Presentation title: CMC Microsystems - Springboard Atlanticspringboardatlantic.ca/images/uploads/CMC-MicrosystemsOverviewJ… · •Presentation title: 44pt Arial Regular, blue (R:25,

• Presentation title: 44pt Arial Regular, blue (R:25, G:73, B:136) Recommended maximum length: 2 lines

• Presentation subtitle: 32pt Arial Regular, blue (R:25, G:73, B:136) Recommended maximum length: 2 lines

© 2013 CMC Microsystems

CMC Microsystems

June 2013

© 2013 CMC Microsystems 2 CMC Confidential

Agenda

• CMC Microsystems & National Design Network (NDN)

• Commercial Services / DMT Microsystems


CMC Microsystems - Purpose

Vision Enhance the competitiveness of Canadian industry and

researchers through innovation in the development and

application of microsystems

Mission Enable and support the creation and application of micro- and

nano-systems knowledge by • Providing a national infrastructure for excellence in research

• And a path to commercialization of related devices, components and

systems


History— Milestones

• 1984 - 1995 Microelectronics Only to Academics

• 1995 - 2005 Primarily Microelectronics to Academics

– Some MEMS, Microfluidics, Photonics, Optoelectronics

• 2005 – 2015 Microsystems to Academics and increasing industrial content

– DMT Microsystems established to serve industry

– Expanding academic offerings

– Microelectronics, MEMS, Photonics, Optoelectronics

– Microfluidics

– Embedded Software / FPGA / Microcontrollers

– Software Quality tools / Architectural tools

• 2015 – 2025 Government support for Academics; Self funding products

and services to Industry – Planning for the future


CMC Reach with the

National Design Network

Leading-edge tools, technologies,

and facilities

Opportunities for networking,

partnership and collaboration

A means to translate research into

commercial success including

subsidiary DMT Microsystems

More than 850 faculty members and 2000 post-graduate students

48 universities & colleges

NDN collaborators including 400+ companies and intermediaries

coast to coast


Industry Support

• Increase economic value creation in the Canadian

economy through engagement with companies

having micro/nano activities in Canada and

providing resources, products, and services that

increase their competitiveness and advance

commercialization of their products and

technologies

• Provides technology and prototyping support to

CDN companies in the areas of microelectronics,

photonics, MEMS, and microfluidics

• A wholly-owned subsidiary of CMC Microsystems,

a private not-for-profit corporation

Vision Enhance the competitiveness of Canadian

industry and researchers through innovation in

the development and application of

microsystems

Mission Enable and support the creation and

application of micro- and nano-systems

knowledge by

• Providing a national infrastructure for

excellence in research

• And a path to commercialization of related

devices, components and systems

Same commitment to excellence

Same engineering expertise to ensure continuity

Different faces to provide focus on differing needs


De

gre

e o

f Fo

cus

Commercial Businesses

Universities & Colleges

Trained People; Promising Ideas

Research Problem Identification Problem Solving, Mentoring, Financing…

De

gre

e o

f Fo

cus

Priority setting

Tech Transfer Offices

Public Research

Institutions & Program

Prototyping/Manufacturing

Incubator

Angels & VCs

Knowledge Translation & Mobilization (Innovation Intermediaries)

CMC DMT

Development & Marketing

Basic

Research

Adapted from Peter J Nicholson, Presentation to Research Money Conference, Ottawa, 17 May 2012

CONVERTING “RESEARCH”

INTO “INNOVATION

© 2013 DMT Microsystems 8 DMT Confidential

Microsystems Prototyping … lowering financial, knowledge, and capability barriers

… ‘getting to yes’ with investors and customers

Design • technical – architecture, design, techniques, tools, training, technologies, support • leading edge design tools enabling performance, quality, and time to market advantage • design kit and IP support

Make • prototyping access and results from microsystems manufacturing technologies

– microelectronics, photonics, MEMS, microfluidics, embedded SW – lowering costs through consolidation / MPW runs for multiple customers

• customized packaging solutions • supply chain expertise and advice • wide range of sourcing through CDN commercial suppliers, University, and institutional facilities • selected international suppliers for leading technologies

Test • access to leading edge equipment and facilities at CDN University and institutional labs

Lowering the Barriers – managed legal, technical, financial solutions lowering the technical, administrative overhead – direct support of prototyping activity to help drive industrial economic growth – lower direct costs through consolidation / MPW runs for multiple customers

People – Service Expertise Value Trust


Products & Services

• Prototype fabrication • Microelectronics • MEMS • Silicon photonics • Microfluidics • Embedded systems • Custom micro/nano

fabrication and thin film services

• Technology selection & process design

• CAD solutions & methods • Design kits • Training & webinars • Custom Engineering

• Packaging, Assembly, PCB services

• Advanced MNT lab access for prototype evaluation

• Short term test equipment access

Design Make Test

Comprehensive Support Environment


Strong Supplier Relationships

• Global access including IBM, TSMC, IME, STMicroelectronics

• Canadian leadership including Teledyne Dalsa, FlowJEM, Celestica,

INO, C2MI

http://www.cadence.com/


Micro/Nano (MNT) Labs

We help clients realize their MEMS, microfluidics, and general micromachining prototypes by developing and optimizing their process flow and assisting them in their design stage. We also offer selected capabilities in characterization, assembly and testing. Areas of expertise include: • Thin film processing of different materials • Bulk micromachining • Plating of different metals • ITO deposition • Nano-patterning using E-beam Lithography • Processing of high aspect ratio structures • PDMS processing • Polymer and glass processing • Hot embossing • Microsurgery of chips


The UW-MEMS process is a research oriented, multi-user

MEMS fabrication process for universities and industry

offered at the University of Waterloo Signal

GNDActuation

electrode

Dielectric Cantilever

25 mil Alumina

Example: UW-MEMS

MEMS Devices from UW-MEMS

Fabrication Process

MEMS Impedance Tuners A 4x4 Switch Matrix Switched Capacitor

© 2013 DMT Microsystems 13 DMT Confidential 13

Photonics

Example: IME

silicon photonics

MPW (Singapore)

Prototyping access, tools, support, engineering expertise

• CPFC (NRC)

• Epixfab (IMEC)

• Landmark (Ireland)

• FBH (Germany)


Custom Services

• Matching customer’s needs to foundry’s capabilities • Co-development of process models with foundries • Supporting design, fabrication and verification • Examples:

- Bio-sensing chip: CPFC and AMS fab - Active Si-photonics : LETI fab

Ref: • L. Soleymani, et al. Nature Nanotechnology

advanced on line publication, 27 September 2009

• L. Soleymani, et al. ACS Nano 5, 3360-3366

Ref: Doylend et al, “Silicon photonic dynamic optical channel leveler with external feedback loop,” Optics Express, Vol. 18 Issue 13, pp.13805-13812 (2010)


Microelectronics

Example:

GaN500 Electronics

Process technology

Prototyping in standard CMOS and disruptive technologies • TSMC

• IBM

• Teledyne Dalsa

• STMicroelectronics

• Austria Microsystems

• CPFC


Commercial, platform, and advanced technologies • UW MEMS

• MEMSCAP

MEMS

• Teledyne Dalsa

• Micralyne


Microfluidics

Prototyping Options

Off-the-shelf microfluidic chips

Polymer/Glass based microfluidic chips

Complex microfluidics (deep etching, in-channel electrode, optical waveguide/fiber

coupling, surface modification etc.)

Packaging (flip chip bonding, vacuum packaging, sensors integration )

Prototyping access, tools, support, engineering expertise

• FlowJEM - rigid polymer based fabrication technology

• Micronit - Sensonit MPW process on bonded glass substrate


Packaging and Assembly

Prototyping access, support, engineering expertise

Die-on-board

Die-in-package Die bumping and flip chip

Low loss LTCC substrate/package

Laser assisted cleaving

Packaging and assembly

capabilities for microsystems

components and sub-

assemblies

• Off-the-shelf package options

• Wire bonding and glob top encapsulation

• Die bumping and flip chip

• Photonics packaging

• Laser assisted cleaving for photonics

devices

• Parylene coating for insulation and

biocompatibility

• Die-on-board, die stacking sub-assemblies


DMT Microsystems A CMC Microsystems Company Embedded Systems

STMicroelectronics “STHorm”

• P12-64 test chip, Xilinx Zynq

• XC7020 host (2x ARM CA9)

• Linux OS / Android, 1GBps sNoC

Beam combiner

Green Laser

Red

La

ser

Beam splitter

PSD

Co

nca

ve le

ns

HV Amplifier

Analog out

Digital out

BNC adaptor

Real-Time

Embedded

Software Lab

Design, analysis,

debug of real-time

software on next-

generation processor

systems

350 Development Systems

Custom embedded software developments

• Presentation title: 44pt Arial Regular, blue (R:25, G:73, B:136) Recommended maximum length: 2 lines

• Presentation subtitle: 32pt Arial Regular, blue (R:25, G:73, B:136) Recommended maximum length: 2 lines

Thank-you

For more information:

Peter Stokes, [email protected]

mailto:[email protected]

Documents

Presentation title: CMC Microsystems - Springboard Atlanticspringboardatlantic.ca/images/uploads/CMC-MicrosystemsOverviewJ… · •Presentation title: 44pt Arial Regular, blue (R:25,