Perspectives on Digital Industrial Perspectives on Digital Industrial

BerlinBAM

Perspectives on Digital IndustrialPerspectives on Digital Industrial Radiology

t@b d

Uwe Ewert

April 2012,Ewert et al. Essential Parameters in Radiology

[email protected]

1

Outline Digital Radiology is replacing Film Radiography in analogy to digital photography,

which has replaced film photography almost completely. Computed Radiography with imaging plates and Radiography with Digital Detector

Arrays (DDA) are the upcoming new technologies. Special calibration procedures of DDAs yield higher image quality than X-ray film Spec a ca b at o p ocedu es o s y e d g e age qua ty t a ay

radiography (high contrast sensitivity technique) and reduced exposure times. New digital measurement tools allow the exact measurement of object dimension

and functionalityand functionality. Corrosion and wall thickness lost can be measured exactly in industrial plants. Digital detectors with a central hole allow the endoscopic application for inspection

f h t hof heat exchangers. X-ray back scatter technologies and dual energy radiography can be applied in

industrial NDT, additionally to the security applications. Modeling of digital radiography supports training and film replacement. Computed Tomography with DDA becomes a routine industrial application for flaw

detection and measurement of inner dimensions


detection and measurement of inner dimensions.

Filmless Radiographyg y

Computed Radiography withPhosphor Imaging Plates


Classic Radiographyg p y

Our roots: Experiences in Fil R di hFilm Radiography

since 1933 at BAM


Digital Industrial Radiology: Techniques

ReportingImagingPl t

Data TransmissionScannerfor Imaging Plates p g

Plates Plates

Archive

NetworkingFilm Digitizer

Real Time Hard CopReal TimeDetector

Hard CopyGrayscalePrinter Agfa


Motivation for Film Replacement by Computed Radiography and DDA‘sComputed Radiography and DDA‘s

• Shorter test and interpretation time

• New application areas by higher inspection quality and wall Film (D4)thickness range

• No chemicals and dangerous

( )

• No chemicals and dangerous waste

• Less consumablesFlachdetektor (Hamamatsu)


( )

Filmless Radiographyg y

Computed Radiography withPhosphor Imaging Plates


The Imaging Plate Cycle

Scanning the IP, Digitising and Erasing the residual Image

Exposure of Imaging Plate

Imaging Cassette

Erasing the residual Image

Plate

Lead filter

Exposure

Processing Station


High Definition CR Systems for Welding

Systems available down to• 12 µm pixel pitch and • < 40 µm unsharpness

• “weld quality”

BAM 5: 8 mm steel

HD CR:„VistaScan“, of Duerr, Germany

FUJI IP‘s, light blue


Digital Radiography for Pipeline Testing

•36 inch 12.7 mm Wall thickness Pipe Weld (SWSI-panoramic exposure )

FilmFree meeting17.04.2007


Corrosion and Wall Thickness Measurement

f = film focus distancer = outer pipe radiusR = outer radius of insulationw = projection of wall thickness

w on the detector planeVEBA-OEL 2000

p


Wall Thickness MeasurementTutorial at 11.12.2007

Tangential RadiographicRadiographic Technique(TRT)


(TRT)

X-Ray Inspection in Lieu of Manual Maintenance Check of Large Componentsg p


X-Ray Inspection in Lieu of Manual Maintenance Check of Large Componentsg p

Pseudo plast filter (relief)


Filmless RadiographyFilmless Radiography

Digital Detector Arrays(Flat Panel Detectors)(Flat Panel Detectors)

and the newHi h C t t S iti it T h iHigh Contrast Sensitivity Technique

HCS-RT


New Digital Detector Array Technology

Spahn 97


Film and Flat Panel Detector for the BAM 5 Weld.

EN 462 2 Step HoleASTM E747 / EN 462-2Fe 13 Wire Penetrameter

EN 462-2 Step Hole Type IQI „H1“

ASTM E1025 InconelASTM E2002 duplex wire

ASTM E1025 Inconel 5 Hole Penetrameter

BAM 5 is a hand welded steel plate (St 35) 8 mm thick, the welding seam is max. 10 mm thick. It t i ll t f ldi fl i ll i k t th f f th ldi


It contains all types of welding flaws, especially nice cracks at the surface of the welding seam.

BAM 5, 8mm steel

Fuji IX25SNRnorm~ 265

DDA Technology provides betterprovides better image quality than film with a

Best (slowest) NDT filmt a

special calibration procedure!

Images high pass filtered for better presentation

PerkinElmer 1620

presentation


SNRnorm~ 1500Magn. = 3.5DDA exposure

F t T t f H t E hFast Test of Heat Exchangerswith

Tiled DDA


RT-testing of tube-to-tube-sheet jointsGammat B3

Possible tube dimensions: 12*1.5 up to 76.1*4 (diameter*thickness)Materials: carbon and stainless steel, Ni-alloys, Zr, (Ti, Ta)Joint design shall be consideredJoint design shall be considered

Ir 192, Radiator: 1 x 0.5 mm²

April 2012,Ewert et al.

WLE/AD - Plant Inspection, Welding Engineering; PVT Meeting Freeport 2004 14

X-ray tube Warrikhoff MCTS 130A-0,6 and CdTe-Detector Ajat DIC100THTesting of Heat Exchanger Welds

with a specialisedwith a specialised Digital Detector ArrayThrough the Detector

Practice test:

Alekseychuk Zscherpel RostAlekseychuk, Zscherpel, Rost


D4 film with 130 kV:1 min (1mm Sn filter)

X-Ray tube with DIC100TH detector75 kV, 0,5 mA, 10s

Research-Project BASF/Ajat/BAM since 2006, first results on test weld


Research Project BASF/Ajat/BAM since 2006, first results on test weld

Imaging andImaging and Materials Characterisation with

Dual Energy Technique


Explosive Detection by Dual-Energy-Radiology

Typical device for explosive detection of baggage and fin postal ser ice

Fan beams at two different energies

Baggage-

fin postal service

(Smiths Heimann)Baggage-transport

L-line detectors

Smiths Heimann


Dual-Energy-Technique for Plastics and Composite Pipes

Inspection of a multi layer pipe, made from different plastics and with partial glass fibre reinforcement for chemical industry


chemical industry

X-Ray Back Scatter Techniqueforfor

Security and Aircraft Industry


X-Ray B k S tt T h iBack Scatter Techniquewith Single Sided Access

AS&E


X-Ray Back Scatter TechniqueFlying Spot Unit

X-Ray Back Scatter Techniquewith Single Sided Access

Organic materials are visible with high contrast

AS&E


X-Ray Back Scatter Technique with Single Sided Access


Source: http://www.as-e.com Accepted e.g. in UK on voluntary basis


Backscatter image of a person

N t t d i G d t R di ti S f t R l ti

Accepted e.g. in UK on voluntary basis


Not accepted in Germany due to Radiation Safety Regulations


DiaphragmX-ray tube

Imaging plate/

Shielding box

Imaging plate/Detector Array

Camera

Osterloh01/2007


Fast Back Scatter Technique with Specialized Diaphragm

Water in Honeycomb


Water in Honeycomb-Structures

Radiograph

Back scatter image


Inspection of an Aircraft Test Object


Comparison of Back Scatter vs. Penetration Techniquep q

X-ray penetration image X-ray back scatter image


y p g y g

X R M d li fX-Ray Modeling for- Film replacement

- Training

- Planning of testing

- POD


Simulation-Example Complex Geometry: Rail

Pore


Computed TomographyComputed Tomographyfor

Nuclear Power Plants and

Ai ft I d tAircraft Industry


High Energy CT at BAM

Inspection of radioactive drums

LINACDrum

200 kV-12 MeVDetector > 500 µm1000 mm

Detector

X-ray tube


J. Goebbels et al.

Quality Assurance of Radioactive WasteDrum with radioactive metallic stirrer in concreteDrum with radioactive metallic stirrer in concrete

200 l200 l

ironiron

hoophoop

drumdrum


J. Goebbels et al.

Mobile CTin

Nuclear Power Plants andNuclear Power Plants and

in Aircraft IndustryMobile unitIllerhaus


yIllerhaus

3D-Reconstruction of Weldments Metallography

Certification byEuropeanEuropeanNetwork ofInspection and

from outside to insidePlanar Tomography

Inspection andQualification.

Planar Tomography

8


Planar Tomography as Reference for New Methods EvaluationEvaluation

EDISON WELDING INSTITUTE: DOT OPS ProgramEnhanced Defect Detection and Sizing Accuracy Using g y gMatrix Phased Array Ultrasonics Tools

Concept #1 - Girth Weld from OD


X-Ray Tomographic Non Destructive Micrography

222Cross sections

345

222Cross sections

382572

772872

Top viewsilce 222Near center plane


p

Electronic components

Sample Gas-filled capacitor

Aim Tightness of the gasket

Procedure

segmentation of different materials

evaluation of irregularities


Planar Computed TomographyPlanar Computed Tomography for Inspection of

Large Flat Composite Structures ofLarge Flat Composite Structures of Aircrafts


Moving Gantry CT Construction for Flexible Planar TomoCAR

Object dimensions

Yellow marked: regions to measure

Measurement positions: 87, witheach ROI: 17 x 17 cmeach ROI: 17 x 17 cm

inspected Stringer-length: 14 8 mlength: 14,8 m


TomoCAR: Qualification by Comparison of C S ti d TCross Sections and Tomograms

Cross section cut from stringer Planar tomogramCross section, cut from stringer(micrograph)

Planar tomogram


Summary:

Computed Radiography with Phosphor Imaging Plates is gaining more and more importance for mobile inspection and Film Replacement.

New High Definition CR (HD CR) systems allow the CR application for Weld and New High Definition CR (HD CR) systems allow the CR application for Weld and Casting inspection with low energy X-rays.

New calibration methods enable the High Contrast Sensitivity Technology (HCS RT) f di hi i ti Th t t iti it b h d bRT) for radiographic inspection. The contrast sensitivity can be enhanced by a factor of 10 in comparison to film.

New Digital Detector Arrays (DDA) are now available for stationary and mobile testing. They are also applied for automated defect recognition (ADR), CT, Back Scatter and Dual Energy Applications.

Back Scatter Techniques are increasingly applied for Security and NDTq g y pp y Numeric Radiographic Modelling is applied for Experiment Planning, Film

replacement, POD-calculations and training Computed Tomography gains importance for internal evaluation of flaws and Computed Tomography gains importance for internal evaluation of flaws and

dimensional measurements. Mobile and portable CT devices are suitable for non destructive cross sectioning

i l i d t d i ft li ti


in nuclear power industry and aircraft applications

Acknowledgement

B. Redmer – BAM Berlin

A. Alekseychuk – BAM Berlin

B. Müller – BAM Berlin

A. Lange – BAM Berlin

K. Bavendiek – YXLON Hamburg

K. Osterloh – BAM Berlin

A. Kupsch – BAM Berlin

J. Beckmann – BAM Berlin

G.-R. Jaenisch – BAM Berlin

C. Bellon – BAM Berlin

Ch. Müller – BAM Berlin

S. Sood – CIT London


J. Goebbels – BAM-Berlin B. Schillinger – TUM-Tech Munich

BAM-Berlin FG 8 3

Ende e-mail: [email protected]://www.bam.de

BAM-Berlin, FG 8.3Unter den Eichen 8712005 BerlinTel. (030) 81041830


FAX (030) 81041839

Documents

Perspectives on Digital Industrial Perspectives on Digital Industrial