NeSSI*: Shiftin’ Gears“Moving to the Project Stage”

CPAC - Seattle, WA - May 6, 2002

Rob Dubois - Peter van Vuuren - Jim Tatera .

CPC

“the best way to predict the future is to create it”

Tatera and Associates

*New Sampling/Sensor Initiative

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Presentation Outline

Summary of NeSSI Objectives & Drivers Activities Update [Quick] Gen I, II, III Comparison Project Plans Progress Rating of Gen II Elements Installs & Late Breaking Developments Summary and Acknowledgements

Courtesy of Owen Beattie,

University of Alberta, Canada

Question:

Is Process Analytical frozen in time?

Answer:

No! A renaissance is in progress.

John Torrington Chief Petty Officer on the HMS Terror - preserved in the permafrost. Victim of lead poisoning.

”The Franklin Expedition” d. 1846 (age 20)

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NeSSI Structure

An ad hoc global industry initiative, formed in June, 2000 to drive permanent change in how we do Process Analysis. NeSSI mail-out has now grown to 300+

subscribersRepresents over 31 End Users from Oil and

Petrochemical as wells as Manufacturing Companies, Academia, National Labs, etc.

Center for Process Analytical Chemistry (CPAC) is our sponsor and legal umbrella

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NeSSI Objectives

Facilitate the acceptance/implementation of... modular, miniature & smart process

analytical technology Promote the concept of...

at the pipe/field-mounted (“byline”) analytical systems

Lay the groundwork for... open connectivity communication architecture

Provide a technology bridge to the process for... “sensor/lab-on-a-chip” microanalytical devices

6* Posted on CPAC website

Activities Update

Activities since Fall CPAC, 2001 Tutorial - INTERMAC November, 2001 [Tokyo] Plenary Paper, Session & Roundtable - IFPAC Jan2002 [San

Diego]* Talk - IEC SC65D Maintenance Mtg, Feb. 2002 [Frankfurt] “UMIX” & Workshop Pittcon March, 2002 [New Orleans]* Talk: IEC SC65D Full Committee Mtg, April, 2002 [Beijing] Tutorial & Session - ISA Analytical Div. April, 2002 [Denver] X-team (hazardous area focus group) activities completed NeSSI Marketing Survey - Included in AD newsletter

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NeSSI Generation Segmentation Pyramid

Gen III

Gen II

Gen IMechanical (mostly)

Electrical/Smart (Diagnostic)

MicroAnalytical & WirelessValue

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Gen I - Mechanicalminiature, modular footprint

Adapted from the semicon industry

LEGO® like designISA SP76 Standard

Courtesy of Swagelok

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Gen II SystemPlug and Play Electrical

Programmable Substrate Heater

VP

A

F

Ethernet LAN

Analyzer

Controller or PC

SAM

CANbus

PDA

Auxiliary Heating/Cooling

SubstrateT

T

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Gen III SystemPlug & Play Analytical

SAM

Fiber Optic

AT

One sensorper component“lab on a chip”

One Sensor and Multiple Analytes

Ethernet LANEnabling Technology

for Analytical

VTA

A

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Gen III Plug & Play Wireless Signal

Ethernet LAN

VTP

A

Bluetooth , 802.11 Wi-Fi Power Supplied by...

X-proof MINI bus ...or IS miniature power bus

P.S.

SAM

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Gen I Installs & Tests in progress...

Coutesy of a

gulf coast

petrochemical facility

Courtesy of an east coast petrochemical facility

and Parker-Hannifin

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Gen II Development CampaignLead - Honeywell Labs/Ulrich Bonne

1. Finalize NeSSI Gen II spec2. Fabricate an alpha unit. Lab

evaluate. 3. Fabricate 10-20 beta units. Field

tests years 20044. 2005 Commercial Product available

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Gen II DevelopmentInvolvement and Funding

$1-2M funding request to DoE-OIT Submit White Paper (June 2002)

50% of funding to be borne by “prototype testers” as “work in kind” commitment of $50K/participant ExxonMobil Chemical, Air Products,

ChevronTexaco, Honeywell, Dow We would like 10-20 participants!

Possibly other funding sources (eg ATP)

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Generation II DimensionsProgress to Date...

1. Programmable Substrate2. mini-Sensors3. “Combi” Valve

4. SAM - Sensor/Actuator Manager 5. PC/PDA with HMI* [Wireless]6. Multi-Drop IS Bus7. Micro Climate Enclosure

* HMI = Human Machine Interface

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1. Programmable substrate temp.IEC Ex d Div/Zone 1 Haz. Locations

AC PowerAC Power

Purpose

Maintain the substrate/sample at the appropriate temperature to maintain dewpoint and optimize & simplify sample heating. Improve reliability, minimize utility load and reduce LTCO.

Strengths

Available from certain “solid block” substrate mfgs.

Commercial technology avail.

Weaknesses

Difficult to implement in substrate suspended designs

No IS version of control portion4/10

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2. mini-SensorsIEC Ex ia (low power) Haz. Location

FLOW

PRESSURE

TEMP

Substrate

A/D

Comm.

µP

Mem

ory

A

4/10

PurposeProvides measurements for validation and control. Simplify andstandardize. Lower cost implementation. Increase reliability by increased vigilance of the system and reduce maintenance by predictive as opposed to preventive maintenance.

StrengthsExcellent results from Honeywell - thisappears to be the genesis of process readymini instrumentation suitable for use in hazardous locations. Suspect wide applicability in industry as well as analytical. Enables plug and play with extremely low power.

WeaknessesCurrently untried in industry. We need toknow the operating characteristics such asrange, accuracy, robustness, etc.

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Smart

T-Comp.

TC Sensor

Smart

T-Comp

Flow Sensor

17 mm

Smart

T-Comp

Flow Sensor

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3. “COMBI” ValveIEC Ex ia Low Power Haz. Location

A

Actuator

Instrument Air

Valve

Vent

Vent

Comm.

D/A

Solenoid

Pneumatic valve

3/10

Purpose

On/off and/or modulation of sample and validation fluids. Combining a pneumatic valve and solenoid in one package simplifies design. Low power gives plug and play & multi-drop capabilities. Safe design reduces maintenance.

Strengths

Some commercial products for the pilot valve are available. C/w haz. certifications and very low (1.45 mA) power drain.

Weaknesses

No one has integrated this product into a 1.5” substrate.

No modulation product.

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4. Sensor/Actuator ManagerEx d microPC c/w CE operating system

Gateway to an

Ethernet LAN

Host to a

Sensor/Actuator Bus

Wireless Field

Interface to HMI

Software Applets “Open” Development Space

3/10

PurposeStandardizes repetitiveoperating tasks and providesnetworking hardware.

StrengthsSimplify maintenance across all platforms. Reduces design engineering.

Weaknesses- Competes with some product offerings of existing analytical mfgs.- No standards for applets - foundation like organization req. for over-sight. - Cost and size must be minimized. Remains to be seen if this can be accomplished.

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5. Graphical HMI*Intrinsically Safe Field PC/PDA

PDA/PC

HMI

VTP

A

* HMI = Human Machine Interface

Purpose

Allows field adjustment and interrogation of an analytical system. (mimics remote PC)

Simplifies and uncomplicates maintenance by standardizing interface.

Strengths

Commercial Intrinsically Safe PC’s, PDA’s available. One unit may service many field devices.

Weaknesses

Haven’t set whether IrDA, Bluetooth or Wi-Fi wireless.

Need standard way to do HMI software. Oversight needed.

SAM

5/10

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6. Serial Multi-drop BusEx ia Intrinsically Safe

VTP

A

CANbus

Purpose

Simplify maintenance. Vendors can sell their product with “value added” software applets on board their devices. Plug and Play with no gas test.

Strengths

Many existing multi-drop buses and software. DeviceNet has critical mass in the industry for a bit bus. Low cost.

Weaknesses

Confusion and lack of thrust on identifying an IS product (and cost) to do this properly.

2/10

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7. MicroClimate Enclosure

Div/Zone 1GP. A-D, T4

PurposeProvides a practical temperature controlled microenvironment tohandle sampling and analyticalequipment in varied climatic conditions “in the field”. Simplifies design.

StrengthsAll technology available to implement.Simplifies design by standardizing onan area classification inside the enclosure which accounts for any hazardous fluid leakage.

WeaknessesCooling not addressed at this time.

6/10

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Announced at Pittcon...

Courtesy of Applied Analytics (also Wilks)

MIR ATR

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The Race to the PipeWhat will it be? An In-ey or Out-ey? Suggest both...

“Like a thermocouple”

[in situ - inline]

In-ey

“Like a pressure transmitter”

[ex situ - byline]

Out-ey

Analytical sensor (typ.)

tx

tx

SS

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AcknowledgementsEnd Users

Dow Danny Quevillon Reg Hartwig Bac Vu (SP76) Craig Snook Walter Henslee

Air Products Frank Schweighardt

ChevronTexaco D. Nettles/D. Young

ExxonMobil Chemical Dan Podkulski (SP76) Jeff Gunnell John Cumbus Rajko Puzic Kelley Bell

Honeywell Kenneth Creasy John Mosher Ulrich Bonne Bob Nickels

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Summary...

Gen I products achieving traction in industry

Rapidly moving from the definition stage to the project stage on Gen II

Some technical opportunities...White Paper to be submitted to DoELooking for (more) “beta” Partners