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From Technologies to Markets
© 2019
From Technologies to Markets
Status of the CMOS Image Sensor Industry
2019
Market and Technology
Report 2019
Sample
22
Glossary 2
Table of contents 3
Report objectives 5
Report methodology & definitions 7
About the authors 9
Companies cited in this report 10
What does our analysis cover 11
What we got right, what we got wrong 12
Who should be interested in this report 14
Executive summary 15
1. Introduction 30
o Market segmentation
o Historical perspective
o CMOS image sensor landscape, by player
o CMOS image sensor landscape, by application
o CMOS image sensor technology shift - CMOS vs. CCD
o CMOS image sensor technology shift - BSI vs. FSI
o CMOS image sensor technology shift - 300mm vs. 200mm
2. Market forecast 44
o 2018 CIS revenue breakdown, by market
o CIS volume shipment forecast 2012 - 2024
o CIS revenue forecast 2012 - 2024
o CIS average selling price forecast 2012 - 2024
o CIS wafer production forecast 2012 - 2024
3. Ecosystem 57
o 2018 M&A activity in CIS
o CMOS image sensor – M&A historical timeline
o CMOS image sensor - competitive landscape
o CMOS image sensor - ecosystem
o CIS players - geographic mapping
o CIS foundries - geographic mapping
4. Players & rankings 67
o 2018 CIS revenue rankings, by player
o 2018 CIS production rankings, by foundry
o 2018 CIS player activity breakdown
o 2018 CIS mobile market revenue breakdown, by player
o 2018 CIS photography market revenue breakdown, by player
o 2018 CIS tablet market revenue breakdown, by player
o 2018 CIS laptop PC market revenue breakdown, by player
o 2018 CIS medical X-ray market revenue breakdown, by player
o 2018 CIS security & surveillance market revenue breakdown, by player
o 2018 CIS machine vision market revenue breakdown, by player
Status of the CMOS Image sensor Industry 2019 | Sample | www.yole.fr | ©2019
TABLE OF CONTENTS
Part 1/2
33
5. Mobile market trends 80
o Consumer electronics volume forecast
o Consumer electronics revenue forecast
o Who can afford a smartphone?
o Revenue comparison
o Mobile market volume forecast, by phone type
o Mobile market volume forecast, by player
o Market drivers
o Mobile resolution mix - forecast
o Dual-camera rollout scenario
o 3D camera applications
o Mobile market trends
6. Other consumer market trends 105
o Consumer photography volume forecast
o Action camera & drone volume forecast
o 360°camera trends
o AR/VR headset volume forecast
o AR/VR headset trends
o Wearables volume forecast
o Consumer drone volume forecast
o Consumer robotics volume forecast
o Computing volume forecast
8. Automotive market trends 123
o Light-vehicle volume forecast
o Automotive imaging trends
o Automotive camera volume forecast
o Robotic vehicle trends
9. Other high-end market trends 143
o Medical CIS volume forecast
o Medical CIS trends
o Security & surveillance volume forecast
o Machine vision volume forecast
10. Technology trends 160
o Pixel/resolution/optical format
o From FSI to BSI to stacked BSI
o Hybrid stack/multi-stack
o 3D imaging & sensing
o Technology, by players
Conclusions 194
Yole Développement presentation 211
Status of the CMOS Image sensor Industry 2019 | Sample | www.yole.fr | ©2019
TABLE OF CONTENTS
Part 2/2
4
REPORT OBJECTIVES
Status of the CMOS Image sensor Industry 2019 | Sample | www.yole.fr | ©2019
1. Provide market data on key CIS metrics and dynamics
o CIS revenue forecast, volume shipments, and component share
o Market shares, with detailed breakdown by player
o Application focus on key growth areas for CIS : Mobile, 3D sensing,Automotive
2. Deliver an in-depth understanding of the CIS value chain, infrastructure, and players
o Who are the CIS players (Foundries, Design Houses, IDM, Vendors, ODM…), and how they are related?
o Who are the key suppliers to watch - and more generally, how will the image sensor industry evolve?
3. Present key technical insight and analysis regarding future technology trends and challenges
o Manufacturing technologies: design structure
o Device technologies: CIS applications across markets
o Technology focus on game-changing areas like 3D semiconductor stacking
55Status of the CMOS Image sensor Industry 2019 | Sample | www.yole.fr | ©2019
A COMPLETE SET OF PRODUCTS & SERVICES TO ANSWER YOUR NEEDS
WEEKLY
TRACKS
Insight
› Teardowns of phones, smart
home, wearables and automotive
modules and systems
› Bill-of-Materials
› Block diagrams
Format
› Web access
› PDF and Excel files
› High-resolution photos
Topics
› Consumer: Smartphones, smart
home, wearables
› Automotive: Infotainment, ADAS,
Connectivity
175+ teardowns per year125+ reports per year
YEARLY
REPORTS
Insight
› Yearly reports
› Market, technology and strategy
analysis
› Supply chain changes analysis
› Reverse costing and reverse
engineering
Format
› PDF files with analyses
› Excel files with graphics and data
Topics
› Photonics, Imaging & Sensing
› Lighting & Displays
› Power Electronics & Battery
› Compound Semiconductors
› Semiconductor Manufacturing and
Packaging
› Computing & Memory
115+ reports per year
SERVICES
QUARTERLY
MONITORS
Insight› Quarterly updated market data and
technology trends in units, value
and wafer
› Direct access to the analyst
Format› Excel files with data
› PDF files with analyses graphs and
key facts
› Web access (to be available soon)
Topics› Advanced Packaging
› Application Processor
› DRAM
› NAND
› Compound Semiconductor
› CMOS Image Sensors
› Smartphones
7 different monitors
quarterly updated
CUSTOM
SERVICE
Insight
› Specific and dedicated projects
› Strategic, financial, technical, supply
chain, market and other
semiconductor-related fields
› Reverse costing and reverse
engineering
Format
› PDF files with analyses
› Excel files with graphics and data
Topics
› Photonics, Imaging & Sensing
› Lighting & Displays
› Power Electronics & Battery
› Compound Semiconductors
› Semiconductor Manufacturing and
Packaging
› Computing & Memory
190 custom projects
per year
6
METHODOLOGY & DEFINITIONS
Status of the CMOS Image sensor Industry 2019 | Sample | www.yole.fr | ©2019
Market segmentation
volume (in Munits),
ASP (in $),
revenue (in $M)
Yole’s market forecast model is based on matching heterogeneous sources:
Information
aggregation
Preexisting
information
Forecast
Reconciliation
Bottom-up
approach
Top-down
approach
77
Pierre Cambou
Pierre Cambou MSc, MBA, is a Principal analyst in the Photonic and Display Division atYole Développement (Yole).
Pierre’s mission is dedicated to imaging related activities by providing market & technology analyses along with strategyconsulting services to semiconductor companies. He is responsible for the CIS Quarterly Market Monitor while he has authoredmore than 15 Yole Market & Technology reports. Known as an expert in the imaging industry, he is regularly interviewed andquoted by leading international media.
Pierre has an Engineering degree from Université de Technologie de Compiègne (France) and a Master of Science from VirginiaTech. (VA, USA), Pierre also graduated with an MBA from Grenoble Ecole de Management (France).
Contact: [email protected]
Chenmeijing Liang
Chenmeijing Liang works as a Technology & Market Analyst within the Photonics, Sensing & Display Division at YoleDéveloppement (Yole). As part of the Imaging team, Chenmeijing contributes daily to analyses of CIS markets, relatedtechnologies and market strategies of the leading semiconductor companies, as well as the quarterly Monitor. Prior to Yole,Chenmeijing was engaged in the development of R&D projects, as a member of Group PSA R&D department where she workedonVehicle 3D Holography Imaging projects. In addition, she assisted with various technical and commercial projects.
Chenmeijing Liang holds a Master’s Degree in the field of Applied Physics and Optical Engineering from Paris-Saclay Universityand University Pierre and Marie Curie (UPMC) (Paris, France).
Contact: [email protected]
Status of the CMOS Image sensor Industry 2019 | Sample | www.yole.fr | ©2019
Biographies and Contacts
ABOUT THE AUTHORS
8
Almalence, Ambarella, Apple, Ams, Arm, Axis, Basler, Bosch, Brigates, BYD, Caeleste, Canon, Clairpixel, Cmosis,
Cognex, Continental, Core Photonics, CSEM, Dahua, DB Hitek, DXO Mark, Espros Photonics, Evg, Excelitas
Technologies, Fairchild Imaging, Flir, Forza Silicon, Fotonic, Foxconn, Fraunhofer, Fujitsu, Fujifilm, GalaxyCore, Given
Imaging, GoPro, Gpixel, Grass Valley, Hamamatsu, Hasselblad, Himax Imaging, HikVision, Honeywell, Hoya, HTC,
Huawei, Image Lab, IMEC, Infineon, Invisage, Kingpak, Konica Minolta, Lattice, Leap Motion, Leica, Lenovo, LG,
Luxima, Magna, MantisVision, Medigus, Melexis, Microsoft, Mobileye, Movidius, New Imaging Technologies, Nikon,
NXP, Nvidia, Olympus, Omnivision, Omron, ON Semiconductor, Panasonic, PerkinElmer, Philips, Pixart, PixelPlus,
Pelco, PMD Technologies, Pyxalis, Raytrix, Rosnes, Red, Samsung, Sanei Hytech, Sharp, Silicon Optronics, Sirona, SK
Hynix, SMIC, Siemens, Smartsens, Socionext, Soitec, Sony, STMicroelectronics, SuperPix, Teledyne, Teradyne, Trixell,
TSMC, TowerJazz, TPSCo, UMC, Valeo, Videantis, Viimagic, WLCSP, Xiaomi, X-Fab, Xintec, Xperi, ZTE, and more.
Status of the CMOS Image sensor Industry 2019 | Report | www.yole.fr | ©2019
COMPANIES CITED IN THIS REPORT
9
WHAT WE GOT RIGHT, WHAT WE GOT WRONG
Technology and market forecast - challenge
What we got right
o CIS’ steady growth
o Proliferation of cameras in mobile, automotive and security
o Automotive’s emergence as a key CIS market
o Security’s emergence as a key CIS market
o Emergence of smart home devices and robotics
Status of the CMOS Image sensor Industry 2019 | Sample | www.yole.fr | ©2019
What we got wrong
o Mobile front cameras impacted by the edge-lessdisplay trend :
• Front 3D sensing is stalling
• Under-display optical fingerprint gainsmomentum
o Mobile rear cameras driven by photography
• Rear 3D sensing gets high momentum
o Consumer drone market is down
10
WHAT DOES OUR ANALYSIS COVER?
From wafer to the first packaged sensor
Analysis at the component level.
Status of the CMOS Image sensor Industry 2019 | Sample | www.yole.fr | ©2019
Courtesy of Omnivision
Courtesy of Valeo
Courtesy of Sony
Courtesy of Tesla
Camera
modules
SystemsImage
sensors
Courtesy of Xiaomi
CIS
die
Courtesy of Sony
CIS
wafer
Courtesy of Apple
Market report focus Market analysis only
11
WHAT WE GOT RIGHT, WHAT WE GOT WRONG
Yole’s CIS forecasts over the years
Yole is again upping its forecast for CMOS image sensors.
Driven mostly by multi-camera approaches and the introduction of new sensors in smartphones, 2018 CIS revenue was correctly predicted by our forecast.
Yole is upping its forecast for the next 5 years.
Status of the CMOS Image sensor Industry 2019 | Sample | www.yole.fr | ©2019
12
2019 CMOS IMAGE SENSOR INDUSTRY STATUS REPORT
Not deviating from last year’s forecast in the “Status of CIS industry 2018”, the CIS industry has ended upwhere analysts thought the market would be at this time of year. It successfully achieved 11% YoY growthamid a global semiconductor recession.
This performance is mainly due to the sustainability of the mobile market. Globally the CMOS ImageSensor industry thrived. In 2018, the industry reached the $15.5B revenue mark and Yole’s expectation isfor 8.1% CAGR for 2018 – 2024. Revenue should hit $24B in just five years. At the beginning of 2019,security and automotive became the second and third largest CIS market segments.
With regard to end-products, it seems that “all markets except mobile” are on a downward slope:consumer photography (DSC, DSLR, action cameras, drones) and computing (PC, laptop, tablets) have beensliding since 2012; the automotive and industry market downturn has also been influenced by the knock-on effect brought by the China-US trade war; nevertheless positive news from China shows that growthcould resume in 2020 as the market seems to have bottomed.
Having reached $15.5B, CMOS image sensors are now highly-visible semiconductor products.
Status of the CMOS Image sensor Industry 2019 | Sample | www.yole.fr | ©2019
13
2018 CIS MARKET BREAKDOWN
by market (in $M)
2018CIS revenue breakdown.
Status of the CMOS Image sensor Industry 2019 | Sample | www.yole.fr | ©2019
2017 2018 YoY(%)
2017$13.9B
2018$15.5B
Yole Développement © October 2019
Revenue ($M)
14
2018 CIS REVENUE MARKET SHARES
by player (in $M)
The top four players own 75% of the CIS market.
Status of the CMOS Image sensor Industry 2019 | Sample | www.yole.fr | ©2019
Yole Développement © October 2019
2017$13.9B
2018$15.5B
2017 2018 YoY(%)Revenue ($M)
15
CIS WAFER PRODUCTION FORECAST 2014 - 2024
by technology (in kW 12” eq.)
CIS is now mainly produced using 3D stacked technology.
Status of the CMOS Image sensor Industry 2019 | Sample | www.yole.fr | ©2019
2014 2015 2016 2017 2018 2019e 2020e 2021e 2022e 2023e 2024e
BSI Multistack TSV - - - 31 65 332 606 850 1 024 1 152 1 329
BSI Stacked Hybrid - - 42 183 695 747 808 920 1 060 1 152 1 130
BSI Stacked TSV 325 650 921 1 070 792 714 606 531 475 461 436
BSI 838 719 618 549 487 395 334 304 295 290 298
FSI 1 126 922 741 608 487 431 408 406 385 387 433
TOTAL 2 289 2 291 2 322 2 440 2 526 2 620 2 762 3 012 3 240 3 442 3 625
YoY (%) 17% 0% 1% 5% 4% 4% 5% 9% 8% 6% 5%
0
500
1 000
1 500
2 000
2 500
3 000
3 500
4 000
k W
afer
( 12"
eq)
2014 - 2024 CIS W afer production (in kW 12"eq.)by technology
16
CMOS IMAGE SENSOR LANDSCAPE
2018 market landscape, by application
While feature-phone cameras are slowly retreating, rear and front cameras for smartphones remain the key applications for CMOS image sensors.
Automotive ADAS image sensors have quickly established themselves as a dynamic application, along with surveillance.
Mobile is king,but it is not alone.
Status of the CMOS Image sensor Industry 2019 | Sample | www.yole.fr | ©2019
$5.9B
$2.7B
$0.4B
Low End
High End
Mobile
Yole Développement © 2018
17
MOBILE MARKET TREND
More cameras, probably different types
If the current trend continues, we are heading toward 8 cameras per smartphone!
Status of the CMOS Image sensor Industry 2019 | Sample | www.yole.fr | ©2019
Total rear
cameras
Total front
cameras
Smartphone
Front
2017 2018 2019 2020e 2021e 2022e
# of cameras
2023e
Smartphone
Rear
TOTAL
cameras
Dual cameras
+1
Front 3D
sensing
+1
2 2 3 3 4 4 5 ???
2 2 3 3 4 41
Triple
cameras
+1 Rear 3D
sensing
+1 Multi-
spectral?
+1
Optical
fingerprint
+1(event based)
Neuromorphic?
+1
3 4 5 6 7 8 ???
Flagship smartphone - configuration scenario
Courtesy
of Light
2024e
18
MOBILE MARKET TREND
Number of cameras per smartphone (market average - in units per smartphone)
The introduction of dual/triple front and back cameras, as well as the revolution in sensing cameras, is increasing the number of cameras per smartphone.
An average of four cameras per phone by 2024.
Status of the CMOS Image sensor Industry 2019 | Sample | www.yole.fr | ©2019
Yole Développement © October 2019
19
CMOS IMAGE SENSOR - COMPETITIVE LANDSCAPE 2018
Status of the CMOS Image sensor Industry 2019 | Sample | www.yole.fr | ©2019
CIS players
Suppliers
Design tools & IP
Equipment & Materials
Packaging & test service
New entrants
Substitute technologies
Buyers
OEM
Camera module players
Foundry service
MV & other
2020Status of the CMOS Image sensor Industry 2019 | Sample | www.yole.fr | ©2019
MOBILE TECHNOLOGY TREND
BSI opened the way to 3D semiconductors to BSI, to multi-stacked BSI - pixel level
Backside
illumination
will
enable ~
100% fill-
factor!
Front-side
illuminated
(FSI)
TSV
stack
Silicon bulk Silicon bulk
Backside
illuminated
(BSI)
Silicon bulk
2008 2010 2014
Backside
illumination
will
enable ~
100% fill-
factor!
Hybrid
stack
Silicon bulk
2016
Backside
illumination
will
enable ~
100% fill-
factor!
TSV
multi-stack
Silicon bulk
Silicon bulk
2017
Backside
illumination
will
enable ~
100% fill-
factor!
Hybrid-TSV
multi-stack
Silicon bulk
CIS
wafer
Logic
wafer
Memory
wafer
Computing
wafer
>2020?
2121Status of the CMOS Image sensor Industry 2019 | Sample | www.yole.fr | ©2019
MOBILE TECHNOLOGY TREND
Interconnection choice depends on the required interconnection density
Backside
illuminati
on will
enable ~
100% fill-
factor!
TSV stack
1st gen
Silicon bulk
TSVTSV
Interco
upper-to-
lower
wafer
Backside
illuminati
on will
enable ~
100% fill-
factor!
TSV stack
2nd gen
TSV
Backside
illuminati
on will
enable ~
100% fill-
factor!
Hybrid stack
Interco upper-
to-lower wafer
Connection
within pixels
becomes possible
2014 2016 2016
Backside
illuminati
on will
enable ~
100% fill-
factor!
Hybrid-TSV stack
Interco upper-
to-lower stack
TSV
>2020?
22
CIS - MAIN TECHNOLOGY TRENDS
2019 conclusions
• Technology race remains a key aspect of competition, driving developments in smaller pixels and 3Dsemiconductor technologies.
• Over the years, significant improvements have been made to the CIS manufacturing process. Theindustry has transitioned from FSI to BSI and now toward stacked BSI, where TSVs are used to makeconnections to the sensor array and the logic die. Now the standard technique has moved to hybridstacking.
• New CIS sensing approaches are transforming the technology landscape formerly dominated by a singlepixel type. New pixel designs, namely GS and ToF, have gained significant market access, and the next tobe adopted could be event-based (EB) pixels.
• The next technology challenge is the integration of Artificial Intelligence within CIS sensors, whichcould use FD-SOI nodes, 28-22nm node.
Imaging still evolving quickly.
Status of the CMOS Image sensor Industry 2019 | Sample | www.yole.fr | ©2019
23
2019 CMOS IMAGE SENSOR INDUSTRY STATUS REPORT
Not deviating from last year’s forecast in the “Status of CIS industry 2018”, the CIS industry has ended upwhere analysts thought the market would be at this time of year. It successfully achieved 11% YoY growthamid a global semiconductor recession.
This performance is mainly due to the sustainability of the mobile market. Globally the CMOS ImageSensor industry thrived. In 2018, the industry reached the $15.5B revenue mark and Yole’s expectation isfor 8.1% CAGR for 2018 – 2024. Revenue should hit $24B in just five years. In the beginning of 2019,security and automotive became the second and third largest CIS market segments.
With regard to end-products, it seems that “all markets except mobile” are on a downward slope:consumer photography (DSC, DSLR, action cameras, drones) and computing (PC, laptop, tablets) have beensliding since 2012; the automotive and industry market downturn has also been influenced by the knock-on effect brought by the China-US trade war; nevertheless positive news from China shows that growthcould resume in 2020 as the market seems to have bottomed.
Having reached $15.5B, CMOS image sensors are now highly-visible semiconductor products.
Status of the CMOS Image sensor Industry 2019 | Sample | www.yole.fr | ©2019
24
Contact our
Sales Team
for more
information
24
Contact our
Sales Team
for more
information
3D Imaging& Sensing 2018
CMOS Image Sensor Quarterly Market Monitor
Status of the Camera Module Industry 2019 – Focus on Wafer
Level Optics
Status of the CMOS Image sensor Industry 2019 | Report | www.yole.fr | ©2019
YOLE GROUP OF COMPANIES RELATED REPORTS
Yole Développement
25
Contact our
Sales Team
for more
information
25
Contact our
Sales Team
for more
information
Mobile CMOS Image SensorComparison 2019
Goodix Under-Display Optical Fingerprint
Status of the CMOS Image sensor Industry 2019 | Report | www.yole.fr | ©2019
YOLE GROUP OF COMPANIES RELATED REPORTS
System Plus Consulting
26About Yole Développement | www.yole.fr | ©2020
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