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BSC014N04LS
Rev.2.4,2016-05-04Final Data Sheet
12
34
56
78
43
21
56
78
TDSON-8FL(enlargedsourceinterconnection)
8 D
7 D
6 D
5 D
S 1
S 2
S 3
G 4
MOSFETOptiMOSTMPower-MOSFET,40V
Features•Optimizedforsynchronousrectification•Verylowon-stateresistanceRDS(on)•100%avalanchetested•Superiorthermalresistance•N-channel,logiclevel•QualifiedaccordingtoJEDEC1)fortargetapplications•Pb-freeleadplating;RoHScompliant•Halogen-freeaccordingtoIEC61249-2-21•Highersolderjointreliabilityduetoenlargedsourceinterconnection
Table1KeyPerformanceParametersParameter Value UnitVDS 40 V
RDS(on),max 1.4 mΩ
ID 100 A
Qoss 54 nC
Qg(0V..10V) 61 nC
Type/OrderingCode Package Marking RelatedLinksBSC014N04LS TDSON-8 FL 014N04LS -
1) J-STD20 and JESD22
2
OptiMOSTMPower-MOSFET,40VBSC014N04LS
Rev.2.4,2016-05-04Final Data Sheet
TableofContentsDescription . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Electrical characteristics diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Disclaimer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
3
OptiMOSTMPower-MOSFET,40VBSC014N04LS
Rev.2.4,2016-05-04Final Data Sheet
1MaximumratingsatTA=25°C,unlessotherwisespecified
Table2MaximumratingsValues
Min. Typ. Max.Parameter Symbol Unit Note/TestCondition
Continuous drain current ID
-----
-----
10010010010032
A
VGS=10V,TC=25°CVGS=10V,TC=100°CVGS=4.5V,TC=25°CVGS=4.5V,TC=100°CVGS=10V,TA=25°C,RthJA=50K/W1)
Pulsed drain current2) ID,pulse - - 400 A TC=25°C
Avalanche current, single pulse3) IAS - - 50 A TC=25°C
Avalanche energy, single pulse EAS - - 170 mJ ID=50A,RGS=25Ω
Gate source voltage VGS -20 - 20 V -
Power dissipation Ptot--
--
962.5 W TC=25°C
TA=25°C,RthJA=50K/W1)
Operating and storage temperature Tj,Tstg -55 - 150 °C IEC climatic category;DIN IEC 68-1: 55/150/56
2Thermalcharacteristics
Table3ThermalcharacteristicsValues
Min. Typ. Max.Parameter Symbol Unit Note/TestCondition
Thermal resistance, junction - case,bottom RthJC - 0.8 1.3 K/W -
Thermal resistance, junction - case,top RthJC - - 20 K/W -
Device on PCB,6 cm2 cooling area1) RthJA - - 50 K/W -
1) Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm2 (one layer, 70 µm thick) copper area for drainconnection. PCB is vertical in still air.2) See Diagram 3 for more detailed information3) See Diagram 13 for more detailed information
4
OptiMOSTMPower-MOSFET,40VBSC014N04LS
Rev.2.4,2016-05-04Final Data Sheet
3Electricalcharacteristics
Table4StaticcharacteristicsValues
Min. Typ. Max.Parameter Symbol Unit Note/TestCondition
Drain-source breakdown voltage V(BR)DSS 40 - - V VGS=0V,ID=1mA
Gate threshold voltage VGS(th) 1.2 - 2 V VDS=VGS,ID=250µA
Zero gate voltage drain current IDSS --
0.110
1100 µA VDS=40V,VGS=0V,Tj=25°C
VDS=40V,VGS=0V,Tj=125°C
Gate-source leakage current IGSS - 10 100 nA VGS=20V,VDS=0V
Drain-source on-state resistance RDS(on)--
1.51.1
1.91.4 mΩ VGS=4.5V,ID=50A
VGS=10V,ID=50A
Gate resistance1) RG 0.45 0.9 1.8 Ω -
Transconductance gfs 120 230 - S |VDS|>2|ID|RDS(on)max,ID=50A
Table5DynamiccharacteristicsValues
Min. Typ. Max.Parameter Symbol Unit Note/TestCondition
Input capacitance1) Ciss - 4300 6020 pF VGS=0V,VDS=20V,f=1MHz
Output capacitance1) Coss - 1200 1680 pF VGS=0V,VDS=20V,f=1MHz
Reverse transfer capacitance1) Crss - 100 200 pF VGS=0V,VDS=20V,f=1MHz
Turn-on delay time td(on) - 8 - ns VDD=20V,VGS=10V,ID=50A,RG,ext,ext=1.6Ω
Rise time tr - 9 - ns VDD=20V,VGS=10V,ID=50A,RG,ext,ext=1.6Ω
Turn-off delay time td(off) - 35 - ns VDD=20V,VGS=10V,ID=50A,RG,ext,ext=1.6Ω
Fall time tf - 7 - ns VDD=20V,VGS=10V,ID=50A,RG,ext,ext=1.6Ω
Table6Gatechargecharacteristics2)Values
Min. Typ. Max.Parameter Symbol Unit Note/TestCondition
Gate to source charge Qgs - 11 - nC VDD=20V,ID=50A,VGS=0to10V
Gate charge at threshold Qg(th) - 6.9 - nC VDD=20V,ID=50A,VGS=0to10V
Gate to drain charge1) Qgd - 9.8 14 nC VDD=20V,ID=50A,VGS=0to10V
Switching charge Qsw - 14 - nC VDD=20V,ID=50A,VGS=0to10V
Gate charge total1) Qg - 61 85 nC VDD=20V,ID=50A,VGS=0to10V
Gate plateau voltage Vplateau - 2.5 - V VDD=20V,ID=50A,VGS=0to10V
Gate charge total1) Qg - 31 44 nC VDD=20V,ID=50A,VGS=0to4.5V
Gate charge total, sync. FET Qg(sync) - 24 - nC VDS=0.1V,VGS=0to4.5V
Output charge1) Qoss - 54 76 nC VDD=20V,VGS=0V
1) Defined by design. Not subject to production test2) See ″Gate charge waveforms″ for parameter definition
5
OptiMOSTMPower-MOSFET,40VBSC014N04LS
Rev.2.4,2016-05-04Final Data Sheet
Table7ReversediodeValues
Min. Typ. Max.Parameter Symbol Unit Note/TestCondition
Diode continuous forward current IS - - 96 A TC=25°C
Diode pulse current IS,pulse - - 400 A TC=25°C
Diode forward voltage VSD - 0.82 1 V VGS=0V,IF=50A,Tj=25°C
Reverse recovery time1) trr - 32 64 ns VR=20V,IF=50A,diF/dt=400A/µs
Reverse recovery charge Qrr - 98 - nC VR=20V,IF=50A,diF/dt=400A/µs
1) Defined by design. Not subject to production test
6
OptiMOSTMPower-MOSFET,40VBSC014N04LS
Rev.2.4,2016-05-04Final Data Sheet
4Electricalcharacteristicsdiagrams
Diagram1:Powerdissipation
TC[°C]
Ptot[W
]
0 40 80 120 1600
20
40
60
80
100
120
Ptot=f(TC)
Diagram2:Draincurrent
TC[°C]
ID[A
]
0 40 80 120 1600
20
40
60
80
100
120
ID=f(TC);VGS≥10V
Diagram3:Safeoperatingarea
VDS[V]
ID[A
]
10-1 100 101 10210-1
100
101
102
103
1 µs10 µs
100 µs
1 ms
10 ms
DC
ID=f(VDS);TC=25°C;D=0;parameter:tp
Diagram4:Max.transientthermalimpedance
tp[s]
ZthJC[K
/W]
10-6 10-5 10-4 10-3 10-2 10-1 10010-3
10-2
10-1
100
101
0.5
0.2
0.1
0.05
0.02
0.01
single pulse
ZthJC=f(tp);parameter:D=tp/T
7
OptiMOSTMPower-MOSFET,40VBSC014N04LS
Rev.2.4,2016-05-04Final Data Sheet
Diagram5:Typ.outputcharacteristics
VDS[V]
ID[A
]
0 1 20
50
100
150
200
250
300
350
400
3.5 V
4 V
4.5 V5 V
10 V
3.2 V
3 V
2.8 V
ID=f(VDS);Tj=25°C;parameter:VGS
Diagram6:Typ.drain-sourceonresistance
ID[A]
RDS(on
) [m
Ω]
0 10 20 30 40 500.5
1.0
1.5
2.0
2.5
3.0
2.8 V
3 V
3.2 V
3.5 V
4 V4.5 V5 V
10 V
RDS(on)=f(ID);Tj=25°C;parameter:VGS
Diagram7:Typ.transfercharacteristics
VGS[V]
ID[A
]
0 1 2 3 4 50
80
160
240
320
400
150 °C 25 °C
ID=f(VGS);|VDS|>2|ID|RDS(on)max;parameter:Tj
Diagram8:Typ.forwardtransconductance
ID[A]
gfs [S]
0 20 40 60 80 1000
80
160
240
320
gfs=f(ID);Tj=25°C
8
OptiMOSTMPower-MOSFET,40VBSC014N04LS
Rev.2.4,2016-05-04Final Data Sheet
Diagram9:Drain-sourceon-stateresistance
Tj[°C]
RDS(on
) [m
Ω]
-60 -20 20 60 100 1400.00
0.25
0.50
0.75
1.00
1.25
1.50
1.75
2.00
2.25
2.50
max
typ
RDS(on)=f(Tj);ID=50A;VGS=10V
Diagram10:Typ.gatethresholdvoltage
Tj[°C]
VGS(th) [V]
-60 -20 20 60 100 1400.0
0.5
1.0
1.5
2.0
2.5
250 µA
VGS(th)=f(Tj);VGS=VDS;ID=250µA
Diagram11:Typ.capacitances
VDS[V]
C[p
F]
0 10 20 30 40101
102
103
104
Ciss
Coss
Crss
C=f(VDS);VGS=0V;f=1MHz
Diagram12:Forwardcharacteristicsofreversediode
VSD[V]
IF [A]
0.0 0.5 1.0 1.5100
101
102
103
25 °C150 °C25 °C, max150 °C, max
IF=f(VSD);parameter:Tj
9
OptiMOSTMPower-MOSFET,40VBSC014N04LS
Rev.2.4,2016-05-04Final Data Sheet
Diagram13:Avalanchecharacteristics
tAV[µs]
IAV [A]
100 101 102 103100
101
102
25 °C
100 °C
125 °C
IAS=f(tAV);RGS=25Ω;parameter:Tj(start)
Diagram14:Typ.gatecharge
Qgate[nC]
VGS [V]
0 20 40 600
2
4
6
8
10
12
8 V32 V
20 V
VGS=f(Qgate);ID=50Apulsed;parameter:VDD
Diagram15:Drain-sourcebreakdownvoltage
Tj[°C]
VBR(DSS
) [V]
-60 -20 20 60 100 14030
32
34
36
38
40
42
44
46
VBR(DSS)=f(Tj);ID=1mA
Gate charge waveforms
10
OptiMOSTMPower-MOSFET,40VBSC014N04LS
Rev.2.4,2016-05-04Final Data Sheet
5PackageOutlines
Figure1OutlineTDSON-8FL,dimensionsinmm/inches
11
OptiMOSTMPower-MOSFET,40VBSC014N04LS
Rev.2.4,2016-05-04Final Data Sheet
Figure2OutlineFootprint(TDSON-8FL)
12
OptiMOSTMPower-MOSFET,40VBSC014N04LS
Rev.2.4,2016-05-04Final Data Sheet
Figure3OutlineTape(TDSON-8FL)
13
OptiMOSTMPower-MOSFET,40VBSC014N04LS
Rev.2.4,2016-05-04Final Data Sheet
RevisionHistoryBSC014N04LS
Revision:2016-05-04,Rev.2.4
Previous Revision
Revision Date Subjects (major changes since last revision)
2.0 2012-10-11 Release of final version
2.1 2012-10-12 New diagram titles.
2.2 2013-02-27 Rev. 2.1
2.4 2016-05-04 Update footnotes and insert max values
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