Upload
others
View
6
Download
0
Embed Size (px)
Citation preview
MOSFETMetalOxideSemiconductorFieldEffectTransistor
CoolMOS™P6600VCoolMOS™P6PowerTransistorIPL60R650P6S
DataSheetRev.2.0Final
PowerManagement&Multimarket
2
600VCoolMOS™P6PowerTransistor
IPL60R650P6S
Rev.2.0,2014-07-08Final Data Sheet
ThinPAK5x61DescriptionCoolMOS™isarevolutionarytechnologyforhighvoltagepowerMOSFETs,designedaccordingtothesuperjunction(SJ)principleandpioneeredbyInfineonTechnologies.CoolMOS™P6seriescombinestheexperienceoftheleadingSJMOSFETsupplierwithhighclassinnovation.TheoffereddevicesprovideallbenefitsofafastswitchingSJMOSFETwhilenotsacrificingeaseofuse.Extremelylowswitchingandconductionlossesmakeswitchingapplicationsevenmoreefficient,morecompact,lighterandcooler.
Features•ExtremelylowlossesduetoverylowFOMRdson*QgandEoss•Veryhighcommutationruggedness•Easytouse/drive•Pb-freeplating,Halogenfreemoldcompound•QualifiedforindustrialgradeapplicationsaccordingtoJEDEC(J-STD20andJESD22)
ApplicationsPFCstages,hardswitchingPWMstagesandresonantswitchingPWMstagesfore.g.PCSilverbox,Adapter,LCD&PDPTV,Lighting,Server,TelecomandUPS.
Pleasenote:ForMOSFETparallelingtheuseofferritebeadsonthegateorseperatetotempolesisgenerallyrecommended.
Table1KeyPerformanceParametersParameter Value UnitVDS @ Tj,max 650 V
RDS(on),max 0.65 Ω
Qg,typ 12 nC
ID,pulse 16.5 A
Eoss@400V 1.8 µJ
Body diode di/dt 500 A/µs
Type/OrderingCode Package Marking RelatedLinksIPL60R650P6S ThinPAK 5x6 SMD 60P6650 see Appendix A
3
600VCoolMOS™P6PowerTransistor
IPL60R650P6S
Rev.2.0,2014-07-08Final Data Sheet
TableofContentsDescription . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Electrical characteristics diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Test Circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Appendix A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Disclaimer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
4
600VCoolMOS™P6PowerTransistor
IPL60R650P6S
Rev.2.0,2014-07-08Final Data Sheet
2MaximumratingsatTj=25°C,unlessotherwisespecified
Table2MaximumratingsValues
Min. Typ. Max.Parameter Symbol Unit Note/TestCondition
Continuous drain current1) ID --
--
6.74.2 A TC = 25°C
TC = 100°C
Pulsed drain current2) ID,pulse - - 16.5 A TC=25°C
Avalanche energy, single pulse EAS - - 133 mJ ID =1.3A; VDD = 50V
Avalanche energy, repetitive EAR - - 0.20 mJ ID =1.3A; VDD = 50V
Avalanche current, repetitive IAR - - 1.3 A -
MOSFET dv/dt ruggedness dv/dt - - 100 V/ns VDS=0...480V
Gate source voltage VGS-20-30
--
2030 V static;
AC (f>1 Hz)
Power dissipation (non FullPAK) Ptot - - 56.8 W TC=25°C
Operating and storage temperature Tj,Tstg -40 - 150 °C -
Continuous diode forward current IS - - 5.8 A TC=25°C
Diode pulse current2) IS,pulse - - 16.2 A TC = 25°C
Reverse diode dv/dt3) dv/dt - - 15 V/ns VDS=0...400V,ISD<=IS,Tj=25°C
Maximum diode commutation speed3) dif/dt - - 500 A/µs VDS=0...400V,ISD<=IS,Tj=25°C
3Thermalcharacteristics
Table3Thermalcharacteristics(nonFullPAK)Values
Min. Typ. Max.Parameter Symbol Unit Note/TestCondition
Thermal resistance, junction - case RthJC - - 2.2 °C/W -
Thermal resistance, junction - ambient RthJA - 35 62 °C/W
Device on 40mm*40mm*1.5 epoxyPCB FR4 with 6cm2 (one layer 70µmthick) copper area for drainconnection and cooling. PCB isvertical without blown air.
Soldering temperature, wavesolderingonly allowed at leads Tsold - - 260 °C reflow MSL1
1) Limited by Tj max. Maximum duty cycle D=0.752) Pulse width tp limited by Tj,max3)VDClink=400V;VDS,peak<V(BR)DSS;identicallowsideandhighsideswitchwithidenticalRG
5
600VCoolMOS™P6PowerTransistor
IPL60R650P6S
Rev.2.0,2014-07-08Final Data Sheet
4Electricalcharacteristics
Table4StaticcharacteristicsValues
Min. Typ. Max.Parameter Symbol Unit Note/TestCondition
Drain-source breakdown voltage V(BR)DSS 600 - - V VGS=0V,ID=1mA
Gate threshold voltage V(GS)th 3.50 4 4.50 V VDS=VGS,ID=0.2mA
Zero gate voltage drain current IDSS --
-10
1- µA VDS=600V,VGS=0V,Tj=25°C
VDS=600V,VGS=0V,Tj=150°C
Gate-source leakage curent IGSS - - 100 nA VGS=20V,VDS=0V
Drain-source on-state resistance RDS(on)--
0.591.52
0.65- Ω VGS=10V,ID=2.4A,Tj=25°C
VGS=10V,ID=2.4A,Tj=150°C
Gate resistance RG - 11 - Ω f=1MHz,opendrain
Table5DynamiccharacteristicsValues
Min. Typ. Max.Parameter Symbol Unit Note/TestCondition
Input capacitance Ciss - 557 - pF VGS=0V,VDS=100V,f=1MHz
Output capacitance Coss - 28 - pF VGS=0V,VDS=100V,f=1MHz
Effective output capacitance, energyrelated1) Co(er) - 23 - pF VGS=0V,VDS=0...480V
Effective output capacitance, timerelated2) Co(tr) - 88 - pF ID=constant,VGS=0V,VDS=0...480V
Turn-on delay time td(on) - 11 - ns VDD=400V,VGS=13V,ID=3A,RG=6.8Ω
Rise time tr - 7 - ns VDD=400V,VGS=13V,ID=3A,RG=6.8Ω
Turn-off delay time td(off) - 33 - ns VDD=400V,VGS=13V,ID=3A,RG=6.8Ω
Fall time tf - 14 - ns VDD=400V,VGS=13V,ID=3A,RG=6.8Ω
Table6GatechargecharacteristicsValues
Min. Typ. Max.Parameter Symbol Unit Note/TestCondition
Gate to source charge Qgs - 3 - nC VDD=480V,ID=3A,VGS=0to10V
Gate to drain charge Qgd - 5 - nC VDD=480V,ID=3A,VGS=0to10V
Gate charge total Qg - 12 - nC VDD=480V,ID=3A,VGS=0to10V
Gate plateau voltage Vplateau - 6.1 - V VDD=480V,ID=3A,VGS=0to10V
1)Co(er)isafixedcapacitancethatgivesthesamestoredenergyasCosswhileVDSisrisingfrom0to80%V(BR)DSS2)Co(tr)isafixedcapacitancethatgivesthesamechargingtimeasCosswhileVDSisrisingfrom0to80%V(BR)DSS
6
600VCoolMOS™P6PowerTransistor
IPL60R650P6S
Rev.2.0,2014-07-08Final Data Sheet
Table7ReversediodecharacteristicsValues
Min. Typ. Max.Parameter Symbol Unit Note/TestCondition
Diode forward voltage VSD - 0.9 - V VGS=0V,IF=3A,Tf=25°C
Reverse recovery time trr - 196 - ns VR=400V,IF=3A,diF/dt=100A/µs
Reverse recovery charge Qrr - 1.7 - µC VR=400V,IF=3A,diF/dt=100A/µs
Peak reverse recovery current Irrm - 17 - A VR=400V,IF=3A,diF/dt=100A/µs
7
600VCoolMOS™P6PowerTransistor
IPL60R650P6S
Rev.2.0,2014-07-08Final Data Sheet
5Electricalcharacteristicsdiagrams
Diagram1:Powerdissipation
TC[°C]
Ptot[W
]
0 25 50 75 100 125 1500
10
20
30
40
50
60
Ptot=f(TC)
Diagram2:Safeoperatingarea
VDS[V]
ID[A
]
100 101 102 10310-3
10-2
10-1
100
101
102
1 µs
10 µs
100 µs
1 ms
10 ms
DC
ID=f(VDS);TC=25°C;D=0;parameter:tp
Diagram3:Safeoperatingarea
VDS[V]
ID[A
]
100 101 102 10310-3
10-2
10-1
100
101
102
1 µs
10 µs
100 µs
1 ms
10 msDC
ID=f(VDS);TC=80°C;D=0;parameter:tp
Diagram4:Max.transientthermalimpedance
tp[s]
ZthJC[K
/W]
10-5 10-4 10-3 10-2 10-110-2
10-1
100
101
0.5
0.2
0.1
0.05
0.02
0.01
single pulse
ZthJC=f(tP);parameter:D=tp/T
8
600VCoolMOS™P6PowerTransistor
IPL60R650P6S
Rev.2.0,2014-07-08Final Data Sheet
Diagram5:Typ.outputcharacteristics
VDS[V]
ID[A
]
0 5 10 15 200
2
4
6
8
10
12
14
16
18
2020 V
10 V
8 V
7 V
6 V
5.5 V
5 V4.5 V
ID=f(VDS);Tj=25°C;parameter:VGS
Diagram6:Typ.outputcharacteristics
VDS[V]
ID[A
]
0 5 10 15 200
2
4
6
8
10
1220 V
10 V
8 V
7 V
6 V
5.5 V
5 V
4.5 V
ID=f(VDS);Tj=125°C;parameter:VGS
Diagram7:Typ.drain-sourceon-stateresistance
ID[A]
RDS(on
) [Ω]
0 5 10 151
2
3
4
5
20 V
5.5 V 6 V 6.5 V 7 V
10 V
RDS(on)=f(ID);Tj=125°C;parameter:VGS
Diagram8:Drain-sourceon-stateresistance
Tj[°C]
RDS(on
) [Ω]
-50 -25 0 25 50 75 100 125 1500.00
0.20
0.40
0.60
0.80
1.00
1.20
1.40
1.60
1.80
2.00
98% typ
RDS(on)=f(Tj);ID=3A;VGS=10V
9
600VCoolMOS™P6PowerTransistor
IPL60R650P6S
Rev.2.0,2014-07-08Final Data Sheet
Diagram9:Typ.transfercharacteristics
VGS[V]
ID[A
]
0 2 4 6 8 10 120
2
4
6
8
10
12
14
16
18
150 °C
25 °C
ID=f(VGS);VDS=20V;parameter:Tj
Diagram10:Typ.gatecharge
Qgate[nC]
VGS [V]
0 5 10 150
1
2
3
4
5
6
7
8
9
10
120 V
480 V
VGS=f(Qgate);ID=3Apulsed;parameter:VDD
Diagram11:Forwardcharacteristicsofreversediode
VSD[V]
IF [A]
0.0 0.5 1.0 1.5 2.010-1
100
101
102
125 °C 25 °C
IF=f(VSD);parameter:Tj
Diagram12:Avalancheenergy
Tj[°C]
EAS [mJ]
25 50 75 100 125 1500
20
40
60
80
100
120
140
EAS=f(Tj);ID=1.3A;VDD=50V
10
600VCoolMOS™P6PowerTransistor
IPL60R650P6S
Rev.2.0,2014-07-08Final Data Sheet
Diagram13:Drain-sourcebreakdownvoltage
Tj[°C]
VBR(DSS
) [V]
-75 -50 -25 0 25 50 75 100 125 150 175520
540
560
580
600
620
640
660
680
700
VBR(DSS)=f(Tj);ID=1mA
Diagram14:Typ.capacitances
VDS[V]
C[p
F]
0 100 200 300 400 500100
101
102
103
104
Ciss
Coss
Crss
C=f(VDS);VGS=0V;f=1MHz
Diagram15:Typ.Cossstoredenergy
VDS[V]
Eoss[µ
J]
0 100 200 300 400 5000.0
0.5
1.0
1.5
2.0
2.5
3.0
Eoss=f(VDS)
11
600VCoolMOS™P6PowerTransistor
IPL60R650P6S
Rev.2.0,2014-07-08Final Data Sheet
6TestCircuits
Table8DiodecharacteristicsTest circuit for diode characteristics Diode recovery waveform
t
V ,I
Irrm
IF
VDS
10 %Irrm
trrtF tS
QF QS
dIF / dt
dIrr / dt
VDS(peak)
Qrr = QF +QS
trr =tF +tS
VDS
IF
VDS
IF
Rg1
Rg 2
Rg1 = Rg 2
Table9SwitchingtimesSwitching times test circuit for inductive load Switching times waveform
VDS
VGS
td(on) td(off)tr
ton
tf
toff
10%
90%
VDS
VGS
Table10UnclampedinductiveloadUnclamped inductive load test circuit Unclamped inductive waveform
VDS
V(BR)DS
IDVDS
VDSID
12
600VCoolMOS™P6PowerTransistor
IPL60R650P6S
Rev.2.0,2014-07-08Final Data Sheet
7PackageOutlines
E2
K1
K2
e
MILLIMETERS
A
DIM
MIN MAX
INCHES
MIN MAX
1
SCALE
Z8B00172997
REVISION
ISSUE DATE
EUROPEAN PROJECTION
01
17-04-2014
0
2mm
0
1
DOCUMENT NO.
b1
c
D
D1
E
E1
N
L
0.90 1.10 0.035 0.043
0.00
0.10
4.90
4.11
5.90
2.60
0.45
0.05
0.30
5.10
4.31
6.10
2.80
0.65
0.000
0.004
0.193
0.162
0.232
0.102
0.018
0.002
0.012
0.201
0.170
0.240
0.110
0.026
0.30
8
0.50
8
0.012 0.020
1.27 (BSC) 0.05 (BSC)
b 0.30 0.50 0.012 0.020
1.80 2.00 0.071 0.079
0.20 0.40 0.008 0.016
L1 0.45 0.65 0.018 0.026
Figure1OutlineThinPAK5x6SMD,dimensionsinmm/inches
13
600VCoolMOS™P6PowerTransistor
IPL60R650P6S
Rev.2.0,2014-07-08Final Data Sheet
8AppendixA
Table11RelatedLinks
• IFXCoolMOSWebpage:www.infieon.com
• IFXDesigntools:www.infineon.com
14
600VCoolMOS™P6PowerTransistor
IPL60R650P6S
Rev.2.0,2014-07-08Final Data Sheet
RevisionHistoryIPL60R650P6S
Revision:2014-07-08,Rev.2.0
Previous Revision
Revision Date Subjects (major changes since last revision)
2.0 2014-07-08 Release of final version
WeListentoYourCommentsAnyinformationwithinthisdocumentthatyoufeeliswrong,unclearormissingatall?Yourfeedbackwillhelpustocontinuouslyimprovethequalityofthisdocument.Pleasesendyourproposal(includingareferencetothisdocument)to:[email protected]
PublishedbyInfineonTechnologiesAG81726München,Germany©2014InfineonTechnologiesAGAllRightsReserved.
LegalDisclaimerTheinformationgiveninthisdocumentshallinnoeventberegardedasaguaranteeofconditionsorcharacteristics.Withrespecttoanyexamplesorhintsgivenherein,anytypicalvaluesstatedhereinand/oranyinformationregardingtheapplicationofthedevice,InfineonTechnologiesherebydisclaimsanyandallwarrantiesandliabilitiesofanykind,includingwithoutlimitation,warrantiesofnon-infringementofintellectualpropertyrightsofanythirdparty.
InformationForfurtherinformationontechnology,deliverytermsandconditionsandpricespleasecontactyournearestInfineonTechnologiesOffice(www.infineon.com).
WarningsDuetotechnicalrequirements,componentsmaycontaindangeroussubstances.Forinformationonthetypesinquestion,pleasecontactthenearestInfineonTechnologiesOffice.TheInfineonTechnologiescomponentdescribedinthisDataSheetmaybeusedinlife-supportdevicesorsystemsand/orautomotive,aviationandaerospaceapplicationsorsystemsonlywiththeexpresswrittenapprovalofInfineonTechnologies,ifafailureofsuchcomponentscanreasonablybeexpectedtocausethefailureofthatlife-support,automotive,aviationandaerospacedeviceorsystemortoaffectthesafetyoreffectivenessofthatdeviceorsystem.Lifesupportdevicesorsystemsareintendedtobeimplantedinthehumanbodyortosupportand/ormaintainandsustainand/orprotecthumanlife.Iftheyfail,itisreasonabletoassumethatthehealthoftheuserorotherpersonsmaybeendangered.