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©2018 by System Plus Consulting | Littelfuse LCIS1MO120E0080 1
Littelfuse LSIC1MO120E0080 1200V SiC MOSFET in TO-247 PackagePower Semiconductor report by Farid HamraniApril 2018 - sample
©2018 by System Plus Consulting | Littelfuse LCIS1MO120E0080 2
SUMMARY
Overview / Introduction 3
o Executive Summary
o Reverse Costing Methodology
Company Profile 8
o Littlefuse Inc
Physical Analysis 11
o Synthesis of the Physical Analysis
o Package analysis
Package opening
Package Cross-Section
o MOSFET Die
MOSFET Die View & Dimensions
MOSFET Die Process
MOSFET Die Cross-Section
MOSFET Die Process Characteristic
MOSFET Manufacturing Process 32
o MOSFET Die Front-End Process
o MOSFET Die Fabrication Unit
o Final Test & Packaging Fabrication unit
Cost Analysis 41
o Synthesis of the cost analysis
o Yields Explanation & Hypotheses
o MOSFET die
MOSFET Front-End Cost
MOSFET Die Probe Test, Thinning & Dicing
MOSFET Wafer Cost
MOSFET Die Cost
o Complete MOSFET
Assembled Components Cost
Synthesis of the assembly
Component Cost
Price Analysis 52
o Estimation of selling price
Company services 55
©2018 by System Plus Consulting | Littelfuse LCIS1MO120E0080 3
Overview / Introductiono Executive Summaryo Reverse Costing
Methodology
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
The reverse costing analysis is conducted in 3 phases:
Teardown analysis
• Package is analyzed and measured• The dies are extracted in order to get overall data: dimensions, main blocks, pad number and pin out, die marking• Setup of the manufacturing process.
Costing analysis
• Setup of the manufacturing environment• Cost simulation of the process steps
Selling price analysis
• Supply chain analysis• Analysis of the selling price
Executive Summary
©2018 by System Plus Consulting | Littelfuse LCIS1MO120E0080 4
PHYSICALANALYSIS
©2018 by System Plus Consulting | Littelfuse LCIS1MO120E0080 5
Overview / Introduction
Company Profile & SupplyChain
Physical Analysiso Synthesiso Packageo Die designo Die Cross-Section
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Package characteristics
©2018 by System Plus Consulting | Littelfuse LCIS1MO120E0080 6
Overview / Introduction
Company Profile & SupplyChain
Physical Analysiso Synthesiso Packageo Die designo Die Cross-Section
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Package Cross-Section – Views and Dimensions
Package cross section
Solder and Leadframe Measures
©2018 by System Plus Consulting | Littelfuse LCIS1MO120E0080 7
Overview / Introduction
Company Profile & SupplyChain
Physical Analysiso Synthesiso Packageo Die designo Die Cross-Section
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Die cross section
Gate Contact Configuration
Al contact
P+ Implant N+ Implant
6.15 µm
P- Implant
©2018 by System Plus Consulting | Littelfuse LCIS1MO120E0080 8
MANUFACTURINGPROCESS FLOW
©2018 by System Plus Consulting | Littelfuse LCIS1MO120E0080 9
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flowo MOSFET Process Flowo MOSFET Fab Unito Packaging Fab Unit
Cost Analysis
Selling Price Analysis
About System Plus
MOSFET Process Flow (2/4)
Implantations
•SiO2 deposition•Pattern SiO2•P+ source
implantation•Recess etching
Gate Oxide
•Gate Oxide deposition and pattern
Gate poly
•Polysilicon deposition and pattern (gate)
00 00 000
00 00 000
00 00 000
Drawing not to Scale
©2018 by System Plus Consulting | Littelfuse LCIS1MO120E0080 10
C O S TANALYSIS
©2018 by System Plus Consulting | Littelfuse LCIS1MO120E0080 11
Overview / Introduction
Company Profile & SupplyChain
Physical Analysis
Manufacturing ProcessFlow
Cost Analysiso Synthesiso Die Costo Packaging Costo Component Costo Cost Evolution
Selling Price Analysis
About System Plus
MOSFET Wafer Cost per process steps
©2018 by System Plus Consulting | Littelfuse LCIS1MO120E0080 12
Overview / Introduction
Company Profile & SupplyChain
Physical Analysis
Manufacturing ProcessFlow
Cost Analysiso Synthesiso Die Costo Packaging Costo Component Costo Cost Evolution
Selling Price Analysis
About System Plus
MOSFET Die Cost
©2018 by System Plus Consulting | Littelfuse LCIS1MO120E0080 13
Overview / Introduction
Company Profile & SupplyChain
Physical Analysis
Manufacturing ProcessFlow
Cost Analysiso Synthesiso Die Costo Packaging Costo Component Costo Cost Evolution
Selling Price Analysis
About System Plus
Packaging Cost
©2018 by System Plus Consulting | Littelfuse LCIS1MO120E0080 14
SELLINGP R I C E
©2018 by System Plus Consulting | Littelfuse LCIS1MO120E0080 15
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Estimated Manufacturer Price
