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Physical Design Key Highlights Successfully executed multiple turnkey projects from RTL to GDS and Netlist to GDS Experience in most advanced Process nodes down to 5nm. Experience in PDKs from industry leading fabs - TSMC, Intel, Samsung, Global Foundries etc Integration of Analog & Mixed signal SOC Low Power design and High-Performance designs Expertise on all industry standard EDA tools – Synopsys, Mentor, Cadence, Ansys etc. Logic / Physical aware Synthesis with focus on Power, Performance & Area Full chip level activities like IO Ring creation, Floor planning, P&R activities Block level Place & Route activities Rich experience in Optimal Timing closure in multiple process corners as per the application requirements Sign off Physical Verification and closure of DRC, LVS, Antenna, ERC Development/Enhancement of Physical Design flows. Motivated team, better design capability Rich and extensive Physical Design (PD) experience has enabled the team to work on multiple successful tape-outs. Expertise with all Industry standard EDA tools, Design Flow and well trained to handle low power, high performance area critical designs. Value Proposition Domain Expertise Team includes highly skilled and experienced professionals ranging from project managers, testers, programmers, designers, and developers Technology / Process Nodes: 180nm down to 7nm, 5nm designs EDA Tools: Synopsys, Mentor, Cadence, Ansys etc Fab experience: TSMC, Intel, Samsung, Global Foundries Servers Graphics Mobile Audio Networking Physical Design (PD) Technical Advantage Team Automotive Wireless IoT www.tessolve.com

Physical Design (PD)...to GDS in 28nnm on 10 different partitions. Each one has roughly 700K instances. Fq: 1 GHz Synthesis-GDS flow dev. Block level (4) and Top-level PD 40nm PD Genus,

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  • Physical Design Key Highlights

    Successfully executed multiple turnkey projects from RTL to GDS and Netlist to GDS

    Experience in most advanced Process nodes down to 5nm.

    Experience in PDKs from industry leading fabs - TSMC, Intel, Samsung, Global Foundries etc

    Integration of Analog & Mixed signal SOC Low Power design and High-Performance

    designs Expertise on all industry standard EDA tools

    – Synopsys, Mentor, Cadence, Ansys etc.

    Logic / Physical aware Synthesis with focus on Power, Performance & Area

    Full chip level activities like IO Ring creation, Floor planning, P&R activities

    Block level Place & Route activities Rich experience in Optimal Timing closure in

    multiple process corners as per the application requirements

    Sign off Physical Verification and closure of DRC, LVS, Antenna, ERC

    Development/Enhancement of Physical Design flows.

    Motivated team, better design capability Rich and extensive Physical Design (PD) experience has enabled the team to work on multiple successful tape-outs. Expertise with all Industry standard EDA tools, Design Flow and well trained to handle low power, high performance area critical designs.

    Value Proposition

    Domain Expertise

    Team includes highly skilled and experienced professionals ranging from project managers, testers, programmers, designers, and developers

    Technology / Process Nodes: 180nm down to 7nm, 5nm designs

    EDA Tools:Synopsys, Mentor, Cadence, Ansys etc

    Fab experience:TSMC, Intel, Samsung, Global Foundries

    Servers Graphics Mobile Audio Networking

    Physical Design (PD)

    Technical AdvantageTeam

    Automotive Wireless IoT

    www.tessolve.com

  • Tessolve is the market leader in providing engineering solutions for silicon and systems development. We offer a unique combination of both pre-silicon and post-silicon expertise to provide an efficient turnkey solution for silicon bring up, spec to a product. With 2100+ employees worldwide, Tessolve enables customers a faster time-to-market through deep domain expertise in Analog, Digital, Mixed Signal, and RF, broad ATE platform experience, diverse embedded software services and built-in infrastructure including a test floor, characterization, reliability lab, system lab, and PCB FAB.

    Tessolve delivers ASIC design services including advanced process nodes with a strong eco-system relationship with EDA, IP, and foundries. Tessolve’s post-silicon solution takes silicon from the foundry to high volume manufacturing. Our front-end design strengths integrated with the knowledge from the backend flow, allows Tessolve to catch design flaws ahead in the cycle, thus reducing expensive re-design costs, and risks.

    Contact For more details https://www.tessolve.com/vlsi-design/ | www.tessolve.com

    Recent Projects Delivered

    Activity Technology Domain Tools Metrics, Design Details

    RTL/ Block level test bench coding, RTL/ Block level test bench micro architecting

    40nm – 10nm RTL Coding, QC checks

    Cadence, Spyglass

    RTL/Spyglass clearance/Block level test benches for I2C/I3C, SPI, UART/HSUART, MIPI, MMC, Secure Digital, USB protocols

    Physical implementation of Always on Subsystem.

    7nm PD Innovus, ICC2, PT, PTPX, Conf LEC.

    Cell count: 1.17M; Size: 720 x 720 um; 3 power domains.; Frequency 250MHz.

    P&R of GPU Block 28nm PD Talus Chip with advance features & one of the biggest in 28nm. Worked from scratch to GDS in 28nnm on 10 different partitions. Each one has roughly 700K instances. Fq: 1 GHz

    Synthesis-GDS flow dev. Block level (4) and Top-level PD

    40nm PD Genus, Innovus, LEC Calibre, RH, Tempus

    NXP – HeliosBlock and top-level synthesis; PD flow development and implementation.Instance count approx. 350K per block. Top RDL IO routing, Sign-off checks

    Physical implementation of 1 block.

    180nm PD Encounter, Tempus, Assura; Voltus.

    NXP – Automotive group P&R STA & Sign off closure for the blocks.Gate Count: ~1.5 M; Macros: 1; Clock Domains: 5; Fq: 250MHz.

    Physical implementation of 2 blocks for a Server SOC.

    10nm PD DC, ICC2, PT, PT-GCA, PT-PX, ICV, Conf LEC

    Block1: Gates: ~1.5 M; Macros: 32; Clock Domains: 5; Fq: 1.3 GHzBlock2: Gates: ~5 K; Macros; Clock Domains: 8; Fq: 1.5 GHz