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Printed in KoreaP/NO : MFL68646501(1502-REV00)
CHASSIS : LA57H
MODEL : 32LF5600 32LF5600-UBCAUTIONBEFORE SERVICING THE CHASSIS,READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
LED TVSERVICE MANUAL
North/Latin America http://aic.lgservice.comEurope/Africa http://eic.lgservice.comAsia/Oceania http://biz.lgservice.com
Internal Use Only
- 2 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.Only for training and service purposes
CONTENTS
CONTENTS .............................................................................................. 2
PRODUCT SAFETY ................................................................................. 3
SPECIFICATION ....................................................................................... 4
ADJUSTMENT INSTRUCTION .............................................................. 10
TROUBLE SHOOTING ............................................................................16
BLOCK DIAGRAM .................................................................................. 22
EXPLODED VIEW .................................................................................. 23
SCHEMATIC CIRCUIT DIAGRAM ............................................APPENDIX
- 3 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.Only for training and service purposes
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and Exploded View.It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the servicing of a receiver whose chassis is not isolated from the AC power line. Use a transformer of adequate power rating as this protects the technician from accidents resulting in personal injury from electrical shocks.
It will also protect the receiver and it's components from being damaged by accidental shorts of the circuitry that may be inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown, replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor, over 1 W), keep the resistor 10 mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed metallic parts of the cabinet, such as antennas, terminals, etc., to be sure the set is safe to operate without damage of electrical shock.
Leakage Current Cold Check(Antenna Cold Check)With the instrument AC plug removed from AC source, connect an electrical jumper across the two AC plug prongs. Place the AC switch in the on position, connect one lead of ohm-meter to the AC plug prongs tied together and touch other ohm-meter lead in turn to each exposed metallic parts such as antenna terminals, phone jacks, etc. If the exposed metallic part has a return path to the chassis, the measured resistance should be between 1 MΩ and 5.2 MΩ. When the exposed metal has no return path to the chassis the reading must be infinite.An other abnormality exists that must be corrected before the receiver is returned to the customer.
Leakage Current Hot Check (See below Figure) Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check. Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor between a known good earth ground (Water Pipe, Conduit, etc.) and the exposed metallic parts.Measure the AC voltage across the resistor using AC voltmeter with 1000 ohms/volt or more sensitivity.Reverse plug the AC cord into the AC outlet and repeat AC voltage measurements for each exposed metallic part. Any voltage measured must not exceed 0.75 volt RMS which is corresponds to 0.5 mA.In case any measurement is out of the limits specified, there is possibility of shock hazard and the set must be checked and repaired before it is returned to the customer.
Leakage Current Hot Check circuit
IMPORTANT SAFETY NOTICE
SAFETY PRECAUTIONS
- 4 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.Only for training and service purposes
SERVICING PRECAUTIONSCAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the SAFETY PRECAUTIONS on page 3 of this publication.NOTE: If unforeseen circumstances create conflict between the following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First.
General Servicing Precautions1. Always unplug the receiver AC power cord from the AC power
source before;a. Removing or reinstalling any component, circuit board mod-
ule or any other receiver assembly.b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explo-sion hazard.
2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe.Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its assemblies.
4. Unless specified otherwise in this service manual, clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable non-abrasive applicator; 10 % (by volume) Acetone and 90 % (by volume) isopropyl alcohol (90 % - 99 % strength)CAUTION: This is a flammable mixture.Unless specified otherwise in this service manual, lubrication of contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed.
7. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead.Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in this service manual.CAUTION: Do not connect the test fixture ground strap to any heat sink in this receiver.
Electrostatically Sensitive (ES) DevicesSome semiconductor (solid-state) devices can be damaged eas-ily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor “chip” components. The following techniques should be used to help reduce the incidence of component dam-age caused by static by static electricity.1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alter-natively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent poten-tial shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or expo-sure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static type solder removal device. Some solder removal devices not classified as “anti-static” can generate electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electri-cally shorted together by conductive foam, aluminum foil or comparable conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed.CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replace-ment ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity suf-ficient to damage an ES device.)
General Soldering Guidelines1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the range or 500 °F to 600 °F.
2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.4. Thoroughly clean the surfaces to be soldered. Use a mall wire-
bristle (0.5 inch, or 1.25 cm) brush with a metal handle.Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering techniquea. Allow the soldering iron tip to reach normal temperature.
(500 °F to 600 °F)b. Heat the component lead until the solder melts.c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.CAUTION: Work quickly to avoid overheating the circuit board printed foil.
6. Use the following soldering technique.a. Allow the soldering iron tip to reach a normal temperature
(500 °F to 600 °F)b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there only until the solder flows onto and around both the compo-nent lead and the foil.CAUTION: Work quickly to avoid overheating the circuit board printed foil.
d. Closely inspect the solder area and remove any excess or splashed solder with a small wire-bristle brush.
- 5 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.Only for training and service purposes
IC Remove/ReplacementSome chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent flat against the cir-cuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above.
Removal1. Desolder and straighten each IC lead in one operation by
gently prying up on the lead with the soldering iron tip as the solder melts.
2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC.
Replacement1. Carefully insert the replacement IC in the circuit board.2. Carefully bend each IC lead against the circuit foil pad and
solder it.3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete TransistorRemoval/Replacement1. Remove the defective transistor by clipping its leads as close
as possible to the component body.2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.3. Bend into a "U" shape the replacement transistor leads.4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection.
Power Output, Transistor DeviceRemoval/Replacement1. Heat and remove all solder from around the transistor leads.2. Remove the heat sink mounting screw (if so equipped).3. Carefully remove the transistor from the heat sink of the circuit
board.4. Insert new transistor in the circuit board.5. Solder each transistor lead, and clip off excess lead.6. Replace heat sink.
Diode Removal/Replacement1. Remove defective diode by clipping its leads as close as pos-
sible to diode body.2. Bend the two remaining leads perpendicular y to the circuit
board.3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.4. Securely crimp each connection and solder it.5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder.
Fuse and Conventional ResistorRemoval/Replacement1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.
Circuit Board Foil RepairExcessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered.
At IC ConnectionsTo repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connec-tions).
1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.
At Other ConnectionsUse the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board.
1. Remove the defective copper pattern with a sharp knife.Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly con-nected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side.Carefully crimp and solder the connections.CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.
- 6 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.Only for training and service purposes
SPECIFICATIONNOTE : Specifications and others are subject to change without notice for improvement.
1. Application rangeThis spec sheet is applied LED TV with LA57H chassis
2. Test conditionEach part is tested as below without special notice.
1) Temperature : 25 ºC ± 5 ºC(77 ± 9 ºF) , CST : 40 ºC±5 ºC2) Relative Humidity: 65 % ± 10 %3) Power Voltage
Market Input voltage Frequency Remark
USA 100~240V 50/60Hz Standard Voltage of each product is marked by models
4) Specification and performance of each parts are followed each drawing and specification by part number in accordance with BOM
5) The receiver must be operated for about 20 minutes prior to the adjustment
3. Test method1) Performance: LGE TV test method followed 2) Demanded other specification
Safety : UL, CSA, IEC specificationEMC: FCC, ICES, IEC specification
- 7 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.Only for training and service purposes
4. General SpecificationNo Item Specification Result Remark
1. Receiving System ATSC / NTSC-M / 64 & 256 QAM
2. Available Channel 1) VHF : 02~132) UHF : 14~693) DTV : 02-694) CATV : 01~1355) CADTV : 01~135
3. Input Voltage AC 100 ~ 240V 50/60Hz Mark : 110V, 60Hz (N.America)
4. Market NORTH AMERICA
5. Screen Size 32/42/43/49/55 inch Wide (1920 × 1080)
FHD / 60Hz 32LF5600-Ux42LF5500-Ux42LF5600-Ux43LF5400-Ux49LF5500-Ux49LF5400-Ux55LF5500-Ux
32 inch Wide (1366 × 768) HD / 60Hz 32LF560B-Ux
6. Aspect Ratio 16:9
7. Tuning System FS
8. Module Direct LC320DXE-MGA3 LGD HD / 60Hz 32LF560B-Ux
HC320DXN-ABHS3 BOE HD / 60Hz 32LF560B-Ux
LC320DUE-MGA3 LGD FHD / 60Hz 32LF5600-Ux
NC320DUN-VBBP3 BOE FHD / 60Hz 32LF5600-Ux
LC420DUE-MGA3 LGD FHD / 60Hz 42LF5600-Ux
NC420DUN-VUBP5 AUO FHD / 60Hz 42LF5600-Ux
LC420DUE-MGA6 LGD FHD / 60Hz 42LF5500-Ux
NC420DUN-VUBP8 AUO FHD / 60Hz 42LF5500-Ux
LC490DUE-MGA6 LGD FHD / 60Hz 49LF5500-Ux
LC550DUE-MGA6 LGD FHD / 60Hz 55LF5500-Ux
NC430EUN-AACR1 LGD FHD / 60Hz 43LF5400-Ux
NC490EUN-AACR1 LGD FHD / 60Hz 49LF5400-Ux
9. Operating Environment 1) Temp : 0 ~ 40 deg2) Humidity : ~ 80 %
10. Storage Environment 1) Temp : -20 ~ 60 deg2) Humidity : ~ 85 %
- 8 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.Only for training and service purposes
5. Supported video resolutions5.1. Component input(Y, CB/PB, CR/PR)
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed
1 720*480 15.73 59.94 13.50 SDTV ,DVD 480I
2 720*480 15.73 60.00 13.5135 SDTV ,DVD 480I
3 720*480 31.47 59.94 27.00 SDTV 480P
4 720*480 31.50 60.00 27.027 SDTV 480P
5 1280*720 44.96 59.94 74.176 HDTV 720P
6 1280*720 45.00 60.00 74.25 HDTV 720P
7 1920*1080 33.72 59.94 74.176 HDTV 1080I
8 1920*1080 33.75 60.00 74.25 HDTV 1080I
9 1920*1080 26.97 23.976 74.176 HDTV 1080P
10 1920*1080 27.00 24.00 74.25 HDTV 1080P
11 1920*1080 33.71 29.97 74.176 HDTV 1080P
12 1920*1080 33.75 30.00 74.25 HDTV 1080P
13 1920*1080 67.432 59.94 148.352 HDTV 1080P
14 1920*1080 67.50 60.00 148.50 HDTV 1080P
- 9 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.Only for training and service purposes
5.2. HDMI Input (DTV / PC)
No. Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Proposed Remarks
DTV
1 640*480 31.46 59.94 25.125 SDTV 480P
2 640*480 31.5 60.00 25.125 SDTV 480P
3 720*480 15.73 59.94 13.500 SDTV 480I Spec-Out.(Just Display)
4 720*480 15.75 60.00 13.514 SDTV 480I Spec-Out.(Just Display)
5 720*480 31.47 59.94 27.00 SDTV 480P
6 720*480 31.5 60.00 27.027 SDTV 480P
7 1280*720 44.96 59.94 74.176 HDTV 720P
8 1280*720 45 60.00 74.25 HDTV 720P
9 1920*1080 33.72 59.94 74.176 HDTV 1080I
10 1920*1080 33.75 60.00 74.25 HDTV 1080I
11 1920*1080 26.97 23.97 74.176 HDTV 1080P
12 1920*1080 27.00 24.00 74.25 HDTV 1080P
13 1920*1080 33.71 29.97 74.176 HDTV 1080P
14 1920*1080 33.75 30.00 74.25 HDTV 1080P
15 1920*1080 67.43 59.94 148.352 HDTV 1080P
16 1920*1080 67.5 60.00 148.50 HDTV 1080P
PC
1 640*350 @70Hz 31.46 70.09 25.17 EGA X
2 720*400 @70Hz 31.46 70.08 28.32 DOS O
3 640*480 @60Hz 31.46 59.94 25.17 VESA(VGA) O
4 800*600 @60Hz 37.87 60.31 40.00 VESA(SVGA) O
5 1024*768 @60Hz 48.36 60.00 65.00 VESA(XGA) O
6 1152*864 @60Hz 54.34 60.05 80.002 VESA O
7 1280*1024 @60Hz 63.98 60.02 108.0 VESA (SXGA) O FHD only
8 1360*768 @60Hz 47.71 60.01 85.50 VESA (WXGA) O
9 1920*1080 @60Hz 67.5 60.00 148.5 WUXGA(CEA 861D) O FHD only
- 10 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.Only for training and service purposes
ADJUSTMENT INSTRUCTION1. Application
This spec. sheet applies to LA57H Chassis applied LED TV all models manufactured in TV factory
2. Specification(1) Because this is not a hot chassis, it is not necessary to use
an isolation transformer. However, the use of isolation transformer will help protect test instrument.
(2) Adjustment must be done in the correct order.(3) The adjustment must be performed in the circumstance of
25 ±5 ºC of temperature and 65±10% of relative humidity if there is no specific designation
(4) The input voltage of the receiver must keep 100~240V, 50/60Hz
(5) At first Worker must turn on the SET by using Power Only key.
(6) The receiver must be operated for about 5 minutes prior to the adjustment when module is in the circumstance of over 15 ºC
In case of keeping module is in the circumstance of 0°C, it should be placed in the circumstance of above 15°C for 2 hours
In case of keeping module is in the circumstance of below -20°C, it should be placed in the circumstance of above 15°C for 3 hours.
※ CautionWhen still image is displayed for a period of 20 minutes or longer (especially where W/B scale is strong.Digital pattern 13ch and/or Cross hatch pattern 09ch), there can some afterimage in the black level area
3. Adjustment items3.1. Main PCBA Adjustments
(1) ADC adjustment: Component 480i, 1080p / RGB-PC 1080p(2) EDID download: HDMI and RGB-PC
Above adjustment items can be also performed in Final Assembly if needed. Adjustment items in both PCBA and final assembly tages can be checked by using the INSTART Menu(1.ADJUST CHECK)
Component 1080p and RGB-PC Adjust will be calculated by 480i adjust value.
3.2. Final assembly adjustment(1) White Balance adjustment(2) RS-232C functionality check(3) Factory Option setting per destination(4) Shipment mode setting (In-Stop)(5) GND and HI-POT test
3.3. Appendix(1) Shipment conditions(2) Tool option menu(3) USB Download (S/W Update, Option and Service only)(4) Preset CH Information
4. MAIN PCBA Adjustments* Download
(1) Execute ISP program “Mstar ISP Utility” and then click “Config” tab.
(2) Set as below, and then click “Auto Detect” and check “OK” message. If display “Error”, Check connect computer, jig, and set.
(3) Click “Connect” tab. If display “Can’t ”, Check connect computer, jig, and set.
(4) Click “Read” tab, and then load download file(XXXX.bin) by clicking “Read”
(5) Click “Auto” tab and set as below(6) Click “Run”.(7) After downloading, check “OK” message.
4.1. ADC Calibration4.1.1. Overview
ADC adjustment is needed to find the optimum black level and gain in Analog-to-Digital device and to compensate RGB deviation
ADC adjustment is OTP (Auto ADC)
- 11 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.Only for training and service purposes
4.2. EDID Download4.2.1. Overview
It is a VESA regulation. A PC or a MNT will display an optimal resolution through information sharing without any necessity of user input. It is a realization of “Plug and Play”.
4.2.2. Equipment Since embedded EDID data is used, EDID download JIG,
HDMI cable and D-sub cable are not need. Adjust by using remote controller
4.2.3. Download method (using DFT)※ PC(for communication through RS-232C), UART baud rate:
115200 bps Command : aa 00 00 (Start Factory mode) Command : ae 00 10 (Download All EDID) Command : aa 00 90 (End of Factory mode)
4.2.4. Download method1) Press Adj. key on the Adj. R/C,2) Select EDID D/L menu.3) By pressing Enter key, EDID download will begin4) If Download is successful, OK is display, but If Download is
failure, NG is displayed.5) If Download is failure, Re-try downloads.
※ Caution) When EDID Download, must remove RGB/HDMI Cable.
6) EDID Write confirmation
4.2.5. Models for EDID Data2D
HD / 8bitHDMI 2ea
FHD / 8bitHDMI 2ea
North America(PCM)
32LF560B-Ux32LF550B-Ux
32/42LF5600-Ux42/49/55LF5500-Ux
43/49LF5400-Ux
4.2.6. EDID DATA L15_M1L EDID - PCM
2D / 8bit / HD(1) EDID Block 0, Bytes 0-127 [00H-7FH]
(2) EDID Block 1, Bytes 128-255 [80H-FFH]
2D / 8bit / FHD(1) EDID Block 0, Bytes 0-127 [00H-7FH]
(2) EDID Block 1, Bytes 128-255 [80H-FFH]
L15_M1L EDID - AC3 2D / 8bit / HD(1) EDID Block 0, Bytes 0-127 [00H-7FH]
(2) EDID Block 1, Bytes 128-255 [80H-FFH]
2D / 8bit / FHD(1) EDID Block 0, Bytes 0-127 [00H-7FH]
(2) EDID Block 1, Bytes 128-255 [80H-FFH]
4.2.7. Tool Option Input Input Model Tool Option according to BOM
- 12 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.Only for training and service purposes
5. Final Assembly Adjustment5.1. White Balance Adjustment5.1.1. Overview5.1.1.1. W/B adj. Objective & How-it-works
(1) Objective: To reduce each Panel’s W/B deviation(2) How-it-works: When R/G/B gain in the OSD is at 192, it
means the panel is at its Full Dynamic Range. In order to prevent saturation of Full Dynamic range and data, one of R/G/B is fixed at 192, and the other two is lowered to find the desired value.
(3) Adj. condition: normal temperature- Surrounding Temperature: 25±5 °C- Warm-up time: About 5 Min- Surrounding Humidity: 20% ~ 80%- Before White balance adjustment, Keep power on status,
don’t power off
5.1.1.2. Adj. condition and cautionary items(1) Lighting condition in surrounding area surrounding lighting
should be lower 10 lux. Try to isolate adj. area into dark surrounding.
(2) Probe location: Color Analyzer (CA-210) probe should be within 10cm and perpendicular of the module surface
(80°~ 100°)(3) Aging time- After Aging Start, Keep the Power ON status during 5 Minutes.
- In case of LCD, Back-light on should be checked using no signal or Full-white pattern.
5.1.2. Equipment(1) Color Analyzer: CA-210 (NCG: CH 9 / WCG: CH12 / LED:
CH14)(2) Adj. Computer (During auto adj., RS-232C protocol is
needed)(3) Adjust Remocon(4) Video Signal Generator MSPG-925F 720p/204-Gray
(Model: 217, Pattern: 49) → Only when internal pattern is not available※ Color Analyzer Matrix should be calibrated using CS-1000
5.1.3. Equipment connection
When you connect the RS232 to set Phone jack, please use 3pin phone jack cable.
5.1.4. Adjustment Command (Protocol)(1) RS-232C Command used during auto-adj.
RS-232C COMMANDExplanation
CMD DATA ID
Wb 00 00 Begin White Balance adj.
Wb 00 ff End White Balance adj. (internal pattern disappears )
Ex) wb 00 00 -> Begin white balance auto-adj. wb 00 10 -> Gain adj. ja 00 ff -> Adj. data jb 00 c0 ... ...wb 00 1f -> Gain adj. complete*(wb 00 20(start), wb 00 2f(end)) -> Off-set adj.wb 00 ff ->End white balance auto adj.
(2) Adjustment MapAdj. item
Command(lower case ASCII)
Data Range(Hex.)
Default(Decimal)
CMD1 CMD2 MIN MAX
Cool R Gain j g 00 C0 172
G Gain j h 00 C0 172
B Gain j i 00 C0 192
R Cut 128
G Cut 128
B Cut 128
Medium R Gain j a 00 C0 192
G Gain j b 00 C0 192
B Gain j c 00 C0 192
R Cut 128
G Cut 128
B Cut 128
Warm R Gain j d 00 C0 192
G Gain j e 00 C0 192
B Gain j f 00 C0 172
R Cut 128
G Cut 128
B Cut 128
- 13 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.Only for training and service purposes
5.1.5. Adjustment method5.1.5.1. Auto WB calibration
(1) Set TV in ADJ mode using P-ONLY key (or POWER ON key)
(2) Place optical probe on the center of the display - It need to check probe condition of zero calibration before
adjustment.(3) Connect RS-232C Cable(4) Select mode in ADJ Program and begin a adjustment.(5) When WB adjustment is completed with OK message,
check adjustment status of pre-set mode (Cool, Medium, Warm)
(6) Remove probe and RS-232C cable. W/B Adj. must begin as start command “wb 00 00” , and
finish as end command “wb 00 ff”, and Adj. offset if need
5.1.5.2. Manual adjustment(1) Set TV in Adj. mode using POWER ON (2) Zero Calibrate the probe of Color Analyzer, then place it on
the center of LCD module within 10cm of the surface.. (3) Press ADJ key → EZ adjust using adj. R/C → 6. White-
Balance then press the cursor to the right (KEY). (When KEY() is pressed 204 Gray(80IRE) internal
pattern will be displayed)(4) One of R Gain / G Gain / B Gain should be fixed at 192,
and the rest will be lowered to meet the desired value.(5) Adj. is performed in COOL, MEDIUM, WARM 3 modes of
color temperature.
※ CASE First adjust the coordinate far away from the target value(x, y).B(1) x, y >target i) Decrease the R, G.(2) x, y< target i) First decrease the B gain, ii) Decrease the one of the others.(3) x >target , y< target i) First decrease B, so make y a little more than the target. ii) Adjust x value by decreasing the R(4) x < target , y >target i) First decrease B, so make x a little more than the target. ii) Adjust x value by decreasing the G
How to adjust(1) Fix G gain at least 172 : Adjust R, B Gain ( In Case of Mostly Blue Gain Saturation ) (2) When R or B Gain > 255, Release Fixed G Gain and
Readjust
※ CASE : Medium / Warm modeFirst adjust the coordinate far away from the target value(x, y).(1) x, y >target i) Decrease the R, G. (2) x, y< target i) First decrease the B gain, ii) Decrease the one of the others.(3) x >target , y< target i) First decrease B, so make y a little more than the target. ii) Adjust x value by decreasing the R(4) x < target , y >target i) First decrease B, so make x a little more than the target. ii) Adjust x value by decreasing the G
5.1.6. Reference (White Balance Adj. coordinate and color temperature)
Luminance: 204 Gray, 80IRE
** (normal line) LGD Cell (LF56xx, LF55xx,LF54xx) Standard color coordinate and temperature using
CA-210(CH-14) – by aging time
L15 Aging time(Min)
Cool Medium Warm
X Y X Y X Y
271 270 286 289 313 329
1 0-2 281 285 296 304 323 344
2 3-5 280 284 295 303 322 343
3 6-9 279 282 294 301 321 341
4 10-19 277 279 292 288 319 338
5 20-35 275 275 290 294 317 334
6 36-49 273 273 288 292 315 332
7 50-79 272 272 287 291 314 331
8 80-119 271 270 286 289 313 329
9 Over 120 271 270 286 289 313 329
** (Aging chamber) LGD Cell (LF56xx, LF55xx,LF54xx) Standard color coordinate and temperature using
CA-210(CH-14) – by aging time
L15 Aging time(Min)
Cool Medium Warm
X Y X Y X Y
271 270 286 289 313 329
1 0-5 280 285 295 304 319 340
2 6-10 276 280 291 299 315 335
3 11-20 272 275 287 294 311 330
4 21-30 269 272 284 291 308 327
5 31-40 267 268 282 287 306 323
6 41-50 266 265 281 284 305 320
7 51-80 265 263 280 282 304 318
8 81-119 264 261 279 280 303 316
9 Over 120 264 260 279 279 303 315
** For INX,AUO,SHARP,CSOT Module.( In the case of , the color temperature spec of cool mode is 13000K)
L15cool med warm
x y x y x y
spec 271 270 286 289 313 329
target 276 277 291 296 318 336
- 14 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.Only for training and service purposes
5.2. Option selection per country5.2.1. Overview
(1) Tool option selection is only done for models in Non-USA North America due to rating
(2) Applied model: LA57H Chassis applied to CANADA and MEXICO
5.2.2. Country Group selection(1) Press ADJ key on the Adj. R/C, and then select Country
Group Menu(2) Depending on destination, select US, then on the lower
Country option, select US, CA, MX. Selection is done using +, - KEY(3) Using DFT(Auto)※ PC (for communication through RS-232C) -> UART Baud
rate : 115200 bps Command : ah 00 00 DATA(Area Number(hexadecimal))
ITEM DATA(Area Number) AREA
AREA OPTION1 0 USA
1 CANADA
2 MEXICO
5.2.3. Tool Option inspection Press Adj. key on the Adj. R/C, then select Tool option.
Model 2,3thSuffix
4thSuffix Module Tool 1 Tool 2 Tool 3 Tool 4
32LF560B-Ux
- M Sharp 13074 13314 41036 28768
32LF550B-Ux
CC/US M Sharp 13074 17410 53324 24672
WM M Sharp 13074 17410 53316 24672
CC/US F BOE 21266 17410 53324 24672
WM F BOE 21266 17410 53316 24672
CC/US Y LGD 785 17410 49228 24672
WM Y LGD 785 17410 49220 24672
32LF5600-Ux
CC/US Y LGD 785 1030 45132 28768
WM Y LGD 785 1030 45124 28768
32LF5600-Ux
CC/US F BOE 21264 1030 49228 20576
WM F BOE 21264 1030 49220 20576
42LF5600-Ux
CC/US Y LGD 1553 1030 49228 28768
WM Y LGD 1553 1030 49220 28768
CC/US D AUO 9744 1030 49228 24672
WM D AUO 9744 1030 49220 24672
42LF5500-Ux
CC/US Y LGD 1553 5126 49228 28768
WM Y LGD 1553 5126 49220 28768
CC/US D AUO 9744 5126 49228 24672
WM D AUO 9744 5126 49220 24672
49LF5500-Ux
CC/US Y LGD 2321 5126 49228 24672
WM Y LGD 2321 5126 49220 24672
55LF5500-Ux
CC/US Y LGD 2833 5126 53324 24672
WM Y LGD 2833 5126 53316 24672
※ Tool option can be reconstructed by Software
6. GND and HI-POT Test6.1. GND & HI-POT auto-check preparation
(1) Check the POWER CABLE and SIGNAL CABE insertion condition
6.2. GND & HI-POT auto-check(1) Pallet moves in the station. (POWER CORD / AV CORD is
tightly inserted)(2) Connect the AV JACK Tester.(3) Controller (GWS103-4) on.(4) GND Test (Auto) - If Test is failed, Buzzer operates.- If Test is passed, execute next process (Hi-pot test). (Remove A/V CORD from A/V JACK BOX) (5) HI-POT test (Auto) - If Test is failed, Buzzer operates. - If Test is passed, GOOD Lamp on and move to next process
automatically.
6.3. Checkpoint(1) Test voltage - GND: 1.5KV/min at 100mA - SIGNAL: 3KV/min at 100mA(2) TEST time: 1 second(3) TEST POINT - GND Test = POWER CORD GND and SIGNAL CABLE
GND. - Hi-pot Test = POWER CORD GND and LIVE & NEUTRAL.(4) LEAKAGE CURRENT: At 0.5mArms
7. AUDIO output check7.1. Audio input condition
(1) RF input: Mono, 1KHz sine wave signal, 100% Modulation(2) CVBS, Component: 1KHz sine wave signal (0.4Vrms)(3) RGB PC: 1KHz sine wave signal (0.7Vrms)
7.2. SpecificationNo Item Min Typ Max Unit Remark
1 Audio practical max Output, L/R(Distor-tion=10% max Output)
4.56.0
5.06.3
6.06.9
WVrms
(1) Measurement condition
- EQ/AVL/Clear Voice: Off
(2) Speaker (8Ω Impedance)
(3) LF55 Series
2 Audio practical max Output, L/R(Distor-tion=10% max Output)
9.08.5
10.08.9
12.09.8
WVrms
(1) Measurement condition
- EQ/AVL/Clear Voice: Off
(2) Speaker (8Ω Impedance)
(3) LF56 Series
- 15 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.Only for training and service purposes
8. USB S/W Download (optional, Service only)
(1) Put the USB Stick to the USB socket (2) Automatically detecting update file in USB Stick - If your downloaded program version in USB Stick is lower
than that of TV set, it didn’t work. Otherwise USB data is automatically detected.
(3) Show the message “Copying files from memory”
(4) Updating is staring.
(5) Updating Completed, The TV will restart automatically(6) If your TV is turned on, check your updated version and
Tool option. * If downloading version is more high than your TV have, TV
can lost all channel data. In this case, you have to channel recover. If all channel data is cleared, you didn’t have a DTV/ATV test on production line.
* After downloading, TOOL OPTION setting is needed again.(1) Push "IN-START" key in service remote controller.(2) Select "Tool Option 1" and Push “OK” button.(3) Punch in the number. (Each model has their number.)
- 16 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.Only for training and service purposes
TROUBLE SHOOTING1. Power-up boot check
Check PSU DC VoltageP401_5,6,7,8 pin : 13.2V
Check stand-by VoltageL202 : +3.3V
Check P200 PWR_ON.1pin : 3.3V
Check X100 clock24 MHz
Check Ms ta r LVDS Output
Check DRV ON Control P200 11pin : High
Change Module
Check TCON(Module) Panel_VCCQ205 : 13.2V
Check IC402/3/4 Output VoltageIC202 : 1.15V & 5VIC200 : 1.8VQ204 : 3.3V
NO
NO
NO
NO
NO
NO
NO
NO
OK
OK
NO
OKCheck 12pin Power connector
Main B/D 3.3V LineShort Check
Re-download software.
Replace X100
Replace Mstar(IC102) or Main Board
Check PSU
Replace Q205
Replace IC402, IC403, IC404, Q403
Main B/D 13.2V LineShort Check
Replace IC201(DCDC)
Replace Mstar(IC102) or Main board
Replace PSU
OK
OK
OK
OK
OK
OK
OK
OK
- 17 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.Only for training and service purposes
2. Digital / Analog TV Video
3. AV Video
Check RF Cable & Signal
Check input signal format.Is it supported?
Check AV Cable for damagef o r d a m a g e o r o p e n conductor
Check Tuner 3.3V PowerL500
Check JK401, CVBS Signal LineR120
Check IF_P/N SignalTU501 6,7 Pin
Check CVBS_DET Signal
Check Mstar LVDS Output
Check Ms ta r LVDS Output
NO
NO
NO
NO
NO
NO
Replace L500
Replace Jack
Bad Tuner. Replace Tuner.
Replace AR401 or R110
Replace Mstar(IC102) or Main Board.
Replace Mstar(IC102) or Main Board.
OK
OK
OK
OK
OK
OK
OK
- 18 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.Only for training and service purposes
4. Component Video
Check input signal format.Is it supported?
Check Component Cablef o r d a m a g e o r o p e n conductor.
Check JK401Y/PB/PR signal Line
C h e c k C O M P _ D E T Signal
Check Ms ta r LVDS Output
NO
NO
NO
Replace Jack
Replace AR401or R109
Replace Mstar(IC101) or Main Board.
OK
OK
OK
OK
- 19 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.Only for training and service purposes
5. HDMI Video
Check input signal format.Is it supported?
Check HDMI Cable conductorsfor damage or open conductor.
Check EDIDAR102, AR101, AR410, AR411 I2C Signal
Check JK403, JK404
Check HDMI_DET (HPD)
Check HDMI Signal
Check Ms ta r LVDS Output
NO
NO
NO
NO NO
NO
Replace the defect ive IC or re-download EDID data
Replace Jack
Replace R418, R410, Q400, R419
Check other setIf no problem, check signal line
Replace Main Board
Replace Mstar(IC101) or Main Board.
OK
OK
OK
OK
OK
OK
- 20 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.Only for training and service purposes
6. All Source Audio
Check the TV Speaker Menu(Menu -> Audio -> TV Speaker)
Check AMP IC(IC5600) Power24V, 3.3V
Check AMP I2C LineR140, R141
Check Mstar AUDIO_MASTER_CLKR148
Check Connec tor & P5600
Check speaker resistanceand connector damage.
Check Output Signal P56001, 2, 3, 4 pin.
Check Mstar I2S OutputIC5600 20,21,22 Pin
OFF
NO
NO
NO
NO
NO
NO
NO
Toggle the Menu
Main B/D 3.3V LineShort Check
Check signal line. Or replace Mstar(IC101)
Replace Mstar(IC101) or Main Board.
Replace connectorif found to be damaged.
Replace speaker.
Replace Audio AMP IC(IC5600)
Check signal line. Or replace Mstar(IC101)
ON
OK
OK
OK
OK
OK
OK
- 21 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.Only for training and service purposes
7. Digital / Analog TV Audio
8. AV Audio
9. Component Audio
Check RF Cable & Signal
Check Tuner 3.3V PowerL500
Check Tuner I2CAR500, R502, R503
Check IF_P/N SignalTU501 6/7 Pin
Follow procedure ‘7. All source audio’ trouble shooting guide.
NO
NO
NO
Replace L500
Replace AR500, R502, R503
Bad Tuner. Replace Tuner.
OK
OK
OK
OK
Check AV Cable for damagefor damage or open conductor
Check Component Cablefor damage or open conductor.
Check JK401 Signal LineR409 ,R406
Check JK401 Signal LineR409 ,R406
Follow procedure ‘7. All source audio’trouble shooting guide.
Follow procedure ‘7. All source audio’trouble shooting guide.
NO
NO
Replace Jack
Replace Jack
OK
OK
OK
OK
- 22 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.Only for training and service purposes
BLOCK DIAGRAM
Pow
er B
oard
(LPB
)
Soun
d AM
PTA
S573
3
IC30
1
( ( ( (
Mod
ule
JK60
1
Y,Pb,Pr In
LGE8
220
/ M1L
5
93 4 10 11
Tune
r SC
LTu
ner S
DA
TU
NE
R
IF_A
GC
B+
53
24M
hz
4950
IC10
1
46LP
F1 3936
P305
P200
P300
/301
42
1
79 ~
89
54
116
117
9495
Aud
io_S
CL
Aud
io_S
DA
Pane
l_12
V
INV_on
PWM
RL_on
M_3
.3V
TU_3
.3V
232415 20 21 22
I2S_
MC
LKI2
S_W
SI2
S_SC
KI2
S_SD
O
105
106
LED
110
100
101
59 58
62
EEP
SDA
EEP
SCL
114
113
112
111
SPI_
CLK
SPI_
DI
SPI_
CZ
SPI_
DO
S_A
MP_
24V
3
13
LPF
JK605
USB
_5V
P304
IRKEY1KEY2
ST_3
.5V
Q20
4D
MP2
130L
Pane
l_Vc
c
USB
_DN
USB
_DP
IF_N
33
JK60
2
4 34
Comp. R/L In
AV1 In
29,3
4,35
22,2
4,26
,34,
35
2133
51
3257
131
5613
2
144
134,
135,
145~
152
48
IF_P
HD
MI2
JK603
67 ~ 78
MH
L_5V
USB
_DN
USB
_DP
124
123
5287
127
63 64 65 6613
9,14
0,1~
4,15
3~15
6
HD
MI1
HD
MI2
SPDI
F
JK60
8
Debu
g
TDSS
-H70
1F
Tx, R
x
TU70
1
JK60
7/P6
01/P
602
P_13.2V3, 4
, 7, 8
IC1
01
Seria
l Fla
sh8M
byte
s
IC1
00
EEPR
OM
24C
512
VDD
C_1
.15V
Q20
4D
MP2
130L
IC20
0A
Z111
7EH
DD
R_1
.8V
N_3
.3V
IC20
1TI
(TB
D)
2BU
CK 1
OCP
AVD
D_S
T_3.
5VIC
202
BD9D
321E
FJIR
KEY1
/2LE
D
IRB
oard
- 23 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.Only for training and service purposes
EXPLODED VIEW
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and EXPLODED VIEW. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.
IMPORTANT SAFETY NOTICE
400
121
310
900
A2
A10
Set
+ S
tand
120
200
530
540
521
410
LV1
THERMAL
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
AUD_LRCK
IF_AGC_MAIN
RXB0-
RXB3+
R119
33
AVDD_DMPLL
I2C_SDA
RXB1+
C1470.1uF16V
COMP_Pr+
COMP_Y+
COMP_Pb+
AUD_SCK
COMP_R_IN
RXBCK-
C1160.1uF16V
USB_CTL
C1240.1uF16V
USB_OCD
C1220.1uF16V
R121
180
C112
0.047uF
25V
+1.15V_VDDC
PM_RXD
SPI_SCK
AUD_MASTER_CLK
C1440.1uF
16V
RXBCK+
C11710uF6.3V
COMP_L_IN
SPI_SDO
R12410K
C1320.1uF16V
AVDD_MOD
C109
0.047uF
25V
C107
0.047uF
25V
PWM_DIM
RXA3+
AVDD_DADC
+3.3V_NORMAL
AMP_SCL
C110
0.047uF
25V
+3.3V_ST
AVDD_MOD
AVDD_DADC
R120
150
IF_P_MSTAR
C111
0.047uF
25V
DDR_CMD
+3.3V_ST
RXA0-
RXA1-
PM_TXD
C1400.1uF16V
C1450.1uF16V
RXACK+
AVDD_DMPLL
SOC_RESET
AVDD_MOD
C1230.1uF16V
AVDD_MOD
AMP_SDA
/SPI_CS
RXACK-
1uF10V
C127
+3.3V_STRL_ON
RXA2-
R118
68
AUD_LRCH
RXA1+
C1330.047uF25V
C113
0.047uF
25V
AVDD_MOD
RXA2+
DDR_DATA
RXB3-
RXB1-
RXB0+
+1.15V_VDDCSPI_SDI
RXB2-
SIDE_USB_DM
AVDD_VIDEO
IF_N_MSTAR
C108
1000pF
50V
KEY1
RXB2+
SIDE_USB_DP
AVDD_AU33
I2C_SCL
C1030.1uF16V
SOC_RESET
+1.15V_VDDC
C1390.1uF16V
R113
33
AVDD_VIDEO
C1460.1uF16V
RXA3-
IR
RXA0+
AVDD_AU33
COMP_Y+
+1.15V_VDDC
+3.3V_NORMAL
R1271M
POWER_DET
PANEL_CTL
INV_CTL
POWER_DET_RESET
R103470
OPT
C1004.7uF10V
OPTC1014.7uF10V
D0+_HDMI1
CK+_HDMI1
D0-_HDMI1
CK-_HDMI1
D2+_HDMI1
D1-_HDMI1
D1+_HDMI1
D2-_HDMI1
C128100pF
OPT C134100pF
OPT
R125100
DDC_SDA_1
DDC_SCL_1
DDC_SCL_2
MODEL_OPT
HPD1
X10024MHz
C143 15pF
C142 15pF
TU_SDA
TU_SCL
AMP_RESET
POWER_ON/OFF
AMP_MUTE
DDR_DATA
+1.15V_VDDC
+1.8V_DDR
C1250.1uF16V
OPT
C1300.1uF16V
C1370.1uF16V
C1410.1uF16V
OPT
C1290.1uF16V
C1360.1uF16V
DDR_CMD
C1380.1uF16V
+1.8V_DDR
C1261uF10V
C1190.1uF16V
C1048pF
OPTC1028pF
OPT
I2C_SCL
I2C_SDA
SPI_SCK
C1060.1uF16V
/SPI_CS
+3.3V_ST
/FLASH_WP
SPI_SDO
SPI_SDI
R1054.7K
OPT
R10010K
C1050.1uF16V
IC102LGE8220(MSD8220LBM)
1RX1N_B
2RX1P_B
3RX2N_B
4RX2P_B
5AVDD_MOD_1
6RXCN_A
7RXCP_A
8RX0N_A
9RX0P_A
10
RX1N_A
11
RX1P_A
12
RX2N_A
13
RX2P_A
14
HSYNC0
15
BIN0P
16
SOGIN0
17
GIN0P
18
GIN0M
19
RIN0P
20
VSYNC0
21
AVDD
3P3_
ADC
22
BIN1P
23
SOGIN1
24
GIN1P
25
GIN1M
26
RIN1P
27
VSYNC1
28
CVBS1
29
CVBS0
30
VCOM
31
CVBS_OUT1
32
VDDC_1
33
AVDD_AU33
34
AUR0
35
AUL0
36
AUR1
37
AUL1
38
AUR2
39
AUL2
40
AUR3
41
AUL3
42
VAG
43
VRM
44
LINEOUTL3
45
LINEOUTR3
46
LINEOUTL0
47 LINEOUTR0
48 IFAGC
49 VIFP
50 VIFM
51 AVDD3P3_DADC
52 AVDD3P3_DMPLL
53 XIN
54 XOUT
55 AVDD_MOD_2
56 VDDIO_CMD
57 VDDC_2
58 GPIO44/I2C_SDAM/UART_TX159 GPIO45/I2C_SCLM/UART_RX160 GPIO46/MHL_VBUS61 GPIO4762 GPIO49/SPDIF_OUT63 GPIO50/I2S_OUT_WS64 GPIO51/I2S_OUT_MCK65 GPIO52/I2S_OUT_BCK66 GPIO53/I2S_OUT_SD67 B_ODD[0]/LVA4+/LLV6+68 B_ODD[1]/LVA4-/LLV6-69 B_ODD[2]/LVA3+/LLV5+70 B_ODD[3]/LVA3-/LLV5-71 B_ODD[4]/LVACLK+/LLV4+72 B_ODD[5]/LVACLK-/LLV4-73 B_ODD[6]/LVA2+/LLV3(CLK)+74 B_ODD[7]/LVA2-/LLV3(CLK)-75 G_ODD[0]/LVA1+/LLV2+/EPI0+76 G_ODD[1]/LVA1-/LLV2-/EPI0-77 G_ODD[2]/LVA0+/LLV1+/EPI1+78 G_ODD[3]/LVA0-/LLV1-/EPI1-
79
G_OD
D[4]
/LVB
4+/L
LV0+
/EPI
2+80
G_OD
D[5]
/LVB
4-/L
LV0-
/EPI
2-81
G_OD
D[6]
/LVB
3+/R
LV6+
/EPI
3+82
G_OD
D[7]
/LVB
3-/R
LV6-
/EPI
3-83
R_OD
D[0]
/LVB
CLK+
/RLV
5+/E
PI4+
84
R_OD
D[1]
/LVB
CLK-
/RLV
5-/E
PI4-
85
R_OD
D[2]
/LVB
2+/R
LV4+
/EPI
5+86
R_OD
D[3]
/LVB
2-/R
LV4-
/EPI
5-87
AVDD_MOD_3
88
R_OD
D[4]
/LVB
1+/R
LV3(
CLK)
+/EP
I6+
89
R_OD
D[5]
/LVB
1-/R
LV3(
CLK)
-/EP
I6-
90
R_OD
D[6]
/LVB
0+/R
LV2+
/EPI
7+91
R_OD
D[7]
/LVB
0-/R
LV2-
/EPI
7-92
LCK/
GPIO
19/R
LV1+
/GPI
O19
93
LDE/
GPIO
18/R
LV1-
/GPI
O18
94
LHSY
NC/G
PIO1
7/RL
V0+/
GPIO
1795
LVSY
NC/G
PIO1
6/RL
V0-/
GPIO
1696
GPIO10/TCON10
97
GPIO9/TCON9
98
GPIO8/TCON8
99
GPIO7/TCON7
100
GPIO6/TCON6
101
GPIO5/TCON5
102
GPIO4/TCON4
103
GPIO3/TCON3
104
GPIO2/TCON2
105
GPIO1/TCON1
106
GPIO0/TCON0
107
HOTPLUG_D
108
HOTPLUG_A
109
PWM1/GPIO14
110
PWM0/GPIO15
111
SPI_DO
112
SPI_DI
113
SPI_CZ
114
SPI_CK
115
ARC/GPIO87
116
DDCA_DA
117
DDCA_CK
118
TEST
119
CEC
120
IRIN
121
INT/
GPIO
64/I
2S_O
UT_M
CK122
RESET
123
DM_P0
124
DP_P0
125DM_P1
126DP_P1
127AVDD_MOD_4
128SAR0/GPIO75
129SAR1/GPIO74
130SAR2/GPIO73
131VDDC_3
132VDDIO_DATA
133GPIO54
134DDCDD_CL
135DDCDD_DA
136DDCDA_CL
137DDCDA_DA
138MHL_DET/GPIO86
139DDCDB_DA
140DDCDB_CL
141HOTPLUG_B
142AVDD_5V_MHL
143GND_EFUSE
144VDDC_4
145RXCN_D
146RXCP_D
147RX0N_D
148RX0P_D
149RX1N_D
150RX1P_D
151RX2N_D
152RX2P_D
153RXCN_B
154RXCP_B
155RX0N_B
156RX0P_B
157
E-PAD
R1072.2K
R1062.2K
+3.3V_ST
R112
1K
R111 1KLED_RED
C1310.1uF16V
R1014.7K
HD
R1024.7K
FHD
PWM_DIM2
R115
1K
C11810uF6.3V
C13510uF6.3V
10uF6.3V
C121
10uF6.3V
C120
C114
2.2uF
10V
C115
2.2uF
10V
R104470K
DDC_SDA_2
+3.3V_ST
R11710K
KEY2
SPDIF_OUTR126100
SPDIF
VCOM_SCL
VCOM_SDA
MODEL_OPT
5V_DET_HDMI_2
AV_DETR110 1K
R108 10K
R109 1KCOMP_DET
D1-_HDMI2
D2+_HDMI2
D1+_HDMI2
D2-_HDMI2
CK-_HDMI2
D0+_HDMI2
CK+_HDMI2
D0-_HDMI2
HPD2
5V_DET_HDMI_1
R11410K
/FLASH_WP
AR100331/16W
AR109
33
AR106
33
1/16W
AR111
33
1/16W
R122 0
R123 0
AR107331/16W
L100
PZ1608U121-2R0TF
L101PZ1608U121-2R0TF
L102PZ1608U121-2R0TF
L103
PZ1608U121-2R0TF
L104PZ1608U121-2R0TF
L105PZ1608U121-2R0TF
L106PZ1608U121-2R0TF
L107PZ1608U121-2R0TF
L108PZ1608U121-2R0TF
AR1021001/16W
AR1031001/16W
AR104
100
1/16W
AR110
100
1/16W
AR1054.7K
OPT
AR1084.7K1/16W
IC101W25Q64FVSSIG
3WP[IO2]
2DO[IO1]
4GND
1CS
5DI[IO0]
6CLK
7%HOLD[IO3]
8VCC
AR101 100
1/16W
AR112
100
1/16W
TP1
IC100-*1BR24G512FJ-3
SUB_NVRAM_ROHM
3A2
2A1
4GND
1A0
5SDA
6SCL
7WP
8VCC
IC100AT24C512C-SSHD-T
NVRAM_ATMEL
3A2
2A1
4GND
1A0
5SDA
6SCL
7WP
8VCC
R128 10K
HDMI2_5V
[M1L]
Closed to SoC
<SOC_RESET>
<HW_OPTION>
<Chip config.>
<MAIN SoC Vcc>
Close to MSTAR
MAIN 51
140822L15_M1L
EEPROM(512KB)
SERIAL FLASH(64MB)
Closed to Main SoC Each Pin
Closed to SoC
Closed to SoC as possible
Closed to SoC as possible
Closed to SoC as possible
Not USe Macronix (EAN63146601)
MHL Disable
Copyright 2015 LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only
THERMAL
THERMAL
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. POWER
141020
2 5
L15_M1L
+3.3V_NORMAL
C23410uF6.3V
OPT
R21810K
C20310uF25V
USB_CTL
+3.3V_ST
Q201MMBT3906(NXP)
TR_NXP
1
2
3
Q204
SSM3J332R
FET_3.3V_TOSHIBA
S
G
D
C2120.1uF25V
OPT
PWM_DIM
R2274.7KOPT
L203UBW2012-121F
R2070
OPT
C2050.1uF25V
L2064.7uH
POWER_ON/OFF
+3.3V_ST
Q200MMBT3904(NXP)
TR_NXP
E
B
C
+5V_NORMAL
C2271uF16V
C20810uF6.3V
L204PZ1608U121-2R0TF
M13.2V
R20310K
+3.3V_ST
C21910uF25V
R245300
R20110K
OPT
+3.3V_ST
R241100K
C2061uF10V
C2323300pF50V
VR200
ICVS0518150FR_
OPT
C2380.1uF
R20010K
C22010uF25V
C204100pF50V
R234
15K
C23322pF50V
C20110uF6.3V
R22610K
POWER_DET
RL_ON
R2061K
C2150.1uF16V
C23022pF50V
L201MLB-201209-0120P-N2
+5V_USB
+3.3V_NORMAL
R2243.3K
C2293300pF50V
+3.3V_NORMAL
R2253.3K
OPT
+3.3V_NORMAL
PANEL_CTL
R22310K
R23520K
+3.3V_NORMAL
R2370
OPT
IC200AZ1117EH-ADJTRG1
ADJ/GND
OUTIN
INV_CTL
R211
22K
1/16W
1%
C23722uF6.3V
C23547pF50V
R2300
C2240.1uF16V
C2144.7uF10V
R209100
+5V_NORMAL
Q203MMBT3904(NXP)
TR_NXP
E
B
C
C2090.1uF
16V
PANEL_VCC
C2212200pF
50V
OPT
POWER_DET_RESET
C226
0.047uF
25V
R231
0
R21610K
OPT
C21810uF6.3V
USB_OCD
ZD2025V
OPT
C2222200pF
50V OPT
R21533K
OPT
C223
1uF
10V
R2360
OPT
PWM_DIM2
ZD2032.5V
OPT
+1.15V_VDDC
R24439K
1%
ZD2002.5V
C2164700pF50V
OPT
C2280.047uF25V
C2072200pF50V
L205CB2012PK501T
R2435.1K1%
+1.8V_DDR
+3.3V_ST
C2174700pF50V
OPT
R21710K
OPT
M13.2V
R20510K
M13.2V
R20868K
1/16W1%
L2074.7uH
R2422001%
ZD2015V
OPT
SD05
C24022uF6.3V
+3.3V_ST
R22112K
C20010uF25V
C225
22uF
16V
M13.2V
L200
BLM18PG121SN1D
+3.3V_ST
+3.3V_NORMAL
R2464.7K
C23182pF50V
OPT
Q202MMBT3904(NXP)
TR_NXP
E
B
C
R2221.8K
C2020.1uF25V
OPT
R20210K
Q205
SSM3J332R
S
G
D
R22991K
R2123.9K
1%
R2131.6K
1%
R210100K
L2022uH
R24010K
R228
10K
L208
MLB-201209-0120P-N2OPT
A13.2V
C2410.1uF25V
R2384.7K1%
R2395.1K
1%
IC203
KIC7529M2
Reset_IC_KEC
1
GND
2 OUT3VCC
Q204-*1
AO3435
SUB_FET_3.3V_AOS
G
DS
P200SMAW200-H12S5K(BK)(LTR)
9GND
4 D13.2V
8 A13.2V
3GND
12 PDIM#1
7A13.2V
2 PDIM#2
11DRV_ON
6 D13.2V
1PWR_ON
10 GND
5D13.2V
13
.
SN1406035RGER IC202
1SS2
3EN2
7SW_OUT
9VIN2
10
PGND2
11
LX2
12
BST2
13COMP2
14FB2
15RSET
16AGND
17FB1
18COMP1
19
BST1
20
LX1
21
PGND1
22
VIN1
23
V7V
24
SS1
5SW_EN
8SW_IN
6NFAULT
4ROSC/SYNC
2EN1 25
[EP]
IC203-*1
APX803E29
RESET_IC_DIODES
1
GND
2 RESET3VCC
PANEL_VCC
IC201BD9D321EFJ
3VREG
2FB
4SS
1EN
5GND
6SW
7BOOT
8VIN
9
[EP]
R2046.2K
1/16W1%
R249300K
OPTR250300K
OPT
R24833K
R2473.3K
R220120K
R21933K
R23214K
1%
R2335.6K
1%
C23622uF16V321685C
C23922uF16V321685CC210
22uF10V
125C3216
C21122uF10V
125C3216
ZD2045.1v
OPT
ZD2055.1v
OPT
R2140
C213
0.22uF25V
Panel_Cgs_0.22uF
10%1608
C213-*10.1uF50V
Panel_Cgs_0.1uF
10%1608
Q201-*12N3906S-RTK
TR_KEC
E
B
C
Q200-*12N3904S
TR_KEC
E
B
C
Q202-*12N3904S
TR_KEC
E
B
C
Q203-*12N3904S
TR_KEC
E
B
C
L15 NA POWER BLOCK
+3.3V_Normal
R2
R1
+1.8V_DDR
R1
Vout=0.765*(1+R1/R2)
PANEL_Vcc
Vout=0.6(R1/R2)+0.6
+3.3V_STANDBY
R1
R2
R2
3A
+5V_Normal & +1.15V_VDDC
Vout=0.6(R1/R2)+0.6
FROM LIPS or POWER B/D +13.2V --> 3.56V
R2
R1
Power_DET
Vout=1.25*(1+R2/R1)+I(ADJ)XR2
CST Check!!
To make high at RL_ONwhen AC On
Check ESR!!
Copyright 2015 LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only
THERMAL
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. LVDS/S_AMP/IR
140828
3 5
L15_M1L
+3.3V_NORMAL
R30110K
OPT
PANEL_VCC
R3023.3K
OPT
RXA3-
RXA1+
RXA0-
RXA2-
RXA0+
RXACK-
RXA2+
RXA1-
RXACK+
RXA3+
RXB2+
RXB3-
RXB0-
RXB1+
RXB0+
RXBCK-
RXB1-
RXBCK+
RXB2-
RXB3+
L300
UBW2012-121F
FHD
RXA1-
RXA3-
RXA2+
RXA3+
RXA0+
L302
UBW2012-121F120OHM
HD
PANEL_VCC
R3073.3K
OPT
RXA2-
RXA1+
RXACK-
R30610K
OPT
+3.3V_NORMAL
RXA0-
RXACK+
KEY1
+3.3V_ST
LED_RED
IR
+3.3V_ST
C3380.1uF16V
OPT
C3350.1uF
16V
C3361000pF50V
+3.3V_ST
R3223.3K
OPT
C339100pF50V
R300 0FHD_GND_26
VR302
VR300OPT
SPK_L+
SPK_R+
SPK_R-
SPK_L-
VR303OPT
P30110031HR-30
HD
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
P30212507WR-08L
OPT
1
2
3
4
5
6
7
8
9
C3370.1uF16V
OPT
KEY2
VR301OPT
VCOM_SCL_M
VCOM_SDA_M
VCOM_SDA_M
VCOM_SCL_M
VCOM_SDA_M
VCOM_SCL_M VCOM_SCL
R3172K
V_COM
VCOM_SDA
R3162K
V_COM
+3.3V_NORMAL
P303
12507WR-10L
1
2
3
4
5
6
7
8
9
10
11
L307PZ1608U121-2R0TF
AR300
0
FHD_GND_42_43
AR302
0
V_COM
AR30310K
1/16W
C30010uF25V
FHD_VCC_Cap
C30310uF25V
HD_VCC_CapC3060.1uF25V
HD
C3010.1uF25V
FHD
A13.2V
L304
NRS6045T100MMGK10.0uH
C3422200pF50V
OPT
C3330.1uF50V
C3340.1uF50V
C3070.1uF50V
OPT
C327330pF50V
C3250.033uF50V
+3.3V_NORMAL
SPK_R-
C3200.1uF50V
+3.3V_NORMAL
R31318
1/16W
1%
C3442200pF50V
OPT
C3190.033uF50V
R312
181/16W1%
C3114700pF
C3171uF16V
AMP_SDA
+13.2V_AMP
+3.3V_NORMAL
R310
470
ZD3005V
OPT
POWER_DET
AMP_RESET
R309
2.2K
+13.2V_AMP
C3080.1uF16V
C3120.1uF16V
L301
120OHM
SPK_L-
C3160.1uF16V
C328330pF50V+13.2V_AMP
AMP_SCL
SPK_R+
C3432200pF50V
OPT
R3054.7K
AUD_LRCH
IC300
TAS5733
1OUT_A
2PV
DD_A
B_1
3PV
DD_A
B_2
4BST_A
5NC_1
6SSTIMER
7NC_2
8PBTL
9AVSS
10
PLL_
FLTM
11
PLL_
FLTP
12
VR_ANA
13AVDD
14A_SEL_FAULT
15MCLK
16OSC_RES
17DVSSO
18VR_DIG
19PDN
20LRCLK
21SCLK
22SDIN
23SDA
24SCL
25
RESET
26
STEST
27
DVDD
28
DVSS
29
GND
30
AGND
31
VREG
32
GVDD_OUT
33
BST_D
34
PVDD
_CD_
135
PVDD
_CD_
236
OUT_D
37 PGND_CD_138 PGND_CD_239 OUT_C40 NC_341 NC_442 BST_C43 BST_B44 NC_545 NC_646 OUT_B47 PGND_AB_148 PGND_AB_2
49
[EP]
R308
18K 1%
C3210.1uF50V
C3140.047uF
C3240.033uF50V
C310
0.047uF
C329330pF50V
AUD_SCK
AUD_LRCK
SPK_L+
R3030
1/16W
AR301
4.7K
1/16W
C3021000pF
50V
OPT
AUD_MASTER_CLK
C3152200pF
50V
AMP_MUTE
R31418
1/16W
1%
R3040
OPT
L303
NRS6045T100MMGK10.0uH
L305
NRS6045T100MMGK10.0uH
C32210uF25V
C32310uF25V
C3090.1uF16V
C3412200pF50V
OPTC3320.1uF50V
C3180.033uF50V
R311470
L306
NRS6045T100MMGK10.0uH
R315
18
1/16W1%
+3.3V_NORMAL
C3400.1uF50V
C3134700pF
C326330pF50V
C3050.1uF16V
R320 0FHD_GND_27
P304250A1-WR-H04M
1
2
3
4
P300
SP14-11592-01-51Pin
FHD
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52 C3300.33uF50V
C3310.33uF50V
R3242K
OPTR323
2K
OPT
LVDS_SEL
[51Pin LVDS Connector] (For FHD 60Hz)
[30Pin LVDS Connector] (For HD 60Hz_Normal)
LVDS_SEL
AUDIO AMP(TI)/LVDS/IR IR
V-COM I2C or GPIO(Tuner)
This parts are Located on AVSS area.
SPEAKER_R
AUDIO AMP(TI)
Need to Check.
Separate DGND AND AVSS
SPEAKER_L
Close to Speaker
SPK Wafer Box Type
Copyright 2015 LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only
USB DOWN STREAM
Fiber Optic
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
COMP_L_IN
COMP_Pr+
R40610K
AV_DET
R40910K
COMP_R_IN
C4021000pF50V
OPT
+3.3V_NORMALR40712K
COMP_DET
COMP_Pb+
R40812K
R402470K
R401470K C401
1000pF50V
OPT
COMP_Y+
SIDE_USB_DM
SIDE_USB_DP
+5V_USB
P4013AU04S-305-ZC-(LG)
12
34
5
ZD4065V
OPT
ZD405
ZD404
ZD402
ZD403
ZD401
ZD400
VR403OPT
VR401OPT
IC400MAX3232CDR
EAN41348201
3C1-
2V+
4C2+
1C1+
6V-
5C2-
7DOUT2
8RIN2
9ROUT2
10DIN2
11DIN1
12ROUT1
13RIN1
14DOUT1
15GND
16VCC
C4040.1uF
C4030.1uF
JK400KJA-PH-1-0177
3 M3_DETECT
4 M4
5 M5_GND
1 M1
6 M6
PM_TXD
C4060.1uF
C4000.1uF
C4050.1uF
PM_RXD
+3.3V_ST
D400
RCLAMP0502BAOPT C413
5pF50V
OPTC4145pF50V
OPT
VR402OPT
VR400OPT
JK401PPJ245N2-01
5A [GN/YL]O-SPRING
6A [GN/YL]E-LUG
4A [GN/YL]CONTACT
5B [BL]O-SPRING
7C [RD1]E-LUG-S
5C [RD1]O-SPRING
4C [RD1]CONTACT
5D [WH]O-SPRING
4E [RD2]CONTACT
5E [RD2]O-SPRING
6E [RD2]E-LUG
+3.3V_NORMAL
JK402JST1223-001
SPDIF
1
GND
2
VCC
3
VINPUT
4FIX_POLE
SPDIF_OUT
C4081uF10V
OPT
P400
12507WS-04L
1
2
3
4
5
R4000
1/16W5%
OPT
AR4001001/16W
AR40110K
1/16W
VA400
ICVS0518150FR_
OPT
VA401
ICVS0518150FR_
OPT
VA402
ICVS0518150FR_
OPT
JP425
JP424
JP422
JP423
R403751%comp-shape=3216
R40475 1%comp-shape=1005
R40575 1%
comp-shape=1005
C418
22uF
10V
OPT
2012
C417
22uF
10V
OPT
2012
5V_DET_HDMI_1
VR407OPT
5V_DET_HDMI_2
VR404OPT
D1-_HDMI1
D1+_HDMI1
VR409
OPT
R4101K
+5V_NORMAL
HPD2
VR406OPT
+5V_NORMAL
AR4104.7K
1/16W
DDC_SDA_1
D2+_HDMI1
D2-_HDMI1
DDC_SDA_2
R4111K
OPT
VR410OPT
Q400MMBT3904(NXP)
TR_NXP
E
B
C
HPD1
R4154.7K
VR411OPT
DDC_SCL_2
D0-_HDMI1
VR412OPT
CK+_HDMI1
R4164.7K
VR408OPT
R4132.7K
VR413OPT
VR405OPT
JK403
EAG62611204
14 NC
13 CE_REMOTE
5D1_GND
20
BODY_SHIELD
GND
12 CK-
11 CK_GND
2D2_GND
19 HP_DET
18 5V
10CK+
4D1+
1D2+
17 GND
9D0-
8D0_GND
3D2-
16 DDC_DATA
7D0+
6D1-
15 DDC_CLK
JK404
EAG59023302
14
NC
13
CE_REMOTE
5D1_GND
20
SHIELDGND
12
CK-
11
CK_GND
2D2_GND
19
HP_DET
18
5V
10CK+
4D1+
1D2+
17
GND
9D0-
8D0_GND
3D2-
16
DDC_DATA
7D0+
6D1-
15
DDC_CLK
D0+_HDMI1
AR4114.7K
1/16W
CK-_HDMI1
R4122.7K
R41810K
DDC_SCL_1
R414
10K
OPT
L401DLP11SA900HL2L
21
4 3
L402DLP11SA900HL2L
21
4 3
L403DLP11SA900HL2L
21
4 3
L404DLP11SA900HL2L
21
4 3
AR4095.11/16W
AR4085.11/16W
AR4075.11/16W
AR4065.11/16W
D0+_HDMI2
D2+_HDMI2
AR4045.11/16W
AR4055.11/16W
D1-_HDMI2
D401IP4283CZ10-TBA
OPT
3
2
4
1
5 6
7
8
9
10
D0-_HDMI2
AR4025.11/16W
CK-_HDMI2
AR4035.11/16W
D402IP4283CZ10-TBA
OPT
3
2
4
1
5 6
7
8
9
10
D1+_HDMI2
CK+_HDMI2
D2-_HDMI2
C41218pF50V
SPDIF
R41933
HDMI2_5V
R42010
Q400-*12N3904S
TR_KEC
E
B
C
C407
22uF
16V3216
C409
22uF
16V
OPT
3216
141020L15_M1L
EXTERNAL INTERFACE
4 5COMP/USB/SPDIF
UART For DEBUG
AV/COMPONENT
USB(SIDE)
SPDIF OPTIC JACK
ESD Ready
HDMI_1(REAR)
HDMI_2(SIDE)
Check!!HPD2 Pull-Up
HDMI_EMI_Filter
Copyright 2015 LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
C5070.1uF16V
+3.3V_TU
C50822uF6.3V
+3.3V_NORMAL
C5100.1uF
16V
C50922uF6.3V
TU_SCL
TU_SDA
R5031.8K
C50620pF50V
OPT
R5021.8K
+3.3V_TU
C50520pF50V
OPT
IF_P_MSTAR
IF_N_MSTAR
C50415pF50V
C50115pF50V
AR500331/16W
R50133
1/16W5%
R50033
1/16W5%
L500PZ1608U121-2R0TF
C503
0.1uF16V
+3.3V_TU
C500100pF50V
C5020.1uF16V
IF_AGC_MAIN
TU_GND_A
TDJH-H301F
TU501
47
SHIELD
6DIF[P]
7DIF[N]
8SIF
9CVBS
1+3.3V
2NC_1
3DIF_AGC
4SCL_RF
5SDA_RF
A1A1
B1B1
L15_M1L 140822
TUNER
3.3V_NORMAL -> 3.3V_TUTUNER for ATSC W/O Isolator
Close to the tuner
1. should be guarded by ground2. No via on both of them3. Signal Width >= 12mils Signal to Signal Width = 12mils Ground Width >= 24mils
5 5
should be guarded by ground
close to the tuner pin
Copyright 2015 LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only