comBackplane Board-to-Board Products

Orthogonal Backplane Products

Modular Jacks and Plugs

Microminiature Wire-to-Board Connectors

FFC/FPC Products

RF Products

ConnectorOverview


ttieurope.comMemory Card Products

High-Speed I/O Connectors

Standard Antennas

DDR3 and DDR4 DIMM Sockets

iPass+™ HD Interconnects

zQSFP+™ Interconnect Solutions

ConnectorOverview


NEW PRODUCT INTRODUCTIONS

ttieurope.com


Product Name Description Pitch CurrentRating

Circuits Size Applications

The Micro-Lock™ 1.25mm Wire-to-Board System is available in straight- and right-angle styles for both single and dual rows with a maximum current rating of 1.5A. The damage-proof pin protection feature prevents header pins from being bent or crushed while the wide mating latch with two-point positive lock provides secure mating retention.

1.25mm 1.5A2-16

16-40

• Automotive• Consumer• Data/Communications

A dual contact, right angled non ZIF FPC/FFC connector with a mated height of only 1.00mm and a width of only 2.55mm. The dual contact feature allows the same connector to be used on parallel boards simplifying design and sourcing. The staggered contact design allows for easier soldering and lower cable insertion forces.

0.30mm 0.3A11, 13, 17, 19

• Consumer• Medical

Ideal for tight packaging constraints, low-profile SolderRight™ Direct-Solder Terminals enable right-angle connections onto a PCB. Available in multiple terminal / wire size ranges (14 to 28 AWG) and also in a straddle mount version, this product provides an extremely low cost way of connecting wires to a PCB with a very low ‘z’ axis height.

N/A14.0A max.

1

• Automotive• Consumer• Industrial• Medical• Telecom/Networking

Eliminating the need for mating headers, EdgeMate™ Power Connectors offer positive PCB-locking and significant cost savings for wire-to-edge-card terminations. Added electrical reliability is achieved with the crimp terminal known for its cantilever beam and dual-contact-point design for high normal-force and current-carrying capacity.

3.96mm 7.0A 2-12• Consumer• Industrial• Lighting

Achieve exceptionally reliable, convenient wireterminations with fixed-mount, push-button Eurostyle™ Terminal Blocks, ideal for a variety of industries and applications. Available in 2.50 to 10.00mm pitch and from 2 to 24 circuits in vertical, horizontal and 45° angle orientations. Modular construction also offers ultimate design flexibility.

2.50mm – 10.00mm

10.0Amax.

2-24

• Industrial• Lighting• Consumer• Networking• Security

Simplify the LED installation process with SlimRay™ pre-wired COB LED array holders. Including LED pre-hold features along with a low-profile design, these products are ideal for use with Lumileds LUXEON* and similar next-generation COB arrays. The holders also feature a screw-mount attachment method for securing the array to a heat sink.

*LUXEON is a registered trademark of Lumileds

N/A N/A N/A • Lighting

The Pico-Lock™ 1.00mm Pitch Wire-to-Board System offers a mated height of just 1.50mm combined with a current carrying capacity of 1.5A per contact. Secure mating is achieved by side positive locks. Wide, robust fitting nails facilitate increased board retention. Headers and housings are polarised to prevent mismating.

1.00mm 1.5A 2-12

• Automotive• Consumer• Lighting• Industrial• Telecoms

Miniature and mechanically resilient Compression Connectors provide excellent electrical contact for reliable operations in ultra-slim mobile devices. Featuring low level contact resistance, low-profile heights and high terminal retention forces. These connectors also save PCB real estate due to their small PCB footprints.

Various 1.0A 4, 6, 8• Consumer• Medical

Micro-Lock™ 1.25mm

Eurostyle™Terminal Blocks

0.30mm FPC Connector

SlimRay™ LED Array Holders

SolderRight™ Direct-Solder Terminals

Pico-Lock™ 1.00mm

EdgeMate™ Power Connectors

Compression Connectors

New Product Introductions

ttieurope.com




Delivering high density and excellent frequency performance, SMPM RF Blind-Mate and SMP Connectors reduce system weight and increase manufacturability with multiple port configuration options. Working over a frequency range from DC to 65GHz these connectors are 30% smaller than existing SMP families.

N/A N/A N/A

• Aerospace and Defence

• Telecom• Medical• Networking

The Impel™ Backplane Connector system will handle data rates scalable from 25 to 40 Gbps. Multiple pitch options include 1.90mm pitch broad-edge-coupled; 2.35mm pitch orthogonal; 3.00mmpitch quad-route. Two compliant-pin attach optionsand 18 to 72 differential pairs per orthogonal node are available.

N/A N/A N/A

• Data Communications• Telecom• Aerospace and

Defence

Ideal for tight-packaging applications, fine-pitchSlimStack™ SSB6 Board-to-Board Connectors offermaximum space savings, mating guidance, andsecure electrical and mechanical contact for all typesof mobile devices. With a stacking height of 0.60mm and a width of 2.00mm these connectors also come with a dual contact design.

0.35mm 0.3A 10-50• Consumer• Medical• Mobile Devices

Ideal for tight-packaging applications, the ultra-compact FPC connectors offer simplified cable assembly and retention to meet the design needs of mobile device manufacturers. Available in either 0.95mm or 0.75mm heights these series offer a BackFlip™ actuator and dual contacts all packaged in a low halogen material housing.


Halving the tooling and operational costs of plug-and-receptacle power systems, Ditto™ Wire-to-Wire Interconnects and pre-assembled harnesses increase cost-savings and operational efficiency of low-amperage consumer and lighting applications. This hermaphroditic connector system features polarised housings with friction locks.

2.50mm8.0A max.

2-8• Consumer• Lighting

SlimStack Armor™ 0.35mm Pitch Connectors deliver up to 3.0A of extra power through protective metal covers, and provide superior mating guidance and electrical contact assurance for mobile device and other tight-packaging applications. Featuring a stack height of just 0.60mm, tactile and audible mating feedback and a dual contact design.

0.35mm3.0A max.

6-48• Consumer• Medical• Mobile Devices

The rugged ML-XT™ Connection System with market-leading high-performance seal technology is a cost-competitive solution offering superior reliability for critical vehicle-wiring applications in harsh environments. Advanced two-shot LSR molded one-piece plug and plug seal, plus rear HCR seals with cover guards guarantee optimum seal positioning at all times.

N/A 13.0A 2-18• Automotive• Commercial Vehicle• Industrial

Block-Style SIM Card Connectors are available in a wide range of profile heights and are all offered in a halogen free material. Other features include high-contact normal forces and gold-plated rounded geometry contacts. N/A 0.5A 6 & 8

• Consumer• Medical• Mobile Devices

SMPM Blind-Mate and SMP RF Connectors

Ditto™ Wire-to-Wire Interconnects

Impel™ Backplane Connectors

SlimStack Armor™ 0.30mm Pitch Connectors

SlimStack™ SSB6 Board-to-Board Connectors

ML-XT™ Sealed Connection System

0.30mm FPC Dual Contact, BackFlip™

Block-Style SIM Card Connectors


ttieurope.com




Achieve up to 6.0A of power and electrical reliability in an ultra-compact design with SlimStack™ Hybrid Power Connectors designed for battery and other power applications in mobile devices. Featuring a stack height of just 0.75mm and dual-contact design for both signal and power contacts which ensures a reliable electrical and mechanical connection.

0.40mm6.0A Power0.3A Signal

8• Consumer• Medical• Mobile Devices

Designed for large-scale data-center storage systems, industry-leading iPass+™ HD Interconnects support SAS 3.0 signaling up to 100m with low power consumption, while reducing cable-management challenges. Featuring a fully integrated press-fi t receptacle design available in 1-by-1, 1-by-2 and 1-by-4 confi gurations.

N/A 0.5A 1, 2, 4• Data Communications• Telecom• Networking

The sleek TermiMate™ Wire-to-Board and Board-to-Board Connector System minimizes shadowing in LED lighting applications while providing space-savings and reduced component costs. This single-circuit system is low profi le and compact in size. It features a secure friction lock and its unique shaped terminals provide a fl oating mating tolerance.

N/A 3.0A 1• Consumer• Lighting

Molex’s 0.50mm Pitch FFC/FPC Connectors with double the contacts per circuit offer the best combination of signal reliability, compactness, wide circuit size range and cable style choices of any similar version in the market. These zero insertion force (ZIF) connectors also include a cable ear-tab locking feature.


High-Durability-Class USB 3.0 Cable Assemblies provide robust connectivity to support high speed computing, consumer and automotive applications. Available in standard lengths of 1.0m, 1.5m and 2.0m these assemblies are rated for up to 5,000 mating cycles. All cable assemblies are available in halogen-free versions.

N/A N/A N/A• Consumer• Medical• Mobile Devices

High durability spring clips offer mobile device makers maximum cost savings with superb interconnect performance over a wide working range. Other features include anti-snag design, narrow clip widths, high durability (1,500 cycles) and device to PCB grounding contact.

N/A1.5A max.

1

• Consumer• Telecom• Security• Industrial

High-density Ultra-Fit™ Power Connectors offer low mating forces, eliminate same-circuit-size cross mating, optimize space savings and reduce terminal back-out.This feature packed system offers single- and dual row wire-to-board options with vertical- and right angle headers. The positive locking housings are also available with TPA retainers.

3.50mm14.0A max.

2-16

• Consumer• Home Appliance• Telecom• Transportation• Industrial• Medical

Leveraging full keying and color-pairing features,foolproof CP-6.5 Wire-to-Board Connectors enhanceuser-safety while speeding up consumer and industrialinterconnect assembly applications. Features include positive locking, terminal position assurance (TPA) clips and kinked solder tails for pre solder board retention. The headers are 260° wave solder compliant.

6.50mm10.0A max.

2-6• Consumer• Home Appliance• Industrial

SlimStack™ Hybrid Power Connectors

USB 3.0 Cable Assemblies

iPass+™ HD Interconnects

Spring Clips for Mobile Devices

TermiMate™ Connector System

Ultra-Fit™ Power Connectors

0.50mm Pitch FFC Connectors

CP-6.5 Wire-to-Board Connector System


ttieurope.com


ttieurope.com

Find the Latest Innovations and Information at ttieurope.com/molex


ttieurope.com

Wire-To-Board .................................................................................................................................14 Wire-To-Board Microminiature ...................................................................................................................................14 Wire-To-Board Signal .................................................................................................................................................16 Wire-To-Board Power .................................................................................................................................................18 Wire-To-Board Ribbon Cable / Wire Trap ...................................................................................................................19 Wire-To-Board Storage ..............................................................................................................................................19

Wire-to-Wire ..................................................................................................................................20 Wire-to-Wire Power ...................................................................................................................................................20 Wire-to-Wire Signal ...................................................................................................................................................21

Board-to-Board ..............................................................................................................................22 Board-to-Board High Speed ......................................................................................................................................22 Board-to-Board Microminiature ................................................................................................................................23 Board-to-Board Power ..............................................................................................................................................24 Board-to-Board Signal ..............................................................................................................................................25 Board-to-Board Storage ............................................................................................................................................26

Power up to 5A ...............................................................................................................................26

Power up to 20A .............................................................................................................................27

Power up to 21A+...........................................................................................................................28

I/O Connectors ...............................................................................................................................30 I/O Connectors Consumer/PC ...................................................................................................................................30 I/O Connectors Networking/Telecommunications .....................................................................................................31 I/O Connectors Mobile Products ...............................................................................................................................32 I/O Connectors Industrial Products ...........................................................................................................................34

Backplane ......................................................................................................................................34 Backplane Connectors High Speed ..........................................................................................................................34 Backplane Connectors Cable Assemblies.................................................................................................................35

FFC/FPC .........................................................................................................................................36

Modular Jacks .................................................................................................................................40

Solderless Terminals .......................................................................................................................41

Terminal Blocks ..............................................................................................................................42

RF Products ...................................................................................................................................43

Sealed Connectors..........................................................................................................................44

Memory Module Sockets .................................................................................................................46

Memory Card Sockets .....................................................................................................................47

Standard Antennas .........................................................................................................................48

Solid State Lighting ........................................................................................................................49

Switch Products .............................................................................................................................50

Custom Solutions / Application Tooling ............................................................................................51

TABLE OF CONTENTS


ttieurope.com



Flexible, high-performance microminiature IDT coaxial connectors feature a double-clamp wire grounding method that provides both electrical and mechanical grounding. This method offers a more reliable termination than hand-soldering and up to 60% less transmission (dB) loss at frequencies between 1-3MHz.

0.40mm N/A 30-50 • Consumer

Pico-Clasp™ is a compact wire-to-board system, offered in both single and dual-row versions. Friction and (inner and outer) positive locks are offered for various application needs. Other features include mating guides, solder tabs and footprint compatibility with some competitive versions.

1.00mm 1.0A 2-15

20-50• Consumer

Pico-EZmate™ connectors are compact and low-profile; ideal for miniature, tight packaging, wire-to-board applications. Locking features and vertical mating between the receptacle housing and header enables secure and easy placement in tight spaces. 1.20mm 1.5A 2-6

• Transportation• Consumer• Mobile Devices

PanelMate™ offers the lowest profile of any fully-shrouded wire-to-board system from Molex. The series features an SMT header with robust solder tabs and solder-conducing SMT fillet tail design for secure PCB retention. The housing includes a friction lock for secure mating and housing lance for safe and secure terminal retention.

1.25mm 1.0A2-30

12-14 15-20

• Transportation• Consumer• Medical• Mobile Devices

PicoBlade™ is offered in wire-to-board and wire-to-wire options, single row, with both SMT and through-hole headers. The system saves about 45% of PCB space versus typical 2.00mm wire-to-board systems whilst providing the same amperes of current. (Semi-) automatic and manual tooling is available to support crimp harness assembly.

1.25mm 1.0A 2-15

• Transportation• Consumer• Industrial Automation• Medical

Mini Mi II™ is a compact multi-harness system available in both wire-to-board and wire-to-wire options. Custom lengths and wire configurations, single/ dual row and SMT/ through-hole styles available. Other features include APQP certified, internal positive lock for secure retention, and IDT housings for cost effective termination.

1.25mm 1.0A 2-40• Transportation• Consumer• Data/Communications

CLIK-Mate™ wire-to-board connectors are designed for applications that require higher pin-count connectors to carry more signal lines in less space. A tuning-fork terminal design provides low insertion force and a secure mating contact. Reinforced metal solder tabs ensure a secure PCB retention and solder joint strain relief. Note: * single row †dual row.

1.25mm

1.50mm

2.00mm

1.0A

2.0A

3.0A

2-15

2-15* 16-34†

4-15

• Consumer

Duo-Clasp™ dual-row, SMT connectors offer secure positive lock-system for superior mating retention and gold plating for increased durability. The dual-lock design prevents the housing from being dislodged from the PCB connector in case the wires are pulled, thus ensuring high signal contact. Suitable for high volume pick-and-place production.

1.25mm 1.0A 20-40 • Consumer

Micro IDT Coaxial Connectors

PicoBlade™

Pico-Clasp™

Mini Mi II™

Pico-EZmate™

CLIK-Mate™

PanelMate™

Duo-Clasp™

Wire-To-Board Microminiature


ttieurope.com

Product Name Description Pitch Current Rating


The Pico-Spox™ system includes crimp terminal, receptacle housings and PCB headers. The box style terminal makes contact with the header pin via two inward-facing dimples ensuring high reliability. Vertical and right-angle headers offer design flexibility. Friction lock and polarising features provide secure retention and proper mating.

1.50mm 3.0A 2-15• Consumer• Data/Communications• Medical

The Pico-Lock™ 1.50mm pitch wire-to-board system offers a mated height of just 2.00mm combined with a current carrying capacity of 3.0A per contact. Secure mating is achieved by side positive locks and top friction locks. Increased board retention is helped by way of wide robust fitting nails. Headers and housings are polarised to prevent mis-mating.

1.50mm 3.0A4, 6, 7, 8 and 10

• Automotive• Consumer• Solid State Lighting• Industrial• Telecoms

The Flexi-Mate™ connector system provides a full range of co-planar wire-to-board, board-to-board and terminator options for the lighting industry. Key features include a dual-contact terminal design for secure electrical contact and space-saving positive side locks. Guide features help facilitate mating and protect terminals.

3.70mm 2.0A 2 • Consumer

Pico-Spox™

Pico-Lock™

Flexi-Mate™

Wire-To-Board Microminiature


ttieurope.com

Wire-To-Board Signal



The Milli-Grid™ family saves up to 40% in PCB real estate over traditional 2.54mm pitch connectors. Suitable for wire-to-board, board-to-board and IDT cable-to board connections. Features include early entry (long wipe) terminals, center polarisation key and locking ramps, SMT and through-hole headers.

2.00mm 2.0A 4 -50

• Automotive• Consumer• Networking• Telecommunications

iGrid™ wire-to-board dual-row system comes with an anti-tangle internal positive lock providing space savings and secure mating retention, in a compact and robust design to withstand rugged handling and high vibration. Includes crimp terminals, receptacle housings and fully shrouded PCB headers in straight and right-angle configurations.

2.00mm 2.0A 10-40

• Automotive• Consumer• Industrial• Medical• Smart Phones and

Mobile Devices

DuraClik™ connectors meet various space constraints and harness installation needs due to the right-angle and vertical configuration options. Features include wide solder tabs, positive inner-lock and an audible mating sound, footprint compatibility, dust and damage reppelent contact design and an open area for pick-and-place.

2.00mm 3.0A 2-12• Automotive• Commercial Vehicle• Industrial Automation

MicroClasp™ wire-to-board system includes a unique inner positive lock that provides latch protection, secure retention and an audible mating “click”. The terminal design offers low insertion and withdrawal forces. Single and dual-row crimp receptacles and PCB headers are available in SMT and through-hole configurations.

2.00mm 3.0A 2-40• Consumer• Industrial• Medical

MicroBlade™ system offers a reliable box-type terminal that provides secure electrical contact, optional IDT receptacle and fully shrouded headers in straight, right-angle and bottom-entry versions. Features include a low-profile mated height for space savings, user-friendly friction lock with housing windows and polarisation options to prevent mis-mating.

2.00mm 2.0A 2-15• Consumer• Data/Communications

Micro-Lock™ connectors feature a wide mating latch with two-point positive lock for secure mating retention. The system provides the optimal combination of pinprotection, low profile and low-insertion force enablingeasy mating and unmating. ‘Crash Free’ mating design protects housing terminals and header pins from damage.

2.00mm 3.0A 4-15• Consumer• Data/Communications

The Sherlock™ family consists of vertical and right-angle headers, crimp housings and reliable box-style terminals. Key features include a positive locking latch that withstands high vibration and permits unmating only when activated, a low mated profile for space saving, and polarised sidewalls that prevent mismating and provide mating guidance.

2.00mm 2.0A 2-20• Automotive• Consumer

Micro-Latch™ connectors ensure durable mating and protection of the electrical circuits due to a friction-lock mechanism where the noses on the latching receptacle housing slide into the header wall openings. Through-hole versions are available for both right-angle and surface-mount compatible vertical headers. Polarising features help prevent mis-mating.

2.00mm 2.0A 2-15• Automotive• Consumer

Milli-Grid™

MicroBlade™

iGrid™

Micro-Lock™

DuraClik™

Sherlock™

Micro-Clasp™

Micro-Latch™


ttieurope.com

Wire-To-Board Signal



Versatile wire-to-board and wire-to-wire system including terminals, crimp housings and fully-shrouded straight and right-angle headers available in tray and radial tape packaging. Features include a four-point contact design for electrical reliability, guide walls and pull tabs for easy mating/unmating, anti-fishhooking contact for safe harness assembly.

2.50mm 3.0A 2-15• Consumer• Industrial

SPOX BMI™ (Blind-Mate Interface) connectors offer low-profile, dual-row, wire-to-wire and wire-to-board solutions. Self-aligning features and mated stack distance of only 11.00mm allow for secure use in both horizontal and vertical directions. Multiple pin counts permit design flexibility and provide solutions for both power and signal applications.

2.54mm 3.0A 6-16• Networking• Telecommunications

The SPOX™ family features Mini-SPOX™, including crimp and IDT housings, wire-to-wire and wire-to-board options, and Macro-SPOX™, including unshrouded and partially shrouded headers, along with board-to-board options. The “spring box“-shaped terminals provide multiple points of contact assuring excellent signal integrity.

2.50- 5.08mm

3.0-7.0A 2-16

• Transportation• Consumer• Data/Communications • Industrial Automation

The 3rd generation C-Grid III™ system offers unique design features including 3 different plating options - a termination technique supporting discrete wire and ribbon cable connectors, inter-mateability with Molex‘s QF-50 product line and full compatibility with DIN41651, HE-13/14 standard connector systems.

2.54mm 3.0A 2-130• Transportation• Consumer

SL™ (Stackable Linear) is a modular, single-row, wire-to-wire and wire-to-board system including press-fit (compliant-pin), through-hole and SMT PCB termination. Latching vertical/right-angle headers; discret wire, FFC and IDT crimp housings are available. SL™ intermates with CGrid® and KK® product families in same pitch to provide design flexibility and configuration options.

2.54mm 3.0A 2-25

• Transportation• Consumer• Data/Communications• Industrial Automation• Medical• Networking

A versatile single-row wire-to-board and board-to-board crimp contact system. Vertical and right-angle PCB headers with or without polarisation and friction locks. Right-angle top- and bottom-entry PCB connectors mate with standard headers to facilitate board-to-board configurations.

2.50mm/ 2.54mm

4.0A 2-28


Wire-to-Board

Connectors

Product Name Description PitchCurrent Rating

Circuits Size

Applications

2.50mm 3.0A 2-15

10.0mm(0.393”)

30.0A(PowerBlade)

2

10.0mm(0.393”)

30.0A(PowerBlade)

1

10.0mm(0.393”)

30.0A(PowerBlade)

1

10.0mm(0.393”)

30.0A(PowerBlade)

3

10.0mm(0.393”)

30.0A(PowerBlade)

3

10.0mm(0.393”)

30.0A(PowerBlade)

3

10.0mm(0.393”)

30.0A(PowerBlade)

3

Versatile wire-to-board and wire-to-wire system

including terminals, crimp housings and fully

shrouded straight and right-angle headers available

in tray and radial tape packaging. Features include:

four-point contact design for electrical reliability;

guide walls and pull tabs for easy mating/unmating;

anti-fishhooking contact for safe harness assembly. Mini-Lock

Product

Image

Duplicate

Spox BMI

Product

Image

Duplicate

Spox

Product

Image

Duplicate

C-Grid III

Product

Image

Duplicate

SL

Product

Image

Minctor endisqu aesequos sandanim lat ant qui vel

magnam qulaccus, solorep, blablablubbblubb,

tatemolorum rem, Aceaque, veni, vidi, vici, endisqu

aesequos sandanim lat ant qui vel magnam

qulaccus, lat ant qui vel magnam Aceaque, veni, vidi,

vici, endisqu aesequos sandanim lat ant qui vel

magnam qulaccus, XYZ product name

product name

Product

Image








product name

Product

Image








product name

Product

Image

Note: do not

change font size

in this template

Consumer

Industrial

Mini-Lock™

SPOX BMI™

C-Grid III™

SLSL™ Modular Connectors

KK®

SPOX™


ttieurope.com



Mini-Fit Sr.™ power connectors offer a compact wire-to-wire and wire-to-board high-current system capable of handling up to 50.0A per contact. This single- and dual-row system is UL, CSA and TUV approved. Features include integrally molded TPA’s on single-row products, positive locking and polarised housings across all circuit sizes.

10.00mm 50.0A 2 – 14

• Commercial Vehicles• Consumer• Industrial Automation• Medical• Networking

Molex offers the full range of RAST IDT connectors and headers. RAST 5 for indirect mating in either 10.0A or 16.0A versions. RAST 2.5 for direct and indirect mating and RAST Power in both 6.0A and 10.0A versions for direct or indirect mating. Multiple polarisation and coding options are available as standard and all products are Glow Wire compliant.

2.50mm 5.00mm

4.0A 16.0A

1 - 20• Home Appliance• Consumer• Automotive

Able to handle up to 13.0A per contact when using the MarKK terminal the KK® 396 wire-to-board and board-to-board system is ideal for use in many varied applications. RPC (reflow process compatible) headers are also available in vertical and right-angle friction-lock variations. UL 94V-0 and Glow wire compliant versions are also available.

3.96mmUp to 13.0A

2-24

• Automotive• Consumer• Industrial• Medical

Industry standard .093” pin-and-socket power connectors are suitable for wire-to-wire and wire-to-board configurations. Terminals can be used in both plug or receptacle housings allowing for design flexibility. PCB headers are also available. Features include panel mount and free hanging housings with positive locks and fully isolated contacts.

5.03mm 17.0A 1-15• Consumer• Data/Communications• Networking

The Mini-Fit® family is designed for higher-current / higher-density applications which require design flexibility for wire-to-wire, wire-to-board and board-to-board configurations. Features include fully isolated terminals, positive locking, low-engagement forces and polarised housings and receptacles. Glow wire compliant and Halogen free versions are available.

4.20mm 13.0A 2 - 24

• Consumer• Data/Communications• Industrial Automation• Networking• Medical• Automotive• Commercial Vehicle• Military/Aerospace• Telecommunications• Alternative Energy

Source

The MLX™ series is interchangeable, intermateable and intermountable with industry standard products. This allows greater flexibility in mating with existing wire harnesses, connectors or PCB headers. The housings are designed for both male and female terminals. Housings are fully polarised and offer positive locking.

6.35mm 13.5A 1-15

• Commercial Vehicle• Consumer• Industrial Automation

Networking

The Micro-Fit™ family is a wire-to-wire, wire-to-board and board-to-bord connector system in single- and dual-row configurations. Features include blind mate (BMI), compliant pin (CPI) and reduced mating force (RMF) options. PCB-mount headers are available in straight and right angle, SMT and through-hole types, halogen-free and glow-wire compliant materials.

3.00mm 5.0A 2-24

• Alternative Energy Source

• Consumer• Data/Communications• Medical• Military/Aerospace• Telecommunications

Mega-Fit Power Connectors deliver cutting-edge current density at 23.0A per circuit; terminals provide six independent contact points for long-term reliability in virtually every industry and application. Available in a wire-to-board configuration with vertical and right- angled headers along with UL94V-0 and glow-wire compliant housings.

5.70mm 23.0A 2-12

• Consumer• Home Appliance• Commercial Vehicle• Industrial• Telecom

Mini-Fit Sr.™

Mini-Fit® Products

RAST Connectors

MLX™

KK® 396

Micro-Fit™ Products

Mega-Fit

Standard .093’’

Wire-To-Board Power


ttieurope.com

Wire-To-Board Ribbon Cable / Wire Trap



The iPass™ Interconnect System offers bothconnectors and cable assemblies that enable flexible speed compatibility for applications ranging from 1.5 Gbps up through 10.0 Gbps. Cable assemblies provide 100 Ohm differential impedance with tight skew control and low crosstalk, available in multiple standard / custom cable lengths.

0.75mm 0.80mm 1.27mm

N/A Multiple• Data/Communications• Networking• Telecommunications

Molex leads the way with an ever growing family of SATA interconnect solutions including latching cable receptacles in both straight- and right-angle versions for Parallel ATA to Serial ATA conversion, locking PCB plugs that are backwards-compatible in right-angle and vertical options, and combo external SATA and USB receptacles for effective storage.

Multiple N/A Multiple• Consumer• Networking• Storage

Low-Insertion-Force Micro SATA Revision 3.0 Specification-compliant interconnects deliver high- speed data at 6 Gbps with uncompromised quality for 1.80” Solid State Drives, mobile computing and consumer applications. Features include FMLB, guide post and pockets, friction locks, solder tabs and high temperature thermoplastic housings.

1.27mm 1.32mm 5.08mm

1.5A AC or DC 14, 16 • Consumer

• Data/Communications

Also known as SAS Backplane Connector, this connector has the same form factor as Serial ATA with the addition of a “bump” to key it specifically for SAS. Features include point-to-point topology, disk/ backplane interoperability with Serial ATA, hot plug, blind-mate connections, 3.0 Gbps transfer rate, compact cabling and multiple receptacle options.

0.80mm, 1.27mm


Serial Attach SCSI uses a point-to-point architecture which works in conjunction with PCI Express and other high-speed architectures on the market such as Serial ATA. Molex offers a broad range of connectors ranging from SAS Multi-Lane cable assemblies to SAS vertical and right angle Internal Multi-Lane connectors.

Multiple N/A Multiple• Consumer• Networking

iPass™

Serial Attached SCSI – SFF 8484

Serial ATA

Micro SATA

Serial Attached SCSI – SFF 8482



The 8 versatile series of Picoflex® receptacles and headers, including the reverse-footprint SMT headers in standard and latched versions, enable maximum design flexibility. Picoflex offers excellent polarisation to both the PCB and between the female connector and header. Plating options include tin and palladium nickel with gold flash.

1.27mm 1.2A 4-26


• Automotive• Consumer• Data/Communications• Industrial Automation • Medical

Lite-Trap™ is a low profile (4.20mm) SMT wire-to-board connector ideal for the lighting industry. A stripped wire is inserted into the connector and pushes open a gate-style terminal that “traps” the wire. To unmate, a button-style lever on the housing top is pushed down to allow the wire to be removed. The connector also features a compact industry standard PCB layout pattern.

4.0mm 9.0A 1 and 2• Solid State Lighting• Consumer• Industrial

Picoflex®

Wire-To-Board Storage

Lite-Trap™


ttieurope.com



Offered in wire-to-wire, wire-to-panel and wire-to-board configurations, the IP67-rated MX150L™ system provides design flexibility for low level signal to high power applications. Key features include pre-assembled connector housings, integral TPA and two-way mat seal on mating connector, sealed panel-mount plugs and proven blade-type terminals.

5.84mm, 7.62mm

Up to 18.0A and

40.0A

2-16• Commercial Vehicle• Consumer• Industrial Automation

The Versablade™ wire-to-wire connector system consists of wide flat blade tab terminals (1.78mm), multi-configured modular housings and terminal position assurance inserts for modularity and design flexibility in various applications. Other features include positive lock and TPA secondary lock, single-row system and spring style mounting ears.

Various 4.0A -15.0A 1-9• Consumer• Industrial Automation


6.35mm 13.5A 1 - 15


Networking


4.20mm 13.0A 2 - 24


Source



The Industry standard 0.62“ pin-and-socket wire-to-wire connector system provides a robust economical solution to applications needing a current handling capability of up to 5.0A. Housings will accept both male and female terminals and are polarised to eliminate mismating. 3.68mm 5.0A 1-36

• Consumer• Data/Communications• Networking

Smallest pitch wire-to-wire connector system for 100 to 300 V signal and power applications when using 2.60mm diameter wire. The system features a positive lock design for secure mating, fully shrouded contacts and an optional TPA retainer. 3.30mm 4.0A 2-6

• Consumer• Industrial Automation

Beau™ plug and socket blade-type connectors provide superior durability over hollow-pin connectors, allowing repetitive mating without any damage. Thermoplastic backshells provide greater dielectric strength and safety, uniform float contacts enable maximum surface engagement, low contact resistance and easier mating.

6.35mm 10.0A 2-24• Consumer• Industrial Automation

MX150L™

Standard .093’’

Versablade™

Standard .062’’

MLX™

Inertia Lock 3.30mm

Mini-Fit® Products

Beau™ Power Connectors

Wire-To-Wire Power


ttieurope.com



The Micro-Fit™ family is a wire-to-wire, wire-to-board and board-to-bord connector system in single- and dual-row configurations. Features include blind mate (BMI), compliant pin (CPI) and reduced mating force (RMF) options. PCB-mount headers are available in straight and right angle, SMT and through-hole types, Halogen Free and Glow Wire compliant materials.

3.00mm 5.0A 2-24


• Consumer• Data/Communications• Medical• Military/Aerospace• TelecommunicationsMicro-Fit™

Products

Wire-To-Wire Power



The SPOX™ family features Mini-SPOX™, including crimp and IDT housings, wire-to-wire and wire-to-board options and Macro-SPOX™, including unshrouded and partially shrouded headers, along with board-to-board options. The “spring box“-shaped terminals provide multiple points of contact assuring excellent signal integrity.

2.50- 5.08mm

3.0-7.0A 2-16

• Transportation• Consumer• Data/Communications • Industrial Automation

SPOX BMI™ (Blind-Mate Interface) connectors offer low-profile, dual-row, wire-to-wire and wire-to-board solutions. Self-aligning features and mated stack distance of only 11.00mm allow for secure use in both horizontal and vertical directions. Multiple pin counts permit design flexibility and provide solutions for both power and signal applications.

2.54mm 3.0A 6-16• Networking• Telecommunications

Mizu-P25™ wire-to-wire connector system is IP67 certified. The family includes systems rated up to 125 V and 250 V. Due to their small dimensions both systems are ideal for wire-to-wire applications in confined spaces. Other features include positive locking, polarisation and special terminal designs for high vibration applications.

2.50mm 3.0/4.0A 2-4• Transportation• Consumer• Industrial Automation


2.54mm 3.0A 2-25


SPOX™

SPOX BMI™

Mizu-P25™

SL™ Modular Connectors

Wire-To-Wire Signal


ttieurope.com

Product Name Description Speed Density Orien-tation Applications

The Impact™ backplane connector system for con-ventional, coplanar and mezzanine configurations provides data rates up to 25 Gbps and superior signal density up to 80 differential pairs per inch. Achieve low cross-talk and high signal bandwidth while minimising channel-performance variation across every differential pair within the system.

25 Gbps80 diff

pair / sq inch

ConvenCoplanar

Mezz

• Data Communications• Telecommunications• Military/Aerospace

GBX I-Trac™ system, available in standard backplane, orthogonal midplane, high-current power modules, inverted and coplanar configurations provides design flexibility and enables future system performance upgrades without requiring platform re-design. Capable of supporting next-generation applications with data rates of 12.5 Gbps or higher.

12.5 Gpbs69 diff

pair / sq inch

ConvenCoplanarInvertedOrthog

• Networking• Telecommunications

The Z-PACK TinMan’s press-fit, flexible, mono-block based system can be stacked end-to-end to meet customer pin-count requirements. The system delivers integrated shielding, differential-pair density, 85 Ohm impedance and lower crosstalk and insertion loss versus 100 Ohm backplane systems.

*Z-PACK and Z-PACK TinMan are trademarks of Tyco Electronics

12.5 Gbps66 diff

pair / sq inchConvenMezz

• Data Communications• Medical• Networking• Telecommunications

GbX® backplane connectors deliver high-density and high-speeds up to 10 Gbps and are custom-configurable. Bifurcated contact beams in daughtercard receptacles ensure greater reliability with 2 points of contact to each header pin. †GbX® is a registered trademark of Amphenol Corporation

10 Gbps69 diff

pair / sq inch

ConvenCoplanarOrthog


Very High Density Metric connectors achieve high- speed signal integrity via interstitial signal and ground shields between columns. Standard VHDM®* connectors support data rates of 3.125 Gbps with less than 5% crosstalk; H-series supports up to 6.25 Gbps.

*VHDM is a registered trademark of Amphenol Corporation

Up to 6.25 Gbps

100 diff pair / sq inch

ConvenCoplanar

• Data Communications• Industrial Automation• Medical• Military/Aerospace• Networking• Telecommunications

MicroTCA delivers a low-cost, flexible and scaleable solution with 10.0 Gbps data rate for a wide variety of low to mid-range telecom applications. This press-fit, vertical, edge-card connector provides 170 contacts on 0.75mm pitch and enables AdvancedMC (AMC) cards to be plugged directly to a backplane.

10Gbps 1.5A 170 ckt.• Medical• Instrumentation• Telecommunications

Impact™

MicroTCA

VHDM®

GbX I-Trac™

Z-PACK TinMan*

GbX®†

Board-To-Board High Speed


ttieurope.com



Molex’s SlimStack™ family of board-to-board connectors offers stacking heights from 0.70mm to 20.00mm. All versions are gold-plated for high reliability over multiple mating cycles. Other features include a durable blade-on-beam contact, SMT tails that create strong solder fillets, and a friction locking feature for added mating retention.

0.40/0.50 0.635/

1.00mm 0.4/0.5A 6-140

• Transportation• Consumer

Standardised PCI mezzanine card connectors have a fully shrouded leaf-style design which minimizes the chance of damaging plug contacts. Receptacle contacts feature a low mating force that reduces PCB stress. Gold over Nickel contact plating enhances long-term reliability. LCP housings enable SMT reflow processing.

1.00mm 1.0A 64-256• Consumer• Networking• Telecommunications

Molex’s compression connectors offer design flexibility, reduced component counts and a high degree of manufacturability. The range includes parts with a height above the board of 0.60mm and contact pitches as small as 0.70mm. The high temperature materials used in the manufacturing process enable the parts to be IR reflow soldered.

0.7mm - 4.5mm

1.5-7.0A 2-10• Transportation• Consumer• Mobile Devices

The Flexi-Mate™ connector system provides a full range of co-planar wire-to-board, board-to-board and terminator options for the lighting industry. Key features include a dual-contact terminal design for secure electrical contact and space-saving positive side locks. Guide features help facilitate mating and protect terminals.

3.70mm 2.0A 2 • Consumer

MicroTCA delivers a low-cost, flexible and scaleable solution with 10.0 Gbps data rate for a wide variety of low to mid-range telecom applications. This press-fit, vertical, edge-card connector provides 170 contacts on 0.75mm pitch and enables AdvancedMC (AMC) cards to be plugged directly to a backplane.

0.75mm 1.5A 170• Medical• Instrumentation• Telecommunications

MicroTCA

SlimStack™

PMC

Compression Connectors

Flexi-Mate™

Board-To-Board Microminiature


ttieurope.com



EXTreme PowerMass™ is a high-current, board-to-board, modular connector system, providing customer-specific interconnect solutions for AC and DC power requirements. The system offers a density of up to 350.0A per inch while providing minimum heat generation due to extremely low plane-to-plane resistance.

Various150.0A, 80.0A, 40.0A

Multiple power and

signal


EXTreme Ten60Power™ is easily configured to meet special design requirements with no tooling costs! The system is a modular high-current power and signal connector system in a coplanar and right-angle board-to-board orientation. The low profile (10.0mm height) helps to enhance the system airflow within the power system.

Various 60.0A Multiple• Industrial Automation• Networking• Telecommunications

EXTreme ZPower™ is a high-current, rigid, board-to-board and wire-to-board mezzanine style interconnect designed to transfer power loads from one PCB to another. The connector is press-fit into the PC base board. The PC top board is then screwed down on top of the EXTreme ZPower connector, forming a high-pressure interface.

10.30mm 30.0A 1• Industrial Automation• Power Supplies• Telecommunications

EXTreme PowerEdge™ is a one-piece vertical card edge style connector, used with either gold finger pc boards, or as a bus bar interconnect for power supply and power distribution applications. Connectors are available in power only, signal only and power/signal combinations and can be configured for AC and DC power systems.

Various 40.0A Multiple • Networking• Telecommunications

EXTreme PowerDock™ interconnects include guide pins for blind mating, mounting ears option for mechanical attachment to the PCB, power blades and signal pins in multiple lengths and press-fit tails. This family can be used as a drop-in replacement in many existing applications due to its custom configurable nature.

Various40.0A 3.0A

Multiple

• Consumer• Data Communications• Industrial Automation• Networking• Telecommunications

The EXTreme LPHPower™ connector is a mixed, high-current power and signal connector system with power blades parallel to the PC board. Its extremely low-profile height of only 7.50mm allows greater system airflow while taking up 53% less space than traditional connectors with the same current rating. Right-angle, coplanar or vertical configurations are available.

Various35.0A 3.0A

Multiple

• Data Communications• Industrial Automation• Networking• Telecommunications

EXTreme PowerPlus™ series conforms to the Server System Infrastructure (SSI) open specification. Features include recessed signal-pins and sequential mating (LMFB) that allows the hot-swapping of power supply units on the male side, guide pockets (headers) or guide posts (receptacles) and fully shrouded headers.

Various30.0A 1.0A

Multiple



4.20mm 13.0A 2 - 24


Source

EXTreme PowerMass™

EXTreme PowerDock™

EXTreme Ten60Power™

EXTreme LPHPower™

EXTreme ZPower™

EXTreme PowerPlus™

EXTreme PowerEdge™

Mini-Fit® Products

Board-To-Board Power


ttieurope.com



The Milli-Grid™ family, saves up to 40% in PCB real estate over traditional 2.54mm pitch connectors. Suitable for wire-to-board, board-to-board and IDT cable-to board connections. Features include early entry (long wipe) terminals, center polarisation key and locking ramps, SMT and through-hole headers.

2.00mm 2.0A 4 -50

• Automotive• Consumer• Networking• Telecommunications


2.54mm 5.0A 2-36


The 3rd generation C-Grid III™ system offers unique design features including 3 different plating options, a termination technique supporting discrete wire and ribbon cable connectors, inter-mateability with Molex‘s QF-50 product line and full compatibility with DIN41651, HE-13/14 standard connector systems.

2.54mm 3.0A 2-130• Transportation• Consumer


2.54mm 3.0A 2-25


Milli-Grid™

KK® 254

C-Grid III™

SL™ Modular Connectors

Board-To-Board Power



Able to handle up to 13.0A per contact when using the MarKK™ terminal the KK® 396 wire-to-board and board-to-board system is ideal for use in many varied applications. RPC (reflow process compatible) headers are also available in vertical and right-angle friction-lock variations. UL 94V-0 and Glow Wire compliant versions are also availble.

3.96mm Up to 13.0A 2-24


KK® 396

Board-To-Board Signal


ttieurope.com



Molex leads the way with an ever growing family of SATA interconnect solutions including latching cable receptacles in both straight- and right-angle versions for Parallel ATA to Serial ATA conversion, locking PCB plugs that are backwards-compatible in right-angle and vertical options, and combo external SATA and USB receptacles for effective storage.

Multiple N/A Multiple• Consumer• Networking• Storage

Low-Insertion-Force Micro SATA Revision 3.0 Specification-compliant interconnects deliver high- speed data at 6 Gbps with uncompromised quality for 1.80” Solid State Drives, mobile computing and consumer applications. Features include FMLB, guide post and pockets, friction locks, solder tabs and high temperature thermoplastic housings.

1.27mm 1.32mm 5.08mm

1.5A AC or DC

14, 16• Consumer• Data/Communications

Molex‘s versatile low-cost EBBI™ 50D series are unshielded, high density, leaf-style connectors available in vertical, right-angle, blind-mating and SMT configurations. Housings are UL 94V-0 approved, the IDT receptacles mate to standard .062 inch pc card edge and terminals are plated with 30µ“ minimum gold in the mating area.

1.27mm 1.0A 30 - 130• Data communication• Telecommunication

Serial ATA

Micro SATA

EBBI™ 50D

Board-To-Board Storage



The Micro-Fit™ family is a wire-to-wire, wire-to-board and board-to-bord connector system in single and dual row configurations. Features include blind mate (BMI), compliant pin (CPI) and reduced mating force (RMF) options. PCB mount headers available in straight and right angle, SMT and T/H types. Halogen-free and glow-wire compliant materials.

3.00mm 5.0A 2-24


• Consumer• Data/Communications• Medical• Military/Aerospace• Telecommunications


2.54mm 5.0A 2-36


The Industry standard 0.62“ pin-and-socket wire-to-wire connector system provides a robust economical solution to applications needing a current handling capability of up to 5.0A. Housings will accept both male and female terminals and are polarised to eliminate mismating. 3.68mm 5.0A 1-36

• Consumer• Data/Communications• Networking

Micro-Fit™ 3.0

KK 245®

Standard .062’’

Power ConnectorsCurrent up to 5A


ttieurope.com



The Mini-Fit® family is designed for higher-current / higher-density applications which require design flexibility for wire-to-wire, wire-to-board and board-to-board configurations. Features include fully isolated terminals, positive locking, low-engagement forces and polarised housings and receptacles. Glow Wire compliant and Halogen free versions are available.

4.20mm 13.0A 2 - 24


Source


6.35mm 13.5A 1 - 15


Networking



RAST 5 IDT and crimp connectors are extremely reliable power connectors meeting all industry standards and testing requirements. Features include Glow Wire compliant, low-insertion force, colour-coded polarisation, multiple keying and latching configurations, vertical and right-angle headers are also available in tin and silver plating.

5.00mm10.0A, 16.0A

1 - 8 • Consumer

Sabre™ is a high-current wire-to-wire and wire-to-board connector family with a built-in TPA feature that prevents terminal backout. Crimp terminals are available to suit a wide range of wire guages and insulation thicknesses and terminals are fully isolated. The system is UL recognised, CSA approved, TUV licensed.

7.50mm 18.0A 2 - 8


• Consumer• Industrial Automation• Medical• Military/Aerospace• Networking• Telecommunications

Able to handle up to 13.0A per contact when using the MarKK™ terminal the KK® 396 wire-to-board and board-to-board system is ideal for use in many varied applications. RPC (reflow process compatible) headers are also available in vertical and right-angle friction-lock variations. UL 94V-0 and Glow Wire compliant versions are also available.

3.96mmUp to 13.0A

2-24


Mini-Fit® Products

MLX™

Standard .093’’

RAST 5

Sabre™

KK™ 396

Power ConnectorsCurrent up to 20A


ttieurope.com

Power ConnectorsCurrent up to 21A+



EXTreme PowerMass™ is a high-current, board-to-board, modular connector system, providing customer-specific interconnect solutions for AC and DC power requirements. The system offers a density of up to 350.0A per inch while providing minimum heat generation due to extremely low plane-to-plane resistance.

Various150.0A, 80.0A, 40.0A

Multiple power and

signal


EXTreme Ten60Power™ is easily configured to meet special design requirements with no tooling costs! The system is a modular high-current power and signal connector system in a coplanar and right-angle board-to-board orientation. The low profile (10.0mm height) helps to enhance the system airflow within the power system.

Various 60.0A Multiple• Industrial Automation• Networking• Telecommunications

EXTreme ZPower™ is a high-current, rigid, board-to-board and wire-to-board mezzanine style interconnect designed to transfer power loads from one PCB to another. The connector is press-fit into the PC base board. The PC top board is then screwed down on top of the EXTreme ZPower connector, forming a high-pressure interface.

10.30mm 30.0A 1• Industrial Automation• Power Supplies• Telecommunications

EXTreme PowerEdge™ is a one-piece vertical card edge style connector, used with either gold finger pc boards, or as a bus bar interconnect for power supply and power distribution applications. Connectors are available in power only, signal only and power/signal combinations and can be, configured for AC and DC power systems.

Various 40.0A Multiple • Networking• Telecommunications

EXTreme PowerDock™ interconnects include guide pins for blind mating, mounting ears option for mechanical attachment to the PCB, power blades and signal pins in multiple lengths and press-fit tails. This family can be used as a drop-in replacement in many existing applications due to its custom configurable nature.

Various40.0A 3.0A

Multiple

• Consumer• Data Communications• Industrial Automation• Networking• Telecommunications

The EXTreme LPHPower™ connector is a mixed, high-current power and signal connector system with power blades parallel to the PC board. Its extremely low-profile height of only 7.50mm allows greater system airflow while taking up 53% less space than traditional connectors with the same current rating. Right-angle, coplanar or vertical configurations are available.

Various35.0A 3.0A

Multiple


EXTreme PowerPlus™ series conforms to the Server System Infrastructure (SSI) open specification. Features include recessed signal-pins and sequential mating (LMFB) that allows the hot-swapping of power supply units on the male side, guide pockets (headers) or guide posts (receptacles) and fully shrouded headers.

Various30.0A 1.0A

Multiple


Exceed high-current and reliability requirements in top-end server and high-power applications with Molex’s compact, EXTreme Guardian™ Power Connector System, providing EMI/RFI shielding, overmolding and discrete-wire options for design flexibility. This wire-to-board system also features ‘first mate, last break’ contact arrangements.

11.00mm 80.0A 2 and 3

• Automotive• Consumer• Telecom• Datacom

EXTreme PowerPlus™

EXTreme LPHPower™

EXTreme PowerMass™

EXTreme Ten60Power™

EXTreme ZPower™

EXTreme PowerEdge™

EXTreme PowerDock™

EXtreme Guardian™


ttieurope.com

Power ConnectorsCurrent up to 21A+



Mini-Fit Sr.™ power connectors offer a compact wire-to-wire and wire-to-board high-current system capable of handling up to 50.0A per contact. This single- and dual-row system is UL, CSA and TUV approved. Features include integrally molded TPA’s on single-row products, positive locking and polarised housings across all circuit sizes.

10.00mm 50.0A 2-14

• Commercial Vehicles• Consumer• Industrial Automation• Medical• Networking

Mega-Fit Power Connectors deliver cutting-edge current density at 23.0A per circuit; terminals provide six independent contact points for long-term reliability in virtually every industry and application. Available in a wire-to-board configuration with vertical and right- angled headers along with UL94V-0 and Glow Wire compliant housings.

5.70mm 23.0A 2-12

• Consumer• Home Appliance• Commercial Vehicle• Industrial• Telecom

Sabre™ is a high-current wire-to-wire and wire-to-board connector family with a built-in TPA feature that prevents terminal backout. Crimp terminals are available to suit a wide range of wire gauges and insulation thicknesses and terminals are fully isolated. The system is UL recognised, CSA approved, TUV licensed.

7.50mm 18.0A 2-8


• Consumer• Industrial Automation• Medical• Military/Aerospace• Networking• Telecommunications

Mini-Fit Sr.™

Mega-Fit

Sabre™


ttieurope.com



Industry standard USB connectors and cable assemblies provide connection for power and data exchange without the need for a host PC across a variety of industries. Available in standard, mini and micro versions.

2.00mm 2.50mm

1.5A 5

• Consumer• Medical• Smart Phones and

Mobile Devices

The DisplayPort solution consists of SMT external receptacles with a polarised D-shape mating interface and PCB retention features. Receptacles are mountable on the device side and the overmolded plug connects to the display device. The cable assemblies come in both latching and non-latching versions.

*DisplayPort is a trademark of Video Electronics Standards Association (VESA)

0.50mm 0.5A 20• Consumer• Data/Communications

High Definition Multimedia Interface (HDMI*) Connectors come in a compact, user-friendly fully shielded design. A single cable bandwidth of 5 Gbps carries both uncompressed audio and video. Other features include backward compatible HDMI to DVI cables, mounting flanges and triad signal layout.

*HDMI, the HDMI Logo, and High Definition Multimedia Interface are trademarks or registered trademarks of HDMI Licensing LLC in the US and other countries.

0.40mm 0.50mm

0.8A 19 • Consumer

A 19-pin interconnect in a stainless steel shell, half the size of the current Mini connector, offering all the advan- tages of the HDMI 1.4 specification. Available in full SMT, through-hole shell tabs and hybrid SMT and through-hole shell tab versions; receptacles offer friction lock and terminal hold-down features. Cable assemblies available.

*HDMI, the HDMI Logo, and High Definition Multimedia Interface are trademarks or registered trademarks of HDMI Licensing LLC in the US and other countries

0.40mm 0.8A 19

• Automotive • Consumer• Smart phones and

Mobile Devices

The Molex MicroCross DVI system provides a high-bandwidth video interface for host and display devices. The rugged LFH (Low Force Helix) contact design provides two points of contact for optimal signal integrity and reduces insertion force to ensure high reliability. A full range of connectors, cables and adaptors is available.

N/A 3.0A 29 • Consumer

USB Products

DisplayPort*

MicroCross DVI

HDMI*

Micro HDMI*

I/O ConnectorsConsumer / PC


ttieurope.com



The iPass™ Interconnect System offers bothconnectors and cable assemblies that enable flexible speed compatibility for applications ranging from 1.5 Gbps up through 10 Gbps. Cable assemblies provide 100 Ohm differential impedance with tight skew control and low crosstalk, available in multiple standard / custom cable lengths.

0.75mm 0.80mm 1.27mm


iPass+™ HD, also named mini-SAS, improves system airflow and signal integrity by eliminating midplane connections. This low-profile system, meets SAS-3 next-generation speed and density requirements, with signals enabling active copper and optical cable modules. iPass+ HD connectors mate to all current miniSAS HD cable assemblies.

0.75mm N/A36, 62, 72, 144

• Data/Communications• Networking• Telecommunications

The newest addition to the iPass+™ family enables pluggable copper/optical options, thereby increasing the flexibility of system-level hardware for end users. Offered as one-piece press-fit connector and cage assembly in both single and stacked dual-port configurations. Adopted by Infiniband* CXP 12x QDR and IEEE 802.3ba.

*Trademark of the InfiniBand Trade Association

0.80mm N/A 84, 168• Networking• Telecommunications

The Quad Small Form-factor Pluggable Plus (QSFP+) Interconnect system is designed for high density applications. The QSFP+ connector, cage and cable assemblies (copper and optical) and loopbacks are part of a highly-integrated system that combines effective use of space, power and port density for high-density applications.

0.80mm N/A N/A• Automotive• Networking• Telecommunications

The patented Low Force Helix (LFH) male pin interfaces with a split-beam receptacle contact giving a low insertion force with 2-point contact reliability. The system will accept various wire sizes and is available in vertical and right-angle header versions. Optional hardware for docking applications is also available.

1.27mm (Matrix 50),

1.90mm (Matrix 75)

1.0A

60-200 (Matrix 50);

96-130 (Matrix 75)

• Data/Communications • Medical• Networking• Telecommunications

TDP® connectors provide a shielded, dual-row, cable-to-board interface offering mid-range speed (up to 5Gbps) and 100 Ohm controlled impedance. Fully shielded vertical (through-hole) and right-angle (SMT) receptacles plus fully shielded plugs and cable kits are available. Overmolded cable assemblies complete the range.

1.27mm 1.5A18, 28, 38,

48, 72

• Consumer• Data/Communications• Industrial Automation• Medical

The Ultra+™ Very High Density Cable Interconnect system features “blade on beam” style contact, reduced size (27% smaller than SCSI-3), increased robustness, improved electrical performance and higher density. Superior leaf/ribbon style contact, meets EIA, ANSI/SFF-8441and SPI-4 specifications to ensure intermatability with conforming products.

0.80mm N/A 68, 136

• Data/Communications• Industrial Automation• Medical• Networking• Telecommunications

Molex offers jacks in a variety of styles and configurations, including right-angle, top- and bottom-entry, through-hole and SMT, shielded and un-shielded using gold or high durability palladium-nickel plating. Modular jacks with integrated magnetics with or without LED’s that support Power-over-Ethernet (PoE) are also available.

Various Various Various

• Consumer• Data/Communications• Industrial Automation• Medical• Networking

iPass™

LFH

IPass+™ HD

TDP® (Triad™ Differential Pair)

IPass+™ High Speed Channel (HSC)

Ultra+™ VHDCI

QSFP+

Modular Plugs - Jacks

I/O ConnectorsNetworking / Telecomm


ttieurope.com



Molex has developed seven series of Micro-USB Type ‘B’ and Type ‘AB’ receptacles in a selection of top-, bottom- and mid-mount versions, and a new series of USB ‘A’ to Micro-USB ‘B’ cable assemblies. These connectors include a lead-in feature in the connector housing for blind-mating of the receptacle to the plug.

0.65mm1.0 (Signal), 1.8 (Power)

5• Consumer• Smart Phones and

Mobile Devices

Key features of the USB OTG are compact and light-weight design (about 1/8th the size of standard USB-B connectors), fully shielded, fully compliant with USB 2.0 specifications, detent lock and keying feature, 5-pin design and high durability of 5,000 mating cycles, UL certified. Cable assemblies available.

0.80mm 1.0A 5• Consumer• Smart Phones and

Mobile Devices

Mini DisplayPort* is 50% of the size of standard DisplayPort connectors, delivering pure digital connections quickly and seamlessly to external displays and offering plug-and-play performance while supporting VGA, DVI and dual-link DVI connections.

*DisplayPort is a trademark of Video Electronics Standards Association (VESA)

0.60mm 0.5A 20 • Consumer• Data/Communications

A 19-pin interconnect in a stainless steel shell, half the size of the current Mini connector, offering all the advan- tages of the HDMI 1.4 specification. Available in full SMT, through-hole shell tabs and hybrid SMT and through-hole shell tab versions; receptacles offer friction lock and terminal hold-down features. Cable assemblies available.

*HDMI, the HDMI Logo, and High Definition Multimedia Interface are trademarks or registered trademarks of HDMI Licensing LLC in the US and other countries

0.40mm 0.8A 19

• Automotive • Consumer• Smart phones and

Mobile Devices

The HandyLink™ USB 2.0 compatible family includes a right-angle SMT receptacle, a wire and PCB version of the plug, perpendicular and parallel mounted cradle connectors for docking applications and a wide array of cable assemblies. HandyLink wire-to-board solutions and board-to-board docking solutions are RoHS compliant.

0.80mm 1.5 – 3.0A 16


• Automotive• Consumer• Data/

Communications• Medical• Smart Phones and

Mobile Devices

Micro USB

HandyLink™

USB OTG (On-The-Go)

Mini DisplayPort*

Micro HDMI*

I/O ConnectorsMobile Products


ttieurope.com



Molex’s CRC™ rectangular I/O connector system provides a compact solution for small industrial robots and factory automation equipment. The system includes panel-mount and wire-to-wire versions, and takes up only about 1/15th the space of industry-standard heavy-duty connectors.

Various 7.0, 15.0A

12, 20, 30, 50

(signal); 4, 15

(power)


• Automotive• Data/Communications• Industrial Automation• Medical• Telecommunications

Molex’s line of HMC™ Heavy Duty Rectangular Connectors offer a unique new design and user-friendly features compared to traditional-style heavy duty connectors for robotic and other industrial applications. Multi-module types allow gender interchanging of housings, as well as hybrid configurations using different terminal inserts.

N/A6.0, 10.0,

12.0A12, 36, 40, 48, 52, 72

• Industrial Automation

The compact sized Mini-HMC™ family incorporates the same unique features of Molex’s standard HMC™ connectors such as a one-touch lock and interchangeable housings with the same solderless crimp terminals as Molex’s CRC™ connectors. Other features include a braided wire clamp for additional ESD shielding and a hard-shell hood.

3.00mm 7.0A 10, 40• Data/Communications• Industrial Automation• Medical

High-density Commercial Micro-D shielded microminiature connectors provide 4 times the density of standard D-sub connectors. Commercial versions available in right-angle (single row and stacked) and vertical configurations, cable assemblies in single- and double-ended Commercial Micro-D to standard D-Sub connectors.

1.27mm 1.0A Various


• Commercial Vehicle• Data/Communications• Industrial General• Medical

Compact Robotic Connector - CRC™

Heavy Duty Rectangular Connector - HMC™ Connectors

Mini-HMC™

Commercial Micro-D

I/O ConnectorsIndustrial Products


ttieurope.com

Product Name Description Speed Density Orientation Applications

The Impact™ backplane connector system for con-ventional, coplanar and mezzanine configurations provides data rates up to 25 Gbps and superior signal density up to 80 differential pairs per inch. Achieve low cross-talk and high signal bandwidth while minimising channel-performance variation across every differential pair within the system.

25 Gbps80 diff

pair / sq inch

ConvenCoplanar

Mezz

• Data Communications• Telecommunications• Military/Aerospace

GBX I-Trac™ system, available in standard backplane, Orthogonal midplane, high-current power modules, Inverted and Coplanar configurations provides design flexibility and enables future system performance upgrades without requiring platform re-design. Capable of supporting next-generation applications with data rates of 12.5 Gbps or higher.

12.5 Gpbs69 diff

pair / sq inch

ConvenCoplanarInvertedOrthog


The Z-PACK TinMan’s press-fit, flexible, mono-block based system can be stacked end-to-end to meet customer pin-count requirements. The system delivers integrated shielding, differential-pair density, 85 Ohm impedance and lower crosstalk and insertion loss versus 100 Ohm backplane systems.

*Z-PACK and Z-PACK TinMan are trademarks of Tyco Electronics

12.5 Gbps66 diff

pair / sq inchConvenMezz


GbX® backplane connectors deliver high-density and high-speeds up to 10 Gbps and are custom-configurable. Bifurcated contact beams in daughtercard receptacles ensure greater reliability with 2 points of contact to each header pin. †GbX® is a registered trademark of Amphenol Corporation

10 Gbps69 diff

pair / sq inch

ConvenCoplanarOrthog


Very High Density Metric connectors achieve high- speed signal integrity via interstitial signal and ground shields between columns. Standard VHDM®* connectors support data rates of 3.125 Gbps with less than 5% crosstalk; H-series supports up to 6.25 Gbps.

*VHDM is a registered trademark of Amphenol Corporation

Up to 6.25 Gbps

100 diff pair / sq inch

ConvenCoplanar

• Data Communications• Industrial Automation• Medical• Military/Aerospace• Networking• Telecommunications

The High Density Metric (HDM®*) connector system suits applications that require high interconnect density and high-speed signal integrity. Daughter card modules are combined on a metal stiffner enabling very high circuit count assemblies to be handled as one connector. Power, guidance and coding function modules are also available.

*HDM is a registered trademark of Amphenol Corporation

N/A 30 Contacts/CM

Right AngleVertical • Networking

MicroTCA™ delivers a low-cost, flexible and scaleable solution with 10.0 Gbps data rate for a wide variety of low to mid-range telecom applications. This press-fit, vertical, edge-card connector provides 170 contacts on 0.75mm pitch and enables AdvancedMC (AMC) cards to be plugged directly to a backplane.

10Gbps N/A Card Edge• Medical• Instrumentation• Telecommunications

Impact™

VHDM®*

GBX I-Trac™

HDM®*

Z-PACK TinMan*

GbX®†

Backplane ConnectorsHigh Speed

MicroTCA™


ttieurope.com

Product Name Description Speed Density Circuits Size Applications

The Very High Density Metric (VHDM*) system comprises arrays of individual wafers that incorporate the signal pins as well as strip-line shielding. The shielding allows 100% of the signal pins to be used for signal transmission. Accommodates micro coaxial, micro twisted pair and micro twin axial cable constructions.

*VHDM is a trademark of Amphenol Corporation

2.5 Gbps 100 real signals/inch

Contact Molex

• Data/Communications• Networking• Telecommunications

Impact™ cable assemblies use a low-impedance, localised ground-return path in an optimised differential-pair array. Shielded and isolated, the pairs are tightly coupled to, and surrounded by, ground structures, leading to reduced cross-talk and increased overall bandwidth performance, with minimal performance variance across the system.

25 Gbps 80 diff pair/inch

Contact Molex

• Data/Communications• Telecommunications

Impact™ Cable Assemblies

VHDM* Cable Assemblies

Backplane ConnectorsCable Assemblies


ttieurope.com

Product Name Description Pitch (mm) Series Conn T&R

(Tray)ContactPlating

TailPlating

H(mm)

Depth(mm)

FPC T(mm)

Cable Type

Contact Pos.

Actuatortype

Voltage(V)

Current(A)

Temp.(min.)

Temp.(max.) Note

Ideal for tight-packaging applications, Molex’s line of FFC/FPC connectors come in various pitch options ranging from 0.20mm pitch up to 1.00mm and include features to meet a wide variety of space and usage needs for applications in all markets.

Molex’s FFC/FPC connectors are available with push and flip-style actuators, which are pre-assembled covers that secure the connection between the FFC/FPC and the connector terminals. Molex is continually developing lower-profile and higher-density versions to meet the downsizing needs of electronic equipment makers.

Other features include Molex’s unique BackFlip™ actuator design, which provides easy cable insertion and extraction even in tight packaging applications, top, bottom and dual contact versions are available.

Through-hole versions are avai-lable in vertical and right-angle configurations, ZIF and non ZIF versions and various pitch options ranging from 1.00mm to 2.54mm. Circuit sizes range from 1 to 50.

0.20 503419 -0xx8 -0xx0 Au Au 0.9 2.85 0.2 FPC Bottom Front flip 50 0.2 -40°C +85°C FPC with tabs

0.25502078

-xx18 -xx10Au Au 1.0 2.75 0.2 FPC Bottom Front flip 50 0.2 -20°C +85°C

Low-Halogen

-xx68 -xx60 Longer actuator

503320 -xx68 -xx60 Au Au 1.65 2.98 0.2 FPC Bottom Front flip 50 0.3 -40°C +85°C

0.30

502250 -xx20 -xx91

Au Au

0.9 4.19 0.2 FPC Dual Back flip 50 0.2 -25°C +85°CFPC with notches

-xx21 -xx92 Low-Halogen

503566 -xx08 -xx00 0.95 2.85 0,2 FPC Bottom Front flip 50 0.2 -40°C +85°C FPC with tabs

502598 -xx11 -xx91 1.15 3.8 0.2 FPC Dual Back flip 50 0.2 -40°C +85°C

503425 -xx11 -xx91 1.2 4.6 0.2 FPC Dual Back flip 50 0.2 -40°C +85°C FPC with notches

501912 -xx10 -xx90 1.8 3.85 0.2 FPC Bottom Front flip 50 0.2 -20°C +85°C

0.50RA0.50RA0.50

RA

501461 -xx09 -xx01 Au Au

0.8 3.2 0.12 FPC Bottom Back flip 50 0.3 -40°C +85°CFPC with notches

-xx08 -xx02 Au Au increased act lock F, 8ckt only

503480 -xx09 -xx00 Au Au 1.0 4.0 0.3 FFC/FPC Dual Back Flip 50 0.5 -40°C +85°C

51281 -xx30 -xx92 SnBi SnBi

1.2 4.05 0.3 FFC/FPC Dual Non ZIF 50 0.5 -20°C +85°C -xx40 -xx94 Au Au


1.2 3.85 0.3 FFC/FPC Bottom Pull up 50 0.5 -20°C +85°C -xx29 -xx71 Au Au

54550 -xx22 -xx33 SnAgBi SnAgBi

1.2 3.85 0.3 FFC/FPC Top Push pull 50 0.5 -20°C +85°C -xx29 -xx71 Au Au

503366 -xx19 -xx11 Au Au 2.0 5.6 0.3 FFC/FPC Bottom Front flip 50 0.5 -20°C +85°C FPC with tabs












2.0 5.6 0.3 FFC/FPC Bottom Push pull 50 0.5 -20°C +85°C -xx68 -xx62 Au Au

502790 -xx11 -xx91 Au Au 2.5 5.3 0.3 FPC Bottom Front flip 50 0.5 -20°C +85°C FPC with tabs, 2 contacts

502611 -xx29 -xx21 Au Au 3.9 7.9 0.3 FPC Bottom Front Flip 100 0.3 -10°C +100°C FPC with tabs

501864

-xx21 -xx80SnBi SnBi

4.85 8.0 0.3 FFC/FPC Bottom Jacket 50 0.3 -40°C +85°C

Jacket:501783, Cover:501784

-xx51 -xx81

-xx11 -xx90

Au Au-xx31 -xx91 Shield FFC

-xx41 -xx92 Sealing treat

FFC/FPC Connectors

FFC/FPC Connectors Core Micro Products


ttieurope.com

Product Name Description Pitch (mm) Series Conn T&R


TailPlating

H(mm)

Depth(mm)

FPC T(mm)

Cable Type

Contact Pos.

Actuatortype

Voltage(V)

Current(A)

Temp.(min.)

Temp.(max.) Note

Ideal for tight-packaging applications, Molex’s line of FFC/FPC connectors come in various pitch options ranging from 0.20mm pitch up to 1.00mm and include features to meet a wide variety of space and usage needs for applications in all markets.

Molex’s FFC/FPC connectors are available with push and flip-style actuators, which are pre-assembled covers that secure the connection between the FFC/FPC and the connector terminals. Molex is continually developing lower-profile and higher-density versions to meet the downsizing needs of electronic equipment makers.

Other features include Molex’s unique BackFlip™ actuator design, which provides easy cable insertion and extraction even in tight packaging applications, top, bottom and dual contact versions are available.

Through-hole versions are avai-lable in vertical and right-angle configurations, ZIF and non ZIF versions and various pitch options ranging from 1.00mm to 2.54mm. Circuit sizes range from 1 to 50.


0.25502078


Low-Halogen



0.30

502250 -xx20 -xx91

Au Au



503566 -xx08 -xx00 0.95 2.85 0,2 FPC Bottom Front flip 50 0.2 -40°C +85°C FPC with tabs




0.50RA0.50RA0.50

RA

501461 -xx09 -xx01 Au Au

























501864




-xx51 -xx81

-xx11 -xx90





ttieurope.com

Pitch (mm) Series Conn T&R


TailPlating

H(mm)

Depth(mm)

FPC T(mm)

Cable Type Contact Pos. Actuator

typeVoltage

(V)Current

(A)Temp.(min.)

Temp.(max.) Note


0.25502078


Low-Halogen



0.30

502250 -xx20 -xx91

Au Au



503566 -xx08 -xx00 0.95 2.85 0.2 FPC Bottom Front flip 50 0.2 -40°C +85°C FPC with tabs




0.50RA0.50RA0.50

RA

501461 -xx09 -xx01 Au Au

























501864




-xx51 -xx81

-xx11 -xx90





ttieurope.com

Pitch (mm) Series Conn T&R


TailPlating

H(mm)

Depth(mm)

FPC T(mm)

Cable Type Contact Pos. Actuator

typeVoltage

(V)Current

(A)Temp.(min.)

Temp.(max.) Note


0.25502078


Low-Halogen



0.30

502250 -xx20 -xx91

Au Au



503566 -xx08 -xx00 0.95 2.85 0.2 FPC Bottom Front flip 50 0.2 -40°C +85°C FPC with tabs




0.50RA0.50RA0.50

RA

501461 -xx09 -xx01 Au Au

























501864




-xx51 -xx81

-xx11 -xx90





ttieurope.com

Style Description Number of Ports Catagory Circuits /

Contacts Applications

Available with and without shielding in through-hole or SMT mounting. Optional integrated LED‘s or light pipes also available. Mounting options include inboard or outboard fitting nails. Inverted types and types with RJ11 keep out features also available. Standard and low profile versions and gold and palladium nickel / gold flash plating is offered.

1, 2, 3, 4, 5, 6, 8, 12, 16

3, 5, 5e, 6

4/2, 4/4, 6/2, 6/4, 6/6, 8/2, 8/4, 8/6, 8/8, 8/10

• Telecom• Networking• Medical• Consumer• Data/Computing

Available with and without shielding in through-hole or SMT mounting with flush or flanged panel options. Low profile (12.70mm height) versions and types with SMT solder tabs for increased board retention.A single port bottom entry type is also availabe for space constrained applications. Gold or palladium nickel / gold flash plating is offered.

1 3, 5

4/2, 4/4, 6/2, 6/4, 6/6, 8/2, 8/4, 8/6, 8/8, 8/10


Magnetic modular jacks, available in single- and multi-port versions, simplify customer board layouts by reducing the number of components required. All parts are IEEE 802.3 compilant and hence Ethernet 10/100/1000 compatible. Available with or without integrated LED’s and also availabe in low-profile 13.45mm heights.

1, 8, 12Gigabit

Magnetics8/8


Molex offers a range of Integrated Jacks or ICMs that provide a cost-effective, plug-and-play solution for customers implementing PoE and PoE Plus (PoE+). Available in single port (1-by-1), 8-port (2-by-4), and 12-port (2-by-6) configurations and with LED options, the ICMs provide PoE+ Power Source Equipment (PSE) capability.

1, 8, 12PSE - PoE+

8/8


PDJack™ with integrated ‘Power Device’ controllercircuitry plus Ethernet connectivity simplifies PoE Plus implementation for any network device. The PDJack supplies 54 V of power up to 25.5 watts. Two pins output power and standard signal pins provide Ethernet connectivity. Additional pins allow power-up of external DC to DC converter.

1PD – PoE+

8/8


Right Angle

PoE PD Magnetic Jacks

Vertical

Right Angle with Magnetics

PoE / PoE+ Magnetic Jacks

Modular Jacks


ttieurope.com

Product Name Description

• An all-weather solderless terminal• Provides waterproof crimp connections• NiAc™ heat-shrinkable insulation

• Solutions for splicing and tapping of magnet and aluminum wire• Terminates magnet wire without removing insulation• Open barrel permits easy access

• Wire AWG: 10 - 22• Available in non-insulated, PVC insulated and nylon insulated wires• Provides a reliable, vibration-proof connection

• Wire AWG: 8 AWG - 250 MCM• Available with or without tin plating• For heavy-duty 600V applications

• Wire AWG: 22 AWG - 600 MCM• Seamless crimp barrel• Heavy-duty terminals with tin plating

• High-quality, seamless-barrel metric ring terminals• Insulated Avikrimp™ and un-insulated VersaKrimp™ seamless barrel types• Suitable for terminations using metric studs up to 10mm in diameter and wire size up to 6mm²

• Designed for high-temperature applications from +343 to +649°C• Nickle-plated copper• Butt seamed and barrel styles

Perma-Seal™

VersaKrimp™

MagKrimp™

Metric Ring Terminals

Wire Pins

High Temperature Terminals and Splices

Battery Cable Lugs

Solderless Terminals


ttieurope.com


• Current rating: 10.0A• Wire Gauge: 12 to 30 AWG• Voltage rating: 300V• Circuits: 2 to 24• Pitch: 4.00 to 5.00mm• Operating temperature: -40 to +115°C• UL File No.: E48521

• Current rating: 12.0 to 15.0A• Wire Gauge: 12 to 22 AWG• Voltage rating: 300V• Circuits: 3 to 24• Pitch: 3.81 to 5.08mm• Operating temperature: -40 to +120°C• UL File No.: E48521

• Current rating: 20.0 to 115.0A• Wire Gauge: 11 to 30 AWG• Voltage rating: 300V or 600V• Circuits: 2 to 16• Pitch: 5.08 to 15.00mm• Operating temperature: -40 to +130°C• UL File No.: E48521

• Current rating: 85.0A• Wire Gauge: 3 to 14 AWG• Voltage rating: 600V• Circuits: 2 to 12• Pitch: 12.00mm• Operating temperature: -40 to +130°C• UL File No.: E48521

• Current rating: 20.0 to 63.0A• Wire Gauge: 6 to 22 AWG• Voltage rating: 300V or 600V• Circuits: 2 to 12• Pitch: 8.00 to 15.00mm• Operating temperature: -40 to +105°C• UL File No.: E48521

• Current rating: 8.0 to 30.0A• Wire Gauge: 12 to 30 AWG• Voltage rating: 300V• Circuits: 2 to 48• Pitch: 3.50 to 9.53mm• Operating temperature: -40 to +115°C• UL File No.: E48521

• Current rating: 10.0 to 65.0A• Wire Gauge: 8 to 30 AWG• Voltage rating: 300V or 600V• Circuits: 2 to 32• Pitch: 6.37 to 17.48mm• UL File No.: E48521

Positive Locking System

Eurostyle™ Two-Screw Terminal Strips

Beau™ EuroMate™ Pluggable

Eurostyle™ PCB Pluggable

Beau™ Eurostyle™ High-Power Fixed Mount

Beau™ Barrier Strips

EuroMax™ Pluggable High-Power

Terminal Blocks


ttieurope.com

RF Microminiature & Subminiature Products

RF Miniature, Medium and Large Products


ttieurope.com

SealedConnectors



The pre-assembled, fully-submersible MX150™ family is available with housing matte seals or cable seals. It offers a reduced package size and is ideal for SAE- and ISO-style wire in single- and dual-row configurations supporting both signal and power applications up to 22.0A. Features include integral TPA and optional CPA.

3.50mm 22.0A 2- 20• Automotive• Commercial Vehicle

Offered in wire-to-wire, wire-to-panel and wire-to-board configurations, the IP67-rated MX150L™ system provides design flexibility for low level signal to high power applications. Key features include pre-assembled connector housings, integral TPA and two-way mat seal on mating connector, sealed panel-mount plugs and proven blade-type terminals.

5.84mm, 7.62mm

Up to 18.0A and

40.0A

2-16• Commercial Vehicle• Consumer• Industrial Automation

The MX123™ is a fully sealed, high-performance connection system designed for transportation power-train applications in the most challenging under-hood environments. Features include integral TPA and CPA, lever ‘mate assist’ receptacles and ‘anti-scoop’ housings to prevent terminal damage. Headers and dress covers complete the range.

2.54mm 25.0A Max

56, 66, 73, 80,

• Automotive• Commercial Vehicle

High-density all optical MXL38999™ provides MIL-DTL-38999 solutions for APC, UPC single mode and PC multi-mode applications. The connectors include precision-machined and plated all-metallic inserts with zero plastic distortion. Available in all standard shell materials and plating options. Designed with Molex’s LumaCore™ optical terminus technology.

N/A N/A 4 - 64

• Industrial Automation• Military/Aerospace• Networking• Telecommunications

The Sealed SFP (Small Form-factor Pluggable) assembly is an optical and electrical-integrated connection system, designed to maximize valuable real estate on the PCB while providing an environmentally rugged interface rated to IP67. Compatible with ODVA optical and copper assemblies.

N/A N/A N/A

• Data/Communications• Industrial Automation• Networking• Telecommunications

Molex’s IP67 and NEMA 6P rated Industrial type A and type B Universal Serial Bus (USB) connectors are ideal for industrial and harsh commercial applications. The rugged plug and receptacle designs feature bayonet-style latches, encapsulated PCB receptacles and fully shielded cable assemblies to help keep out dust, debris and water.

N/A N/A N/A• Industrial Automation• Medical

The IP67 rated Extra Rugged Circular (XRC™) system includes plastic plugs and receptacles and new low-insertion-force stamped terminals. Features include tactile and audible mating feedback, visual markings on outer shell, seal retainer collar, imprinted wire seals and bayonet-latch design in shell sizes 18 (14 contact) and 24 (31 contact) types.

N/A13.0A Max

14, 31• Automotive• Commercial Vehicle

Molex’s SRC (Sealed Rectangular Connectors), with single-handed blind-mate functionality offer a hybrid, high power-and-signal, high circuit-count interface for harsh applications in commercial vehicles. The SRC system uses proven MX150™ terminals with current ratings up to 18.0A and MX150L™ terminals with current ratings up to 40.0A.

4.20mm 40.0A max 38, 66, 84• Commercial Vehicle• Industrial

SRC

MXL38999™

MX150™

Sealed SFP

MX150L™

Industrial USB

MX123™

XRC™


ttieurope.com

SealedConnectors



Mizu-P25™ wire-to-wire connector system is IP67 certified. The family includes systems rated up to 125 V and 250 V. Due to their small dimensions both systems are ideal for wire-to-wire applications in confined spaces. Other features include positive locking, polarisation and special terminal designs for high vibration applications.

2.50mm 3.0/4.0A 2-4

• Automotive• Commercial Vehicle• Consumer• Industrial

The Molex family of CMC Hybrid Connectors provides a sealed, high-density, modular and cost-effective connection system for heavy-duty, powertrain and body-electronics applications in the transportation industry. Traditionally a wire-to-board system, Molex has recently introduced a 32-circuit wire-to-wire version and new 28-circuit R/A headers.

Various2.5 - 26.0A

(PowerBlade)

22 - 154• Automotive• Commercial Vehicle• Industrial

Robust, high-density CMX connectors provide IP6K9K interfacial-seal protection in a compact, cost-effective lean design for electronic control units and other wire-to-board transportation applications. Features include a robust TPA™ design, different color codings and polarisation, lever-actuated movable seal protector and sealing dummy cavity plugs.

2.50mm 3.70mm 7.50A max 55, 65 • Automotive

• Commercial Vehicle

MIL-T-7928 approved Perma-Seal™ terminals and splices give long-lasting, moisture-proof connections that withstand corrosive compounds and heat. The NiAc™ insulation material (shrinks up to 40% faster than comparable nylon/ polyolefin products) and special hot-melt adhesive used in the inner wall of the sleeve provide a tough and durable seal.

N/A N/A N/A

• Industrial Automation• Military/Aerospace• Networking• Telecommunications

The MXP120™ Sealed Connector System is a high-performance 1.20mm terminal in-line connection system for automotive and commercial vehicles. Female receptacles feature an integral locking-latch with bridge protection and independent secondary locking while the male connectors feature primary lock reinforcement.

4.00mm 13.0A 2, 6• Automotive• Commercial Vehicle• Consumer

Perma-Seal™

MXP120™

Mizu-P25™

CMC

CMX


ttieurope.com

Product Name Description Angle CurrentRating


Molex offers DDR3 DIMM sockets in low-profile and very-low-profile SMT and press-fit aerodynamic versions with 2.40mm seating plane, that maximise air flow around memory modules during operation, and ultra-low-profile DDR3 DIMM sockets with 1.10mm seating plane for optimum design flexibility. Accepts JEDEC specifications, ATCA recognised.

Vertical 25°

1.0A 240

• Data/Communications• Industrial• Medical• Networking• Telecommunications

DDR2 increases the data bandwidth over DDR by doubling the data fetch rate at the same bus frequency. It is able to deliver data throughput beyond 3.2 Gbps. Features include high-temperature thermoplastic housing, dual ejector latches, added contact wipe and beveled metal pins.

Vertical 25°

22.5°1.0A 200, 244

• Consumer• Data/Communications• Networking• Telecommunications

The MiniDIMM saves PCB real estate over full size DIMMs whilst ensuring the same reliable features. Features include card guide style latch, direct module insertion into connector, integral vibration damping, SMT fitting nails at both ends, and standard and reverse configurations in vertical, angled and right-angled versions.

Vertical Right Angle

22.5°1.0A 200, 244

• Consumer• Networking• Telecommunications

FB DIMM combines the high-speed internal architecture of DDR2 with a bi-directional point-to-point serial memory interface which links each FB DIMM module together in a chain. The system is available in various color options and accepts JEDEC defined modules to ensure 100% industry compatibility.

Vertical 28.5°

0.5A 240• Data/Communications• Networking

Molex’s DIMM modules feature high-temperature thermoplastic housing to withstand lead-free solder processing, dual ejector latches to ensure easy module insertion/removal with minimal micro-motion, added contact wipe for oxidation wipe-off and forklocks for secure PCB retention.

Vertical Right Angle

25°1.0A 168

• Consumer• Data/Communications• Networking• Telecommunications

Meeting JEDEC specifications, Molex’s DDR4 high-speed sockets offer greater PCB real-estate and cost savings with excellent assembly-processing compatibility. The sockets feature high dimensional stability and excellent compatibility in lead-free and halogen-free technologies. Vertical

0.75A(Per pin)

288• Telecom• Datacom

DDR3 DIMM

DIMM

DDR4

DDR2 DIMM

MiniDIMM

Fully Buffered DIMM

Memory ModuleSockets


ttieurope.com



Available in various profiles, Molex’s push-push, hinged and push-pull microSD* connectors reduce card sticking and memory card fly-out. Features include ultra small size, detect terminal with wiping function, metal shielding, gold-plated beveled contacts, solder nails and detect switch.

*microSD is a trademark of the SD Card Association

1.09mm 1.10mm 1.27mm

0.5A 8 / 9

• Automotive • Consumer• Data/Communications• Industrial• Medical

Molex‘s compact size, user-friendly SD memory card connectors provide space savings and features like push-push eject for smooth card extraction and with the newest design allowing the card to extend to 6.00mm outside the shell in the locked position. The family includes card polarisation features and gold-plated beveled contacts.

2.50mm 0.5A 9


This combo connector enables the user to combine two connector form factors into one, thus saving space. Push-push reverse-mount microSD* with detect switch combined with push-pull normal-mount SIM provide design flexibility with left-entry and right-entry versions. Reliable coplanarity of 0.1mm max after reflow ensures assembly process efficiency.

*microSD is a trademark of the SD Card Association

1.09mm 1.27mm

0.5A 16 / 18


Molex’s low-profile micro-SIM card sockets come in hinged, push-pull and push-push styles offering optimum space and cost-savings. Features include small footprint and low-profile height, terminal-beam design with gradual lead-in, anti-shorting feature, card polarisation and multiple soldering hold-down points.

1.35mm 1.40mm 2.54mm

0.5A 6 / 8


Molex‘s SIM card connectors are made of high-temperature thermoplastic material and feature a range of standard options plus the ability to custom design parts in specific applications. The new block-type design integrates the SIM card into the mobile application via the connector.

1.09mm 1.27mm 2.54mm

0.5A 6, 8


Molex offers ChipSIM connectors in standard and custom designs for both the connector and cardholder. Optionally, the connector comes with an active- or passive-latch mechanism, location tabs and various button designs and colors; the cardholder fascia is modifiable for shorter customer assembly process.

2.54mm 0.5A 6


microSD*

SIM

SD

ChipSIM

microSD*/ SIM Combo

micro-SIM

Memory CardSockets


ttieurope.com


• Ground-plane independent design• Poly-fl exible, double-sided adhesive tape on antenna• Robust coaxial cable to fl exi-antenna with Pull Force of over 18.0N• Choice of several miniature coaxial cable length options

• Smallest on-ground plastic antenna in the market measuring only 3.00 by 3.00 by 4.00mm • No removal of ground layers from beneath the antenna needed• Fully SMD-compatible• Application of Laser Direct Structuring (LDS) chip antenna technology in manufacturing

• Built on proprietary MobliquA™ technology enable signifi cant antenna volume reduction• Balanced design minimises ground-plane effects• Minimum total radiation effi ciency of 50% and 67% (respectively) for the 868 and 915 MHz bands• Poly-fl exible, double-sided adhesive tape for easy peel-and-stick mounting

• Total average effi ciency of 80% at the low band (GSM850, GSM900) and 70% at the high band (GSM1800, GSM1900 and LTE band-7)

• Balanced design minimises ground-plane effects• Poly-fl exible double-sided adhesive tape for easy peel-and-stick mounting• Robust coaxial cable to fl exi-antenna with a pull-force of over 18N

• Simple 50 Ohm passive antenna interface provides complete CMMB band coverage• Internal antenna design enhances mobile device appearance• Product is RoHS compliant and halogen-free for environmental sustainability• Specially-designed housing slots reduce antenna radiation loss

2.4/5 GHz Wifi Standalone Antenna

Mobile TV Standard Antenna

2.4GHz Surface Mount Device (SMD) On Ground Antenna

868/915MHz ISM Standalone Antenna

Cellular 6 Band Standalone Antenna

Standard Antennas


ttieurope.com


• Molex LED Array Holders available for Bridgelux*, Citizen†, Cree‡, Nichia and Sharp** • Certified and tested to UL 496 OLFB2 lampholder specification• Simplifies the COB (chip on board) LED installation process, reducing quality concerns associated with other

installation methods such as hand solder• Compression contacts to power array provide a reliable electrical connection• Double-ended wire-trap terminal to attach power source, allows for wiring single or serial LED sequences to ensure

ease of assembly and design flexibility• New elegant design features provide a clean and finished look to COB LED array installation• Molex LED holder designs address every aspect of COB LED installation: thermal management, reliable electrical

connection and optical requirement

• New designs available for Cree XLamp‡ series CXA1507, CXA1512, CXA2520, CXA2530• Mechanical attachment for directional optics (Optional CXA25)• Pre-load feature allows for attachment of COB LED to holder prior to attaching to heat sink, simplifying installation• Elegant design with flat landing surface for secondary optics and beveled area to allow for an uninterrupted beam

pattern from lightsource • High temperature thermal plastic housing to resist high heat environments

• Designed to accommodate Nichia L series COB LED arrays• Clearance provided around LED to easily incorporate secondary optics • Concealed wire trap cap protects electrical contacts and provides additional voltage isolation when incorporating metal

reflectors• High temperature thermal plastic housing to resist high heat environments

• Solderless connection design minimises handling of arrays during installation, greatly reducing the possibility of damage

• Eliminates specialised operator training and solder-joint inspection• Vertical snap-to-mate connection enables a fast, easy and reliable connection to the LED array holder• Low-profile 1.40mm connector height provides a slim design for space-limited applications and minimises risk of

affecting light output• Positive-lock latching feature provides an audible click to confirm connection• Available in 3 wire gauges and several length options for design flexibility (Bridgelux Vero* example shown in photo)

LED ArrayHolders

Cree ‡ LED ArrayHolders

Nichia LED ArrayHolders

Pico-EZmate™Harness

Solid StateLighting

* Bridgelux and Vero are trademarks or registered trademarks of Bridgelux, Inc.† Citizen is a registered trademark of Citizen Electronics Co., Ltd.‡ Cree and XLamp are registered trademarks of Cree, Inc. ** Sharp is a registered trademark of Sharp Electronics Corporation.


ttieurope.com

Switch Technology Description

• Elegant design - Unique backlighting solution with seamless overlays allow for easy cleaning - Unlimited cosmetic options including colors, textures and backlighting

• Robust and durable - No moving parts to wear out; can sense through the protection of glass or thick plastic overlays - Resistant to harsh chemical exposure, the effects of EMI and contaminants on overlays - Can be sealed and protected from environmental effects

• Design flexibility - Circuit can be constructed using polyester, polyimide or PCB and can be mounted to curved surfaces - Shape and size of buttons can be tailored to customer specifications

• Extremely reliable contact system withstands even the most rugged commercial environment• Dome designs are produced with auto-placement in mind to ensure product reliability• Lightweight and low profile; easy to integrate into smaller and thinner packages

• Extremely resistant to shock and vibration; excellent for commercial applications• Durable to meet the needs of rugged and high-usage applications• Can be shielded to offer protection against static discharge and EMI/RFI

• Extremely reliable contact system that withstands even the most rugged commercial environment• Dome designs are produced with auto-placement in mind to ensure product reliability• Can be shielded to offer protection against static discharge and EMI/RFI

• Allows addition of simple electronic components onto the flexible switch substrate, which often eliminates the need for an additional LED or display board mounted below the switch substrate

• Washable and well-suited for medical, industrial and commercial applications• Can be shielded to offer protection against static discharge and EMI/RFI

• Combines both the switch contact system and custom electronics into one complete package, eliminating the need for an additional LED indicator board

• Keypad can be designed using various interface systems, such as 3-dimensional (rubber keypad) buttons or flat panels• PCB substrate offers additional rigidity in front panel applications, which may eliminate the need for a metal backer

• Combines both the switch contact system and custom electronics into once complete package, eliminating the need for an additional motherboard or display board

• Keypad can be designed using various interface systems, such as 3-dimensional (rubber keypad) buttons or flat panels• Can be shielded to offer protection against static discharge and EMI/RFI

• Insert molded contact system can be combined with molded assembly packages, which is well-suited for end products such as cellular telephone volume controls and special, sealed product applications

• Front panel may be backlit by electroluminescent panels• Washable and well-suited for medical, industrial and commercial applications

Capacitive Sensing

Bonded Membrane Switch Assemblies

Metal Dome Arrays

Hybrid Switch Assemblies

Membrane Switches Non-Tactile

Control Panel Assemblies

Membrane Switches Tactile

Insert Molded Switch Assemblies

SwitchProducts


ttieurope.com

Switch Technology Description

• Alternative to PCBs or polyimide, which reduces the cost and allows printed flexible tail integration as part of the switch substrate

• Eliminates the need for an additional interconnect method• Easy to integrate into low-profile applications so products can be designed into tightly controlled areas• Designers may add optional cosmetic enhancements such as rubber keypads or graphic overlays

SwitchProducts

Flexible Circuits

Application Tooling

CustomSolutions

Molex offers a wide variety of production equipment designed and tested to ensure a high quality electrical connection. From fully automatic equipment that provides production flexibility and works in most industry standard wire processors to semi-automatic equipment and hand tools for prototyping, Molex offers the solution for all your application needs.

When it comes to investing in research and development, Molex is an industry leader. We know that by leveraging our internal product technology, we can drive a continuous supply of innovation directly to you. If you are faced with a specific challenge that cannot be solved through our existing portfolio of connectors and integrated products, please contact Molex.

Get more insights at: www.ttieurope.com/molex

©2014 MolexOrder No. 987651-0991 Rev.1 EU/PDF/2015.08

ttieurope.com

Documents

Molex Connector Product Overview