SAM E70 Xplained Ultra Evaluation User's Guideww1.microchip.com/downloads/en/DeviceDoc/SAME70_Xplained_Ultra... · The Atmel SAM E70 Xplained Ultra Dvelopment Kit is a hardware platform

SAM E70 Xplained Ultra User's Guide

Introduction

This user’s guide provides detailed information about the SAM E70 Xplained Ultra Evaluation kit and itsvarious features. The figure below illustrates the SAM E70 Xplained Ultra Evaluation kit.

Figure 1. SAM E70 Xplained Ultra Evaluation Kit with PHY Daughter Board

FeaturesThe following are key features of the SAM E70 Xplained Ultra Evaluation kit.

• ATSAME70Q21 Microcontroller• One Mechanical Reset Button• One Mechanical User Push Button• Two User LEDs• 12.0 MHz Oscillator (DSC6003)• 32.768 kHz Oscillator (DSC6083)• 2-MB SDRAM• 4-MB QSPI Flash (SST26VF032BA)

© 2019 Microchip Technology Inc. DS70005389B-page 1

• Ethernet Interface with External IEEE® 802.3az 10Base-T/100Base-TX Ethernet RMII PHY on aDaughter Board

• AT24MAC402 256KB EEPROM with EUI-48 Address• ATA6561 CAN Transceiver• Micro SD Card Connector with SDIO Support• Camera Interface Connector• Two Xplained Pro Extension Headers• Graphics Card Interface• CoreSight® 20 Connector for 4-bit ETM• Arduino MEGA Shield Connector• External Debugger Connector• USB Interface, Device and Host Mode• Embedded Debugger:

– Programming and debugging through USB interface– Auto-ID for board identification in Atmel Studio and MPLAB® X IDE– One yellow status LED– One green board power LED– Symbolic debug of complex data types including scope information– Data Gateway Interface: SPI, I2C, and four GPIOs– Virtual COM port (CDC)

• External Power Input (5-14V) or USB Power• X32 Daughter Board Interface to Support Audio and Bluetooth®

• One mikroBus™ Interface

Kit OverviewThe Microchip PIC32 SAM E70 Xplained Ultra Development Kit (DM320113) provides a modulardevelopment system for Microchip’s line of 32-bit Cortex® microcontrollers.

For a free Microchip demonstration code and additional information, visit the MPLAB Harmony™ webpage at: http://www.microchip.com/MPLABHarmony.

The Atmel SAM E70 Xplained Ultra Dvelopment Kit is a hardware platform to evaluate the MicrochipATSAME70Q21. The kit offers a set of features that enables the ATSAME70Q21 users to start with theSAM E70 peripherals and understand how to integrate the device in their design.

The SAM E70 Xlpained Ultra kit contains the following items:

• One SAM E70 Xplained Ultra Development Kit• One KSZ8061 Ethernet PHY• One Graphics card set up for 565 (16-bit color) graphics

Note: If any items are missing in the kit, contact Microchip sales office for assistance. A list of Microchipsales offices is provided on the last page of this document.

The figure below illustrates the SAM E70 Xplained Ultra Evaluation Kit features.


http://www.microchip.com/MPLABHarmny

Figure 2. SAM E70 Xplained Ultra Evaluation Kit


The table below provides the SAM E70 Xplained Ultra Evaluation kit feature descriptions.

Table 1. SAM E70 Xplained Ultra Evaluation Kit Feature and Location

Number Description

1 CAN interface

2 X32 Daughter Board interface

3 Mikro interface

4 Ethernet PHY interface

5 Ethernet Clock enable/disable jumper1. Shorted = disabled2. Open = enabled

6 EXT1/EXT2 interface

7 Debugger USB1. Programming2. Power3. DGI

8 External Reset Button

9 User Button

10 MCU current measurement jumper

11 SAM E70 Host/Device USB

12 CoreSite® 20 (SWD + ETM) debugging interface

13 Barrel power input (2.1mm)

14 User defined LEDs

15 LED2/USB detect jumper

16 Image Sensor interface

17 SWD debugger interface

18 Graphics card interface

19 ATSAME70Q21B

20 SQI external Flash memory


Table of Contents

Introduction......................................................................................................................1

1. Getting Started.......................................................................................................... 7

2. Xplained Ultra............................................................................................................ 9

3. Embedded Debugger.............................................................................................. 103.1. Hardware Identification System..................................................................................................10

4. System Level Block Diagram...................................................................................12

5. Hardware Features..................................................................................................135.1. Xplained Pro Standard Extension Header..................................................................................135.2. Graphics Connectors or GFX Card Interface............................................................................. 145.3. SDRAM and LCD Connections.................................................................................................. 175.4. Camera Connector.....................................................................................................................195.5. USB Connectivity....................................................................................................................... 205.6. Chip Erase Header.....................................................................................................................215.7. Audio Connectivity......................................................................................................................215.8. mikroBUS™ Header................................................................................................................... 235.9. CAN............................................................................................................................................235.10. Ethernet......................................................................................................................................245.11. Debug USB Connectivity............................................................................................................255.12. Switches.....................................................................................................................................255.13. AT24MAC402 Serial EEPROM.................................................................................................. 265.14. Power Sources...........................................................................................................................27

6. Hardware................................................................................................................. 296.1. SAM E70 Main Board Schematics............................................................................................. 296.2. Ethernet Daughter Board Schematics........................................................................................516.3. 565 LCD Adapter Schematics....................................................................................................526.4. Bill of Materials...........................................................................................................................53

7. Revision History.......................................................................................................58

The Microchip Web Site................................................................................................ 59

Customer Change Notification Service..........................................................................59

Customer Support......................................................................................................... 59

Microchip Devices Code Protection Feature................................................................. 59

Legal Notice...................................................................................................................60

Trademarks................................................................................................................... 60


Quality Management System Certified by DNV.............................................................61

Worldwide Sales and Service........................................................................................62


1. Getting Started

SAM E70 Xplained Ultra Evaluation Quick StartFollow these steps to explore the Atmel SAM E70 Xplained Ultra evaluation kit:

1. Download and install MPLAB X IDE.2. Launch MPLAB X IDE.3. Install MPLAB Harmony 3™.

When Microchip SAM E70 Xplained Ultra is connected to the computer for the first time, by default, theoperating system will install a driver software. The driver file supports both 32-bit and 64-bit versions ofMicrosoft® Windows® XP/ Vista /7/8/10.

Once the kit is powered, the green power LED will be lit and MPLAB X IDE will auto-detect the kit andidentify which Xplained Pro extension boards are to be connected. MPLAB X IDE will provide relevantinformation, such as data sheets and kit documentation. The SAM E70 device is programmed anddebugged by the on-board Embedded Debugger, hence no external programmer or debugger tool isneeded.

Design Documentation and Relevant LinksThe following list provides detailed information about relevant documents and software for the SAM E70Xplained Ultra.

• Xplained Pro products– Atmel Xplained Pro is a series of small-sized and easy-to-use evaluation kit for Microchip

microcontrollers and other Microchip products. It consists of a series of low-cost MCU boards forevaluation and demonstration of features and capabilities of different MCU families.

• Microchip MPLAB Integrated Development Environment– A free Microchip MPLAB X IDE for development of C/C++ and assembler code for Microchip

microcontrollers.• MPLAB Harmony

– A free MPLAB Harmony code base is available for user application. The latest MPLAB Harmonycode is available for download at: http://www.microchip.com/MPLABHarmony.

• EDBG User Guide– This user’s guide provides additional information about the on-board Embedded Debugger.

• Data Visualizer– Data Visualizer is a program used for processing and visualizing data. The Data Visualizer can

receive data from various sources, such as the Embedded Debugger Data Gateway Interfacefound on the Xplained Pro boards and COM ports.

• IAR Embedded Workbench® for Arm®

– A commercial C/C++ compiler that is available for ARM. A 30-day evaluation version and a codesize limited kick-start version are also available for download from their web site. The code sizelimit is 16-KB for devices with M0, M0+, M1 cores, and 32-KB for devices with other cores.

• Keil MDK-ARM Microcontroller Development Kit– The MDK-ARM is a complete software development environment for Cortex®-M, Cortex-R4,

ARM7™, and ARM9™ processor-based devices. The MDK-ARM is specifically designed formicrocontroller applications, it is user friendly yet powerful enough for the most demandingembedded applications.

Getting Started


http://www.microchip.com/MPLABHarmony

• Design Documentation– Package containing schematics, BOM, assembly drawings, 3D plots, layer plots, and so on.

• Hardware Users Guide– PDF version of this user guide.

Getting Started


2. Xplained UltraThe SAM E70 Xplained Ultra implements several Xplained Pro standards, such as extension headersand connectors. Xplained Pro is an evaluation platform that provides a full Microchip microcontrollerexperience. The platform consists of a series of Microcontroller (MCU) boards and extension boards thatare integrated with the Microchip MPLAB X IDE that supports data streaming. The Xplained Pro MCUboards support a wide range of Xplained Pro extension boards, such as audio DACs/CODECs, EthernetPHYs, graphics cards, and mikroBUS™ that are connected through a set of standardized headers andconnectors. Each extension board has an identification (ID) chip to uniquely identify which boards areconnected to a Xplained Pro MCU board. This information is used to present relevant user guides,application notes, data sheets, and example code through MPLAB X IDE.

Xplained Ultra


3. Embedded DebuggerThe SAM E70 Xplained Ultra contains Microchip Embedded Debugger (EDBG) for on-board debugging.The EDBG is a composite USB device, which is based on the following interfaces:

• Debugger• Virtual COM Port• Data Gateway Interface (DGI)

Together with the Microchip MPLAB X IDE, the EDBG debugger interface can program and debug theATSAME70Q21. On the SAM E70 Xplained Ultra, the SWD interface is connected between the EDBGand the ATSAME70Q21.

The Virtual COM Port is connected to a UART on the ATSAME70Q21 and provides an easy way tocommunicate with the target application through the terminal software. It offers variable baud rate, parity,and Stop bit settings. The settings on the ATSAME70Q21 must match the settings given in the terminalsoftware.

Note: If not set automatically, Data Terminal Ready (DTR) must be set in the terminal software.

The DGI consists of several physical interfaces for communication with the host computer.Communication over the interfaces is bidirectional. It can be used to send events and values from theATSAME70Q21, or as a generic printf-style data channel. Traffic over the interfaces can be timestampedon the EDBG for accurate tracing of events. Note that timestamping imposes an overhead that reducesmaximal throughput. The Data Visualizer is used to send and receive data through DGI.

The EDBG controls two LEDs on SAM E70 Xplained Ultra: a power LED and a status LED.

The following table describes how the LEDs are controlled in different operation modes.

Table 3-1. EDBG LED Control

Operation Mode Power LED Status LED

Normal operation The power LED is lit when power isapplied to the board.

Activity indicator, LED flashes when anycommunication happens to the EDBG.

Bootloader mode(idle)

The power LED and the status LEDblinks simultaneously.

The power LED and the status LEDblinks simultaneously.

Bootloader mode(firmware upgrade)

The power LED and the status LEDblinks in an alternating pattern.

The power LED and the status LEDblinks in an alternating pattern.

For additional information on EDBG, refer to the EDBG User Guide.

3.1 Hardware Identification SystemAll Xplained Pro-compatible extension boards have an Microchip ATSHA204 CryptoAuthentication™ chipmounted. This chip contains information that identifies the extension with its name and data. When anXplained Pro extension is connected to an Xplained Pro MCU board, the information is read and sent tothe MPLAB X IDE. The Microchip kits extension, installed with MPLAB X IDE, provides relevantinformation, such as code examples, and links to relevant documents. The following table provides thedata fields stored in the ID chip with content examples.

Embedded Debugger


http://ww1.microchip.com/downloads/en/DeviceDoc/Atmel-42096-Microcontrollers-Embedded-Debugger_User-Guide.pdf

Table 3-2. Xplained Pro ID Chip Content Example

Data Field Data Type Example

Manufacture ASCII string Microchip’\0’

Product Name ASCII string

Product Revision ASCII string 04’\0’

Product Serial number ASCII string 1774020200000010’\0’

Minimum Voltage (mV) uint16_t 3000

Maximum Voltage (mV) uint16_t 3600

Maximum Current (mA) uint16_t 30

Embedded Debugger


4. System Level Block DiagramThe following figure illustrates the high-level signal block diagram of the SAM E70 Xplained UltraDevelopment Kit.Figure 4-1. Signal Level Block Diagram

Wire buses that are tied together are connected together. In this system the SPI bus data and clock areshared across several interfaces. The SPI Slave selects are addressed individually with GPIO.

System I2C uses I2C0 and connects to the debugger, EXT1, EXT2, and mikroBus/X32. Touch I2C usesI2C2 and only goes from the microcontroller to the graphics connector.

The debugger has the following interfaces connected: DGI SPI, DGI I2C, DGI UART, and SWD.

UART wires from the microcontroller to the blocks are not shared with each other.

System Level Block Diagram


5. Hardware Features

5.1 Xplained Pro Standard Extension HeaderAll Xplained Ultra Kits have many dual-row, 20-pin, 100 mil extension headers. Xplained Ultra MCUboards have male headers, while Xplained Ultra extensions have their female counterparts as shown inthe image below.

Note: All pins are not always connected.

The extension headers can be used to connect a variety of Xplained Pro extensions to Xplained UltraMCU boards or to access the pins of the target MCU on Xplained Ultra MCU boards directly.

Figure 5-1. Extension Headers

All connected pins follow the defined pinout description as shown in the following table.

Table 5-1. Xplained Pro Standard Extension Header

Pin number Name Description

1 ID Communication line to the ID chip on an extension board

2 GND Ground

3 ADC(+) Analog-to-Digital Converter (ADC), alternatively positive part ofdifferential ADC

4 ADC(-) Analog-to-Digital Converter (ADC), alternatively negative part ofdifferential ADC

5 GPIO1 General purpose I/O


7 PWM(+) Pulse-Width Modulation, alternatively positive part of differential PWM

8 PWM(-) Pulse-Width Modulation, alternatively negative part of differential PWM

9 IRQ/INT/GPIO Interrupt request line and general purpose I/O

10 SPI SS B/GPIO SPI Slave Select or general purpose I/O

11 I2C SDA Data line for I2C interface. Always implemented, bus type

12 I2C SCL Clock line for I2C interface. Always implemented, bus type

Hardware Features


...........continuedPin number Name Description

13 UART RX Receiver line of target device UART

14 UART TX Transmitter line of target device UART

15 SPI SS A/GPIO SPI Slave Select or general purpose I/O

16 SPI MOSI Master Out Slave In line of serial peripheral interface. Alwaysimplemented, bus type.

17 SPI MISO Master In Slave Out line of serial peripheral interface. Alwaysimplemented, bus type.

18 SPI SCK Clock for serial peripheral interface. Always implemented, bus type.

19 GND Ground

20 VCC Power for extension boards (3.3V)

5.2 Graphics Connectors or GFX Card InterfaceThe SAM E70 Xplained Ultra Development Kit is designed to have a modular graphics interface. Thisinterface enables using several graphics cards, which allow for expandability and different use cases. A565 adapter card is included in the kit, which takes 16-bit parallel LCD data and converts it to 24-bit data.This card also provides access to ADC for resistive touch screens, hence an external controller is notneeded. See table below for pin descriptions.

Table 5-2. Graphics Interface Pinout

Pin Number Name Description

1 GND Ground

2 GND Ground

3 MCLR Master Clear, Controlled by the debuggers. Allows for acomplete system reboot.

4 IRQ1 (LCD Touch) Interrupt request line for cap touch device

5 5.0v VCC 5.0v

6 IRQ2 (Q Touch) Interrupt request line for Q touch devices

7 LCDEN LCD Data Enable

8 IRQ3 (Display Controllers) Interrupt request line for external display controllers

9 LCDHSYNC/NCS3 LCD Horizontal Sync

10 IRQ4 (Resistive touch) Interrupt request line for resistive touch controllers

11 LCDVSYNC/nWE LEC Vertical Sync or Write enable (active-low)

12 5.0v VCC +5.0v

13 LCDPCK/nRD LCD pixel Clock or Read Enable (active-low)

Hardware Features


...........continuedPin Number Name Description

14 I2C SDA Data line for I2C interface. Always implemented, bus type.

15 LCD D0 LCD Data bit 0

16 I2C SCL Clock line for I2C interface. Always implemented, bus type.


18 SPI SCK Clock for serial peripheral interface. Always implemented, bustype.


20 SPI MOSI Master Out Slave In line of serial peripheral interface.


22 SPI MISO Master In Slave Out line of serial peripheral interface.


24 SPI SS SPI Slave Select


26 UART RX Receiver line of target device UART


28 UART TX Transmitter line of target device UART. (from MCU to GFXcard)


30 UART RTS UART Ready To Send (from MCU to GFX card)


32 UART CTS UART Clear To Send (from MCU to GFX card)


34 LCD PWM LCD PWM back light control


36 PWM2 Pulse-Width Modulation,








Hardware Features



44 STBY/RST/GPIO4 Standby/Reset or general purpose I/O. For resetting devicesattached to the GFX connector.


46 STBY/RST/GPIO5 Standby2/Reset2 or general purpose I/O

47 LCD D16 LCD Data bit 16 (Not Implemented on this design)

48 ID pin Communication line to the ID chip on an extension board


50 ADC 0 Analog-to-Digital Converter to MCU


52 ADC1 Analog-to-Digital Converter to MCU











63 3.3V VCC +3.3V VCC


65 GND Ground

66 3.3V VCC +3.3V VCC

67 GND Ground

68 GND TAB Mounting Tab

69 GND TAB Mounting Tab

Hardware Features


5.3 SDRAM and LCD ConnectionsThe external bus interface (EBI) on SAM E71 Xplaned Ultra is controlled by the static memory controller(SMC) and SDRAM controllers modules in the ATSAME70Q21B.

ATSAME70Q21B has on-die series termination on very I/O pin as shown in figure below.

Figure 5-2. On-Die Termination

The EBI is connected to the on-board SDRAM and the Xplained Pro Graphics connector. The followingfigure shows how the SDRAM and LCD share the same sets of data pins, and displays the location of theseries termination resistors.

Figure 5-3. LCD and SDRAM

As the I/O pins have on-die series termination, the impedance of the drivers must be matched to theimpedance of the EBI tracks on the PCB using series resistors. The EBI tracks are routed as 50Ω onSAM E70 Xplained Ultra. The clock and address lines are only driven by the ATSAME70Q21B, while thedata lines are driven by the ATSAME70Q21B and the on-board SDRAM.

Hardware Features


Simulation of the transmissions lines using IBIS files for the ATSAME70Q21B and the SDRAM gave theresults are shown in the table below.

Table 5-3. EBI Simulation Results

Driving Circuit Signal Type Driver Impedance(from ibis)

SeriesTermination

Z0

ATSAME70Q21B Data/Address 22Ω 24Ω ≈ 22Ω 50Ω

Clock 21Ω 25Ω ≈ 22Ω 50Ω

SDRAM Data 11Ω 32Ω ≈ 33Ω 50Ω

The routing of the data lines to the LCD connector causes stubs on the data lines at the SDRAM (thestubs are even longer when a cable is plugged in). The 200Ω resistors are placed close to the SDRAM tocreate a high-impedance path for the signal to the stubs, improving the signal integrity whencommunicating with the SDRAM.

TIP:

• The series-termination is always placed near to the driving pin.• The 200Ω resistors are placed close to the intersection between the SDRAM routing and the routing

to the LCD connector.• All designs must be simulated using an IBIS file for the ATSAMV71Q21B and the target peripherals

to check whether the signals are within the limits of the devices.

Hardware Features


5.4 Camera ConnectorA 2 x 15, 100 mil pin-header camera connector is implemented to provide access to the SAM E70'sparallel Image Sensor Interface (ISI).

Table 5-4. Camera Interface Pin Description

Pin Number Name Function

1 VCC +3.3v

2 GND Ground

3 VCC +3.3v

4 GND Ground

5 Reset Reset

6 PWD ISI PWD

7 I2C SCK Clock line for I2C interface. Always implemented, bus type.

8 I2C SDA Data line for I2C interface. Always implemented, bus type.

9 GND Ground

10 MCK Master Clock

11 GND Ground

12 VSYNC Image Sensor Vertical Sync

13 GND Ground

14 HSYNC Image Sensor Horizontal Sync

15 GND Ground

16 Pixel Clock Image Sensor Pixel Clock

17 GND Ground

18 ISI D0 Image Sensor Data Bit 0











Hardware Features


...........continuedPin Number Name Function


30 GND Ground

5.5 USB ConnectivityUsers can connect to the PIC32 USB microcontroller using any one of the following modes:

• Host mode: If connecting the device to the Type-A/B Micro connector, an adapter is required. Usingthis method, a maximum of 400 mA can be supplied from the debug USB port to the host port. If afull 500 mA supply is needed, an external supply must be connected to the application board.

• Device mode: Connect the SAM E70 to the target USB Micro-A/B port using a USB cable. This isenough to power the board as a device. If programming and debugging is required, connect theDebug USB Micro-A/B port. The other end of the cable must have a Type-A connector, to connect itto a USB host.

• On-The-Go (OTG) mode: Connect the starter kit to the OTG device by using an OTG Micro-A/Bcable to the Micro-A/B port.

There is a 1x3, 100mil pin-header marked VBUS on the kit. The PB08 pin on the SAM E70 can beconnected to the LED2 or to the target USB VBUS DETECT signal by placing a jumper between pin 1and pin 2, or pin 2 and pin 3 on this pin-header. The USB VBUS DETECT is the target USB voltagedivided by 1.64. When connected to the PB08 pin the signal can be used to detect power on the targetUSB connector.

Table 5-5. USB Jumper Description

Pin number Name Description

1 LED2 LED2 active-low

2 PB08 Pin and Port to microcontroller

3 VBUS_ Detect VBUS Detect, used to detect when a device cable (micro-B) is pluggedinto the SAM E70

The SAM E70 Xplained Ultra has a Micro-USB connector to use with the SAM E70 USB module labeledas TARGET USB on the kit. In USB Host mode, the VBUS voltage is provided by the kit, and must beenabled by setting the VBUS Host Enable pin to low. When a USB OTG cable is plugged in, it willautomatically trigger the power supply.

Table 5-6. USB Interface Pin Description

Pin on SAM USB Function

PA08 VBUS Host Enable

HSDM USB -

HSDP USB +

Hardware Features


5.6 Chip Erase HeaderA 1x2 pin-header is connected to the SAM E70 chip erase pin, PB12, and 3V3 is marked ERASE. Thisheader can be used to chip erase the SAM E70 by placing the jumper on the header and toggle power tothe board. After the power is toggled, the jumper must be removed. Using the chip erase jumper may bethe only way to erase a chip with the security bit set, and applications that immediately set invalid clockoptions, or go into deep sleep without any wake-up sources enabled.

5.7 Audio ConnectivityThe SAM E70 provides an audio connection through the X32 interface to the two main audio modules inthe chip, such as the SSC and the I2S. On this board, the SSC interface is considered to the main audiointerface as shown in the image below.

There is a 32-pin interface to the board to support the audio codec or DACs and Bluetooth radios. Thisinterface has two audio supply interfaces, such as the SSC and the I2S. Addition to this other control linesand data interfaces are available.

Figure 5-4. SSC/I2S Block Diagram

The table below provides the X32 audio interface pin names and descriptions.

Hardware Features


Table 5-7. X32 Audio Interface Pin Description

Pin Number Name Description Interface

1 GND Ground Power

2 GND Ground Power

3 UART RX UART RX, receive to MCU from DB UART

4 UART CTS UART Clear to send UART

5 UART TX UART TX, transmit from MCU to DB UART

6 UART RTS UART Ready to send UART

7 I2C SCL Clock line for I2C interface I2C

8 STBY/RST Standby/Reset control GPIO

9 I2C SDA Data line for I2C interface I2C

10 Audio WS/LRCLK Audio Word Select/ Left Right Clock SSC

11 Audio In Audio into MCU, out from CODEC SSC

12 Audio CLK Audio clock SSC

13 Audio out Audio out of MCU, in to CODEC/DAC SSC

14 REFCLK/MCK Reference clock #1 REFCLK

15 GND Ground -

16 GND Ground -

17 NC Legacy hold over -

18 +3.3v VDD -

19 NC Legacy hold over -

20 +5.0v VDD -

21 (1) Audio WS/ Audio LRCLK Audio Word Select/ Left Right Clock I2S

22 (2) ADC/Card ID pin Analog-to-Digital Converter to read voltage on thedaughter card

ADC

23 (3) Audio CLK Audio Clock I2S

24 (4) NC - -

25 (5) Audio IN Audio into MCU, out from CODEC I2S

26 (6) NC -

27 (7) Audio OUT Audio out of MCU, in to CODEC/DAC I2S

28 (8) NC - -

29 (9) REFCLK2/MCK2 Reference clock #2 REFCLK

30 (10) NC - -

Hardware Features


...........continuedPin Number Name Description Interface

31 (11) GND Ground -

32 (12) GND Ground -

5.8 mikroBUS™ HeaderThe mikroBUS™ interface enables using the additional click boards. For additional information and toidentify the boards to be used with this development kit, visit the following web site: https://www.mikroe.com/.

Table 5-8. mikroBUS™ interface Pin Description

Pin Number Name Function

1 GND Ground

2 +5V +5.0V

3 SDA I2C SDA

4 SCL I2C SCL

5 TX UART TX

6 RX UART RX

7 INT Interrupt request line

8 PWM Pulse-Width Modulation

9 GND Ground

10 +3.3V Ground

11 MOSI Master Out Slave In line of serial peripheral interface

12 MISO Master In Slave Out line of serial peripheral interface

13 SCK Clock for serial peripheral interface

14 CS Chip Select for serial peripheral interface. (Active-low)

15 RST Reset

16 AN Analog-to-Digital Converter.

5.9 CANThe development kit provides access to the a CAN-FD interface that is post transceiver. The SAM E70Xplained Ultra has two MCAN modules that perform communications according to ISO11898-1 (RobertBosch GmbH CAN specification 2.0 part A and B). Bosch CAN FD specification V1.0. MCAN1 isconnected to an on-board ATA6561 CAN physical-layer transceiver. These connections are described inthe following table.

Hardware Features


https://www.mikroe.com/https://www.mikroe.com/

Table 5-9. Connections Between the ATSAME70Q21 and the ATA6561


1 CAN_H CAN High Signal

2 GND Ground

3 CAN_L CAN Low Signal

5.10 EthernetThe SAM E70 Xplained Ultra kit has a modular Ethernet PHY system that enables different PHYs to beplugged into the board. This interface is set up to use a Reduced Media-Independent Interface (RMII) anda SPI bus interface with GPIO. The figure below illustrates the Ethernet PHY header configuration.

Figure 5-5. Ethernet PHY Header Configuration

The table below provides the Ethernet PHY interface pinout descriptions.

Table 5-10. Ethernet Interface Pinout Description


1 GPIO General purpose I/O


3 RXD1 Receive Data 1

Hardware Features



4 RXD0 Receive Data 0

5 RXER Receive Error

6 RXDV Receive Data Valid

7 MDC -

8 MDIO -

9 IRQ Interrupt request line

10 RESET Reset control to the Ethernet PHY


12 EGND Shield Ground

13 (1) TXEN Transmit Enable

14 (2) TXD0 Transmit Data

15 (3) TDX1 Transmit Data

16 (4) MOSI Master Out Slave In line of serial peripheral interface

17 (5) MISO Master In Slave Out line of serial peripheral interface

18 (6) GND Ground

19 (7) NC No Connect

20 (8) REFCLK (in) Reference Clock input (50 MHz)

21 (9) GND GND

22 (10) +3.3v VDD +3.3V VDD

23 (11) CS Chip Select for serial peripheral interface

24 (12) SCK Clock for serial peripheral interface

25 -30 EGND Shield Ground

5.11 Debug USB ConnectivityThe starter kit includes an EDBG USB microcontroller that provides debugger connectivity over the USB.The EDBG MCU is hard-wired to the SAM E70 device to provide protocol translation.

An external programmer, such as MPLAB ICD4, may be used with the development kit through either theSWD interface or through the Coresite 20 interface.

5.12 SwitchesThe starter kit provides two push button switches: User switch and Reset switch. The push buttonswitches do not have any debounce circuitry, hence require the use of internal pull-up resistors. This

Hardware Features


enables the user to investigate the software debounce techniques. When Idle the switches are pulledhigh (+3.3V,) and when pressed the switches are grounded.

5.13 AT24MAC402 Serial EEPROMThe development board has an onboard 2-Kbit I2C serial EEPROM available for user applications. Thisserial EEPROM has an unique EUI-48, EUI-64, and 128-bit serial number. These unique numbers can beseen in the Microchip MPLAB Xplained window or Atmel Studio Xplained window after the kit is pluggedinto the PC. The figure below shows the SAM E70 Xplained Ultra window.

Figure 5-6. SAM E70 Xplained Ultra Window

Note: The above figure provides an example of the Xplained window with the MAC48 address.

Users can change the device address using the solder pads on the board, but all address bits have beendefaulted to one, refer to schematics for additional information. For additional usage information of on thispart, refer to the “AT24MAC402 and AT24MAC602 Data Sheet”, which is available for download from the

Hardware Features


following location: http://ww1.microchip.com/downloads/en/DeviceDoc/Atmel-8807-SEEPROM-AT24MAC402-602-Datasheet.pdf.

5.14 Power SourcesThe SAM E70 Xlplained Ultra evaluation kit has several power systems to it. This section covers thepower sub system in detail. Figure below shows a high-level block diagram of the power system.

Figure 5-7. Power Sources Block Diagram

The following options can be used to power the development kit:• Using the Micro-USB connector that is connected to the EDBG known as Debug USB.• Using the Micro-USB connector which is known as Target USB.• Using the Barrel Jack. This input can take a large range of power inputs from 5.5V to 19V.• Using the Arduino headers. This has several options one must be careful of when using this method.

Not all power rails are protected from the user error. VIN connects to the input side of the main bucksupply (step down), and it is similar to the barrel jack (2.1 mm).

• Using the 2 x 2 x 0.1 header, located on the side of the board, which has a 3.3v and 5.0v capableinputs.

The SAM E70 Xplained Ultra kit can be powered by several power sources as described in the followingtable.

Hardware Features


http://ww1.microchip.com/downloads/en/DeviceDoc/Atmel-8807-SEEPROM-AT24MAC402-602-Datasheet.pdfhttp://ww1.microchip.com/downloads/en/DeviceDoc/Atmel-8807-SEEPROM-AT24MAC402-602-Datasheet.pdf

Table 5-11. Power Sources for SAM E70 Xplained Ultra

Power Input Voltage Requirements Current Requirements ConnectorMarking

External Power 5V ±2% (±100 mV) for USBhost operation. 4.3V to 5.5V ifUSB host operation is notrequired.

Recommended minimum current is1A to be able to provide enoughcurrent for the connected USBdevices and the board.Recommended maximum current is2A due to the input protectionmaximum current specification.

5V0

EmbeddedDebugger USB

4.4V to 5.25V (according toUSB spec.)

500 mA (according to USB spec.) DEBUG USB

Target USB 4.4V to 5.25V (according toUSB spec.)

500 mA (according to USB spec.) TARGET USB

External JackInput

5.5v to 19V 1A minimum, 2.5A is recommended.6A maximum.

VIN

The development kit will detech and choose the available power sources based on the following options:

• External jack input• External power• Embedded debugger USB• Target USB

Hardware Features


6. Hardware

6.1 SAM E70 Main Board Schematics

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Hardware


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VDDIO J5

GNDIO E2GNDIO H3

GNDIO F5

VDDIO B5

GNDIO E6

GNDIO C3

GNDCORE F10VDDCORE E10

GNDPLL B10VDDIN D10

VDDANA J6

VDDIN D9

GNDANA H8

VDDIO E5

PA01

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10

PA02

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3V3

100kR31

9

1

23

DM

N20

75U

Q30

1M

OSF

ET_N

_GSD

3

1

2

IRLM

L520

3PBF

Q30

0M

OSF

ET_P

_GSD

100k

R31

7

LED

1LE

D 2

Inpu

t filt

er o

n U

SB

pow

er in

put.

Con

nect

the

test

poi

nts d

urin

g st

artu

p of

th

e ED

BG

to fo

rce

it in

to b

ootlo

ader

m

ode.

The

test

poi

nts s

houl

d be

cov

ered

with

so

lder

so th

at it

is e

asie

r to

get a

goo

d co

ntac

t.

Prog

ram

min

g in

terf

ace

of th

e em

bedd

ed d

ebug

ger.

The

test

po

ints

will

be

conn

ecte

d by

nee

dles

in

the

test

fixt

ure

for p

rogr

amm

ing.

G

ND

test

poi

nt is

TP4

00.

Hardware


PC31

PC00

PC01

PC02

PC03

PC04

PC05

PC06

PC07

PC08

PC09

PC10

PC11

PC12

PC13

PC14

PC15

PC16

PC17

PC18

PC19

PC20

PC21

PC22

PC23

PC24

PC25

PC26

PC27

PC28

PC29

PC30

PD02

PD03

PD04

PD05

PD06

PD07

PD08

PD09

PD10

PD11

PD12

PD13

PD14

PD15

PD16

PD17

PD18

PD19

PD20

PD21

PD22

PD23

PD24

PD25

PD26

PD27

PD28

PD29

PD30

PD31

PE00

PE01

PE02

PE03

PE04

PE05

PA00

PA01

PA02

PA03

PA04

PA05

PA06

XIN

_32

PA08

PA09

PA10

PA11

PA12

PA13

PA14

PA15

PA16

PA17

PA18

PA19

PA20

PA21

PA22

PA23

PA24

PA25

PA26

PA27

PA28

PA29

PA30

PA31

PB00

PB01

PB02

PB03

PB04

PB05

PB06

PB07

XIN

_12

PB12

PB13

GN

D

VD

DO

UT

100n

C41

3

GN

DG

ND+

2.2u

F

C41

7

100n

C41

5

100n

C41

2

JS40

1GN

D

GN

DV

DD

CO

RE

BLM18PG471SN1

L404

BLM18PG471SN1

L403

VDDPLL

VDDUTMIC

100n

C40

7

100n

C40

8GN

D

GN

DBLM18PG471SN1L402

BLM18PG471SN1

L401

VC

C_T

AR

GET

_P3V

3

GN

D

10p

C40

4

5.62kR406

GN

D

BLM

18PG

471S

N1

L400

100n

C40

1

GN

D

VDDPLLUSB

VDDUTMII

TP40

2TP

401

TST

JTA

GSE

L

TAR

GET

_RES

ET

PD00

PD01

DIG

DIG

22

DIG

23

DIG

24

DIG

25

DIG

26

DIG

27

DIG

28

DIG

29

DIG

30

DIG

31

DIG

32

DIG

33

DIG

34

DIG

35

DIG

36

DIG

37

DIG

38

DIG

39

DIG

40

DIG

41

DIG

42

DIG

43

DIG

44

DIG

45

DIG

46

DIG

47

DIG

48

DIG

49

DIG

50

DIG

51

DIG

52

DIG

53

DIGSP

ISP

I_M

ISO

SPI_

MO

SISP

I_SC

KR

ESET

SPI

TAR

GET

_RES

ET

0RR

404

SPI0

_SPC

KSP

I0_M

OSI

SPI0

_MIS

O

PD22

PD20

PD21

PA18

PCK

2

PA21

RX

D1

PB00

TFPD

19C

TS2

39R

39R

R40

1

DG

I_G

PIO

DG

I_SP

I

EDB

G_U

AR

T

PA23

PA02

GPI

O /

BTN

0G

PIO

/ LE

D0

GPI

O /

EXT2

PIN

9

PD21

PD20

PD22

SPI0

_MO

SISP

I0_M

ISO

SPI0

_SPC

KPD

12SP

I0_N

PCS2

PA09

PA21

RX

D1

PD28

GPI

O /

EXT1

PIN

9

PB04

TXD

1

SWC

LKSW

DIO

TAR

GET

_CH

IP_R

ESET

TRA

CES

WO

SWD

SWD

PB12

ERA

SEPB

05TR

AC

ESW

O

PB06

SWD

IOPB

07SW

CLK

MIS

OM

OSI

SCKSS

DGI_SPI DG

I_G

PIO

0D

GI_

GPI

O1

DG

I_G

PIO

2D

GI_

GPI

O3

DGI_GPIO

RX

DTX

DED

BG

_UA

RT I

O0

IO1

IO2

IO3

CLK C

S

QSPI

QSP

I

PA13

PA12

PA17

PD31

PA14

PA11

PWM

C1_

PWM

L1PW

MC

1_PW

MH

0PW

MC

0_PW

MH

3IS

I_D

11

WK

UP7

/PIO

DC

5(3)

GPI

O_I

NT

AD

CL

AD

0A

D1

AD

2A

D3

AD

4A

D5

AD

6A

D7

ADCL

AD

CH

AD

8A

D9

AD

10A

D11

DA

C0

DA

C1

CA

NR

XC

AN

TX

ADCH

CO

M

DIG

14D

IG15

DIG

16D

IG17

DIG

18D

IG19

DIG

20D

IG21

COM

AD

VR

EF

IOL

DIG

0D

IG1

DIG

2

DIG

3D

IG4

DIG

5D

IG6

DIG

7

IOL

0RR

414

0RR

415

PA04

PA03

TWD

0TW

CK

0

PB03

PB02

CA

NR

X0

CA

NTX

0

PB13

PD00

DA

C0

DA

C1

SPI0

_SPC

K

SPI0

_MO

SI

SPI0

_MIS

OPD

22PD

20

PD21

PD25

SPI0

_NPC

S1

PD27

SPI0

_NPC

S3

PD26

TD

PD24

RF

PA10

RD

PA22

RK

0RR

424

0RDNP

R42

00R

DNP

R41

90R

DNP

R41

8

AFE

0_A

D8

PC13

AFE

1_A

D1

PA05

PA06

PWM

C1_

L3G

PIO

PD11

PC19

PA02

PWM

C0_

H0

PWM

C0_

H2

PWM

C0_

H1

LED

_TIO

B7

PD16

PD15

TXD

2R

XD

2PD

19PD

18U

TXD

4U

RX

D4

PD27

PD28

TWD

2TW

CK

2

PB01

TXD

0PB

00R

XD

0

PC30

PA17

PC12

PC31

AFE

1_A

D5

AFE

1_A

D6

AFE

0_A

D3

AFE

0_A

D3

0RR

421

0RR

422

0RR

423

0RR

417

39R

39R

R41

3

0RR

416

PA19

PD30

AFE

0_A

D0

PC31

AFE

1_A

D06

PD28

UR

XD

3PD

30U

TXD

3

PC09

I2C

PA03

PA04

TWC

K0

TWD

0

PD10

PWM

C0_

L2

IOH

DIG

9D

IG10

DIG

11D

IG12

DIG

13

DIG

8

AR

EF

I2C

_SC

LI2

C_S

DA

IOH

PD11

GTS

UC

OM

P

PA17

PWM

C0_

PWM

H3

0RDNP

R40

70R

R40

8

0RDNP

R40

90R

R41

0

SDA

SCL

I2C

1k1kR41

21k1k

R41

1

PIN

1_A

DC

(+)

PIN

2_R

STPI

N3_

CS

PIN

4_SC

KPI

N5_

MIS

OPI

N6_

MO

SIPI

N11

_SD

API

N12

_SC

LPI

N13

_TX

PIN

14_R

XPI

N15

_IR

QPI

N16

_PW

M(+

)

MikroBUS

Mik

roB

US

PC31

AFE

1_A

D06

PA00

PWM

C0_

H0

PD28

WK

UP5

PB01

TXD

0PB

00R

XD

00R

R42

70R

R42

8

PA03

TWD

0PA

04TW

CK

0

PD21

SPI0

_MO

SIPD

20SP

I0_M

ISO

PD22

SPI0

_SPC

K39

R39

RR

426

PA05

GPI

OPD

11VC

C_T

AR

GET

_P3V

3

D0

D1

D2

D3

D4

D5

D6

D7

D8

D9

D10

D11

D12

D13

D14

D15

EBI

EBI

SDR

AM

PC00

PC01

PC02

PC03

PC04

PC05

PC06

PC07

PE00

PE01

PE02

PE03

PE04

PE05

PA15

PA16

D0

D1

D2

D3

D4

D5

D6

D7

D8

D9

D10

D11

D12

D13

D14

D15

A2

A3

A4

A5

A6

A7

A8

A9

A10

A11

SDA

10B

A0

CA

SB

SDC

KE

SDC

K

SDC

S

A0/

NB

S0

RA

SB

NW

R1/

NB

S1

SDW

E

PC20

PC21

PC22

PC23

PC24

PC25

PC26

PC27

PC28

PC29

PD13

PA20

PD17

PD14

PD23

PC15

PC18

PD16

PD15

PD29

MC

CD

AM

CC

KM

CD

A3

MC

DA

2M

CD

A1

MC

DA

0

DET

ECT

SD_CARD

SD_C

AR

D

PC16

GPI

O

MC

DA

0M

CD

A1

MC

DA

2M

CD

A3

MC

CK

MC

CD

A

PA30

PA31

PA26

PA27

PA25

PA28

AU

DIO

PIN

9_I2

C_S

DA

PIN

7_I2

C_S

CL

PIN

14_P

CK

2

PIN

5_TX

D0

PIN

4_C

TS0

PIN

6_R

TS0

PIN

11_R

DPI

N13

_TD

PIN

8_IR

QR

EFC

LK

PIN

3_R

XD

0

PIN

10_R

FPI

N12

_TK

RK

PIN

10_T

F

PIN

2_A

DC

(+)

PIN

9_A

FEO

_AD

8PI

N3_

BA

O

AUDIO

PA03

PA04

0RR

435

0RR

437

0RR

441

0RR

438

0RR

439

0RR

436

0RR

434

TWC

K0

TWD

0

0RR

440

PB00

RX

D0

PB01

TXD

0PB

02C

TS0

PB03

RTS

0

PA18

PCK

2

PD21

TIO

A11

PD11

GPI

O

0RR

429

0RR

430

0RR

431

0RR

432

PD24

RF

PB01

TKPA

22R

KPB

00TF

PA10

RD

PD26

TD

0RR

442

0RR

433

PD30

AFE

0_A

D0

CA

SR

AS

CS

CLK

CK

E

WE

LDQ

MU

DQ

M

A0

A1

A2

A3

A4

A5

A6

A7

A8

A9

A10

A11

SDRAM

0RR

443

PA19

PA20

TIO

A11

BA

O

CA

MER

A

MC

KV

SYN

CH

SYN

CPC

KD

0D

1D

2D

3D

4D

5D

6D

7D

8D

9D

10D

11

I2C

_SC

KI2

C_S

DA

RST

PWD

CAMERA

PD21

PB03

PA09

PA05

PD11

PD12

PA27

PD27

PD28

PD30

PD31

PD24

PA06

PA24

PC19

PA13

PD25

PA04

TWC

K0

ISI_

PWD

GPI

OPC

K0

ISI_

PCK

ISI_

HSY

NC

ISI_

VSY

NC

ISI_

D0

ISI_

D1

ISI_

D2

ISI_

D3

ISI_

D4

ISI_

D5

ISI_

D6

ISI_

D7

ISI_

D8

ISI_

D9

ISI_

D10

ISI_

D11

39R

39R

R48

4

PA03

TWD

0

PD22

PA02

WK

UP2

PD28

WK

UP5

PA06

GPI

OIR

Q4

(R T

ouch

)

IRQ

2 (Q

Tou

ch)

IRQ

3 (D

ispl

ay C

ntrl)

h)0R

R48

5

PD28

WK

UP5

PA03

PA04

PD20

PD21

PD25

PD22

TWC

K0

TWD

0

SPI0

SPC

KSP

I0 M

OSI

SPI0

MIS

OSP

I0 N

PCS1

LCD

PWM

USA

RT_

RX

USA

RT_

TXU

SAR

T_R

TSU

SAR

T_C

TSLE

D T

IOB

7

AD

C0

AD

C1

AD

C2

AD

C3

AD

C4

AD

C5

AD

C6

AD

C7

LCD

DIS

PST

BY

/RST

AFE

0 A

D0

RX

D1

AFE

1 A

D06

AFE

1 A

D1

PB01

TX

D0

GPI

O4

ON

E W

IRE

INTE

RFA

CE

ID3

/ ID

4R

ESET

2GPI

O1

PWM

C0

H2 GPI

O2

GPI

O3

GPI

O5

PC09

PC13

PD30

PA21

PC31

PC13

PD19

PD11

TRA

CE

SWD

IOSW

CLK

TRA

CEC

LKTR

AC

ED0

TRA

CED

1TR

AC

ED2

TRA

CED

3

nRES

ET

SWO

TRACE

PB06

PB07

TAR

GET

_RES

ETPD

08PD

04PD

05PD

06PD

07

TRA

CEC

LKTR

AC

ED0

TRA

CED

1TR

AC

ED2

TRA

CED

3

PB05

TRA

CES

WO

SWD

IOSW

CLK

CA

NTX

CA

NR

X

CAN

CA

NPC

14PC

12C

AN

TX1

CA

NR

X1

EXT2

EXT1

PIN

10_S

PI_S

S_B

/GPI

OPI

N11

_TW

I_SD

API

N12

_TW

I_SC

LPI

N13

_UA

RT_

RX

PIN

14_U

AR

T_TX

PIN

15_S

PI_S

S_A

PIN

16_S

PI_M

OSI

PIN

17_S

PI_M

ISO

PIN

18_S

PI_S

CK

PIN

3_A

DC

(+)

PIN

4_A

DC

(-)

PIN

5_G

PIO

PIN

6_G

PIO

PIN

7_PW

M(+

)PI

N8_

PWM

(-)

PIN

9_IR

Q/G

PIO

EXT1

PIN

10_S

PI_S

S_B

/GPI

OPI

N11

_TW

I_SD

API

N12

_TW

I_SC

LPI

N13

_UA

RT_

RX

PIN

14_U

AR

T_TX

PIN

15_S

PI_S

S_A

PIN

16_S

PI_M

OSI

PIN

17_S

PI_M

ISO

PIN

18_S

PI_S

CK

PIN

3_A

DC

(+)

PIN

4_A

DC

(-)

PIN

5_G

PIO

PIN

6_G

PIO

PIN

7_PW

M(+

)PI

N8_

PWM

(-)

PIN

9_IR

Q/G

PIO

EXT2

0RR

486

0RR

487

PB03

PB02

PC30

PA00

PC17

PA04

PA03

PB00

PB01

PD25

PD21

PD20

PD22

RTS

0C

TS0

TIO

B5

PWM

C0_

H0

GPI

OTW

D0

TWC

K0

RX

D0

TXD

0SP

I0_N

PCS1

SPI0

_MO

SISP

I0_M

ISO

SPI0

_SPC

K

PC13

PA06

PD11

PC19

PD26

PA02

PA24

PD27

PD21

PD20

PD22

SPI0

_MO

SISP

I0_M

ISO

SPI0

_SPC

K

AFE

1_A

D1

GPI

OG

PIO

PWM

C0_

H2

PWM

C0_

L2W

KU

P2G

PIO

SPI0

_NPC

S3

0RR

489

39R

39R

R49

0

39R

39R

R48

8

PA04

PA03

TWD

0TW

CK

0

AFE

0_A

D8

PA19

PA21

RX

D1

PC31

AFE

1_A

D06

PD30

AFE

0_A

D0

PD28

WK

UP5

PB04

TXD

1

TXD

0TX

D1

TXEN

TXC

K

RX

D0

RX

D1

MD

CM

DIO

RX

ER

RX

DV

RES

ETSI

GD

ETM

OSI

MIS

OSC

LKC

SG

PIO

0G

PIO

1G

PIO

2

ETHERNET

ETH

ERN

ETPA

29G

PIO

GPI

O

PD00

PD01

PD02

PD03

PD04

PD05

PD06

PD07

PD08

PD09

PC10

GTX

CK

GTX

ENG

TX0

GTX

1G

RX

DV

GR

X0

GR

X1

GR

XER

GM

DC

GM

DIO

GPI

O

PA19

0RR

503

0RR

504

0RR

505

0RR

506

0RDNP

R50

7

0RR

502

0RR

501

0RR

500

0RR

499

0RR

498

39R

39R

R49

739

R39

RR

496

39R

39R

R49

439

R39

RR

493

0RR

492

39R

39R

R49

1

0RR

495

PD21

SPI0

_MO

SIPD

20SP

I0_M

ISO

PD22

SPI0

_SPC

KPC

19IS

I_PW

D

GN

D39RR405 G

ND39R

R405

TP40

0

2 1

EL17-21UYC/A3

D400

VC

C_P

3V3

330RR400

USE

R B

UTT

ON

USE

R L

ED

PA05USER_LED0

PA11 USER_BUTTON0

GN

D

VC

C_P

3V3

GN

D

GN

D

VC

C_P

3V3

_

GN

D

RES

ET b

utto

n w

ith c

urre

nt li

mit

and

noise

filte

r

0RR

515

TAR

GET

_RES

ET

2.2kR512

100p

FC

421

330RR513

330R

R51

0

PA05

USE

R_L

ED0

USE

R_B

UTT

ON

0PA

11

AD

VR

EF

22R

22R

R44

822

R22

RR

449

22R

22R

R45

022

R22

RR

451

22R

22R

R45

222

R22

RR

453

22R

22R

R45

422

R22

RR

455

22R

22R

R45

622

R22

RR

457

22R

22R

R45

822

R22

RR

459

22R

22R

R46

022

R22

RR

461

22R

22R

R46

222

R22

RR

463

22R

22R

R46

422

R22

RR

465

22R

22R

R46

622

R22

RR

467

22R

22R

R46

822

R22

RR

469

22R

22R

R47

022

R22

RR

471

22R

22R

R47

222

R22

RR

473

22R

22R

R47

422

R22

RR

475

22R

22R

R47

622

R22

RR

477

22R

22R

R47

822

R22

RR

479

22R

22R

R48

022

R22

RR

481

22R

22R

R48

222

R22

RR

483

0RR

425

0RR516

TARGET_RESET_SENSE

YELLOW

0RR

508

0RR

509

100n

C41

6

100n

C41

4

100n

C41

1

100n

C41

0

100n

C40

6

100n

C40

5

100n

C40

3

100n

C40

2

100n

C40

0

GN

DG

ND

VD

DC

OR

EV

DD

IO

100n

C40

6

100n

C40

5

100n

C40

3

100n

C40

2

100n

C40

0

GN

D

VD

DIO

VD

DIO

De-

Cou

plin

gcl

ose

to p

ins 3

0, 4

3, 7

2, 8

0 an

d 96

100n

C41

6

100n

C41

4

100n

C41

1

100n

C41

0

GN

D

VD

DC

OR

EV

DD

CO

RE

De-

Cou

plin

gcl

ose

to p

ins 2

9, 3

3, 5

0, 8

1 an

d 10

7

100n

C41

8

PB12

ERA

SE

VC

C_T

AR

GET

_P3V

3

JS40

0

TARGET_RESET

EDBG_TARGET_RESET

10uF

/10VC40

9

TAR

GET

_USB

_NTA

RG

ET_U

SB_P

SDA

SCL

DG

I_I2

CD

GI_

I2C

PA03

PA04

TWC

K0

TWD

0 GPI

O

SWC

LKSW

DIO

TAR

GET

_CH

IP_R

ESET

TRA

CES

WO

EDB

G_S

WD

EDB

G_S

WD

PB12

ERA

SEPB

05TR

AC

ESW

O

PB06

SWD

IOPB

07SW

CLK

PD28

WK

UP5

PA02

WK

UP2

PWM

C1_

PWM

L3PA

05PA

29TC

LK2

PB03

RTS

0PB

13SC

K0

PA13

PWM

C1_

PWM

L1

PA25

CTS

1

PA30

PWM

C1_

PWM

EXTR

G0

PB02

CTS

0

PC14

CA

NTX

1

PC12

CA

NR

X1

PA18

PWM

C1_

PWM

EXTR

G1

0RR

403

PB01

TKPD

17SC

K2

PA01

WK

UP1

(1)

PA26

PWM

C1_

PWM

FI1

PD18

RTS

2

PA12

PWM

C1_

PWM

H0

PA31

PWM

C1_

PWM

H2

PB04

TXD

1PA

24R

TS1

PA23

PWM

C0_

PWM

H0

PA28

PWM

C1_

PWM

FI2

JS40

2

GPI

O

PC11

VD

DIO

PC11

ATS

AM

E70Q

21B

-AN

TA

TSA

ME7

0Q21

B-A

NT

PA00

102

PA01

99PA

0293

PA03

91PA

0477

PA05

73PA

0611

4PA

0735

PA08

36PA

0975

PA10

66PA

1164

PA12

68PA

1342

PA14

51PA

1549

PA16

45PA

1725

PA18

24PA

1923

PA20

22PA

2132

PA22

37PA

2346

PA24

56PA

2559

PA26

62PA

2770

PA28

112

PA29

129

PA30

116

PA31

118

PC00

11PC

0138

PC02

39PC

0340

PC04

41PC

0558

PC06

54PC

0748

PC08

82PC

0986

PC10

90PC

1194

PC12

17PC

1319

PC14

97PC

1518

PC16

100

PC17

103

PC18

111

PC19

117

PC20

120

PC21

122

PC22

124

PC23

127

PC24

130

PC25

133

PC26

13PC

2712

PC28

76PC

2916

PC30

15PC

3114

PD00

1PD

0113

2PD

0213

1PD

0312

8PD

0412

6PD

0512

5PD

0612

1PD

0711

9PD

0811

3PD

0911

0PD

1010

1PD

1198

PD12

92PD

1388

PD14

84PD

1510

6PD

1678

PD17

74PD

1869

PD19

67PD

2065

PD21

63PD

2260

PD23

57PD

2455

PD25

52PD

2653

PD27

47PD

2871

PD29

108

PD30

34PD

312

PB00

21PB

0120

PB02

26PB

0331

PB04

105

PB05

109

PB06

79PB

0789

PB08

141

PB09

142

PB12

87PB

1314

4

HSD

P13

7H

SDM

136

NR

ST83

TST

85JT

AG

SEL

104

VR

EFP

9V

REF

N8

VB

G14

0

PE00

4PE

016

PE02

7PE

0310

PE04

27PE

0528

GN

D_0

144

GN

D_0

261

GN

D_0

395

GN

D_0

411

5G

ND

_05

135

GN

D_0

613

8

VDDIO_01 30VDDIO_02 43VDDIO_03 72VDDIO_04 80VDDIO_05 96

VDDIN 5

VDDUTMII 134

VDDPLLUSB 143

VDDPLL 123

VDDUTMIC 139

VDDOUT 3

VDDCORE_01 29VDDCORE_02 33VDDCORE_03 50VDDCORE_04 81VDDCORE_05 107

U40

0

TP40

3

1 2J40

0

HEA

DER

1x2

12

J401

HEA

DER

1x2

12

Pin

head

er 1

x2 R

AJ4

02

134 2

TS604VM1-035CR

SW400

134 2

TS604VM1-035CR

SW401

GFX

-CTR

L

PIN

6_IR

Q2

PIN

8_IR

Q3

PIN

10_I

RQ

4

PIN

4_IR

Q1

PIN

14_D

0PI

N16

_D1

PIN

18_D

2PI

N20

_D3

PIN

22_D

4PI

N24

_D5

PIN

26_D

6PI

N28

_D7

PIN

30_D

8PI

N32

_D9

PIN

34_D

10PI

N36

_D11

PIN

38_D

12PI

N40

_D13

PIN

42_D

14PI

N44

_D15

PIN

60_D

23PI

N58

_D22

PIN

56_D

21PI

N54

_D20

PIN

52_D

19

PIN

46_D

16PI

N48

_D17

PIN

50_D

18

PIN

62_D

24PI

N64

_D25

GFX-CTRL

PC30

PC11

PD19

nCS

NW

R

DC

XnR

D

PC08

PIN

11_L

CD

VSY

NC

PIN

13_L

CD

PCLK

PIN

9_LC

DH

SYN

CPI

N7_

LCD

EN

GFX-SYNC

GFX

-SY

NC

PA08

PB08

VB

US

HO

ST E

NV

BU

S_H

OST

_EN

DET

ECT/

LED

330R

R44

4

10n

C42

2

LED3

12 M

Hz

Osc

illat

or

XIN

_12

0RR51

1

STB

1G

ND

2O

UT

3

VD

D4

DSC

6003

CI2

A-0

12.0

000

Y40

1

GN

D

100n

C41

9 GN

D

VC

C_T

AR

GET

_P3V

3

XIN

_12

0RR51

1

123 4

STB

GN

DO

UT

VD

D

DSC

6003

CI2

A-0

12.0

000

Y40

1

GN

D

100n

C41

9 GN

D

VC

C_T

AR

GET

_P3V

3

32.7

68 k

Hz

Osc

illat

or

XIN

_32

0RR51

4O

UT

1

GN

D2

NC

3V

DD

4

DSC

6083

CE2

A-0

32K

768

Y40

0

100nC42

0

GN

DG

ND

XIN

_32

0RR51

41 2

34O

UT

GN

DN

C

VD

D

DSC

6083

CE2

A-0

32K

768

Y40

0

100nC42

0

GN

DG

ND

VC

C_T

AR

GET

_P3V

3

Documents

SAM E70 Xplained Ultra Evaluation User's Guideww1.microchip.com/downloads/en/DeviceDoc/SAME70_Xplained_Ultra... · The Atmel SAM E70 Xplained Ultra Dvelopment Kit is a hardware platform