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7/30/2019 QWIUnivLinz.pdf
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Quantum Well Intermixing and Its Applications
Shu YuanSchool of Materials Engineering
Nanyang Technological University
Singapore
Thanks to the following friends for providing some slides:
Dr. B. S. Ooi, Phosistors Inc., CA, USA
Dr. C. Jagadish & Dr. L. Fu, Australian Natl Univ.
Dr. S. F. Yu, NTU & late Dr. E. H. Li (Hong Kong Univ.)
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Contents
Introduction
Techniques for QW intermixing Device applications
Conclusions
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IntroductionIntroductionIntroduction
What is QW intermixing?
A non-square QW produced by
thermal induced interdiffusion ofconstituent atoms through the QWheterointerface
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Quantum Well Intermixing
before
1
2
after
1
2
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Column III self diffusion through a Column III
interstitial mechanism.Ga
As Ga
As
Ga
As Ga
As
Ga
As Ga
As
Ga
As Ga
As
Ga
As Ga
As
Ga
As
As
Ga
As Ga
As
Ga
As Ga
As
Al
As Al
As
Al
As VAl
As
Al
As Al
As
Al
As Al
As
Al
As Al
As
Al
As Al
As
Al
As Al
As
Al
As Al
As
GaAs AlAs
IGa
IAlVGa
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As atom
Ga atom
Al atom
interface
GaAs AlAsBefore QWI
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AlxGa1-xAs AlyGa1-yAsAfter QWI
As atom
Ga atom
Al atom
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Quantum Well Intermixing Techniques
Impurity Induced Intermixing e.g., Zn diffusion induced intermixing
Impurity Free Intermixing
e.g., intermixing induced by SiO2 cap
Laser Induced Intermixing
Especially for InGaAsP/InP QW structures
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QWI techniquesHow to produce QWI?
By slow (hrs) / rapid (sec-min) thermal
annealing (Group III atoms self-diffusion
with the help of Group III interstitial andvacancy diffusion)
By controlled interdiffusion using impurity or
impurity-free / vacancy disordering
Laser-assisted disordering
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Thermal Annealing
(n-Sample, p-Sample, SI sample PL results)Transfer energy to crystal latticeTransfer energy to crystal lattice increase defect migration and enhanced defect formationincrease defect migration and enhanced defect formation
700 720 740 780
0
3
6
9
12
As-grown
N-sample (on Si-doped GaAs)
P-Sample(on Zn-doped GaAs)
SI-Sample (on semi-insulating GaAs)
RelativePLIntensity(a.u.)
Wavelength (nm)
RTA@880C
760 800
50nm Al0.24Ga0.76As (undoped)
100nm GaAs (undoped)
4nm GaAs (undoped)
50nm Al0.24Ga0.76As (undoped)
200nm GaAs buffer (undo ed
(001) GaAs substrate
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Rapid thermal Annealing of GaAs/AlGaAsquantum wells
0 30 60 90 120 150
0
20
40
60
80
100
120
N-Sample
P-Sample
SI-Sample
PLEnergyShift(meV)
RTA Time (s)
RTA @ 876 C
180
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Diffusion equations in quantum well intermixing
The group III atom profile W across the quantum well can
be described as:
where z is the displacement in the growthdirection and is centered at the quantum wellcenter, Lz is the well width, Ld = sqrt (Dt) is thediffusion length, D is the diffusioncoefficient, and t is the diffusion time.
Al profile of a GaAs/AlGaAsquantum well before and afterintermixing.
S. Yuan et al, J. Appl. Phys., Vol. 83, No. 3, 1 February 1998
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Impurity Induced Intermixing
Zn or Si diffusion enhanced QWI
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Impurity Induced IntermixingMechanism
Zn induced intermixing:
Column III interstitial is generated directly by an Interstitial Zn moving into a Column IIIlattice site through a kick-out mechanism:
++++ ++ hIZnZn IIIIIII 2
Si induced intermixing:
The donor binds with the Group III vacancy to form a
complex and they move together.
+GaSi
IIIV
+GaSi( )
IIIV
The group III vacancy and interstitial diffusion causes Column III atoms (like Ga, Al, In)to diffuse through the sample.
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Ion implantation Induced Intermixing
Vacancy
Interstitial
Ion implantation
Point defects:
Intermixing
QW
(1) Ion implantation(2) Rapid thermal annealing
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Impurity induced intermixing: ion implantation
Ion energies from a few keV to several MeV
Implant doses from 1010 to more than 1016
ions/cm2
Great combinations of ions and substratespossible, e.g.
p-type ion (Zn, Be) n-type ion (Si)
neutral-type ion (O)
constituent ion (Al, Ga, As) on AlGaAs/GaAs
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Ion implantation Induced Intermixing
40-keV proton implantation profile in a 4-well
multiple quantum well structure.
Photoluminescence photon energy
shift as a function of irradiation dose.RTA: 900C for 30s.
H. H. Tan, C. Jagadish et alAppl. Phys. Lett. 68, 2401(1995)
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Lateral Selectivity of QW Intermixing (Ion
implantation induced intermixing)
MOCVD grown
InGaAs/InGaAsP unstrained laserstructure
P+ at 1 MeV with 1014 cm-2 dose
at 200 C prior to implantation, a 2.0m
SiO2 layer as a selective area mask
5m mask stripe width giving a
lateral selectivity of 2.5 mJ.Vac. Sci. Tech. A, vol.16, no.2 (1998)
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Impurity free induced intermixing
(a) As-grown GaAs/AlAs QW
(b) A SiO2 cap layer is depositedon top of the sample. The sampleis then annealed. Ga atoms aresocked into the SiO2 cap, leavingbehind some Ga vacancies, thuspromoting interdiffusionbetween Al and Ga atoms.
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Selective area QWI
Degree of intermixing is in some way proportional to the area ofcontact between the sample and the SiO2 cap.
One-step lithography (e-beam), lift-off, and one-step RTP.
B.S. Ooi, et.al IEEE. J. Quantum Electron. , 33 (10), pp1784-1793, (1997)
L ower cladding AlGaAs
1m SrF2 mask
SiO2 capp ing layer
Up per cladd ingAl GaAs
GaAs D QW
Intensity(arb.
units)
830 840 850 860 870
Wavelength (nm)
0% 15% 25% 50% As-grown
SiO2: promotes intermixingSrF2: surpresses intermixing
SrF2 area percentage
Vacancy diffusion front
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Impurity free intermixing(Pulsed anodic oxide induced intermixing)
Pulsed anodic oxidation set-up
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Pulsed anodic oxide induced intermixing
Effects of the distance between the oxide andthe quantum well
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Impurity free intermixing application toquantum wire photoluminescence(Pulsed anodic oxide induced intermixing)
Quantum well intermixing in the side walls enhances the lateral confinementof electrons in the quantum wire, resulting in the observation of PL signal from thequantum wire (QWR).
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Laser induced intermixing
Quantum Well Intermixing
Bandgap increases as intermixing proceeds
h
Eg disordered
hhh h
Eg starting
h
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Laser induced intermixing methods:
Direct laser radiation: thermal intermixing (poorspatial resolution ~ 100 micron )
Two step Photo-absorption induced intermixing:
(1) Laser radiation at low power and low temperature togenerate defects
(2) High temperature annealing.
(better spatial resolution ~20 micron)
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Laser induced intermixing: experimental set-up
Operation: AlGaAS-GaAs as example
Encapsulation layer Si3N4 (90nm) Light source Ar+ laser beam,
= 488nm
scan speed 85 m / s
Setup consists of computer-controlled x-y table and a laser
Appl. Phys. Lett. 52, 1371 (1988)
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Laser induced intermixing (pulsed photon-absorptionassisted interdiffusion, PPAID)
Power-current characteristics of three lasersAs-grown, control (annealed, without pulsedlaser exposure), and PPAID lasers.
Emission spectrum of these threelasers.
B. S. Ooi et al, IEEE Photonics Technology Letters, 9, 587(1997)
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Quantum Well Intermixing Applications
Laser diodes: non-absorbing mirrors (windows)
Laterial confinement lasers
Photonic Integration
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Nonabsorbing mirror laser diodes
Ti/Aumetalcontact
SiO 2insulationlayer
MQWInGaAs-InGaAsP
Au/Ge/Au/Ni/Au
backcontact
QWI in a region near the laser facet (window/mirror)
to increase the band gap of that region, making thatregion transparent to the laser beam, reducing the light absorptionand reducing facet temperature==> higher light output and better reliability
Selected area QWI
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Lateral confinement in laser diodes
Lateral electrical and optical confinements can both be enhanced by QWI in the regionsoutside of the ridge wave guide.
When this region is intermixing, the effective band gap is increased, and effective
refractive index is reduced.
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Lateral confinement in laser diodes
Lateral leakage current is reduced by impurity induced intermixing (IID).S. Y. Hu et al, PTL 7, 712(1995)
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Photonic Integration Laser action occurs just above the band-edge
i.e. passive section is highly absorbing at lasing wavelength
Solution: modify the bandgap energy at the passive region
Laser Waveguide couplerModulator
Absorpt
ion
QWs
Laser
Energy
modulatorwaveguide
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Photonic integration by using QW Intermixing
Excellent alignment of active and passive waveguides
Reflection at the joint can be negligible (~10-6) Mode matching is intrinsic to the process
Low-loss waveguideQuantum well amplifier
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Extended Cavity Lasers Two-section Integration
Active cavity = 500 m
Passive cavity lengths = 0 600 m
Activ
elaser
sectio
n
Passiv
e
waveg
uides
ection
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Multiple wavelength laser array
p-type contact
Oxide isolation
QW
n-type contact
Substrate
un-implanted dose A dose B
1
1
> 2
> 3
dose A < dose B
2 3
Ion implantation
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Multiple wavelength laser array (results)
< 20% increase in Jth, and
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Multiple Wavelength Integration Capability
Multiple bandgaps monolithically integrated on a single chip
Wavelength spans over entire C-band
1250 1300 1350 1400 1450 15000.000
0.001
0.002
0.003
0.004
0.005
FWHM=113 nm
Enveloped curve
PL
intensi
ty
(a.u.)
Wavelength (nm)
Confidential
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Multiple-Bandgap Integration
Ion-Implantation Induced Disordering
One-step implantation, one-step RTP, multiple-step oflithography and dry etching.
E.S. Koteles, et. al, IEEE Selected Topics in Quantum Electron, 1998
Semiconductor wafer
SiO2
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One-Step Multiple-Bandgap Integration
One photolithography step to achieve different thicknessof resist.
One dry etching step to create different thickness of SiO2
implant mask. One implantation and RTP step to create multiple bandgap
across a laser chip.
B.S. Ooi, et. al, Multiple Bandgap Photonic Integration, PTC Patent pending, 1999
Semiconductor wafer Semiconductor wafer
SiO2SiO2
Photoresist
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Monolithic Multiple Wavelength Lasers
.
Isolation
Lasersection
Multiple wavelength lasers (10-channel) fabricated using theone-step postgrowth bandgap engineering technique.
B.S. Ooi, et. al, A technique for fabricating WDM laser sources, PTC Patent pending, 2000
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Monolithic Multiple Wavelength Lasers
1470 1480 1490 1500 1510 1520 1530 1540 1550 1560
Intensity
(a.u.)
Wavelength (nm)
1 2 3 4 5 6 7 8 9 101460
1480
1500
1520
1540
1560
Lasingwavelength(nm)
Channel number
Lasing wavelength
0.0
0.2
0.4
0.6
0.8SiO2thickness(nm)
SiO2 thickness
A correlation between SiO2 thickness and the emission has been observed.
17% increase in Jth, i.e. from 1.2 kA/cm2 (channel 1) to 1.4
kA/cm2 (channel 10).
Only small change in slope efficiency has been observed.
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Tuning the wavelength of QWIP
Metal contact
Multi-QWsMetal contact
Bottom contact
Substrate
un-implanted dose A < dose B
1
23
1 < 2 < 3
Top contact
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Conclusions
Impurity induced intermixing
Impurity free vacancy induced intermixing
Laser induced intermixing
Improving device performance
Photonic integration
Quantum well intermixing: post-growth modification of band gap
==> usually larger band gap (0-200meV) andlower refractive index (0-5% change)
Its applications
Vielendank !