the layer in a substantially stationary posi- tion until a metal layer of sufficient thick- ness is deposited and then the remaining metallization liquid is removed.

Selective Plating Process U.S. Patent 5,403,650. Apr. 4, 1595 D. W. Baudrand, Lincolnshire, 111.

A process for chemically and electro- lessly selectively depositing a high-purity nickel-boron alloy as a uniform and essen- tially crack-free layer over an existing met- allurgy pattern on the top side surface of a dielectric ceramic subsrate in an integrated circuit semiconductor assembly.

Polyurethane Self-Priming Topcoats U.S. Patent 5,403,880. Apr. 4, 1995 CR. Hqedus e! al., assignors to The United States of America as represented by the Secretary of the Navy, Washington

A corrosion-resistant self-priming coat- ing comprising 15 to 50 parts by weight of a polyurethane binder, 1 to 30 parts by weight of an alkaline earth metal phos- phate, 0.1 to 5.0 parts by weight of a zinc

benzoate, 1 to 25 parts by weight of an aluminum triphosphate, l-30 parts by weight of titanium dioxide, 0 to 2.0 parts by weight of an oil-soluble surface active agent, and 0 to 50 parts by weight of at least one organic solvent.

Sputtering U.S. Patent 5,403,663. Apr. 4, 1995 E. Sichmann et al, assignors to Leybold AG, Hanau, Germany

A coated substrate comprising a polycar- bonate substrate with an aluminum alloy coating having improved adhesion and cor- rosion resistance sputtered directly thereon, said coating consisting of 0.5-2.0% silicon and 99.5-98.0% aluminum.

Anodized Aluminum Electronic Package Components U.S. Patent 5,403,975. Apr. 4, 1995 A.M. Pasqualoni et a/., assignors to Olin Corp., New Haven, Conn.

An electronic package component, com- prising an aluminum alloy substrate having a first and an opposing second surface and sides; a black integral anodization layer

coating on at least the second surface and the sides having pores Owith an average diameter of 50 to 500 A and an average macroscppic surface roughness in excess of 4,000 A; an integrated circuit device bonded to the aluminum alloy substrate; and a bonding agent in contact with a por- tion of the first surface.

Electrostatic Spray Gun U.S. Patenr5,405,090. Apr. II, 1995 R.H. Greene and A.C. Outhwaite, assignors fo The Morgan Crucible Co., PLC, England

An electrostatic spray gun comprising a housing; a handle adjacent the housing; a replaceable, collapsible container receiv- able in the housing; a nozzle in communi- cation with the container for spraying .fluid from the container; a delivery valve having inner and outer valve members; a squeeze gripping means mounted on the housing for transmitting a compressive force to the container to deliver fluid to the nozzle; and a high voltage generator for applying elec- trostatic potential to the fluid such that the fluid emerges from the nozzle in the form of an electrically charged atomized spray.

With Schaffner rapid exchange cartridge and stack buffs. Unitized pre-com- pressed balanced stack and cartridge buffs offer quick change-overs, and many components are recyclable. Schaffner manufacturers to customer specification and all Buffing Wheels are produced in a SPC environment.

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