SJ-20120320184105-002-Unitrans ZXMP S325 (V2.20) SDH Based Multi-Service Node Equipment Product Description.pdf

ZXMP S325SDH Based Multi-Service Node Equipment

Product Description

Version 2.20

ZTE CORPORATIONNO. 55, Hi-tech Road South, ShenZhen, P.R.ChinaPostcode: 518057Tel: +86-755-26771900Fax: +86-755-26770801URL: http://ensupport.zte.com.cnE-mail: [email protected]

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Revision History

Revision No. Revision Date Revision Reason

R1.1 2012-07-30 Updated the documentation architecture.

R1.0 2012-03-30 ZXMP S325(V2.20) Issued.

Serial Number: SJ-20120320184105-002

Publishing Date: 2012-07-30(R1.1)

SJ-20120320184105-002|2012-07-30(R1.1) ZTE Proprietary and Confidential

Table of ContentsAbout This Manual ......................................................................................... I

Chapter 1 System Functions..................................................................... 1-11.1 Service Functions............................................................................................... 1-1

1.1.1 Service Access Types............................................................................... 1-1

1.1.2 Service Access Capacity .......................................................................... 1-2

1.1.3 Multi-Service Functions ............................................................................ 1-2

1.2 System Control and Communication Functions .................................................... 1-3

1.3 Power Supply Function....................................................................................... 1-4

1.4 Overhead Processing Function ........................................................................... 1-4

1.5 Timing and Synchronization Output Function ....................................................... 1-4

1.6 Alarm Input/Output Function ............................................................................... 1-5

1.7 Alarm Concatenation Function ............................................................................ 1-5

1.8 Tandem Connection Monitoring Function ............................................................. 1-5

1.9 Cross-connect Capacity...................................................................................... 1-6

1.10 Protection Function........................................................................................... 1-7

1.10.1 Equipment Level Protections................................................................... 1-7

1.10.2 Network Level Protections....................................................................... 1-9

Chapter 2 Technical Specifications .......................................................... 2-12.1 Dimension and Weight........................................................................................ 2-1

2.1.1 Cabinet Dimensions and Weights .............................................................. 2-1

2.1.2 Dimensions and Weight of Components .................................................... 2-2

2.1.3 Dimensions and Weight of Boards............................................................. 2-3

2.2 Bearing Requirement of Equipment Room ........................................................... 2-8

2.3 Power Supply Requirements ............................................................................... 2-8

2.3.1 Power Supply Range................................................................................ 2-8

2.3.2 Power Consumption Specifications............................................................ 2-8

2.3.3 Power Consumptions of Typical System Configurations ............................ 2-12

2.4 Environment Requirements............................................................................... 2-14

2.4.1 Grounding Requirements ........................................................................ 2-14

2.4.2 Temperature and Humidity Requirements ................................................ 2-15

2.4.3 Cleanness Requirements........................................................................ 2-15

2.4.4 Application Environment Requirements.................................................... 2-16

2.5 EMC Requirements .......................................................................................... 2-16

I


2.5.1 EMS...................................................................................................... 2-16

2.5.2 EMI ....................................................................................................... 2-19

2.6 Optical Interface Specifications ......................................................................... 2-19

2.6.1 Transmission Code Pattern..................................................................... 2-19

2.6.2 Optical Modules ..................................................................................... 2-19

2.6.3 Eye Diagram of Optical Transmit Signals ................................................. 2-21

2.6.4 Mean Optical Launched Power................................................................ 2-22

2.6.5 Extinction Ratio ...................................................................................... 2-22

2.6.6 Receiver Sensitivity ................................................................................ 2-22

2.6.7 Receiver Overload.................................................................................. 2-23

2.6.8 Mean Optical Received Power ................................................................ 2-23

2.6.9 Permitted Frequency Deviation of Optical Input Interfaces ........................ 2-23

2.6.10 AIS Rate of Optical Output Interfaces .................................................... 2-23

2.7 Electrical Interface Specifications ...................................................................... 2-23

2.7.1 Code Patterns of Electrical Interface........................................................ 2-23

2.7.2 Permitted Attenuation of Input Interfaces, Frequency Deviation of InputInterfaces and Bit Rate Tolerance of Output Interfaces ............................ 2-24

2.7.3 Reflection Attenuation of Input/Output Interfaces ...................................... 2-24

2.7.4 Anti-Interference Capability of Input Interfaces ......................................... 2-25

2.7.5 Waveform of Output Interfaces................................................................ 2-25

2.8 Interface Jitter Specifications............................................................................. 2-30

2.8.1 Jitter and Wander Tolerance of PDH Input Interfaces ................................ 2-30

2.8.2 Jitter and Wander Tolerance of SDH Input Interfaces ................................ 2-31

2.8.3 STM-N Interface Inherent Output Jitter .................................................... 2-33

2.8.4 Mapping Jitter of PDH Tributary............................................................... 2-34

2.8.5 Combined Jitter...................................................................................... 2-34

2.8.6 Jitter Transfer Characteristic of Regenerator ............................................ 2-36

2.9 Clock Specifications ......................................................................................... 2-37

2.10 OA Board Specifications ................................................................................. 2-39

2.11 Ethernet Performance Specifications ............................................................... 2-41

2.11.1 Transparent Transmission Performance Specifications............................ 2-41

2.11.2 VLAN Specifications ............................................................................. 2-42

2.11.3 L2 Switching Specifications ................................................................... 2-43

2.12 RPR Performance Specifications..................................................................... 2-44

2.13 ATM Characteristics........................................................................................ 2-46

2.14 External Interface Standards ........................................................................... 2-49

Appendix A Standards and Recommendations ..................................... A-1

II


Glossary .......................................................................................................... I

III


IV


About This ManualPurpose

This manual is applicable to the Unitrans ZXMP S325 SDH based multi-service nodeequipment.

Unitrans ZXMP S325 is a multi-service node equipment with the highest transmission rateof 2.5 Gbit/s. It can apply to the access network.

Intended Audience

This manual is intended for:

l Planning engineerl Maintenance engineer

What Is in This Manual

This manual contains the following chapters:

Chapter Summary

Chapter 1, System Functions Explains about the system functions.

Chapter 2, Technical Specifications Discusses about the technical specifications.

Appendix A, Standards and

Recommendations

Gives the standards and recommendations that ZXMP

S325 complies with.

Related Documentation

The following documentation is related to this manual:

l Unitrans ZXMP S325 (V2.20) SDH Based Multi-Service Node Equipment SystemDescription

l Unitrans ZXMP S325 (V2.20) SDH Based Multi-Service Node Equipment HardwareDescription

l Unitrans ZXMP S325 (V2.20) SDH Based Multi-Service Node Equipment InstallationManual

l Unitrans ZXMP S325 (V2.20) SDH Based Multi-Service Node EquipmentMaintenance Manual

l Unitrans ZXMP S325 (V2.20) SDH Based Multi-Service Node Equipment OperationInstructions

Conventions

This document uses the following typographical conventions.

I


Typeface Meaning

Italics Variables in commands. It may also refers to other related manuals and documents.

Bold Menus, menu options, function names, input fields, option button names, check boxes,

drop-down lists, dialog box names, window names, parameters and commands.

CAPS Keys on the keyboard and buttons on screens and company name.

Danger: Indicates an imminently hazardous situation, which if not avoided, will result in

death or serious injury.

Warning: Indicates a hazard that, if not avoided, could result in serious injuries,

equipment damages or interruptions of major services.

Caution: Indicates a potential hazard that, if not avoided, could result in moderate

injuries, equipment damages or partial service interruption.

Note: Provides additional information about a certain topic.

II


Chapter 1System FunctionsTable of Contents

Service Functions.......................................................................................................1-1System Control and Communication Functions ..........................................................1-3Power Supply Function...............................................................................................1-4Overhead Processing Function ..................................................................................1-4Timing and Synchronization Output Function..............................................................1-4Alarm Input/Output Function.......................................................................................1-5Alarm Concatenation Function ...................................................................................1-5Tandem Connection Monitoring Function....................................................................1-5Cross-connect Capacity .............................................................................................1-6Protection Function ....................................................................................................1-7

1.1 Service Functions

1.1.1 Service Access TypesTable 1-1 lists the services types supported by ZXMP S325.

Table 1-1 ZXMP S325 Service Access Types

Service Type Rate

STM-1 (optical/electrical) 155520 kbit/s

STM-4 622080 kbit/s

SDH services

STM-16 2488320 kbit/s

E3 34368 kbit/s

T3 44736 kbit/s

E1 2048 kbit/s

PDH services

T1 1544 kbit/s

FE 10 Mbit/s or 100 Mbit/sEthernet services

GE 1 Gbit/s

ATM services ATMSTM-1 155520 kbit/s

1-1


ZXMP S325 Product Description

1.1.2 Service Access CapacityThe ZXMP S325 provides abundant service interfaces, including STM-4 or STM-1 opticalinterfaces, STM-1 electrical interface, E3/T3/E1/T1 PDH electrical interfaces, 10/100Mbit/s Ethernet interfaces, and ATM interface. Table 1-2 lists the ZXMP S325 serviceaccess capability.

Table 1-2 Service Access Capacity of ZXMP S325

Board/InterfaceType

Number of BoardPorts (channelsper board)

MaximumAccess Capacityper Subrackwithout BoardProtection(channel)

MaximumAccess Capacityper Subrack withBoard Protection(channel)

Remarks

STM-16 1 5 - without Board

Protection

STM-4 123 or 4 13 - without BoardProtection

STM-1(optical) 123 or 4 26 - without BoardProtection

STM-1(electrical) 1 or 2 12 10 -

E3/T3 3 18 15 -

E1/T1 21 126 105 -

10/100 Mbps

Ethernet interface

(electrical)

6 36 30 -

100 Mbps

Ethernet interface

(optical)

8 48 - without Board

Protection

ATM interface 4 24 - without Board

Protection

GE optical

interface


Protection

GE electrical

interface


Protection

1.1.3 Multi-Service FunctionsThe ZXMP S325 can process Ethernet service, ATM service and RPR service. It providesthe following interfaces listed in Table 1-3 for multi-service function.

1-2


Chapter 1 System Functions

Table 1-3 Multi-service Interfaces Provided by the ZXMP S325

Interface Type ProcessingBoard ID

Interface BoardID

ConnectorType

BoardIntegration(channel perboard)

MaximumAccess Capacityper Subrack(channel)

SFEx6SED OIS1x4OIS1x6

4 24FE optical

interface

TFEx8 EIFEx4EITFEx6

LC/PC

2 16

SFEx6SED EIFEx4EIFEx6 36FE electricalinterface TFEx8 EIFEx4

EITFEx6

RJ45 6

48

ATM service

optical interface

AP1x4 OIS1x4 LC/PC 4 24

GE optical

interface

RSEBSED - LC/PC 2 16

GE electrical

interface

SED - RJ45 2 16

1.2 System Control and Communication FunctionsThe system control and communication functions are carried out by the NCP board. Thefunctions include:

l Sending configuration commands to MCUs and collecting their performance andalarm information.

l Exchanging network management information between NEs through the embeddedcontrol channel (ECC), and supporting the selection of DCCr, DCCm, and DCCr+m.

Note:

The ECC provides the function of transmitting network maintenance informationthrough the data communication channel (DCC) which is the physical layer of ECC.The DCC carries communication data between NEs, including DCC bytes in theregenerator section (DCCr) and DCC bytes in the multiplex section (DCCm).

l Implementing the connection of orderwire phones between NEs through the sectionoverhead bytes E1 and E2 in the SDH frame.

l Through the Qx interface, it reports to SMCC (Subnet Management Control Center)the alarm and performance information of this NE and of the subnet which the NE

1-3



belongs to, and receives commands and configurations sent from the SMCC to theNE and subnet. The Qx interface works for communication between NE and SMCC.

l Detecting fan status of the NE. Fan speed can be set to half or full in the EMS. Ifthe fan stops running when equipment is working, the EMS will report alarm.

l Monitoring the board-in-position status and over/under-voltage of the power supplyboard.

1.3 Power Supply FunctionPower supply for the subracks of the ZXMP S325 is supplied by the power boards.

Distributed power supply mode is employed in the ZXMP S325 to supply power to eachsubrack separately. Each subrack is equipped with two power supply boards (PWRA) for1+1 protection.

1.4 Overhead Processing FunctionThe overhead processing function of ZXMP S325 is performed by NCP board and opticalline boards.

Optical line boards separate section overheads from payload in SDH data frame andintegrate these overheads into an overhead bus. All the boards (including OCS4 board,optical line board, and NCP board) read or insert corresponding overhead bytes from orto the overhead bus.

The ZXMP S325 supports the overhead cross-connect function. The overhead can beconfigured to any port as required by the EMS.

1.5 Timing and Synchronization Output FunctionThemaster-slave synchronizationmode is adopted between ZXMPS325 equipments. TheOCS16 board or OCS4 board performs timing and synchronization functions, including:clock source selection, clock source switching, and clock exporting.

l Clock source selection

There are multiple ways to get the clock source, including:

Tracing external timing reference

Locking onto a line clock in a certain direction

Locking onto the internal clock

The system allows configuring ten line clock sources and two external clock sourcesat the same time.

l Clock source switching

The clock source switching occurs under any of the following three cases:

The current clock source is lost

1-4



A clock source of higher quality level recovers

The current clock source deteriorates

The system clock supports the synchronous priority switching and SSMalgorithm-based automatic switching.

In complex networks, the application of SSM algorithm-based automatic switchingcan optimize the timing and synchronization distribution of the network, reduce thedifficulty of synchronization planning, and avoid timing loops, thus ensuring the optimalnetwork synchronization.

l Clock exporting

ZXMP S325 supports the export of two channels of 2 Mbit/s or 2 MHz externalreference clock signals. The output interface of external reference clock is suppliedby SAIA or SAIB board (system auxiliary interface board).

1.6 Alarm Input/Output Functionl External alarm input interface

The ZXMP S325 supports the function of external alarm Boolean value input, and thecorresponding physical interface is provided by the SAIA board or SAIB board. Theequipment can access at most four channels of external alarms to detect the alarmsof fans, access control, and ambient temperature.

l Alarm output interface

The ZXMP S325 supports two channels of alarm output, and the correspondingphysical interface is provided by the SAIA or SAIB board. The equipment outputsthe alarm signal via the touch point switch, and outputs the alarm ringing signals,critical alarm, major alarm, and minor alarm signals to the column head cabinet inthe equipment room.

1.7 Alarm Concatenation FunctionThe ZXMP S325 supports the function of alarm concatenation, and the correspondingphysical interface is provided by the SAIA or SAIB board. The subrack alarmconcatenation output interface (i.e. the alarm output interface) can directly connect tothat of another ZXMP S325 subrack to implement alarm concatenation of multiple ZXMPS325 equipments.

1.8 Tandem Connection Monitoring FunctionThe OCS16 or OCS4 board of ZXMP S325 supports the newly added HP-TCM(Higher-order Path Tandem Connection Monitoring) function.

1-5



As specified in ITU-T G.707 Recommendation, the tandem connection layer locatesbetween the multiplex section and the path section. Tandem connection mainly applies tointer-office communication, especially at the border between different network carriers.

This function is implemented by N1 higher-order path overhead byte. It can detect thenumber of B3 block errors received in a carriers networks and the number of B3 blockerrors transferred to next carriers network.

1.9 Cross-connect CapacityOptical line boards and/or electrical tributary boards of ZXMP S325 can cross-connectsignals at AU-4, TU-3, TU-12, and TU-11 levels. In addition, they implement protectionswitching via cross-connect matrix.

Configured with OCS16 board, ZXMP S325 can implement higher-order cross-connect of128128 VC-4, and lower-order cross-connect of 3232 VC-4. Configured with OCS4board, ZXMP S325 can implement higher-order cross-connection of 6464 VC-4, andlower-order cross-connect of 3232 VC-4.

OCS16 or OCS4 board of ZXMP S325 can perform the functions of a DXC (DigitalCross Connect) equipment to implement the pass-through, broadcast, add/drop, andcross-connect of services.

The pass-through, broadcast, and add/drop modes are subsets of the cross-connectfunction. In the equipment, both the tributary electrical interfaces and optical line interfacesare connected to the cross-connect network and their connections are equivalent.Therefore, the inter-interface services can be cross-connected in any form, as illustratedin Figure 1-1.

Figure 1-1 Interfaces of the ZXMP S325 DXC Equipment

As shown in Figure 1-2, the service interworking between the NE T1 and NE T2 can beachieved on the backbone network through NE A. It can also be implemented throughforming a direct service route through NE A without establishing another line between T1and T2 or adding equipment.

1-6



Figure 1-2 Application of Cross-Connect between Tributaries

The cross-connect function of ZXMP S325 also supports network maintenance and testduring networking and operation.

1.10 Protection Function

1.10.1 Equipment Level Protections

Power Protection

l Out-of-cabinet power protection

Two groups of -48 V power supplies in the equipment room are connected to theZXMP S325 equipment. The external power supply 1+1 protection ensures that theequipment operates normally when either power group fails.

The power distribution box can provide up to 12 channels of power supply to thesubrack, each two channels as a group. Each group can provide power supply inthe active/standby mode. At most six groups of active/standby power supply can beprovided.

l Inside-cabinet power protection

Each subrack of the ZXMP S325 can be configured with two power supply boards,connected to the active power supply and the standby power supply respectively for1+1 protection. When the active or standby power supply fails, the power alarm willbe reported to the EMS.

Cross-connect Protection and Clock Protection

Configured with one active OCS16 or OCS4 board and one standby OCS16 or OCS4board, ZXMP S325 can implement the 1+1 protection for cross-connect and clock. In caseof fault, the system can control the switching between the two OCS16 or OCS4 boardsautomatically.

The two OCS16 or OCS4 boards can work in 1+1 hot backup mode. The ZXMP S325 canalso be equipped with one OCS16 or OCS4 board.

When configured with one active and one standby OCS16 or OCS4 boards, and they areboth in position and work normally, only the clock of the active OCS16 or OCS4 board is

1-7



exported to the motherboard. If one OCS16 or OCS4 board fails, the clock is switched tothe other OCS16 or OCS4 board.

1:N Protection for Electrical Service Processor Boards

ZXMP S325 can implement the 1:N (N6) protection for E1/T1 service processor board,1:N (N5) protection for FE service processor board, and 1:N (N5) protection forE3/T3/STM-1 electrical service processor board. The system can support at most twogroups of 1:N protections.

l 1:N protection for E1/T1 service processor board

The ZXMPS325 can support at most 1:6 protection for E1/T1 service processor board.The active board can choose any slot among the six tributary board slots, while thestandby board slot has two choices:

The standby board can choose any slot among the six tributary slots

Using this method, the system can implement at most 1:5 tributary protection;meanwhile, the interface board slot corresponding to the standby board slot needto be configured with the BIE1x21 board (E1/T1 electrical interface bridge board).

The standby board can choose the dedicated slot for E1/T1 standby board

Using this method, the system can implement at most 1:6 tributary protection;meanwhile, there is no need to install the BIE1x21 board.

l 1:N protection for FE service processor board

The ZXMP S325 can support at most 1:5 protection for FE service processor board.The standby board can choose slot 5/6.

l 1:N protection for E3/T3/STM-1 (electrical) service processor board

The ZXMP S325 can support at most 1:5 protection for E3/T3/STM-1 (electrical)service processor board. The standby board can only occupy slot 1, i.e. the first slotof the six tributary board slots.

Note:

The protection for E1/T1/FE service processor board belongs to the same protectiontype, while the protection for E3/T3/STM-1 (electrical) service processor board belongsto another protection type. One ZXMP S325 subrack can simultaneously support twogroups of protections with different protection types, but cannot simultaneously supportmultiple groups of service protections with the same protection type. For example, onesubrack does not simultaneously support two groups of 1:N protections for E1 serviceprocessor board; however, it supports 1:N protection for E1 service processor board andfor E3 service processor board simultaneously.

1-8



1.10.2 Network Level ProtectionsZXMP S325 supports the following network protection modes:

l MS chain 1+1 protectionl MS chain 1:1 protectionl 2-fiber unidirectional path protection ringl 2-fiber bidirectional path protection ringl 2-fiber bidirectional MS protection ring with extra servicel 2-fiber bidirectional MS protection ring without extra servicel STM-4/STM-16 4-fiber bidirectional MS protection ringl DNI (Dual Node Interconnection) protectionl Subnet Connection Protection (SNCP), including SNC (I) which is subnet connection

protection with inherent monitoring, and SNC (N) which is subnet connectionprotection with no interfered monitoring.

1-9



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1-10


Chapter 2Technical SpecificationsTable of Contents

Dimension and Weight ...............................................................................................2-1Bearing Requirement of Equipment Room..................................................................2-8Power Supply Requirements ......................................................................................2-8Environment Requirements ......................................................................................2-14EMC Requirements ..................................................................................................2-16Optical Interface Specifications ................................................................................2-19Electrical Interface Specifications .............................................................................2-23Interface Jitter Specifications....................................................................................2-30Clock Specifications .................................................................................................2-37OA Board Specifications...........................................................................................2-39Ethernet Performance Specifications........................................................................2-41RPR Performance Specifications..............................................................................2-44ATM Characteristics .................................................................................................2-46External Interface Standards ....................................................................................2-49

2.1 Dimension and Weight

2.1.1 Cabinet Dimensions and WeightsTable 2-1 describes dimensions and weights of ZXMP S325 cabinets.

Table 2-1 Dimensions and Weights of ZXMP S325 Cabinets

Dimensions (Height Width Depth) (Unit: mm) Weight (Unit: kg)

2000 600 300 59

2200 600 300 65

The weight refers to the weight of an empty cabinet. If a 2600 mm-high cabinet is required on site, you can mount a top box on the top of the cabinet.

Figure 2-1 illustrates the outline dimensions of the 300 mm-deep cabinet.

2-1



Figure 2-1 Dimensions of ZTE Transmission Equipment Cabinet (300 mm Deep)

2.1.2 Dimensions and Weight of ComponentsThe dimensions and weights of the ZXMP S325 components are listed in Table 2-2.

2-2


Chapter 2 Technical Specifications

Table 2-2 Dimensions and Weights of ZXMP S325 Components

Component Dimensions (Height Width Depth) (Unit: mm)

Weight (Unit: kg) Remarks

2000 600 300 59.00 Weight of an empty

cabinet

ZXMP unified 300 mm deep

cabinet

2200 600 300 65.00 Weight of an empty

cabinet

Transmission multifunctional

box

752 608 520 52.20 -

Outdoor Power cabinet 800 600 600 51.00 -

Wall-mounted subrack 245 512 255 3.00 -

Desktop installation

components

244.5 495.8 230.0 2.80 -

ZXMP S325 subrack 221.5 482.6 270 9.00 Includes motherboard,

fan plug-in box,

dustproof unit)

Power distribution box 132.5 482.6 269.5 7.00 With electronic

components

AC power lightning protection

unit

88.1 482.6 75.0 2.50 -

DC power lightning protection

unit

88.1 482.6 75.0 2.00 -

Rectifier unit 43.7 436.0 240.0 5.00 -

Lightning-proof unit 43.7 445.0 197.8 2.50 -

Motherboard 214.6 438.4 4.5 1.50 -

PCB90 79 1.6Fan box

Size after assembly:

21.5 139.6 244.8

0.52 Includes structural

parts and hardware

circuits

Dustproof unit 13.1 279.6 253 Accounted in

subrack weight

-

2.1.3 Dimensions and Weight of BoardsThe dimensions and weight of boards of ZXMP S325 are listed in Table 2-3.

2-3



Table 2-3 Dimensions and Weight of Boards

Board ID Board Name Dimension (mm) Weight (kg)

NCP NE control processor PCB: 160 (height) 210 (depth) 2

(thickness)

Front panel: 181.5 (height) 25.4

(width)

0.430

SAIA System auxiliary

interface board (type

A)

PCB: 160 (height) 80 (depth) 2

(thickness)

Front panel: none

0.160

SAIB System auxiliary

interface board (type

B)


(thickness)

Front panel: none

0.130

PWRA Power supply board PCB: 2 (height) 72 (width) 170

(depth)

Front panel: 25 (height) 74 (width)

0.160

PWRB Power supply board PCB: 2 (height ) 72 (width) 170

(depth)

Front panel: 25 (height) 74 (width)

0.690

FAN Fan board PCB: 90 (height) 79 (width) 1.6

(thickness)

Size after assembly:

21.5 (height) 139.6 (width) 244.8

(depth)

0.520

OCS4 STM-1/4 optical line,

cross-connect, and

synchronous-clock

board


(thickness)


(width)

0.550

OCS16 STM-16 optical line,

cross-connect, and

synchronous-clock

board


(thickness)


(width)

0.460

OL1/4x44xSTM-1

0.485

OL1/4x43xSTM-1

0.465

OL1/4x42xSTM-1

0.445

OL1/4x41xSTM-1

0.425

4-channel STM-

1/STM-4 optical line

board


(thickness)


(width)

2-4




OL1/4x44xSTM-4

0.485

OL1/4x43xSTM-4

0.465

OL1/4x42xSTM-4

0.445

OL1/4x41xSTM-4

0.425

OL16x1 1-channel STM-16

optical line board


(thickness)

Front panel: 181.5 (height )25.4

(width)

0.410

LP1x1 1-channel STM-1 line

processor


(thickness)

Front panel: 181.5 (height )25.4

(width)

0.355

OIS1x1 1-channel STM-1

optical interface

board


(thickness)

Front panel: none

0.125


processor


(thickness)


(width)

0.375


optical interface

board


(thickness)

Front panel: none

0.145


processor


(thickness)


(width)

0.360


optical interface

board


(thickness)

Front panel: none

0.125


processor


(thickness)


(width)

0.380

2-5





optical interface

board


(thickness)

Front panel: none

0.145


optical interface

board


(thickness)

Front panel: none

0.185


optical interface

board


(thickness)

Front panel: none

0.250

OBA12 Optical booster

amplifier OBA12


(thickness)


(width)

0.490

OBA14 Optical booster

amplifier OBA14


(thickness)


(width)

0.490

BIS1 STM-1 bridge

interface board


(thickness)

Front panel: none

0.105

ESS1x2 2-channel STM-1

electrical interface

switching board


(thickness)

Front panel: none

0.140

EPE1x2175

EPE1x21120

21-channel E1

electrical processor


(thickness)


(width)

0.420

EPT1x21 21-channel T1



(thickness)


(width)

0.400

EP1EBx21 21-channel E1/T1



(thickness)


(width)

0.420

BIE1x21 21-channel E1/T1

bridge interface

board


(thickness)

Front panel: none

0.090

2-6




ESE1x2175 21-channel E1electrical interface

switching board (75

)

ESE1x21120 21-channel E1/T1electrical interface

switching board


(thickness)

Front panel: none

0.160

EP3x3 3-channel E3/T3



(thickness)


(width)

0.400


electrical bridge

interface board


(thickness)

Front panel: none

0.115

ESE3x3 3-channel E3/T3


switching board


(thickness)

Front panel: none

0.145

SFEx6PPP

SFEx6GFP

Smart fast Ethernet

board


(thickness)


(width)

0.430

EIFEx4 4-channel electrical

interface board of

fast Ethernet


(thickness)

Front panel: none

0.150

EIFEx6 6-channel electrical

interface board of

fast Ethernet


(thickness)

Front panel: none

0.140

EITFEx6 6-channel switching

board of smart and

fast Ethernet


(thickness)


(width)

0.190

BIFE Bridge interface

board of fast Ethernet


(thickness)

Front panel: none

0.090

AP1x4 ATM processor with

4 STM-1 ports


(thickness)


(width)

0.430

2-7




RSEB Ethernet processor

with RPR function


(thickness)


(width)

0.735

SED Enhanced smart

Ethernet board


(thickness)


(width)

0.640

TFEx8 8-channel

transparent board

of fast Ethernet


(thickness)


(width)

0.380

2.2 Bearing Requirement of Equipment RoomWhen only ZXMP S325 is taken into consideration, the bearing of the equipment roomshould be greater than 450 kg/m2.

2.3 Power Supply Requirements

2.3.1 Power Supply RangeRated working voltage of ZXMP S325: -48 V DC

Range: -40 V DC to -57 V DC

2.3.2 Power Consumption SpecificationsTable 2-4 lists power consumptions and weights of boards in the ZXMP S325. The powerconsumption of the whole system depends on system configuration. It is less than 250 Wwith full configuration.

Table 2-4 Power Consumptions of Boards in ZXMP S325

Board ID Board Name Max PowerConsumption(25 C) (W)

Max PowerConsumption (45C) (W)

Remarks

NCP NE control processor 4.37 4.50 -

SAIA System auxiliary

interface board

2.16 2.22 The impedance of

clock input/ output

interface is 75

2-8





Remarks

SAIB System auxiliary

interface board

0.97 1.00 The impedance of

clock input/ output

interface is 120

PWRA -48 V power supply

board

3.00 3.09 -

PWRB +24 V power supply

board

15.80 16.60 -

FAN Fan board 8.04 8.28 -

- SFP optical module 0.80 0.82 -

16.17 16.66 STM-1 applicationOCS4 STM-4 optical line,

cross-connect, and

synchronous clock

board

16.95 17.46 STM-4 application

OCS16 STM-16 optical line,

cross-connect, and

synchronous clock

board

20.88 21.51 -

OL1/4x44xSTM-1

9.60 9.89 -

OL1/4x43xSTM-1

7.71 7.94 -

OL1/4x42xSTM-1

6.74 6.94 -

OL1/4x41xSTM-1

5.78 5.95 -

OL1/4x44xSTM-4

11.76 12.11 -

OL1/4x43xSTM-4

10.04 10.34 -

OL1/4x42xSTM-4

8.32 8.57 -

OL1/4x41xSTM-4

4-channel STM-

1/STM-4 optical line

board

6.56 6.76 -

OL16x1 1-channel STM-16

optical line board

14.11 14.39 -

2-9





Remarks


processor


optical interface board

5.75 (LP1x1 and

OIS1x1)

5.92 (LP1x1 and

OIS1x1)

-


processor



6.96 (LP1x2 and

OIS1x2)

7.17 (LP1x2 and

OIS1x2)

-


processor



8.26 (LP4x1 and

OIS4x1)

8.51 (LP4x1 and

OIS4x1)

-


processor



13.06 (LP4x2 and

OIS4x2)

13.45 (LP4x2 and

OIS4x2)

-



2.16 2.22 Provides optical

interface for SFEx6,

RSEB, AP1x4 boards



3.05 3.14 Provides optical

interface for SED

board

OBA12 Optical booster amplifier

OBA12

3.98 8.98 Use EDFA module with

no cooling

OBA14 Optical booster amplifier

OBA14

4.94 9.94 Use EDFA module with

no cooling

BIS1 STM-1 interface bridge

board

2.59 2.67 -

ESS1x2 2-channel STM-1


switching board

2.20 (4.62) 2.26 (4.76) The numbers in

parentheses are

consumptions after

switching

2-10





Remarks

EPE1x2175 4.42 4.55 The interfaceimpedance is 75

EPE1x21120

21-channel E1 electrical

processor

6.12 6.30 The interface

impedance is 120

EPT1x21 21-channel T1 electrical

processor

6.10 6.28 The interface

impedance is 100

EP1EBx21 21-channel E1/T1


7.39 7.61 -


interface bridge board

0 0 Has no active devices

and consumption can

be ignored

ESE1x2175 21-channel E1 electricalinterface switching

board

The interface

impedance is 75

The numbers in

parentheses are

consumptions after

switching

ESE1x21120 21-channel E1/T1electrical interface

switching board

0.50 (6.29) 0.51 (6.48)

The interface

impedance is 120

or 100

The numbers in

parentheses are

consumptions after

switching

EP3x3 3-channel E3/T3


6.96 7.17 -



bridge board

3.00 3.09 -

ESE3x3 3-channel E3/T3


switching board

2.13 (4.13) 2.19 (4.25) The numbers in

parentheses are

consumptions after

switching

SFEx6PPP 19.54 20.13 -

SFEx6GFP

Smart fast Ethernet

board 21.27 21.91 -

2-11





Remarks

EIFEx4 4-channel Ethernet


board

0.43 (2.28) 0.44 (2.35) The numbers in

parentheses are

consumptions after

switching

EIFEx6 6-channel Ethernet


board

0.05 0.05 Provides electrical

interface for SED

board

EITFEx6 6-channel FE handover

board

0.46 (2.90) 0.47 (3.00) The value in the

parentheses is the

value after handover

BIFE Ethernet interface

bridge board

0 0 Has no active devices

and consumption can

be ignored

AP1x4 4-channel ATM

processor

16.52 17.02 -

RSEB Ethernet Processor with

RPR Function

26.83 27.63 -

SED Enhanced smart

Ethernet board

20.88 21.51 -

TFEx8 8-channel fast

Ethernet transparent

transmission board

16.80 17.65 -

The weights of OCS4, OCS16, optical line boards, and optical interface boards include the weights of SFP modules. Power consumptions of boards shall be higher during equipment startup and in low temperature environment. The

refore, the power capacity provided by the equipment should be 1.5 to 1.8 times the power consumptions listed inthe table.

2.3.3 Power Consumptions of Typical System ConfigurationsTable 2-5, Table 2-6 and Table 2-7 list the power consumptions of three typical ZXMP S325configurations.

Table 2-5 ZXMP S325 Power Consumptions (Typical Configuration 1)

S.N. Board/Part Unit Quantity

1 NCP Piece 1

2 SAIA Piece 1

3 PWRA Piece 1

4 OCS4 (S-4.1) Piece 2

2-12




5 LP41 Piece 2

6 OIS4x1 (S-4.1) Piece 2

7 EPE1x21 (75) Piece 2

8 ESE1x21 (75) Piece 2

9 SFEx6 (GFP) Piece 1

10 EIFEx4 Piece 1

11 FAN Piece 2

12 3U power distribution box Set 1

13 ZJ-Front (Front fixed

subrack including MB

and fan)

Set 1

14 Tested Power Consumption: 109.38W



1 NCP Piece 1

2 SAIA Piece 1

3 PWRA Piece 2

4 OCS16 Piece 2

5 OL1/4x4 (4xS-1.1,LC) Piece 2




9 SED Piece 2

10 EIFEx6 Piece 2

11 FAN Piece 2



subrack including MB and

fan)

Set 1

14 Tested Power Consumption: 124.23W

2-13





1 NCP Piece 1

2 SAIA Piece 1

3 PWRA Piece 2

4 OCS16 Piece 2

5 OL16 (L-16.2,LC) Piece 3





10 SED Piece 1

11 EIFEx6 Piece 1

12 FAN Piece 2



subrack including MB and

fan)

Set 1

15 Tested Power Consumption: 160.26 W

2.4 Environment Requirements

2.4.1 Grounding Requirementsl If separate grounding is adopted in the equipment room, the grounding resistance

should meet the following requirements:

The ground resistance of -48 V GND: 4 .

The ground resistance of the system working ground: 1 .

The ground resistance of the lightning protection ground: 3 .

l If combined grounding is employed in the equipment room, the ground resistanceshould meet the following requirements:

The ground resistance: 1 .

The voltage differences among the lightning protection ground, the systemworking ground, and the -48 V GND should be less than 1 V.

2-14



2.4.2 Temperature and Humidity RequirementsThe requirements regarding the working temperature and relative humidity of the ZXMPS325 are given in Table 2-8.

Table 2-8 Temperature/Humidity Requirements

Index Specification

Working Temperature (inside desktop,mounted

on wall or transmission cabinet )

-5 C ~ +45 C

Working Temperature inside transmissionmultifunctional box

-5 C ~ +45 C

Working Temperature (inside outdoor power

cabinet)

-40 C ~ +45 C

Relative Humidity 5% ~ 95%

In normal conditions, the temperature and humidity are measured at 1.5 m above the floor and 0.4 mnear the equipment.

2.4.3 Cleanness RequirementsCleanness requirements include requirements for dust and harmful gases in the air. TheZXMP S325 equipment should operate in the equipment room that meets the cleannessrequirements described below:

l The equipment room should be free of explosive, conductive, magnetic-conductive orcorrosive dust.

l The density of dust particles with the diameter greater than 5m is no more than 3104particles/m3.

l There should be no corrosive metal or insulation-destructive gas in the equipment,such as SO2, H2S, NH3, NO2, and so on. The detailed information are listed in Table2-9.

Table 2-9 Density Limit of Hazardous Gases in the Equipment

Gas Average (mg/m3) Maximum (mg/m3)

SO2 0.2 1.5

H2S 0.006 0.030

NO2 0.04 0.15

NH3 0.05 0.15

Cl2 0.01 0.30

l The equipment room should be always kept clean, with doors and windows tightlysealed.

2-15



2.4.4 Application Environment RequirementsAccording the application scope of GB 4798 and ZXMP S325, the application environmentrequirements are listed as follows:

l Product storage environment: 1K5, 1Z1, 1B2, 1C2, 1S3, or 1M3. The storage durationis 180 days.

l Product transportation environment: 2K4P, 2B2, 2C2, 2S3, or 2M3. The transporta-tion duration is 30 days.

l Product usage environment: 3K5, 3Z2, 3Z7, 3B2, 3C2, 3S2, or 3M3. The usageduration is 10 years.

2.5 EMC RequirementsThe requirements for electromagnetic compatibility (EMC) include two aspects:requirements for electromagnetic susceptibility (EMS) and electromagnetic interference(EMI).

The following three criteria should be followed to judge the test result:

l Performance A: Continuous phenomenon. Neither error nor alarm is allowed. Afterelectromagnetic interference, the number of error bits does not exceed the maximumvalue of the normal requirement.

l Performance B: Transient phenomenon. During the course of an electromagneticinterference, the degradation of function is allowed and the equipment can work asexpected without the operators intervention.

No loss of frame and synchronization is allowed, and neither pattern out-of-sync, norAIS alarm is allowed. The equipment shall work normally after the electromagneticinterference.

The above does not apply to surge testing where some loss of frame alignment maybe expected. For this test, the EUT shall operate as intended following the cessationof the exposure.

l Performance R: Resistive phenomenon. The interference imposed on the equipmentduring the test can cause action of the fuse or other specified device which need tobe replaced or reset so that the equipment can work properly.

2.5.1 EMS

ESD Resistivity

The Electrical Static Discharge (ESD) resistivity indexes of ZXMP S325 are listed in Table2-10.

2-16



Table 2-10 ESD Resistivity

Contact Discharge Air Discharge Criterion

6 kV 8 kV Performance criterion B

Be sure to wear an antistatic wrist strap during operating in interface areas.

RF Electromagnetic Field Radiation Resistivity

The indexes of the RF electromagnetic field radiation resistivity of the ZXMP S325 arelisted in Table 2-11.

Table 2-11 RF Electromagnetic Field Radiation Resistivity

Test Frequency: 80 MHz ~ 1000 MHz, 1400 MHz ~ 2000 MHz

Electric Field Intensity Amplitude Modulation Criterion

10 V/m 80% AM1 kHz Performance criterion A

Electrical Transient Burst Resistivity

The indexes of the electrical transient burst resistivity at different ports of ZXMP S325 arelisted in Table 2-12, Table 2-13, and Table 2-14.

Table 2-12 Electrical Transient Burst Resistivity at DC PowerPort

Generator Waveform: 5 ns/50 ns

Test Voltage Repetition Frequency Criterion

1 kV 5 kHz Performance criterion B

Table 2-13 Electrical Transient Burst Resistivity at AC PowerPort




Table 2-14 Electrical Transient Burst Resistivity at Signal Cable and ControlCablePorts




Surge Resistivity

The surge resistivity indexes of ZXMP S325 are listed in Table 2-15 to Table 2-18.

2-17



Table 2-15 Surge Resistivity of DC Power Supply

Generator Waveform: 1.2 s/50 s (8 s/20 s); Internal Impedance: 12

Test Mode Test Voltage Criterion

Line to line 0.5 kV Performance criterion B

Line to ground 1 kV Performance criterion B

Table 2-16 Surge Resistivity of AC Power Supply



Line to ground 1 kV Performance criterion B

Line to ground 2 kV Performance criterion R

Table 2-17 Surge Resistivity of Outdoor Signal Cable

Generator Waveform: 10 s/700 s; Internal Impedance: 40


Line to line

Line to ground

2 kV Performance criterion B

Table 2-18 Surge Resistivity of Indoor Signal Cable (10 m)



Line to line

Line to ground

1 kV Performance criterion B

RF Field Conductivity Resistivity

The indexes of the RF field conductivity resistivity of ZXMP S325 arelisted in Table 2-19.

Table 2-19 RF Field Conductivity Resistivity

Test Frequency: 0.15 MHz ~ 80 MHz

Test Intensity Amplitude Modulation Criterion

3 V 80% AM1 kHz Performance criterion A

2-18



2.5.2 EMI

Conductive Emission Electromagnetic Interference

The indexes of conductive emission electromagnetic interference of the ZXMP S325 arelisted in Table 2-20.

Table 2-20 Conductive Emission Electromagnetic Interference

Threshold (dBV)Test Frequency (MHz)

Quasi-Peak Value Mean Value

0.15~0.5 79 66

0.5~30 73 60

These indexes satisfy the requirements specified in the international standard of CISPR 22 CLASSA.

Radiated Emission Electromagnetic Interference

The indexes of radiated emission electromagnetic interference of the ZXMPS325 are listedin Table 2-21.

Table 2-21 Radiated Emission Electromagnetic Interference

Quasi-Peak Wave Detection Limit (dBV/m)Test Frequency (MHz)

Test Distance: 10 m Test Distance: 3 m

30~230 40 50

230~1000 47 57

These indexes satisfy the requirements specified in the international standard of CISPR 22 CLASSA.

2.6 Optical Interface Specifications

2.6.1 Transmission Code PatternZXMP S325 employs the NRZ scramble code. Specification for the scramble complieswith the 7-class synchronous scrambler specified in the ITU-T Recommendation G.707.

2.6.2 Optical Modulesl Table 2-22 lists the STM-16 optical modules supported by ZXMP S325.

2-19



Table 2-22 STM-16 Optical Modules Supported by ZXMP S325

Optical ModuleType

Light NominalWavelength(nm)

TransmissionDistance (km)

Connector Type ServiceCapacity(Channel perboard)

S-16.1 1310 15 LC/PC 1

S-16.2 1550 15 LC/PC 1

L-16.1 1310 40 LC/PC 1

L-16.2 1550 80 LC/PC 1

L-16.2U 1550 150 LC/PC 1

CWDM nS1-2XX Compliant with

the ITU-T Rec-

ommendation

G.695

40 LC/PC 1

CWDM nL1-2XX Compliant with

the ITU-T Rec-

ommendation

G.695

80 LC/PC 1

l Table 2-23 lists the STM-4 optical modules supported by ZXMP S325.


Optical ModuleType




S-4.1 1310 15 LC/PC or SC/PC 123 or 4

L-4.1 1310 40 LC/PC or SC/PC 123 or 4

L-4.2 1550 80 LC/PC or SC/PC 123 or 4

Single-fiber

bidirectional

optical module

S-4.1

1310/1550 15 LC/PC or SC/PC 123 or 4

Single-fiber

bidirectional

optical module

L-4.1

1310/1550 40 LC/PC or SC/PC 123 or 4

l Table 2-24 lists the STM-1 optical modules supported by ZXMP S325.

2-20




Optical ModuleType




S-1.1 1310 15 LC/PC or SC/PC 123 or 4

L-1.1 1310 40 LC/PC or SC/PC 123 or 4

L-1.2 1550 80 LC/PC or SC/PC 123 or 4

Single-fiber

bidirectional

optical module

S-1.1

1310/1550 15 LC/PC or SC/PC 123 or 4

Single-fiber

bidirectional

optical module

L-1.1

1310/1550 40 LC/PC or SC/PC 123 or 4

2.6.3 Eye Diagram of Optical Transmit SignalsThe ZXMP S325 eye diagram conforms to the eye diagram mask of optical transmit signalas shown in Figure 2-2.

Figure 2-2 Mask of Eye Diagram for Optical Transmit Signal

General transmitter pulse shape characteristics include rise time, fall time, pulseovershoot, pulse undershoot, and ringing. All these may deteriorate the sensitivity of thereceiver and therefore should be restricted.

2-21



To prevent excessive deterioration of the receivers sensitivity, the waveform of transmitsignal should be limited. Therefore, the eye diagram mask sent at the transmit point S isspecified to regulate the pulse shape of optical transmit signal.

Systems at different STM levels should meet corresponding requirements for different eyediagram mask shapes. The eye diagram mask parameters are listed in Table 2-25.

Table 2-25 Parameters of Eye Diagram Mask for Optical Transmit Signal

Coordinate Relations of EyeDiagram Mask

STM-1 STM-4 STM-16

x1/x4 0.15/0.85 0.25/0.75 -

x2/x3 0.35/0.65 0.40/0.60 -

y1/y2 0.20/0.80 0.20/0.80 0.25/0.75

x3x2 - - 0.2

2.6.4 Mean Optical Launched PowerThe mean optical launched power parameters of the ZXMP S325 STM-N (N=1, 4, 16) arelisted in Table 2-26.

Table 2-26 STM-N Mean Optical Launched Power (dBm)

STM-1 STM-4 STM-16Index

S-1.1/

S-1.2

L-1.1/

L1.2

S-4.1/

S-4.2

L-4.1/L-

4.2

S-16.1/

S-16.2

L-16.1/L-16.2

/L-16.2U

nS1-2XX/

nL1-2XX

Mean opticallaunched power(dBm)

-15~-8 -5~0 -15~-8 -3~+2 -5~0 -2~+3 0~+5

2.6.5 Extinction RatioThe extinction ratios of the ZXMP S325 are listed in Table 2-27.

Table 2-27 Extinction Ratio of STM-N Optical Interfaces

STM-1 STM-4Index

S-1.1/S-1.2 L-1.1/L1.2 S-4.1/S-4.2 L-4.1/L-4.2

STM-16

Extinction ratio(dB)

8.2 10 8.2 10 8.2

2.6.6 Receiver SensitivityThe STM-N receiver sensitivities of ZXMP S325 are listed in Table 2-28.

2-22



Table 2-28 STM-N Receiver Sensitivity (Unit: dBm)

STM-1 STM-16Index

S-1.1/S-1.2 L-1.1/L-1.2/L-

1.3

STM-4

S-16.1/S-

16.2/nS1-2XX

L-16.

1

L-16.2/L-16.2U/

nL1-2XX

Receiver sensitivity(dBm)

-28 -34 -28 -18 -27 -28

BER=110-10

2.6.7 Receiver OverloadThe receiver overloads of ZXMP S325 are described in Table 2-29.

Table 2-29 STM-N Receiver Overload

STM-1 STM-16Index

S-1.1/S-1.2 L-1.1/L-1.2/L-1.3

STM-4

S-16.1/ S-16.2/

nS1-2XX

L16.1/L-16.2/L-

16.2U/ nL1-2XX

Overload (dBm) -8 -10 -8 0 -9

BER=110-10

2.6.8 Mean Optical Received PowerThe mean optical received power should be greater than the worst sensitivity and less thanthe overload of relevant optical boards.

ZXMP S325 conforms to the above specifications.

2.6.9 Permitted Frequency Deviation of Optical Input InterfacesThe permissible frequency deviation of the ZXMP S325 optical input interface is within 20 ppm (1 ppm=110-6).

2.6.10 AIS Rate of Optical Output InterfacesThe AIS rate deviation of the ZXMP S325 optical output interface is within 20 ppm (1ppm=110-6)

2.7 Electrical Interface Specifications

2.7.1 Code Patterns of Electrical InterfaceTable 2-30 lists the code patterns of electrical interface supported by the ZXMP S325.

2-23



Table 2-30 Code Patterns of Electrical Signal

ElectricalSignal Type

Bit Rate (kbit/s) Code PatternAbbreviation

Code Pattern Full Name

E0 64 AMI Alternate Mark Inversion

T1 1544 B8ZS Bipolar with 8-Zero Substitution

T3 44736 B3ZS Bipolar with 3-Zero Substitution

E1 2048

E3 34368

HDB3 High Density Bipolar of order 3

STM-1 (E) 155520 CMI Code Mark Inversion

2.7.2 Permitted Attenuation of Input Interfaces, FrequencyDeviation of Input Interfaces and Bit Rate Tolerance of OutputInterfaces

The permissible attenuation/frequency deviation of input interface and bit rate tolerancesof the ZXMP S325 output interface signals are listed in Table 2-31.

Table 2-31 Permitted Attenuation/Frequency Deviation of Input Interface, and Signal BitRate Tolerance of Output Interface

Interface Rate(kbit/s)

Permitted Attenuationof Input Interface (dB) (regular square rootattenuation)

Permitted FrequencyDeviation of InputInterface (ppm)

Permitted Bit ErrorTolerance of OutputInterface (ppm)

1544 0~6, 772 kHz Within 32 Within 32




155520 0~12.7, 78 MHz Within 20 Within 20

1 ppm=110-6

2.7.3 Reflection Attenuation of Input/Output InterfacesThe requirements on the reflection attenuation index of an input/output interface of theZXMP S325 are described in Table 2-32.

2-24



Table 2-32 Requirements on the Reflection Attenuation Index of an Input/OutputInterface

Interface bit rate (kbit/s) TestFrequencyRange(kHz)

Reflection Attenuation(dB)

51.2~102.4 12

102.4~2048 18

Input interface

2048~3072 14

51~102 6

2048

Output interface

102~3072 8

860~1720 12

1720~34368 18

Input interface

34368~51550 14

1720~51550 6

34368

Output interface

102~3072 8

860~1720 12

1720~34368 18

Input interface

34368~51550 14

1720~51550 6

44736

Output interface

102~3072 8

155520 Input/output

interface

8000~240000 15

2.7.4 Anti-Interference Capability of Input InterfacesTable 2-33 lists the anti-interference capability of ZXMP S325.

Table 2-33 Anti-interference Capability of ZXMP S325

Interface bit rate (Unit: kbit/s) Signal-to-noise Ratio (S/N) (Unit: dB)

2048 18

34368 20

2.7.5 Waveform of Output InterfacesThe waveforms of various electrical output interfaces of ZXMP S325 satisfy the templaterequirement of ITU-T G.703 Recommendation.

2-25



1544 kbit/s Electrical Interface

The output pulse mask of the 1544 kbit/s electrical interface is shown in Figure 2-3.

Figure 2-3 Output Pulse Mask at the 1544 kbit/s Electrical Interface


The output pulse mask of the 2048 kbit/s electrical interface is shown in Figure 2-4.

2-26





Figure 2-5 illustrates the output pulse mask of the 34368 kbit/s electrical interface.

2-27





illustrates the output pulse mask of 44736 kbit/s electrical interface.

2-28




155520 kbit/s Electrical Interfaces

Masks of pulsescorresponding to a binary 0 and a binary 1 at the 155520 kbit/s electricalinterface are respectively shown in Figure 2-7 and Figure 2-8.

2-29



Figure 2-7 Mask of a Pulse Corresponding to a Binary 0 at the 155520 kbit/s ElectricalInterface

Figure 2-8 Mask of a pulse Corresponding to a Binary 1 at the 155520 kbit/s ElectricalInterface

2.8 Interface Jitter Specifications

2.8.1 Jitter and Wander Tolerance of PDH Input InterfacesThe jitter and wander tolerance of ZXMP S325 PDH input interface is shown in Figure 2-9,and it meets the requirements listed in Table 2-34.

2-30



Figure 2-9 Jitter and Wander Tolerance of PDH Input Interface

Table 2-34 Jitter and Wander Tolerance of PDH Input Interface

UIp-p Frequency (Hz)InterfaceRate(kbit/s)

A0 A1 A2 A3 f10 f9 f8 f1 f2 f3 f4

Pseudo-randomSignal

1544 18 5 0.1 1.2

10-5 10 120 6k 40k

2048 36.9 1.5 0.2 18 4.88

10-30.01 1.66

7

20 2.4k 18k 100k 215-1

34368 618.6 1.5 0.15 100 1k 10k 800k 223-1

44736 18 5 0.1 1.2

10-5 10 600 30k 400k

2.8.2 Jitter and Wander Tolerance of SDH Input InterfacesThe input interfaces jitter and wander tolerance of the ZXMP S325 SDH terminalmultiplexer satisfies the requirements described in Figure 2-10, Table 2-35, and Table2-36.

The input interfaces jitter and wander tolerance of the ZXMP S325 SDH regeneratorsatisfies the requirements shown in Figure 2-11 and Table 2-37.

2-31



Figure 2-10 Jitter Tolerance of STM-N Terminal Multiplexer Input Interface

Table 2-35 Input Jitter and Wander Tolerance (UIP-P) of SDH Terminal Multiplexer

Interface A0 A1 A2 A3 A4

STM-1 (E) 2800 311 39 1.5 0.075

STM-1 (O) 2800 311 39 1.5 0.15

STM-4 (O) 11200 1244 156 1.5 0.15

STM-16 (O) 44790 4977 622 1.5 0.15

Table 2-36 Frequency (Hz) of Input Jitter and Wander Tolerance of SDH Terminal Multiplexer

Inter-face

f0 f12 f11 f10 f9 f8 f1 f2 f3 f4

STM-1

(E)

1.210-5 1.7810-4 1.610-3 1.5610-2 0.125 19.3 500 3.25k 65k 1.3M

STM-1

(O)

1.210-5 1.7810-4 1.610-3 1.5610-2 0.125 19.3 500 6.5k 65k 1.3M

STM-4

(O)

1.210-5 1.7810-4 1.610-3 1.5610-2 0.125 9.65 1000 25k 250k 5M

STM-16

(O)

1.210-5 1.7810-4 1.610-3 1.5610-2 0.125 12.1 5000 100k 1M 20M

2-32



Figure 2-11 Input Jitter Tolerance of STM-N SDH Regenerator

Table 2-37 Input Jitter Tolerances of STM-1, STM-4 and STM-16 Regenerators

STM Interface f1 (kHz) f2 (kHz) A1 (UIP-P) A2 (UIP-P)

A 65 6.5 0.15 1.5STM-1

B 12 1.2 0.15 1.5

A 250 25 0.15 1.5STM-4

B 12 1.2 0.15 1.5

A 1000 100 0.15 1.5STM-16

B 12 1.2 0.15 1.5

2.8.3 STM-N Interface Inherent Output Jitterl STM-N interface inherent output jitter of SDH equipment is defined as the jitter at the

STM-N output interface of the equipment when there is no input jitter. For the ADMand TM equipment of ZXMP S325, the STM-N interface inherent output jitter satisfiesthe requirements listed in Table 2-38.

Table 2-38 STM-N Interface Inherent Output Jitter Specifications of SDH Equipment

STM Interface Test Filter Peak-peak Jitter (UI)

500 Hz ~ 1.3 MHz 0.3STM-1

65 kHz ~ 1.3 MHz 0.1

1 kHz ~ 5 MHz 0.3STM-4

250 kHz ~ 5 MHz 0.1

5 kHz ~ 20 MHz 0.5STM-16

1 MHz ~ 20 MHz 0.1

Due to the randomness of jitter, the test value might exceed the specifications. It is acceptableas long as over 99% test values satisfy the specifications during the test (about 1 to 2 minutes).

l The STM-N network interface output jitter of SDH equipment is defined as the outputjitter value measured at the output interface of any STM-N level in the SDH network.

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For ADM and TM equipment of ZXMP S325, the STM-N network interface output jittersatisfies the requirements listed in Table 2-39.

Table 2-39 STM-N Network Interface Output Jitter Specifications of SDH Equipment

STM Interface f1 (Hz) f3 (Hz) F4 (MHz) B1 (UIp-p) B2 (UIp-p)

STM-1 optical

interface

500 65 k 1.3 1.5 0.15

STM-1 electrical

interface

500 65 k 1.3 1.5 0.075

STM-4 optical

interface

1 k 250 k 5 1.5 0.15

STM-16 optical

interface

5 k 1 M 20 1.5 0.15

Due to the randomness of jitter, the test value might exceed the specifications. It is acceptableas long as over 99% test values satisfy the specifications during the test (about 1 to 2 minutes).

l For REG equipment, when the test filter employs a 12 kHz high-pass filter, the rootmean square caused by jitter should be no more than 0.01 UI.

2.8.4 Mapping Jitter of PDH TributaryZXMP S325 The mapping jitter of the PDH tributary interface satisfies the requirementslisted in Table 2-40.

Table 2-40 Mapping Jitter of PDH Tributary Interface

High-Pass Filter, 20 dB/10 Octaves Mapping Jitter of MaximumPeak Value

G.703Interface(kbit/s)

Tolerance(ppm)

f1 (Hz) f3 (Hz) f4 (Hz) f1 ~ f4 f3 ~ f4

1544 22 10 8 k 40 k 0.7

2048 50 20 18 k 100 k To be

determined

0.075

34368 20 100 10 k 800 k To be

determined

0.075

44736 20 10 30 k 400 k 0.4 0.1

2.8.5 Combined JitterIn SDH system, generally there are both mapping jitter and pointer adjustment jitter. Thecombined jitter of these two jitters is called the combined jitter. The combined jitter of ZXMPS325 got from various test sequences should satisfy the specifications listed in Table 2-41,Table 2-42, and Table 2-43.

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Table 2-41 E1/E3 Combined Jitter Specifications

High-Pass Filter 20 dB/10Octaves

Maximum Peak-Peak Value Combined Jitter UIp-pPDH In-terface(kbit/s)

Bit RateToler-ance(ppm)

f1 (Hz) f3 (Hz) f4 (Hz) UIp-p (f1 ~ f4) UIp-p (f3 ~ f4)

2048 50 20 18 k 100 k 0.4 0.4 0.4 0.075 0.075 0.075

34368 20 100 10 k 800 k 0.4 0.4 0.4 0.75 0.075 0.075 0.075 0.075

Test sequence a b c d a b c d

Table 2-42 T1 Combined Jitter Specifications

High-Pass Filter 20dB/10 Octaves

Maximum Peak-Peak Value Combined Jitter UIp-pPDHInter-face(kbit/s)

BitRateToler-ance(ppm)

f1(Hz)

f3 (Hz) f4(Hz)

UIp-p (f1 ~ f4) UIp-p (f3 ~f4)

1544 32 10 8 k 40 k 1.3 1.3 1.9 1.9 To be de-

termined

Test sequence e h,

periodic

and

regular

h,

periodic

and

added

h, pe-

riodic

and can-

celled

Table 2-43 T3 Combined Jitter Specifications

High-PassFilter 20dB/10Octaves


BitRateToler-ance(ppm) f1

(H-z)

f3(H-z)

f4 (Hz)


44736 20 10 30

k

40

0 k

0

.

7

1

.

3

1 1.3 1.3 1 1.3 1.3 To be de-

termined

2-35



High-PassFilter 20dB/10Octaves


BitRateToler-ance(ppm) f1

(H-z)

f3(H-z)

f4 (Hz)


Test sequence e f h,

peri-

odic

and

reg-

u-

lar (

87-3

co-

de

pat-

tern)

h,

peri-

odic

and

reg-

u-

lar (

87-3

co-

de

pat-

tern)

h,

peri-

odic

and

can-

cel-

led (

87-3

code

pat-

tern)

h,

peri-

odic

and

reg-

ular

h,

peri-

odic

and

add-

ed

h,

peri-

odic

and

can-

cel-

led

-

2.8.6 Jitter Transfer Characteristic of RegeneratorThe jitter transfer characteristic of the ZXMP S325 SDH regenerator is shown in Figure2-12. The parameters of the jitter transfer characteristic of regenerator are listed in Table2-44.

Figure 2-12 Jitter Transfer Characteristic of Regenerator

Table 2-44 Parameters of Jitter Transfer Characteristic of Regenerator

STM-N fc (kHz) P (dB)

A 130 0.1STM-1

B 30 0.1

2-36



STM-N fc (kHz) P (dB)

A 500 0.1STM-4

B 30 0.1

A 2000 0.1STM-16

B 30 0.1

2.9 Clock SpecificationsTiming Principles

The component closest to the SDH network synchronization performance is the clock unit.ITU-T Recommendations specify three types of clocks:

l ITU-T G.811 specifies the primary reference clock.l ITU-T G.812 specifies slave clocks at different levels.l ITU-T G.813 specifies the slave clock of SDH equipment.

All the timings of SDH system should conform to the primary reference clock (PRC)described in G.811.

Output Jitter

When there is no input jitter, the inherent jitter of the 2MHz or 2Mbit/s clock output interfacein ZXMP S325 should not exceed 0.05 UIP-P. The test is conducted at the time interval of60 s, using a single pole bandpass filter with 20 Hz and 100 kHz turnover frequencies.

Permissible Input Interface Attenuation/Frequency Deviation and Others

The specifications of permissible input interface attenuation/frequency deviation of theZXMP S325 clock are listed in Table 2-45.

Table 2-45 Specifications of Permissible Input Interface Attenuation/FrequencyDeviation and Others

Item Specification

Permissible input

interface attenuation

The attenuation characteristic introduced by the input interface signal

complies with the frequency square root rule. When using cables with

attenuation range of 0 dB ~ 6 dB, no bit error or clock lock loss occurs in

the equipment.

Permissible input

interface frequency

deviation

4.6 ppm

Signal bit rate tolerance of

the output interface

4.6 ppm

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Item Specification

Output interface

waveform

Conforms to the relevant templates specified in ITU-T G.703

1 ppm=110-6

Switching of Timing Reference SourcesZXMP S325 is equipped with more than one external timing reference input. When theselected timing reference fails, the SDH equipment can automatically switch to anothertiming reference input using the S1 byte.

Note:

For 2 Mbit/s external timing source, the timing reference failure refers to the signal loss ofsynchronous clock input interface; for the timing recovery through STM-N line signals, thetiming reference failure refers to the loss of STM-N signals that bear timing signals, or theAIS occurrence.

Long-term Phase Variation in Locked ModeThe long-term phase variation in the locked mode is generally expressed by the MaximumTime Interval Error (MTIE) and Time Deviation (TDEV).

ZXMP S325 satisfies the requirements listed in Table 2-46, Table 2-47, and Table 2-48.

Table 2-46 Wander Limit at Constant Temperature (MTIE)

MTIE Limit Observation Interval

40 ns 0.1 s


TDEV Limit Observation Interval

6.4 ns 100 s


l OPA: 1-channel pre-amplifier

Table 2-49 lists the specifications of OBA board.

Table 2-49 Types and Specifications of OBA Board

Index Unit OBA12 OBA14 Remark

Working wavelength nm 1530~1562 1530~1562 -

Optical received power range dBm -12~+4 -12~+4 -

Optical launched power (typical

value)

dBm 12 14 -

Adjustment range of optical

launched power

dB 9~12.5 11~14.5 Can be directly

adjusted.

Output controllable precision dB 0.5 0.5 -

Optical launched power in

Eyesafe (APR) mode

dBm


2.11 Ethernet Performance Specifications

2.11.1 Transparent Transmission Performance Specifications

Maximum and Minimum Frame Lengths

The frame lengths that can be processed by the smart fast Ethernet board (SFEx6), theenhanced smart Ethernet board (SED), the embedded RPR processor board (RSEB), andthe Ethernet transparent transmission board (TFEx8) of ZXMPS325meet the requirementslisted in Table 2-51.

Table 2-51 Specifications of Frame Length

Ethernet Board Minimum Frame Length (byte) Maximum Frame Length(byte)

SFEx6 64 1522

SED 64 1522 (1600 with Jumbo frame

enabled)

RSEB 64 1522 (1600 with Jumbo frame

enabled)

TFEx8 64 1522 (1600 with Jumbo frame

enabled)

Board Throughput

l For the ZXMP S325, when the ports of smart fast Ethernet board (SFEx6) areconfigured with 46 VC-12s, the port throughput can reach the line speed of 100Mbit/s.

l When the enhanced smart Ethernet board (SED) is configured with GE services, theport throughput can reach the line speed of 1 Gbit/s.

l When the RSEB board is configured with GE services, the port throughput can reachthe line speed of 1 Gbit/s.

l When the ports of Ethernet transparent transmission board (TFEx8) are configuredwith 63 VC-12s, the port throughput can reach the line speed of 100 Mbit/s.

Note:

The flow control function of port must be disabled while testing the port throughput.

2-41



Packet Loss Ratio

Packet loss ratio refers to the maximum acceptable packet loss ratio under the prerequisitethat data is normally received. There is no specific criterion for packet loss ratio. However,it should be as low as possible and close to zero under certain conditions.

Note:

The flow control function of port must be disabled when conducting the packet loss ratiotest.

Delay

Delay refers to the maximum acceptable delay under the prerequisite that data is normallyreceived. There is no specific criterion for delay. However, it should be as small as possibleunder certain conditions.

2.11.2 VLAN Specifications

Specification of VLAN Basic Function

The basic function of VLAN refers to the function of the tag-based VLAN that complieswith the IEEE 802.1Q standard. Through the network management configuration, theSmart Fast Ethernet board (SFEx6), the enhanced smart Ethernet board (SED), and theembedded RPR processor board (RSEB) of ZXMP S325 supports this function.

Trunk Specification

Trunk refers to the transmission of large-capacity Ethernet services by binding multipleEthernet interfaces. The Ethernet ports in the same Trunk group have the same VLANconfiguration attributes. They cannot interwork with the Ethernet ports that do not belongto the same Trunk group.

l The SFEx6 board supports two trunk groups at most at the user side, and each groupcan support one to four Ethernet ports.

l The SED board supports ten trunk groups at most at the user side, and each groupcan support one to four Ethernet ports. The SED board supports eight trunk groupsat most at the system side, and each group can support two, four, or eight Ethernetports.

l The RSEB board can support three trunk groups at most at the user side. Whensupporting two trunk groups, one trunk group supports tow Ethernet ports, and theother trunk group supports four Ethernet ports; when supporting three trunk groups,each trunk group supports two Ethernet ports.

2-42



Quantity of VLAN IDs

In IEEE 802.1Q standard, a header of four bytes is defined as a VLAN ID. Each port canbelong to multiple VLANs.

The smart fast Ethernet board (SFEx6), the enhanced smart Ethernet board (SED), andthe embedded RPR processor board are able to recognize C-VLAN IDs that comply withIEEE 802.1Q standards. The range of VLAN ID is 1 to 4094.

VLAN Priority

Under the prerequisite that the QoS function is enabled, when services from multiplesources are converged at one transmit port, the port can transmit these services accordingto the preset VLAN priorities and bandwidths. Once the total traffic exceeds the transmitbandwidth of the port, the port will discard the services with lower priorities and overbandwidth limit, to ensure the normal transmission of services with higher priorities.

The SFEx6 board, the SED board, and the RSEB board of ZXMP S325 support theconfigurations of VLAN priority and bandwidth proportion.

2.11.3 L2 Switching Specifications

Security Filtering Characteristics

The security filtering characteristics include the static MAC address setting, MAC addressfiltering, and broadcast address filtering.

l Setting of static MAC address

Manually add a MAC address and the information of the corresponding port into theMAC address list. Only the receive port which has been set can receive the trafficnormally without any packet loss.

The SFEx6 board and the RSEB board of ZXMP S325 support this function by theconfiguration of EMS.

l MAC address filtering

Filter frames that have a MAC address as the source address or the destinationaddress by adding the MAC address manually into the MAC address list. The portthat has been set cannot receive any traffic.

Through network management configurations, the SFEx6 board and the RSEB boardof ZXMP S325 support this function.

l Broadcast address filtering

A broadcast address is a MAC address of all Fs. It may increase network load andcause path congestion. Broadcast address filtering can prevent path congestion.

Through network management configurations, the SFEx6 board, the SED board andthe RSEB board of ZXMP S3

Documents

SJ-20120320184105-002-Unitrans ZXMP S325 (V2.20) SDH Based Multi-Service Node Equipment Product Description.pdf