PESD5V0F1BSF - Extremely Low Capacitance Bidirectional ESD Protection Diode - NXP

7/30/2019 PESD5V0F1BSF - Extremely Low Capacitance Bidirectional ESD Protection Diode - NXP

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1. Product profile

1.1 General description

Extremely low capacitance bidirectional ElectroStatic Discharge (ESD) protection diode in

a DSN0603-2 (SOD962) leadless ultra small Surface-Mounted Device (SMD) package

designed to protect one signal line from the damage caused by ESD and other transients.

1.2 Features and benefits

Bidirectional ESD protection of one line

Extremely low diode capacitance Cd = 0.25 pF

Minimized capacitance variation over voltage

ESD protection up to 10 kV according to IEC 61000-4-2

Ultra small SMD package

1.3 Applications

Cellular handsets and accessories

Portable electronics

Communication systems

Computers and peripherals

1.4 Quick reference data

2. Pinning information

PESD5V0F1BSFExtremely low capacitance bidirectional ESD protection diode

Rev. 1 10 December 2012 Product data sheet

Table 1. Quick reference data

Tamb= 25C unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Unit

VRWM reverse standoff voltage - - 5 V

Cd diode capacitance f = 1 MHz; VR = 0 V 0.20 0.25 0.30 pF

Table 2. Pinning

Pin Description Simplified outline Graphic symbol

1 cathode (diode 1)

2 cathode (diode 2)

Transparent

top view

21

sym045

21


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PESD5V0F1BSF All information provided in this document is subject to legal disclaimers. NXP B.V. 2012. All rights reserved.

Product data sheet Rev. 1 10 December 2012 2 of 12

NXP Semiconductors PESD5V0F1BSFExtremely low capacitance bidirectional ESD protection diode

3. Ordering information

4. Marking

5. Limiting values

[1] Non-repetitive current pulse 8/20 s exponentially decaying waveform according to IEC61000-4-5.

[1] Device stressed with ten non-repetitive ESD pulses.

Table 3. Ordering information

Type number Package

Name Description Version

PESD5V0F1BSF DSN0603-2 leadless ultra small package; 2 terminals;

body 0.6 0.3 0.3 mm

SOD962

Table 4. Marking codes

Type number Marking code

PESD5V0F1BSF F

Table 5. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

PPPM rated peak pulse power tp = 8/20 s [1] - 28 W

IPPM rated peak pulse current tp = 8/20 s[1] - 2.2 A

Tj junction temperature - 150 C

Tamb ambient temperature 55 +150 C

Tstg storage temperature 65 +150 C

Table 6. ESD maximum ratings

Symbol Parameter Conditions Min Max Unit

VESD electrostatic

discharge voltage

IEC 61000-4-2 (contact discharge) [1] - 10 kV

IEC 61000-4-2 (air discharge) [1] - 10 kV

MIL-STD-883 (human body model) - 10 kV

Table 7. ESD standards compliance

Standard Conditions

IEC 61000-4-2, level 4 (ESD) > 8 kV (contact)

MIL-STD-883; class 3B (human body model) > 8 kV


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6. Characteristics

[1] Non-repetitive current pulse 8/20 s exponential decay waveform according to IEC 61000-4-5.[2] Non-repetitive current pulse, Transmission Line Pulse (TLP) tp = 100 ns; square pulse;

ANS/IESD STM5.1-2008.

Fig 1. 8/20 s pulse waveform according to

IEC 61000-4-5

Fig 2. ESD pulse waveform according to

IEC 61000-4-2

t (s)0 403010 20

001aaa630

40

80

120

IPP

(%)

0

et

100 % IPP; 8 s

50 % IPP; 20 s

001aaa631

IPP

100 %

90 %

t

30 ns

60 ns

10 %

tr = 0.7 ns to 1 ns

Table 8. Characteristics

Tamb= 25C unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Unit

VRWM reverse standoff

voltage

- - 5 V

IRM reverse leakage

current

VRWM = 5 V - 1 100 nA

VCL clamping voltage IPP = 0.5 A[1] - - 10 V

IPPM = 2.2 A[1] - - 12.8 V

VBR breakdown voltage IR = 1 mA 6 - 10 V

Cd diode capacitance f = 1 MHz; VR = 0 V 0.20 0.25 0.30 pF

rdyn dynamic resistance IR = 1 0 A[2] - 1.3 -


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f = 1 MHz; Tamb = 25 C

Fig 3. Diode capacitance as a function of reverse

voltage; typical values

Fig 4. V-I characteristics for a bidirectional

ESD protection diode

tp = 100 ns; Transmission Line Pulse (TLP)

Fig 5. Dynamic resistance; typical values

VR (V)0.0 5.04.02.0 3.01.0

018aaa061

0.4

0.6

0.2

0.8

1.0Cd

(pF)

0.0

006aab325

-VCL -VBR -VRWM

VCLVBRVRWM-IRM

IRM

-IR

IR

-IPP

IPP

- +

IPPM

-IPPM

DDD

9&/9

33,33$$


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Fig 6. ESD clamping test setup and waveforms

5G

&V

'87

'(9,&(

81'(5

7(67

*1'

*1'

5*8FRD[

(6'7(67(5

,(&QHWZRUN

&VS)5G

*+]',*,7$/

26&,//26&23(

[

$77(18$725

XQFODPSHGN9(6'SXOVHZDYHIRUP

,(&QHWZRUN

XQFODPSHGN9(6'SXOVHZDYHIRUP

,(&QHWZRUN

*1'

FODPSHGN9(6'SXOVHZDYHIRUP

,(&QHWZRUN

DDD

*1'

FODPSHGN9(6'SXOVHZDYHIRUP

,(&QHWZRUN

YHUWLFDOVFDOHN9GLY

KRUL]RQWDOVFDOHQVGLY

YHUWLFDOVFDOHN9GLY


YHUWLFDOVFDOH9GLYKRUL]RQWDOVFDOHQVGLY

YHUWLFDOVFDOH9GLY



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7. Application information

The PESD5V0F1BSF is designed for the protection of one data or signal line from surgepulses and ESD damage. The device is suitable on lines where the signal polarities are

both, positive and negative with respect to ground. It provides protection against surges

with up to 28 W per line.

Circuit board layout and protection device placement

Circuit board layout is critical for the suppression of ESD, Electrical Fast Transient (EFT)

and surge transients. The following guidelines are recommended:

1. Place the device as close to the input terminal or connector as possible.

2. Minimize the path length between the device and the protected line.

3. Keep parallel signal paths to a minimum.4. Avoid running protected conductors in parallel with unprotected conductors.

5. Minimize all Printed-Circuit Board (PCB) conductive loops including power and

ground loops.

6. Minimize the length of the transient return path to ground.

7. Avoid using shared transient return paths to a common ground point.

8. Use ground planes whenever possible. For multilayer PCBs, use ground vias.

Fig 7. Application diagram

aaa-002737

ESD protection diode

GND

line to be protected


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8. Package outline

9. Packing information

[1] For further information and the availability of packing methods, see Section 13.

Fig 8. Package outline DSN0603-2 (SOD962)

'LPHQVLRQVLQPP

Table 9. Packing methods

The indicated -xxx are the last three digits of the 12NC ordering code. [1]

Type number Package Description Packing quantity

9000PESD5V0F1BSF DSN0603-2

(SOD962)

2 mm pitch, 8 mm tape and reel -315


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10. Soldering

Fig 9. Reflow soldering footprint DSN0603-2 (SOD962)

Footprint information for reflow soldering of leadless ultra small package; 2 terminals SOD962

sod962_fr

solder land

solder resist

solder land plus solder paste

solder paste deposit

Dimensions in mm

R0.025 (8)

0.12

(2)

0.2

(2)

0.22

(2)0.4

0.85

0.4


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11. Revision history

Table 10. Revision history

Document ID Release date Data sheet status Change notice Supersedes

PESD5V0F1BSF v.1 20121210 Product data sheet - -


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12. Legal information

12.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term short data sheet is explained in section Definitions.

[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product statusinformation is available on the Internet at URL http://www.nxp.com.

12.2 DefinitionsDraft The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liability for the consequences of

use of such information.

Short data sheet A short data sheet is an extract from a full data sheet

with the same product type number(s) and title. A short data sheet is intended

for quick reference only and should not be relied upon to contain detailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

office. In case of any inconsistency or conflict with the short data sheet, the

full data sheet shall prevail.

Product specification The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to offer functions and qualities beyond those described in the

Product data sheet.

12.3 Disclaimers

Limited warranty and liability Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warranties, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information. NXP Semiconductors takes no

responsibility for the content in this document if provided by an information

source outside of NXP Semiconductors.

In no event shall NXP Semiconductors be liable for any indirect, incidental,

punitive, special or consequential damages (inc luding - without limitation - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconductors aggregate and cumulative liability towards

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial saleof NXP Semiconductors.

Right to make changes NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all information supplied prior

to the publication hereof.

Suitability for use NXP Semiconductors products are not designed,

authorized or warranted to be suitable for use in life support, life-critical or

safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in personal injury, death or severe property or environmental

damage. NXP Semiconductors and its suppliers accept no liability for

inclusion and/or use of NXP Semiconductors products in such equipment or

applications and therefore such inclusion and/or use is at the customers own

risk.

Applications Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and operation of their applications

and products using NXP Semiconductors products, and NXP Semiconductors

accepts no liability for any assistance with applications or customer product

design. It is customers sole responsibility to determine whether the NXPSemiconductors product is suitable and fit for the customers applications and

products planned, as well as for the planned application and use of

customers third party customer(s). Customers should provide appropriate

design and operating safeguards to minimize the risks associated with their

applications and products.

NXP Semiconductors does not accept any liability related to any default,

damage, costs or problem which is based on any weakness or default in the

customers applications or products, or the application or use by customers

third party customer(s). Customer is responsible for doing all necessary

testing for the customers applications and products using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by customers third party

customer(s). NXP does not accept any liability in this respect.

Limiting values Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanently and irreversibly affect

the quality and reliability of the device.

Terms and conditions of commercial sale NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individual agreement. In case an individual

agreement is concluded only the terms and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customers general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

No offer to sell or license Nothing in this document may be interpreted or

construed as an offer to sell products that is open for acceptance or the grant,

conveyance or implication of any license under any copyrights, patents or

other industrial or intellectual property rights.

Document status[1][2] Product status[3] Definition

Objective [short ] data sheet Development This document contains data from the object ive specification for product development.

Preliminary [short ] data sheet Quali fication This document contains data from the preliminary specification.

Product [short] data sheet Production This document contains the product specification.
http://www.nxp.com/http://www.nxp.com/profile/termshttp://www.nxp.com/profile/termshttp://www.nxp.com/


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Export control This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior

authorization from competent authorities.

Quick reference data The Quick reference data is an extract of the

product data given in the Limiting values and Characteristics sections of this

document, and as such is not complete, exhaustive or legally binding.

Non-automotive qualified products Unless this data sheet expressly

states that this specific NXP Semiconductors product is automotive qualified,

the product is not suitable for automotive use. It is neither qualified nor tested

in accordance with automotive testing or application requirements. NXP

Semiconductors accepts no liability for inclusion and/or use of

non-automotive qualified products in automotive equipment or applications.

In the event that customer uses the product for design-in and use in

automotive applications to automotive specifications and standards, customer

(a) shall use the product without NXP Semiconductors warranty of the

product for such automotive applications, use and specifications, and (b)whenever customer uses the product for automotive applications beyond

NXP Semiconductors specifications such use shall be solely at customers

own risk, and (c) customer fully indemnifies NXP Semiconductors for any

liability, damages or failed product claims resulting from customer design and

use of the product for automotive applications beyond NXP Semiconductors

standard warranty and NXP Semiconductors product specifications.

12.4 Trademarks

Notice: All referenced brands, product names, service names and trademarks

are the property of their respective owners.

13. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: [email protected]


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NXP B.V. 2012. All rights reserved.For more information, please visit: http://www.nxp.comFor sales office addresses, please send an email to: [email protected]

Date of release: 10 December 2012

Document identifier: PESD5V0F1BSF

Please be aware that important notices concerning this document and the product(s)described herein, have been included in section Legal information.

14. Contents

1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1 General description . . . . . . . . . . . . . . . . . . . . . 1

1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . 1

1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1

2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 1

3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2

4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2

6 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3

7 Application information. . . . . . . . . . . . . . . . . . . 6

8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7

9 Packing information . . . . . . . . . . . . . . . . . . . . . 7

10 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

11 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 9

12 Legal information. . . . . . . . . . . . . . . . . . . . . . . 10

12.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 10

12.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

12.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

12.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11

13 Contact information. . . . . . . . . . . . . . . . . . . . . 11

14 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Documents

PESD5V0F1BSF - Extremely Low Capacitance Bidirectional ESD Protection Diode - NXP