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© June 13, 2010 Dr. Lynn Fuller Microsystem Prototype Components Page 1 Rochester Institute of Technology Microelectronic Engineering ROCHESTER INSTITUTE OF TECHNOLOGY MICROELECTRONIC ENGINEERING Microsystem, PCB and Protoboard Components Dr. Lynn Fuller Webpage: http://people.rit.edu/lffeee Microelectronic Engineering Rochester Institute of Technology 82 Lomb Memorial Drive Rochester, NY 14623-5604 Tel (585) 475-2035 Fax (585) 475-5041 Email: [email protected] Department webpage: http://www.microe.rit.edu 6-13-2010 PCB_Protoboard_Components.ppt

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© June 13, 2010 Dr. Lynn Fuller

Microsystem Prototype Components

Page 1

Rochester Institute of Technology

Microelectronic Engineering

ROCHESTER INSTITUTE OF TECHNOLOGYMICROELECTRONIC ENGINEERING

Microsystem, PCB and Protoboard Components

Dr. Lynn FullerWebpage: http://people.rit.edu/lffeee

Microelectronic EngineeringRochester Institute of Technology

82 Lomb Memorial DriveRochester, NY 14623-5604

Tel (585) 475-2035Fax (585) 475-5041

Email: [email protected] webpage: http://www.microe.rit.edu

6-13-2010 PCB_Protoboard_Components.ppt

© June 13, 2010 Dr. Lynn Fuller

Microsystem Prototype Components

Page 2

Rochester Institute of Technology

Microelectronic Engineering

INTRODUCTION

The design of microsystems involves the integration of MEMS, on chip custom integrated circuits, off chip electronics such as power supply chips, microcontrollers and communication components. The integration is often done at the printed circuit board (PCB) level. This document will illustrate some of the various components used at the prototype, PCB and System level.

Protoboard PCB, MEMS

© June 13, 2010 Dr. Lynn Fuller

Microsystem Prototype Components

Page 3

Rochester Institute of Technology

Microelectronic Engineering

MICROSYSTEM DESIGN

Signal Conditioning Electronics

µP....

.

.

.

.

Multi-Sensor MEMs Chip

Micro Controller

Power Management

Com

munic

atio

n

Sig

nal

Cond

itio

ning

other

© June 13, 2010 Dr. Lynn Fuller

Microsystem Prototype Components

Page 4

Rochester Institute of Technology

Microelectronic Engineering

PCB PROTOTYPE

Prototype evaluation: breadboard sensors and signal processing electronics at the PCB level to evaluate different approaches for realizing microsystems.

Jirachai, Murat Baylav

Jennifer AlbrechtJirachai Dan Smith

© June 13, 2010 Dr. Lynn Fuller

Microsystem Prototype Components

Page 5

Rochester Institute of Technology

Microelectronic Engineering

MEMS Universal Fluid Interrogation Sensor (MUFINS)

0.8

0.85

0.9

0.95

1

0 100 200 300 400 500 600

Kinematic Viscosity ( cSt )

No

rma

lized

Fre

que

ncy

.

0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1

Temperature ( °C )

No

rma

lized

Q

.

D25-norm-T

Q normal

57 42 36 32 29

pH

Viscosity

Spectroscopic impedanceZe ro-S pa n Com pe nsa te d Pr e ssure S e nsor ov e r

Te m pe ra ture

0.00

5.00

10.00

15.00

20.00

25.00

30.00

35.00

40.00

45.00

50.00

0 5 10 15 20

P re ss ure [p si ]

Ou

tpu

t V

olt

ag

e [m

V]

T = 27 C T = 57 C T = 84 C

Pressure

500

600

700

800

20 25 30 35 40 45

Vout

(mV

)

Temperature

0

500

1000

0 2505007501000

Vout

(mV

)

NTU

Turbidity

Fluid Level and Conductivity

Applications:

•Drinking water

•Automobile engine oil

•Industrial Fluids

© June 13, 2010 Dr. Lynn Fuller

Microsystem Prototype Components

Page 6

Rochester Institute of Technology

Microelectronic Engineering

GATE LEVEL DESIGN AND SIMULATION

R

C

RC Oscillator

Vout

U2

uA741

3

2

74

6

1

5+

-

V+

V-

OUT

OS1

OS2

U1A

7414

1 2

V

0

VEE

PARAM ET ERS:

Cvar = 10e-12

VEE

R1

47k

VCC

V1

5VDC

VCC

V2

5VDC

0

C2

{Cvar}

© June 13, 2010 Dr. Lynn Fuller

Microsystem Prototype Components

Page 7

Rochester Institute of Technology

Microelectronic Engineering

TRANSISTOR LEVEL CIRCUIT DESIGN AND SIMULATION

1

2V19V

+-

M1

7

3

M3

M2

RC_OSCILLATOR.TXT

M4

C1

M5

M6

4M7 M8

30 pF

3.0pF

© June 13, 2010 Dr. Lynn Fuller

Microsystem Prototype Components

Page 8

Rochester Institute of Technology

Microelectronic Engineering

PROTOBOARD REALIZATION

Heidi Purrington

© June 13, 2010 Dr. Lynn Fuller

Microsystem Prototype Components

Page 9

Rochester Institute of Technology

Microelectronic Engineering

EXPRESS PCB – FREE SOFTWARE FOR PCB DESIGN

Using “Express PCB”

free software

© June 13, 2010 Dr. Lynn Fuller

Microsystem Prototype Components

Page 10

Rochester Institute of Technology

Microelectronic Engineering

ARTWORK GENERATION

Print using a laser printer onto a transparency

© June 13, 2010 Dr. Lynn Fuller

Microsystem Prototype Components

Page 11

Rochester Institute of Technology

Microelectronic Engineering

MAKE COPPER PCB BOARD

1. Cut two sided copper board (6”x 9”) into smaller size that can be spin coated with photoresist (3”x 3”). Use shear in machine shop.

2. Clean Board with 400 grit sand paper or very fine steel wool followed by using Soap, Water and Blow Dry.

3. Spin coat with photoresist (HPR504) at 1500 rpm, 60 sec.4. Bake in Oven 100°C, 4 min. (gray oven near ion implanter)5. Place Transparency on Board and Flatten with Glass Plate6. Flood Expose, (10 sec = ~ 100mj/cm2) on Karl Suss MA1507. Develop in CD-26 Developer (~1 min), inspect8. Repeat 2 to 5 for other side of two sided board9. Test with drop of etch mixture on bare copper area, rinse, dry10. Hard bake in Oven 140°C 15 min11. Etch in Mixture of Water, H2O2, HCl (3:2:1)12. Strip Resist in Acetone, Rinse in Water13. Drill holes.14. Cut Board into Individual Packages Using Shear in Machine

Shop.

© June 13, 2010 Dr. Lynn Fuller

Microsystem Prototype Components

Page 12

Rochester Institute of Technology

Microelectronic Engineering

MAKE COPPER PCB BOARD

2-sided copper PCB 1/32” x 6”x9”

473-1011-ND $8.82

Shear

Small Shear

© June 13, 2010 Dr. Lynn Fuller

Microsystem Prototype Components

Page 13

Rochester Institute of Technology

Microelectronic Engineering

MAKE COPPER PCB BOARD

Oven

SCS Spin Coater

© June 13, 2010 Dr. Lynn Fuller

Microsystem Prototype Components

Page 14

Rochester Institute of Technology

Microelectronic Engineering

MAKE COPPER PCB BOARD

Flood Expose(10 sec = ~ 100mj/cm2)

Karl Suss MA150

© June 13, 2010 Dr. Lynn Fuller

Microsystem Prototype Components

Page 15

Rochester Institute of Technology

Microelectronic Engineering

PCB

Drinking Water Sensor

Heidi Purrington, 2009

© June 13, 2010 Dr. Lynn Fuller

Microsystem Prototype Components

Page 16

Rochester Institute of Technology

Microelectronic Engineering

PICK, PLACE AND SOLDER TOOL

Jeff [email protected]

78-1552

CEMA – Center for Electronics Manufacturing and Assembly

© June 13, 2010 Dr. Lynn Fuller

Microsystem Prototype Components

Page 17

Rochester Institute of Technology

Microelectronic Engineering

ADXL325 ALIGNMENT IMAGES

Copper Traces with Solder PasteImage of bottom of ADXL325

Superimposed on Copper Traces

© June 13, 2010 Dr. Lynn Fuller

Microsystem Prototype Components

Page 18

Rochester Institute of Technology

Microelectronic Engineering

BMA140 ALIGNMENT IMAGES

Copper Traces with Solder PasteImage of bottom of BMA140

Superimposed on Copper Traces

© June 13, 2010 Dr. Lynn Fuller

Microsystem Prototype Components

Page 19

Rochester Institute of Technology

Microelectronic Engineering

TEMPERATURE RAMP DURING SOLDERING

© June 13, 2010 Dr. Lynn Fuller

Microsystem Prototype Components

Page 20

Rochester Institute of Technology

Microelectronic Engineering

COMPLETED BOARD WITH SOLDERED COMPONENTS

© June 13, 2010 Dr. Lynn Fuller

Microsystem Prototype Components

Page 21

Rochester Institute of Technology

Microelectronic Engineering

SURFACE MOUNT

© June 13, 2010 Dr. Lynn Fuller

Microsystem Prototype Components

Page 22

Rochester Institute of Technology

Microelectronic Engineering

XRAY IMAGE OF ADXL325 SOLDER JOINTS

Glenbrook X-Ray Inspection

© June 13, 2010 Dr. Lynn Fuller

Microsystem Prototype Components

Page 23

Rochester Institute of Technology

Microelectronic Engineering

XRAY IMAGE OF BMA140 SOLDER JOINTS

Shows Possible Problem with Y and Z outputs shorted together

© June 13, 2010 Dr. Lynn Fuller

Microsystem Prototype Components

Page 24

Rochester Institute of Technology

Microelectronic Engineering

MEMS MULTI-SENSOR CHIP’s

1-AxisAccelerometerTemperature SensorHumidity SensorX & Y Strain Sensor

4mm x 4mm Chip

Prognostic Integrated Sensory MEMS (PRISM)

Health Management Solution to Predict

Equipment Performance and Readiness

© June 13, 2010 Dr. Lynn Fuller

Microsystem Prototype Components

Page 25

Rochester Institute of Technology

Microelectronic Engineering

MULTISENSOR MICROSYSTEM

MEMS Multisensor Chip

Acceleration (shock)

Temperature, Humidity

Back

Front

µP

© June 13, 2010 Dr. Lynn Fuller

Microsystem Prototype Components

Page 26

Rochester Institute of Technology

Microelectronic Engineering

PARTIAL LIST OF PROTOTYPE COMPONENTS

Power Conditioning Components:NEG Lin Regulator; Voltage Converter CMOS SW-CAP; POS Lin Regulator; 3.3V Regulator;

Integrated Circuits:Schmitt Inverter; Op Amp Lo Voltage MOS; Microcontroller; Counter/Shift Register, Instrumentation Amplifier, Multiplier, Waveform Generator

Passive: 100Kohm, 10Kohm, 1Kohm Trimpot; SMD Resistors many values from 100ohm to 10 MEG ohm; Axial Lead Resistors ¼ watt, all values; Chip Capacitors 0.001uF, 0.1uF, 1.0uF, 10uF, more;

Other:LEDs IR, Red, Green, Blue, White, Yellow; Diodes, MOSFETs N and P; Bluetooth Radio

Hardware: Connector for Pin Strip Header, Pin Strip Header, 2-sided copper PCB

© June 13, 2010 Dr. Lynn Fuller

Microsystem Prototype Components

Page 27

Rochester Institute of Technology

Microelectronic Engineering

PROTOTYPE AND PCB PARTS

© June 13, 2010 Dr. Lynn Fuller

Microsystem Prototype Components

Page 28

Rochester Institute of Technology

Microelectronic Engineering

POWER CONDITIONING COMPONENTS

Description Digikey Part Number Package ~Price

POS Lin Regulator Variable LM317MBSTT3GOSCT-ND

SOT-223 $0.72

POS Lin Regulator 3.3 Volt 576-1151-ND 8-SOIC $1.11

Voltage Converter CMOS SW-CAP MAX1044CPA+-ND 8-DIP $2.68

Voltage Converter CMOS SW-CAP MAX1044CSA+-ND 8-SOIC $3.26

NEG Lin Regulator 296-11417-5-ND 8-SOIC $5.60

8-SOIC

8-DIP

SOT-223

© June 13, 2010 Dr. Lynn Fuller

Microsystem Prototype Components

Page 29

Rochester Institute of Technology

Microelectronic Engineering

SWITCHED CAPACITOR VOLTAGE CONVERTER

MAX1044CSA+-NDCMOS1.5-10 Volt Supply

© June 13, 2010 Dr. Lynn Fuller

Microsystem Prototype Components

Page 30

Rochester Institute of Technology

Microelectronic Engineering

INTEGRATED CIRCUITS

Description Digikey Part Number Package ~Price

Hex Schmitt Inverter CD40106BCN-ND 14-DIP $0.40

Hex Schmitt Inverter CD40106BCMXCT-ND 14-SOIC $0.32

Quad Op Amp Lo Voltage MOS NJU7034D-ND 14-DIP $1.43

Dual Op Amp Lo Voltage MOS NJU7032M#-ND 8-DMP $0.83

Quad Bipolar Op Amp 1.8to12V MC33204DGOS-ND 14-SOIC $1.46

PIC33 Microcontroller DSPIC33FJ64MC804-E/PT-ND

44-TQFP $7.26

CD4034B 8-Stage Counter/Shift 296-14237-ND 24-DIP $1.88

14-DIP24-DIP

44-TQFP

© June 13, 2010 Dr. Lynn Fuller

Microsystem Prototype Components

Page 31

Rochester Institute of Technology

Microelectronic Engineering

INTEGRATED CIRCUITS

Description Digikey Part Number Package ~Price

AD9833 Waveform Generator MAX038CWP+-ND 10-MSOP $8.20

AD534 Analog Multiplier AD534JDZ-ND 14-CDIP $31.58

Instrumentation Amplifier INA101HP-ND 14-DIP $19.13

14-CDIP14-SOIC 10-MSOP

© June 13, 2010 Dr. Lynn Fuller

Microsystem Prototype Components

Page 32

Rochester Institute of Technology

Microelectronic Engineering

HEX INVERTER WITH HYSTERESIS

CD40106CMOS3-15 Volt Supply

© June 13, 2010 Dr. Lynn Fuller

Microsystem Prototype Components

Page 33

Rochester Institute of Technology

Microelectronic Engineering

LOW VOLTAGE CMOS OP AMP

NJU7032MCMOS3-16 Volt Supply

© June 13, 2010 Dr. Lynn Fuller

Microsystem Prototype Components

Page 34

Rochester Institute of Technology

Microelectronic Engineering

MICRO-CONTROLLER (µP)

3 to 3.6 Volt Supply-40 to 85°C13 Analog Input Channels, 10 BitDAC Output 15 Bit, 100KspsSerial Communication PortMore

© June 13, 2010 Dr. Lynn Fuller

Microsystem Prototype Components

Page 35

Rochester Institute of Technology

Microelectronic Engineering

Proposed Sine Wave Generator Chip

§ MAX038 / MAX038CWP Waveform Generator

§ VSUPPLY = ±5 V ~40mA each

§ VSINE = ±1 V

§ fSINE = 4 MHz

AC signals used in the test circuitry must be

sine waves because high frequency

components of square waves were coupling to other sensors on the chip.

20-SOIC

20-DIP

© June 13, 2010 Dr. Lynn Fuller

Microsystem Prototype Components

Page 36

Rochester Institute of Technology

Microelectronic Engineering

PASSIVE COMPONENTS

Description Digikey Part Number Package ~Price

1/10 watt, Thick Film Chip Resistors, 10M, 2M, 1M, 200K, 100K, 20K, 10K, 6.04K, 2K, 1K, 604, 200, 100

RHMxxxyHCT-ND* 0603SMD $0.08

Chip Capacitors, 16-50V,100pf, 1000pf, 0.1uF, 1.0uF, 10uF

399-xxxx-1-ND SMD $0.05 -$0.55

100K ohm potentiometer 3006-104LF-ND 3-lead $1.70

10K ohm potentiometer 3006Y-103LF-ND 3-lead $1.70

1K ohm potentiometer 3006Y-102LF-ND 3-lead $1.70

100K ohm 3mm Trimpot 3313J-104ECT-ND SMD $1.50

10K ohm 3mm Trimpot 3313J-103ECT-ND SMD $1.50

1K ohm 3mm Trimpot 3313J-102ECT-ND SMD $1.50

* RHM = Rohm Semiconductor, xxx= 2 or 3 digits for resistance value, y = power of 10 multiplier, H = 1%, CT=cut tape, Example RHM12.0KHCT-ND is 12.0 Kohm

© June 13, 2010 Dr. Lynn Fuller

Microsystem Prototype Components

Page 37

Rochester Institute of Technology

Microelectronic Engineering

PASSIVE COMPONENTS - RESISTORS

Chip Resistors

© June 13, 2010 Dr. Lynn Fuller

Microsystem Prototype Components

Page 38

Rochester Institute of Technology

Microelectronic Engineering

PASSIVE COMPONENTS - CAPACITORS

Size see next page

© June 13, 2010 Dr. Lynn Fuller

Microsystem Prototype Components

Page 39

Rochester Institute of Technology

Microelectronic Engineering

CHIP CAPACITORS

L x W = 2mm x 1.25mm

© June 13, 2010 Dr. Lynn Fuller

Microsystem Prototype Components

Page 40

Rochester Institute of Technology

Microelectronic Engineering

PASSIVE COMPONENTS - TRIMPOT

10 plus 2 more zeros = 1000 ohms

© June 13, 2010 Dr. Lynn Fuller

Microsystem Prototype Components

Page 41

Rochester Institute of Technology

Microelectronic Engineering

OTHER COMPONENTS

Description Digikey Part Number Package ~Price

NMOSFET BS107P 200V 3.3A IRF610PBF TO-220 $0.68

PMOSFET 100V 230ma Vth~-2.5 ZVP2110A-ND TO92-3 $1.13

NMOSFET 100V 320ma Vth~2.5 ZVN2110A-ND TO92-3 $0.81

PMOSFET 100V 75ma Vth~-2.5 ZVP3310FCT-ND SOT23-3 $0.83

NMOSFET 100V 100ma Vth~2.5 ZVN3310FCT-ND SOT23-3 $0.70

MOSFETs Matching N and P in same package

UP0497900LCT-ND 6-SSMINI

$0.71

Surface Mount NPN BJT MMBT3904LT3GOSCT SOT23-3 $0.07

Surface Mount PNP BJT MMBT4403LT1GOSCT SOT23-3 $0.07

TO-220SOT23-3

TO92

© June 13, 2010 Dr. Lynn Fuller

Microsystem Prototype Components

Page 42

Rochester Institute of Technology

Microelectronic Engineering

OTHER COMPONENTS

Description Digikey Part Number Package ~Price

IR LEDs 751-1027-ND Axial $0.50

1N4448 Diode 1N4448CT-ND Axial $0.062

1N4448 Diode BAS-16 BAS16FSCT-ND SOT23-3 $0.031

SFH4110 IR Diode Side Look – 950nm 475-1087-ND Axial $0.31

SEP8736 IR Diode Side Look – 880 nm 480-1969-ND Axial $1.38

CSD01060A SiC Schottky Diode CSD01060A-ND TO220-2 $1.38

Side

Looking

Axial

© June 13, 2010 Dr. Lynn Fuller

Microsystem Prototype Components

Page 43

Rochester Institute of Technology

Microelectronic Engineering

1N4448 DIODE

Axial

SOT-23

© June 13, 2010 Dr. Lynn Fuller

Microsystem Prototype Components

Page 44

Rochester Institute of Technology

Microelectronic Engineering

DISCRETE MOS TRANSISTORS

ZVN2110A

TO92

Vt = 1.5

© June 13, 2010 Dr. Lynn Fuller

Microsystem Prototype Components

Page 45

Rochester Institute of Technology

Microelectronic Engineering

DISCRETE MOS TRANSISTORS

ZVP2110A

TO92

Vt = 3.0

© June 13, 2010 Dr. Lynn Fuller

Microsystem Prototype Components

Page 46

Rochester Institute of Technology

Microelectronic Engineering

DISCRETE MOS TRANSISTORS – SURFACE MOUNT

D

S

G

D

S

G

© June 13, 2010 Dr. Lynn Fuller

Microsystem Prototype Components

Page 47

Rochester Institute of Technology

Microelectronic Engineering

OTHER

Description Digikey Part Number Qty ~Price

Receptacle for Pin Strip Header 929850E-01-36-ND 36 pin row $3.31

Pin Strip Header, Breakable 929450-01-36-ND 36 pin row $4.85

14 DIP Socket ED60001-ND each $1.09

2-sided copper PCB 6”x9” 473-1011-PCB-ND Each $10.38

Prototype boards From Computer Eng Each $10.00

Wire for Prototype boards C2004x-100-ND White, Red, BLue, BroWn

$16.24

Solder RMA Flux, 25AWG,63/37 KE1201-ND $40.25

Solder Iron 25 Watt WP25-ND $38.92

Solder Iron Tips ST5-ND $3.44

Pin Strip Header 0.1” Single Row of 36 pins, break in any length, Straight, Gold PlatedReceptacle

© June 13, 2010 Dr. Lynn Fuller

Microsystem Prototype Components

Page 48

Rochester Institute of Technology

Microelectronic Engineering

REFERENCES

1. WWW.digikey.com

2. www.Newark.com

3. Data sheets for all the components.

4. RIT_Package.pdf contains information on how to make PCBs atRIT. See http://people.rit.edu/~lffeee/labnotes.htm