PATTERNED MEDIA TECHNOLOGY

An Equipment Perspective

Ren XuSeptember 17-18, 2008

Think Lean. Create Value.

Jan 2008_Needham_Slide 2Intevac–DiskConUSA2008 Slide 2Think Lean. Creat4e Value.

Outline

2008 StatusBPM/DTR Pilot/MFG LineProcesses ApproachEquipment Technology

Key Drivers of Current Equipment TrendThroughput—Cost—Platform—ModuleMedia Process Development

Intevac Strategy200L Gen II PlatformModular Approach to Key Process CapabilitiesHW—Modular Demo’s—Platform Test Bed—Customer Site Installations—Process Development/Validation—Ramping

Summary and Outlook

Jan 2008_Needham_Slide 3Intevac–DiskConUSA2008 Slide 3Think Lean. Creat4e Value.

Current StatusInitial Discrete-Track Recording (DTR) and/or Bit-Patterned Media (BPM) 2.5” Disk Development

Nano Imprint Lithography Resist Pattern IBE/RIE/Wet-Etch/ Ion Implantation of Substrate/SUL/Magnetic Layers

Magnetic Layer Patterning Test Via Two Routes:Physical patterning of Mag layer/SUL/substrate (etch)Chemical patterning of Mag layer by doping (implantation)

Fully Functional DTR/BPM Disks From Manufacturing-Capable Equipment Line is Essential to DTR/BPM Drive Product Development

Key Missing Link: Manufacturable Process at High DPH, High Reliability Equipment Line-Up Enabling Development/ Production of Fully Finished, Flyable, Guzik Testable Disks

Jan 2008_Needham_Slide 4Intevac–DiskConUSA2008 Slide 4Think Lean. Creat4e Value.

Pilot/Manufacturing Line Outlook

Clean Substrate

Cont. Media(200L Gen II)

SeedLULIL

Multiple MagLCOC

Vapor Lube

(AccuLuber)

Glide Test(Burnishing

Pass, GlideHeight

Test)

Bonding(UV,

Thermal)Certification

Test

Shipment

BurnishNano ImprintLithography

(LithoPrime)

QA

Lean DTR/BPM(Patterning)

De-Scum/TrimHard Mask

EtchResist Strip

Mag Stack EtchPlanarization

COC

Continuous Media Proc/Eqpt Bit Patterned MediaNano Imprint Lithography

Jan 2008_Needham_Slide 5Intevac–DiskConUSA2008 Slide 5Think Lean. Creat4e Value.

Key Equipment Trend Drivers

Process Development for Advanced Continuous Media

Patterning Approaches (Cap, NIL, Etching Strategy, Planarization, HDI)

Winning DTR/BPM Process Approach: Manufacturable, Cost Effective, and Scalable

Equipment Platform, Module, Throughput, Cost

All Encompassing, Universal Enabler for Industry-Wide Process Development and Technology Evolution

Jan 2008_Needham_Slide 6Intevac–DiskConUSA2008 Slide 6Think Lean. Creat4e Value.

DTR/BPM Challenges: Product Cost

Throughput Identified as the Main Per-Disk Cost Driver

Impact of Equipment Cost Diminishes at Sufficiently High Throughput

Model Basis: 15M/QTR Capacity at 1.5M Disks/Line

Cost/DPH

New Eqpt (M$)

Base DPH

No. Tool Per Line

CapitalCost (M$)

Substrate Cost

PMR BOM

PMR Eqpt

NewEqpt Labor Facilities

Total Cost

H/L 15 12 83 1250 1.75$ 1.46$ 0.55$ 34.72$ 0.48$ 0.15$ 39.11$ L/L 5 12 83 417 1.75$ 1.46$ 0.55$ 11.57$ 0.48$ 0.15$ 15.96$ H/M 15 120 8 125 1.75$ 1.46$ 0.55$ 3.47$ 0.11$ 0.04$ 7.38$ L/M 5 120 8 42 1.75$ 1.46$ 0.55$ 1.16$ 0.11$ 0.04$ 5.07$ H/H 15 1000 1 15 1.75$ 1.46$ 0.55$ 0.42$ 0.07$ 0.03$ 4.28$ L/H 5 1000 1 5 1.75$ 1.46$ 0.55$ 0.14$ 0.07$ 0.03$ 4.00$

PMR PMR 0 1000 0 0 1.75$ 1.46$ 0.55$ -$ 0.04$ 0.02$ 3.82$

DTR/BPM Assumptions Per Disk Cost Base and Cost Adder

DTR

and

BPM

Cat

egor

y

Cost/DPH

New Eqpt (M$)

Base DPH

No. Tool Per Line

CapitalCost (M$)

Substrate Cost

PMR BOM

PMR Eqpt

NewEqpt Labor Facilities

Total Cost

H/L 15 12 83 1250 1.75$ 1.46$ 0.55$ 34.72$ 0.48$ 0.15$ 39.11$ L/L 5 12 83 417 1.75$ 1.46$ 0.55$ 11.57$ 0.48$ 0.15$ 15.96$ H/M 15 120 8 125 1.75$ 1.46$ 0.55$ 3.47$ 0.11$ 0.04$ 7.38$ L/M 5 120 8 42 1.75$ 1.46$ 0.55$ 1.16$ 0.11$ 0.04$ 5.07$ H/H 15 1000 1 15 1.75$ 1.46$ 0.55$ 0.42$ 0.07$ 0.03$ 4.28$ L/H 5 1000 1 5 1.75$ 1.46$ 0.55$ 0.14$ 0.07$ 0.03$ 4.00$

PMR PMR 0 1000 0 0 1.75$ 1.46$ 0.55$ -$ 0.04$ 0.02$ 3.82$

DTR/BPM Assumptions Per Disk Cost Base and Cost Adder

DTR

and

BPM

Cat

egor

y

Jan 2008_Needham_Slide 7Intevac–DiskConUSA2008 Slide 7Think Lean. Creat4e Value.

Process Approach & Equipment Technology

ProcessContinuous Media, Full Stack Mag-Layer NIL Resist Pattern Finished DTR/BPM Disk, Full Stack and Flyable/TestableKey New Processes: – De-Scum/Trim/Resist Strip– Sputtered Carbon/Metal Hard Mask Etch – Mag-Stack Etch– Carbon/Metal or Oxide Dep/Etch/Dep/Etch...Planarization

Process ModulesICP Source: De-Scum/Trim/StripMagnetic Layer Hard Etch: IBE/RIE and OthersPlanarization: – Carbon: Sputter Carbon + Reactive Etch Back– Oxide/Metal: RF/DC Sputter + Etch Back

System200 Lean Gen II Platform Incorporating New SourcesProgressive, Approach/Match Current 200 LEAN Gen II Throughput

Jan 2008_Needham_Slide 8Intevac–DiskConUSA2008 Slide 8Think Lean. Creat4e Value.

200 Lean - BPM Process and Tool Configuration

Media Process DrivesMedia Process DrivesTool Configuration DrivesTool Configuration DrivesModule/EquipmentModule/EquipmentTechnology DevelopmentTechnology Development

Jan 2008_Needham_Slide 9Intevac–DiskConUSA2008 Slide 9Think Lean. Creat4e Value.

PMR and Patterned Media Process Steps

PatterningDTR/BPM200 Lean® Gen II• De-Scum/Trim• C-Hard Mask• Resist Strip• Etch• Planarization

Clean Substrate

Plate

PolishPolish

Clean

Texture(not needed with PMR)

Clean

Sputter200 Lean®• SeedL• UL• IL• Multiple MagL• COC

Nano Imprint LithographyLithoPrime™

Vapor LubricationAccuLuber™

GlideCertify

QAShipment

Blank

(TB) Tape Burnish

UV Bonding

Jan 2008_Needham_Slide 10Intevac–DiskConUSA2008 Slide 10Think Lean. Creat4e Value.

Intevac Commitment to the HDD Industry

PMR Ramp and DTR/BPM Transition

Committed to Making 200 Lean Extendible to All PMR, HAMR and Patterned Media Technology Generations

Focused on Continuous Technology Advancement and Cost Effectiveness

Enabling New Media Technology