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    Quantum Well Intermixing and Its Applications

    Shu YuanSchool of Materials Engineering

    Nanyang Technological University

    Singapore

    Thanks to the following friends for providing some slides:

    Dr. B. S. Ooi, Phosistors Inc., CA, USA

    Dr. C. Jagadish & Dr. L. Fu, Australian Natl Univ.

    Dr. S. F. Yu, NTU & late Dr. E. H. Li (Hong Kong Univ.)

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    Contents

    Introduction

    Techniques for QW intermixing Device applications

    Conclusions

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    IntroductionIntroductionIntroduction

    What is QW intermixing?

    A non-square QW produced by

    thermal induced interdiffusion ofconstituent atoms through the QWheterointerface

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    Quantum Well Intermixing

    before

    1

    2

    after

    1

    2

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    Column III self diffusion through a Column III

    interstitial mechanism.Ga

    As Ga

    As

    Ga

    As Ga

    As

    Ga

    As Ga

    As

    Ga

    As Ga

    As

    Ga

    As Ga

    As

    Ga

    As

    As

    Ga

    As Ga

    As

    Ga

    As Ga

    As

    Al

    As Al

    As

    Al

    As VAl

    As

    Al

    As Al

    As

    Al

    As Al

    As

    Al

    As Al

    As

    Al

    As Al

    As

    Al

    As Al

    As

    Al

    As Al

    As

    GaAs AlAs

    IGa

    IAlVGa

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    As atom

    Ga atom

    Al atom

    interface

    GaAs AlAsBefore QWI

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    AlxGa1-xAs AlyGa1-yAsAfter QWI

    As atom

    Ga atom

    Al atom

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    Quantum Well Intermixing Techniques

    Impurity Induced Intermixing e.g., Zn diffusion induced intermixing

    Impurity Free Intermixing

    e.g., intermixing induced by SiO2 cap

    Laser Induced Intermixing

    Especially for InGaAsP/InP QW structures

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    QWI techniquesHow to produce QWI?

    By slow (hrs) / rapid (sec-min) thermal

    annealing (Group III atoms self-diffusion

    with the help of Group III interstitial andvacancy diffusion)

    By controlled interdiffusion using impurity or

    impurity-free / vacancy disordering

    Laser-assisted disordering

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    Thermal Annealing

    (n-Sample, p-Sample, SI sample PL results)Transfer energy to crystal latticeTransfer energy to crystal lattice increase defect migration and enhanced defect formationincrease defect migration and enhanced defect formation

    700 720 740 780

    0

    3

    6

    9

    12

    As-grown

    N-sample (on Si-doped GaAs)

    P-Sample(on Zn-doped GaAs)

    SI-Sample (on semi-insulating GaAs)

    RelativePLIntensity(a.u.)

    Wavelength (nm)

    RTA@880C

    760 800

    50nm Al0.24Ga0.76As (undoped)

    100nm GaAs (undoped)

    4nm GaAs (undoped)

    50nm Al0.24Ga0.76As (undoped)

    200nm GaAs buffer (undo ed

    (001) GaAs substrate

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    Rapid thermal Annealing of GaAs/AlGaAsquantum wells

    0 30 60 90 120 150

    0

    20

    40

    60

    80

    100

    120

    N-Sample

    P-Sample

    SI-Sample

    PLEnergyShift(meV)

    RTA Time (s)

    RTA @ 876 C

    180

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    Diffusion equations in quantum well intermixing

    The group III atom profile W across the quantum well can

    be described as:

    where z is the displacement in the growthdirection and is centered at the quantum wellcenter, Lz is the well width, Ld = sqrt (Dt) is thediffusion length, D is the diffusioncoefficient, and t is the diffusion time.

    Al profile of a GaAs/AlGaAsquantum well before and afterintermixing.

    S. Yuan et al, J. Appl. Phys., Vol. 83, No. 3, 1 February 1998

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    Impurity Induced Intermixing

    Zn or Si diffusion enhanced QWI

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    Impurity Induced IntermixingMechanism

    Zn induced intermixing:

    Column III interstitial is generated directly by an Interstitial Zn moving into a Column IIIlattice site through a kick-out mechanism:

    ++++ ++ hIZnZn IIIIIII 2

    Si induced intermixing:

    The donor binds with the Group III vacancy to form a

    complex and they move together.

    +GaSi

    IIIV

    +GaSi( )

    IIIV

    The group III vacancy and interstitial diffusion causes Column III atoms (like Ga, Al, In)to diffuse through the sample.

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    Ion implantation Induced Intermixing

    Vacancy

    Interstitial

    Ion implantation

    Point defects:

    Intermixing

    QW

    (1) Ion implantation(2) Rapid thermal annealing

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    Impurity induced intermixing: ion implantation

    Ion energies from a few keV to several MeV

    Implant doses from 1010 to more than 1016

    ions/cm2

    Great combinations of ions and substratespossible, e.g.

    p-type ion (Zn, Be) n-type ion (Si)

    neutral-type ion (O)

    constituent ion (Al, Ga, As) on AlGaAs/GaAs

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    Ion implantation Induced Intermixing

    40-keV proton implantation profile in a 4-well

    multiple quantum well structure.

    Photoluminescence photon energy

    shift as a function of irradiation dose.RTA: 900C for 30s.

    H. H. Tan, C. Jagadish et alAppl. Phys. Lett. 68, 2401(1995)

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    Lateral Selectivity of QW Intermixing (Ion

    implantation induced intermixing)

    MOCVD grown

    InGaAs/InGaAsP unstrained laserstructure

    P+ at 1 MeV with 1014 cm-2 dose

    at 200 C prior to implantation, a 2.0m

    SiO2 layer as a selective area mask

    5m mask stripe width giving a

    lateral selectivity of 2.5 mJ.Vac. Sci. Tech. A, vol.16, no.2 (1998)

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    Impurity free induced intermixing

    (a) As-grown GaAs/AlAs QW

    (b) A SiO2 cap layer is depositedon top of the sample. The sampleis then annealed. Ga atoms aresocked into the SiO2 cap, leavingbehind some Ga vacancies, thuspromoting interdiffusionbetween Al and Ga atoms.

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    Selective area QWI

    Degree of intermixing is in some way proportional to the area ofcontact between the sample and the SiO2 cap.

    One-step lithography (e-beam), lift-off, and one-step RTP.

    B.S. Ooi, et.al IEEE. J. Quantum Electron. , 33 (10), pp1784-1793, (1997)

    L ower cladding AlGaAs

    1m SrF2 mask

    SiO2 capp ing layer

    Up per cladd ingAl GaAs

    GaAs D QW

    Intensity(arb.

    units)

    830 840 850 860 870

    Wavelength (nm)

    0% 15% 25% 50% As-grown

    SiO2: promotes intermixingSrF2: surpresses intermixing

    SrF2 area percentage

    Vacancy diffusion front

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    Impurity free intermixing(Pulsed anodic oxide induced intermixing)

    Pulsed anodic oxidation set-up

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    Pulsed anodic oxide induced intermixing

    Effects of the distance between the oxide andthe quantum well

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    Impurity free intermixing application toquantum wire photoluminescence(Pulsed anodic oxide induced intermixing)

    Quantum well intermixing in the side walls enhances the lateral confinementof electrons in the quantum wire, resulting in the observation of PL signal from thequantum wire (QWR).

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    Laser induced intermixing

    Quantum Well Intermixing

    Bandgap increases as intermixing proceeds

    h

    Eg disordered

    hhh h

    Eg starting

    h

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    Laser induced intermixing methods:

    Direct laser radiation: thermal intermixing (poorspatial resolution ~ 100 micron )

    Two step Photo-absorption induced intermixing:

    (1) Laser radiation at low power and low temperature togenerate defects

    (2) High temperature annealing.

    (better spatial resolution ~20 micron)

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    Laser induced intermixing: experimental set-up

    Operation: AlGaAS-GaAs as example

    Encapsulation layer Si3N4 (90nm) Light source Ar+ laser beam,

    = 488nm

    scan speed 85 m / s

    Setup consists of computer-controlled x-y table and a laser

    Appl. Phys. Lett. 52, 1371 (1988)

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    Laser induced intermixing (pulsed photon-absorptionassisted interdiffusion, PPAID)

    Power-current characteristics of three lasersAs-grown, control (annealed, without pulsedlaser exposure), and PPAID lasers.

    Emission spectrum of these threelasers.

    B. S. Ooi et al, IEEE Photonics Technology Letters, 9, 587(1997)

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    Quantum Well Intermixing Applications

    Laser diodes: non-absorbing mirrors (windows)

    Laterial confinement lasers

    Photonic Integration

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    Nonabsorbing mirror laser diodes

    Ti/Aumetalcontact

    SiO 2insulationlayer

    MQWInGaAs-InGaAsP

    Au/Ge/Au/Ni/Au

    backcontact

    QWI in a region near the laser facet (window/mirror)

    to increase the band gap of that region, making thatregion transparent to the laser beam, reducing the light absorptionand reducing facet temperature==> higher light output and better reliability

    Selected area QWI

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    Lateral confinement in laser diodes

    Lateral electrical and optical confinements can both be enhanced by QWI in the regionsoutside of the ridge wave guide.

    When this region is intermixing, the effective band gap is increased, and effective

    refractive index is reduced.

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    Lateral confinement in laser diodes

    Lateral leakage current is reduced by impurity induced intermixing (IID).S. Y. Hu et al, PTL 7, 712(1995)

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    Photonic Integration Laser action occurs just above the band-edge

    i.e. passive section is highly absorbing at lasing wavelength

    Solution: modify the bandgap energy at the passive region

    Laser Waveguide couplerModulator

    Absorpt

    ion

    QWs

    Laser

    Energy

    modulatorwaveguide

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    Photonic integration by using QW Intermixing

    Excellent alignment of active and passive waveguides

    Reflection at the joint can be negligible (~10-6) Mode matching is intrinsic to the process

    Low-loss waveguideQuantum well amplifier

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    Extended Cavity Lasers Two-section Integration

    Active cavity = 500 m

    Passive cavity lengths = 0 600 m

    Activ

    elaser

    sectio

    n

    Passiv

    e

    waveg

    uides

    ection

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    Multiple wavelength laser array

    p-type contact

    Oxide isolation

    QW

    n-type contact

    Substrate

    un-implanted dose A dose B

    1

    1

    > 2

    > 3

    dose A < dose B

    2 3

    Ion implantation

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    Multiple wavelength laser array (results)

    < 20% increase in Jth, and

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    Multiple Wavelength Integration Capability

    Multiple bandgaps monolithically integrated on a single chip

    Wavelength spans over entire C-band

    1250 1300 1350 1400 1450 15000.000

    0.001

    0.002

    0.003

    0.004

    0.005

    FWHM=113 nm

    Enveloped curve

    PL

    intensi

    ty

    (a.u.)

    Wavelength (nm)

    Confidential

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    Multiple-Bandgap Integration

    Ion-Implantation Induced Disordering

    One-step implantation, one-step RTP, multiple-step oflithography and dry etching.

    E.S. Koteles, et. al, IEEE Selected Topics in Quantum Electron, 1998

    Semiconductor wafer

    SiO2

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    One-Step Multiple-Bandgap Integration

    One photolithography step to achieve different thicknessof resist.

    One dry etching step to create different thickness of SiO2

    implant mask. One implantation and RTP step to create multiple bandgap

    across a laser chip.

    B.S. Ooi, et. al, Multiple Bandgap Photonic Integration, PTC Patent pending, 1999

    Semiconductor wafer Semiconductor wafer

    SiO2SiO2

    Photoresist

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    Monolithic Multiple Wavelength Lasers

    .

    Isolation

    Lasersection

    Multiple wavelength lasers (10-channel) fabricated using theone-step postgrowth bandgap engineering technique.

    B.S. Ooi, et. al, A technique for fabricating WDM laser sources, PTC Patent pending, 2000

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    Monolithic Multiple Wavelength Lasers

    1470 1480 1490 1500 1510 1520 1530 1540 1550 1560

    Intensity

    (a.u.)

    Wavelength (nm)

    1 2 3 4 5 6 7 8 9 101460

    1480

    1500

    1520

    1540

    1560

    Lasingwavelength(nm)

    Channel number

    Lasing wavelength

    0.0

    0.2

    0.4

    0.6

    0.8SiO2thickness(nm)

    SiO2 thickness

    A correlation between SiO2 thickness and the emission has been observed.

    17% increase in Jth, i.e. from 1.2 kA/cm2 (channel 1) to 1.4

    kA/cm2 (channel 10).

    Only small change in slope efficiency has been observed.

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    Tuning the wavelength of QWIP

    Metal contact

    Multi-QWsMetal contact

    Bottom contact

    Substrate

    un-implanted dose A < dose B

    1

    23

    1 < 2 < 3

    Top contact

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    Conclusions

    Impurity induced intermixing

    Impurity free vacancy induced intermixing

    Laser induced intermixing

    Improving device performance

    Photonic integration

    Quantum well intermixing: post-growth modification of band gap

    ==> usually larger band gap (0-200meV) andlower refractive index (0-5% change)

    Its applications

    Vielendank !