Semiconductor Training The Industry Insert Conax Semi Brochure Semiconductor Training The Market Semiconductor Training The Process & Equipment

Semiconductor Training The

IndustryInsert Conax Semi Brochure

Semiconductor Training

The Market


The Process & Equipment

Semiconductor Training The Industry

Semi is a Trade Organization that manufacturers of semiconductor manufacturing equipment belong

to, companies such as Applied Materials, ASM, AMSL, Veeco

(formerly Emcore), Moore Technologies, Novellus, Lam

Research, etc.

Conax has joined this organization as of February 2004.

SIA is a Trade Organization that manufacturers of semiconductors (chips) belong to, companies such

as Intel, Texas Instruments, Motorola, AMD, Analog Devices,

National Semiconductor, etc.


•Semiconductor Industry Association (SIA)•European Electronic Component Association (EECA)•Japan Electronics & Information Technology Industries Association (JEITA)•Korean Semiconductor Industry Association (KSIA)•Taiwan Semiconductor Industry Association (TSIA)

The International Technology Roadmap for Semiconductors (ITRS) is an assessment of the

semiconductor technology requirements. The ITRS

identifies the technological challenges and needs facing the semiconductor industry over the next 15 years. It is sponsored by:


Glossary

•Fab (Wafer Fabrication Facility…manufacturer may have multiple Fabs at a given location)

•Susceptor (device that holds a wafer)

•Photolithography (standard method of transferring a circuit pattern to a wafer)

•Reticle (the “negative” used to project a circuit pattern over a portion of a wafer)

•Front End (the making of the silicon portion of a chip, or die)•Front End Of Line or FEOL (the building of the device into and on the silicon wafer)•Back End Of Line or BEOL (the laying down of the metal interconnects on the wafer)

•Back End (the packaging of the die into a plastic or ceramic package)

•Cluster vs. Batch (Processing wafers individually or in groups)

•HAST (Highly Accelerated Stress Test to check life of an IC and/or test new robustness of designs)

•LSI (Large Scale Integration, chip with 1,000 – 100,000 components)

•VLSI (Very Large Scale Integration, chip with 100,000 – 1,000,000 components)

•ULSI (Ultra Large Scale Integration, chip with over 1,000,000 components)

•CD (Critical Dimension)

•CVD (Chemical Vapor Deposition and its many variations)


Glossary

•Units of Measure… 1 millimeter = 1,000 micrometers or 1,000 micron 1 micron = 1,000 nanometers = 10,000 angstrom 1 angstrom = one-billionth of a meter•Nanotechnology (the use of geometries smaller than 100 nm)

•Node (the geometry size being used, typically the half-pitch of DRAM geometries, reached 90 nm in 2004; a node is a 30% reduction in chip geometry, typically happens every 2 – 3 years)

•MOS (Metal Oxide Semiconductor)

•pMOS (MOS with positive wells in a negative wafer)

•nMOS (MOS with negative wells in a positive wafer)

•CMOS (Complementary MOS, combining both pMOS and nMOS)

•Die or Dice (one integrated circuit cut from a wafer)


Moore’s Law:Every 2 years, Chip

Memory will quadruple.This general law has been applied to all major chip

measures such as component

density/shrinkage of geometry, speed, power

consumption, etc.


Moore’s Law:Every 2 years, Chip

Memory will quadruple.This general law has been applied to all major chip

measures such as component

density/shrinkage of geometry, speed, power

consumption, etc.

Semiconductor Training The Process & Equipment



“Pulling a Crystal”Silicon ingots are

grown to the desired diameter. Silicon is naturally neutral (no

charge). During manufacture, they are chemically doped as “p-type” (positive) or “n-type” (negative).


Epitaxial Reactors are used to grow

additional layers of silicon on the surface of a newly produced

wafer. This is done to make a wafer with

slight surface defects usable, and to

improve diode and transistor

performance as geometries decrease. Both of these factors

make epi more important as the

industry migrates towards larger

diameter wafers.


Moore Technologies’ (formerly Applied Materials) Epitaxial Barrel Reactor

Original 3-Zone Reactor New 8-Zone Reactor

Susceptor to hold Wafers


Moore Technologies’ (formerly Applied Materials) Epitaxial Barrel Reactor

Cut-away view showing perimeter heating lamps (with

susceptor removed).

Note the center IR temperature sensor with 3

“eyes”. This sensor measures temperature during

process runs. During calibration, the Conax Triple-

point is inserted into a calibration susceptor to

check the IR unit’s readings.


CVD can be used to deposit layers

of insulation (dielectric),

semiconductor, or conductors.

There are many variations of CVD.

•CVD•APCVD•RPCVD•LPCVD•PECVD•HDPCVD•UHV/CVD•MOCVD


Ion Implantation is the process used to create

localized areas of relative positive or negative

charge. The ions are shielded from the silicon by either an oxide or by a

resist mask.


Stripping, or ashing is done to remove

the resist following its use. The ions used are reactive only to the resist

and nothing to the wafer, oxide or other coatings.


Following ion implantation, the

crystal structure of the wafer is

damaged. Some sort of heating process is typically done after

each implantation to anneal, or reorder the wafer crystal

structure. RTP, or Rapid Thermal

Processing is the most common

method to quickly anneal the wafer without causing

other high temperature related

damage. RTP: Cluster Furnace: Batch



Metal interconnects on the wafer surface are

commonly made of aluminum, which does not deposit

well with CVD. PVD is used for coating

with aluminum, also called sputtering.

CMP (Chemical Mechanical

Polishing, or Planarization) uses both chemicals and abrasives to smooth

the surface of a wafer are points

along its processing.

As geometries continue to shrink,

clear focus is needed photolithography to

attain reliable circuits.

CMP also important in Damascene

Process.


Semiconductor Training The Market

The top OEMs(Original Equipment Manufacturers)


The top End Users(chip manufacturers)





Web site: www.conaxbuffalo.com

Semi Sub-site


Temperature Sensors

Semi Sub-site

Compression Seal Fittings


Semi Temperature Sensor Sub-site7 Sample Applications

See Individual links for

details on each

application.


OEM: Applied Materials/Moore Technologies.

Use: Calibrations for IR process control sensors.

Price: $3,100 - $6,100

Notes: We custom make variations for customers with unique needs. Currently in talks to make a 7-Point variation for Wacker Siltronic and Sumco.


OEM: Applied Materials/Moore Technologies.

Use: Calibrations for IR process control sensors.

Price: $400

Notes: We custom make variations for customers with unique needs. We have made a dual version for Wacker Siltronic.


OEM: ASM Epsilon Reactor Series.

Use: Process control temperature sensors for Epitaxial Wafer Coating.

Price: $1,300 per set, per reactor.

Notes: Typical life is 1 month for a set of sensors.


OEM: Veeco (Emcore) TurboDisc.

Use: Process control molybdenum sheathed platinum T/C to control MOCVD process.

Price: $400 - $600 per sensor.

Notes: Price includes junction location x-ray and leak test report.


OEM: Axcelis

Use: Ion implantation process equipment.

Price: $240 per sensor.

Notes: None


OEM: APT

Use: Process control 2-wire RTD for wafer resist/bake/wash.

Price: $25 per sensor x 49 sensors per plate = $1,225.

Notes: Typical life is 1 month for a set of sensors.


Semi Compression Seal Fitting Sub-site5 Seal Applications

See Individual links for

details on each

application.


OEM: Espec/Despatch for Intel

Use: Signal and T/C feed throughs for HAST (Highly Accelerated Stress Test) Chambers.

Price: $2,500 - $5,000 per assembly, $45,000 per chamber.

Notes: None


OEM: Zygo Corporation

Use: Fiber Optic Feedthroughs for Laser Interferometry Wafer Stage Movement measurements.

Price: $2,500 - $6,000 per assembly, $7,500 to 15,000 per photolithography tool.

Notes: Need for this type measurement is increasing due to shrinking chip geometries and new photolithography techniques that require the wafer to be exposed under vacuum.


OEM Subsystems: In addition to the major tool makers like AMAT (Applied Materials), TEL (Tokyo Electron), etc., there are a multitude of subcomponent makers that supply the top-level tool makers. Some are large (like Zygo), and some are small (like Conax). Look into other companies that are involved as subsystem suppliers in the semiconductor industry.


Selling to the Semiconductor Market

•OEMs: There are equipment manufacturers that make finished process equipment, and/or subsystems to finished process equipment located throughout the world.

•End Users: Just like with power plants, knowing the manufacturer of particular pieces of equipment will be helpful. For example, if someone is using a Applied Materials/Moore Technologies Epitaxial Barrel Reactor, we are the OEM of the calibration sensor. Just like with GE, we can provide the OEM part, or a modified/improved version if the customer is interested.

•End Users: Just like with power plants, if we’ve never made a sensor for a particular machine before, that does not mean that we can’t. Get a drawing, sample of a failed or new probe.

Semiconductor Training The

IndustryInsert Conax Semi Brochure


The Market


The Process & Equipment

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Semiconductor Training The Industry Insert Conax Semi Brochure Semiconductor Training The Market Semiconductor Training The Process & Equipment