Opportunities to Apply Phase Change Materials to …apps1.eere.energy.gov/.../webinar_pcm_enclosures_20111111.pdf · Opportunities to Apply Phase Change Materials to Building Enclosures

1 | Building America Program www.buildingamerica.gov

Buildings Technologies Program

Date: November 11, 2011

Opportunities to Apply Phase Change Materials to Building Enclosures

Welcome to the Webinar! We will start at 2:00 PM Eastern Time

Be sure that you are also dialed into the telephone conference call:

Dial-in number: 888-950-6757; Pass code: 6420234


Building America: Introduction

November 11, 2011

Chuck Booten

[email protected]

Building Technologies Program


• Reduce energy use in new and existing residential buildings

• Promote building science and systems engineering /

integration approach

• “Do no harm”: Ensure safety, health and durability are

maintained or improved

• Accelerate adoption of high performance technologies

www.buildingamerica.gov

Introduction to Building America


Building America Industry Consortia

Industry Research Teams

Habitat Cost Effective Energy Retrofit Program

NorthernSTAR Building America Partnership

Building Energy Efficient Homes for America (BeeHa)

http://www.ibacos.com/

http://building.dow.com/


Today’s Speaker

Dr. Kosny, winner of a 2009 R&D 100 Award for the development of phase-

change materials (PCMs), is a leading building envelope researcher with 30 years

experiences in the building sciences. Dr. Kosny holds a Ph.D. in Building Physics

from the Polish Academy of Sciences. His doctoral research was in area of

passive solar systems. Prior to joining Fraunhofer CSE, Dr. Kosny spent 12 years

teaching building science as a professor of the Rzeszow Technical University,

Poland and 18 years at Oak Ridge National Laboratory. While working for ORNL,

he developed a number of high-performance envelope concepts including

masonry systems, advanced roofing systems, light-gage steel framing and metal-

foam sandwich technologies. He has held a number of faculty positions,

published more than 120 technical articles, and has authored numerous patents

related to advanced building concepts. He has represented the United States at

many international organizations and standards bodies, including the

International Energy Agency. He has extensive experience collaborating with

industry to commercialize advanced building technologies. Particularly relevant to

the proposed presentation, he has worked with most major world manufacturers

of PCM technologies to develop novel dynamic building envelopes based on

integration of advanced heat storage components, local ventilation strategies,

and high-performance insulations (including aerogels, vacuum insulations,

reflective insulations, cool coatings, etc.).

© Fraunhofer USA 2009

Fraunhofer Center for Sustainable Energy Systems

Opportunities to Apply Phase Change

Materials to Building Enclosures

Jan Kosny Ph.D.

Building Enclosure Program

Lead

November 11, 2011

Cambridge, MA USA

[email protected] ph: 865-607-6962

mailto:[email protected]


Agenda

Introduction – A need for proper performance data for PCMs used in building applications - List of Motivations

2011 update on the Frasunhofer CSE PCM research

Challenges of DSC testing and computer simulations

New Dynamic testing methods and New Performance Label for PCMs

Dynamic testing with use of Heat Flow Meter Apparatus

Potential new ASTM and ISO standards for Dynamic Thermal Testing of non-uniform PCM-enhanced products

2

First successful application of PCMs in

buildings

November 11, 2011 Cambridge, MA, USA


MOTIVATION (I): Performance Problems of

Conventional Insulations

3 November 11, 2011 Cambridge, MA, USA


Title_date

Energy consumption change GJ/year

0.00

2.00

4.00

6.00

8.00

10.00

12.00

14.00

16.00

18.00

20.00

6 to 10

10 to

14

14 to

18

18 to

22

22 to

26

26 to

30

30 to

34

34 to

38

38 to

42

42 to

46

46 to

50

50 to

54

54 to

58

Atlanta Bakersfield Chicago Denver

Houston Knoxville Miami Minneapolis

Phoenix Seattle Washington DC

X starting attic R-value

X

R-4

GJ/y

ear

Conventional insulations work only effectively for low R-value

assemblies

ITCC - June 26 - 30, 2011 IEA Annex 24/42 – Sept. 20 - 21, 2011 November 11, 2011 Cambridge, MA, USA


MOTIVATION (II): Different Tactics – Different PCM

Configurations



European Approach – PCM-Impregnated Gypsum Board

PCM charged by

interior

temperature

swings and solar

gains through

glazing

Building HVAC

system used to

discharge PCM

Schematic of Distribution of Heating and

Cooling Loads in Old PCM Applications

Energy Discharged Later

by HVAC System

Cavity

Insulation

PCM-Gypsum Board

Exterior Finish

Exterior

Interior

Peak Loads

Energy Transferred INTO the Building

Energy Transferred Back

to the Environment

Solar Gains


Main Problem with Application of PCM Gypsum Boards in

the U.S. Air-Conditioned Buildings

Enthalpy for commonly-used paraffinic PCM

-45

-30

-15

0

15

30

45

16 17 18 19 20 21 22 23 24 25 26

TEMPERATURE [C]

[J/g

]

melting freezing

Thermostat temperature control +/-2degF

Enthalpy of commonly-used organic PCM


New Approach for PCM Installations In the U.S.

Use fluctuations in

exterior temperature

and solar irradiation

for charging and

discharging of PCM

PCM material has to

be able to fully

charge and

discharge energy

during 24-hour

dynamic cycle

Schematic of Distribution of Heating and Cooling

Loads in PCM-Enhanced Bldg. Envelopes


Peak Hour Energy Transferred

Back to the Environment

Thermally

Active Core

LOW HEAT

TRANSFER

ZONE

Gypsum Board

Low Delta T Min. Heat Transfer

Exterior Finish

Exterior

Interior

Peak Loads

Thermal insulation


Effectiveness of PCMs in cooling attic applications is well

documented (modeling and field testing results)

-0.50

-0.40

-0.30

-0.20

-0.10

0.00

0.10

0.20

6 12 18 24 30 36 42

time [h]

Btu

/ft2

-h

R-50 roof shingle R-100 roof shingle

R-5deck R-50 PCM R-5deck R-50

Two summer days

R-50

R-5 PCM

18.5 BTU

per ft2

R-50

R-5

R-50

R-100

Attic generated cooling loads



documented (full-scale field testing – MCA project)

2010 cooling season

65% - of # days with

PCM cycling

50% - of total cooling

load reduction

Over 90% - cooling

peak-hour load reduction

0

1

2

3

4

5

6

7

8

04

.02

.10

04

.09

.10

04

.16

.10

04

.23

.10

04

.30

.10

05

.07

.10

05

.14

.10

05

.21

.10

05

.28

.10

06

.04

.10

06

.11

.10

06

.18

.10

06

.25

.10

07

.02

.10

07

.09

.10

07

.16

.10

07

.23

.10

07

.30

.10

08

.06

.10

08

.13

.10

08

.20

.10

08

.27

.10

09

.03

.10

09

.10

.10

09

.17

.10

09

.24

.10

10

.01

.10

10

.08

.10

top melting/bottom frozen all layers cycling top freezing/bottom melted

# of days with PCM cycling



documented (Fraunhofer CSE full-scale test hut testing in New Mexico climate)

Full-scale testing performed for different manufactures of

building materials

General results for 2011:

Roofs: up to 60% cooling load reduction

comparing to traditional roof and attic designs

Walls: up to 50% cooling load reduction

comparing to traditional 2x4 wall assembly


2011 update of the Fraunhofer CSE PCM-database



Company Location Product

amount

Temp. Range (°C)

Raw

Data

Downloaded

Flyers

Testing

Method

Micro. Labs USA 17 -30~52 Yes (5) 16 DSC

PCES USA 4 23~29 Yes (4) No DSC

BASF Germany/

USA

9 21~26 Yes (1) 6 DSC

PCM UK 127 -114~885 No 5 tables -

RGEES USA 16 -27~88 Yes (16) 16 T-history

PLUSS India 18 -37~89 No 1 table T-history

(In)

ESI USA 32 -37~151 Yes (8) 1 table DSC

Climator Sweden 11 -21~70 No 11 -

JCXT China 18 5~110 No No -

SGL Germany/

USA

4 22~58°C DSC

Rubitherm Germany 49 -10~86°C No 3-layer

Calorimeter

Capzo Netherlands

Over 350 PCMs represented


1. Microtek Laboratories, Inc. (Micro. Labs)

Application: To maintain a regulated temperature

within a product such as textiles, building materials,

packaging, and electronic.

Types of encapsulated PCMs: MicroPCM’s,

MacroPCM’s, Ignition Resilient PCM’s,

Formaldehyde-free PCM’s, Custom PCM products

(Properties could be checked on the website)

Example of data input for a single PCM manufacture


Micro. Labs product list

MPCM28

Raw experiment data

MPCM18-D

MPCM37

MPCM42

MPCM52

Website Info

MPCM (-30)

MPCM (-30)D

MPCM (-10)

MPCM (-10)D

MPCM 6

MPCM 6D

MPCM 18

MPCM 18D

MPCM 28

MPCM 28D

MPCM 37

MPCM 37D

MPCM 43

MPCM 43D

MPCM 52

MPCM 52D

Microtek Laboratories, Inc. (Micro. Labs)





Basic Info Sample name MPCM28

Appearance (Form) White to slightly off-white color (Wet

cake)

Chemical components n-Octadecane

Organic/Inorganic Organic

Test Data Test method PerkinElmer Thermal Analysis (DSC)

Temp. change rate 5°C/min

Sample mass 2.100 mg

Melting Temp. 29.514°C

Freezing Temp. 23.843°C

Subcooling range 5.671°C

Melting overall enthalpy 164.204 kJ/kg

Freezing overall enthalpy 108.634 kJ/kg

Melting Temp. range 17.4°C~33.8°C

Freezing Temp. range 26.1°C~19.1°C


Challenges of DSC testing and computer simulations



Large Selection of Non-Uniform PCMs is in common

use today which cannot be tested in DSC

PCM blend


Key Temperatures of the PCM Transition Process


-45

-30

-15

0

15

30

45

16 17 18 19 20 21 22 23 24 25 26

TEMPERATURE [C]

[J/g

]

melting freezing

Temperature Range of Phase

Change Process

Lower

Temperature

Limit

Upper

Temperature

Limit


Example of estimation of temperature ranges for DHMA

test using H(T) chart for a blend of thermal insulation and

microencapsulated PCM.



0.0E+00

1.0E+05

2.0E+05

3.0E+05

4.0E+05

5.0E+05

6.0E+05

7.0E+05

8.0E+05

9.0E+05

1.0E+06

1.1E+06

-5 0 5 10 15 20 25 30 35 40 45 50 55

De

lta

en

tha

lpy J

/m^

2

Temperature, C

Delta enthalpy for PCM board J/m^2

DSC can be very useful in solving surprising situations



Advantages of Symmetrical Testing Processes

Transient effects on both plates of HFMA are identical

Since temperature profile is always symmetrical during

the experiment, it is possible to analytically estimate and

later subtract mass-related effects on both plates

Measurement errors generated by heat flux transducers

and heat diffusion time lags are identical on both plates

It is possible to subtract measurement errors generated

by heat flux transducers (due to dynamic character of the

test)



A standard testing HFMA equipment can be modified to

allow dynamic testing of PCM-enhanced products.

Normally the HFMAs are used to measure the apparent thermal

conductivity of materials as specified in ASTM C518.

12

17

22

27

32

37

42

47

0 20 40 60 80

Time [min]

Te

mp

era

ture

[d

eg

C]

bottom plate

upper plate

43oC

16oC



Major Challenges

Potential misinterpretation of

the enthalpy test data in

computer simulations



Major Challenges

Most of currently used whole

building energy simulation

models do not properly

represent PCM thermal

characteristics



Rate of Temperature Change Effects Enthalpy Profiles

Incorrect DSC data is very often used in whole building

computer simulations

27

DSC Melting DSC Freezing

Temp. deg CTemp. deg CJ/

Kg

K

J/K

gK

Heating rate Heating rate

Lower temperature limit of PCM freezing range

Upper temperature limit of PCM melting range



PCM subcooling effect is not properly represented

Estimation of upper and lower temperature limits for sample of the PCM-

enhanced material or composites using original DSC test data for PCM (paraffinic

PCM data shown).


-10,000.00

-8,000.00

-6,000.00

-4,000.00

-2,000.00

0.00

2,000.00

4,000.00

6,000.00

8,000.00

10,000.00

-6.0

0

-4.0

0

-2.0

0

0.0

0

2.0

0

4.0

0

6.0

0

8.0

0

10

.00

12

.00

14

.00

16

.00

18

.00

20

.00

22

.00

24

.00

26

.00

28

.00

30

.00

32

.00

34

.00

36

.00

38

.00

40

.00

42

.00

DSC uW

24.0 oC (75.2 oF) 27.2 oC (81.0 oF)

24.0 oC (75.2 oF)

25.7 oC (78.3 oF) 31.8 oC (89.2 oF)

32.0

0

50

.00

68

.00

86

.00

10

4.0

0

oF

Phase transition range


Need for Development of Enthalpy Charts for PCM-

Enhanced Materials and Systems

Initial Differential Scanning Calorimeter (DSC) tests for pure PCMs or PCM microcapsules, only

Additions to PCM-based blends make a difference; Dynamic Heat Flow Meter Apparatus tests were introduced in 2006 for PCM-enhanced insulations - fire retardant effect, adhesives, not-working PCM pellets, etc….

0.00

2.00

4.00

6.00

8.00

10.00

12.00

16.00 18.00 20.00 22.00 24.00 26.00 28.00

Temp [deg C]

J/g

DSC 80% 67%


Dynamic Test Methods Used in Analysis of PCMs and

PCM-Enhanced Products

DSC – only for uniform PCMs

T-history method

Dynamic Heat Flow Apparatus Method

• Symmetrical process

• Non-symmetrical process

Dynamic Guarded Hot-Plate Method – only speculations so far

Dynamic Hot-Box Method



Complex arrays of PCM containers are extremely difficult

to test in conventional HFMA equipment Example of estimation of the measure area for the arrays of PCM

pouches or PCM containers.

Measure AreaMeasure Area

Measure area needs to contain representative

geometry of the measured array of PCM containers



Potential area for misuse of the experimental data on PCM-

enhanced products for most-likely marketing purposes

32 ITCC - June 26 - 30, 2011


-45

-30

-15

0

15

30

45

16 17 18 19 20 21 22 23 24 25 26

TEMPERATURE [C]

[J/g

]

melting freezing

For what temperature range PCM enthalpy should be calculated if cp-related

effects are included together with phase transition–related effects?

This

one?

Or, this one ???


M-value – New Energy Performance Label for PCM-

Enhanced Products Expressing only phase transition-related enthalpy change



Understanding of Enthalpy Profile in estimation of M-value

H

Temp.

It is possible to analytically estimate and later subtract cp-related enthalpy

changes for both frozen and melted stages of the testing.



Basic Heat Transport Equations:

The one-dimensional heat transport equation for such a case is as follows:

where; ρ and λ are the material density and thermal conductivity, T and h are temperature and enthalpy per unit mass. Heat flux q is given by:

The enthalpy derivative over the temperature (with consideration of constant pressure) represents the effective heat capacity, with phase change energy being one of the components:

Effective heat capacity, ceff, for a material which is a blend of insulation and PCM may be expressed as

where α denotes the percentage of PCM, cins the specific heat of insulation without PCM and ceffPCM is effective heat capacity of PCM.

Th

t x x

,,

T x tq x t

x

eff

hc T

T

1eff ins effPCMc c c



Practical determination of M-value based on the DHFMA data

0.0E+00

2.0E+05

4.0E+05

6.0E+05

8.0E+05

1.0E+06

1.2E+06

1.4E+06

1.6E+06

1.8E+06

2.0E+06

2.2E+06

2.4E+06

2.6E+06

4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40

Vo

lum

etr

ic s

pe

cif

ic h

ea

t, J

/(m

^3

K)

Temperature, C

Volumetric Heat Capacity A

Volumetric Heat Capacity B

Volumetric Heat Capacity C

cp related change for

frozen PCM

cp related change

for melted PCM

Phase

transition

range

Subtract cp

related

change for

melted PCM

Subtract cp

related

change for

frozen PCM

>5%

enthalpy

change per

temperature

step



Final Result



Example of Dynamic Heat Flow Metter Apparatus

Testing of Loose-Fill Insulations Mixed with

Microencapsulated PCM



Enthalpy change profiles for 2oC temperature steps

39

0.0E+00

1.0E+06

2.0E+06

3.0E+06

4.0E+06

5.0E+06

6.0E+06

7.0E+06

4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40

Vo

lum

etr

ic H

Pro

file

, J/(

m3)

Temperature, C

Volumetric H (A)

Volumetric H (B)

Volumetric H (C)



0.0E+00

2.0E+05

4.0E+05

6.0E+05

8.0E+05

1.0E+06

1.2E+06

1.4E+06

1.6E+06

1.8E+06

2.0E+06

2.2E+06

2.4E+06

2.6E+06

4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40

Vo

lum

etr

ic s

pe

cif

ic h

ea

t, J

/(m

^3

K)

Temperature, C

Volumetric Heat Capacity A

Volumetric Heat Capacity B

Volumetric Heat Capacity C

Final Test Results

40

Described above measurements yielded the total enthalpy of the tested PCM-enhanced

material of 16.25 J/g, with a +/-3.4% difference between the highest and lowest results.



Future Fraunhofer CSE Work

Addition of new PCMs to the database

Addition of new PCM-enhanced products???

Introduction of the uniform performance label for PCMs

Dynamic testing of more material samples

Whenever it is possible compare DHFMA data with DSC or T-history test data

More testing with different temperature steps

Modeling leading to optimization of the temperature step – as a function of specimens thermal conductivity and thickness

Field testing of PCM systems

Development of the ASTM and ISO standards


© Fraunhofer USA 2009 ITCC - June 26 - 30, 2011 [email protected] ph: 865-607-6962

mailto:[email protected]


Buildings Technologies Program

To submit a question, click on the Q&A link on the top bar of

your screen, type the question in the box, and click “Ask.”

Our speaker will address as many questions as time allows.

Q&A Session


Download today’s presentation at:

www.buildingamerica.gov/meetings.html

Documents

Opportunities to Apply Phase Change Materials to …apps1.eere.energy.gov/.../webinar_pcm_enclosures_20111111.pdf · Opportunities to Apply Phase Change Materials to Building Enclosures