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PRODUCT DATASHEET
M90 20W High Power LED
Table of Contents
Features………………………………………………………………………………………………………………………………………………. 1
Applications…………………………………………………………………………………………………………………………………………. 1
Absolute Maximum Ratings..……………………………………………………………………………………………………………….. 1
Flux Characteristics………………………………………………………………………………………………………………………………. 2
Typical Electro‐Optical Characteristics Curves..……………………………………………………………………………………
Thermal Design Curve…………………………………………………………………………………………………………………………..
Chromaticity Coordinate Groups…………………………………………………………………………………………………………..
3
4
5
Mechanical Dimensions………….…………………………………………………………………………………………………………… 7
Shipping Package Information.……………………………………………………………………………………………………………. 8
Reflow Soldering Conditions…….…………………………………………………………..…………………………………………….. 10
LED Handling Information…………..…………………………………………………………………………………………………………
Lens Handling………………………………………………………………………………………………………………………………………..
Lens Cleaning………………………………………………………………………………………………………………………………………..
11
11
11
Carrier Tape Handling…....…………………………………………………………………………………………………………………….. 12
RoHS Compliant
M90‐20W PRODUCT DATASHEET
© 2005‐2013 SemiLEDs. All Rights Reserved RoHS Compliant www.semileds.com Data Sheet Rev. 1.0 Subject to change without notice
Page 1
Features General purpose white
Very low thermal resistance: < 1.0 K/W
High luminous flux in a compact footprint: 9.00mm x 9.00mm package size
8KV (HBM) ESD protection
Reflow solder able JEDEC J‐STD‐020D
Applications General lighting
Retail lighting
Architectural lighting
Directional replacement lamps
Industrial and commercial lighting
Absolute Maximum Ratings (Tj = 25 )
Parameters Symbol Rating Unit
DC Forward current (7S7P) IF 840 mA
Operating temperature Topr ‐40 ~ 85 ℃
LED Storage temperature Tstg1 ‐40 ~ 110 ℃
LED Junction temperature Tj 125 ℃
Soldering temperature at tp
(JEDEC‐020‐D) Tsol 20 ~ 40 Second
ESD
classification
MIL‐STD‐883G HBM 8000 (Class 3B) V
JESD22‐A115‐B MM 400 (Class C) V
Notes:
1. Proper current derating must be observed to maintain junction temperature below the maximum.
M90‐20W PRODUCT DATASHEET
© 2005‐2013 SemiLEDs. All Rights Reserved RoHS Compliant www.semileds.com Data Sheet Rev. 1.0 Subject to change without notice
Page 2
Flux Characteristics (Tj = 25 )
Part number Color
CCT Range Base Order
Codes Minimum
Luminous Flux@840mA (Im)
Forward Voltage @840mA (V)
Min. Max. Min. Max.
M9090‐020‐0707‐EA
Cool
White
70‐CRI
6020 7040
1700
19.6 21.7
21.7 23.8
23.8 25.9
1800
19.6 21.7
21.7 23.8
23.8 25.9
1900
19.6 21.7
21.7 23.8
23.8 25.9
M9090‐020‐0707‐CA 5310 6020
1700
19.6 21.7
21.7 23.8
23.8 25.9
1800
19.6 21.7
21.7 23.8
23.8 25.9
1900
19.6 21.7
21.7 23.8
23.8 25.9
M9090‐020‐0707‐WC
Warm
White
80‐CRI
2870 3220
1200
19.6 21.7
21.7 23.8
23.8 25.9
1300
19.6 21.7
21.7 23.8
23.8 25.9
1400
19.6 21.7
21.7 23.8
23.8 25.9
Notes:
1. Forward voltage is measured with an accuracy of ±0.1V (tester tolerance)
2. Flux is measured with an accuracy of ±10% and ±2 on CRI measurements.
3. The typical CRI (Cool Rendering Index) for Cool White 70‐CRI is 70, and for Warm White 80‐CRI is 80.
4. SemiLEDs M90 20W product is tested and binned at 840mA.
M90‐20W PRODUCT DATASHEET
© 2005‐2013 SemiLEDs. All Rights Reserved RoHS Compliant www.semileds.com Data Sheet Rev. 1.0 Subject to change without notice
Page 3
Typical Electro‐Optical Characteristics Curves (Tj=25℃)
Forward Current vs. Forward Voltage Relative Luminous Flux vs. Forward Current
Relative Radiant Power vs. Wavelength Typical Spatial Distribution
Typical Polar Radiation Pattern
M90‐20W PRODUCT DATASHEET
© 2005‐2013 SemiLEDs. All Rights Reserved RoHS Compliant www.semileds.com Data Sheet Rev. 1.0 Subject to change without notice
Page 4
Thermal Design Curve
The junction temperature can be correlated to the thermal resistance between the junction and ambient (Rja)
by the following equation.
Tj=Ta + Rja*W
Tj: LED junction temperature
Ta: Ambient temperature
Rja: Thermal resistance between the junction and ambient
W: Input power (IF*VF)
M90‐20W PRODUCT DATASHEET
© 2005‐2013 SemiLEDs. All Rights Reserved RoHS Compliant www.semileds.com Data Sheet Rev. 1.0 Subject to change without notice
Page 5
Chromaticity Coordinate Groups
Product Binning (Cool White)
ES6500 6020~7040K
Rank CIE‐X CIE‐Y Rank CIE‐X CIE‐Y Rank CIE‐X CIE‐Y Rank CIE‐X CIE‐Y
1A
0.3048 0.3207
1B
0.3028 0.3304
1C
0.3115 0.3391
1D
0.3130 0.3290
0.3130 0.3290 0.3115 0.3391 0.3205 0.3481 0.3213 0.3373
0.3144 0.3186 0.3130 0.3290 0.3213 0.3373 0.3221 0.3261
0.3068 0.3113 0.3048 0.3207 0.3130 0.3290 0.3144 0.3186
ES5700 5310~6020K
Rank CIE‐X CIE‐Y Rank CIE‐X CIE‐Y Rank CIE‐X CIE‐Y Rank CIE‐X CIE‐Y
2A
0.3215 0.3350
2B
0.3207 0.3462
2C
0.3290 0.3538
2D
0.3290 0.3417
0.3290 0.3417 0.3290 0.3538 0.3376 0.3616 0.3371 0.3490
0.3290 0.3300 0.3290 0.3417 0.3371 0.3490 0.3366 0.3369
0.3222 0.3243 0.3215 0.3350 0.3290 0.3417 0.3290 0.3300
M90‐20W PRODUCT DATASHEET
© 2005‐2013 SemiLEDs. All Rights Reserved RoHS Compliant www.semileds.com Data Sheet Rev. 1.0 Subject to change without notice
Page 6
Product Binning (Warm White)
ES3000 2870~3220K
Rank CIE‐X CIE‐Y Rank CIE‐X CIE‐Y Rank CIE‐X CIE‐Y Rank CIE‐X CIE‐Y
7A1
0.4147 0.3814
7B1
0.4221 0.3984
7C1
0.4342 0.4028
7D1
0.4259 0.3853
0.4183 0.3898 0.4259 0.4073 0.4385 0.4119 0.4300 0.3939
0.4300 0.3939 0.4385 0.4119 0.4513 0.4164 0.4418 0.3981
0.4259 0.3853 0.4342 0.4028 0.4465 0.4071 0.4373 0.3893
7A2
0.4183 0.3898
7B2
0.4259 0.4073
7C2
0.4385 0.4119
7D2
0.4300 0.3939
0.4221 0.3984 0.4299 0.4165 0.4430 0.4212 0.4342 0.4028
0.4342 0.4028 0.4430 0.4212 0.4562 0.4260 0.4465 0.4071
0.4300 0.3939 0.4385 0.4119 0.4513 0.4164 0.4418 0.3981
M90‐20W PRODUCT DATASHEET
© 2005‐2013 SemiLEDs. All Rights Reserved RoHS Compliant www.semileds.com Data Sheet Rev. 1.0 Subject to change without notice
Page 7
Mechanical Dimensions
Notes: 1. All dimensions are in millimeters. 2. Drawings not to scale. 3. General tolerances are ±0.13 mm unless otherwise indicated.
Pad configuration
Pad Function
1 Cathode
2 Anode
3 Thermal
M90‐20W PRODUCT DATASHEET
© 2005‐2013 SemiLEDs. All Rights Reserved RoHS Compliant www.semileds.com Data Sheet Rev. 1.0 Subject to change without notice
Page 8
Shipping Package Information
Tape Dimensions (Unit: mm) Item Specification Tol.(+/‐)
W 16.00 ±0.30E 1.75 ±0.10F 7.50 ±0.10
D0 1.50 +0.10,‐0D1 1.50 +0.25,‐0P0 4.00 ±0.10
P1 12.00 ±0.10P2 2.00 ±0.10
P0X10 40.00 ±0.20
t 0.35 ±0.05A0 9.40 ±0.10
B0 9.40 ±0.10K0 4.95 ±0.10
Reel
Trailer 35 pockets (min)
of empty pockets
Leader 35 pockets
(min) of empty pockets
Loaded Pockets
M90‐20W PRODUCT DATASHEET
© 2005‐2013 SemiLEDs. All Rights Reserved RoHS Compliant www.semileds.com Data Sheet Rev. 1.0 Subject to change without notice
Page 9
Packaging
Desiccants
Humidity indicator card
Static Shielding bag
Desiccants
Humidity indicator card
Static Shielding bag
1 reel in a bag = 200pcs
1 bag in an inner box= 200pcs
Small size: 5 inner box in an outer box= 1000pcsLarge size: 10 inner box in an outer box= 2000pcs
Humidity Indicator Card
Static Shielding Bag
Label
Packing after MFG Packing for shipping
M90‐20W PRODUCT DATASHEET
© 2005‐2013 SemiLEDs. All Rights Reserved RoHS Compliant www.semileds.com Data Sheet Rev. 1.0 Subject to change without notice
Page 10
Reflow soldering conditions The LEDs can be soldered using the parameters listed below. As a general guideline, the users are suggested to
follow the recommended soldering profile provided by the manufacturer of the solder paste. Although the
recommended soldering conditions are specified in the list, reflow soldering at the lowest possible temperature
is advised for the LEDs.
Profile Feature Sn‐Pb Eutectic Assembly Pb‐Free Assembly
Average Ramp‐up Rate (Tsmax to Tp)
3℃/second max. 3℃/second max.
Preheat - Temperature Min(Tsmin) - Temperature Max(Tsmax) - Time(tsmin to tsmax)
100℃
150℃
60‐120 seconds
150℃
200℃
60‐180 seconds
Time maintained above: - Temperature(TL) - Time(tL)
183℃
60‐150 seconds
217℃
60‐150 seconds
Peak/classification Temperature(Tp)
215℃ 260℃
Time within 5℃ of actual Peak
Temperature(tp) 10‐30 seconds 20‐40 seconds
Ramp‐Down Rate 6℃/second max. 6℃/second max.
Time 25℃ to Peak Temperature 6 minutes max. 8 minutes max.
Note: 1. The housing side wall is composed by silicon which is a kind of semiconductor. 2. Please avoid solder ball or excessive solder around side wall during SMT process.
M90‐20W PRODUCT DATASHEET
© 2005‐2013 SemiLEDs. All Rights Reserved RoHS Compliant www.semileds.com Data Sheet Rev. 1.0 Subject to change without notice
Page 11
LED Handling Information
The following items are recommended when handling the LEDs:
1. The lens of the LEDs should not be exposed to dust and debris. Excessive dust and debris may cause a
drastic decrease in light output.
2. Avoid mechanical stress on the LED lens.
3. Do not touch the LED lens surface. It would affect the optical performance of the LED due to the LED lens’
damage.
4. Pick and place tool is recommended when removing the LEDs from the factory tape and reel packaging.
Lens Handling
Please follow the following guidelines when handling the LEDs:
1. Use tweezers to hold the LEDs.
2. Do not touch the lens with the tweezers or fingers.
3. Do not apply more than 4N (400g) of force directly onto the lens.
Correct ( ) Wrong (X)
Lens Cleaning
A suitable cleaning solution can be applied to the lens surface to remove dirt and dust particles:
1. Try gentle swabbing using a lint‐free swab.
2. If needed, isopropyl alcohol can be used with a lint‐free swab to gently remove dirt from the lens surface.
3. Do not use other solvents as they may directly react with the LED assembly.
4. Do not use ultrasonic cleaning which may damage the LED.
M90‐20W PRODUCT DATASHEET
© 2005‐2013 SemiLEDs. All Rights Reserved RoHS Compliant www.semileds.com Data Sheet Rev. 1.0 Subject to change without notice
Page 12
Carrier Tape Handling
The following items are recommended when handling the carrier tape of the LEDs:
1. Do not twist the carrier tape
2. The inward bending diameter should not be smaller than 6cm for carrier tape
3. Do not bend the tape outward
4. Storage temperature should not exceed 60℃
5. Ten reels per box
6. Box dimensions: 49cm x 22cm x 21 cm
7. Full box weight: 3±0.5 Kg.
<<66ccmm
M90‐20W PRODUCT DATASHEET
© 2005‐2013 SemiLEDs. All Rights Reserved RoHS Compliant www.semileds.com Data Sheet Rev. 1.0 Subject to change without notice
Page 13
About Us
SemiLEDs Corporation is a US based manufacturer of ultra‐high brightness LED chips with state of
the art fabrication facilities in Hsinchu Science Park, Taiwan. SemiLEDs specializes in the development
and manufacturing of vertical LED chips in blue (white), green, and UV using a patented copper alloy
base. This unique design allows for higher performance and longer lumen maintenance. The World
Economic Forum recognized SemiLEDs innovations with the 2009 Technology Pioneer Award.
SemiLEDs is fully ISO 9001:2008 Certified
SemiLEDs is a publicly traded company on NASDAQ Global Select Market (stock symbol “LEDS”). For
investor information, please contact us at [email protected].
For further company or product information, please visit us at www.semileds.com or please contact
sales@ semileds.com.
www.semileds.com
ASIA PACIFIC
3F, No. 11, KeJung Rd.
Chu‐Nan Site
Hsinchu Science Park
Chu‐Nan 350, Miao‐Li County
Taiwan, ROC
Tel: +886‐37‐586788
Fax: +886‐37‐582688