STMicroelectronics

Lead – Free Program

Overall perspective

Presented by : Ph. Levavasseur, Corp. Env Sup. Group (CESG)Prepared by : Ph Levavasseur CESG

Fabio Borri : CESG DirectorLuc Petit : Corp R&D Packaging Developments

Enrico Galbiati : CESG

Summary

1. Legislation / Regulation Context Europe USA Japan

2. Examples of customers requests3. Examples of Associations position4. Examples of Semiconductor Manufacturers Position5. Overview of ST Activities : « Ecopack » Lead free program

PL CESG 03- 2001

1 – Legislation / Regulation Context : EU

Proposal from EC of 13.06.00 for a directive of the European Parliament and the Council on the Restriction of the use of certain Hazardous Substances in Electrical & Electronic Equipment (ROHS)

To approximate the laws of the member states on the restriction of the use of hazardous substances in electrical and electronic equipment

« Electrical & Electronic Equipment » means equipment designed for use not exceeding 1000 volt for alternating current an 15000 volt for direct current

Use of Lead, Mercury, Cadnium, hexavalent Chromium, PBB and PBDE is substituted on Jan 1, 2008.

Applications of the a.m substances listed in the annex of the directive are exempted from this provision

By Dec 2003 EC shall review the measures provided by the directive to take into account, as necessary, new scientific evidenceExemption for Lead in Electronic ceramic parts

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1- Legislation – Regulation context : EU

EEE Directive Draft (Environmental Impact of Electrical and Electronic Equipment)

IPP (Integrated Product Policy) is an established policy in the EU, aiming at imbedding Environmental requirements into other legislation – co-relate environment, economic and social factors

Initiated by DG Enterprise as a horizontal directive under the new approach principle, which means earlier and more extensive involvement of the concerned industries

Specifies provisions for the design of electrical and electronic equipment in order to secure a high level of environmental protection in balance with Product Performance and economic requirements

Also applies to components in so far as much components are subject to the particular provisions of the EEE Directive

Components are defined as any industrially manufactured product, including subassemblies, intented for incorporation into electrical and electronic equipment

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1- Legislation / Regulation context : US

Lead in US– Jan 8, 2001Toxic Release Inventory (TRI) threshold for Lead reduced

from 25,000 pounds to 100 pounds (Reduction factor 250)First reports at the lower threshold will be due in July 2002

covering 2001 calendar yearIn Jan 8 statement, EPA said : « lead exposure can lead to

damage to the brain and central nervous system and cause slowed growth, hyperactivity, and learning problems. Once in the body, lead is distributed to the blood, Soft tissue, and bone. Young Children and developing fetuses are known to absorb lead more readily than adults »

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1- Legislation / regulation context : US

Lead in US (Con’td)

Lead should be classified as a persistent, bioaccumulative, toxic, which was EPA’s justification for lowering the reporting threshold

EPA has forwarded to the EPA Science Adsisory Board the PBT question for further studies.

This rule does not mean Lead is banned in US. It seems that in US also, a new focus is put now on lead an on its health effect

Full 100+ page regulation can be found at : http : // www.epa.govtrileadrule.pdf

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1- Regulation / Legislation context : Japan

JAPAN Pb free Legislations / Recommendations (from www.leadfree.orgJapaneseLegislation.html)

Not found any specificlaw in Japan calling for the direct reduction or elimination of Lead in electronics

Home electronics recycling law. Revision done in 1998. It calls to be prepared to collect and

recycle major home products by April 1, 2001. Although this law does not mention the use of leaded products, there is another law forbidding companies putting any waste leaching toxic elements into the environment or landfills

MITI proposed in May 1998 take back (recycling) legislation. Japanese EPA and Government « suggest » reduced use of lead to decrease the Recycling need. MITI calls to reduce the use of Lead of Half by 2000 and 2/3 by 2005

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2- Examples of customers requests

Market situation Strong pressure from Japanese customers for lead –

free packages in 2001-2002

Some Key consumer Customers in Europe are following the same approach, with about 6-12 months delay

Interest from key automotive customers in view of higher operating temperature

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2- Examples of Customers requests

Customers’ requirements as seen by ST– Guarantee Reflow Soldering Temperature for Lead-free Solder Use

Solder for PWB Peak Solder

Temperature Request

Pb Free

Various•Sn Ag Cu•Sn Ag Bi Cu•Sn Zn Bi•Etc…

245 ~ 260 °c

7 major Companies

Melting point 183° 210-220° Pb Sn solder Pb-free Solder

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2- Examples of Customers Requests

Customers’ Pb-free Product Production Schedule

Customer A Oct 98

Aug 00

March 01

March 03

Started

Complete

MD Player

Headphone Stereo, VCR

All Products

Customer B March 00

March 02

Started

Complete

VCR, Camcorder

All Products

Customer C June 00

July 03

Started

Complete

Home Audio

Customer D Dec 98

Oct 99

Dec 02

Started

Complete

Pager

PC

1st step : a lot of customers start from 2001 for Use of Pb-free Solder on PWB assembly2nd Step : Use of Pb-free Lead Finish Device

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2- Examples of Customers Requests

Near Future : Realize Pb – free Lead Finish Device

Companies Lead Finish Technology Present Status

A SnBi / Pd plating Prod. Started for all device type

B Sn Bi or SnCu Plating Production started Starting

C SnAg or SnBi Plating Production started Starting

D SnBi / SnCu Plating Production started Starting

E SnCu Plating Production started Starting

F SnBi Plating Production started Starting

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3- Examples of Associations Position

Electronic Industries Alliance (EIA) The Electronic Industries Alliances, which represents more

than 2,100 members of the electronic and high tech industries, recently developed a « material Declaration Template » which its members plan to use as an industry-wide model for supply chain material declarations.

« Section C : Reportable materials. EIA members have agreed to collect information on whether the following chemical substances are contained in electronic products. For lead :

Lead and its compounds

Electrical interconnect (surface finish, solder, leads)

Leaded glass (CRTs, Lenses)

Plastic Stabilizer

Molding agent in plastic manufacture

Counterweights

Machined metal parts

Toxic Chemical

Heavy metal

Neurotoxin

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3- Examples of Electronic associations positions

JEIDA (Japanese Electronic Industry Development Association)

«The JEIDA Lead- free Soldering Research and Development Project Committee in February released its report « Challenges an Efforts Toward Commercialisation of Lead-free Solder – Road-map 2000 for Commercialization of Lead free Solder »

The report includes a survey of 132 companies, offers a revealing look at the Japanese perspective on lead-free electronics

In this report, JEIDA proposes the following Road-map for lead elimination :

First adoption of lead free solders in mass-produced goods : 1999 Adoption of lead-free components : 2000 Adoption of lead-free solders in wave soldering : 2000 Expansion of use of lead-free components : 2001 Expansion of use of Lead –free solders in new products : 2001 General use of lead free solders in new products : 2002 Full use of lead-free solders in all new products : 2003 Lead containing solders used only exceptionally : 2005

See : http://www.leadfree.org/JapanOrganizationalActivities.html

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3- Example of Electronic Associations Position

• ESIA (European S/C Industry Association) General :

In favour of Voluntary Agreements more than banning In favour of Voluntary Agreements (or restrictions) of

substances only when there is scientific risk assessment

Action : Work on exemptions for products that, for documented

technical reasons, cannot be manufatured without Lead Report to EC – before Dec 2003 – any new scientific

evidence, also performed outside Europe Close Cooperation among ESIA members - Creation of a

dedicated « Lead–free » working group

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3- Example of Electronic Associations Position

TSIA (Taïwan)– No specific legislation– Advanced Packaging Technology (APC) Consortium

Sponsored by APC center. 30 companies involved Research in industrial Technology & Research Institute

(ITRI). Lots of subjects are researching such as : Lead free solder bumping in packaging New under bump metallization for lead free solder bump Lead-free solder used in Wafer-level Chip scale packaging

Research in Industry Material manufacturers : new lead free solder balls and

pastes

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4- Examples of Semiconductor Manufacturers Position

Company statements- NEC Corporate Environmental Report « Since 1998, NEC has been working to reduce the amount of Lead in its solder.

Meanwhile, NEC brought out the world’s first PC with no lead solder on its motherboard »

- Hundai Electronics, Statement Jan 05,2001 « Hyundai Electronics Industries annouced yesterday that it had developed the first

Plumbum (Pb) free semiconductor package and memory module in Korea »

- STMicroelectronics « STMicroelectronics has announced the successful development of lead-free BGA (Ball Grid

Packages). The new packages, in which the conventional SnPb (tin, lead) solder balls are replaced by an SnAgCu (Tin, Silver, Copper) alloy, were developed within « ECOPACK » program that ST has been pursuing as part of its commitment to achieve total environmental neutrality » ST inaugurated its « Ecopack » program in 1998.

- Philips Semiconductor, 01-12-2000 « Philips Semiconductor approaches the subject in two distinct phases: 1- investigate

what measures need to be taken to ensure that our current product range will be fully backward compatible. 2- Develop Pb – free plating of connection terminals for all products. It is expected that the progress in time of these actions will differ from one package familiy to an another. Currently we are cooperating in the research for lead-free soldering internally… »

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4- Examples of Semiconductor Manufacturers Position

Company statements- Intel, Corporate Environmental, Health and Safety

Performance report printed April 2000 « Recent attention has been given to the potential impacts of lead and

halogenated compounds; Intel professionals have joined several industry groups to evaluate alternatives to these materials »

- Texas Instruments, ESH annual report « The electronics industry has used lead in electrical components, printed

circuits boards and packaging systems for more than 50 years-amounting to less than 1% of the world’s total consumption. Even through the amount of lead used by the industry is very small, TI still stives to reduce and eliminate lead from its products. Today 98% of our standard Linear and Logic products are lead free… »

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5- Lead-free Activities in ST

ECO PACKR

IS A REGISTERED TRADE MARK BY

STMicroelectronics

IT WAS DEVELOPED FOR IDENTIFICATION OF

PROGRAMS AND SOLUTIONS LEADING TO

ENVIRONMENT FRIENDLY PACKAGING AND

PACKING MATERIALS

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TO DEVELOP & ASSESS TECHNOLOGIES

FOR Pb FREE ELECTRONIC PACKAGING

TO PROVIDE RELIABLE Pb-FREE COMPONENTS

WHEN TECHNOLOGY IS AVAILABLE

TO BE READY TO PRODUCE LEAD-FREE COMPONENTS FOR CUSTOMERS

STARTING 2001 IN ALL APPLICABLE LINES

ECO PACKR

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LEAD FREE ELECTRONICS MEANS :

Pb FREE SOLDER PASTE in board mounting (i.e. the soldering process of the component onto the board, with higher soldering t°)

Pb FREE SEMICONDUCTOR PACKAGING (i.e coating of package leads, balls of BGA, Bumps of Flip Chip, alloy for sft die attach etc…)

inside : soft solder

outside : connections coating and materials

ALL PROCESSES AND MATERIALS

MUST BE COMPATIBLE TOGETHER

BUT STANDARDIZATION IS NOT YET ACHIEVED

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ECO PACKR

Key issuesLead Free Board Assembly :

END USERS ORIENTED TO SUBSTITUTE

PRESENT SnPb (60:40) - MELTING AT 183 C

WITH SOLDER PASTES

MELTING IN THE RANGE : 210 TO 230 °C

Sn Cu : melting at 227°C

Sn Ag : melting at 221°C

Sn Ag Cu : melting at 217°C

other alloys with small addition of Bi or Zn to reduce melting point to 210°C

Impact on Reliability

HIGHER MELTING POINT OF SOLDER PASTE MEANS DIFFERENT

SOLDERING PROFILE WITH HIGHER PEAK TEMPERATURE

(235-245C INSTEAD OF 225-235C )

THERMOMECHANICAL SHOCK DURING SMT SOLDERING IS HIGHER.

SENSITIVENESS TO ABSORBED MOISTURE IS HIGHER .

DEVICE RELIABILITY MUST BE RE-ASSESSED

USING NEW SOLDERING PROFILES

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5- Lead-free activities in ST

Lead in ST components Soft Solder Die Attach (95%Pb – Ag-Sn) Slug / Frame Soldering (90% Pb – Ag-Sn) Connections Dipping (40% Pb – 60%Sn) Connections Electro-Plating (10 to 20% Pb-Sn) BGA Balls (37% Pb – 63%Sn) Bumped Dies (37% - Pb-Sn)

Lead content in Electronic components roughly varied from 0.07 % to, 0.5% of Surface Mount Devices (SMD) Packages and from 3.5 to 8 % in Ball Grid Away (BGA)Packages.BGA are the lead richest packagesST as number 7 S/C manufacturer World wide is using less than 50 tons of Lead .

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ECO

PACK

R

5- Lead-free activities in ST

Lead Free Electronics Requirements– We got inquiries from most of our customers

To know if we have solutions ready To ask Lead free Packages

– Main Requirements are the use of special Solder pastes : In Japan : : Sn-Ag-Cu-Bi : Melting around 212° In Europe : Sn-Ag-Cu : Melting around 220° Note SnPb : melting around 183°For Japanese Customers : 2 Phases

Phase 1 Components to be compatible

with Lead - free Pastes Soldering

Components certified reliable with higher soldering T°

Phase 2

Lead RemovalNew Lead finishing

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ECO

PACK

R

5- Lead-free activities in ST

Phase 1 : RELIABLE PACKAGES WITH LEADFREE SOLDERING TEMPERATURES

EVEN WITH Pb IN CONNECTIONS COATINGS

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ECO

PACK

R

EVALUATION

OF EXISTING

PACKAGES

With 245°C / 255°C

SOLDERING PACKAGES

REDESIGN

MATERIALS CHANGE

FULL

QUALIFICATION

VALIDATION WITH

FEW RELIABILITY TESTS

WARRANTY

CERTIFICATE

5- Lead-free activities in ST

Phase 2 : massive introduction of Lead free devices

LEAD-FREE DIPPING : Tin COATING

LEAD-FREE PLATING : Tin , Tin-Silver , Nickel-palladium-Gold

LEAD-FREE BGA BALLS : Tin-Silver-Copper Balls

LEAD-FREE DIE BUMPING : Tin-Silver , Tin-Silver-Copper

LEAD-FREE SOFT SOLDER : On going research

Tin-Silver-Copper BALLS = SEEMS TO BECOME A STANDARD

LEAD-FREE PLATING : NO STANDARD CHOICE YET

ST CHOICE

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5- Lead-free activities in ST

Lead free Status (Q1 2001)– ST has about 70 major packages families– Each family with several variations

Discrete, Signal, Power, Insertion, Surface mounting– Considering all ST production we are working in 8 areas :

Solder Connection Dipping Solder Connection Plating Soft Solder - Die attach for insertion Soft solder Die attach for Surface Balls for BGA Bumps for Flip Chip Special Discrete Frit Seal (Pb in glass seal) Presently exempted from

ROSH Directive

Solutions Qualification Under Development No solution

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5- Lead-free activities in ST : Road-map

1999-2000 : PROCESS EVALUATION

2000 : TECHNICAL SOLUTION READY FOR QUALIFICATION

2000 : ECOPACK COMPONENTS SPECIFICATION

2000 : STATUS ON RELIABILITY IMPACT

2001 : ECOPACK COMPONENTS QUALIFICATIONS

2001 : VALIDATION & INDUSTRIALISATION

2001 : FIRST PRODUCTIONS

2002-2004 : CONTINUE PACKAGES CONVERSIONS

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ECOPACK COMPONENTS SPECIFICATION

NO LEAD : except traces in materials (100ppm Max)

SOLDERABLE : with both SnPb and Lead-free processes

RELIABLE : at higher melting profile ( base on SnAgCu )

WELL IDENTIED : ECOPACK trade mark

INTERNAL SPECIFICATION DEFINED FOR DEVELOPMENTIN FRONT OF LACK OF STANDARDS

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Conclusions The SC manufacturers are willing to contribute to Lead – free

programs due to their strong ESH commitment (Most of SC plants are ISO 14001 certified or EMAS validated)

Lead Removal from electronics components is a highly complicated issue

Many process to be changed Some Technical solutions defined (BGA- Dipping) Few technical solutions to be designed and validated (Plating – Soft

Solder) Many packages to be requalified No visible solutions for some packages families = need for

Exemptions Changes will be, above all, driven by Competition and customers

requests Lack of International standards is slowing the conversion; Strong financial impact : R&D cost + Manufacturing cost : Do we need

to double our Production lines ????

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