North America Environmental, Health, and Safety (EHS ... EHS report April 2014.pdf · North America Environmental, Health, and Safety (EHS) Committee ... North America Environmental,

North America Environmental, Health, and Safety (EHS) Committee

April 2014

Outline

• Leadership• Organization Chart• Meeting Information• Ballot Results• Upcoming Ballots• Subcommittee & Task Force Reports• Upcoming Meeting Schedule

Task Force and Leadership Changes

• Task Force Changes– S2 Fail-Safe Fault-Tolerant TF has been disbanded.

• While there is value in refining definitions for “fail-safe” and “fault-tolerant,” the TF found that such an effort would likely create more problems (e.g., impact on energetics) than solution. Hence, the TF has disbanded.

• Leadership Changes– Fire Protection TF

• New TF co-leader: Eric Sklar (Safety Guru, LLC) – Existing TF leader: Matt Wyman (Koetter Fire Protection)

Organization Chart

Manufacturing Equipment Safety

Subcommittee (MESSC)

North America Environmental, Health, and Safety Committee

S2/Machinery Directive Mapping TF

S2 Chemical Exposure TF

Ergonomics (S8) TF

Fire Protection (S14) TF

S2 Interlock Reliability TFLifting Equipment TF

(Inactive)

S6 Revision TF

S22 TF

S2 Non-Ionizing Radiation TF

S2 Ladders & Steps TF

Fail-Safe / Fault-Tolerant TF

Hazardous Energy Control Isolation Devices TF

Seismic Liaison TF

S1 Revision TF

S10 TF

Disbanded

S7 Revision TF

Meeting Information

• Last Meeting:– April 3 at NA Standards Spring 2014 Meetings

San Jose, California (SEMI Headquarters)

• Next Meeting:– July 10 at SEMICON West 2014

San Francisco, California (SF Marriott Marquis Hotel)

Committee ActivitiesDocument Review Summary – NA Spring 2014 Meetings

• No ballots reviewed

Committee ActivitiesBallots to be reviewed at SEMICON West 2014 [1/3]

* Cycle 3 or 4, 2014 *

Doc # Description TF / SC

4316K Line Item Revisions to SEMI S2, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment, and SEMI S22, Safety Guideline for the Electrical Design of Semiconductor Manufacturing EquipmentDelayed revision related to Programmable Safety Circuits

S22 TF

5625 Line Item Revisions to SEMI S2, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing EquipmentDelayed revisions related to non-ionizing radiation

S2 Non-ionizingRadiation TF

5649A Delayed Line Item Revisions to SEMI S22, Safety Guideline for the Electrical Design of Semiconductor Manufacturing EquipmentAlignment with IEC 60204-33 and provide the additional flexibility that is allowed in that document

S22 TF


* Cycle 3 or 4, 2014 *


4449E Line Item Revisions to SEMI S2, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing EquipmentDelayed revision related to Work at Elevated Locations and Design Criteria for Platforms, Steps, and Ladders

S2 Ladders & Steps TF

4683C Line Item Revisions to SEMI S2, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment Delayed Revisions Related to Chemical Exposure Criteria

S2 Chemical Exposure TF

5009C Line Item Revisions to SEMI S8, Safety Guidelines for Ergonomics Engineering of Semiconductor Manufacturing EquipmentDelayed Revisions on Multiple Topics

S8 Ergonomics TF


* Cycle 3 or 4, 2014 *


5591 Line Item Revisions to SEMI S2, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing EquipmentDelayed revision related to Fire Protection

Fire Protection TF

TBA* Line Item Revisions to SEMI S10, Safety Guideline for Risk Assessment and Risk Evaluation Process

S8 Ergonomics TF

* TBA – to be assigned

Committee ActivitiesBallots expected to be reviewed at the NA Spring 2015 Meetings

* Cycle 8, 2014 *


TBA* Reapproval of SEMI S5-0310, Safety Guideline for Sizing and Identifying Flow Limiting Devices for Gas Cylinder Valves

NA EHS Committee(5-Year Review)

TBA* Reapproval of SEMI S27-0310, Safety Guideline for the Contents of Environmental, Safety, and Health (ESH) Evaluation Reports

NA EHS Committee(5-Year Review)


NOTE: Reapproval ballots for SEMI S5 and S27 will be submitted for voting for the first available cycle after the NA Standards Fall 2014 meetings.

Committee ActivitiesNew SNARF

• New SNARF– [#TBA] Revision to SEMI S10, Safety Guideline for Risk

Assessment and Risk Evaluation Process• Line items changes to SEMI S10 to solve some clarification

issues and update to latest standards (ISO 12100).• This revision will not affect the Risk Ranking tables of

Appendix 1. These will be done as a separate effort.


Committee ActivitiesSubcommittee & Task Force Updates [1/10]

• MESSC (Manufacturing Equipment Safety Subcommittee)

– SEMATECH presented updates on “Energetics in Semiconductor Processing – Best Known Methods and Standardization”

• SEMATECH teleconferences will be scheduled with materials and equipment suppliers to continue gathering feedback on the BKM

– Teleconferences are open to all SEMI EHS Standards TC members– These meetings will also help formulate a TFOF for presentation to the GCS

for approval (June timeframe)» If this can be done, a TF meeting at West

– Obsolete Standards listing in OSHA website• https://www.osha.gov/SLTC/semiconductors/index.html• Obsolete revisions of most standards are shown• SEMI Staff to communicate with OSHA to remove publication dates

and a sentence with link to www.semi.org– Also suggestion to include how our documents are created and used:

industry consensus

BKM – best known method, OSHA – Occupational Safety & Health Administration


• S1 Revision TF– [#5623] Revision to SEMI S1, Safety Guideline for

Equipment Safety Labels• Continuing ballot development. This includes addressing the

negative and comments received during the S1 reapprovalballot [#5521]

• TF is requesting guidance from SEMI on how to handle copyrighted figures, tables, and other content used in S1 during the revision process

• TF plans to submit document 5623 for Cycle 5, 2014 voting period.


• S2 to Machinery Directive Mapping TF– The TF has completed its initial mapping of SEMI S2 to

the Machinery Directive (2006/42/EC) Essential Health and Safety Requirements.

– The TF plans to publish its work as an auxiliary document.

– Prior to the publication of the auxiliary document, however, the TF would first like to request global EHS committee members to review and provide comments.

• A formal request for EHS committee member feedback will be sent out as soon as possible.


• S2 Chemical Exposure TF– Continuing development of ballot 4683C (S2

revisions related to chemical exposure)– Other discussions

• More explanation of surrogate testing• Defining “representative” testing conditions


• Hazardous Energy Control Isolation Devices TF– Previously raised LOTO concerns:

• Remote LOTO Challenges – OSHA’s Control of Hazardous Energy does not allow the use of Remote LOTO devices

(remote LOTO = low voltage control circuit isolation) unless it meets the minor service exemptions and the alternate LOTO methods via ANSI Z244.1. What if used not just for minor service but for all potential LOTO.

» Human foreseeable misuse error rate versus the safety circuit failure rate?? • SEMI S2, § 17 (Hazardous Energy Isolation)

– Additional Gaps in SEMI S2 for Chemical LOTO• SEMI S2, § 11 (Interlocks)

– Safety Interlocks: should SEMI S2 specify the need for safety interlock for pressurized chemical/gas access doors?

– Next steps• Edit proposed changes to SEMI S2 Section 17 • Transfer Collaboration with Other Industry Standards Organizations to the

ICRC (e.g. RIA, ANSI, others?)

LOTO – lockout/tagout


• Fire Protection TF– Doc 5591 proposed to be balloted in Cycle 3

• Line Item Changes to S2, specifically to: 14.4.4.4, 14.4.4.5, 14.4.5.5, 14.4.5.14

• To be balloted as a delayed revision

– Work plans• Address Negatives from Document #5590 (S14 Re-Approval)• Address Negatives from Document #4495B (Alignment of S14

with S10 Likelihood & Risk Tables)• Tiered Approach for Fire Risk Assessment between S2 and S14.• Future Ballots on Changes derived from responses to re-approval

ballot


• S6 Revision TF– Based on ballot results: Realistic worst case release

scenarios and release rate calculations• TF evenly divided so decision made to look at design

requirements that could be used reduce risk factors possibly leading to testing at a lower release rate for S6 validation.

• Design criteria could be incorporated as line items, appendix or RI that would identify controls and risk reduction factors

– Other discussions• PDCB use and low TLV chemistry• Gas detector approval/listing requirement


• S22 Revision TF– Additional details of upcoming S2/S22 revision

ballots• Allow disconnect timing method for grounding• Modify UPS output disconnect requirements• Modify the FECS criteria

– Other TF discussion• Arc flash

UPS – Uninterruptible Power Supply | FECS – Fail-to-Safe Equipment Control Systems


• S23 Revision TF– Small modification proposal to clarify “energy efficiency

improvement” idea• Idea proposed by NA TF side at Fall 2013 meetings. • Text drafted by TF NA co-leader (Crane) March 2014.• Draft text reviewed, modified and supported by TF Japan co-leader

(Hoshi) March 2014. • Draft reviewed, modified, and supported by NA TF group April 1,

2014.• NA Draft text sent to Japan side of TF April 2, 2014 with a request to

ballot as soon as possible. • NA TF plans to support JA TF with ballot proposal.

– Temperature Control Unit (TCU) Related Information (RI) activity on hold pending volunteer resources


• NA Seismic Liaison TF– At the NA Spring 2014 meeting, there were new questions of how and

whether to set a standard appropriately for our industry, roughly summarized as follows:

1) Is there a clear problem statement being “solved” by revising section 19? 2) Should S2 have stricter criteria as a general mater of “improved standard of care”?3) Should S2 contain the strictest criteria (e.g., perhaps based on Taiwan building code)

for all typical production locations?4) Should S2 have a means of deviation or alternate values if equipment will be sold into

more benign regions only, or if the customer accepts such equipment?5) Seismic load force criteria are based not only on installation location, but also on

equipment design characteristics and the placement in buildings. Should any deviations be allowed for these potential variations?

– What appeared to have been general support for the Japan TF plans, has now reverted to some fundamental questions.

– NA TF would like Japan TF to delay balloting while these questions are considered further.

NA EHS Request to Japan EHS

• NA EHS Committee requests the Japan EHS Committee to delay submission of their ballot to change section 19 (Seismic issues) of SEMI S2 to at least after SEMICON West.

• Questions and concerns raised, documented in the NA Seismic Liaison TF report, will still need to be discussed and agreed upon by the NA Liaison TF.

• Discussion from NA EHS TC Chapter meeting:– NA concerns, not only with regard to aligning the force figures with current

industry values, but also on equations used to arrive at these force figures.– NA Seismic Liaison TF is there to assist Japan TF with discussing these issues

now rather than the Document to get rejected during ballot time.– NA EHS Committee request to delay is simply for more time to review

concerns.– It is unclear whether proposed ballot contains the most stringent

requirements (e.g., requirements used in Taiwan).– Concern seems to come from the reasoning for why these numbers are being

changed.

NA EHS Meeting ScheduleSEMICON West 2014 Meetings [DRAFT]

• Monday, July 7– S22 (Electrical Safety) TF (9:00 AM to 10:30 AM)– Hazardous Energy Control Isolation Devices TF (10:30 AM to 12:00 Noon)– S2 Non-Ionizing Radiation TF (1:00 PM to 2:00 PM)– S2 Chemical Exposure TF (2:00 PM to 3:30 PM)– S6 Revision TF (3:30 PM to 5:00 PM)– NA Seismic Liaison TF (5:00 PM to 6:00 PM)

• Tuesday, July 8– Fire Protection TF (9:00 AM to 10:30 Noon)– S10 TF (10:30 AM to 12:00 Noon)– S7 Revision TF (1:00 PM to 2:00 PM)– S1 Revision TF (2:00 PM to 3:30 PM)– S8 Ergonomics TF (3:30 PM to 5:00 PM)– S23 Revision Japan TF (5:00 PM to 6:00 PM)

• Wednesday, July 9– [ICRC (8:00 AM to 11:00 AM)]– EHS Leadership Meeting (11:00 AM to 12:00 Noon)– S2 Machinery Directive Mapping TF (1:00 PM to 2:00 PM) – Manufacturing Equipment Safety Subcommittee [MESSC] (2:00 PM to 4:00 PM)– S2 Ladders & Steps TF (4:00 PM to 5:30 PM)

• Thursday, July 10– EHS Committee (9:00 AM to 6:00 PM)

San Francisco Marriott Marquis

Hotel

NA Standards Meetings atSEMICON West 2014 (July 6-10)

Sunday Monday Tuesday Wednesday Thursday Friday Saturday

6 7 8 9 10 11 12

MEMS/NEMS

Traceability

EH&S

Facilities & Gases

Information & Control

Physical Interfaces & Carriers

Metrics

NARSC

PV/PV Materials

HB-LED

Silicon Wafer

3DS-IC

Liquid Chemicals

Microlithography

Scheduleat-a-glance

San Francisco Marriott Marquis

Hotel

Thank You!

For more information or participate in any NA EHS activities, please contact Paul Trio at SEMI ([email protected])

Documents

North America Environmental, Health, and Safety (EHS ... EHS report April 2014.pdf · North America Environmental, Health, and Safety (EHS) Committee ... North America Environmental,