M.Tech ELECTRONICS DESIGN and TECHNOLOGY Syllabus · Feedback and opamp compensation, Slew rate, Power supply rejection, Op-amp Noise. Module IV – Advanced Current Mirrors and OP-AMPS

M.TechELECTRONICS DESIGN and TECHNOLOGY

Syllabus

ELECTRONICS DESIGN & TECHNOLOGY 1

SEMESTER I

SLNo.

COURSECODE

COURSE TITLE L T P C

THEORY

Manufacturing and Design3 1 2 5

Integrated Circuits3 1 0 4

Design3 0 3 5

4.Electromagnetic Interference and Compatibility in System

3 1 0 4

5.Advanced Embedded SystemsDesign

3 0 3 5

6. E1 Elective 3 0 3 5

Total 18 3 7 28

ELECTIVES

1. Design of Low Power Circuits

2. Semiconductor Device Modeling and Simulation

3. RF Systems Design

PRACTICAL

1. Electronics Design Lab 0 0 4 2

2. Analog Circuit Design Lab 0 0 4 2

TOTAL : 32 CREDITS


Applied Maths for 1. ED1T1

Analysis and Design of Analog 2.

Advanced Digital System 3.

3 1 2 5Aim:The course aims at providing necessary mathematical background to tackle real life optimizationproblems.

Objective:

1. To familiarize the student with functions of several variables. 2. To enable students to analyse various types of optimization techniques which are useful in

finding the optimum solution to the problems arising in various domains

3. To study fundamental principles of genetic algorithm (GA) used to find approximatesolutions to optimization and search problems.

4. To provide in-depth understanding of queuing theory which provides models for a numberof situations that arises in real life.

Outcome of the Course:At the end of the course, the students would :

1. Have a well – founded knowledge of linear programming and nonlinear programming whichcan describe real life phenomena.

2. Be exposed to basic characteristic features of a queuing system and acquire skills inanalyzing queuing models.

Module I - Linear Programming (10 hrs) Introduction – formulation of the problem – graphical method – canonical form and standard formsof L.P.P – simplex method – artificial variable techniques - Big-M method – two phase simplexmethod. Duality principle – dual simplex method. Transportation model and algorithm, assignmentmodel and Hungarian technique of solution, unbalanced assignment models, maximization case intransportation and assignment method. Problem solving using CPLEX

Module II - Non Linear Programming & Integer programming (11 hrs) Non Linear Programming: Unconstrained optimization techniques, Direct searchmethods, Descent methods, constrained optimization. Formulation of Integer Programmingproblems, Gomory’s cutting plane methods, Branch and Bound Techniques. Problem solving usingCPLEX

Module III - Dynamic Programming & Genetic Algorithm (12 hrs)Characteristics of Dynamic Programming, Bellman’s principle of optimality, Concepts of dynamicprogramming, tabular method of solution. Introduction to Genetic Algorithm (GA), workingprinciple, coding of variables, fitness function. GA operators; Similarities and differences betweenGA and traditional methods; Unconstrained and constrained optimization using GAs. Problem solving using CPLEX/MATLAB

Module IV - Queuing Models (12 hrs)Poisson Process – Markovian queues – Single and Multi Server Models – Little’s formula –Machine Interference Model – Steady State analysis – Self Service queue. Problem solving usingMATLAB


<ED1T1> APPLIED MATHS FOR MANUFACTURING AND DESIGN

L T P C

Total: 45 hrs

Text Books:1. Taha, H.A., “Operations Research: An Introduction”, Pearson Education, New Delhi, 2012.2. M. Mitchell, “An Introduction to Genetic Algorithms”, PHI, 1998.

References:1. D. Gross and C.M. Harris, “Fundamentals of Queueing Theory”, Wiley Student edition,

2004..2. S.S. Rao, “Engineering Optimization: Theory and practice”, New Age International, New

Delhi, 2000.3. Trivedi K.S., “Probability and Statistics with Reliability , Queuing and Computer

Applications”, Prentice Hall, New Delhi, 2003.4. A.E. Eiben and J.E. Smith, “Introduction to Evolutionary Computing”, Springer-Verlag,

2007.5. P. Mazumdar and E. Rudnick, “Genetic Algorithms for VLSI Design, Layout and Test

Automation”, Pearson, 2007.6. K. Deb, “Optimization for Engineering Design – Algorithms and Examples”, PHI, 2012.


3 1 0 4Aim:Analog IC circuits are essential in interfacing and in building amplifiers and low pass filters. Thiscourse introduces design methods for analog IC design.

Objective:1. To introduce the basic building blocks or sub circuits of analog IC design.2. To study basic operational amplifiers.3. To understand applications of opamps- comparators, Switched capacitor circuits and filters.

Outcome of the Course:At the completion of the course, students will be able to:

1. Learn the behaviour of MOSFET and different types of amplifiers.2. Develop mathematical modeling of opamps.3. Design various types of operational amplifier circuits.

Module I - Integrated Circuit Active Devices—Modeling (9 hrs)MOS transistors--large signal behavior of MOSFET - small signal model of the MOS transistors-short channel effects in MOS transistors – weak inversion in MOS transistors- substrate currentflow in MOS transistor, Channel Length Modulation, Body Effect, DIBL, GIDL, Subthresholdconduction, CMOS Inverters, Voltage transfer Characteristics of CMOS inverter.

Module II – Current Mirrors and Single Stage Amplifiers (9 hrs)Simple CMOS Current Mirror, Common-Source Amplifier, Source-Follower or Common-DrainAmplifier, Common-Gate Amplifier, Source-Degenerated, Cascode, Wilson Current Mirrors,Bipolar current Mirrors, MOS Differential Pair, Frequency Response, Band gap Referenceciruits.

Module III – Noise Analysis and Operational Amplifiers (9 hrs)Noise- Time domain and frequency domain analysis, Noise models for circuit elements.Operational Amplifiers- Performance parameters, one stage and two stage operational amplifiers,Feedback and opamp compensation, Slew rate, Power supply rejection, Op-amp Noise.

Module IV – Advanced Current Mirrors and OP-AMPS (9 hrs)Advanced current mirrors, Folded cascode opamp, current mirror opamp, Fully differnetial op-amp, Common mode feedback circuits, Current feedback op-amps.

Module V – Applications of OP-AMPS (9 hrs)Comparators, Charge injection errors, latched comparators, CMOS and BiCMOS comparators,Sample and Hold circuits, CMOS sample and hold circuits, Bipolar and BiCMOS sample and holdcircuit, Switched capacitor circuits, First order filters, Biquad filters, Switched capacitor gaincircuits, Continuous time filters, Gm-C filters, Bipolar, CMOS and BiCMOS Transconductors..

Total : 45 hrs


<ED1T2> ANALYSIS AND DESIGN OF ANALOG INTEGRATED CIRCUITSL T P C

Text Books:1. David A. Johns and Ken Martin, “Analog Integrated Circuit Design”, 2nd edition, Oxford

University Press, 2010.2. Behzad Razavi, “Design of Analog CMOS Integrated Circuit” Tata-Mc GrawHill, 2002.3. Jan Rabaey, “Low power Design Essentials” Springer Edition- 2009.

References:1) Phillip E.Allen Douglas R. Hollberg, “CMOS Analog Circuit Design”, Second Edition

Oxford University Press-2003.2) Gray, Meyer, Lewis, Hurst, “Analysis and design of Analog IC’s”, Fourth Edition, Willey

India Private Limited, 2008.


3 0 3 5Aim:The aim of this course is to understand and design basic blocks of combinational circuits, sequentialcircuit, Datapath and Control Units of Digital sub-systems. Objectives:The objective of the course is

1. To learn advanced digital design concepts.2. To design digital sub-systems using Verilog HDL.3. To learn Memory, CPLDs, FPGAs and ASICs.

Outcomes:Upon completion of this course students would be able to

1. Design digital circuits and subsystems using Verilog HDL.2. Have basic understanding of Memory, CPLDs, FPGAs and ASICs.

Module I - Combinational Logic Design (8 hrs)Combinational-Circuit Analysis, Combinational-Circuit Synthesis, Programmed MinimizationMethods, Timing Hazards, Circuit Timing, Decoders, Encoders, Three-State Devices, Multiplexers,Exclusive-OR Gates and Parity Circuits, Comparators, Adders, Subtractors, ALUs, CombinationalMultipliers

Module II - Sequential Logic Design (9 hrs)Bistable Elements, Latches and Flip-Flops, Counters, Shift Registers, Clocked Synchronous State-Machine Analysis and Design, Designing State Machines Using State Diagrams, State-MachineSynthesis Using Transition Lists, State-Machine Design Example, Decomposing State Machines,Feedback Sequential Circuits, Feedback Sequential-Circuit Design

Module III - Verilog HDL (12 hrs)Overview of Digital Design with Verilog HDL, Hierarchical Modeling Concepts, Basic Concepts,Modules and Ports, Gate Level Modeling, Dataflow Modeling, Behavioral Modeling, Tasks andFunctions, Useful Modeling Techniques, Timing and Delays, User Defined Primitives, LogicSynthesis with Verilog HDL, Testbenches for verification of HDL models

Module IV - Datapaths and Control Units (9 hrs)Designing Dedicated Datapaths, Using Dedicated Datapaths, Examples of Dedicated Datapaths,General Datapaths, Using General Datapaths, A More Complex General Datapath, Timing Issues,Constructing the Control Unit, Examples, Generating Status Signals, Timing Issues, StandaloneControllers:Rotating Lights and PS/2 Keyboard Controller, ASM Charts and State Action Tables Suggested activities: Dedicated Microprocessor and General-Purpose Microprocessor Design

Module V - Memory, CPLDs, FPGAs and ASICs (7 hrs)Read-Only Memory, Read/Write Memory, Static RAM, Dynamic RAM, Complex ProgrammableLogic Devices, Field-Programmable Gate Arrays, Types of ASICs, ASIC Design flow, Economicsof ASICs

Total: 45 hrsText Books:

1. John F. Wakerly, “Digital Design: Principles and Practices”, 4th edition, Pearson, 2008


<ED1T3> ADVANCED DIGITAL SYSTEM DESIGN L T P C

2. Samir Palnitkar, “Verilog HDL: A Guide to Digital Design and Synthesis”, 2nd edition,Pearson, 2003

3. Enoch O. Hwang, “Digital Logic and Microprocessor Design with VHDL”, 1st edition,Nelson Engineering, 2007

References: Michael John Sebastian Smith, “Application-Specific Integrated Circuits”, 1st edition,

Pearson, 2002 Charles H. Roth, “Fundamentals of Logic Design”, 5th edition, Cengage Learning, 2004 Randy H. Katz, Gaetano Borriello, “Contemporary Logic Design”, 2nd edition, PHI

Learning, 2009


L T P C3 1 0 4

Aim:To understand different electromagnetic Interference problems occurring in Inter- system and theirpossible mitigation techniques in Electronic Design.

Objective:To understand EMI Sources, EMI problems and their solution methods in PCB level / Subsystemand system level design. To measure the emission, immunity level from different systems tocouple with the prescribed EMC standards

Outcome of the Course:After completion of course the student shall be able to :

1. Give examples on how electromagnetic noise is generated in large and small electricalsystems.

2. Show theoretically how electromagnetic noise couples to a electrical system.3. Explain how electromagnetic noise can be reduced in an electrical system using proper

layout, shielding, grounding and filtering.4. Describe and give practical examples of the problem of electromagnetic interference.

Module -1: Fundamentals and Requirements (9 Hrs)Introduction to EMC - EMC problem classifications - Physical and electrical dimensions ofcomponents - Common EMC units - Transmission line theory - EMC signal sources EMC standards - Conducted emissions standards and testing - Radiated emissions standards andtesting - Antenna factor - Regulations: FCC and CISPR

Module – 2: Component Behaviour (9 Hrs)Low frequency circuit approximations - Internal impedance of round wires - High frequency wireresistance approximation - External inductance, capacitance and conductance of parallel wires,coaxial conductors and PCB structures - Nonideal behaviour of resistors, capacitors and inductors -Noise suppression with capacitors and inductors - Common mode and differential mode currents -Ferrites and common mode chokes – Digital Circuit Devices

Module -3: Signal Spectra and Radiated Emission & Suceptibility (9 Hrs)Signal classifications - Periodic signals as series expansions of orthogonal basis functions - Fourierseries - Signal spectra - Efficient techniques for the determination of Fourier series coefficients -Fourier expansions of piecewise linear periodic signals - Approximate spectra of digital circuitclock waveforms - Aperiodic signals - Fourier transforms - Linear systems response to periodic andaperiodic signalsEmission models for wires and PCB lands - Signal spectra and the spectra of resulting radiatedemissions - Measured spectra and the effect of antenna factor

Module – 4: Crosstalk, Shielding and EMC/EMI Modelling (9 Hrs)Crosstalk on three-conductor transmission lines – Multi-conductor transmission line per-unit-lengthparameters - Electrically short, weakly-coupled three-conductor line - Common-impedancecoupling - Time-domain crosstalk


<ED1T4> ELECTROMAGNETIC INTERFERENCE AND COMPATIBILITYIN SYSTEM

Far-field shielding effectiveness - Near-field shielding effectivenessEMC/EMI Computational Modelling: Importance of modelling – FDTD and Methods of MomentsTechniques.

Module – 5: EMC Design of PCBs and Electro Static Discharge (9 Hrs)PCB: Board Stack-up Issues – Component Placement - Isolation Electro Static Discharge (ESD): Dielectric Breakdown – Static Charge Generation – Human Body Model – Static Discharge – ESD Protection

Text Books:1. Clayton R. Paul, “Introduction to Electromagnetic Compatibility”, 2nd. Ed., John Wiley &

Sons, 2006.2. Henry W Ott, “Noise Reduction Techniques in Electronic Systems”, John Wiley & Sons, 2nd

Edi., 1988.3. Bruce R Archambeault, “PCB Design for Real-World Emi Control”, Springer Science +

Business Media, LLC, 2002


Aim:This subject focus on essential skills for embedded systems design. The subject combines relevant theory, state-of-the-art tools and methodologies used in industry and academia.

Objectives:1. To expose the students to the fundamentals of embedded system design.2. To enable students to create, develop, apply within the embedded systems development

environment3. To impart knowledge on fundamentals on design attributes of functional units of a Processor4. Understand how real-world embedded devices integrate hardware and software.

Outcomes: Upon completion of the course, students should be able to

1. Define various processes involved in design of an embedded system.2. Understand and reason the technologies involved in Embedded System Design3. Demonstrate the need the for having a Real Time OS of Embedded Systems4. Able to interface various peripherals for bringing up an Embedded System5. Appreciate various memory architectures and communication protocols used in Embedded

System Design

Module I - Introduction and Review of Embedded Hardware (8hrs)Terminology - Gates - Timing diagram - Memory - Microprocessor buses - Direct memory accessInterrupts – Built interrupts - Interrupts basis - Shared data problems - Interrupt latency –Embedded system evolution trends - Round robin- Round robin with interrupt functionRescheduling architecture - algorithm.

Module II - Real Time Operating System (10hrs)Task and Task states - Task and data - Semaphore and shared data operating system services -Message queues timing functions - Events - Memory management - Interrupt routines in an RTOSenvironment - Basic design using RTOS.

Module III- Advanced Processors/Controllers (9hrs)Introduction to ARM CPU Architecture, Programmers Model for ARM CPU, Operating Modes ,Instruction set, ARM Exception Handling , Pipelining, Comparative Study of ARM cores – ARMv4to ARM Cortex

Module IV - Embedded Hardware, Software And Peripherals (9hrs)Peripheral-Processor Interfacing Concepts - Review of Peripheral Interface protocols - SPI, I2C,UART and One-wire with case studies of interface with Sensors, Radio and ADCs. HardwareTimers and Interrupt handling, Interrupt service routines. Software Development environment.

Module V - Memory and Interfacing (9hrs)Memory: Memory write ability and storage performance - Memory types - composing memory-Advance RAM interfacing communication basic - Microprocessor interfacing I/O addressingInterrupts - Direct memory access – Arbitration multilevel bus architecture - Serial protocol


<ED1T5> ADVANCED EMBEDDED SYSTEMS DESIGNL T P C3 0 3 5

-Parallel protocols - Wireless protocols - Digital camera example.Total: 45 hrs

Text Book:1. David. E. Simon, “An Embedded Software Primer”, Pearson Education, 2001.2. Raj Kamal, “Embedded Systems- Architecture, Programming and Design” Tata McGraw

Hill, 2006.3. Andrew N Sloss, “ARM System Developers Guide”, Elsevier, 2013

References:1. Frank Vahid and Tony Gwargie, “Embedded System Design”, John Wiley & sons, 2002.2. Steve Heath, “Embedded System Design”, Elsevier, Second Edition, 2004.3. Tammy Noergaard, ”Embedded System Architecture, A comprehensive Guide for Engineers

and Programmers”, Elsevier, 20064. Michael Barr, “Programming Embedded Systems in C and C++”, O'Reilly, 1999.


Aim:To study the approaches for power consumption estimation and different methods to reduce thepower consumption, low power architectures and algorithmic level analysis for low poweroptimization.

Objective:To learn principles of design, analysis, modeling and optimization of Low Power VLSI.

Outcomes of the Course:The students would apply low power VLSI techniques at different levels of a design such as devicelevel, circuit level, algorithm level and architectural level without compromising on performance ofthe circuit with significant reduction in power consumption.

Module I - Basics of MOS circuits:MOS Transistor structure and device modeling , MOS Inverters , MOS Combinational Circuits -Different Logic Families

Module II - Sources of Power dissipation:Dynamic Power Dissipation -Short Circuit Power, Switching Power, Gliching Power. Static Power Dissipation, Degrees of Freedom

Module III - Supply Voltage Scaling Approaches:Device feature size scaling , Multi-Vdd Circuits, Architectural level approaches: Parallelism,Pipelining, Voltage scaling using high-level transformations, Dynamic voltage scaling, PowerManagement.

Module IV - Switched Capacitance Minimization Approaches:Hardware Software Tradeoff , Bus Encoding , Two’s complement Vs Sign Magnitude ,Architecturaloptimization , Clock Gating , Logic styles

Module V - Leakage Power minimization Approaches:Variable-threshold-voltage CMOS (VTCMOS) approach , Multi-threshold-voltage CMOS(MTCMOS) approach , Power gating , Transistor stacking , Dual-Vt assignment approach(DTCMOS)

Module VI - Special Topics:Adiabatic Switching Circuits , Battery-aware Synthesis , Variation tolerant design, CAD tools forlow power synthesis

Text Books:1. Sung Mo Kang, Yusuf Leblebici, CMOS Digital Integrated Circuits, Tata Mcgraw Hill. 2. Neil H. E. Weste and K. Eshraghian, Principles of CMOS VLSI Design, 2nd Edition,

Addison Wesley (Indian reprint). 3. A. Bellamour, and M. I. Elmasri, Low Power VLSI CMOS Circuit Design, Kluwer

Academic Press, 1995.


<ED1E1> DESIGN OF LOW POWER CIRCUITSL T P C3 0 3 5

4. Anantha P. Chandrakasan and Robert W. Brodersen, Low Power Digital CMOS Design,Kluwer Academic Publishers, 1995.

References:1. Kaushik Roy and Sharat C. Prasad, Low-Power CMOS VLSI Design, Wiley-Interscience,

2000.


<Course code> SEMICONDUCTOR DEVICE MODELING AND SIMULATION L T P C

3 0 3 5Aim: The course aims at providing clear understanding of modeling and simulation of semiconductor devices like diode, BJT and MOSFET.

Objectives: Upon successful completion of the course, students will be able to:

1. Grasp fundamental knowledge of semiconductor devices for Integrated Circuit design.2. Understand the operation principle of Diode, BJT and MOSFET. 3. Have a comprehensive understanding of the second‐order effects and device

modeling through which you can cope with an ever‐increasing‐speed state‐of‐the‐art design.

Outcomes of the Course: At the end of the course, the students would :

1. Have a good knowledge of different models of semiconductor devices like Diode, BJT and MOS Transistor.

2. Be able to model the devices using SPICE modeling.

Module I - PN Junction Diode and Schottky Diode (9 hrs)DC Current- Voltage Characteristics, Static Model, Large- Signal Model, Small- Signal Model,Schottky Diode and its implementation in SPICE2, Temperature and Area Effects on the DiodeModel Parameters, SPICE3 Models, HSPICE Models, PSPICE Models

Module II - Bipolar Junction Transistor (BJT) (9 hrs)Transistor Conversions and Symbols, Ebers-Moll Static Model, Ebers-Moll Large- Signal Model,Ebers-Moll Small- Signal Model, Gummel-Poon Static Model, Gummel-Poon Large- Signal Model,Gummel-Poon Small- Signal Model, Temperature and Area Effects on the BJT Model Parameters,Power BJT Model, SPICE3 Models, HSPICE Models, PSPICE Models

Module III - MOS Transistor(MOST) Theory (6 hrs)Introduction, Long-Channel I-V Characteristics, C-V Characteristics, Non-ideal I-V Effects, DC Transfer Characteristics

Module IV - MOS Transistor Models (11 hrs)LEVEL 1 Static Model, LEVEL 2 Static Model, LEVEL 1 and LEVEL 2 Large-Signal Model,LEVEL 3 Static Model, LEVEL 3 Large-Signal Model, Comments on the Three Models, TheEffects of Series Resistances, Small-Signal Models, The Effect on Temperature on the MOSTModel Parameters, BSIM1 Model, BSIM2 Model, SPICE3 Models, HSPICE Models, PSPICEModels

Module V - MOS Transistor Parameter Measurements (10 hrs)LEVEL1 Model Parameters, LEVEL2 Model (Long-Channel) Parameters, LEVEL2 Model (Short-Channel) Parameters, LEVEL3 Model Parameters, Measurements of Capacitance, BSIM ModelParameter Extraction

Text Books:


1. Giuseppe, Massobrio, “Semiconductor Device Modeling with SPICE”, 2nd edition, TataMcGraw Hill

2. Yannis P. Tsividis, Colin McAndrew, “Operation and Modeling of the Mos Transistor”,Oxford University Press, 2011

References:

1. B. G. Streetman and S. Banerjee, “Solid State Electronic Devices”, 6th edition, PHILearning

2. S. M. Sze, “Semiconductor Devices: Physics and Technology”, 2nd edition, Wiley India PvtLtd

3. Michael Shur, “Physics of Semiconductor Devices”,3rd edition, Wiley India Pvt Ltd

4. Nandita DasGupta and Amitava DasGupta “Semiconductor Devices”, 1st edition, PHILearning Private Limited

5. Karl Hess, “Advanced Theory of Semiconductor Devices”, New edition, IEEE ComputerSociety Press


<Course code> RF SYSTEMS DESIGN L T P C

3 0 3 5Aim:The aim of the course is to give broad understanding RF Systems.

Objective:Objective of this course is to make the students understand

1. RF Transceiver architectures2. RF amplifiers3. PLLs and frequency synthesizers4. Mixers and oscillators

Outcome of the Course:A thorough understanding of analysis and design of electronic circuits for RF System design.

Module I - CMOS physics, transceiver specifications and architectures (9 hrs)CMOS: Introduction to MOSFET Physics – Noise: Thermal, shot, flicker, popcorn noiseTransceiver Specifications: Two port Noise theory, Noise Figure, THD, IP2, IP3, Sensitivity, SFDR,Phase noise - Specification distribution over a communication link Transceiver Architectures:Receiver: Homodyne, Heterodyne, Image reject, Low IF Architectures – Transmitter: Direct upconversion, Two step up conversion, Printed antennas.

Module II - Impedance matching and amplifiers (9 hrs)S-parameters with Smith chart – Passive IC components - Impedance matching networksAmplifiers: Common Gate, Common Source Amplifiers – OC Time constants in bandwidthestimation and enhancement – High frequency amplifier design Low Noise Amplifiers: Powermatch and Noise match – Single ended and Differential LNAs – Terminated with Resistors andSource Degeneration LNAs.

Module III - Feedback systems and power amplifiers (9 hrs)Feedback Systems: Stability of feedback systems: Gain and phase margin, Root locus techniques –Time and Frequency domain considerations – Compensation Power Amplifiers: General model –Class A, AB, B, C, D, E and F amplifiers – linearization Techniques – Efficiency boostingtechniques – ACPR metric – Design considerations

Module IV - PLL and frequency synthesizers (9 hrs)PLL: Liberalized Model – Noise properties – Phase detectors – Loop filters and Charge pumpsFrequency Synthesizers: Integer-N frequency synthesizers – Direct Digital Frequency synthesizers

Module V - Mixers and oscillators (9 hrs)Mixer: characteristics – Non-linear based mixers: Quadratic mixers – Multiplier based mixers:Single balanced and double balanced mixers – sub-sampling mixers Oscillators: DescribingFunctions, Colpitts oscillators – Resonators – Tuned Oscillators – Negative resistance oscillators –Phase noise

Total : 45 hrs

Text books: -


1. T.Lee, “Design of CMOS RF Integrated Circuits”, Cambridge, 2004. 2. B.Razavi, “Design of Analog CMOS Integrated Circuits”, McGraw Hill, 2001 3. Debatosh Guha, Yahia M M Antar, “Microstrip and Printed Antennas: New Trends,

Techniques and Applications” Wiley, 2011

References: 1. Paul R. Gray, Paul J. Hurst, Stephen H. Lewis, Robert G. Meyer, “Analysis and Design of

Integrated Circuits”, 4th Ed., Wiley, 2001.2. B.Razavi, “RF Microelectronics”, Pearson Education, 19973. Jan Crols, Michiel Steyaert, “CMOS Wireless Transceiver Design”, Kluwer Academic

Publishers, 19974. Rod Waterhouse, “Printed Antennas for Wireless Communications”, Wiley, 2007

Tools to be used:Agilent ADS


Aim:The course aims at providing necessary practical skill of Designing Electronic Circuits and usingTest and Measurement instruments in designing different electronic circuits and systems.

Objective:Objective of this course is to make the students acquainted with

1. PCB Design process and Manufacturing2. Different analog and digital components and selection for different circuits3. Instruments and procedures of Electronic test and measurement

Outcome of the Course:At the end of this course, the student should be

1. Familiar with using CAD software to design a PCB and fabrication2. Able to design and build simple circuits of one's own design3. Familiar with the usage of electronic test and measurement instruments such as

Oscilloscopes, Function Generators, Digital Multimeter, Power Supplies, etc.

Study on the following:PCB Design: PCB Design rules for analog, digital and mixed signals circuits, power circuits, RFand high frequency circuits. Fabrication process of PCB (DSB and Multilayer boards) by chemical process and by millingprocess; soldering techniques.

Lab Experiments:1. PCB Design (30 Hrs.)

1. Artwork & printing of a simple PCB, Double Sided PCB2. Etching & drilling of PCB3. PCB Design with Design rules using CAD packages4. Mounting and soldering of component with protection of ESD5. Testing of regulated power supply fabricated 6. Design of Heat-sink with cooling system7. Wire-harnessing and case study of Wire-harness in SMPS and dual power supplies8. Fabricate and test the audio amplifier circuit, music system by using above power supply

2. DC and AC Measurements: (9 Hrs.)1. To get familiar with use of Digital Multimeter, DC power supplies, oscilloscope, function

generator and pulse generator. 2. To measure different time varying electrical signals with respect to : DC and AC voltages,

Frequency, Phase, Time constant of RC circuit , Amplitude and phase shift responses of lowpass and high pass RC filter using the necessary equipment and prototyping boards.

3. Optoelectronics: (9 Hrs.)To get familiar with the use of Light Emitting Diodes (LEDs), LASER diodes, light sensors (Photodiodes, Photo transistors) with the aid of different equipment such as Digital Oscilloscope, PulseGenerator, DC power supply and prototyping board.

4. Electronic System Issues: (12 Hrs.)


<ED1L1> ELECTRONICS DESIGN LABL T P C0 0 4 2

Cabling of Electronic Systems: Capacitive coupling, effect of shield on capacitive coupling, inductive coupling, effect of shield oninductive coupling, effect of shield on magnetic coupling, magnetic coupling between shieldand inner conductor, shielding to prevent magnetic radiation, shielding a receptor against magneticfields, coaxial cable versus shielded twisted pair, ribbon cables.

Grounding of Electronic Systems: Safety grounds, signal grounds, single-point ground systems,multipoint-point ground systems, hybrid grounds, functional ground layout, practical lowfrequency grounding, hardware grounds, grounding of cable shields, ground loops, shieldgrounding at high frequencies.

Protection against Electro-Static Discharges (ESD): Static generation, human body model, static discharge, ESD protection in equipment design,software and ESD protection, ESD versus EMC.

Cooling in/of Electronic System: Heat transfer, approach to thermal management, mechanisms forcooling, operating range, basic thermal calculations, cooling choices, heat sink selection. Total: 60 hrs.

Tools and Equipment needed: Hand held Digital Multimeter (AC/DC Range : 500μA to 10A, 50 mV to 100V), Analog

Oscilloscope(0-20MHz, 2-Channels), Mixed Signal Oscilloscope(0-1GHz, 16 channels), DigitalOscilloscope(0-100MHz, 4-Channels, upto 2Gs/S Sample rate), Function Generator (0-80MHz, sineand square waveforms, 64 Kpoint arbitrary waveforms), Pulse Generator(0-10MHz, Squarewave,double pulse & delayed pulse modes), DC power supply(0 to +30V, 0 to 5A), PrototypingBoard(Microcontroller and FPGA based boards), PCB Design Tools- CADSTAR, Cadence Allegroetc, ESD Safe Lab Table and chairs with mats and equipment, Soldering and de-solderingequipment and tools with consumables, Various Heat sinks, Cooling fans for electronic equipment.

Text Books 1. Kim R.Fowler, “Electronic Instrument Design”, 1st edition, Oxford University Press2. Henry W.Ott, “Noise Reduction Techniques in Electronic Systems”, 2nd edition, John Wiley

& Sons. 3. John F. Wakerly, “Digital Design Principles & Practices”, 3rd edition, Prentice Hall

International4. Robert F. Coughlin, “Operational Amplifiers and linear integrated circuits”, 3rd edition,

Prentice Hall International

References1. W Bosshart, “Printed Circuit Boards - Design & Technology”, 1st edition, Tata McGraw

Hill 2. Benefits and issues on migration of 5-volt and 3.3 volt logic to lower voltage supplies;

Application note SDAA011A@ http://www.Ti.com 3. PCB Design Guidelines For Reduced EMI; Application note SZZA009@http://www.ti.com


1. Spice Analysis of Basic circuits - 5 hrs1. Layout and simulating the I-V curves of PMOS nad NMOS devices.2. Design , Layout and Simulation of CMOS inverter.3. Design, Layout and Simulation of CMOS NAND gate.4. Design, Layout and Simulation of Ring Oscillator.

2. Case studies on spice Analysis of MOS amplifiers - 10 hrs1. Estimation of small signal voltage gain and frequency plot of Common Source Amplifier.2. Estimation of small signal voltage gain and frequency plot of Common Drain

Amplifier/Source Follower.3. Estimation of small signal voltage gain and frequency plot of Common Gate Amplifier.4. Estimation of small signal voltage gain and frequency plot of Common Source Amplifier

with source degeneration.5. Estimation of small signal voltage gain and frequency plot of Common Source Amplifier

with compensation network.6. Estimation of small signal voltage gain and frequency plot of Cascode Amplifier.7. Estimation of small signal voltage gain and frequency plot of basic Differential Amplifier.

3. Case studies on design of Current mirrors and Band-Gap reference circuits- 5 hrs1. Simulation and analysis of a basic Current mirror circuit.2. Simulation and analysis of wilson current mirror circuit.3. Simulation and analysis of a bipolar current mirror ciruit.4. Simulation and analysis of a CMOS Band-gap reference circuit.

4. Case studies on spice Analysis of Operational Amplifiers- 5 hrs1. Design, Frequency plot and analysis of a single stage op-amp.2. Design, Frequency plot and analysis of a two stage op-amp.3. Design, Frequency plot and analysis of a two stage op-amp with compensation network.

5. Case studies on spice Analysis of Adavanced current mirrors and Operational Amplifiers- 15 hrs

1. Simulation and analysis of a wide swing current mirror circuit.2. Simulation and analysis of a enhanced output impedance current mirror circuit.3. Simulation and analysis of a wide swing current mirror circuit with enhanced output

impedance.4. Design, Frequency plot and analysis of a folded cascode op-amp.5. Design, Frequency plot and analysis of a current mirror op-amp.6. Design, Frequency plot and analysis of fully differential op-amp.7. Design, Simulation and analysis of common mode feedback circuit(CMFB).8. Design, Frequency plot and analysis of current feedback op-amp.

6. Case studies on design of Comparators, Sample and Hold circuits, Switched capacitorcircuits,etc- 20 hrs

1. Design, Simulation and analysis of a basic comparator.2. Design, Simulation and analysis of a high speed comparator(latched comparator).3. Design, Simulation and analysis of an open loop track and hold using MOS technology.


<ED1L2> ANALOG CIRCUIT DESIGN LABL T P C0 0 4 2

4. Design, Simulation and analysis of Sample and Hold circuit with clock feedthroughcircuitry.

5. Design, Simulation and analysis of basic switched capacitor circuit.6. Design, Simulation and analysis of discrete time integrator circuits (parasitic sensitive and

insensitive).7. Design, Simulation and analysis of first order RC filter circuit.8. Design, Simulation and analysis of low Q and high Q biquad filters.9. Design, Simulation and analysis of first order Gm-C filter circuit.

Total: 60 hrs

Tools to be used: LTSPICE,Electric EDA tool, CADENCE: virtuoso Analog Design Environment, layout suite, virtuoso assura, spectre ciruit simulation, Matlab/ Simulink.


SEMESTER II

SLNo.

COURSECODE


THEORY

2. MEMS and Applications 3 0 0 3

3. Design for Quality and Reliability

3 0 0 3



Total 15 2 1 19

ELECTIVES

1. IC Manufacturing

2. Advanced Digital Signal Processing

3. Mixed signal design

4. Manufacturing Engineering

PRACTICAL

1. Product Design Practice & Prototyping Lab 0 0 4 2

2. Seminar 1 0 0 1

TOTAL : 22 CREDITS


1. Industrial Design of Electronic Products 3 0 3 5

3 0 3 5Aim :This course is intended to prepare students to design products based on product design principles,guidelines and skills. Students will be given experience of designing products through case studies.At the end of the module students will communicate design concepts through sketches, virtual andphysical appearance model.

Objective :To understand the various processes and systems to address human needs by creating tangibleElectronic Products. To pursue learners with emphasis on learning-by-doing and following acomprehensive process of design, engineering and producing products and systems.

Outcome of the Course :After undergoing this course, students will be able to:

1. Design electronic products using user centered design process2. Develop sketches, virtual and physical appearance models to communicate proposed designs3. Refine product design considering engineering design & manufacturing requirements and

constraints.4. Make mock-up model and working prototype along with design documentation.

Module I - Introduction to Industrial DesignIntroduction to the course, role of ID in the domain of industry, product innovation, Designer’sphilosophy and role in product design, What is good design.

Module II - Product Design Methodology User Centered Design methods, Systems Approach, Electronic Product Design and DevelopmentMethodology, Design Thinking, Creativity and Innovation. Introduction to Sustainable Design.Design Case Studies.

Module III Deconstructing Product Design - Product Analysis

Module IV - Visual Communication TechniquesFree Hand sketching and drawing techniques for concept presentation, Perspectives, and renderingtechniques, colour in design, Engineering drawing practice, exploded views.

Module V - Design Principles Visual information through design principles, Figure-ground relationship, Visual informationdistribution, Gestalt principles, Theory of object perception, Symmetry, Asymmetry, Closure,Continuance, Unifying principles of design.Design Expressions : Mood board, Design trends, Application of design principles and productaesthetics.

Module VI - Ergonomics Ergonomics of electronic products and systems, Control panel design, User interface design,Human-Computer Interaction, Case studies.

Module VII - Product Engineering


<ED2T1> INDUSTRIAL DESIGN OF ELECTRONIC PRODUCTS L T P C

Product architecture, Layout design, Structure design. Product detailing in sheet metal and plasticsfor ease of assembly, maintenance and aesthetics.

Module VIII Electronic Product Design Project – Problem Solving / Re-Design.

Text Books1. Peter Z. , “German Design Standard Vol 2”, Reddot(2006)2. Clarkson P. J, Coleman R. and Keates, S., “Inclusive Design, Design for the whole

population”, Springer Verlag Gmbh(2003) 3. Jordan P. W., “Designing Pleasurable Products: An Introduction to the New Human

Factors.” Taylor and Francis(2002)4. Otto K. and Wood K., “Product design: Techniques in Reverse Engineering and New

Product development ”, Prentice Hall. (2001) 5. Cross N. “Engineering Design Methods: Strategies for Product Design”, Willey.(2000)

References1. Cagan J. and Vogel C. M. (2007) Creating Breakthrough Products, “Innovation from

Product Planning to Program Approval” . Pearson Education2. Coats D. , “Watches Tell More than Time: Product Design, Information, Quest for elegance”

McGraw Hill(2002)3. Norman D. A. , “The design of everyday things, Basic Books.”(2002) 4. Chakrabarty D., “Indian Anthropometric Dimensions for Ergonomic Design Practice”, NID,

Ahmedabad(1999).5. Kelley T. and Littman J. “The Art of Innovation: Lessons in Creativity from Ideo, America's

Leading Design Firm, Doubleday”, Ver: 4 November 2011 MI – PDN2524 Page 4 of 4(2001)

6. E.J. McCormic, Human factors in engineering design, McGraw Hill 1976

Journals1. Behaviour & Information Technology, Taylor & Francis2. The Journal of Sustainable Product Design, Publisher: Springer3. International Journal of Design; College of Design, National Taiwan University of Science

and Technology, Taiwan.4. Virtual & Physical Prototyping, Taylor & Francis

Magazines3) ID4) Form

Internet Sites1. http://www.ulrich-eppinger.net/2. http://www.npd-solutions.com3. http://www.qfdi.org4. http://www.cheshirehenbury.com/rapid/

Electronic Product Design Lab1. Exercises on sketching and drawing, use of colors2. Practice use of model making materials and processes3. Practice methods and techniques of prototype making using sheet metal and plastic fabrication


3 0 0 3Aim: The aim of this course is to enable students to gain the physical knowledge underlying the operationprinciples, design and manufacturing of micro electromechanical systems.

Objective: The objectives of this proposed subject are to instruct students to:

1. have a concept on the scope and recent development of the science and technology of micro-and nano-systems.

2. gain the technical knowledge required for MEMS fabrication and manufacturing Processes.3. learn some typical or potentially applicable micro- and nano-systems at the frontier of the

development of the field.

Outcome of the Course: 1. Knowledge of the world of micro electromechanical devices and systems (MEMS)2. An awareness of material properties, fabrication technologies, basic device structures,

sensing and actuation principles.

Module I: Overview of MEMS and Microsystems (5 hrs)MEMS and Microsystems, Typical MEMS and Micro-system Products, Evolution of Micro-fabrication, Microsystems and Microelectronics, Microsystems and Miniaturization

Module II: Working Principles of MEMS (8 hrs)Micro-sensors, Micro-actuation, MEMS with Micro-actuators, Micro-accelerometers, Micro-fluidics, MEMS for Thermal Sensors

Module III: MEMS Fabrication Processes (10 hrs)Photo-lithography, Ion Implantation, Diffusion, Oxidation, Chemical Vapor Deposition, PhysicalVapour Deposition—Sputtering, Deposition by Epitaxy, Etching, Summary of Micro-fabrication,Overview of Micro-manufacturing, Bulk Micro-manufacturing, Surface Micro-machining, TheLIGA Process

Module IV: MEMS Packaging (12 hrs)Overview of Mechanical Packaging of Microelectronics, Micro-system Packaging, Interfaces inMicro-system Packaging, Essential Packaging Technologies, Three-Dimensional Packaging,Assembly of MEMS, Selection of Packaging Materials, Signal Mapping and Transduction, DesignCase: Pressure Sensor Packaging

Module V: Applications of MEMS (10 hrs)Applications of MEMS in the Automotive Industry and Industrial Products. Case Studies of usageof MEMS Accelerometer, Proximity Sensor and Thermal Sensor

Text Books: 1. Tai-Ran Hsu, “ MEMS and Microsystems: Design and Manufacture”, Wiley, 2008.2. N. Maluf, “An Introduction To Microelectromechanical Systems Engineering”, 2nd Ed,

Artech House,Inc, 2004.

References:


<ED2T2> MEMS AND APPLICATIONSL T P C

1. Gregory Kovacs, “Micromachined Transducers Sourcebook”, WCB McGraw-Hill, Boston, 1998.

2. S. Senturia, “Microsystem Design”, Springer, 20013. M.-H. Bao, “Micromechanical Transducers: Pressure sensors, accelrometers, and

gyroscopes”, Elsevier, New York, 20004. J. Allen, "Micro Electro Mechanical System Design ", CRC, 20055. M.J. Madou, " Fundamentals of Microfabrication ",3rd Ed, CRC, 20116. V.K. Varadan, “Microstereolithography and other fabrication techniques for 3D MEMS”,

Wiley, 2001. 7. Wolfgang Menz, “Microsytem technology”, Weinheim, Wiley-VCH, 20018. Gabriel M. Rebeiz Hoboken, “RF MEMS: theory, design and technology”, Wiley, 2003


Aim: To understand an integrated approach to quality specification, quality control, monitoring, andreliability.

Objective: 1. To develop responsible attitudes towards the importance of quality and reliability 2. To impart knowledge of the design techniques which assist in the achievement of quality

and reliability 3. To install an awareness and understanding of the role of quality and reliability in product

design 4. To promote an awareness of the part played by the concerned in the quality and reliability of

a product.

Outcome of the Course: 1. Can understand process control variables, quality. 2. Clearly identify the functional classes of entities responsible for complying with the

reliability standard. 3. Can organize and manage the quality of products designed or production processes, costs,

customer satisfaction etc., 4. Can apply quality control using statistical tools. 5. Can perform quality optimization, during the design phase of a product or improvement

phase. 6. Can assess the improving reliability of products or production process. 7. Can define and implement a maintenance policy. 8. Can ensure the safety of products or Production processes.

Module I- Introduction and Process Control for Variables: (9 hrs)Introduction, definition of quality, basic concept of quality, definition of SQC, benefits andlimitation of SQC, Quality assurance, Quality cost-Variation in process- factors – process capability– process capability studies and simple problems – Theory of control chart- uses of control chart –Control chart for variables – X chart, R chart and s chart.

Module II - Process Control for Attributes: (9 hrs)Control chart for attributes –control chart for proportion or fraction defectives – p chart and np chart– control chart for defects – C and U charts, State of control and process out of controlidentification in charts.

Module III -Acceptance Sampling: (9 hrs)Lot by lot sampling – types – probability of acceptance in single, double, multiple samplingtechniques – O.C. curves – producer’s Risk and consumer’s Risk. AQL, LTPD, AOQL concepts-standard sampling plans for AQL and LTPD- uses of standard sampling plans.

Module IV- Life Testing – Reliability: (9 hrs)Life testing – Objective – failure data analysis, Mean failure rate, mean time to failure, mean timebetween failure, hazard rate, system reliability, series, parallel and mixed configuration – simpleproblems. Maintainability and availability – simple problems. Acceptance sampling based on


<ED2T3> DESIGN FOR QUALITY AND RELIABILITY L T P C3 0 0 3

reliability test – O.C Curves.

Module V - Quality and Reliability: (9 hrs)Reliability improvements – techniques- use of Pareto analysis – design for reliability – redundancyunit and standby redundancy – failure and survival probability; hazard rate, conditional probabilityand multiplication rules, component and system reliability and its prediction; failure mode and faulttree analysis, reliability testing . Optimization in reliability - Product design – Product analysis –Product development – Product life cycles.

Total Hrs: 45 hrs Reference Books1. GRANT, EUGENE .L“Statistical Quality Control “, McGraw-Hill, 19962. L.S.SRINATH,”Reliability Engineering” Affiliated East west press, 19913. R.C.GUPTA, “Statistical Quality control”, Khanna Publishers, 19974. BESTERFIELD D.H., “Quality Control”, Prentice Hall, 19935. SHARMA S.C., “Inspection Quality Control and Reliability”, Khanna Publishers, 19986. CONNOR, P.D.T.O., “Practical Reliability Engineering”, John Wiley, 19937. Montgomery, D.C., 2005, “Introduction to Statistical Quality Control”, 5th edition, John Wiley &Sons8. Garvin, D.A, 1989, “Managing Quality: Strategic and Competitive Edge”, The Free Press9. Quality Assurance and Total Quality Management ,K C Jain and A K Chitale, -Khanna Publishers10. Statistical Quality Control , M. Mahajan, - Dhanpat Rai & Co. (P) Ltd.11. Quality Control & Application , B. L. Hanson & P. M. Ghare, - Prentice Hall of India12. Total Quality Management , Dale H. Besterfield, Carol Besterfield-Michna, Glen H. Besterfieldand Mary Besterfield-Sacre, - Pearson Educaiton13. Total Quality Management , Dr. S. Kumar, - Laxmi Publication Pvt. Ltd.14. Reliability Engineering , Srinath L. S., - Affiliated East West Press.15. Total Quality Management, K C Arora, - S K Kataria & Sons16. Statistical Quality Control , Eugene L. Grant and Richard S. Leavenworth, - Tata McGraw-HillPublishing Company Ltd.17. Total Quality Management, education(Singapore) Pte. Ltd. Poornima M. Charantimath, Pearson18. Managing for Total Quality,N. Logothetis, - Prentice Hall of India Pvt. Ltd.19. Competitive Manufacturing Management,John M. Nicholas, - Mcgraw Hill20. Managing Quality,Barrie G. Dole, - Blackwell publishing21. TQM – an integrated approach, Samunel K Ho,q - Crest pubslishing House.22. Probability and statistics for Engineers,I. R. Miller, J. E. Freund & R. Johnson, -Prentice Hall ofIndia23. P. A. Tobias and D. C. Trindade, “Applied Reliability,” 3rd Edition, Chapman and Hall/CRC(2011)

Other Books24. W. Q. Meeker and Luis A. Escobar, “Statistical Methods for Reliability Data” Wiley-Interscience (1998)25. W. Nelson, “Applied Life Data Analysis” Wiley, New York, 1982.26. W. Nelson, “Accelerated Testing,” Wiley, New York, 1990.

Links:International Technology Roadmap for SemiconductorsJEDEC


SematechNIST Engineering Statistics Handbook.

Reference Books:1. Weibull, Waloddi, “A Statistical Distribution of Wide Applicability”, Journal of AppliedMechanics, 1951 pp. 293-297.2. P. Nigh, W. Needham, K. M. Butler, P. C. Maxwell, R. C. Aitken, "An Experimental StudyComparing the Relative Effectiveness of Functional Scan, Iddq, and Delay Fault Testing," 15thIEEE VLSI Test Symposium 1997, pp 459-464.


3 1 0 4

Objective:1. Explain the process flow for different microelectronic processes. 2. Describe the processing steps (including the chemical and physical basis,) manufacturing

techniques, measurement techniques, and important output parameters. 3. Use design rules to layout simple circuits and calculate yield.

Outcome of the Course:1. Knowledge of basic limitations of different processes and how these integrate to achieve

final device 2. Working knowledge of basic equations that govern the processes used in fabrication 3. Understanding of fundamental challenges in fabrication techniques4. Able to design integrated silicon based devices’ process steps 5. Understand all silicon fabrication processes, their metrologies and related theory 6. Develop an understanding of the complexities involved in a complete fabrication cycle of

an integrated circuit.

Module I - Fundamentals of Manufacturing (9 hrs)Production systems, automation principles and its strategies; Manufacturing industries; Types ofproduction function in manufacturing.

Module II - Semiconductor technology (9 hrs)Wafer process, NMOS, CMOS technology, acceptable regions, process disturbances,experimental planning and project evaluation. Introduction to physical simulation and TCAD.Basic semiconductor processing steps such as implantation, diffusion, oxidation. Design ofexperiment and wafer split, Process simulation and BJT and CMOS process flow

Module III - Functional Yield Prediction (9 hrs)Yield economics, manufacture and design strategies. Binomial, Poisson yield models, defectdensity, redundancy, Layout defect-sensitivity: Spot defects and their size distributions,Probabilistic analysis, susceptible sites, single-layer critical areas, yield prediction based oncritical area extraction

Module IV - Layout Driven fault analysis (9 hrs)Technology and defect semantics, defect-fault relationship, multiple –layer critical areas, realisticfault extraction

Module V - Virtual Device Simulation (9 hrs)Device physical models. Numerical algorithms and solutions. Device simulation and electricalcharacterization. Device structural and electrical parameters. Visualization of device physicaloperation. Integration Module: Virtual Process Integration Device/process target-variablerelations. Technology optimization through process variation. Device performance optimizationand trade-offs.

Total: 45 hrs

Text Books:


<ED2E3> IC MANUFACTURING L T P C

1. VLSI technology-S.M.Sze2. Streetman,” VLSI Technology”. 3. C.Y. Chang and S.M. Sze (Ed), "ULSI Technology", McGraw-Hill Companies Inc., 1996. 4. S.K.Gandhi, "VLSI fabrication Principles",John Wiley Inc., New York, 1983. 5. Sorab K. Gandhi, “The Theory and Practice of Microelectronics”, John Wiley & Sons

References:1. B.G Streetman, “VLSI Technology” , Prentice Hall, 1990. 2. A.S Grove, “Physics and Technology of semiconductor devices”, John Wiley & Sons, 19673. Flexible Manufacturing Systems in Practice, J Talavage and R.G. Hannam, Marcell Decker 4. Pandley P.S. and shah.N.“Modern Manufacturing Processes”, 1980.5. Marc J. Madou, Fundamentals of Micro fabrication: The Science of Miniaturization,

Second Edition, CRC Press (ISBN: 0 849308267), 2006


3 1 0 4Aim: The course presents and discusses several advanced topics in the field of digital signal processing,with applications in communication and audio and speech processing. The aim is to understand thephenomena underlying the studied techniques and also their implementation in real systems.

Objectives:1. Understand basic trade offs in digital representation of signals.2. Understand why and when to go for Digital Signal Processing.3. Enable students to apply digital signal processing concepts in real world applications.

Outcomes of the course:1. Analyzing discrete time signals in the time domain and frequency domain.2. Apply digital signal processing techniques to analyze discrete time signals and systems3. Design and apply digital filters for a given specification.4. Applying DSP techniques to practical applications

Module – I (9 hrs)Digital Processing of Continuous Signals, Discrete time Signals and Systems, Characterization ofDiscrete LTI Systems, Correlation of Signals and Random Signals.Continuous Time Fourier Transform, Discrete Time Fourier Transform, Fourier Series, DiscreteFourier Transform, Fast Fourier Transform. Z transforms, Calculation of frequency and Phaseresponse.Digital Filters, recursive and non-recursive filters, order and co-efficients of digital filter, stability,transfer function. Realization of IIR and FIR filters, Filter design, Design of Lowpass, Highpass,Bandpass and Bandstop IIR and FIR Filters.

Module – II (9 hrs)Concepts of Multirate Digital Signal Processing, Design of practical sampling rate converters,Implementation of sampling rate converters - decimators, Implementation of interpolators, Samplerate conversion using poly-phase filter structure. Application examples: High quality Analog to Digital conversion for Digital Audio, EfficientDigital to Analog conversion in compact hi-fi systems, Application in the acquisition of High-Quality data, Multirate narrowband digital filtering, High resolution narrowband spectral analysis.

Module – III (9 hrs)Introduction and evolution of Digital Signal Processors, Computer Architecture of DSP – Harvardand Modified Harvard Architecture, VLIW, Super scalar, pipelining, Multiplier and Accumulator(MAC), Special Instructions, On-Chip memory Cache, Special Purpose DSP Hardware, Fixed andFloating point Digital Signal Processors.DSP System Design – Algorithm Development, Selection of DSP Hardware, Software development,Software Development tools.

Module – IV (9 hrs)Case Study of a Fixed Point Digital Signal Processor (TMS320C55xx) – Architecture, overview,On-chip memory, memory mapped registers, Buses, peripherals, addressing modes, Assemblylanguage, Mixed C and Assembly language programming.

Module – V (9 hrs)


<ED2E2> ADVANCED DIGITAL SIGNAL PROCESSINGL T P C

Implementation of Algorithms on Digital Signal Processors (TMS320C55xx): FIR Digital Filtering,IIR Digital Filtering, FFT Processing, Adaptive Filtering. DSP Applications: Adaptive removal ofOcular Artefacts from human EEGs, Equalization of digital audio signals.

Total: 45 hrs

Text books:1. S.K. Mitra, “DIGITAL SIGNAL PROCESSING: A Computer Based Approach”, 4th edition,

Mcgraw-Hill Education, 20132. Emmanuel C. Ifeachor and Barrie W. Jervis, “Digital Signal Processing: A Practical

Approach”, 2nd edition, Prentice Hall, 2001

References:

1. John G. Proakis, Dimitris G Manolakis, “Digital Signal Processing: Principles, Algorithmsand Applications”, 4th edition, Pearson Education, 2007

2. Ashok Ambardar, “Digital Signal Processing: A Modern Introduction, 1st edition, NelsonEngineering, 2007

3. Steven W. Smith, “The Scientist and Engineer's Guide to Digital Signal Processing, 1stedition, California Technical Publication, 1998

4. B. Venkataramani, M. Bhaskar, “Digital Signal Processors: Architecture, Programming andApplications, 2nd edition, Tata Mcgraw-Hill Education Private Limited, 2011.

5. CPU reference guide, Mnemonics and Instruction set reference guide6. NPTEL video lecture on Digital Signal Processing : http://nptel.ac.in/courses/117102060/


3 1 0 4Aim: To learn and understand the fundamentals of mixed signal design using CMOS circuits

Objective:1. To provide students with the theory and design consideration for analog and mixed signal IC

design.2. To cover the basics of Data converters and their architectures in both analog and digital

domains.

Outcome of the Course:1. Upon completion of the course, students will have the skills needed to design an integrated

mixed-signal circuit in CMOS.2. Understanding of fundamental challenges in Mixed Signal Design. 3. Understand the fundamentals of Data Converters – ADCs and DACs

Module I - Introduction to A/D and D/A conversion 10 Hrs

Analog and discrete-time signal processing, introduction to sampling theory, quantization,quantization noise, aliasing and reconstruction filtering. Sample and Hold characteristics, DAC andADC specifications

Module II - Analog and Digital Filters 10 HrsAnalog continuous-time filters: passive and active filters Basics of analog discrete-time filters andZ-transform Switched-capacitor filters, Nonidealities in switched-capacitor filters. Switched-capacitor filter architectures, Switched-capacitor filter applications

Module III - Analog to digital converters (ADC) 8 HrsBasics of data converters. Nyquist rate A/D converters, Successive approximation ADCs, Dual slope ADCs, Flash ADC, Pipeline ADC, Hybrid ADC structures., Two step ADC, Interpolating ADC, Folding ADC, Time Interleaved ADC, High-resolution ADC

Module IV - Digital to analog converters (DAC) 8 HrsNyquist rate D/A converters, Decoder based converters, Binary scaled converters, R-2R ladder networks, Thermometer code converters, Hybrid converters, current steering, charge scaling DACS,pipelined DACs, Oversampling Converters.

Module V - Interconnects and PLL 9 HrsInterconnects and data transmission., Voltage-mode signaling and data transmission., Current-modesignaling and data transmission., Basics of PLL., Analog PLL, Digital PLL, Delay locked loops,PLLs with charge pump, phase comparators, Dynamics of PLL.

Text Books: 1. R. Jacob Baker, “CMOS mixed-signal circuit design”, Wiley India, IEEE press, reprint

2008.2. David A. Johns and Ken Martin, “Analog Integrated Circuit Design”, 2nd edition, Oxford

University Press, 2010.


<ED2E1> MIXED SIGNAL DESIGN L T P C

References:1. Behzad Razavi, “Design of Analog CMOS Integrated Circuit” Tata-Mc GrawHill, 2002.2. Phillip E.Allen Douglas R. Holberg, “CMOS Analog Circuit Design”, Second Edition

Oxford University Press-2003.3. Mikael Gustavsson, J. Jacob Wikner, Nianxiong Nick Tan, “CMOS Data Convertor for

Communications”, First Edition, Springer-2010


3 1 0 4Aim:To understand different electromagnetic Interference problems occurring in Intersystem and in intersystem and their possible mitigation techniques in Electronic design

Objective:To understand the principles for manufacturability and Factors influencing design, form factor,CAD tools to be used for modeling. To learn and use the sheet metal fabrication, vacuum formingand rapid prototyping in product design.

Outcome of the Course:Student will learn about all aspects of manufacturing. Specific topics include computer-aideddrafting and solids modeling, materials and processes, machining, plastics and composites,production methods and supervision, and rapid prototyping.

Module I - Introduction General design principles for manufacturability , Factors influencing design, Systematic workingplan for the designer, Types of problems to be solved-Possible solutions, Evaluation method,Process capability , Feature tolerances , Geometric tolerances , Assembly limits, Datum features ,Tolerance stacks, Interchangeable part manufacture and selective assembly.

Module II - Factors Influencing Form DesignMaterials choice - Influence of basic design, mechanical loading, material, production method, size and weight on form design- form design of welded members and forgings.

Module III - CAD DesignsDefinition of CAD Tools, Types of system, CAD/CAM system evaluation Criteria, Graphicsstandards, functional areas of CAD, Modeling and viewing, software documentation, efficient useof CAD software. Wire frame modeling -Types of mathematical representation of curves, wireframe models, wire frame entities, parametric representation of synthetic curves – Hermite cubicsplines, Bezier curves, B-Splines, rational curves – NURBS.

Module IV: Sheet Metal FabricationSheet Metal Fitting Layout & Design, bending, bending angle, Sheet Metal Fitting Fabrication,Sheet Metal Drafting & Blueprint Reading, Sheet Metal Welding, Sheet Metal Practical ProblemSolving, surface finishes, Powder coating.

Module V - Vacuum Forming Introduction to Thermoforming, General Forming Concepts, Vacuum Forming process, creating a thermoformed model using vacuum forming.

Module VI - Rapid PrototypingRapid Product Development (RPD), Product Development Cycle, Detail design, Prototype andtooling. RAPID PROTOTYPING (RP): Principle of RP technologies and their classification of RPsystems–Stereo lithography systems – Selection of RP process; Issues in RP ; Emerging trends–Direct Metal Laser Sintering (DMLS) system – Principle – process parameters – process details –Applications.


<ourse Code> MANUFACTURING ENGINEERING L T P C

Total: 45 hrs

Text books:1. Bralla, “Design for Manufacture Handbook”, McGraw hill, 1999.2. Boothroyd, G, Heartz and Nike, “Product Design for Manufacture”, Marcel Dekker, 1994.3. Marciniak,Z., Duncan J.L., Hu S.J., ‘Mechanics of Sheet Metal Forming’, Butterworth-

Heinemann An Imprint of Elesevier, 20064. Llbrahim Zeid “CAD/CAM Theory and Practice”, Mc Graw Hill international5. Chua Chee Kai and Leong Kah Fai, 1997, “Rapid Protoyping: Principles and Applications

in Manufacturing”, John Wiley AND Sons6. Martin Helander, A guide to the ergonomics of manufacturing, East West press, 1996

References:1. Boothroyd, G, “Design for Assembly Automation and Product Design”, New York, Marcel

Dekker, 1980.2. Bralla, “Design for Manufacture Handbook”, McGraw hill, 1999.3. Boothroyd, G, Heartz and Nike, “Product Design for Manufacture”, Marcel Dekker, 1994.4. Kevien Otto and Kristin Wood, “Product Design”, Pearson Publication, 2004.5. Dr.ING.Robert Matouslk, “Engineering Design”.Blackie & son limited, 1962.6. Harry peck, “Designing for Manufacture”,Pitman publishing.7. D.E. Walsh, “Do It Yourself Vacuum Forming for the Hobbyist, Workshop Publishing”, Lake

Orion, MI, 20028. P.N.Rao , “CAD/CAM”, TMH. 9. Paul F. Jacobs, 1996, “Stereo-lithography and other RP & M Technologies”: from Rapid

Prototyping to Rapid Tooling, SME/ASME10. D. Faux and M. J. Pratt, 1979, “Computational Geometry for Design and Manufacture”,

John Wiley and Sons11. Pham, D.T. & Dimov.S.S., “Rapid manufacturing”, Springer-Verlag, London, 2001.12. Altan T., Metal forming – Fundamentals and applications – American Society of Metals, Metals

park, 2003.13. E.J. McCormic, Human factors in engineering design, McGraw Hill 1976


L T P C0 0 4 2

Lab Experiments

1. Requirement analysis

2. Creative Sketch model construction

3. Mechanical modeling

a. Solid state modeling

b. Plastic modeling

4. Plastic modeling with 3D printer

5. CAD design

6. Electronics Prototyping

7. Testing of a Prototype

List of Equipments and Components

Equipment/Component Name Quantity

Clay modeling tools 10

CAD/CAM Tools 20

Electronic Prototyping tools 10

3D Printer 2

Electronic Prototyping Micro-controller Boards 10


<ED2L1> PRODUCT DESIGN PRACTICE & PROTOTYPING LAB

SEMESTER III & IV

SLNo.

COURSECODE


PROJECT WORK

1. PROJECT WORK and SEMINAR 0 0 20 20

TOTAL : 20 CREDITS


Documents

M.Tech ELECTRONICS DESIGN and TECHNOLOGY Syllabus · Feedback and opamp compensation, Slew rate, Power supply rejection, Op-amp Noise. Module IV – Advanced Current Mirrors and OP-AMPS