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Petalet-Stavelet; 13 July 2015. Birmingham Update Gluing to mechanical sensor with Epolite (as reported earlier). 1 st hybrid – too much glue on stencil. Bleed but bond pads not affected. 2 nd hybrid glued successfully – no bleed. Module bonding (Sam and Simon) •Great difficulty bonding on to patterned glass ASICs. (OK on sensor). •After 1 st two rows of bonds, abandon ship. i)batch to batch variations? Storage problem? Surface contamination? ii)check bonder settings. Difficult to determine source + history of patterned glass but no indication of anything untoward. On 2nd hybrid, patterned glass ASICs cleaned with alcohol. Back to basics with bonder settings; test on 2 nd hybrid 1st two rows used to test/set up; rows 3+ 4 bonded well. With same settings, return to attempt rows 3 and 4 of “bad” 1 st hybrid. 1 1

Petalet-Stavelet; 13 July 2015. Birmingham Update Gluing to mechanical sensor with Epolite (as reported earlier). 1 st hybrid – too much glue on stencil

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Page 1: Petalet-Stavelet; 13 July 2015. Birmingham Update Gluing to mechanical sensor with Epolite (as reported earlier). 1 st hybrid – too much glue on stencil

Petalet-Stavelet; 13 July 2015.

Birmingham UpdateGluing to mechanical sensor with Epolite (as reported earlier).

1st hybrid – too much glue on stencil. Bleed but bond pads not affected.

2nd hybrid glued successfully – no bleed.

Module bonding (Sam and Simon)•Great difficulty bonding on to patterned glass ASICs. (OK on sensor).•After 1st two rows of bonds, abandon ship.

i)batch to batch variations? Storage problem? Surface contamination?

ii)check bonder settings.

Difficult to determine source + history of patterned glass but no indication of anything untoward.

On 2nd hybrid, patterned glass ASICs cleaned with alcohol.

Back to basics with bonder settings; test on 2nd hybrid

1st two rows used to test/set up; rows 3+ 4 bonded well.

With same settings, return to attempt rows 3 and 4

of “bad” 1st hybrid.11

Page 2: Petalet-Stavelet; 13 July 2015. Birmingham Update Gluing to mechanical sensor with Epolite (as reported earlier). 1 st hybrid – too much glue on stencil

Atlys+ABCN250-Hybrid at B'ham (1) (Juergen, AndyC, SimonH)

John Wilson, Phil Allport, Simon Pyatt, Sam Edwards, Juergen Thomas, James Broughton, Kostas Nikolopoulos, Andy Chisholm, Simon Head16th July 2015, WP3 Meeting

Now updated s/w on clean-room PC: We should be ok now ! -NMASK (sawtooth) works for whole hybrid (Birmingham-assembled Stave09, ‘B1_H6’) (see screenshot from 'ScanData') -Can do 'StrobeDelay(0.25) then 3PointGain(1fC)' test withall 20 chips ok (results on next slides)

(Note: On Monday, we showed setup with second PC, outside clean-room, Liverpool hybrid ‘L1’, there can access one row with NMASK (10 chips) and run tests with 9 chips. One only partially responding chip (row 0 chip 6) marked by Liverpool)

Page 3: Petalet-Stavelet; 13 July 2015. Birmingham Update Gluing to mechanical sensor with Epolite (as reported earlier). 1 st hybrid – too much glue on stencil

Atlys+ABCN250-Hybrid at B'ham (2) (Juergen, AndyC, SimonH)

John Wilson, Phil Allport, Simon Pyatt, Sam Edwards, Juergen Thomas, James Broughton, Kostas Nikolopoulos, Andy Chisholm, Simon Head16th July 2015, WP3 Meeting

Main changes since last time:1)Updated ITSDAQ s/w version tor3315 (built in MS VisualStudio10Pro/Express)2)Atlys ethernet connection: Clean-room PC has 2-ethernet PCI card fitted (one to HSIO, one to Atlys). Other PC changed to USB3.0-Ethernet dongle ('StarTech USB31000S‘, tip from RichardT), before was 2nd ethernet plug on PC mainboard.3)No LVDS driver board4)Short (15-30cm) cables used (some fitted with 3M connectors)5)Always run ‘NoBCCSetup’6)Atlys f/w has been for a whilethe recommended: va056

Page 4: Petalet-Stavelet; 13 July 2015. Birmingham Update Gluing to mechanical sensor with Epolite (as reported earlier). 1 st hybrid – too much glue on stencil

Atlys+ABCN250-Hybrid at B'ham (3) (Juergen, AndyC, SimonH)

John Wilson, Phil Allport, Simon Pyatt, Sam Edwards, Juergen Thomas, James Broughton, Kostas Nikolopoulos, Andy Chisholm, Simon Head

16th July 2015, WP3 Meeting

Should be all-good with clean-room test system Could run ABC130 hybrid when they become available (2/3 chips ?) Second PC (outside clean-room, can access 9 chips on ‘L1’ hybrid):

For testing s/w developments: Install ITSDAQ ‘trunk’, TortoiseSVN (also: as back-up machine). What happens when we go for Windows 10 ? No worries about second row of chips.

Some notes written during set-up, trying to prepare a Twiki page