PMG, June 15, 2000 Slide 1

DDSchedule

Milestone Finish Date Completed

Barrel 1 Complete April 18, 2000 May 18, 2000Barrel 2 Complete May 23, 2000 June 13, 2000Barrel 3 Complete June 28, 2000Barrel 4 Complete July 27, 2000Barrel 5 Complete August 24, 2000Barrel 6 Complete September 22, 2000

F Disk 0 Complete March 28, 2000 March 31, 2000F Disk 1 Complete April 11, 2000 May 10, 2000F Disk 2 Complete April 25, 2000 May 23, 2000F Disk 3 Complete May 9, 2000F Disk 4 Complete May 23, 2000F Disk 5 Complete June 21, 2000F Disk 6 Complete July 6, 2000

F Disk 7 Complete July 20, 2000F Disk 8 Complete August 3, 2000F Disk 9 Complete August 17, 2000F Disk 10 Complete August 31, 2000F Disk 11 Complete September 15, 2000F Disk 12 Complete October 6, 2000

H Disk 1 Complete May 17, 2000H Disk 2 Complete July 7, 2000H Disk 3 Complete August 25, 2000H Disk 4 Complete October 16, 2000

South Half-Cylinder Complete and Ready to Move to DABJuly 27, 2000North Half-Cylinder Complete and Ready to Move to DABOctober 27, 2000

Started !

Done

Done

Late

DoneDone

Done

Done(today)

PMG, June 15, 2000 Slide 2

Sensor Delivery Sensor Delivery

Axial detectors (3-chip): All sensors in hand

90o detectors, DSDM (6-chip): ~60 sensors to be delivered; current delivery 5/wk production paced by sensor delivery Micron delivery just in time, and remains worrisome

» Fallback: Accept sensors which have one p-stop fault (noise region 10-15 channels). 15 such sensors have been identified

» Need to act soon on lower grade devices 2o detectors (9-chip)

Still to deliver 27 + 24 (lyr2), 8 + 24 (lyr4) sensors, which includes sensor to be returned after cleaning

226 sensors being processed at Micron (with yield of 53%), of which 94 have 4 month processing remaining

Taking processing into account, will need to purchase ~10 lower grade devices » Fallback:

Accept sensors which have higher Rbias , ~50 sensors have been identified

F-Wedge sensorsMicron:

All 125 sensors received

Eurisys: Order of 65 sensors complete Enough sensors on hand to build full complement of F disks But, breakdown Voltage 70 - 80V at Vdepl=15-20 V for most One more batch processed with improved implantation.

Received 9 sensors of last batch. Quality indeed better. Requested delivery of all sensors of this batch (~20) in exchange for lower quality sensors received.

PMG, June 15, 2000 Slide 3

Sensor DeliverySensor Delivery

H Wedges additional 42 sensors needed which will arrive soon.

Silicon Sensors

0 100 200 300 400 500 600

axial

2 degree

90 degree

F-Wedge

H-Wedge

Number of sensors

At FNAL

Needed

()

()

PMG, June 15, 2000 Slide 4

High Density Interconnect StatusHigh Density Interconnect Status

3-chip hdi’s done

6-chip hdi’s All hdi’s in hand 40 to be stuffed at Promex

9-chip hdi’s Last 46 hdi’s (short tail) on order; delivery next week 40 hdi’s at Promex for stuffing, 46 to go

F-wedge hdi’s All hdi’s in hand ~35 to go for stuffing at Promex

H-wedge hdi’s All hdi’s in hand 75 to go for stuffing at Silitronics

HDI status

0 50 100 150 200 250

axial

2 degree

90 degree

F-Wedge

H-Wedge

Number of hdis

need

have

surfm.

PMG, June 15, 2000 Slide 5

Ladder and Wedge ProductionLadder and Wedge Production

Axial detectors (3-chip): Ladder production has started again at rate 1/day No problems foreseen

2o detectors (9-chip): Production lagging due to availability of hdi’s

» Reorder hdi’s» Problems with surface mounting components (Promex);

e.g. problems with 27 hdi’s of one type (short tails) Production slowly proceeding

90o detectors (6-chip): Paced by Micron delivery, 107 sensors built so far

F Wedges (14-chip): Production proceeding at adequate pace Sensor and hdi availability not a problem Recently received most Eurisys detectors with low Vdepl Testing sensors is cumbersome

H Wedges (6-chip): 180 half wedges produced to date Half wedge production proceeding adequately Glued 39 full wedges of which ~21 detector grade Encapsulation and full wedge production is slow but not

limiting process

PMG, June 15, 2000 Slide 6

Yield Folded Detector Production

0

0.2

0.4

0.6

0.8

1

3/31/99 7/9/99 10/17/99 1/25/00 5/4/00 8/12/00 11/20/00

Date

Fra

cti

on

Co

mp

lete

9 Chip

3 chip

6 Chip

H disk

F Disk

Production Status and ProjectionProduction Status and Projection

Projected rates: assumed yield capacity

9-chip: 9.0/week 80% 15/wk 6-chip: 5.4/week 85% 10/wk H-wedge: 6.2 week 85% 10/wk F-wedge: 4.3/week 90% 15/wk

Nov 1, 00

Aug 10, 00

today

50% line

PMG, June 15, 2000 Slide 7

Production Status for first half cylinderProduction Status for first half cylinder

Last dates for detector production keeping original schedule with completion August 1:

F Wedges: June 26, 2000 6/9-chip ladders: June 12, 2000

4 flavors of 9-chip ladders; current status:

Needed Available now91xx 18 3192xx 18 3093xx 36 2494xx 36 27

“short tails”

Yield Folded Detector Production

0

0.2

0.4

0.6

0.8

1

2/9/99 5/20/99 8/28/99 12/6/99 3/15/00 6/23/00

Date

Fra

cti

on

Co

mp

lete

9 Chip

3 chip

6 Chip

F Disk

Delay of ~ 3 weeks with respect to schedule

PMG, June 15, 2000 Slide 8

Production Rate Production Rate

Ladder/Wedge Production Rate(20% Spares)

0

100

200

300

400

500

600

700

800

900

1000

2/9/99 5/20/99 8/28/99 12/6/99 3/15/00 6/23/00 10/1/00

Date

Ass

emb

lies

Total Assemblies Produced

Planned

PMG, June 15, 2000 Slide 9

Barrel / Disk AssemblyBarrel / Disk Assembly

First barrel (barrel 6) completed May 18 Grounding problems observed in first barrel, coherent

noise barrel will be moved to address these problems

Second barrel (barrel 5) completed June 13 Work on third barrel started

Third F disk encountered set back remeasurement of alignment showed discrepancies

of ~100m Probably due to mislabeling of files OGP measurements performed today and disk should

be completed today. Next F disks, one of end disk assemblies, being prepared Wedge production proceeding adequately for future

assembly

H-disk still awaiting ORC sign-off for electrical tests

PMG, June 15, 2000 Slide 10

Silicon SupportSilicon Support

Silicon Support Cylinder Fabrication of support at z=o Adding fiducials to end rings Finished installing H disk kinematic mounts Finished installation of adapter ring Add reinforcements to cylinder feedthroughs …... June 26 move CFT to DAB